Conductive connector and method of making the same

Abstract

The present application provides a kind of electrically conductive connector, including at least two layers of electrically conductive layer, and wherein at least one of the electrically conductive layer is provided with hole through its two side surfaces, any two adjacent layers of the electrically conductive layer is provided with inner adhesive film layer, the surface of the electrically conductive layer towards the inner adhesive film layer is provided with protruding part, and the protruding part on the opposite two side surfaces of any two adjacent layers of the electrically conductive layer protrudes into the inner adhesive film layer between the two layers of the electrically conductive layer and is connected with each other.Compared with prior art, the electrically conductive connector has the advantages of simple manufacturing process, low production cost, high firmness, good electrical conductivity and the like.In addition, the present application also provides a manufacturing method of the above-mentioned electrically conductive connector, which has the advantages of simple operation, easy implementation and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic component packaging technology, in particular to a conductive connector and a manufacturing method thereof. BACKGROUND

[0002] With the development of electronic products towards miniaturization and high integration, the packaging technology of electronic components and the manufacturing technology of printed circuit boards have increasingly stringent requirements for interconnection materials, and traditional interconnection materials have been unable to meet the needs of the environment and technology.

[0003] Conductive adhesive is a kind of adhesive with certain conductive properties after curing or drying, which is an emerging electronic material and an ideal substitute for traditional Sn-Pb solder and has more competitiveness. However, it is found in the use process that the conductive adhesive not only has the problem of poor conductive effect, but also has the problem of unstable connection performance.

[0004] To solve the above problems, the industry proposes a flexible connector which includes a first conductive layer, an insulating layer and a second conductive layer which are sequentially stacked, and the first conductive layer and the second conductive layer are connected and conducted through the conductive hole provided on the insulating layer, so that the electronic component and the circuit board are electrically connected through the first conductive layer, the conductive hole and the second conductive layer. However, the preparation process of this flexible connector is complex, which requires a lot of time and labor costs. In order to enable the first conductive layer and the second conductive layer to realize electrical connection, during preparation, a mechanical drilling, laser drilling or stamping method is first used to form a connecting hole connecting the two copper foils on the flexible copper-clad plate, and then the connecting hole needs to be hole metallized to form a conductive hole.

[0005] Therefore, it is necessary to design an interconnection structure which has good conductive effect, stable connection performance, simple manufacturing process and low cost. SUMMARY

[0006] To solve the above technical problems, the present application provides a conductive connector and a manufacturing method thereof, which is used for the installation and connection of a circuit board and has the advantages of simple manufacturing process, low production cost, high firmness and good conductive performance.

[0007] Based on this, the present application provides a conductive connector which includes at least two conductive layers, at least one of which is provided with a hole penetrating through both sides of the surface, and an inner adhesive film layer is provided between any two adjacent conductive layers. The surface of the conductive layer facing the inner adhesive film layer is provided with a protruding part, and the protruding parts on the opposite surfaces of any two adjacent conductive layers protrude into the inner adhesive film layer between the two conductive layers and are connected to each other.

[0008] As a preferred scheme, the protruding part is a regular or irregular three-dimensional geometric shape.

[0009] As a preferred solution, the shape of the protruding part is pointed, inverted cone, granular, dendritic, columnar or block.

[0010] As a preferred solution, the material of the protruding part is one or a combination of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold and silver.

[0011] As a preferred solution, the height of the protruding part is 0.2-30 μm.

[0012] As a preferred solution, two or more protruding parts are provided on the same side surface of the conductive layer, and the two or more protruding parts are distributed continuously or discontinuously, the shape of each protruding part is the same or different, and the size of each protruding part is the same or different.

[0013] As a preferred solution, the thickness of the conductive layer is 1-18 μm.

[0014] As a preferred solution, the surface of the conductive layer is rough or smooth.

[0015] As a preferred solution, the material of the inner adhesive film layer is thermosetting adhesive or thermoplastic adhesive.

[0016] As a preferred solution, two or more holes are provided in the conductive layer, and the shape of each hole is the same or different, and the size of each hole is the same or different.

[0017] As a preferred solution, the outermost conductive layer is referred to as an outer conductive layer, and the surface of the outer conductive layer away from the inner adhesive film layer is also provided with the protruding part.

[0018] As a preferred solution, the side of the outer conductive layer away from the inner adhesive film layer is further provided with an outer adhesive film layer, and the protruding part on the surface of the outer conductive layer away from the inner adhesive film layer is hidden in the outer adhesive film layer or penetrates the outer adhesive film layer and is exposed.

[0019] As a preferred solution, the protruding part on the surface of the outer conductive layer away from the inner adhesive film layer is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is less than the average height of the protruding part.

[0020] As a preferred solution, the material of the outer adhesive film layer is pressure-sensitive adhesive, thermosetting adhesive or thermoplastic adhesive.

[0021] The application also provides a method for manufacturing a conductive connector, comprising the following steps:

[0022] forming a protruding part on the outer surface of the thin copper layer of the peelable copper foil;

[0023] forming a hole through both sides of the peelable copper foil;

[0024] forming an inner adhesive film layer on the thin copper layer of the peelable copper foil where the protrusions are formed;

[0025] Take any two pieces of peelable copper foil, respectively, as the first peelable copper foil and the second peelable copper foil, and press the first peelable copper foil and the second peelable copper foil against each other with the thin copper layers opposite to each other until they are pressed together, at this time, a layer of inner adhesive film is formed between the two pieces of peelable copper foil, which is recorded as the first inner adhesive film layer, and the protrusions on the outer side surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer side surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and connect with each other;

[0026] Respectively, peel off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil.

