LED bracket, light-emitting unit, light-emitting module and display device

Abstract

The present invention provides an LED bracket, a light-emitting unit, a light-emitting module and a display device. The LED bracket is composed of at least two metal sheets arranged in an insulated manner, and a colloid combined with the metal sheets to form a base body. The LED bracket structure is simpler than the existing bracket structure, easier to manufacture, and has lower cost. The first surface of at least one metal sheet is used to carry an LED chip. The heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet. Since the second surface, the third surface and the fourth surface of the metal sheet are all exposed, they can all be used as solder pads for external electrical connection. Therefore, it can be suitable for various application scenarios and can increase the heat dissipation area.

Description

Technical Field

[0001] The present invention relates to the field of LED (Light Emitting Diode), and in particular to an LED bracket, a light emitting unit, a light emitting module and a display device. Background Art

[0002] At present, the color gamut and brightness required by various display devices are getting higher and higher, and the thickness is getting thinner and thinner. The color gamut and brightness are negatively correlated. The higher the color gamut requirement, the lower the brightness. The brightness of the original single chip package cannot meet the requirements. It is necessary to propose an ultra-thin side light-emitting diode with higher brightness when the color gamut is high. To this end, the prior art provides a light-emitting diode with higher brightness when the color gamut is high, which includes a substrate, a circuit formed on the top surface of the substrate and electrically connected to the LED chip, and a solder pad set on the bottom surface of the substrate. The circuit on the top surface of the substrate is electrically connected to the solder pad through the conductive material in the through hole through the bottom surface. A shell is formed on the plastic substrate, and a cavity for placing the LED chip is formed in the shell, and the cavity is filled with fluorescent glue. Although the light-emitting diode of this structure can improve the brightness, its structure is relatively complex and the cost is high; in addition, the heat generated by the LED chip in the light-emitting diode is mainly transferred to the solder pad for heat dissipation through the conductive material in the through hole through the substrate. The heat dissipation path is long and the heat dissipation area is small, resulting in poor heat dissipation effect. Summary of the invention

[0003] The present invention provides an LED bracket, a light-emitting unit, a light-emitting module and a display device, which solve the problems of complex structure, high cost and poor heat dissipation of existing light-emitting diodes.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides an LED bracket, comprising three metal sheets which are sequentially insulated and isolated, and a colloid combined with the metal sheets to form a base body, wherein the base body encloses a bowl cup for placing an LED chip, and the first surface of the metal sheet is located at the bottom of the bowl cup and is at least partially exposed to the outside; the first surface of at least one of the metal sheets is used to carry the LED chip, and the exposed areas of the first surface of the metal sheets at the two ends are respectively used to be electrically connected to the electrodes of the corresponding one of the LED chips, and the exposed areas of the first surface of the metal sheet located in the middle are respectively electrically connected to the electrodes corresponding to the two LED chips;

[0005] At least a portion of the second surface of the metal sheet is exposed outside the base body, and the second surface is a surface opposite to the first surface. At least one of the metal sheets is located between the first surface and the second surface, and at least a portion of the third surface and the fourth surface are exposed outside the base body to serve as a welding area. The third surface and the fourth surface are two opposite surfaces.

[0006] Optionally, a first recess for accommodating solder is provided in an area of ​​the third surface exposed outside the base body.

[0007] Optionally, a second recess for accommodating solder is provided in an area of ​​the second surface exposed outside the base body.

[0008] Optionally, the first recess is communicated with the second recess.

[0009] Optionally, a third recess for accommodating solder is provided in an area of ​​the fourth surface exposed outside the base body.

[0010] Optionally, a soldering layer for improving soldering capability is provided on the inner wall of at least one of the first recess, the second recess and the third recess.

[0011] Optionally, the first recess is communicated with the third recess.

[0012] Optionally, the first recess is a first groove or a first hole, the second recess is a second groove or a second hole, and the third recess is a third groove or a third hole.

[0013] Optionally, the area on the first surface of the metal sheet that is combined with the base body is provided with a rough surface with a concave-convex structure for enhancing the bonding force with the base body, or is provided with a bonding hole for the colloid that forms the base body to flow in.

[0014] Optionally, the end of the combining hole close to the first surface is the upper end, the end of the combining hole close to the second surface is the lower end, and the hole diameter of the upper end of the combining hole is larger than the hole diameter of the lower end of the combining hole.

[0015] Optionally, the base body further comprises a separation wall arranged on the first surface of the metal sheet located in the middle, so as to form two isolated bowls on the first surfaces of the three metal sheets.

[0016] Optionally, the lateral width of the upper end of the metal sheet close to the first surface is greater than the lateral width of the lower end close to the second surface, and a portion of the upper end of the metal sheet is embedded in the base body;

[0017] Alternatively, at least one of the metal sheets is provided with a protrusion protruding outward between the first surface and the second surface, and at least a portion of the protrusion is embedded in the base body.

[0018] Optionally, the protrusion is a protrusion inclined toward the second surface.

[0019] Optionally, the metal sheet is a copper substrate, and a reflective layer is provided on at least an exposed area of ​​the first surface.

[0020] Optionally, the shapes and / or sizes of the areas of the third surface and the fourth surface exposed outside the base body are different.

[0021] In order to solve the above technical problems, an embodiment of the present invention also provides a light-emitting unit, including the LED bracket as described above, and also including an LED chip arranged in the bowl cup, and a packaging layer arranged in the bowl cup to cover the LED chip, and the electrodes of the LED chip are electrically connected to the corresponding exposed area of ​​the first surface of the metal sheet.

