A luminaire having an electrically and thermally conductive heat spreading substrate

Abstract

The present application relates to a lamp with electrically and thermally conductive heat-dissipating substrate, which comprises a whole substrate and a lamp bulb, the lamp bulb has a sealed cavity, the whole substrate is arranged in the sealed cavity, a plurality of substrates are connected into the whole substrate through insulating connectors, each of the substrates comprises a light source fixing part and a heat-dissipating part, a plurality of the light source fixing parts and a plurality of the heat-dissipating parts are connected together to form the substrate, the light source fixing part is provided with an LED light source, the heat-dissipating part is attached to the inner surface of the glass bulb wall, the lamp bulb comprises the glass bulb wall and the inner wall of the glass bulb, the inner surface of the glass bulb wall and the outer surface of the inner wall of the glass bulb surround to form the sealed cavity, the LED light source is electrified to emit light, the light transmits through the glass bulb wall to irradiate outwards, the heat generated by the operation of the substrate is dissipated through the heat-dissipating part and the glass bulb wall to dissipate heat for the lamp.

Description

TECHNICAL FIELD

[0001] The present application relates to a lamp, in particular to a lamp provided with an LED light source and having electrically conductive and thermally conductive heat dissipation effect. BACKGROUND

[0002] It is known that, with the further withdrawal of incandescent lamps from the market, the demand for LED filament lamps is increasing at home and abroad. Since LED filament lamps have the large-angle light emission form of the traditional incandescent lamps that are familiar to the public, they are popular among the application groups with "vintage" complex, and the LED filament lamps that look like incandescent lamps find their "valley" of application. Also, since the production and manufacturing process of LED filament lamps is similar to that of incandescent lamps, for lighting manufacturers who have been engaged in the production and manufacturing of incandescent lamps, it is undoubtedly an extremely simple thing to produce LED filament lamps and enter this application field. With the LED filament lamps from theory to reality lighting products, from decorative applications to functional lighting applications, the demand will continue to expand.

[0003] However, in terms of technical composition, since the filaments of the filament lamp are in a closed environment, and the substrate area of the LED filament is too small, the actual application of heat dissipation is difficult to meet the ideal design requirements under the requirements of small light decay and long service life. The power cannot be improved, and the maximum power can only fluctuate between 6-8 watts. At present, another deficiency of LED filament lamps is that due to the need to increase the heat dissipation area and the long length of the filaments, it is difficult to achieve full circumferential light in structure. In addition, due to the large light-emitting area, the light intensity cannot reach the effect of traditional incandescent lamps, and LED filament lamps cannot replace incandescent lamps in many occasions.

[0004] The deficiencies of the current LED filament lamp are: 1. The length of the transparent substrate such as sapphire and glass for double-sided light emission is relatively long, and the light mainly goes in the four directions, and the light below the lamp is relatively dark. 2. The soft aluminum substrate emits light on one side - the main light also goes in the four directions, and the light above and below is weak.

[0005] The current double-sided light emitting and single-sided light emitting LED filament lamp has a problem that the limited substrate itself cannot achieve the heat dissipation purpose. In addition, the substrate is made of sapphire, glass, aluminum and FPC, and the infrared wavelength radiated by these materials is above 8 μm, which belongs to medium and far infrared radiation. The glass bulb shell of the filament lamp is made of ordinary soda lime glass. The vibration frequency (intrinsic frequency) of a substance is determined by the size of the mechanical constant and the atomic weight. The glass forms oxides such as Na2O·CaO·6SiO2 or Na2SiO3, CaSiO3, SiO2, etc. The atomic weight is small, the force constant is large, so the intrinsic frequency is large, and it cannot penetrate medium and far infrared, but only near infrared short wave with a wavelength below 2.5 μm, visible light and ultraviolet light. Therefore, the heat of the filament of the ordinary filament lamp cannot be directly transmitted through the glass shell, but only through the low thermal conductivity gas and glass, and the heat resistance is transmitted to the limited outer surface of the glass, and then taken away by the air, and the heat dissipation efficiency is not good. This is the main drawback of the traditional technology. SUMMARY

