Electronic device including an optical sensor module

Abstract

This invention provides an electronic device comprising a housing, a display panel, and an optical sensor module. The display panel is disposed within the interior space of the housing and is at least partially visible from the outside through the housing. The display panel includes a display area, a first non-display area adjacent to at least a portion of the periphery of the display area, and a second non-display area adjacent to at least a portion of the periphery of the first non-display area. The optical sensor module is disposed within the interior space and includes a flexible printed circuit board (FPCB), a light emitting structure, and a light receiving structure. The light emitting structure is disposed on the FPCB and at least partially overlaps with the first non-display area when the display panel is viewed from above. The light receiving structure is disposed on the FPCB and at least partially overlaps with the display area when the display panel is viewed from above. The display area has a first transmittance, and the first non-display area has a second transmittance greater than the first transmittance.

Description

Technical Field

[0001] This disclosure relates to an electronic device including an optical sensor module. Background Technology

[0002] One current trend in developing electronic devices to meet customer needs is to make the device body thinner, for example, by reducing the thickness of the electronic device. In addition, electronic devices are being developed to increase their rigidity, enhance their design aspects, and differentiate their functional features.

[0003] To achieve a slim electronic device, multiple electronic components must be efficiently arranged within the device's internal space. In addition to this, these components must be appropriately positioned to reliably perform their functions. This efficient arrangement within the electronic device is particularly necessary in the case of electronic components related to large-screen displays.

[0004] Currently, mobile electronic devices are being improved to relatively increase the display area without changing the overall size. Therefore, as displays are being improved to essentially occupy most of the front surface of electronic devices, optical sensor modules, such as proximity sensor modules or illuminance sensor modules, are also being improved with corresponding arrangement structures. For example, an optical sensor module can be placed inside the electronic device, below the display, to detect the external environment by passing through a portion of the display area. An optical sensor module can include a light-emitting structure and a light-receiving structure, both disposed within a module housing and spaced apart from each other. For example, an optical sensor module can perform sensing operations in such a manner that the light-emitting structure emits light through the display area, and then the light-receiving structure receives the light reflected from external objects.

[0005] However, when the optical sensor module is positioned below the display area (e.g., the active area) of the display, spotting due to the photoelectric effect may occur in the display area because light emitted from the light-emitting structure leaks into the display device (e.g., an OLED device). Furthermore, when the light-emitting structure is positioned below a display area where the transmittance gradually decreases with depth, sensing performance may degrade due to crosstalk caused by diffuse reflection. Additionally, in the case of partial-off control where a specific portion of the display area is closed for operation of the optical sensor module, the relatively large portion corresponding to the optical sensor module should be closed. This contradicts the efficient operation of the display area. Summary of the Invention

[0006] Embodiments of this disclosure provide an electronic device including an optical sensor module.

[0007] Embodiments of this disclosure provide an electronic device capable of preventing and / or reducing speckle phenomena in a display area through an improved arrangement of optical sensor modules.

[0008] Embodiments of this disclosure provide an electronic device with improved sensing performance through an improved arrangement of an optical sensor module.

[0009] Embodiments of this disclosure provide an electronic device with improved assembly efficiency through an improved arrangement of optical sensor modules.

[0010] According to various exemplary embodiments of this disclosure, an electronic device may include: a housing, a display panel, and an optical sensor module. The display panel is disposed within the interior space of the housing so that it is at least partially visible from the outside through the housing, and includes a display area, a first non-display area disposed adjacent to at least a portion of the periphery of the display area, and a second non-display area disposed adjacent to at least a portion of the periphery of the first non-display area. The optical sensor module is disposed within the interior space and at least partially overlaps with the display panel. The optical sensor module includes a flexible printed circuit board (FPCB), a light emitting structure, and a light receiving structure. The light emitting structure is disposed on the FPCB and at least partially overlaps with the first non-display area when the display panel is viewed from above. The light receiving structure is disposed on the FPCB and at least partially overlaps with the display area when the display panel is viewed from above. The display area has a first transmittance, and the first non-display area has a second transmittance greater than the first transmittance.

[0011] According to various exemplary embodiments of this disclosure, an electronic device may include a housing, a display, and an optical sensor module. The housing includes a transparent cover. The display is disposed within the interior space of the housing to be at least partially visible from the outside through the transparent cover, and includes: a display panel including a display area, a first non-display area, and a second non-display area, the first non-display area being disposed adjacent to at least a portion of the periphery of the display area, and the second non-display area being disposed adjacent to at least a portion of the periphery of the first non-display area; and at least one additional layer disposed on the rear surface of the display panel. The optical sensor module is disposed within the interior space and attached to the rear surface of the additional layer. The optical sensor module includes a flexible printed circuit board (FPCB), a light-emitting structure including light-emitting circuitry, and a light-receiving structure including light-receiving circuitry. The light-emitting structure is disposed on the FPCB and at least partially overlaps with the first non-display area when the display panel is viewed from above, and the light-receiving structure is disposed on the FPCB and at least partially overlaps with the display area when the display panel is viewed from above. The display area has a first transmittance, and the first non-display area has a second transmittance greater than the first transmittance. Attached Figure Description

[0012] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0013] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments;

[0014] Figure 2A This is a perspective view illustrating a mobile electronic device according to an embodiment of the present disclosure;

[0015] Figure 2B This is a perspective view showing the rear surface of a mobile electronic device according to an embodiment of the present disclosure;

[0016] Figure 3 This is an exploded perspective view of a mobile electronic device according to an embodiment of the present disclosure;

[0017] Figure 4 This is an exploded perspective view showing example displays according to various embodiments of the present disclosure;

[0018] Figure 5A This is a diagram showing the front surface of an example display according to various embodiments of the present disclosure;

[0019] Figure 5B This is a diagram showing the rear surface of an example display according to various embodiments of the present disclosure;

[0020] Figure 6 It is a combination of cross-sectional and plan views showing the arrangement relationship between the display panel and the optical sensor module according to various embodiments of the present disclosure;

[0021] Figure 7 This is a combination of cross-sectional and plan views that partially illustrate various embodiments of an electronic device including an optical sensor module according to the present disclosure;

[0022] Figure 8 This is a cross-sectional view showing, in part, an example electronic device including a distance detection sensor module according to various embodiments of the present disclosure;

[0023] Figure 9 The figures partially illustrate example displays and optical sensor modules according to various embodiments of the present disclosure; and

[0024] Figure 10 This is a diagram comparing partially closed portions of a display area depending on the arrangement of the optical sensor modules according to various embodiments of the present disclosure. Detailed Implementation

[0025] Figure 1This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

[0026] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0027] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 may control at least some of the functions or states associated with at least one component of the electronic device 101 (other than the main processor 121) (e.g., display device 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123.