[0022] In order to solve the above technical problem, an embodiment of the present invention further provides a light-emitting module, including a substrate and a plurality of light-emitting units as described above, wherein the plurality of light-emitting units are electrically connected to the substrate.

[0023] In order to solve the above technical problem, an embodiment of the present invention further provides a display device, comprising the light-emitting module as described above. Beneficial Effects

[0024] The present invention provides an LED bracket, a light-emitting unit, a light-emitting module and a display device, wherein the LED bracket is composed of at least two metal sheets arranged in an insulated manner and a colloid combined with the metal sheets to form a base body. The LED bracket structure is simpler than the existing bracket structure, easier to manufacture and lower in cost.

[0025] The first surface of the metal sheet is located at the bottom of the bowl cup for placing the LED chip formed by the base body, and is at least partially exposed to the outside; the first surface of at least one metal sheet is used to carry the LED chip, and the exposed area of ​​the first surface of each metal sheet is used to be electrically connected to the electrode of the corresponding LED chip; at least part of the second surface of the metal sheet is exposed outside the base body, and at least part of the third surface and the fourth surface of at least one metal sheet are also exposed outside the base body, so that the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, which greatly shortens the heat dissipation path and greatly increases the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the light-emitting unit;

[0026] In addition, at least part of the second surface, the third surface and the fourth surface of at least one metal sheet is exposed outside the base body, and the exposed areas can be used as pads for external electrical connection. Therefore, at least one of the exposed areas of the second surface, the third surface and the fourth surface can be flexibly selected for welding according to the requirements of specific application scenarios. It can be applicable to various application scenarios, and welding is convenient. Welding can also be performed on two or three surfaces according to requirements, which can improve the firmness of welding and thus improve the reliability of the product.

[0027] The light-emitting unit is composed of an LED chip placed in a bowl in the LED bracket and a packaging layer covering the LED chip. The structure of the light-emitting unit is simpler than that of existing LED lamp beads, and is easier to manufacture and has lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of a metal sheet group in an example provided in an embodiment of the present invention;

[0029] Figure 2 A schematic diagram of an LED bracket in an example provided in an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of a metal sheet assembly in another example provided by an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of an LED bracket in another example provided by an embodiment of the present invention;

[0032] Figure 5 A schematic diagram of an LED bracket in another example provided by an embodiment of the present invention;

[0033] Figure 6 A third surface projection view of an LED bracket in another example provided by an embodiment of the present invention;

[0034] Figure 7 A fourth surface projection view of an LED bracket in another example provided by an embodiment of the present invention;

[0035] Figure 8 A schematic diagram of an LED bracket in another example provided by an embodiment of the present invention;

[0036] Fig. 9 A schematic diagram of a metal sheet assembly in another example provided by an embodiment of the present invention;

[0037] Fig.10 A schematic diagram of an LED bracket in another example provided by an embodiment of the present invention;

[0038] Fig.11 A schematic diagram of a metal sheet assembly in another example provided by an embodiment of the present invention;

[0039] Fig.12 A schematic diagram of a metal sheet assembly in another example provided in an embodiment of the present invention Figure 1 ;

[0040] Fig.13 A schematic diagram of a metal sheet assembly in another example provided in an embodiment of the present invention Figure 2 ;

[0041] Fig.14A schematic diagram of a metal sheet assembly in another example provided in an embodiment of the present invention Figure 3 ;

[0042] Figure 15-1 A three-dimensional schematic diagram of a metal sheet group in another example provided in an embodiment of the present invention Figure 1 ;

[0043] Figure 15-2 A three-dimensional schematic diagram of a metal sheet group in another example provided in an embodiment of the present invention Figure 2 ;

[0044] Figure 15-3 A three-dimensional schematic diagram of a metal sheet group in another example provided in an embodiment of the present invention Figure 3 ;

[0045] Figure 15-4 A schematic plan view of a metal sheet group in another example provided by an embodiment of the present invention;

[0046] Figure 15-5 A three-dimensional schematic diagram of an LDE bracket in another example provided in an embodiment of the present invention Figure 1 ;

[0047] Figure 15-6 A three-dimensional schematic diagram of an LDE bracket in another example provided in an embodiment of the present invention Figure 2 ;

[0048] Figure 15-7 A cross-sectional view of an LDE bracket in another example provided by an embodiment of the present invention;

[0049] Figure 15-8 A cross-sectional view of a metal sheet group in another example provided by an embodiment of the present invention;

[0050] Fig.16 A schematic diagram of a light emitting unit in another example provided in an embodiment of the present invention Figure 1 ;

[0051] Fig.17 A schematic diagram of a light emitting unit in another example provided in an embodiment of the present invention Figure 2 ;

[0052] Fig.18 A schematic diagram of a light-emitting module in another example provided by an embodiment of the present invention;

[0053] Fig.19 A schematic diagram of a display device in yet another example provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0055] This embodiment provides an LED bracket with a simple structure, low cost, good heat dissipation performance, and easy welding, which is applicable to a wider range of scenarios, and a light-emitting unit obtained by collecting the LED bracket. For ease of understanding, the LED bracket is first illustrated below.