[0006] The technical scheme adopted by the present application is as follows: a lamp with a conductive and heat-conductive heat-dissipating substrate, characterized in that it comprises a whole substrate and a lamp bulb, the lamp bulb has a sealed cavity, the whole substrate is arranged in the sealed cavity, a plurality of substrates are connected into the whole substrate through an insulating connecting body, each substrate comprises a light source fixing part and a heat-conductive and heat-dissipating part, a plurality of light source fixing parts and a plurality of heat-conductive and heat-dissipating parts are connected together to form the substrate, the light source fixing part is provided with an LED light source, the heat-conductive and heat-dissipating part is attached to the inner surface of the glass bulb wall, the lamp bulb comprises the glass bulb wall and the glass bulb inner wall, the inner surface of the glass bulb wall and the outer surface of the glass bulb inner wall surround to form the sealed cavity, the LED light source is electrified to emit light, the light transmits through the glass bulb wall and irradiates out, the heat generated by the operation of the substrate is dissipated through the heat-conductive and heat-dissipating part and the glass bulb wall to dissipate heat for the lamp.

[0007] The beneficial effects of the present application are that the light source fixing parts and the heat-conducting and heat-dissipating parts are connected together to form the substrate. The light source fixing parts are provided with LED light sources. The LED light sources can be LED lamp beads, LED light-emitting chips or other light sources. The substrate is arranged in a bulb of a lamp, and the heat-conducting and heat-dissipating parts are attached to the inner surface of the glass bulb wall. When the LED light sources are powered on and emit light, the light transmits through the glass bulb wall and is emitted out, at this moment, the heat generated by the operation of the substrate is mainly in the form of heat radiation and is dissipated through the heat-conducting and heat-dissipating parts and the glass bulb wall to achieve the effect of dissipating heat for the lamp. In practice, the intensity of heat radiation is inversely proportional to the square of the distance, and in the present application, the heat-conducting and heat-dissipating parts are directly attached to the inner surface of the glass bulb wall, which can minimize the distance between the substrate and the glass bulb wall, thereby improving the radiation and heat dissipation efficiency and improving the overall heat dissipation efficiency of the lamp. When the present application works, most of the heat generated by the operation of the LED light sources is directly conducted to the heat-conducting and heat-dissipating parts, and then the heat is mainly in the form of heat radiation and is dissipated through the glass bulb wall. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 It is a front view of the substrate of the present application.

[0009] Figure 2 It is a structural schematic view of the substrate of the present application.

[0010] Figure 3 It is a schematic view of the substrate of the present application arranged in a bulb.

[0011] Figure 4 It is a schematic view of the bulb of the present application.

[0012] Figure 5 It is a schematic view of the overall substrate of the present application.

[0013] Figure 6 It is a schematic view of the front fixed film of the present application.

[0014] Figure 7 It is a schematic view of the back fixed film of the present application.

[0015] Figure 8 It is a schematic view of the lamp of the present application.

[0016] Figure 9 It is a schematic view of the heat-conducting column of the present application.

[0017] Figure 10 It is a schematic view of the spiral current forming light bar magnetic field of the present application.

[0018] Figure 11 It is a schematic view of the fan arranged in the bulb of the present application.

[0019] Figure 12 A schematic diagram of a lamp made according to the present application in the form of a bulb.

[0020] Figure 13 A front view of another embodiment of a substrate according to the present application.

[0021] Figure 14 A cross-sectional view of another embodiment of a substrate according to the present application.

[0022] Figure 15 A front view of another embodiment of a substrate according to the present application.

[0023] Figure 16 A cross-sectional view of another embodiment of a substrate according to the present application.

[0024] Figure 17 A cross-sectional view of an embodiment of a light source according to the present application as a street lamp. DETAILED DESCRIPTION

[0025] As shown in the drawings, a substrate 500 with electrically and thermally conductive heat dissipation function comprises a light source fixing portion 510 and a thermally conductive heat dissipation portion 520. Figures 1-7

[0026] A plurality of the light source fixing portions 510 and a plurality of the thermally conductive heat dissipation portions 520 are connected together to form the substrate 500.

[0027] In a specific implementation, the light source fixing portions 510 and the thermally conductive heat dissipation portions 520 are arranged in an interval, that is, one of the thermally conductive heat dissipation portions 520 is connected between two of the light source fixing portions 510, and one of the light source fixing portions 510 is connected between two of the thermally conductive heat dissipation portions 520.

[0028] The light source fixing portion 510 is provided with an LED light source 530.

[0029] The LED light source 530 can be an LED lamp bead, an LED light emitting chip or other light sources.

