Electrical components

Abstract

The invention relates to an electrical component, comprising a first housing part (100) composed of a first plastic compound, the first housing part (100) having a first groove-forming profile (110), a first semiconductor body (200) with an integrated circuit being arranged in the first groove-forming profile (110), at least two conductor tracks (310, 320, 330) being arranged on a surface (120) of the first groove-forming profile (110), the conductor tracks being led to an outer side (130) of the first housing part (100), the at least two conductor tracks (310, 320, 330) being connected to the integrated circuit, wherein the first groove-forming profile (110) is at least partially filled with a filler material composed of a second plastic compound for covering the first semiconductor body (200).

Description

[0001] This application is a divisional application of the invention patent application with application number "201510454936.6", application date July 29, 2015, and invention name "Electrical Component". Technical Field

[0002] The invention relates to an electric component. Background Art

[0003] Quad Flat No-Lead Package (QFN), also known as Micro Lead Frame (MLF), is a chip housing construction form commonly used in electronics for integrated circuits (ICs). The name includes IC housings of different sizes, all of which are soldered to a circuit board as a surface-mounted component.

[0004] These housings are marketed under different, mostly manufacturer-specific names, such as DFN (Dual Flat No-lead Package) or QFN (Quad Flat No-lead Package).

[0005] Die-cast plastic components with metal conductor tracks applied by special methods are called Molded Interconnect Devices (English for injection molded circuit carriers), or MIDs for short. They are used as circuit carriers for electrical components or electromechanical components. The main areas of use of MID technology are automobile manufacturing, industrial automation, pharmaceutical technology, household appliance industry, communication technology, measurement and analysis technology, and aviation and aerospace. MIDs can be made in different types. The most important methods for applying conductor tracks and emitting or shielding surfaces are two-component injection molding, hot pressing, mask exposure methods, laser structuring, and in-film injection molding. In principle, a distinction is made between structuring methods that reduce material and metallization methods that increase material. Summary of the invention

[0006] The object of the present invention is to improve electrical components as far as possible.

[0007] This object is achieved by an electrical component having the features of the invention. Advantageous further developments are contained in the description.

[0008] Therefore, an electrical component is provided.

[0009] The electrical component has a first housing part composed of a first plastic compound. The plastic compound comprises thermoplastic or thermosetting compounds and in particular silicones and resins.

[0010] The first housing portion has a first groove-forming profile.

[0011] A first semiconductor body having an integrated circuit is arranged in the first recess-forming profile.

[0012] At least two conductor tracks are arranged on the surface of the first groove-forming profile and are guided on the outer side of the first housing part.

[0013] The at least two conductor tracks are connected to the integrated circuit.

[0014] The first recess-forming profile is at least partially filled with a potting compound consisting of a second plastic compound for covering the first semiconductor body.

[0015] The applicant's research shows that the aforementioned features can be used to obtain a multi-purpose, flexible frameless package with a standardized terminal configuration diagram (English, footprint). The terminal configuration diagram is preferably standardized according to the JEDEC Solid State Technology Association. The package can be manufactured more advantageously by eliminating the lead frame. Delamination on the semiconductor substrate is significantly reduced or can be completely avoided. By a specific implementation as shown in the embodiment of the accompanying drawings, the requirements that have been contradictory to date are optimized at the same time. Good mechanical rigidity of the package is thus obtained. The printed conductors are well fixed in the housing part. The covering of the semiconductor body and, if necessary, the covering of other components such as passive components are optimized.

[0016] According to an advantageous embodiment, a fixing layer composed of a third plastic compound is introduced between the first semiconductor body and the first housing part for the purpose of being integrally connected to the first semiconductor body and to the first housing part.

[0017] According to an advantageous extended configuration, the first housing part is made as an injection molded part. The at least two conductor tracks are inserted into the injection molded part. The at least two conductor tracks are advantageously processed by means of a material-reducing structured MID method and / or a material-adding metallization MID method. For example, the conductor tracks are processed as metallic built-in parts.

