A semiconductor test packaging device can realize online high temperature test function mechanism

Abstract

The present invention discloses a semiconductor test packaging equipment that can realize an online high-temperature test functional mechanism, including a feed direct vibration heating track, a circular vibration heating track, a discharge direct vibration heating track, a blowing block and an adsorption block. The feed direct vibration heating track and the discharge direct vibration heating track have the same structure, both including a straight vibrator, a heat insulation plate, a linear track, a cover plate and a heating rod. The circular vibration heating track includes a circular vibrator, a vibration disk, a fixing plate and a fan-shaped track; the outlet end of the linear track of the feed direct vibration heating track and the inlet end of the linear track of the discharge direct vibration heating track are connected to the two ends of the fan-shaped track in a one-to-one correspondence, and the blowing block is arranged at the inlet end of the linear track of the feed direct vibration heating track. The semiconductor test packaging equipment of the present invention can realize an online high-temperature test functional mechanism, can realize automatic heating of products, has a simple structure, occupies less space, can reduce operating costs, improve use efficiency, and is easy to operate, stable and reliable.

Description

Technical Field

[0001] The invention relates to a semiconductor testing and packaging equipment capable of realizing an online high-temperature testing function mechanism. Background Art

[0002] The heating mechanism in traditional semiconductor testing and production takes up a large space, has a complex structure, and incurs high costs. Summary of the invention

[0003] The purpose of the present invention is to overcome the defects of the prior art and provide a semiconductor testing and packaging equipment that can realize online high temperature testing function mechanism, has a simple structure, occupies less space, and can reduce operating costs, improve utilization efficiency, and is easy to operate, stable and reliable.

[0004] The technical solution to achieve the above purpose is: a semiconductor test packaging equipment can realize the online high temperature test function mechanism, including a feed direct vibration heating track, a circular vibration heating track, a discharge direct vibration heating track, a blowing block and an adsorption block, wherein:

[0005] The in-feed direct vibration heating track and the out-feed direct vibration heating track have the same structure, both comprising a direct vibrator, a heat insulation board, a linear track, a cover plate and a heating rod, wherein the heat insulation board is arranged on the top of the direct vibrator; the linear track is arranged on the heat insulation board; the cover plate is arranged above the linear track; and the heating rod is arranged at the bottom of the linear track;

[0006] The circular vibration heating track includes a circular vibrator, a vibration plate, a fixing plate and a fan-shaped track, wherein the vibration plate is arranged on the top of the circular vibrator; the fixing plate is arranged on the vibration plate; and the fan-shaped track is arranged on the fixing plate;

[0007] The outlet end of the linear track of the inlet direct vibration heating track and the inlet end of the linear track of the outlet direct vibration heating track are connected to the two ends of the fan-shaped track in a one-to-one correspondence;

[0008] The air blowing block is arranged at the inlet end of the linear track of the feed direct vibration heating track;

[0009] The adsorption block is arranged at the outlet end of the linear track of the discharging direct vibration heating track;

[0010] The inlet end of the linear track of the feed direct vibration heating track is provided with a detector through a bracket.

[0011] The semiconductor test packaging equipment described above can realize an online high temperature test functional mechanism, wherein the air blowing block is fixed to the inlet end of the linear track of the feed direct vibration heating track by screws;

[0012] The adsorption stopper is fixed to the outlet end of the linear track of the discharging direct vibration heating track by means of screws.

[0013] The semiconductor testing and packaging equipment described above can realize an online high-temperature testing functional mechanism, wherein the blowing block and the adsorption block are respectively provided with suction pen mounting holes, and a vacuum suction pen is installed in the suction pen mounting hole.

[0014] The above-mentioned semiconductor testing and packaging equipment can realize an online high-temperature testing functional mechanism, wherein the outlet end of the linear track of the discharge direct vibration heating track is provided with a detector through a bracket.

