A method for preparing a photosensitive component, a photosensitive component, and an imaging module

Abstract

The present invention discloses a method for preparing a photosensitive component, the method comprising: disposing a photosensitive element on a substrate; disposing a compensation portion on all or part of the surface of the photosensitive element; performing a molding process on the photosensitive element provided with the compensation portion on the substrate; and removing the compensation portion. The present invention also relates to a photosensitive component, a layout, and an imaging module. In the photosensitive component of the present invention, the photosensitive component has the isolation channel, and the isolation channel isolates the molding body from the side surface of the photosensitive element, so that the molding body does not contact the isolation channel, thereby preventing stress from being transmitted from the molding body to the photosensitive element, and further preventing or reducing deformation or / and displacement of the photosensitive element, thereby protecting the photosensitive element.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a method for preparing a photosensitive component, a photosensitive component and a camera module. Background Art

[0002] There are various structures and corresponding assembly methods for camera modules used in existing mobile phones. Traditional modules adopt a method of attaching a photosensitive element to a circuit board, fixing a lens holder to the circuit board, and then fixing an optical lens and a color filter element on the light-sensitive path of the photosensitive element.

[0003] In order to reduce the size of the module and improve the efficiency, the MOB / MOC method is currently used for assembly. The module includes a photosensitive component and a light-transmitting component. The light-transmitting component is arranged on the photosensitive path of the photosensitive element of the photosensitive component. The photosensitive component includes a circuit board and a molded body integrally molded on the circuit board. For example, in the MOC packaging process, the photosensitive element is pre-attached to the circuit board, and then the molded body is formed on the circuit board through a molding process. The molded body wraps at least part of the non-photosensitive area of ​​the photosensitive element.

[0004] However, since the thermal expansion coefficients of the circuit board and the molded body in the camera module are different, when the camera module is placed in different environments, stress is generated due to the different expansion degrees of various components. This stress acts on the photosensitive element, causing the photosensitive element to undergo a certain degree of deformation or displacement, thereby resulting in a deterioration in the imaging effect.

[0005] Therefore, designing a photosensitive component and a camera module that can be applied to different environments and whose molded body will not generate stress on the photosensitive element during use and has good imaging effect is one of the problems that need to be solved urgently in this field. Summary of the invention

[0006] In view of this, the present invention provides a method for preparing a photosensitive component, a photosensitive component and a camera module. The photosensitive component can be applied to different environments, and the molded body will not generate stress on the photosensitive element during use, so the photosensitive element has a longer life.

[0007] To achieve the above objective, according to one aspect of the present invention, a method for preparing a photosensitive component is provided.

[0008] The present invention relates to a method for preparing a photosensitive component, the method comprising:

[0009] Disposing a photosensitive element on a substrate;

[0010] Disposing a compensation portion on the entire or partial surface of the photosensitive element;

[0011] Mold the photosensitive element provided with the compensation part on the substrate;

[0012] Remove the compensation part.

[0013] In a specific embodiment, the molding process includes forming a molding body outside the compensation part.

[0014] In a specific embodiment, at least part of the compensation part is covered by the molding body.

[0015] In a specific embodiment, at least part of the compensation part communicates with the outside.

[0016] In a specific embodiment, the compensation part is a continuous whole.

[0017] In a specific embodiment, the compensation part includes a plurality of discrete parts, and each discrete part is at least partially covered by the molding body.

[0018] In a specific embodiment, the compensation part includes a plurality of discrete parts, and each discrete part is at least partially in communication with the outside.

[0019] In a specific embodiment, the compensation part is solid or gel-like.

[0020] In a specific embodiment, the compensation part is made of a high-temperature molten material, and the melting temperature is 175 - 240 °C. The step of removing the compensation part includes raising the temperature to melt the compensation part.

[0021] In a specific embodiment, the compensation part is made of a high-temperature gasification material, and the gasification temperature is 175 - 240 °C. The step of removing the compensation part includes raising the temperature to gasify the compensation part.

[0022] In a specific embodiment, the compensation part is made of a material soluble in an organic solvent or water. The step of removing the compensation part includes using an organic solvent or water to dissolve the compensation part.

[0023] In a specific embodiment, there are two or more photosensitive elements provided on the substrate. After removing the compensation part, the substrate is cut to form a plurality of photosensitive components.

[0024] In a specific embodiment, after the compensation part is removed, an isolation channel is formed. The isolation channel includes a surrounding channel and a connecting channel. The isolation channel surrounds the photosensitive element, the connecting channel is a channel extending away from the photosensitive element starting from the surrounding channel, and the surrounding channel and the connecting channel are in communication.

[0025] In a specific embodiment, after removing the compensation part, the end of the communication channel away from the surrounding channel is sealed with a filling material.

[0026] To achieve the above object, according to one aspect of the present invention, a method for preparing a photosensitive component is provided.

[0027] The present invention relates to a method for preparing a photosensitive component, and the method includes:

[0028] Disposing a photosensitive element on a substrate;

[0029] Providing a compensation part on all or part of the surface of the photosensitive element;

[0030] A stepped part is provided on the photosensitive element;

[0031] Performing a molding process on the photosensitive element provided with the stepped part on the substrate;

[0032] Removing the compensation part.

[0033] In a specific embodiment, the photosensitive element includes a photosensitive area and a non-photosensitive area. The non-photosensitive area is located at the edge of the photosensitive area and surrounds the photosensitive area. The stepped part is located in the non-photosensitive area and surrounds the photosensitive area.

[0034] In a specific embodiment, the molding process includes forming a molding body outside the compensation part.

[0035] In a specific embodiment, at least part of the compensation part is covered by the molding body.

[0036] In a specific embodiment, at least part of the compensation part is in communication with the outside.

[0037] In a specific embodiment, the compensation part is a continuous whole.

