aligning one or more carrier bodies and electronics by multiple alignment processes

Abstract

A method of mounting electronic devices (100) on one or more carrier bodies (102) is disclosed, wherein the method comprises providing a support body (104) having at least one first alignment mark (106); mounting the one or more carrier bodies (102) on the support body (104) by alignment between the at least one first alignment mark (106) and at least one second alignment mark (108) respectively possessed by the one or more carrier bodies (102); and subsequently mounting a plurality of electronic devices (100) on a respective one of the one or more carrier bodies (102) by alignment using the at least one second alignment mark (108).

Description

TECHNICAL FIELD

[0001] The present invention relates to a method of mounting electronic devices on one or more carrier bodies, and to a semi-finished product. BACKGROUND

[0002] A package can comprise electronic devices, such as semiconductor chips, mounted on a carrier, such as a leadframe. A package can be implemented as an encapsulated electronic device mounted on a carrier having electrical connections extending from the encapsulation material and coupled with peripheral electronic devices.

[0003] US 2006 / 0283011 Al discloses a method of mounting electronic devices on one or more carrier bodies, wherein the method comprises providing a support body having at least one first alignment mark; mounting the one or more carrier bodies each having at least one second alignment mark on the support body; and then mounting a plurality of electronic devices on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark. A plurality of alignment procedures are performed between the support body, the carrier bodies and the electronic devices.

[0004] DE 10 2009 059 236 Al discloses a method for manufacturing a semiconductor device, wherein a plurality of modules are provided. Each module comprises a carrier and at least one semiconductor chip attached to the carrier. US 2014 / 0242734 Al discloses a method of manufacturing a semiconductor device, comprising mounting at least a first semiconductor chip and a second semiconductor chip on die pads of a leadframe; and inspecting a mounting position of at least one of the first semiconductor chip and the second semiconductor chip, wherein the leadframe comprises a first mark formed to the die pads for indicating a first mounting area for the first semiconductor chip; and a second mark formed to the die pads for indicating a second mounting area for the second semiconductor chip, the first mark being different from the second mark. SUMMARY

[0005] It can be desirable to precisely mount electronic devices during the manufacture of a package.

[0006] According to one exemplary embodiment, a method of mounting electronic devices on one or more carrier bodies is provided, wherein the method comprises providing a support body having at least one first alignment mark; mounting the one or more carrier bodies on the support body by alignment between the at least one first alignment mark and at least one second alignment mark respectively possessed by the one or more carrier bodies; and mounting a plurality of electronic devices on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.

[0007] According to another exemplary embodiment, a method of mounting electronic devices on leadframe-type carrier bodies is provided, wherein the method comprises providing a support body; mounting a plurality of carrier bodies on the support body; mounting each of a plurality of electronic devices on a respective one of the carrier bodies; wherein the mounting comprises performing a plurality of alignment procedures between the support body, the carrier bodies and the electronic devices.

[0008] According to yet another exemplary embodiment, a semi-finished product is provided, the semi-finished product comprising: a support body having at least one first alignment mark; one or more carrier bodies mounted on the support body, each carrier body having at least one second alignment mark, wherein a correlation between the at least one first alignment mark and the at least one second alignment mark enables an alignment between the support body and the one or more carrier bodies; a plurality of electronic devices, each electronic device having at least one third alignment mark, and each electronic device being mounted on a respective one of the one or more carrier bodies, wherein a correlation between the at least one second alignment mark and the third alignment mark enables an alignment between the one or more carrier bodies and the electronic devices.

[0009] According to one exemplary embodiment, a manufacturing architecture for batch manufacturing a plurality of packages on panel level can be provided. According to such a manufacturing procedure, one or, preferably, a plurality of carrier bodies (e.g. leadframe bodies) can be mounted on a (in particular temporary) support body. An alignment between the one or more carrier bodies and the support body (which can be removed before the manufacturing of the packages is completed) can be achieved by detecting and comparing alignment marks formed on both the support body and the carrier bodies. Additionally, electronic devices to be mounted on the one or more carrier bodies can be aligned with respect to the associated carrier body by making use of the alignment marks of the carrier bodies which have already been used for aligning the carrier bodies with respect to the support body. By making use of the alignment marks of the carrier bodies (rather than the support body) for aligning the electronic devices with respect to the associated carrier body, the mounting tolerance of the electronic devices is limited only by the tolerance of the alignment marks of the carrier bodies, without additional limitations by the tolerance of the alignment marks of the support body. Thus, the described multi-level alignment procedure ensures a high positional accuracy and, thus, a high reliability of the packages to be manufactured.

[0010] According to one exemplary embodiment, the positioning accuracy of electronic device (in particular semiconductor dies) placement can be improved by the overlay of a plurality of (in particular global) alignment procedures. For (in particular leadframe-based) packages, a labor-saving panel-level packaging can be achieved.

[0011] Description of further exemplary embodiments

[0012] In the following, further exemplary embodiments of the method and the semi-finished product will be explained.

[0013] In the context of the present application, the term "electronic device" can particularly encompass semiconductor chips (in particular power semiconductor chips), active electronic devices (e.g. transistors), passive electronic devices (e.g. capacitors or inductors or ohmic resistors), sensors (e.g. microphones, light sensors or gas sensors), actuators (e.g. loudspeakers) and microelectromechanical systems (MEMS). In particular, an electronic device can be a semiconductor chip having at least one integrated circuit element (e.g. a diode or a transistor) at a surface portion thereof. The electronic device can be a bare die or can have already been packaged or encapsulated.

[0014] In the context of the present application, the term "carrier body" can particularly denote an object configured for mounting electronic devices thereon, in particular comprising or consisting of an electrically conductive material. For example, such a carrier body can be a preform of a plurality of individual carriers, each carrier being configured for carrying one or more electronic chips of a respective package. For example, the carrier body can be a leadframe, which can comprise (in particular integrally connected) an array of a plurality of leadframe units, each leadframe unit being configured for carrying and electrically connecting a respective electronic device (e.g. a semiconductor chip) of an assigned leadframe package. The carrier body can be separated into individual carriers (e.g. individual leadframe units) at the end of the manufacturing process of the package, i.e. after having mounted and electrically connected the electronic devices to the one or more carrier bodies (and optionally after having at least partially encapsulated the electronic devices and at least a portion of the one or more carrier bodies).

[0015] In the context of the present application, the term "support body" can particularly denote an object serving as a temporary support (e.g. a support plate) for carrying one or preferably a plurality of carrier bodies in a part of the process of manufacturing the package. The support body can be removed from the one or more carrier bodies with assembled electronic devices (optionally encapsulated) before or after separation or singulation into individual packages.