[0015] The above-mentioned semiconductor testing and packaging equipment can realize an online high-temperature testing functional mechanism, wherein the automatic heating mechanism also includes a base plate, the direct vibrator is fixed on the base plate through a direct vibration base; the circular vibrator is fixed on the base plate through a circular vibration base.

[0016] The semiconductor testing and packaging equipment described above can realize an online high-temperature testing functional mechanism, wherein the direct vibrator can be movably arranged on the direct vibration base up and down; and the circular vibrator can be movably arranged on the circular vibration base up and down.

[0017] The above-mentioned semiconductor testing and packaging equipment can realize an online high-temperature testing functional mechanism, wherein the automatic heating mechanism also includes a vibration controller, and the linear vibrator and the circular vibrator are respectively connected to the vibration controller.

[0018] The semiconductor testing and packaging equipment mentioned above can realize an online high-temperature testing functional mechanism, wherein two heating rods are arranged at the bottom of the fan-shaped track.

[0019] The above-mentioned semiconductor testing and packaging equipment can realize an online high-temperature testing functional mechanism, wherein the heating rod is externally connected to a heating controller.

[0020] The semiconductor testing and packaging equipment described above can realize an online high temperature testing functional mechanism, wherein the heating rod heats the products on the linear track and the fan-shaped track to 130°C.

[0021] The semiconductor testing and packaging equipment of the present invention can realize an online high-temperature testing functional mechanism, meet the temperature rise requirements of the product while minimizing the space as much as possible, reduce operating costs, reduce space requirements, and improve testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional structural diagram of the semiconductor test packaging equipment of the present invention that can realize the online high-temperature test function mechanism;

[0023] Figure 2It is a side view of a mechanism for realizing online high temperature testing function of the semiconductor testing and packaging equipment of the present invention;

[0024] Figure 3 The top view of the semiconductor testing and packaging equipment of the present invention can realize the online high temperature testing function mechanism. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solution of the present invention, the specific implementation methods thereof are described in detail below in conjunction with the accompanying drawings:

[0026] See also Figure 1 , Figure 2 and Figure 3 The best embodiment of the present invention is a semiconductor testing and packaging equipment that can realize an online high-temperature testing functional mechanism, including a base plate 60, a feed direct vibration heating track 10, a circular vibration heating track 20, a discharge direct vibration heating track 30, a blowing block 40 and an adsorption block 50.

[0027] The structure of the feeding direct vibration heating track 10 and the discharging direct vibration heating track 20 is the same, both of which include a direct vibrator 1, a heat insulation board 2, a linear track 3, a cover plate 4 and a heating rod 5. The direct vibrator 1 is fixed to the bottom plate 60 through a direct vibration base 11, and the heat insulation board 2 is arranged at the top of the direct vibrator 1; the linear track 3 is arranged on the heat insulation board 2; the cover plate 4 is arranged above the linear track 3; the heating rod 5 is arranged at the bottom of the linear track 3; there are two heating rods 5, and the two heating rods 5 are arranged one by one at the bottom of the linear track 3 of the feeding direct vibration heating track 10 and the bottom of the linear track 3 of the discharging direct vibration heating track 20. The heating rod 5 heats the linear track 3 and transfers it to the product on the linear track 3 through heat transfer. The heat insulation board 2 can prevent the temperature of the heating rod 5 from affecting the direct vibrator 1 Internal components are damaged. The cover plate 4 limits the product on the linear track 3. The cover plate 4 needs to ensure the height tolerance and verticality to avoid product jamming caused by tolerance deviation and prevent unsmooth feeding and discharging.

[0028] The circular vibration heating track 20 includes a circular vibrator 6, a vibration disk 7, a fixed plate and a fan-shaped track 8. The circular vibrator 6 is fixed on the base plate 60 through a circular vibration base 61. The vibration disk 7 is arranged on the top of the circular vibrator 6; the fixed plate is arranged on the vibration disk 7; the fan-shaped track 8 is arranged on the fixed plate; two heating rods are arranged at the bottom of the fan-shaped track 8; the fixed plate plays a heat insulating role, which can prevent the temperature of the fan-shaped track 8 from being directly transferred to the circular vibrator 6 and causing overheating and damage to its internal components.

