Temperature adjustment device, substrate processing device, and control method for controlling mounting table

Abstract

The present invention provides a temperature adjustment device, a substrate processing device, and a control method for controlling a mounting table. The temperature adjustment device comprises: a mounting table having a plurality of heating units and a plurality of temperature detection units, the plurality of heating units being arranged in each of the individual segments within a segment region having at least two or more individual segments in both the radial and circumferential directions, the plurality of temperature detection units being arranged in the individual segments, the number of which is less than the number of the individual segments; and a control device for controlling the heating units arranged in a first individual segment and a second individual segment based on temperatures detected by the temperature detection units, the first individual segment being an individual segment provided with the temperature detection units, and the second individual segment being an individual segment controlled synchronously with the first individual segment and not provided with the temperature detection units, wherein the control device comprises a switching unit for switching the second individual segment to be controlled synchronously with the first individual segment.

Description

Technical Field

[0001] The present disclosure relates to a temperature adjustment device, a substrate processing device, and a control method for controlling a mounting table. Background Art

[0002] For example, Patent Document 1 discloses a mounting table in which a hot plate constituting a wafer mounting table is divided into a plurality of regions. Patent Document 1 also discloses that a temperature sensor for a heater is provided in each divided region of the hot plate of the mounting table.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-125335 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The present disclosure provides a temperature adjustment device, a substrate processing device, and a control method for controlling a mounting table, which are capable of reducing a calculation load when controlling the temperature of a mounting table.

[0008] Solutions for solving problems

[0009] The temperature adjustment device disclosed herein comprises: a mounting table having a plurality of heating parts and a plurality of temperature detection parts, the plurality of heating parts being arranged in each of the separate segments in a segment area having at least two or more separate segments in the radial and circumferential directions respectively, the plurality of temperature detection parts being arranged in the plurality of separate segments, and the number of the plurality of temperature detection parts being less than the number of the separate segments; and a control device controlling the heating parts arranged in the first separate segment and the heating parts arranged in the second separate segment according to the temperature detected by the temperature detection parts, the first separate segment being a separate segment provided with the temperature detection part, and the second separate segment being a separate segment that is controlled synchronously with the first separate segment and is not provided with the temperature detection part, wherein the control device has a switching part that switches the second separate segment that is controlled synchronously with the first separate segment.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to reduce the calculation load when performing temperature control of the mounting table. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is an overall structural diagram of a substrate processing apparatus including a mounting table according to a first embodiment of the present disclosure.

[0013] Figure 2 This is a diagram illustrating the definition of sections of the mounting table according to the first embodiment of the present disclosure.

[0014] Figure 3 It is a diagram for explaining the structure and operation of the temperature adjustment device according to the first embodiment of the present disclosure.

[0015] Figure 4 This is a diagram showing an example of a temperature control state of a zone of a mounting table according to the first embodiment of the present disclosure.

[0016] Figure 5 It is a diagram for explaining the structure and operation of the temperature adjustment device according to the second embodiment of the present disclosure.

[0017] Figure 6 It is a diagram for explaining the structure and operation of a temperature adjustment device according to a third embodiment of the present disclosure.

[0018] Figure 7 It is a diagram for explaining the structure and operation of a temperature adjustment device according to a fourth embodiment of the present disclosure.

[0019] Figure 8 This is a diagram showing an example of a temperature control state of a zone in a first modification example of the mounting table according to the embodiment of the present disclosure.

[0020] Figure 9 This is a diagram showing an example of a temperature control state of a zone in a second modification of the mounting table according to the embodiment of the present disclosure.

[0021] Figure 10 This is a diagram showing an example of a temperature control state of a zone in a third modified example of the mounting table according to the embodiment of the present disclosure.