[0027] In the above method for manufacturing the conductive connector, after peeling off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, further comprising the steps of:

[0028] forming protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer;

[0029] Take another piece of peelable copper foil, which is recorded as the third peelable copper foil, and press the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil against each other until they are pressed together, at this time, a layer of inner adhesive film is formed between the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil, which is recorded as the second inner adhesive film layer, and the protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer and the protrusions on the outer side surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and connect with each other;

[0030] peel off the carrier layer of the third peelable copper foil;

[0031] According to the needs, continue to press the new peelable copper foil by referring to the above steps.

[0032] In the above method for manufacturing the conductive connector, after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector, further comprising the steps of:

[0033] forming protrusions on the surface of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer.

[0034] In the above method for manufacturing the conductive connector, after forming protrusions on the surface of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer, further comprising the steps of:

[0035] An outer adhesive film layer is formed on the side of the thin copper layer of the conductive connector facing away from the inner adhesive film layer.

[0036] In the method for manufacturing the conductive connector, the step of forming the inner adhesive film layer or the outer adhesive film layer comprises:

[0037] The inner adhesive film layer or the outer adhesive film layer is coated on the release film, and then transferred to the surface of the thin copper layer through the release film;

[0038] Or the inner adhesive film layer or the outer adhesive film layer is coated directly on the surface of the thin copper layer.

[0039] In the method for manufacturing the conductive connector, one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used to form the protruding part on the surface of the thin copper layer.

[0040] In the method for manufacturing the conductive connector, the carrier layer comprises a peelable layer, a barrier layer and a main body layer, and the thin copper layer, the peelable layer, the barrier layer and the main body layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer and the main body layer are sequentially stacked.

[0041] In the method for manufacturing the conductive connector, mechanical drilling, laser drilling or stamping is used to form a hole penetrating through both sides of the peelable copper foil.

[0042] The application also provides a method for manufacturing a conductive connector, comprising the following steps:

[0043] A protruding part is formed on the outer side surface of the thin copper layer of the peelable copper foil;

[0044] An inner adhesive film layer is formed on the thin copper layer of the peelable copper foil with the protruding part;

[0045] Any two peelable copper foils are taken, respectively denoted as a first peelable copper foil and a second peelable copper foil, and the first peelable copper foil and the second peelable copper foil are pressed together with the thin copper layers opposite to each other until they are pressed together, at this time, an inner adhesive film layer is formed between the two peelable copper foils, denoted as a first inner adhesive film layer, and the protruding part on the outer side surface of the thin copper layer of the first peelable copper foil and the protruding part on the outer side surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and are connected to each other;

[0046] The carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off respectively, and thus the thin copper layer of the first peelable copper foil, the first inner adhesive film layer and the thin copper layer of the second peelable copper foil are sequentially stacked to form a conductive connector with two thin copper layers;

[0047] If necessary, continue to form the protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer;

[0048] Take another piece of peelable copper foil, which is referred to as the third peelable copper foil, and press the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil together until they are pressed together, at which time a layer of inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil, which is referred to as the second inner adhesive film layer, and the protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer and the protrusions on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and are connected to each other;

[0049] Peel off the carrier layer of the third peelable copper foil;

[0050] According to the needs, continue to press the new peelable copper foil according to the above steps until the desired conductive connector is obtained;

[0051] Form holes through both sides of the outermost thin copper layer of the conductive connector or form holes from one side of the outermost surface of the conductive connector to the other side of the outermost surface of the conductive connector.

[0052] In the above method for manufacturing a conductive connector, after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector, the method further comprises the steps of:

[0053] Forming protrusions on the surface of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer.

[0054] In the above method for manufacturing a conductive connector, after forming protrusions on the surface of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer, the method further comprises the steps of:

[0055] Forming an outer adhesive film layer on one side of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer.

[0056] In the above method for manufacturing a conductive connector, the step of forming an inner adhesive film layer or an outer adhesive film layer comprises:

[0057] Coating the inner adhesive film layer or the outer adhesive film layer on the release film, and then transferring the inner adhesive film layer or the outer adhesive film layer to the surface of the thin copper layer through the release film;

[0058] Or directly coating the inner adhesive film layer or the outer adhesive film layer on the surface of the thin copper layer.

[0059] In the above method for manufacturing a conductive connector, one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used to form protrusions on the surface of the thin copper layer.

[0060] In the manufacturing method of the conductive connector, the carrier layer comprises a peelable layer, a barrier layer and a main body layer, and the thin copper layer, the peelable layer, the barrier layer and the main body layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer and the main body layer are sequentially stacked.

[0061] In the manufacturing method of the conductive connector, a hole is formed on the outermost thin copper layer of the conductive connector by mechanical drilling, laser drilling or stamping, or a hole is formed in the conductive connector from one side of the outermost surface to the other side of the outermost surface.

[0062] The embodiment of the present application has the following beneficial effects:

[0063] Compared with the traditional welding and bonding, the conductive connector provided by the embodiment of the present application can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and the two outermost conductive layers are connected with the two circuit boards or the circuit board and the grounding metal plate, so as to realize the electrical connection between the two circuit boards or between the circuit board and the grounding metal plate. Therefore, the circuit board can be repeatedly disassembled, the circuit board is convenient to maintain, the manufacturing cost of the electronic product is reduced, and the installation reliability of the circuit board is ensured while realizing the electrical connection.

