Substrate vacuum processing equipment and method

Abstract

A vacuum processing apparatus for a substrate comprises a vacuum processing device (3). An input load lock device (1i) is directed toward and into the vacuum processing device (3), and an output load lock device (1o) is directed out of the vacuum processing device (3). One (1i) of the two load lock devices (1i, 1o) comprises at least two load locks (10ai, 10bi) connected in series, and the at least two load locks (10ai, 10bi) are pumped by pumps (12ai, 12bi) respectively.

Description

[0001] In the field of vacuum processing of substrates, unprocessed substrates are usually transported, for example, from the ambient atmosphere via an input load lock device towards a vacuum processing device, which includes a vacuum transport chamber that supplies a plurality of processing chambers. In the processing chambers, the substrates are subjected to one or more vacuum processes, for example to etching, to lamination, etc. Once processed, the substrates pass through the vacuum transport chambers and are removed to the ambient atmosphere via an output load lock device. The substrates are transported through the respective input load lock device and the output load lock device by means of respective input conveyor devices and output conveyor devices.

[0002] Thus, the respective load locks may be unidirectional, i.e. the input load lock is acted upon by an input conveyor device that only conveys substrates towards the vacuum processing device, and the output load lock is acted upon by an output conveyor device that only conveys substrates from the vacuum processing device. Alternatively, a bidirectional load lock may be provided, which is acted upon by a conveyor device that conveys substrates both towards and from the vacuum processing device. The respective input load lock and output load lock are typically implemented by respective single load locks.

[0003] definition:

[0004] In the present description and claims, by the term "load lock", we understand a chamber which, in operation, is operably connected to a pump and has at least one input valve for a substrate and at least one output valve for the substrate. One of the load lock valves controllably separates the internal atmosphere of the chamber from an atmosphere at one pressure, and another of the load lock valves separates the internal atmosphere of the chamber from an atmosphere at a different, further pressure.

[0005] An object of the present invention is to provide an alternative vacuum processing apparatus and a method of vacuum processing a substrate or manufacturing a vacuum processed substrate.

[0006] According to the invention, this object is solved by a substrate vacuum processing apparatus comprising a vacuum processing device for at least one substrate. The vacuum processing device comprises a vacuum transport chamber, which supplies a plurality of processing chambers. An input load lock device is provided, which cooperates with the input conveyor device and conveys the substrates to the vacuum transport chamber. Thus, seen in the direction of the input conveyance, this input load lock device bridges an atmosphere of higher pressure (e.g. ambient atmosphere) to an atmosphere of lower pressure (the vacuum pressure in the vacuum transport chamber).

[0007] There is further provided an output load lock device which cooperates with the output conveyor device out of the vacuum transport chamber. Thus, in the direction of the output conveyance, the output load lock device bridges the atmosphere of lower pressure (i.e. the vacuum pressure in the vacuum transport chamber) and the atmosphere of higher pressure (e.g. the ambient atmosphere).

[0008] Thus, considered along the transport path of the corresponding conveyor device, at least one of the input loadlock device and the output loadlock device comprises at least two loadlocks connected in series. The at least one loadlock device is interconnected between the vacuum transport chamber and the ambient atmosphere.

[0009] Thus, "load locking" of substrates towards and / or out of the vacuum transport chamber is performed by subsequently bridging a smaller pressure difference than would be bridged by a corresponding single load lock "overall" load lock arrangement.

[0010] This brings the advantage that the respective load locks can be pumped by means of a pump which is specifically selected for operation in the pressure range to be bridged by the load lock in question. For example, considering an input load lock arrangement vented to the ambient atmosphere, the first load lock can be pumped by a rough pump, while subsequent load locks can be pumped by a high vacuum pump, such as a turbomolecular pump.

[0011] The throughput of the apparatus can be increased due to the fact that the pressure difference to be bridged by the at least two load locks is reduced compared to the pressure difference to be bridged by the respective load lock arrangement implemented by a single load lock. This leads to a reduced pumping time and a reduced pressure equalization time. Furthermore, the volume of the at least two load locks at the respective arrangement can be minimized, which additionally reduces the pumping time and the pressure equalization time.

[0012] By subdividing at least one of the input loadlock and the output loadlock in at least two loadlocks, a further advantage is achieved that the substrates are exposed to a lower pressure, in particular to a vacuum pressure, for a longer time span than in a single loadlock. This improves substrate conditioning when the substrates are supplied towards a vacuum transport chamber or when the substrates are supplied from a vacuum transport chamber of a vacuum processing apparatus.

[0013] In one embodiment of the apparatus according to the invention, the input loadlock arrangement and the output loadlock arrangement each comprise at least two loadlocks connected in series along the conveying path of the respective conveyor arrangement.

[0014] In one embodiment of the apparatus according to the invention, at least the input loadlock arrangement comprises at least two loadlocks connected in series and at least one of the at least two loadlocks of the input loadlock arrangement is not a loadlock of the output loadlock arrangement.

[0015] In one embodiment of the apparatus according to the invention, at least the output loadlock arrangement comprises at least two loadlocks connected in series and at least one of the at least two loadlocks of the output loadlock arrangement is not a loadlock of the input loadlock arrangement.

