Light-emitting device and method for manufacturing the same

Abstract

Provided are a light-emitting device with high luminance and excellent contrast, and a method for manufacturing the light-emitting device. The light-emitting device (100) includes: a substrate (10); a plurality of light-emitting elements (20) mounted on the substrate (10); a covering member (30) disposed on the substrate (10) and between the light-emitting elements (20) up to the position of the upper surface of the light-emitting elements (20); and a light-transmissive member (40) disposed above the plurality of light-emitting elements (20). The covering member (30) is a formed body including an inorganic material powder and an adhesive material.

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and a method for manufacturing the light-emitting device. Background Art

[0002] Conventionally, a light-emitting device in which a light-emitting element is placed on a substrate has been known. For example, in Patent Document 1, a light-emitting device is disclosed in which a light-emitting element is placed on the upper surface of a wiring substrate, and a light-reflecting member that is in contact with the side surface of the light-emitting element is provided on the wiring substrate.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2018-174334 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] A problem of an embodiment of the present disclosure is to provide a light-emitting device with high brightness and excellent contrast and a method for manufacturing the light-emitting device.

[0008] Means for Solving the Problems

[0009] The light-emitting device according to an embodiment of the present disclosure includes: a substrate; a plurality of light-emitting elements placed on the substrate; a covering member provided on the substrate and reaching the upper surface of the light-emitting elements between the light-emitting elements; and a light-transmissive member provided above the plurality of light-emitting elements, and the covering member is a molded body including powder of an inorganic material and an adhesive material.

[0010] The light-emitting device according to an embodiment of the present disclosure includes: a substrate; a plurality of light-emitting elements placed on the substrate; a covering member provided on the substrate and reaching the upper surface of the light-emitting elements between the light-emitting elements; and a light-transmissive member provided above the plurality of light-emitting elements, and the covering member is a molded body including powder of an inorganic material and an adhesive material.

[0011] The light-emitting device according to an embodiment of the present disclosure includes: a substrate; a plurality of light-emitting elements placed on the substrate; a covering member provided on the substrate and reaching the upper surface of the light-emitting elements between the light-emitting elements; and a light-transmissive member provided above the plurality of light-emitting elements, and the covering member is a molded body of TiO2 powder.

[0012] The light-emitting device according to an embodiment of the present disclosure includes: a substrate; a plurality of light-emitting elements mounted on the substrate; a light-transmissive member provided separately for each of the light-emitting elements above the plurality of light-emitting elements; and a covering member provided on the substrate and between the light-emitting elements and between the light-transmissive members up to the position of the upper surface of the light-transmissive member, the covering member being a molded body of TiO2 powder.

[0013] The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: a step of mounting a plurality of light-emitting elements on a substrate; a step of forming a covering member on the substrate and between the light-emitting elements up to the position of the upper surface of the light-emitting elements; and a step of forming a light-transmissive member above the plurality of light-emitting elements, the step of forming the covering member includes: a step of filling a powder of an inorganic material on the substrate and between the light-emitting elements; and a step of impregnating the powder of the inorganic material with a bonding material solution.

[0014] The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: a step of preparing a substrate on which a plurality of light-emitting elements having a light-transmissive member above are mounted; and a step of forming a covering member on the substrate and between the light-emitting elements and between the light-transmissive members up to the position of the upper surface of the light-transmissive member, the step of forming the covering member includes: a step of filling a powder of an inorganic material on the substrate and between the light-emitting elements and between the light-transmissive members; and a step of impregnating the powder of the inorganic material with a bonding material solution.

[0015] The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: a step of mounting a plurality of light-emitting elements on a substrate; a step of forming a covering member on the substrate and between the light-emitting elements up to the position of the upper surface of the light-emitting elements; and a step of forming a light-transmissive member above the plurality of light-emitting elements, the step of forming the covering member includes a step of filling a powder of TiO2 on the substrate and between the light-emitting elements.

[0016] The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: a step of preparing a substrate on which a plurality of light-emitting elements having a light-transmissive member above are mounted; a step of forming a covering member on the substrate and between the light-emitting elements and between the light-transmissive members up to the position of the upper surface of the light-transmissive member, the step of forming the covering member includes a step of filling a powder of TiO2 on the substrate and between the light-emitting elements and between the light-transmissive members.

[0017] Advantageous Effects of the Invention

[0018] The light-emitting device according to an embodiment of the present disclosure has high brightness and excellent contrast.

[0019] The manufacturing method of the light-emitting device according to the embodiment involved in the present disclosure can manufacture a light-emitting device with high brightness and excellent contrast. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1A It is a top view schematically showing the structure of the light-emitting device according to the first embodiment.

[0021] Figure 1B It is schematically shown through a part Figure 1A partial enlarged view of.

[0022] Figure 1C is Figure 1A cross-sectional view at the IC-IC line of.

[0023] Figure 1D is Figure 1C partial enlarged view of.

[0024] Figure 2 It is a schematic diagram schematically showing the irradiation area of the headlight when the light-emitting device according to the first embodiment is applied to the headlight of an automobile, and is used to illustrate the lighting state of the light-emitting device according to the first embodiment.

[0025] Figure 3 It is a flowchart of the manufacturing method of the light-emitting device according to the first embodiment.

[0026] Figure 4A It is a cross-sectional view showing the process of placing the light-emitting element in the manufacturing method of the light-emitting device according to the first embodiment.

[0027] Figure 4B It is a cross-sectional view showing the process of forming the frame in the manufacturing method of the light-emitting device according to the first embodiment.

[0028] Figure 4C It is a cross-sectional view showing the process of filling the powder of the inorganic material in the manufacturing method of the light-emitting device according to the first embodiment.

[0029] Figure 4D It is a cross-sectional view showing the process of impregnating the bonding material solution in the manufacturing method of the light-emitting device according to the first embodiment.

[0030] Figure 4E It is a cross-sectional view showing the process of exposing the upper surface of the light-emitting element in the manufacturing method of the light-emitting device according to the first embodiment.

[0031] Figure 4F It is a cross-sectional view showing the process of forming the light-transmissive member in the manufacturing method of the light-emitting device according to the first embodiment.

[0032] Figure 5 It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the second embodiment.

[0033] Figure 6 It is a flowchart of the manufacturing method of the light-emitting device according to the second embodiment.

[0034] Figure 7A It is a cross-sectional view showing the process of preparing a substrate in the manufacturing method of the light-emitting device according to the second embodiment.

[0035] Figure 7B It is a cross-sectional view showing the process of forming a frame in the manufacturing method of the light-emitting device according to the second embodiment.

[0036] Figure 7C It is a cross-sectional view showing the process of filling powder of an inorganic material in the manufacturing method of the light-emitting device according to the second embodiment.

[0037] Figure 7D It is a cross-sectional view showing the process of impregnating a bonding material solution in the manufacturing method of the light-emitting device according to the second embodiment.

[0038] Figure 7E It is a cross-sectional view showing the process of exposing the upper surface of the light-transmissive member in the manufacturing method of the light-emitting device according to the second embodiment.

[0039] Figure 8A It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the third embodiment.

[0040] Figure 8B It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the fourth embodiment.

[0041] Figure 8C It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the fifth embodiment.

[0042] Figure 9 It is a flowchart of the manufacturing method of the light-emitting device according to the fifth embodiment.

[0043] Figure 10 It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the sixth embodiment.

[0044] Figure 11 It is a flowchart of the manufacturing method of the light-emitting device according to the sixth embodiment.

[0045] Figure 12It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the seventh embodiment.

[0046] Figure 13 It is a flowchart of the manufacturing method of the light-emitting device according to the seventh embodiment.

