Thermal insulation structure and preparation method, heating without burning device

Abstract

The present application provides a heat insulation structure and a preparation method, and a heating without burning device. The heat insulation structure includes a tubular inner layer and an outer layer surrounding the inner layer, wherein the infrared emissivity of the outer layer is lower than the infrared emissivity of the inner layer. The heat insulation structure can reduce the loss of heat radiation generated by the heating element inside the heat insulation structure.

Description

Technical Field

[0001] The present application belongs to the technical field of smoking articles, and specifically relates to a heat insulation structure and a preparation method, and a heat-without-burning device. Background Art

[0002] Heat-not-burn devices are increasingly becoming a popular simulated smoking device for consumers. The heating element therein is used to heat the smoking material. How to reduce the thermal efficiency of the heating element in heating the smoking material has become a technical problem that technicians in this field continue to promote and solve. Summary of the invention

[0003] The purpose of the present application is to provide a heat insulation structure and a preparation method, and a heating without burning device to address the deficiencies of the prior art.

[0004] In order to solve the above technical problems, the present application adopts the following technical solution: a heat insulation structure, comprising a tubular inner layer and an outer layer surrounding the inner layer, wherein the infrared emissivity of the outer layer is lower than the infrared emissivity of the inner layer.

[0005] Optionally, a gap is left between the inner layer and the outer layer, and the thermal insulation structure further includes a main body layer located between the inner layer and the outer layer.

[0006] Optionally, the material of the body layer includes at least one of glass, ceramic, plastic and metal.

[0007] Optionally, the infrared emissivity of the inner layer is not less than 0.9; and the infrared emissivity of the outer layer is not greater than 0.6.

[0008] Optionally, the material of the inner layer includes at least one of spinel, silicon oxide, metal oxide and nitride.

[0009] Optionally, the material of the outer layer includes at least one of copper, aluminum, gold, silver, titanium and zinc.

[0010] Optionally, the thickness of the main layer is between 0.01 mm and 5 mm, the thickness of the inner layer is between 5 nm and 1000 nm, and the thickness of the outer layer is between 5 nm and 1000 nm.

[0011] An embodiment of the present application also provides the following scheme: A method for preparing a thermal insulation structure, comprising: providing a flat main body layer, the main body layer having a first surface and a second surface relative to each other; forming an inner layer on the first surface; forming an outer layer on the second surface, the infrared emissivity of the outer layer being lower than the infrared emissivity of the inner layer; and making the main body layer into a stable tubular structure.

[0012] Optionally, the process of forming the inner layer and / or the process of forming the outer layer includes: any one of vapor deposition, magnetron sputtering, thermal oxidation, plasma vapor deposition, chemical plating, electroplating, vacuum plating, coating, and printing.

[0013] Optionally, the main body layer is made into a stable tubular structure, including: using a bending, splicing or bonding process to make the main body layer into a stable tubular structure.

[0014] The embodiments of the present application also provide the following solution: a heat-not-burn device, comprising a heating element and the above-mentioned heat insulation structure, wherein a accommodating space surrounding the heating element is provided between the inner surface of the inner layer and the heating element, and the accommodating space is used to accommodate a smoking material.

[0015] Optionally, the heating element is in a needle-like, sheet-like or cylindrical shape.

[0016] Compared with the prior art, the beneficial effects of the present application are: if the heat insulation structure is applied to a heat-not-burn device, the heating element can be placed near the central axis of the inner layer, and since the infrared emissivity of the outer layer is lower than that of the inner layer, the outer layer emits less infrared rays to the outside, so that the heat radiation of the heating element is blocked in the internal space surrounded by the inner layer. Thus, the overall thermal efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the heat insulation structure provided in the embodiment of the present application and the heating without combustion device constituted by the heat insulation structure.

[0018] Figure 2 It is a flow chart of the method for preparing the thermal insulation structure provided in the embodiment of the present application.

[0019] Among them, the figures are marked as: 1, thermal insulation structure; 101, outer layer; 102, main body layer; 103, inner layer; 2, heating element. DETAILED DESCRIPTION

[0020] In the present application, it should be understood that terms such as “including” or “having” are intended to indicate the presence of features, numbers, steps, behaviors, components, parts, or a combination thereof disclosed in the present specification, and are not intended to exclude the possibility of the presence of one or more other features, numbers, steps, behaviors, components, parts, or a combination thereof.

