Substrate support assembly and substrate processing apparatus including the same

Abstract

A substrate support assembly disposed in a chamber includes a support plate including a first surface on which a substrate is disposed, a drive configured to tilt the support plate such that the first surface is tilted at a down tilt angle relative to a reference surface, and a controller configured to control the drive such that the down tilt angle is adjusted based on an up tilt angle formed by a tilt of a gas supply coupled to an upper surface of the chamber relative to the reference surface.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Patent Application No. 62 / 872551, filed July 10, 2019, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a substrate support assembly and a substrate processing apparatus including the same, and more specifically, to a substrate support assembly capable of forming a uniform distance between a substrate and a gas supply, and a substrate processing apparatus including the substrate support assembly. Background Technology

[0004] As the size of semiconductor devices continues to shrink, the importance of precisely controlling processes performed on substrates (e.g., deposition) is increasing. The substrate processing process may include steps for maintaining the interior of the reactor within the substrate processing apparatus under vacuum pressure and / or high temperature, as needed. The upper surface of a chamber comprising multiple reactors may deform in a direction toward the interior of the chamber depending on the conditions inside the reactors (vacuum pressure and / or high temperature) during the substrate processing. Additionally, a gas supply connected to the upper surface of the chamber may also be tilted in a direction toward the interior of the chamber along the deformation direction of the upper surface. Therefore, the distance between the substrate and the gas supply in the reactor is non-uniform within the reactor's reaction space, and the processing uniformity of the substrate processing process may deteriorate. Summary of the Invention

[0005] One or more embodiments include a substrate support assembly capable of forming a uniform distance between a substrate and a gas supply to improve the processing uniformity of the substrate processing process, and a substrate processing apparatus including the substrate support assembly.

[0006] Other aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments presented.

[0007] According to one or more embodiments, a substrate support assembly disposed in a chamber includes: a support plate including a first surface on which a substrate is disposed; a driver configured to tilt the support plate such that the first surface tilts down an angle relative to a reference surface; and a controller configured to control the driver, wherein the controller is configured to control the driver such that the down tilt angle is adjusted based on an up tilt angle caused by the tilt of a gas supply coupled to an upper surface of the chamber relative to the reference surface.

[0008] In one embodiment, the reference surface may be the bottom surface of the chamber.

[0009] In one embodiment, the controller can determine whether the difference between the downtilt angle and the uptilt angle is outside a predetermined error range.

[0010] In one embodiment, the controller may communicate with at least one of a lower angle sensor configured to measure a downward tilt angle and an upper angle sensor configured to measure an upward tilt angle.

[0011] In one embodiment, the actuator may include: a motor; a linkage unit connected to the motor and configured to be driven in a vertical direction; an inclined plate connected to the linkage unit; and a connecting arm extending from the inclined plate and coupled to a support plate.

[0012] In one embodiment, the linkage unit may include: a first linkage connected to a motor and configured to be driven in a vertical direction; and a second linkage connecting the first linkage and an inclined plate and configured to be inclined relative to the central axis of the first linkage, wherein the first linkage and the second linkage are joined together.

[0013] In one embodiment, the first link and the second link can be interconnected by at least one of a ball joint and a universal joint.

[0014] In one embodiment, there may be multiple linkage units, and each linkage unit may be configured to be equally symmetrical with respect to the center of the inclined plate.

[0015] In one embodiment, the controller can individually control the motors that are each connected to a linkage unit.

[0016] According to one or more embodiments, a substrate processing apparatus includes: a chamber; a substrate support assembly configured to support a substrate in the chamber; a gas supplier coupled to an upper surface of the chamber and configured to define a reaction space of a reactor and supply gas to the reaction space together with the substrate support assembly, wherein the substrate support assembly includes: a support plate including a first surface on which the substrate is disposed; a driver configured to tilt the support plate such that the first surface tilts down an angle relative to a reference surface; and a controller configured to control the driver, wherein the controller is configured to control the driver such that the down tilt angle is adjusted based on an up tilt angle formed by the tilt of the gas supplier relative to the reference surface.

[0017] In one embodiment, the controller can control the driver such that the downtilt angle and the uptilt angle are equal to each other.

[0018] In one embodiment, the substrate processing apparatus may further include a lower angle sensor configured to measure a lower tilt angle, and a controller capable of communicating with the lower angle sensor.

[0019] In one embodiment, the substrate processing apparatus may further include an upper angle sensor configured to measure an upper tilt angle, and a controller capable of communicating with the upper angle sensor.

[0020] In one embodiment, the substrate processing apparatus may further include: a lower angle sensor configured to measure a downward tilt angle; and an upper angle sensor configured to measure an upward tilt angle, and the controller may determine whether the difference between the downward tilt angle measured by the lower angle sensor and the upward tilt angle measured by the upper angle sensor is not within a predetermined error range.

[0021] In one embodiment, the actuator may include: a motor; a linkage unit connected to the motor and configured to be driven in a vertical direction; an inclined plate connected to the linkage unit; and a connecting arm extending from the inclined plate and coupled to a support plate.

[0022] In one embodiment, the linkage unit may include: a first linkage connected to a motor and configured to be driven in a vertical direction; and a second linkage connecting the first linkage and an inclined plate and configured to be inclined relative to the central axis of the first linkage, wherein the first linkage and the second linkage are joined together.

