Electronic Devices

Abstract

The present application relates to an electronic device. The electronic device includes a display panel, the display panel including a front surface and a rear surface opposite to the front surface. The lower panel includes a plurality of sheets stacked on the rear surface of the display panel and an opening penetrating the sheets. The opening exposes a portion of the rear surface of the first sheet, and the first sheet has a front surface opposite to the exposed portion of the rear surface of the first sheet and in contact with the display panel. A fingerprint sensing unit includes a fingerprint sensor positioned in the opening and a sensing circuit board connected to the fingerprint sensor. The exposed portion of the rear surface of the first sheet contacts a portion of the sensing circuit board.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority benefit of Korean Patent Application No. 10-2019-0068877 filed on June 11, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Herein, the present disclosure relates to electronic devices, and more particularly to electronic devices having improved reliability. Background Art

[0004] The electronic device may provide various functions for communicating with the user. For example, the electronic device may display an image to provide information to the user, or may sense the user's input.

[0005] The electronic device may further include a function for sensing a user's fingerprint. Fingerprint recognition methods may include a capacitive method for sensing a change in capacitance between electrodes, an optical method for sensing incident light by using a light sensor, and an ultrasonic method for sensing vibration by using a piezoelectric material. The electronic device may include a fingerprint sensing unit for sensing a fingerprint located on the rear surface of the display panel. Summary of the invention

[0006] The present disclosure may provide an electronic device including a fingerprint sensing unit.

[0007] In an exemplary embodiment of the present inventive concept, an electronic device may include a display panel including a front surface and a rear surface opposite to the front surface. The lower panel includes a plurality of sheets stacked on the rear surface of the display panel and an opening penetrating the sheets. The opening exposes a portion of the rear surface of the first sheet, and the first sheet has a front surface opposite to the exposed portion of the rear surface of the first sheet and in contact with the display panel. The fingerprint sensing unit includes a fingerprint sensor positioned in the opening and a sensing circuit board connected to the fingerprint sensor. The exposed portion of the rear surface of the first sheet contacts a portion of the sensing circuit board.

[0008] In an exemplary embodiment, the sheet of the lower panel may include: a first sheet including a first functional layer having a buffering function and a first adhesive layer arranged on the first functional layer; a second sheet including a second functional layer arranged on the first adhesive layer and having a heat dissipation function and a second adhesive layer arranged on the second functional layer; and a third sheet including a third functional layer arranged on the second adhesive layer and having a light shielding function and a third adhesive layer arranged on the third functional layer.

[0009] In an exemplary embodiment, the openings may include a first opening in the first sheet, a second opening in the second sheet, and a third opening in the third sheet. An area of ​​the second opening and an area of ​​the third opening are greater than an area of ​​the first opening.

[0010] In an exemplary embodiment, the thickness of the lower panel overlapping the exposed portion may be equal to or less than the thickness of the fingerprint sensing unit.

[0011] In an exemplary embodiment, a height from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor may be equal to a height from the rear surface of the display panel to the sensing circuit board overlapping the exposed portion.

[0012] In an exemplary embodiment, a height from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor may be greater than a height from the rear surface of the display panel to the sensing circuit board overlapping the exposed portion.

[0013] In an exemplary embodiment, the sensing circuit board may be bent in a direction from the fingerprint sensor toward the exposed portion.

[0014] In an exemplary embodiment, the sensing circuit board overlapping the exposed area may be coupled to the first sheet through the first adhesive layer.

[0015] In an exemplary embodiment, the electronic device may further include a main circuit board connected to the front surface of the display panel and bent toward the rear surface of the display panel. The sensing circuit board may be connected to the main circuit board.

[0016] In an exemplary embodiment, the sensing circuit board may include a first connection portion connected to the fingerprint sensor, a second connection portion connected to the main circuit board, and a grip portion disposed between the first connection portion and the second connection portion. The grip portion may have a predetermined curvature.

[0017] In an exemplary embodiment, the fingerprint sensing unit may further include an adhesive portion coupling the fingerprint sensor to the rear surface of the display panel.

[0018] In an exemplary embodiment, the opening may be spaced apart from the adhesive portion and may have a closed line shape surrounding an edge of the fingerprint sensor.

[0019] In an exemplary embodiment of the present inventive concept, the display panel includes a front surface and a rear surface opposite to the front surface. The fingerprint sensing unit includes a fingerprint sensor disposed on the rear surface of the display panel and a sensing circuit board connected to the fingerprint sensor. The lower panel is disposed on the rear surface of the display panel and includes an exposed area overlapping the sensing circuit board. The fingerprint sensor is located within an opening in the lower panel. The thickness of the lower panel in the exposed area is equal to or less than the thickness of the fingerprint sensing unit.

[0020] In an exemplary embodiment, the lower panel may include: a first sheet including a first functional layer having a buffering function and a first adhesive layer disposed on the first functional layer; a second sheet including a second functional layer disposed on the first adhesive layer and having a heat dissipation function and a second adhesive layer disposed on the second functional layer; and a third sheet including a third functional layer disposed on the second adhesive layer and having a light shielding function and a third adhesive layer disposed on the third functional layer.

[0021] In exemplary embodiments, the first adhesive layer of the exposed area may be exposed by removing portions of the second sheet and the third sheet.

[0022] In an exemplary embodiment, the sensing circuit board overlapping the exposed area may be coupled to the first sheet through the first adhesive layer.

[0023] In an exemplary embodiment, a height from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor may be equal to a height from the rear surface of the display panel to the sensing circuit board overlapping the exposed area.

[0024] In an exemplary embodiment, a height from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor may be greater than a height from the rear surface of the display panel to the sensing circuit board overlapping the exposed area.

[0025] In an exemplary embodiment, the sensing circuit board may be bent in a direction from the fingerprint sensor toward the exposed area.

[0026] In an exemplary embodiment, the fingerprint sensing unit may further include an adhesive portion coupling the fingerprint sensor to the rear surface of the display panel. The adhesive portion may be provided along an edge of the fingerprint sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept. In the drawings:

[0028] Figure 1A is a perspective view showing an electronic device according to an exemplary embodiment of the inventive concept;

[0029] Figure 1B is a diagram showing an exemplary embodiment according to the present inventive concept Figure 1A An exploded perspective view of an electronic device;

[0030] Figure 2 According to an exemplary embodiment of the present invention Figure 1A A block diagram of an electronic device;

[0031] Figure 3A is a diagram showing an exemplary embodiment according to the present inventive concept Figure 2 An exploded perspective view of some of the components of

[0032] Figure 3B According to an exemplary embodiment of the present invention Figure 3A A perspective view of some of the components;

[0033] Figure 4 is a rear view showing a portion of a display unit according to an exemplary embodiment of the present inventive concept;

[0034] Figure 5 According to an exemplary embodiment of the present invention, Figure 4 A cross-sectional view taken along line II';

[0035] Fig. 6A is a rear view showing a lower panel according to an exemplary embodiment of the present inventive concept;

[0036] Figure 6B According to an exemplary embodiment of the present invention, Fig. 6A A cross-sectional view taken along line II-II';

[0037] Figure 7 is a cross-sectional view illustrating a portion of a display unit according to an exemplary embodiment of the present inventive concept;

[0038] Figure 8 is a cross-sectional view illustrating a portion of a display unit according to an exemplary embodiment of the present inventive concept; and

[0039] Fig. 9 is a rear view illustrating a display unit according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0040] The inventive concept will now be described more fully below with reference to the accompanying drawings, in which various exemplary embodiments are shown. However, the inventive concept can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Throughout the specification, the same reference numerals refer to the same elements.

