Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Abstract

The present application discloses a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. The silicon rod cutting and grinding integrated machine combines a cutting device and a grinding device. The silicon rod conversion device can transfer the silicon rod orderly and seamlessly between various processing devices. The cutting device is used to perform two side cuts on the silicon rod to form a square silicon rod, and the grinding device is used to grind the square silicon rod after the square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improving the production efficiency and the quality of product processing operations.

Description

Technical Field

[0001] This application relates to the technical field of silicon workpiece processing, and particularly to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Background Art

[0002] At present, with the increasing attention and development of the society towards the utilization of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, ordinary crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are formed by multi-wire saw cutting and subsequent processing after pulling or casting silicon ingots.

[0003] Taking single-crystalline silicon products as an example, the existing production process of silicon wafers generally includes the following rough operation procedures: First, use a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, use a silicon rod squaring machine to square the cut short silicon rods to form single-crystalline silicon rods; then perform processing operations such as surface grinding and chamfering on each single-crystalline silicon rod to make the surface shaping of the single-crystalline silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, use a slicing machine to slice the single-crystalline silicon rod to obtain single-crystalline silicon wafers.

[0004] However, in general, in the related art, the operations required for each process operation (such as cutting and squaring, surface grinding, chamfering, etc.) are independently arranged, and the corresponding processing devices are scattered in different production units or production workshops or different production areas of the production workshop. The transfer of workpieces for different process operations requires handling and allocation, and pre-treatment work may be required before each process operation. In this way, the processes are complicated, the efficiency is low, and it is easy to affect the quality of silicon rod processing operations. More labor or transfer equipment is required, and there are great safety hazards. In addition, there are many flow links between the operation devices of each process, which increases the risk of workpiece damage during the transfer of workpieces, easily generates unqualified products caused by non-production factors, reduces the product qualification rate and the unreasonable losses brought by the existing processing methods, which is a major improvement issue faced by each company. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the related art, the purpose of this application is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between each process operation and poor effect of silicon rod processing operations existing in the existing related art.

[0006] To achieve the above purpose and other related purposes, this application discloses a silicon rod cutting and grinding integrated machine, including:

[0007] A machine base having a silicon rod processing platform;

[0008] A cutting device is provided on the machine base and is used for performing side cutting in a first direction on a silicon rod at a first processing location of the silicon rod processing platform and performing side cutting in a second direction on a silicon rod at a second processing location of the silicon rod processing platform to form a square silicon rod; wherein, the second direction is perpendicular or parallel to the first direction.

[0009] A grinding device is provided on the machine base and is used for grinding the surface and chamfering the square silicon rod at a third processing location of the silicon rod processing platform; and

[0010] A silicon rod conversion device is provided on the silicon rod processing platform and is used for converting the silicon rod among the first processing location, the second processing location, and the third processing location.

[0011] The silicon rod cutting and grinding integrated machine disclosed in the present application integrates a cutting device and a grinding device, can use the silicon rod conversion device to transfer the silicon rod orderly and seamlessly among various processing devices, and use the cutting device to perform two side cuts on the silicon rod to form a square silicon rod and use the grinding device to grind the square silicon rod after square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, and improve the production efficiency and the quality of product processing operations.

[0012] In some embodiments of the first aspect of the present application, the cutting device includes: a first cutting device provided at a first processing location of the silicon rod processing platform and a second cutting device provided at a second processing location of the silicon rod processing platform.

[0013] In some embodiments of the first aspect of the present application, the first cutting device includes: a first cutting frame; a first cutting support seat that moves up and down actively on the first cutting frame; a first cutting unit provided on the first cutting support seat; the first cutting unit includes a first wire frame provided on the first cutting support seat, a plurality of first cutting wheels provided on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form a first cutting line segment arranged in a first direction.

[0014] In some embodiments of the first aspect of the present application, the first cutting device further includes a first edge skin discharging device for discharging the edge skin formed after the first cutting device performs side cutting on the silicon rod in the first direction.

[0015] In certain embodiments of the first aspect of the present application, the second cutting device includes: a second cutting frame; a second cutting support seat that moves up and down actively on the second cutting frame; a second cutting unit provided on the second cutting support seat; the second cutting unit includes a second wire frame provided on the second cutting support seat, a plurality of second cutting wheels provided on the second wire frame, and a second cutting wire, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form a second cutting line segment arranged in a second direction.

[0016] In certain embodiments of the first aspect of the present application, the second cutting device further includes a second side skin discharging device for discharging the side skin formed after the second cutting device performs side cutting on the silicon rod in the second direction.

[0017] In certain embodiments of the first aspect of the present application, the cutting device includes: a cutting frame; a cutting support seat that moves up and down actively on the cutting frame; the cutting support seat includes a seat main body and a first support wing and a second support wing located on opposite sides of the seat main body; a first cutting unit provided on the first side of the cutting support seat; the first cutting unit includes a first wire frame provided on the first support wing of the cutting support seat, a plurality of first cutting wheels provided on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form a first cutting line segment arranged in a first direction; a second cutting unit provided on the second side of the cutting support seat; the second cutting unit includes a second wire frame provided on the second support wing of the cutting support seat, a plurality of second cutting wheels provided on the second wire frame, and a second cutting wire, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form a second cutting line segment arranged in a second direction.

[0018] In certain embodiments of the first aspect of the present application, the first cutting wire and the second cutting wire are the same cutting wire, and a guide wheel for winding the cutting wire is further provided on the cutting support seat between the first cutting unit and the second cutting unit.

[0019] In certain embodiments of the first aspect of the present application, the first cutting unit further includes a first side skin discharging device for discharging the side skin formed after the first cutting unit performs side cutting on the silicon rod in the first direction; the second cutting unit further includes a second side skin discharging device for discharging the side skin formed after the second cutting unit performs side cutting on the silicon rod in the second direction.

[0020] In certain embodiments of the first aspect of the present application, the intersection point of the cutting wire when the first cutting unit performs side cutting on the silicon rod in the first direction and the cutting wire when the second cutting unit performs side cutting on the silicon rod in the second direction is located within the cross-section of the silicon rod.

[0021] In certain embodiments of the first aspect of the present application, the grinding device includes: a grinding support seat disposed on the machine base; at least a pair of grinding tools oppositely arranged on the grinding support seat; the at least a pair of grinding tools are movably lifted relative to the grinding support seat for grinding and chamfering the square silicon rod.

[0022] In certain embodiments of the first aspect of the present application, the grinding tool includes: a main shaft; at least one grinding wheel disposed at the working end of the main shaft.

[0023] In certain embodiments of the first aspect of the present application, the grinding tool includes: a rotary chassis; a double-headed main shaft disposed on the rotary chassis, with at least one rough grinding wheel provided at its first end and at least one fine grinding wheel provided at its second end; a driving motor for driving the rotary chassis to rotate so that the first end and the second end of the double-headed main shaft are interchanged.

[0024] In certain embodiments of the first aspect of the present application, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are distributed at 120° to each other in pairs, and the rotation angle range of the silicon rod conversion device is ±240°.

[0025] In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting area, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device adjacent to the waiting area of the silicon rod processing platform for transferring the silicon rod to be processed to the waiting area of the silicon rod processing platform or transferring the processed silicon rod on the waiting area out of the silicon rod processing platform.

[0026] In certain embodiments of the first aspect of the present application, the silicon rod transfer device includes: a transfer base slidably disposed on the machine base through a sliding mechanism; a silicon rod platform movably disposed on the transfer base for horizontally placing the silicon rod; a silicon rod fastening mechanism disposed on the silicon rod platform for fastening the silicon rod during the transfer of the silicon rod; a platform flipping mechanism for driving the silicon rod platform to flip relative to the transfer base so that the silicon rod is vertically placed on the silicon rod transfer device.

[0027] In certain embodiments of the first aspect of the present application, the silicon rod cutting and grinding integrated machine further includes a positioning and detection device for performing ridge line detection and center positioning on the silicon rod located in the waiting area.

[0028] In certain embodiments of the first aspect of the present application, the positioning and detection device includes: a ridge line detection unit, including a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism. The contact detection structure is configured to send a conduction and interruption signal to the detection controller by contacting the ridge line of the silicon rod, and the rotation mechanism is configured to adjust the position of the silicon rod according to the control of the detection controller; an axis adjustment unit, configured to position the axis of the silicon rod at the center of the pretreatment area, including a clamping mechanism, where the clamping mechanism is configured to form a clamping space for clamping the silicon rod and the center of the clamping space coincides with the center of the pretreatment area.

[0029] In certain embodiments of the first aspect of the present application, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are distributed at 90° to each other in pairs, and the rotation angle range of the silicon rod conversion device is ±270°.

[0030] In certain embodiments of the first aspect of the present application, the silicon rod conversion device includes: a conveying body; a silicon rod positioning mechanism disposed on the conveying body for positioning the silicon rod; and a conversion driving mechanism for driving the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to be converted between the respective processing areas.

[0031] The second aspect of the present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a machine base having a silicon rod processing platform, the silicon rod processing platform is provided with a first processing area, a second processing area, and a third processing area, and the silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The silicon rod cutting and grinding method includes the following steps:

[0032] Let the silicon rod conversion device convert the first silicon rod to the first processing area, and let the cutting device perform a first-direction side cutting on the first silicon rod in the first processing area;

[0033] Let the silicon rod conversion device rotate a first preset angle to convert the first silicon rod from the first processing area to the second processing area and convert the second silicon rod to the first processing area, and let the cutting device perform a second-direction side cutting on the first silicon rod in the second processing area and a first-direction side cutting on the second silicon rod in the first processing area;

[0034] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, and transfer the third silicon rod to the first processing position. Then, let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. At this stage, let the cutting device perform side cutting in the second direction on the second silicon rod at the second processing position and perform side cutting in the first direction on the third silicon rod at the first processing position.

[0035] Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the first processing position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, unload the first silicon rod from the first processing position and load the fourth silicon rod. Let the cutting device perform side cutting in the first direction on the fourth silicon rod at the first processing position. At this stage, let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position, and let the cutting device perform side cutting in the second direction on the third silicon rod at the second processing position.

[0036] The silicon rod cutting and grinding method disclosed in this application, which is applied to a silicon rod cutting and grinding integrated machine, can make the silicon rod conversion device transfer the silicon rod orderly and seamlessly between various processing devices, and make the cutting device perform two side cuts on the silicon rod to form a square silicon rod, and make the grinding device grind the square silicon rod after square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improving production efficiency and the quality of product processing operations.

[0037] In some embodiments of the second aspect of this application, the first processing position, the second processing position, and the third processing position on the silicon rod processing platform are distributed at 120° to each other; when the direction in the order of the first processing position, the second processing position, and the third processing position is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 120°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 120° or a negative rotation of 240°.

[0038] The third aspect of this application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a machine base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting position, a first processing position, a second processing position, and a third processing position. The silicon rod cutting and grinding integrated machine also includes a cutting device, a grinding device, and a silicon rod conversion device. The silicon rod cutting and grinding method is characterized by including the following steps:

[0039] Load the first silicon rod at the waiting position and perform preprocessing on the first silicon rod.

[0040] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the waiting position to the first processing position, and let the cutting device perform side cutting in the first direction on the first silicon rod at the first processing position. At this stage, load the second silicon rod at the waiting position and perform pretreatment on the second silicon rod;

[0041] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing position to the second processing position and transfer the second silicon rod from the waiting position to the first processing position, and let the cutting device perform side cutting in the second direction on the first silicon rod at the second processing position and perform side cutting in the first direction on the second silicon rod at the first processing position. At this stage, load the third silicon rod at the waiting position and perform pretreatment on the third silicon rod;

[0042] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, transfer the third silicon rod from the waiting position to the first processing position, and let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. At this stage, let the cutting device perform side cutting in the second direction on the second silicon rod at the second processing position and perform side cutting in the first direction on the third silicon rod at the first processing position. Meanwhile, load the fourth silicon rod at the waiting position and perform pretreatment on the fourth silicon rod;

[0043] Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the waiting position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, transfer the fourth silicon rod from the waiting position to the first processing position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and perform pretreatment on the fifth silicon rod. At this stage, let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position, and let the cutting device perform side cutting in the second direction on the third silicon rod at the second processing position and perform side cutting in the first direction on the fourth silicon rod at the first processing position.

[0044] The silicon rod cutting and grinding method applied to the silicon rod cutting and grinding integrated machine disclosed in this application can make the silicon rod conversion device transfer the silicon rod orderly and seamlessly between various processing devices, and make the cutting device perform two side cuts on the silicon rod to form a square silicon rod and make the grinding device grind the square silicon rod after square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improve production efficiency and the quality of product processing operations.

[0045] In certain embodiments of the third aspect of the present application, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° to each other in pairs; when the direction in the order of the waiting area, the first processing area, the second processing area, and the third processing area is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 90°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 90° or a reverse rotation of 270°. Description of the Drawings

[0046] Figure 1 Shown is a perspective structural view of the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0047] Figure 2 Shown is a top view of the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0048] Figure 3 Shown as Figure 1 A partial enlarged view of part A of

[0049] Figure 4 Shown is a structural view of the cutting device in the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0050] Figure 5 Shown is a cross-sectional view in which the intersection point of the first cutting line when the first cutting unit performs side cutting on the silicon rod in the first direction and the second cutting line when the second cutting unit performs side cutting on the silicon rod in the second direction is located inside the cross-section of the silicon rod.

[0051] Figure 6 Shown is a cross-sectional view in which the intersection point of the first cutting line when the first cutting unit performs side cutting on the silicon rod in the first direction and the second cutting line when the second cutting unit performs side cutting on the silicon rod in the second direction is located on the circumference of the cross-section of the silicon rod.

[0052] Figures 7 to 13 Shown is a structural view of the silicon rod cutting and grinding integrated machine of the present application in each step of performing the silicon rod cutting and grinding method. Detailed Embodiments

[0053] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification.

[0054] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical compositions, structures, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the drawings and another element or feature.

[0055] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first direction may be referred to as the second direction, and similarly, the second direction may be referred to as the first direction, without departing from the scope of the various described embodiments.

[0056] Furthermore, as used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms, unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the described features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition only occurs when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0057] In the related processing technology for silicon rods, several processes such as squaring cutting, grinding the surface, and chamfering are involved.

[0058] Generally, most of the existing silicon rods are cylindrical structures. The silicon rods are squared and cut by a silicon rod squaring device, so that the cross-section of the silicon rod after squaring is quasi-rectangular (including quasi-square), and the processed silicon rod as a whole is quasi-cuboid-shaped (which may also include quasi-cubic-shaped).

[0059] Taking a single-crystalline silicon rod as an example, the formation process of the single-crystalline silicon rod may include: first, using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squaring machine to perform a squaring operation on the cut short silicon rods to form a single-crystalline silicon rod with a quasi-rectangular cross-section. Among them, the specific implementation of using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods can refer to patent disclosure documents such as CN105856445A, CN105946127A, and CN105196433A, etc. The specific implementation of using a silicon rod squaring machine to perform a squaring operation on the cut short silicon rods to form a single-crystalline silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN105818285A, etc. However, the formation process of the single-crystalline silicon rod is not limited to the foregoing technologies. In alternative examples, the formation process of the single-crystalline silicon rod may further include: first, using a full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single-crystalline silicon rod with a quasi-rectangular cross-section; after the squaring is completed, using a silicon rod cutting machine to perform a cutting operation on the long single-crystalline silicon rod after squaring and cutting to form short single-crystalline silicon rods. Among them, the specific implementation of using the full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single-crystalline silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN106003443A, etc.