[0022] Description of Reference Numerals

[0023] 1: mounting table; 10: substrate processing device; 15: control device; 20: thermistor; 45: heater; 110: temperature control unit; 150: switching unit; 300: driving unit; 500: switching unit; 600: switching unit; W: substrate. DETAILED DESCRIPTION

[0024] Hereinafter, the embodiment of the present disclosure will be described with reference to the accompanying drawings. In the drawings, the same components are sometimes denoted by the same reference numerals, and repeated descriptions are omitted.

[0025] <First embodiment>

[0026] 《Overall structure of substrate processing equipment》

[0027] Figure 1 1 is an overall structural diagram of a substrate processing apparatus having a mounting table according to a first embodiment of the present disclosure. The mounting table 1 according to this embodiment is a table for mounting and holding a substrate W in, for example, a plasma processing apparatus that performs plasma processing.

[0028] The substrate processing apparatus 10 includes a processing container 111 and a mounting table 1 disposed within the processing container 111. The processing container 111 is grounded. The mounting table 1 includes an electrostatic chuck (ESC) 11, an adhesive layer 12, and a base 13. The base 13 supports the electrostatic chuck 11. The electrostatic chuck 11 and the base 13 are bonded together by the adhesive layer 12. The mounting table 1 is disposed at the bottom of the processing container 111 via a support portion 114 formed of an insulating member.

[0029] The base 13 is made of aluminum or the like. The electrostatic chuck 11 is made of a dielectric material such as alumina (Al2O3). The electrostatic chuck 11 is generally circular in plan view. The electrostatic chuck 11 holds the substrate W using electrostatic attraction generated by applying a DC voltage to an electrode (not shown).

[0030] The electrostatic chuck 11 includes a plurality of thermistors 20. The thermistors 20 are elements for measuring the temperature inside the electrostatic chuck 11. The thermistors 20 are provided in a portion of the segment region Seg of the mounting table 1 (electrostatic chuck 11) (see FIG. Figure 2 Thermistor 20 is a general term for thermistors 20a, 20b, etc. described later (see Figure 4 ).

[0031] In addition, the electrostatic chuck 11 is provided with a heater 45. The heater 45 controls the temperature of the substrate W by heating the electrostatic chuck 11. The heater 45 is embedded in the electrostatic chuck 11. The heater 45 is divided into a plurality of parts. Each heater 45 is provided in each individual segment obtained by dividing the segment area Seg. Each heater 45 can operate independently. The heater 45 is a general term for the heaters 45a, 45b, 45c, etc. described later (see Figure 4 ).

[0032] A substrate W is placed at the center of the electrostatic chuck 11 , and an annular edge ring 115 (also referred to as a focus ring) surrounding the substrate W is placed on the outer periphery.

[0033] An annular exhaust path 123 is formed between the sidewall of the processing container 111 and the sidewall of the mounting table 1. The exhaust path 123 is connected to an exhaust device 122 via an exhaust port 124. The exhaust device 122 is composed of a vacuum pump, and exhausts the gas in the processing container 111 to reduce the pressure of the processing space in the processing container 111 to a predetermined vacuum level.

[0034] A partition 127 is provided in the exhaust path 123 to separate the processing space from the exhaust space and control the flow of gas. The mounting table 1 is connected to a first high-frequency power source 117 and a second high-frequency power source 118. The first high-frequency power source 117 applies, for example, 60 MHz high-frequency power HF to the mounting table 1 for generating plasma. The second high-frequency power source 118 applies, for example, 40 MHz high-frequency power LF to the mounting table 1 for attracting ions.

[0035] A showerhead 121 is installed around the outer periphery of the opening at the top of the processing container 111, via an annular insulating member 128. A gas supply source 119 supplies gas tailored to the process conditions. The gas enters the showerhead 121 through a gas pipe 121a and is introduced into the processing container 111 in a spray-like manner. High-frequency power (HF) is applied capacitively between the mounting table 1 and the showerhead 121, generating plasma from the gas.