[0021] It should also be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] The present application will be further described below in conjunction with the embodiments shown in the accompanying drawings.

[0023] As attached Figure 1 As shown, an embodiment of the present application provides a thermal insulation structure 1, including a tubular inner layer 103, and an outer layer 101 surrounding the inner layer 103, wherein the infrared emissivity of the outer layer 101 is lower than the infrared emissivity of the inner layer 103.

[0024] If the heat insulation structure 1 is applied to a heat-not-burn device, the heating element 2 can be placed near the central axis of the inner layer 103. Since the infrared emissivity of the outer layer 101 is lower than that of the inner layer 103, the outer layer 101 emits less infrared rays to the outside, so that the heat radiation of the heating element 2 is blocked in the internal space surrounded by the inner layer 103. Thus, the overall thermal efficiency is improved.

[0025] If the structure of the materials selected for the inner layer 103 and the outer layer 101 is stable, the thermal insulation structure 1 can be a double-layer structure. If the structural stability of the materials selected for the inner layer 103 and the outer layer 101 is relatively weak, the outer layer 101 can be attached to the inner surface of a tubular structure with better structural stability. In addition, the embodiment of the present application also proposes a composition method of the thermal insulation structure 1: a gap is left between the inner layer 103 and the outer layer 101, and the thermal insulation structure 1 also includes a body layer 102 located between the inner layer 103 and the outer layer 101.

[0026] That is, the main body layer supports the inner layer 103 and the outer layer 101. The main body layer should also have good heat resistance, so the material of the main body layer 102 may include at least one of glass, ceramic, plastic and metal.

[0027] The greater the difference in infrared emissivity between the inner layer 103 and the outer layer 101 , the better. However, considering the limited available materials, the configuration can be as follows: the infrared emissivity of the inner layer 103 is not less than 0.9; the infrared emissivity of the outer layer 101 is not greater than 0.6.

[0028] Optionally, the material of the inner layer 103 includes at least one of spinel, silicon oxide, metal oxide, and nitride.

[0029] Optionally, the material of the outer layer 101 includes at least one of copper, aluminum, gold, silver, titanium, and zinc.

[0030] refer to Figure 2 Combined with Figure 1 , an embodiment of the present application also provides a method for preparing a thermal insulation structure 1, comprising the following steps.

[0031] Step S201, providing a flat body layer 102, wherein the body layer 102 has a first surface and a second surface opposite to each other;

[0032] Step S202, forming an inner layer 103 on the first surface;

[0033] Step S203, forming an outer layer 101 on the second surface, wherein the infrared emissivity of the outer layer 101 is less than the infrared emissivity of the inner layer 103;

[0034] Step S204: making the main body layer 102 into a stable tubular structure.

[0035] Optionally, the process of forming the inner layer 103 and / or the process of forming the outer layer 101 includes: any one of vapor deposition, magnetron sputtering, thermal oxidation, plasma vapor deposition, chemical plating, electroplating, vacuum plating, coating, and printing.

[0036] Optionally, the main body layer 102 is made into a stable tubular structure, including: using a bending, splicing or laminating process to make the main body layer 102 into a stable tubular structure.

[0037] If the main body layer 102 is bendable, the main body layer 102 can be bent into a tubular shape. If the main body layer 102 is not bendable, multiple main body layers 102 can be selected and spliced ​​into a tubular shape. If the main body layer 102 is bendable, the outer layer 101 can also be attached to the inner wall of a tubular structure with a larger diameter.

[0038] The above method uses the main body layer as a stable structure, and attaches the inner layer 103 and the outer layer 101 to the main body layer. Of course, if the material of the outer layer 101 has better structural stability, the main body layer can also be omitted, and the inner layer 103 can be attached to the outer layer 101.

[0039] refer to Figure 1 An embodiment of the present application also provides a heating without burning device, including a heating element 2 and the above-mentioned insulation structure 1, and an accommodation space surrounding the heating element 2 is provided between the inner surface of the inner layer 103 and the heating element 2, and the accommodation space is used to accommodate the smoking material.

[0040] Specifically, the inner surface of the inner layer 103 can be used as the boundary of the accommodation space. Of course, other layer structures can also be arranged on the inner surface of the inner layer 103. That is, the accommodation space can also be smaller than the space between the inner side and the heating element 2.