[0038] In a specific embodiment, the compensation part includes a plurality of discrete parts, and each discrete part is at least partially covered by the molding body.

[0039] In a specific embodiment, the compensation part includes a plurality of discrete parts, and each discrete part is at least partially in communication with the outside.

[0040] In a specific embodiment, the compensation part is solid or gel-like.

[0041] In a specific embodiment, the compensation part uses a high-temperature molten material, and the melting temperature is 175 - 240 °C. The step of removing the compensation part includes raising the temperature to melt the compensation part.

[0042] In a specific embodiment, the compensation part is made of a high-temperature vaporization material with a vaporization temperature of 175 - 240°C. The step of removing the compensation part includes raising the temperature to vaporize the compensation part.

[0043] In a specific embodiment, the compensation part is made of a material soluble in an organic solvent or water. The step of removing the compensation part includes using an organic solvent or water to dissolve the compensation part.

[0044] In a specific embodiment, there are two or more photosensitive elements disposed on the substrate. After removing the compensation part, the substrate is cut to form a plurality of photosensitive components.

[0045] In a specific embodiment, after the compensation part is removed, an isolation channel is formed. The isolation channel includes a surrounding channel and a connecting channel. The isolation channel surrounds the photosensitive element, and the connecting channel is a channel extending away from the photosensitive element starting from the surrounding channel, and the surrounding channel communicates with the connecting channel.

[0046] In a specific embodiment, after the compensation part is removed, one end of the connecting channel away from the surrounding channel is sealed with a filling material.

[0047] To achieve the above object, according to one aspect of the present invention, a photosensitive component is provided.

[0048] A photosensitive component according to the present invention, wherein the photosensitive component is the photosensitive component prepared by the above preparation method.

[0049] To achieve the above object, according to one aspect of the present invention, a photosensitive component is provided.

[0050] The present invention relates to a photosensitive component, including a substrate, a photosensitive element, and a molding body integrally combined with the substrate. The photosensitive element is disposed on the substrate, and the molding body covers at least a part of the top surface of the photosensitive element;

[0051] An isolation channel is provided along the edge of the photosensitive element on the substrate, and the edge of the photosensitive element and the molding body surround to form the isolation channel.

[0052] In a specific embodiment, an isolation channel is provided between the edge of the photosensitive element and the molding body on the substrate.

[0053] In a specific embodiment, the isolation channel includes a surrounding channel and a connecting channel, and at least one connecting channel is provided on the surrounding channel.

[0054] In a specific embodiment, the surrounding channel is a closed channel disposed around the photosensitive element, the communication channel is a channel extending away from the photosensitive element starting from the surrounding channel, and the surrounding channel communicates with the communication channel.

[0055] In a specific embodiment, the photosensitive element includes a photosensitive area and a non-photosensitive area. The non-photosensitive area is located at the edge of the photosensitive area and is disposed around the photosensitive area, and the molding body covers at least a part of the non-photosensitive area.

[0056] In a specific embodiment, the surrounding channel surrounds the edge of the non-photosensitive area.

[0057] In a specific embodiment, electronic components are disposed on the substrate, and the electronic components are located outside the surrounding channel.

[0058] In a specific embodiment, a stepped portion is disposed on the upper surface of the non-photosensitive area. The stepped portion is disposed around the photosensitive area and is higher than the photosensitive element.

[0059] In a specific embodiment, the molding body covers at least a part of the stepped portion, and the covered stepped portion is away from the photosensitive area.

[0060] To achieve the above object, according to one aspect of the present invention, there is provided a layout.

[0061] A layout according to the present invention includes a plurality of photosensitive components disposed at intervals.

[0062] To achieve the above object, according to one aspect of the present invention, there is provided an imaging module.

[0063] An imaging module according to the present invention includes the photosensitive component and a light-transmitting component, and the light-transmitting element is disposed on the light-sensitive path of the photosensitive component.

[0064] To achieve the above object, according to one aspect of the present invention, there is provided a method for manufacturing an imaging module.

[0065] A method for manufacturing an imaging module according to the present invention includes the following steps:

[0066] Providing the photosensitive component and the light-transmitting component;

[0067] Placing the light-transmitting component on the photosensitive component.

[0068] In a specific embodiment, the light-transmitting element is disposed on the light-sensitive path of the photosensitive component.

[0069] According to the preparation method of the photosensitive component of the present invention, the compensation part is located on the side surface and / or the top surface of the photosensitive element, which can prevent the photosensitive element from being impacted by external forces during the molding process and from being deformed or broken.

[0070] According to the preparation method of the photosensitive component of the present invention, the filling material in the surrounding channel is discharged through the communication channel. When the filling material in the surrounding channel is exhausted, the outlet of the communication channel is resealed with a sealing material (i.e., the end of the communication channel far from the surrounding channel) to prevent pollutants such as dust from entering the photosensitive component through the communication channel.

[0071] According to the photosensitive component of the present invention, the photosensitive component has the isolation channel, and the isolation channel separates the molding body from the side surface of the photosensitive element, so that the molding body does not contact the side surface of the photosensitive element, thereby suppressing the transfer of stress from the molding body to the photosensitive element, and further preventing or reducing the deformation or / displacement of the photosensitive element, thus protecting the photosensitive element.

[0072] According to the photosensitive component of the present invention, the stepped portion surrounds the photosensitive area on the upper surface of the photosensitive element, so that the molding material can be better prevented from flowing into the photosensitive area of the photosensitive element during the molding process.

[0073] According to the photosensitive component of the present invention, the stepped portion surrounds the upper surface of the photosensitive element. During the molding process, the upper mold presses against the stepped portion, thereby preventing the upper mold from pressing against the photosensitive element and preventing damage to the photosensitive element.