[0029] The heating rod 5 is connected to an external heating controller, which can control the heating temperature of the heating rod 5. The heating rod 5 heats the products on the linear track 3 and the fan-shaped track 8 and maintains the temperature at 130°C.

[0030] The outlet end of the linear track 3 of the feeding direct vibration heating track 10 and the inlet end of the linear track 3 of the discharging direct vibration heating track 30 are connected to the two ends of the fan-shaped track 8 in a one-to-one correspondence; in this way, the product goes from the linear track 3 of the feeding direct vibration heating track 10 to the linear track 3 of the discharging direct vibration heating track 30 through the fan-shaped track 8. The fan-shaped track 8 needs to ensure the tolerance of the cover plate and the inlet chamfer to avoid material jamming at the joint with the linear track 3. The product on the fan-shaped track 8 vibrates normally and the product turns smoothly.

[0031] The air blowing block 40 is fixed to the linear track of the feed direct vibration heating track 10 by screws. 3 The inlet end of the straight track 3 of the discharge straight vibration heating track 30 is fixed by screws to the adsorption block 50; suction pen mounting holes are respectively provided on the blowing block 40 and the adsorption block 50, and vacuum suction pens are installed in the suction pen mounting holes. The blowing block 40 plays the role of limiting and blowing air to the product, and the adsorption block 50 plays the role of limiting and sucking the product. In this way, the product can break the vacuum through the vacuum suction pen on the blowing block 40 and enter the feed straight vibration heating track 10. After passing through the circular vibration heating track 20, the product is taken away from the outlet of the discharge straight vibration heating track 30 by the vacuum suction pen on the adsorption block 50, which can reduce operating costs and improve feeding efficiency. The operation is simple, stable and reliable.

[0032] The inlet end of the linear track 3 of the feeding direct vibration heating track 10 is provided with a detector 91 through a bracket. The outlet end of the linear track 3 of the discharging direct vibration heating track 30 is provided with a detector 92 through a bracket. The detectors 91 and 92 realize the action control of the overall automatic heating mechanism and the signal transmission of the semiconductor testing equipment. The detector 91 determines whether the product is in place, and transmits a signal to the direct vibrator 1 to vibrate the product into the linear track 3 and heat it; the detector 92 determines whether the product is in place, and transmits a signal to the semiconductor testing equipment to take the product away.

[0033] A vibration controller is provided on the feeding direct vibration heating track 10 and the discharging direct vibration heating track 20 to control the vibration parameters of the straight vibrator 1. A vibration controller is provided on the circular vibration heating track 10 to control the vibration parameters of the circular vibrator 6. The vibrations of the straight vibrator 1 and the circular vibrator 6 cannot resonate, otherwise the product will be skewed and stuck. The parameters of the product can be adjusted by the vibration controller to control the feeding speed. At the same time, the parameters of the product can be adjusted by the vibration controller to control the speed of the product passing through the fan track 8.

[0034] The semiconductor testing and packaging equipment of the present invention can realize an online high-temperature testing functional mechanism, and the overall structure can be slightly adjusted in height up and down. For example, the direct vibrator 1 can be movably arranged on the direct vibration base 11 up and down; the circular vibrator 6 can be movably arranged on the circular vibration base 61 up and down.

[0035] The semiconductor test packaging equipment of the present invention can realize the online high temperature test function mechanism, and can be used in conjunction with the turret on a continuous machine. When in use, the feed direct vibration heating track 10 and the discharge direct vibration heating track 20 are both located in the semiconductor test equipment; in this way, the product is heated for a long time on the fan-shaped track 8 and re-enters the semiconductor test equipment after turning 180 degrees, and the temperature of the product is maintained by heating on the fan-shaped track 8, eliminating the possibility of product cooling. It can reduce operating costs and improve feeding efficiency on semiconductor test equipment, and is easy to operate, stable and reliable.