[0028] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0029] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0030] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, or keyboard.

[0031] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0032] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0033] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0034] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0035] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0036] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0038] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0039] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0040] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0041] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0042] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to embodiments, antenna module 197 may include one or more antennas, and therefore, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna.

[0043] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0044] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0045] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0046] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0047] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0048] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0049] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g.), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0050] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0051] Figure 2A A perspective view showing the front surface of a mobile electronic device 200 according to an embodiment is shown. Figure 2B It shows Figure 2A A perspective view of the rear surface of the mobile electronic device 200 shown.

[0052] Reference Figure 2A and Figure 2B The mobile electronic device 200 may include a housing 210, wherein the housing 210 includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. The housing 210 may refer to a structure forming a portion of the first surface 210A, the second surface 210B, and the side surface 210C. The first surface 210A may be formed from a front panel 202 (e.g., a glass or polymer panel coated with various coatings), at least partially of which is substantially transparent. The second surface 210B may be formed from a substantially opaque rear panel 211. The rear panel 211 may be formed from, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The side surface 210C may be formed from a side frame structure (or “side member”) 218 ​​bonded to the front panel 202 and the rear panel 211 and comprising metal and / or polymer. The back panel 211 and the side frame structure 218 can be integrally formed and can be made of the same material (e.g., a metallic material such as aluminum).

[0053] The front panel 202 may include two first regions 210D, each disposed along its long edge and seamlessly curved and extended from a first surface 210A toward the rear panel 211. Similarly, the rear panel 211 may include two second regions 210E, each disposed along its long edge and seamlessly curved and extended from a second surface 210B toward the front panel 202. The front panel 202 (or the rear panel 211) may include only one of the first regions 210D (or the second regions 210E). The first region 210D or the second region 210E may be partially omitted. When viewed from the side of the mobile electronic device 200, the side frame structure 218 may have a first thickness (or width) on the side excluding the first region 210D or the second region 210E, and may have a second thickness less than the first thickness on the other side including the first region 210D or the second region 210E.

[0054] Mobile electronic device 200 may include at least one of the following: display 201, audio modules 203, 207 and 214, sensor modules 204, 216 and 219, camera modules 205, 212 and 213, key input device 217, light-emitting device, and connector holes 208 and 209. Mobile electronic device 200 may omit at least one of the above components (e.g., key input device 217 or light-emitting device), or may include other components.

[0055] For example, a large portion of the display 201 may be exposed through the front panel 202. At least a portion of the display 201 may be exposed through the front panel 202 forming a first region 210D of the first surface 210A and side surfaces 210C. The outline of the display 201 (i.e., edges and corners) may have a substantially the same shape as the outline of the front panel 202. The spacing between the outline of the display 201 and the outline of the front panel 202 may remain substantially constant in order to increase the exposed area of ​​the display 201.

[0056] A recess or opening may be formed in a portion of the display area of ​​the display 201 to accommodate at least one of the audio module 214, sensor module 204, camera module 205, and light-emitting device. At least one of the audio module 214, sensor module 204, camera module 205, fingerprint sensor 216, and light-emitting element may be arranged on the back of the display area of ​​the display 201. The display 201 may be combined with or adjacent to touch sensing circuitry, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. At least a portion of sensor modules 204 and 219 and / or at least a portion of key input device 217 may be arranged in a first region 210D and / or a second region 210E.

[0057] Audio modules 203, 207, and 214 may correspond to microphone hole 203 and speaker holes 207 and 214, respectively. Microphone hole 203 may contain a microphone for acquiring external sound, and in this case, may contain multiple microphones for sensing the direction of sound. Speaker holes 207 and 214 may be classified as external speaker hole 207 and call receiver hole 214. Microphone hole 203 and speaker holes 207 and 214 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without speaker holes 207 and 214.

[0058] Sensor modules 204, 216, and 219 can generate electrical signals or data corresponding to the internal operating state of the mobile electronic device 200 or to external environmental conditions. Sensor modules 204, 216, and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on a second surface 210B of the housing 210. A fingerprint sensor may be disposed on both the second surface 210B and the first surface 210A (e.g., a display 201) of the housing 210. The electronic device 200 may also include at least one of the following sensors: a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, and a second camera device 212 disposed on a second surface 210B, and / or a flash 213. Camera module 205 or camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. Flash 213 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device 200.

[0060] The key input device 217 may be arranged on the side surface 210C of the housing 210. The mobile electronic device 200 may not include some or all of the key input devices 217 described above, and the un-included key input devices 217 may be implemented in another form, such as soft keys on the display 201. The key input device 217 may include a sensor module 216 arranged on the second surface 210B of the housing 210.

[0061] A light-emitting device may be disposed on a first surface 210A of the housing 210. For example, the light-emitting device may provide status information of the electronic device 200 in an optical form. The light-emitting device may provide a light source associated with the operation of the camera module 205. The light-emitting device may include, for example, a light-emitting diode (LED), an IR LED, or a xenon lamp.

[0062] Connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole 209, wherein the first connector hole 208 is adapted for a connector (e.g., a USB connector) for transmitting power and / or data to and receiving power and / or data from an external electronic device, and the second connector hole 209 is adapted for a connector (e.g., a headphone jack) for transmitting audio signals to and receiving audio signals from an external electronic device.

