Cooler body

Abstract

The invention relates to a cooler body (1), in particular, it is designed for cooling electronic components (100), the cooler body (1) comprising: a contact piece (2) comprising a contact surface for contacting a part to be cooled; a base piece (3) spaced apart from the contact piece by an intermediate piece (4) between the contact piece and the base piece. The intermediate piece (4) comprises individual holes forming parallel coolant ducts (5d, 5u, 5d1, 5u1, 5d2, 5u2-5dN), whereby each duct extends from the contact piece to the base piece, and at least two coolant channels (C, C1-Cn) are formed by a series of parallel ducts connected by a closed surface (2s) of the contact piece and a closed surface (3s) of the base piece, so that the coolant channels extend from the contact piece to the base piece and from the base piece to the contact piece multiple times.

Description

Technical Field

[0001] The present invention relates to a cooler body which is particularly suitable for cooling electronic components or assemblies. Background Art

[0002] It's well known that with the continued advancement of power-related electronic components, the power dissipation and, consequently, the heat released by electronic assemblies is increasing. While these components are becoming increasingly smaller, their efficiency, and therefore the amount of heat to be removed, is increasing. Furthermore, due to their compactness, these electronic components are housed in smaller spaces, which again leads to higher localized heat release. Using fan cooling, power dissipation is only possible with complex and bulky cooling elements, which is unacceptable. Consequently, air cooling, with its high losses, has clearly reached its limits.

[0003] The new high-performance processor is approximately 10cm 2 The system delivers approximately 70 to 100W of power within a single area, thus achieving a much higher heat flux density. Processor manufacturers predict further increases in waste heat in the coming years. In light of this development, those skilled in the art are considering liquid cooling for this application. Liquid cooling more efficiently dissipates heat from electronic components, resulting in the potential for higher power density. Liquid coolers also allow for more compact switch cabinets with numerous electronic components and operate very quietly.

[0004] An exemplary universal cooling device is disclosed in EP 2 291 859 A1, in which an insert is arranged inside a cooling channel, the insert having a plurality of pins which form a channel towards the cooler wall and are supplied with coolant via openings in an inclined surface of the inlet, which is hit by the coolant flow from the coolant channel.

[0005] In particular in the field of power electronics in automotive applications, more specifically for inverters, converters and charger devices for electric vehicles, intensive cooling of electronic components, especially switching components like IGBTs or MOSFETs, is required (since these are the components with the highest power consumption in such devices and are therefore the main heat sources in these devices).

[0006] Achieving effective cooling at an affordable price is difficult because, due to physical limitations, a liquid like water must be used as a heat sink in combination with flow channels that provide a large exchange area and produce a high heat transfer coefficient. Other construction materials that provide high thermal conductivity must be used.

[0007] Other more demanding requirements are that there must be direct contact between the electronic components and the cooling system (avoiding any air gaps to ensure sufficient thermal conductivity), while ensuring sufficient electrical insulation and avoiding mechanical stress on the electronic components (e.g. due to vibrations or thermal expansion).

[0008] A further requirement, particularly for automotive solutions, is that the cooling liquid must transfer the heat received (via the vehicle radiator) to the ambient air, which can reach high temperatures (e.g., Dubai summer conditions, in the worst-case scenario for which the system must be designed). This results in higher cooling liquid temperature levels compared to non-automotive applications, and therefore requires higher liquid flow rates. Consequently, such cooling systems require a low-pressure-drop design to avoid the high pressure drop caused by the higher flow rates.

[0009] Due to increased safety and maintenance requirements (compared to fixed equipment), the need for automotive cooling solutions to be insensitive to debris increases. Additionally, automotive cooling system solutions must be designed to be suitable for mass production. Summary of the Invention

[0010] The present invention provides an improved cooler body which, while being as compact as possible, allows for a more efficient cooling structure and a simpler design.

[0011] Another object of the present invention is to provide a cooler body that meets the cooling requirements of electronic components in the automotive field as described above.

