Wafer unit flying prevention device

Abstract

Provided is a wafer unit flying-out prevention device that can suppress modification or alteration of a processing device that houses and sets a cassette and can prevent wafers from flying out of the cassette. A wafer unit flying-out prevention device (1) includes a lock lever (2) that alternately has a plurality of lock portions (24) that can block an insertion slot in correspondence with the height of the insertion slot and a plurality of unlock portions (25) that can communicate the insertion slot, and a guide pin (3) that is connected to the lock lever (2), protrudes downward compared to the bottom of a side plate of a cassette, and forms a lock lever (2) that is forced upward when a lower end portion is pressed. When the lower end portion (30) of the guide pin (3) is pressed, the unlock portion (25) communicates with the insertion slot, and when the pressing of the lower end portion (30) of the guide pin (3) is released, the insertion slot is blocked by the lock portion (24).

Description

Technical Field

[0001] The present invention relates to a device for preventing a wafer unit from flying out. Background Art

[0002] In order to chip semiconductor wafers, a cutting device called a dicing saw is used. In preparation for processing the wafers using this cutting device, the wafers are fixed to a ring-shaped frame with the help of adhesive tape and stored in a box. The box containing the wafers is transported to the cutting device by an operator and placed on a box mounting table provided in the cutting device. The processed wafers that have been taken out of the box and processed and then put back into the box are transported again by the operator to a device for implementing the next process. In such a box, in order to prevent the wafers from flying out of the box when the box is transported, various solutions with locking mechanisms have been proposed (for example, see Patent Documents 1 and 2).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-157381

[0004] Patent Document 2: Japanese Patent Application Laid-Open No. 2016-119354

[0005] However, the methods described in Patent Documents 1 and 2 have a problem in that changes must be made to the cartridge body or the device for mounting the cartridge, which increases the cost. Summary of the Invention

[0006] Therefore, an object of the present invention is to provide a wafer unit fly-out prevention device that can prevent wafers from flying out of a cassette while suppressing modification or alteration of a cassette and a processing device in which the cassette is installed.

[0007] According to the present invention, a device for preventing a chip unit from flying out is provided, which is installed in a box and used to prevent the chip unit from flying out of the box. The box includes: a pair of side plates, which have a plurality of insertion grooves for inserting the chip unit on their inner surfaces and make the insertion grooves face each other, and the chip unit is obtained by integrating the annular frame and the chip with the help of adhesive tape; and a back stopper, which supports the chip unit with its back, wherein the device for preventing the chip unit from flying out includes: a locking rod, which is removably arranged on the opening side of the side plate, and alternately has a plurality of locking parts and a plurality of unlocking parts, the plurality of locking parts corresponding to the height of the insertion groove and can block the insertion groove, and the plurality of unlocking parts can communicate When the lower end of the guide pin is pressed, the locking rod is forced upward, and the unlocking portion is consistent with the insertion slot, so that the unlocking portion is connected to the insertion slot, and the chip unit can be inserted into the insertion slot from the opening. When the pressure on the lower end of the guide pin is released, the locking rod moves downward due to its own weight, and the unlocking portion and the insertion slot are different in height in the upper and lower directions, so that the insertion slot is blocked by the locking portion, and the chip unit inserted into the insertion slot is in a closed state where it cannot be taken out.

[0008] According to the present invention, it is possible to suppress modification or alteration of the cassette and the processing apparatus in which the cassette is installed, and prevent wafers from flying out of the cassette. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective view showing a configuration example of a wafer unit flyout prevention device according to an embodiment.

[0010] Figure 2 It shows Figure 1 The illustrated perspective view shows a state where the wafer unit fly-out prevention device is mounted on a cassette.

[0011] Figure 3 yes Figure 2 A perspective view of the box is shown.

[0012] Figure 4 It is along Figure 1 Cross-sectional view along line IV-IV.

[0013] Figure 5 It is schematically shown Figure 2 The figure shows a side view of the anti-flying device during the transportation of a box.

[0014] Figure 6 It is schematically shown Figure 5 A front view of the box and fly-out prevention device is shown.

[0015] Figure 7 It is schematically shown Figure 2 The illustrated diagram is a side view of the anti-flying device when the cassette is placed on a processing device.