[0063] Some sensor modules 205 in camera modules 205 and 212, some sensor modules 204 in sensor modules 204 and 219, or indicators may be arranged to be exposed through display 201. For example, camera modules 205, sensor modules 204, or indicators may be arranged within the interior space of electronic device 200 so as to be in contact with the external environment through a perforated opening in display 201 to front panel 202. In another embodiment, some sensor modules 204 may be arranged to perform their functions within the interior space of electronic device without being visually exposed through front panel 202. For example, in this case, the area of ​​display 201 facing the sensor modules may not require a perforated opening.

[0064] Figure 3 It shows Figure 1 An exploded perspective view of the mobile electronic device 100 shown.

[0065] Reference Figure 3 The mobile electronic device 300 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 400, an electromagnetic induction panel, a PCB 340, a battery 350, a second support member 360 (e.g., a rear cover), an antenna 370, and a rear panel 380. The mobile electronic device 300 may omit at least one of the above components (e.g., the first support member 311 or the second support member 360), or may include another component. Some components of the electronic device 300 may be compatible with... Figure 1 The components are the same as or similar to those of the mobile electronic device 100 shown in Figure 2, therefore, their description is omitted below.

[0066] A first support member 311 is disposed inside the mobile electronic device 300 and may be connected to or integrated with the side bezel structure 310. The first support member 311 may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member 311 may be coupled to a display 400 on one side and to a PCB 340 on the other side. A processor, memory, and / or interface may be mounted on the PCB 340. The processor may include, for example, one or more of a CPU, AP, GPU, ISP, sensor central processor, or CP.

[0067] The memory may include, for example, volatile memory or non-volatile memory.

[0068] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The interface enables the mobile electronic device 300 to be electrically or physically connected to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0069] Battery 350 is a means for supplying power to at least one component of mobile electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. At least a portion of battery 350 may be arranged on a plane substantially the same as PCB 340. Battery 350 may be integrally arranged within mobile electronic device 300 and may be detachably arranged from mobile electronic device 300.

[0070] Antenna 370 may be disposed between rear panel 280 and battery 350. Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 370 may perform short-range communication with external devices or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion of side frame structure 310 and / or first support member 311, or a combination of side frame structure 310 and first support member 311.

[0071] Figure 4 This is an exploded perspective view showing an example display 400 according to various embodiments of the present disclosure.

[0072] Figure 4 The display 400 shown may be at least partially similar to Figure 2A The display 201 shown may include other embodiments of the display.

[0073] Reference Figure 4The display 400 may include: a display panel 430 including a polarizer (POL) 432 (e.g., a polarizing film) disposed on the rear surface of a front cover 320 (e.g., a front panel, glass plate, or front cover member) via an adhesive member; and at least one additional layer 440 attached to the rear surface 430b of the display panel 430. According to an embodiment, the POL 432 may be attached to the front surface 430a of the display panel 430. According to an embodiment, the adhesive member may include, for example (but not limited to), optically clear adhesive (OCA), pressure-sensitive adhesive (PSA), thermally reactive adhesive, common adhesive, double-sided tape, or the like.

[0074] According to various embodiments, the front cover 320 may have a configuration disposed with respect to the camera module (e.g., Figure 2A The camera exposure portion 321 is located at a position corresponding to the camera module 205 in the camera module 205. According to an embodiment, the camera exposure portion 321 may be determined based on a printed area (e.g., a black matrix (BM) area) configured to surround the camera exposure portion 321. According to an embodiment, the size or shape of the printed area may be determined based on the viewing angle of the camera module 205. In another embodiment, the front cover 320 may only have the camera exposure portion 321 without a printed area.

[0075] According to various embodiments, the display panel 430 and POL 432 may be integrally formed. According to embodiments, the display 400 may also include a touch panel 433. According to embodiments, depending on the arrangement of the touch panel 433, the display 400 may operate, for example (but not limited to), as an in-cell or on-cell type touch display. In another embodiment, the display 400 may also include a fingerprint sensor (not shown) that operates through the display panel 430. According to embodiments, the fingerprint sensor may include, for example (but not limited to), an ultrasonic or optical fingerprint sensor or the like, capable of recognizing the fingerprint of a finger that contacts or approaches the outer surface of the front cover 320 through a hole at least partially formed in some components of the display 400.

[0076] According to various embodiments, the at least one additional layer 440 may include one or more polymeric members 441 and 442 disposed on the rear surface of the display panel 430, at least one functional member 443 disposed on the rear surface of the polymeric members 441 and 442, and a conductive member 444 disposed on the rear surface of the at least one functional member 443. According to embodiments, the one or more polymeric members 441 and 442 may include an embossed layer 441 for removing air bubbles that may appear between the display panel 430 and the underlying layers and / or a cushioning layer 442 for shock absorption. According to embodiments, the at least one functional member 443 may include, for example (but not limited to), a graphite sheet for heat dissipation, an additional display, a force-touch FPCB, a fingerprint sensor FPCB, a communication antenna radiator, a heat sink, conductive / non-conductive tape, and / or perforated sponge, etc. According to embodiments, the conductive member 444 may be for enhancing electronic devices (e.g., Figure 3 The display 400 includes a rigid metal plate that shields against ambient noise and dissipates heat from surrounding components. In one embodiment, the conductive member 444 may include, for example (but not limited to), copper (Cu), aluminum (Al), stainless steel (SUS), cladding (e.g., a stack of different types of metals such as SUS and Al), etc. In another embodiment, the display 400 may also include a detection member 445 for detecting input actions from an electromagnetically inductive writing component (e.g., an electronic pen). According to an embodiment, the detection member 445 may include a digitizer. According to an embodiment, the detection member 445 may be disposed between the lower polymer member 442 and the functional member 443. In another embodiment, the detection member 445 may be disposed between the display panel 430 and the upper polymer member 441.