[0041] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element, it can be directly on the other element, or there can be intervening elements. Conversely, the term "directly" means that there are no intervening elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0042] The terms used herein are used only for the purpose of describing specific exemplary embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an", and "the" are intended to include plural forms (including "at least one") unless the context clearly indicates otherwise. "Or" means "and / or". It will be further understood that when used in this specification, the terms "comprises" and / or "comprising" or "includes" and / or "including" specify the presence of the features, regions, wholes, steps, operations, elements, and / or components set forth, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or combinations thereof.

[0043] For ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of an element or feature as shown in the figure to another element or feature. It should be understood that in addition to the orientation depicted in the drawings, the spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" may encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0044] It will be understood that although the terms first, second, etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0045] As used herein, "about" or "approximately" includes the stated value and the average within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and errors associated with the measurement of the particular quantity (e.g., limitations of the measurement system).

[0046] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary illustrations. In the accompanying drawings, the thickness of layers and regions may be exaggerated for clarity. In this way, variations in the shapes illustrated, such as due to manufacturing techniques and / or tolerances, should be expected. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions as shown herein, but should include deviations in shapes, such as those caused by manufacturing. For example, an etched region shown as a rectangle will typically have rounded or curved features. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments. Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings.

[0047] Figure 1A is a perspective view illustrating an electronic device according to an exemplary embodiment of the inventive concept. Figure 1B It is shown Figure 1A An exploded perspective view of an electronic device. Figure 2 yes Figure 1A Block diagram of an electronic device.

[0048] The electronic device ED may be activated by an electrical signal. According to an exemplary embodiment, the electronic device ED may be in various forms, including a tablet computer, a laptop computer, a personal computer, a smart TV, a smart phone, etc. In the present exemplary embodiment, the electronic device ED is a smart phone. However, exemplary embodiments of the inventive concept are not limited thereto.

[0049] The electronic device ED may display an image IM on a display surface IS extending in a first direction D1 and a second direction D2. In an exemplary embodiment, the display surface IS displaying the image IM may correspond to a front surface of the electronic device ED (e.g., a top surface in a third direction D3). The image IM may include a dynamic image, a static image, or a combination thereof. Figure 1A , a time display frame and application icons are shown as examples of the image IM.

[0050] In the present exemplary embodiment, the front surface (e.g., the top surface in the third direction D3) and the rear surface (e.g., the bottom surface in the third direction D3) of each component may be defined based on the direction (e.g., the third direction D3) in which the image IM is displayed. The front surface and the rear surface may be opposite to each other in the third direction D3, and the normal direction of each of the front surface and the rear surface may be parallel to the third direction D3.

[0051] The distance between the front surface and the rear surface in the third direction D3 may correspond to the thickness or height of the electronic device ED in the third direction D3. However, the directions indicated by the first direction D1, the second direction D2, and the third direction D3 are relative concepts and may be changed to other directions. In the following, the first direction, the second direction, and the third direction are respectively Figure 1A The directions indicated by the first direction D1, the second direction D2 and the third direction D3 shown in FIG.

[0052] The display surface IS (e.g., front surface) of the electronic device ED may be divided into a transmission area TA and a frame area BZA. The transmission area TA may be an area where an image IM is displayed. A user may observe the image IM through the transmission area TA. In the present exemplary embodiment, the transmission area TA has a quadrilateral (or rectangular) shape with rounded corners. However, exemplary embodiments of the inventive concept are not limited thereto, and in other exemplary embodiments, the transmission area TA may have various shapes.

[0053] The border area BZA may be adjacent to the transmission area TA. For example, the border area BZA may surround the transmission area TA in the first direction D1 and / or the second direction D2. The border area BZA may have a predetermined color. The shape of the transmission area TA in a plan view (for example, when viewed from a third direction D3) may be roughly defined by the border area BZA. However, exemplary embodiments of the present invention are not limited thereto. In other exemplary embodiments, the border area BZA may be adjacent to only one side of the transmission area TA, or may be omitted. The electronic device ED according to the present invention may be implemented differently and is not limited to a specific embodiment.

[0054] The electronic device ED can sense a user's fingerprint FNG applied from the outside. Therefore, the electronic device ED can provide a fingerprint sensing area FRA in the display surface IS. In the present exemplary embodiment, the fingerprint sensing area FRA is disposed in a portion of the transmission area TA (e.g., the lower portion of the transmission area TA in the first direction D1) that displays the image IM. However, the exemplary embodiments of the present inventive concept are not limited thereto. For example, in other exemplary embodiments, the fingerprint sensing area FRA may be disposed in the bezel area BZA, may be disposed in the entire transmission area TA, or may be disposed on the entire display surface IS. The electronic device ED can sense the fingerprint FNG provided in the fingerprint sensing area FRA.

[0055] The user's fingerprint FNG may include a surface state of the user's hand or finger (e.g., a degree of surface uniformity or topography). However, exemplary embodiments of the inventive concept are not limited thereto. In another exemplary embodiment, when an input (e.g., a touch) of an object or another part of the user's body is provided to the electronic device ED, the electronic device ED may sense information on the surface of the other part of the object or the user's body.

[0056] refer to Figure 1B and Figure 2 The electronic device ED may include a display module DD, an electronic module EM, a power module PM, a bracket BRK and a housing EDC. Figure 1B A schematic diagram of components of the electronic device ED is shown in FIG.

[0057] The display module DD may include a window member WM and a display unit DU. Figure 1A As shown in , the window member WM may form the appearance of the electronic device ED in an assembled state. The window member WM may protect internal components of the electronic device ED from external impacts, and may be a component that provides a display surface IS of the electronic device ED.

[0058] The display unit DU may be disposed on a rear surface (eg, in the third direction D3) of the window member WM. The display unit DU may include a display panel DP and a fingerprint sensing unit FSU (see FIG. Figure 3A ). The display panel DP may be a component that generates an image IM. The image IM generated from the display panel DP may be displayed on the display surface IS through the transmissive area TA and thus may be visible to a user.

[0059] The fingerprint sensing unit FSU may sense the user's fingerprint FNG applied from the outside. As described above, the fingerprint sensing unit FSU may sense the user's fingerprint FNG provided to the fingerprint sensing area FRA. This will be described in detail later.

[0060] The display unit DU can be connected to the main circuit board MPC (see Figure 3A ) is electrically connected to the electronic module EM. The display unit DU can receive data about the image IM to be displayed through the electronic module EM. In addition, the display unit DU can provide the electronic module EM with data about the sensed user's fingerprint FNG, and can provide the user with information processed based on the data.

