Chip connector
By combining rotating and pushing components, the problem of uneven force applied by the heat dissipation module to the chip module during chip connector rotation is solved, achieving uniform force and stable heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD
- Filing Date
- 2020-09-28
- Publication Date
- 2026-04-17
AI Technical Summary
The heat dissipation module of the existing chip connector applies uneven force to the chip module when rotating, resulting in uneven stress.
The structure employs a combination of rotating and pushing components. Through the cooperation of the first and second pivot axes, the pushing component can rotate and float, maintaining horizontal contact with the chip and ensuring uniform force distribution.
This achieves uniform force distribution on the chip during rotation, improving heat dissipation and component stability.
Smart Images

Figure CN112260024B_ABST
Abstract
Description
[Technical Field]
[0001] This invention relates to a chip connector, and more particularly to a chip connector with a heat dissipation support structure. [Background Technology]
[0002] Chinese Utility Model Patent No. CN202712640U discloses an electrical connector including a base, conductive terminals held in the base, a cover rotatable around the base, and a heat dissipation module rotatable around the cover and used to fix the front end of the cover to the base housing and assembled on the cover. The cover, base, and housing are all pivotally connected. The cover and base form a receiving portion for accommodating the chip module, and the bottom surface of the heat dissipation module is exposed within the receiving portion, thereby achieving heat transfer from the chip module. However, the direct contact between the heat dissipation module and the chip module can cause uneven force application to the chip module during rotation.
[0003] Therefore, it is desirable to design an improved chip connector to overcome the above-mentioned defects. [Summary of the Invention]
[0004] The technical problem to be solved by the present invention is to provide a chip connector with a heat dissipation support structure.
[0005] To solve the above problems, the present invention can adopt the following technical solution:
[0006] A chip connector includes a connector body carrying conductive terminals and a heat dissipation support assembly. The connector body has a first end and a second end opposite to each other. The heat dissipation support assembly includes a rotating member and a pushing member. The rotating member is pivotally connected to the first end of the connector body via a first pivot axis and rotates and opens and closes relative to the connector body along the first pivot axis. The rotating member is frame-shaped and has a central opening and two side walls perpendicular to the first pivot axis. The pushing member is accommodated in the central opening and has two side surfaces corresponding to the two side walls of the rotating member. The side walls and side surfaces are respectively provided with a second pivot axis and a second pivot hole that cooperate with each other. The second pivot axis and the second pivot hole are located at the middle position of the side wall along the longitudinal extension direction, so that the pushing member can rotate and float around the second pivot axis.
[0007] Compared with the prior art, the pusher structure of the present invention can remain horizontal by rotating and floating, so that the pusher contacts the chip horizontally and ensures that the chip is subjected to uniform force. [Attached Image Description]
[0008] Figure 1 This is a perspective view of the chip connector of the present invention, which is equipped with a heat dissipation module.
[0009] Figure 2 yes Figure 1The image shown is a stereoscopic view from another angle.
[0010] Figure 3 yes Figure 1 The image shows an exploded 3D view of the chip connector and heat dissipation module.
[0011] Figure 4 yes Figure 3 A 3D view of the chip connector, in which the heat dissipation support is rotated at a certain angle.
[0012] Figure 5 This is a 3D view of the heat dissipation module.
[0013] Figure 6 This is a 3D view of the actuator.
[0014] Figure 7 yes Figure 6 The exploded view shown is a three-dimensional diagram.
[0015] Figure 8 yes Figure 7 Another perspective of the exploded 3D view.
[0016] Figure 9 yes Figure 3 A more detailed 3D view of the chip connector.
[0017] Figure 10 This is a 3D view of the heat dissipation mounting component.
[0018] Figure 11 This is a side view of the heat dissipation fixture being assembled into the chip connector.
[0019] Figure 12 yes Figure 11 A schematic diagram of the cross-section along the positioning post.
[0020] [Component Symbol Explanation]
[0021] Chip connector 100, side 221
[0022] Connector body 10, connecting hole 222
[0023] Containment cavity 101 Floating plate 23
[0024] Insulating body 11 First clearance groove 231
[0025] First end 111 push plate 24
[0026] Second end 112 Second clearance groove 241
[0027] Mounting bracket 12, heat dissipation module 30
[0028] Positioning post 121 Contact part 31
[0029] Positioning structure 13 Connecting column 32
[0030] Screw 131 Heat dissipation fixing member 40
[0031] Socket 132 Clamping port 401
[0032] Spring 133 Hook 41
[0033] Heat dissipation support assembly 20 First pivot shaft 51
[0034] Rotating member 21 Second pivot shaft 52
[0035] Pushing member 22 Third pivot shaft 53
[0036] Central opening 210 Convex portion 530
[0037] Side wall 211 Fourth pivot shaft 54
[0038] Clamping groove 212 Fourth pivot hole 504
[0039] Support surface 213
[0040] The following specific embodiments will further illustrate the present invention in conjunction with the above drawings.