[0077] According to various embodiments, the front cover 320 may have a camera exposure portion 321 formed at a position that at least partially overlaps with the display panel 430 when viewed from above. According to an embodiment, when viewed from above, the display panel 430 may have an opening 4301 formed at a position overlapping with the camera exposure portion 321. According to an embodiment, the POL 432 and / or touch panel 433 attached to the display panel 430 may also have openings 4321 and 4331 formed at corresponding positions. According to an embodiment, when viewed from above, the at least one additional layer 440 may further include openings 4411, 4421, 4441, and 4451 formed at positions corresponding to the opening 4301.

[0078] Electronic devices according to embodiments (e.g.) Figure 3The electronic device 300 may include an optical sensor module 500 disposed by being attached to the rear surface of the display 400. According to embodiments, the optical sensor module 500 may include various sensor modules that detect the external environment by detecting light emitted through the display 400 and then reflected off an external object. According to embodiments, the optical sensor module 500 may include at least one of, for example (but not limited to), a camera module (e.g., including a camera), an ultraviolet (UV) sensor module, an iris sensor module, a spectral sensor module, an infrared (IR) sensor module, a red-green-blue (RGB) sensor module, and / or a time-of-flight (TOF) sensor module, each of which includes a corresponding sensing circuit.

[0079] According to various embodiments, the optical sensor module 500 is capable of emitting and receiving light. However, the additional layer 440 does not allow light to pass through. Therefore, in order to allow the transmission of light emitted from or reflected toward the optical sensor module 500, the additional layer 400 may have one or more through-holes 4412, 4422, 4442, and 4452 formed at positions corresponding to the underlying sensor module 500. In another embodiment, when the optical sensor module 500 is a camera sensor module or a TOF module, the display panel 430 and POL 432 may also have through-holes (not shown) formed at corresponding positions.

[0080] Figure 5A This is a diagram showing the front surface of an example display 400 according to various embodiments of the present disclosure. Figure 5B This is a diagram showing the rear surface of an example display 400 according to various embodiments of the present disclosure.

[0081] Reference Figure 5A and Figure 5B As described above, the display 400 can be attached to the rear surface of the front cover 320 via an adhesive member. According to an embodiment, the display 400 may include a display panel 430 and an additional layer 440 attached to the rear surface 430b of the display panel 430. According to an embodiment, the display panel 430 may have a front surface 430a (e.g., a first surface) facing the front cover 320 and a rear surface 430b (e.g., a second surface) opposite the front surface 430a and allowing the additional layer 440 to be attached.

[0082] According to various embodiments, such as Figure 5BAs shown, the display 400 may include a flat portion 411, a flexible portion 412 folded from the flat portion 411 to the rear surface of the display 400, and a flexible printed circuit board (FPCB) 413 electrically connected to the flexible portion 412. According to an embodiment, the display 400 may include control circuitry 4121 mounted on the flexible portion 412. According to an embodiment, the control circuitry 4121 may include, for example, a display driver IC (DDI) or touch display driver IC (TDDI) mounted on the flexible portion 412. According to an embodiment, the DDI or TDDI may be mounted on the flexible portion 412 in, for example, a chip-on-panel (COP) structure. According to an embodiment, at least a portion of the FPCB 413 and the flexible portion 412 may be folded to the rear surface of the display 400 and attached to an additional layer 440 by bonding or tape. According to an embodiment, the display 400 may include a plurality of elements 4131 disposed on the FPCB 413 and electrically connected to electronic devices (e.g., Figure 3 The printed circuit board of the electronic device 300 (e.g.) Figure 3 The electronic connector 4132 of the PCB 340 in the example. According to an embodiment, the plurality of components 4131 may include, for example (but not limited to), a touch IC, flash memory for display, ESD protection diodes, decoupling capacitors, etc.

[0083] According to various embodiments, such as Figure 5A As shown, the display panel 430 may include a display area 431 (e.g., an active area) that substantially occupies most of the area and a non-display area 432 (e.g., an active area or black matrix (BM) area) that is configured to at least partially surround the periphery of the display area 431 and has a certain width. According to an embodiment, the non-display area 432 may include: a first non-display area 4321 configured to at least partially surround the periphery of the display area 431; and a second non-display area 4322 configured to at least partially surround the periphery of the first non-display area 4321. According to an embodiment, the first non-display area 4321 may have a greater transmittance than the display area 431.

[0084] According to various embodiments, the display 400 may include an optical sensor module 500 disposed at a suitable location on the rear surface of the additional layer 440 (e.g., a conductive member). According to embodiments, the optical sensor module 500 may include a flexible printed circuit board (FPCB) (e.g., Figure 7The optical sensor module 500 comprises an FPCB 520, a module housing 510 mounted on the FPCB 520, a light emitting structure (e.g., including a light emitting circuit) 501 disposed in the module housing 510, and a light receiving structure (e.g., including a light receiving circuit) 502 disposed in the module housing 510 spaced apart from the light emitting structure 501. According to an embodiment, when viewing the display 400 from above, the optical sensor module 500 can be configured such that the light emitting structure 501 overlaps with a first non-display area 4321 and the light receiving structure 502 overlaps with a display area 431. When the light emitting structure 501 is disposed within the first non-display area 4321, which has relatively high transmittance, to avoid the display area 431, a decrease in sensing performance due to diffuse reflection can be prevented and / or reduced. Furthermore, spotting that may occur in the display area 431 due to light emitted from the light emitting structure 501 and leaking into the display device can be prevented and / or reduced.

[0085] Figure 6 It is a combination of cross-sectional and plan views showing the arrangement between the display panel 430 and the optical sensor module 500 according to various embodiments of the present disclosure. Figure 6 The sectional view along Figure 5A The line A-A' is intercepted.