[0061] The power module PM may provide power necessary for overall operation of the electronic device ED. The power module PM may include a battery module.

[0062] The bracket BRK may be coupled to the display module DD and / or the housing EDC to divide the internal space of the electronic device ED formed between the housing EDC and the window member WM. The bracket BRK may provide a space for arranging other components. In addition, the bracket BRK may support the display module DD to ensure the position of the display module DD and prevent the display module DD from shaking or accidentally moving. A coupling groove corresponding to the shape of the electronic module EM may be defined in the bracket BRK to ensure the positioning of the electronic module EM. The bracket BRK may include a metal or plastic member. A single bracket BRK is shown as an example. However, in other exemplary embodiments, the electronic device ED may include a plurality of brackets BRK.

[0063] The housing EDC can be connected to the bracket BRK and / or the display module DD. Figure 1B In the exemplary embodiment shown in FIG. 1 , the housing EDC may form the appearance of the electronic device ED together with the window member WM. Figure 1B In the exemplary embodiment shown in , a housing EDC having a single integral body is shown. However, the exemplary embodiments of the present inventive concept are not limited thereto. In another exemplary embodiment, the housing EDC may include a plurality of bodies assembled to each other. The housing EDC may include a plurality of frames and / or plates formed of glass, plastic, and / or metal.

[0064] The electronic module EM may be mounted on the main board and may include various functional modules for operating the electronic device ED. The main board may be electrically connected to the main circuit board MPC of the display unit DU (see Figure 3A ). In an exemplary embodiment, the main board may include a rigid printed circuit board.

[0065] refer to Figure 2 , the electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, a sound input module 40, a sound output module 50, a memory 60, an external interface 70, a light emitting module 80, a light receiving module 90, and / or a camera module 100. In an exemplary embodiment, some of the components (e.g., modules) may not be mounted on the main board but may be electrically connected to the main board through a flexible circuit board.

[0066] The control module 10 may control the overall operation of the electronic device ED. The control module 10 may include a microprocessor. For example, the control module 10 may activate or deactivate the display module DD. The control module 10 may control the image input module 30, the sound input module 40, and the sound output module 50 according to the touch signal received from the display module DD.

[0067] The wireless communication module 20 can send / receive wireless signals to / from other terminals by using Bluetooth or Wi-Fi. The wireless communication module 20 can send / receive voice signals by using a general communication line. The wireless communication module 20 may include a transmitter 24 and a receiver 22, the transmitter 24 is configured to modulate a signal to be transmitted and transmit the modulated signal, and the receiver 22 is configured to demodulate the received signal.

[0068] The image input module 30 may process the image signal to convert the image signal into image data available in the display module DD. The sound input module 40 may receive an external sound signal through a microphone in a recording mode or a voice recognition mode, and may convert the received sound signal into electrical sound data. The sound output module 50 may convert the sound data received from the wireless communication module 20 or the sound data stored in the memory 60, and may output the converted sound data to the outside.

[0069] The external interface 70 may be connected to and interface with an external charger, a cable / wireless data port, and / or a card socket (eg, a memory card or a SIM / UIM card).

[0070] The light emitting module 80 may generate light and may output the generated light. In an exemplary embodiment, the light emitting module 80 may output infrared light. The light emitting module 80 may include a light emitting diode (LED) element. The light receiving module 90 may sense the infrared light. When infrared light greater than or equal to a predetermined intensity level is sensed, the light receiving module 90 may be activated. The light receiving module 90 may include a CMOS sensor. After the infrared light generated in the light emitting module 80 is output, the infrared light may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared light may be incident on the light receiving module 90. The camera module 100 may acquire an external image.

[0071] Figure 3A It is shown Figure 2 Exploded perspective views of some of the components. Figure 3B yes Figure 3A A perspective view of some of the components. Figure 4 is a rear view illustrating a portion of a display unit according to an exemplary embodiment of the inventive concept. Figure 5 It is along Figure 4 A cross-sectional view taken along line II'. Fig. 6A is a rear view illustrating a lower panel according to an exemplary embodiment of the present inventive concept. Figure 6B It is along Fig. 6A A cross-sectional view taken along line II-II'.

[0072] Figure 3A shows an exploded perspective view of the display module DD, and Figure 3BFIG. 1 shows a perspective view of the display unit DU except the window member WM. Figure 3A and Figure 3B Exemplary embodiments of the present inventive concept are described.

[0073] As described above, the window member WM may include the display surface IS including the optically transparent transmission area TA and the bezel area BZA adjacent to the transmission area TA. Figure 3A The window widget WM can correspond to Figure 1B The window member WM is shown in FIG. 1 , and therefore descriptions of the same features as above will be omitted.

[0074] The display unit DU may be disposed on the rear surface of the window member WM. For example, the bottom surface (e.g., in the third direction D3) of the window member WM may contact the top surface (e.g., in the third direction D3) of the display unit DU. The display unit DU may include a display panel DP, a main circuit board MPC, a lower panel CVP, and a fingerprint sensing unit FSU.

[0075] The display panel DP may include a front surface DP-U and a rear surface DP-B opposite to the front surface DP-U. The front surface DP-U may face the window member WM (for example, in the third direction D3). The front surface DP-U may include an active area AA and a peripheral area NAA. In an exemplary embodiment, the display panel DP may include a plurality of layers stacked along the third direction D3, and the rear surface DP-B of the display panel DP may be defined by a layer closest to the lower panel CVP among the stacked layers of the display panel DP.

[0076] The display panel DP may activate the active area AA by an electrical signal. The display panel DP may display an image IM (see FIG. 1 ) in the activated active area AA. In an exemplary embodiment, the transmissive area TA may overlap at least the entire portion of the active area AA.

[0077] The peripheral area NAA may be adjacent to the active area AA. The peripheral area NAA may surround at least one edge of the active area AA in a plan view (eg, when viewed from a third direction D3). Figure 3A As shown in the exemplary embodiment of the present invention, the peripheral area NAA may surround each of the edges of the active area AA in the first direction D1 and / or the second direction D2. However, exemplary embodiments of the present inventive concept are not limited thereto. In another exemplary embodiment, the peripheral area NAA may be adjacent to only a portion of one or more edges of the active area AA.

[0078] Various signal lines and / or electronic components for providing electrical signals to the active area AA may be disposed in the peripheral area NAA. The peripheral area NAA may be covered by the bezel area BZA and thus may not be visible from the outside.

[0079] The display panel DP may include a plurality of signal lines, pixels PX, and a plurality of display pads PDD. The signal lines may include gate lines GL, data lines DL, and power lines PL. The gate lines GL, data lines DL, and power lines PL may transmit different electrical signals from each other.

[0080] In an exemplary embodiment, the gate line GL may extend in the second direction D2. The gate line GL may be provided in plurality, and the plurality of gate lines GL may be spaced apart from each other and may be arranged in the first direction D1. Figure 3A , for the purpose of ease and convenience of description, a single gate line GL is shown as an example.