[0056] The LED bracket in this embodiment includes at least two metal sheets arranged in an insulated manner. The metal sheets are combined with a colloid used to form a base body to form an LED bracket. The first surface of the metal sheet is located at the bottom of the bowl cup formed by the base body for placing the LED chip, and is at least partially exposed to the outside; the first surface of at least one metal sheet is used to carry the LED chip, and the exposed area of ​​the first surface of each metal sheet is used to electrically connect with the electrode of the corresponding LED chip; at least part of the second surface of the metal sheet is exposed outside the base body, and the second surface is a surface opposite to the first surface; at least part of the third surface and the fourth surface of at least one metal sheet located between the first surface and the second surface are exposed outside the base body, and the third surface and the fourth surface are two opposite side surfaces. That is, in this embodiment, the first surface, the second surface, the third surface and the fourth surface of the metal sheet can be set to be at least partially exposed outside the base body, and the other surfaces are covered by the base body, thereby increasing the bonding area between the base body and the metal sheet, improving the bonding strength between the two, thereby improving the reliability of the LED bracket, and also making the LED bracket have better airtightness, thereby improving the safety and reliability of the LED product.

[0057] In addition, since the LED chip can be directly arranged on the first surface of the metal sheet, and the second surface and the third surface of the metal sheet are exposed outside the base body, the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, which greatly shortens the heat dissipation path and increases the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the light-emitting unit.

[0058] For example, see Figure 1 to Figure 2A metal sheet group 1 of an LED bracket and an LED bracket are shown, and an LED bracket includes a metal sheet group 1. The metal sheet group 1 includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. The first metal sheet 11, and at least a portion of the first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown in the figure). See FIG. Figure 1 and Figure 2 As shown, in this example, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed on the third surface 22 of the base body 2 is a plane area. Optionally, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed on the base body 2 may be flush with the third surface 22 of the base body 2, or may be slightly higher or slightly lower than the third surface 22 of the base body 2. In this example, the area where the fourth surface of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed on the fourth surface of the base body 2 may be flush with the fourth surface of the base body 2, or may be slightly higher or slightly lower than the fourth surface of the base body 2.

[0059] In this example, the area where the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 is also flat, and optionally, in this embodiment, the area where the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2, or slightly higher or slightly lower than the second surface 23 of the base body 2. Figure 2 The center 21 is the first surface of the base body, and may be parallel to, but not limited to, the first surface a of the metal sheet.

[0060] Figure 2 In the LED bracket shown, three surfaces of the metal sheet are exposed outside the base body, which can be used as soldering pads and heat dissipation surfaces. It can be flexibly applied to welding in various application scenarios, and can increase the heat dissipation area, thereby improving the heat dissipation effect.

[0061] Optionally, in this embodiment, in order to increase the welding area and improve the reliability of welding, the area of ​​the third surface of the metal sheet exposed outside the base body may be provided with a first recess for accommodating solder. The shape, size and structure of the first recess may be flexibly set according to the specific application scenario. For example, the first recess may be, but is not limited to, a first groove, or a first hole, and the shape, size, etc. of the specific groove and hole may be flexibly set.

[0062] For example, see Figure 3 to Figure 4 A metal sheet group 1 of an LED bracket and an LED bracket are shown, and an LED bracket includes a metal sheet group 1. The metal sheet group 1 includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. The first metal sheet 11, and at least a portion of the first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown in the figure). See FIG. Figure 3 and Figure 4 As shown, in this example, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the third surface 22 of the base body 2 is provided with a first recess c1 of a horseshoe-shaped groove. Optionally, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the base body 2 and the first recess c1 is not provided can be flush with the third surface 22 of the base body 2, or slightly higher or slightly lower than the third surface 22 of the base body 2. In this example, the area where the fourth surface of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the fourth surface of the base body 2 can be a plane, and the area where the fourth surface is exposed to the base body 2 can be flush with the fourth surface of the base body 2, or slightly higher or slightly lower than the fourth surface of the base body 2.

[0063] In this example, the area where the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 is also flat, and optionally, in this embodiment, the area where the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2, or slightly higher or slightly lower than the second surface 23 of the base body 2.

[0064] Optionally, in this embodiment, in order to increase the welding area and improve the reliability of welding, and to improve the flexibility of welding, so as to better suit various application scenarios, the area of ​​the fourth surface of the metal sheet exposed outside the base body can be provided with a third recess for accommodating solder. And the shape, size and structure of the third recess can also be flexibly set according to the specific application scenario. For example, the third recess can be but not limited to a third groove, or a third hole, and the shape, size, etc. of the specific groove and hole can be flexibly set.

[0065] For another example, see Figures 5 to 7 The LED bracket shown, Figure 5 This is a three-dimensional schematic diagram of the LED bracket. Figure 6is a projection view of the third surface of the base body of the LED bracket, Figure 7 The LED bracket includes a metal sheet group 1, which includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. The first metal sheet 11, the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 have at least a portion of their first surfaces a exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown in the figure). See Figures 5 to 7 As shown, in this example, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the third surface 22 of the base body 2 is provided with a first recess c1 of a horseshoe-shaped groove, and the area where the fourth surface d of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the fourth surface of the base body 2 is also provided with a third recess d1 of a horseshoe-shaped groove, and the third recess d1 and the first recess c1 may have the same shape and size, and may correspond to each other in position, or the third recess d1 and the first recess c1 may have different shapes and sizes, and may not correspond to each other in position. The specific setting can be flexibly made according to the requirements.

[0066] Optionally, in this example, the third surface c and the fourth surface d of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 exposed to the base body 2 and the area where the first recess c1 and the third recess d1 are not provided may be flush with the base body 2, or slightly higher or slightly lower than the base body 2. In this example, the area where the second surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed to the second surface 23 of the base body 2 is also a plane, and optionally, in this embodiment, the area where the second surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed to the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2, or slightly higher or slightly lower than the second surface 23 of the base body 2.