[0041] Optionally, the heating element 2 is in a needle-like, sheet-like or cylindrical shape. The shape of the heating element 2 can be flexibly selected, and the heating element 2 heats the smoking material from the inside of the smoking material.

[0042] In a specific example, the thermal insulation structure 1 is a tubular structure, having an inner layer 103 and an outer layer 101. The outer layer 101 is distributed on the outer wall surface of the body layer 102, and the inner layer 103 is distributed on the inner wall surface of the body layer 102. The body layer 102 is made of a polyimide material, and its wall thickness is between 0.01 mm and 5 mm. The outer layer 101 is made of one or more materials including aluminum, silver, copper, and zinc, and its thickness ranges from 5 nanometers to 1000 nanometers. The inner layer 103 is made of one or more materials including oxides of manganese, cobalt, and copper, and its thickness ranges from 5 nanometers to 1000 nanometers.

[0043] To make the above-mentioned heat-insulating structure 1, a polyimide film (a kind of plastic) is used as a substrate, and an oxide material containing manganese, cobalt, and copper is bonded to one side of the polyimide film by a magnetron sputtering method, and then one or more materials containing aluminum, silver, copper, and zinc are bonded to the other side of the polyimide film by a magnetron sputtering method. Finally, the prepared polyimide film is rolled to obtain a heat-insulating structure 1 for surrounding a heating element 2 in a heat-not-burn device.

[0044] The various embodiments in the present application are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0045] The protection scope of this application is not limited to the above-mentioned embodiments. Obviously, those skilled in the art can make various changes and modifications to this application without departing from the scope and spirit of this application. If these changes and modifications fall within the scope of the claims of this application and their equivalents, the intention of this application also includes these changes and modifications.

Claims

1. A thermal insulation structure (1), characterized in that: It comprises a tubular inner layer (103) and an outer layer (101) surrounding the inner layer (103), wherein the infrared emissivity of the outer layer (101) is lower than the infrared emissivity of the inner layer (103); A gap is left between the inner layer (103) and the outer layer (101), and the thermal insulation structure (1) further comprises a body layer (102) located between the inner layer (103) and the outer layer (101); The infrared emissivity of the inner layer (103) is not less than 0.9; the infrared emissivity of the outer layer (101) is not greater than 0.6; The material of the inner layer (103) includes: at least one of spinel, silicon oxide, metal oxide, and nitride; The material of the outer layer (101) includes: at least one of copper, aluminum, gold, silver, titanium, and zinc; The thickness of the main layer (102) is between 0.01 mm and 5 mm, the thickness of the inner layer (103) is between 5 nm and 1000 nm, and the thickness of the outer layer (101) is between 5 nm and 1000 nm; The material of the body layer (102) includes: at least one of glass, ceramic, plastic and metal; The preparation method of the thermal insulation structure comprises: Providing a planar body layer (102), the body layer (102) having a first surface and a second surface opposite to each other; forming an inner layer (103) on the first surface; forming an outer layer (101) on the second surface, wherein the infrared emissivity of the outer layer (101) is lower than the infrared emissivity of the inner layer (103); The body layer (102) is formed into a stable tubular structure.

2. A method for preparing a thermal insulation structure according to claim 1, characterized in that: include: Providing a planar body layer (102), the body layer (102) having a first surface and a second surface opposite to each other; forming an inner layer (103) on the first surface; forming an outer layer (101) on the second surface, wherein the infrared emissivity of the outer layer (101) is lower than the infrared emissivity of the inner layer (103); The body layer (102) is formed into a stable tubular structure.

3. The preparation method according to claim 2, characterized in that: The process of forming the inner layer (103) and / or the process of forming the outer layer (101) includes: any one of vapor deposition, magnetron sputtering, thermal oxidation, plasma vapor deposition, chemical plating, electroplating, vacuum plating, coating, and printing.

4. The preparation method according to claim 2, characterized in that: The main body layer (102) is made into a stable tubular structure, comprising: using a bending, splicing or bonding process to make the main body layer (102) into a stable tubular structure.

5. A heat-not-burn device, characterized in that: It comprises a heating element (2) and a heat insulation structure (1) according to claim 1, wherein an accommodation space surrounding the heating element (2) is provided between the inner surface of the inner layer (103) and the heating element (2), and the accommodation space is used for accommodating a smoking material.

6. The heating without burning device according to claim 5, characterized in that: The heating element (2) is in the shape of a needle, a sheet or a tube.

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