[0064] Compared with the existing flexible connector, the conductive connector provided by the present application does not need to be metalized when manufactured, and only needs to be pressed towards each other, so that the conductive connector is more convenient and fast to manufacture, and the cost is lower. Since the two conductive layers are electrically connected by the protruding part protruding into the inner adhesive film layer, the conductive connector provided by the present application has better conductivity and more stable connection performance. Since the inner adhesive film layer has a certain elasticity and anti-deformation ability, it can play a buffering role, so that the conductive connector provided by the present application is not easy to deform when repeatedly disassembled, and the reliability of the electrical connection between the two circuit boards or between the circuit board and the grounding metal plate is ensured. In addition, since the conductive layer is provided with a hole, when the conductive connector is pressed between the two circuit boards or between the circuit board and the grounding metal plate, the adhesive of the inner adhesive film layer will flow into the hole of the conductive layer, tightly connecting the two adjacent conductive layers. At the same time, the hole is beneficial to the discharge of volatile substances in the inner adhesive film layer at high temperature, thereby avoiding the problem of peeling between the conductive layers caused by the bubble layering of the inner adhesive film layer, and further improving the peeling strength between the conductive layers, effectively ensuring that the conductive layers are firmly connected together.

[0065] The present application also provides a manufacturing method of the conductive connector, which has the advantages of simple operation and easy implementation. BRIEF DESCRIPTION OF DRAWINGS

[0066] Figure 1 This is a cross-sectional schematic diagram of a conductive connector with a flat conductive layer according to Embodiment 1 of the present invention.

[0067] Figure 2 This is a cross-sectional schematic diagram of a conductive connector employing three conductive layers according to Embodiment 1 of the present invention;

[0068] Figure 3 This is a cross-sectional schematic diagram of a conductive connector with a rough conductive layer surface according to Embodiment 1 of the present invention.

[0069] Figure 4 This is a cross-sectional schematic diagram of a conductive connector with an outer adhesive film layer according to Embodiment 1 of the present invention;

[0070] Figure 5 This is a cross-sectional schematic diagram of a conductive connector employing a double conductive layer according to Embodiment 1 of the present invention.

[0071] Explanation of reference numerals in the attached figures:

[0072] 1. Conductive layer; 1a. First conductive layer; 1b. Second conductive layer; 101. Outer conductive layer; 102. Inner conductive layer; 11. Hole; 11a. First hole; 11b. Second hole; 12. Protrusion; 12a. First protrusion; 12b. Second protrusion; 12c. Third protrusion; 12d. Fourth protrusion; 2. Inner adhesive film layer; 3. Outer adhesive film layer; 3a. First outer adhesive film layer; 3b. Second outer adhesive film layer. Detailed Implementation

[0073] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0074] Example 1

[0075] like Figure 1 As shown, this embodiment of the invention provides a conductive connector, mainly comprising at least two conductive layers 1, wherein at least one conductive layer 1 has holes 11 penetrating its two side surfaces. In this embodiment, each conductive layer 1 has holes 11. An inner adhesive film layer 2 is provided between any two adjacent conductive layers 1. A protrusion 12 is provided on the surface of the conductive layer 1 facing the inner adhesive film layer 2, and the protrusions 12 on the opposite side surfaces of any two adjacent conductive layers 1 protrude into the inner adhesive film layer 2 between the two conductive layers 1 and are interconnected. Based on the above structure, the conductive connector provided by this embodiment of the invention has the following beneficial effects:

[0076] Compared with traditional welding and bonding, the conductive connector provided by the embodiment of the present application can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and the outermost two conductive layers 1 are connected with the two circuit boards or the circuit board and the grounding metal plate, so as to realize the electrical connection between the two circuit boards or between the circuit board and the grounding metal plate. Thus, the circuit board can be repeatedly disassembled, the circuit board is convenient to maintain, the manufacturing cost of the electronic product is reduced, and the mounting reliability of the circuit board is ensured while realizing the electrical connection.

[0077] Compared with the existing flexible connector, the conductive connector provided by the present application does not need hole metallization when being manufactured, and only needs to press the two conductive layers 1 towards each other, so that the conductive connector is more convenient and fast to manufacture, and the cost is lower. Since the electrical connection between the two conductive layers 1 is realized by the protruding part 12 protruding into the inner adhesive film layer 2, the conductive connector provided by the present application has better conductive effect and more stable connection performance. Since the inner adhesive film layer 2 has certain elasticity and anti-deformation ability, it can play a buffering role, so that the conductive connector provided by the present application is not easy to deform when being repeatedly disassembled, and the reliability of the electrical connection between the two circuit boards or between the circuit board and the grounding metal plate is ensured. In addition, since the conductive layer 1 is provided with the hole 11, when the conductive connector is pressed between the two circuit boards or between the circuit board and the grounding metal plate, the adhesive of the inner adhesive film layer 2 will flow into the hole 11 of the conductive layer 1, and the two adjacent conductive layers 1 are tightly connected together. At the same time, the hole 11 is beneficial to discharging the volatile matter in the inner adhesive film layer 2 at high temperature, so as to avoid the problem that the bubbles produced by the inner adhesive film layer 2 cause the peeling between the conductive layers 1, and further improve the peeling strength between the conductive layers 1, so as to effectively ensure that the conductive layers 1 can be firmly connected together.

