Electronic component parameter distributed management method and flat panel detector

Abstract

The present invention provides a distributed management method for electronic component parameters and a flat panel detector, the distributed management method for electronic component parameters comprising: S101: connecting a main control circuit board with a subcomponent, scanning the subcomponent according to a pre-stored subcomponent list address; S102: receiving electronic component parameters sent by the subcomponent, and controlling the subcomponent to work according to the electronic component parameters, wherein the electronic component parameters are stored in a memory of the subcomponent, including calibration parameters of the subcomponent. The present invention stores the calibration parameters of the subcomponent in the subcomponent, and completes the addition and replacement of the subcomponent by receiving the calibration parameters sent by the subcomponent through the main control circuit board, thereby avoiding the problem of inconsistency between the parameters stored in the main control circuit board and the subcomponent, and eliminating the need to calibrate the new subcomponent and add corresponding information when replacing, thereby reducing maintenance costs and maintenance difficulties.

Description

Technical Field

[0001] The present invention relates to the field of electronic component parameter management, and in particular to an electronic component parameter distributed management method and a flat panel detector. Background Art

[0002] Flat panel detectors are multi-electronic component systems, especially analog components. These sub-components often need to obtain their calibration parameters when in use, and control the electronic components according to the calibration parameters. Most of the calibration parameters are stored in the memory of the main control circuit board. The calibration parameters of the components are read when the flat panel detector is turned on. Once the sub-component is replaced, the calibration parameters of different sub-components are different, which often leads to the calibration parameters of the new sub-component being inconsistent with the parameters stored on the main control circuit board.

[0003] In the prior art, replacing a sub-component requires first calibrating the new sub-component, then writing down the calibration parameters, and then writing the calibration parameters into the main control circuit board of the replaced or flat-panel detector. When expanding sub-components, corresponding information also needs to be added to the system software, which makes the maintenance cost and difficulty relatively high. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the present invention proposes a distributed management method for electronic component parameters and a flat-panel detector, which store the calibration parameters of sub-components in the sub-components, and complete the addition and replacement of sub-components by receiving the calibration parameters sent by the sub-components through the main control circuit board, thereby avoiding the problem of inconsistency between the parameters stored in the main control circuit board and the sub-components, and eliminating the need to calibrate new sub-components and add corresponding information when replacing them, thereby reducing maintenance costs and maintenance difficulties.

[0005] To solve the above-mentioned problem, a technical solution adopted by the present invention is: a distributed management method of electronic component parameters, the distributed management method of electronic component parameters comprising: S101: connecting the main control circuit board with the sub-component, and scanning the sub-component according to the pre-stored sub-component list address; S102: receiving the electronic component parameters sent by the sub-component, and controlling the operation of the sub-component according to the electronic component parameters, wherein the electronic component parameters are stored in the memory of the sub-component, including the calibration parameters of the sub-component.

[0006] Furthermore, the main control circuit board is connected to the subcomponent via an I2C data line.

[0007] Furthermore, the subcomponent list address includes an I2C address of each subcomponent.

[0008] Furthermore, the electronic component parameters also include at least one of an ID and a serial number of the subcomponent.

[0009] Furthermore, after the step of receiving the electronic component parameters sent by the sub-component, the method further includes: storing the electronic component parameters of the sub-component and displaying functional modules related to the functions of the sub-component.

[0010] Furthermore, after the step of displaying the functional modules related to the functions of the sub-component, the step also includes: determining whether the main control circuit board is connected to the sub-component; if so, saving the electronic component parameters of the sub-component; if not, removing the stored electronic component parameters of the sub-component, and not displaying the functional modules related to the functions of the sub-component.

[0011] Based on the same inventive concept, the present invention also proposes a flat-panel detector, which includes a main control circuit board and a sub-component. The electronic component parameter management method implemented by the main control circuit board through the sub-component includes: S201: the main control circuit board is connected to the sub-component, and the sub-component is scanned according to a pre-stored sub-component list address; S202: receiving the electronic component parameters sent by the sub-component, and controlling the operation of the sub-component according to the electronic component parameters, wherein the electronic component parameters are stored in the memory of the sub-component, including the calibration parameters of the sub-component.

[0012] Furthermore, the main control circuit board is connected to the subcomponent via an I2C data line.

[0013] Furthermore, the subcomponent list address includes an I2C address of each subcomponent.

