Motor, camera module and electronic device

Abstract

The application relates to the motor technical field, in particular to a motor, a camera module and electronic equipment. The motor is used for being installed on a support, the motor comprises a fixed component and a carrier component, the fixed component is bonded with the support, the fixed component comprises a first anti-chipping part and a first bonding part, the first anti-chipping part is close to the carrier component, and the first bonding part is close to the support. The motor can avoid or reduce the generation of chippings of the fixed component in the collision process, and can also guarantee the stable connection of the fixed component and other components.

Description

Technical Field

[0001] This invention relates to the field of motor technology, and more particularly to a motor, a camera module, and an electronic device. Background Technology

[0002] A motor is a device that converts electrical energy into mechanical energy. As an important component of a camera module, it is mainly used to enable the camera module to perform autofocus in electronic devices.

[0003] Current motors have the following main problems: First, the motor's mounting and carrier components are prone to generating debris during operation or reliability testing. This debris falls into the optical path of the camera module, forming black spots and blemishes, affecting the imaging effect. Second, the motor's mounting components are prone to poor adhesion when bonded to other components of the camera module, preventing the camera module from taking pictures. Therefore, it is necessary to improve the existing mounting components to solve these problems. Summary of the Invention

[0004] This application discloses a motor, a camera module, and an electronic device. By improving the fixing component, it solves the problem of debris generated by the motor during operation or reliability testing, and also ensures a reliable bond between the fixing component and other components of the camera module.

[0005] To achieve the above objectives, in a first aspect, embodiments of this application disclose a motor for mounting on a bracket. The motor includes a fixing component and a carrier component. The fixing component is bonded to the bracket. The fixing component includes a first anti-chipping portion and a first adhesive portion. The first anti-chipping portion is close to the carrier component, and the first adhesive portion is close to the bracket.

[0006] In this embodiment, the fixing component in the motor is improved. The fixing component with a single overall structural property in the related technology is improved into a base with two different properties: a first anti-chipping part and a first adhesive part. This allows the fixing component to meet the requirements of impact resistance and anti-chipping, as well as easy adhesion. This solves the problem that fixing components made of a single material in the related technology can only have good characteristics in one aspect and cannot meet different performance requirements. As a result, the performance of the entire motor is optimized.

[0007] Furthermore, the first adhesive portion and the first anti-chipping portion are integrally formed to constitute the fixing component.

[0008] The fixing component adopts an integral molding structure of the first adhesive part and the first anti-chipping part. On the one hand, it is conducive to making the assembly of the fixing component with the carrier component, bracket, etc. more convenient and improving the assembly efficiency; on the other hand, it can also avoid the tolerance problem when assembling a large number of parts, making the assembly more accurate; and it is also conducive to improving the overall structural strength of the fixing component, so that the first adhesive part and the first anti-chipping part can form a more tightly formed, structurally stable and reliable fixing component.

[0009] Furthermore, the first adhesive portion and the first anti-chipping portion are separate structures, and the first adhesive portion and the first anti-chipping portion are fixedly connected to form the fixing component.

[0010] When the first adhesive part and the second anti-chipping part are separate structures, a fixed component can still be obtained through the fixed connection between the two. Using the above structure facilitates the separate production and processing of the first adhesive part and the first anti-chipping part.

[0011] Furthermore, the motor also includes a drive member, and the carrier component is located inside or above the first anti-chipping part, the drive member being used to drive the carrier component to move relative to the first anti-chipping part.

[0012] In the fixed component, the part used to move relative to the carrier component and impact is the first anti-chipping part, which has good impact resistance and anti-chipping function, thus avoiding or reducing the debris generated by the fixed component during the impact.

[0013] Furthermore, the first adhesive portion is located on the side of the first anti-chipping portion away from the carrier component, and there is a gap between the first adhesive portion and the carrier component, and the first adhesive portion is fixedly bonded to the bracket.

[0014] In the fixing component, the first adhesive part is used for fixing and bonding with the bracket. It has a good adhesive effect, so the fixing component and the bracket can be firmly bonded by the first adhesive part and the bracket.

[0015] Furthermore, the first anti-chipping part is made of a liquid crystal polymer material with low or no chipping.

[0016] When using liquid crystal polymer materials with low or no chipping, the high structural strength of the first anti-chipping part can be utilized to make it less likely for the carrier component to generate chips during the movement of the carrier component relative to the first anti-chipping part made of such material, especially during the impact of the carrier component on the first anti-chipping part in reliability tests. This avoids problems caused by chipping that affect the imaging effect of the camera module.

[0017] Preferably, the first anti-chipping part is made of a liquid crystal polymer material of type LCP-96AC.

[0018] The liquid crystal polymer material with model number LCP-96AC has high structural strength and exhibits excellent anti-chipping properties. Therefore, when the carrier component moves relative to the first anti-chipping part or when the carrier component collides with the first anti-chipping part, no chips will be generated.

[0019] Furthermore, a protruding elastic member is provided on the surface of the first anti-chipping part facing the carrier component, and the carrier component contacts the elastic member when it moves toward the first anti-chipping part.

[0020] By providing an elastic member on the surface of the first anti-chipping part toward the carrier component, the force exerted when the carrier component moves toward the first anti-chipping part, especially when the carrier component collides with the first anti-chipping part, can be buffered, which helps to further avoid chipping problems caused by the collision between the two.

[0021] Furthermore, the first adhesive part is made of a liquid crystal polymer material with model number LCP-529B.

[0022] The liquid crystal polymer material, model LCP-529B, has excellent adhesive properties. When it is bonded and fixed to the bracket in the camera module, it can be firmly and reliably bonded to the bracket, ensuring the stability of the structure.