[0016] In the context of the present application, the term "alignment mark" can in particular denote any detectable (in particular optionally detectable) feature on or belonging to a respective body (in particular support body, carrier body, electronic device, intermediate carrier body and / or connection body) which is capable of providing alignment information about the assigned body, in particular with respect to another body. Thus, the alignment mark can be detected as a position and / or orientation reference of the assigned body, so that the body can be brought into a relative positioning or orientation with respect to another body. For example, such an alignment mark can be a specially formed dedicated feature for alignment on and / or in the assigned body. However, alternatively, also an inherent structural feature of the body can be detected as an alignment mark, for example an edge of an electronic device or a carrier body. While the detection of a physical feature of the body itself can be simple, since the alignment mark involves a higher precision, it can be preferred to form the alignment mark separately, specifically and dedicatedly.

[0017] In the context of the present application, the term "semifinished product" can in particular denote a structure comprising at least one support body, at least one carrier body and electronic devices forming preforms of a plurality of packages which are not yet readily manufactured and thus not yet separated.

[0018] It should be said that the numbering of the alignment marks (i.e. first alignment mark, second alignment mark, third alignment mark, fourth alignment mark, fifth alignment mark, etc.) is made in the present application only for the sake of clarity. Thus, the use of a larger number to denote a respective alignment mark (e.g. fifth alignment mark) does not necessarily imply that all alignment marks with a smaller number (e.g. first to fourth alignment mark) must exist. Thus, the numbering of the alignment marks is only made for the purpose of making them distinct from each other.

[0019] In one embodiment, the method comprises providing at least one third alignment mark for each of the plurality of electronic devices, wherein the operation of mounting the plurality of electronic devices on a respective one of the one or more carrier bodies comprises an alignment between the at least one second alignment mark and the third alignment mark. Advantageously, the electronic devices can also be provided with at least one respective alignment mark. Further advantageously, the alignment between the respective electronic device and the assigned carrier body can then be achieved by taking into account the relationship between the one or more alignment marks of the carrier body and the one or more alignment marks of the assigned electronic device. By taking such measures, a high precision can be achieved during the assembly of the electronic devices onto the assigned carrier bodies.

[0020] In one embodiment, the method comprises aligning between the at least one second alignment mark and the third alignment mark without taking into account the at least one first alignment mark. By aligning the electronic device relative to the carrier body by disregarding the one or more alignment marks of the support body, the cumulative effect of alignment tolerances between the support body and the carrier body and between the carrier body and the electronic device can be prevented. In contrast, by aligning the electronic device relative to the carrier body by taking into account the alignment marks of the carrier body and optionally the alignment marks of the electronic device, the cumulative effect of tolerances of various alignment procedures can be prevented resulting in a reduced overall accuracy of the positioning of the device.

[0021] In one embodiment, the method comprises detecting the at least one first alignment mark prior to mounting the one or more carrier bodies on the support body. Such detection can be optical detection, for example. For this purpose, a camera can capture an image of the support body to identify the one or more first alignment marks.

[0022] In one embodiment, the method comprises detecting the at least one second alignment mark prior to mounting the one or more carrier bodies on the support body. Again, the one or more second alignment marks of the one or more carrier bodies can be detected, for example, optionally by the same camera that also detects the first alignment marks. Alternatively, a separate camera can be used to detect the second alignment marks.

[0023] In one embodiment, the method comprises performing the alignment between the at least one first alignment mark and the at least one second alignment mark as a global alignment. Accordingly, the method can comprise performing the alignment between the at least one second alignment mark and the third alignment mark as a further global alignment. Thus, the two global alignment procedures can advantageously be combined in order to assemble the device with high precision on the respective carrier body.

[0024] Preferably, a further global alignment procedure involving the relationship between the at least one second alignment mark of the carrier body and the third alignment mark of the electronic device can be added in order to further improve the positional accuracy.

[0025] In one embodiment, the method comprises mounting one or more connectors each having at least one fourth alignment mark on the one or more carrier bodies to electrically connect the electronic devices with the respective carrier bodies. For example, in case the electronic devices are power semiconductor chips having a vertical current flow, it can be preferred to electrically connect the upper main surface of the assembled electronic device with the upper main surface of the carrier body on which the electronic device is mounted. In one embodiment, this can be achieved by forming a wire connection or a wire strip, i.e. individually for each electronic device. However, in order to further increase the yield and to further facilitate a batch manufacturing architecture, it is also possible to integrally connect a common connector to the electronic devices and to the assigned carrier bodies. Such a connector can comprise a plurality of connection elements, each configured for electrically coupling the upper main surface of the respective electronic device with the upper main surface of the assigned carrier body. In order to efficiently and precisely perform such a batch procedure of electrically coupling the electronic devices with the assigned carrier bodies, one or more further alignment marks can be provided at the connector. The alignment between the connector and the assigned carrier bodies can then be achieved by considering the correlation between the alignment marks of both the carrier bodies and the connector.

[0026] In one embodiment, each connector is a clip frame. When the connector is a clip frame, an integral structure can be attached to each carrier body, thereby providing at least one clip for each electronic device. When the clip frame is connected to the assigned carrier body, the clips of the clip frame can be interconnected. Such clips can be curved conductive bodies which achieve an electrical connection between the upper main surface of the respective electronic device and the upper main surface of the respective carrier body with a high connection area. When the obtained structure is singulated to form individual packages, the connector can also be separated into, for example, individual clips. Optionally, at least one further electronic device can be mounted on the connector.

[0027] In one embodiment, the method comprises mounting the one or more connectors on the one or more carrier bodies by alignment between the at least one second alignment mark and the at least one fourth alignment mark. Thus, a high positional accuracy can be achieved between the connector and the assigned carrier body, and thus between the respective connection element of the connector and the assigned electronic device on the respective carrier body.

[0028] In an embodiment, the method comprises encapsulating at least a portion of the electronic device and at least a portion of the one or more carrier bodies by an encapsulation material. For example, the encapsulation material comprises or consists of a molding compound. In the context of the present application, the term "encapsulation material" can particularly denote a substantially electrically insulating and preferably thermally conductive material that surrounds, e.g. hermetically surrounds, a portion of the electronic device and optionally the carrier or carrier body to provide mechanical protection, electrical insulation and optionally to facilitate heat dissipation during operation. Such an encapsulation material can for example be a molding compound. When encapsulation is performed by molding, e.g. injection molding or transfer molding can be performed. Thus, the encapsulation material can comprise a molding material, in particular a plastic molding material. For example, a respective encapsulated structure, in particular an electronic device with a carrier or carrier body, can be provided by placing the structure between an upper molding tool and a lower molding tool and injecting a liquid or particulate molding material thereinto. After the molding material has hardened, the formation of the encapsulation material is completed. If desired, the molding material can be filled with particles that improve its properties, e.g. its heat dissipation properties. Other encapsulation materials can also be used.