Specific Embodiments
[0041] Refer Figures 1 to 12 As shown, the present invention discloses a chip connector 100 for testing a chip. The chip connector 100 shown includes a connector body 10 carrying conductive terminals and a heat dissipation support assembly 20, and a heat dissipation module 30 and a heat dissipation fixing member 40 are also installed. A chip 60 (refer Figure 12 As shown) is installed in the connector body 10 and is connected to an external circuit board (not shown) through the connector body. During the testing process of the chip, heat is dissipated through the heat dissipation module 30 to ensure that the chip connector 100 operates at an appropriate temperature. The heat dissipation support assembly 20 is located between the connector body 10 and the heat dissipation module 30 and pivotally connects the connector body 10 and the heat dissipation module 30 at the same time. The heat dissipation fixing member 40 is a metal support frame structure for stabilizing the heat dissipation module 30. The following will introduce each structure in detail.
[0042] Refer Figure 3-4 、 Figure 9 As shown, the connector body 10 includes an insulating body 11 and a fixing base 12. Conductive terminals (not shown) are fixed in the insulating body 11, and the fixing base 12 is disposed around the insulating body 11. The fixing base 12 and the insulating body 11 together form an upwardly penetrating receiving cavity 101 for receiving the chip 60, [[ID=……]] Figure 12Shows the structure inside the receiving cavity 101, and the chip 60 is received in the receiving cavity 101. The connector body 10 has opposite first end 111 and second end 112. It can be understood that the chip connector 100 and its components can all define corresponding first end and second end for convenient description. The first end of the fixing base 12 is provided with a first pivot hole (not labeled), and the first pivot shaft 51 passes through the rotating member 21 and is installed in the first pivot hole. The second end of the fixing base 12 is provided with a third pivot hole (not labeled) and a third pivot shaft 53. The third pivot shaft passes through the third pivot hole and has cylinders at both ends, and the cylinders form a convex portion 530. The fixing base 12 is provided with upwardly protruding positioning columns 121 at its first end and second end. An elastically expandable and contractible positioning structure 13 is provided inside the positioning column, and the positioning structure 13 abuts against the heat dissipation module 30 upward. Figure 12 As shown. The positioning structure 13 includes a screw 131, a sleeve 132 and a spring 133. Specifically, the screw 131 is installed into the sleeve 132 from top to bottom, and the spring 133 is installed into the sleeve 132 from bottom to top and is located between the screw and the sleeve. The screw 133 is fixed in the positioning column 121 through the bottom thread, and the sleeve 132 can move up and down in the positioning column 121. Combining Figure 12 As shown, when the sleeve 132 is forced to be abutted, the spring 133 contracts and the sleeve 132 moves downward. When the force is withdrawn, the spring 133 expands freely and the sleeve 132 moves upward, thereby abutting against the heat dissipation module 30 upward.
[0043] Continue to refer to Figure 3-4 、 Figure 9 As shown, the heat dissipation support assembly 20 includes a rotating member 21 and a pushing member 22. In this embodiment, the rotating member is a metal part and the pushing member is an insulator. The rotating member 21 is pivotally connected to the first end 111 of the connector body 10 through the above-mentioned first pivot shaft 51 and rotates and opens and closes relative to the connector body 10 along the first pivot shaft 51. The rotating member 21 is in a frame shape and has a central opening 210 and two side walls 211 perpendicular to the first pivot shaft 51. Combining Figure 6-8 As shown, the pushing member 22 is accommodated in the central opening 210 and has two sides 221 corresponding to the two side walls 211 of the rotating member. The side walls 211 and the sides 221 are respectively provided with a second pivot shaft 52 and a second pivot hole (not labeled) that cooperate with each other. The second pivot shaft 52 and the second pivot hole are located at the middle position of the side wall 211 along the longitudinal extension direction, so that the pushing member 22 can rotate and float around the second pivot shaft 52. By rotating and floating, the pushing member 22 can maintain horizontal, so that the pushing member 22 can maintain horizontal contact with the chip and ensure uniform force on the chip.