[0023] Furthermore, the first adhesive portion is a substrate connected to the first anti-chip portion. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface faces the carrier component, and the second surface is fixedly bonded to the bracket. The second surface is provided with a plurality of protrusions in the direction facing the bracket, so that the second surface forms an uneven surface. The surface of the bracket fixedly bonded to the second surface is formed to match the second surface.

[0024] In this embodiment, the first adhesive part is a substrate connected to the first anti-chipping part. The second surface of the substrate that is fixedly bonded to the bracket is set as an uneven surface. The surface of the bracket that is fixedly bonded to the second surface also matches the shape of the second surface. Thus, through the improvement of the uneven structure, the contact area between the second surface and the bracket is increased, so that the two have a larger fixed bonding area and the bonding stability is improved.

[0025] Furthermore, the substrate has an opening in the middle, and the outer edge of the opening extends toward the carrier component to form a closed baffle, with the carrier component disposed near the baffle on the side away from the opening.

[0026] In this embodiment, a baffle is provided at the outer edge of the opening on the substrate, facing the carrier component, to block the carrier component from entering the opening. This design ensures that even if the fixing component generates a small amount of debris due to a collision with the carrier component, this debris will not fall into the opening, thus effectively preventing debris from entering the optical path of the camera module.

[0027] Furthermore, an inclined chip removal groove is provided on the first surface of the substrate, and the chip removal groove is inclined from high to low in the direction from the baffle toward the outer edge of the substrate.

[0028] In this embodiment of the application, by setting an inclined chip removal groove, a small amount of debris generated on the fixed component can be removed in time, so as to prevent the accumulation of debris.

[0029] Furthermore, the motor is also used to drive the object to be driven to move. The carrier component is bonded to the object to be driven. The carrier component includes a second bonding part and a second anti-chipping part. The second bonding part is close to the object to be driven, and the second anti-chipping part is close to the fixing component.

[0030] In this embodiment, the carrier component in the motor is also improved. The carrier component with a single overall structural property in the related technology is improved into a carrier with two different properties: a second anti-chipping part and a second adhesive part. This allows the carrier component to meet the requirements of impact resistance and anti-chipping, as well as the requirement of easy adhesion. This solves the problem that carrier components made of a single material in the related technology can only have good characteristics in one aspect and cannot meet different performance requirements. Ultimately, the performance of the entire motor is improved and optimized.

[0031] Furthermore, the second adhesive portion and the second anti-chipping portion are integrally formed to constitute the carrier component, or the second adhesive portion and the second anti-chipping portion are separate structures, and the second adhesive portion and the second anti-chipping portion are fixedly connected to constitute the carrier component.

[0032] The carrier component adopts an integral molding structure for the second adhesive part and the second anti-chipping part. This design facilitates easier assembly of the carrier component with the fixed part and the object to be driven, improving assembly efficiency. It also avoids tolerance issues that arise when assembling multiple parts, resulting in more accurate assembly. Furthermore, it enhances the overall structural strength of the carrier component, allowing the second adhesive part and the second anti-chipping part to form a more tightly bonded, stable, and reliable structure. Alternatively, even when the second adhesive part and the second anti-chipping part are separate structures, the carrier component can still be obtained through their fixed connection. This structure also facilitates the separate manufacturing and processing of the second adhesive part and the second anti-chipping part.

[0033] Furthermore, the second anti-chipping portion is located inside or above the first anti-chipping portion, and the second anti-chipping portion is movable relative to the first anti-chipping portion.

[0034] In the carrier component, the part used for relative movement and impact with the fixed component is the second anti-chipping part. Because it has good impact resistance and anti-chipping properties, it can avoid or reduce the debris generated during the impact between the carrier component and the fixed component. In particular, since the fixed component and the carrier component each have a first anti-chipping part and a second anti-chipping part respectively, the second anti-chipping part can better prevent chipping when it impacts or collides with the first anti-chipping part.

[0035] Furthermore, the second anti-chipping portion is located inside or above the first anti-chipping portion, and the second anti-chipping portion is movable relative to the first anti-chipping portion.

[0036] In the carrier component, the second adhesive part is used to fix and bond with the object to be driven. It has a good adhesive effect, so the reliable bonding between the carrier component and the object to be driven can ensure a stable bond.

[0037] Furthermore, the second adhesive part is made of liquid crystal polymer material of model LCP-529B; the second anti-chipping part is made of liquid crystal polymer material of model LCP-96AC.

[0038] Using the two materials described above can satisfy the requirements of the second adhesive part for easy bonding and reliable adhesion, and the requirements of the second anti-chipping part for impact resistance and minimal chipping.

[0039] Secondly, embodiments of this application provide a camera module, including:

[0040] The motor described in the first aspect is used to drive the movement of an object to be driven, the object being a lens and / or a photosensitive core.

[0041] Because the motor described in the first aspect is used, the camera module of this application embodiment can also play the above-mentioned role, enabling a single motor to meet different performance requirements—having both good impact resistance and anti-chipping properties, as well as good adhesion properties.

[0042] Thirdly, this application provides an electronic device that includes a motor as described in the first aspect.

[0043] Because the motor described in the first aspect is used, the electronic device in the embodiment of this application can also perform the above-mentioned function, so that a motor can meet different performance requirements—it has good impact resistance and anti-chipping function, as well as good adhesion characteristics. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the structure of a camera module equipped with a motor in an embodiment of this application (outer casing omitted);

[0046] Figure 2 This is an exploded view of the camera module equipped with a motor in an embodiment of this application;

[0047] Figure 3 This is a top view of the camera module equipped with a motor in an embodiment of this application;

[0048] Figure 4 yes Figure 3 Schematic diagram of the cross section of line AA in the middle;

[0049] Figure 5 This is a schematic diagram of the structure of the fixed component in the motor according to an embodiment of this application;

[0050] Figure 6 This is a schematic diagram of another fixing component according to an embodiment of this application;

[0051] Figure 7 This is a structural schematic diagram of another fixing component according to an embodiment of this application;

[0052] Figure 8 This is a schematic diagram of the fixed component in the motor according to an embodiment of this application from another perspective;

[0053] Figure 9 This is a schematic diagram of the structure of another fixing component according to an embodiment of this application;

[0054] Figure 10 This is a schematic diagram of the structure of a camera module equipped with a motor (with a housing) in an embodiment of this application.