[0060] After using a squaring device to perform a squaring cut on a cylindrical single-crystalline silicon rod to form a quasi-rectangular silicon rod, a grinding device can be used to perform operations such as grinding the surface and chamfering the quasi-rectangular silicon rod.

[0061] The inventors of the present application found that in the related processing technologies for silicon rods, the processing devices involved in squaring, grinding (such as surface grinding, chamfering, etc.) are scattered and independently arranged. The conversion of silicon rods for performing different process operations requires handling and preprocessing before processing, resulting in problems such as complicated processes and low efficiency.

[0062] In view of this, the present application proposes a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Through equipment transformation, multiple processing devices are integrated in one device, which can automatically realize the squaring cut and grinding (such as surface grinding, chamfering, etc.) of the silicon rod. The various processing operations are seamlessly connected, saving labor costs and improving production efficiency, and improving the quality of the silicon rod processing operation.

[0063] Please refer to Figures 1 to 2 wherein, Figure 1 shows a three-dimensional structural schematic diagram of the silicon rod cutting and grinding integrated machine of the present application in an embodiment, Figure 2 shows a top view of the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0064] In this embodiment, the silicon rod cutting and grinding integrated machine of the present application is used for performing processing operations such as squaring cutting and grinding on a silicon rod. Here, the silicon rod is a single crystal silicon rod, but it is not limited thereto. For example, a polycrystalline silicon rod should also fall within the protection scope of the present application.

[0065] As shown in the figure, the silicon rod squaring device disclosed in the present application includes: a machine base 1, a cutting device 2, a grinding device 3, and a silicon rod conversion device 4. The machine base 1 has a silicon rod processing platform. The cutting device 2 is arranged on the machine base 1 and is used for performing side cutting in the first direction on the silicon rod at the first processing area of the silicon rod processing platform and performing side cutting in the second direction on the silicon rod at the second processing area of the silicon rod processing platform to form a square silicon rod. The grinding device 3 is arranged on the machine base 1 and is used for grinding the surface and chamfering the square silicon rod at the third processing area of the silicon rod processing platform.

[0066] The machine base 1, as the main component of the multi-station silicon rod processing machine of the present application, has a silicon rod processing platform. Among them, the silicon rod processing platform can be divided into multiple functional areas according to the specific operation content of the silicon rod processing operation. Specifically, in Figure 1 and Figure 2 the shown embodiment, the silicon rod processing platform at least includes a waiting area, a first processing area, a second processing area, and a third processing area.

[0067] The silicon rod conversion device 4 is arranged in the central area of the silicon rod processing platform and is used for converting the silicon rod 100 between the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform. In an implementation manner, the silicon rod conversion device 4 is rotatably arranged on the silicon rod processing platform. The silicon rod conversion device 4 may further include: a conveying body 41, which is in a disk shape, a square disk shape or other similar shapes; a silicon rod positioning mechanism 43 arranged on the conveying body 41 and used for positioning the silicon rod; and a conversion driving mechanism used for driving the conveying body 41 to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism 43 to convert positions.

[0068] As described above, the silicon rod processing platform in this embodiment includes a waiting area, a first processing area, a second processing area, and a third processing area. To be adapted to these functional areas, the number of silicon rod positioning mechanisms 43 on the conveying body 41 can be set to four, and each silicon rod positioning mechanism 43 can position at least one silicon rod. Further, the angles between the four silicon rod positioning mechanisms 43 are also consistent with the angle distribution between the four functional areas. Thus, when a certain silicon rod positioning mechanism 43 corresponds to a certain functional area, inevitably, the other three silicon rod positioning mechanisms 43 also correspond to the other three functional areas respectively. In this way, in the assembly line operation, at any moment, when at least one silicon rod is positioned on each silicon rod positioning mechanism 43 and the silicon rod positioning mechanism 43 corresponds to the functional area, then these silicon rods are located at a corresponding functional area to perform corresponding processing operations. For example: the silicon rod located in the waiting area can be preprocessed, the silicon rod located in the first processing area can be subjected to the first processing operation, the silicon rod located in the second processing area can be subjected to the second processing operation, and the silicon rod located in the third processing area can be subjected to the third processing operation. In an alternative embodiment, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° to each other. Therefore, correspondingly, the four silicon rod positioning mechanisms 43 on the conveying body 41 are also distributed at 90° to each other. Of course, the number of silicon rod positioning mechanisms 43 can be changed according to actual needs and is not limited to this. For example, the number of silicon rod positioning mechanisms 43 can be determined according to the number of functional areas set on the silicon rod processing platform.

[0069] In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotating carrier 431, a rotating pressing device 433, a lifting driving device (not shown in the figure), and a rotating driving device (not shown in the figure).

[0070] The rotating carrier 431 is disposed on the conveying body 41 in the silicon rod conversion device 4 for carrying the silicon rod 100(200) and making the silicon rod 100(200) stand upright, that is, the bottom of the silicon rod 100(200) is seated on the rotating carrier 431. In this embodiment, the rotating carrier 431 rotates together when the conveying body 41 in the silicon rod conversion device 4 rotates. In some embodiments, the rotating carrier 431 can also be designed to be rotatable, for example, the rotating carrier 431 has a rotating shaft relative to the conveying body 41 to achieve the rotation movement. Thus, after the rotating carrier 431 supports the silicon rod 100(200), the rotating carrier 431 and the silicon rod 100(200) thereon can rotate together. Further, the contact surface of the rotating carrier 431 for contacting the silicon rod has damping to provide a certain frictional force to drive the silicon rod. The rotating carrier 431 is adapted to the silicon rod 100(200). In some embodiments, the rotating carrier 431 can be a circular carrier or a square carrier adapted to the cross-sectional size of the silicon rod 100(200).

[0071] The rotating pressing device 433 is oppositely disposed above the rotating carrier 431 for pressing against the top of the silicon rod 100(200) to press the silicon rod 100(200). The rotating pressing device 433 may further include a movably disposed support and a pressing movable block disposed at the bottom of the support. The support is movably disposed on a central mounting frame, and the central mounting frame is located in the central region of the conveying body 41 and rotates together with the conveying body 41. The pressing movable block is adapted to the silicon rod 100(200). In an alternative embodiment, the pressing movable block can be a round cake-shaped pressing block or a square pressing block adapted to the cross-sectional size of the silicon rod 100(200). Further, the pressing movable block in the rotating pressing device 433 is pivotally connected to the support and can rotate relative to the support.

[0072] As known from the foregoing, the rotating carrier 431 is designed to be rotatable and the pressing movable block in the rotating pressing device 433 is pivotally connected to the support. Therefore, the rotating carrier 431 or the pressing movable block can be linked to a rotation driving device. In one case, when the rotating carrier 431 is linked to a rotation driving device, the rotating carrier 431 is the active rotating component and the pressing movable block is the driven rotating component; in another case, when the pressing movable block is linked to a rotation driving device, the pressing movable block is the active rotating component and the rotating carrier 431 is the driven rotating component.

[0073] In practical applications, the rotary pressing device 433 can cooperate with the rotary carrier 431 below it. Specifically, after the silicon rod 100(200) is placed vertically on the rotary carrier 431, the lifting drive device drives the support to move downward along the central mounting frame until the pressing movable block on the support presses against the top of the silicon rod 100(200). Subsequently, when it is necessary to rotate the silicon rod 100(200), the rotary carrier 431 or the pressing movable block linked by the rotary drive device is driven to rotate. By using the frictional force between the rotary carrier 431, the silicon rod 100(200), and the pressing movable block, the silicon rod 100(200) is also driven to rotate accordingly, realizing the adjustment of the working surface or working area in the silicon rod 100(200), so as to perform processing operations on the adjusted working surface or working area in the silicon rod 100. The rotation speed and rotation angle of the silicon rod 100(200) can be controlled by the rotary drive device. In a specific implementation manner, the lifting drive device can be, for example, a cylinder or a lifting motor, and the rotary drive device can be, for example, a rotary motor.

[0074] Furthermore, as can be seen from the above, in some cases, the rotary carrier 431 or the pressing movable block can be controlled by the rotary drive device to rotate to drive the silicon rod 100(200) to rotate to change the working surface or working area. Sometimes, when the silicon rod 100(200) rotates to the required working surface or working area, it is necessary to stop the actuation and position it to receive the processing operations of the processing device in the corresponding functional area. Therefore, in this application, the silicon rod positioning mechanism may further be configured with a locking mechanism if necessary. In one implementation manner, a carrier locking mechanism (not shown in the figure) can be configured at the bottom of the central mounting frame and adjacent to the rotary carrier 431. The carrier locking mechanism may include a locking pin and a locking cylinder connected to the locking pin. In practical applications, when it is necessary to lock the rotary carrier 431, the locking cylinder in the carrier locking mechanism drives the locking pin to extend and act on the bottom or neck of the rotary carrier 431 to ensure that the rotary carrier 431 is firmly immovable. When it is necessary to rotate the silicon rod to change the working surface or working area, the locking cylinder in the carrier locking mechanism then drives the locking pin to retract, unlocking the rotary carrier 431, so that the rotary carrier 431 can rotate.

[0075] The conveying body 41 is driven to rotate under the control of the conversion drive mechanism. Through the rotation of the conveying body 41, the silicon rod positioning mechanism 43 on the conveying body 41 and the silicon rod 100(200) positioned by the silicon rod positioning mechanism 43 are converted between different functional areas.

[0076] In some embodiments, the conversion driving mechanism further includes: a conversion toothed belt disposed on the circumferential side of the conveying body 41; a driving motor and a linkage structure connected to and driven by the driving motor, disposed on the silicon rod processing platform of the machine base 1, and the linkage structure includes a rotating gear meshing with the conversion toothed belt. Thus, the rotating gear drives the conveying body 41 to rotate under the drive of the driving motor to drive the silicon rod positioning mechanism 43 and the silicon rod 100 (200) thereon to be converted to other functional positions to complete the conveying, and the driving motor can be a servo motor.

[0077] In some embodiments, the silicon rod conversion device 4 may further include a locking mechanism (not shown in the drawings) for locking the conveying body 41. For example, the locking mechanism may include a locking bolt and a locking cylinder connected to the locking bolt. The number of locking bolts may be multiple and evenly distributed on the edge of the conveying body 41 (for example, the number of locking bolts is four and evenly distributed at a 90° angle). In practical applications, when it is necessary to convert the silicon rod from one processing position to another processing position, the locking cylinder drives the locking bolt to contract, unlocking the disc-shaped or ring-shaped conveying body, so that the conveying body 41 can rotate; when the silicon rod conversion is completed, that is, after the silicon rod is converted from one processing position to the target processing position, the locking cylinder in the locking mechanism drives the locking bolt to extend and act on the conveying body 41 to lock the conveying body 41.

[0078] As described above, the silicon rod in the waiting position can be subjected to pretreatment operations. The silicon rod cutting and grinding integrated machine of the present application further includes a silicon rod transfer device 6, adjacent to the waiting position of the silicon rod processing platform, for transferring the silicon rod 100 (200) to be processed to the waiting position of the silicon rod processing platform or transferring the processed silicon rod on the waiting position out of the silicon rod processing platform.

[0079] Please refer to Figure 3 shown as Figure 1 a partial enlarged view of part A in Figure 3 As shown, the silicon rod transfer device 6 further includes: a transfer base 61, a silicon rod platform 63, and a platform flipping mechanism.

[0080] The transfer base 61 is slidably disposed on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can achieve sliding in at least two directions. For example, the sliding mechanism includes a support portion 621, a conversion portion 623, a first-direction sliding unit disposed between the support portion 621 and the conversion portion 623, and a second-direction sliding unit disposed between the conversion portion 623 and the transfer base 61. Among them, the first-direction sliding unit may include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction driving source. The second-direction sliding unit may include a second-direction slide rail, a second-direction slider or slide bar corresponding to the second-direction slide rail, and a second-direction driving source.

[0081] Among them, the first slide rail, the first-direction slider or slide bar, the second slide rail, and the second-direction slider or slide bar are arranged in a horizontal state. Any one of the first-direction driving source and the second-direction driving source may include a sliding rack, a rotating gear (not shown in the figure) meshing with the sliding rack, and a sliding driving motor. For the first-direction sliding unit, the first driving source can drive the conversion portion 623 and the transfer base 61 thereon to slide along the first direction through the first-direction slider or slide bar and the first-direction slide rail. For the second-direction sliding unit, the second driving source can drive the transfer base 61 to slide along the second direction through the second-direction slider or slide bar and the second-direction slide rail.

[0082] In some examples, the first direction may be, for example, the left-right direction (i.e., Figure 2 and Figure 3 the X-axis direction in Figure 2 and Figure 3 ), and the second direction may be, for example, the front-back direction (i.e.,

[0083] the Y-axis direction in

[0084] The silicon rod platform 63 is movably disposed on the transfer base 61 and is used for horizontally (i.e., horizontally) placing the silicon rods 100 (200). In this embodiment, the silicon rod platform 63 is a plate-like structure or a frame structure. At least one silicon rod support bracket is respectively provided at the front and rear ends of the silicon rod platform 63 at least to support the front and rear ends of the silicon rods 100 (200), so that the silicon rods 100 (200) can be horizontally placed. At the same time, stop structures may also be respectively provided on the left and right sides of the silicon rod platform to limit the movement of the silicon rods 100 (200) in the left-right direction.

[0084] As we know, in subsequent processing operations, it is necessary to convert the silicon rod 100 from a horizontal state (lying horizontally) to an upright state (standing vertically). Therefore, in this application, a silicon rod fastening mechanism can also be provided for fastening the silicon rod during the transfer process of the silicon rod (not shown in the drawings). In some embodiments, the silicon rod fastening mechanism may include fastening claws and a fastening motor or a fastening cylinder for controlling the fastening claws. Further, at least two pairs of fastening claws are included in the silicon rod fastening mechanism, and the at least two pairs of fastening claws respectively correspond to the foregoing two silicon rod support brackets, that is, one pair of fastening claws corresponds to one silicon rod support bracket, and the two fastening claws in one pair of fastening claws are oppositely arranged on the left and right sides of the silicon rod support bracket, and a fastening motor or a fastening cylinder is arranged on each fastening claw. In practical applications, when the silicon rod 100 (200) lies horizontally on the silicon rod platform, the fastening motor or the fastening cylinder drives the respective corresponding fastening claws towards the silicon rod 100 (200) on the silicon rod platform. In this way, through the cooperation of at least two pairs of fastening claws, the overall fastening of the silicon rod 100 (200) is achieved. Preferably, a buffer member can be provided at the pressing contact where the fastening claw contacts the silicon rod 100 (200) to avoid or reduce damage to the silicon rod 100 (200).

