Resin pasting machine

Abstract

A resin bonding machine is provided that can reduce variations in the thickness of resin applied to a wafer. The resin bonding machine comprises a processing chamber, which includes a holding portion, a worktable, a resin supply portion, a moving portion, and a curing portion. The holding portion holds the wafer, the worktable is opposed to the holding portion, the resin supply portion supplies liquid resin to the worktable, the moving portion brings the holding portion and the worktable into relative proximity, and the curing portion cures the liquid resin. A temperature measuring portion measures the temperature within the processing chamber, and a control portion controls each mechanism. The control portion includes a correlation data storage portion that records correlation data between temperature and the amount of movement of the moving portion at each temperature as data for maintaining a constant thickness of the applied resin even at different temperatures. The control portion, referring to the correlation data, sets the amount of movement in the moving portion that corresponds to the temperature measured by the temperature measuring portion, thereby coating the wafer with resin to a predetermined thickness.

Description

Technical Field

[0001] The present invention relates to a resin bonding machine for coating one surface of a wafer with a resin. Background Art

[0002] A technique is known in which a holding portion holding a wafer is brought close to a stage supplying liquid resin to thereby coat one surface of the wafer with resin (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-168565

[0004] When the bump surface of a bumped chip is coated with resin to absorb unevenness and then cut or ground from the opposite surface, if the thickness of the resin is not constant, there is a problem of deviation in the cutting depth or thickness after grinding. In a resin bonding machine, the liquid resin is usually cured after being coated on the chip. Therefore, the heat generated when the liquid resin is cured remains in the resin bonding machine, and the holder or workbench sometimes expands. In addition, the degree to which the holder and the workbench are brought close to each other in order to coat the chip with resin is determined by a fixed value. However, since the holder or the workbench expands and contracts according to the temperature, the distance between the holder and the workbench actually varies according to the temperature, and the amount of pressure of the liquid resin on the chip also varies. Therefore, there is a problem that the resin cannot be coated with uniform thickness. Summary of the Invention

[0005] The present invention has been made in view of this problem, and an object of the present invention is to provide a resin bonding machine capable of reducing thickness variations of a resin applied to a wafer.

[0006] In order to solve the above-mentioned problems and achieve the purpose, the resin bonding machine of the present invention coats a desired thickness of resin on one side of a wafer, wherein the resin bonding machine comprises: a processing chamber, which includes a holding portion, a workbench, a resin supply portion, a moving portion, and a curing portion, wherein the holding portion holds the wafer, the workbench is opposite to the holding portion, the resin supply portion supplies liquid resin to the workbench, the moving portion brings the holding portion and the workbench relatively close, and the curing portion cures the liquid resin coated on the wafer; a temperature measuring portion, which measures the temperature in the processing chamber; and a control portion, which controls each mechanism The control unit includes a correlation data storage unit that records correlation data between the temperature and the movement amount of the moving unit at each temperature as data for making the thickness of the coated resin constant even at different temperatures, and the correlation data is obtained based on the measurement results of the thickness of the coated resin when the moving unit is moved the same amount in the processing chamber at different temperatures. With reference to the correlation data, the movement amount that matches the temperature measured by the temperature measuring unit is set in the moving unit, and the wafer is coated with resin of a specified thickness.

[0007] The temperature measuring unit may measure the temperature of any one of the holding unit and the stage.

[0008] The temperature measuring unit may measure the temperatures of the holding unit and the stage, and set an average value thereof as the temperature of the resin sticking machine.

[0009] The present invention can reduce thickness variations of the resin coating the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a perspective view showing a configuration example of the resin sticking machine according to the first embodiment.

[0011] Figure 2 It shows Figure 1 A cross-sectional view of the main parts of the sheet loading operation in the resin bonding machine.

[0012] Figure 3 It shows Figure 1 A cross-sectional view of the main parts of the wafer holding action in the resin bonding machine.

[0013] Figure 4 It shows Figure 1 A cross-sectional view of the main parts of the resin providing action in the resin pasting machine.

[0014] Figure 5 Yes Figure 1 A cross-sectional view illustrating the amount of movement in a resin pasting machine.

[0015] Figure 6 It is shown in Figure 1 A graph showing the correlation between the temperature in the processing chamber and the thickness of the coated resin at a predetermined movement amount in a resin sticking machine.

[0016] Figure 7 It is shown in Figure 1 A graph showing the correlation between the temperature in the processing chamber and the amount of movement when a resin having a predetermined resin thickness is applied in a resin laminating machine.

[0017] Figure 8 (A) and Figure 8 (B) is correct Figure 1 A cross-sectional view illustrating the main parts of the resin coating operation in the resin pasting machine.

[0018] Figure 9 Yes Figure 1 A cross-sectional view illustrating the main parts of the curing operation in a resin pasting machine.

[0019] Figure 10 Yes Figure 1 A cross-sectional view of the main parts illustrating the remaining part removal operation in a resin pasting machine.

[0020] Figure 11 (A) and Figure 11 (B) is a cross-sectional view of a main portion showing the tape sticking operation of the resin sticking machine according to the second embodiment.

[0021] Figure 12 It is a cross-sectional view of a main part showing the resin coating operation of the resin sticking machine according to the second embodiment.