[0030] The substrate 500 is arranged in a bulb of a lamp, and the thermally conductive heat dissipation portion 520 is attached to an inner surface 610 of a glass bulb wall 600.

[0031] The LED light source 530 is powered to emit light, and the light is transmitted through the glass bulb wall 600 to be emitted out, at this moment, heat generated by the operation of the substrate 500 is mainly transmitted through the thermally conductive heat dissipation portion 520 and the glass bulb wall 600 to be dissipated out in the form of heat radiation to achieve the heat dissipation effect for the lamp.

[0032] ​In practice, the intensity of heat radiation is inversely proportional to the square of the distance, and in the present application, the heat-conducting and heat-dissipating part 520 is directly attached to the inner surface 610 of the glass bulb wall 600, so that the distance between the substrate 500 and the glass bulb wall 600 is minimized, thereby improving the radiation and heat-dissipating efficiency and improving the overall heat-dissipating efficiency of the lamp.

[0033] In operation, the LED light source 530 generates most of the heat generated during operation directly into the heat-conducting and heat-dissipating part 520, which then dissipates heat mainly in the form of heat radiation through the glass bulb wall 600.

[0034] In specific implementation, the LED flip chip directly on the substrate 500 can also meet the above-mentioned heat-dissipating requirements.

[0035] The light source fixing part 510 has a fixing top surface 511 on which the LED light source 530 is arranged, and the fixing top surface 511 is a reflective surface, part of the light emitted by the LED light source 530 directly transmits through the glass bulb wall 600, and part of the light is reflected by the inner surface 610 of the glass bulb wall 600 and finally reflected by the reflective surface and transmitted through the glass bulb wall 600.

[0036] The heat-conducting and heat-dissipating part 520 has a contact top surface 521 on which a plurality of contact ribs 522 are provided, and the plurality of contact ribs 522 are in contact with the inner surface 610 of the glass bulb wall 600 to realize the effect of the heat-conducting and heat-dissipating part 520 being attached to the inner surface 610 and dissipating heat.

[0037] At the same time, when the substrate 500 is bent and placed in the bulb, the plurality of contact ribs 522 also have the effect of ensuring the bending effect.

[0038] As shown in Figure 4 In specific implementation, the glass bulb wall 600 is straight pipe-shaped, the inner surface 610 is pipe-shaped, and a plurality of heat-conducting and heat-dissipating parts 520 are simultaneously attached to the inner surface 610 of the pipe.

[0039] As shown in Figure 2 In specific implementation, a near-infrared radiation layer 13 is provided on the contact top surface 521 of the heat-conducting and heat-dissipating part 520.

[0040] It is worth noting that at this time, the top of the contact rib 522 is not provided with the near-infrared radiation layer 13, because the radiation material layer itself has a certain thermal resistance, which will affect the contact between the contact rib 522 and the inner surface 610 and affect the heat conduction.

[0041] AsFigure 2 As shown, in a specific implementation, a radiation reflective layer 540 is provided on the bottom surface of the substrate 500.

[0042] The radiation reflective layer 540 can be a silver-plated layer or other reflective layers. Silver is a low-emissivity layer and will not lower the effective front radiation temperature.

[0043] The thermal radiation generated by the substrate 500 is partially radiated directly through the glass bulb wall 600, and the other part is reflected by the radiation reflection layer 540 and then radiated through the glass bulb wall 600.

[0044] In practice, the intensity of thermal radiation is proportional to the fourth power of temperature: (273° + X). 4 , where X is temperature.

[0045] The radiation reflective layer 540 enables most of the thermal radiation generated by the substrate 500 to radiate outward from its top. At this time, the temperature of the top of the substrate 500 is much higher than the temperature of its bottom surface. Therefore, the outward emissivity of the top surface of the substrate 500 is stronger. This cycle allows the thermal radiation generated by the substrate 500 to be efficiently and directly radiated through the glass bulb wall 600.

[0046] In practice, the radiation reflection layer 540 is disposed on the bottom surface of the heat-conducting and heat-dissipating part 520 and the light source fixing part 510.

[0047] like Figure 5 The diagram shows another structural form of the substrate 500 of the present invention. The arrow indicates the overall bending direction, and after bending, the entire substrate is placed in the glass bulb wall 600.

[0048] In practice, several substrates 500 are connected into a single substrate by an insulating connector 700.