[0055] Explanation of reference numerals in the attached drawings: 1. Motor; 10. Fixing component; 11. First anti-chipping part; 111. Elastic component; 12. First adhesive part; 12a. First surface; 12b. Second surface; 121. Protrusion; 122. Opening; 20. Carrier component; 21. Second anti-chipping part; 22. Second adhesive part; 30. Outer shell; 2. Support; 3. Object to be driven. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0057] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0058] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0059] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0060] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0061] The technical solution of this application will be further described below with reference to specific embodiments and accompanying drawings.

[0062] This application provides a voice coil motor (VCM), which is a device that converts electrical energy into mechanical energy. A motor can achieve linear and limited-angle motion. For example, a motor can be installed in a camera module of an electronic device to drive the lens in the camera module to move in different directions, thereby achieving functions such as focusing and image stabilization of the camera module.

[0063] The aforementioned motor includes a fixing component. As an important structural component of the motor, the fixing component plays a role in supporting and carrying the carrier component and cooperating with the carrier component to achieve the focusing function. On the other hand, since the motor is an important part of the camera module, that is, the fixing component in the motor refers to the motor base and similar structures. Therefore, the fixing component also plays a role in assembling and fixing and bonding with other important components in the camera module.

[0064] However, the fixing component in related technologies is a base with a relatively simple overall structure. During use or reliability testing, it is subjected to multiple impacts from the carrier component in the motor. These impacts cause the fixing component to generate a lot of debris. This debris falling into the optical path of the camera module will seriously affect the imaging effect of the camera module. To solve this problem, the structural characteristics of the entire fixing component need to be adjusted. However, the inventors of this application found in practice that once the structural characteristics of the fixing component are adjusted to generate less debris during impact, a new problem arises—the adhesive performance of the fixing component becomes poor. Specifically, the fixing component not only needs to collide with the carrier component, but also needs to be fixed and bonded to other important components in the camera module. When the fixing component does not generate much debris, its adhesive characteristics also become very poor, resulting in the inability to guarantee the strong adhesion between the fixing component and other important components in the camera module. In other words, the inventors of this application found in practice that the fixing component in related technologies cannot simultaneously guarantee no debris generation and good adhesive performance. Therefore, the inventors, through a lot of creative work, proposed the technical solution of the embodiments of this application to solve the above problems.

[0065] Please see Figures 1 to 5 The diagram shown is a schematic representation of the structure of a motor according to an embodiment of this application. Figure 1 This is a schematic diagram of the structure of a camera module equipped with a motor according to an embodiment of this application (the housing structure of the motor is not shown). Figure 2 yes Figure 1 An exploded view of the camera module with a motor located in the upper middle section. Figure 3 yes Figure 1 A top view of the camera module with a motor. Figure 4 yes Figure 3A cross-sectional view of line AA in the middle. Figure 5 This is a schematic diagram of the structure of the fixed component in the motor according to an embodiment of this application.

[0066] This application provides a motor 1 for mounting on a bracket 2. The motor 1 includes a fixing component 10 and a carrier component 20. The fixing component 10 is bonded to the bracket 2. The fixing component 10 includes a first anti-chipping part 11 and a first adhesive part 12. The first anti-chipping part 11 is close to the carrier component 20, and the first adhesive part 12 is close to the bracket 2.

[0067] In this embodiment, the fixing component 10 is improved to include two components with different properties: a first anti-chipping part 11 and a first adhesive part 12. The first adhesive part 12 is located close to the bracket 2 so that it can be bonded to the bracket 2 using its adhesive properties. The first anti-chipping part 11 is located close to the carrier component 20 so that it can have a certain impact resistance when it collides with the carrier component 20, thus preventing or reducing the generation of debris in the fixing component 10 during the collision process.

[0068] The bonding of the fixing component 10 to the bracket 2 should be interpreted broadly, meaning that only a part of the structure of the fixing component 10 can be bonded to the bracket 2. For example, in this embodiment, the first bonding part 12 of the fixing component 10 can be bonded to the bracket 2 while being positioned close to the bracket 2.

[0069] In summary, the primary inventive point of this application is that it proposes a novel technical solution for the fixing component in the motor. Instead of using a fixing component with a relatively simple overall structure that cannot meet multiple performance requirements, it combines two components with different properties into one fixing component. This allows the fixing component to avoid or reduce the generation of debris during collisions with other components and structures, while also having good adhesive properties.

[0070] As an optional implementation, the first adhesive portion 12 and the first anti-chipping portion 11 are integrally formed to constitute the fixing component 10. This integrally formed structure facilitates easier assembly of the fixing component 10 with the carrier component 20, the bracket 2, etc., improving assembly efficiency. It also avoids tolerance issues when assembling multiple parts, resulting in more accurate assembly. Furthermore, it enhances the overall structural strength of the fixing component 10, allowing the first adhesive portion 12 and the first anti-chipping portion 11 to more tightly form a structurally stable and reliable fixing component 10.