[0012] The present invention relates to a cooler body, preferably designed for cooling electronic components, comprising: a contact element comprising a contact surface for (thermal) contact with the component to be cooled; and a base element, which is separated from the contact element by an intermediate element between the contact element and the base element. The intermediate element comprises individual or independent holes forming a plurality of parallel rows of coolant ducts, whereby each duct substantially extends from the contact element to the base element. At least two coolant channels - channels enabling a coolant (preferably water to be used as a heat sink) to flow from a coolant inlet to a coolant outlet - are formed by a series of parallel ducts connected by a closed surface of the contact element and a closed surface of the base element, so that each of the coolant channels extends multiple times from the contact element to the base element and multiple times from the base element to the contact element.

[0013] Preferably, the cooler body includes five or more such coolant channels, for example, a number of five to ten coolant channels. As another preferred option, the closed surface of the contact member and the closed surface of the base member each include a plurality of protrusions, which are arranged continuously on each closed surface and spaced apart from each other, and two continuous protrusions together with a portion of the corresponding closed surface (and the end face of the intermediate member) form a cavity or chamber, which connects the pipeline to the subsequent pipeline. For example, basically, the encapsulation member (base member or contact member) provides a chamber between itself and the intermediate member by means of limited protrusions, whereby two adjacent pipelines of parallel pipelines pass into each chamber, thereby enabling inflow and reverse outflow. Preferably, the protrusions are implemented as fin-like structures. This fin-like structure can have a straight form, or a wavy form and / or a zigzag form, and is preferably arranged transversely to the extension direction of the base / contact member.

[0014] Preferably, subsequent rows of tubes are offset relative to each other (relative to the general or bulk flow direction of each channel)

[0015] In an embodiment having cavities as described above, optionally, each cavity connects the outlets of all tubes in one row with all inlets of tubes in a subsequent row.

[0016] Preferably, the main body is made of ceramic, preferably an electrically insulating and thermally conductive ceramic such as aluminum oxide or aluminum nitride. Alternatively, the main body is made of a metal such as aluminum or copper.

[0017] In the case of a ceramic body, the body is optionally a monolithic body, preferably manufactured by sintering the green ceramic parts (raw materials) of the base element, the intermediate element and the contact element together in one step. Thus, additional assembly steps and thermal interfaces can be avoided.

[0018] As an option, the base element and the contact element are embodied as parallel plates, whereby preferably the extension direction of the plates defines the general or overall direction of the channel.As another option, the base element also serves as a contact element for contacting the part to be cooled.

[0019] As another option, the closing surface of the contact element and the closing surface of the base element are facing each other, and / or the duct is arranged at least approximately perpendicular to the closing surfaces.

[0020] In some embodiments, the base member and the contact member comprise stabilizing ribs, and / or the contact surface is designed for direct attachment to the part to be cooled.

[0021] The present invention further relates to a cooler, in particular an electronic component cooler, especially an automotive power electronics cooler, comprising the cooler body according to the present invention.

[0022] The invention also relates to the use of a cooler body according to the invention in a power electronics system, in particular in an automotive power electronics system. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] By way of example only, preferred embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which:

[0024] Figures 1a to 1c A first embodiment of a cooler body according to the present invention is shown;

[0025] Figure 2 Other embodiments of portions of the cooler body are shown. DETAILED DESCRIPTION

[0026] Figures 1a to 1c A first embodiment of a cooler body 1 according to the invention is shown together with a component 100 to be cooled, for example a power electronic component such as a MOS-FET or an IGBT, in particular as part of an automotive electronic circuit. Figure 1a As shown in the 3D view in FIG, the cooler body 1 comprises three main parts, namely a contact member 2, a middle member 4 and a base member 3. Preferably, the electronic component 100 to be cooled is directly contacted by the contact member 2, for example, via thermal adhesive, thermal grease or some other interface material with high thermal conductivity.

[0027] The main body 1 can be made of a metal such as aluminum or copper, whereby the three parts 2, 3, and 4 can be made of metal sheets joined together by welding or brazing. Joining techniques such as sintering can also be used, using an intermediate sintered layer between the metal sheets. However, the main body 1 is preferably made of a thermally conductive but electrically insulating ceramic such as aluminum nitride or aluminum oxide, thus advantageously eliminating the need for an additional electrically insulating layer. The main body 1 is preferably a monolithic body 1. For example, the monolithic ceramic body 1 can be formed by first manufacturing the three individual parts 2, 3, and 4 as "green" ceramic parts and then sintering all three parts together in a single step. This avoids the need for additional assembly steps and thermal interfaces. Alternatively, the base member 3 and the contact member 2 can be made of two layers of "green" ceramic instead of one. This simplifies the formation process of the unsintered ceramic. In this case, additional ribs are preferably added to stabilize the structure. (Alternatively, the main body 1 can be made of metal and insulating members can be added to cool the electronic components.)