[0074] According to the photosensitive component of the present invention, the isolation channel includes a surrounding channel and a communication channel. The surrounding channel is used to isolate the photosensitive element and the molding body, and the communication channel enables the surrounding channel to communicate with the outside. Description of the Drawings

[0075] The drawings are used to better understand the present invention and do not constitute an improper limitation to the present invention. Among them:

[0076] Figure 1 is one of the structural schematic diagrams of the photosensitive component according to the present invention;

[0077] Figure 2 is one of the structural schematic diagrams of the photosensitive component according to the present invention;

[0078] Figure 3 is one of the structural schematic diagrams of the camera module according to the present invention;

[0079] Figure 4 is one of the structural schematic diagrams of the camera module according to the present invention;

[0080] Figure 5 is one of the schematic structural diagrams of the camera module according to the present invention;

[0081] Figure 6 is one of the schematic structural diagrams of the camera module according to the present invention;

[0082] Figure 7 includes Figures 7A - 7G is the flowchart of the preparation method of the photosensitive component according to the present invention;

[0083] Figure 8 includes Figures 8A - 8I is the flowchart of the preparation method of the photosensitive component according to the present invention;

[0084] Figure 9 is the schematic structural diagram of the photosensitive component placed in the mold according to the present invention;

[0085] Figure 10 is the schematic structural diagram of the photosensitive component placed in the mold according to the present invention.

[0086] List of reference numerals

[0087] 1 - Surrounding channel, 2 - Connecting channel, 3 - Step portion, 4 - Electronic component, 5 - Substrate, 6 - Photosensitive element, 7 - Lens, 8 - Filter element, 9 - Molding body, 10 - Upper mold, 11 - Molding space, 12 - Lower mold, 13 - Windowed molding portion, 14 - Molding guiding portion, 15 - Molding guiding groove, 16 - Connecting channel, 17 - Compensation portion.

[0088] Detailed implementation manners of the invention

[0089] The following describes exemplary embodiments of the present invention with reference to the accompanying drawings. Various details of the embodiments of the present invention are included to facilitate understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, descriptions of well-known functions and structures are omitted in the following description for clarity and conciseness.

[0090] Refer to Figures 7A - 7G , the present invention relates to a method for preparing a photosensitive component, and the method includes:

[0091] Step 1: Dispose the photosensitive element 6 on the substrate 5;

[0092] The substrate 5 is a circuit board, and one or more photosensitive elements 6 can be disposed on the substrate 5. The photosensitive element 6 is attached to the substrate 5.

[0093] Step 2: Dispose the compensation portion 17 on all or part of the surface of the photosensitive element 6;

[0094] The compensation part 17 can be disposed on the side surface of the photosensitive element 6 or on the top surface of the photosensitive element 6.

[0095] In a specific embodiment, the compensation part 17 is disposed around the side surface of the photosensitive element 6.

[0096] In a specific embodiment, the compensation part 17 is disposed around the top surface of the photosensitive element 6 near the edge.

[0097] In a specific embodiment, the compensation part 17 is disposed around the side surface of the photosensitive element 6 and at the same time, the compensation part 17 is disposed around the top surface of the photosensitive element 6 near the edge.

[0098] Step three: perform a molding process on the photosensitive element 6 provided with the compensation part 17 on the substrate 5 to form a molded body 9;

[0099] In the molding process, a mold is required. The mold includes an upper mold 10 and a lower mold 12. At least one of the upper mold 10 and the lower mold 12 can be operated. Place the substrate 5 on the lower mold 12, and fasten the upper mold 10 on the upper mold 10. A molding space 11 is provided on the upper mold 10. The position of the molding space 11 is set according to the size of the substrate 5. After the upper mold 10 and the lower mold 12 are fastened together, fill the molding material into the molding space 11 for molding. When the molding material is cured, the upper mold 10 and the lower mold 12 are demolded, and the molding process ends after demolding.

[0100] The type of the molding material is not limited in the present invention. For example, the molding material can be any flowable material such as a liquid, solid particles, or a mixture of liquid and solid particles, and after the molding material is added to the mold, it can be cured by means of heating, pressurization, cooling, radiation, etc.

[0101] Step four: remove the compensation part 17 to obtain the photosensitive element 6.

[0102] After the molding process, the compensation part 17 is removed by physical and / or chemical methods without damaging other components.

[0103] The molding process includes forming a molded body 9 outside the compensation part 17.

[0104] At least part of the compensation part 17 is not covered by the molded body 9.

[0105] In a specific embodiment, after the molding process, the top of the compensation part 17 has a molded body 9.

[0106] In a specific embodiment, after the molding process, the compensation part 17 has a molding body 9 on the side away from the photosensitive element 6.

[0107] In a specific embodiment, after the molding process, the compensation part 17 has a molding body 9 both on the top and on the side away from the photosensitive element 6.

[0108] The compensation part 17 is a continuous whole. The continuously arranged compensation part 17 can prevent the photosensitive element 6 from being impacted by external forces during the molding process and deforming or cracking.

[0109] The compensation part 17 includes a plurality of discrete parts (the number of the discrete parts can be 1, 2, 3, and multiple, etc.), and each of the discrete parts is at least partially not covered by the molding body 9.

[0110] In a specific embodiment, the end of the discrete part is not covered by the molding body 9.

[0111] In a specific embodiment, the top of the discrete part is not covered by the molding body 9.

[0112] In a specific embodiment, the side of the discrete part is not covered by the molding body 9.

[0113] In a specific embodiment, both the top and the end of the discrete part are not covered by the molding body 9.

[0114] The compensation part 17 is solid or gel-like.