[0016] Thus, even all of the at least two load locks of the input load lock arrangement may be only part of the input load lock, regardless of whether the output load lock arrangement also has or does not have the at least two load locks as mentioned. Similarly, even all of the at least two load locks of the output load lock arrangement may be only part of the output load lock arrangement, regardless of whether the input load lock arrangement has or does not have the at least two load locks as mentioned.

[0017] It is apparent that load locks commonly applied to both the input load lock device and the output load lock device are supplied bidirectionally, whereas a specific load lock of one of the input load lock device and the output load lock device is supplied unidirectionally.

[0018] In one embodiment of the apparatus according to the invention, at least one of the at least two loadlocks is used in common for both the input loadlock arrangement and the output loadlock arrangement.

[0019] In one embodiment of the just-mentioned embodiment of the apparatus according to the invention, the common load lock is closer to the vacuum transport chamber considered along the transport path of the corresponding conveyor device than other load locks of the at least two load locks that are not shared for the input load lock device and the output load lock device.

[0020] Since the vacuum transport chamber is operated in an atmosphere having a lower pressure relative to the ambient atmospheric pressure at the loadlock that is closer to the vacuum transport chamber among the at least two loadlocks connected in series, a pump (e.g., a turbo pump) operating in a low pressure range may be provided only once at the shared loadlock. The non-shared loadlock among the at least two loadlocks connected in series mentioned above may be operated with a rough pump.

[0021] In one embodiment of the apparatus according to the invention, along the transport path of the respective conveyor device, the input load lock device and the output load lock device each comprise at least two load locks connected in series. Thus, both load lock devices are interconnected between the vacuum transport chamber and the ambient atmosphere. At least one load lock is common to the input load lock device and the output load lock device, and at least one of the at least two load locks of the input load lock device is not common to the output load lock device, and at least one of the at least two load locks of the output load lock device is not common to the input load lock device. Thus, considered along the transport path of the input conveyor device and the output conveyor device respectively, at least one shared load lock is positioned closer to the vacuum transport chamber than a non-shared load lock.

[0022] As mentioned before, a shared loadlock bridges the pressure differential at a smaller pressure level than a non-shared loadlock. This leads to the fact that a more demanding pump, such as a turbo pump, can be provided at the shared loadlock, while more than one non-shared loadlock can be served by a less demanding rough pump.

[0023] In one embodiment of the just mentioned embodiment of the apparatus according to the invention, at least one of the load locks in series is operatively connected to the substrate buffer station. This allows, for example, to supply pasting substrates to and / or from a vacuum processing device or a transport chamber of a vacuum processing device. It must be noted that it is an advantage if the pasting substrates are not vented to the atmosphere, which results in less contamination and faster handling times.

[0024] In one embodiment of the device according to the invention, at least one of the at least two load locks connected in series is furthermore at least one of the following:

[0025] • operatively connected to a substrate processing station;

[0026] • an operatively connected substrate buffer;

[0027] • Heating stations;

[0028] • Cooling stations;

[0029] • Degasser station.

[0030] In one embodiment of the apparatus according to the present invention, each of the at least two load locks in series is operably connected to a pump, and at least one of the at least two load locks in series (which is located closer to the vacuum transport chamber than other load locks in the at least two load locks in series) is operably connected to a pump configured to operate within a lower pressure range than the pumps operably connected to other load locks in the at least two load locks in series.

[0031] In one embodiment of the apparatus according to the invention, at least one of the at least two load locks connected in series is specially made to accommodate a single substrate or a single cluster of substrates transported simultaneously. The volume of the mentioned load lock thereby becomes optimally small, which shortens the pumping down time span or the pressure equalization time span.

[0032] Please note that in this description and claims, whenever we talk about manipulating a "substrate", it is to be understood that such a "substrate" may be a cluster of substrates that are conveyed together on respective substrate holders of respective conveyor devices.

[0033] In one embodiment of the apparatus according to the invention, the input loadlock device and the output loadlock device as well as the input conveyor device and the output conveyor device are configured to handle rectangular substrates or square substrates.

[0034] In one embodiment of the just-mentioned embodiment of the device according to the invention, the shorter side of the rectangular base body or the side of the square base body is equal to or greater than 400 mm or greater than 600 mm.

[0035] In one embodiment of the just-mentioned embodiment of the device according to the invention, the shorter side is a maximum of 1100 mm.

[0036] In one embodiment of the device according to the invention, the rectangular or square base body has a maximum side extent of 1400 mm.

[0037] In one embodiment of the apparatus according to the invention, the input conveyor device and the output conveyor device are designed to convey square or rectangular substrates only perpendicularly to their sides.

[0038] In one embodiment of the apparatus according to the invention, at least one of the input conveyor device and the output conveyor device is configured to convey the substrates only in translation mode. By conveying the substrates only in translation mode, we understand that the substrates are conveyed only in such a way that all points of the substrates are always subject to equal movement vectors. The angular orientation of the substrates is thereby kept constant. This significantly facilitates a predetermined and well-controlled alignment of the conveyed substrates, in particular of square or rectangular shaped substrates, more generally of non-circular shaped substrates.