[0049] like Figure 3 As shown, the integral substrate is disposed in the bulb of the lamp, and the heat-conducting and heat-dissipating portion 520 of each of the substrate 500 that makes up the integral substrate is attached to the inner surface 610 of the glass bulb wall 600.

[0050] like Figure 3 As shown, each of the substrates 500 is provided with a spring-loaded portion 550. When the substrate 500 is bent, the spring-loaded portion 550 can apply an elastic force to the substrate 500, so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 of the glass bulb wall 600.

[0051] When the glass bulb wall 600 is a straight tube and the inner surface 610 is tubular, the spring-loaded portion 550 is disposed at the rear end of the substrate 500.

[0052] When the substrate 500 is bent into a ring shape, the elastic pressing portion 550 presses the front end of the substrate 500, so that the heat-conducting heat-dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 of the tube.

[0053] In a specific implementation, the insulating connecting body 700 includes a front fixed film 710 and a back fixed film 720.

[0054] The front fixed film 710 is attached to the front surface of the whole substrate, and the back fixed film 720 is attached to the back surface of the whole substrate.

[0055] As shown in Figure 6 The front fixed film 710 is provided with a light source window 711 and an infrared radiation window 712.

[0056] As shown in Figure 7 The back fixed film 720 is provided with a reflection window 721 and a lamp bead back radiation window 722.

[0057] The fixed top surface 511 of the light source fixed portion 510 and the LED light source 530 are in the light source window 711.

[0058] The contact top surface 521 of the heat-conducting heat-dissipating portion 520 and the near-infrared radiation layer 13 thereon are in the infrared radiation window 712.

[0059] The radiation reflection layer 540 on the bottom surface of the substrate 500 is in the reflection window 721.

[0060] The bottom surface of the light source fixed portion 510 is in the lamp bead back radiation window 722.

[0061] In a specific implementation, the front fixed film 710 is a white fixed film, so as to improve the light reflection effect of the LED light source 530.

[0062] In a specific implementation, the lamp bulb is filled with a heat-dissipating gas, such as helium, argon, etc.

[0063] The heat of the whole substrate is mainly radiated through the light-emitting front surface, and the heat generated by the back surface is conducted through the heat-dissipating gas.

[0064] As shown in Figures 1-12 Another embodiment of the technical scheme of the present application is as follows.

[0065] As shown in Figure 8As shown, a lamp with a conductive and thermally conductive heat dissipation substrate includes an integral substrate and a lamp bulb. The lamp bulb has a sealed cavity 100, and the integral substrate is disposed in the sealed cavity 100. Several substrates 500 are connected to form the integral substrate by an insulating connector 700.

[0066] like Figures 1-7 As shown, each of the substrates 500 includes a light source fixing portion 510 and a heat conduction and heat dissipation portion 520.

[0067] Several light source fixing parts 510 and several heat conduction and heat dissipation parts 520 are connected together to form the substrate 500.

[0068] In practice, the light source fixing part 510 and the heat conduction and heat dissipation part 520 are spaced apart. That is, one heat conduction and heat dissipation part 520 is connected between two light source fixing parts 510, and one light source fixing part 510 is connected between two heat conduction and heat dissipation parts 520.

[0069] An LED light source 530 is provided on the fixed part 510 of the light source.

[0070] The LED light source 530 can be an LED bead, an LED chip, or other light source.

[0071] The heat-conducting and heat-dissipating part 520 is attached to the inner surface 610 of the glass bulb wall 600.

[0072] like Figure 8 As shown, the lamp bulb includes a glass bulb wall 600 and a glass bulb inner wall 800, and the sealed cavity 100 is formed by the inner surface 610 of the glass bulb wall 600 and the outer surface of the glass bulb inner wall 800 surrounding each other.

[0073] When the LED light source 530 is powered on, it emits light, which shines out through the glass bulb wall 600. At this moment, the heat generated by the substrate 500 during operation is mainly dissipated through the heat-conducting and heat-dissipating part 520 and through the glass bulb wall 600 in the form of thermal radiation, so as to achieve the function of heat dissipation for the lamp.