[0028] The contact element 2 and the base element 3 are separated by an intermediate element 4 located therebetween. In this example, the contact element 2 and the base element 3 are embodied as long plates which are arranged parallel to each other and extend in the direction S.

[0029] In this example, the intermediate member 4 is embodied as a block that is shorter in its extension direction than the plates 2 and 3. The intermediate member 4 is perforated, with the holes 5u and 5d serving as coolant conduits. Thus, the intermediate member 4 includes a plurality of conduits 5u and 5d arranged parallel to one another. The conduits 5d and 5u extend from the facing surface 2s of the contact member 2 to the facing surface 3s of the base member 3, at least approximately perpendicular to the surfaces 2s and 3s, or at a right angle (90°) between the extension direction H of each hole 5u and 5d and the extension direction S of the plates 2 and 3.

[0030] The three workpieces 2, 3, 4 are stacked one on top of the other, forming a sandwich-like structure in the example. As an alternative to the sandwich-like structure shown in the example in which the two closed surfaces 2s, 3s face each other, the surfaces 2s, 3s are arranged at a certain angle to each other (for example, orthogonal), or are "anti-" parallel to each other, so that the body 1 forms a U-shaped structure. Therefore, the pipes 5d, 5u are not as Figure 1a Instead of being straight as shown in FIG, it is angled or formed in the shape of a “U.” Optionally, the base element 3 is also embodied as a contact element for thermal contact with the part to be cooled.

[0031] The surfaces 2s, 3s facing the pipes 5d, 5u serve as closing surfaces. There are small gaps G between the intermediate member 4 and the base member 3, and also between the intermediate member 4 and the contact member 2; or more precisely, there is a gap G between each end of the pipes 5u, 5d and each closing surface 2s, 3s.

[0032] Each gap G is created by protrusions 2p, 3p distributed on each closed surface 2s, 3s. In other words, protrusions 2p, 3p are present on the inner surfaces 2s, 3s of the contact plate 2 and the base plate 3, acting as distance keepers to the intermediate duct 4. The gap G allows coolant to enter or exit the ducts 5u, 5d between the outer workpieces 2, 3 and the inner workpiece 4.

[0033] According to the invention, the protrusions 2p, 3p are designed such that they act as stops in the longitudinal direction S. Preferably, they are designed as fin-like structures as shown in the figures.

[0034] To better observe this fin-like protrusion, Figure 1b Only the base plate 3 with the fin-like structure 3p on the closing surface 3s is shown. The fin-like structure 3p is arranged perpendicular to the extension direction S, or the angle β between the extension direction P of each fin 3p and the extension direction S is a right angle or at least approximately 90°.

[0035] In the example, the fins 3p are implemented as straight fins. Alternatively, they are wavy or zigzag. The height of the protrusions 3p defines the gap G between the closing surface 3s and the duct of the intermediate piece.

[0036] The fins 3p are arranged continuously on the sealing surface 3s and are (equally) spaced apart from each other. The distance D between two consecutive protrusions 3p of the respective workpiece 2 or 3 is matched to the diameter of the pipe, so that two consecutive pipes are enclosed. The contact element 2 is designed accordingly, but has an offset relative to the base element 3 by (approximately) one pipe diameter, as will be explained in more detail below.

[0037] Refer again Figure 1a , it can be seen that, therefore, two consecutive protrusions 2p or 3p, together with the portion of the corresponding closed surface 2s and 3s therebetween (and the end face of the intermediate piece), form a kind of chamber or cavity 6, with the end 7 of one duct 5d as a first opening and the end 8 of the following duct 5u as a second opening. In other words, the cavity 6 connects (the end 7 of) one duct 5u with (the end 8 of) the following duct 5d.