[0029] In an embodiment, the method comprises mounting a plurality of electronic devices on an intermediate carrier body having at least one fifth alignment mark by aligning considering the mounting position and orientation of the at least one carrier body and subsequently transferring the electronic devices from the intermediate carrier body to the one or more carrier bodies by aligning using the at least one fifth alignment mark. Thus, individual separate electronic devices can for example be picked from a diced or sawn wafer and placed on predetermined positions on the intermediate carrier body. The positions at which the individual separate electronic devices are placed in this process can be determined by considering the alignment result between the support and the one or more carrier bodies. For example, if the carrier bodies are arranged on the support with a certain spatial error, this spatial error can be detected or determined based on the identified alignment marks of the support and / or the carrier bodies. This in turn can allow to determine at which position on the intermediate carrier body an electronic device is to be mounted to ensure that after connecting the intermediate carrier body with the attached electronic devices to the carrier bodies on the support, the electronic devices are arranged in the correct position so that they can be correctly connected with the respective carrier bodies. To ensure correct alignment, the intermediate carrier body can also be provided with one or more respective alignment marks. Thus, the electronic chips can also be aligned with respect to the assigned carrier bodies.

[0030] In one embodiment, the method comprises picking up a plurality of electronic devices from the singulated wafer and transferring the picked up electronic devices, in particular simultaneously, to an intermediate carrier body. On the disc-shaped wafer, the electronic devices can be arranged in a circular pattern. Transferring the individual electronic devices from the wafer to the intermediate carrier body can involve reordering the electronic devices, e.g. from the circular pattern on the wafer to one or more rectangular patterns on the one or more carrier bodies.

[0031] The method comprises separating the one or more carrier bodies and the electronic devices into individual packages, each package comprising a portion of one of the one or more carrier bodies and at least one of the electronic devices. In the context of the present application, the term "package" can in particular denote an electronic device comprising one or more electronic devices mounted on a carrier, i.e. a segment of the previous carrier body, and optionally encapsulated using an encapsulation material. Further optionally, one or more electrically conductive contact elements or interconnect structures, e.g. connection wires or clips, can be implemented in the package, e.g. for electrically coupling the electronic devices with the carrier. The separation can be achieved, e.g. by mechanical cutting, laser cutting and / or chemical or plasma etching.

[0032] After the separation or singulation, a plurality of packages can be obtained, each package comprising at least a portion of a respective carrier body and at least one electronic device mounted on the segment of the carrier body. Optionally, each package can further comprise the encapsulation material encapsulating the electronic devices and that portion of the carrier body. Further optionally, each package can comprise a segment of the above-mentioned connection body, e.g. a connection element such as a clip. Differently from this, the support body can be a temporary support body, which can be removed from the carrier body prior to singulation. Alternatively, a portion of the support body can also form a portion of the package to be manufactured.

[0033] In one embodiment, the method comprises forming at least a portion of the alignment mark by at least one of the group consisting of etching, printing, laser slotting, drilling, engraving and stamping. However, any other procedure for forming the alignment mark is possible.

[0034] In one embodiment, the method comprises mounting the electronic devices on the carrier structure by at least one of the group consisting of soldering, sintering, welding and gluing. Thus, the electronic devices can be mounted on their mounting areas by at least one of the group consisting of solder structures, sinter structures and weld structures. The electronic devices can also be adhesively mounted on the mounting areas.

[0035] In an embodiment, each of the one or more carrier bodies comprises at least one leadframe. In particular, each carrier body can be separated into a separate leadframe-type carrier such that each carrier comprises a die pad and a plurality of leads. In other words, a patterning or structuring process can be performed in order to define a separate leadframe portion for each subsequent package. In such an embodiment, a respective electronic device can be mounted on the die pad. The leads can extend in an outward direction from the die pad and can be separated from the die pad to serve as terminals for electrically contacting the encapsulated electronic device after encapsulation. The electrical coupling between the electronic device and the leads can be achieved by a connection structure such as a clip or a connecting wire which can electrically bridge and thereby couple a main surface of the electronic device with a contact surface of a respective one of the leads.

[0036] Thus, the leadframe can comprise a set of pads, e.g. die pads, and additionally one or more bond pads. The leadframe can be a sheet-like metal structure which can be patterned to form one or more die pads or mounting sections for mounting the one or more electronic devices of the package and one or more lead sections for forming electrical connections of the package to a peripheral electronic environment when the electronic devices are mounted on the leadframe. In an embodiment, the leadframe can be a metal plate, in particular made of copper, which can be patterned, e.g. by etching or laser treatment. Forming the device carrier as a leadframe is a cost-effective and mechanically and electrically advantageous configuration in which the low-ohmic connection of the at least one electronic device can be combined with the robust support capabilities of the leadframe. Furthermore, due to the high thermal conductivity of the metal, in particular copper, material of the leadframe, the leadframe can contribute to the thermal conductivity of the package and can remove heat generated during operation of the electronic devices. The leadframe can comprise, e.g., aluminum and / or copper.

[0037] However, many different carrier bodies and carriers can be used with different embodiments and the described leadframe is only one example.

[0038] In an embodiment, each of the one or more carrier bodies comprises a plurality of recesses, in particular imprinted or etched recesses, each configured for accommodating a respective one of the electronic devices. By etching or imprinting cavities, a correct positioning of the electronic devices on the respective carrier bodies can be further simplified.

[0039] At least one of the group consisting of the support body and the one or more carrier bodies comprises at least two different sets of alignment marks, which different sets are distinguishable due to having different properties. In particular, the different sets can comprise a first set having a larger spatial extension than a second set, the first set being used for coarse alignment and the second set being used for fine alignment. The different properties can for example be different shapes and / or sizes of the various alignment marks. By providing different sets of alignment marks on the respective bodies, different stages of alignment can advantageously be performed on this basis. This further improves the accuracy. In such embodiments, coarse alignment using the first set of alignment marks can advantageously be combined with fine-tuning of the alignment by taking into account the second set of alignment marks. Thus, the accuracy of the position placement of the electronic device relative to the assigned carrier body can be further improved.

[0040] In one embodiment, at least a portion of the alignment marks comprises or consists of one or more circular features. It has proven that circular alignment marks can be better protected against artefacts during the manufacturing process.

[0041] In one embodiment, at least a portion of the alignment marks comprises at least one of the following group: alignment marks which are flush with the surrounding surface, alignment marks which are elevated relative to the surrounding surface, alignment marks which are sunken relative to the surrounding surface, and alignment marks which extend through the surrounding surface as a through-hole. Since all of the mentioned alternatives are compatible with the optical detection of the alignment marks, there is a high degree of freedom in designing and forming the alignment marks during the manufacturing process.

[0042] In one embodiment, the at least one first alignment mark and the at least one second alignment mark are distinguishable by having different properties. For example, the different properties can be different shapes and / or sizes. For example, the at least one first alignment mark can have a larger spatial extension than the at least one second alignment mark. For example, the first alignment mark having the larger spatial extension can be correctly detected by a camera which captures an image of a larger area of the semi-finished product. In contrast thereto, the second alignment mark having the smaller spatial extension can for example be detected by capturing an image of only a portion of the semi-finished product for a more precise alignment.