[0086] Reference Figure 6 The display panel 430 disposed on the rear surface of the front cover 320 may include a display area 431 having a first transmittance and a non-display area 432 disposed adjacent to the display area 431. According to an embodiment, the non-display area 432 may include a first non-display area 4321 adjacent to the display area 431 and having a second transmittance greater than the first transmittance, and a second non-display area 4322 adjacent to the first non-display area 4321 and having a transmittance of 0%. According to an embodiment, the second non-display area 4322 may have a printed layer P formed on its outer surface. According to an embodiment, the first transmittance may be in the range, for example, from about 1% to about 4%. According to an embodiment, the second transmittance may be in the range, for example, from about 5% to about 10%.

[0087] According to various embodiments, the display area 431 of the display panel 430 may include a plurality of pixels. According to embodiments, the non-display area 432 may include a driving circuit 4331 (e.g., a gate driving circuit) configured to control the plurality of pixels and a wiring structure 4332 electrically connected to the driving circuit 4331. According to embodiments, the second transmittance of the first non-display area 4321 can be determined by adjusting the arrangement density of the driving circuit 4331 and the wiring structure 4332. For example, the second transmittance of the first non-display area 4321 can be determined based on the arrangement density of the driving circuit 4331 and the wiring structure 4332 arranged in the first non-display area 4321 to be lower than the arrangement density of the driving circuit 4331 and the wiring structure 4332 arranged in the second non-display area 4322.

[0088] According to various embodiments, when the display panel 430 is viewed from above, the optical sensor module 500 can be configured such that the light emitting structure 501 overlaps with the first non-display area 4321 and the light receiving structure 502 overlaps with the display area 431. With this arrangement, the light emitting structure 501 can emit light through the first non-display area 4321, which has a relatively high second transmittance, and the light receiving structure 502, located below the display area 431, can smoothly receive light reflected from the outside.

[0089] Figure 7 This is a combination of cross-sectional and plan views of an example electronic device 700 including an optical sensor module 500, which is partially shown according to various embodiments of the present disclosure.

[0090] Figure 7 The electronic device 700 shown may be at least partially similar to Figure 1 Electronic device 101 Figure 2A and Figure 2B Electronic devices 200 or Figure 3 The electronic device 300 may include other embodiments of the electronic device.

[0091] Reference Figure 7 The electronic device 700 may include a housing structure (e.g. Figure 2AThe electronic device 700 includes a housing 210, which comprises a front cover 320 (e.g., a front cover member, front panel, front window, or first panel), a rear cover 380 (e.g., a rear cover member, rear panel, rear window, or second panel) facing in the opposite direction to the front cover 320, and side members 310 surrounding an internal space 7001 between the front cover 320 and the rear cover 380. According to an embodiment, the side member 310 may include a support member 311 that extends at least partially into the internal space 7001 of the electronic device 700. According to an embodiment, the support member 311 may be formed by structural coupling with the side member 310. According to an embodiment, the support member 311 may have a structural shape for supporting at least a portion of an optical sensor module 500 disposed beneath an additional layer 440 of the display 400.

[0092] According to various embodiments, the electronic device 700 may include a display 400 disposed in an interior space 7001 so that it is visible from the outside through at least a portion of a front cover 320. According to embodiments, the display 400 may include a display panel 430 attached to the front cover 320 and an additional layer 440 attached to the rear surface of the display panel 430. According to embodiments, the display panel 430 may include a display area 431 having a first transmittance, a first non-display area 4321 adjacent to the display area 431 and having a second transmittance greater than the first transmittance, and a second non-display area 4322 adjacent to the first non-display area 4321.

[0093] According to various embodiments, the electronic device 700 may include an optical sensor module 500 disposed in an internal space 7001 and attached to an additional layer 440 of the display 400. According to an embodiment, when viewed from above, the optical sensor module 500 may be configured such that a light-emitting structure 501 overlaps with a first non-display area 4321 and a light-receiving structure 502 overlaps with the display area 431. According to an embodiment, since the additional layer 440 does not allow light transmission, the additional layer 440 may have at least one through-hole 4401 formed all the way to the display panel 430 at a location facing the light-emitting structure 501 and the light-receiving structure 502. According to an embodiment, the at least one through-hole 4401 may be formed at each of the locations corresponding to the light-emitting structure 501 and the light-receiving structure 502. In another embodiment, the at least one through-hole 4401 may be formed as a single hole corresponding to both the light-emitting structure 501 and the light-receiving structure 502.

[0094] According to various embodiments, the optical sensor module 500 may include an FPCB 520 and a module housing 510 mounted on the FPCB 520, and further include a light emitting structure 501 and a light receiving structure 502, both disposed in the module housing 510, spaced apart from each other, and electrically connected to the FPCB 520. According to embodiments, the optical sensor module 500 may also include an extension 521 extending from the FPCB 520 and an electrical connector 522 mounted at an end of the extension 521. According to embodiments, the electrical connector 522 may be electrically connected to a PCB 340 (e.g., a main PCB) separately disposed in the internal space 7001 of the electronic device 700.

[0095] According to various embodiments, the optical sensor module 500 can be configured such that the FPCB 520 is attached to the additional layer 440 of the display 400 via at least one waterproof member 710 (e.g., waterproof tape). According to embodiments, the optical sensor module 500 can have a first sealing structure (S1) for sealing the module housing 510 via at least one waterproof member 710 disposed between the additional layer 440 and the FPCB 520. For example, the at least one waterproof member 710 is disposed on the FPCB 520 to surround the module housing 510 and then attached to the additional layer 440, such that the optical sensor module 500 can be disposed below the display 400. According to embodiments, the optical sensor module 500 can also have a second sealing structure (S2) for sealing even the FPCB 520 via at least one waterproof member 710 disposed between the additional layer 440 and the support member 311. According to an embodiment, since the optical sensor module 500 is attached to the rear surface of the additional layer 440 of the display 400 via the first sealing structure S1 and the second sealing structure S2, the entry of foreign matter and / or moisture into the through-hole 4401 formed in the additional layer 440 can be prevented and / or reduced. According to an embodiment, when the display 400 is disposed via the side member 310 and the support member 311 of the electronic device 700, the FPCB 520 can be attached to the support member 311 via the waterproof member 710 (e.g., double-sided tape).