[0085] To convert the silicon rod 100 from a horizontal state (lying horizontally) to an upright state (standing vertically), the silicon rod transfer device 6 further includes a platform flipping mechanism. The platform flipping mechanism is used to drive the silicon rod platform 63 to flip relative to the transfer base 61, so that the silicon rod 100 (200) is vertically placed on the silicon rod conversion device 4. In this embodiment, the platform flipping mechanism includes: a mounting frame, a moving frame, a flipping cylinder or a flipping motor, a flipping rack, and a flipping gear. The mounting frame is fixedly arranged on the transfer base. In some embodiments, the mounting frame is a plate-like structure or a frame structure. The moving frame is movably arranged above the mounting frame. In some embodiments, the moving frame is a hollow plate-like structure or a frame structure. Further, flipping racks are respectively arranged on the left and right opposite sides of the moving frame adjacent to the silicon rod conversion device 4. Correspondingly, flipping gears are respectively arranged on the left and right opposite sides of the flipping end of the silicon rod platform 63 adjacent to the silicon rod conversion device 4, and the flipping gears are meshed with the corresponding flipping racks above. The flipping cylinder or the flipping motor is used to drive the moving frame to move relative to the mounting frame. Taking the flipping cylinder as an example, the flipping cylinder is integrally arranged in the hollow area of the moving frame. Specifically, the cylinder body of the flipping cylinder (for example, including a cylinder barrel and a piston) is arranged on the mounting frame, and the piston rod of the flipping cylinder is connected to the moving frame. In practical applications, for the silicon rod platform to be flipped from a horizontal state to a vertical state: the flipping cylinder acts, the piston rod extends and pushes the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the flipping rack on the moving frame also moves with the moving frame. The flipping gear meshed with the flipping rack on the silicon rod platform rotates under the drive of the flipping rack, thereby driving the silicon rod platform to flip, and finally realizing the flipping of the silicon rod platform from a horizontal state to a vertical state. For the silicon rod platform to be flipped from a vertical state to a horizontal state: the flipping cylinder acts, the piston rod contracts and pulls the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the flipping rack on the moving frame also moves with the moving frame. The flipping gear meshed with the flipping rack on the silicon rod platform rotates under the drive of the flipping rack, thereby driving the silicon rod platform to flip, and finally realizing the flipping of the silicon rod platform from a vertical state to a horizontal state.

[0086] It should be added that: In addition, in order to enable the moving frame to move smoothly and steadily relative to the mounting frame, slide rails are arranged on the left and right opposite sides of the mounting frame, and sliders or slide bars for sliding on the slide rails are arranged on the left and right opposite sides of the bottom of the moving frame. Of course, the above is only an exemplary description and is not intended to limit the present invention. For example, in other embodiments, the slide rails can be arranged on the moving frame and the sliders or slide bars can be arranged on the mounting frame. Furthermore, in order to avoid or reduce the collision damage to the moving frame, the mounting frame, the flipping cylinder or the flipping motor during the flipping process of the silicon rod platform (for example, when the silicon rod platform flips back from a vertical state to a horizontal state), a relatively protruding buffer can be further arranged on the moving frame or the mounting frame.

[0087] The silicon rod transfer device 6 may further include a lifting mechanism. The lifting mechanism is disposed on the silicon rod platform and is used for lifting the silicon rod 100(200) after flipping. In this embodiment, the lifting mechanism may include a slide rail or a slide bar, and a lifting motor or a lifting cylinder. Among them, in order to realize the lifting movement of the silicon rod 100(200), the silicon rod support bracket is arranged on the silicon rod platform through the slide rail or the slide bar (the silicon rod fastening mechanism is installed and connected to the silicon rod support bracket), and the lifting motor or the lifting cylinder controls the silicon rod support bracket (together with the silicon rod fastening mechanism) to perform a lifting movement, thereby driving the silicon rod 100(200) to realize lifting. Still taking the lifting cylinder as an example, the lifting cylinder is integrally arranged in the middle of the silicon rod platform. Specifically, the cylinder body of the lifting cylinder (for example, including a cylinder barrel and a piston) is arranged on the silicon rod platform, and the piston rod of the lifting cylinder is connected to the silicon rod support bracket. In practical applications, when the lifting cylinder actuates, the piston rod expands and contracts (extends or contracts) and pushes and pulls (pushes or pulls) the silicon rod support bracket, so that the silicon rod support bracket moves up and down relative to the mounting bracket under the push and pull, and the silicon rod 100(200) on the silicon rod support bracket also moves up and down following the silicon rod support bracket.

[0088] The foregoing silicon rod transfer device 6 is only an exemplary illustration and is not limited thereto. The silicon rod transfer device can still make other changes.

[0089] In some embodiments, the silicon rod transfer device may include: a commutation carrier, a silicon rod clamp disposed on the commutation carrier, and a commutation drive mechanism for driving the commutation carrier to perform a commutation movement.

[0090] The commutation carrier is a main device for setting various other components in the silicon rod transfer device. Various other components mainly may include a silicon rod clamp, but are not limited thereto. Other components may also be, for example, mechanical structures, electrical control systems, and numerical control devices, etc. In this embodiment, the commutation carrier may include a base, a top frame opposite to the base, and a support structure disposed between the base and the top frame. In addition, another important function of the commutation carrier is to support the commutation conversion of the silicon rod clamp through a commutation movement. The commutation carrier may perform a commutation movement, for example, through a commutation drive mechanism. By using the commutation drive mechanism, the commutation carrier can be driven to perform a commutation movement to make the silicon rod clamp on the commutation carrier clamp the silicon rod 100 to be processed and transfer it from the loading and unloading area to the corresponding waiting position, or, clamp the processed silicon rod 200 corresponding to the waiting position and transfer it from the waiting position to the loading and unloading area.

[0091] In terms of specific implementation manners, the commutation drive mechanism for enabling the commutation vehicle to perform commutation movement may include a rotating shaft and a rotating motor. The commutation vehicle is shaft-connected to the underlying installation infrastructure through the rotating shaft. When implementing the steering movement, the rotating motor is started to drive the rotating shaft to rotate, thereby driving the commutation vehicle to rotate to achieve the commutation movement. The driving of the rotating shaft to rotate can be designed as unidirectional rotation or bidirectional rotation. The unidirectional rotation can be, for example, unidirectional clockwise rotation or unidirectional counterclockwise rotation, and the bidirectional rotation can be, for example, to achieve clockwise rotation and counterclockwise rotation. In addition, the angle of driving the rotating shaft to rotate can be set according to the actual structure of the silicon rod transfer device. Furthermore, the base in the commutation vehicle can adopt a disc structure, a rectangular disc or an elliptical disc, and its central position is connected to the rotating shaft. However, the shape of the base is not limited to this. In other embodiments, the base can also adopt other shapes.

[0092] A silicon rod clamp is provided on the commutation vehicle for clamping the corresponding silicon rod. For example, in some embodiments, a silicon rod clamp is provided on a certain mounting surface of the commutation vehicle. The silicon rod clamp may include at least two silicon rod clamping members, and among them, the at least two silicon rod clamping members are arranged at intervals. The silicon rod clamping members in the silicon rod clamp can be used to clamp round silicon rods (i.e., silicon rods to be processed) and square silicon rods (i.e., processed silicon rods). In this way, by driving the commutation vehicle to perform commutation movement, the silicon rod clamp on the commutation vehicle is switched between the loading and unloading area and the waiting position area to transfer the silicon rods to be processed, and is switched between the waiting position area and the loading and unloading area to transfer the processed silicon rods. In actual applications, the rotation angle of the commutation vehicle during commutation movement is determined according to the positional relationship between the loading and unloading area and the waiting position area. In some implementation manners, the loading and unloading area and the waiting position area are arranged opposite to each other, and the silicon rod transfer device is located between the two. Therefore, the commutation vehicle is driven by the commutation drive mechanism to rotate by an angle of 180°. In some implementation manners, the loading and unloading area and the waiting position area are arranged at a 90° angle. Then, the commutation vehicle is driven by the commutation drive mechanism to rotate by an angle of 90°. However, anyway, there is no specific limitation on the positional relationship between the loading and unloading area and the waiting position area. Their setting order and the setting angle between each other can still be changed in other ways. As long as there is no unnecessary interference between each work station, in this way, the rotation direction and rotation angle of the commutation vehicle will also be adjusted adaptively.

[0093] In some embodiments, both the silicon rod to be processed and the processed silicon rod are placed vertically. Therefore, at least two silicon rod clamping members in the silicon rod clamp are arranged at intervals up and down. Any one of the silicon rod clamping members may further include: a clamp arm mounting seat and two clamp arms. Among them, the clamp arm mounting seat is arranged on the commutation carrier, and at least two clamp arms are movably arranged on the clamp arm mounting seat. These two clamp arms are symmetrically arranged left and right, and the two clamp arms can form a clamping space for clamping a single-wafer silicon rod or a silicon cube. Additionally, the silicon rod clamping member can also play a role in centering adjustment. Generally, when the clamp arms in the silicon rod clamping member are in the clamped state, the center of the clamping space formed by the two clamp arms coincides with the center of the silicon rod to be processed and the processed silicon rod. Therefore, when using the silicon rod clamping member to clamp the silicon rod to be processed or the processed silicon rod placed vertically, the two clamp arms in the silicon rod clamping member contract, and the clamp arms abut against the silicon rod to be processed or the processed silicon rod. During the process of the clamp arms contracting and clamping the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamp arms on both sides and moves towards the central area of the clamping space until the silicon rod to be processed or the processed silicon rod is clamped by the two clamp arms in the silicon rod clamping member. At this time, the center of the silicon rod to be processed or the processed silicon rod can be located at the center of the clamping space of the silicon rod clamping member.

[0094] To enable at least two clamp arms in the silicon rod clamping member to smoothly and stably clamp silicon rods to be processed or processed silicon rods with different size specifications, at least one of the clamp arms in each of the silicon rod clamping members is designed to be adjustable. Taking two clamp arms as an example, at least one of the two clamp arms is a movable design (one or both of the two clamp arms are movable designs), so that the clamping distance between the two clamp arms can be adjusted.

[0095] In addition, the silicon rod clamp in the silicon rod transfer device of the present application may have other variations. For example, the silicon rod transfer device may be configured with two silicon rod clamps, and these two silicon rod clamps can be respectively arranged on two opposite mounting surfaces in the commutation carrier. Moreover, these two silicon rod clamps can be the same or different. In the embodiment where the two silicon rod clamps are the same, these two silicon rod clamps are used to clamp round silicon rods and square silicon rods. In the embodiment where the two silicon rod clamps are different, one of the two silicon rod clamps is used to clamp round silicon rods, and the other silicon rod clamp is used to clamp square silicon rods.

[0096] Furthermore, the silicon rod transfer device 6 in the present application can further provide movement in at least one direction. For example, the silicon rod transfer device may further include a forward and backward movement mechanism, and the forward and backward movement mechanism may include: a forward and backward guide rail and a forward and backward motor. Among them, the forward and backward guide rail is arranged in the front and back direction, and the base of the commutation carrier can be cushioned on the forward and backward guide rail through a slider. Thus, when it is necessary to adjust the position of the commutation carrier, the forward and backward motor drives the commutation carrier to advance and retreat along the forward and backward guide rail.

[0097] The silicon rod cutting and grinding integrated machine of the present application further includes a positioning and detection device. In this embodiment, the positioning and detection device (not shown in the drawings) is used to perform ridge line detection and center positioning on the silicon rod 100 located at the waiting position.

[0098] The positioning and detection device further includes: a ridge line detection unit and an axis center adjustment unit.

[0099] In some embodiments, the ridge line detection unit includes a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism. The contact detection structure is used to send a conduction and interruption signal to the detection controller by contacting the ridge line of the silicon rod, and the rotation mechanism is used to adjust the position of the silicon rod according to the control of the detection controller.

[0100] The number of the silicon rod positioning mechanisms 43 can be changed according to actual needs and is not limited thereto. For example, the number of the silicon rod positioning mechanisms 43 can be determined according to the number of functional positions set on the silicon rod processing platform.

[0101] In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotating carrier 431,

[0102] In some embodiments, the axis center adjustment unit is used to position the axis center of the silicon rod 100 at the center of the pretreatment area, and includes a clamping mechanism. The clamping mechanism is used to form a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the pretreatment area.

[0103] In a specific implementation manner, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

[0104] Given that the cross-section of the silicon rod is circular, in some examples, the clamping member as a whole is a circular workpiece fixture. There are two symmetrically designed clamping arms that make up the clamping member. A single clamping arm is designed to have an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single clamping arm exceeds a quarter of the arc of the silicon rod 100. In this way, the arc-shaped clamping surface of the clamping member composed of two clamping arms exceeds half of the arc of the silicon rod 100. Of course, a buffer pad can be additionally provided on the arc-shaped clamping surface in the clamping arm to avoid damaging the surface of the silicon rod during the process of clamping the silicon rod, achieving a good effect of protecting the silicon rod. Generally, when the clamping arms in the clamping member are in the clamped state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when using the clamping member to clamp the silicon rod 100 vertically placed at the to-be-processed location, the two clamping arms in the clamping member contract, and the arc-shaped clamping surface in the clamping arm abuts against the silicon rod. During the process of the clamping arms contracting and clamping the silicon rod 100, the silicon rod 100 is pushed by the two clamping arms on both sides and moves towards the central area of the clamping space until the silicon rod 100 is clamped by the clamping arms in the clamping member. At this time, the center of the silicon rod 100 can be located at the center of the clamping space of the clamping member.

[0105] When the silicon rod 100 to be processed is transferred by the silicon rod transfer device 6 to the waiting location of the silicon rod processing platform and undergoes pre-treatment, the silicon rod can be transferred from the waiting location to other processing locations by the silicon rod conversion device 4.

[0106] The cutting device 2 is provided on the machine base 1 and is used to perform side cutting in the first direction on the silicon rod 100 at the first processing location of the silicon rod processing platform and side cutting in the second direction on the silicon rod 100 at the second processing location of the silicon rod processing platform to form a square silicon rod.

[0107] Please refer to Figure 4 , which shows a schematic structural diagram of the cutting device in an embodiment of the silicon rod cutting and grinding integrated machine of the present application. In the silicon rod cutting and grinding integrated machine as shown in Figure 1 , Figure 2 and Figure 4 , the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

[0108] The cutting frame 21 is provided on the machine base 1. In this embodiment, the cutting frame 21 is a columnar structure or a frame structure, serving as the support main body of the cutting device 2 and providing support for other components in the cutting device 2.

[0109] The cutting support 22 is vertically movably arranged on the cutting frame 21 through a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism that can realize the vertical movement of the cutting support 22, such as a lifting motor, lifting guide rails, and lifting sliders. Among them, the lifting guide rails are vertically arranged on the cutting frame 21, and the lifting sliders are arranged on the back of the cutting support 22 and cooperate with the lifting guide rails. To enable the cutting support 22 to be stably lifted and lowered in the installation structure of the machine base 1, a double-guide rail design can be adopted, that is, two lifting guide rails are used, and these two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the cutting support 22 can be lifted and lowered relative to the cutting frame 21 and the machine base 1 by means of the lifting guide rails and the lifting sliders.