[0043] In one embodiment, the support body can be a support plate. For example, such a support plate can be made of glass, plastic, ceramic or a sufficiently thick metal in order to correctly support the one or more carrier bodies during the assembly of the electronic device and optionally during the encapsulation. After the support function has been fulfilled (for example, after the encapsulation has been completed), the temporary support plate can again be removed from the structure, since the completion of the encapsulation makes the structure sufficiently robust even without the temporary support plate. The temporary support plate can then be reused or recycled for another manufacturing process or it can be discarded.

[0044] In one embodiment, the assembled electronic device can be electrically connected to the associated carrier body by means of a clip, a connecting wire and / or a connecting band. The clip can be a three-dimensionally curved plate-shaped connecting element having two planar sections to be connected to the upper main surface of the respective electronic device and the upper main surface of the carrier body, wherein the two planar sections can be interconnected by means of an inclined or vertical connecting section. As an alternative to such a clip, a wire connection structure or a band connection structure can be used, which is a flexible electrically conductive wire or a band-shaped body, one end of which is connected to the upper main surface of the respective electronic device and the other, opposite end is electrically connected to the carrier body.

[0045] In one embodiment, the at least one electronic device is subjected to a vertical current flow during operation. The package configuration according to the exemplary embodiments is particularly suitable for high-power applications requiring a vertical current flow, i.e. a current flow in a direction perpendicular to the two opposite main surfaces of the electronic device, one of which is used for mounting the electronic device on the carrier body and the other of which is used for connecting the electronic device with the clip, the connecting wire or the connecting band.

[0046] In one embodiment, the at least one electronic device comprises at least one of the group consisting of a controller circuit, a driver circuit and a power semiconductor circuit. All these circuits can be integrated into one semiconductor chip or can be integrated separately in different chips. For example, the respective power semiconductor application can be implemented by means of a chip, wherein the integrated circuit elements of such a power semiconductor chip can comprise at least one transistor, in particular a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), at least one diode, etc. In particular, circuits implementing a half-bridge function, a full-bridge function, etc. can be manufactured.

[0047] As a substrate or wafer for the semiconductor chip, a semiconductor substrate, i.e. a silicon substrate, can be used. Alternatively, a silicon oxide or another insulator substrate can be provided. A germanium substrate or a III-V semiconductor material can also be implemented. For example, the exemplary embodiments can be implemented in GaN or SiC technology.

[0048] The above and other objects, features and advantages of the present application will become more apparent from the following description when taken in conjunction with the accompanying drawings, in which like reference characters refer to like parts throughout the figures, and in which: BRIEF DESCRIPTION OF DRAWINGS

[0049] The accompanying drawings, which are included to provide a further understanding of the exemplary embodiments of the application and are incorporated in and constitute a part of this specification, illustrate the exemplary embodiments of the application.

[0050] In the drawings:

[0051] Figure 1A block diagram of a method of mounting electronic devices on one or more carrier bodies according to one exemplary embodiment is shown.

[0052] Figure 2 A block diagram of a method of mounting electronic devices on a carrier body according to another exemplary embodiment is shown.

[0053] Figure 3 A cross-sectional view of a semi-finished product according to another exemplary embodiment is shown.

[0054] Figure 4 and Figure 5 A structure obtained during execution of a method of mounting electronic devices on a carrier body according to one exemplary embodiment is shown.

[0055] Figures 6 to 13 A structure obtained during execution of a method of mounting electronic devices on one or more carrier bodies according to another exemplary embodiment is shown.

[0056] Figure 14 A cross-sectional view of a semi-finished product according to one exemplary embodiment is shown.

[0057] Figure 15 A cross-sectional view of a support body with different sets of alignment marks according to one exemplary embodiment is shown. DETAILED DESCRIPTION

[0058] The illustrations in the drawings are schematic and not drawn to scale.

[0059] Before exemplary embodiments are described in detail, some general considerations based on exemplary embodiments that have been developed will be summarized.

[0060] Due to large panel sizes combined with parallel processing, panel level packaging can be realized with lower packaging effort. For a leadframe package, the thickness of a leadframe type carrier body is in many cases very high. Therefore, a half-etched leadframe can not be the first choice, but a stamped leadframe can be desirable to be used as a carrier body for electronic devices such as semiconductor chips. Such a stamped leadframe as a carrier body can be smaller than a panel size. Therefore, it can be desirable to place multiple leadframe type carrier bodies on a support body (or panel size carrier). In order to place electronic devices (in particular dies) on the leadframe type carrier bodies later on, a suitable alignment method for both the panel level support body and the leadframe type carrier bodies can be advantageous as provided by exemplary embodiments.

[0061] Conventionally, leadframe-based packages are typically not packaged on panel levels with panel sizes larger than standard leadframe sizes, in particular maximum 100 mm x 300 mm. Conventional panel-related packaging techniques typically do not use leadframes as packaging carriers, but rather complex advanced packages such as fan-out packages.

[0062] For molded packages with leadframe-type carrier bodies, panel-level processing has traditionally been considered problematic in view of the fact that the size of leadframes is typically limited. For stamping, the maximum leadframe size available can be 150 mm x 600 mm, which is already an exceptional size. For etched leadframes, the size can be larger, but the thickness of the leadframes can be limited due to the etching process.

[0063] One exemplary embodiment provides a process using leadframe-type carrier bodies, in particular stamped, which can be formed with lower manufacturing effort, combined into a large panel format using a common support body, and involves parallel manufacturing processes with higher cost efficiency and lower effort. More particularly, exemplary embodiments provide a very beneficial alignment strategy for such panel-level package manufacturing architectures.

[0064] According to one exemplary embodiment, an alignment procedure is provided for packaging (in particular leadframe-based) packages in a panel format, preferably using a plurality of carrier bodies, which can be leadframes, either stamped or etched. Stamped leadframes can be mass-produced with low technical investment and can allow the use of thick metal.

[0065] In one embodiment, a plurality of carrier bodies, e.g. integral leadframe structures, can be placed on a support body by a pick-and-place process. The one or preferably the plurality of carrier bodies, in particular leadframe-type, can be equipped with alignment marks, and preferably a plate-like support body. On the support body, the plurality of alignment marks can be at different positions and have the same, similar or different shapes. The alignment system of the respective pick-and-place tool can recognize the alignment marks before placing the carrier bodies on the support body. In addition, the one or more carrier bodies can have alignment marks. The pick-and-place equipment can also detect those alignment marks before placement, and can then place the respective carrier bodies on the support body according to the alignment of the two alignment marks described above. This step can be repeated for all carrier bodies to be placed on the support body, if applicable.