[0023] In one embodiment, the first link and the second link can be interconnected by at least one of a ball joint and a universal joint.

[0024] In one embodiment, there may be multiple linkage units, and each linkage unit may be configured to be equally symmetrical with respect to the center of the inclined plate.

[0025] In one embodiment, the controller can individually control the motors that are each connected to a linkage unit.

[0026] In one embodiment, the driver may further include a fixed plate with holes, wherein the fixed plate is located between the tilting plate and the motor, and the linkage unit is connected to the tilting plate through the holes.

[0027] The substrate support assembly and substrate processing apparatus including the substrate support assembly disclosed herein can form a uniform distance between the substrate and the gas supply, thereby improving the processing uniformity of the substrate processing process under various environmental conditions during the substrate processing process. Attached Figure Description

[0028] These and / or other aspects will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

[0029] Figure 1 This is an internal cross-sectional view of a conventional substrate processing device;

[0030] Figure 2This is a cross-sectional view of a substrate support assembly and a substrate processing apparatus including the substrate according to an embodiment.

[0031] Figure 3 This is a cross-sectional view of the substrate processing apparatus according to an embodiment;

[0032] Figure 4 This is a side view of the driver according to an embodiment;

[0033] Figure 5 This is a plan view of the fixing plate according to the embodiment;

[0034] Figure 6 This is a plan view of the inclined plate according to the embodiment;

[0035] Figure 7 yes Figure 4 A cross-sectional view of region A of the drive; and

[0036] Figure 8 This is a flowchart illustrating a method for assembling a drive substrate support assembly according to an embodiment. Detailed Implementation

[0037] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein similar reference numerals always denote similar elements. In this respect, the embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments are described below only by reference to the accompanying drawings to explain aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. When an expression such as “at least one” precedes a list of elements, it modifies the entire list of elements and does not modify any individual element in the list.

[0038] In the following description, one or more embodiments will be described more fully with reference to the accompanying drawings.

[0039] In this respect, this embodiment may take different forms and should not be construed as limited to the description set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of this disclosure to those skilled in the art.

[0040] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit this disclosure. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that the terms “comprising,” “including,” and variations thereof, as used herein, specify the presence of the stated features, integers, steps, operations, components, parts, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0041] It will be understood that although the terms first, second, etc., may be used herein to describe various components, parts, regions, layers, and / or portions, these components, parts, regions, layers, and / or portions should not be limited by these terms. These terms do not indicate any order, number, or importance, but are used only to distinguish between various components, regions, layers, and / or portions. Therefore, without departing from the teachings of the embodiments, the first component, part, region, layer, or portion discussed below may be referred to as a second component, part, region, layer, or portion.

[0042] In the following description, embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. In the drawings, variations from the illustrated shapes can be expected due to, for example, manufacturing techniques and / or tolerances. Therefore, embodiments of the present disclosure should not be construed as limited to a specific shape within the areas shown herein, but may include, for example, shape deviations resulting from the manufacturing process.

[0043] Figure 1 This is an internal cross-sectional view of a conventional substrate processing apparatus 100. The substrate processing apparatus 100 may be an apparatus provided for processing a substrate S. For example, the substrate processing apparatus 100 may be an apparatus for depositing on a semiconductor substrate or a display substrate, and may be an apparatus for etching on the substrate S and / or a material film on the substrate S.

[0044] Reference Figure 1 The conventional substrate processing apparatus 100 may include a chamber 10, a substrate support 11, and a gas supply 12. The chamber 10 may include a bottom surface 10a, an inner surface 10b, and an upper surface 10c defining the interior space of the chamber.

[0045] The substrate support 11 can be configured to support the substrate S within the chamber 10. The substrate support 11 can be located below the gas supply 12.

[0046] The gas supply 12 can be configured to supply gas for processing the substrate S to the substrate S. The gas supply 12 can be located above the substrate support 11 and can be fixedly connected to the upper surface 10c of the chamber 10.

[0047] The substrate support 11 and gas supplier 12 constituting the reactor can be interconnected to define the reaction space R of the reactor. The reaction space R of the reactor can be the space in which the substrate S is processed during the substrate processing.

[0048] If necessary, the substrate processing apparatus 100 can create various environmental conditions within the reaction space R of the reactor used to process the substrate S. For example, the substrate processing apparatus 100 can maintain a vacuum pressure state inside the reaction space R to process the substrate S. Alternatively, the substrate processing apparatus 100 can maintain a high temperature inside the reaction space R to process the substrate S. When the reaction space R of the substrate processing apparatus 100 is under vacuum pressure and / or high temperature, the upper surface 10c of the chamber 10 may deform and tilt towards the interior of the chamber. Therefore, the gas supply 12, which is fixedly connected to the upper surface 10c, can also tilt towards the interior of the chamber.