[0096] Therefore, the optical sensor module 500 according to an embodiment of the present disclosure is arranged directly below the display 400 using an FPCB 520 provided separately from the PCB 340. This arrangement can prevent and / or reduce sensing errors caused by tilt tolerances (e.g., tilt of the optical sensor module) and also allows for efficient layout design, wherein the optical sensor module 500 is separately positioned from the PCB 340 all the way to the top of the display 400 (in plan view).

[0097] Figure 8This is a partial cross-sectional view of an example electronic device 800 including a distance detection sensor module 810 according to various embodiments of the present disclosure.

[0098] Figure 8 The electronic device 800 shown may be at least partially similar to Figure 1 Electronic device 101 Figure 2A and Figure 2B Electronic devices 200 Figure 3 Electronic device 300, or Figure 7 The electronic device 700 may include other embodiments of the electronic device.

[0099] In description Figure 8 At that time, and Figure 7 Those components that are substantially the same are indicated by the same reference numerals, and their detailed descriptions are not repeated here.

[0100] Reference Figure 8 The electronic device 800 may include a distance detection sensor module 810 (e.g., a time-of-flight (TOF) module) disposed in the internal space 7001 and below the display 400. According to an embodiment, the distance detection sensor module 810 may include a light emitting structure 811 (e.g., a vertical-cavity surface-emitting laser (VCSEL)) for irradiating a laser and a light receiving structure 812 (e.g., an infrared camera) disposed near the light emitting structure 811 and detecting light irradiated from the light emitting structure 811 and then reflected by an external object. For example, the light emitting structure 811 and the light receiving structure 812 may be arranged side-by-side on a single FPCB 813 and may be controlled by a control circuit (e.g., a driver IC) (not shown).

[0101] According to various embodiments, when viewing the display 400 from above, the distance detection sensor module 810 can be configured such that the light emitting structure 811 overlaps with the first non-display area 4321 and the light receiving structure 812 overlaps with the display area 431. According to embodiments, the light emitting structure 811 and the light receiving structure 812 can be configured to face the display panel 430 through through-holes 4401 formed in the additional layer 440. According to embodiments, in the case of the distance detection sensor module 810, the corresponding portion of the display panel 430 overlapping the light receiving structure 812 can have an opening or hole 4301 that is perforated to allow for the smooth operation of an infrared camera.

[0102] According to various embodiments, the distance detection sensor module 810 can also be directly attached to the additional layer 440 beneath the display panel 430 via a waterproof member 710. For example, the distance detection sensor module 810 can be configured to have a third sealing structure (S3) via the waterproof member 710 surrounding both the light emitting structure 811 and the light receiving structure 812 between the FPCB 813 and the additional layer 440. According to embodiments, when the display 400 is disposed via the side member 310 and / or the support member 311, the FPCB 813 of the distance detection sensor module 810 can be attached to the support member 311 via the waterproof member 710 (e.g., double-sided tape).

[0103] Figure 9 This is a diagram illustrating an example display 400 and an optical sensor module 500 according to various embodiments of the present disclosure.

[0104] Reference Figure 9 The display panel 430 attached to the rear surface of the front cover 320 may include a display area 431 having a first transmittance, a first non-display area 4321 disposed adjacent to the display area 431 and having a second transmittance greater than the first transmittance, and a second non-display area 4322 adjacent to the first non-display area 4321 and having approximately 0% transmittance. According to an embodiment, when viewing the display 400 from above, the optical sensor module 500 may be configured such that the light emitting structure 501 overlaps with the first non-display area 4321 and the light receiving structure 502 overlaps with the display area 431.

[0105] According to various embodiments, the first non-display area 4321 may occupy only the portion of the non-display area 432 that overlaps with the light-emitting structure 501, and the remaining portion may be formed as the second non-display area 4322. In this example, since the second non-display area 4322 is relatively enlarged, the space available for the driving circuit (e.g., Figure 6 The driving circuit 4331 in the middle) and wiring structure (e.g. Figure 6 The degree of freedom in the layout design of the wiring structure (4332) in the middle.

[0106] Figure 10 This is a diagram comparing the partially closed portions of the display area 431, depending on the arrangement position of the optical sensor module 500, according to various embodiments of the present disclosure.

[0107] Reference Figure 10 Electronic devices (e.g.) Figure 1 The processor of the electronic device 101 in the middle (e.g. Figure 1The processor 120 can control at least a portion of the display area 431 to enable the optical sensor module 500 to operate smoothly. For example, when the optical sensor module 500 is a proximity sensor module, when the electronic device 101 enters a specific mode for recognizing objects via the light receiving structure 502 (e.g., facial recognition mode, call receiving or transmission mode for video calls), and when light emitted from the light emitting structure 501 is reflected off an external object and then returns to the light receiving structure 502, light in pixel areas controlled to be "on" in the display area 431 can cause malfunction of the light receiving structure 502. Therefore, in this mode, the processor 120 can control the display to partially turn off a specific portion of the display area 431 that overlaps with the optical sensor module 500 (specifically, the light receiving structure).

[0108] In various embodiments where the light emitting structure 501 of the optical sensor module 500 is disposed in the first non-display area 4321, the partially closed display area 431 has a first width (d1). In a comparative example where both the light emitting structure 501 and the light receiving structure 502 of the optical sensor module 500 are disposed in the display area 431, the partially closed display area 431 has a second width (d2). Since the first width (d1) is smaller than the second width (d2), this can facilitate the efficient operation of the display area.

[0109] As described above, the electronic device according to various exemplary embodiments of this disclosure has an improved arrangement structure, wherein the light emitting structure is disposed at a location that partially overlaps with a non-display area formed to have relatively high transmittance. In this way, spotting in the display area caused by the photoelectric effect can be prevented and / or reduced, and performance degradation due to interference can also be prevented and / or reduced by mitigating diffuse reflection. Furthermore, by directly mounting the optical sensor module on the rear surface of the display, the assembly efficiency and thinness of the electronic device can be improved.