[0016] Figure 8 It is schematically shown Figure 7 A front view of the box and fly-out prevention device is shown.

[0017] Figure 9 It is a cross-sectional view of a rod mounting portion of a wafer unit flyout prevention device according to a first modified example of the embodiment.

[0018] Figure 10 It is a cross-sectional view of a guide pin of a wafer unit flyout prevention device according to a second modified example of the embodiment.

[0019] Description of labels

[0020] 1, 1-1, 1-2: device for preventing the chip unit from flying out; 2: locking rod; 3, 3-2: guide pin; 24: locking part; 25: unlocking part; 30: lower end part; 32: head part (lower end part); 50: box; 51: side panel; 54: back panel (back stop part); 56: opening part; 100: chip unit; 101: chip; 102: adhesive tape; 103: frame; 511: inner surface; 512: insertion groove. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily imagined by those skilled in the art, or substantially the same contents. In addition, the structures described below may be appropriately combined. In addition, various omissions, replacements, or changes in the structure may be made without departing from the scope of the present invention.

[0022] [Implementation Method]

[0023] A wafer unit flying prevention device according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 It is a perspective view showing a configuration example of a wafer unit flyout prevention device according to an embodiment. Figure 2 It shows Figure 1 The illustrated perspective view shows a state where the wafer unit fly-out prevention device is mounted on a cassette. Figure 3 yes Figure 2 A perspective view of the box is shown. Figure 4 It is along Figure 1 Cross-sectional view along line IV-IV.

[0024] Implementation Figure 1 The chip unit flying prevention device (hereinafter referred to as the flying prevention device) 1 is shown as Figure 2 As shown, it is installed in the box 50 and used. Figure 2 As shown, the cassette 50 is a storage container capable of storing a plurality of wafer units 100, each of which is formed by integrating a ring-shaped frame 103 and wafers 101 with adhesive tape 102. The cassette 50 is used for various processing devices used in semiconductor manufacturing processes, etc. The processing devices include, for example, a cutting device for cutting the wafer 101, a grinding device for grinding the wafer 101, a polishing device for grinding the wafer 101, or a laser processing device for laser processing the wafer 101.

[0025] The wafer 101 is a disk-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, gallium, etc. Figure 2 As shown, wafer 101 has devices 112 formed within the regions demarcated by grid-like planned dividing lines 111 on its front surface 110. Furthermore, wafer 101 has notches 113 formed on its outer edge to indicate crystal orientation. Adhesive tape 102 is attached to wafer 101 on its back surface 114, the back side of front surface 110. The outer edge of adhesive tape 102 is attached to an annular frame 103 and held within the opening of annular frame 103, thereby forming wafer unit 100.

[0026] The cassette 50 is provided in the processing apparatus and stores a plurality of wafers 101 before and after processing by the processing apparatus. The cassette 50 is used to store a plurality of wafers 101 and to transport the plurality of wafers 101 between the plurality of processing apparatuses.

[0027] like Figure 2 and Figure 3 As shown, the box 50 includes a pair of side plates 51 facing each other, a bottom plate 52, a top plate 53, and a back plate 54 serving as a back stop. The pair of side plates 51, the bottom plate 52, the top plate 53, and the back plate 54 are formed in a flat plate shape. When installed in a processing device, the pair of side plates 51 are spaced apart and face each other in the horizontal direction.

[0028] The pair of side panels 51 have multiple insertion slots 512 on their facing inner surfaces 511. The insertion slots 512 are recessed from the inner surfaces 511 and extend linearly horizontally when the cassette 50 is installed in the processing equipment. The multiple insertion slots 512 provided on the inner surfaces 511 of each side panel 51 are evenly spaced in the vertical direction when the cassette 50 is installed in the processing equipment. Therefore, in this embodiment, a separator 513 is provided between adjacent insertion slots 512.

[0029] Furthermore, the insertion grooves 512 provided on the inner surfaces 511 of the pair of side panels 51 are positioned so as to face each other horizontally when the cassette 50 is installed in the processing apparatus. Thus, the pair of side panels 51 are arranged so that the insertion grooves 512 face each other horizontally. Furthermore, the insertion grooves 512 receive the outer edges of the frames 103 of the wafer units 100 housed within the cassette 50, thereby supporting the wafer units 100. In other words, the insertion grooves 512 are grooves into which the wafer units 100 are inserted. Regarding the multiple insertion grooves 512 provided on the inner surfaces 511 of the pair of side panels 51, the frames 103 of the same wafer units 100 are inserted into the insertion grooves 512 that face each other horizontally.