[0115] After the compensation part 17 is removed, an isolation channel is formed. The isolation channel includes a surrounding channel 1 and a connecting channel 2 (that is, the connecting channel 2 is formed after the filling material of the discrete part is removed). The isolation channel surrounds the photosensitive element 6. The connecting channel 2 is a channel extending away from the photosensitive element 6 starting from the surrounding channel 1, and the surrounding channel 1 communicates with the connecting channel 2.

[0116] In a specific embodiment, the compensation part 17 uses a high-temperature molten material, and the melting temperature is 175 - 240 °C. The step of removing the compensation part 17 includes raising the temperature to melt the compensation part 17. The high-temperature molten material used for the compensation part 17 can be silicone rubber, etc.

[0117] In a specific embodiment, the compensation part 17 is made of a high-temperature vaporization material with a vaporization temperature of 175 - 240 °C. The step of removing the compensation part 17 includes raising the temperature to vaporize the compensation part 17. In a specific embodiment, the compensation part 17 is made of a material soluble in an organic solvent. The step of removing the compensation part 17 includes using an organic solvent to dissolve the compensation part 17. The filling material used for the compensation part 17 is a hydrophobic epoxy resin or the like.

[0118] In a specific embodiment, the filling material used for the compensation part 17 is easily soluble in water or reacts with water. In step four, the molded substrate 5 is placed in water. Since the filling material is soluble in water or reacts with water, the compensation part 17 is removed. The filling material in the surrounding channel 1 is discharged through the communication channel 2. The residual moisture in the isolation channel is removed by baking or other means. When the filling material in the surrounding channel 1 is completely discharged, the outlet of the communication channel 2 is sealed (i.e., the end of the communication channel 2 away from the surrounding channel 1 is sealed) to prevent contaminants such as dust from entering the photosensitive component through the communication channel 2. The sealing material can be glue.

[0119] In a specific embodiment, the filling material used for the compensation part 17 is easily soluble in an organic reagent or reacts with an organic reagent. In step four, the molded substrate 5 is placed in an organic reagent. Since the filling material is soluble in the organic reagent or reacts with the organic reagent, the compensation part 17 is removed. The filling material in the surrounding channel 1 is discharged through the communication channel 2. After the filling material in the surrounding channel 1 is completely discharged, the outlet of the communication channel 2 is sealed (i.e., the end of the communication channel 2 away from the surrounding channel 1 is sealed) to prevent contaminants such as dust from entering the photosensitive component through the communication channel 2. The sealing material can be glue.

[0120] In a specific embodiment, the filling material used for the compensation part 17 is easily liquefied or vaporized. In step four, the molded substrate 5 is placed in a heating device for heat treatment. Since the filling material is easily liquefied or vaporized, the compensation part 17 can be removed by heating. The liquefied or vaporized filling material is discharged through the communication channel 2. After the filling material in the surrounding channel 1 is completely discharged, the outlet of the communication channel 2 is sealed (i.e., the end of the communication channel 2 away from the surrounding channel 1 is sealed) to prevent contaminants such as dust from entering the photosensitive component through the communication channel 2. The sealing material can be glue.

[0121] There are two or more photosensitive elements 6 provided on the substrate 5. After removing the compensation part 17, the substrate 5 is cut to form a plurality of photosensitive components.

[0122] The number of the photosensitive elements 6 can be 2, 3, 4, 5, 6, 7, 8, or multiple, etc.

[0123] Reference Figures 8A - 8I , the present invention relates to a method for preparing another photosensitive component, and the method includes:

[0124] Step 1: Dispose the photosensitive element 6 on the substrate 5;

[0125] The substrate 5 is a circuit board, and one or more photosensitive elements 6 can be disposed on the substrate 5. The photosensitive element 6 is attached to the substrate 5.

[0126] Step 2: Dispose a compensation portion 17 on all or part of the surface of the photosensitive element 6;

[0127] The compensation portion 17 can be disposed on the side surface of the photosensitive element 6 or on the top surface of the photosensitive element 6.

[0128] In a specific embodiment, the compensation portion 17 is disposed around the side surface of the photosensitive element 6.

[0129] In a specific embodiment, the compensation portion 17 is disposed around the top surface of the photosensitive element 6 near the edge.

[0130] In a specific embodiment, the compensation portion 17 surrounds the side surface of the photosensitive element 6, and at the same time, the compensation portion 17 surrounds the top surface of the photosensitive element 6 near the edge.

[0131] Step 3: A step portion 3 is provided on the photosensitive element 6;

[0132] The step portion 3 has a certain height and protrudes above the photosensitive element 6. Therefore, the step portion 3 can prevent the molding material from flowing into the photosensitive area and damaging the photosensitive element 6 during the subsequent molding process.

[0133] Step 4: Perform a molding process on the photosensitive element 6 provided with the step portion 3 on the substrate 5;

[0134] In the molding process, a mold is required. The mold includes an upper mold 10 and a lower mold 12. At least one of the upper mold 10 and the lower mold 12 can be operated. The substrate 5 is placed on the lower mold 12, and the upper mold 10 is buckled on the upper mold 10. A molding space 11 is provided on the upper mold 10. The position of the molding space 11 is set according to the size of the substrate 5. After the upper mold 10 and the lower mold 12 are buckled, the molding material is filled into the molding space 11 for molding. When the molding material is cured, the upper mold 10 and the lower mold 12 are demolded, and the molding process ends after demolding.

[0135] The type of the molding material is not limited in the present invention. For example, the molding material can be any flowable material such as a liquid, solid particles, or a mixture of a liquid and solid particles, etc. And after the molding material is added to the mold, it can be cured by means such as heating, pressurization, cooling, radiation, etc.

[0136] Step Five: Remove the compensation part 17 to obtain the photosensitive element 6.

[0137] After the molding process, the compensation part 17 is removed by physical and / or chemical methods without damaging other components.