[0066] In the following procedure, placement of electronic devices (e.g. dies) can be performed. For example, an interconnect material such as solder, glue, flux, sinter paste or the like can be applied to connect to the electronic devices on the one or more carrier bodies. Now, the pick-and-place system can be aligned on the respective carrier body and on the electronic devices for attaching the electronic devices to the carrier body (in particular for attaching dies to lead frames). In order to keep low tolerances, it can be advantageous to align on the carrier body for placing the electronic devices, without aligning on the panel level support. For example, the pick-and-place process can have a placement accuracy of e.g. ±25 pm in order to achieve high speed. If the two placements (i.e. placement of the carrier body such as a lead frame and the electronic devices such as dies) are performed aligned on the support only, the tolerances can increase which leads to a placement tolerance of e.g. ±50 pm. In case of strict design rules and subsequent processes, this can exceed the specification limits of e.g. a lead frame based package of ±25 pm. In order to achieve a precise placement of the electronic devices, alignment on the carrier body for device attachment can be preferred, but since the positioning of the carrier body on the support also provides tolerances, both different alignment systems can be used for panel based (in particular lead frame) packaging. Advantageously, in view of the described alignment architecture, the alignment tolerances can not increase for precise packaging, thus, covering multiple global alignment systems can be highly preferred.

[0067] Figure 1 A block diagram of a method of mounting electronic devices 100 on one or more carrier bodies 102 according to one exemplary embodiment is shown. With respect to the mentioned reference numerals, reference is made to Figure 3 .

[0068] As shown in block 200, the method comprises providing a support 104 having at least one first alignment mark 106.

[0069] With respect to subsequent block 210, the method can further comprise mounting the one or more carrier bodies 102 each having at least one second alignment mark 108 on the support 104 by alignment between the at least one first alignment mark 106 and the at least one second alignment mark 108.

[0070] As shown in subsequent block 220, the method further comprises mounting the plurality of electronic devices 100 on a respective one of the one or more carrier bodies 102 by alignment using the at least one second alignment mark 108.

[0071] Figure 2 A block diagram of a method of mounting electronic devices 100 on a lead frame type carrier body 102 according to another exemplary embodiment is shown. With respect to the mentioned reference numerals, reference is made toFigure 3 .

[0072] As shown in block 230, the method comprises providing a support 104.

[0073] The subsequent block 240 shows that the method further comprises mounting the carrier bodies 102 on the support 104.

[0074] In addition, the subsequent block 250 indicates that the method additionally comprises mounting each of the electronic devices 100 on a respective one of the carrier bodies 102.

[0075] As shown in block 260, said mounting comprises performing a plurality of alignment procedures between the support 104, the carrier bodies 102 and the electronic devices 100.

[0076] Figure 3 A cross-sectional view of a semi-finished product 130 according to another exemplary embodiment is shown.

[0077] The semi-finished product 130 comprises a support 104 having first alignment marks 106. In addition, a carrier body 102 is mounted on the support 104. The carrier body 102 comprises a plurality of second alignment marks 108. The correlation between the first alignment marks 106 and the second alignment marks 108 enables alignment between the support 104 and the carrier body 102.

[0078] In addition, the semi-finished product 130 comprises a plurality of electronic devices 100, each having third alignment marks 110, and each mounted on the carrier body 102. The correlation between the second alignment marks 108 and the third alignment marks 110 enables alignment between the carrier body 102 and the electronic devices 100.

[0079] Figure 4 and Figure 5 A structure obtained during the execution of a method for mounting electronic devices 100 on carrier bodies 102 according to one exemplary embodiment is shown. According to Figure 4 and Figure 5 The two procedures shown indicate a procedure for alignment according to one exemplary embodiment.

[0080] Reference is made to Figure 4The support body 104 is provided with first alignment marks 106. Furthermore, a plurality of carrier bodies 102 each having second alignment marks 108 is mounted on the support body 104 by global alignment between the first alignment marks 106 and the second alignment marks 108. The first alignment marks 106 are optically detected prior to mounting the carrier bodies 102 on the support body 104. Furthermore, the second alignment marks 108 are optically detected prior to mounting the carrier bodies 102 on the support body 104. For example, the alignment marks 106, 108 can be formed by etching, printing, laser grooving, drilling, milling and / or punching.

[0081] In a first alignment procedure according to Figure 4 , a first global alignment between the leadframe-type carrier bodies 102 and the support body 104 is performed. The optically detected alignment marks 106 of the support body 104 are detected by a vision system which is schematically shown. Then, a pick-and-place device can place the carrier bodies 102, which are embodied as leadframes, accordingly on the assigned surface areas of the plate-like support body 104.

[0082] Figure 4 Components of a device for performing a pick-and-place procedure for manufacturing packages based on the semi-finished product 130 shown in Figure 5 are also shown. As shown, the device comprises an optical detection unit 190, e.g. a camera (e.g. a CMOS camera or a CCD camera), as a vision system. The optical detection unit 190 can capture images of the entire surface or a portion of the surface of the structure shown in Figure 4 ( and Figure 5 ). Then, the obtained image data can be transferred to an image recognition unit 192. The image recognition unit 192 can be configured for recognizing various alignment marks 106, 108, etc. by performing an image recognition algorithm, for example. Then, a control unit 194 can use the positions of the recognized alignment marks 106, 108 and, optionally, the respective assigned relationship of the detected alignment marks 106, 108 to the support body 104 or the respective carrier body 102 to control the pick-and-place procedure to be performed based on the alignment results and, thus, to perform the pick-and-place procedure with high precision.

[0083] Figure 4 An example of a plurality of relatively small carrier bodies 102 (i.e. leadframes) on a larger panel-type support body 104 is shown. In the shown example, a single support body 104 is equipped with four carrier bodies 102. The alignment with respect to the respective alignment marks 106 of the support body 104 is performed for all leadframe-type carrier bodies 102 having assigned alignment marks 108 in order to perform the placement.

[0084] Reference is made to Figure 5The mounting of the plurality of electronic devices 100, in particular semiconductor chips, on a respective one of the carrier bodies 102 involves a registration with the second registration marks 108 (and optionally with the third registration marks, see Figure 3 the reference 110 in may be provided on the electronic devices 100). The mounting of the electronic devices 100 on the carrier bodies 102 can be carried out, for example, by soldering, sintering, welding and / or gluing.

[0085] Preferably, a global registration between the carrier bodies 102 and the electronic devices 100 can be carried out without taking the first registration marks 106 into account, thus avoiding undesirably increasing individual tolerances. Thus, the accuracy of the pick-and-place method is higher.

[0086] In a second partial procedure of the registration according to Figure 5 The electronic devices 100 are placed on the carrier bodies 102, in particular the lead frames. Now, the registration marks 108 of the individual carrier bodies 102 serve as global registration marks for placing the different electronic devices 100. The vision system of the pick-and-place apparatus detects the registration marks 108 of the carrier bodies 102 and places the electronic devices 100 accordingly. The electronic devices 100 can also be provided with registration marks Figure 5 not shown in Figure 3 the third registration marks 110 in The global registration on the carrier bodies 102 serves to position the plurality of electronic devices 100.