[0022] Description of labels

[0023] 1: Resin pasting machine; 10: Processing chamber; 15: Temperature measuring unit; 15-1: Thermocouple; 15-2: Radiation thermometer; 20: Holding unit; 27: Movement amount; 30: Workbench; 40: Resin supply unit; 50: Moving unit; 60: Hardening unit; 70: Control unit; 71: Correlation data storage unit; 72, 73: Correlation data; 90: Sheet supply unit; 92: Sheet; 97: Thickness; 110: Wafer detection unit; 120: Residue removal unit; 130: Tape pasting unit; 200: Wafer; 201: Front side; 204: Bump; 205: Back side; 210: Thickness; 220: Tape; 221: Tape base material; 222: Adhesive layer; 225: Ring frame; 301: Liquid resin; 302: Resin; 311, 312: Resin thickness. DETAILED DESCRIPTION

[0024] The methods (embodiments) for implementing the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the constituent elements described below include substantially the same constituent elements that can be easily thought of by those skilled in the art. In addition, the structures described below can be appropriately combined. Furthermore, various omissions, replacements, or changes in the structure can be made without departing from the scope of the present invention.

[0025] [First embodiment]

[0026] A resin sticking machine 1 according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 1 is a perspective view showing a configuration example of a resin bonding machine 1 according to a first embodiment. The resin bonding machine 1 coats a front surface 201, which is one surface of a wafer 200, with a resin 302 (see FIG. Figure 9 and Figure 10 ) device.

[0027] In the first embodiment, the wafer 200 to be coated with the resin 302 of the resin bonding machine 1 is, for example, a disk-shaped semiconductor wafer or an optical device wafer made of silicon, sapphire, gallium arsenide, etc. Since it is the object of processing by the processing method of the first embodiment performed by the resin bonding machine 1, it is also called a workpiece. The wafer 200 has a device area 202 (see FIG. 201 ) on which a device is formed on the front surface 201. Figure 3 ) and the peripheral remaining area 203 surrounding the device area 202 (refer to Figure 3 ).

[0028] The wafer 200 has a plurality of bumps 204 on the front side of the device that function as electrodes (see FIG. Figure 3 ). The bump 204 protrudes from the front surface of the device. The device has unevenness due to the bump 204 mounted on the front surface. The back surface 205 of the wafer 200 opposite to the front surface 201 (see Figure 3 ) is formed to be flat.

[0029] In the first embodiment, since the chip 200 has bumps 204 on the front side of the device and has unevenness, the effect of the resin bonding machine 1 of the first embodiment of the present invention is more significant, but the present invention is not limited to this. For example, it can be a packaging substrate with unevenness formed by using a so-called molded resin to form a sealant that seals the device and the unillustrated wires formed on the device by wire bonding, or it can be a method without unevenness, or it can be a sliced ​​chip before the device is formed.

[0030] like Figure 1 As shown, the resin bonding machine 1 includes a processing chamber 10, a temperature measuring unit 15 for measuring the temperature in the processing chamber 10, and a control unit 70 for controlling the various mechanisms. The processing chamber 10 of the resin bonding machine 1 includes a holding unit 20 for holding a wafer 200, a worktable 30 facing the holding unit 20, a resin supply unit 40 for supplying liquid resin 301 to the worktable 30, a moving unit 50 for bringing the holding unit 20 and the worktable 30 closer together to coat the wafer 200 with the liquid resin 301, and a curing unit 60 for curing the liquid resin 301 coated on the wafer 200.

[0031] The holding portion 20 holds the wafer 200 from above by suction at its lower end. The holding portion 20 is supported by the moving portion 50 for vertical movement. The holding portion 20 further includes a pressing force measuring portion 22 located vertically above the position where the wafer 200 is held. The pressing force measuring portion 22 measures the downward pressing force applied by the holding portion 20, thereby measuring the pressing force applied when the holding portion 20 expands the liquid resin 301.

[0032] The work table 30 has a holding surface 31 slightly larger than the diameter of the wafer. The work table 30 uses the holding surface 31 to hold a sheet 92 supplied from a sheet supply unit 90 (described later). Liquid resin 301 is supplied from the resin supply unit 40 onto the sheet 92 held by the holding surface 31. A curing unit 60 is provided vertically below the work table 30, and the work table 30 and the curing unit 60 are integrally formed. The curing unit 60 below cures the liquid resin 301 supplied onto the sheet 92 held by the holding surface 31, while interposing the sheet 92 therebetween.

[0033] The resin supply unit 40 includes a resin supply source 41 serving as a supply source for the liquid resin 301, and a nozzle 42 for introducing the liquid resin 301 from the resin supply source 41 toward the holding surface 31 of the stage 30. In the first embodiment, the liquid resin 301 supplied by the resin supply unit 40 preferably has a viscosity of 0.5 Pa·s or more and 400 Pa·s or less.

[0034] In the first embodiment, the liquid resin 301 provided by the resin supply unit 40 uses a UV-curing resin. However, the present invention is not limited to this, and a thermosetting resin may also be used. When using a UV-curing resin, the liquid resin 301 provided by the resin supply unit 40 is composed, for example, of a curing resin component such as a UV-curing resin and a binder polymer component such as an acrylic polymer. Furthermore, when using a thermosetting resin, the liquid resin 301 provided by the resin supply unit 40 is composed of a thermosetting resin component such as an epoxy resin or a phenolic resin and a binder polymer component such as an acrylic polymer. Furthermore, the liquid resin 301 provided by the resin supply unit 40 may be a mixture of a UV-curing resin and a thermosetting resin.