[0138] The photosensitive element 6 includes a photosensitive area and a non-photosensitive area. The non-photosensitive area is located at the edge of the photosensitive area and surrounds the photosensitive area. The step part 3 is located in the non-photosensitive area and surrounds the photosensitive area.

[0139] Since the step part 3 surrounds the upper surface of the photosensitive element 6, during the molding process, the upper mold 10 presses the step part 3 to avoid the upper mold 10 pressing the photosensitive element 6 and prevent the photosensitive element 6 from being damaged. At the same time, during the molding process, the step part 3 also prevents the molding material in the non-photosensitive area from flowing into the photosensitive area, thereby protecting the photosensitive area from being damaged.

[0140] The molding process includes forming a molded body 9 outside the compensation part 17.

[0141] At least part of the compensation part 17 is not covered by the molded body 9.

[0142] In a specific embodiment, after the molding process, the top of the compensation part 17 has a molded body 9.

[0143] In a specific embodiment, after the molding process, the side of the compensation part 17 away from the photosensitive element 6 has a molded body 9.

[0144] In a specific embodiment, after the molding process, the top of the compensation part 17 and the side away from the photosensitive element 6 both have a molding body 9.

[0145] The compensation part 17 is a continuous whole. The continuously arranged compensation part 17 can prevent the photosensitive element 6 from being impacted by external forces during the molding process and deforming or cracking.

[0146] The compensation part 17 includes a plurality of discrete parts (the number of the discrete parts can be 1, 2, 3, and multiple, etc.), and each discrete part is at least partially not covered by the molding body 9.

[0147] In a specific embodiment, the end of the discrete part is not covered by the molding body 9.

[0148] In a specific embodiment, the top of the discrete part is not covered by the molding body 9.

[0149] In a specific embodiment, the side of the discrete part is not covered by the molding body 9.

[0150] In a specific embodiment, both the top and the end of the discrete part are not covered by the molding body 9.

[0151] The compensation part 17 is solid or gel-like.

[0152] After the compensation part 17 is removed, an isolation channel is formed. The isolation channel includes a surrounding channel 1 and a connecting channel 2 (that is, the connecting channel 2 is formed after the filling material of the discrete part is removed). The isolation channel surrounds the photosensitive element 6. The connecting channel 2 is a channel extending in a direction away from the photosensitive element 6 starting from the surrounding channel 1, and the surrounding channel 1 communicates with the connecting channel 2.

[0153] In a specific embodiment, the compensation part 17 uses a high-temperature melting material, and the melting temperature is 175 - 240 °C. The step of removing the compensation part 17 includes raising the temperature to melt the compensation part 17. The high-temperature melting material used for the compensation part 17 can be silica gel, etc.

[0154] In a specific embodiment, the compensation part 17 uses a high-temperature gasification material, and the gasification temperature is 175 - 240 °C. The step of removing the compensation part 17 includes raising the temperature to gasify the compensation part 17.

[0155] In a specific embodiment, the compensation part 17 uses a material soluble in an organic solvent. The step of removing the compensation part 17 includes using an organic solvent to dissolve the compensation part 17. The filling material used for the compensation part 17 is a hydrophobic epoxy resin, etc.

[0156] In a specific embodiment, the filling material used in the compensation part 17 is easily soluble in water or reacts with water. In step five, the molded substrate 5 is placed in water. Since the filling material is soluble in water or reacts with water, the compensation part 17 is removed. The filling material in the surrounding channel 1 is discharged through the communication channel 2, and the residual moisture in the isolation channel is removed by baking or other means. When the filling material in the surrounding channel 1 is exhausted, the outlet of the communication channel 2 is sealed (that is, the end of the communication channel 2 far from the surrounding channel 1 is sealed) to prevent pollutants such as dust from entering the photosensitive component through the communication channel 2. The sealing material can be glue.

[0157] In a specific embodiment, the filling material used in the compensation part 17 is easily soluble in organic reagents or reacts with organic reagents. In step five, the molded substrate 5 is placed in organic reagents. Since the filling material is soluble in organic reagents or reacts with organic reagents, the compensation part 17 is removed. The filling material in the surrounding channel 1 is discharged through the communication channel 2. After the filling material in the surrounding channel 1 is exhausted, the outlet of the communication channel 2 is sealed (that is, the end of the communication channel 2 far from the surrounding channel 1 is sealed) to prevent pollutants such as dust from entering the photosensitive component through the communication channel 2. The sealing material can be glue.

[0158] In a specific embodiment, the filling material used in the compensation part 17 is easily liquefied or vaporized. In step five, the molded substrate 5 is placed in a heating device for heat treatment. Since the filling material is easily liquefied or vaporized, the compensation part 17 can be removed by heating. The liquefied or vaporized filling material is discharged through the communication channel 2. After the filling material in the surrounding channel 1 is exhausted, the outlet of the communication channel 2 is sealed (that is, the end of the communication channel 2 far from the surrounding channel 1 is sealed) to prevent pollutants such as dust from entering the photosensitive component through the communication channel 2. The sealing material can be glue.

[0159] There are two or more photosensitive elements 6 provided on the substrate 5. After removing the compensation part 17, the substrate 5 is cut to form a plurality of photosensitive components.

[0160] The number of the photosensitive elements 6 can be 2, 3, 4, 5, 6, 7, 8, and multiple, etc.

[0161] Reference Figure 1 and Figure 2 , a photosensitive component involved in the present invention, wherein the photosensitive component is the photosensitive component prepared by the above preparation method.