[0087] Figure 5 Still referring to , the placement of die-type electronic devices 100 on small carrier bodies 102, in the shown embodiment lead frame type, on a larger panel-type support 104 is shown. In the shown example, two electronic devices 100 are mounted on each carrier body 102.

[0088] Figure 5 Thus, a semi-finished product 130 as shown in is obtained. The semi-finished product 130 comprises a support 104 with first registration marks 106. Carrier bodies 102 are mounted on the support 104. Each carrier body 102 is provided with an associated second registration mark 108. The correlation between the first registration marks 106 and the second registration marks 108 enables a registration between the support 104 and the carrier bodies 102. Furthermore, each of the plurality of electronic devices 100 is mounted on a respective one of the carrier bodies 102. The second registration marks 108 enable a registration between the carrier bodies 102 and the electronic devices 100.

[0089] The alignment marks 106, 108 (and optionally 110) can comprise circular features, which are more reliable against large tolerances and inaccuracies. For example, the alignment marks 106, 108 (and optionally 110) can be coplanar with the surrounding surface, can be elevated with respect to the surrounding surface (as shown), can be lowered with respect to the surrounding surface, and / or can extend as through-holes through the surrounding surface. For example, the first alignment marks 106 and the second alignment marks 108 can be optically distinguishable by having different properties such as different shapes and / or different sizes and / or different colors. In the shown embodiment, the first alignment marks 106 have a larger spatial distance between each other than the second alignment marks 108.

[0090] On one or both of the support plate 104 and the carrier body 102, two or more groups of alignment marks 106, 108 (not shown, see Figure 15 ) can also be used. For example, a first large group can be used for coarse alignment, while a second small group can be used for fine alignment.

[0091] The alignment marks 106, 108 on the support plate 104 and the carrier body 102 can be formed by etching, printing, laser slotting, drilling, milling, stamping, or otherwise. They can be coplanar with the respective surface, raised, recessed, or even holes. Circular features or patterns consisting of multiple circular features can be preferred for etched marks, as center detection can be less affected by etching tolerances. If recognition is done by pattern comparison, patterns with large areas and clear symbols are preferred. Preferably, the first alignment marks 106 of the support plate 104 can be different from the second alignment marks 108 of the carrier body 102. The sizes of the alignment marks 106, 108 can also be different. Thus, a first detection on the support plate 104 can use larger alignment marks 106, which can be detected by a detection system with a wider field of view, while the second alignment marks 108 on the carrier body 102, which mainly affect the placement accuracy, are smaller and visible for a smaller field of view but higher resolution.

[0092] Although not shown in Figure 4 and Figure 5 , the method can comprise encapsulating the electronic device 100 and a portion of the carrier body 102 by an encapsulation material such as a molding compound. Thereafter, the batch manufacturing method can comprise separating the carrier body 102 and the electronic device 100 encapsulated by the encapsulation material into individual packages, each package comprising a portion of the carrier body 102 and one of the electronic devices 100 and a portion of the encapsulation material (not shown).

[0093] Again referring to Figure 4 and Figure 5High-precision placement of the electronic devices 100 on the carrier bodies 102 can be achieved by first aligning the carrier bodies 102 relative to the support 104 and then aligning the electronic devices 100 relative to the carrier bodies 102 (and not relative to the support 104). By taking this measure, undesired increases in tolerances can be avoided, and thus high spatial precision can be achieved.

[0094] Figures 6 to 13 A structure obtained during execution of a method of mounting electronic devices 100 on carrier bodies 102 is shown according to another exemplary embodiment.

[0095] Referring to Figure 6 , a plate-shaped support 104 is shown having first alignment marks 106 at opposite corners.

[0096] Referring to Figure 7 , four leadframe-type carrier bodies 102 having second alignment marks 108 at opposite corners are placed on the support 104. Misalignment of the carrier bodies 102 relative to the first alignment marks 106 of the support 104 can be measured optically, for example, based on the alignment marks 106, 108. As Figure 7 schematically shown in , each leadframe-type carrier body 102 can comprise a plurality of still integrally connected leadframe units 134, each configured for mounting one or more electronic devices 100 of a respective package. Upon singulation, each carrier body 102 can then be separated into individual leadframe units 134.

[0097] Figure 8 Referring to Figure 8 , the electronic devices 100 (in particular electronic chips) can be transferred from a wafer 180 to an intermediate carrier body 170. A protective foil 174 can be attached to the intermediate carrier body 170. Still referring to , the electronic devices 100 of the wafer 180 should be assembled to the carrier bodies 102 for manufacturing of packages. Although not shown, a pick-and-place apparatus can pick up individual electronic devices 100 from the circular array of sawn wafer 180 and can place them on a main surface of the plate-shaped intermediate carrier body 170.

[0098] Figure 9 Referring to Figure 7The data of the performed measurements are used to perform an adjustment of the placement position of the electronic chips 100. The method can comprise picking up the circularly arranged plurality of electronic devices 100 from the wafer 180 and transferring the picked-up electronic devices 100 to the intermediate carrier body 170 in a rectangular pattern. In other words, the picked-up electronic devices 100 can be placed on the intermediate carrier body 170 according to the arrangement of the carrier bodies 102 on the support plate 104. The electronic devices 100 are thereby mounted on the intermediate carrier body 170, which intermediate carrier body 170 is provided with the alignment marks 172. The respective alignment can take into account the mounting position and orientation of the carrier bodies 102 on the support 104. Accordingly, the intermediate carrier body 170 is also equipped with alignment marks 172, which can be optically detected. Accordingly, the placement of the electronic devices 100 on the intermediate carrier body 170 can be done taking into account the alignment relationship between the (slightly misaligned) carrier bodies 102 placed on the support 104. In other words, the electronic devices 100 are intentionally placed on the intermediate carrier body 170 in the same misaligned state as the carrier bodies 102 were arranged on the support 104 according to. This can be achieved by comparing the alignment marks 108 of the carrier bodies 102 with the alignment marks 106 of the support 104 and by taking into account the relationship between the alignment marks 172 of the intermediate carrier body 170 and the alignment marks 108 of the carrier bodies 102. Illustratively, the electronic devices 100 are attached to the intermediate carrier body 170 according to the misalignment of the carrier bodies 102 on the support 104. Accordingly, by placing the electronic devices 100 accordingly on the intermediate carrier body 170, the misalignment of the carrier bodies 102 on the support 104 has been remedied. This allows to combine all electronic devices 100 on the intermediate carrier body 170 in the assigned positions of the carrier bodies 102. Figure 7

[0099] Reference is made to Fig. 1 1, which shows the intermediate carrier body 170 with the attached electronic devices 100 in a perspective view. Figure 10 The electronic devices 100 are transferred from the intermediate carrier body 170 to the carrier bodies 102. The respective alignment procedure can make use of the alignment marks 172 of the intermediate carrier body 170. Illustratively, the combination of the support 104 and the intermediate carrier body 170 can be done by using the alignment marks 172.