[0049] refer to Figure 1 When the upper surface 10c of chamber 10 is tilted, the upper surface 10c and the bottom surface 10a can form an upward tilt angle α. For example, the upward tilt angle α can be the angle formed by the tilt of the upper surface 10c of chamber 10 relative to the bottom surface 10a of chamber 10. Furthermore, the gas supply 12 connected to the upper surface 10c can also be tilted from the bottom surface 10a to form an upward tilt angle α. When the upward tilt angle α is formed, the distance between the substrate S and the gas supply 12 can be different between different regions of the substrate S. For example, the first distance d1 between the first region P1 of the substrate S and the gas supply 12 can be greater than the second distance d2 between the second region P2 of the substrate S (which is different from the first region P1) and the gas supply 12. Since the first distance d1 and the second distance d2 are different from each other, the processing uniformity of the substrate processing process may be deteriorated.

[0050] Figure 2 This is a cross-sectional view of the substrate support assembly 250 and the substrate processing apparatus 200 including the substrate support assembly 250 according to an embodiment. Figure 2 As shown, the substrate processing apparatus 200 may include a plurality of substrate support assemblies 250.

[0051] Reference Figure 2 The substrate processing apparatus 200 may include a chamber 20, a gas supply 21, and a substrate support assembly 250. In one embodiment, the chamber 20 may form an inner space in which the substrate support assembly 250 and the gas supply 21 are located. Additionally, the chamber 20 may include a bottom surface 20a, an inner surface 20b, and an upper surface 20c defining the inner space.

[0052] In one embodiment, the gas supply 21 may be configured to supply gas for processing the substrate S to the substrate S. For example, the gas supply 21 may be configured to supply various types of processing gases for the deposition process to the substrate S. The gas supply 21 may be located above the substrate support assembly 250 and may be fixed to the chamber 20. More specifically, the gas supply 21 may be fixed to the upper surface 20c of the chamber 20 by means of a fixing member (not shown). Furthermore, the gas supply 21 may include a nozzle having a plurality of gas injection holes on a spray surface facing the substrate S and configured to supply gas for processing the substrate S to the substrate S.

[0053] In one embodiment, the substrate support assembly 250 of this disclosure may include a support plate 201, an actuator 202, and a controller 203. The substrate support assembly 250 may be configured to support a substrate S within a chamber 20. Furthermore, the actuator 202 of the substrate support assembly 250 may drive the support plate 201 configured to support the substrate S to form a uniform distance between the substrate S and the gas supply 21.

[0054] In one embodiment, the gas supplier 21 and the substrate support assembly 250 are interconnected during the substrate processing to define a reaction space R in the reactor, which is the space in which the substrate S is processed. Depending on the type of substrate processing, the interior of the reaction space R can be formed with various pressure and temperature distributions.

[0055] In one embodiment, the support plate 201 may be configured such that the substrate S is placed. More specifically, the support plate 201 may include a first surface 201a facing the gas supply 21, and the substrate S to be processed may be placed on the first surface 201a.

[0056] Furthermore, the support plate 201 can be tilted by the actuator 202, as will be described later. For example, the angle formed between the first surface 201a of the support plate 201 and the reference surface can be adjusted by the actuator 202. For example, the reference surface can be the bottom surface 20a of the chamber 20, but is not limited thereto. The reference surface can include any surface formed by the components of the substrate processing apparatus 200, which is substantially undeformed under various environmental conditions of the substrate processing process. When the support plate 201 is tilted from the bottom surface 20a of the chamber 20 by the actuator 202, the first surface 201a of the support plate 201 and the bottom surface 20a of the chamber 20 can form a downward tilt angle b.

[0057] Furthermore, the support plate 201 can be used as an electrode. For example, RF power can be applied to the reaction space R of the reactor through the support plate 201, thereby forming plasma in the reaction space R.

[0058] In one embodiment, the driver 202 may be configured to drive the support plate 201. More specifically, the driver 202 may drive the support plate 201 such that a first surface 201a of the support plate 201 is tilted relative to a reference surface. For example, the driver 202 may drive the support plate 201 to adjust the downward tilt angle b between the first surface 201a of the support plate 201 and the bottom surface 20a of the chamber 20 based on different substrate processing environmental conditions.

[0059] In one embodiment, the controller 203 may be configured to control the actuator 202. When the interior of the reaction space R is formed under vacuum pressure and / or high temperature, the upper surface 20c of the chamber 20 may be tilted from the bottom surface 20a. The gas supply 21 connected to the upper surface 20c may also be tilted from the bottom surface 20a, and the gas supply 21 and the bottom surface 20a of the chamber 20 may form an upward tilt angle α. Here, the controller 203 may be configured to control the actuator 202 such that a downward tilt angle b can be adjusted based on the upward tilt angle α.

[0060] In one embodiment, the controller 203 can control the driver 202 such that the upward tilt angle a is substantially equal to the downward tilt angle b. For example, the controller 203 can control the driver 202 such that the support plate 201 can be tilted relative to the bottom surface 20a of the chamber 20 until the first surface 201a of the support plate 201 and the gas supply 21 connected to the upper surface 20c of the chamber 20 are parallel (i.e. until the distance between the first surface 201a and the gas supply 21 becomes uniform).

[0061] In one embodiment, the controller 203 can determine whether the difference between the upward tilt angle a and the downward tilt angle b is outside a predetermined error range. The error range can be determined from the processor in the substrate processing procedure and can be changed as needed. When the difference between the downward tilt angle b and the upward tilt angle a controlled by the driver 202 is outside the predetermined error range, the controller 203 can control the driver 202 again so that the difference is within the error range.