[0081] In an exemplary embodiment, the display unit DU may further include a gate driving circuit mounted on the display panel DP to provide an electrical signal to the gate line GL. In this embodiment, the gate driving circuit pad for providing an electrical signal to the gate driving circuit may be one of the display pads PDD. Alternatively, the display panel DP may further include a gate pad electrically connected to a gate driving circuit disposed outside the display panel DP. These gate pads may include some of the display pads PDD.

[0082] In an exemplary embodiment, the data line DL may extend in the first direction D1. The data line DL may be electrically insulated from the gate line GL. The data line DL may be provided in plurality, and the plurality of data lines DL may be spaced apart from each other and may be arranged in the second direction D2. Figure 3A In the embodiment, for the purpose of easy and convenient description, a single data line DL is shown as an example. The data line DL may be connected to a data pad corresponding to one of the display pads PDD. The data line DL may provide a data signal received through the data pad to the pixel PX.

[0083] In an exemplary embodiment, the power line PL may extend in the first direction D1. The power line PL may be electrically insulated from the gate line GL and the data line DL. The power line PL may be provided in plurality, and the plurality of power lines PL may be spaced apart from each other and may be arranged in the second direction D2. Figure 3A , for the purpose of ease and convenience of description, a single power line PL is shown as an example. The power line PL may provide a power signal to the pixel PX.

[0084] At least some of the components included in the pixel PX may overlap the active area AA. The pixel PX may be provided in plurality, and each of the pixels PX may be connected to a corresponding signal line. The pixel PX may display light through an electrical signal to generate an image IM. Figure 3A , for the purpose of ease and convenience of description, a single pixel PX is shown as an example.

[0085] The pixel PX may include a first thin film transistor TR1, a second thin film transistor TR2, a capacitor CP, and a light emitting element EMD. The first thin film transistor TR1, the second thin film transistor TR2, the capacitor CP, and the light emitting element EMD may be electrically connected to each other.

[0086] The first thin film transistor TR1 may be a switching element configured to control turning on and off of the pixel PX. The first thin film transistor TR1 may be connected to the gate line GL and the data line DL. The first thin film transistor TR1 may be turned on by a gate signal provided through the gate line GL, and may provide a data signal provided through the data line DL to the capacitor CP when it is turned on.

[0087] The capacitor CP may store a voltage corresponding to a potential difference between a first power signal supplied from the power line PL and a data signal supplied from the first thin film transistor TR1. The second thin film transistor TR2 may supply an electric signal to the light emitting element EMD in response to the voltage stored in the capacitor CP.

[0088] The light emitting element EMD may be disposed in the active area AA. The light emitting element EMD may generate light or control the amount of light in response to an electrical signal. For example, the light emitting element EMD may include an organic light emitting element, a quantum dot light emitting element, an electrophoresis element, or an electrowetting element. However, exemplary embodiments of the inventive concept are not limited thereto.

[0089] The light emitting element EMD may be connected to a power supply voltage and may receive a second power signal having a power level lower than a power level of a first power signal provided by the power line PL. A driving current corresponding to a difference between the second power signal and an electric signal provided from the second thin film transistor TR2 may flow through the light emitting element EMD. The light emitting element EMD may generate light corresponding to the driving current.

[0090] However, exemplary embodiments of the inventive concept are not limited thereto. Components of the pixel PX may be variously modified or changed, and may be variously arranged.

[0091] The display pads PDD may be disposed in the peripheral area NAA. The display pads PDD may be connected to the signal lines, respectively. Figure 3A As shown in , the display pad PDD may be disposed on a bottom portion (e.g., in the first direction D1) of the peripheral area NAA and may be connected to the power line PL and the data line DL extending in the first direction D1. In an exemplary embodiment, the pixel PX may be electrically connected to a component disposed outside the display panel DP through the display pad PDD. For example, the display pad PDD may be connected to a pad included in the main circuit board MPC.

[0092] like Figure 4As shown in the exemplary embodiment of , the main circuit board MPC may include a main flexible film CB-M and a main driving device IC-M. The main circuit board MPC may be connected to the display pad PDD. The main circuit board MPC may provide an electrical signal to the display panel DP through the display pad PDD. The main circuit board MPC may generate a signal and / or a power signal for controlling the image IM, and may provide the generated signal to the display panel DP.

[0093] In an exemplary embodiment, a portion of the main circuit board MPC may be connected to the front surface DP-U of the display panel DP. Another portion of the main circuit board MPC may be bent to face the rear surface DP-B of the display panel DP. As described above, the main circuit board MPC may include a main flexible film CB-M and a main driving device IC-M.

[0094] The main flexible film CB-M may include a main connector CB-MC, a pad, and a signal line. The main flexible film CB-M may be connected to the display pad PDD through the pad, and thus may be electrically connected to the display panel DP. The main flexible film CB-M may be electrically and physically connected to the display panel DP through an adhesive member such as an anisotropic conductive film. The main connector CB-MC may be bent toward the display panel DP and may be electrically connected to the electronic module EM.

[0095] The main driving device IC-M may be mounted on the main flexible film CB-M. The main driving device IC-M may be connected to the signal line of the main flexible film CB-M and thus may be electrically connected to the display panel DP. The main driving device IC-M may generate and / or process various electrical signals.

[0096] The lower panel CVP may be disposed on the rear surface DP-B of the display panel DP. The lower panel CVP may include a plurality of sheets ST1, ST2, and ST3 that may extend in the first direction D1 and the second direction D2. The lower panel CVP may include an opening OP in which the fingerprint sensing unit FSU is positioned (e.g., installed). The sheets ST1, ST2, and ST3 may be sequentially stacked in the third direction D3.

[0097] The sheets ST1, ST2, and ST3 may include openings OP1, OP2, and OP3, respectively, and the opening OP (eg, a main opening) of the lower panel CVP may be defined by the openings OP1, OP2, and OP3 of the sheets ST1, ST2, and ST3 overlapping each other in the third direction D3. Figure 3AIn the exemplary embodiment shown in FIG. 1 , the openings OP1, OP2, and OP3 include rectangular openings extending in the first direction D1 and the second direction D2. However, the exemplary embodiments of the inventive concept are not limited thereto, and the openings may have many different shapes and sizes. In addition, although the exemplary embodiment shows a plurality of sheets including three sheets, in other exemplary embodiments, there may be only two sheets or there may be four sheets or more sheets.

[0098] The first sheet ST1 may be closest to the rear surface DP-B of the display panel DP (e.g., in the third direction D3). In an exemplary embodiment, the bottom surface of the display panel DP (e.g., in the third direction D3) may directly contact the top surface of the first sheet ST1 (e.g., in the third direction D3). Figure 5 As shown in the exemplary embodiment of FIG. 1 , the first sheet ST1 may include a first functional layer FL1 having a buffer function and a first adhesive layer AH1 disposed on the first functional layer FL1. Figure 5 As shown in the exemplary embodiment of , the first adhesive layer AH1 may be disposed on the bottom surface of the first functional layer FL1 (e.g., in the third direction D3). The first sheet ST1 may include a first opening OP1 that penetrates a portion of the first sheet ST1 along the third direction D3. The first opening OP1 may overlap the fingerprint sensing unit FSU in the third direction D3.