[0036] In summary, the semiconductor testing and packaging equipment of the present invention can realize an online high-temperature testing functional mechanism, has a simple structure, a light shape, reduces occupied space, reduces operating costs, improves discharge efficiency, and is easy, stable, and reliable to operate.

[0037] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A semiconductor testing and packaging device can realize an online high temperature testing function mechanism, characterized in that: It includes a feed direct vibration heating track, a circular vibration heating track, a discharge direct vibration heating track, a blowing block and an adsorption block, wherein: The in-feed direct vibration heating track and the out-feed direct vibration heating track have the same structure, both comprising a direct vibrator, a heat insulation board, a linear track, a cover plate and a heating rod, wherein the heat insulation board is arranged on the top of the direct vibrator; the linear track is arranged on the heat insulation board; the cover plate is arranged above the linear track; and the heating rod is arranged at the bottom of the linear track; The circular vibration heating track includes a circular vibrator, a vibration plate, a fixing plate and a fan-shaped track, wherein the vibration plate is arranged on the top of the circular vibrator; the fixing plate is arranged on the vibration plate; and the fan-shaped track is arranged on the fixing plate; The outlet end of the linear track of the inlet direct vibration heating track and the inlet end of the linear track of the outlet direct vibration heating track are connected to the two ends of the fan-shaped track in a one-to-one correspondence; The air blowing block is arranged at the inlet end of the linear track of the feed direct vibration heating track; The adsorption block is arranged at the outlet end of the linear track of the discharging direct vibration heating track; The inlet end of the linear track of the feed direct vibration heating track is provided with a detector through a bracket.

2. The semiconductor testing and packaging equipment according to claim 1 can realize an online high temperature testing function mechanism, characterized in that: The air blowing block is fixed to the inlet end of the linear track of the feed direct vibration heating track by screws; The adsorption stopper is fixed to the outlet end of the linear track of the discharging direct vibration heating track by means of screws.

3. The semiconductor testing and packaging equipment according to claim 1 or 2 can realize an online high temperature testing function mechanism, characterized in that: The air blowing block and the adsorption block are respectively provided with suction pen mounting holes, and a vacuum suction pen is mounted in the suction pen mounting holes.

4. The semiconductor testing and packaging equipment according to claim 1 can realize an online high temperature testing function mechanism, characterized in that: The outlet end of the linear track of the discharging direct vibration heating track is provided with a detector through a bracket.

5. The semiconductor testing and packaging equipment according to claim 1 can realize an online high temperature testing function mechanism, characterized in that: The semiconductor testing and packaging equipment can realize the online high-temperature testing function mechanism and also includes a base plate, the direct vibrator is fixed on the base plate through a direct vibration base; the circular vibrator is fixed on the base plate through a circular vibration base.

6. The semiconductor testing and packaging equipment according to claim 5 can realize an online high temperature testing function mechanism, characterized in that: The straight vibrator is movably arranged on the straight vibration base; the circular vibrator is movably arranged on the circular vibration base.

7. The semiconductor testing and packaging equipment according to claim 1 can realize an online high temperature testing function mechanism, characterized in that: The semiconductor testing and packaging equipment can realize the online high temperature testing function. The mechanism also includes a vibration controller. The linear vibrator and the circular vibrator are respectively connected to the vibration controller.

8. The semiconductor testing and packaging equipment according to claim 1 can realize an online high temperature testing function mechanism, characterized in that: Two heating rods are arranged at the bottom of the sector track.

9. The semiconductor testing and packaging equipment according to claim 1 or 8 can realize an online high temperature testing function mechanism, characterized in that: The heating rod is externally connected to a heating controller.

10. The semiconductor testing and packaging equipment according to claim 9 can realize an online high temperature testing function mechanism, characterized in that: The heating rod heats the products on the linear track and the fan-shaped track to 130°C.

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