[0018] According to an advantageous extended configuration, a second semiconductor body with another integrated circuit and / or a passive component is arranged in the first groove-forming portion. Obviously, the passive component is preferably understood as a capacitor and / or a resistor. Advantageously, the integrated circuit is electrically connected to the other integrated circuit and / or the passive component. The passive component is, for example, a capacitor or a coil or a resistor.

[0019] According to an advantageous embodiment, the first housing part has a second groove-forming profile. Advantageously, a permanent magnet and / or a magnetically permeable material is arranged in the second groove-forming profile.

[0020] According to an advantageous embodiment, the first groove-forming profile is formed on the outer side of the first housing part carrying the at least two conductor tracks.

[0021] According to an advantageous embodiment, the outer side of the first housing part with the at least two conductor tracks is situated opposite a side of the first housing part with the first groove-forming profile.

[0022] According to an advantageous embodiment, the at least two conductor tracks are arranged on the outer side of the first housing part in accordance with a standardized terminal assignment (JEDEC).

[0023] In another embodiment, the conductor tracks are mechanically decoupled from the conductor tracks on the outer side facing the circuit carrier by means of straight or U-shaped recesses.

[0024] In a preferred embodiment, at least two conductor tracks are located on the outer side of the housing on the side of the first groove-forming profile.

[0025] It should be noted that the first housing part is designed in one piece and the first recess-forming profile is designed in a pot-shaped manner with a surrounding edge. Preferably, the surrounding edge has a thickness of from 0.1 mm to 1.0 mm, preferably 0.5 mm, wherein the first housing part has a height of at least 0.8 mm. It is understood that the edge of the recess is preferably higher than the thickness of the component located in the recess, so that the component can be completely embedded by injection molding and protected from environmental influences.

[0026] In an extended configuration, there are exactly two cutouts extending parallel to one another, wherein the cutouts are each spaced from the outer edge on the underside by a thickness of the surrounding edge, preferably 0.5 mm. Preferably, the cutouts are designed so as not to reach the outer edge on the underside.

[0027] The aforementioned expansion configuration variations are particularly advantageous not only individually but also in combination. Here, all expansion configuration variations can be combined with each other. Some possible combinations are explained in the description of the embodiments of the accompanying drawings. However, the combination possibilities of these expansion configuration variations described there are not exhaustive. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention is described in detail below by way of embodiments with reference to the accompanying drawings.

[0029] The accompanying drawings show:

[0030] Figures 1a to 1d A view of an electrical component of a first embodiment;

[0031] Figures 2a to 2d A view of an electrical component of a second embodiment;

[0032] Figures 3a to 3eA view of an electrical component of a third embodiment;

[0033] Figures 4a to 4e Illustration of an electrical component of a fourth exemplary embodiment. DETAILED DESCRIPTION

[0034] Figure 1a The electrical components are schematically shown in a three-dimensional view. Figure 1b A schematic diagram of the upper side of the electrical component is shown, and Figure 1d A schematic representation of an outer side 130 of the electrical component is shown, which outer side forms the bottom side 130 . Figure 1c A schematic cross-sectional view along line AA is shown.

[0035] Three conductor tracks 310, 320, 330 are led to the outer side 130 of the first housing part 100. The conductor tracks 310, 320, 330 are arranged on the outer side 130 for electrical connection to conductor tracks of a circuit carrier, such as a printed circuit board. By routing the conductor tracks around the sides of the housing part, a check of correct wetting of the soldered connection of the component to the circuit board is ensured after the soldering process. Figure 1d In the implementation, the printed conductors are arranged according to the standardized terminal configuration diagram SOT23. Depending on the number of printed conductors, other standardized terminal configuration diagrams, such as SOT323, QFN, etc., can be formed instead.

[0036] Figures 1a to 1d The first housing part 100 in the embodiment of the present invention is preferably composed of a first thermoplastic or thermosetting plastic compound. The first plastic compound is based on, for example, acrylonitrile-butadiene-styrene (ABS), polyamide (PA), polylactic acid (PLA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyetheretherketone (PEEK), polyvinyl chloride (PVC), celluloid or polyolefins such as polyethylene or polypropylene, or epoxy resin. By using a thermoplastic plastic compound, material costs can be reduced, processing time can be shortened and injection losses can be reduced (hot runner injection molding).