[0099] In an exemplary embodiment, the first functional layer FL1 may include a synthetic resin foam including a matrix member and a plurality of pores. The matrix member may include a flexible material. For example, the matrix member may include a synthetic resin. The pores may easily absorb an impact applied to the display panel DP. The first sheet ST1 may have a porous structure, and the pores may be dispersed throughout the matrix member. The pores may allow the shape of the first sheet ST1 to be easily deformed. Therefore, the elasticity of the first sheet ST1 may be improved to increase the impact resistance of the lower panel CVP.

[0100] The first adhesive layer AH1 may couple the first functional layer FL1 to the second sheet ST2 (e.g., the second functional layer FL2 of the second sheet ST2). The first adhesive layer AH1 may be optically transparent or optically clear. For example, in an exemplary embodiment, the first adhesive layer AH1 may include at least one of an optically transparent resin (OCR), an optically transparent adhesive (OCA), and a pressure-sensitive adhesive (PSA). Alternatively, the first adhesive layer AH1 may be a double-sided tape. However, exemplary embodiments of the inventive concept are not limited to specific embodiments.

[0101] The second sheet ST2 may be disposed between the first sheet ST1 and the third sheet ST3 (e.g., in the third direction D3). The second sheet ST2 may include a second functional layer FL2 having a heat dissipation function and a second adhesive layer AH2 disposed on the second functional layer FL2. For example, the second adhesive layer AH2 may be disposed on the bottom surface of the second functional layer FL2 (e.g., in the third direction D3). The second sheet ST2 may include a second opening OP2 that penetrates a portion of the second sheet ST2 along the third direction D3. The second opening OP2 may overlap with the fingerprint sensing unit FSU in the third direction D3.

[0102] In an exemplary embodiment, the second functional layer FL2 may be a sheet including a metal material having high thermal conductivity, such as copper or aluminum. The metal having high thermal conductivity may absorb heat to provide a heat dissipation function.

[0103] The second adhesive layer AH2 may couple the second functional layer FL2 to the third sheet ST3. The second adhesive layer AH2 may be optically transparent or optically clear. For example, the second adhesive layer AH2 may include the same resin or adhesive as the first adhesive layer AH1, or may include a double-sided tape. However, exemplary embodiments of the present inventive concept are not limited thereto.

[0104] The third sheet ST3 may be disposed on the second sheet ST2. For example, the top surface of the third sheet ST3 (eg, in the third direction D3) may be disposed on the bottom surface of the second sheet ST2 (eg, in the third direction D3). Figure 5 As shown in , the third sheet ST3 may include a third functional layer FL3 having a light shielding function and a third adhesive layer AH3 disposed on the third functional layer FL3. For example, the third adhesive layer AH3 may be disposed on the bottom surface of the third functional layer FL3 (e.g., in the third direction D3). The third sheet ST3 may include a third opening OP3 that penetrates a portion of the third sheet ST3 along the third direction D3. The third opening OP3 may overlap the fingerprint sensing unit FSU in the third direction D3.

[0105] The third functional layer FL3 may prevent components disposed on the rear surface DP-B of the display panel DP from being visible to the outside. However, exemplary embodiments of the inventive concept are not limited thereto. In another exemplary embodiment, the third sheet ST3 may be a light shielding layer formed directly on the rear surface DP-B of the display panel DP. In this embodiment, the third sheet ST3 may be formed by coating the rear surface DP-B of the display panel DP with a material such as carbon and / or chromium, and a separate adhesive layer may be omitted.

[0106] The third adhesive layer AH3 may couple the third functional layer FL3 to the main circuit board MPC. The third adhesive layer AH3 may be optically transparent or optically clear. For example, the third adhesive layer AH3 may include the same resin or adhesive as the first adhesive layer AH1, or may include a double-sided tape. However, exemplary embodiments of the present inventive concept are not limited thereto.

[0107] According to an exemplary embodiment of the present inventive concept, the opening OP of the lower panel CVP may be defined by overlapping portions of the openings OP1, OP2, and OP3 (e.g., in the third direction D3) of the sheets ST1, ST2, and ST3. In an exemplary embodiment, the area of ​​at least one of the openings OP1, OP2, and OP3 may be different from the area of ​​at least one of the other openings. For example, Figure 5 As shown in , the area of ​​the first opening OP1 of the first sheet ST1 may be smaller than the area of ​​the second opening OP2 of the second sheet ST2 and the area of ​​the third opening OP3 of the third sheet ST3. Figure 5 The length of the first opening OP1 of the first sheet ST1 shown in the exemplary embodiment in the first direction D1 and / or the second direction D2 may be smaller than the corresponding lengths of the openings OP2 and OP3 of the second sheet ST2 and the third sheet ST3. Therefore, when viewed from the rear surface of the lower panel CVP (e.g., in the third direction D3), a portion of the first sheet ST1 may be exposed by the second opening OP2 and the third opening OP3.

[0108] like Figure 4 and Figure 5 As shown in , the fingerprint sensing unit FSU may be disposed on the rear surface DP-B of the display panel DP. The fingerprint sensing unit FSU may include a fingerprint sensor FS, an adhesive portion HA, and a sensing circuit board FPC. The sensing circuit board FPC may be electrically connected to the rear surface FS-B of the fingerprint sensor FS. The fingerprint sensor FS may also include a front surface FS-U opposite to the rear surface FS-B.

[0109] The fingerprint sensor FS may include at least one sensor. In an embodiment where the fingerprint sensor FS includes a plurality of sensors, one or more sensors may be driven by various different methods. For example, the fingerprint sensor FS may include an optical fingerprint sensor that senses incident light by using a light sensor, an ultrasonic fingerprint sensor that senses vibration by using a piezoelectric material, and the like. However, exemplary embodiments of the inventive concept are not limited thereto.

[0110] In an exemplary embodiment, the opening OP defined in the lower panel CVP may be configured to receive the fingerprint sensor FS. For example, the fingerprint sensor FS may be received in the opening OP of the lower panel CVP and may be disposed on the rear surface DP-B of the display panel DP in the opening OP.

[0111] exist Figure 3B , for the purpose of easy and convenient description and illustration, the area in which the fingerprint sensor FS is disposed (for example, the fingerprint sensor FS is disposed on the rear side of the display panel DP) is shown in dotted lines. In the present exemplary embodiment, the fingerprint sensor FS may overlap with the active area AA (for example, in the third direction D3). In an exemplary embodiment, the fingerprint sensor FS received in the opening OP may be spaced apart from the sidewall of the opening OP, and a space GP may be defined between the fingerprint sensor FS and the sidewall of the opening OP (for example, in the first direction D1 and / or the second direction D2).

[0112] The adhesive portion HA may couple the fingerprint sensor FS to the rear surface DP-B of the display panel DP. In an exemplary embodiment, the adhesive portion HA may have a closed line shape surrounding the fingerprint sensor FS received in the opening OP when viewed in a plan view. Figure 4 In the exemplary embodiment shown in FIG. 1 , the adhesive portion HA may have a substantially rectangular shape extending in the first direction D1 and the second direction D2, which surrounds the fingerprint sensor FS. However, exemplary embodiments of the inventive concept are not limited thereto. The adhesive portion HA may partially overlap the space GP, but may be spaced apart from the sidewall of the opening OP by a predetermined distance. Therefore, interference between the lower panel CVP and the adhesive portion HA may be minimized.