[0062] In one embodiment, the controller 203 adjusts the downward tilt angle b formed by the support plate 201 based on the upward tilt angle a, so that the distance between the substrate S located on the first surface 201a of the support plate 201 and the gas supply 21 connected to the upper surface 20c of the chamber 20 can be uniform. For example, the first distance d1 between the first region P1 of the substrate S and the gas supply 21 can be formed to be substantially equal to the second distance d2 between the second region P2 of the substrate S and the gas supply 21. Therefore, the processing uniformity of the substrate processing can be improved.

[0063] Figure 3This is a cross-sectional view of the substrate processing apparatus 300 according to an embodiment.

[0064] In one embodiment, the substrate processing apparatus 300 of this disclosure may include a chamber 30, a gas supply 31, a substrate support assembly 350, an upper angle sensor 32, and a lower angle sensor 33. Figure 3 The technical concepts of the chamber 30, gas supply unit 31, and substrate support assembly 350 may include reference to Figure 2 The technical concepts of the chamber 20, gas supply 21, and substrate support assembly 250 are described, therefore detailed descriptions will be omitted.

[0065] In addition, the substrate support assembly 350 may include a support plate 301, a driver 302, and a controller 303. Figure 3 The technical concepts of the support plate 301, driver 302, and controller 303 may include references Figure 2 The technical concepts of the support plate 201, driver 202, and controller 203 are described, therefore detailed descriptions will be omitted.

[0066] In one embodiment, the upper angle sensor 32 of the substrate processing apparatus 300 may be configured to measure an upper tilt angle α. For example, the upper tilt angle α measured by the upper angle sensor 32 may include at least one of the angle formed by the tilt of the upper surface 30c of the chamber 30 relative to a reference surface, the angle formed by the tilt of the gas supplier 31 relative to the reference surface, and the angle formed by the tilt of the nozzle in the gas supplier 31 relative to the reference surface. The reference surface may include, but is not limited to, the bottom surface 30a of the chamber 30, and may include any of the surfaces formed by the components of the substrate processing apparatus 300 that are substantially undeformed under various environmental conditions of the substrate processing process.

[0067] In one embodiment, the upper angle sensor 32 can communicate with the controller 303. More specifically, the upper angle sensor 32 can communicate with the controller 303 and transmit the measured upper tilt angle α to the controller 303 in real time.

[0068] In one embodiment, the lower angle sensor 33 of the substrate processing apparatus 300 may be configured to measure a downward tilt angle b. For example, the downward tilt angle b measured by the lower angle sensor 33 may include at least one of the angle formed by the tilt of the first surface 301a of the support plate 301 relative to a reference surface and the angle formed by the tilt of the substrate S on the first surface 301a relative to the reference surface. The reference surface may include, but is not limited to, the bottom surface 30a of the chamber 30, and may include any surface formed by the components of the substrate processing apparatus 300 that is substantially undeformed under various environmental conditions of the substrate processing process.

[0069] In one embodiment, the down-angle sensor 33 can communicate with the controller 303. More specifically, the down-angle sensor 33 can communicate with the controller 303 and transmit the measured down-tilt angle b to the controller 303 in real time.

[0070] In one embodiment, the controller 303 may control the driver 302 based on an upward tilt angle α received from the upper angle sensor 32. More specifically, the controller 303 may control the driver 302 such that the support plate 301 may tilt relative to a reference surface based on the upward tilt angle α to form a downward tilt angle β.

[0071] In one embodiment, the controller 303 can control the driver 302 to tilt the support plate 301 relative to a reference surface until the downward tilt angle b formed by the support plate 301 is substantially equal to the upward tilt angle a measured by the upper angle sensor 32. When the downward tilt angle b is substantially equal to the upward tilt angle a, the first surface 301a of the support plate 301 and the gas supply 31 connected to the upper surface 30c of the chamber 30 can be parallel to each other. Therefore, the distance between the substrate S located on the first surface 301a of the support plate 301 and the gas supply 31 connected to the upper surface 30c of the chamber 30 can be made uniform.

[0072] In one embodiment, after the driver 302 tilts the support plate 301 relative to a reference surface, the lower angle sensor 33 can transmit the downward tilt angle b formed by the support plate 301 to the controller 303.

[0073] In one embodiment, the controller 303 can determine whether the difference between the downward tilt angle b measured by the lower angle sensor 33 and the upward tilt angle a measured by the upper angle sensor 32 is outside a predetermined error range. The error range can be determined as a value from the processor of the substrate processing procedure, and the error range can be changed as needed.

[0074] More specifically, when the controller 303 determines that the difference between the downward tilt angle b and the upward tilt angle a is not within a predetermined error range, the controller 303 can drive the support plate 301 by secondary control of the driver 302. Furthermore, the downward angle sensor 33 can measure the downward tilt angle b formed by the support plate 301 and transmit the measured downward tilt angle b to the controller 303. The controller 303 can determine whether the difference between the measured second downward tilt angle b and the upward tilt angle a is not within the error range. When the difference between the second downward tilt angle b and the upward tilt angle a is within the error range, the controller 303 can stop the control of the driver 302. When the difference between the second downward tilt angle b and the upward tilt angle a is not within the error range, the controller 303 can control the driver 302 again to drive the support plate 301.