[0037] according to Figures 1a to 1c , the first housing part 100 has a first groove-forming profile 110. The groove shape is preferably a rectangular plan view with an inclined groove wall. Alternatively, other groove shapes, such as an elliptical or circular groove shape, can also be provided. It is understood that the first housing part 100 is constructed in one piece and the first groove-forming profile 110 is constructed in a pot-shaped manner with a surrounding edge. Here, the surrounding edge has a thickness of preferably 0.5 mm. The first housing part 100 has a height of at least 0.8 mm.

[0038] exist Figure 1a In the embodiment of the embodiment of the present invention, the first semiconductor body 200 with an integrated circuit is arranged in the groove-forming profile 110. The integrated circuit has, for example, a plurality of transistors and / or diodes and / or other elements, such as sensor elements, which are interconnected in the integrated circuit. Preferably, the semiconductor body 200 is arranged on the bottom surface of the groove-forming profile 110.

[0039] Three conductor tracks 310, 320, 330 are arranged on the surface 120 of the groove-forming profile 110. These conductor tracks 310, 320, 330 are connected to the integrated circuit. This connection is realized, for example, by bonding wires or solder balls. The conductor tracks 310, 320, 330 establish a connection from the integrated circuit to the outer side 130 of the housing. For this purpose, a bonding process and / or a "flip-chip" process is particularly implemented. For this purpose, the conductor tracks 310, 320, 330 are led to the outer side 130 of the first housing part 100. The conductor tracks 310, 320, 330 are formed by conductive materials. The conductive materials are, for example, metals such as copper or aluminum or nickel or gold. The conductor tracks 310, 320, 330 can be guided, for example, completely on the surfaces 120, 130 of the first housing part 110. The conductor tracks 310, 320, 330 are manufactured, for example, by means of MID technology. Conductor tracks 310 , 320 , 330 are advantageously produced by means of a material-reducing structuring method and / or a material-increasing metallization method.

[0040] exist Figure 1c In an embodiment, the groove forming profile 110 is at least partially filled with a filler 400 for covering the first semiconductor body 200. The filler has a second plastic compound. Preferably, the second plastic compound also includes silicone and / or resin. Here, the first plastic compound and the second plastic compound can have the same or different materials. By separating the first housing part 100 and the filler 400, the properties for covering the semiconductor body 200 can be optimized separately from the first housing part. For example, the filler 400 can be optimized in terms of reducing delamination. The mechanical stress acting on the semiconductor body is reduced by the optimized filler 400. At the same time, the first housing part 100 can be optimized in terms of the required rigidity.

[0041] As in Figure 1c As shown in FIG, a fixing layer 500 consisting of a third plastic compound is introduced between the semiconductor body 200 and the first housing part 100 for materially connecting to the semiconductor body 200 and to the first housing part 100. Preferably, the third plastic compound also includes silicone and / or resin. The conductor tracks 310, 320, 330 are mechanically movable and mechanically decoupled relative to the remaining housing parts. The mechanical decoupling of the conductor tracks 310, 320, 330 on the outer side 130 facing the circuit carrier is Figure 1c and1d In the embodiment of the present invention, the two cutouts 140, 150 are obtained by the particularly straight or U-shaped cutouts 140, 150 on the outer side 130. The two cutouts 140, 150 extend parallel to each other and are preferably 0.5 mm away from the outer edge on the bottom side 130. The two cutouts 140, 150 are also designed not to reach the outer edge on the bottom side 130.

[0042] exist Figures 2a to 2d , a schematic diagram of an electrical component of another embodiment is shown. The electrical component comprises a first housing part 101 with a first groove-forming profile 111, a semiconductor body 201 and conductor tracks 311, 321, 331, wherein the conductor tracks 311, 321, 331 are electrically connected to the integrated circuit of the semiconductor body 201. The semiconductor body 201 is fixed to a surface 121 in the groove-forming profile 111 on the first housing part 101 by means of a fixing layer 501. The groove-forming profile 111 is filled by means of a filler 401.