[0030] The bottom plate 52 connects the lower ends of the pair of side plates 51, and the top plate 53 connects the upper ends of the pair of side plates 51. The top plate 53 is provided with a handle 55 for an operator of various processing devices to grasp and transport the cassette 50.

[0031] The back plate 54 supports the wafer unit 100 by its back, and connects the pair of side plates 51, the bottom plate 52 and the top plate 53. Figure 2 and Figure 3 The ends of the inner side are connected to each other to seal between them. The outer edge of the back plate 54 and the frame 103 are supported by the frame 103 of the wafer unit 100 inserted into the insertion groove 512, limiting the wafer unit 100 from Figure 2 and Figure 3 The inner side falls off toward the outside of the box 50.

[0032] In addition, the box 50 is formed by a pair of side plates 51, a bottom plate 52 and a top plate 53. Figure 2 and Figure 3 An opening 56 is formed between the middle and front ends of the cassette 50. The opening 56 is a space connecting the inside and outside of the cassette 50 and allows the wafer unit 100 to be inserted into and removed from the insertion slot 512. In other words, the opening 56 allows the wafer unit 100 to be inserted into and removed from the cassette 50.

[0033] In addition, in the embodiment, the box 50 has at least one of the pair of side plates 51. Figure 3 The side plate 51 on the near front side has a recessed portion 57 for installation. The recessed portions 57 are respectively formed on the upper surface and the lower surface of one end portion of the opening portion 56 side of the side plate 51 on one side, and a pair of recessed portions 57 are provided in the embodiment. The recessed portions 57 are formed by being recessed from the upper surface and the lower surface, and the planar shape is formed into a circle. In the embodiment, the recessed portions 57 are formed so that the inner diameter is constant along the entire length. In addition, in the present invention, the box 50 has a recessed portion 57 for installation on each of the pair of side plates 51.

[0034] The flying prevention device 1 of the embodiment is mounted on the cassette 50 to prevent the wafer unit 100 from flying out of the cassette 50 through the opening 56. Figure 1 and Figure 2 As shown, the fly-out prevention device 1 has a locking lever 2 and a guide pin 3 .

[0035] The locking lever 2 includes a rod body 20 extending linearly, a pair of mounting pieces 21 connected to both ends of the rod body 20 in the longitudinal direction, and a rod mounting portion 22. The overall length of the rod body 20 is formed to be longer than the overall length of one side plate 51 in the vertical direction when the box 50 is installed in the processing device.

[0036] The pair of mounting pieces 21 extend in the same direction from both ends of the rod body 20 in the longitudinal direction. In the embodiment, the longitudinal direction of the mounting pieces 21 is perpendicular to the longitudinal direction of the rod body 20.

[0037] The rod mounting portion 22 is provided on each mounting piece 21. That is, in the embodiment, a pair of rod mounting portions 22 are provided, and the rod mounting portions 22 are configured so that one end of the locking rod 2 on the side of the opening 56 of one side plate 51 can be removed. Figure 4 As shown, the rod mounting portion 22 has a through hole 220 that passes through the mounting piece 21, a screw 221 and a nut 222. Figure 4 Show Figure 1 The cross section of the rod mounting portion 22 in the middle and lower part is shown. However, in the present invention, the structures of the pair of rod mounting portions 22 are identical to each other. Figure 1 The rod mounting portion 22 in the upper middle portion is denoted by the same reference numerals and description thereof is omitted.

[0038] In this embodiment, the through-hole 220 is circular in plan view, with a constant inner diameter along its entire length. The screw 221 comprises a cylindrical threaded portion 223 with a thread groove formed on its outer circumference, and a disc-shaped head 224 connected to one end of the threaded portion 223 and having a larger diameter than the threaded portion 223. The outer diameter of the threaded portion 223 is approximately equal to the inner diameter of the through-hole 220. The nut 222 is threadedly engaged with the outer circumference of the threaded portion 223 of the screw 221.