[0078] Optionally, as Figure 1 and Figure 2As shown, the outermost conductive layer 1 is denoted as outer conductive layer 101, and the outer conductive layer 101 is generally provided with two layers; the remaining conductive layers 1 are denoted as inner conductive layer 102, and all the inner conductive layers 102 are located between the two outer conductive layers 101; in order to further improve the conductive effect of the conductive connector, the surface of the two outer conductive layers 101 or any one of them away from the inner adhesive film layer 2 is also provided with a protruding part 12. Based on this, when the conductive connector provided by the embodiment of the application is clamped between the circuit board and the grounding metal plate, the protruding part 12 on the surface of the outer conductive layer 101 away from the inner adhesive film layer 2 can ensure that the conductive layer 1 and the grounding layer of the circuit board or the grounding metal plate form a more effective electrical connection, so that the conductive connector provided by the embodiment of the application can effectively discharge the static electricity accumulated on the circuit board, avoiding the interference source formed by the static electricity accumulated on the circuit board to affect the transmission of the signal.

[0079] Optionally, as shown in Figure 1 The protruding part 12 is a regular or irregular three-dimensional geometric shape, such as a sharp corner shape, an inverted cone shape, a particle shape, a tree branch shape, a column shape, a block shape, etc., and the protruding parts 12 on the same side surface of the conductive layer 1 are provided with two or more than two, the shape of each protruding part 12 can be the same or different, and the size of each protruding part 12 can also be the same or different, that is, the shape of the two or more than two protruding parts 12 can be one or more of a sharp corner shape, an inverted cone shape, a particle shape, a tree branch shape, a column shape, and a block shape, and the size of the two or more than two protruding parts 12 with the same shape can not be the same. In addition, the two or more than two protruding parts 12 are continuously or discontinuously distributed, for example, when the shape of the two or more than two protruding parts 12 is a sharp corner shape and continuously distributed, a regular, periodic tooth-like three-dimensional pattern or an irregular, disordered tooth-like three-dimensional pattern can be formed. Of course, only one of the above situations is listed here, and combinations of other shapes in the above are also within the protection scope of the application, which will not be listed one by one here.

[0080] Optionally, as shown in Figure 1 The thickness T of the conductive layer 1 is preferably in the range of 1 to 18 μm, and the height h1 of the protruding part 12 is preferably in the range of 0.2 to 30 μm.

[0081] Optionally, as shown in Figure 1 and Figure 3As shown, the two sides of the conductive layer 1 can be either flat or rough. It should be noted that the flat and rough surfaces referred to here are the surfaces of the conductive layer 1 where the protrusions 12 are located, i.e., the reference surfaces where the protrusions 12 are located, not the plane formed by two or more protrusions 12. When the surface of the conductive layer 1 is rough, it includes valleys and peaks. The protrusions 12 are distributed in both valleys and peaks, and the sum of the height H1 of any peak and the range h1 of the height of the protrusion 12 located on that peak is 0.2 to 30 μm. Of course, the two sides of each conductive layer 1 can be different; that is, one side may be flat and the other side may be rough, and each conductive layer 1 can also be different.

[0082] Optionally, such as Figure 4 As shown, an outer adhesive layer 3 is also provided on the side of the outer conductive layer 101 facing away from the inner adhesive layer 2. The protrusions 12 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 are either hidden within the outer adhesive layer 3 or penetrate the outer adhesive layer 3 and are exposed. In this embodiment, the protrusions 12 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 are hidden within the outer adhesive layer 3, and the thickness of the outer adhesive layer 3 is less than the average height of the protrusions 12. Like the inner adhesive layer 2, the outer adhesive layer 3 also has a certain degree of elasticity and resistance to deformation, which can act as a buffer. Therefore, when the conductive connector is clamped between two circuit boards or between a circuit board and a grounding metal plate, thanks to the elastic force of the outer adhesive layer 3 and the inner adhesive layer 2, a more reliable electrical connection will be formed between the protrusions 12 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 and the circuit board or grounding metal plate.

[0083] Optionally, the shape of the hole 11 can be circular, triangular, rectangular, elliptical, or an irregular polygon, etc. Furthermore, each conductive layer has two or more holes 11, with the shapes of the holes 11 being the same or different, and the sizes of the holes 11 being the same or different. That is, the shapes of the two or more holes 11 can be one or more of circular, triangular, rectangular, elliptical, and polygonal, while the sizes of two or more holes 11 of the same shape can be different. In addition, the holes 11 in the same conductive layer can be arranged according to certain rules, such as equidistant, ascending, or descending arrangements, or they can be arranged randomly. For any two adjacent conductive layers, the holes 11 can be completely staggered, completely aligned, or partially staggered and partially aligned. Of course, the conductive connector with all the holes 11 in each conductive layer aligned provides the best venting effect.

[0084] Optionally, the material of the conductive layer 1 is preferably copper, and the material of the protruding part 12 is preferably a combination of one or more of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver, that is, the protruding part 12 can be a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or can be a combination of one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver as the main component, and one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, etc. ， One or more of the metals other than the main body are formed on the surface of the main body to form the protruding part 12 of the composite material. In the present embodiment, the protruding part 12 is preferably a composite material of copper as the main body and one or more of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver formed on the surface of the copper, because the protruding part 12 composed only of copper is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of the copper can improve the corrosion resistance and wear resistance of the protruding part 12, thereby prolonging the service life of the conductive connector.