[0067] In this embodiment, the third recess and the first recess may be connected or not connected. When connected, the excess solder in one recess may flow directly into the other recess through the connecting structure.

[0068] Optionally, in some examples, the area of ​​the second surface of the metal sheet exposed outside the base body may also be provided with a second recess for accommodating solder, and the shape, size and structure of the second recess may also be flexibly set according to the specific application scenario. For example, the second recess may be, but not limited to, a second recess, or a second hole, and the shape, size, etc. of the specific recess and hole may be flexibly set. The second recess, the first recess and the third recess are provided to accommodate excess solder in the welding process in the recess, thereby ensuring the flatness and reliability of welding.

[0069] Optionally, in this embodiment, in order to further improve the reliability of welding, a soldering layer for improving welding force can be provided on the metal sheet exposed outside the base body and on the area where welding is required, and the soldering layer can be a metal layer, such as a metal plating layer, or other layer structures that can improve welding force. For example, in some examples, a metal plating layer for improving welding force can be provided on at least one side wall of the first groove, the second groove, and the third groove in the above examples, and the metal plating layer can be, but is not limited to, a silver plating layer.

[0070] For another example, see Figure 8 The LED bracket shown in the figure comprises a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a portion of the first surface a of the first metal sheet 11, the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown in the figure). Figures 5 to 7As shown, in this example, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the third surface 22 of the base body 2 is provided with a first recess c1 with a horseshoe-shaped groove, and the area where the fourth surface d of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the fourth surface of the base body 2 is also provided with a third recess d1 with a horseshoe-shaped groove. The shape and size of the third recess d1 and the first recess c1 can be the same, and the position can correspond. The shape and size of the third recess d1 and the first recess c1 can also be different, and the position may not correspond. The specific setting can be flexibly determined according to the needs. In this example, the area where the second surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 is provided with a groove-shaped second recess b1, and the second recess b1 connects the first recess c1 with the third recess d1. Optionally, in this embodiment, the second surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 and the area where the second recess b1 is not provided can also be flush with the second surface 23 of the base body 2, or slightly higher or slightly lower than the second surface 23 of the base body 2. In this example, the third surface c and the fourth surface d of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 are exposed to the base body 2 and the area where the first recess c1 and the third recess d1 are not provided can be flush with the base body 2, or slightly higher or slightly lower than the base body 2.

[0071] It should be understood that the number of metal sheets included in an LED bracket in this embodiment can be flexibly set according to the specific application scenario. For example, only two insulated metal sheets can be set, and the base body can only enclose a bowl body, and at least a part of the first surface of the two insulated metal sheets is exposed at the bottom of the bowl body to carry the LED chip and complete the electrical connection with the electrode of the LED chip, and the number of LED chips set in the bowl body and the luminous color of the LED chip can be flexibly set according to the needs. For example, it can be set to one, or it can be set to two or three, etc.

[0072] The LED chip in this embodiment can be a flip-chip LED chip, and the two electrodes of the flip-chip LED chip can directly cross over the exposed first surfaces of two adjacent metal sheets, so as to realize the electrical connection while supporting the LED chip; the LED chip in this embodiment can also be a face-up LED chip, and a face-up LED chip can be set on the first surface of any one of the metal sheets, or can be set across the first surfaces of multiple metal sheets at the same time, and the two electrodes of the face-up LED chip are electrically connected to the exposed first surfaces of the corresponding two metal sheets through leads.

[0073] In some application examples of this embodiment, the LED bracket may include three metal sheets arranged in sequence, and the exposed areas of the first surface of the metal sheet located in the middle are electrically connected to the electrodes corresponding to the two LED chips respectively; the exposed areas of the first surface of the metal sheets located on both sides are electrically connected to the remaining electrodes corresponding to the two LED chips respectively, so as to realize the series connection of the two LED chips. In this example, the three metal sheets can also be located at the bottom of the same bowl. In some other application scenarios of this example, the base body can also include a partition wall arranged on the first surface of the metal sheet located in the middle to form two isolated bowls on the first surfaces of the three metal sheets (the partition wall can also be not arranged and a large bowl is formed on the three metal sheets), so that the metal sheet located in the middle spans the bottom of the two isolated bowls, and the two metal sheets of the two are respectively located at the bottom of the two separated bowls. Which structure is used can be flexibly set according to the needs. In this application example, the number and color of LED chips set in a bowl, as well as whether to use a positive LED chip or a flip-chip LED chip, etc., can be flexibly set according to the needs. In some application scenarios of this application example, at least one of the third surface, second surface, and fourth surface of the metal sheet located in the middle may not be exposed outside the base body as required. When at least one of the third surface, second surface, and fourth surface of the metal sheet located in the middle may be exposed outside the base body as required, during welding, at least one of the third surface, second surface, and fourth surface of the metal sheet in the middle may be selectively welded, or at least one of the third surface, second surface, and fourth surface of the metal sheet in the middle may be selectively not welded, and the specific selection may be flexibly based on the application scenario.