[0035] In the first embodiment, since ultraviolet curing resin is used as the liquid resin 301, the ultraviolet rays 62 (see Figure 9 ) of the plurality of ultraviolet irradiation sections 61 (see Figure 2 The curing section 60 is arranged horizontally in a manner such as (e.g., a UV irradiation section 61) is, for example, an UV LED. Therefore, in the first embodiment, the workbench 30 and the sheet 92 described later are formed of a material that transmits at least a portion of the UV rays 62. The workbench 30 is, for example, a glass workbench that is transparent to UV rays. Furthermore, the present invention is not limited to this. For example, the following embodiment is also possible: a thermosetting resin is used as the liquid resin 301, a heater is used as the curing section 60, and the workbench 30 and sheet 92 are formed of a material with sufficient thermal conductivity.

[0036] The control unit 70 controls various components and mechanisms to cause the resin bonding machine 1 of the first embodiment to perform various operations. The control unit 70 is a computer comprising: an arithmetic processing unit including a microprocessor such as a CPU (Central Processing Unit); a storage device including memory such as ROM (Read Only Memory) or RAM (Random Access Memory); and an input / output interface device. The arithmetic processing unit of the control unit 70 performs arithmetic processing according to a computer program stored in the storage device and outputs control signals for controlling the resin bonding machine 1 to the various components and mechanisms of the resin bonding machine 1 via the input / output interface device.

[0037] The control unit 70 includes a correlation data storage unit 71. The function of the correlation data storage unit 71 is to record predetermined correlation data 73 (see Figure 7 The related relationship data 73 will be described later.

[0038] like Figure 1 As shown, the resin bonding machine 1 further includes cassettes 81 and 82, a loading and unloading unit 83, and a conveying unit 86. Both cassettes 81 and 82 are containers having multiple slots for wafers 200. Cassette 81 stores wafers 200 before processing by the resin bonding machine 1, while cassette 82 stores wafers 200 after processing by the resin bonding machine 1.

[0039] The loading and unloading unit 83 unloads the unprocessed wafers 200 from the cassette 81 to the temporary placement table 111 of the wafer inspection unit 110 described later, and loads the processed wafers 200 from the excess portion removal unit 120 described later into the cassette 82 .

[0040] The conveying unit 86 conveys the chip 200 whose diameter has been measured and whose center and direction have been aligned using the chip detection unit 110 from the temporary placement table 111 to the holding unit 20, and conveys the chip 200 coated with resin 302 on the front side 201 from the holding unit 20 to the remainder removal unit 120.

[0041] like Figure 1 As shown, the resin laminating machine 1 further includes a sheet supply unit 90. The sheet supply unit 90 pulls out a sheet 92 from a sheet roll 91 that is a roll of a sheet 92 having two flat surfaces, cuts the sheet 92 into pieces according to a predetermined length, and passes through an adsorption unit 94 (see FIG. 1 ) provided below the sheet conveying unit 93 in the vertical direction. Figure 2) sucks and holds the cut sheet 92, and the sheet conveying unit 93 driven by the driving unit 95 conveys the sheet 92 sucked and held by the suction unit 94 to the holding surface 31 of the workbench 30. In the first embodiment, the sheet 92 is formed to be slightly larger than the holding surface 31 of the workbench 30. In the first embodiment, the material of the sheet 92 is a material that transmits at least a portion of the ultraviolet rays 62, such as polyolefin (PO) or polyethylene terephthalate (PET).

[0042] like Figure 1 As shown in FIG. 1 , the resin bonding machine 1 further includes a wafer detection unit 110. Figure 1 As shown, the wafer inspection unit 110 further includes a temporary placement table 111, an illumination unit 112, and an imaging unit 113. The illumination unit 112 is formed to extend horizontally, which is the radial direction of the wafer 200, below the temporary placement table 111 in the thickness direction of the wafer 200. It irradiates light toward the wafer 200 placed on the temporary placement table 111 from above. The imaging unit 113 is provided downwardly, above the center of the temporary placement table 111 in the thickness direction of the wafer 200, to capture an image of the wafer 200 placed on the temporary placement table 111 below, and to detect the light emitted from the illumination unit 112. The imaging unit 113 captures the image of the wafer 200 to detect the center of the wafer 200, and detects the radial shape of the wafer 200 by detecting the light emitted from the illumination unit 112.

[0043] The wafer inspection unit 110 can measure the wafer diameter, which is the radial size of the wafer 200, based on the detection results of the radial shape of the wafer 200 captured by the imaging unit 113. Furthermore, the wafer inspection unit 110 can perform center alignment and direction alignment of the wafer 200 based on the detection results of the center and radial shape of the wafer 200 captured by the imaging unit 113.

[0044] like Figure 1 As shown, the resin bonding machine 1 further includes a surplus portion removing unit 120. The surplus portion removing unit 120 includes a holding table 121 for holding the wafer 200 coated with the resin 302 on the front surface 201 thereof, and a cutter 122 for cutting and removing the surplus portion of the resin 302 coating the front surface 201 of the wafer 200 held by the holding table 121, which extends radially beyond the outer edge of the wafer 200.