[0113] The adhesive portion HA may be optically transparent or optically clear. For example, the adhesive portion HA may include at least one of an optically transparent resin (OCR), an optically transparent adhesive (OCA), and a pressure-sensitive adhesive (PSA). In the present embodiment, even if the fingerprint sensor FS is operated by an optical method, the amount of light provided to the fingerprint sensor FS may be suppressed or prevented from being reduced due to the adhesive portion HA. Therefore, regardless of the operating method of the fingerprint sensor FS, the adhesive portion HA may stably couple the fingerprint sensor FS to the display panel DP.

[0114] In an exemplary embodiment, the sensing circuit board FPC may be electrically connected to the main circuit board MPC and bent toward the rear surface DP-B of the display panel DP. The sensing circuit board FPC may include a sensing circuit film CB-F and a sensing driving device IC-F.

[0115] The sensing circuit film CB-F may include a sensing connector CB-FC and a signal line. The sensing circuit film CB-F may be connected to the fingerprint sensor FS through an adhesive member such as an anisotropic conductive film. Alternatively, the sensing circuit film CB-F may be coupled to the fingerprint sensor FS through a connector. The sensing connector CB-FC may be electrically connected to the main circuit board MPC.

[0116] The sensing driver IC-F may be mounted on the sensing circuit film CB-F. The sensing driver IC-F may be connected to the signal line of the sensing circuit film CB-F and thus may be electrically connected to the fingerprint sensor FS. The sensing driver IC-F may receive a fingerprint FNG (see FIG. 1 ) from the fingerprint sensor FS. Figure 1A ) and can process the received electrical signals.

[0117] According to an exemplary embodiment of the inventive concept, a portion of the first sheet ST1 contacting the rear surface DP-B of the display panel DP may be exposed by the second and third sheets ST2 and ST3 and may contact a portion of the sensing circuit board FPC.

[0118] like Fig. 6A and Figure 6B As shown in , in the present exemplary embodiment, the area of ​​the first opening OP1 of the first sheet ST1 may be smaller than the area of ​​the second opening OP2 of the second sheet ST2 and the area of ​​the third opening OP3 of the third sheet ST3. For example, the length of the first opening OP1 in the first direction D1 and / or the second direction D2 may be smaller than the corresponding lengths of the second opening OP2 and the third opening OP3.

[0119] For example, the first opening OP1 may have a first width W1 in the first direction D1, and each of the second opening OP2 and the third opening OP3 may have a second width W2 in the first direction D1. Figure 6B In the exemplary embodiment shown in , the first width W1 is smaller than the second width W2. In addition, in a plan view (eg, when viewed from a third direction D3), an area of ​​the first opening OP1 may be smaller than areas of the second opening OP2 and the third opening OP3.

[0120] Since the area of ​​the first opening OP1 is smaller than the areas of the second opening OP2 and the third opening OP3 , a portion of the first sheet ST1 may be exposed through the second opening OP2 and the third opening OP3 .

[0121] For example, a surface of the first sheet ST1 facing the rear surface DP-B of the display panel DP may be defined as a front surface of the first sheet ST1. Another surface of the first sheet ST1 opposite to the front surface of the first sheet ST1 may be defined as a rear surface of the first sheet ST1. A portion of the rear surface of the first sheet ST1 may be exposed through the second opening OP2 and the third opening OP3.

[0122] According to an exemplary embodiment of the inventive concept, a portion ST1-N of the rear surface of the first sheet ST1 exposed through the second opening OP2 and the third opening OP3 may contact a portion of the sensing circuit board FPC. A portion ST1-N of the rear surface of the first sheet ST1 exposed through the second opening OP2 and the third opening OP3 may be defined as an exposed area NA.

[0123] In an exemplary embodiment, the sensing circuit board FPC may be connected to the fingerprint sensor FS and may extend into the exposed area NA in the first direction D1.

[0124] The sensing circuit board FPC extending in the exposed area NA may contact the portion ST1-N of the rear surface of the first sheet ST1. The first adhesive layer AH1 may be exposed at the portion ST1-N of the rear surface of the first sheet ST1. Therefore, the sensing circuit board FPC extending in the exposed area NA may be stably coupled to the first sheet ST1 through the first adhesive layer AH1.

[0125] refer to Figure 5 In the present exemplary embodiment, the fingerprint sensing unit FSU may have a first thickness TH1. The first thickness TH1 may be defined as the sum of the thickness of the fingerprint sensor FS and the thickness of the adhesive portion HA in the third direction D3.

[0126] The first sheet ST1 of the lower panel CVP may have a second thickness TH2. The second thickness TH2 may be defined as the sum of the thickness of the first functional layer FL1 and the thickness of the first adhesive layer AH1 in the third direction D3.

[0127] In the present exemplary embodiment, the first thickness TH1 may be equal to the second thickness TH2. Therefore, the height (e.g., the distance in the third direction D3) from the rear surface DP-B of the display panel DP to the sensing circuit board FPC overlapping the fingerprint sensor FS (e.g., in the third direction D3) may be equal to the height from the rear surface DP-B of the display panel DP to the sensing circuit board FPC overlapping the exposed area NA. Therefore, the sensing circuit board FPC may be stably disposed on the fingerprint sensor FS and the portion ST1-N of the rear surface of the first sheet ST1.

[0128] According to an exemplary embodiment of the inventive concept, the lower panel CVP may include sheets ST1, ST2, and ST3 having openings OP1, OP2, and OP3 of different areas, and the sensing circuit board FPC may be disposed on a portion ST1-N of a rear surface of the first sheet ST1 having the same height as the fingerprint sensor FS. Therefore, stress that may occur at the sensing circuit board FPC due to a height difference between the fingerprint sensor FS and the sheets ST1, ST2, and ST3 may be minimized.

[0129] Therefore, the adhesive strength between the sensing circuit board FPC and the fingerprint sensor FS can be increased, and the coupling strength between the fingerprint sensor FS and the rear surface DP-B of the display panel DP can also be increased. Figure 1A )’s fingerprint sensing function.

[0130] Figure 7 is a cross-sectional view showing a portion of a display unit according to an exemplary embodiment of the present inventive concept. Figures 1A to 6B The same / similar components as those in the exemplary embodiments of the present invention will be denoted by the same / similar reference numerals, and the reference numerals identical to those in the exemplary embodiments of the present invention will be omitted. Figures 1A to 6B The components and features in the exemplary embodiments are the same as those in the description.

[0131] refer to Figure 7 In the present exemplary embodiment, the lower panel CVP-A may include a first sheet STA1 having a first functional layer FLA1 and a first adhesive layer AHA1, a second sheet STA2 having a second functional layer FLA2 and a second adhesive layer AHA2, and a third sheet STA3 having a third functional layer FLA3 and a third adhesive layer AHA3.