[0110] In this embodiment, since the cutting support 22 can be configured with the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Therefore, in this embodiment, on the one hand, the cutting frame 21 and the cutting support 22 in the cutting device 2 are arranged at the middle position between the first processing area and the second processing area. On the other hand, the cutting support 22 has a special design. As Figures 1 to 4 shown, the cutting support 22 in this embodiment may include a support body 221 and a first support flank 223 and a second support flank 225 located on the opposite sides of the support body 221. Among them, the angle between the first support flank 223 and the support body 221 is an obtuse angle, and the angle between the second support flank 225 and the support body 221 is an obtuse angle, so that the first support flank 223 and the second support flank 225 are perpendicularly arranged, that is, the first support flank 223 is arranged along the Y axis and the second support flank 225 is arranged along the X axis. For example, in some embodiments, the support body 221 in the cutting support 22 is arranged at an angle of 45° with the X axis or the Y axis, the angle between the first support flank 223 and the support body 221 is 145° and is arranged along the Y axis, and the angle between the second support flank 225 and the support body 221 is 145° and is arranged along the X axis.

[0111] The first cutting unit 23 is arranged on the first side of the cutting support 22 and is used for performing a first-direction side cutting on the silicon rod 100 in the first processing area of the silicon rod processing platform.

[0112] In this embodiment, as mentioned above, the cutting support 22 includes a support body 221 and a first support wing 223 and a second support wing 225 located on opposite sides of the support body 221, so the first cutting unit 23 is installed at the first support wing 223 of the cutting support 22. Specifically, the first cutting unit 23 includes a first wire frame 231 disposed on the first support wing 223, a plurality of first cutting wheels 233 disposed on the first wire frame 231, and a first cutting wire 235, and the first cutting wire 235 is sequentially wound around the plurality of first cutting wheels 233 to form a first cutting line segment disposed in a first direction. In this embodiment, the first direction is the X-axis direction.

[0113] In actual applications, the first cutting unit 23 may include at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into a pair of first cutting wheel groups, that is, two first cutting wheels arranged opposite to each other along the first direction (i.e., along the X-axis direction) form one first cutting wheel group, and two first cutting wheel groups arranged along the second direction (i.e., along the Y-axis direction) form a pair of first cutting wheel groups. Specifically, the first cutting unit 23 includes a pair of first cutting wheel groups, and the pair of first cutting wheel groups may include two first cutting wheel groups, and the two first cutting wheel groups are arranged along the second direction (i.e., along the Y-axis direction) on the left and right sides of the first wire frame 231, wherein one first cutting wheel group is located on the left side of the first wire frame 231 and includes two first cutting wheels 233 arranged along the first direction (i.e., along the X-axis direction), and the other first cutting wheel group is located on the right side of the first wire frame 231 and includes two first cutting wheels 233 arranged along the first direction (i.e., along the X-axis direction).

[0114] The first cutting line 235 is sequentially wound around each first cutting wheel 233 in the first cutting unit 23 to form a first cutting line net. In actual applications, the first cutting line 235 is sequentially wound around the four first cutting wheels 233 in the first cutting unit 23 to form two first cutting line segments, which are arranged along the X-axis and parallel to each other, forming a first cutting line net. Specifically, the first cutting line 235 is wound around two first cutting wheels 233 arranged along the first direction (i.e., along the X-axis direction) in one first cutting wheel group to form one first cutting line segment, and the first cutting line 235 is wound around two first cutting wheels 233 arranged along the first direction (i.e., along the X-axis direction) in another first cutting wheel group to form another first cutting line segment. In this way, the two mutually parallel first cutting line segments cooperate to form a first cutting line net in the shape of "=" along the first direction (i.e., along the X-axis direction).

[0115] Of course, the first cutting unit 23 is not Figures 1 to 3 The embodiments shown are limited thereto, and other changes may be made in other embodiments.

[0116] In some embodiments, the first cutting unit 23 may include at least four first cutting wheels 233. These four first cutting wheels 233 can be combined into a pair of first cutting wheel sets. That is, two first cutting wheels arranged oppositely along the Y-axis form a first cutting wheel set, and two first cutting wheel sets along the X-axis form a pair of first cutting wheel sets. Specifically, the first cutting unit 23 includes a pair of first cutting wheel sets. The pair of first cutting wheel sets may include two first cutting wheel sets, which are arranged on the front and rear sides of the first wire rack 231 along the first direction (i.e., along the X-axis direction). Among them, one first cutting wheel set is located on the front side of the first wire rack 231 and includes two first cutting wheels 233 arranged along the second direction (i.e., along the Y-axis direction), and the other first cutting wheel set is located on the rear side of the first wire rack 231 and includes two first cutting wheels 233 arranged along the second direction (i.e., along the Y-axis direction). The first cutting wire 235 is sequentially wound around each of the first cutting wheels 233 in the first cutting unit 23 to form a first cutting wire mesh. In actual applications, the first cutting wire 235 is sequentially wound around the four first cutting wheels 233 in the first cutting unit 23 to form two first cutting wire segments. These two first cutting wire segments are arranged along the second direction (i.e., along the Y-axis direction) and are parallel to each other, constituting the first cutting wire mesh. Specifically, the first cutting wire 235 forms a first cutting wire segment after being wound around the two first cutting wheels 233 arranged along the second direction (i.e., along the Y-axis direction) in one first cutting wheel set, and the first cutting wire 235 forms another first cutting wire segment after being wound around the two first cutting wheels 233 arranged along the second direction (i.e., along the Y-axis direction) in the other first cutting wheel set. In this way, these two parallel first cutting wire segments cooperate to form a first cutting wire mesh in the shape of "=" along the second direction (i.e., along the Y-axis direction).

[0117] In some embodiments, the number of the first cutting wheels 233 and the first cutting wire segments in the first cutting unit 23 may also be changed in other ways. For example, the first cutting unit includes two first cutting wheels, which are arranged oppositely along the first direction (i.e., along the X-axis direction) or along the second direction (i.e., along the Y-axis direction). The first cutting wire is sequentially wound around the two first cutting wheels in the first cutting unit to form a first cutting wire segment in the shape of "-" along the first direction (i.e., along the X-axis direction) or along the second direction (i.e., along the Y-axis direction), serving as the first cutting wire mesh.

[0118] In addition, in this embodiment, the first cutting unit 23 may further include at least one of the following components: a wire guide wheel disposed on the first wire frame 231 and / or the first support flank 223 for guiding the first cutting wire 235; a tension wheel disposed on the first wire frame 231 and / or the first support flank 223 for adjusting the tension of the first cutting wire 235; and a wire storage cylinder (the wire storage cylinder may further include a wire pay-off cylinder and a wire take-up cylinder) disposed on the machine base 1 for taking in and paying out the first cutting wire.

[0119] The second cutting unit 25 is disposed on the second side of the cutting support 22 for performing a second-direction side cutting on the silicon rod 100 at the second processing location of the silicon rod processing platform.

[0120] In this embodiment, as described above, the cutting support 22 includes a support main body 221 and first and second support flanks 223 and 225 located on opposite sides of the support main body 221. Therefore, the second cutting unit 25 is installed at the second support flank 225 of the cutting support 22. Specifically, the second cutting unit 25 includes a second wire frame 251 disposed on the second support flank 225, a plurality of second cutting wheels 253 disposed on the second wire frame 251, and a second cutting wire 255. The second cutting wire 255 is sequentially wound around the plurality of second cutting wheels 253 to form a second cutting segment arranged in the second direction. In this embodiment, the second direction is the Y-axis direction.

[0121] In actual application, the second cutting unit 25 may include at least four second cutting wheels 253. These four second cutting wheels 253 can be combined into a pair of second cutting wheel groups, that is, two second cutting wheels arranged oppositely in the second direction (i.e., along the Y-axis direction) form a second cutting wheel group, and a pair of second cutting wheel groups is formed by two second cutting wheel groups in the first direction (i.e., along the X-axis direction). Specifically, the second cutting unit 25 includes a pair of second cutting wheel groups. The pair of second cutting wheel groups may include two second cutting wheel groups. These two second cutting wheel groups are arranged on the left and right sides of the second wire frame 251 in the first direction (i.e., along the X-axis direction). Among them, one second cutting wheel group is located on the left side of the second wire frame 251 and includes two second cutting wheels 253 arranged in the second direction (i.e., along the Y-axis direction), and the other second cutting wheel group is located on the right side of the second wire frame 251 and includes two second cutting wheels 253 arranged in the second direction (i.e., along the Y-axis direction).

[0122] The second cutting line 255 is sequentially wound around each second cutting wheel 253 in the second cutting unit 25 to form a second cutting line network. In actual applications, the second cutting line 255 is sequentially wound around four second cutting wheels 253 in the second cutting unit 25 to form two second cutting line segments. These two second cutting line segments are arranged along the second direction (i.e., along the Y-axis direction) and are parallel to each other, constituting the second cutting line network. Specifically, the second cutting line 255 is wound around two second cutting wheels 253 arranged along the second direction (i.e., along the Y-axis direction) in one second cutting wheel group to form a second cutting line segment, and the second cutting line 255 is wound around two second cutting wheels 253 arranged along the second direction (i.e., along the Y-axis direction) in another second cutting wheel group to form another second cutting line segment. In this way, these two parallel second cutting line segments cooperate to form a second cutting line network in the shape of "=" along the second direction (i.e., along the Y-axis direction).

[0123] Of course, the second cutting unit 25 is not limited to Figures 1 to 3 the embodiment shown, and it can still be changed in other embodiments.

[0124] In some embodiments, the second cutting unit 25 may include at least four second cutting wheels 253. These four second cutting wheels 253 can be combined into a pair of second cutting wheel groups. That is, two second cutting wheels arranged opposite to each other in the first direction (i.e., along the X-axis direction) form a second cutting wheel group, and two second cutting wheel groups in the second direction (i.e., along the Y-axis direction) form a pair of second cutting wheel groups. Specifically, the second cutting unit 25 includes a pair of second cutting wheel groups. The pair of second cutting wheel groups may include two second cutting wheel groups. These two second cutting wheel groups are arranged on the front and rear sides of the second wire frame 251 in the second direction (i.e., along the Y-axis direction). Among them, one second cutting wheel group is located on the front side of the second wire frame 251 and includes two second cutting wheels 253 arranged in the first direction (i.e., along the X-axis direction), and the other second cutting wheel group is located on the rear side of the second wire frame 251 and includes two second cutting wheels 253 arranged in the first direction (i.e., along the X-axis direction). The second cutting wire 255 is sequentially wound around each second cutting wheel 253 in the second cutting unit 25 to form a second cutting wire mesh. In actual applications, the second cutting wire 255 is sequentially wound around the four second cutting wheels 253 in the second cutting unit 25 to form two second cutting line segments. These two second cutting line segments are arranged in the first direction (i.e., along the X-axis direction) and are parallel to each other, constituting the second cutting wire mesh. Specifically, the second cutting wire 255 is wound around the two second cutting wheels 253 arranged in the first direction (i.e., along the X-axis direction) in one second cutting wheel group to form a second cutting line segment, and the second cutting wire 255 is wound around the two second cutting wheels 253 arranged in the first direction (i.e., along the X-axis direction) in the other second cutting wheel group to form another second cutting line segment. In this way, these two parallel second cutting line segments cooperate to form a second cutting wire mesh in the shape of "=" in the first direction (i.e., along the X-axis direction).

[0125] In some embodiments, the number of second cutting wheels 253 and second cutting line segments in the second cutting unit 25 may also be changed in other ways. For example, the second cutting unit includes two second cutting wheels. These two second cutting wheels are arranged opposite to each other in the second direction (i.e., along the Y-axis direction) or in the first direction (i.e., along the X-axis direction). The second cutting wire is sequentially wound around the two second cutting wheels in the second cutting unit to form a second cutting line segment in the shape of "—" in the second direction (i.e., along the Y-axis direction) or in the first direction (i.e., along the X-axis direction), serving as the second cutting wire mesh.

[0126] In addition, in this embodiment, the second cutting unit 25 may further include at least one of the following components: a wire guide wheel disposed on the second wire rack 251 and / or the second support flank 225 for guiding the second cutting wire 255; a tension wheel disposed on the second wire rack 251 and / or the second support flank 225 for adjusting the tension of the second cutting wire 255; and a wire storage cylinder (the wire storage cylinder may further include a wire pay-off cylinder and a wire take-up cylinder) disposed on the machine base 1 for taking in and paying out the second cutting wire.

[0127] Furthermore, regarding the first cutting wire 235 in the first cutting unit 23 and the second cutting wire 255 in the second cutting unit 25.

[0128] In some embodiments, the first cutting unit 23 and the second cutting unit 25 are two independent cutting units, and the first cutting wire 235 in the first cutting unit 23 and the second cutting wire 255 in the second cutting unit 25 may be two independent cutting wires.

[0129] In some embodiments, the first cutting wire 235 in the first cutting unit 23 and the second cutting wire in the second cutting unit 25 may be the same cutting wire. In this case, the shared cutting wire is sequentially wound around a plurality of first cutting wheels 233 in the first cutting unit 23 to form a first cutting wire mesh and then transferred to the adjacent second cutting unit to be sequentially wound around a plurality of second cutting wheels 253 in the second cutting unit 25 to form a second cutting wire mesh. Therefore, in this embodiment, one or more guide wheels for winding the shared cutting wire are further provided on the cutting support 22 between the first cutting unit 23 and the second cutting unit 25. Specifically, in Figure 2 the shown embodiment, a guide wheel 26 for winding the shared cutting wire is provided on the support body 221 of the cutting support 22 between the first cutting unit 23 and the second cutting unit 25. The first cutting unit 23 and the second cutting unit 25 sharing the same cutting wire can simplify the structure of the cutting unit (for example, omitting a set of wire pay-off cylinder and wire take-up cylinder), have good integrity, simplify the wire winding process, improve efficiency, and better control the wire tension of the two cutting units, etc.

[0130] When using Figure 2When the cutting device 2 in the illustrated embodiment cuts the silicon rods on the first processing area and the second processing area of the silicon rod processing platform, the driving cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the silicon rods on the corresponding first processing area and the second processing area. Among them, the first cutting unit 23 performs a side cut on the silicon rod on the first processing area along the first direction (i.e., along the X-axis direction) (the first cutting unit 23 is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction), and the second cutting unit 25 performs a side cut on the silicon rod on the second processing area along the second direction (i.e., along the Y-axis direction) (the second cutting unit 25 is provided with a second cutting wire mesh in the shape of "=" along the Y-axis direction). Of course, in other embodiments, if the first cutting unit 23 is provided with a first cutting wire mesh in the shape of "=" along the second direction (i.e., along the Y-axis direction), then the first cutting unit 23 performs a side cut on the silicon rod on the first processing area along the second direction (i.e., along the Y-axis direction). Similarly, if the second cutting unit 25 is provided with a first cutting wire mesh in the shape of "=" along the first direction (i.e., along the X-axis direction), then the first cutting unit 23 performs a side cut on the silicon rod on the first processing area along the first direction (i.e., along the X-axis direction). It can be seen that in this embodiment, the first cutting unit 23 and the second cutting unit 25 in the cutting device 2 share the cutting support 22. By driving the shared cutting support 22 to move up and down, the first cutting unit 23 and the second cutting unit 25 thereon can respectively perform a side cut on the silicon rod on the first processing area along the first direction (i.e., along the X-axis direction) and a side cut on the silicon rod on the second processing area along the second direction (i.e., along the Y-axis direction) at the same time. The cutting device 2 has a simple overall structure, convenient control, and can improve the cutting efficiency and quality of the silicon rod.