[0045] Hereinafter, the operation of the resin sticking machine 1 according to the first embodiment will be described. Figure 2 It shows Figure 1 sectional view of the main part of the sheet loading operation in the resin bonding machine 1. Figure 3It shows Figure 1 A cross-sectional view of a main portion of a wafer holding operation in the resin bonding machine 1. Figure 4 It shows Figure 1 A sectional view of a main portion of a resin pasting machine 1 showing a resin applying action. Figure 5 Yes Figure 1 A cross-sectional view illustrating a movement amount 27 in the resin sticking machine 1. Figure 6 It is shown in Figure 1 Graph showing the correlation between the temperature in the processing chamber 10 and the resin thickness 312 of the coated resin 302 at a predetermined movement amount 27 in the resin sticking machine 1 . Figure 7 It is shown in Figure 1 Graph showing the correlation between the temperature in the processing chamber 10 and the movement amount 27 when the resin 302 having a predetermined resin thickness 312 is applied in the resin sticking machine 1 . Figure 8 (A) and Figure 8 (B) is correct Figure 1 A cross-sectional view illustrating a main portion of a resin coating operation in a resin pasting machine 1. Figure 8 (A) shows the holding portion 20 and the workbench 30 before approaching. Figure 8 (B) shows the holding portion 20 and the table 30 after they have approached each other. Figure 9 Yes Figure 1 A cross-sectional view illustrating a main portion of a curing operation in a resin pasting machine 1. Figure 10 Yes Figure 1 A sectional view of a main part for explaining a remainder removing operation in the resin sticking machine 1.

[0046] like Figure 2 As shown, the resin bonding machine 1 performs the following sheet loading operation: the sheet supply unit 90 supplies a sheet 92 to the holding surface 31 of the work table 30. The sheet loading operation is a process that can be omitted in the series of operations of the resin bonding machine 1 for coating the front surface 201 of the wafer 200 with resin 302. However, it is preferably performed because the sheet 92 can suppress contamination caused by the liquid resin 301 supplied to the holding surface 31 of the work table 30.

[0047] like Figure 3 As shown, the resin bonding machine 1 performs the following wafer holding operation: the holding portion 20 holds the wafer 200. Figure 3As shown, the holding unit 20 includes a suction unit 20-2 having a flat holding surface 20-1 formed on its lower surface, and a frame 20-3 that secures the suction unit 20-2 by inserting it into a recessed portion in the center of the lower surface. The suction unit 20-2 has a disk shape, made of porous ceramic or the like having multiple pores, and is connected to a vacuum source (not shown) via a vacuum suction path (not shown). The entire holding surface 20-1 is used to suction and hold the wafer 200.

[0048] During the wafer holding operation, first, the moving part 50 makes the holding surface 20-1 of the holding part 20 sufficiently away from the holding surface 31 of the workbench 30. During the wafer holding operation, the transporting part 86 then transports the wafer 200, the wafer diameter of which has been measured by the wafer detection part 110 and the center and direction alignment have been performed, to the bottom of the holding surface 20-1 of the holding part 20 with the back side 205 facing upward in the vertical direction. During the wafer holding operation, the holding part 20 uses the holding surface 20-1 to attract the back side 205 facing upward of the wafer 200 transported to the bottom of the holding surface 20-1. Thus, during the wafer holding operation, as shown in FIG. Figure 3 As shown, the holding portion 20 holds the wafer 200 by suction using the holding surface 20 - 1 in a state where the front surface 201 on which the bumps 204 are mounted faces the holding surface 31 of the stage 30 below.

[0049] like Figure 4 As shown, the resin sticking machine 1 performs the following resin supply operation: the resin supply unit 40 supplies liquid resin 301 to the table 30 facing the holding unit 20 .

[0050] In the resin supply operation, specifically, first, the control unit 70 determines the desired resin thickness 311 (see FIG. 3 ) of the liquid resin 301 coated on the front surface 201 of the wafer 200 based on the wafer diameter obtained by the wafer detection unit 110. Figure 5 ), calculate the appropriate amount of liquid resin 301 to be supplied. In addition, the desired resin thickness 311 of the liquid resin 301 is based on the desired resin thickness 312 of the resin 302 coated on the front surface 201 of the wafer 200 (refer to Figure 9 ) and the shrinkage rate when the liquid resin 301 is cured and becomes the resin 302.

[0051] In the resin supply operation, the resin supply unit 40 then moves the tip of the nozzle 42 from the retracted position on the holding surface 31 of the table 30 to the supply position facing the holding surface 31 of the table 30. Thereafter, in the resin supply operation, the resin supply unit 40 supplies the liquid resin 301 in an appropriate supply amount calculated by the control unit 70 from the nozzle 42 toward the holding surface 31 of the table 30 on which the sheet 92 is placed in the sheet loading operation.

[0052] Furthermore, in the resin bonding machine 1 of the first embodiment, the order in which the wafer loading, wafer holding, and resin supply operations are performed is not limited to this order. Specifically, in the resin bonding machine 1 of the first embodiment, as long as the resin supply operation is performed after the wafer loading operation, the wafer holding operation (processing operation on the wafer 200 side) and the series of wafer loading and resin supply operations (processing operation on the worktable 30 side) can be performed one set first and the other set later, or they can be performed in parallel. The resin coating operation, described later, is performed after all the processing operations of the wafer loading, wafer holding, and resin supply operations have been performed.