[0085] Optionally, to prevent the two adjacent conductive layers 1 from being separated, the material of the inner adhesive film layer 2 is preferably a thermosetting adhesive or a thermoplastic adhesive with good stability, such as thermoplastic polyimide, modified thermoplastic polyimide, acrylic, modified acrylic, epoxy resin, modified epoxy resin, etc. Unlike the inner adhesive film layer 2, the material of the outer adhesive film layer 3 can be selected from a pressure-sensitive adhesive that can be repeatedly peeled off, such as acrylic, silicone, and polyurethane, or a thermosetting adhesive or a thermoplastic adhesive with good stability, and when the outer adhesive film layer 3 and the inner adhesive film layer 2 are both selected from a thermosetting adhesive or a thermoplastic adhesive, they can not be the same.

[0086] In order to make the features and benefits of the conductive connector provided by the embodiments of the present application more popular and easy to understand, the following will combine the drawings to make a detailed description. Figure 5 The conductive connector with double conductive layers 1 is further described in detail.

[0087] As Figure 5As shown, the conductive connector comprises a first conductive layer 1a, an inner adhesive film layer 2 and a second conductive layer 1b which are sequentially stacked, obviously, the first conductive layer 1a and the second conductive layer 1b are outer conductive layers 101 of the conductive connector, and the conductive connector has no inner conductive layer 102. The first conductive layer 1a is provided with a first hole 11a penetrating through two side surfaces thereof, the second conductive layer 1b is provided with a second hole 11b penetrating through two side surfaces thereof, and the first hole 11a and the second hole 11b are completely staggered. The two side surfaces of the first conductive layer 1a are respectively provided with a first protruding part 12a and a second protruding part 12b, and the two side surfaces of the second conductive layer 1b are respectively provided with a third protruding part 12c and a fourth protruding part 12d, wherein, the surface of the first conductive layer 1a where the first protruding part 12a is located is opposite to the surface of the second conductive layer 1b where the third protruding part 12c is located, the surface of the first conductive layer 1a where the second protruding part 12b is located is opposite to the surface of the second conductive layer 1b where the fourth protruding part 12d is located, and the first protruding part 12a and the third protruding part 12c protrude into the inner adhesive film layer 2 and are connected to each other. Based on this, the first conductive layer 1a and the second conductive layer 1b are electrically connected through the first protruding part 12a and the third protruding part 12c.

[0088] Further, as shown, Figure 5 the surface of the first conductive layer 1a where the second protruding part 12b is located is provided with a first outer adhesive film layer 3a, and the second protruding part 12b is hidden in the first outer adhesive film layer 3a; similarly, the surface of the second conductive layer 1b where the fourth protruding part 12d is located is provided with a second outer adhesive film layer 3b, and the fourth protruding part 12d is hidden in the second outer adhesive film layer 3b. Therefore, when the conductive connector is clamped between two circuit boards or between a circuit board and a grounding metal plate, the static electricity on the circuit board on the same side of the first conductive layer 1a is conducted to the circuit board on the same side of the second conductive layer 1b or the grounding metal plate through the second protruding part 12b, the first conductive layer 1a, the first protruding part 12a, the third protruding part 12c, the second conductive layer 1b and the fourth protruding part 12d, so as to realize the transfer of static electricity.

[0089] Embodiment two

[0090] The embodiment of the present application provides a manufacturing method of the conductive connector, comprising the following steps:

[0091] Step one, forming protruding parts on the outer side surface of the thin copper layer of the peelable copper foil;

[0092] Step two, forming holes penetrating through two side surfaces of the peelable copper foil;

[0093] Step three, forming an inner adhesive film layer on the thin copper layer of the peelable copper foil where the protruding parts are formed;

[0094] Step four, take any two pieces of peelable copper foil, respectively, as the first peelable copper foil and the second peelable copper foil, the first peelable copper foil and the second peelable copper foil with thin copper layer opposite each other, until the two are pressed together, at this time, the two pieces of peelable copper foil between the formation of a layer of inner adhesive film layer, which is recorded as the first inner adhesive film layer, the first peelable copper foil thin copper layer on the outer surface of the protruding part and the second peelable copper foil thin copper layer on the outer surface of the protruding part protrude into the first inner adhesive film layer and connect with each other;

[0095] Step five, respectively, the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off, the thin copper layer of the first peelable copper foil is recorded as the first thin copper layer, and the thin copper layer of the second peelable copper foil is recorded as the second thin copper layer. At this point, the first thin copper layer, the first inner adhesive film layer, and the second thin copper layer are sequentially stacked to form the simplest conductive connector (i.e., only two thin copper layers are provided).

[0096] If a more complex structure of the conductive connector (i.e., at least three thin copper layers are provided) is required, the following steps are required after step four:

[0097] Step six, form a protruding part on the surface of the second thin copper layer away from the first inner adhesive film layer;

[0098] Step seven, take another piece of peelable copper foil, which is recorded as the third peelable copper foil, and press the thin copper layer of the third peelable copper foil with the second thin copper layer until they are pressed together. At this time, a layer of inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the second thin copper layer, which is recorded as the second inner adhesive film layer. The protruding part on the surface of the second thin copper layer away from the first inner adhesive film layer and the protruding part on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and connect with each other;

[0099] Step eight, peel off the carrier layer of the third peelable copper foil, and record the thin copper layer of the third peelable copper foil as the third thin copper layer. At this point, the first thin copper layer, the first inner adhesive film layer, the second thin copper layer, the second inner adhesive film layer, and the third thin copper layer are sequentially stacked to form a conductive connector with three thin copper layers;

[0100] Step nine, according to the requirements, continue to press the new peelable copper foil by referring to steps six to eight until the required conductive connector is obtained.