[0036] Here, the segment area of the mounting table 1 will be described. Figure 2 It is a diagram for explaining the definition of the segment area of the mounting table 1 according to the first embodiment of the present disclosure. Figure 2 It shows Figure 1 FIG. AA cross section of the electrostatic chuck 11. The heater 45 embedded in the electrostatic chuck 11 of the mounting table 1 includes a plurality of heaters 45. The plurality of heaters 45 are divided and arranged in the segment area Seg. The segment area Seg is a circle having an outer diameter substantially the same as the outer diameter of the substrate W mounted thereon. The segment area Seg is composed of a plurality of separate segments. A separate segment is provided at the center of the circle. Figure 2 In the example, the mounting table 1 of this embodiment is divided into three separate segments in the radial direction and twelve separate segments in the circumferential direction outside the separate segment in the center. Therefore, the mounting table 1 of this embodiment has 1+3×12=37 separate segments. In addition, the radial length of the separate segments closer to the outside becomes shorter. However, the configuration and number of separate segments in the segment area Seg are not limited to this, and at least two or more separate segments obtained by division can be provided in the radial and circumferential directions respectively. In addition, in Figure 2 In the example shown in FIG, a single segment is provided in the center portion of the circle, but the single segment in the center portion may be divided in the circumferential direction.

[0037] Here, the format for expressing the position of each individual segment of the segment area Seg is described. The position of each individual segment is expressed in the form of Sa, b. Here, "a" represents the position in the radial direction. Specifically, "a" is a value that increases as the individual segment in the center is set to 0 and moves away from the center in the radial direction. In addition, "b" represents the circumferential position. Specifically, "b" is the value of the circumferential position of the reference ( Figure 2 When the center is set to 1, the circumferential direction ( Figure 2 In addition, for the single segment at the center, b is set to 0.

[0038] exist Figure 2 Thermistors 20 are omitted from the figure, but thermistors 20 are provided in part of the plurality of individual segments, not in one-to-one correspondence with all the individual regions of the plurality of individual segments. Therefore, the number of thermistors 20 is less than the number of individual segments in the segment region Seg.

[0039] The heaters 45 are provided in a one-to-one correspondence with all the individual segments of the plurality of individual segments. That is, the number of the heaters 45 is the same as the number of the individual segments in the segment region Seg.

[0040] Back to Figure 1 The substrate processing apparatus 10 includes a control device 15. The control device 15 controls the entire substrate processing apparatus 10. The following describes the temperature control of the mounting table 1 performed by the control device 15 within the control of the substrate processing apparatus 10. Specifically, the following describes the temperature control of the mounting table 1 performed by the control device 15, with the mounting table 1 and the control device 15 included in the substrate processing apparatus 10 being considered as a temperature adjustment device.

[0041] Operation of the temperature control device

[0042] Figure 3 It is a diagram for explaining the structure and operation of the temperature adjustment device according to the first embodiment of the present disclosure. Figure 4 This is a diagram showing an example of a temperature control state of a zone in the mounting table 1 according to the first embodiment of the present disclosure.

[0043] The temperature adjustment device comprises a mounting table 1 and a control device 15. Figure 3 As shown, the control device 15 is connected to the thermistor 20 and the heater 45 provided on the mounting table 1. Figure 3 Shown in Figure 4 Thermistors 20a, 20b, multiple heaters 45a, 45b, 45c, and control device 15 are shown. Thermistors 20a, 20b, and so on are examples of temperature detection units that measure the temperature of mounting table 1. Temperature detection units are not limited to thermistors; any temperature measuring device capable of detecting temperature may be used. Heaters 45a, 45b, 45c, and so on are examples of multiple heating units that heat mounting table 1. The heating units are not limited to heaters embedded in mounting table 1; sheet heaters attached to mounting table 1 may also be used.

[0044] The control device 15 controls the temperature of the mounting table 1. The control device 15 includes a temperature control unit 110, a temperature acquisition unit 120, a switching unit 150, and a driving unit 300. The temperature control unit 110, the temperature acquisition unit 120, and the switching unit 150 can be implemented by an FPGA (Field-Programmable Gate Array) or a CPU (Central Processing Unit) that executes a program stored in a storage device. The driving unit 300 can be implemented, for example, by a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). The driving unit 300 can also be a driving circuit, for example, and is not included in the control device 15. The driving unit 300 is a general term for the driving units 300a, 300b, 300c, etc.