[0074] In this embodiment, the shape of the second recessed portion provided in the area of ​​the second surface of the metal sheet exposed outside the base body and the shape of the first recessed portion for accommodating solder provided in the area of ​​the third surface exposed outside the base body can be flexibly combined. For example, the second recessed portion can be provided as the second recessed portion, and the first recessed portion can be provided as the first recessed portion or the first hole, or the second recessed portion can be provided as the second hole, and the first recessed portion can be provided as the first recessed portion or the first hole. The specific configuration can be flexibly configured according to the requirements. Similarly, the shapes of the first recessed portion and the third recessed portion, and the third recessed portion and the second recessed portion can also be flexibly combined; and whether the first recessed portion, the second recessed portion, and the third recessed portion are connected can be flexibly configured. For example, the second recessed portion provided on the second surface of the metal sheet and the first recessed portion provided on the third surface may not be connected. For example, in a side-emitting application scenario, when the third surface is placed on a welding surface provided with solder, the third surface squeezes the solder on the welding surface, and a portion of the solder will overflow along the third surface. When heated for welding, the solder will gather toward the metal sheet due to the heat, so that the overflowing solder can be preferentially gathered into the second recess provided on the second surface to complete bonding with the second surface, and at the same time, the solder under the third surface is bonded to the first surface, thereby realizing welding between the third surface and the second surface and improving welding reliability; at the same time, the setting of the second recess and the first recess can increase the welding area relative to the planar setting, and can store excess solder in the recess, which can further improve the stability of welding and improve the flatness of welding. In the application scenario of positive light emission, the process of welding when the second surface of the metal sheet is placed on the welding surface provided with solder is similar to the welding process in the above-mentioned side-emitting application scenario, and will not be repeated again.

[0075] For another example, the second recessed portion provided on the second surface of the metal sheet and the first recessed portion provided on the third surface can be arranged to communicate with each other. Such a communicating structure can form a better drainage for the liquid solder and can more reliably ensure that the excess solder is stored in the recessed portion. In this embodiment, when the second recessed portion and the first recessed portion communicate with each other, the communication can be formed inside the metal sheet or on the outer surfaces of the second and third surfaces of the metal sheet, and the structure of the communicating portion between the two can be a groove, a hole or other structure. For example, in the side-emitting application scenario, when the third surface is placed on the welding surface provided with solder, the third surface squeezes the solder on the welding surface. Since the second recess and the first recess are connected, a part of the solder squeezed into the first recess can flow directly into the second recess along the position where the two are connected. Therefore, it can be ensured as much as possible that there is solder in the second recess and the first recess, thereby ensuring that the second surface and the third surface are welded; when there is a part of solder that will overflow along the third surface, during the heating process, the solder will gather toward the metal sheet due to the heat, and the overflowed solder can also be preferentially gathered into the second recess provided on the second surface. It can be seen that the setting of the second recess and the first recess being connected can better realize the welding of the third surface and the second surface, and improve the reliability of welding. In the application scenario of positive light emission, the process of welding when the second surface of the metal sheet is placed on the welding surface provided with solder is similar to the welding process in the above-mentioned side-emitting application scenario, which will not be repeated here.

[0076] It should be understood that in this embodiment, when the second recess is set as the first recess or the first hole, and the first recess is set as the second recess or the second hole, the specific shapes and sizes of the first recess and the second recess, and the specific shapes and sizes of the second hole and the first hole can be flexibly set according to needs. Fig. 9 and Fig.10 As shown, the metal sheet group 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a portion of the first surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the first surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, and the third surface c and the fourth surface d are two surfaces located between the first surface a and the second surface b and opposite to each other. Fig. 9 and Fig.10As shown, in this example, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the third surface 22 of the base body 2 is provided with a first recess c1 in the shape of a circular hole. Optionally, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the base body 2 and the first recess is not provided is flush with the third surface 22 of the base body 2. The area where the second surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 is provided with a second recess b1 in the shape of a square hole. In this example, the second recess b1 is connected to the first recess c1. Optionally, in this embodiment, the area where the second surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the second surface 23 of the base body 2 and the first recess is not provided can also be flush with the second surface 23 of the base body 2.

[0077] See also Fig.11 and Fig.12 As shown, the first recess c1 may also be a square recess, or a combination of a square recess and a hole. Similarly, the shapes of the third recess and the second recess may also be deformed in a similar manner, and the arrangement relationship between the third recess and the second recess may refer to but not be limited to the relationship between the first recess and the second recess, which will not be described in detail.

[0078] Optionally, in one example of this example, the lateral width of the upper end of at least one metal sheet close to the first surface can be set to be greater than the lateral width of the third surface and / or the fourth surface, so that when the LED bracket is formed, a portion of the upper end of the metal sheet is embedded in the colloid of the base body, thereby improving the stability of the combination between the metal sheet and the base body. In addition, the lateral width of the third surface and / or the fourth surface is smaller than the lateral width of the upper end, which can increase the interval between the third surfaces of each metal sheet, and / or increase the interval between the fourth surfaces of each metal sheet, thereby avoiding short circuits between metal sheets during welding, and further improving safety. Of course, in some application examples, the lateral width of the upper end of the metal sheet close to the upper surface can also be the same or substantially the same as the lateral width of the third surface and / or the fourth surface. At this time, the combination of the two can be achieved through the bonding force between the base body and the metal sheet bonding area. It can be flexibly set according to specific needs.

[0079] See for example Figure 1 In the conductive base shown, the lateral width W1 of the upper end of the third metal sheet 13 is greater than the lateral width W2 of the third surface. Similarly, the lateral width W1 of the upper ends of the first metal sheet 11 and the second metal sheet 12 may also be greater than the lateral width W2 of the third surface.

[0080] In some examples of the present embodiment, in order to further improve the stability of the combination between the metal sheet and the base body, the side surface of the upper end of at least one metal sheet can be set as an inclined surface, and the inclination angle of the inclined surface can be flexibly set according to the needs. For example, in one example, the side surfaces of the upper ends of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces. After being combined with the base body, the inclined surface can have a larger contact area with the base body relative to the structure of the non-inclined surface, and can better withstand the pressure of the base body on the metal sheet, thereby better improving the bonding force between the metal sheet and the base body. Of course, the side surface of the upper end of the second metal sheet 12 can also be set as an inclined surface according to needs.