[0074] In practice, the intensity of thermal radiation is inversely proportional to the square of the distance. In this invention, by directly attaching the heat-conducting and heat-dissipating part 520 to the inner surface 610 of the glass bulb wall 600, the distance between the substrate 500 and the glass bulb wall 600 can be minimized, thereby improving the efficiency of radiative heat dissipation and thus improving the overall heat dissipation efficiency of the lamp. When the LED light source 530 is powered on and emits light, most of the heat generated is directly conducted to the heat-conducting and heat-dissipating part 520, and then the heat-conducting and heat-dissipating part 520 dissipates the heat mainly through the glass bulb wall 600 in the form of thermal radiation.

[0075] The light source fixing part 510 has a fixing top surface 511, the LED light source 530 is arranged on the fixing top surface 511, the fixing top surface 511 is a reflecting surface, part of the light emitted by the LED light source 530 directly transmits through the glass bulb wall 600 to irradiate, and part of the light is reflected by the inner surface 610 of the glass bulb wall 600 and finally transmits through the glass bulb wall 600 after being reflected by the reflecting surface.

[0076] The heat-conducting and heat-dissipating part 520 has a contact top surface 521, a plurality of contact ribs 522 are protruded on the contact top surface 521, the plurality of contact ribs 522 are in contact with the inner surface 610 of the glass bulb wall 600, so that the heat-conducting and heat-dissipating part 520 is tightly attached to the inner surface 610 and dissipates heat.

[0077] Meanwhile, when the substrate 500 is bent and placed in the bulb, the plurality of contact ribs 522 also have the effect of ensuring the bending effect.

[0078] In the specific implementation, the near-infrared radiation layer 13 is arranged on the contact top surface 521 of the heat-conducting and heat-dissipating part 520.

[0079] The near-infrared radiation layer 13 is also arranged on the bottom surface of the substrate 500.

[0080] It is worth noting that at this time, the top of the contact rib 522 is not provided with the near-infrared radiation layer 13, because the radiation material layer itself has a certain thermal resistance, which will affect the contact between the contact rib 522 and the inner surface 610 and affect the heat conduction.

[0081] In the specific implementation, the elastic pressing part 550 is arranged on each of the substrates 500, when the substrate 500 is bent, the elastic pressing part 550 can exert an elastic force on the substrate 500, so that the heat-conducting and heat-dissipating part 520 of the substrate 500 is tightly attached to the inner surface 610 of the glass bulb wall 600.

[0082] When the glass bulb wall 600 is a straight pipe, and the inner surface 610 is a pipe, the elastic pressing part 550 is arranged at the rear end of the substrate 500, when the substrate 500 is bent into a ring shape, the elastic pressing part 550 presses the front end of the substrate 500, so that the heat-conducting and heat-dissipating part 520 of the substrate 500 is tightly attached to the inner surface 610 of the pipe.

[0083] In the specific implementation, the insulating connecting body 700 includes a front fixed film 710 and a back fixed film 720, wherein the front fixed film 710 is attached to the front of the whole substrate, and the back fixed film 720 is attached to the back of the whole substrate.

[0084] The front fixed film 710 is provided with a light source window 711 and an infrared radiation window 712, and the back fixed film 720 is provided with a lamp bead back radiation window 722.

[0085] The fixed top surface 511 of the light source fixed part 510 and the LED light source 530 are located in the light source window 711.

[0086] The near-infrared radiation layer 13 on the contact top surface 521 of the heat-conducting heat-dissipating part 520 is located in the infrared radiation window 712.

[0087] The near-infrared radiation layer 13 on the bottom surface of the substrate 500 is located in the lamp bead back radiation window 722.

[0088] In specific implementation, the front fixed film 710 is a white fixed film to improve the light reflection effect of the LED light source 530.

[0089] In specific implementation, the sealed cavity 100 is filled with heat-dissipating gas, such as helium, argon, etc.

[0090] In specific implementation, the near-infrared radiation layer 13 can be made of various materials, such as a mixed material composed of 60% nickel oxide, 30% cobalt oxide, and 10% iron oxide.

[0091] In operation, the LED light source 530 is powered to emit light, and the heat generated by the operation is conducted to the near-infrared radiation layer 13, which radiates the heat in the form of near-infrared short waves to achieve the effect of dissipating heat and reducing the working temperature of the substrate 500.

[0092] The lamp further comprises a heat-conducting column 20 corresponding to the near-infrared radiation layer 13 on the bottom surface of the substrate 500.

[0093] The heat-conducting column 20 is used to absorb the near-infrared short waves emitted by the near-infrared radiation layer 13.

