Magnetic field adjustable magnetron sputter cathode

Abstract

The application discloses a magnetic field adjustable magnetron sputtering cathode, which comprises a target material, a back plate, a magnet device, a cathode bottom plate and a shielding plate, the magnet device is composed of multiple independent magnetic field modules in the length direction, each independent magnetic field module is connected with a fixed bottom plate fixed on the cathode bottom plate through an adjusting assembly, the adjusting assembly comprises an adjusting nut, an adjusting screw and a guide column, the adjusting nut is rotationally connected to the fixed bottom plate, the adjusting screw is threadedly connected with the adjusting nut, the adjusting screw is connected with the independent magnetic field module through the fixed bottom plate, the fixed bottom plate is provided with a guide hole, one end of the guide column is fixedly connected with the independent magnetic field module, and the other end of the guide column is matched with the guide hole. The magnet device is divided into multiple independent magnetic field modules in the height direction, each independent magnetic field module can be moved forward and backward through the adjusting nut, the distance between the front and the back of the magnetic field is adjusted, and the process production requirement that the film thickness is inconsistent in different regions in the height direction is realized.

Description

Technical Field

[0001] This invention relates to a magnetron sputtering coating apparatus, and more particularly to a magnetron sputtering cathode with an adjustable magnetic field. Background Technology

[0002] Magnetron sputtering vacuum deposition is a commonly used coating technology. In magnetron sputtering, a negative high voltage is applied to the target material, using the target as the cathode and the substrate as the anode. An electric field is formed between the target and the substrate, while a magnetic field is provided by magnetic poles on the back of the target. The interaction between the magnetic and electric fields confines electrons to a spiral trajectory near the target surface, continuously colliding with argon gas to generate ions. These argon ions, under the influence of the electric field, collide with the target surface, sputtering target atoms and depositing them on the substrate to obtain the desired thin film layer. Currently, planar magnetron sputtering cathodes are the most widely used in magnetron sputtering deposition technology. Traditional cathodes, due to their fixed magnetic field, cannot achieve different film thicknesses along the height direction of the substrate under the same conditions. Summary of the Invention

[0003] To address the shortcomings of the existing technologies, this invention provides a magnetron sputtering cathode with an adjustable magnetic field, achieving the process production requirement of inconsistent film thickness in different regions along the height direction.

[0004] The technical solution adopted in this invention is as follows: a magnetron sputtering cathode with adjustable magnetic field, comprising a target, a backplate, a magnet device, a cathode base plate, and a shielding plate. The magnet device consists of multiple independent magnetic field modules along its length. Each independent magnetic field module is individually connected to a fixed base plate fixed on the cathode base plate via an adjustment component. The adjustment component includes an adjustment nut, an adjustment screw, and a guide post. The adjustment nut is rotatably connected to the fixed base plate. The adjustment screw is threadedly connected to the adjustment nut and passes through the fixed base plate to connect with the independent magnetic field module. The fixed base plate is provided with a guide hole. One end of the guide post is fixedly connected to the independent magnetic field module, and the other end engages with the guide hole.

[0005] Furthermore, the guide post consists of a large-diameter section connected to the independent magnetic field module and a small-diameter section connected to the large-diameter section. The guide hole includes a large-diameter section on the side closer to the independent magnetic field module and a small-diameter section on the side farther from the independent magnetic field module. The large-diameter section of the guide post cooperates with the large-diameter section of the guide hole, and the small-diameter section of the guide post cooperates with the small-diameter section of the guide hole.

[0006] Furthermore, each of the aforementioned independent magnetic field modules is equipped with a scale rod as a reference for adjusting the distance.

[0007] Furthermore, each of the aforementioned independent magnetic field modules has the same length.

[0008] Furthermore, adjacent independent magnetic field modules are placed close together.

[0009] Furthermore, the adjustment distance of the independent magnetic field module is within 5mm.

[0010] This invention relates to an adjustable magnetron sputtering cathode, which changes the existing fixed mode to a front-to-back adjustable mode. Based on the target length and substrate process requirements, the magnet device is divided into multiple independent magnetic field modules along its height. Each independent magnetic field module is connected to a fixed base plate via guide posts and adjusting screws. Adjusting nuts allow the independent magnetic field modules to move back and forth, thereby adjusting the distance between the front and back of the magnetic field. The cathode adjusts the magnetic field strength at corresponding locations based on different film thicknesses on the substrate to control the glow intensity and energy level in those areas, achieving the required film thickness. The segmented guide posts and guide holes allow for control of the adjustment distance, and each segment has an independent scale rod as a reference for the adjustment distance, making adjustment convenient and reliable. Attached Figure Description

[0011] Figure 1 This is a side view of the present invention.