[0071] As another optional implementation, the first adhesive portion 12 and the first anti-chipping portion 11 are separate structures, and are fixedly connected to form a fixing component 10. Even when the first adhesive portion and the second anti-chipping portion are separate structures, the carrier component can still be obtained through the fixed connection between them. Using the above structure facilitates the separate production and processing of the first adhesive portion and the first anti-chipping portion. Specifically, the first adhesive portion 12 and the first anti-chipping portion 11 can be fixedly connected into a whole by, for example, adhesive bonding, screwing, riveting, or other fixed connection methods.

[0072] Combination Figures 1 to 5 As shown, the motor 1 also includes a drive member (not shown) for driving the carrier component 20 to move relative to the fixed component 10. Specifically, the carrier component 20 is located inside the first anti-chipping part 11, and the drive member is used to drive the carrier component 20 to move relative to the first anti-chipping part 11 so that the carrier component 20 impacts the first anti-chipping part 11. Since the part in the fixed component 10 that is used to collide and impact with the carrier component 20 is the first anti-chipping part 11, the good impact resistance and anti-chipping performance of the first anti-chipping part 11 can be utilized to reduce or avoid the debris generated during the impact between the carrier component 20 and the fixed component 10.

[0073] The driving component can be either an electromagnetic coil type or a shape memory alloy (SMA) type; in short, it can drive the carrier component 20 to move relative to the first anti-chipping part 11 in the fixed component 10 through changes in current or magnetic field. Alternatively, the driving component can be positioned between the fixed component 10 and the carrier component 20 to drive the carrier component 20.

[0074] It is understandable that the carrier component 20 can be located not only inside the first anti-chipping part 11, but also above the first anti-chipping part 11, as long as the carrier component 20 can move relative to the first anti-chipping part 11 so that the carrier component 20 can collide with the first anti-chipping part 11.

[0075] Additionally, the first adhesive portion 12 is located on the side of the first anti-chipping portion 11 away from the carrier component 20 (i.e. Figure 4The first adhesive portion 12 is located at the lower end of the first anti-chipping portion 11, and there is a gap between the first adhesive portion 12 and the carrier component 20. The first adhesive portion 12 is fixedly bonded to the bracket 2. Since the first adhesive portion 12 is used to bond with the bracket 2 in the fixing component 10, the good adhesive performance of the first adhesive portion 12 can be utilized to ensure a stable adhesive relationship between the first adhesive portion and the bracket, thereby ensuring a reliable and stable adhesive relationship between the fixing component 10 and the bracket 2. In this way, during the operation or testing of the motor, the situation where the fixing component easily detaches from the bracket can be avoided.

[0076] In this embodiment, the fixing component 10 in the motor 1 is improved. The fixing component 10, which has a single overall structural property in related technologies, is modified into a base comprising two different structural features: a first anti-chipping part 11 and a first adhesive part 12. Furthermore, the carrier component 20 can move relative to the first anti-chipping part 11 so that the carrier component 20 only collides with the first anti-chipping part 11. In addition, since the motor 1 needs to be mounted on a bracket for support, this embodiment also fixes the first adhesive part 12 to the bracket. Through this structural improvement, the anti-chipping characteristics of the first anti-chipping part 11 can be utilized to prevent debris from being generated during the movement of the carrier component 20 relative to the first anti-chipping part 11, especially during the impact of the carrier component 20 with the first anti-chipping part 11. This prevents debris from falling into the optical path of the camera module and affecting the imaging effect of the camera module. At the same time, the bonding characteristics of the first adhesive part 12 can be used to achieve a stable connection between the fixing part 10 and the bracket. That is, the fixing part 10 in this embodiment can not only avoid the debris generated by the impact of the carrier part 20, but also ensure a stable connection with the bracket 2 of the camera module.

[0077] In this embodiment, the first anti-chipping part 11 is made of a low-chipping or non-chipping liquid crystal polymer material. The liquid crystal polymer is a special engineering plastic raw material. Low chipping means that the first anti-chipping part 11 uses a liquid crystal polymer material with high strength, making it less prone to generating chips during collisions with the carrier component, and even if chips are generated, they are only a small amount. Non-chipping means that the strength of the liquid crystal polymer material is sufficient to prevent chip generation during collisions between the fixing component 10 and the carrier component 20.

[0078] When using liquid crystal polymer materials with low or no chipping, the high structural strength of the first anti-chipping part 11 can be utilized to make it less likely to generate chips during the movement of the carrier component 20 relative to the first anti-chipping part 11 made of such material, especially during the impact of the carrier component 20 on the first anti-chipping part 11 in the reliability test. This avoids or reduces the problems caused by chipping on the imaging effect of the camera module.

[0079] To achieve better anti-chipping effect, preferably, the first anti-chipping part in this embodiment is made of a liquid crystal polymer material of type LCP-96AC. The liquid crystal polymer material of type LCP-96AC is commercially available. The liquid crystal polymer material of type LCP-96AC has high structural strength and exhibits superior anti-chipping properties; therefore, when the carrier component 20 moves relative to the first anti-chipping part 11, or when the carrier component 20 impacts the first anti-chipping part 11, no chips will be generated.

[0080] To improve the anti-chipping effect, in this embodiment, the first anti-chipping part 11 can also be made of other materials. For example, the first anti-chipping part 11 can be a structure made of metal material, such as aluminum, copper, stainless steel, etc. The hardness of the above-mentioned metal material can ensure that the carrier component 20 and the first anti-chipping part 11 are not prone to generating debris during mutual impact. In this case, the first adhesive part 12 and the bracket 2 will inevitably have a problem of unreliable adhesion. Therefore, the first adhesive part 12 cannot be made of metal material, but other materials need to be used. However, the bonding strength between other materials and metal materials also needs to overcome certain technical difficulties, which will be detailed later.