[0039] In one embodiment of the apparatus according to the invention, one of the at least two load locks in series (considered along the path of the corresponding conveyor device, which is closer to the vacuum transport chamber than the other load locks in the at least two load locks in series) is connected to the path of the other load locks in the series by a controlled gas flow bypass.

[0040] In one embodiment of the apparatus according to the invention, a transport direction of a respective conveyor device towards one of the at least two load locks connected in series and a transport direction of the respective conveyor device out of the one load lock are perpendicular to each other and the respective conveyor devices are configured to transport plate-shaped, flat or curved substrates extending along a plane-locus parallel to both directions.

[0041] In one embodiment of the device according to the invention, the substrate is plate-shaped, flat or curved and extends along a planar trajectory, whereby the input conveyor device and the output conveyor device are configured to convey the plate-shaped substrate only in a direction parallel to the planar trajectory.

[0042] In one embodiment of the apparatus according to the present invention, the input load lock device and the output load lock device are jointly constructed with a T-shaped or Y-shaped footprint, wherein at least one load lock of the at least two load locks in series of the input load lock device is along one side arm of the T or Y, at least one load lock of the at least two load locks in series of the output load lock device is along the other side arm of the T or Y, and wherein at least one common bidirectional load lock in series is along the central arm of the T or Y.

[0043] In one embodiment of the just mentioned embodiment of the apparatus according to the invention, the common loadlock is closer to the vacuum transport chamber than the loadlocks along the side arms, considered along the respective conveyor lane of the respective conveyor arrangement.

[0044] In one embodiment of the just-mentioned embodiment of the device according to the invention, the vacuum transport chamber comprises a container having an outer wall, which defines a cylindrical trajectory around the axis of the cylinder, and a common load lock along the central arm of the mentioned T or Y is mounted to the outer wall of the container, wherein the transport path of the conveyor device passes through the mentioned common load lock in a radial direction relative to the axis of the cylinder.

[0045] A well-controlled alignment of substrates, in particular square or rectangular-shaped substrates, more generally non-circular-shaped substrates, entering and exiting the vacuum transport chamber is thereby significantly simplified.

[0046] In one embodiment of the apparatus according to the invention, a load lock of at least two load locks which is closer to the vacuum transport chamber than the other load locks of the at least two load locks considered along the transport path of the corresponding conveyor device is operably connected to a high vacuum pump, preferably a turbomolecular pump, having a base pressure of a maximum of 0.001 Pa.

[0047] In one embodiment of the apparatus according to the invention, a load lock of at least two load locks which is further away from the vacuum transport chamber than the other load locks of the at least two load locks, considered along the transport path of the respective conveyor device, is operably connected to a rough pump having a base pressure between 0.1 Pa and 1 Pa.

[0048] Unless contradictory, one or more than one of the mentioned embodiments of the device according to the invention may be combined with the general device structure according to the invention.

[0049] The invention further relates to a method for vacuum-treating at least one substrate or for producing at least one vacuum-treated substrate by means of the device according to the invention or by means of the device according to the invention in one or more of its embodiments as mentioned.

[0050] The invention further relates to a method for vacuum treating at least one substrate or for producing at least one vacuum treated substrate, comprising:

[0051] • transporting the substrate from the ambient atmosphere through a first load lock;

[0052] • subsequently, conveying the substrate from the first loadlock through at least one second loadlock;

[0053] • transporting substrates from at least one second load lock into a vacuum transport chamber that supplies more than one processing station;

[0054] • transporting the substrate in the vacuum transport chamber toward at least one of more than one of the vacuum processing stations;

[0055] • treating the substrate by at least one vacuum treatment station;

[0056] • Transport the processed substrates from the vacuum transport chamber through the output load lock.

[0057] In one variation of the just-mentioned method, transferring the processed substrate from the vacuum transport chamber through an output load lock device comprises:

[0058] • transporting the processed substrate from the vacuum transport chamber through at least one third load lock;

[0059] • Transferring the substrate from at least one third load lock through a fourth load lock to ambient atmosphere.

[0060] In one variation of the just-mentioned variation of the method, the second loadlock is selected to be shared with the third loadlock.

[0061] The invention further relates to a method for vacuum treating at least one substrate or for producing at least one vacuum treated substrate, comprising:

[0062] • transporting the substrate through an input load lock device into a vacuum transport chamber that supplies more than one vacuum processing station;

[0063] • transporting the substrate in the vacuum transport chamber toward one of more than one vacuum processing stations;

[0064] • treating the substrate by at least one vacuum treatment station;

[0065] • transporting the processed substrate from the vacuum transport chamber through at least one second load lock;

[0066] • Transporting the substrate from at least one second loadlock through the first loadlock to ambient atmosphere.

[0067] Embodiments of the invention shall now be further illustrated with the aid of the accompanying drawings.