[0075] In one embodiment, before the substrate processing, the first surface 301a of the support plate 301 can be set parallel to the bottom surface 30a of the chamber 30 (i.e., the downward tilt angle b is approximately 0 degrees). When the upper surface 30c of the chamber 30 is not tilted towards the interior space of the chamber 30, during the substrate processing, the gas supply 31 connected to the upper surface 30c can be parallel to the bottom surface 30a of the chamber 30. In other words, the upward tilt angle α formed by the gas supply 31 and the bottom surface 30a can be approximately 0 degrees. Here, the controller 303 can be configured not to drive the driver 302.

[0076] Figure 4 This is a side view of the driver 302 according to an embodiment. Figure 5 This is a plan view of the mounting plate 43 of the driver 302, and Figure 6 This is a plan view of the tilt plate 44 of the driver 302.

[0077] In one embodiment, the actuator 302 of this disclosure may include a motor 41, a linkage unit 42, a fixed plate 43, an inclined plate 44, and a connecting arm 45. (Referring to the above...) Figure 3 The driver 302 can drive the support plate 301 such that the first surface 301a of the support plate 301 is tilted relative to the reference surface to form a downward tilt angle b.

[0078] In one embodiment, motor 41 may be a power source configured to receive electricity and generate driving force. The driving force of motor 41 may be transmitted to linkage unit 42, which will be described later, and used to drive tilting plate 44. Driver 302 may include a plurality of motors 41.

[0079] In one embodiment, the linkage unit 42 is mechanically connected to the motor 41 and can be configured to be driven in the vertical direction by the driving force of the motor 41. Furthermore, the linkage unit 42 can be connected to the tilting plate 44 and can transmit the driving force of the motor 41 to the tilting plate 44. The linkage unit 42 may include a first link 71 connected to the motor 41. Figure 7 ) and the second link 72 connected to the inclined plate 44 Figure 7 (Refer to) Figure 7 The technical concepts behind the first link 71 and the second link 72 will be described in more detail.

[0080] In one embodiment, the linkage unit 42 may be located between the motor 41 and the tilting plate 44. One area of ​​the linkage unit 42 may be connected to the motor 41, while another area of ​​the linkage unit 42 may be connected to the tilting plate 44.

[0081] In one embodiment, there may be multiple linkage units 42. More specifically, the linkage units 42 may be configured in a number corresponding to the number of motors 41. For example, when there are three motors 41, three linkage units 42 may be provided.

[0082] Furthermore, the linkage unit 42 can be connected to the lower surface 44b of the inclined plate 44, such that the linkage unit 42 is equally symmetrical with respect to the center of the inclined plate 44. For example, when the inclined plate 44 is as follows... Figure 6 When the triangle shown is represented and there are three link units 42, the link units 42 can be connected to the lower surface 44b of the inclined plate 44 at a distance of 120 degrees from the center of the inclined plate 44.

[0083] In one embodiment, when multiple linkage units 42 exist, the controller 303 can individually control the motors 41 connected to each linkage unit 42. Since there are multiple linkage units 42 and motors 41 and the controller 303 controls the motors 41 individually, the downward tilt angle b formed by the support plate 301 and the bottom surface 30a of the chamber 30 can be precisely adjusted.

[0084] Reference Figure 4 and 5 The fixing plate 43 may include an upper surface 43a facing the inclined plate 44 and a lower surface 43b facing the upper surface 43a. The fixing plate 43 may be located between the inclined plate 44 and the motor 41. The fixing plate 43 may be as follows: Figure 5 The triangular plate shown is in shape. However, this disclosure is not limited to this, and the fixing plate 43 can have various shapes.

[0085] In one embodiment, the fixing plate 43 may include a first hole h1 penetrating the central portion and second holes h2 penetrating the edge portions. For example, the first hole h1 may be located in the central portion of the fixing plate 43, and a plurality of second holes h2 may be symmetrically arranged with respect to the center of the fixing plate 43 and may be arranged around the first hole h1. The second holes h2 may be located near the vertices of the fixing plate 43, so that when the fixing plate 43 is in the shape of a triangular plate, it is symmetrical with respect to the center of the fixing plate 43.

[0086] In one embodiment, the first hole h1 of the fixing plate 43 can provide space for devices and wires connected to the lower part of the connecting arm 45 to be positioned therethrough. For example, a connecting arm driver (not shown) configured to drive the connecting arm 45 and wires electrically connected to the connecting arm driver can be positioned through the first hole h1 of the fixing plate 43.

[0087] In one embodiment, the second hole h2 of the fixing plate 43 can form a space in which the link unit 42 can be positioned. The second hole h2 of the fixing plate 43 can be formed with dimensions that do not interfere with the driving of the link unit 42. For example, when the link unit 42 is driven vertically in the space formed by the second hole h2 and / or positioned relative to the central axis c, Figure 7 When tilted, the drive of the linkage unit 42 will not be disturbed by the fixed plate 43.