[0038] According to the invention, the closed surfaces 2s, 3s or more specifically the cavities 6 connect the pipes 5u, 5d so that at least two coolant channels are derived from the first pipe 5d, which extend multiple times from the contact element 2 to the base element 3 and multiple times from the base element 3 to the contact element 2 via the pipes 5u, 5d and the cavities 6 between the pipes 5u, 5d. Figures 1a to 1c In the exemplary embodiment of the embodiment of the present invention, the projection 2p and thus the "upper" cavity 6 at the contact member 2 are offset in the extension direction S relative to the projection 3p and thus the "lower" cavity 6 at the base member 3 by at least one pipe (diameter) - preferably more than one pipe diameter, to achieve this result of alternating channels in direction. Such alternating channels C are Figure 1c is illustrated in more detail in .

[0039] Figure 1c The alternating coolant channels C according to the present invention, indicated by bright arrows within the cooler body 1, are schematically illustrated in a 3D view (for ease of illustration, only one of two or more channels is explicitly depicted). Coolant (not shown) enters the corresponding channel C of the cooler body 1 at the inlet IN (on the left side in the figure) in the direction of extension S of the cooler body 1. The coolant is first directed to the inner or closed surface 2s of the contact 2 (indicated by the first two left-hand arrows), where it absorbs heat from the contact 2 and, in turn, from the electronic component 100.

[0040] Then, due to the first protrusion 2p of the closing surface 2s of the contact element 2, the channel C extends for the first time through the first duct 5d “downwards” from the contact element 2 to the base element 3 (indicated by the first dotted arrow on the left).

[0041] Then, there is a first base member cavity 6, formed by the closed surface 3s of the base member 3 with two continuous protrusions 3p. This cavity connects the end of the first pipe 5d to the end of the pipe 5u following in the direction S. In other words, the outlet of the first pipe 5d opens into the cavity 6, and the base-side opening of the second pipe 5u is the outlet of the cavity 6. Thus, the channel C changes direction by approximately 180°, or in other words, makes a U-turn (indicated by the first curved arrow). As a result, the coolant flowing out of the first pipe 5d forms an impingement flow on the closed surface 3s and enters the second pipe 5u.

[0042] The channel C then extends back or "upwards" to the contact 2 according to the second conduit 5u (indicated by the upward continuous arrow). The "upward" conduit 5u opens into the contact cavity 6 at the contact 2. Here, the coolant can in turn absorb heat from the contact 2 and correspondingly from the electronic component 100.

[0043] Once again, channel C changes direction by approximately 180° due to cavity 6, thus opening into a second "downward" channel. In other words, the coolant now descends a second time from contact element 2 to base element 3 through the next channel of porous intermediate element 4. As can be seen, the fin-like structures 2p, 3p of outer elements 2, 3 divide the coolant among the holes, forcing the fluid back in the next hole.

[0044] This "downward-upward" process of the channel C from the contact member 2 to the base member 3 is repeated several times (in this example, five times). Thus, the proposed structure of the coolant body 1 provides a channel C or coolant flow in a simple and compact manner, which alternates multiple times between the contact member 2 and the base member 3 between the inlet IN and the outlet OUT of the cooler body 1. This design enables the coolant to impact or impinge on the contact member 2 (and the base member 3) and the contact area between the coolant and the surfaces 2s / 3s of the contact member 2, respectively, to be relatively large.

[0045] Figure 2 A further embodiment according to the invention is shown: a cross section of a base part 2 and an intermediate part 4 is shown in a top view.

[0046] In this embodiment, there are multiple parallel channels C1, C2 ... Cn with alternating directions between the contact member 2 and the base member 3 as described above, as provided by the multiple rows of holes 5d1, 5u1, 5d2, 5u2 ... 5dN in the intermediate member 4. The multiple rows of channels 5d1, 5u1, 5d2, 5u2 ... 5uN are separated in the extension direction (or the general direction of coolant flow F) by the base side protrusions 2p and extend along the entire width of the intermediate member 4 in the direction P orthogonal to the direction S (again, but one channel offset separation is due to Figure 2(caused by such base side protrusions not shown in FIG).

[0047] Preferably, the difference between the total number of channels Cdtotal (∑Cn@5dn) at a given pipe row 5dn and the total number of channels Cutotal (∑Cn@5un+1) at the same pipe row is 1. The difference between the total number of channels Cdtotal (∑Cn@5dn) at a given pipe row 5dn and the total number of channels Cutotal (∑Cn@5un) at an adjacent pipe row is also 1. However, the present invention also works with an equal number of channels.