[0110] According to various example embodiments, an electronic device (e.g.) Figure 7 The electronic device 700 in the middle may include a housing (e.g. Figure 2A The housing 210 in the middle), the display panel (e.g. Figure 7 The display panel 430 in the middle) and the optical sensor module (e.g. Figure 7 The optical sensor module 500 is located within the housing. The display panel can be positioned within the internal space of the housing (e.g., the optical sensor module 500). Figure 7 The interior space 7001 is located within the housing and is at least partially visible from the outside, and includes a display area (e.g., Figure 7 The display area 431 in the middle), and the first non-display area (e.g., the display area) is disposed adjacent to at least a portion of the periphery of the display area. Figure 7The first non-display area 4321) and a second non-display area (e.g., a first non-display area 4321) are disposed adjacent to at least a portion of the periphery of the first non-display area. Figure 7 The second non-display area 4322 in the display panel. The optical sensor module may be disposed in the internal space to at least partially overlap with the display panel and includes a flexible printed circuit board (FPCB) (e.g., Figure 7 FPCB 520 in the middle), light emitting structure containing light emitting circuitry (e.g., Figure 7 The light emitting structure 501 and the light receiving structure containing the light receiving circuit (e.g., the light emitting structure 501) and the light receiving structure containing the light receiving circuit (e.g., the light receiving structure 501) are shown in the figure. Figure 7 The light receiving structure 502 is disposed on the FPCB and at least partially overlaps with a first non-display area when the display panel is viewed from above. The light receiving structure is disposed on the FPCB and at least partially overlaps with a display area when the display panel is viewed from above. The display area may have a first transmittance, and the first non-display area may have a second transmittance greater than the first transmittance.

[0111] According to various example embodiments, each of the first non-display area and the second non-display area may include driving circuitry arranged to control pixels disposed in the display area (e.g., Figure 6 The driving circuit 4331 in the middle) and wiring structure (e.g. Figure 6 Wiring structure 4332 in the middle.

[0112] According to various example embodiments, the second transmittance can be based on the arrangement density of the drive circuit and wiring structure.

[0113] According to various example embodiments, the first transmittance may be in the range of about 1% to about 4%, and the second transmittance may be in the range of about 5% to about 10%.

[0114] According to various example embodiments, the electronic device may also include a printed circuit board (PCB) disposed in the internal space (e.g., Figure 7 PCB 340 in the middle), and the FPCB can be connected via electrical connectors (e.g. Figure 7 The electrical connector 522 is electrically connected to the PCB.

[0115] According to various example embodiments, the electronic device may also include at least one additional layer (e.g. Figure 7 Additional layer 440), disposed on the rear surface of the display panel and having at least one through-hole (e.g., in the form of an additional layer 440), which is disposed on the rear surface of the display panel and has at least one through-hole formed therein. Figure 7 (via 4401 in the additional layer). In this example, the optical sensor module can be attached to the rear surface of the additional layer such that the light emitting structure and the light receiving structure face the at least one via in the additional layer.

[0116] According to various example embodiments, the electronic device may also include at least one waterproof component comprising a waterproof material (e.g., Figure 7 The waterproof component 710 is configured to attach the optical sensor module to the additional layer within the interior space.

[0117] According to various example embodiments, the at least one waterproof component may include a first waterproof component disposed between the FPCB and the additional layer.

[0118] According to various example embodiments, the first waterproof component may be configured to surround both the light emitting structure and the light receiving structure in a closed loop.

[0119] According to various example embodiments, the at least one waterproof component may include a second waterproof component disposed between the additional layer and the housing.

[0120] According to various example embodiments, the second waterproof component can be configured to surround the FPCB in a closed loop.

[0121] According to various example embodiments, the additional layer may include: at least one polymer component comprising a polymer material (e.g., Figure 4 Polymer components 441 and 442 are disposed on the rear surface of the display panel; at least one functional component (e.g., Figure 4 Functional component 443), disposed on the rear surface of the at least one polymer component; and conductive component comprising conductive material (e.g., Figure 4 The conductive component 444 is disposed on the rear surface of the at least one functional component.

[0122] According to various example embodiments, the electronic device may also include a cover disposed on at least a portion of the housing (e.g., Figure 7 The front cover 320 of the display panel can be configured to be at least partially visible from the outside through the cover.

[0123] According to various example embodiments, the optical sensor module may include at least one of a camera, an ultraviolet (UV) sensor, an iris sensor, a spectral sensor, an infrared (IR) sensor, a red-green-blue (RGB) sensor, and / or a time-of-flight (TOF) sensor.

[0124] According to various example embodiments, when viewed from above, the display panel may have an opening (e.g., providing an opening at a location overlapping with the light-receiving structure). Figure 8 (Opening 4301 in the middle).

[0125] According to various example embodiments, an electronic device (e.g.) Figure 7 The electronic device 700 in the middle may include a housing (e.g. Figure 2AThe housing 210 in the middle), the display (e.g. Figure 7 The display 400 in the middle) and the optical sensor module (e.g. Figure 7 The optical sensor module 500 is located within the housing. Figure 7 The front cover 320 of the housing). The display can be housed within the internal space of the housing (e.g., the front cover 320). Figure 7 The interior space 7001 is at least partially visible from the outside through a transparent cover and includes: a display panel (e.g., Figure 7 The display panel 430 includes a display area (e.g., Figure 7 The display area 431 in the middle), and the first non-display area (e.g., the display area) is disposed adjacent to at least a portion of the periphery of the display area. Figure 7 The first non-display area 4321) and a second non-display area (e.g., a first non-display area 4321) are disposed adjacent to at least a portion of the periphery of the first non-display area. Figure 7 The second non-display area 4322 in the middle); and at least one additional layer (e.g. Figure 7 An additional layer 440 is disposed on the rear surface of the display panel. An optical sensor module may be disposed within the internal space and attached to the rear surface of the additional layer, and includes a flexible printed circuit board (FPCB) (e.g., Figure 7 FPCB 520 in the middle), light emitting structure containing light emitting circuitry (e.g., Figure 7 The light emitting structure 501 and the light receiving structure containing the light receiving circuit (e.g., the light emitting structure 501) and the light receiving structure containing the light receiving circuit (e.g., the light receiving structure 501) are shown in the figure. Figure 7 The light receiving structure 502 is disposed on the FPCB and at least partially overlaps with a first non-display area when the display is viewed from above. The light receiving structure is disposed on the FPCB and at least partially overlaps with a display area when the display is viewed from above. The display area may have a first transmittance, and the first non-display area may have a second transmittance greater than the first transmittance.