[0088] Reference Figure 4 and 6 The inclined plate 44 may include an upper surface 44a facing the support plate 301 and a lower surface 44b facing the upper surface 44a. The inclined plate 44 may be on the fixed plate 43.

[0089] In one embodiment, the inclined plate 44 may be shaped as follows: Figure 6 The triangular plate shown is in shape. However, this disclosure is not limited to this, and the inclined plate 44 can have various shapes. Furthermore, the inclined plate 44 can have a shape substantially the same as that of the fixed plate 43. For example, when the fixed plate 43 is in the shape of a triangular plate, the inclined plate 44 can also be in the shape of a triangular plate.

[0090] In one embodiment, the tilting plate 44 may include a fixing hole h3 passing through a central portion. The fixing hole h3 may be located in the central portion of the tilting plate 44 and may provide space therein for the connecting arm 45, which will be described later below, to be inserted and fixed.

[0091] In one embodiment, the tilting plate 44 can be connected to the linkage unit 42. More specifically, the lower surface 44b of the tilting plate 44 can be connected to the second linkage 72. Figure 7 For example, the tilting plate 44 can be driven integrally with the second link 72. In one embodiment, the tilting plate 44 can be raised or lowered when the second link 72 is raised or lowered. Furthermore, when the second link 72 is relative to the central axis c of the first link 71... Figure 7 When tilted, the tilting plate 44 connected to the second link 72 can also tilt relative to the central axis c.

[0092] In one embodiment, the connecting arm 45 may be configured to connect the inclined plate 44 and the support plate 301. More specifically, the connecting arm 45 may be columnar and configured to connect the inclined plate 44 and the support plate 301 between the inclined plate 44 and the support plate 301. The lower part of the connecting arm 45 may be connected to the inclined plate 44, and the upper part of the connecting arm 45 may be connected to the support plate 301.

[0093] Figure 7 yes Figure 4 A cross-sectional view of region A of the drive.

[0094] Reference Figure 7 The linkage unit 42 may include a first link 71 and a second link 72. For example, the linkage unit 42 may include a plurality of first links 71 and a plurality of second links 72 connected to the first links 71.

[0095] In one embodiment, the first link 71 can be connected to the motor 41 and can be driven vertically by the driving force of the motor 41. The height formed by the first link 71 driven vertically by the motor 41 can be controlled by the controller 303.

[0096] In one embodiment, the second link 72 may be configured to connect the first link 71 and the inclined plate 44. More specifically, the second link 72 may be connected to the inclined plate 44 at its upper part. For example, the second link 72 may be fixedly connected to the inclined plate 44 as a single unit.

[0097] In one embodiment, the second link 72 may be coupled to the first link 71 at its lower portion. More specifically, the coupling may be a coupling in which the second link 72 can be driven up and down as the first link 71 is driven up and down, can rotate relative to the central axis c of the first link 71, and can tilt relative to the central axis c of the first link 71 to form a downward tilt angle b.

[0098] like Figure 7 As shown, the first link 71 and the second link 72 can be connected by a ball-and-socket joint. However, this disclosure is not limited thereto. The joint connection of the first link 71 and the second link 72 can include at least one of various joint connections in which the second link 72 can be driven up and down as the first link 71 is driven up and down, can rotate relative to the central axis c of the first link 71, and can tilt relative to the central axis c of the first link 71 to form a downward tilt angle b. For example, the joint connection of the first link 71 and the second link 72 can include at least one of a ball-and-socket joint connection and a universal joint connection.

[0099] In one embodiment, such as Figure 3 As shown, when the upper surface 30c of chamber 30 is tilted during substrate processing to form an upward tilt angle α with the bottom surface 30a, controller 303 can control the vertical movement of each first link 71 based on the upward tilt angle α. When the first links 71 form different heights, the tilting plate 44 connected to the second link 72 can tilt from the central axis c to form a downward tilt angle b. The method of connecting the first link 71 and the second link 72 as described above can facilitate the formation of the downward tilt angle b of the tilting plate 44.

[0100] In one embodiment, the controller 303 can control the vertical movement of each first link 71 based on an upward tilt angle α, so that the substrate S mounted on the first surface 301a of the support plate 301 and the gas supply 31 connected to the upper surface 30c of the chamber 30 can be parallel. In other words, the controller 303 can control the vertical movement of each first link 71 based on an upward tilt angle α, so that the distance between the substrate S located on the first surface 301a of the support plate 301 and the gas supply 31 connected to the upper surface 30c of the chamber 30 can become uniform.

[0101] In one embodiment, as described above, the linkage unit 42 can be positioned via the second hole h2 of the fixing plate 43, and the second hole h2 can be formed with dimensions that do not interfere with the driving of the linkage unit 42. For example, when the second link 72 is tilted from the central axis c of the first link 71, the second link 72 may not contact the fixing plate 43.

[0102] Figure 8 This is a flowchart illustrating a method (S1000) for driving a substrate support assembly according to an embodiment. The method (S1000) for driving the substrate support assembly 350 of this disclosure may be a method for driving the substrate support assembly 350 of the substrate processing apparatus 300 such that the distance between the gas supply 31 connected to the upper surface 30c of the chamber 30 and the substrate S on the support plate 301 is uniform.