[0039] like Figure 4 As shown, the pair of rod mounting portions 22 insert the threaded portions 223 of the screws 221 into the through-holes 220 so that the threaded portions 223 face each other, and the mounting piece 21 is clamped between the nut 222 and the head 224 that are screwed with the threaded portions 223, thereby fixing the screws 221 to the mounting piece 21. Furthermore, the rod mounting portion 22 inserts the tip of the threaded portion 223 of each screw 221 into the recess 57, thereby mounting the rod body 20, i.e., the locking rod 2, to the case 50.

[0040] The rod mounting portion 22 is configured so that the rod body 20, i.e., the locking rod 2, can be removed from the recess 57 and the through hole 220 by loosening the nut 222 when the rod body 20, i.e., the locking rod 2, is mounted on the box 50. The rod mounting portion 22 is configured so that the rod body 20, i.e., the locking rod 2, can be removed from the opening 56 side of the side plate 51 by removing the screw 221 from the recess 57 and the through hole 220. The distance 23 ( Figure 1 As shown) is formed to be larger than the distance 58 (between the bottom surfaces of the recessed portion 57 provided on one side plate 51) Figure 3 As shown in the figure, the rod body 20, that is, the locking rod 2 is supported to be movable in the vertical direction relative to the side plate 51.

[0041] Furthermore, the rod body 20 has a plurality of locking portions 24 and a plurality of unlocking portions 25 arranged alternately along its length. The locking portions 24 are arranged at equal intervals in the vertical direction, extending from the rod body 20 toward the other side plate 51. In the embodiment, the thickness of the locking portions 24 is approximately equal to the thickness of the separator 513, and the same number of locking portions 24 and separator 513 are provided. The thickness of the locking portions 24 is approximately equal to the thickness of the separator 513, thereby corresponding to the height of the insertion slot 512. Furthermore, when the locking portions 24 are arranged in a position horizontally aligned with the insertion slot 512, they block the insertion slot 512, restricting movement of the outer edge of the frame 103 of the wafer unit 100 within the insertion slot 512. Thus, the locking portions 24 block the insertion slot 512 by corresponding to the height of the insertion slot 512.

[0042] The unlocking portion 25 is the space between adjacent locking portions 24. Therefore, when the unlocking portion 25 is arranged in a position aligned horizontally with the insertion slot 512, the insertion slot 512 can be connected, allowing the outer edge of the frame 103 of the wafer unit 100 to move within the insertion slot 512. In this way, the unlocking portion 25 can connect the insertion slot 512.

[0043] The guide pin 3 is attached to and connected to the mounting piece 21 below the rod body 20 of the locking lever 2. The guide pin 3 protrudes downward from the lower surface of the mounting piece 21. When the locking lever 2 is mounted in the cassette 50, the guide pin 3 protrudes downward from the bottom of one side plate 51. Therefore, when the cassette 50 is installed in a processing device, the lower end 30 of the guide pin 3 is pressed upward from the processing device. This upward pressure on the lower end 30 of the guide pin 3 causes the locking lever 2 to move upward (applying a force).

[0044] Next, this specification describes the operation of the flyout prevention device 1 according to the embodiment when it is attached to the cassette 50 storing the wafers 101 . Figure 5 It is schematically shown Figure 2The figure shows a side view of the anti-flying device during the transportation of a box. Figure 6 It is schematically shown Figure 5 A front view of the box and fly-out prevention device is shown. Figure 7 It is schematically shown Figure 2 The illustrated diagram is a side view of the anti-flying device when the cassette is placed on a processing device. Figure 8 It is schematically shown Figure 7 A front view of the box and fly-out prevention device is shown.

[0045] When the fly-out prevention device 1 of the embodiment is mounted on the box 50, when the box 50 is transported between processing devices, for example, the operator grasps the handle 55 of the box 50. Therefore, the lower end portion 30 of the guide pin 3 of the fly-out prevention device 1 is not pressed upward or the pressing of the lower end portion 30 toward the upper side is released, as shown in FIG. Figure 5 and Figure 6 As shown, the fly-out prevention device 1 moves downward relative to the box 50 due to its own weight.