[0081] In addition to improvements in materials, the embodiments of this application can also improve the structure of the first anti-chipping part 11 to achieve the anti-chipping function. Please continue reading. Figure 6 and Figure 7 , Figure 6 and Figure 7 These are two other optional embodiments of the fixing component in the motor according to the present application. Specifically, a protruding elastic component 111 is provided on the surface of the first anti-chipping part 11 facing the carrier component 20. When the carrier component 20 moves toward the first anti-chipping part 11, it contacts the elastic component 111. The elastic component 111 can be, for example, a metal spring sheet disposed on the surface of the first anti-chipping part 11. When the carrier component 20 is located above the fixing component 10, as... Figure 6 As shown, the elastic member 111 is formed on the upper surface of the first anti-chipping part 11. When the carrier member 20 is located inside the fixing member 10, as... Figure 7As shown, the elastic member 111 is formed on the inner surface of the first anti-chipping part 11. In this embodiment, since the elastic member 111 is provided on the surface of the first anti-chipping part 11 in the direction towards the carrier member 20, it has a certain elastic deformation capability and buffering capability under the action of external force. Therefore, when the carrier member 20 moves towards the first anti-chipping part 11, especially when the carrier member 20 hits the first anti-chipping part 11, the carrier member 20 actually hits the elastic member 111. At this time, the elastic force of the elastic member 111 will play a buffering role, which is conducive to further avoiding the chipping problem caused by the carrier member hitting the fixed member.

[0082] It is understood that in the embodiments of this application, the first anti-chipping part 11 can be obtained by improving only the material, or by improving both the material and the structure. For example, the first anti-chipping part 11 is a structure made of liquid crystal polymer material of model LCP-96AC, and the aforementioned elastic member 111 is provided on the surface of the first anti-chipping part 11 in the direction towards the carrier member 20. Through various improvements, the anti-chipping effect of the first anti-chipping part 11 is optimized.

[0083] In this embodiment, the first adhesive portion 12 is a structure made of a liquid crystal polymer material of model LCP-529B. The liquid crystal polymer material of model LCP-529B is commercially available. The liquid crystal polymer material of model LCP-529B has superior adhesive properties; when bonded and fixed to the bracket 2 in the camera module, the material surface exhibits strong adhesion, enabling it to be firmly and reliably bonded to the bracket 2, ensuring structural stability.

[0084] Preferably, in this embodiment, both the first anti-chipping part 11 and the first adhesive part 12 are made of liquid crystal polymer material, and the first anti-chipping part 11 is a structure made of liquid crystal polymer material of model LCP-96AC, while the first adhesive part 12 is a structure made of liquid crystal polymer material of model LCP-529B. When manufacturing the fixing component 10, a two-stage injection molding process is used. Specifically, the first anti-chipping part 11 is first injection molded to obtain the first anti-chipping part 11, and then the first anti-chipping part 11 is injection molded a second time. Based on the first anti-chipping part 11, the first adhesive part 12 is formed at a designated location. Through two injection molding processes, a fixing component 10 with two different properties but molded into a single structure is obtained, thereby retaining both the two different structural characteristics and ensuring the stability of the overall structure. Alternatively, a one-time molding technique can be used to obtain the fixing component with the first anti-chipping part 11 and the first adhesive part 12.

[0085] Alternatively, in this embodiment, the first anti-chipping part 11 may be made of metal, and the first adhesive part 12 may be made of a liquid crystal polymer material of model LCP-529B. Since metal materials themselves have poor adhesive properties, it is difficult to integrate them with other materials without welding or indirect connection (e.g., by screwing, riveting, pinning, etc.). Therefore, this embodiment also provides a processing method for combining metal materials with liquid crystal polymer materials, including: obtaining the first adhesive part 12 through injection molding, and then obtaining a metal film layer deposited on the first adhesive part 12 through a coating process. This metal film layer can directly serve as the first anti-chipping part 11, or if the metal film layer is too thin, a metal structure that can serve as the first anti-chipping part 11 can be further welded onto the metal film layer.

[0086] In addition to improvements in materials, embodiments of this application can also improve the structure of the first adhesive portion 12 to achieve a good adhesive effect. Specifically, such as... Figure 9 As shown, the first adhesive portion 12 is a substrate connected to the first anti-chipping portion 11. The substrate includes a first surface 12a and a second surface 12b disposed opposite to each other. The first surface 12a faces the carrier component 20 (i.e., Figure 9 The first side 12a faces upwards, and the second side 12b faces the support 2 (i.e., Figure 9 The second surface 12b faces downwards, and the second surface 12b is fixedly bonded to the bracket 2; wherein, the second surface 12b is provided with a plurality of protrusions 121 in the direction of the bracket 2, so that the second surface 12b forms an uneven surface, and the surface of the bracket 2 and the second surface 12b fixedly bonded together is formed to match the second surface 12b.

[0087] To further improve the bonding ability of the first bonding portion 12, in this embodiment, a plurality of protrusions 121 are provided on the second surface 12b of the substrate serving as the first bonding portion 12. This makes the surface of the second surface 12b no longer just a flat surface, but an uneven surface. Simultaneously, the surfaces of the support 2 and the second surface 12b to be bonded are set to match the uneven surface of the second surface 12b. Then, adhesive materials such as adhesives are used to bond the second surface 12b and the support 2. Since the improved structure greatly increases the contact area between the second surface 12b and the support 2, that is, increases the fixed bonding area between them, it is more conducive to improving bonding stability.