[0081] Optionally, in another example of this example, at least one metal sheet may be provided with a protrusion protruding outward between the first surface and the second surface, so that when the LED bracket is formed, at least a portion of the protrusion is embedded (it can be fully embedded or partially embedded, and the colloid embedded in the base body can be flexibly set according to needs), thereby improving the stability of the combination between the metal sheet and the base body. In addition, the setting of the protrusion can also increase the interval between the lower ends of each metal sheet, thereby avoiding short circuits between the metal sheets during welding, and further improving safety. Optionally, in this example, the protrusion provided on the metal sheet can be a protrusion inclined toward the second surface of the metal sheet, and the inclination angle can be flexibly set, for example, it can be set to any value between 30° and 70°, such as 30°, 45°, 60° or 70°, etc.

[0082] For another example, see Figure 15-1 to Figure 15-4 As shown, the LED bracket also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are insulated and isolated in sequence. At least a portion of the first surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the first surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. In this example, the area where the third surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the third surface 22 of the base body 2 is provided with a second concave portion c1 in the shape of an arc. In this embodiment, the left and right sides of the first metal sheet 11 and the third metal sheet 13 are provided with a protrusion 3 protruding outward between the first surface and the second surface, and the shape, size, etc. of the protrusion 3 can be flexibly set. In some examples, the protrusion 3 can also be set only on one of the left and right sides of the first metal sheet 11 and the third metal sheet 13, or the protrusion 3 can be flexibly set on at least one of the front, back, left and right sides of the first metal sheet 11 and the third metal sheet 13 according to needs; it can be flexibly set according to needs. See. Figure 15-3As shown, the second surface b and the fourth surface d are two discontinuous surfaces (that is, they are two non-adjacent surfaces), and are separated by the bottom surface of the protrusion 3 (also called the step surface); the step surface can be embedded in the base body to enhance the bonding force with the base body.

[0083] See also Figure 15-5 to Figure 15-7 As shown, in this embodiment, after the LED bracket is formed, the protrusion 3 set on the metal sheet is embedded in the base body, and at the bottom of the bowl, the colloid 20 constituting the base body is flush with the first surface a of the metal sheet. Figure 15-5 and Figure 15-7 As shown, there is a colloid 20 between the first surface a of the metal sheet and the side wall of the base body, and the colloid 20 is arranged flush with the first surface a. In this setting example, there is no restriction on the setting of the thickness of the side wall of the base body. Under the condition of meeting the strength requirement of the LED bracket, the side wall can be set thinner, thereby reducing the size of the LED bracket as a whole, which is more conducive to its miniaturization. It should be understood that the second metal sheet 12 can be provided with a protrusion 3 in the manner of the first metal sheet 11 or the third metal sheet 13, or the protrusion 3 can be not provided, and it can be flexibly set according to the needs.

[0084] In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the base body, the side surface of the protrusion 3 of at least one metal sheet can be set as an inclined surface, and the inclination angle of the inclined surface can be flexibly set according to needs. For example, see Figure 15-8 As shown, the side surface 31 of the upper protrusion 3 of the first metal sheet 11 and the second metal sheet 13 is an inclined surface. After being combined with the base body, the inclined surface can have a larger contact area with the base body relative to the structure of the non-inclined surface, and can better withstand the pressure of the base body on the metal sheet, thereby better improving the bonding force between the metal sheet and the base body. Of course, the second metal sheet 12 can also be provided with a structure similar to the protrusion 3 on the first metal sheet 11 and the third metal sheet 13 according to needs.

[0085] Optionally, in order to further enhance the firmness of the bonding between the metal sheet and the base body, a rough surface with a concave-convex structure for enhancing the bonding force with the base body may be provided in the area of ​​the first surface of the metal sheet bonding with the base body (of course, a rough surface with a concave-convex structure for enhancing the bonding force with the base body may also be provided in other areas of the metal sheet contacting with the base body), and / or a bonding hole for the colloid forming the base body to flow in.

[0086] Optionally, in this embodiment, the combining hole provided on the first surface of the metal sheet may communicate with the second recess provided on the second surface of the metal sheet, and may also communicate with the first recess provided on the third surface and / or the fourth recess provided on the fourth surface.

[0087] Optionally, in this embodiment, the end of the combining hole close to the first surface is the upper end, and the end close to the second surface is the lower end. The hole diameter of the upper end of the combining hole is larger than the hole diameter of the lower end of the combining hole, that is, there is at least one raised surface between the upper end and the lower end of the combining hole, so that the contact area between the combining hole and the colloid used to form the base body can be further increased, thereby further improving the bonding strength between the two.

[0088] For example, see the following example of a setup: Fig.13 As shown, the first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is provided with a rough surface a1 having a concave-convex structure in the area for contacting with the base body. Fig.14 As shown, a coupling hole a2 having a convex structure is provided in the area for contacting with the base body on the first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13. Of course, in other setting examples, a rough surface a1 having a concave-convex structure and a coupling hole a2 having a convex structure can also be provided in the area for contacting with the base body on the first surface a of at least one of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13.

[0089] This embodiment also provides a light-emitting unit, including the LED bracket as shown above, and also including an LED chip arranged in the bowl, the LED chip can be a front-mounted LED chip or a flip-mounted LED chip, and a packaging layer arranged in the bowl to cover the LED chip, and the electrode of the LED chip is electrically connected to the exposed area of ​​the first surface of the corresponding metal sheet. The packaging layer in this embodiment can be a fluorescent glue layer, or a combination of a fluorescent glue layer and a transparent glue layer, or a quantum dot QD film, or a combination of a QD film and a transparent glue layer, or a combination of at least two of the fluorescent glue layer, the QD film and the transparent glue layer.