[0094] In operation, the near-infrared radiation layer 13 radiates heat in the form of near-infrared short waves, and at this moment, the heat-conducting column 20 absorbs the near-infrared short waves, and at the same time, the heat-conducting column 20 dissipates heat outward to achieve the effect of dissipating heat for the lamp.

[0095] The heat-conducting column 20 is provided with an infrared absorption layer 21 corresponding to the near-infrared radiation layer 13 on the bottom surface of the substrate 500, and the infrared absorption layer 21 is used to absorb the near-infrared short waves emitted by the near-infrared radiation layer 13.

[0096] In the embodiment, the infrared absorption layer 21 has an absorption rate greater than 90% and an emissivity less than 20%. The infrared absorption layer 21 can be made of a mixture of various materials, for example, a mixture of 60% nickel oxide, 30% cobalt oxide and 10% iron oxide by weight.

[0097] The heat-conducting column 20 further has an aerogel layer 22 arranged on the outer surface of the heat-conducting column 20 between the outer surface of the heat-conducting column 20 and the infrared absorption layer 21.

[0098] In operation, the infrared absorption layer 21 absorbs the near-infrared short waves emitted by the near-infrared radiation layer 13. At this time, the heat is radiated outward through the inner surface of the other side of the heat-conducting column 20 by means of the aerogel layer 22.

[0099] The aerogel (SiO_2 aerogel has extremely low thermal conductivity due to its fine nano-porous structure, and is almost transparent to near-infrared wavelengths below 8 μm) used to make the aerogel layer 22. When the near-infrared passes through, the heat generated is absorbed by a black body material with a characteristic wavelength greater than 8 μm. After being heated, the wavelength of the radiation is greater than 8 μm, which is blocked by the aerogel. In addition, the aerogel has extremely poor thermal conductivity of 0.013 W / m.k. Therefore, the heat can only be radiated from the inner surface of the heat-conducting column 20.

[0100] In the embodiment, the air flows around the heat-conducting column 20 to improve the heat dissipation efficiency of the heat-conducting column 20 and the heat dissipation effect of the lamp.

[0101] In the embodiment, the glass bulb wall 600 and the glass bulb inner wall 800 are made of quartz or infrared glass.

[0102] The quartz or infrared glass allows the near-infrared, mid-infrared and infrared reflected by the glass to pass through, and the transmitted near-infrared is absorbed by the heat-conducting column 20.

[0103] In the embodiment, the glass bulb inner wall 800 is a glass inner sleeve, and the glass bulb wall 600 is a glass outer sleeve.

[0104] The outer surface of the glass inner sleeve and the inner surface of the glass outer sleeve surround the sealed cavity 100.

[0105] The inner surface of the glass inner sleeve surrounds a ventilation and heat dissipation cavity 150, and the heat-conducting column 20 is arranged in the ventilation and heat dissipation cavity 150.

[0106] The ventilation and heat dissipation cavity 150 includes an air inlet 151 and an air outlet 152.

[0107] The air inlet 151 and the air outlet 152 are respectively located at two ends of the lamp.

[0108] Wherein, the air inlet 151 is located at the lamp holder, and the air outlet 152 is located at the front end of the lamp.

[0109] In the embodiment, the whole base plate is arranged around the heat-conducting column 20.

[0110] The whole base plate and the heat-conducting column 20 are in tubular shape.

[0111] The whole base plate is powered to emit light, and a spiral current 15 is formed along the spiral direction of the whole base plate, a light bar magnetic field 16 is formed by the spiral current 15, the light bar magnetic field 16 is in the ventilation and heat dissipation cavity 150, and the heat-conducting column 20 is in the light bar magnetic field 16, so that the heat dissipation efficiency of the heat-conducting column 20 is improved by the light bar magnetic field 16.

[0112] Specifically, various optical phenomena caused by the interaction between light (infrared) and substances in a magnetized state, including Faraday's magnetic rotation effect, Cotton-Mouton effect and Kerr magneto-optical effect, etc. These effects all originate from the magnetization of the substance.

[0113] It reflects the relationship between light and the magnetism of the substance. When light propagates in a medium, if a strong magnetic field is added parallel to the direction of light propagation, the light vibration direction will be deflected, and the deflection direction depends on the properties of the medium and the direction of the magnetic field. This phenomenon is called magnetic rotation effect. The external magnetic field can reduce the energy level of electromagnetic waves, and the heat required by infrared radiation is reduced by the substrate, so that the radiation intensity is enhanced at the same temperature.