[0014] Furthermore, the electronic component parameters also include at least one of an ID and a serial number of the subcomponent.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the calibration parameters of the sub-components are stored in the sub-components, and the addition and replacement of the sub-components are completed by receiving the calibration parameters sent by the sub-components through the main control circuit board, thereby avoiding the problem of inconsistency between the parameters stored in the main control circuit board and the sub-components, and there is no need to calibrate the new sub-components and add corresponding information when replacing them, thereby reducing maintenance costs and maintenance difficulties. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A flow chart of an embodiment of a method for distributed management of electronic component parameters according to the present invention;

[0017] Figure 2 A flow chart of another embodiment of the method for distributed management of electronic component parameters of the present invention;

[0018] Figure 3 A structural diagram of an embodiment of a flat panel detector of the present invention;

[0019] Figure 4A connection block diagram of an embodiment of a flat panel detector of the present invention;

[0020] Figure 5 The flowchart is a method for distributed management of electronic component parameters executed by a flat panel detector according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0022] See also Figure 1-2 ,in, Figure 1 A flow chart of an embodiment of a method for distributed management of electronic component parameters according to the present invention; Figure 2 FIG. 1 is a flow chart of another embodiment of the method for distributed management of electronic component parameters of the present invention. Figure 1-2 The electronic component parameter distributed management method of the present invention is described in detail.

[0023] In this embodiment, the electronic component parameter distributed management method includes:

[0024] S101: The main control circuit board is connected to the sub-component, and the sub-component is scanned according to the pre-stored sub-component list address.

[0025] In this embodiment, the device for executing the distributed management method of electronic component parameters is a flat panel detector. In other embodiments, it may also be an oscilloscope, a single-chip microcomputer, or other devices that need to control subcomponents according to calibration parameters.

[0026] In this embodiment, the main control circuit board is connected to the subcomponents via an I2C data line, and the subcomponent list address includes the I2C address of each subcomponent.

[0027] In this embodiment, the subcomponent list addresses are stored in a storage chip of the main control circuit board.

[0028] In other embodiments, the main control circuit board can also be connected to the sub-components via ISA, EISA, VESA, PCI, SPI, USB, RS232 and other buses. The memory chip of the corresponding main control circuit board can also store the addresses of these buses or the connection ports with the main control circuit board, and connect to the sub-components via the addresses or the connection ports.

[0029] In this embodiment, the main control circuit board can scan the information in the sub-component list address at a preset period to scan the sub-component, and obtain the data stored in the sub-component when it is determined that the sub-component is scanned.

[0030] In this embodiment, the main control circuit board further includes a control chip, which is connected to the storage chip, and the sub-components are scanned through the sub-component list addresses stored in the storage chip.

[0031] In other embodiments, the subcomponent list address may also be stored in the control chip.

[0032] In this embodiment, the control chip is a CPU and the storage chip is an EEPROM. In other embodiments, the control chip may also be an MCU, a SOC, a DSP or other devices capable of reading data stored in the storage chip and the subcomponents. The storage chip may also be an E2PROM, a FLASH, a DRAM or other storage device capable of storing a subcomponent list.

[0033] In this embodiment, the number of sub-components can be 1, 2, 3 or other numbers. The user can set it according to the number of sub-components that can be connected to the main control circuit board and his own needs, and there is no limitation here.

[0034] S102: receiving electronic component parameters sent by the sub-component, and controlling the sub-component to operate according to the electronic component parameters, wherein the electronic component parameters are stored in a memory of the sub-component, including calibration parameters of the sub-component.

[0035] In this embodiment, the electronic component parameter further includes at least one of an ID and a serial number of the subcomponent.

[0036] In a specific embodiment, after the main control circuit board is connected to the sub-component, it first receives the sub-component ID and serial number sent by the sub-component, stores the sub-component ID and serial number in a storage chip, reads the calibration parameters of the sub-component, and calculates the sub-component functional data based on the calibration parameters.

[0037] In this embodiment, after the step of receiving the electronic component parameters sent by the sub-component, the step further includes: storing the electronic component parameters of the sub-component, and displaying functional modules related to the functions of the sub-component.

[0038] In this embodiment, the step of displaying the functional modules related to the functions of the sub-component also includes: determining whether the main control circuit board is connected to the sub-component; if so, saving the electronic component parameters of the sub-component; if not, removing the stored electronic component parameters of the sub-component, and not displaying the functional modules related to the functions of the sub-component.

[0039] In this embodiment, the main control circuit board stores the function modules related to the functions of the subcomponents, and after determining the existence of the subcomponents, the function modules are controlled to work according to the function parameters of the subcomponents. The main control circuit board can search for the function modules related to the subcomponents according to at least one of the ID, serial number and calibration parameters of the subcomponents, and can also correspond each I2C address to a different subcomponent, and search for the corresponding function module according to the I2C address corresponding to the subcomponents.

[0040] In this embodiment, the memory is an EEPROM memory. In other embodiments, the memory may also be an E2PROM, FLASH, DRAM or other storage devices capable of storing a sub-component list.

[0041] The following is a specific description of the execution process of the electronic component parameter distributed management method.