[0100] In Fig. 12, the batch assembly procedure, which will be referred to later, is shown. Figure 10 The arrangement between the intermediate carrier body 170 with the attached electronic devices 100 and the carrier bodies 102 on the support 104 is shown in an oblique top view. Figure 10

[0101] An oblique bottom view of the arrangement according to Fig. 1 1 is shown. Figure 11 Figure 10

[0102] Figure 12 ​​​The result of the attachment of the intermediate carrier body 170 (with mounted electronic device 100) on the support 104 (with mounted carrier body 102) is shown. The foil 174 can be removed from the intermediate carrier body 170.

[0103] Figure 13 The result of the manufacturing procedure according to Figure 11 and Figure 12 is schematically shown, wherein the electronic device 100 is correctly mounted on the carrier body 102, which is mounted on the support 104 in some misalignment state. However, the relationship between the electronic device 100 and the carrier body 102 is achieved with high positional accuracy, on the one hand due to the alignment result of the alignment between the support 104 and the carrier body 102, and on the other hand due to the alignment result of the alignment between the intermediate carrier body 170 and the carrier body 102. Again, high positioning accuracy can be guaranteed by the described procedure.

[0104] Figure 14 A cross-sectional view of a semi-finished product 130 according to one exemplary embodiment is shown.

[0105] The semi-finished product 130 according to Figure 14 can be obtained by mounting a connecting body 112 on a respective one of the carrier bodies 102 to electrically connect the electronic device 100 with the respective carrier body 102, each connecting body 112 having one or more alignment marks 114. In the shown embodiment, each connecting body 112 is a clip frame. More precisely, the connecting body 112 can be mounted on the carrier body 102 by alignment between the alignment marks 108 of the carrier body 102 and the alignment marks 114 of the connecting body 112.

[0106] Hence, the described embodiments use a further set of alignment marks 114. For example, the clip frame or any other connecting body 112 comprising this further set of alignment marks 114 is placed on the lead frame type carrier body 102 after (e.g. first) attaching the electronic device 100. Both latter procedures can use the set of alignment marks 108 on the carrier body 102.

[0107] If desired, a second electronic device (e.g. another semiconductor chip) can be incorporated on top of the clip using the alignment marks 114 for alignment on the clip frame type connecting body 112 (and the second electronic device can optionally contain at least one further alignment mark, not shown). The wire connections can now use the marks on the last electronic device (not shown).

[0108] Figure 14An embodiment is shown, in which the connection body 112, configured as a clip frame, has been mounted on each respective carrier body 102 to achieve an electrically conductive connection between the upper main surface of each electronic device 100 and the assigned carrier body 102.

[0109] After singulation (before the temporary support 104 can be removed), individual packages 124 can be obtained. Each package comprises a segment of the respective carrier body 102, the respective electronic device 100 and the respective clip as a separate piece of the clip frame type connection body 112.

[0110] In Figure 14 the first alignment marks 106 have larger spatial extension dimensions D1, D2 than the second alignment marks 108 having smaller spatial extension dimensions d1, d2, i.e. D1 > d1 and / or D2 > d2. In this example, D1 and d1 denote diameters of the respective alignment marks 106, 108, while D2 and d2 denote maximum distances between the respective types of alignment marks 106, 108. This simplifies the correct assignment of the detected alignment marks 106, 108 to the support 104 or carrier body 102.

[0111] Figure 15 A cross-sectional view of a support 104 with different sets 138, 140 of alignment marks 106 according to one exemplary embodiment is shown.

[0112] According to Figure 15 the support 104 comprises two different sets 138, 140 of alignment marks, which can be distinguished by having different properties. For example, the different sets 138, 140 comprise a first set 138 having larger spatial extension dimensions than a second set 140. The first set 138 can be used for coarse alignment, the second set 140 can be used for fine alignment. More specifically, the first set 138 has larger spatial extension dimensions D1, D2 than the second set 140 having smaller spatial extension dimensions d1, d2, i.e. D1 > d1 and / or D2 > d2. In this example, D1 and d1 denote diameters of the respective alignment marks 106, while D2 and d2 denote maximum distances between the respective alignment marks 106 of the respective sets 138, 140.

[0113] Thus, Figure 15 A set 138 of alignment marks 106 is shown having large spatial dimensions and large spatial distances and can be used for coarse alignment in a first stage. For this purpose, a camera or the like with a large angle of view can capture Figure 15An image of the entire main surface of the structure shown. A coarse alignment can be made based on the result. To further improve the accuracy, the alignment marks 106 can then be precisely aligned by a second set 140, which can detect only a smaller viewing angle and thus only detect Figure 15 A more precise camera detection of a part of the structure shown. By combining the alignment information derived from aligning the alignment marks 106 by the first set 138 and the second set 140, the accuracy of the alignment can be further improved, and thus the accuracy of the placement or assembly process can be further improved.

[0114] It should be noted that the term "comprising" does not exclude other elements or features and "a" or "one" does not exclude a plurality. Also, means for can comprise one or more of the described elements. It should be noted that the numbering of the figures is not intended to be a limitation on the scope of the claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. Accordingly, the appended claims are intended to encompass within their scope all processes, machines, manufactures, compositions of matter, means, methods, or steps, irrespective of

[0115] List of reference signs

[0116] 100 electronic device

[0117] 102 carrier body

[0118] 104 support body

[0119] 106 first alignment marks on the support body 104

[0120] 108 second alignment marks on the carrier body 102

[0121] 110 third alignment marks on the electronic device 100

[0122] 112 connection body

[0123] 114 alignment marks on the connection body 112

[0124] 124 individual package

[0125] 130 semi-finished product

[0126] 134 lead frame unit

[0127] 138, 140 sets of alignment marks of the first alignment marks 106

[0128] 180 wafer

[0129] 170 intermediate carrier body

[0130] 172 alignment mark on the intermediate carrier body 170

[0131] 174 protective foil on the intermediate carrier body 170

[0132] D1, D2 spatial extension of the first alignment mark 106

[0133] d1, d2 spatial extension of the second alignment mark 108

[0134] 190 optical detection unit

[0135] 192 image recognition for the optical detection unit 190

[0136] 194 control unit

[0137] 200-260 mounting method

Claims

1. A method of mounting an electronic device (100) on one or more carrier bodies (102), wherein, The method comprises: • providing a support (104) having at least one first registration mark (106); • mounting one or more carrier bodies (102) on the support (104) by optical registration based on a correlation between the at least one first registration mark (106) and at least one second registration mark (108) respectively possessed by the one or more carrier bodies (102), the at least one first registration mark (106) being spaced apart from the one or more carrier bodies (102) after mounting to the support (104); • subsequently mounting a plurality of electronic devices (100) on a respective one of the one or more carrier bodies (102) by optical registration using the at least one second registration mark (108); and • separating the one or more carrier bodies (102) and the electronic devices (100) mounted thereon into individual packages (124), each package comprising at least a portion of one of the one or more carrier bodies (102) and at least one of the electronic devices (100).