[0053] like Figure 8 (A) and Figure 8 As shown in (B), the resin bonding machine 1 performs the following resin coating operation: the moving part 50 brings the holding part 20 and the work table 30 relatively close to coat the wafer 200 with liquid resin 301. Figure 5 As shown, the control unit 70 of the resin pasting machine 1 refers to the correlation data 73 recorded in the correlation data storage unit 71, and sets the relative movement amount 27 between the holding unit 20 and the workbench 30 that matches the temperature measured by the temperature measuring unit 15 in the moving unit 50, so that the resin 302 with a specified resin thickness 312 is coated on the chip 200.

[0054] In the first embodiment, as Figure 5 As shown, the temperature measuring unit 15 includes a thermocouple 15-1 mounted in a hole within a housing 20-3, facing the holding surface 20-1 of the adsorption portion 20-2 of the holding unit 20; and a radiation-type thermometer 15-2 mounted next to the holding unit 20, facing the holding surface 31 of the workbench 30. In the first embodiment, the temperature measuring unit 15 measures the temperature of the holding unit 20 in the processing chamber 10 using the thermocouple 15-1, and measures the temperature of the workbench 30 using the radiation-type thermometer 15-2. The present invention is not limited to the first embodiment described above; any method can be used as long as it can measure the temperature in the processing chamber 10. However, as in the first embodiment described above, it is preferred that the temperature of at least one of the holding unit 20 and the workbench 30, which are directly involved in the coating of the liquid resin 301, be measured, and more preferably, the temperature of both, be measured.

[0055] In the resin pasting machine 1 of the first embodiment, in order to record the correlation data 73 in the correlation data storage unit 71 in advance, it is necessary to implement a prescribed experiment in advance. Regarding the prescribed experiment, specifically, first, the resin thickness 312 of the coated resin 302 is measured when the holding unit 20 and the workbench 30 are relatively moved by the same movement amount 27 by the moving unit 50 in the processing chamber 10 at different temperatures. In other words, through the prescribed experiment, the correlation between the temperature in the processing chamber 10 when the movement amount 27 of the moving unit 50 is kept constant and the resin thickness 312 of the coated resin 302 can be obtained. In more detail, by further fitting the experimental results with a prescribed smooth approximate function, for example, Figure 6 The related relationship data 72 is shown.

[0056] Here, in the predetermined experiment pre-performed in the resin bonding machine 1 of the first embodiment, it is preferable to use the arithmetic average value of the temperature of the holding unit 20 by the thermocouple 15-1 and the temperature of the worktable 30 by the radiation type thermometer 15-2 as the temperature in the processing chamber 10. In this case, an appropriate representative value can be used to process the temperature in the processing chamber 10. In addition, the temperature in the processing chamber 10 processed in the predetermined experiment pre-performed in the resin bonding machine 1 is not limited to this in the present invention. The temperature in the processing chamber 10 measured by the thermocouple 15-1, the temperature of the worktable 30 by the radiation type thermometer 15-2, or the temperature in the processing chamber 10 measured at another location or by another method may be used.

[0057] Furthermore, when the liquid resin 301 is deformed during the resin coating operation, Figure 5 As shown, when the bump 204 is immersed in the liquid resin 301, between the holding surface 20-1 of the holding portion 20 and the holding surface 31 of the workbench 30, the wafer 200 with a thickness of 210, the liquid resin 301 with a desired resin thickness 311 as a target, and the sheet 92 with a known thickness 97 are stacked in the vertical direction. In view of this, in the predetermined experiment previously carried out in the resin bonding machine 1 of the first embodiment, it is considered that Figure 5 The experiment was conducted by taking into account the thickness 97 of the sheet 92 and the thickness 210 of the wafer 200 shown, with appropriate corrections such as subtraction. Furthermore, in this predetermined experiment, similar to the calculation of the appropriate amount of liquid resin 301 to be supplied during the resin supply operation, the shrinkage rate of the liquid resin 301 when it hardens to form resin 302 was taken into account, and appropriate corrections were made. Furthermore, in this predetermined experiment, if the sheet loading operation was omitted, corrections such as subtraction of the thickness 97 of the sheet 92 were not necessary.

[0058] In the first embodiment, as Figure 6As shown, within the temperature range of the processing chamber 10 during actual use of the resin bonding machine 1, the correlation data 72 is represented by a monotonically decreasing function, in which the resin thickness 312 decreases as the temperature increases. This is because, within this temperature range, the thermal expansion of various components within the processing chamber 10 of the resin bonding machine 1, such as the holding unit 20, the table 30, and the moving unit 50, reduces the distance between the front surface 201 of the wafer 200 and the upper surface of the sheet 92. Therefore, the shrinkage rate of the liquid resin 301 and the thermal expansion of the resin 302 determine the final resin thickness 312 of the resin 302 based on this distance. Furthermore, in the first embodiment, within this temperature range, the correlation data 72 and the resin thickness 312 are approximated by a linear function. This is because, within this temperature range, the thermal expansion of the aforementioned components can be approximated by a linear function, and therefore, the reduction in the aforementioned distance can also be approximated by a linear function.