[0068] The accompanying drawings show:

[0069] Figure 1 : The principle of the invention is schematically and simplified illustrated with the aid of functional blocks / signal flow diagrams and with the aid of embodiments of the device according to the invention;

[0070] Figure 2 : Similar to Figure 1 A representation of the kind shows a further embodiment of the device according to the invention;

[0071] Figure 3 : Similar to Figure 1 and Figure 2 Those representations show further embodiments of the device according to the invention;

[0072] Figure 4 : Similar to Figures 1 to 3 Those representations show further embodiments of the device according to the invention;

[0073] Figure 5 : Similar to Figures 1 to 4 Those representations show further embodiments of the device according to the invention;

[0074] Figure 6 : Similar to Figures 1 to 5 Those representations show further embodiments of the device according to the invention;

[0075] Figure 7 : Similar to Figures 1 to 6 Those representations show further embodiments of the device according to the invention;

[0076] Figure 8 : Similar to Figures 1 to 7 Those representations show further embodiments of the device according to the invention;

[0077] Fig. 9 : Similar to Figures 1 to 8 Those representations show implementations close to the implementation as currently implemented;

[0078] Fig.10 : Similar to Figures 1 to 9 those and are different from those based on Fig. 9 The representation of an embodiment shows a further embodiment of the device according to the invention;

[0079] Fig.11 : shows schematically and simplified in a top view an embodiment of the device according to the invention as currently practiced;

[0080] Fig.12 : A substrate extending schematically along a planar trajectory and as processed by an embodiment of the device according to the invention in a transport direction provided in some embodiments of the device.

[0081] Figure 1 A schematic and simplified description of the method of feeding a substrate through an input load lock device 1 is shown with reference to an embodiment of the invention. i The principle of the present invention is to load and transport the substrate (not shown) to and into the vacuum transport chamber 3 of a vacuum processing device or vacuum processing equipment via the output load lock device 1. o Unload from the vacuum transport chamber 3. ii Ambient input atmospheric AT ii Provide an input load lock device 1 toward the vacuum transport chamber 3 i . Input Load Lock Device 1 i From the higher ambient input pressure p ii Cross-over pressure difference Δp1 i The lower output vacuum atmospheric pressure p to the vacuum transport chamber 3 oi .

[0082] Output load lock device 1 o From the vacuum pressure p at the vacuum transport chamber 3 oi `Cross-over pressure difference Δp1 o to have an output atmospheric pressure p oo Atmosphere AT oo As already mentioned, the input atmospheric air AT ii is the ambient atmosphere. Most commonly, but not necessarily, the vacuum pressure p oi and p oi `At least it's similar.

[0083] An input conveyor device (not shown) is provided, which conveys a single substrate or a single cluster of substrates conveyed simultaneously on a corresponding single or multiple substrate carriers (not shown) along an input conveying path Pi toward a vacuum transport chamber 3 of a vacuum substrate processing device.

[0084] An output conveyor device (not shown) is provided, which output conveyor device is arranged along the output conveying path P o From the vacuum transport chamber 3 , a single substrate or a single group of simultaneously transported substrates is transported on a corresponding single or multiple substrate carriers (not shown).

[0085] As described so far, the device corresponds to a known device in which the input loadlock arrangement and the output loadlock arrangement consist of a single loadlock.

[0086] According to the present invention, the input load lock device 1 i and output load lock device 1 o At least one of the transport paths P i and / or P o At least two load lock passages are provided in series. The load lock device or devices comprising at least two load locks in series are connected to each other between the vacuum transport chamber 3 and the ambient atmosphere. Figure 1 Enter the load lock device.

[0087] according to Figure 1 In the embodiment of the present invention, only the input load lock device is provided with at least two load locks 10ai and 10bi. In most applications, providing only two load locks 10ai, 10bi is sufficient to bridge the input load lock device 1 i The pressure difference Δp1 i and / or, similarly, if the output load lock device 1 o There are also provided at least two load locks connected in series, sufficient to bridge the output load lock device 1 o The pressure difference Δp1 o .

[0088] By providing two or more load locks 10ai, 10bi, ..., the corresponding overall pressure difference Δp1 i and / or Δp1 o - if at least two load locks are provided in series - is subdivided into the pressure difference Δp10 across the load locks ai , Δp10 bi wait.

[0089] Please note that despite the Figure 1 As shown in the following figure, two loadlocks connected directly in series are shown each having a facing loadlock valve, such facing loadlock valves are usually implemented by a common valve that is common to both loadlocks in series.

[0090] The substrate throughput of the overall apparatus is not necessarily lower than that of an apparatus with a single load lock input and / or output load lock arrangement. This is because the substrate throughput is usually governed by the machine clock, which is adapted to the overall process step with the longest process time. Since the load locks 10ai, 10bi, ..., each of which actually performs a process step, bridge the overall pressure difference Δp1 i and / or Δp1 oThe pressure difference is smaller than that of pumps 12ai, 12bi, etc., so the corresponding load locks 10ai, 10bi are pumped more than the crossover Δp1. i and / or Δp1 o The load lock of the present invention requires a shorter time span. Therefore, the multiple load concept according to the present invention does not reduce the substrate throughput compared to the substrate throughput of a single load lock device. In addition, along the corresponding transport path P i and / or P o A pump of a load lock in series positioned closer to the vacuum transport chamber 3 (eg Figure 1 The pump 12bi in the vacuum transport chamber 3 is more distant than the pump of the series load lock (such as Figure 1 12ai in the specification), operating at a lower pressure level.