[0047] -Symbol Explanation-

[0048] 3 Wiring part

[0049] 4 Conductive adhesive material

[0050] 5 Plate-like member

[0051] 6 Roller

[0052] 7 Pipette

[0053] 10 Substrate

[0054] 20 Light-emitting element

[0055] 20a Irradiation area of the light-emitting element that emits light

[0056] 20b Irradiation area in the case where the light-emitting element that is turned off emits light

[0057] 30, 30A Covering member

[0058] 30a Powder

[0059] 30b Adhesive material solution

[0060] 40, 40A, 40B, 40C Light-transmissive member

[0061] 41 Transparent member

[0062] 42 Wavelength conversion member layer

[0063] 50, 50A Frame

[0064] 70 Resin

[0065] 80 Coating

[0066] 100, 100A, 100B, 100C, 100D, 100E, 100F Light-emitting device

[0067] L1, L2, L3 Irradiation area Detailed Embodiment

[0068] Hereinafter, embodiments will be described with reference to the accompanying drawings. However, the embodiments shown below illustrate a light-emitting device and a method for manufacturing the light-emitting device for embodying the technical idea of the present embodiment, and are not limited to the following embodiments. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the constituent members described in the embodiments are not intended to limit the scope of the present invention only thereto, but are merely illustrative, unless otherwise specified. In addition, the sizes, positional relationships, etc. of the members shown in the respective drawings may be exaggerated for clarity of explanation.

[0069] <<First Embodiment>>

[0070] [Light-Emitting Device]

[0071] Figure 1A is a plan view schematically showing the structure of the light-emitting device according to the first embodiment. Figure 1B is schematically shown through a part Figure 1A partial enlarged view of. Figure 1C is Figure 1A cross-sectional view at the IC-IC line of. Figure 1D is Figure 1C partial enlarged view of. Figure 2 is a schematic view schematically showing the irradiation area of the headlamp when the light-emitting device according to the first embodiment is applied to the headlamp of an automobile, and for explaining the lighting state of the light-emitting device according to the first embodiment.

[0072] The light-emitting device 100 includes: a substrate 10; a plurality of light-emitting elements 20 mounted on the substrate 10; a covering member 30 provided on the substrate 10 and provided up to the upper surface position of the light-emitting elements 20 between the light-emitting elements 20; and a light-transmissive member 40 provided above the plurality of light-emitting elements 20. Moreover, the covering member 30 is a molded body including an inorganic material powder and an adhesive material.

[0073] Furthermore, the light-emitting device 100 includes a frame 50 provided around the plurality of light-emitting elements 20 on the substrate 10. Moreover, the covering member 30 is provided between the frame 50 and the light-emitting elements 20.

[0074] In other words, the light-emitting device 100 mainly includes a substrate 10, light-emitting elements 20, a covering member 30, a light-transmissive member 40, and a frame 50.

[0075] Hereinafter, each structure of the light-emitting device 100 will be described.

[0076] The substrate 10 is a member on which a plurality of light-emitting elements 20 are mounted, and electrically connects the light-emitting device 100 to an external power source. The substrate 10 is formed in a substantially rectangular shape in plan view, for example. A wiring portion 3 is provided on the upper surface of the substrate 10.

[0077] As the substrate 10, an insulating material is preferably used, and a material that hardly transmits light emitted from the light-emitting element 20, external light, etc. is preferably used. For example, ceramics such as alumina, aluminum nitride, and mullite, PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or thermoplastic resins such as liquid crystal polymers, epoxy resins, silicone resins, modified epoxy resins, polyurethane resins, or phenolic resins can be used. In addition, the substrate may be configured to have a concave cavity and the light-emitting element 20 is placed in the cavity.

[0078] The wiring portion 3 is provided on the upper surface of the substrate 10 and is electrically connected to the light-emitting element 20. In addition, the wiring portion 3 has a terminal electrically connected to an external power supply.

[0079] As the wiring portion 3, for example, metals such as Fe, Cu, Ni, Al, Ag, Au, Al, Pt, Ti, W, Pd, or alloys including at least one of these can be used to form. Such a wiring portion 3 can be formed by electroplating, electroless plating, evaporation plating, sputtering, etc.

[0080] The light-emitting element 20 is a semiconductor element that emits light by itself when a voltage is applied. As the emission color of the light-emitting element 20, a light-emitting element of any wavelength can be selected according to the use. For example, as the light-emitting element 20 for blue (light with a wavelength of 430 to 490 nm) and green (light with a wavelength of 495 to 565 nm), nitride semiconductors (In X Al Y Ga 1-X-Y N, 0≤X, 0≤Y, X + Y≤1), GaP, etc. can be used. As the light-emitting element 20 for red (light with a wavelength of 610 to 700 nm), in addition to nitride semiconductor elements, GaAlAs, AlInGaP, etc. can also be used.

[0081] The light-emitting element 20 is flip-chip mounted on the wiring portion 3 on the substrate 10 via the conductive adhesive material 4. As the conductive adhesive material 4, for example, eutectic solder, conductive paste, bumps, etc. can be cited.

[0082] The light-emitting device 100 includes a plurality of light-emitting elements 20. Here, for example, 96 light-emitting elements 20 are arranged in a row and column pattern, 24 in the row direction and 4 in the column direction, on the substrate 10. The light-emitting device 100 is configured to be able to turn on and off individual light-emitting elements 20 and grouped light-emitting elements 20 among the plurality of light-emitting elements 20.

[0083] The distance between the light-emitting elements 20 is preferably 70 μm or less. If the distance between the light-emitting elements 20 is 70 μm or less, the brightness of the light-emitting device 100 becomes higher, and the distance of the non-light-emitting portion between the light-emitting elements 20 can be shortened. Therefore, the dark portion between the light-emitting elements 20 can be reduced. The distance between the light-emitting elements 20 is more preferably 50 μm or less. If the distance between the light-emitting elements 20 is 50 μm or less, the brightness of the light-emitting device 100 is further improved, and the distance of the non-light-emitting portion between the light-emitting elements 20 can be further shortened, and the dark portion between the light-emitting elements 20 can be further reduced. From the viewpoint of easy manufacturing, the distance between the light-emitting elements 20 is preferably 40 μm or more.

[0084] The covering member 30 is on the substrate 10 and is adjacently disposed between the light-emitting elements 20 up to the same height as the upper surface of the light-emitting elements 20. In addition, the covering member 30 is on the substrate 10 and is adjacently disposed between the frame body 50 and the light-emitting elements 20 up to the same height as the upper surface of the light-emitting elements 20. That is, the covering member 30 is filled and disposed between all the light-emitting elements 20 and is filled and disposed between all the frame bodies 50 and the light-emitting elements 20. In addition, in the light-emitting device 100, the upper surface of the covering member 30 and the upper surface of the light-emitting elements 20 are formed in the same plane.

[0085] In addition, the covering member 30 is not provided between the upper surface of the substrate 10 and the lower surface of the light-emitting elements 20. By adopting such a structure, by applying a reflective member such as Ag plating on the wiring portion 3, the reflectivity under the light-emitting elements 20 can be improved. However, the covering member 30 may also be provided between the upper surface of the substrate 10 and the lower surface of the light-emitting elements 20.

[0086] In addition, when an inorganic material is disposed between the upper surface of the substrate 10 and the lower surface of the light-emitting elements 20, it can be carried out by preparing a slurry including the inorganic material by using a low-viscosity solvent, flowing it under the light-emitting elements 20, and drying it.

[0087] The covering member 30 is a molded body including inorganic material powder and an adhesive material. Specifically, the covering member 30 is formed by compressing the inorganic material powder and curing it with the adhesive material. By using such a covering member 30, when a part of the light-emitting elements 20 emit light in the light-emitting device 100, the light of the light-emitting light-emitting elements 20 is suppressed from entering the adjacent non-light-emitting light-emitting elements 20. As a result, the contrast of the light-emitting device 100 becomes excellent. In addition, since the covering member 30 is provided between the light-emitting elements 20, the amount of light extracted from the upper surface of the light-emitting elements 20 increases, and the brightness of the light-emitting device 100 becomes high.

[0088] In addition, in a conventional light-emitting device in which a covering member uses a resin, deterioration of the covering member due to heat is likely to occur. In addition, sink marks caused by the resin sometimes occur on the upper surface of the covering member, and color unevenness occurs due to a change in the shape of the light-transmissive member provided on the covering member. The light-emitting device 100 of the present embodiment uses an inorganic material for the covering member 30, so that deterioration of the covering member due to heat in the case of using a resin does not occur, and the life of the light-emitting device 100 is extended. Furthermore, sink marks caused by the resin do not occur on the upper surface of the covering member 30, and generation of color unevenness can be suppressed.

[0089] The content of the inorganic material is, for example, 90% by mass or more and 99.99% by mass or less with respect to the entire covering member 30, but as long as it is less than 100% by mass.