[0101] Optionally, if the conductive effect of the conductive connector is to be further improved, the following steps can be taken after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector:

[0102] Form a protruding part on the surface of the thin copper layer located at the outermost side of the conductive connector away from the inner adhesive film layer.

[0103] Optionally, if a conductive connector provided with an outer adhesive film layer is to be obtained, the following step can be further performed after the above step:

[0104] The outer adhesive film layer is formed on the side of the thin copper layer located at the outermost side of the conductive connector and facing away from the inner adhesive film layer.

[0105] In the above manufacturing method, the specific steps of forming the inner adhesive film layer or the outer adhesive film layer include:

[0106] The inner adhesive film layer or the outer adhesive film layer is first coated on the release film, and then transferred to the surface of the thin copper layer through the release film;

[0107] Or the inner adhesive film layer or the outer adhesive film layer is directly coated on the surface of the thin copper layer.

[0108] In the above manufacturing method, one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. are used to form the protruding part on the surface of the thin copper layer.

[0109] In the above manufacturing method, mechanical drilling, laser drilling or stamping is used to form the hole penetrating through the two side surfaces of the peelable copper foil.

[0110] Further, the carrier layer of the peelable copper foil includes a peelable layer, a barrier layer and a main body layer, and the thin copper layer, the peelable layer, the barrier layer and the main body layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer and the main body layer are sequentially stacked, wherein the main body layer can be an organic thin film layer or a metal thin film layer, such as a copper layer.

[0111] Obviously, for the conductive connector manufactured by the method provided in the embodiment, the holes on the two adjacent thin copper layers can be completely staggered, completely opposite, or partially staggered and partially opposite.

[0112] Embodiment three

[0113] The embodiment of the present application provides a manufacturing method of the above conductive connector, including the following steps:

[0114] Step one, forming a protruding part on the outer side surface of the thin copper layer of the peelable copper foil;

[0115] Step two, forming an inner adhesive film layer on the thin copper layer of the peelable copper foil on which the protruding part is formed;

[0116] Step three, take any two pieces of peelable copper foil, respectively, as the first peelable copper foil and the second peelable copper foil, the first peelable copper foil and the second peelable copper foil are pressed together with the thin copper layer opposite to each other, until the two are pressed together, at this time, a layer of inner adhesive film layer is formed between the two pieces of peelable copper foil, which is recorded as the first inner adhesive film layer, the protruding part on the outer side surface of the thin copper layer of the first peelable copper foil and the protruding part on the outer side surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and connect with each other;

[0117] Step four, respectively, peel off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, the thin copper layer of the first peelable copper foil is recorded as the first thin copper layer, and the thin copper layer of the second peelable copper foil is recorded as the second thin copper layer, at this time, the first thin copper layer, the first inner adhesive film layer and the second thin copper layer are sequentially stacked to form the simplest conductive connector (i.e. only two layers of thin copper layer are provided).

[0118] If a more complex structure of the conductive connector (i.e. at least three layers of thin copper layer are provided) is required, the following steps are required after step four:

[0119] Step five, form a protruding part on the surface of the second thin copper layer away from the first inner adhesive film layer;

[0120] Step six, take another piece of peelable copper foil, which is recorded as the third peelable copper foil, press the thin copper layer of the third peelable copper foil and the second thin copper layer together, until the two are pressed together, at this time, a layer of inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the second thin copper layer, which is recorded as the second inner adhesive film layer, the protruding part on the surface of the second thin copper layer away from the first inner adhesive film layer and the protruding part on the outer side surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and connect with each other;

[0121] Step seven, peel off the carrier layer of the third peelable copper foil, and record the thin copper layer of the third peelable copper foil as the third thin copper layer, at this time, the first thin copper layer, the first inner adhesive film layer, the second thin copper layer, the second inner adhesive film layer and the third thin copper layer are sequentially stacked to form the conductive connector with three layers of thin copper layer;

[0122] Step eight, according to the requirements, continue to press the new peelable copper foil according to steps five to seven until the required conductive connector is obtained;

[0123] Step nine, form a hole through the two side surfaces of the outermost thin copper layer of the conductive connector or form a hole from one side of the outermost surface of the conductive connector to the other side of the outermost surface.

[0124] Optionally, if the conductive effect of the conductive connector is to be further improved, the following steps can be performed after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector:

[0125] A protrusion is formed on the surface of the inner adhesive film layer opposite to the thin copper layer on the outermost side of the conductive connector.

[0126] Optionally, if the conductive connector provided with the outer adhesive film layer is to be obtained, the following step can be further performed after the above step:

[0127] An outer adhesive film layer is formed on the side of the inner adhesive film layer opposite to the thin copper layer on the outermost side of the conductive connector.

[0128] In the above manufacturing method, the specific steps of forming the inner adhesive film layer or the outer adhesive film layer include:

[0129] The inner adhesive film layer or the outer adhesive film layer is first coated on the release film, and then transferred to the surface of the thin copper layer through the release film;

[0130] Or the inner adhesive film layer or the outer adhesive film layer is directly coated on the surface of the thin copper layer.

[0131] In the above manufacturing method, one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc. is used to form the protrusion on the surface of the thin copper layer.