2. The method of claim 1, wherein, The method comprises providing at least one third registration mark (110) for each of the plurality of electronic devices (100), wherein the operation of mounting the plurality of electronic devices (100) on a respective one of the one or more carrier bodies (102) comprises optical registration between the at least one second registration mark (108) and the third registration mark (110).

3. The method of claim 2, wherein, The method comprises optical registration between the at least one second registration mark (108) and the third registration mark (110) without taking into account the at least one first registration mark (106).

4. The method of any one of claims 1 to 3, wherein, The method comprises optically detecting the at least one first registration mark (106) prior to mounting the one or more carrier bodies (102) on the support (104).

5. The method of any one of claims 1 to 3, wherein, The method comprises optically detecting the at least one second registration mark (108) prior to mounting the one or more carrier bodies (102) on the support (104).

6. The method of any one of claims 1 to 3, wherein, The method comprises mounting one or more connectors (112) each having at least one fourth registration mark (114) on the one or more carrier bodies (102) for electrically connecting the electronic devices (100) to the respective carrier bodies (102) via the respective connectors (112).

7. The method of claim 6, wherein, The one or more connectors (112) are one or more clip frames.

8. The method of claim 7, wherein, The method comprises mounting the one or more connectors (112) on the one or more carrier bodies (102) by optical registration between the at least one second registration mark (108) and the at least one fourth registration mark (114).

9. A method of mounting an electronic device (100) on one or more carrier bodies (102), wherein, The method comprises: providing a support (104) having at least one first registration mark (106); mounting the one or more carrier bodies (102) on the support (104) by alignment between the at least one first alignment mark (106) and at least one second alignment mark (108) respectively of the one or more carrier bodies (102); subsequently mounting the plurality of electronic devices (100) on a respective one of the one or more carrier bodies (102) by alignment using the at least one second alignment mark (108); and singulating the one or more carrier bodies (102) and the electronic devices (100) mounted thereon into individual packages (124) each comprising at least a portion of one of the one or more carrier bodies (102) and at least one of the electronic devices (100), wherein the method comprises: • mounting the plurality of electronic devices (100) on an intermediate carrier body (170) having at least one fifth alignment mark (172) by alignment taking into account the mounting position and orientation of the one or more carrier bodies (102) on the support (104); and • subsequently transferring the electronic devices (100) from the intermediate carrier body (170) to the one or more carrier bodies (102) by alignment using the at least one fifth alignment mark (172).

10. The method of claim 9, wherein, The method comprises picking up a plurality of electronic devices (100) from a singulated wafer (180) and transferring the picked up electronic devices (100) to the intermediate carrier body (170).

11. The method of any one of claims 1 to 3, 7 to 10, wherein, The method comprises forming at least a portion of the alignment marks (106, 108, 110, 114, 172) by at least one of the group consisting of etching, printing, laser slotting, drilling, routing and stamping.

12. The method of any one of claims 1 to 3, 7 to 10, wherein, The method comprises mounting the electronic devices (100) on the one or more carrier bodies (102) by at least one of the group consisting of brazing, sintering, welding and gluing.

13. A method of mounting an electronic device (100) on a leadframe type carrier body (102), wherein, The method comprises: • providing a support (104) having first alignment marks (106); • mounting a plurality of carrier bodies (102) on the support (104), each carrier body (102) having second alignment marks (108); • mounting each of the electronic devices (100) on a respective one of the carrier bodies (102), each electronic device (100) having third alignment marks (110); • wherein the mounting comprises performing a first optical alignment procedure based on a correlation between the first alignment marks (106) of the support (104) and the second alignment marks (108) of each carrier body (102), and performing a second optical alignment procedure based on a correlation between the third alignment marks (110) of each electronic device (100) and the second alignment marks (108) of the respective carrier body (102), the second optical alignment procedure being independent of the first optical alignment procedure to eliminate an accumulated tolerance of the first optical alignment procedure and the second optical alignment procedure; and • wherein the mounting comprises performing a first optical alignment procedure based on a correlation between the first alignment marks (106) of the support (104) and the second alignment marks (108) of each carrier body (102), and performing a second optical alignment procedure based on a correlation between the third alignment marks (110) of each electronic device (100) and the second alignment marks (108) of the respective carrier body (102), the second optical alignment procedure being independent of the first optical alignment procedure to eliminate an accumulated tolerance of the first optical alignment procedure and the second optical alignment procedure; and • separating the one or more carrier bodies (102) and the electronic devices (100) mounted thereon into separate packages (124), each package comprising at least a portion of one of the one or more carrier bodies (102) and at least one of the electronic devices (100).

14. A semi-finished product (130) comprising: • a support body (104) having at least one first alignment mark (106); • one or more carrier bodies (102) mounted on the support body (104), each carrier body (102) having at least one second alignment mark (108), wherein a correlation between the at least one first alignment mark (106) and the at least one second alignment mark (108) enables an optical alignment between the support body (104) and the one or more carrier bodies (102), the at least one first alignment mark (106) being spaced apart from the one or more carrier bodies (102); and • a plurality of electronic devices (100), each electronic device (100) having at least one third alignment mark (110), and each electronic device (100) being respectively mounted on a respective one of the one or more carrier bodies (102), wherein a correlation between the at least one second alignment mark (108) and the third alignment mark (110) enables an optical alignment between the one or more carrier bodies (102) and the electronic devices (100); • wherein at least one of the group consisting of the support body (104) and the one or more carrier bodies (102) comprises at least two different sets (138, 140) of alignment marks (106, 108), the different sets (138, 140) being distinguishable due to having different characteristics.

15. The semi-finished product (130) according to claim 14, wherein Each of the one or more carrier bodies (102) comprises at least one lead frame.

16. The semi-finished product (130) according to any one of claims 14, 15, wherein The different sets (138, 140) comprise a first set (138) and a second set (140), the second set (140) having a smaller spatial extension (dl, d2) than the first set (138) having a larger spatial extension (Dl, D2), the first set (138) being used for coarse alignment and the second set (140) being used for fine alignment.

17. The semi-finished product (130) according to claim 14 or 15, wherein The at least one first alignment mark (106) and the at least one second alignment mark (108) are distinguishable due to having different characteristics.

18. The semi-finished product (130) according to claim 17, wherein The at least one first alignment mark (106) has a larger spatial extension (Dl, D2) than the at least one second alignment mark (108) having a smaller spatial extension (dl, d2). The at least one first alignment mark (106) has a larger spatial extension (Dl, D2) than the at least one second alignment mark (108) having a smaller spatial extension (dl, d2).

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