[0103] Reference Figure 8 Together Figure 3 Together, the method (S1000) for driving the substrate support assembly 350 may include: an operation S100 of measuring an upward tilt angle a; an operation S200 of transmitting the measured upward tilt angle a to the controller 303; an operation S300 of controlling the driver 302 to form a downward tilt angle b based on the upward tilt angle a; an operation S400 of measuring the downward tilt angle b; an operation S500 of transmitting the measured downward tilt angle b to the controller 303; and an operation S600 of determining whether the difference between the upward tilt angle a and the downward tilt angle b is not within a predetermined error range.

[0104] The operation S100 of measuring the upward tilt angle α of this disclosure may include measuring the upward tilt angle α by means of the upward tilt angle sensor 32. As described above, the upward tilt angle α may include at least one of the angle formed by the tilt of the upper surface 30c of the chamber 30 relative to a reference surface, the angle formed by the tilt of the gas supplier 31 relative to the reference surface, and the angle formed by the tilt of the nozzle formed in the gas supplier 31 relative to the reference surface. The reference surface may include, for example, the bottom surface 30a of the chamber 30.

[0105] In one embodiment, the operation S100 of measuring the tilt angle a may include measuring the changed tilt angle a in real time as the tilt angle a changes in real time as the substrate processing is carried out.

[0106] The operation S200 of transmitting the measured upward tilt angle α to the controller 303 of this disclosure may include transmitting the upward tilt angle α measured by the upward angle sensor 32 to the controller 303 in real time. The upward angle sensor 32 may transmit the upward tilt angle α measured by a wired communication method or a wireless communication method to the controller 303.

[0107] In one embodiment, the operation S200 of sending the measured upward tilt angle a to the controller 303 may include transmitting the changed upward tilt angle a in real time as the upward tilt angle a changes in real time as the substrate processing proceeds.

[0108] The operation S300 of controlling the driver 302 to form a downward tilt angle b based on the upward tilt angle a may include controlling the driver 302 to adjust the downward tilt angle b formed by the first surface 301a of the support plate 301 and the bottom surface 30a of the chamber 30 based on the upward tilt angle a.

[0109] In one embodiment, the controller 303 can control the driver 302 such that the gas supply 31 connected to the upper surface 30c of the chamber 30 and the first surface 301a of the support plate 301 are parallel to each other (e.g., such that the upward tilt angle a is substantially equal to the downward tilt angle b). In other words, the controller 303 can control the driver 302 such that the distance between the substrate S located on the first surface 301a of the support plate 301 and the gas supply 31 connected to the upper surface 30c of the chamber 30 can become uniform. Therefore, the first distance d1 between the first region P1 of the substrate S and the gas supply 12 can be formed to be substantially equal to the second distance d2 between the second region P2 of the substrate S (different from the first region P1) and the gas supply 31, which can improve the processing uniformity of the substrate processing. The configuration of the driver 302 and the operation of the above-described components are referenced. Figures 2 to 7 The technical concepts described are basically the same, so their detailed descriptions will be omitted.

[0110] The operation S400 of measuring the downward tilt angle b of this disclosure may include measuring the downward tilt angle b by means of the downward tilt sensor 33. As described above, the downward tilt angle b may include at least one of the angle formed by the tilt of the first surface 301a of the support plate 301 relative to a reference surface and the angle formed by the tilt of the substrate S on the first surface 301a relative to the reference surface. The reference surface may include, for example, the bottom surface 30a of the chamber 30.

[0111] In one embodiment, the operation S400 of measuring the downtilt angle b may include measuring the changed downtilt angle b in real time as the downtilt angle b changes in real time as the substrate processing process proceeds.

[0112] The operation S500 of transmitting the measured downtilt angle b to the controller 303 of this disclosure may include transmitting the downtilt angle b measured by the downtilt sensor 33 to the controller 303 in real time. The downtilt sensor 33 may transmit the downtilt angle b measured by a wired communication method or a wireless communication method to the controller 303.

[0113] In one embodiment, the operation S500 of transmitting the measured downtilt angle b to the controller 303 may include transmitting the changed downtilt angle b in real time as the downtilt angle b changes in real time as the substrate processing proceeds.

[0114] The operation S600, which determines whether the difference between the upward tilt angle a and the downward tilt angle b is outside the predetermined error range of this disclosure, may include determining whether the difference between the upward tilt angle a measured by the upper angle sensor 32 and the downward tilt angle b measured by the lower angle sensor 33 is outside the predetermined error range. The error range can be determined as a value by the processor in the substrate processing procedure, and the error range can be changed as needed.

[0115] In one embodiment, the driving of the substrate support assembly 350 can be terminated when the difference between the upper tilt angle a and the lower tilt angle b is within a predetermined error range.

[0116] In one embodiment, when the difference between the upward tilt angle a and the downward tilt angle b is not within a predetermined error range, the operation S300 of controlling the driver 302 to form the downward tilt angle b based on the upward tilt angle a can be executed again. When the driver 302 changes the downward tilt angle b again, the operation S400 of measuring the downward tilt angle b can be performed again; the operation S500 of transmitting the measured downward tilt angle b to the controller 303 can be performed again; and the operation S600 of determining whether the difference between the upward tilt angle a and the downward tilt angle b is not within a predetermined error range can be performed again.