[0090] The light-emitting unit provided in this embodiment is made by using the above-mentioned LED bracket. For ease of understanding, the following is an explanation in combination with several examples of light-emitting unit structures.

[0091] See also Fig.16 As shown, the figure shows a transverse cross-sectional view of a light-emitting unit made by using the LED bracket in each of the above examples. It can be seen from the figure that the gaps between the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are filled with a colloid forming the base body, and two isolated cups are formed on the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13, each of which is provided with an LED chip 4, which is a flip-chip LED chip, and each flip-chip LED chip is arranged across two adjacent metal sheets, and the cup is filled with a packaging layer 3.

[0092] See also Fig.17As shown in the figure, it is a transverse cross-sectional view of another light-emitting unit made by using the LED bracket in the above examples. Fig.16 The difference between the lamp beads shown in the figure is that the LED chip 4 arranged in the bowl is a normal-mounted LED chip, and the two normal-mounted LED chips are arranged on the first surface of the second metal sheet 12. Of course, it can also be adjusted so that the two normal-mounted LED chips are arranged on the first surfaces of the first metal sheet 11 and the third metal sheet 13 respectively, or one of the normal-mounted LED chips is arranged on the first surface of the first metal sheet 11, and the other is arranged on the first surface of the second metal sheet 12, or one of the normal-mounted LED chips is arranged on the first surface of the third metal sheet 13, and the other is arranged on the first surface of the second metal sheet 12. Of course, it should be understood that when more than three LED chips are required to be connected in series, they can also be arranged on the first surface of the third metal sheet 13. Fig.17 On the basis shown in the figure, a fourth metal sheet, a fourth and fifth metal sheets, etc. are added in sequence, and the specific settings can be flexibly selected according to needs. However, it should be understood that these setting ideas are equivalent replacement settings made based on the structure provided in this embodiment, and are all within the scope of this embodiment.

[0093] Optionally, in some examples of this embodiment, the shapes and / or sizes of the areas of the third surface and the fourth surface of the metal sheet exposed outside the base body can be set to be different, so that the user can accurately identify which surface is the third surface and which surface is the fourth surface when using it, thereby playing a fool-proof role when installing the LED lamp beads, and can further improve the convenience of use. For example, the shapes of the areas of the third surface and the fourth surface exposed outside the base body can be set to be different, one of which is circular and the other is square or triangular or elliptical, etc.; the sizes of the areas of the third surface and the fourth surface exposed outside the base body can also be set to be different, or the shapes and sizes of the areas of the third surface and the fourth surface exposed outside the base body can be set to be different. The specific setting can be based on application requirements and will not be repeated here.

[0094] The light-emitting units shown in the above examples are composed of a conductive base and a base body covering the conductive base. Compared with the existing light-emitting diodes, the structure is greatly simplified and the cost is low.

[0095] The metal sheet can simultaneously support the LED chip and realize electrical connection with the LED chip, and can also be used as a pad to realize electrical connection with the outside, with high integration and simple structure;

[0096] Since the LED chip is directly placed on the first surface of the metal sheet, and the second and third surfaces of the metal sheet are exposed, the heat generated by the LED chip can be directly transferred to the metal sheet during operation and quickly dissipated outward through the metal sheet, thereby improving the performance of the light-emitting unit.

[0097] Since the second surface, the third surface, and the fourth surface of the metal sheet are all exposed, at least one of the three can be used as a pad for external electrical connection. For example, in the side-emitting application scenario, the third surface can be welded to the outside, or the third surface and the second surface can be welded at the same time, or the fourth surface can be welded to the outside, or the fourth surface and the second surface can be welded to the outside at the same time; in the positive-emitting application scenario, the second surface can be welded, or the second surface and the third surface can be welded at the same time, or the second surface and the fourth surface can be welded at the same time, etc., and the provision of the third recess, the second recess, and the first recess can further improve the reliability and convenience of welding. Therefore, it can be applied to various application scenarios, and welding is convenient. It can also be welded on two surfaces according to needs, which can improve the firmness of welding and thus improve the reliability of the product.

[0098] Optionally, in some examples of this embodiment, only the first surface, the second surface, the third surface, and the fourth surface of the metal sheet may be exposed outside the wall, and the other surfaces may be covered by the base body, thereby improving the reliability of the connection between the conductive metal plate and the wall.

[0099] In an application scenario of the present embodiment, the metal sheet may be, but is not limited to, a copper substrate, which has the advantages of low cost, easy processing, good electrical conductivity and thermal conductivity, etc.

[0100] Optionally, in some other application examples of this embodiment, a reflective layer for improving light extraction efficiency may be provided on at least the exposed area on the first surface of the metal sheet, thereby improving the efficiency of the light-emitting unit. In this embodiment, the reflective layer may be, but is not limited to, a silver layer, and the silver layer may be formed on the copper substrate by, but is not limited to, electroplating, chemical silver plating, and the like.

[0101] It should be understood that the overall shape of the LED bracket in this embodiment can be a strip, a square, a hexagon, etc., and the overall shape of the LED bracket is not limited in this embodiment.