[0045] The temperature acquisition unit 120 acquires the measured values measured by the thermistors 20a, 20b, etc. The temperature acquisition unit 120 converts the acquired measured values into measured values and outputs them to the temperature control unit 110. Regarding the conversion of the measured values into measured values by the temperature acquisition unit 120, when a digital signal is input from the thermistors 20a, 20b, etc., the digital value is converted into a measured value. When an analog signal is input, the analog-to-digital conversion is performed and the result is converted into a measured value.

[0046] The temperature control unit 110 controls the temperature of the substrate W placed on the mounting table 1. Based on the converted measurement values, the temperature control unit 110 controls the drive unit 300 to achieve a desired temperature for the substrate W. The measurement values are input from the temperature acquisition unit 120 to the temperature control unit 110, which then outputs a control signal to the drive unit 300. The temperature control unit 110 uses the input measurement values as feedback to perform, for example, PID control.

[0047] The switching unit 150 switches the output destination of the control signal from the temperature control unit 110 . The driving unit 300 drives the corresponding heater 45 .

[0048] like Figure 4As shown, thermistors 20a, 20b... are not provided in all the individual sections of the mounting table 1, but are provided in specified positions. Specifically, thermistors 20 are provided in every other individual section in the circumferential and radial directions. In addition, thermistors 20 are alternately provided in the individual sections at the outermost periphery and the individual sections inside thereof. For example, thermistor 20a is provided in the individual section S3,1 to measure the temperature of the individual section S3,1. Similarly, thermistor 20b measures the temperature of the individual section S2,2. No thermistors are provided in the individual sections S2,1 and S3,2. However, the positions of the thermistors 20 are not limited thereto, and the thermistors 20 may also be staggered in the circumferential direction in the individual sections at the outermost periphery and the individual sections inside thereof.

[0049] The driving unit 300 drives the heater 45. Figure 3 In the example of FIG, the driving units 300a, 300b, 300c, and 300d output driving signals to the heaters 45a, 45b, 45c, and 45d, respectively, based on the control signal from the control device 15. The driving signal output from the driving unit 300 is, for example, a signal based on a driving current, a driving voltage, or the like. The driving units 300 of this embodiment are provided in a one-to-one correspondence with the heaters 45. That is, the number of driving units 300 is the same as the number of heaters 45. The heaters 45a, 45b, 45c, and 45d are driven by the driving units 300a, 300b, 300c, and 300d, respectively. Alternatively, the driving unit 300 may be provided outside the control device 15.

[0050] Heater 45 heats electrostatic chuck 11 based on a control signal from drive unit 300. Heater 45 is provided in each individual segment. For example, heater 45a is provided in individual segment S3,1 and heats electrostatic chuck 11 in individual segment S3,1. Similarly, heater 45b is provided in individual segment S2,1, and heater 45c is provided in individual segment S3,2, respectively, heating electrostatic chuck 11 in the individual segments.

[0051] In the mounting table 1 of the present embodiment, the heater 45 controlled in accordance with the thermistor 20 is switched according to the performance required during heating under the control of the control device 15 .

[0052] use Figure 4 The specific operation of the mounting table 1 according to the first embodiment will be described.

[0053] The following describes the heater 45 whose temperature is controlled by the temperature control unit 110 using the measured value of the thermistor 20a in the outermost individual segment S3, 1. The temperature control unit 110 uses the measured value of the thermistor 20a to control the temperature of at least the heater 45a in the individual segment S3, 1 having the thermistor 20a.