[0114] As shown in Figure 11 , in the embodiment, a fan 155 is arranged in the ventilation and heat dissipation cavity 150 to improve the heat dissipation efficiency.

[0115] In the embodiment, the heat-conducting column 20 can be tubular, conical, etc. As shown in Figure 12 , the lamp of the present application can also be made into a bulb shape.

[0116] As shown in Figures 13-16 , it is another embodiment of the present application.

[0117] A substrate with heat-conducting and heat-dissipating effect, which comprises a light source area 910 and a heat-conducting and heat-dissipating area 920.

[0118] A plurality of the light source areas 910 are arranged on the substrate.

[0119] In the embodiment, the heat-conducting and heat-dissipating area 920 is between two adjacent light source areas 910, the light source area 910 can be arranged on the surface of the substrate, and the light source area 910 can also be arranged in the substrate.

[0120] The light source region 910 is provided with an LED light body 930.

[0121] The substrate is arranged in the bulb of the lamp, and the heat-conducting heat dissipation region 920 is attached to the inner surface of the glass bulb wall.

[0122] The LED light body 930 is powered to emit light, and the light transmits through the glass bulb wall to be emitted out. At this moment, the heat generated by the operation of the substrate is mainly dissipated in the form of heat radiation through the heat-conducting heat dissipation region 920 and the glass bulb wall to achieve the effect of dissipating heat for the lamp.

[0123] As shown in Figures 13-14 , the LED light body 930 is a positive LED light chip. In practice, a plurality of positive LED light chips can be arranged in the light source region 910 at the same time.

[0124] In specific implementation, a reinforcing platform 911 can be arranged below the light source region 910.

[0125] As shown in Figures 15-16 , the LED light body 930 is an LED light bar, and the light source region 910 is a through slot.

[0126] The LED light bar is connected to the substrate, and the LED light source on the LED light bar is in the through slot.

[0127] At this moment, the substrate as a whole can be designed as a uniform temperature plate, such as a thick copper plate, or a plate body provided with a uniform temperature material layer.

[0128] Figures 13-16 The other structures of the substrate in the embodiment shown in Figures 1-12 are the same as those in , and will not be repeated here.

[0129] In addition, it is worth emphasizing that the direct replacement of the traditional high-pressure sodium lamp, gold halide lamp light source with an LED standard light source has always been the goal pursued by LED researchers. Based on the large power and large heat dissipation, the volume is limited and the heat dissipation surface is not enough, and it has always been unable to achieve. Especially for street lamps, since the lamp shell of the traditional high-pressure sodium lamp, ceramic gold halide lamp light source has been included in the city's road landscape, and the traditional LED street lamp must replace the entire lamp head, one is the replacement cost is high, and two is affected by the heat dissipation design, the appearance cannot be designed at will.

[0130] Now the general practice is to set the filament lamp bar in the center of the glass and then transmit to the glass by helium, because the conduction coefficient of helium is extremely low (0.2W / c.m), so that the temperature difference between the chip and the glass is large (about 40 degrees), when the temperature of the glass is 60 degrees, the temperature of the chip has reached or exceeded 100 degrees, in order to reduce the temperature difference, the design idea of the present application can make the substrate of the light source as close as possible to the glass wall, preferably filled with high thermal conductivity medium, and directly transmit heat to the glass. Glass is a high radiation material with a radiation coefficient of 0.94. According to the radiation law of Boltzmann, the radiation intensity is proportional to the 4th power of the blackbody temperature. In the case of closely contacting the glass, the temperature of the glass is also close to 100 degrees, and the heat radiation is increased by nearly 1 times, that is, the power can be increased by nearly 1 times under the condition of the same chip temperature. The specific design idea is as follows.

[0131] As shown in Figure 17 , the substrate in Figures 13-16 is made into Figure 17 the street lamp bulb, and the whole bulb can be circular, oval, flat plate and the like.

[0132] The outer surface of the glass bulb wall 600 can be roughened, and the heat-conducting and heat-dissipating area 920 is attached to the inner surface 610 of the glass bulb wall 600.

[0133] The surface of the light source area 910 can be provided with a light reflecting layer to reflect the light of the LED light emitting body 930.

[0134] In addition, the back of the light source area 910 can be provided with a near-infrared radiation layer 13.