[0162] ReferenceFigure 1 and Figure 2 , the present invention relates to a photosensitive component, comprising a substrate 5, a photosensitive element 6 and a molding body 9 integrally combined with the substrate 5. The photosensitive element 6 is disposed on the substrate 5, and the molding body 9 covers at least a part of the top surface of the photosensitive element 6;

[0163] An isolation channel is formed along the edge of the photosensitive element 6 on the substrate 5. The edge of the photosensitive element 6 and the molding body 9 surround to form the isolation channel, that is, an isolation channel is formed between the edge of the photosensitive element 6 and the molding body 9 on the substrate 5. When the photosensitive component is disposed in different environments, due to different degrees of expansion of each component, stress is generated. This stress acts on the photosensitive element 6, which may cause a certain degree of deformation or displacement of the photosensitive element 6; through the isolation channel, the molding body 9 can be isolated from the photosensitive element 6, so that the molding body 9 does not contact the isolation channel, thereby preventing stress from being transmitted from the molding body 9 to the photosensitive element 6, and further preventing or reducing the deformation or / displacement of the photosensitive element 6, thus protecting the photosensitive element 6.

[0164] The isolation channel includes a surrounding channel 1 and a communication channel 2. At least one communication channel 2 is disposed on the surrounding channel 1. The number and position of the communication channels 2 can be determined according to actual applications. The number of the communication channels 2 can be 1, 2, 3 or multiple, etc.

[0165] The surrounding channel 1 is a closed channel surrounding the photosensitive element 6. The communication channel 2 is a channel extending away from the photosensitive element 6 starting from the surrounding channel 1, and the surrounding channel 1 communicates with the communication channel 2. The surrounding channel 1 is a closed ring structure. The cross-sectional shape of the surrounding channel 1 is not limited, and can be rectangular, arc-shaped, polygonal, etc. And a plurality of communication channels 2 start from the surrounding channel 1 and diverge towards the edge of the substrate 5 respectively. The shape of the communication channel 2 can be a straight channel or an arc-shaped channel.

[0166] The photosensitive element 6 includes a photosensitive area and a non-photosensitive area. The non-photosensitive area is located at the edge of the photosensitive area and surrounds the photosensitive area. The molding body 9 covers at least a part of the non-photosensitive area.

[0167] In a specific embodiment, the molding body 9 covers the edge of the non-photosensitive area.

[0168] In a specific embodiment, the molding body 9 covers the non-photosensitive area.

[0169] The surrounding channel 1 surrounds the edge of the non-photosensitive area, and the molding body 9 is not contained in the surrounding channel 1. Therefore, the molding body 9 can be isolated from the side surface of the non-photosensitive area through the surrounding channel 1.

[0170] Electronic components 4 are provided on the substrate 5, and the electronic components 4 are located outside the surrounding channel 1. On the substrate 5, the electronic components 4 are located on at least one side of the photosensitive element 6, and the side where the communication channel 2 is located does not contain the electronic components 4. The electronic components 4 are covered by the molding body 9.

[0171] In a specific embodiment, one communication channel 2 is provided on one side of the photosensitive element 6 on the substrate 5. On the substrate 5, the electronic components 4 are provided on the other three sides of the photosensitive element 6.

[0172] In a specific embodiment, one communication channel 2 is provided on one side of the photosensitive element 6 on the substrate 5. On the substrate 5, the electronic components 4 are provided on any one of the other three sides of the photosensitive element 6.

[0173] In a specific embodiment, one communication channel 2 is provided on one side of the photosensitive element 6 on the substrate 5. On the substrate 5, the electronic components 4 are provided on any two of the other three sides of the photosensitive element 6.

[0174] In a specific embodiment, two communication channels 2 are provided on one side of the photosensitive element 6 on the substrate 5. On the substrate 5, the electronic components 4 are provided on the other three sides of the photosensitive element 6.

[0175] In a specific embodiment, two communication channels 2 are provided on one side of the photosensitive element 6 on the substrate 5. On the substrate 5, the electronic components 4 are provided on any two of the other three sides of the photosensitive element 6.

[0176] In a specific embodiment, two communication channels 2 are provided on one side of the photosensitive element 6 on the substrate 5. On the substrate 5, the electronic components 4 are provided on any one of the other three sides of the photosensitive element 6.

[0177] In a specific embodiment, two communication channels 2 are provided on the substrate 5, and the two communication channels 2 are respectively on any two sides of the photosensitive element 6. On the substrate 5, the electronic components 4 are provided on any one of the other two sides of the photosensitive element 6.

[0178] In a specific embodiment, two of the communication channels 2 are provided on the substrate 5, and the two communication channels 2 are respectively on any two sides of the photosensitive element 6, and electronic components 4 are provided on the other two sides of the photosensitive element 6 on the substrate 5.

[0179] A step portion 3 is provided on the upper surface of the non-photosensitive area. The step portion 3 surrounds the photosensitive area, and the step portion 3 is higher than the photosensitive element 6. The step portion 3 is a closed ring structure. During the molding process, the step portion 3 can better prevent the molding material from flowing into the photosensitive area of the photosensitive element 6.

[0180] The molding body 9 at least covers a part of the step portion 3, and the covered step portion 3 is away from the photosensitive area.

[0181] The present invention relates to a panel layout, including a plurality of spaced photosensitive components. The photosensitive components manufactured by using the panel layout have higher consistency and save costs.

[0182] When using the panel layout to prepare the photosensitive component, after the photosensitive component is manufactured, the panel layout is cut into a plurality of the photosensitive components by cutting.

[0183] As Figure 9 and Figure 10 As shown, when using the panel layout to manufacture the photosensitive component, a plurality of spaced photosensitive components are provided on the panel, and when the photosensitive component is subjected to molding treatment, the mold includes an upper mold 10 and a lower mold 12, and any one of the upper mold 10 and the lower mold 12 can be operated to perform mold closing and mold opening operations on the mold.

[0184] In a specific embodiment, when the mold is closed, at least one molding space 11 can be formed between the upper mold 10 and the lower mold 12 of the mold. When the panel layout is placed between the upper mold 10 and the lower mold 12 of the mold, the compensation portion 17 is located in the molding space 11.