[0091] This allows a pump to be applied to each of the series connected load locks 10ai, 10bi, . . . which operates optimally within the corresponding pressure range.

[0092] Further and along the corresponding transport path P i and / or P o Consider that each of the at least two load locks 10ai, 10bi, ... in series only needs to be pressure-equalized to a lower pressure having a pressure difference bridged by the adjacent load lock in series further away from the vacuum transport chamber 3. Figure 1 In the embodiment, the load lock 10bi is to be pressure equalized to the lower pressure at which the load lock 10ai is operated. Since the pressure difference to be equalized is small, this can be accomplished via a corresponding number of the load lock base control valves 14, but in accordance with Figure 1 In one embodiment, this is performed via a gas flow bypass 15 with a corresponding control valve 17. i and / or 1 o Compared with pressure equalization of a load lock, pressure equalization of a load lock requires a shorter time span.

[0093] Furthermore, along the transport path P i and / or P o The substrates on the respective substrate carriers or the group of substrates being transported together remain under reduced pressure for a longer period of time, since the substrates for transporting the substrates through the load lock 1 are i and / or via output load lock device 1 o The time span of the transport - if at least two load locks connected in series are also provided - requires more than one machine clock, for example one machine clock per load lock connected in series. This can be very advantageous for conditioning unprocessed substrates before entering the vacuum transport chamber 3 of the vacuum processing device or for reconditioning processed substrates leaving the vacuum transport chamber 3.

[0094] As in Figure 1 As further shown in FIG. 1 , in one embodiment, one of the at least two load locks 10ai, 10bi, the load lock 10bi closer to the vacuum transport chamber 3, can be operably connected to a substrate buffer 19. Such a substrate buffer can accommodate a pasted substrate that is delivered to the vacuum transport chamber 3 at a predetermined time and, for example, is delivered via a corresponding output load lock device 19. o Remove.

[0095] Furthermore, for their load lock functions, the load locks 10ai, 10bi, ... may be tailored for substrate cooling, heating, degassing functions, and may be operably connected to additional substrate processing stations (not shown).

[0096] For transport channel P i The conveyor device of and / or Pa is realized by a corresponding number of substrate handling robots.

[0097] As an example:

[0098] Such as AT ii The load lock 10ai is the ambient atmosphere and, for example, only two load locks 10ai and 10bi are provided, which can be operated with a pump 12ai, which is a rough pump, for example, with a base pressure of 0.1 to 1 Pa. The load lock 10bi just upstream of the high vacuum transport chamber 3 is operated by a turbo pump 12bi, which has a base pressure of less than 0.001 Pa. Thus Δp10 ai Can be found in 1e 5 Pa range, and Δp10bi is within 1 Pa range.

[0099] With the help of Figure 1 The explained concepts and corresponding features are also valid for further embodiments of the device as will be presented hereinafter.

[0100] Figure 2 Similar to Figure 1 A representation of the type shown shows an embodiment of the device according to the invention, in which only the output load lock device 10 is provided with at least two load locks 10ao and 10bo connected in series, which have corresponding pumps 12ao and 12bo. Figure 2 Other reference numerals refer to Figure 1 Therefore, for those who have understood Figure 1 This embodiment is completely clear to those skilled in the art.

[0101] As in Figure 2 In the embodiment of the present invention, AToo is ambient atmosphere, and along the output load lock device 1 o For example, only two load locks 10ao and 10bo are provided, and further, the vacuum transport chamber 3 is a high vacuum transport chamber, in the context of Figure 1 The examples given are for Figure 2 Implementations of may also be effective.

[0102] Figure 3 Similar to Figure 1 and Figure 2 The figures show an embodiment of the device according to the invention, in which an input load lock device 1 is implemented according to the invention. i And output load lock device 1 o , that is, each uses at least two load locks 10ai, 10bi and 10ao, 10bo connected in series. Therefore, Figure 3 The implementation method is Figure 1 The implementation method and Figure 2 Combination of implementation methods. Atmospheric AT ii and AT oo Both are ambient atmospheres. Both load lock devices are implemented with two load locks connected in series, and the vacuum transport chamber 3 is a high vacuum transport chamber. Therefore, in the context of Figure 1 and Figure 2 The examples given can also be found in Figure 3 is implemented in the implementation method.

[0103] In the embodiment presented below, at least one of the at least two loadlocks in series of one of the loadlock arrangements is shared with a loadlock of another loadlock arrangement. This has the advantage that a single loadlock with a corresponding pump is utilized for the input loadlock arrangement as well as for the output loadlock arrangement. In particular, if such a shared loadlock is closer to the vacuum transport chamber 3 than the other loadlocks in the series and therefore requires a more demanding pump operating in a lower pressure range, one such pump can be saved, considering along the transport path of the one loadlock arrangement mentioned.

[0104] Thus, the common load lock connected in series is a bidirectionally operating load lock.

[0105] Figure 4 Similar to Figures 1 to 3 The figures show an embodiment in which the input load lock device 1 i All of the at least two load locks 10ai and 10bi connected in series with the output load lock device 1 o All of the at least two load locks 10ao, 10bo connected in series are shared.