[0088] It is understandable that when the second surface 12b is a conventional flat surface rather than an uneven surface structure, adhesive tape can be used to bond the second surface 12b to the surface to be bonded to the support 2. This adhesive bonding method is relatively easy to operate. However, when the second surface 12b has an uneven structure, it is preferable to use glue to bond the second surface 12b to the surface to be bonded to the support 2. This adhesive bonding method may have the problem of glue overflow, but the reliability after bonding is higher. In order to solve the problem of glue overflow, this embodiment further provides a glue overflow groove (not shown in the figure) on the second surface 12b. Specifically, a glue overflow groove is formed by recessing from the surface of the second surface 12b in a direction away from the support 2 near the outer edge of the substrate. In this way, when glue is used to bond the second surface 12b to the support 2, the excess glue can be contained in the glue overflow groove, thereby solving the problem of glue overflow.

[0089] To achieve better overall performance of the fixing component—simultaneously reducing chipping and ensuring good adhesion—in this embodiment, the substrate has an opening 122 in the middle, and the outer edge of the opening 122 extends towards the carrier component 20 to form a closed baffle (not shown). The carrier component 20 is located on the side of the baffle facing away from the opening 122. The opening 122 in the middle of the substrate serves to ensure unobstructed light path for the camera module. Although the first anti-chipping part 11 in this embodiment can avoid or reduce chipping, even a small amount of chipping may fall from the opening 122 into the light path of the camera module, thus adversely affecting the imaging effect. Therefore, this application provides a baffle at the outer edge of the opening 122 of the substrate, extending towards the carrier component 20, forming a ring of baffles around the opening 122 of the substrate, thereby blocking the carrier component 20 outside the opening 122. With this configuration, even if the fixing component 10 generates a small amount of debris due to collision with the carrier component 20, this debris will be blocked between the baffle and the substrate and will not fall into the opening 122. Therefore, it can effectively prevent debris from entering the optical path of the camera module. In other words, in this embodiment, through further improvements to the substrate structure, the substrate can not only block debris and prevent it from entering the optical path of the camera module, but also have good adhesive properties to ensure a stable connection with the bracket 2 and prevent the two from detaching during operation or testing.

[0090] Considering that the relative movement and impact between the carrier component 20 and the fixing component 10 may still generate a small amount of debris, and if this debris accumulates between the baffle and the substrate for a long time and cannot be discharged in time, it will accumulate more and more, inevitably affecting the performance and lifespan of the motor. Therefore, in this embodiment, an inclined chip removal groove (not shown in the figure) is provided on the first surface 12a of the substrate. The chip removal groove is inclined from high to low in the direction from the baffle toward the outer edge of the substrate. By providing a chip removal groove that is inclined from the inside to the outside and from high to low, the small amount of debris generated on the fixing component 10 can be discharged in time, preventing the accumulation of debris.

[0091] Please see the return Figure 1 and Figure 2 In the motor 1 of this application embodiment, the motor 1 is also used to drive the movement of the object 3 to be driven. The carrier component 20 is bonded to the object 3 to be driven. The carrier component 20 includes a second anti-chipping part 21 and a second bonding part 22. The second bonding part 22 is close to the object 3 to be driven, and the second anti-chipping part 21 is close to the fixing component 10.

[0092] In this embodiment, the carrier component 20 is improved to include two components with different properties: a second anti-chipping part 21 and a second adhesive part 22. The second adhesive part 22 is positioned close to the object to be driven 3 so that it can be bonded to the object using its adhesive properties. The second anti-chipping part 21 is positioned close to the fixing component 10 so that it can have a certain impact resistance when it collides with the fixing component 10, thus preventing or reducing the generation of debris in the carrier component 20 during the collision process.

[0093] In this context, "motor 1 drives the object 3" means that the motor's function is to move the object 3. For example, when motor 1 is installed in a camera module, the object 3 to be driven is a lens and / or a photosensitive chip, enabling the motor to drive the lens and / or the photosensitive chip to achieve focusing. In this embodiment, the object 3 to be driven specifically refers to a lens.

[0094] The bonding between the carrier component 20 and the object to be driven 3 should be interpreted broadly, meaning that only a part of the carrier component 20 may be bonded to the object to be driven 3. For example, in this embodiment, the second bonding part 22 of the carrier component 20 may be bonded to the object to be driven 3 while being positioned close to it.

[0095] As an optional implementation, the second adhesive portion 22 and the second anti-chipping portion 21 are integrally formed to constitute the carrier component 20. This integrally formed structure facilitates easier assembly and improves assembly efficiency between the carrier component 20 and the fixing component 10, the object to be driven 3, etc.; it also avoids tolerance issues when assembling multiple parts, resulting in more accurate assembly; and it further enhances the overall structural strength of the carrier component 20, allowing the second adhesive portion 22 and the second anti-chipping portion 21 to more tightly form a structurally stable and reliable carrier component 20.

[0096] As another optional implementation, the second adhesive portion 22 and the second anti-chipping portion 21 are separate structures, and are fixedly connected to form the carrier component 20. Even when the first adhesive portion and the second anti-chipping portion are separate structures, the carrier component can still be obtained through their fixed connection. Using the above structure facilitates the separate production and processing of the first adhesive portion and the first anti-chipping portion. The second adhesive portion 22 and the second anti-chipping portion 21 can be fixedly connected as a whole, for example, through bonding, screwing, riveting, or other fixed connection methods.

[0097] To better prevent the generation of debris, the second anti-debris part 21 is located inside the structure of the first anti-debris part 11, and the second anti-debris part 21 moves relative to the first anti-debris part 11. Specifically, the drive component in the motor drives the second anti-debris part 21 to move relative to the first anti-debris part 11, so that the second anti-debris part 21 impacts the first anti-debris part 11. Thus, in the carrier component 20, the part that collides and impacts with the fixed component 10 is the second anti-debris part 21, and in particular, the second anti-debris part 21 impacts the first anti-debris part 11. In this way, by utilizing the impact resistance and debris prevention functions of the two anti-debris parts, the generation of debris can be avoided or reduced during the movement and collision of the carrier component 20 relative to the fixed component 10.