[0132] In the above manufacturing method, mechanical drilling, laser drilling or stamping is used to form a hole penetrating through the two surfaces of the thin copper layer on the outermost side of the conductive connector or a hole penetrating from one side of the outermost surface to the other side of the outermost surface of the conductive connector.

[0133] Further, the carrier layer of the peelable copper foil includes a peelable layer, a barrier layer and a main body layer, and the thin copper layer, the peelable layer, the barrier layer and the main body layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer and the main body layer are sequentially stacked, wherein the main body layer can be an organic film layer or a metal film layer, such as a copper layer.

[0134] Obviously, for the conductive connector manufactured by the method provided in the embodiment, if only a hole penetrating through the two surfaces of the thin copper layer on the outermost side is formed, the holes in the two thin copper layers can be completely staggered, completely opposite, or partially staggered and partially opposite; if a hole penetrating from one side of the outermost surface to the other side of the outermost surface is formed, holes will also be formed on the inner adhesive film layer and the outer adhesive film layer, and the holes in each layer must be completely opposite.

[0135] Finally, it should be noted that the thin copper layer in Embodiment Two and Embodiment Three is the conductive layer in Embodiment One.

[0136] In conclusion, the present application provides a conductive connector, which comprises at least two conductive layers 1, and at least one of the conductive layers 1 is provided with holes penetrating through both sides of the conductive layer 1, and an inner adhesive film layer 2 is arranged between any two adjacent conductive layers 1, and the surface of the conductive layer 1 facing the inner adhesive film layer 2 is provided with a protruding part 12, and the protruding parts 12 on the opposite surfaces of any two adjacent conductive layers 1 protrude into the inner adhesive film layer 2 between the two conductive layers 1 and are connected to each other. Compared with the prior art, the conductive connector has the advantages of simple manufacturing process, low production cost, high firmness, good conductive performance and the like.

[0137] In addition, the present application also provides a manufacturing method of the conductive connector, which has the advantages of simple operation and easy implementation.

[0138] It should be understood that the terms "first", "second" and the like are used to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, the "first" information can also be referred to as "second" information without departing from the scope of the present application, and similarly, the "second" information can also be referred to as "first" information.

[0139] The above is the preferred embodiment of the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and modifications can also be made, and these improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An electrically conductive connector, characterized by, The conductive layer includes at least two layers, at least one of which has holes through both sides of the layer, and an inner adhesive film layer with elasticity between any two adjacent conductive layers. The surface of the conductive layer facing the inner adhesive film layer has protrusions, and any two adjacent conductive layers are pressed together. The protrusions on the opposite surfaces of any two adjacent conductive layers protrude into the inner adhesive film layer between the two layers and are connected to each other in the inner adhesive film layer, thereby electrically connecting the two adjacent conductive layers.

2. The electrically conductive connector of claim 1, wherein, The protrusions are regular or irregular three-dimensional geometric shapes.

3. The electrically conductive connector of claim 2, wherein, The protrusions are in the shape of sharp corners, inverted cones, particles, branches, columns or blocks.

4. The electrically conductive connector of claim 1, wherein, The protrusions are made of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold or silver, or a combination of one or more of these materials.

5. The electrically conductive connector of claim 1, wherein, The height of the protrusions is in the range of 0.2 to 30 microns.

6. The electrically conductive connector of claim 1, wherein, There are two or more protrusions on the same side surface of the conductive layer, and the protrusions are continuously or discontinuously distributed. The shapes and sizes of the protrusions can be the same or different.

7. The electrically conductive connector of claim 1, wherein, The thickness of the conductive layer is in the range of 1 to 18 microns.

8. The electrically conductive connector of claim 1, wherein, The surface of the conductive layer is rough or flat.

9. The electrically conductive connector of claim 1, wherein, The inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.

10. The electrically conductive connector of claim 1, wherein, The conductive layer has two or more holes, and the shapes and sizes of the holes can be the same or different.

11. The electrically conductive connector of any one of claims 1-10, wherein, The outermost conductive layer is referred to as the outer conductive layer, and the surface of the outer conductive layer facing away from the inner adhesive film layer also has protrusions.

12. The electrically conductive connector of claim 11, wherein, The side of the outer conductive layer facing away from the inner adhesive film layer also has an outer adhesive film layer, and the protrusions on the surface of the outer conductive layer facing away from the inner adhesive film layer are hidden in the outer adhesive film layer or penetrate the outer adhesive film layer and are exposed.

13. The electrically conductive connector of claim 12, wherein, The protrusions on the surface of the outer conductive layer facing away from the inner adhesive film layer are hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is less than the average height of the protrusions.

14. The electrically conductive connector of claim 12, wherein, The outer adhesive film layer is made of pressure-sensitive adhesive, thermosetting adhesive or thermoplastic adhesive.

15. A method of making an electrically conductive connector, comprising: The method includes the following steps: Forming protrusions on the outer surface of the thin copper layer of the peelable copper foil; Forming holes through both sides of the peelable copper foil; Forming an inner adhesive film layer on the thin copper layer of the peelable copper foil with protrusions; Taking any two pieces of peelable copper foil, respectively referred to as the first peelable copper foil and the second peelable copper foil, and pressing the first peelable copper foil and the second peelable copper foil together with the thin copper layers opposite each other until they are pressed together. At this time, a layer of inner adhesive film layer is formed between the two pieces of peelable copper foil, which is referred to as the first inner adhesive film layer. The protrusions on the outer surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and are connected to each other in the first inner adhesive film layer. Respectively, the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off.