[0106] Figure 5 Similar to Figures 1 to 4 The figures show an embodiment of the device according to the invention, in which the input load lock device 1 i The load lock 10bi of the series connection of at least two load locks 10ai and 10bi, which is closer to the vacuum transport chamber 3, is connected to the output load lock device 1 o Please note that the output load lock device 1 o Only one load lock may be included, such as load lock 10co. For example, if the atmosphere AT oo Such a configuration may be used if the atmosphere of a low pressure station (eg a vacuum adjustment station for the treated substrate) is at room temperature.

[0107] Figure 6 Similar to Figures 1 to 5 The figures show an embodiment in which the output load lock device 1 o The load lock 10bo of the series of at least two load locks 10ao and 10bo, which is closer to the vacuum transport chamber 3, is connected to the input load lock device 1 i Please note that the input load lock device 1 i Only load lock 10ci may be included. For example, if the atmosphere AT ii is the atmosphere of a low pressure station (e.g. a vacuum degasser station for untreated substrates), such a configuration may be used.

[0108] Figure 7 Similar to Figures 1 to 6 The figures show an embodiment in which the input load lock device 1 i The load lock 10ai, which is farther from the vacuum transport chamber 3, among the at least two load locks 10ai and 10bi connected in series, and the output load lock device 1 o Please note that the output load lock device 1 o Only a load lock 10co may be included. Such a configuration may be used, for example, if the last processing step in the apparatus having the vacuum transport chamber 3 is performed at a higher pressure than the initial processing step performed on the freshly input, not yet processed substrate. Such a higher pressure processing step may, for example, be a cooling step for the substrate before leaving the vacuum transport chamber 3.

[0109] Figure 8 Similar to Figures 1 to 7 The figures show an embodiment in which the output load lock device 1 o The load lock 10ao in series, which is farther from the vacuum transport chamber 3, among the at least two load locks 10ai and 10bo in series, is connected to the input load lock device 1 iPlease note that the input load lock device 1 i Only a load lock 10ci may be included. Such a configuration may be used, for example, if the input processing station of the apparatus with vacuum transport chamber 3 operates on unprocessed substrates at a higher pressure than the last processing station of the apparatus with vacuum transport chamber 3 after which the substrates leave the chamber 3. The input processing station may be, for example, a degasser station.

[0110] Fig. 9 Similar to Figures 1 to 8 The representations of those show an embodiment close to the embodiment as currently realized. Input load lock device 1 i And output load lock device 1 o Each of the load locks includes at least two load locks 10ai, 10bi and 10ao, 10bo connected in series. The load lock 10bi and the output load lock device 1 o The load lock 10bo is shared along the input transport path P i Consider that the load lock 10bi is larger than the input load lock device 1 i The load lock 10ai is positioned closer to the vacuum transport chamber 3, along the output transport path P o Considering that the load lock 10bo is larger than the output load lock device 1 o The load lock 10ao is closer to the vacuum transport chamber 3.

[0111] Only one demanding pump operating in the lower pressure range (such as for example a turbomolecular pump) has to be provided which pumps the shared bidirectional load locks 10bi, 10bo, whereas the unshared load locks 10ai and 10ao can be pumped by a less demanding pump operating at a higher pressure (such as a corresponding rough pump).

[0112] Especially if the substrates to be processed by the apparatus according to the invention are rectangular or square, more generally non-circular, accurately maintaining the orientation of the substrates is significantly simplified if the substrates are transported from one load lock to the next in the series without rotation (i.e. in translation mode) and finally into and out of the vacuum transport chamber 3.

[0113] Different from Fig. 9 implementation method, which is based on Fig.10 (Similar to Figures 1 to 9 Transport path P i And the transport path P o are linear and parallel or aligned and perpendicular to the common bidirectional transport path P i , P o , the transport path P iThe transport path P is directed toward and through the non-shared load lock 10ai in series and into the shared load locks 10bi, 10bo in series. o The shared bidirectional transport path P extends from the shared load locks 10bi, 10bo in series toward and through the non-shared load locks 10ao in series. i , P o From the common load locks 10bi and 10bo connected in series, toward the vacuum transport chamber 3 and out of the vacuum transport chamber 3. Fig.10 The base body 20 shown in dotted lines in FIG. 1 is plate-shaped and can be Fig.12 The substrate 20a in FIG. 1 is flat or can be formed by Fig.12 The base 20b in FIG. 1 is curved as shown in FIG. Fig.12 The plane trajectory E shown in FIG. extends. The base body 20 is oriented with its extended surface parallel to the passage P. i , P o and parallel to the common path P i , P o , and the substrate 20 does not need to be in the input load lock device 1 i The load lock device 1 is rotated between the input of the vacuum transport chamber 3 and the input of the vacuum transport chamber 3, and there is no need to rotate between the output load lock device 1 o If the vacuum transport chamber 3 has an outer wall, for example in the shape of a polygon, the outer wall defines a cylindrical trajectory L around a central axis A, which is perpendicular to the transport plane of the substrate and which is parallel to the transport plane of the substrate. Fig.12 The load locks 10bi, 10bo are mounted in series to the wall so that the common linear path P coincides with or is parallel to the plane trajectory E. i , P o The direction is radial relative to the axis A. Usually the vacuum transport chamber 3 of multiple stations is constructed with a container having walls defining a cylindrical track around the axis A and as shown by Fig.10 The substrates are transported in the container about axis A from one processing station to the next, as indicated by the arrows in FIG.