[0117] Since the method (S1000) for driving the substrate support assembly 350 of this disclosure can change the downward tilt angle b formed by the support plate 301 in real time based on the upward tilt angle a, the distance between the substrate S on the support plate 301 and the gas supply 31 can become uniform. Therefore, the method (S1000) for driving the substrate support assembly 350 of this disclosure can improve the processing uniformity of the substrate processing process.

[0118] It should be understood that the shapes of each part in the accompanying drawings are illustrative in order to clearly understand this disclosure. It should be noted that these parts can be modified into various shapes in addition to those shown.

[0119] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects in each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as defined by the following claims.

Claims

1. A substrate support assembly disposed in a room, the substrate support assembly comprising: A support plate, including a first surface on which a substrate is disposed; A driver is configured to tilt a support plate such that a first surface tilts relative to a reference surface at a downward tilt angle greater than 0 degrees and less than 90 degrees to form the downward tilt angle. as well as The controller is configured to control the actuator to adjust the downward tilt angle based on an upward tilt angle greater than 0 degrees and less than 90 degrees formed by the tilt of the gas supplier connected to the upper surface of the chamber relative to a reference surface. Wherein, the reference surface is the bottom surface of the chamber. The driver includes: motor; A linkage unit that is connected to a motor and configured to be driven in the vertical direction; Inclined plate, which is connected to the linkage unit; and A connecting arm extends from the inclined plate and connects to the support plate. The substrate support assembly further includes: A downward tilt sensor, configured to measure the downward tilt angle; and The upper angle sensor is configured to measure the upper tilt angle. The controller is configured to communicate with the lower angle sensor and the upper angle sensor. The controller is further configured to determine in real time whether the difference between the downward tilt angle and the upward tilt angle is outside a predetermined error range; The controller is further configured to control the driver to adjust the tilt angle in real time when the difference is not within a predetermined error range; and The down-tilt sensor transmits the measured down-tilt angle to the controller in real time.

2. The substrate support assembly according to claim 1, in, The linkage unit includes: The first link, which is connected to the motor and configured to be driven in the vertical direction; and The second link connects the first link and the inclined plate and is configured to be inclined relative to the central axis of the first link. The first link and the second link are connected by a joint.

3. The substrate support assembly according to claim 2, wherein, The first link and the second link are interconnected by at least one of a ball joint and a universal joint.

4. The substrate support assembly according to claim 1, wherein, There are multiple linkage units, and Each link unit is configured to be equally symmetrical with respect to the center of the inclined plate.

5. The substrate support assembly according to claim 4, in, The controller is also configured to individually control the motors that are connected to the linkage units.

6. A substrate processing apparatus, comprising: room; A substrate support assembly configured to support a substrate in a chamber; as well as A gas supplier, connected to the upper surface of the chamber, is configured, together with the substrate support assembly, to define the reaction space of the reactor and supply gas to the reaction space. The substrate support assembly includes: A support plate, including a first surface on which a substrate is disposed; The driver is configured to tilt the support plate such that the first surface tilts relative to the reference surface at a downward tilt angle greater than 0 degrees and less than 90 degrees, to form the downward tilt angle; and The controller is configured to control the actuator to adjust the downward tilt angle based on an upward tilt angle greater than 0 degrees and less than 90 degrees formed by the tilt of the gas supplier relative to a reference surface. The reference surface is the bottom surface of the chamber. The driver includes: motor; A linkage unit that is connected to a motor and configured to be driven in the vertical direction; Inclined plate, which is connected to the linkage unit; and A connecting arm extends from the inclined plate and connects to the support plate. The substrate support assembly further includes: A downward tilt sensor, configured to measure the downward tilt angle; and The upper angle sensor is configured to measure the upper tilt angle. The controller is configured to communicate with the lower angle sensor and the upper angle sensor. The controller is further configured to determine in real time whether the difference between the downward tilt angle and the upward tilt angle is outside a predetermined error range; The controller is further configured to control the driver to adjust the tilt angle in real time when the difference is not within a predetermined error range; and The down-tilt sensor transmits the measured down-tilt angle to the controller in real time.

7. The substrate processing apparatus according to claim 6, in, The controller is also configured to control the driver such that the downward tilt angle and the upward tilt angle are equal to each other.

8. The substrate processing apparatus according to claim 6, in, The linkage unit includes: The first link, which is connected to the motor and configured to be driven in the vertical direction; and The second link connects the first link and the inclined plate and is configured to be inclined relative to the central axis of the first link. The first link and the second link are connected by a joint.

9. The substrate processing apparatus according to claim 8, in, The first link and the second link are interconnected by at least one of a ball joint and a universal joint.

10. The substrate processing apparatus according to claim 6, in, There are multiple linkage units, and Each link unit is configured to be equally symmetrical with respect to the center of the inclined plate.

11. The substrate processing apparatus according to claim 10, in, The controller is also configured to individually control the motors that are connected to the linkage units.

12. The substrate processing apparatus according to claim 6, in, The driver also includes: A fixing plate, which includes holes, The fixing plate is located between the inclined plate and the motor, and The linkage unit is connected to the inclined plate through a hole.

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