[0054] When heating the substrate W using the mounting table 1, the following two situations can be considered: (1) the situation where it is desired to finely control the temperature of the substrate W in the circumferential direction and roughly control the temperature in the radial direction; and (2) the situation where it is desired to roughly control the temperature of the substrate W in the circumferential direction and finely control the temperature in the radial direction. These two situations are described below.

[0055] (1) When it is desired to finely control the temperature of the substrate W in the circumferential direction and roughly control the temperature in the radial direction

[0056] When heating the substrate W by the mounting table 1, if it is desired to control the temperature of the substrate W in a fine manner in the circumferential direction and in a rough manner in the radial direction, the temperature is controlled using the measured value of the thermistor 20a. Figure 4 The switching unit 150 switches the control signal output by the temperature control unit 110 based on the value measured by the thermistor 20a to the drive units 300a and 300b. This controls the heaters 45a and 45b to adjust the substrate W temperature to the value measured by the thermistor 20a.

[0057] In this case, the temperature of the substrate W is controlled in the circumferential direction with the same resolution as that of the individual circumferentially divided segments. Therefore, the temperature of the substrate W is controlled more precisely in the circumferential direction than in the radial direction. This control allows the substrate W to be heated by the mounting table 1 while maintaining precise temperature control in the circumferential direction and roughly controlling the temperature in the radial direction.

[0058] (2) When it is desired to roughly control the temperature of the substrate W in the circumferential direction and finely control the temperature in the radial direction

[0059] When heating the substrate W by the mounting table 1, if it is desired to roughly control the temperature in the circumferential direction of the substrate W and finely control the temperature in the radial direction, the temperature is controlled using the measured value of the thermistor 20a. Figure 4The switching unit 150 switches the control signal output by the temperature control unit 110 based on the value measured by the thermistor 20a to the drive units 300a and 300c. This controls the heaters 45a and 45c so that the substrate W temperature is adjusted to a temperature corresponding to the value measured by the thermistor 20a.

[0060] In this case, the temperature control in the radial direction of the substrate W is performed with the same resolution as that of the individual radially divided segments. Therefore, the temperature control in the radial direction of the substrate W is performed more precisely than the temperature control in the circumferential direction. This control allows the substrate W to be heated by the mounting table 1 while achieving both coarse temperature control in the circumferential direction and fine temperature control in the radial direction.

[0061] In the mounting table 1 of this embodiment, the switching unit 150 switches between the outermost segment S3,2 of the segment region Seg adjacent to the individual segment S3,1 where the thermistor 20a is arranged and the inner individual segment S2,1 of the individual segment S3,1.

[0062] As described above, the mounting table 1 of this embodiment is controlled using a control method that includes the following process: the controller 15 controls the heater 45a, which is equipped with the thermistor 20a, based on the measured value of the thermistor 20a. In addition, either heater 45b or heater 45c is controlled based on the switching between heaters 45b and 45c. Furthermore, the individual segment S3,1, in which the thermistor 20a is located, is an example of a first individual segment equipped with a temperature detector. The individual segment S3,2, circumferentially adjacent to the individual segment S3,1, or the individual segment S2,1, radially adjacent to the individual segment S3,1, is an example of a second individual segment controlled synchronously with the first individual segment. Furthermore, "synchronous control" means that the second individual segment, which is not equipped with a temperature detector, is controlled based on the measured value of the temperature detector in the first individual segment equipped with the temperature detector.

[0063] Effect

[0064] In the mounting platform 1 of this embodiment, heaters 45 in multiple individual segments are controlled by a thermistor 20 located in a single segment at a predetermined location. Specifically, the mounting platform 1 includes multiple heaters 45 located in each of the individual segments formed by dividing the segment area Seg, and multiple thermistors 20, the number of which is less than the number of individual segments, and each of which is located in any of the individual segments. Based on the temperature detected by the thermistor 20, the control device 15 controls the heater 45 located in the single segment at the predetermined location where the thermistor 20 is located, as well as the heaters 45 located in other individual segments within the same segment set that are controlled synchronously with the single segment and do not have the thermistor 20. The switching unit 150 of the control device 15 switches the control to a second individual segment controlled synchronously with the first individual segment.