[0135] The back of the heat-conducting and heat-dissipating area 920 can be provided with an infrared absorbing layer 21.

[0136] The near-infrared radiation layer 13 can dissipate heat in the manner described above.

[0137] In practice, part of the heat radiated by the radiation layer 13 is reflected, part is absorbed by the absorbing coating on the top and dissipated, and the other part of the heat is conducted to the glass bulb wall through the filled helium and dissipated.

Claims

1. A lamp fixture having a conductive and thermally conductive heat dissipation substrate, characterized in that: The device includes an integral substrate and a lamp bulb. The lamp bulb has a sealed cavity, and the integral substrate is disposed in the sealed cavity. Several substrates are connected to form the integral substrate by insulating connectors. Each of the substrates includes a light source fixing portion and a heat conduction and heat dissipation portion. Several light source fixing portions and several heat conduction and heat dissipation portions are connected together to form the substrate. An LED light source is mounted on the fixed part of the light source, and the heat-conducting and heat-dissipating part is attached to the inner surface of the glass bulb wall. The light bulb includes a glass bulb wall and a glass bulb inner wall, with the inner surface of the glass bulb wall and the outer surface of the glass bulb inner wall surrounding each other to form a sealed cavity. The LED light source emits light when powered on, and the light shines out through the glass bulb wall. The heat generated by the substrate during operation is dissipated through the heat-conducting heat dissipation part and through the glass bulb wall to dissipate heat for the lamp. The light source fixing part has a fixed top surface, on which the LED light source is disposed. The fixed top surface is a reflective surface. Part of the light emitted by the LED light source shines directly through the glass bulb wall, and part of the light is reflected by the inner surface of the glass bulb wall and finally reflected by the reflective surface before shining through the glass bulb wall. The heat-conducting and heat-dissipating part has a contact top surface, on which a plurality of contact ribs are protruding, and the plurality of contact ribs contact the inner surface of the glass bulb wall. A near-infrared radiation layer is provided on the top contact surface of the heat-conducting and heat-dissipating part, but the top of the contact rib does not have the near-infrared radiation layer. The near-infrared radiation layer is disposed on the bottom surface of the substrate. The insulating connector includes a front fixing film and a back fixing film, wherein the front fixing film is attached to the front side of the integral substrate, and the back fixing film is attached to the back side of the integral substrate. A light source window is provided on the front fixing film, and a lamp bead rear radiation window is provided on the back fixing film. The fixing top surface of the light source fixing part and the LED light source are located in the light source window. The near-infrared radiation layer on the bottom surface of the substrate is located in the lamp bead rear radiation window. The lamp also includes a heat-generating column, which corresponds to the near-infrared radiation layer on the bottom surface of the substrate. The heat-generating column is used to absorb the near-infrared short waves emitted by the near-infrared radiation layer. During operation, the near-infrared radiating layer radiates heat outward in the form of near-infrared short waves. At this time, the heat-absorbing column absorbs these near-infrared short waves and simultaneously dissipates the heat outward. An infrared absorption layer is disposed on the outer surface of the heat-conducting column, and an aerogel layer is also disposed on the outer surface of the heat-conducting column between the outer surface of the heat-conducting column and the infrared absorption layer. A ventilation and heat dissipation cavity is formed around the inner wall of the glass bulb, and this cavity includes an air inlet and an air outlet. The integral substrate is arranged around the heat-generating column. When the integral substrate is energized, it emits light. The current flowing in the integral substrate forms a spiral current along the spiral direction of the integral substrate. The spiral current forms a lamp bar magnetic field. The lamp bar magnetic field is located in the ventilation and heat dissipation cavity. The heat-generating column is located in the lamp bar magnetic field. The heat dissipation efficiency of the heat-generating column is improved by means of the lamp bar magnetic field.

2. A lamp fixture with a conductive and thermally conductive heat dissipation substrate as described in claim 1, characterized in that: A fan is installed in the ventilation and heat dissipation cavity.

3. A lamp fixture with a conductive and thermally conductive heat dissipation substrate as described in claim 1, characterized in that: Each of the substrates is provided with a spring-loaded portion. When the substrate is bent, the spring-loaded portion can apply an elastic force to the substrate, so that the heat-conducting and heat-dissipating portion of the substrate is tightly attached to the inner surface of the glass bulb wall.

Images