[0114] Fig.11 An embodiment of the device according to the invention as currently practiced is shown schematically and simplified in a top view.

[0115] In the ambient atmosphere AT ii , AT oo A robotic device 30 having one or more robots operating in the manipulating a single plate-shaped substrate 20 (not shown) Fig.11), which is for example rectangular or square, typically in the range of from 400x400 mm up to 650x650 mm, or even larger, which enters the input load lock device 1 from the magazine device 32 through the input slit valve 34 i The load lock 10ai is pumped by a rough pump 12ai.

[0116] The bidirectional robot 38 in the shared load lock 10bi, 10bo transports the substrate from the load lock 10ai through the slit valve 36, which is common to the load lock 10ai and the shared load lock 10bi, 10bo. The robot 38 loads the unprocessed substrate into the vacuum transport chamber 3 through the slit valve 40, and removes the processed substrate from the vacuum transport chamber 3 through the slit valve 40.

[0117] The processed substrates in the common load locks 10bi, 10bo are transported by the robot 38, through the slit valve 42 into the load lock 10ao, and from the load lock 10ao back to the ambient atmosphere AT by means of the robot device 30 and via the slit valve 44. oo A valve-controlled pressure equalization bypass 15 is provided from the load lock 10ai to the common load locks 10bi, 10bo and from the latter to the load lock 10ao.

[0118] The load lock 10ao is pumped by means of a rough pump 12ao, whereas the common load locks 10bi, 10bo are pumped by a turbo pump 12com.

[0119] While in the load locks 10ai and 10ao the substrates are brought from ambient pressure to pre-vacuum and vice versa respectively, in the common load locks 10bi, 10bo the substrates are brought from pre-vacuum to high vacuum as operated in the vacuum transport chamber 3, or vice versa.

[0120] The vacuum transport chamber 3 supplies five processing stations 50 which are clustered around the axis A. A high vacuum robot 52 supplies substrates from and towards the crack valve 40 and from one processing station 50 to another. Transport path P i and P o And a shared bidirectional transport channel P i , P o As in the context Fig.10 Established as explained.

Claims

1. A substrate vacuum processing device, comprising a vacuum processing device for at least one substrate, the vacuum processing device comprising a vacuum transport chamber, the vacuum transport chamber supplying a plurality of processing chambers; An input load lock device having an input conveyor device to the vacuum transport chamber; an output load lock device having an output conveyor device out of the vacuum transport chamber; ·in, Considered along a transport path of the corresponding conveyor device, at least one of the input load lock device and the output load lock device includes at least two load locks connected in series, and the at least one of the input load lock device and the output load lock device is interconnected between the ambient atmosphere and the vacuum transport chamber.

2. The device according to claim 1, wherein: The input loadlock arrangement and the output loadlock arrangement each include at least two loadlocks connected in series along the conveying path of the respective conveyor arrangement.

3. The device according to claim 1 or 2, wherein: At least the input loadlock arrangement includes the at least two loadlocks connected in series, and at least one of the at least two loadlocks of the input loadlock arrangement is not a loadlock of the output loadlock arrangement.

4. The device according to claim 1 or 2, wherein: At least the output loadlock arrangement includes the at least two loadlocks connected in series, and at least one of the at least two loadlocks of the output loadlock arrangement is not a loadlock of the input loadlock arrangement.

5. The apparatus according to claim 1 or 2, at least one of the at least two load locks is commonly used for the input load lock device and the output load lock device.

6. The device according to claim 5, wherein: Considered along the transport path of the respective conveyor device, the common loadlock of the at least two loadlocks is closer to the vacuum transport chamber than other loadlocks of the at least two loadlocks.

7. The device according to claim 1 or 2, wherein: Along the transport passage of the corresponding conveyor device, the input load lock device and the output load lock device each include at least two load locks connected in series, and at least one load lock is shared by the input load lock device and the output load lock device, at least one of the at least two load locks of the input load lock device is not shared by the output load lock device, and at least one of the at least two load locks of the output load lock device is not shared by the input load lock device, and considered along the passage of the input conveyor device and the output conveyor device, the at least one shared load lock is positioned closer to the vacuum transport chamber than the non-shared load lock.

8. The device according to claim 1 or 2, wherein: At least one of the load locks in series is operably connected to a substrate buffer station.

9. The device according to claim 1 or 2, wherein: At least one of the load locks in series is further one of: · operatively connected to a substrate processing station; · operatively connected to a base buffer; Heating station; Cooling station; Degasser station.

10. The device according to claim 1 or 2, wherein: Each of the at least two load locks in series is operably connected to a pump, and wherein at least one of the at least two load locks in series is operably connected to a pump configured to operate within a lower pressure range, the at least one of the at least two load locks in series is positioned closer to the vacuum transport chamber than other load locks in the at least two load locks in series, and the pump configured to operate within a lower pressure range refers to a pump that operates within a lower pressure range than a pump operably connected to the other load locks in the at least two load locks in series.