[0185] When two or more molding spaces 11 are formed between the upper mold 10 and the lower mold 12, at least one connection channel 16 can also be formed between the upper mold 10 and the lower mold 12 for communicating adjacent molding spaces 11.

[0186] Further, the upper mold 10 includes a forming guiding portion 14 and at least one window forming portion 13. Each of the window forming portions 13 integrally extends from the forming guiding portion 14 to respectively form a forming guiding groove 15 between each of the window forming portions 13 and the forming guiding portion 14, or to form the forming guiding groove 15 between adjacent window forming portions 13. When the upper mold 10 and the lower mold 12 are closed, each of the forming spaces 11 is respectively formed at the position corresponding to each of the forming guiding grooves 15, and each of the connecting channels 16 is formed between the upper mold 10 and the lower mold 12 to communicate adjacent forming spaces 11.

[0187] As Figures 3 - 6 shown, the present invention relates to an imaging module, the photosensitive component and the light-transmitting component, the light-transmitting element is disposed on the photosensitive path of the photosensitive component, and external light passes through the light-transmitting component to reach the photosensitive element 6.

[0188] The light-transmitting component includes a lens assembly and a filter assembly. The lens assembly includes a lens 7 and the filter assembly includes a filter element 8 which are sequentially located on the photosensitive path of the photosensitive element 6, that is, the filter element 8 is located directly above the photosensitive element 6, and the lens 7 is located directly above the filter element 8. External light passes through the lens 7 and the filter element 8 in sequence and then reaches the photosensitive element 6 for imaging.

[0189] In a specific embodiment, the filter assembly includes a lens holder and a filter element mounted on the lens holder.

[0190] In a specific embodiment, the lens assembly includes a lens carrier and a lens mounted on the lens carrier.

[0191] In a specific embodiment, the lens assembly includes a motor and a lens. The lens is mounted in the motor, and the motor drives the lens to move or tilt to achieve the functions of autofocus or optical image stabilization.

[0192] The lens holder is mounted on the molding body 9. The filter element is mounted at the center position of the lens holder, and the filter element is disposed opposite to the photosensitive element. The lens carrier is mounted on the lens holder, and the lens is located within the lens carrier. The lens is located directly above the filter element.

[0193] In Figures 3 - 4 it, the molding body 9 is located at the edge of the photosensitive element, and the surrounding channel 1 surrounds the photosensitive element 6.

[0194] In Figure 5In the [description], a stepped portion 3 surrounding the photosensitive area is provided on the photosensitive element 6, and the molding body 9 is located on a side of the stepped portion 3 away from the photosensitive area. The surrounding channel 1 is provided to surround the photosensitive element 6.

[0195] In Figure 6 the [description], the molding body 9 is located at an edge of the photosensitive element 6, and the surrounding channel 1 covers a side surface and a part of an upper surface of the photosensitive element 6.

[0196] The present invention also relates to a method for manufacturing an imaging module, including the following steps:

[0197] Providing the photosensitive component and the light-transmitting component as described above;

[0198] Placing the light-transmitting component on the photosensitive component.

[0199] The light-transmitting element is disposed on a photosensitive path of the photosensitive component.

[0200] In addition, in the method for manufacturing the imaging module of the present invention, an outlet of the communication channel 2 (i.e., an end of the connection channel away from the surrounding channel 1) can be sealed with a sealing material in the last step, that is, after the photosensitive component and the light-transmitting component are installed, the outlet of the connection channel is sealed with the sealing material, and the sealing material can be glue.

[0201] Although the embodiments of the present invention have been described above in conjunction with the accompanying drawings, the present invention is not limited to the above specific embodiments and application fields. The above specific embodiments are merely illustrative and guiding, rather than restrictive. Those of ordinary skill in the art can also make many forms under the inspiration of this specification and without departing from the scope protected by the claims of the present invention, and these all belong to the scope of protection of the present invention.

Claims

1. A method for preparing a photosensitive component, characterized in that, the method comprises: disposing a photosensitive element on a substrate; providing a compensation portion on all or part of the surface of the photosensitive element; performing a molding process on the photosensitive element provided with the compensation portion on the substrate; removing the compensation portion.

2. The preparation method according to claim 1, characterized in that, the molding process includes forming a molding body outside the compensation portion.

3. The preparation method according to claim 2, characterized in that, at least part of the compensation portion is covered by the molding body.

4. The preparation method according to claim 2, characterized in that, at least part of the compensation portion communicates with the outside.

5. The preparation method according to claim 2, characterized in that, the compensation portion is a continuous whole.

6. The preparation method according to claim 2, characterized in that, the compensation portion includes a plurality of discrete portions, and each of the discrete portions is at least partially covered by the molding body.

7. The preparation method according to claim 2, characterized in that, the compensation portion includes a plurality of discrete portions, and each of the discrete portions is at least partially in communication with the outside.

8. The preparation method according to claim 1, characterized in that, the compensation portion is solid or gel-like.

9. The preparation method according to claim 1, characterized in that, the compensation portion is made of a high-temperature molten material, and the melting temperature is 175 - 240 °C. The step of removing the compensation portion includes raising the temperature to melt the compensation portion.

10. The preparation method according to claim 1, characterized in that, the compensation portion is made of a high-temperature gasification material, and the gasification temperature is 175 - 240 °C. The step of removing the compensation portion includes raising the temperature to gasify the compensation portion.

11. The preparation method according to claim 1, characterized in that, the compensation portion is made of a material soluble in an organic solvent or water. The step of removing the compensation portion includes using an organic solvent or water to dissolve the compensation portion.

12. The preparation method according to any one of claims 1 - 11, characterized in that, there are two or more photosensitive elements disposed on the substrate. After removing the compensation portion, the substrate is cut to form a plurality of photosensitive components.