[0012] Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention. Detailed Implementation

[0013] To facilitate understanding of the present invention, the present invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of protection of the present invention is not limited to the following specific embodiments.

[0014] like Figure 1 , Figure 2 As shown, the magnetic field adjustable magnetron sputtering cathode of this embodiment includes a target material 1, a back plate 3, a magnet device, a cathode base plate 6, and a shielding plate 2. The magnet device is composed of multiple independent magnetic field modules 4 in the length direction. Each independent magnetic field module 4 has the same length and adjacent independent magnetic field modules 4 are close to each other.

[0015] Each independent magnetic field module 4 is individually connected to a fixed base plate 5 fixed on a cathode base plate 6 via an adjustment assembly. The adjustment assembly includes a fixed base plate 8, an adjustment screw 9, and a guide post 7. The fixed base plate 8 is rotatably connected to the fixed base plate 5. The adjustment screw 9 is threadedly connected to the fixed base plate 8 and passes through the fixed base plate 5 to connect with the independent magnetic field module 4. The fixed base plate 5 is provided with a guide hole. One end of the guide post 7 is fixedly connected to the independent magnetic field module 4, and the other end cooperates with the guide hole.

[0016] Each of the four independent magnetic field modules is equipped with a ruler rod as a reference for adjusting the distance.

[0017] The guide post 7 consists of a large-diameter section connected to the independent magnetic field module 4 and a small-diameter section connected to the large-diameter section. The guide hole includes a large-diameter section near the independent magnetic field module 4 and a small-diameter section away from the independent magnetic field module 4. The large-diameter section of the guide post 7 mates with the large-diameter section of the guide hole, and the small-diameter section of the guide post 7 mates with the small-diameter section of the guide hole. By coordinating the segmented guide post 7 and the guide hole, the adjustment distance can be controlled. In this embodiment, the adjustment distance of the independent magnetic field module 4 is within 5mm.

[0018] With the aid of the teachings present in the foregoing description and related drawings, those skilled in the art will conceive of many modifications and other embodiments of the invention. Therefore, it is to be understood that the invention is not limited to the specific embodiments disclosed, and modifications and other embodiments are considered to be included within the scope of the appended claims. Although specific terms are used herein, they are used in a general and descriptive sense only and are not intended to be limiting.

Claims

1. A magnetron sputtering cathode with adjustable magnetic field, comprising a target, a backplate, a magnet assembly, a cathode base plate, and a shielding plate, characterized in that: The magnet device consists of multiple independent magnetic field modules along its length. Each independent magnetic field module is individually connected to a fixed base plate fixed to a cathode base plate via an adjustment assembly. The adjustment assembly includes an adjustment nut, an adjustment screw, and a guide post. The adjustment nut is rotatably connected to the fixed base plate, and the adjustment screw is threadedly connected to the adjustment nut. The adjustment screw passes through the fixed base plate and connects to the independent magnetic field module. The fixed base plate has a guide hole. One end of the guide post is fixedly connected to the independent magnetic field module, and the other end mates with the guide hole. The guide post consists of a large-diameter section connected to the independent magnetic field module and a small-diameter section connected to the large-diameter section. The guide hole includes a large-diameter section near the independent magnetic field module and a small-diameter section away from the independent magnetic field module. The large-diameter section of the guide post mates with the large-diameter section of the guide hole, and the small-diameter section of the guide post mates with the small-diameter section of the guide hole. Each independent magnetic field module has a corresponding scale rod as a reference for adjusting the distance.

2. The magnetic field-tunable magnetron sputtering cathode as described in claim 1, characterized in that: Each of the individual magnetic field modules has the same length.

3. The magnetic field-tunable magnetron sputtering cathode as described in claim 1, characterized in that: Adjacent independent magnetic field modules are placed close together.

4. The magnetic field-tunable magnetron sputtering cathode as described in any one of claims 1-3, characterized in that: The adjustment distance of the independent magnetic field module is within 5mm.

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