[0132] exist Figure 7 In the exemplary embodiment of the present invention, the fingerprint sensing unit FSU may have a third thickness TH3. The third thickness TH3 may be defined as the sum of the thickness of the fingerprint sensor FS and the thickness of the adhesive portion HA in the third direction D3.

[0133] The first sheet STA1 of the lower panel CVP-A may have a fourth thickness TH4. The fourth thickness TH4 may be defined as the sum of the thickness of the first functional layer FLA1 and the thickness of the first adhesive layer AHA1 in the third direction D3.

[0134] In the present exemplary embodiment, the fourth thickness TH4 may be smaller than the third thickness TH3. Therefore, the height from the rear surface DP-B of the display panel DP to the sensing circuit board FPC overlapping with the fingerprint sensor FS (e.g., the distance in the third direction D3) may be greater than the height from the rear surface DP-B of the display panel DP to the sensing circuit board FPC overlapping with the exposed area NA (e.g., the distance in the third direction D3). Therefore, the sensing circuit board FPC may be bent in a direction from the fingerprint sensor FS toward the exposed area NA. For example, a portion of the sensing circuit board FPC overlapping with the space GP in the third direction D3 may be bent. The bent portion may be bent from the fingerprint sensor FS toward the display panel DP (in the third direction D3) to the exposed area NA of the first piece STA1.

[0135] According to an exemplary embodiment of the inventive concept, the lower panel CVP-A may include sheets STA1, STA2, and STA3 having openings OP1, OP2, and OP3 having different areas, and the sensing circuit board FPC may be disposed on an exposed portion STA1-N of a rear surface of the first sheet STA1 having a height lower than the fingerprint sensor FS. Therefore, stress that may occur at the sensing circuit board FPC due to a height difference between the fingerprint sensor FS and the sheets STA1, STA2, and STA3 may be minimized.

[0136] Therefore, the adhesive strength between the sensing circuit board FPC and the fingerprint sensor FS can be increased, and the coupling strength between the fingerprint sensor FS and the rear surface DP-B of the display panel DP can also be increased. Figure 1A )’s fingerprint sensing function.

[0137] Figure 8 is a cross-sectional view showing a portion of a display unit according to an exemplary embodiment of the inventive concept. Figure 8 In the exemplary embodiment shown in Figures 1A to 6B The same / similar components as those in the exemplary embodiments of the present invention will be denoted by the same / similar reference numerals, and the reference numerals identical to those in the exemplary embodiments of the present invention will be omitted. Figures 1A to 6B The components and features in the exemplary embodiments are the same as those in the description.

[0138] refer to Figure 8 In the present exemplary embodiment, the lower panel CVP-B may include a first sheet STB1 having a first functional layer FLB1 and a first adhesive layer AHB1, a second sheet STB2 having a second functional layer FLB2 and a second adhesive layer AHB2, and a third sheet STB3 having a third functional layer FLB3 and a third adhesive layer AHB3.

[0139] The lower panel CVP-B may include sheets STB1, STB2, and STB3 having openings OP1, OP2, and OP3 of different areas.

[0140] For example, in an exemplary embodiment, the areas of the first opening OP1 and the second opening OP2 (e.g., the lengths of the sides in the first direction D1 and / or the second direction D2) may be equal to each other, and the area of ​​the third opening OP3 may be greater than the areas of the first opening OP1 and the second opening OP2. Figure 8 As shown in the exemplary embodiment of FIG. 5 , the width of the third opening OP3 in the first direction D1 may be greater than the corresponding widths of the first opening OP1 and the second opening OP2 .

[0141] exist Figure 8In the exemplary embodiment, the portion STB2-N of the rear surface of the second sheet STB2 exposed through the third opening OP3 may contact a portion of the sensing circuit board FPC. The portion STB2-N of the rear surface of the second sheet STB2 exposed through the third opening OP3 may be defined as an exposure area NA.

[0142] In the present exemplary embodiment, the fingerprint sensing unit FSU may have a fifth thickness TH5. The fifth thickness TH5 may be defined as the sum of the thickness of the fingerprint sensor FS and the thickness of the adhesive portion HA in the third direction D3.

[0143] The first sheet STB1 of the lower panel CVP-B may have a sixth thickness TH6. The sixth thickness TH6 may be defined as the sum of the thickness of the first functional layer FLB1 and the thickness of the first adhesive layer AHB1 in the third direction D3.

[0144] The sum of the thickness of the first sheet STB1 and the second sheet STB2 of the lower panel CVP-B may be a seventh thickness TH7. The seventh thickness TH7 may be defined as the sum of the thickness of the first functional layer FLB1, the thickness of the second functional layer FLB2, the thickness of the first adhesive layer AHB1, and the thickness of the second adhesive layer AHB2 in the third direction D3.

[0145] exist Figure 8 In the exemplary embodiment shown in , the sixth thickness TH6 may be less than the fifth thickness TH5, and the seventh thickness TH7 may be equal to the fifth thickness TH5. Therefore, the height from the rear surface DP-B of the display panel DP to the sensing circuit board FPC overlapping with the fingerprint sensor FS may be equal to the height from the rear surface DP-B of the display panel DP to the sensing circuit board FPC overlapping with the exposed area NA. Therefore, the sensing circuit board FPC may be stably disposed on the fingerprint sensor FS and the portion STB2-N of the rear surface of the second piece STB2. However, in another exemplary embodiment, the thickness of the fingerprint sensing unit FSU may be greater than the sum of the thicknesses of the first piece STB1 and the second piece STB2 of the lower panel CVP-B. That is, the fifth thickness TH5 may be greater than the seventh thickness TH7. Therefore, the sensing circuit board FPC may be bent in the direction from the fingerprint sensor FS toward the exposed area NA.

[0146] Fig. 9 is a rear view showing a display unit according to an exemplary embodiment of the present inventive concept. Figures 1A to 6B The same / similar components as those in the exemplary embodiments of the present invention will be denoted by the same / similar reference numerals, and the reference numerals identical to those in the exemplary embodiments of the present invention will be omitted. Figures 1A to 6B The components and features in the exemplary embodiments are the same as those in the description.

[0147] according to Fig. 9 The fingerprint sensing unit FSU1 of the exemplary embodiment may include a fingerprint sensor FS1, an adhesive portion HA1, and a sensing circuit board FPC1.

[0148] exist Fig. 9 In an exemplary embodiment of the present invention, the sensing circuit board FPC1 may include a first connecting portion CB-1, a second connecting portion CB-2, and a holding portion CB-3.

[0149] The first connection portion CB-1 may be connected to the fingerprint sensor FS1 and may extend into the exposed area NA in the first direction D1. The first connection portion CB-1 may overlap the exposed area NA (e.g., in the third direction D3). The second connection portion CB-2 may be disposed on the main circuit board MPC. The grip portion CB-3 may be disposed between the first connection portion CB-1 and the second connection portion CB-2 (e.g., in the first direction D1 and / or the second direction D2).