[0044] Refer to Figure 6-8As shown, the above-mentioned driving member 22 includes a floating plate 23 and a driving plate 24 housed in the floating plate. The two side surfaces of the floating plate 23 are provided with the above-mentioned second pivot shafts 52, and the driving plate 24 is detachably fixed within the floating plate 23. Specifically, the floating plate 23 is generally square in shape, and it has a central opening for installing the driving plate 24. The second pivot shafts 52 do not pivotally connect the driving plate 24. Second relief grooves 241 are provided on two side surfaces of the driving plate 24 corresponding to the second pivot shafts 52, such that the driving plate 24 will not connect to or even touch the second pivot shafts 52. The driving plate 24 is fixed to the floating plate 23 by hard interference or by other fixing methods, such as engaging a protrusion with a groove, screw fixing, etc., to combine the two. In short, when the driving member 22 rotates and floats around the second pivot shafts 52, the driving plate 24 will rotate and float together with the floating plate 23. The floating plate 23 is provided with first relief grooves 231 at its two end faces. Specifically, two first relief grooves 231 are provided at each end face to avoid the positioning structure 13 provided on the connector body 10, such that the positioning structure 13 passes through the first relief grooves 231 and abuts against the heat dissipation module 30 above the driving member 22. When installing the heat dissipation module 30, the positioning structure 13 can abut and horizontally position the heat dissipation module 30 in advance, such that the heat dissipation module is in a horizontal state when it contacts the chip module. The driving member 22 is in an overall shape with a central opening, and the heat dissipation module 30 passes through the opening and contacts the chip 60 in the receiving cavity 101 to transfer heat.
[0045] Refer to Figure 3 、 5 As shown in FIGS. 12, the heat dissipation module 30 includes a contact portion 31 protruding downward. The contact portion 31 passes through the opening of the driving member 22 and abuts against the chip 60 in the receiving cavity 101. The heat dissipation module 30 includes a connecting column 32 connected to the driving member 22. The driving member 22 is provided with connecting holes 222 at its four right angles. The diameter dimension of the connecting column 32 is smaller than the diameter dimension of the connecting holes 222, ensuring that there is a slight floating space between the driving member 22 and the heat dissipation module 30, such that after the heat dissipation module 30 is assembled into the heat dissipation support assembly 20, the driving member 22 can maintain its rotational floating function.
[0046] Refer to Figure 10-11 As shown, a heat dissipation fixing member 40 is further installed on the chip connector 100. The heat dissipation fixing member is fixed by a fourth pivot shaft 54 passing through a fourth pivot hole 504 provided at the second end of the rotating member 21, and the heat dissipation fixing member 40 can rotate and close around the fourth pivot shaft 54. The third pivot shaft 53 has a convex portion 530 protruding outward. One end of the heat dissipation fixing member 40 has a locking port 401 stuck on the convex portion 530, and the other end is provided with a hook 41 that can be latched on the rotating member 21. When rotated and closed to a certain angle, the locking port 401 catches the convex portion 530, and when the heat dissipation fixing member 40 is further rotated downward, the hook 41 catches the latching groove 212 provided at the first end of the rotating member 21 (marked in Figure 4within).
[0047] In summary, the first end of the rotating component 21 is pivotally connected to the connector body 10 via a first pivot shaft 51 mounted on the fixed base 12, and rotates and opens relative to the connector body 10 around the first pivot shaft 51. The second end of the rotating component 21 is not pivotally connected to the connector body 10, allowing the user to operate it by rotating it to open and close, thus enabling the rotating component 21 to rotate and open around the first pivot shaft. The pushing component 22 is pivotally connected to the rotating component 21, forming a heat dissipation support assembly 20, the relationship between the two of which has been described in detail above. It can be understood that the assembly sequence of the heat dissipation support assembly 20 here should be as follows: the pushing plate 24 is fixed into the floating plate 23 to form the pushing component 22; the pushing component 21 and the rotating component 22 are pivotally connected via a second pivot shaft 52 to form the heat dissipation support assembly 20; the heat dissipation support assembly 20 is pivotally connected to the first pivot shaft 51 via the first end of the rotating component 22. Next, the connecting post 32 of the heat dissipation module 30 is assembled with the connecting hole 222 of the pusher 22. The rotating member 21 has upward supporting surfaces 213 at its first and second ends to support the heat dissipation module 30. However, under normal conditions, the heat dissipation module 30 is a distance away from the supporting surface 213, and the rotating member 21 will not touch the heat dissipation module 30 when rotating at a small angle. Figure 12 As shown. Finally, the heat dissipation fastener 40 is installed. The second end of the heat dissipation fastener 40 is pivotally connected to the rotating member 21 through the fourth pivot shaft 54, so that it rotates and closes around the fourth pivot shaft 54. At the same time, the retaining port 401 at the second end can retain the protrusion 530. Finally, the first end hook 41 of the heat dissipation fastener 40 is engaged in the retaining groove 212.