11. The device according to claim 1 or 2, wherein: At least one of the at least two load locks in series is specially made to accommodate a single substrate or a single cluster of substrates being transported simultaneously.

12. The device according to claim 1 or 2, wherein: The input and output loadlock devices and the input and output conveyor devices are configured to handle rectangular or square substrates.

13. The device according to claim 12, wherein: The shorter side of the rectangular base or the side of the square base is equal to or greater than 400 mm or greater than 600 mm.

14. The device according to claim 13, wherein: The shorter side is at most 1100 mm.

15. The apparatus according to claim 12, wherein the rectangular substrate or square substrate has a maximum side extent of 1400 mm.

16. The apparatus according to claim 12, wherein: The input conveyor device and the output conveyor device are configured to convey the substrates only perpendicularly to the sides of the substrates.

17. The apparatus according to claim 1 or 2, wherein: At least one of the input conveyor device and the output conveyor device is configured to convey the substrate only in a translation mode.

18. The apparatus according to claim 1 or 2, wherein: Considered along the pathway of the respective conveyor devices, one of the at least two loadlocks in series that is closer to the vacuum transport chamber than the other of the at least two loadlocks in series is connected to the other loadlocks in series by a controlled airflow bypass.

19. The device according to claim 1 or 2, wherein: The transport direction of the corresponding conveyor device toward one of the at least two load locks in series and the transport direction of the corresponding conveyor device out of the one load lock in series are perpendicular to each other, and the corresponding conveyor device is configured to transport a plate-shaped, flat or curved substrate extending along a planar trajectory parallel to both directions.

20. The apparatus according to claim 1 or 2, wherein: The substrate is plate-shaped, flat or curved, and extends along a planar trajectory, and the input conveyor device and the output conveyor device are configured to convey the plate-shaped substrate only in a direction parallel to the planar trajectory.

21. The apparatus according to claim 1 or 2, wherein: The input load lock device and the output load lock device are jointly constructed with a T-shaped or Y-shaped footprint, wherein at least one load lock of the at least two load locks in series of the input load lock device is along one side arm of the T or Y, at least one load lock of the at least two load locks in series of the output load lock device is along the other side arm of the T or Y, and wherein at least one shared bidirectional load lock in series is along a center arm of the T or Y.

22. The apparatus according to claim 21, wherein Considered along the respective conveyor lanes of the conveyor arrangement, the common loadlock is closer to the vacuum transport chamber than the loadlocks along the side arms.

23. The apparatus of claim 21, wherein: The vacuum transport chamber comprises a container having an outer wall, the container defining a cylindrical track around a cylindrical axis, and the common load lock along the central arm is mounted to the outer wall of the container, wherein the transport passage of the conveyor device through the common load lock extends in a radial direction relative to the cylindrical axis.

24. The apparatus according to claim 1 or 2, wherein: Considered along the transport path of the corresponding conveyor device, a loadlock of the at least two loadlocks in series that is closer to the vacuum transport chamber than other loadlocks of the at least two loadlocks in series can be operably connected to a high vacuum pump having a maximum base pressure of 0.001 Pa.

25. The apparatus according to claim 1 or 2, wherein: Considered along the conveying path of the respective conveyor device, a loadlock of the at least two loadlocks farther from the vacuum transport chamber than other loadlocks of the at least two loadlocks may be operatively connected to a rough pump having a base pressure between 0.1 Pa and 1 Pa.

26. The apparatus of claim 24, wherein: The high vacuum pump is a turbomolecular pump.

27. Method for vacuum-treating at least one substrate or for producing at least one vacuum-treated substrate by means of an apparatus according to one of claims 1 to 26.

28. A method of vacuum treating at least one substrate or manufacturing at least one vacuum treated substrate, comprising: · conveying the substrate from the ambient atmosphere through a first load lock; subsequently conveying the substrate from the first loadlock through at least one second loadlock; transferring the substrate from the at least one second loadlock into a vacuum transport chamber, the vacuum transport chamber supplying more than one processing station; transporting the substrate in the vacuum transport chamber toward at least one of the more than one vacuum processing stations; · processing the substrate by the at least one vacuum processing station; • Transporting the processed substrate from the vacuum transport chamber through an output load lock.

29. The method of claim 28, wherein transferring the processed substrate from the vacuum transport chamber through an output load lock comprises: · transporting the processed substrate from the vacuum transport chamber through at least one third load lock; • Transferring the substrate from the at least one third loadlock through a fourth loadlock to ambient atmosphere.

30. The method of claim 29, whereby the second loadlock is selected to be shared with the third loadlock.

31. A method of vacuum treating at least one substrate or manufacturing at least one vacuum treated substrate, comprising: · transporting the substrate through an input load lock device into a vacuum transport chamber that supplies more than one vacuum processing station; transporting the substrate in the vacuum transport chamber toward one of the more than one vacuum processing stations; · processing the substrate by the at least one vacuum processing station; · transporting the processed substrate from the vacuum transport chamber through at least one second load lock; • Transferring the substrate from the at least one second loadlock through the first loadlock to ambient atmosphere.

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