[0090] Examples of the inorganic material include at least one of TiO2, BN, SiO2, and Al2O3. By using these substances, the brightness becomes higher and the contrast becomes more excellent. The inorganic material is preferably a material having a refractive index of 2 or more. If the refractive index is 2 or more, the effect of suppressing the light of the light-emitting element 20 that emits light from entering the adjacent non-light-emitting light-emitting element 20 is further improved, and the contrast becomes more excellent. In addition, the reflection performance of the covering member 30 is further improved, and the brightness becomes higher.

[0091] Examples of the adhesive material include polysilazane. By using polysilazane as the adhesive material for the covering member 30, it is easy to bond the powder of the inorganic material. Polysilazane is produced by curing the polysilazane solution described later.

[0092] The content of the adhesive material is, for example, 0.01% by mass or more and 10% by mass or less with respect to the entire covering member 30, but as long as it exceeds 0% by mass.

[0093] In addition, the covering member 30 may be a member mixed with silver, Al, etc. By the covering member 30 containing these substances, the effect of suppressing the light of the light-emitting element 20 that emits light from entering the adjacent non-light-emitting light-emitting element 20 is further improved, and the contrast becomes more excellent. In addition, the reflection performance of the covering member 30 is further improved, and the brightness becomes higher.

[0094] The light-transmissive member 40 is provided on the light extraction surface side of the plurality of light-emitting elements 20. Here, the light-transmissive member 40 is continuously arranged to cover the entire upper surface of the plurality of light-emitting elements 20. In addition, the light-transmissive member 40 is also provided on the frame 50. By providing the light-transmissive member 40 on the frame 50, the light-emitting device 100 can increase the size of the light-transmissive member 40 when viewed from above. In addition, by providing the light-transmissive member 40 on the frame 50, it is possible to make it difficult to see the color of the frame 50 when viewed from above.

[0095] The light transmissive member 40 is formed of a resin that transmits light. The light transmissive member 40 is formed by curing a resin of the light transmissive member after disposing the resin on the plurality of light emitting elements 20 and the frame body 50 by pouring, spraying, or the like. Accordingly, the resin also flows outside the frame body 50, and the light transmissive member 40 is also formed on the outer side surface of the frame body 50.

[0096] Examples of the resin material for the resin of the light transmissive member 40 include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin.

[0097] The light transmissive member 40 may also contain a wavelength conversion member. Examples of the wavelength conversion member include phosphors. Examples of the light transmissive member 40 containing a phosphor include a member containing phosphor powder in the resin. In addition, the light transmissive member 40 may contain a diffusion material, a filler, or the like according to the purpose.

[0098] As the phosphor, a phosphor known in the art can be used. For example, YAG (Y3Al5O 12 :Ce), a yellow phosphor such as silicate, a red phosphor such as CASN (CaAlSiN3:Eu), KSF (K2SiF6:Mn), or a green phosphor such as chlorosilicate, BaSiO4:Eu2+ can be used.

[0099] As the diffusion material, a diffusion material known in the art can be used. For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be used.

[0100] Examples of the particle diameter of the phosphor include 1 μm or more and 30 μm or less.

[0101] The frame body 50 is disposed around the plurality of light emitting elements 20 on the substrate 10. The frame body 50 is formed in a frame shape along the shape of the substrate 10 by covering the upper surface of the substrate 10 with a resin containing a reflective material. The frame body 50 is formed in a substantially rectangular ring shape in a plan view. In addition, the frame body 50 is formed at the same height as the light emitting element 20.

[0102] The distance between the frame body 50 and the light emitting element 20 is preferably 200 μm or less. If the distance between the frame body 50 and the light emitting element 20 is 200 μm or less, it is easy to compress the powder of the inorganic material between the frame body 50 and the light emitting element 20, and it is easy to fill the inorganic material. In addition, the distance between the frame body 50 and the light emitting element 20 in the present embodiment refers to the distance from the part at half of the height direction of the frame body 50 to the side surface of the light emitting element 20. In addition, from the viewpoint of more easily disposing the powder of the inorganic material between the frame body 50 and the light emitting element 20, the distance between the frame body 50 and the light emitting element 20 is preferably 50 μm or more.

[0103] In this embodiment, since the covering member 30 uses powder of an inorganic material, the inorganic material can be disposed between the frame 50 and the light-emitting element 20 by applying the powder from above. Therefore, it is not necessary to insert a nozzle for filling resin or the like between the frame 50 and the light-emitting element 20, and it is easier to dispose the covering member 30 between the frame 50 and the light-emitting element 20 than in the case where a resin is used for the covering member. In addition, compared with the case where a resin is used for the covering member, the distance between the frame 50 and the light-emitting element 20 can be shortened, and the size of the light-emitting device 100 can be reduced.

[0104] Examples of the resin material for the frame 50 include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin. Examples of the light reflection material for the frame 50 include titanium oxide, silicon dioxide, silica, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, and boron nitride. Among them, from the viewpoint of light reflection, titanium oxide having a relatively high refractive index is preferably used.

[0105] [Operation of Light-Emitting Device]

[0106] When the light-emitting device 100 is driven, current is supplied to the light-emitting element 20 from an external power source via the wiring portion 3, and the light-emitting element 20 emits light. The light emitted from the light-emitting element 20 and traveling upward is taken out to the outside above the light-emitting device 100 via the light-transmissive member 40. In addition, the light traveling downward is reflected by the wiring portion 3 and the substrate 10 and taken out to the outside of the light-emitting device 100 via the light-transmissive member 40. In addition, the light traveling between the light-emitting element 20 and the frame 50 is reflected by the covering member 30 and taken out to the outside of the light-emitting device 100 via the light-transmissive member 40. In addition, the light traveling between the light-emitting elements 20 is reflected by the covering member 30 and taken out to the outside of the light-emitting device 100 via the light-transmissive member 40. At this time, since the covering member 30 which is a molded body including powder of an inorganic material and an adhesive material is provided between the light-emitting elements 20, when a part of the light-emitting elements 20 emit light, the light of the already-emitted light-emitting element 20 is suppressed from entering the adjacent non-light-emitting light-emitting element 20. As a result, the contrast of the light-emitting device 100 becomes excellent. In addition, since the covering member 30 is provided between the light-emitting elements 20, the brightness of the light-emitting device 100 becomes high.

[0107] The light-emitting device 100 can be used, for example, for an adaptive driving beam (ADB) headlamp of a vehicle. Figure 2The irradiation area of the headlamp indicating the case where the vehicle travels on the left side. The irradiation area L1 is the area irradiated by the light-emitting device 100 of the present embodiment, and the irradiation areas L2 and L3 are the areas irradiated by other light-emitting devices. These three irradiation areas constitute the irradiation area of the headlamp. The irradiation areas L1 and L2 are high-beam irradiation areas and preferably have a high contrast. Not only the irradiation area L1, but also the irradiation area L2 can be irradiated using the light-emitting device 100 of the present embodiment. Then, the light-emitting device 100 causes a part of the light-emitting elements 20 to emit light and causes the other light-emitting elements 20 to go out. Thereby, the light-emitting device 100 adjusts the intensity of the light from the headlamp according to the brightness of the irradiation areas L1 and L1. At this time, the contrast between the area 20a irradiated by the light-emitting light-emitting elements and the area 20b irradiated when the adjacent extinguished light-emitting elements emit light becomes high.

[0108] [Manufacturing method of light-emitting device]

[0109] Next, an example of the manufacturing method of the light-emitting device according to the first embodiment will be described.

[0110] Figure 3 It is a flowchart of the manufacturing method of the light-emitting device according to the first embodiment. Figure 4A It is a cross-sectional view showing the process of placing the light-emitting elements in the manufacturing method of the light-emitting device according to the first embodiment. Figure 4B It is a cross-sectional view showing the process of forming the frame in the manufacturing method of the light-emitting device according to the first embodiment. Figure 4C It is a cross-sectional view showing the process of filling the powder of the inorganic material in the manufacturing method of the light-emitting device according to the first embodiment. Figure 4D It is a cross-sectional view showing the process of impregnating the bonding material solution in the manufacturing method of the light-emitting device according to the first embodiment. Figure 4E It is a cross-sectional view showing the process of exposing the upper surface of the light-emitting element in the manufacturing method of the light-emitting device according to the first embodiment. Figure 4F It is a cross-sectional view showing the process of forming the light-transmissive member in the manufacturing method of the light-emitting device according to the first embodiment.