[0098] It is understandable that the second anti-chipping part 21 can be located not only inside the first anti-chipping part 11, but also above the first anti-chipping part 11, as long as the second anti-chipping part 21 can drive the carrier component 20 to move relative to the first anti-chipping part 11 so that the second anti-chipping part 21 can collide with the first anti-chipping part 11.

[0099] Furthermore, the second adhesive portion 22 is located on the side of the second anti-chipping portion 21 away from the fixing member 10 (i.e. Figure 2The second adhesive portion 22 is located above the second anti-chipping portion 21, and is fixedly bonded to the object 3 to be driven. Since the second adhesive portion 22 is used for fixed bonding to the object 3 in the carrier component 20, its excellent adhesive properties ensure a reliable and stable bond between it and the object 3. This prevents detachment between the carrier component and the object during motor operation or testing.

[0100] As can be seen, the embodiments of this application improve the carrier component 20, which has a single overall structural property in the related technology, into a carrier structure with two different structural properties, namely the second anti-chipping part 21 and the second adhesive part 22. This allows the carrier component 20 to have two different structural properties at the same time, which can better avoid or reduce the debris generated by the carrier component 20 during the collision process, and also ensure the stable connection between the carrier component 20 and the object to be driven 3.

[0101] In this embodiment, in order to achieve better impact resistance and prevent flaking, the second anti-flaking part 21 and the first anti-flaking part 11 are preferably made of the same low-flaking or non-flaking liquid crystal polymer material to ensure the best effect of preventing the generation of flaking.

[0102] The second anti-chipping part 21 is made of a low-chipping or non-chipping liquid crystal polymer material. The liquid crystal polymer is a special engineering plastic raw material. Low chipping means that the second anti-chipping part 21 uses a liquid crystal polymer material with high strength properties, making it less prone to generating chips during collisions with the fixing component 10, and even if chips are generated, they are only a small amount. Non-chipping means that the strength of the liquid crystal polymer material is sufficient to prevent chip generation during collisions between the carrier component 20 and the fixing component 10.

[0103] When using liquid crystal polymer materials with low or no chipping, the high structural strength of the second anti-chipping part 21 can be utilized to make the second anti-chipping part 21 made of such materials less prone to chipping during the movement of the second anti-chipping part 21 relative to the fixed part 10, especially during the impact of the second anti-chipping part 21 on the fixed part 10 in the reliability test, thereby avoiding or reducing the problems caused by chipping to the imaging effect of the camera module.

[0104] To achieve better anti-chipping effect, preferably, the second anti-chipping part in this embodiment is made of a liquid crystal polymer material of type LCP-96AC. The liquid crystal polymer material of type LCP-96AC is commercially available. The liquid crystal polymer material of type LCP-96AC has high structural strength and exhibits superior anti-chipping properties; therefore, when the second anti-chipping part 21 moves relative to the fixed part 10, or when the second anti-chipping part 21 impacts the fixed part 10, no chips will be generated.

[0105] The second adhesive part 22 is made of a liquid crystal polymer material of model LCP-529B. This liquid crystal polymer material of model LCP-529B is commercially available. The liquid crystal polymer material of model LCP-529B has superior adhesive properties; when bonded and fixed to the bracket 2 in the camera module, the material surface exhibits strong adhesion, enabling a firm and reliable bond to the bracket 2 and ensuring structural stability.

[0106] Understandably, please refer to Figure 10 The motor 1 in this embodiment of the application also includes a housing 30, which is mounted on the fixing member 10 and forms a mounting cavity with the fixing member 10, and the carrier member 20 is housed in the mounting cavity.

[0107] This application also provides a camera module, which is installed in an electronic device to perform multiple functions such as taking photos, recording videos, making video calls, and scanning images.

[0108] The camera module in this embodiment includes:

[0109] based on Figures 1 to 10 The motor 1 shown is used to drive the movement of the object 3 to be driven, which is a lens.

[0110] Because the motor 1 has improved the fixing component 10, it can simultaneously possess two different characteristics on the same fixing component. This allows the fixing component to have both good impact resistance and anti-chipping ability, as well as good adhesion ability. This solves the problem in related technologies where fixing components made of a single material can only have good characteristics in one aspect and it is difficult to meet different performance requirements. Ultimately, the performance of the entire motor and camera module is also improved and optimized.

[0111] Understandably, depending on actual needs, the object to be driven can be a photosensitive chip, and the motor can be used to drive the movement of the photosensitive chip. Alternatively, the motor can drive both the lens and the photosensitive chip simultaneously, without any limitations.

[0112] This application also provides an electronic device, which can be a smartphone, tablet computer, laptop computer, desktop computer, or wearable device, among other electronic devices. This electronic device is equipped with a... Figures 1 to 10 The motor 1 mentioned above.

[0113] By improving the fixing components of motors in electronic devices, the fixing components with a single overall structural property in related technologies are transformed into carriers with two different properties: a first anti-chipping part and a first adhesive part. This allows the fixing components to meet both the requirements of impact resistance and anti-chipping, as well as the requirement of easy adhesion. This solves the problem that fixing components made of a single material in related technologies can only have good characteristics in one aspect and cannot meet different performance requirements. Ultimately, the performance of the entire motor and electronic device is improved and optimized.