13. The preparation method according to claim 1, characterized in that, after removing the compensation portion, an isolation channel is formed. The isolation channel includes a surrounding channel and a connecting channel. The isolation channel surrounds the photosensitive element, and the connecting channel is a channel extending away from the photosensitive element starting from the surrounding channel, and the surrounding channel communicates with the connecting channel.

14. The preparation method according to claim 13, characterized in that, when the compensation portion is removed, one end of the connecting channel away from the surrounding channel is sealed with a sealing material.

15. A method for preparing a photosensitive component, characterized in that, the method comprises: disposing a photosensitive element on a substrate; providing a compensation portion on all or part of the surface of the photosensitive element; providing a stepped portion on the photosensitive element; performing a molding process on the photosensitive element provided with the stepped portion on the substrate; removing the compensation portion.

16. The preparation method according to claim 15, wherein, the photosensitive element includes a photosensitive area and a non - photosensitive area, the non - photosensitive area is located at the edge of the photosensitive area and is disposed around the photosensitive area, the step portion is located in the non - photosensitive area and the step portion is disposed around the photosensitive area.

17. The preparation method according to claim 15, wherein, the molding process includes forming a molding body outside the compensation portion.

18. The preparation method according to claim 17, wherein, at least part of the compensation portion is covered by the molding body.

19. The preparation method according to claim 17, wherein, at least part of the compensation portion communicates with the outside.

20. The preparation method according to claim 17, wherein, the compensation portion is a continuous whole.

21. The preparation method according to claim 17, wherein, the compensation portion includes a plurality of discrete portions, and each of the discrete portions is at least partially covered by the molding body.

22. The preparation method according to claim 17, wherein, the compensation portion includes a plurality of discrete portions, and each of the discrete portions is at least partially in communication with the outside.

23. The preparation method according to claim 15, wherein, the compensation portion is solid or gel - like.

24. The preparation method according to claim 15, wherein, the compensation portion is made of a high - temperature melting material, the melting temperature is 175 - 240 °C, and the step of removing the compensation portion includes raising the temperature to melt the compensation portion.

25. The preparation method according to claim 15, wherein, the compensation portion is made of a high - temperature gasification material, the gasification temperature is 175 - 240 °C, and the step of removing the compensation portion includes raising the temperature to gasify the compensation portion.

26. The preparation method according to claim 15, wherein, the compensation portion is made of a material soluble in an organic solvent or water, and the step of removing the compensation portion includes using an organic solvent or water to dissolve the compensation portion.

27. The preparation method according to any one of claims 15 - 26, wherein, there are two or more photosensitive elements disposed on the substrate, and after removing the compensation portion, the substrate is cut to form a plurality of photosensitive components.

28. The preparation method according to claim 15, wherein, after the compensation portion is removed, an isolation channel is formed, the isolation channel includes a surrounding channel and a communication channel, the isolation channel surrounds the photosensitive element, the communication channel is a channel extending away from the photosensitive element starting from the surrounding channel, and the surrounding channel communicates with the communication channel.

29. The preparation method according to claim 28, wherein, when the compensation portion is removed, the end of the communication channel away from the surrounding channel is sealed with a sealing material.

30. A photosensitive component, wherein, the photosensitive component is the photosensitive component prepared by the preparation method according to any one of claims 1 - 29.

31. A photosensitive component, wherein, It includes a substrate, a photosensitive element, and a molding body integrally combined with the substrate. The photosensitive element is disposed on the substrate, and the molding body covers at least a part of the top surface of the photosensitive element; On the substrate and along the edge of the photosensitive element, there is an isolation channel, and the edge of the photosensitive element and the molding body enclose to form the isolation channel; The isolation channel separates the molding body from the side surface of the photosensitive element, so that the molding body does not contact the side surface of the photosensitive element.

32. The photosensitive component according to claim 31, wherein, The isolation channel includes a surrounding channel and a communication channel, and at least one of the communication channels is provided on the surrounding channel.

33. The photosensitive component according to claim 32, wherein, The surrounding channel is a closed channel surrounding the photosensitive element, the communication channel is a channel extending away from the photosensitive element starting from the surrounding channel, and the surrounding channel is in communication with the communication channel.

34. The photosensitive component according to any one of claims 32-33, wherein, The photosensitive element includes a photosensitive area and a non-photosensitive area. The non-photosensitive area is located at the edge of the photosensitive area and surrounds the photosensitive area, and the molding body covers at least a part of the non-photosensitive area.

35. The photosensitive component according to claim 34, wherein, The surrounding channel surrounds the edge of the non-photosensitive area.

36. The photosensitive component according to claim 35, wherein, Electronic components are provided on the substrate, and the electronic components are located outside the surrounding channel.

37. The photosensitive component according to claim 34, wherein, A stepped portion is provided on the upper surface of the non-photosensitive area. The stepped portion surrounds the photosensitive area and is higher than the photosensitive element.

38. The photosensitive component according to claim 37, wherein, The molding body covers at least a part of the stepped portion, and the covered stepped portion is away from the photosensitive area.

39. A panel, wherein, It includes a plurality of photosensitive components according to any one of claims 31-38 arranged at intervals.

40. An imaging module, wherein, It includes the photosensitive component according to any one of claims 31-38 and a light-transmitting component. The light-transmitting component is disposed on the light-sensing path of the photosensitive component.

41. A method for manufacturing an imaging module, wherein, It includes the following steps: Providing the photosensitive component according to any one of claims 31-38 and the light-transmitting component; Placing the light-transmitting component on the light-sensing path of the photosensitive component.

42. The method for manufacturing an imaging module according to claim 41, wherein, The light-transmitting component is disposed on the light-sensing path of the photosensitive component.

Images