[0059] In the resin laminating machine 1 of the first embodiment, it is also necessary to perform predetermined data processing on each of the various movement amounts 27 based on the plurality of correlation data 72 obtained in the above-mentioned predetermined experiment. Specifically, through the predetermined data processing, based on the plurality of correlation data 72, it is possible to obtain the correlation between the temperature in the processing chamber 10 and the movement amount 27 based on the moving part 50 when the resin thickness 312 of the coated resin 302 is a predetermined value. By performing predetermined calculation processing, for example, Figure 7 The correlation data 73 shown in FIG. The correlation data 73 thus obtained is data for maintaining the resin thickness 312 of the coating resin 302 constant even at different temperatures in the processing chamber 10 . The resin sticking machine 1 of the first embodiment records the correlation data 73 thus obtained in the correlation data storage unit 71 .

[0060] In the first embodiment, within the temperature range of the processing chamber 10 when the resin sticking machine 1 is actually used, the correlation data 72 is represented by a monotonically decreasing function in which the resin thickness 312 decreases as the temperature increases. Therefore, similarly to the correlation data 72, Figure 7 As shown, the correlation data 73 is represented by a monotonically decreasing function in which the movement amount 27 decreases as the temperature increases. Furthermore, in the first embodiment, within this temperature range, the temperature and the resin thickness 312 are approximately represented by a linear function. Therefore, similar to the correlation data 72, in the correlation data 73, the temperature and the movement amount 27 are approximately represented by a linear function.

[0061] In the resin coating action, such as Figure 8 (A) and Figure 8As shown in (B), the moving unit 50 moves the holding unit 20 downward by the movement amount 27 set by the control unit 70 with reference to the correlation data 73 recorded in the correlation data storage unit 71, thereby bringing the holding unit 20 closer to the worktable 30. As a result, the liquid resin 301 located between the holding surface 20-1 of the holding unit 20 and the holding surface 31 of the worktable 30 is spread horizontally across the wafer 200 and the sheet 92. Thus, during the resin coating operation, the liquid resin 301 is formed between the front surface 201 of the wafer 200 and the sheet 92, coating the front surface 201 of the wafer 200. During the resin coating operation, since the sheet 92 is flat, the surface of the liquid resin 301 in contact with the sheet 92 is formed flat.

[0062] like Figure 9 As shown, the resin bonding machine 1 performs the following curing operation: the curing section 60 cures the liquid resin 301 coated on the wafer 200 in the resin coating operation to form the resin 302 .

[0063] In the hardening operation, in the first embodiment, as Figure 9 As shown, specifically, ultraviolet irradiation section 61 of curing section 60 irradiates ultraviolet light 62 onto liquid resin 301, which is an ultraviolet curable resin, via stage 30 and sheet 92, causing liquid resin 301 to undergo an ultraviolet curing reaction to form cured resin 302. During the curing operation, as liquid resin 301 hardens and forms resin 302, liquid resin 301, which has a resin thickness 311, shrinks, and resin 302 has a resin thickness 312 that is thinner than resin thickness 311.

[0064] like Figure 10 As shown, the resin sticking machine 1 performs the following excess portion removal operation: the excess portion removal unit 120 cuts off and removes the excess portion of the resin 302 covering the front surface 201 of the wafer 200 that protrudes radially beyond the outer edge of the wafer 200 .

[0065] In the remaining part removal action, specifically, first, the conveying part 86 conveys the chip 200 coated with resin 302 on the front side 201 after the processing action up to the hardening action from the holding part 20 to the remaining part removal part 120, so that the coated resin 302 side is on the lower side in the vertical direction and is placed on the holding workbench 121.

[0066] In the remainder removal action, then, as Figure 10As shown, the excess portion removal unit 120 uses a cutter 122 to cut into the resin 302 vertically downward along the outer edge of the wafer 200 held by the holding table 121. During the excess portion removal operation, the excess portion removal unit 120 then removes the remaining portion of the resin 302 by moving the cutter 122, which is still cutting into the resin 302, in a circumferential direction along the outer edge of the wafer 200. Furthermore, during the excess portion removal operation, by previously moving the cutter 122 past the resin 302 and into the sheet 92, the remaining portion of the sheet 92 can be removed simultaneously, corresponding to the removal of the remaining portion of the resin 302. Furthermore, during the excess portion removal operation, even if there is no remaining portion of the resin 302, the excess portion removal operation is preferably performed for the purpose of removing the remaining portion of the sheet 92.

[0067] The resin bonding machine 1 of the first embodiment can obtain the wafer 200 in which the entire front surface 201 as one surface is coated with the resin 302 having a desired resin thickness 312 by performing the above-mentioned processes from the wafer mounting operation to the excess portion removing operation.

[0068] The resin bonding machine 1 of the first embodiment has the above-mentioned structure, and therefore, the control unit 70 includes a correlation data storage unit 71, which records correlation data 73 between the temperature in the processing chamber 10 and the movement amount 27 of the moving unit 50 at each temperature as data for making the resin thickness 312 of the coated resin 302 constant even at different temperatures in the processing chamber 10, and the correlation data 73 is obtained based on the measurement result of the resin thickness 312 of the coated resin 302 when the holding unit 20 and the workbench 30 are relatively moved by the same movement amount 27 by the moving unit 50 in the processing chamber 10 at different temperatures. With reference to the correlation data 73, the movement amount 27 that matches the temperature measured by the temperature measuring unit 15 is set in the moving unit 50, and the resin 302 with the specified resin thickness 312 is coated on the chip 200. Therefore, the resin pasting machine 1 of the first embodiment changes the movement amount 27 set for the moving part 50 according to the temperature in the processing chamber 10 so as to be able to coat the resin 302 with the desired resin thickness 312, thereby having the effect of reducing the thickness deviation of the resin 302 coated on the chip 200 that may be caused by the temperature deviation in the processing chamber 10.