[0046] Then, the upper mounting piece 21 of the anti-flying device 1 overlaps with the upper surface of one side plate 51, and the lower end portion 30 of the guide pin 3 protrudes downward from the lower surface of one side plate 51. Figure 6 As shown, the flyout prevention device 1 aligns the locking portion 24 and the insertion slot 512 horizontally, thereby arranging the unlocking portion 25 at a different height than the insertion slot 512 in the vertical direction. In the flyout prevention device 1 , the unlocking portion 25 is at a different height than the insertion slot 512 in the vertical direction. This allows the locking portion 24 to block the insertion slot 512, restricting movement of the frame 103 within the insertion slot 512 and limiting the movement of the wafer unit 100 in and out of the cassette 50. The flyout prevention device 1 is in a closed state, preventing the wafer unit 101 from being removed from the cassette 50 by inserting the outer edge of the frame 103 into the insertion slot 512. This prevents the wafer 101 from flying out of the cassette 50.

[0047] In addition, when the fly-out prevention device 1 of the embodiment is installed in the box mounting portion 300 of the processing device, the lower end portion 30 of the guide pin 3 is pressed toward the upper side, as shown in FIG. Figure 7 and Figure 8 As shown in FIG, the locking lever 2 is moved upward (forced), so that the upper mounting piece 21 is spaced apart from the upper surface of one side plate 51. Figure 8 As shown, the fly-out prevention device 1 aligns the locking portion 24 with the partition piece 513 in the horizontal direction, so that the unlocking portion 25 and the insertion groove 512 are aligned in the horizontal direction.

[0048] The fly-out prevention device 1 aligns the unlocking portion 25 with the insertion slot 512 in the horizontal direction, thereby connecting the unlocking portion 25 and the insertion slot 512, allowing the frame 103 in the insertion slot 512 to move, and allowing the wafer unit 100 to be inserted into and out of the cassette 50. The fly-out prevention device 1 is in an open state in which the wafer unit 100 can be inserted into the insertion slot 512 through the opening 56, and the wafer 101 can be inserted into and out of the cassette 50.

[0049] The flyout prevention device 1 of the embodiment described above includes a pair of rod mounting portions 22 that allow the rod body 20 of the locking rod 2 to move freely relative to the box 50. Therefore, the flyout prevention device 1 can be mounted on an existing box 50 having a recessed portion 57 formed on the side plate 51. In addition, the flyout prevention device 1 can be mounted on an existing box 50 by forming the recessed portion 57 on the side plate 51.

[0050] Therefore, simply by retrofitting the ejection prevention device 1 to the existing cassette 50 , the wafers 101 stored in the cassette 50 can be prevented from ejecting. This can suppress modification of the cassette 50 or changes to the device, thus contributing to cost reduction.

[0051] [First Modification]

[0052] A wafer unit flying prevention device according to a first modified example of the embodiment of the present invention will be described with reference to the drawings. Figure 9 1 is a cross-sectional view of a rod mounting portion of a wafer unit flyout prevention device according to a first modified example of the embodiment. Figure 9 In the embodiment, the same parts as those in the embodiment are marked with the same reference numerals and descriptions thereof are omitted.

[0053] The chip unit fly-out prevention device (hereinafter referred to as the fly-out prevention device) 1-1 of the first modified example has the same structure as that of the embodiment except that the recess 57 is not provided and the rod mounting portion 22 is different. Figure 9 As shown, the rod mounting portion 22-1 of the flyout prevention device 1-1 of the first modified example is composed of an elastic member 26 that is mounted on both the side plate 51 and the mounting piece 21 and is elastically deformable. The rod mounting portion 22-1 is elastically deformed by the elastic member 26, thereby supporting the rod body 20, i.e., the locking rod 2, to be movable in the vertical direction relative to the side plate 51. Figure 9 Although an example in which the elastic member 26 is a coil spring is shown, in the present invention, the elastic member 26 is not limited to the coil spring and may be, for example, sponge rubber or the like.

[0054] The fly-out prevention device 1-1 of the first modified example includes a pair of rod mounting portions 22-1 that allow the rod body 20 of the locking rod 2 to freely move relative to the cassette 50. Therefore, by mounting the elastic member 26 constituting the rod mounting portion 22-1 on the side plate 51, the device can be mounted on an existing cassette 50. Therefore, simply by subsequently mounting the fly-out prevention device 1-1 on the existing cassette 50, the wafers 101 housed in the cassette 50 can be prevented from flying out, thereby suppressing modifications or alterations to the cassette 50 and the processing equipment in which the cassette 50 is installed.