[0131] It should be noted that in this embodiment, the intersection point of the first cutting line 235 when the first cutting unit 23 performs a side cut on the silicon rod 100 in the first direction and the second cutting line 255 when the second cutting unit 25 performs a side cut on the silicon rod 100 in the second direction is located within the cross-section of the silicon rod 100 (including the case where the intersection point is located on the cross-section circumference), so as to enable the formed square silicon rod to obtain the largest possible cross-section (the surface area of the silicon wafer obtained after subsequent slicing is larger), and the material loss in subsequent grinding operations (such as surface grinding and chamfering, etc.) can be reduced, and the utilization rate of the silicon material can be improved. Please refer to Figure 5 and Figure 6 , where Figure 5 is a cross-sectional schematic diagram showing that the intersection point of the first cutting line when the first cutting unit performs a side cut on the silicon rod in the first direction and the second cutting line when the second cutting unit performs a side cut on the silicon rod in the second direction is located inside the cross-section of the silicon rod. Figure 6Schematic cross-sectional view showing that the intersection point of the first cutting line when the first cutting unit performs side cutting on the silicon rod in the first direction and the second cutting line when the second cutting unit performs side cutting on the silicon rod in the second direction is located on the circumferential of the cross-section of the silicon rod, where Figure 5 and Figure 6 the 101 shown in is the edge skin formed after cutting the silicon rod.

[0132] After performing the first cutting operation (side cutting the silicon rod 100 in the first direction by the first cutting unit 23) and the second cutting operation (side cutting the silicon rod 100 in the second direction by the second cutting unit 25) on the silicon rod 100 through the above cutting device 2, a square silicon rod (i.e., a silicon rod in the shape of a quasi-rectangular body) is formed.

[0133] In this embodiment, as can be seen from the foregoing, edge skins will be formed after the silicon rod is square-cut. In order not to hinder the rising of the wire cutting device, it is necessary to unload the edge skins in a timely manner. For the unloading of the edge skins, the general edge skin unloading method mostly still requires the operator to manually operate to separate the edge skin from the square-cut silicon rod and carry it out of the silicon rod square-cutting equipment, which is not only inefficient, but also increases the risk of damage to the square-cut silicon rod due to the collision between the edge skin and the square-cut silicon rod during the handling process. In view of this, the silicon rod cutting and grinding integrated machine of the present application further includes an edge skin unloading device for unloading the edge skins formed after the wire cutting device performs square cutting on the silicon rod. That is, in this embodiment, the first cutting unit further includes a first edge skin unloading device for unloading the edge skins formed after the first cutting unit performs side cutting on the silicon rod in the first direction; the second cutting unit further includes a second edge skin unloading device for unloading the edge skins formed after the second cutting unit performs side cutting on the silicon rod in the second direction.

[0134] Since the first edge skin unloading device and the second edge skin unloading device have the same structure, only the first edge skin unloading device will be described as an example here.

[0135] Generally, the first edge skin unloading device may include an edge skin lifting mechanism for lifting the edge skin so that the top end of the edge skin protrudes from the cut silicon rod. The edge skin lifting mechanism includes a jacking member provided on the first wire rack in the first cutting unit. The jacking member can be driven by a telescopic member to perform telescopic movement. After the jacking member is controlled to perform an extending movement, it supports the bottom of the edge skin to jack up the edge skin.

[0136] In some embodiments, the lifting member includes a abutting plate and a supporting plate. The abutting plate extends upward from the bottom of the supporting plate. Further, the abutting plate can be an arc-shaped plate adapted to the arc-shaped surface of the edge skin. When the abutting plate abuts against the edge skin, it can be in full contact with the arc-shaped surface of the edge skin. The part of the abutting plate in contact with the edge skin is designed to be smooth or a buffer pad is added to the inner surface of the abutting plate in contact with the edge skin. The supporting plate is used to support the bottom of the edge skin. Further, the supporting plate can be a bow-shaped plate adapted to the bottom surface of the edge skin. In other embodiments, bumps can be added to the chord edge of the bow-shaped plate serving as the supporting plate to increase the contact area with the bottom surface of the edge skin.

[0137] In some embodiments, the telescopic member can be, for example, a cylinder with a telescopic rod. Wherein, the telescopic rod can be connected to the supporting plate in the lifting member through a connecting structure, and the cylinder can drive the telescopic rod to drive the lifting member to perform telescopic motion. Here, the telescopic motion of the lifting member includes the contraction motion and the extension motion of the lifting member. Among them, the contraction motion of the lifting member specifically refers to the cylinder driving the telescopic rod to contract to drive the lifting member away from the edge skin, and the extension motion of the lifting member specifically refers to the cylinder driving the telescopic rod to extend to drive the lifting member close to the edge skin. Of course, the foregoing telescopic member can also adopt other implementation manners. For example, the telescopic member can also be, for example, a servo motor with a lead screw. The lead screw is connected to the lifting member, and the servo motor drives the lead screw to rotate to drive the connected lifting member to perform telescopic motion. For example, driving the lead screw to rotate forward drives the lifting member to perform contraction motion and driving the lead screw to rotate reversely drives the lifting member to perform extension motion, or driving the lead screw to rotate forward drives the lifting member to perform extension motion and driving the lead screw to rotate reversely drives the lifting member to perform contraction motion. Regarding the specific structure and its implementation manner of the first edge skin unloading device, reference can be made to patent disclosure documents such as CN208148230U.

[0138] In practical applications, in the initial state, the telescopic rod drives the lifting member to be in a contracted state. The first cutting unit is driven to descend along with the cutting support so that the first cutting line segment in the first cutting unit performs a side cutting on the silicon rod located at the first processing position in the first direction until the first cutting line segment penetrates through the silicon rod, completing the side cutting of the silicon rod in the first direction and forming a skin. At this time, the skin lifting mechanism has descended to the bottom along with the first wire rack. The cylinder drives the telescopic rod to extend to drive the lifting member close to the skin until the abutting plate in the lifting member contacts and abuts against the skin. Subsequently, the first cutting unit is driven to rise along with the cutting support, and the skin lifting mechanism rises along with the cutting support, driving the skin to have an upward displacement relative to the silicon rod that has been cut once, such that the top end of the skin protrudes from the silicon rod. When the protruding part of the top end of the skin relative to the silicon rod meets the set condition, the rising of the cutting support can be controlled to stop. In this way, the top end of the skin can be used as the force-applying part for grasping, enabling the skin to be grasped and unloaded. Then, the cylinder drives the telescopic rod to contract to drive the lifting member back to the initial state, and at the same time, controls the cutting support to drive the first cutting unit and the skin lifting mechanism to continue rising above the silicon rod to prepare for the next cutting operation.

[0139] In other embodiments, the skin lifting mechanism may include a suction attachment and a telescopic component for driving the suction attachment to perform telescopic movement. The suction attachment is controlled by the telescopic component to abut against and adsorb the skin. The suction attachment may further include an abutting plate and an adsorption element. The abutting plate may be, for example, an arc-shaped plate adapted to the arc-shaped surface of the skin. When the abutting plate abuts against the skin, it can be in full contact with the arc-shaped surface of the skin. The adsorption element may be, for example, a vacuum suction cup. Multiple vacuum suction cups may be arranged on the contact surface of the abutting plate that is to contact the skin. The telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking the cylinder with a telescopic rod as an example, the telescopic rod can be connected to the abutting plate in the lifting member through a connection structure. The cylinder can drive the telescopic rod to contract to drive the abutting plate away from the skin, and the cylinder can drive the telescopic rod to extend to drive the abutting plate close to the skin and, after the abutting plate contacts the skin, the adsorption element adsorbs the skin. Subsequently, the cutting support is driven to rise, and the skin lifting mechanism and the first cutting unit rise along with the cutting support. The skin lifting mechanism can drive the skin to have an upward displacement relative to the silicon rod by using the adsorption force, such that the top end of the skin protrudes from the silicon rod.

[0140] In addition, the skin unloading device may further include a clamping and transporting unit, which is arranged above the machine base and is used for clamping the top end of the skin and lifting the skin to separate it from the silicon rod and transporting the skin to the skin unloading area.

[0141] In some embodiments, the clamping and transferring unit may include a moving mechanism providing movement in at least one direction and a side skin clamping mechanism, and the side skin clamping mechanism is connected to the moving mechanism and is driven to move in at least one direction.

[0142] The side skin clamping mechanism may include a lifting drive structure and a clamping assembly disposed at the bottom of the lifting drive structure.

[0143] Wherein, the lifting drive structure is used to drive the clamping assembly to perform a lifting motion. The lifting drive structure may be, for example, a lifting cylinder with a lifting rod, and the lifting rod is connected to the clamping assembly. The lifting cylinder can be used to control the telescopic movement of the lifting rod to drive the clamping assembly to perform a lifting motion, but it is not limited thereto. For example, the lifting drive structure may also be a lead screw assembly driven by a motor, and the lead screw assembly is connected to the clamping assembly. The motor is used to drive the lead screw assembly to lift to drive the clamping assembly to perform a lifting motion.

[0144] The clamping assembly may include a cover body and a telescopic clamping member. The telescopic clamping member is disposed inside the cover body, and a clamping space for clamping the side skin is formed between the clamping member and the cover body. In an embodiment, the cover body is used to cover the side skin, and the size of the cover body that can be inserted is slightly larger than the cross-sectional circle of the silicon rod to be cut. The cover body is provided as a closed or non-closed circular cover, but it is not limited thereto.

[0145] The structure of the clamping assembly is not limited thereto. In other embodiments, the clamping assembly includes an arc-shaped plate and a telescopic clamping member, and a clamping space for clamping the side skin is formed between the clamping member and the arc-shaped plate.

[0146] In Figure 1 and Figure 2 In the silicon rod cutting and grinding integrated machine shown, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, it is not limited thereto. In other embodiments, the cutting device of the silicon rod cutting and grinding integrated machine of the present application may still have other variations.

[0147] In some embodiments, the cutting device may include a first cutting device disposed at a first processing location of the silicon rod processing platform and a second cutting device disposed at a second processing location of the silicon rod processing platform. Among them, the first cutting device and the second cutting device are two independent devices.

[0148] The first cutting device includes: a first cutting frame, a first cutting support, and a first cutting unit.

[0149] The first cutting frame is disposed on the machine base. The first cutting frame is a columnar structure or a frame structure, and as the support main body of the first cutting device, it can provide support to other components in the first cutting device.

[0150] The first cutting support can be movably raised and lowered on the first cutting frame. In some embodiments, the first cutting support can be movably raised and lowered on the first cutting frame by a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the first cutting support, such as a lifting motor, a lifting guide rail, and a lifting slider, wherein the lifting guide rail is vertically arranged on the first cutting frame, and the lifting slider is arranged on the back of the first cutting support and cooperates with the lifting guide rail. In order to enable the first cutting support to realize a stable lifting and lowering installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are adopted, and the two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the first cutting support can be lifted and lowered relative to the first cutting frame and the machine base by means of the lifting guide rail and the lifting slider.

[0151] The first cutting unit may include at least four first cutting wheels, and the four first cutting wheels may be combined into a pair of first cutting wheel groups, that is, two first cutting wheels arranged opposite to each other along a first direction (i.e., along the X-axis direction) form a first cutting wheel group, and two first cutting wheel groups arranged along a second direction (i.e., along the Y-axis direction) form a pair of first cutting wheel groups. Specifically,

[0152] The first cutting unit includes a pair of first cutting wheel groups, and the pair of first cutting wheel groups may include two first cutting wheel groups, and the two first cutting wheel groups are arranged on the left and right sides of the first wire rack along the second direction (i.e., along the Y-axis direction), wherein one first cutting wheel group is located on the left side of the first wire rack and includes two first cutting wheels arranged along the first direction (i.e., along the X-axis direction), and the other first cutting wheel group is located on the right side of the first wire rack and includes two first cutting wheels arranged along the first direction (i.e., along the X-axis direction). The first cutting line is sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting line network. In actual applications, the first cutting line is sequentially wound around the four first cutting wheels in the first cutting unit to form two first cutting line segments, and the two first cutting line segments are arranged along the first direction (i.e., along the X-axis direction) and are parallel to each other to form a first cutting line network. Specifically, the first cutting line is wound around two first cutting wheels arranged along the first direction (i.e., along the X-axis direction) in one first cutting wheel group to form a first cutting line segment, and the first cutting line is wound around two first cutting wheels arranged along the first direction (i.e., along the X-axis direction) in another first cutting wheel group to form another first cutting line segment. In this way, the two mutually parallel first cutting line segments cooperate to form a first cutting line network in the shape of "=" along the first direction (i.e., along the X-axis direction).

[0153] Of course, in some embodiments, the location, direction, and number of the first cutting wheel and the first cutting line segment in the first cutting unit may also be changed.

[0154] The second cutting device includes: a second cutting frame, a second cutting support, and a second cutting unit.

[0155] The second cutting frame is arranged on the machine base. The second cutting frame is of a columnar structure or a frame structure, and as the supporting main body of the second cutting device, it can provide support for other components in the second cutting device.

[0156] The second cutting support is movably lifted on the second cutting frame. In some embodiments, the second cutting support can be movably lifted on the second cutting frame through a lifting mechanism. The lifting mechanism can include a mechanism that can realize the vertical movement of the second cutting support, such as a lifting motor, a lifting guide rail, and a lifting slider. Among them, the lifting guide rail is vertically arranged on the second cutting frame, and the lifting slider is arranged on the back of the second cutting support and is matched with the lifting guide rail. To enable the second cutting support to be stably lifted on the machine base, a double-guide rail design can be adopted, that is, two lifting guide rails are used, and these two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the second cutting support can be lifted relative to the second cutting frame and the machine base by means of the lifting guide rail and the lifting slider.

[0157] The second cutting unit may include at least four second cutting wheels, and the four second cutting wheels may be combined into a pair of second cutting wheel groups, that is, two second cutting wheels arranged opposite to each other along the second direction (i.e., along the Y-axis direction) form a second cutting wheel group, and two second cutting wheel groups arranged along the first direction (i.e., along the X-axis direction) form a pair of second cutting wheel groups. Specifically, the second cutting unit includes a pair of second cutting wheel groups, and the pair of second cutting wheel groups may include two second cutting wheel groups, and the two second cutting wheel groups are arranged on the left and right sides of the second wire rack along the first direction (i.e., along the X-axis direction), wherein one second cutting wheel group is located on the left side of the second wire rack and includes two second cutting wheels arranged along the second direction (i.e., along the Y-axis direction), and the other second cutting wheel group is located on the right side of the second wire rack and includes two second cutting wheels arranged along the second direction (i.e., along the Y-axis direction). The second cutting line is sequentially wound around each second cutting wheel in the second cutting unit to form a second cutting line network. In actual applications, the second cutting line is sequentially wound around the four second cutting wheels in the second cutting unit to form two second cutting line segments, and the two second cutting line segments are arranged along the second direction (i.e., along the Y-axis direction) and are parallel to each other, forming a second cutting line network. Specifically, the second cutting line is wound around two second cutting wheels arranged along the second direction (i.e., along the Y-axis direction) in one second cutting wheel group to form one second cutting line segment, and the second cutting line is wound around two second cutting wheels arranged along the second direction (i.e., along the Y-axis direction) in another second cutting wheel group to form another second cutting line segment. In this way, the two second cutting line segments parallel to each other cooperate to form a second cutting line network in the shape of "=" along the second direction (i.e., along the Y-axis direction).