[0069] In conventional methods, when setting the resin thickness 312 of the resin 302 coating the wafer 200 to 100 μm, there is a problem: the temperature in the processing chamber 10 varies by only about 1°C within the aforementioned temperature range, resulting in a thickness variation of about 2 μm in the resin 302 coating the wafer 200, a relative error of 2%. However, the resin laminating machine 1 of the first embodiment measures the temperature in the processing chamber 10 each time the resin coating operation is performed and optimizes the travel distance 27 set for the moving unit 50. Therefore, it is found that the relative error conversion can significantly reduce the thickness variation of the resin 302 coating the wafer 200 that may be caused by temperature variations in the processing chamber 10.

[0070] Furthermore, when the pressing force applied to the liquid resin 301 during the resin coating operation is controlled as in the method of Patent Document 1, there is a problem that the thickness of the resin 302 coated on the wafer 200 may vary significantly due to variations in the viscosity of the liquid resin 301. However, since the resin laminating machine 1 of the first embodiment uses the movement amount 27, a parameter that directly affects the resin thickness 312, as the control factor during the resin coating operation instead of the pressing force, it can be seen that variations in the thickness of the resin 302 coated on the wafer 200 that could be caused by variations in the viscosity of the liquid resin 301 do not substantially occur.

[0071] Furthermore, the temperature measuring unit 15 of the resin bonding machine 1 of the first embodiment measures the temperature of at least one of the holding unit 20 and the worktable 30. Therefore, the resin bonding machine 1 of the first embodiment can use the temperature of the holding unit 20 or the worktable 30, which is close to the temperature of the liquid resin 301, as the temperature in the processing chamber 10. This allows the machine to accurately capture the thermal expansion of the holding unit 20, the worktable 30, the moving unit 50, and other components, as well as the resin 302. This allows the machine to optimize the travel distance 27 set for the moving unit 50. This effectively reduces variations in the thickness of the resin 302 coating the wafer 200 that could otherwise occur due to temperature variations in the processing chamber 10.

[0072] Next, the temperature measuring unit 15 of the resin bonding machine 1 of the first embodiment measures the temperatures of the holding unit 20 and the worktable 30, and sets the average value thereof as the temperature in the processing chamber 10 of the resin bonding machine 1. Therefore, the resin bonding machine 1 of the first embodiment can more accurately capture the temperature of the liquid resin 301 as the temperature in the processing chamber 10 and optimize the movement amount 27 set for the moving unit 50. This has the effect of more appropriately reducing variations in the thickness of the resin 302 coated on the wafer 200 that may occur due to variations in the temperature in the processing chamber 10.

[0073] [Second embodiment]

[0074] A resin sticking machine 1 according to a second embodiment of the present invention will be described with reference to the drawings. Figure 11 (A) and Figure 11 (B) is a cross-sectional view of a main portion showing the tape sticking operation of the resin sticking machine 1 according to the second embodiment. Figure 11 (A) shows the state before the tape 220 is attached to the wafer 200. Figure 11 (B) shows the wafer 200 after the tape 220 is attached. Figure 12 1 is a cross-sectional view showing a main part of the resin coating operation of the resin sticking machine 1 according to the second embodiment. Figure 11 (A) Figure 11 (B) and Figure 12 In the present invention, the same parts as those in the first embodiment are denoted by the same reference numerals and their description is omitted.

[0075] The resin sticking machine 1 of the second embodiment is a component in which a tape sticking section 130 is added to the first embodiment. Figure 11 (A) and Figure 11 As shown in FIG. 1B , the tape applying unit 130 includes a holding table 131 that holds the wafer 200 to which the tape 220 is to be applied and an annular frame 225 attached to the outer edge of the tape 220, and a tape supply unit (not shown) that supplies the tape 220 and applies it to the wafer 200 and the annular frame 225. While the tape applying unit 130 includes the tape supply unit in the second embodiment, the present invention is not limited thereto. The tape supply unit may be omitted, and an operator may supply the tape 220 and apply it to the wafer 200 and the annular frame 225.

[0076] like Figure 11 (A) and Figure 11 As shown in (B), similar to the holding portion 20, the holding table 131 includes: a suction portion 131-2 having a flat holding surface 131-1 formed on its upper surface; and a frame 131-3 that secures the suction portion 131-2 by inserting the suction portion 131-2 into a recessed portion in the center of the upper surface. The suction portion 131-2 is made of the same material as the suction portion 20-2 and, like the suction portion 20-2, is connected to a vacuum source (not shown) via a vacuum suction path (not shown). Thus, the wafer 200 and the annular frame 225 are suctioned and held by the entire holding surface 131-1.

[0077] The tape 220 used in the tape applying unit 130 includes a tape base 221 that is larger than the diameter of the wafer 200 and an adhesive layer 222 provided on one surface of the tape base 221. The tape 220 does not have the adhesive layer 222 in the central region of the tape base 221 that faces the device region 202 of the wafer 200, but does have the adhesive layer 222 in the peripheral region that includes the outer edge portion facing the peripheral remaining region 203 of the wafer 200 and the annular frame 225.