[0150] The grip portion CB- 3 may be a portion that a user grips in a process of coupling the sensing circuit board FPC1 to the fingerprint sensor FS1 or the main circuit board MPC.

[0151] Since the first connection portion CB-1 overlaps the exposed area NA, the first connection portion CB-1 may not be affected by the height difference between the lower panel CVP and the main circuit board MPC. Therefore, the first connection portion CB-1 may be stably coupled to the exposed area NA, and the coupling strength between the first connection portion CB-1 and the fingerprint sensor FS may be increased. Therefore, the reliability of the electronic device ED may be improved.

[0152] According to an exemplary embodiment of the inventive concept, the lower panel receiving the fingerprint sensing unit may include a sheet having openings of different areas, and a sensing circuit board of the fingerprint sensing unit may be disposed on a rear surface of the sheet, the height of the sheet being the same as or lower than the height of the fingerprint sensor. Therefore, stress that may occur at the sensing circuit board due to the height difference between the fingerprint sensor and the sheet may be minimized.

[0153] Therefore, the adhesive strength between the sensing circuit board and the fingerprint sensor can be increased, and the coupling strength between the fingerprint sensor and the display panel can also be increased. Therefore, the reliability of the electronic device can be improved.

[0154] Although the inventive concept has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above exemplary embodiments are not restrictive, but illustrative. Therefore, the scope of the inventive concept should be determined by the broadest permissible interpretation of the appended claims and their equivalents, and should not be restricted or limited by the above description.

Claims

1. Electronic devices, including: A display panel comprising a front surface and a rear surface opposite to the front surface; a lower panel including a plurality of sheets stacked on the rear surface of the display panel and an opening penetrating the sheets, wherein the opening exposes a portion of the rear surface of a first sheet, the first sheet having a front surface opposite to the exposed portion of the rear surface of the first sheet and contacting the display panel; and a fingerprint sensing unit, comprising a fingerprint sensor positioned in the opening and a sensing circuit board connected to the fingerprint sensor, Wherein, the exposed portion of the rear surface of the first sheet contacts a portion of the sensing circuit board.

2. The electronic device according to claim 1, wherein: The plurality of sheets of the lower panel include: The first sheet includes a first functional layer having a buffering function and a first adhesive layer disposed on the first functional layer; A second sheet including a second functional layer disposed on the first adhesive layer and having a heat dissipation function and a second adhesive layer disposed on the second functional layer; and The third sheet includes a third functional layer provided on the second adhesive layer and having a light shielding function, and a third adhesive layer provided on the third functional layer.

3. The electronic device according to claim 2, wherein: The opening comprises: a first opening located in the first sheet; a second opening located in the second sheet; and A third opening is located in the third sheet, wherein an area of ​​the second opening and an area of ​​the third opening are greater than an area of ​​the first opening.

4. The electronic device according to claim 3, wherein: A thickness of the lower panel overlapping the exposed portion is equal to or smaller than a thickness of the fingerprint sensing unit.

5. The electronic device according to claim 4, wherein: A distance from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor is equal to a distance from the rear surface of the display panel to the sensing circuit board overlapping the exposed portion.

6. The electronic device according to claim 4, wherein: A distance from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor is greater than a distance from the rear surface of the display panel to the sensing circuit board overlapping the exposed portion.

7. The electronic device according to claim 6, wherein: The sensing circuit board is bent in a direction from the fingerprint sensor toward the exposed portion.

8. The electronic device according to claim 2, wherein: The first adhesive layer is configured to couple the exposed portion of the rear surface of the first sheet to the sensing circuit board.

9. The electronic device according to claim 1, further comprising: a main circuit board connected to the front surface of the display panel and bent toward the rear surface of the display panel, Wherein, the sensing circuit board is connected to the main circuit board.

10. The electronic device according to claim 9, wherein: The sensing circuit board comprises: A first connecting portion connected to the fingerprint sensor; a second connecting portion connected to the main circuit board; and a gripping portion, disposed between the first connecting portion and the second connecting portion, Wherein, the holding portion has a predetermined curvature.

11. The electronic device according to claim 1, wherein: The fingerprint sensing unit further includes an adhesive portion configured to couple the fingerprint sensor to the rear surface of the display panel.

12. The electronic device according to claim 11, wherein: The opening is spaced apart from the adhesive portion, and has a closed line shape surrounding an edge of the fingerprint sensor.

13. Electronic devices, including: A display panel comprising a front surface and a rear surface opposite to the front surface; a fingerprint sensing unit, comprising a fingerprint sensor disposed on the rear surface of the display panel and a sensing circuit board connected to the fingerprint sensor; as well as a lower panel disposed on the rear surface of the display panel and including an exposed area overlapping and contacting the sensing circuit board, wherein the fingerprint sensor is positioned within an opening in the lower panel, Wherein, the thickness of the lower panel in the exposed area is equal to or less than the thickness of the fingerprint sensing unit.

14. The electronic device according to claim 13, wherein: The lower panel comprises: A first sheet, comprising a first functional layer having a buffering function and a first adhesive layer disposed on the first functional layer; A second sheet including a second functional layer disposed on the first adhesive layer and having a heat dissipation function and a second adhesive layer disposed on the second functional layer; and The third sheet includes a third functional layer provided on the second adhesive layer and having a light shielding function, and a third adhesive layer provided on the third functional layer.

15. The electronic device according to claim 14, wherein: The exposed area includes a rear portion of the first sheet; as well as Portions of the second sheet and the third sheet are removed to expose portions of the first adhesive layer on the rear portion of the first sheet.

16. The electronic device according to claim 15, wherein: The first adhesive layer of the first sheet is configured to couple the first sheet to a portion of the sensing circuit board overlapping the exposed area.

17. The electronic device according to claim 15, wherein: A distance from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor is equal to a distance from the rear surface of the display panel to the sensing circuit board overlapping the exposed area.

18. The electronic device according to claim 15, wherein: A distance from the rear surface of the display panel to the sensing circuit board overlapping the fingerprint sensor is greater than a distance from the rear surface of the display panel to the sensing circuit board overlapping the exposed area.

19. The electronic device according to claim 18, wherein: The sensing circuit board is bent in a direction from the fingerprint sensor toward the exposed area.

20. The electronic device according to claim 15, wherein: The fingerprint sensing unit further includes an adhesive portion configured to couple the fingerprint sensor to the rear surface of the display panel, wherein the adhesive portion is disposed along an edge of the fingerprint sensor.

21. Electronic devices, including: A display panel comprising a front surface and a rear surface opposite to the front surface; a lower panel including a plurality of sheets stacked on the rear surface of the display panel, the plurality of sheets including a first sheet having a first opening, a second sheet having a second opening, and a third sheet having a third opening, wherein the first opening, the second opening, and the third opening form a main opening; and a fingerprint sensing unit, comprising a fingerprint sensor positioned in the main opening and a sensing circuit board connected to the fingerprint sensor, wherein an area of ​​the first opening and an area of ​​the second opening are smaller than an area of ​​the third opening, and the third opening exposes a portion of a rear surface of the second sheet; and The sensing circuit board is coupled to an exposed portion of the rear surface of the second sheet.

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