[0048] In actual use, the chip 60 is first assembled into the connector body 10, and the heat dissipation support 20 is adjusted to a basically closed state before installing the heat dissipation module 30 and the heat dissipation fixing component 40. Otherwise, excessive weight of the heat dissipation module 30 may damage the heat dissipation support 20. In the prior art, the heat dissipation support component 20 or other rotating components of the chip connector do not have the technical feature of the rotating component 21 and the pushing component 22 being movably connected by a pivot axis. This causes uneven force on the chip due to angle issues when the rotating component rotates. In this invention, the heat dissipation module 30 exerts a downward pressure on the heat dissipation support component 20. When the rotating component 21 rotates, this downward pressure presses down on the pushing component 22, causing the pushing component 22 to rotate and float around the pivot axis, thereby maintaining a horizontal state. Figure 4 As shown, the rotating component 21 rotates at a certain angle, while the pushing component 22 remains horizontal.
[0049] The above embodiments are preferred embodiments of the present invention, but not all embodiments. Any equivalent changes to the technical solutions of the present invention made by those skilled in the art through reading this specification are covered by the claims of the present invention.
Claims
1. A chip connector comprising a connector body carrying electrically conductive terminals and a heat dissipation support assembly, the connector body having opposite first and second ends; characterized by: The heat dissipation support assembly includes a rotating component and a pushing component. The rotating component is pivotally connected to the first end of the connector body via a first pivot axis and rotates and opens / closes relative to the connector body along the first pivot axis. The rotating component is frame-shaped and has a central opening and two side walls perpendicular to the first pivot axis. The pushing component is housed in the central opening and has two side surfaces corresponding to the two side walls of the rotating component. The two side walls of the rotating component are provided with second pivot holes, and the two side surfaces of the pushing component are provided with second pivot axes that cooperate with the second pivot holes. The second pivot axis and the second pivot hole are located at the middle position of the side wall along the longitudinal extension direction, so that the pushing component can rotate and float around the second pivot axis.
2. The chip connector of claim 1, wherein: The pushing component includes a floating plate and a pushing plate housed within the floating plate. The floating plate has the aforementioned second pivot shaft on both sides, and the pushing plate is detachably fixed within the floating plate.
3. The chip connector as described in claim 1, characterized in that: The chip connector includes a heat dissipation fixing component. The second end of the connector body has an outwardly protruding protrusion. One end of the heat dissipation fixing component has a retaining hole that engages with the protrusion, and the other end is fastened to the rotating component.
4. The chip connector as described in claim 1, characterized in that: The connector body includes an insulating body and a fixing base. The conductive terminal is fixed to the insulating body, and the fixing base is arranged around the insulating body. The first end of the fixing base is provided with a first pivot hole, and the first pivot shaft passes through the rotating member and is installed in the first pivot hole.
5. The chip connector as described in claim 4, characterized in that: The second end of the fixed base is provided with a third pivot hole and a third pivot shaft. The third pivot shaft passes through the third pivot hole and has cylinders at both ends thereon, and the cylinders form protrusions.
6. The chip connector as described in claim 1, characterized in that: The rotating component has upward-facing support surfaces at its first and second ends to support a heat dissipation module.
7. The chip connector as described in claim 2, characterized in that: The push plate is fixed inside the floating plate and floats and rotates with the floating plate.
8. The chip connector as described in claim 6, characterized in that: The pusher has an opening in the middle, through which the heat dissipation module enters the connector body.
9. The chip connector as described in claim 6, characterized in that: The connector body includes a fixing base, and the fixing base has upwardly protruding positioning posts at its first and second ends. The positioning posts have elastically retractable positioning structures inside, and the positioning structures abut upward against the heat dissipation module.
10. The chip connector as described in claim 9, characterized in that: The first and second ends of the pusher are provided with relief grooves corresponding to the positioning structure. The positioning structure passes upward through the relief grooves and then abuts against the heat dissipation module.
Citation Information
Patent Citations
Electric connector
CN202712640U
Chip connector
CN213278646U