[0111] The manufacturing method of the light-emitting device 100 includes: a light-emitting element placement step S101, which is a step of placing a plurality of light-emitting elements 20 on the substrate 10; a frame formation step S102, which is a step of forming a frame 50 around the plurality of light-emitting elements 20; a covering member formation step S103, which is a step of forming a covering member 30 on the substrate 10 and between the light-emitting elements 20 to the position of the upper surface of the light-emitting elements 20; and a light-transmissive member formation step S104, which is a step of forming a light-transmissive member 40 above the plurality of light-emitting elements 20.

[0112] The covering member forming step S103 includes: a powder filling step S103a of filling powder of an inorganic material between the light-emitting elements 20 on the substrate 10; an adhesive material solution impregnation step S103b of impregnating the powder of the inorganic material with an adhesive material solution; and a light-emitting element upper surface exposure step S103c of polishing the powder of the inorganic material to expose the upper surface of the light-emitting element 20.

[0113] In addition, regarding the materials, arrangements, etc. of the respective members, as described in the description of the light-emitting device 100, the description is appropriately omitted here.

[0114] (Light-emitting element mounting step)

[0115] The light-emitting element mounting step S101 is a step of mounting a plurality of light-emitting elements 20 on the substrate 10.

[0116] The light-emitting element 20 has an electrode formation surface as a mounting surface and is flip-chip mounted on the wiring portion 3 on the upper surface of the substrate 10 through a conductive adhesive material 4.

[0117] (Frame forming step)

[0118] The frame forming step S102 is a step of forming a frame 50 around the plurality of light-emitting elements 20.

[0119] The frame 50 can be formed, for example, at a desired position on the substrate 10 at substantially the same height as the light-emitting element 20 by using a discharge device (resin discharge device) that can continuously discharge a liquid resin under air pressure (see Japanese Patent Application Laid-Open No. 2009-182307). The viscosity of the resin used in the frame 50 is adjusted in advance, and by overlapping it once or multiple times, it can be formed to a specified height or to a height higher than that of the light-emitting element 20. In addition, in this case, by grinding, polishing, or cutting the frame 50, etc., it can also be made to have the same height as the light-emitting element 20.

[0120] (Covering member forming step)

[0121] The covering member forming step S103 is a step of forming a covering member 30 between the light-emitting elements 20 on the substrate 10 up to the position of the upper surface of the light-emitting element 20. In addition, this step S103 is a step of forming a covering member 30 between the frame 50 and the light-emitting element 20.

[0122] This step S103 includes a powder filling step S103a, an adhesive material solution impregnation step S10b, and a light-emitting element upper surface exposure step S10c.

[0123] <Powder filling step>

[0124] The powder filling step S103a is a step of filling the powder 30a of the inorganic material on the substrate 10 and between the light-emitting elements 20. In addition, this step S103a is a step of filling the powder 30a of the inorganic material on the substrate 10 and between the frame 50 and the light-emitting elements 20.

[0125] In this step S103a, first, the powder 30a of the inorganic material is set above the position of the upper surface on the substrate 10 so as to cover the upper surface of the light-emitting element 20. Next, the plate-like member 5 is placed on the upper surface of the powder 30a, and the powder is compressed by the roller 6 via the plate-like member 5. As the plate-like member 5, for example, a glass plate, a metal plate, a ceramic plate, etc. can be cited. In addition, in addition to the roller 6, compression can also be performed by a device that uniformly applies pressure from the upper surface, such as a press.

[0126] <Adhesive material solution impregnation step>

[0127] The adhesive material solution impregnation step S103b is a step of impregnating the powder of the inorganic material with the adhesive material solution 30b.

[0128] In this step S103b, first, for example, the adhesive material solution 30b is dropped from above the powder 30a of the inorganic material over the whole. Next, for example, the adhesive material is cured under the conditions of 150 °C or higher and 200 °C or lower, and 4 hours or longer and 48 hours or shorter to cure the powder of the inorganic material. Thereby, the covering member 30 is formed. The amount of the adhesive material solution is not particularly limited as long as it is an amount capable of curing the powder of the inorganic material.

[0129] As the adhesive material solution, for example, a polysilazane solution as a glass solution can be cited. As the polysilazane solution, any solution can be used, for example, a commercially available glass solution can be used.

[0130] <Exposing step of the upper surface of the light-emitting element>

[0131] The exposing step of the upper surface of the light-emitting element S103c is a step of polishing the powder of the inorganic material to expose the upper surface of the light-emitting element 20.

[0132] In the process S103c, by grinding the upper surface of the powder of the inorganic material after impregnating and curing the adhesive material solution, a part of the covering member 30 is removed, and the covering member 30 covering the upper surface of the light-emitting element 20 is removed, so that the upper surface of the light-emitting element 20 is exposed. Thus, the upper surface of the covering member 30 and the upper surface of the light-emitting element 20 are formed on the same plane. In addition, when a part of the covering member 30 is removed to expose the upper surface of the light-emitting element 20, a part of the covering member 30 can also be removed by grinding, cutting, etc. In addition, when a part of the covering member 30 is removed, the substrate of the light-emitting element 20 can also be slightly ground, etc. In the frame forming process S102, when forming a frame 50 higher than the height of the light-emitting element 20, a part of the frame 50 can also be removed simultaneously with the removal of the covering member 30.

[0133] (Light-transmissive member forming process)

[0134] The light-transmissive member forming process S104 is a process of forming a light-transmissive member 40 above a plurality of light-emitting elements 20.

[0135] In this process S104, first, a resin of the light-transmissive member is disposed on a plurality of light-emitting elements 20 and on the frame 50 by pouring, spraying, etc. Next, for example, the resin is cured at a temperature of 120 °C or higher and 200 °C or lower to form the light-transmissive member 40.

[0136] <<Second Embodiment>>

[0137] [Light-emitting device]

[0138] Figure 5 is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the second embodiment.

[0139] The light-emitting device 100A includes: a substrate 10; a plurality of light-emitting elements 20 mounted on the substrate 10; a light-transmissive member 40A provided separately for each light-emitting element 20 above the plurality of light-emitting elements 20; and a covering member 30 provided on the substrate 10 and between the light-emitting elements 20 and between the light-transmissive members 40A up to the position of the upper surface of the light-transmissive member 40A. Moreover, the covering member 30 is a formed body including powder of an inorganic material and an adhesive material. Further, the light-emitting device 100A includes a frame 50A provided around the plurality of light-emitting elements 20 on the substrate 10. Moreover, the covering member 30 is provided between the frame 50A and the light-emitting element 20.

[0140] Hereinafter, regarding the light-emitting device 100A, mainly the parts different from the light-emitting device 100 will be described. In the light-emitting device 100A, the shape of the light-transmissive member 40A, the shape and height of the frame 50A, and the height formed by the covering member 30 are different from those of the light-emitting device 100.

[0141] In the light-emitting device 100A, the light-transmissive members 40A are provided separately for each light-emitting element 20.

[0142] The light-transmissive member 40A is, for example, a member formed of resin, glass, inorganic substances, etc. The light-transmissive members 40A are arranged for each light-emitting element 20.

[0143] The light-transmissive member 40A may also contain a wavelength conversion member. As the wavelength conversion member, for example, a phosphor can be cited. Examples of the light-transmissive member 40A containing a phosphor include members containing phosphor powder in a sintered body of phosphor, resin, glass, ceramic, or other inorganic substances, etc. In addition, the light-transmissive member 40A may contain a diffusion material, filler, etc. according to the purpose.

[0144] The light-transmissive member 40A has a lower surface wider than the upper surface of the light-emitting element 20. The distance between the light-transmissive members 40A is preferably 30 μm or less. If the distance between the light-transmissive members 40A is 30 μm or less, the light-emitting device 100A can reduce the dark portion between the light-emitting elements 20 (in this case, between the light-transmissive members 40A) compared to the case where the distance between the light-emitting elements 20 of the first embodiment is 50 μm, for example. The distance between the light-transmissive members 40A is more preferably 20 μm or less. If the distance between the light-transmissive members 40A is 20 μm or less, the light-emitting device 100A can further reduce the dark portion between the light-emitting elements 20 (in this case, between the light-transmissive members 40A). From the viewpoint of easy manufacturing, the distance between the light-transmissive members 40A is preferably 10 μm or more.