[0042] The distributed parameter management method is divided into the main control part and the sub-component part. The sub-component has an independent parameter EEPROM memory. After the sub-component storing the calibration parameters is connected to the main control circuit through the I2C communication data line, the main control circuit board will scan the sub-component according to the pre-stored sub-component list address. The installed sub-component will send the sub-component ID and serial number back to the main control circuit board. The main control board will register the sub-component according to the sub-component ID and serial number, and read the calibration parameters stored on the sub-component for the calculation of the component function data. When the optional sub-component is removed, the registration information of the sub-component will also be removed, and the optional function will also be removed from the main function, so that there is a function when there is a component, and there is no function when there is no component, without adding settings in the software interface.

[0043] Beneficial effect: The distributed management method of electronic component parameters of the present invention stores the calibration parameters of sub-components in the sub-components, and completes the addition and replacement of sub-components by having the main control circuit board receive the calibration parameters sent by the sub-components, thereby avoiding the problem of inconsistency between the parameters stored in the main control circuit board and the sub-components, and eliminating the need to calibrate new sub-components and add corresponding information when replacing them, thereby reducing maintenance costs and difficulty.

[0044] Based on the same inventive concept, the present invention also proposes a flat panel detector, see Figure 3-5 , Figure 3 A structural diagram of an embodiment of a flat panel detector of the present invention; Figure 4 A connection block diagram of an embodiment of a flat panel detector of the present invention; Figure 5 A flowchart of an embodiment of a method for distributed management of electronic component parameters executed by a flat panel detector of the present invention, combined with Figure 3-5 The flat panel detector of the present invention will be described.

[0045] In this embodiment, the flat panel detector includes a main control circuit board and a subcomponent. The electronic component parameter management method implemented by the main control circuit board through the subcomponent includes:

[0046] S201: The main control circuit board is connected to the sub-component, and the sub-component is scanned according to the pre-stored sub-component list address.

[0047] In this embodiment, the main control circuit board is connected to the subcomponents via an I2C data line, and the subcomponent list address includes the I2C address of each subcomponent.

[0048] In this embodiment, the subcomponent list addresses are stored in a storage chip of the main control circuit board.

[0049] In other embodiments, the main control circuit board can also be connected to the sub-components via ISA, EISA, VESA, PCI, SPI, USB, RS232 and other buses. The memory chip of the corresponding main control circuit board can also store the addresses of these buses or the connection ports with the main control circuit board, and connect to the sub-components via the addresses or the connection ports.

[0050] In this embodiment, the main control circuit board can scan the information in the sub-component list address at a preset period to scan the sub-component, and obtain the data stored in the sub-component when it is determined that the sub-component is scanned.

[0051] In this embodiment, the main control circuit board further includes a control chip, which is connected to the storage chip, and the sub-components are scanned through the sub-component list addresses stored in the storage chip.

[0052] In other embodiments, the subcomponent list address may also be stored in the control chip.

[0053] In this embodiment, the control chip is a CPU and the storage chip is an EEPROM. In other embodiments, the control chip may also be an MCU, a SOC, a DSP or other devices capable of reading data stored in the storage chip and the subcomponents. The storage chip may also be an E2PROM, a FLASH, a DRAM or other storage device capable of storing a subcomponent list.

[0054] In this embodiment, the number of sub-components can be 1, 2, 3 or other numbers. The user can set it according to the number of sub-components that can be connected to the main control circuit board and his own needs, and there is no limitation here.

[0055] S202: receiving electronic component parameters sent by the sub-component, and controlling the sub-component to operate according to the electronic component parameters, wherein the electronic component parameters are stored in a memory of the sub-component, including calibration parameters of the sub-component.

[0056] In this embodiment, the electronic component parameter further includes at least one of an ID and a serial number of the subcomponent.

[0057] In a specific embodiment, after the main control circuit board is connected to the sub-component, it first receives the sub-component ID and serial number sent by the sub-component, stores the sub-component ID and serial number in a storage chip, reads the calibration parameters of the sub-component, and calculates the sub-component functional data based on the calibration parameters.

[0058] In this embodiment, after the step of receiving the electronic component parameters sent by the sub-component, the step further includes: storing the electronic component parameters of the sub-component, and displaying functional modules related to the functions of the sub-component.

[0059] In this embodiment, the step of displaying the functional modules related to the functions of the sub-component also includes: determining whether the main control circuit board is connected to the sub-component; if so, saving the electronic component parameters of the sub-component; if not, removing the stored electronic component parameters of the sub-component, and not displaying the functional modules related to the functions of the sub-component.