[0078] The operation of the resin bonding machine 1 of the second embodiment will be described below. The operation of the resin bonding machine 1 of the second embodiment is implemented by adding a tape bonding operation before the wafer holding operation in the first embodiment, and changing the resin coating operation accordingly.

[0079] like Figure 11 (A) and Figure 11 As shown in (B), the resin sticking machine 1 performs the following tape sticking operation: the tape sticking unit 130 sticks the tape 220 on a predetermined surface, that is, the front surface 201 , of the coating resin 302 of the wafer 200 and installs the annular frame 225 on the outer edge of the tape 220 .

[0080] In the paste action, specifically, first, as Figure 11 As shown in (A), the holding table 131 of the tape applying unit 130 suction-holds the wafer 200 from the back side 205 in the central region of the holding surface 131-1, and suction-holds the annular frame 225 in the peripheral region of the holding surface 131-1. During the tape applying operation, the tape supply unit of the tape applying unit 130 supplies the tape 220 above the wafer 200 and the annular frame 225, such that the central region without the adhesive layer 222 faces the front side 201 of the device region 202 of the wafer 200, and the peripheral region with the adhesive layer 222 faces the front side 201 of the peripheral remaining region 203 of the wafer 200 and the annular frame 225.

[0081] In the paste action, after that, such as Figure 11 As shown in (B), the tape providing portion of the tape pasting portion 130 makes the central area of ​​the tape 220 without the adhesive layer 222 in close contact with the front side 201 of the device area 202 of the chip 200, and makes the peripheral area of ​​the tape 220 with the adhesive layer 222 adhere to the front side 201 of the peripheral remaining area 203 of the chip 200 and the annular frame 225 via the adhesive layer 222.

[0082] In the resin coating action of the second embodiment, by adding to the resin coating action of the first embodiment, when the control unit 70 sets the movement amount 27 for the moving unit 50 with reference to the correlation data 73 recorded in the correlation data storage unit 71, a correction is further subtracted, such as the thickness of the central area of ​​the tape 220 without the adhesive layer 222 that is in close contact with the front side 201 side of the device area 202 of the chip 200 in the tape pasting action, that is, the thickness of the tape base material 221, when the movement amount 27 is set for the moving unit 50, and the correction is implemented, the movement amount 27 for bringing the holding unit 20 and the workbench 30 closer together with the thickness of the tape 220 corrected is set in the moving unit 50.

[0083] In the resin coating operation of the second embodiment, the process is changed to one based on the movement amount 27 for approaching the holding unit 20 and the stage 30 when the thickness of the tape 220 is corrected in the resin coating operation of the first embodiment.

[0084] Since the resin bonding machine 1 of the second embodiment has the above-described structure, it can achieve the same effect as the resin bonding machine 1 of the first embodiment in that it can reduce the thickness variation of the resin 302 coated on the wafer 200 that may be caused by temperature variation in the processing chamber 10. Furthermore, the resin bonding machine 1 of the second embodiment also achieves the same effect as the resin bonding machine 1 of the first embodiment.

[0085] Since the resin bonding machine 1 and processing method of the second embodiment also corrects the thickness of the tape 220 and performs the resin coating operation, it has the effect of suppressing the thickness change of the resin 302 coated on the wafer 200 that may be caused by thermal expansion of the tape 220.

[0086] The present invention is not limited to the above-described embodiment, but can be implemented with various modifications without departing from the spirit of the present invention.

Claims

1. A resin bonding machine for coating one surface of a wafer with a desired thickness of resin, wherein: The resin pasting machine has: A processing chamber comprising a holding portion for holding a wafer, a workbench, a resin supply portion, a moving portion, and a curing portion. The holding portion holds the wafer, the workbench is opposed to the holding portion, the resin supply portion supplies liquid resin to the workbench, the moving portion brings the holding portion and the workbench into relative proximity, and the curing portion cures the liquid resin coated on the wafer. a temperature measuring unit for measuring the temperature in the processing chamber, the temperature measuring unit including a first temperature measuring device for measuring the temperature of the holding unit and a second temperature measuring device for measuring the temperature of the worktable, wherein the temperature in the processing chamber is a temperature based on the temperature measured by the first temperature measuring device and the temperature measured by the second temperature measuring device; as well as A control unit configured to control each mechanism. The control unit includes a correlation data storage unit that records correlation data between temperature and the amount of movement of the moving unit at each temperature as data for maintaining a constant thickness of the coated resin even at different temperatures, wherein the correlation data is obtained based on a measurement result of the thickness of the coated resin when the moving unit is moved by the same amount in the processing chamber at different temperatures. The control unit is configured to set the movement amount corresponding to the temperature measured by the temperature measuring unit in the moving unit with reference to the correlation data. The wafer is coated with a resin having a predetermined thickness.

2. The resin bonding machine according to claim 1, wherein: The temperature measuring unit measures the temperatures of the holding unit and the stage, and sets an average value of the temperature measured by the first temperature measuring device and the temperature measured by the second temperature measuring device as the temperature of the resin sticking machine.

3. The resin bonding machine according to claim 1, wherein: Within the temperature range of the processing chamber, the correlation data is represented by a monotonically decreasing function in which the thickness of the liquid resin decreases as the temperature increases.

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