[0145] In the light-emitting device 100A, the covering member 30 is on the substrate 10 and is adjacently disposed between the light-emitting element 20 and the light-transmissive member 40A at a position having the same height as the upper surface of the light-transmissive member 40A. Further, the housing 50A has a substantially rectangular shape in a cross-sectional view and is formed at the same height as the light-transmissive member 40A. Further, the covering member 30 is on the substrate 10 and is disposed between the housing 50A, the light-emitting element 20, and the light-transmissive member 40A at a position having the same height as the upper surface of the light-transmissive member 40A. That is, the covering member 30 fills all of the spaces between the light-emitting elements 20 and between the light-transmissive members 40A, and also fills all of the spaces provided between the housing 50A, the light-emitting element 20, and the light-transmissive member 40A. Further, the upper surface of the covering member 30 of the light-emitting device 100A and the upper surface of the light-transmissive member 40A are formed in the same plane.

[0146] [Method for manufacturing a light-emitting device]

[0147] Next, an example of a method for manufacturing a light-emitting device according to the second embodiment will be described.

[0148] Figure 6 is a flowchart of a method for manufacturing a light-emitting device according to the second embodiment. Figure 7A is a cross-sectional view showing a process of preparing a substrate in the method for manufacturing a light-emitting device according to the second embodiment. Figure 7B is a cross-sectional view showing a process of forming a housing in the method for manufacturing a light-emitting device according to the second embodiment. Figure 7C is a cross-sectional view showing a process of filling powder of an inorganic material in the method for manufacturing a light-emitting device according to the second embodiment. Figure 7D is a cross-sectional view showing a process of impregnating a bonding material solution in the method for manufacturing a light-emitting device according to the second embodiment. Figure 7E is a cross-sectional view showing a process of exposing the upper surface of the light-transmissive member in the method for manufacturing a light-emitting device according to the second embodiment.

[0149] The method for manufacturing the light-emitting device 100A includes: a substrate preparation step S201 of preparing a substrate 10 on which a plurality of light-emitting elements 20 having a light-transmissive member 40A on the upper surface are placed; a housing formation step S202 of forming a housing 50A around the plurality of light-emitting elements 20; and a covering member formation step S203 of forming a covering member 30 on the substrate 10 and between the light-emitting elements 20 and between the light-transmissive members 40A up to the position of the upper surface of the light-transmissive member 40A.

[0150] The cover member forming step S203 includes: a powder filling step S203a of filling powder of an inorganic material between the light-emitting elements 20 and between the light-transmissive members 40A on the substrate 10; an adhesive material solution impregnation step S203b of impregnating the powder of the inorganic material with an adhesive material solution; and an upper surface exposure step S203c of polishing the powder of the inorganic material to expose the upper surface of the light-transmissive member 40A.

[0151] In addition, regarding the materials, arrangements, etc. of the respective members, as described in the description of the light-emitting device 100A as described above, the description is appropriately omitted here.

[0152] (Substrate preparation step)

[0153] The substrate preparation step S201 is a step of preparing a substrate 10 on which a plurality of light-emitting elements 20 having a light-transmissive member 40A above are placed.

[0154] In this step S201, first, for example, on the upper surface (light extraction surface side) of the light-emitting element 20, a light-transmissive member 40A having a specified shape is joined. When joining the light-transmissive member 40A to the light-emitting element 20, the joining can be performed by direct joining or via a light guide member. Next, a plurality of light-emitting elements 20 are placed on the substrate 10 such that the light-transmissive member 40A faces upward. The light-emitting element 20 has an electrode formation surface as a mounting surface and is flip-chip mounted on the upper surface of the wiring 3 on the substrate 10 by a conductive adhesive material 4.

[0155] However, in this step S201, for example, after placing the light-emitting element 20 on the substrate 10, the light-emitting element 20 and the light-transmissive member 40A may be joined.

[0156] (Frame formation step)

[0157] The frame formation step S202 is a step of forming a frame 50A around the plurality of light-emitting elements 20. The frame 50A is formed to a height higher than that of the light-transmissive member 40A, and other than that, is the same as the frame formation step S102. In addition, the frame 50A is formed to a specified height by overlapping the resin used for the frame 50A twice (refer to Figure 7B ).

[0158] (Cover member forming step)

[0159] The covering member forming step S203 is a step of forming a covering member 30 on the substrate 10 and up to the position of the upper surface of the light transmissive member 40A between the light emitting elements 20 and between the light transmissive members 40A. Further, this step S203 is a step of forming a covering member 30 between the housing 50A, the light emitting elements 20, and the light transmissive members 40A.

[0160] This step S203 includes a powder filling step S203a, an adhesive material solution impregnation step S203b, and a light transmissive member upper surface exposure step S203c.

[0161] <Powder filling step>

[0162] The powder filling step S203a is a step of filling the powder 30a of an inorganic material on the substrate 10 and between the light emitting elements 20 and between the light transmissive members 40A. Further, this step S203a is a step of filling the powder 30a of an inorganic material on the substrate 10 and between the housing 50A, the light emitting elements 20, and the light transmissive members 40A.

[0163] In this step S203a, first, on the substrate 10, the powder 30a of an inorganic material is set to a position higher than the upper surface position so as to cover the upper surface of the light transmissive member 40A. Next, a plate-like member 5 is placed on the upper surface of the powder 30a, and the powder is compressed by a roller 6 via the plate-like member 5. Further, in addition to the roller 6, compression may also be performed by a device that uniformly applies pressure from the upper surface, such as a press.

[0164] <Adhesive material solution impregnation step>

[0165] The adhesive material solution impregnation step S203b is the same as the above-described adhesive material solution impregnation step S103b.

[0166] <Light transmissive member upper surface exposure step>

[0167] The light transmissive member upper surface exposure step S203c is a step of polishing the powder of the inorganic material to expose the upper surfaces of the light transmissive member 40A and the housing 50A.

[0168] In this step S203c, a part of the covering member 30 is removed by grinding the upper surface of the powder of the inorganic material after impregnating and curing the adhesive material solution, and the covering member 30 covering the upper surface of the light-transmissive member 40A is removed, so that the upper surface of the light-transmissive member 40A is exposed. Further, in this step S203c, when removing a part of the covering member 30, the covering member 30 covering the upper surface of the frame body 50A is removed, and a part of the frame body 50A is removed, so that the upper surface of the frame body 50A is exposed. Thus, the upper surface of the covering member 30, the upper surface of the light-transmissive member 40A, and the upper surface of the frame body 50A are formed on the same plane. In addition, when removing a part of the covering member 30 to expose the upper surface of the light-transmissive member 40A and the upper surface of the frame body 50A, a part of the covering member 30 may also be removed by grinding, cutting, etc.

[0169] <<Third Embodiment>>

[0170] [Light-emitting Device]

[0171] Figure 8A It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the third embodiment.

[0172] Hereinafter, regarding the light-emitting device 100B, mainly the parts different from the light-emitting device 100 will be described. In the light-emitting device 100B, a light-transmissive member 40B including a transparent member 41 and a wavelength conversion member layer 42 is provided on the light extraction surface of the light-emitting element 20, which is different from the light-emitting device 100.

[0173] The light-transmissive member 40B is a member having a wavelength conversion member layer 42 on the lower surface of the transparent member 41. As the transparent member 41, for example, molded bodies such as resins, glass, and ceramics can be cited. As the wavelength conversion member layer 42, for example, a resin layer containing a phosphor can be cited.

[0174] In the light-emitting device 100B, the light-transmissive member 40B is joined to the light extraction surface of the light-emitting element 20 and is provided separately for each light-emitting element 20.

[0175] [Manufacturing Method of Light-emitting Device]

[0176] Next, an example of the manufacturing method of the light-emitting device according to the third embodiment will be described.