[0158] Of course, in some embodiments, the location, direction, and quantity of the second cutting wheel and the second cutting line segment in the second cutting unit may also be changed.

[0159] The grinding device 3 is arranged on the machine base 1, and is used to grind the square silicon rods which have been squared and cut on the third processing area of ​​the silicon rod processing platform. In this embodiment, the grinding operation includes grinding and chamfering.

[0160] The grinding device 3 has a receiving space for receiving the silicon rods that have been converted from the second processing position to the third processing position by the silicon rod conversion device 4 and have completed the square cutting. The grinding device 3 mainly includes a grinding frame 31 and at least one pair of grinding tools 33. The at least one pair of grinding tools 33 are arranged on the grinding frame 31 in opposite directions and are used to grind the silicon rods that have completed the square cutting and are located in the third processing position.

[0161] In this embodiment, the cross-section of the silicon rod after square cutting is square (the whole silicon rod is in the shape of a quasi-rectangular body), having four vertical cutting surfaces and four connecting edge surfaces. Therefore, at least a pair of grinding tools 33 are arranged oppositely, and there is an accommodation space for accommodating the silicon rod 200 between them. After the silicon rod 200 is transferred to the third processing position and located in the accommodation space between the at least a pair of grinding tools 33, the at least a pair of grinding tools 33 can contact a pair of opposite vertical cutting surfaces or a pair of connecting edge surfaces of the silicon rod 200, and then move up and down for grinding.

[0162] Among them, the grinding frame 31 can be slidably arranged on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can achieve sliding in at least one direction. For example, the sliding mechanism can achieve the sliding of the grinding frame 31 along the first direction (i.e., along the X-axis direction). Specifically, the sliding mechanism can include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction driving source. The first-direction driving source can be, for example, a driving motor.

[0163] The grinding tool 33 can be slidably arranged on the grinding frame 31 through a sliding mechanism.

[0164] In some embodiments, at least a pair of grinding tools 33 in the grinding device 3 are independently arranged. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are respectively slidably arranged on the grinding frame 31 through their respective sliding mechanisms. Among them, the sliding mechanism can achieve sliding in at least two directions. Specifically, the sliding mechanism can include a first sliding unit and a second sliding unit. Among them, the first sliding unit is the lifting and sliding unit, including a lifting guide rail arranged on the grinding frame 31, a lifting slider or slide bar arranged on a movable mounting frame, and a lifting driving source. The lifting driving source can be, for example, a driving motor. The second sliding unit includes a second-direction guide rail arranged on the movable mounting frame (the second direction is the Y-axis direction as shown), a second-direction slider or slide bar arranged on the grinding tool 33, and a second-direction driving source. The second-direction driving source can be, for example, a driving motor. Figure 2 shown), a second-direction slider or slide bar arranged on the grinding tool 33, and a second-direction driving source. The second-direction driving source can be, for example, a driving motor.

[0165] In some embodiments, at least a pair of grinding tools 33 in the grinding device 3 are jointly arranged. Taking a pair of grinding tools 33 as an example, these two grinding tools 33 are slidably arranged on the grinding machine frame 31 through a sliding mechanism, wherein the sliding mechanism can realize sliding in at least two directions. Specifically, the sliding mechanism may include a first sliding unit and a second sliding unit. Among them, the first sliding unit is the lifting sliding unit, including a lifting guide rail arranged on the grinding machine frame 31, a lifting slider or slide bar arranged on a common movable mounting bracket, and a lifting driving source. The lifting driving source may be, for example, a driving motor. These two grinding tools 33 are slidably arranged on the common movable mounting bracket through the second sliding unit, and the second sliding unit includes a second-direction guide rail arranged on the common movable mounting bracket (the second direction is the Y-axis direction as shown in Figure 2 ), a second-direction slider or slide bar arranged on the grinding tool 33, and a second-direction driving source. The second-direction driving source may be, for example, a driving motor.

[0166] In this embodiment, the grinding machine frame 31 can be slidably arranged on the machine base 1 through a sliding mechanism to realize the advancement and retreat of the grinding machine frame 31, that is, approaching or departing from the silicon rod. The grinding tool 33 can be slidably arranged on the grinding machine frame 31 through the first sliding unit to realize the lifting of the grinding tool 33. The grinding tool 33 can also be slidably arranged on the grinding machine frame 31 through the second sliding unit to realize the advancement and retreat of the grinding tool 33, that is, approaching or departing from the silicon rod, so as to control the grinding amount of the silicon rod.

[0167] In some embodiments, the grinding tool may include a main shaft and at least one grinding wheel, wherein at least one grinding wheel is arranged at the working end of the main shaft.

[0168] Specifically, as shown in Figure 2As shown in the figure, in this embodiment, each grinding tool 33 in the grinding device 3 has a double-headed structure. Specifically, each grinding tool includes: a rotary chassis; a double-headed main shaft 332 disposed on the rotary chassis, a rough grinding wheel 331 is provided at the first end of the double-headed main shaft 332, and a fine grinding wheel 333 is provided at the second end of the double-headed main shaft 332; a driving motor for driving the rotary chassis to rotate so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-headed main shaft 332 exchange positions. In practical applications, during grinding, first, the rough grinding wheel 331 of the double-headed main shaft 332 in at least one pair of grinding tools 33 in the grinding device 3 is used to perform rough grinding on the silicon rod 200 that has completed square cutting. After that, the rotary chassis is driven to rotate so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-headed main shaft 332 exchange positions, and the fine grinding wheel 333 of the double-headed main shaft 332 in at least one pair of grinding tools 33 in the grinding device 3 is used to perform fine grinding on the silicon rod 200 that has completed square cutting. Among them, the rough grinding operation may include rough grinding the vertical cut surface of the silicon rod 200 that has completed square cutting and rough chamfering the connecting edge surface, and the fine grinding operation may include fine grinding the vertical cut surface of the silicon rod 200 that has completed square cutting and fine chamfering the connecting edge surface.

[0169] Taking the rough grinding of the vertical cut surface of the silicon rod 200 that has completed square cutting as an example: First, use the silicon rod conversion device 4 to transfer the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 performs positioning adjustment on the silicon rod 200, so that the grinding machine frame 31 moves relative to the silicon rod 200 along the first direction (i.e., along the X-axis direction) with respect to the machine base 1, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33, that is, the first pair of vertical cut surfaces in the silicon rod 200 correspond to a pair of grinding tools 33 in the grinding device 3; make the grinding tool 33 feed relative to the grinding machine frame 31 along the second direction (i.e., along the Y-axis direction) according to the feed amount, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to perform rough grinding on the first pair of vertical cut surfaces in the silicon rod 200; drive the silicon rod 200 to rotate forward (or reverse) 90° by the rotary carrier 431 in the silicon rod positioning mechanism 43, so that the second pair of vertical cut surfaces in the silicon rod 200 correspond to a pair of grinding tools 33 in the grinding device 3, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to perform rough grinding on the second pair of vertical cut surfaces in the silicon rod 200.

[0170] Among them, the rough grinding operation of any pair of vertical cutting surfaces may include, for example: providing a feed rate, driving the rough grinding wheels 331 in a pair of grinding tools 33 to move downward from top to bottom to grind a pair of vertical cutting surfaces of the silicon rod; after the pair of rough grinding wheels 331 grind to the bottom of the silicon rod and pass through the silicon rod and stay at the lower limit position, increasing the feed rate by one more step, driving the pair of rough grinding wheels 331 to move upward from bottom to top to grind the silicon rod; after the pair of rough grinding wheels 331 grind to the top of the silicon rod and pass through the silicon rod and stay at the upper limit position, continuously increasing the feed rate by one more step, driving the pair of rough grinding wheels 331 to move downward from top to bottom to grind the silicon rod; in this way, grinding, increasing the feed rate, reverse grinding, increasing the feed rate, after repeating several times, the pair of vertical cutting surfaces of the silicon rod can be ground to a preset size.

[0171] Taking the rough chamfering of the vertical section of the silicon rod 200 that has completed square cutting as an example: Initially, when the silicon rod transfer device 4 transfers the silicon rod 200 to the first processing position, the vertical section of the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3. Therefore, the positioning and adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 can, for example, include driving the silicon rod 200 to rotate forward (or backward) by 45°, so that the first pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding machine frame 31 move relative to the base 1 along the first direction (i.e., along the X-axis direction) towards the silicon rod 200, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33, that is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first rough cut on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second rough cut on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, so that the second pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first rough cut on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second rough cut on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third rough cut on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third rough cut on the first pair of connecting edges in the silicon rod 200.

[0172] It should be particularly noted that in the rough chamfering operation of the foregoing connecting edges, driving the first silicon rod 101 to rotate by a corresponding angle by the first silicon rod positioning mechanism 53, for example: driving the first silicon rod 101 to rotate forward by 5° by the first silicon rod positioning mechanism 53 is not the only implementation method. In other alternative embodiments, the angle can be adjusted adaptively, for example, it can be from 3° to 7°, including 3°, 4°, 5°, 6°, 7° or other angles. Correspondingly, in the case of driving the first silicon rod 101 to rotate forward by 80° by the first silicon rod positioning mechanism 53, the angle is adjusted adaptively.

[0173] Taking the fine grinding of the vertical section of the silicon rod 200 that has completed square cutting as an example: First, use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 positions and adjusts the silicon rod 200, making the grinding machine frame 31 move relative to the base 1 along the first direction (i.e., along the X-axis direction) towards the silicon rod 200, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33. That is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; make the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotate the fine grinding wheel 333 in the grinding tool 33 and drive the grinding tool 33 to move up and down to finely grind the first pair of vertical sections in the silicon rod 200; drive the silicon rod 200 to rotate forward (or reversely) by 90° by the rotating carrier table 431 in the silicon rod positioning mechanism 43, so that the second pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3, rotate the fine grinding wheel 333 in the grinding tool 33 and drive the grinding tool 33 to move up and down to finely grind the second pair of vertical sections in the silicon rod 200.

[0174] Among them, the fine grinding operation of any pair of vertical sections may, for example, include: providing a feed amount, driving the fine grinding wheels 333 in a pair of grinding tools 33 to move downward from top to grind a pair of vertical sections of the silicon rod; after the pair of fine grinding wheels 333 grind to the bottom of the silicon rod and pass through the silicon rod and stay at the lower limit position, increase the feed amount by one, and drive the pair of fine grinding wheels 333 to move upward from bottom to grind the silicon rod; after the pair of fine grinding wheels 333 grind to the top of the silicon rod and pass through the silicon rod and stay at the upper limit position, continue to increase the feed amount by one, and drive the pair of fine grinding wheels 333 to move downward from top to grind the silicon rod; thus, grind, increase the feed amount, grind in the reverse direction, increase the feed amount, and after repeating several times, a pair of vertical sections of the silicon rod can be ground to a preset size.

[0175] Taking the example of precisely chamfering the vertical section of the silicon rod 200 that has completed square cutting: Initially, when the silicon rod conversion device 4 transfers the silicon rod 200 to the first processing position, the vertical section of the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3. Therefore, the positioning adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 can, for example, include driving the silicon rod 200 to rotate forward (or backward) by 45°, so that the first pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding machine frame 31 move relative to the base 1 along the first direction (i.e., along the X-axis direction) towards the silicon rod 200, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33, that is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotating the fine grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first fine cutting on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the fine grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second fine cutting on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, so that the second pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3, rotating the fine grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first fine cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the fine grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second fine cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the fine grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third fine cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, rotating the fine grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third fine cutting on the first pair of connecting edges in the silicon rod 200.

[0176] It should be noted that the above is only an exemplary illustration and is not used to limit the protection scope of this application. For example, in the description of the grinding operation for the grinding device, the surface grinding operation of the silicon rod is performed first and then the chamfering operation of the polysilicon rod is performed, but this is not limited thereto. In other embodiments, it is also feasible to perform the chamfering operation of the silicon rod first and then the surface grinding operation of the silicon rod, and it should still fall within the protection scope of this application.

[0177] Subsequently, after the silicon rod 200 undergoes grinding operation by the grinding device 3, the silicon rod conversion device 4 converts the silicon rod 200 from the third processing location to the waiting location, and then the silicon rod loading and unloading device unloads the processed silicon rod from the waiting location of the silicon rod processing platform. Of course, before unloading the silicon rod 200, if necessary, at the waiting location, the detection device can detect the silicon rod 200 after the processing operation. For example, a flatness detector can be used to detect the planar flatness of the silicon rod. By using the flatness detector, on the one hand, it can be used to check whether the silicon rod meets the product requirements after each processing operation by detecting the planar flatness of the silicon rod 200, so as to determine the effect of each processing operation; on the other hand, by detecting the planar flatness of the silicon rod 200, the wear condition of the processing components in each processing device can also be indirectly obtained, which is conducive to real-time calibration or correction, and even maintenance or replacement.

[0178] Furthermore, in the cutting and grinding integrated machine of the present application, in an alternative embodiment, a silicon rod cleaning device may further be included. The silicon rod cleaning device may be disposed on the machine base and is used for cleaning the silicon rod. For the silicon rod cleaning device, generally, after the silicon rod undergoes the above processing operations, cutting debris generated during the operation process will adhere to the surface of the silicon rod. Therefore, when necessary, the silicon rod needs to be cleaned as required. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning liquid spraying device cooperating with the cleaning brush head. During cleaning, the cleaning liquid spraying device sprays cleaning liquid onto the silicon rod, and at the same time, the cleaning brush head is driven by a motor to act on the silicon rod to complete the cleaning operation. In practical applications, the cleaning liquid may be, for example, pure water, and the cleaning brush head may be, for example, a rotary brush head.

[0179] In addition, for the cutting and grinding integrated machine of the present application, it should be particularly noted that if the corresponding processing device of the cutting and grinding integrated machine is increased or decreased, then the functional locations on the silicon rod processing platform and the number and positional relationship of the silicon rod positioning mechanisms on the conveying body need to be adjusted accordingly.

[0180] In some embodiments, it is assumed that the multi-station processing machine for silicon rods eliminates the waiting area, and the silicon rod conversion device correspondingly reduces one silicon rod positioning mechanism. Further, preferably, the angles set between any two of the three silicon rod positioning mechanisms are also consistent with the angular distribution between any two of the three functional areas. In this way, when a certain silicon rod positioning mechanism corresponds to a certain functional area, the other two silicon rod positioning mechanisms also correspond to the other two functional areas respectively. Thus, in the flow operation, at any moment, when each silicon rod positioning mechanism has a silicon rod positioned thereon and the silicon rod positioning mechanism corresponds to the functional area, these silicon rods are located at the corresponding functional area to perform the corresponding processing operations. In an alternative embodiment, the three functional areas on the silicon rod processing platform are distributed at 120° to each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the disc-shaped or ring-shaped conveying body are also distributed at 120° to each other.