[0102] It should be understood that the metal sheet in this embodiment can be any metal plate that can achieve reliable conductive connection and has a support strength that meets the requirements of the LED bracket; since the metal plate has good heat dissipation performance, it can improve the heat dissipation performance of the LED bracket. Of course, it can also be replaced with other boards of other materials with conductive properties that can meet the above requirements. In this embodiment, the specific shape and size of the metal sheet can be flexibly set according to application requirements, and this embodiment does not limit it.

[0103] In this embodiment, the colloid material forming the base body can also be flexibly selected according to needs, for example, it can be but not limited to thermosetting glue or hot pressing glue, and can be but not limited to white glue with good reflective performance. For example, in one example, the colloid can be but not limited to epoxy or resin (such as epoxy glue, silicone, resin, etc.) materials.

[0104] This embodiment also provides a light-emitting module, which can be used for but not limited to various lighting scenes and / or display scenes, and includes a substrate and a plurality of light-emitting units as described above, and the plurality of light-emitting units are electrically connected to the substrate. The light-emitting unit in this embodiment can be a front light-emitting unit or a side light-emitting unit. For an example of a light-emitting module, please refer to Fig.18 As shown, the light emitting module 5 shown in the figure includes a substrate 52 and a plurality of the above-mentioned side-emitting light emitting units 51 arranged on the substrate 52 .

[0105] This embodiment also provides a display device, including the light-emitting module described above. The display device can be used for, but not limited to, various displays, mobile phones, PCs, advertising equipment, etc. Fig.19 As shown, it includes an outer frame 6, a film 701 assembled in the outer frame 6, a light guide plate 702, a reflective sheet 703 and a metal back plate 704, and a light emitting module 5 corresponding to the film 701, the light guide plate 702, the reflective sheet 703 and the metal back plate 704. It should be understood that Fig.19 What is shown is only an exemplary display device, and the specific structure of the display device can be flexibly arranged and will not be described in detail here.

[0106] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An LED bracket, characterized in that: The invention comprises three metal sheets which are sequentially insulated and isolated, and a colloid combined with the metal sheets to form a base body, wherein the base body encloses a bowl cup for placing an LED chip, and the first surface of the metal sheet is located at the bottom of the bowl cup and is at least partially exposed to the outside; the first surface of at least one of the metal sheets is used to carry the LED chip, and the exposed areas of the first surface of the metal sheets at the two ends are respectively used to be electrically connected to the electrodes of the corresponding LED chip, and the exposed areas of the first surface of the metal sheet located in the middle are respectively electrically connected to the electrodes corresponding to the two LED chips; At least part of the second surface of the metal sheet is exposed outside the base body, and the second surface is a surface opposite to the first surface. At least one of the metal sheets is located between the first surface and the second surface. At least part of the third surface and the fourth surface are exposed outside the base body as a welding area. The third surface and the fourth surface are two opposite surfaces, so that the LED bracket can dissipate heat through the exposed part of the metal sheet. The area of ​​the third surface exposed outside the base body is provided with a first recess for accommodating solder, the area of ​​the second surface exposed outside the base body is provided with a second recess for accommodating solder, and the area of ​​the fourth surface exposed outside the base body is provided with a third recess for accommodating solder. The second recess connects the first recess and the third recess, and there is a first step surface between the second recess and the first recess, and the first step surface extends inward relative to the wall surface of the first recess. There is a second step surface between the second recess and the third recess, and the second step surface extends inward relative to the wall surface of the third recess.

2. The LED bracket according to claim 1, characterized in that: A soldering layer for improving soldering capability is provided on the inner wall of at least one of the first recess, the second recess and the third recess.

3. The LED bracket according to claim 1, characterized in that: The first recess is a first groove or a first hole, the second recess is a second groove or a second hole, and the third recess is a third groove or a third hole.

4. The LED bracket according to claim 1, characterized in that: The area on the first surface of the metal sheet that is combined with the base body is provided with a rough surface with a concave-convex structure for enhancing the bonding force between the metal sheet and the base body, or is provided with a bonding hole for the colloid forming the base body to flow in.

5. The LED bracket according to claim 4, characterized in that: The end of the combining hole close to the first surface is the upper end, and the end close to the second surface is the lower end. The hole diameter of the upper end of the combining hole is larger than the hole diameter of the lower end of the combining hole.

6. The LED bracket according to claim 1, characterized in that: The base body also includes a separation wall disposed on the first surface of the middle metal sheet to form two isolated bowls on the first surfaces of the three metal sheets.

7. The LED bracket according to claim 1, characterized in that: The lateral width of the upper end of at least one of the metal sheets close to the first surface is greater than the lateral width of the third surface and / or the fourth surface, and a portion of the upper end of the metal sheet is embedded in the base body; Alternatively, at least one of the metal sheets is provided with a protrusion protruding outward between the first surface and the second surface, and at least a portion of the protrusion is embedded in the base body.

8. The LED bracket according to claim 1, characterized in that: The metal sheet is a copper substrate, and a reflective layer is provided on the first surface at least in an exposed area.

9. The LED bracket according to claim 1, characterized in that: The shapes and / or sizes of the areas of the third surface and the fourth surface exposed outside the base body are different.

10. A light emitting unit, characterized in that: It comprises an LED bracket as described in any one of claims 1 to 9, further comprising an LED chip arranged in the bowl, and a packaging layer arranged in the bowl to cover the LED chip, wherein the electrodes of the LED chip are electrically connected to the exposed areas of the first surface of the corresponding metal sheet.

11. A light emitting module, characterized in that: It comprises a substrate and a plurality of light-emitting units as claimed in claim 10, wherein the plurality of light-emitting units are electrically connected to the substrate.

12. A display device, characterized in that: Comprising the light emitting module as claimed in claim 11.

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