[0177] The light-emitting device 100B can be manufactured by forming the light-transmissive member 40B in the light-transmissive member forming step S104 in the manufacturing method of the light-emitting device 100, so that the wavelength conversion member layer 42 is located on the light-emitting element 20 side. At this time, the light-transmissive member 40B can be formed by arranging the light-transmissive member 40B with a specified shape for each light-emitting element 20. In addition, the light-transmissive member 40B is formed by continuously arranging one light-transmissive member 40B to cover the entire upper surface of the plurality of light-emitting elements 20 and then cutting it separately for each light-emitting element 20, so that it can be arranged for each light-emitting element 20.

[0178] In addition, a resin containing a reflective material may be provided between the light-transmissive members 40B.

[0179] <<Fourth Embodiment>>

[0180] [Light-Emitting Device]

[0181] Figure 8B FIG. is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the fourth embodiment.

[0182] Hereinafter, regarding the light-emitting device 100C, mainly the parts different from the light-emitting device 100A will be described. In the light-emitting device 100C, the light-transmissive member 40B including the transparent member 41 and the wavelength conversion member layer 42 is provided on the light extraction surface of the light-emitting element 20, which is different from the light-emitting device 100A.

[0183] [Manufacturing Method of Light-Emitting Device]

[0184] Next, an example of the manufacturing method of the light-emitting device according to the fourth embodiment will be described.

[0185] The light-emitting device 100C can be manufactured by preparing, in the substrate preparation step S201 in the manufacturing method of the light-emitting device 100A, a substrate 10 on which a plurality of light-emitting elements 20 are placed, and the light-transmissive member 40B is provided so as to have the wavelength conversion member layer 42 on the light-emitting element 20 side.

[0186] <<Fifth Embodiment>>

[0187] [Light-Emitting Device]

[0188] Figure 8C FIG. is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the fifth embodiment.

[0189] Hereinafter, regarding the light-emitting device 100D, mainly the parts different from the light-emitting device 100 will be described. In the light-emitting device 100D, the light-transmissive member 40 is separated for each light-emitting element 20, and the resin 70 is provided on the covering member 30 between the light-transmissive members 40 and between the frame 50 and the light-emitting element 20, which is different from the light-emitting device 100. In addition, in the light-emitting device 100D, the light-transmissive member 40C having the light-transmissive member 40 and the transparent member 41 is provided on the light-extracting surface of the light-emitting element 20, which is different from the light-emitting device 100.

[0190] The light-transmissive member 40C is a member having the transparent member 41 on the light-transmissive member 40. In the light-emitting device 100D, the light-transmissive member 40 is provided separately for each light-emitting element 20, and a resin 70 containing a reflective material is provided between the light-transmissive members 40. In addition, the frame 50 is formed at the same height as the light-transmissive member 40, and a resin 70 containing a reflective material is provided on the covering member 30 between the frame 50 and the light-emitting element 20. Moreover, the light-emitting devices 100D are continuously arranged so that the transparent member 41 covers the entire upper surface of the plurality of light-transmissive members 40. Additionally, the resin 70 may not be provided in the light-emitting device.

[0191] [Manufacturing method of light-emitting device]

[0192] Next, an example of the manufacturing method of the light-emitting device according to the fifth embodiment will be described.

[0193] Figure 9 It is a flowchart of the manufacturing method of the light-emitting device according to the fifth embodiment.

[0194] In the manufacturing method of the light-emitting device 100D, first, in the light-transmissive member forming step S104, the light-transmissive member 40 is formed on the plurality of light-emitting elements 20. Next, in the light-transmissive member cutting step S105, the light-transmissive member is cut into pieces separated for each light-emitting element 20. Next, in the resin arranging step S106, the resin 70 containing a reflective material is provided on the covering member 30 between the light-transmissive members 40 and between the frame 50 and the light-emitting element 20, at a position higher than the upper surface of the light-transmissive member 40, and the surface of the light-transmissive member 40 and the surface of the resin 70 are flattened by grinding, polishing, etc. Then, in the transparent member forming step S107, the transparent member 41 is arranged on the upper surface of the light-transmissive member 40. The resin 70 may also be the covering member 30. In this case, the forming method of the covering member 30 arranged in place of the resin 70 can use the forming method according to the aforementioned covering member forming step S103.

[0195] <<Sixth Embodiment>>

[0196] Light-emitting device

[0197] Figure 10 It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the sixth embodiment.

[0198] The light-emitting device 100E includes: a substrate 10; a plurality of light-emitting elements 20 mounted on the substrate 10; a covering member 30A disposed on the substrate 10 and at a position above the upper surfaces of the light-emitting elements 20 between the light-emitting elements 20; and a light-transmissive member 40 disposed above the plurality of light-emitting elements 20. Moreover, the covering member 30A is a formed body of TiO2 powder.

[0199] Furthermore, the light-emitting device 100 has a frame 50 disposed around the plurality of light-emitting elements 20 on the substrate 10. Moreover, the covering member 30A is disposed between the frame 50 and the light-emitting elements 20.

[0200] Hereinafter, regarding the light-emitting device 100E, mainly the parts different from the light-emitting device 100 will be described. In the light-emitting device 100E, the covering member 30A being a formed body of TiO2 powder is different from the light-emitting device 100. That is, in the light-emitting device 100E, the covering member 30A is formed by compressing TiO2 powder and is composed only of TiO2. However, when the light-transmissive member 40 is provided by pouring, there is a case where the resin of the light-transmissive member impregnates the covering member 30A. That is, the covering member 30A is a formed body of TiO2 powder, and in addition to the covering member 30A being composed only of TiO2, it also includes a substance impregnated with the resin of the light-transmissive member.

[0201] By using such a covering member 30A, the same effect as that of the light-emitting device 100 can also be obtained, and the contrast of the light-emitting device 100E becomes excellent. In addition, the brightness of the light-emitting device 100E becomes high.

[0202] Manufacturing method of light-emitting device

[0203] Next, an example of the manufacturing method of the light-emitting device according to the sixth embodiment will be described.

[0204] Figure 11 It is a flowchart of the manufacturing method of the light-emitting device according to the sixth embodiment.

[0205] The manufacturing method of the light-emitting device 100E includes: a light-emitting element mounting step S101 of mounting a plurality of light-emitting elements 20 on a substrate 10; a frame forming step S102 of forming a frame 50 around the plurality of light-emitting elements 20; a covering member forming step S103A of forming a covering member 30 on the substrate 10 and between the light-emitting elements 20 up to the position of the upper surface of the light-emitting elements 20; and a light-transmissive member forming step S104 of forming a light-transmissive member 40 above the plurality of light-emitting elements 20.

[0206] The covering member forming step S103A includes: a powder filling step S103a of filling TiO2 powder on the substrate 10 and between the light-emitting elements 20; and a light-emitting element upper surface exposing step S103c of removing a part of the TiO2 powder and exposing the upper surface of the light-emitting element 20.

[0207] In the powder filling step S103a of the covering member forming step S103A of the light-emitting device 100E, TiO2 powder is used as the powder of the inorganic material. In addition, the adhesive material solution impregnation step S103b is not performed, and the adhesive material solution 30b is not impregnated into the TiO2 powder. Further, in the light-emitting element upper surface exposing step S103c, the TiO2 powder in which the powder is compressed is wiped with, for example, a cotton swab, cloth, etc., and a part of the TiO2 powder, that is, a part of the covering member 30A is removed to expose the upper surface of the light-emitting element 20. Additionally, when a part of the covering member 30A is removed to expose the upper surface of the light-emitting element 20, a part of the covering member 30A may also be removed by grinding, grinding, cutting, etc.

[0208] Other matters are the same as those in the manufacturing method of the light-emitting device 100.

[0209] <<Embodiment 7>>

[0210] [Light-emitting device]

[0211] Figure 12 It is a cross-sectional view schematically showing a part of the structure of the light-emitting device according to the 7th embodiment.

[0212] The light-emitting device 100F includes: a substrate 10; a plurality of light-emitting elements 20 mounted on the substrate 10; a light-transmissive member 40A disposed separately for each light-emitting element 20 above the plurality of light-emitting elements 20; and a covering member 30A disposed on the substrate 10 and up to the upper surface position of the light-transmissive member 40A between the light-emitting elements 20 and between the light-transmissive members 40A. Moreover, the covering member 30A is a formed body including TiO2 powder. Further, the light-emitting device 100F has a frame 50A disposed around the plurality of light-emitting elements 20 on the substrate 10. Moreover, the covering member 30A is disposed between the frame 50A and the light-emitting elements 20. Further, the light-emitting device 100F has a coating 80 on the upper surfaces of the frame 50A, the covering member 30A, and the light-transmissive member 40A.