16. The method of claim 15, wherein the conductive connector is formed by, After peeling off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, the method further includes the following steps: forming a protrusion on a surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer; taking another piece of peelable copper foil, denoted as a third peelable copper foil, and pressing the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil against each other until they are pressed together, at this time, a layer of inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil, denoted as a second inner adhesive film layer, the protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer and the protrusions on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and connect with each other; peeling off the carrier layer of the third peelable copper foil; according to the needs, continuing to press new peelable copper foils by referring to the above steps.

17. A method of making an electrically conductive connector according to any one of claims 15 or 16, wherein, after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector, further comprising the steps of: forming a protrusion on a surface of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer.

18. The method of fabricating an electrically conductive connector according to claim 17, wherein, after forming the protrusion on the surface of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer, further comprising the steps of: forming an outer adhesive film layer on the side of the thin copper layer located at the outermost side of the conductive connector facing away from the inner adhesive film layer.

19. A method for manufacturing a conductive connector according to any one of claims 16 or 18, characterized in that, the steps of forming the inner adhesive film layer or the outer adhesive film layer include: coating the inner adhesive film layer or the outer adhesive film layer on the release film, and then transferring the inner adhesive film layer or the outer adhesive film layer to the surface of the thin copper layer by pressing through the release film; or directly coating the inner adhesive film layer or the outer adhesive film layer on the surface of the thin copper layer.

20. The method of claim 17, wherein: one or more of the following methods are used to form the protrusion on the surface of the thin copper layer: electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc.

21. The method of fabricating an electrically conductive connector according to any one of claims 15 or 16, wherein, the carrier layer includes a peelable layer, a barrier layer, and a main body layer, and the thin copper layer, the peelable layer, the barrier layer, and the main body layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer, and the main body layer are sequentially stacked.

22. The method of fabricating an electrically conductive connector according to claim 15, wherein, mechanical drilling, laser drilling, or stamping is used to form holes through both sides of the peelable copper foil.

23. A method of making an electrically conductive connector, comprising: comprising the following steps: forming a protrusion on the outer surface of the thin copper layer of the peelable copper foil; forming an inner adhesive film layer on the thin copper layer of the peelable copper foil on which the protrusion is formed; taking any two pieces of peelable copper foil, denoted as a first peelable copper foil and a second peelable copper foil, and pressing the first peelable copper foil and the second peelable copper foil against each other with the thin copper layers facing away from each other until they are pressed together, at this time, a layer of inner adhesive film layer is formed between the two pieces of peelable copper foil, denoted as a first inner adhesive film layer, the protrusions on the outer surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and connect with each other in the first inner adhesive film layer; respectively peeling off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, at this time, the thin copper layer of the first peelable copper foil, the first inner adhesive film layer, and the thin copper layer of the second peelable copper foil are sequentially stacked to form a conductive connector with two layers of thin copper layers; if necessary, continue to form a protrusion on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer; Take another piece of peelable copper foil, which is recorded as a third peelable copper foil, and press the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil to each other until they are pressed together, at this time, a layer of inner release film layer is formed between the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil, which is recorded as a second inner release film layer, the protruding parts on the surface of the thin copper layer of the second peelable copper foil away from the first inner release film layer and the protruding parts on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner release film layer and connect to each other in the second inner release film layer; Peel off the carrier layer of the third peelable copper foil; According to the needs, continue to press the new peelable copper foil according to the above steps until the desired conductive connector is obtained; Form holes that penetrate through both sides of the thin copper layer on the outermost side of the conductive connector or form holes that penetrate from one side of the outermost surface of the conductive connector to the other side of the outermost surface of the conductive connector.

24. The method of fabricating an electrically conductive connector according to claim 23, wherein, After peeling off the carrier layer of the peelable copper foil on the outermost side of the conductive connector, further comprising the steps of: Form protruding parts on the surface of the thin copper layer on the outermost side of the conductive connector away from the inner release film layer.

25. The method of fabricating an electrically conductive connector according to claim 24, wherein, After forming protruding parts on the surface of the thin copper layer on the outermost side of the conductive connector away from the inner release film layer, further comprising the steps of: Form an outer release film layer on the side of the thin copper layer on the outermost side of the conductive connector away from the inner release film layer.

26. A method of making an electrically conductive connector according to any one of claims 23 or 25, wherein, The steps of forming the inner release film layer or the outer release film layer include: Coating the inner release film layer or the outer release film layer on the release film, and then transferring the inner release film layer or the outer release film layer to the surface of the thin copper layer by pressing through the release film; Or directly coating the inner release film layer or the outer release film layer on the surface of the thin copper layer.

27. The method of fabricating an electrically conductive connector according to claim 24, wherein, Form protruding parts on the surface of the thin copper layer by using one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, etc.

28. The method of fabricating an electrically conductive connector according to claim 23, wherein, The carrier layer includes a peelable layer, a barrier layer, and a main body layer, and the thin copper layer, the peelable layer, the barrier layer, and the main body layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer, and the main body layer are sequentially stacked.

29. The method of fabricating an electrically conductive connector according to claim 23, wherein, Form holes that penetrate through both sides of the thin copper layer on the outermost side of the conductive connector or form holes that penetrate from one side of the outermost surface of the conductive connector to the other side of the outermost surface of the conductive connector by using mechanical drilling, laser drilling, or stamping.

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