[0114] In this embodiment, the fixing component 10 in the motor 1 is first improved. The fixing component 10, which has a single overall structural property in related technologies, is improved into a carrier comprising two different structural properties: a first anti-chipping part 11 and a first adhesive part 12. This provides both impact resistance and chip prevention, as well as good adhesive properties. Specifically, taking the motor 1 installed in a camera module and the camera module installed in an electronic device as an example, the carrier component 20 can move relative to the first anti-chipping part 11 of the fixing component 10, allowing the carrier component 20 to collide with the first anti-chipping part 11. The good impact resistance of the first anti-chipping part 11 effectively avoids the problem of debris generation from the fixing component 10 during the impact. Furthermore, since the motor 1 is installed in a camera module with a bracket 2, this embodiment also fixes and adhesives the first adhesive part 12 to the bracket 2 of the camera module. Through this structural improvement, the anti-chipping characteristics of the first anti-chipping part 11 can be utilized to prevent debris from being generated during the collision between the carrier component 20 and the fixing component 10, thereby preventing debris from falling into the optical path of the camera module and ultimately avoiding any impact on the imaging effect of the camera module. Simultaneously, the reliable bonding characteristics of the first adhesive part 12 can be utilized to achieve a stable connection between the fixing component 10 and the bracket 2. That is, the fixing component 10 in this embodiment can both prevent debris generated by impact and ensure a stable connection with the bracket 2 of the camera module. This is the primary inventive point of this application.

[0115] Secondly, the motor in this embodiment also improves the carrier component 20 by modifying its structure to include a second anti-chipping part 21 and a second adhesive part 22. This allows the second anti-chipping part 21 to move or collide with the first anti-chipping part 11, further enhancing the anti-chipping ability of the fixing part 10 and the carrier component 20, preventing or minimizing the generation of debris between them. Simultaneously, it ensures a stable connection between the fixing part and the support, as well as a stable connection between the carrier component and the object to be driven. This is another important inventive point of this embodiment.

[0116] The foregoing has provided a detailed description of a motor, camera module, and electronic device disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the products and core ideas of the motor, camera module, and electronic device of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A motor for mounting on a support, characterized in that, The motor comprises a fixed part and a carrier part, the fixed part is bonded with the bracket, the fixed part comprises a first anti-dust part and a first bonding part, the first anti-dust part is close to the carrier part, and the first bonding part is close to the bracket; the first anti-dust part and the first bonding part are made of different liquid crystal polymer materials; The motor is also used to drive the movement of the driven animal body, the carrier part is bonded with the driven animal body, the carrier part comprises a second bonding part and a second anti-dust part, the second bonding part is close to the driven animal body, and the second anti-dust part is close to the fixed part; The first anti-dust part and the second anti-dust part are liquid crystal polymer materials with low or no dust characteristics, and the first bonding part and the second bonding part are liquid crystal polymer materials with bonding characteristics.

2. The motor of claim 1, wherein The first bonding part and the first anti-dust part are integrally formed to constitute the fixed part.

3. The motor of claim 1, wherein The first bonding part and the first anti-dust part are separate structures, and the first bonding part and the first anti-dust part are fixedly connected to constitute the fixed part.

4. The motor according to any one of claims 1 to 3, characterized in that The motor further comprises a driving member, the carrier part is located inside the first anti-dust part or above the first anti-dust part, and the driving member is used to drive the carrier part to move relative to the first anti-dust part.

5. The motor according to any one of claims 1 to 3, characterized in that The first bonding part is located on the side of the first anti-dust part away from the carrier part, and there is a gap between the first bonding part and the carrier part, and the first bonding part is fixedly bonded with the bracket.

6. The motor of any one of claims 1 to 3, wherein, The first anti-dust part is a component made of a liquid crystal polymer material with a model number of LCP-96AC.

7. The motor of any one of claims 1 to 3, wherein, The surface of the first anti-dust part facing the carrier part is provided with a protruding elastic component, and when the carrier part moves towards the first anti-dust part, the carrier part contacts the elastic component.

8. The motor of any one of claims 1 to 3, wherein, The first bonding part is made of a liquid crystal polymer material with a model number of LCP-529B.

9. The motor of any one of claims 1 to 3, wherein, The first bonding part is a substrate connected to the first anti-dust part, the substrate comprises a first surface and a second surface arranged opposite to each other, the first surface faces the carrier part, and the second surface is fixedly bonded with the bracket; wherein the second surface is provided with a plurality of protruding parts facing the bracket, so that the second surface forms a concave-convex surface, and the surface of the bracket fixedly bonded with the second surface forms a surface matched with the second surface.

10. The motor of claim 9, wherein The middle part of the substrate has an opening, and the outer edge of the opening extends in the direction of the carrier part to form a closed baffle, and the carrier part is arranged close to the side of the baffle away from the opening.

11. The motor of claim 10, wherein, An inclined dust removal groove is arranged on the first surface of the substrate, and the dust removal groove is arranged from high to low in the direction from the baffle to the outer edge of the substrate.

12. The motor of claim 1, wherein The second bonding part and the second anti-dust part are integrally formed to constitute the carrier part, or the second bonding part and the second anti-dust part are separate structures, and the second bonding part and the second anti-dust part are fixedly connected to constitute the carrier part.

13. The motor of claim 1, wherein The second anti-dusting part is located inside the first anti-dusting part or above the first anti-dusting part, and is used for moving relative to the first anti-dusting part.

14. The motor of claim 1, wherein, The second bonding part is located on the side of the second anti-dusting part away from the fixing part, and is used for fixing and bonding with the to-be-driven object.

15. The motor of claim 1, wherein, The second bonding part is made of a liquid crystal high polymer material with a model number of LCP-529B, and the second anti-dusting part is made of a liquid crystal high polymer material with a model number of LCP-96AC.

16. A camera module, comprising: Comprise: The motor as claimed in any one of claims 1 to 15 is used for driving a to-be-driven object to move, and the to-be-driven object is a lens and / or a photosensitive chip.

17. An electronic device, comprising: The electronic device is provided with the motor as claimed in any one of claims 1 to 16.

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