[0213] Hereinafter, regarding the light-emitting device 100F, the parts different from the light-emitting device 100A will be mainly described. In the light-emitting device 100F, the covering member 30A is different from the light-emitting device 100A in that it is a formed body of TiO2 powder. That is, in the light-emitting device 100F, the covering member 30A is formed by compressing TiO2 powder and is composed only of TiO2.

[0214] By using such a covering member 30A, the same effect as that of the light-emitting device 100A can be obtained, and the contrast of the light-emitting device 100F becomes excellent. In addition, the brightness of the light-emitting device 100F becomes high.

[0215] In addition, in the light-emitting device 100F, the coating 80 is provided, which is different from the light-emitting device 100A. By including the coating 80, the light-emitting device 100F can prevent the TiO2 powder forming the covering member 30A from falling from the upper surface of the light-emitting device. The thickness of the coating 80 is, for example, 3 μm or more and 10 μm or less.

[0216] The coating 80 can be formed of a resin that transmits light, for example. As the resin material for the coating 80, for example, thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin can be cited.

[0217] [Manufacturing method of light-emitting device]

[0218] Next, an example of the manufacturing method of the light-emitting device according to the seventh embodiment will be described.

[0219] Figure 13 It is a flowchart of the manufacturing method of the light-emitting device according to the seventh embodiment.

[0220] The manufacturing method of the light-emitting device 100F includes: a substrate preparation step S201, which is a step of preparing a substrate 10 on which a plurality of light-emitting elements 20 having a light-transmissive member 40A on the upper surface are placed; a frame forming step S202, which is a step of forming a frame 50A around the plurality of light-emitting elements 20; a covering member forming step S203A, which is a step of forming a covering member 30A on the substrate 10 and between the light-emitting elements 20 and between the light-transmissive members 40A up to the position of the upper surface of the light-transmissive member 40A; and a coating forming step S204, which is a step of forming a coating 80 on the upper surfaces of the frame 50A, the covering member 30A, and the light-transmissive member 40A.

[0221] The covering member forming step S203A includes: a powder filling step S203a, which is a step of filling TiO2 powder on the substrate 10 and between the light-emitting elements 20 and between the light-transmissive members 40A; and a light-transmissive member upper surface exposing step S203c, which is a step of removing a part of the TiO2 powder and exposing the upper surface of the light-transmissive member 40A.

[0222] In the powder filling step S203a of the covering member forming step S203A of the light-emitting device 100F, TiO2 powder is used as the powder of the inorganic material. In addition, the adhesive material solution impregnation step S203b is not performed, and the adhesive material solution 30b is not impregnated into the TiO2 powder. Moreover, in the light-transmissive member upper surface exposing step S203c, the compressed TiO2 powder is wiped with, for example, a cotton swab, cloth, etc., and a part of the TiO2 powder, that is, a part of the covering member 30A, is removed to expose the upper surface of the light-transmissive member 40A. At this time, the covering member 30A covering the upper surface of the frame 50A is removed by wiping, grinding, grinding, cutting, etc. with a cotton swab, cloth, etc., and a part of the frame 50A is removed by grinding, grinding, cutting, etc. to expose the upper surface of the frame 50A. In addition, when a part of the covering member 30A is removed to expose the upper surface of the light-transmissive member 40A, a part of the covering member 30A can also be removed by grinding, grinding, cutting, etc.

[0223] The coating forming step S204 is a step of forming a coating 80 on the upper surfaces of the frame 50A, the covering member 30A, and the light-transmissive member 40A.

[0224] In this step S204, for example, the coating 80 is formed by coating using spraying, pasting a resin sheet, etc.

[0225] Other matters are the same as those of the manufacturing method of the light-emitting device 100A.

[0226] In addition, similarly in the embodiments of the light-emitting devices 100B, 100C, and 100D, it is also possible to use a molded body of TiO2 powder, i.e., the covering member 30A. In this case, similarly in the embodiments of the light-emitting devices 100B and 100C, it is also possible to include the coating 80. In these cases, the light-emitting devices can be manufactured according to the manufacturing methods described for the light-emitting devices 100E and 100F.

[0227] 《Other Embodiments》

[0228] The light-emitting devices described above have a housing, but they may not have a housing.

[0229] In addition, the light-emitting device 100F has the coating 80, but it may not have the coating 80. However, the coating 80 is preferably provided at least on the upper surface of the covering member 30A.

[0230] In addition, the light-emitting devices 100 and 100E use the light-transmissive member 40, but it is also possible to continuously arrange one light-transmissive member 40A after forming the covering members 30 and 30A so as to cover the entire upper surface of the plurality of light-emitting elements 20.

[0231] In addition, the light-emitting devices 100B and 100F use the light-transmissive member 40B having the wavelength conversion member layer 42 on the lower surface of the transparent member 41, but it is also possible to use the light-transmissive member 40 or the light-transmissive member 40A instead of the light-transmissive member 40B. When using the light-transmissive member 40, after forming the light-transmissive member 40 in the manufacturing method of the light-emitting devices 100 and 100F, the surface of the light-transmissive member 40 is flattened by grinding, polishing, etc., and then cut separately for each light-emitting element 20. When using the light-transmissive member 40A, in the manufacturing method of the light-emitting devices 100 and 100F, after forming the covering members 30 and 30A, the light-transmissive member 40A having a specified shape is arranged for each light-emitting element 20. Alternatively, when using the light-transmissive member 40A, one light-transmissive member 40A is continuously arranged so as to cover the entire upper surface of the plurality of light-emitting elements 20, and then cut separately for each light-emitting element 20, whereby the light-transmissive member 40A is arranged for each light-emitting element 20.

[0232] In addition, in the light-emitting device 100B, the light-transmissive members 40B may be continuously arranged so as to cover the entire upper surface of the plurality of light-emitting elements 20. In addition, in the light-emitting device 100D, the light-transmissive member 40 may be continuously arranged so as to cover the entire upper surface of the plurality of light-emitting elements 20.

[0233] In addition, the manufacturing method of the light-emitting device may also include other processes between or before and after these processes, as long as it does not have an adverse effect on each process. For example, it may include a foreign matter removal process for removing foreign matters mixed in during the manufacturing process, etc.

[0234] In addition, in the manufacturing method of the light-emitting device, the order of some processes is not limited, and the order can also be reversed. For example, in the manufacturing method of the light-emitting device described above, a frame is formed after placing the light-emitting element on the substrate, but the process of forming the frame can also be carried out before placing the light-emitting element.

[0235] As described above, the light-emitting device and the manufacturing method of the light-emitting device have been specifically described by way of specific embodiments. However, the gist of the present invention is not limited to these descriptions and must be broadly interpreted based on the descriptions in the claims. In addition, various changes and modifications based on these descriptions are also included in the gist of the present invention.

[0236] [Embodiment]

[0237] Hereinafter, the embodiments will be described.

[0238] [Embodiment]

[0239] As follows, a light-emitting device of the type according to the manufacturing method of the first embodiment was fabricated. Figure 1A to Figure 1D of the type.

[0240] Aluminum nitride was used for the substrate, and Cu was used for the wiring portion. The size of the substrate was 40 mm × 10 mm. TiO2 was used for the inorganic material of the covering member, and a glass solution (polysilazane solution) was used for the adhesive material solution. The amount of the adhesive material solution was 10 μl with respect to 4.5 g of the inorganic material. A member containing YAG phosphor with a particle size of 16 μm in silicone resin was used for the light-transmissive member. A frame containing TiO2 as a light-reflecting material in silicone resin was used for the frame. The size of the light-emitting element was 600 μm × 600 μm, and the distance between the light-emitting elements was 50 μm.

[0241] [Comparative Example]

[0242] A light-emitting device identical to the light-emitting device of the above embodiment was fabricated, except that a covering member containing TiO2 in silicone resin was used.

[0243] The content of TiO2 in the covering member was 60% by mass ratio with respect to the resin.