[0048] By means of the protrusions 2p, cavities 6a, 6b ... 6n are provided which connect the subsequent rows of pipes 5u1, 5d2 to redirect each channel C1 ... Cn from "upward" to "downward". Each time for each channel C1 ... Cn, the flow of coolant impinging on the closed surface 2s is turned.

[0049] In the exemplary embodiment, the holes are offset in direction S. In other words, only each second tube row 5d1 ... 5dN is equally positioned in direction S. For example, coolant flowing into the chamber through tube row 5u1 is distributed to the next two nearest tubes of the subsequent row 5d2 (indicated by continuous arrows Fc in the figure). This is similarly achieved on the bottom side (indicated by dashed arrows Fb in the figure), that is, the same effect is observed on the bottom side.

[0050] Thus, for example, the pipe of row 5u1 is part of not only one channel (e.g., C1), but also two channels (C1 and C2). Due to the offset arrangement of the pipe rows 5d1 ... 5uN, each channel C1 ... Cn is assigned to more than one pipe in each row 5d1 ... 5uN. Thus, the flow F of the coolant liquid is not only as Figures 1a to 1c The description alternates "upwards" and "downwards", but also alternates "leftwards" and "rightwards" (in a more restricted manner). This arrangement of pipes or channels enables a low turbulence F, which allows high heat transfer at low pressure drop, thereby enhancing heat absorption or heat release by the coolant.

[0051] Although the present invention has been described above in part with reference to some preferred embodiments, it must be understood that various features of the embodiments can be modified and combined in numerous ways, all of which fall within the scope of the appended claims.

Claims

1. A cooler body, the cooler body being designed to cool electronic components, the cooler body comprising: a contact element comprising a contact surface for contacting the electronic component to be cooled, a base member spaced apart from the contact member by an intermediate member between the contact member and the base member, in, The intermediate piece includes a plurality of individual holes, the plurality of individual holes forming a plurality of parallel rows of coolant pipes, Each coolant conduit extends from the contact member to the base member, and At least two parallel coolant channels are formed by a plurality of parallel coolant pipes connected by the closed surface of the contact member and the closed surface of the base member, so that the at least two coolant channels each extend multiple times from the contact member to the base member and multiple times from the base member to the contact member.

2. The cooler body according to claim 1, characterized in that The closing surface of the contact member and the closing surface of the base member each include a plurality of protrusions, the plurality of protrusions being continuously arranged on each closing surface and spaced apart from each other, Two consecutive protrusions together with a corresponding portion of the closed surface form a cavity that connects one coolant channel to a subsequent coolant channel.

3. The cooler body according to claim 2, characterized in that The protrusions are straight, wavy or zigzag fin-like structures.

4. The cooler body according to claim 1, characterized in that The base element is designed as another contact surface for contact with the electronic component to be cooled.

5. The cooler body according to claim 2, characterized in that Each cavity connects the outlets of all coolant tubes in one row with the inlets of all coolant tubes in a subsequent row.

6. The cooler body according to claim 1, characterized in that One row of coolant tubes is offset from a subsequent row of coolant tubes.

7. The cooler body according to claim 1, characterized in that The cooler body is made of ceramic, which is aluminum oxide or aluminum nitride.

8. The cooler body according to claim 7, characterized in that The cooler body is a one-piece body formed by sintering the base member, the intermediate member, and the green ceramic portion of the contact member together in one step.

9. The cooler body according to claim 1, characterized in that The cooler body is made of metal, which is aluminum or copper.

10. The cooler body according to claim 1, wherein The base member and the contact member are implemented as parallel plates, wherein an extension direction of the parallel plates defines a general direction of the coolant channel.

11. The cooler body according to claim 1, wherein The closing surface of the contact member and the closing surface of the base member are facing each other, The coolant pipe is arranged perpendicular to the closed surface.

12. The cooler body according to claim 1, wherein The base member and the contact member include stabilizing ribs.

13. The cooler body according to claim 1, wherein The contact surface of the contact element is designed for direct attachment to the electronic component to be cooled.

14. A cooler comprising the cooler body according to claim 1.

15. A method of applying the cooler body according to claim 1 in a power electronic system.

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