[0060] In this embodiment, the main control circuit board stores the function modules related to the functions of the subcomponents, and after determining the existence of the subcomponents, the function modules are controlled to work according to the function parameters of the subcomponents. The main control circuit board can search for the function modules related to the subcomponents according to at least one of the ID, serial number and calibration parameters of the subcomponents, and can also correspond each I2C address to a different subcomponent, and search for the corresponding function module according to the I2C address corresponding to the subcomponents.

[0061] In this embodiment, the memory is an EEPROM memory. In other embodiments, the memory may also be an E2PROM, FLASH, DRAM or other storage devices capable of storing a sub-component list.

[0062] The following is a specific description of the execution process of the electronic component parameter distributed management method.

[0063] The distributed parameter management method is divided into the main control part and the sub-component part. The sub-component has an independent parameter EEPROM memory. After the sub-component storing the calibration parameters is connected to the main control circuit through the I2C communication data line, the main control circuit board will scan the sub-component according to the pre-stored sub-component list address. The installed sub-component will send the sub-component ID and serial number back to the main control circuit board. The main control board will register the sub-component according to the sub-component ID and serial number, and read the calibration parameters stored on the sub-component for the calculation of the component function data. When the optional sub-component is removed, the registration information of the sub-component will also be removed, and the optional function will also be removed from the main function, so that there is a function when there is a component, and there is no function when there is no component, without adding settings in the software interface.

[0064] Beneficial effect: The flat-panel detector of the present invention stores the calibration parameters of the sub-components in the sub-components, and completes the addition and replacement of the sub-components by receiving the calibration parameters sent by the sub-components through the main control circuit board, thereby avoiding the problem of inconsistency between the parameters stored in the main control circuit board and the sub-components, and there is no need to calibrate the new sub-components and add corresponding information when replacing them, thereby reducing maintenance costs and maintenance difficulties.

[0065] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A method for distributed management of electronic component parameters, characterized in that: The electronic component parameter distributed management method comprises: S101: The main control circuit board is connected to the sub-component, and the sub-component is scanned according to the pre-stored sub-component list address; The main control circuit board scans the information in the sub-component list address at a preset period to scan the sub-component, and obtains the data stored in the sub-component when it is determined that the sub-component is scanned; S102: receiving electronic component parameters sent by the subcomponent, and controlling the subcomponent to work according to the electronic component parameters, wherein the electronic component parameters are stored in a memory of the subcomponent, including calibration parameters of the subcomponent; The electronic component parameters also include at least one of the ID and serial number of the subcomponent; After the main control circuit board is connected to the sub-component, it first receives the sub-component ID and serial number sent by the sub-component, stores the sub-component ID and serial number in the storage chip, reads the calibration parameters of the sub-component, and calculates the sub-component functional data according to the calibration parameters; After the step of receiving the electronic component parameters sent by the subcomponent, the method further includes: storing the electronic component parameters of the subcomponent and displaying a functional module related to the function of the subcomponent; After the step of displaying the functional modules related to the functions of the subcomponent, the following step is further included: Determining whether the main control circuit board remains connected to the subcomponent; If so, saving the electronic component parameters of the subcomponent; If not, the stored electronic component parameters of the subcomponent are removed, and the functional modules related to the functions of the subcomponent are not displayed; The subcomponent has an independent parameter EEPROM memory. After the subcomponent storing the calibration parameters is connected to the main control circuit, the main control circuit board scans the subcomponent according to the pre-stored subcomponent list address, and the installed subcomponent will send the subcomponent ID and serial number back to the main control circuit board. The main control circuit board will register the subcomponent according to the subcomponent ID and serial number, and read the calibration parameters stored on the subcomponent for calculation of the component function data; when the optional subcomponent is removed, the registration information of the subcomponent is removed, and the optional function is removed from the main function.

2. The electronic component parameter distributed management method according to claim 1, characterized in that: The main control circuit board is connected to the subcomponent via an I2C data line.

3. The electronic component parameter distributed management method according to claim 2, characterized in that: The subcomponent list address includes the I2C address of each subcomponent.

4. A flat panel detector, characterized in that: The flat panel detector includes a main control circuit board and subcomponents, and the main control circuit board implements the method for distributed management of electronic component parameters according to any one of claims 1 to 3 through the subcomponents, including: S201: The main control circuit board is connected to the sub-component, and the sub-component is scanned according to the pre-stored sub-component list address; S202: receiving electronic component parameters sent by the sub-component, and controlling the sub-component to operate according to the electronic component parameters, wherein the electronic component parameters are stored in a memory of the sub-component, including calibration parameters of the sub-component.

5. The flat panel detector according to claim 4, characterized in that: The main control circuit board is connected to the subcomponent via an I2C data line.

6. The flat panel detector according to claim 5, characterized in that: The subcomponent list address includes the I2C address of each subcomponent.

7. The flat panel detector according to claim 4, characterized in that: The electronic component parameters further include at least one of an ID and a serial number of the subcomponent.

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