[0244] Regarding these light-emitting devices, a pulsed current of 350 mA was passed through each light-emitting element, and the contrast ratio (blue) and the contrast ratio (white) were evaluated, and the average luminance (cd / mm 2 ) was measured.

[0245] The contrast is evaluated by measuring the emission luminance of the front light. In addition, the contrast (blue) is the contrast before the light transmissive member is provided, and the contrast (white) is the contrast after the light transmissive member is provided.

[0246] The average luminance is the emission luminance of the front light within the range of 70% of the light emitting region.

[0247] As a result, the contrast (blue) of the light emitting device of the example is 333:1, the contrast (white) is 134:1, and the average luminance is 95.6 (cd / mm 2 ). On the other hand, the contrast (blue) of the light emitting device of the comparative example is 174:1, the contrast (white) is 64:1, and the average luminance is 93.8 (cd / mm 2 ).

[0248] From this result, it can be seen that the light emitting device according to the embodiment of the present application has high luminance and excellent contrast.

[0249] -Industrial Applicability-

[0250] The light emitting device according to the embodiment of the present disclosure can be used for a light distribution variable type headlight light source. In addition, the light emitting device according to the embodiment of the present disclosure can be used for a backlight light source of a liquid crystal display, various lighting fixtures, large displays, advertisements, various display devices such as destination guides, and image reading devices, projector devices, etc. in digital cameras, fax machines, copiers, scanners, etc.

Claims

1. A light-emitting device, comprising: A substrate; A plurality of light-emitting elements mounted on the substrate; A covering member disposed on the substrate and at a position on the upper surface of the light-emitting elements between the light-emitting elements; And A light-transmissive member disposed above the plurality of light-emitting elements, The covering member is a molded body including a powder of an inorganic material and an adhesive material, The content of the inorganic material is less than 100% by mass with respect to the entire covering member, The content of the adhesive material is more than 0% by mass with respect to the entire covering member.

2. A light-emitting device, comprising: A substrate; A plurality of light-emitting elements mounted on the substrate; A light-transmissive member separately disposed above each of the plurality of light-emitting elements; and A covering member disposed on the substrate and at a position on the upper surface of the light-transmissive member between the light-emitting elements and between the light-transmissive members, The covering member is a molded body including a powder of an inorganic material and an adhesive material, The content of the inorganic material is less than 100% by mass with respect to the entire covering member, The content of the adhesive material is more than 0% by mass with respect to the entire covering member.

3. The light-emitting device according to claim 1 or 2, wherein The inorganic material is at least one of TiO2, BN, SiO2, and Al2O3.

4. The light-emitting device according to claim 1 or 2, wherein The adhesive material is polysilazane.

5. A light-emitting device, comprising: A substrate; A plurality of light-emitting elements mounted on the substrate; A covering member disposed on the substrate and at a position on the upper surface of the light-emitting elements between the light-emitting elements; And A light-transmissive member disposed above the plurality of light-emitting elements, The covering member is a molded body of TiO2 powder.

6. A light-emitting device, comprising: A substrate; A plurality of light-emitting elements mounted on the substrate; A light-transmissive member separately disposed above each of the plurality of light-emitting elements; And A covering member disposed on the substrate and at a position on the upper surface of the light-transmissive member between the light-emitting elements and between the light-transmissive members, The covering member is a molded body of TiO2 powder.

7. The light-emitting device according to any one of claims 1 to 2, 5 to 6, wherein The light-transmissive member is a member having a wavelength conversion member layer on the lower surface of a transparent member.

8. The light-emitting device according to any one of claims 1 to 2, 5 to 6, wherein The light-transmissive member contains a wavelength conversion member.

9. The light-emitting device according to any one of claims 1 to 2, 5 to 6, wherein The distance between the light-emitting elements is 70 μm or less.

10. The light-emitting device according to any one of claims 1 to 2, 5 to 6, wherein A frame is provided on the substrate around the plurality of light-emitting elements, The covering member is provided between the frame and the light-emitting elements.

11. The light-emitting device according to claim 10, wherein The distance between the frame and the light-emitting elements is 200 μm or less.

12. A method for manufacturing a light-emitting device, comprising: a step of placing a plurality of light-emitting elements on a substrate; a step of forming a covering member on the substrate and between the light-emitting elements up to a position covering the upper surface of the light-emitting elements; and a step of forming a light-transmissive member above the plurality of light-emitting elements, The step of forming the covering member includes: a step of filling powder of an inorganic material on the substrate and between the light-emitting elements; a step of impregnating the powder of the inorganic material with a bonding material solution; and a step of exposing the upper surface of the light-emitting elements.

13. The method for manufacturing a light-emitting device according to claim 12, wherein, in the step of forming the covering member, the powder of the inorganic material is disposed above the position of the upper surface of the light-emitting elements, and after impregnating the powder of the inorganic material with the bonding material solution, the powder of the inorganic material is polished to expose the upper surface of the light-emitting elements.

14. The method for manufacturing a light-emitting device according to claim 12 or 13, wherein, the light-transmissive member is a member having a wavelength conversion member layer on the lower surface of a transparent member, in the step of forming the light-transmissive member, the light-transmissive member is formed such that the wavelength conversion member layer is located on the light-emitting element side.

15. A method for manufacturing a light-emitting device, comprising: a step of preparing a substrate on which a plurality of light-emitting elements are placed, the light-emitting elements having a light-transmissive member above; and a step of forming a covering member on the substrate and between the light-emitting elements and between the light-transmissive members up to a position covering the upper surface of the light-transmissive members, The step of forming the covering member includes: a step of filling powder of an inorganic material on the substrate and between the light-emitting elements and between the light-transmissive members; a step of impregnating the powder of the inorganic material with a bonding material solution; and a step of exposing the upper surface of the light-transmissive members.

16. The method for manufacturing a light-emitting device according to claim 15, wherein, in the step of forming the covering member, the powder of the inorganic material is disposed above the position of the upper surface of the light-transmissive members, and after impregnating the powder of the inorganic material with the bonding material solution, the powder of the inorganic material is polished to expose the upper surface of the light-transmissive members.

17. The method for manufacturing a light-emitting device according to claim 15 or 16, wherein, the light-transmissive member is a member having a wavelength conversion member layer on the lower surface of a transparent member, in the step of preparing the substrate, a substrate on which a plurality of the light-emitting elements are placed is prepared such that the wavelength conversion member layer is on the light-emitting element side, and the light-transmissive member is provided to the light-emitting elements.

18. The method for manufacturing a light-emitting device according to any one of claims 12 to 13, 15 to 16, wherein, the light-transmissive member contains a wavelength conversion member.

19. The method for manufacturing a light-emitting device according to any one of claims 12 to 13, 15 to 16, wherein, The inorganic material is at least one of TiO2, BN, SiO2, and Al2O3.

20. The method for manufacturing a light-emitting device according to any one of claims 12 to 13, 15 to 16, wherein, The bonding material solution is a polysilazane solution.

21. A method for manufacturing a light-emitting device, comprising: A step of placing a plurality of light-emitting elements on a substrate; A step of forming a covering member on the substrate and between the light-emitting elements to a position covering the upper surface of the light-emitting elements; And A step of forming a light-transmissive member above the plurality of light-emitting elements, The step of forming the covering member includes: a step of filling a powder of TiO2 on the substrate and between the light-emitting elements; And a step of removing a part of the powder of TiO2 and exposing the upper surface of the light-emitting element.

22. A method for manufacturing a light-emitting device, comprising: A step of preparing a substrate on which a plurality of light-emitting elements are placed, the light-emitting elements having a light-transmissive member above; And A step of forming a covering member on the substrate and between the light-emitting elements and between the light-transmissive members to a position covering the upper surface of the light-transmissive members, The step of forming the covering member includes: a step of filling a powder of TiO2 on the substrate and between the light-emitting elements and between the light-transmissive members; And a step of removing a part of the powder of TiO2 and exposing the upper surface of the light-transmissive member.

23. The method for manufacturing a light-emitting device according to any one of claims 12 to 13, 15 to 16, 21 to 22, wherein, After placing the plurality of light-emitting elements on the substrate and before the step of forming the covering member, the method for manufacturing the light-emitting device includes a step of forming a frame around the plurality of light-emitting elements, The covering member is formed between the frame and the light-emitting elements.

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