[0065] This allows the number of thermistors 20 and the like to be smaller than the number of heaters 45. This reduces the computational load on the FPGA and the like constituting the control device 15. Furthermore, by collectively controlling the plurality of individual segments in the segment region Seg of the mounting table 1, the number of thermistors, wiring, and circuits within the board can be reduced.

[0066] Furthermore, the mounting table 1 of this embodiment can switch the heater 45 to be controlled by the switching unit 150. For example, the mounting table 1 of this embodiment can finely control the temperature of the substrate W in the circumferential direction and roughly control the temperature in the radial direction, or roughly control the temperature of the substrate W in the circumferential direction and finely control the temperature in the radial direction. This can reduce the number of mounting table models, lower production costs, reduce inventory management costs, and shorten delivery times.

[0067] <Second embodiment>

[0068] Figure 5 It is a diagram for explaining the structure and operation of the temperature adjustment device according to the second embodiment of the present disclosure.

[0069] In the mounting table 2 according to the second embodiment, the heater 45 is switched by the switching unit 500 .

[0070] The switching unit 500 switches the driving signal input from the driving unit 300 to any one of the plurality of heaters 45 based on the control signal from the switching control unit 155. For example, Figure 5 In the embodiment of the present invention, the switching unit 500 switches the drive signal output from the driving unit 300a to the heater 45b or the heater 45c. By switching in this way, the heater 45 controlled in accordance with the temperature detection unit is switched.

[0071] In the mounting table 2 according to the second embodiment, the number of the driving units 300 can be made smaller than the number of the heaters 45. In addition, the driving units 300 and the switching units 500 may be provided outside the control device 15.

[0072] <Third embodiment>

[0073] Figure 6 It is a diagram for explaining the structure and operation of a temperature adjustment device according to a third embodiment of the present disclosure.

[0074] In the mounting table 3 according to the third embodiment, a plurality of heaters 45 are connected in series.

[0075] The switching unit 500 switches the driving signal input from the heater 45 to any other heater 45 among the plurality of heaters 45 based on the control signal from the switching control unit 155. Figure 6 In the embodiment, the switching unit 500 switches the driving signal output from the heater 45a to the heater 45b or the heater 45c. By performing such switching, the heater 45 controlled in accordance with the temperature detection unit is switched.

[0076] In the mounting table 3 according to the third embodiment, the heaters 45 are connected in series, thereby increasing the resistance value. Consequently, the flowing current can be reduced. Furthermore, the drive unit 300 and the switch unit 500 may be provided outside the control device 15 .

[0077] <Fourth embodiment>

[0078] Figure 7 It is a diagram for explaining the structure and operation of a temperature adjustment device according to a fourth embodiment of the present disclosure.

[0079] In the mounting table 4 according to the fourth embodiment, the switching unit 600 switches the heater 45. The heater 45 is connected to the control board via a connector in the switching unit 600. The connection destination is changed by replacing the connection destination of the connector or changing the pin assignment. Thus, the switching unit 600 switches the individual segments by changing the wiring connections.

[0080] Since the control device 15 does not need to perform switching control, it is possible to reduce the size of, for example, an FPGA or the like constituting the control device 15. Furthermore, the driving unit 300 and the switching unit 600 may be provided outside the control device 15.

[0081] <Modification>

[0082] In the mounting platform according to the embodiment of the present disclosure, the number of individual segments constituting the segment sets A and B is 2, but the number is not limited to 2. For example, Figure 8 FIG. 1 is a diagram showing an example of a temperature control state of a section of a first modified example of a mounting table according to an embodiment of the present disclosure. Figure 8 As shown, the number of individual segments constituting each segment set may be set to 3. Furthermore, the number of individual segments constituting each segment set may be set to more than 3. In other words, the segment group may be switched by the switching unit.