[0043] and Figures 1a to 1d The implementation methods are different. Figures 2a to 2d In the embodiment of the present invention, a second groove forming molding is provided in the first housing part 100. Figure 2c and 2d In the embodiment of the present invention, a permanent magnet 601 is arranged in the second groove forming part. Alternatively or in combination, a magnetically conductive material is arranged in the second groove forming part. Figure 2d The embodiment of has two cutouts 141, 151 on the outer side 131 of the first housing part 101, which also serve to mechanically decouple the conductor tracks 311, 321, 331 from the permanent magnet 601. Instead of the permanent magnet 601, a passive element (not shown), such as a capacitor or a resistor, which is electrically connected to the conductor tracks 311, 321, 331 can alternatively be arranged in the second groove-forming section.

[0044] exist Figures 1a to 1d In the embodiment of the present invention, the outer side 130 of the first housing part 100 with the three conductor tracks 310, 320, 330 forming the terminal arrangement SOT23 is opposite to the side of the first housing part 100 with the first groove forming profile 110. Figures 3a to 3e In the embodiment of the present invention, the groove-forming profile 110 is formed on the outer side 130 of the first housing part 100 itself, which has at least two conductor tracks 310, 320, 330. Therefore, for contacting the circuit carrier, according to Figure 3a , the electrical components must be turned over (face down in English).

[0045] exist Figure 3a The electrical components are schematically shown in a three-dimensional view. Figure 3bA schematic diagram of the upper side of the electrical component is shown, and Figure 3d A schematic side view is shown. Figure 3c shows a schematic cross-sectional view along line BB, Figure 3e A schematic cross-sectional view along line AA is shown.

[0046] The electrical component comprises a first housing part 10 with a groove-forming profile 112, a semiconductor body 202 and conductor tracks 312, 321, 331, wherein the conductor tracks 312, 322, 332 are electrically connected to the integrated circuit of the semiconductor body 202. The semiconductor body 202 is fixed on the surface 122 in the first groove-forming profile 112 on the first housing part 102 by means of a fixing layer 502. The groove-forming profile 112 is filled by means of a filler 402. The conductor tracks 312, 322, 332 are led to the outer surface 132. Figures 3a to 3e The embodiment of the invention enables mechanical decoupling to be achieved by means of the wall thickness of the first housing part 102 in the region of the first groove forming profile 112 in order to reduce mechanical stresses.

[0047] exist Figures 4a to 4e Schematically shows another embodiment of an electrical component. Here, a semiconductor body 203 and at least one further element 703 are arranged in a first groove-forming profile. The electrical component has a first housing part 103 with a first groove-forming profile 113, a semiconductor body 203 and conductor tracks 313, 321, 331, wherein the conductor tracks 313, 323, 333 are electrically connected to the integrated circuit of the semiconductor body 203. The further element 703 is electrically connected to the integrated circuit of the semiconductor body 203 and / or to the conductor tracks 313, 323, 333. The semiconductor body 203 is fixed to the surface 123 in the groove-forming profile 113 on the first housing part 103 by means of a fixing layer 503. The further element 703 can also be fixed to the surface 123 in the first groove-forming profile 113 by means of a fixing layer. The first groove-forming profile 113 is filled by means of a filler 403. The conductor tracks 313, 323, 333 are led to the outer surface 133.

[0048] The other element 703 is, for example, another semiconductor body with another integrated circuit. For contacting, the two semiconductor bodies can be wired two-dimensionally. The arrangement of the other element 703 enables the integration of multiple (intelligent) semiconductor sensors of the same type with overlapping action axes. Preferably, the other element 703 is a passive element, such as a capacitor, a coil or a resistor.

[0049] The present invention is not limited to the described Figures 1a to 4eThe fillers 400, 401, 402, 403 are shown in a visual manner in the figures. Preferably, the fillers 400, 401, 402, 403 are opaque. It is also possible that the shape of the first groove-forming profile is configured in another way. It is also possible that a plurality of groove-forming profiles are provided on the same side of the first housing part. Figure 1a The functionality of the electrical component can be used particularly advantageously for the magnetic field sensor.