[0055] [Second Modification]

[0056] A wafer unit flying prevention device according to a second modified example of the embodiment of the present invention will be described with reference to the drawings. Figure 10 2 is a cross-sectional view of a guide pin of a chip unit flyout prevention device according to a second modified example of the embodiment. Figure 10 In the embodiment, the same parts as those in the embodiment are marked with the same reference numerals and descriptions thereof are omitted.

[0057] The chip unit flyout prevention device (hereinafter referred to as the flyout prevention device) 1-2 of the second modified example has the same structure as that of the embodiment except that the structure for mounting the guide pin 3-2 on the mounting piece 21 is different. Figure 10 As shown, the guide pin 3-2 of the fly-out prevention device 1-2 of the second variant has: a cylindrical threaded portion 31 having a thread groove formed on the outer peripheral surface; and a circular plate-shaped head 32 connected to one end of the threaded portion 31 and having a diameter larger than that of the threaded portion 31.

[0058] The guide pin 3-2 is inserted into a through-hole 33 provided in the mounting plate 21 with the threaded portion 31 facing upward. The mounting plate 21 is then clamped and attached to the mounting plate 21 by a pair of nuts 34 that engage with the threaded portion 31. The head 32 of the guide pin 3-2 corresponds to the lower end portion, and the amount of protrusion of the lower end portion, i.e., the head 32, from the mounting plate 21 can be adjusted by adjusting the position of the pair of nuts 34 relative to the threaded portion 31.

[0059] The fly-out prevention device 1-2 of the second variant has a pair of rod mounting parts 22 that allow the rod body 20 of the locking rod 2 to move freely relative to the box 50. Therefore, as in the embodiment, only by subsequently installing it on the existing box 50, it is possible to prevent the chip 101 stored in the box 50 from flying out, thereby having the effect of suppressing the modification or change of the box 50 and the processing device where the box 50 is set.

[0060] Furthermore, the fly-out prevention device 1 - 2 of the second modified example can change the amount of protrusion of the head portion 32 , which is the lower end portion of the guide pin 3 - 2 , from the mounting piece 21 , and can therefore be mounted on various existing cartridges 50 .

[0061] The present invention is not limited to the above-described embodiment, and can be implemented with various modifications without departing from the spirit of the present invention.

Claims

1. A wafer unit flying prevention device, which is mounted on a box and used to prevent the wafer unit from flying out of the box, the box comprising: a pair of side plates having a plurality of insertion grooves on their inner surfaces for inserting a wafer unit formed by integrating a ring-shaped frame and a wafer with an adhesive tape, the insertion grooves facing each other; and The back stopper supports the wafer unit with its back. in, The chip unit flying prevention device has: a locking lever removably disposed on the opening side of the side plate, the locking lever having a plurality of locking portions and a plurality of unlocking portions alternately arranged so as to block the insertion slot in accordance with the height of the insertion slot, and the unlocking portions being able to communicate with the insertion slot; as well as A guide pin is connected to the locking rod and is formed to protrude downward from the bottom of the side plate. When the lower end is pressed, the guide pin applies force to the locking rod upward. When the lower end of the guide pin is pressed, the locking lever is urged upward, and the unlocking portion is aligned with the insertion groove, so that the unlocking portion is connected to the insertion groove, and the wafer unit is opened to be inserted from the opening portion into the insertion groove. When the pressure on the lower end of the guide pin is released, the locking lever moves downward due to its own weight, and the unlocking portion and the insertion slot are at different heights in the vertical direction, so that the insertion slot is blocked by the locking portion, and the wafer unit inserted into the insertion slot is in a closed state where it is impossible to remove the wafer unit. The locking lever has: a rod body extending in a straight line and having a plurality of the locking portions and a plurality of the unlocking portions alternately arranged in a longitudinal direction; a pair of mounting pieces extending in the same direction from both ends of the rod body in the longitudinal direction; as well as A pair of lever mounting portions are provided on each mounting piece, and the front end portions thereof are inserted into recesses respectively formed on the upper surface and the lower surface of the side plate to mount the locking lever to the box.

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