[0181] In addition, for the cutting and grinding integrated machine of the present application, it should be particularly noted that if a corresponding processing device is added to the cutting and grinding integrated machine, then the number and positional relationship of the functional areas on the silicon rod processing platform and the silicon rod positioning mechanisms on the conveying body need to be adjusted accordingly. It is assumed that a processing device is added to the multi-station processing machine for silicon rods, a corresponding functional area will be added to the silicon rod processing platform and a silicon rod positioning mechanism will be correspondingly added to the silicon rod conversion device. Further, preferably, the angles set between any two of the five silicon rod positioning mechanisms are also consistent with the angular distribution between any two of the five functional areas. In this way, when a certain silicon rod positioning mechanism corresponds to a certain functional area, the other four silicon rod positioning mechanisms also correspond to the other four functional areas respectively. Thus, in the flow operation, at any moment, when each silicon rod positioning mechanism has a silicon rod positioned thereon and the silicon rod positioning mechanism corresponds to the functional area, these silicon rods are located at the corresponding functional area to perform the corresponding processing operations. In an alternative embodiment, the five functional areas on the silicon rod processing platform are distributed at 72° to each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the disc-shaped or ring-shaped conveying body are also distributed at 72° to each other.

[0182] The silicon rod cutting and grinding integrated machine disclosed in the present application integrates a cutting device and a grinding device, can use the silicon rod conversion device to transfer the silicon rod orderly and seamlessly between various processing devices, and use the cutting device to perform two side cuts on the silicon rod to form a square silicon rod and use the grinding device to grind the square silicon rod after the square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, and improve the production efficiency and the quality of product processing operations.

[0183] The present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine.

[0184] In some embodiments, such as Figure 2 shown, the integrated silicon rod cutting and grinding machine includes a machine base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting area, a first processing area, a second processing area, and a third processing area. The integrated silicon rod cutting and grinding machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are adjacent to each other and are distributed at 90°. In this embodiment, it is assumed that the direction of the order of the waiting area, the first processing area, the second processing area, and the third processing area is defined as the positive direction.

[0185] The silicon rod cutting and grinding method of the present application may at least include the following steps:

[0186] Step S101, loading a first silicon rod on the waiting area and performing preprocessing on the first silicon rod. In this embodiment, in step S101, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the waiting area of the silicon rod processing platform.

[0187] Specifically, reference can be made to Figure 7 and Figure 8 , and the silicon rod transfer device 6 can be used to transfer the first silicon rod 100 to be processed to the waiting area of the silicon rod platform. The specific method of using the silicon rod transfer device 6 to transfer the first silicon rod 100 to be processed to the waiting area of the silicon rod platform can be seen in the previous description and will not be elaborated here.

[0188] In addition, the preprocessing may include using a positioning and detection device to perform ridge line detection and center positioning on the first silicon rod located on the waiting area.

[0189] Step S103, making the silicon rod conversion device rotate a first preset angle to convert the first silicon rod from the waiting area to the first processing area, and making the cutting device perform a first-direction side cutting on the first silicon rod in the first processing area. At this stage, a second silicon rod is loaded on the waiting area and preprocessing is performed on the second silicon rod.

[0190] In step S103, since the angle between the waiting area and the first processing area is 90°, therefore, the first preset angle for making the silicon rod conversion device rotate is to make the silicon rod conversion device rotate 90° in the positive direction.

[0191] Specifically, reference can be made to Figure 8 and Figure 9 , making the silicon rod conversion device 4 rotate 90° in the positive direction (i.e., Figure 8 the clockwise arrow in Figure 8 ), and converting the first silicon rod 100 to be processed from the Figure 9 waiting area in

[0192] Thus, the cutting device 2 in the embodiment shown in Figure 9 can be used to cut the first silicon rod 100 at the first processing location.

[0193] When using Figure 9 the cutting device 2 in the embodiment shown in Figure 1 to cut the first silicon rod 100 at the first processing location, in combination with

[0194] the driving cutting support 22 descends relative to the cutting frame 21, and the first cutting unit 23 on one side of the cutting support 22 performs a side cut on the first silicon rod 100 at the first processing location in the X-axis direction (the first cutting unit is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction).

[0195] As for loading the second silicon rod 102 at the waiting location and preprocessing the second silicon rod 102, reference can be made to the description of the first silicon rod 100 in step S101, which will not be elaborated here.

[0195] Step S105: Rotate the silicon rod conversion device by a first preset angle to convert the first silicon rod from the first processing location to the second processing location and convert the second silicon rod from the waiting location to the first processing location. Then, make the cutting device perform a side cut on the first silicon rod at the second processing location in a second direction and perform a side cut on the second silicon rod at the first processing location in a first direction. At this stage, load the third silicon rod at the waiting location and preprocess the third silicon rod.

[0196] In step S105, since the waiting location, the first processing location, and the second processing location of the silicon rod processing platform are sequentially 90° apart, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 90°.

[0197] Specifically, refer to Figure 9 and Figure 10 to make the silicon rod conversion device 4 rotate forward (i.e., the clockwise arrow in Figure 9 ) by 90°, converting the first silicon rod 100 from the first processing location to the second processing location and converting the second silicon rod 102 from the waiting location to the first processing location.

[0198] Thus, the cutting device 2 in the embodiment shown in Figure 10 can be used to cut the first silicon rod 100 at the second processing location and the second silicon rod 102 at the first processing location of the silicon rod processing platform.

[0199] When using Figure 10 the cutting device 2 in the embodiment shown in Figure 1, drive the cutting support 22 to descend relative to the cutting frame 21, and simultaneously cut the second silicon rod 102 in the first processing area and the first silicon rod 100 in the second processing area by the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22. Among them, the first cutting unit 23 performs a side cut along the X-axis direction on the second silicon rod 102 in the first processing area (the first cutting unit 23 is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction), and the second cutting unit 25 performs a side cut along the Y-axis direction on the first silicon rod 100 in the second processing area (the second cutting unit 25 is provided with a second cutting wire mesh in the shape of "=" along the Y-axis direction). It should be noted that before using the second cutting unit 25 to perform a side cut along the Y-axis direction on the first silicon rod 100 in the second processing area, due to the aforementioned side cut problem, it is also necessary to drive the first silicon rod 100 to rotate forward or backward by 90° by the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 to adjust the cutting surface. In this way, after the first silicon rod 100 located in the second processing area is subjected to a side cut along the Y-axis direction by the second cutting unit 25, a silicon rod with an overall square shape is formed.

[0200] As for loading the third silicon rod 104 onto the waiting area and preprocessing the third silicon rod 104, reference can be made to the description of the first silicon rod 100 in step S101, which will not be elaborated here.

[0201] Step S107, make the silicon rod conversion device rotate by a first preset angle to convert the first silicon rod from the second processing area to the third processing area, convert the second silicon rod from the first processing area to the second processing area, and convert the third silicon rod from the waiting area to the first processing area. Make the grinding device perform surface grinding and chamfering on the first silicon rod in the third processing area. At this stage, make the cutting device perform a side cut in the second direction on the second silicon rod in the second processing area and a side cut in the first direction on the third silicon rod in the first processing area. At the same time, load the fourth silicon rod onto the waiting area and preprocess the fourth silicon rod.

[0202] In step S107, since the waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform differ by 90° in sequence, the first preset angle for making the silicon rod conversion device rotate is to make the silicon rod conversion device rotate forward by 90°.

[0203] Specifically, refer to Figure 10 and Figure 11 , make the silicon rod conversion device 4 rotate forward (i.e., the clockwise arrow in Figure 10 ) by 90°, convert the first silicon rod 100 from the second processing area to the third processing area, convert the second silicon rod 102 from the first processing area to the second processing area, and convert the third silicon rod 104 from the waiting area to the first processing area.

[0204] Thus, the grinding device 3 in the illustrated embodiment can be used to Figure 11 perform a grinding operation on the first silicon rod 100 at the third processing location of the silicon rod processing platform. For the specific method of using the grinding device 3 to perform a grinding operation on the first silicon rod 100 at the third processing location of the silicon rod processing platform, reference can be made to the description above, and details will not be repeated here.

[0205] Meanwhile, the cutting device 2 in the illustrated embodiment can be used to Figure 11 cut the third silicon rod 104 at the first processing location and the second silicon rod 102 at the second processing location of the silicon rod processing platform.

[0206] When using the Figure 11 cutting device 2 in the illustrated embodiment to cut the third silicon rod 104 at the first processing location and the second silicon rod 102 at the second processing location of the silicon rod processing platform, in combination with Figure 1 , the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the corresponding third silicon rod 104 at the first processing location and the second silicon rod 102 at the second processing location. Among them, the first cutting unit 23 performs a side cutting along the X-axis direction on the third silicon rod 104 at the first processing location (the first cutting unit 23 is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction), and the second cutting unit 25 performs a side cutting along the Y-axis direction on the second silicon rod 102 at the second processing location (the second cutting unit 25 is provided with a second cutting wire mesh in the shape of "=" along the Y-axis direction). It should be noted that, before using the second cutting unit 25 to perform a side cutting along the Y-axis direction on the second silicon rod 102 at the second processing location, due to the aforementioned side cutting problem, it is also necessary to use the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 to drive the second silicon rod 102 to rotate forward or backward by 90° to adjust the cutting surface. Thus, after the second silicon rod 102 at the second processing location is subjected to a side cutting along the Y-axis direction by the second cutting unit 25, a silicon rod with an overall square shape is formed.

[0207] As for loading the fourth silicon rod 106 onto the waiting location and preprocessing the fourth silicon rod 106, reference can be made to the description of the first silicon rod 100 in step S101, and details will not be repeated here.

[0208] Step S109: Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the waiting position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, transfer the fourth silicon rod from the waiting position to the first processing position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and perform pre-treatment on the fifth silicon rod. At this stage, make the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position, and make the cutting device perform side cutting in the second direction on the third silicon rod at the second processing position and side cutting in the first direction on the fourth silicon rod at the first processing position.

[0209] In step S109, since the waiting position, the first processing position, the second processing position, and the third processing position of the silicon rod processing platform are sequentially different by 90°, therefore, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 90° or reverse by 270°. Among them, rotating the silicon rod conversion device reverse by 270° can make the silicon rod conversion device return to the initial position and release the cable wound during the forward rotation process.

[0210] For details, please refer to Figure 11 and Figure 12 , rotate the silicon rod conversion device 4 in the reverse direction (i.e., the counterclockwise arrow in Figure 10 ) by 270°, transfer the first silicon rod 100 from the third processing position to the waiting position, transfer the second silicon rod 102 from the second processing position to the third processing position, transfer the third silicon rod 104 from the first processing position to the second processing position, and transfer the fourth silicon rod 106 from the waiting position to the first processing position.

[0211] In this way, the processed first silicon rod 100 at the waiting position can be transferred out of the silicon rod processing platform by the silicon rod transfer device 6, and the fifth silicon rod 108 to be processed can be transferred to the waiting position of the silicon rod processing platform (as shown in Figure 13 ).

[0212] Meanwhile, the grinding device 3 in the embodiment shown in Figure 12 can be used to perform grinding operations on the second silicon rod 102 at the third processing position of the silicon rod processing platform. For the specific method of using the grinding device 3 to perform grinding operations on the second silicon rod 102 at the third processing position of the silicon rod processing platform, reference can be made to the previous description and will not be elaborated here.

[0213] Meanwhile, the cutting device 2 in the embodiment shown in Figure 12 can be used to cut the fourth silicon rod 106 at the first processing position and the third silicon rod 104 at the second processing position of the silicon rod processing platform.

[0214] When usingFigure 12 When the cutting device 2 in the illustrated embodiment cuts the fourth silicon rod 106 on the first processing location of the silicon rod processing platform and the third silicon rod 104 on the second processing location, in combination with Figure 1 , the driving cutting support 22 descends relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the corresponding fourth silicon rod 106 on the first processing location and the third silicon rod 104 on the second processing location. Among them, the first cutting unit 23 performs a side cut in the X-axis direction on the fourth silicon rod 106 on the first processing location (the first cutting unit 23 is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction), and the second cutting unit 25 performs a side cut in the Y-axis direction on the third silicon rod 104 on the second processing location (the second cutting unit 25 is provided with a second cutting wire mesh in the shape of "=" along the Y-axis direction). It should be noted that, before using the second cutting unit 25 to perform a side cut in the Y-axis direction on the third silicon rod 104 on the second processing location, due to the aforementioned side cut problem, it is also necessary to use the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 to drive the third silicon rod 104 to rotate forward or reversely by 90° to adjust the cutting surface. In this way, after the third silicon rod 104 located on the second processing location is subjected to a side cut in the Y-axis direction by the second cutting unit 25, a silicon rod with an overall square shape is formed.

[0215] In some embodiments, the silicon rod cutting and grinding integrated machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a first processing location, a second processing location, and a third processing location. The silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 120° to each other in pairs. In this embodiment, it is assumed that the direction of the order of the first processing location, the second processing location, and the third processing location is defined as the positive direction.

[0216] The silicon rod cutting and grinding method of the present application may at least include the following steps:

[0217] Step S201, load the first silicon rod on the first processing location, and make the cutting device perform a side cut in the first direction on the first silicon rod on the first processing location.

[0218] In this embodiment, in step S201, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the first processing location of the silicon rod processing platform.

[0219] When using the cutting device to cut the first silicon rod on the first processing area, drive the cutting support to descend relative to the cutting frame, and use the first cutting units on the left and right sides of the cutting support to perform side cutting along the X-axis direction on the first silicon rod on the first processing area (the first cutting unit is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction).

[0220] Step S203: Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing area to the second processing area and transfer the second silicon rod to the first processing area, and make the cutting device perform second-direction side cutting on the first silicon rod on the second processing area and first-direction side cutting on the second silicon rod on the first processing area.

[0221] In step S203, since the angle between the waiting area and the first processing area is 120°, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 120°.

[0222] When using the cutting device to cut the second silicon rod on the first processing area and the second silicon rod on the first processing area of the silicon rod processing platform, drive the cutting support to descend relative to the cutting frame, and use the first cutting unit and the second cutting unit on the left and right sides of the cutting support to simultaneously cut the second silicon rod on the corresponding first processing area and the first silicon rod on the second processing area. Among them, the first cutting unit performs side cutting along the X-axis direction on the second silicon rod on the first processing area (the first cutting unit is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction), and the second cutting unit performs side cutting along the Y-axis direction on the first silicon rod on the second processing area (the second cutting unit 25 is provided with a second cutting wire mesh in the shape of "=" along the Y-axis direction). It should be noted that before using the second cutting unit to perform side cutting along the Y-axis direction on the first silicon rod on the second processing area, due to the above-mentioned side cutting problem, it is also necessary to drive the first silicon rod to rotate forward or backward by 90° using the silicon rod positioning mechanism in the silicon rod conversion device to adjust the cutting surface.

[0223] Step S205: Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing area to the third processing area, transfer the second silicon rod from the first processing area to the second processing area, and transfer the third silicon rod to the first processing area, and make the grinding device perform surface grinding and chamfering on the first silicon rod on the third processing area. At this stage, make the cutting device perform second-direction side cutting on the second silicon rod on the second processing area and first-direction side cutting on the third silicon rod on the first processing area.

[0224] In step S205, since the first processing location, the second processing location, and the third processing location of the silicon rod processing platform differ by 90° in sequence, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 90°.

[0225] The first silicon rod on the third processing location of the silicon rod processing platform can be ground by using a grinding device.