[0050] Reference Mark List

[0051] 100, 101, 102, 103 Shell part

[0052] 110, 111, 112, 113 groove forming part

[0053] 120, 121, 122, 123 Surface

[0054] 130, 131, 132, 133 External surface

[0055] 140, 150 cut

[0056] 200, 201, 202, 203 Semiconductor body

[0057] 310, 320, 330, 311 printed conductors

[0058] 321, 331, 312, 322 printed conductors

[0059] 332, 313, 323, 333 printed conductors

[0060] 400, 401, 402, 403 packing

[0061] 500, 501, 502, 503 fixed layer

[0062] 601 permanent magnet

[0063] 703 Passive Components

Claims

1. Electrical components, having a first housing part (100) consisting of a first plastic compound, in, The first housing part (100) is designed in one piece and has a first groove-forming profile (110), which is designed in a pot-shaped manner with a surrounding edge, wherein the surrounding edge is formed downward to the bottom and forms an inclined groove wall. A first semiconductor body (200) with an integrated circuit is arranged in the first groove-forming profile (110). At least two conductor tracks (310, 320, 330) are arranged on the surface (120) of the first groove-forming profile (110), the conductor tracks being led to the outer side (130) of the first housing part (100). The first housing part (100) is manufactured as an injection molded part, and the at least two conductor tracks are inserted into the injection molded part as metallic built-in parts. The at least two printed conductors (310, 320, 330) are connected to the integrated circuit. wherein the first recess-forming profile (110) is at least partially filled with a filler (400) composed of a second plastic compound for covering the first semiconductor body (200), wherein a mechanically movable mechanical decoupling of the conductor tracks (310, 320, 330) on the outer side (130) facing the circuit carrier is achieved by straight or U-shaped parallel cutouts (140, 150), wherein two cutouts (140, 150) extending parallel to one another are designed not to reach an outer edge on the outer side (130), The first housing part (100) has a second groove-forming molding. A permanent magnet (601) and / or a magnetically conductive material is arranged in the second groove forming portion. wherein the outer side (130) of the first housing part (100) having the at least two conductor tracks (310, 320, 330) is opposite to a side of the first housing part (100) having the first groove-forming profile (110), and The cutout is also used for mechanical decoupling of the printed conductor from the permanent magnet (601) and / or the magnetically conductive material.

2. The electrical component according to claim 1, wherein: A fixing layer (500) composed of a third plastic compound is introduced between the first semiconductor body (200) and the first housing part (100) for being integrally connected to the first semiconductor body (200) and to the first housing part (100).

3. The electrical component according to claim 1 or 2, wherein: A second semiconductor body having a further integrated circuit and / or a passive component (703) is arranged in the first recess-forming profile (110).

4. The electrical component according to claim 1 or 2, wherein: The first groove-forming profile (110) is formed on the outer side (130) of the first housing part (100) with the at least two conductor tracks (310, 320, 330).

5. The electrical component according to claim 1 or 2, wherein: The at least two conductor tracks (310, 320, 330) are arranged on the outer side (130) of the first housing part (100) in accordance with a standardized terminal arrangement (JEDEC).

6. The electrical component according to claim 1 or 2, wherein: At least two conductor tracks (312, 322, 332) are present on the outer side of the first housing part laterally of the first groove-forming profile (112).

7. The electrical component according to claim 1 or 2, wherein: The surrounding edge has a thickness in the range from 0.1 mm to 1.0 mm and the first housing part (100) has a height of at least 0.8 mm.

8. The electrical component according to claim 1 or 2, wherein: The cutouts (140, 150) are respectively located within a range of 0.1 mm to 1.0 mm from the outer edge on the outer side (130).

9. The electrical component according to claim 1 or 2, wherein: The second groove-forming profile is configured in a pot-shaped manner with a peripheral edge, and the permanent magnet (601) and / or the magnetically conductive material fills the second groove-forming profile.

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