[0083] In the mounting platform according to the embodiment of the present disclosure, the number of individual segments constituting the segment sets A and B is two segments, which is the same number, but the number of individual segments in each segment set is not limited to the same number. For example, Figure 9 FIG. 1 is a diagram showing an example of a temperature control state of a section of a second modified example of a mounting table according to an embodiment of the present disclosure. Figure 9 As shown, one segment set may be composed of two independent segments, and another segment set may be composed of three independent segments. In other words, the number of independent segments constituting the segment set may be different between the segment sets.

[0084] In the mounting platform according to the embodiment of the present disclosure, the individual segments of each segment set constituting the segment sets A and B are adjacent to each other, but the individual segments constituting each segment set may not be adjacent to each other. Figure 10 FIG. 1 is a diagram showing an example of a temperature control state of a section of a third modified example of a mounting table according to an embodiment of the present disclosure. Figure 10 As shown, segment sets can also be formed by distant segments.

[0085] The heaters 45 in the individual segments within the segment set may be driven at different powers for each segment. Furthermore, when performing temperature control, a pre-generated temperature distribution may be measured and used for control. The heaters 45 may also be driven using PWM (Pulse Width Modulation) with a duty cycle.

[0086] The segment set is not limited to a set of individual segments including the ends of the segment area Seg. For example, the segment set may be composed of individual segments near the center of the segment area Seg.

[0087] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive, and the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and the spirit thereof.

Claims

1. A temperature adjustment device comprising: a mounting table having a plurality of heating portions and a plurality of temperature detecting portions, wherein the plurality of heating portions are provided in each of the individual segments in a segment area having at least two or more individual segments in each of the radial and circumferential directions, and the plurality of temperature detecting portions are provided in the plurality of individual segments, wherein the number of the plurality of temperature detecting portions is less than the number of the individual segments; and a control device for controlling the heating portion provided in a first separate section and the heating portion provided in a second separate section based on the temperature detected by the temperature detection portion, wherein the first separate section is a separate section provided with the temperature detection portion, and the second separate section is a separate section that is controlled synchronously with the first separate section and is not provided with the temperature detection portion; in, The control device includes a switching unit that switches a second individual section that is controlled synchronously with the first individual section. wherein the switching portion switches the second individual segment between the individual segment adjacent to the first individual segment in the radial direction and the individual segment adjacent to the first individual segment in the circumferential direction, The individual sections provided with the temperature detecting portion and the individual sections not provided with the temperature detecting portion are alternately arranged in the radial direction and the circumferential direction.

2. The temperature adjustment device according to claim 1, wherein The control device controls the heating unit by a pulse width modulation signal.

3. The temperature adjustment device according to claim 1 or 2, characterized in that: The switching unit switches the individual segments by changing the connection of wiring.

4. A substrate processing apparatus comprising: The temperature adjustment device according to any one of claims 1 to 3; and The processing container has the mounting table disposed therein.

5. A method for controlling a mounting platform, wherein: The mounting platform has: a plurality of heating portions, each of the plurality of heating portions being provided in a segment region having at least two or more individual segments in the radial direction and the circumferential direction; as well as a plurality of temperature detection parts, the plurality of temperature detection parts being provided in the plurality of the individual sections, and the number of the plurality of temperature detection parts being less than the number of the individual sections, The control method of controlling the mounting table The following processes are included: controlling the heating portion provided in a first separate section and the heating portion provided in a second separate section based on the temperature detected by the temperature detecting section, wherein the first separate section is a separate section provided with the temperature detecting section, and the second separate section is a separate section that is controlled synchronously with the first separate section and is not provided with the temperature detecting section; and switching a second individual segment controlled synchronously with the first individual segment, wherein the second individual segment is switched between the individual segment adjacent to the first individual segment in the radial direction and the individual segment adjacent to the first individual segment in the circumferential direction, The individual sections provided with the temperature detecting portion and the individual sections not provided with the temperature detecting portion are alternately arranged in the radial direction and the circumferential direction.

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