[0226] When using a cutting device to cut the third silicon rod on the first processing location and the second silicon rod on the second processing location of the silicon rod processing platform, drive the cutting support to descend relative to the cutting frame, and the first cutting unit and the second cutting unit on both sides of the cutting support simultaneously cut the corresponding third silicon rod on the first processing location and the second silicon rod on the second processing location. Among them, the first cutting unit performs a side cut along the X-axis direction on the third silicon rod on the first processing location (the first cutting unit is provided with a first cutting wire mesh in the shape of "=" along the X-axis direction), and the second cutting unit performs a side cut along the Y-axis direction on the second silicon rod on the second processing location (the second cutting unit is provided with a second cutting wire mesh in the shape of "=" along the Y-axis direction). It should be noted that before using the second cutting unit to perform a side cut along the Y-axis direction on the second silicon rod on the second processing location, due to the aforementioned side cut problem, it is also necessary to drive the second silicon rod to rotate forward or backward by 90° by using the silicon rod positioning mechanism in the silicon rod conversion device to adjust the cutting surface.

[0227] Step S207: Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing location to the first processing location, transfer the second silicon rod from the second processing location to the third processing location, transfer the third silicon rod from the first processing location to the second processing location, unload the first silicon rod from the first processing location and load the fourth silicon rod, and let the cutting device perform a side cut in the first direction on the fourth silicon rod on the first processing location. At this stage, let the grinding device perform surface grinding and chamfering on the second silicon rod on the third processing location, and let the cutting device perform a side cut in the second direction on the third silicon rod on the second processing location.

[0228] In step S207, since the first processing location, the second processing location, and the third processing location of the silicon rod processing platform differ by 120° in sequence, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 120° or backward by 240°. Among them, rotating the silicon rod conversion device backward by 240° can make the silicon rod conversion device return to the initial position and release the cable wound during the forward rotation process.

[0229] In step S207, the processed first silicon rod on the first processing position can be transferred out of the silicon rod processing platform by using a silicon rod transfer device, and the fourth silicon rod to be processed can be transferred to the waiting position of the silicon rod processing platform.

[0230] The grinding device can be used to grind the second silicon rod on the third processing position of the silicon rod processing platform.

[0231] When using the cutting device to cut the fourth silicon rod on the first processing position and the third silicon rod on the second processing position of the silicon rod processing platform, the cutting support is driven to descend relative to the cutting frame, and the first cutting unit and the second cutting unit on the left and right sides of the cutting support simultaneously cut the corresponding fourth silicon rod on the first processing position and the third silicon rod on the second processing position. Among them, the first cutting unit performs a side cut in the X-axis direction on the fourth silicon rod on the first processing position (the first cutting unit is provided with a first cutting wire mesh in the shape of "=" in the X-axis direction), and the second cutting unit performs a side cut in the Y-axis direction on the third silicon rod on the second processing position (the second cutting unit 25 is provided with a second cutting wire mesh in the shape of "=" in the Y-axis direction). It should be noted that before using the second cutting unit to perform a side cut in the Y-axis direction on the third silicon rod on the second processing position, due to the aforementioned side cut problem, the silicon rod positioning mechanism 43 in the silicon rod conversion device is also required to drive the third silicon rod to rotate forward or backward by 90° to adjust the cutting surface.

[0232] The silicon rod cutting and grinding method disclosed in this application can transfer the silicon rod orderly and seamlessly between various processing devices, and at the same time can perform two side cuts on the silicon rod to form a square silicon rod and grind the square silicon rod after the square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improving the production efficiency and the quality of product processing operations.

[0233] The above embodiments only illustrate the principles and effects of this application by way of example, and are not used to limit this application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application should still be covered by the claims of this application.

Claims

1. A silicon rod cutting and grinding integrated machine, characterized in that, Comprising: A machine base having a silicon rod processing platform; A cutting device disposed on the machine base for performing a first-direction side cutting on a silicon rod at a first processing location of the silicon rod processing platform and performing a second-direction side cutting on a silicon rod at a second processing location of the silicon rod processing platform to form a square silicon rod; wherein the second direction is perpendicular or parallel to the first direction; wherein the cutting device includes: a cutting frame; a cutting support that moves up and down on the cutting frame; the cutting support includes a support main body and a first support flank and a second support flank located on opposite sides of the support main body; a first cutting unit disposed on a first side of the cutting support; the first cutting unit includes a first wire frame disposed on the first support flank of the cutting support, a plurality of first cutting wheels disposed on the first wire frame, and a first cutting wire that is sequentially wound around the plurality of first cutting wheels to form a first cutting segment arranged in the first direction; a second cutting unit disposed on a second side of the cutting support; the second cutting unit includes a second wire frame disposed on the second support flank of the cutting support, a plurality of second cutting wheels disposed on the second wire frame, and a second cutting wire that is sequentially wound around the plurality of second cutting wheels to form a second cutting segment arranged in the second direction; A grinding device disposed on the machine base for grinding the surface and chamfering the square silicon rod at a third processing location of the silicon rod processing platform; wherein the grinding device includes: a surface grinding support disposed on the machine base; at least a pair of grinding tools oppositely arranged on the surface grinding support; the at least a pair of grinding tools move up and down relative to the surface grinding support for grinding the surface and chamfering the square silicon rod; A silicon rod conversion device disposed on the silicon rod processing platform for converting the silicon rod among the first processing location, the second processing location, and the third processing location.

2. The silicon rod cutting and grinding integrated machine according to claim 1, wherein The first cutting wire and the second cutting wire are the same cutting wire, and a guide wheel for winding the cutting wire is further disposed on the cutting support between the first cutting unit and the second cutting unit.

3. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The first cutting unit further includes a first side skin discharging device for discharging the side skin formed after the first cutting unit performs a first-direction side cutting on the silicon rod; the second cutting unit further includes a second side skin discharging device for discharging the side skin formed after the second cutting unit performs a second-direction side cutting on the silicon rod.

4. A silicon rod cutting and grinding integrated machine, characterized in that, Comprising: A machine base having a silicon rod processing platform; Cutting device, which is arranged on the machine base and is used for performing side cutting in the first direction on the silicon rod on the first processing area of the silicon rod processing platform and performing side cutting in the second direction on the silicon rod on the second processing area of the silicon rod processing platform to form a square silicon rod; wherein, the second direction is perpendicular or parallel to the first direction; wherein, the cutting device includes: a first cutting device arranged on the first processing area of the silicon rod processing platform and a second cutting device arranged on the second processing area of the silicon rod processing platform; the first cutting device includes: a first cutting frame; a first cutting support seat, which is movably lifted on the first cutting frame; a first cutting unit, which is arranged on the first cutting support seat; the first cutting unit includes a first wire frame arranged on the first cutting support seat, a plurality of first cutting wheels arranged on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form a first cutting line segment arranged in the first direction; the second cutting device includes: a second cutting frame; a second cutting support seat, which is movably lifted on the second cutting frame; a second cutting unit, which is arranged on the second cutting support seat; the second cutting unit includes a second wire frame arranged on the second cutting support seat, a plurality of second cutting wheels arranged on the second wire frame, and a second cutting wire, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form a second cutting line segment arranged in the second direction; Grinding device, which is arranged on the machine base and is used for grinding the surface and chamfering the square silicon rod on the third processing area of the silicon rod processing platform; wherein, the grinding device includes: a grinding surface support seat arranged on the machine base; at least a pair of grinding tools, which are oppositely arranged on the grinding surface support seat; the at least a pair of grinding tools are movably lifted relative to the grinding surface support seat for grinding the surface and chamfering the square silicon rod; Silicon rod conversion device, which is arranged on the silicon rod processing platform and is used for converting the silicon rod among the first processing area, the second processing area and the third processing area.

5. The silicon rod cutting and grinding integrated machine according to claim 4, characterized in that, The first cutting device further includes a first edge skin discharging device, which is used for discharging the edge skin formed after the first cutting device performs side cutting in the first direction on the silicon rod; the second cutting device further includes a second edge skin discharging device, which is used for discharging the edge skin formed after the second cutting device performs side cutting in the second direction on the silicon rod.

6. The silicon rod cutting and grinding integrated machine according to claim 1 or 4, characterized in that, The intersection point of the cutting wire when the first cutting unit performs side cutting in the first direction on the silicon rod and the cutting wire when the second cutting unit performs side cutting in the second direction on the silicon rod is located within the cross section of the silicon rod.

7. The silicon rod cutting and grinding integrated machine according to claim 6, characterized in that, The grinding tool includes: A main shaft; and At least one grinding wheel, which is arranged at the working end of the main shaft.

8. The silicon rod cutting and grinding integrated machine according to claim 6, characterized in that The grinding tool includes: A rotary chassis; A double-headed main shaft, which is arranged on the rotary chassis, and at least one rough grinding wheel is arranged at its first end and at least one fine grinding wheel is arranged at its second end; A driving motor, which is used for driving the rotary chassis to rotate so that the first end and the second end of the double-headed main shaft are interchanged.

9. The silicon rod cutting and grinding integrated machine according to claim 1 or 4, characterized in that, The first processing area, the second processing area, and the third processing area of the silicon rod processing platform are adjacent to each other and are distributed at 120°, and the rotation angle range of the silicon rod conversion device is ±240°.

10. The silicon rod cutting and grinding integrated machine according to claim 9, wherein, The silicon rod conversion device includes: A conveying body; A silicon rod positioning mechanism arranged on the conveying body for positioning the silicon rod; and A conversion driving mechanism for driving the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to be converted between each processing area.

11. The silicon rod cutting and grinding integrated machine according to claim 1 or 4, characterized in that, The silicon rod processing platform is also provided with a waiting area, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device, which is adjacent to the waiting area of the silicon rod processing platform and is used to transfer the silicon rod to be processed to the waiting area of the silicon rod processing platform or transfer the processed silicon rod on the waiting area out of the silicon rod processing platform.

12. The silicon rod cutting and grinding integrated machine according to claim 11, characterized in that, The silicon rod transfer device includes: A transfer base slidably arranged on the machine base through a sliding mechanism; A silicon rod platform movably arranged on the transfer base for horizontally placing the silicon rod; A silicon rod fastening mechanism arranged on the silicon rod platform for fastening the silicon rod during the transfer of the silicon rod; and A platform flipping mechanism for driving the silicon rod platform to flip relative to the transfer base so that the silicon rod is vertically placed on the silicon rod conversion device.

13. The silicon rod cutting and grinding integrated machine according to claim 11, characterized in that, The silicon rod cutting and grinding integrated machine further includes a positioning and detecting device for performing ridge line detection and center positioning on the silicon rod located in the waiting area.

14. The silicon rod cutting and grinding integrated machine according to claim 13, characterized in that, The positioning and detecting device includes: A ridge line detection unit, including a contact detection mechanism, a rotating mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotating mechanism. The contact detection mechanism is used to send a on-off signal to the detection controller by contacting the ridge line of the silicon rod, and the rotating mechanism is used to adjust the position of the silicon rod according to the control of the detection controller; and An axis adjustment unit for positioning the axis of the silicon rod at the center of the waiting area, including a clamping mechanism, and the clamping mechanism is used to form a clamping space for clamping the silicon rod and the center of the clamping space coincides with the center of the waiting area.

15. The silicon rod cutting and grinding integrated machine according to claim 11, wherein The waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are adjacent to each other and are distributed at 90°, and the rotation angle range of the silicon rod conversion device is ±270°.

16. The silicon rod cutting and grinding integrated machine according to claim 15, wherein, The silicon rod conversion device includes: A conveying body; A silicon rod positioning mechanism arranged on the conveying body for positioning the silicon rod; and A conversion driving mechanism for driving the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to be converted between each processing area.

17. A silicon rod cutting and grinding method, which is applied to the silicon rod cutting and grinding integrated machine as described in claim 1, wherein, The silicon rod processing platform is provided with a first processing area, a second processing area, and a third processing area. It is characterized in that the silicon rod cutting and grinding method includes the following steps: Let the silicon rod conversion device convert the first silicon rod to the first processing area, drive the cutting support in the cutting device to descend relative to the cutting frame, and perform a first-direction side cutting on the first silicon rod in the first processing area by the first cutting unit on the first side of the cutting support; Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing position to the second processing position and transfer the second silicon rod to the first processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, and use the second cutting unit on the second side of the cutting support to perform a second-direction side cutting on the first silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the second silicon rod at the first processing position; Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, and transfer the third silicon rod to the first processing position, and let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. During this stage, drive the cutting support in the cutting device to descend relative to the cutting frame, and use the second cutting unit on the second side of the cutting support to perform a second-direction side cutting on the second silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the third silicon rod at the first processing position; Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the first processing position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, unload the first silicon rod from the first processing position and load the fourth silicon rod, and let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position. During this stage, drive the cutting support in the cutting device to descend relative to the cutting frame, and use the second cutting unit on the second side of the cutting support to perform a second-direction side cutting on the third silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the fourth silicon rod at the first processing position.

18. The silicon rod cutting and grinding method according to claim 17, wherein, The first processing position, the second processing position, and the third processing position on the silicon rod processing platform are distributed at 120° to each other; when the direction in the order of the first processing position, the second processing position, and the third processing position is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 120°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 120° or a reverse rotation of 240°.

19. A method for cutting and grinding a silicon rod, which is applied to the silicon rod cutting and grinding integrated machine as described in claim 1, wherein, The silicon rod processing platform is provided with a waiting position, a first processing position, a second processing position, and a third processing position, and is characterized in that the silicon rod cutting and grinding method includes the following steps: Load the first silicon rod at the waiting position and perform preprocessing on the first silicon rod; Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the waiting position to the first processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the first silicon rod at the first processing position. During this stage, load the second silicon rod at the waiting position and perform preprocessing on the second silicon rod; Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing position to the second processing position and transfer the second silicon rod from the waiting position to the first processing position. Drive the cutting support in the cutting device to descend relative to the cutting frame. Use the second cutting unit on the second side of the cutting support to perform a second-direction side cutting on the first silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the second silicon rod at the first processing position. During this stage, load the third silicon rod at the waiting position and perform preprocessing on the third silicon rod. Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, and transfer the third silicon rod from the waiting position to the first processing position. Let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. During this stage, drive the cutting support in the cutting device to descend relative to the cutting frame. Use the second cutting unit on the second side of the cutting support to perform a second-direction side cutting on the second silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the third silicon rod at the first processing position. At the same time, load the fourth silicon rod at the waiting position and perform preprocessing on the fourth silicon rod. Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the waiting position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, and transfer the fourth silicon rod from the waiting position to the first processing position. Unload the first silicon rod from the waiting position and load the fifth silicon rod, and perform preprocessing on the fifth silicon rod. During this stage, let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position. Drive the cutting support in the cutting device to descend relative to the cutting frame. Use the second cutting unit on the second side of the cutting support to perform a second-direction side cutting on the third silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first-direction side cutting on the fourth silicon rod at the first processing position.

20. The silicon rod cutting and grinding method according to claim 19, characterized in that, The waiting position, the first processing position, the second processing position, and the third processing position on the silicon rod processing platform are distributed at 90° to each other. When the direction of the sequence of the waiting position, the first processing position, the second processing position, and the third processing position is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 90°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 90° or a reverse rotation of 270°.

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