[0126] According to various example embodiments, each of the first non-display area and the second non-display area may include driving circuitry and wiring structures arranged to control pixels disposed in the display area.

[0127] According to various example embodiments, the second transmittance can be based on the arrangement density of the drive circuit and wiring structure.

[0128] According to various example embodiments, the electronic device may also include a printed circuit board (PCB) disposed in the internal space, and the FPCB may be electrically connected to the PCB via an electrical connector.

[0129] According to various example embodiments, the electronic device may also include at least one waterproof component, which includes a waterproof material and surrounds the optical sensor module between the additional layer and the housing.

[0130] Although this disclosure has been shown and described with reference to various exemplary embodiments thereof, it will be understood that these exemplary embodiments are intended to be illustrative and not restrictive. Those skilled in the art will also understand that various changes in form and detail may be made therein without departing from the true spirit and full scope of this disclosure, including the appended claims and their equivalents.

Claims

1. An electronic device comprising: case; A display panel, disposed within the interior space of the housing so as to be at least partially visible from the outside through the housing, the display panel comprising: Display area, A first non-display area is disposed adjacent to at least a portion of the periphery of the display area, and A second non-display area is disposed adjacent to at least a portion of the periphery of the first non-display area; and An optical sensor module, disposed within the internal space and at least partially overlapping the display panel, includes: Flexible printed circuit boards A light-emitting structure is disposed on the flexible printed circuit board and at least partially overlaps with the first non-display area when the display panel is viewed from above. A light-receiving structure is disposed on the flexible printed circuit board and at least partially overlaps with the display area when the display panel is viewed from above. The display area has a first transmittance, and the first non-display area has a second transmittance greater than the first transmittance. Each of the first non-display area and the second non-display area includes a driving circuit and a wiring structure, the driving circuit and the wiring structure being arranged to control pixels disposed in the display area. The second transmittance is based on the arrangement density of the driving circuit and the wiring structure.

2. The electronic device of claim 1, wherein the first transmittance is in the range of 1% to 4%, and the second transmittance is in the range of 5% to 10%.

3. The electronic device according to claim 1, further comprising: Printed circuit boards disposed in the internal space The flexible printed circuit board is electrically connected to the printed circuit board via an electrical connector.

4. The electronic device according to claim 1, further comprising: At least one additional layer is disposed on the rear surface of the display panel and has at least one through-hole therein. The optical sensor module is attached to the rear surface of the additional layer, wherein the light emitting structure and the light receiving structure face the at least one through-hole in the additional layer.

5. The electronic device according to claim 4, further comprising: At least one waterproof component is configured to attach the optical sensor module to the additional layer within the interior space.

6. The electronic device of claim 4, wherein the at least one waterproof component comprises a first waterproof component disposed between the flexible printed circuit board and the additional layer.

7. The electronic device of claim 6, wherein the first waterproof component surrounds the light emitting structure and the light receiving structure in a closed loop.

8. The electronic device of claim 7, wherein the at least one waterproof component comprises a second waterproof component disposed between the additional layer and the housing.

9. The electronic device of claim 8, wherein the second waterproof component surrounds the flexible printed circuit board in a closed loop.

10. The electronic device of claim 4, wherein the additional layer comprises: At least one polymer component is disposed on the rear surface of the display panel. At least one functional component is disposed on the rear surface of the at least one polymer component, and A conductive component is disposed on the rear surface of the at least one functional component.

11. The electronic device according to claim 1, further comprising: A cover disposed on at least a portion of the housing, The display panel is at least partially visible from the outside through the cover within the interior space.

12. The electronic device of claim 1, wherein the optical sensor module comprises at least one of a camera, an ultraviolet sensor, an iris sensor, a spectral sensor, an infrared sensor, a red-green-blue sensor, and / or a time-of-flight sensor.

13. The electronic device of claim 1, wherein the display panel includes an opening disposed within the display area, the opening being provided at a position overlapping the light-receiving structure when the display panel is viewed from above.

14. An electronic device comprising: The casing, including the transparent cover; A display, disposed within the interior space of the housing and at least partially visible from the outside through the transparent cover, the display comprising: A display panel includes a display area, a first non-display area adjacent to at least a portion of the periphery of the display area, and a second non-display area adjacent to at least a portion of the periphery of the first non-display area. At least one additional layer is disposed on the rear surface of the display panel; and An optical sensor module, disposed in the internal space and attached to the rear surface of the additional layer, the optical sensor module comprising: Flexible printed circuit boards A light-emitting structure is disposed on the flexible printed circuit board and at least partially overlaps with the first non-display area when the display is viewed from above. A light-receiving structure is disposed on the flexible printed circuit board and at least partially overlaps with the display area when the display is viewed from above. The display area has a first transmittance, and the first non-display area has a second transmittance greater than the first transmittance. Each of the first non-display area and the second non-display area includes a driving circuit and a wiring structure, the driving circuit and the wiring structure being arranged to control pixels disposed in the display area. The second transmittance is based on the arrangement density of the driving circuit and the wiring structure.

15. The electronic device of claim 14, further comprising: Printed circuit boards disposed in the internal space The flexible printed circuit board is electrically connected to the printed circuit board via an electrical connector.

16. The electronic device of claim 14, further comprising: At least one waterproof component surrounds the optical sensor module between the additional layer and the housing.

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