A temperature and pressure integrated transmitter and manufacturing process

Abstract

The invention discloses a temperature-pressure integrated transmitter and a manufacturing process thereof, comprising a main body with a process interface, a shell detachably connected to the main body, an isolation diaphragm assembly fixed on the main body, and a pressure sensor, wherein the pressure sensor is electrically connected to a main circuit board, a temperature sensor assembly is mounted on the main circuit board, a Hirschmann connector is detachably connected to the shell, and an electrically connected lead is arranged between the Hirschmann connector and the main circuit board; the integrated structure of the main body and the sealed pressure-taking cavity solve the problems in the prior art of inaccurate pressure monitoring and a small application range caused by the blockage of the pressure-taking hole, as well as the complex installation structure of the temperature sensor, and the relatively single material selection due to the armored tube structure of the temperature sensor, and the limited corrosion performance and inability to be applied to special corrosive media; and the production and assembly processes are reduced, the overall production efficiency of the product is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of transmitter design, and in particular to a temperature and pressure integrated transmitter and a manufacturing process. Background Art

[0002] In the fields of petroleum, chemical industry, metallurgy, environmental protection, heating and water supply, and equipment matching, transmitters are widely used to measure gas and liquid pressure, such as water, oil, mildly corrosive liquids and gases. In addition to pressure measurement, temperature is also an important parameter for on-site measurement. In this way, a pressure transmitter and a temperature transmitter are often installed at the same location. The measurement function is single. When a certain number of transmitters need to be installed, not only is the installation cumbersome, but also requires separate wiring, and the subsequent maintenance workload is relatively large.

[0003] The existing integrated temperature and pressure transmitter adopts an armored temperature sensor placed at the front end of the process interface, and the pressure tapping port is a layout structure in which a small hole is opened on the threaded side of the process interface. Although this method can also meet the requirements of integrated temperature and pressure measurement, because the pressure tapping port is a small hole connected to the medium, the diameter of the pressure tapping port cannot be made larger, because the increase in the diameter of the pressure tapping port will affect the accuracy of pressure tapping, so the pressure tapping port can only be made very small; and the pressure tapping port is prone to clogging over time, especially when measuring special media such as viscous media with particles, so the above-mentioned pressure tapping structure is also limited by the use environment and cannot be applied to a variety of media;

[0004] The separately installed armored temperature sensor has a complex structure, complex assembly process, and high cost. In addition, the armored tube of the temperature probe is welded and fixed to the interface thread instrument, and the material selection is relatively simple due to the armored tube structure. Moreover, the wall thickness is generally thin, and the corrosion resistance is limited, which is not suitable for use in occasions with special corrosive media. Summary of the invention

[0005] The purpose of the present invention is to solve the problems in the prior art of inaccurate pressure monitoring and small application range caused by the blockage of the pressure taking hole, the complex installation structure of the temperature sensor armor, unreliable contact, and the relatively single material selection due to the structure of the temperature sensor armor tube, and the limited corrosion performance, which cannot be applied to special corrosive media.

[0006] In order to achieve the above-mentioned purpose, the present invention proposes an integrated temperature and pressure transmitter, comprising a main body with a process interface, a shell detachably connected to the main body, an isolation diaphragm fixed on the main body, and a pressure sensor, the pressure sensor is connected to a main circuit board, the main circuit board is mounted with a temperature sensor assembly, the shell is detachably connected with a Hirschmann connector, and an electrically connected lead is provided between the Hirschmann connector and the main circuit board; it is characterized in that the temperature sensor assembly comprises a medium temperature sensor and a cold end temperature sensor, and also comprises a temperature measuring circuit board which is arranged in the shell and connected to the main circuit board at one end extending into the main body and mounting the medium temperature sensor, and mounting the cold end temperature sensor at the other end, and the main body is also provided with a pressure induction cavity whose two ends are sealed by the isolation diaphragm assembly and the pressure sensor.

[0007] Preferably, the pressure-inducing chamber comprises a pressure-inducing channel and a mounting seat for fixing the pressure sensor, and a groove is provided on the mounting seat.

[0008] Preferably, the pressure-inducing channel is communicated with a groove on the mounting seat, and a pressure-inducing medium is injected into the interior.

[0009] Preferably, a protective ring is provided on the isolation diaphragm, the isolation diaphragm is fixedly connected to the protective ring, and the isolation diaphragm is fixedly connected to the body through the protective ring.

[0010] Preferably, the isolation diaphragm is made of monel alloy, tantalum alloy or stainless steel.

[0011] Preferably, the main body is also provided with a temperature measuring channel, a heat sink, a support ring and an external hexagonal surface and a structure detachably connected to the medium equipment; the pressure chamber, temperature measuring channel, heat sink, support ring and external hexagonal surface are an integrated structure with the main body.

[0012] Preferably, the main body and the shell are detachably connected and fixed, and a sealing ring is provided between them.

[0013] Preferably, the structure detachably connected to the medium device is a thread and a sealing gasket installed between the thread and the external hexagonal surface.

[0014] Another object of the present invention is to solve the problem of low working efficiency caused by the complicated assembly process of the integrated voltage stabilizing transmitter in the prior art; for this purpose, a manufacturing process of an integrated temperature and pressure transmitter is proposed, which is characterized by comprising the following steps:

[0015] The first step is to connect and fix the isolation diaphragm to the body;

[0016] The second step is to fix the pressure sensor on the mounting base so that one end of the pressure sensor is placed in the groove of the mounting base;

[0017] The third step is to place the main circuit board on the plastic support ring, pass it through the pins on the pressure sensor and weld it to the pins to fix it;

[0018] Step 4: Install the temperature measuring circuit board with medium

[0019] One end of the temperature sensor is inserted into the temperature measurement channel, and the other end where the cold end temperature sensor is installed is connected and fixed to the main circuit board;

[0020] The fifth step is to evacuate the pressure chamber; then inject the pressure medium into the pressure chamber through the medium injection hole, and then seal the medium injection hole;

[0021] The sixth step is to connect the Hirschmann connector to the main circuit board through a lead wire, then install the Hirschmann connector on the shell, and finally connect and fix the shell and the main body together.

[0022] The beneficial effects of the present invention are: through the integrated structure of the main body and the sealed pressure-taking chamber, the problems of inaccurate pressure monitoring, small application range, and complex temperature sensor installation structure caused by the pressure-taking hole being blocked in the prior art are solved, and the material selection is relatively single due to the armored tube structure of the temperature sensor, and the corrosion performance is limited and cannot be applied to special corrosive media; and the production and assembly processes are reduced, the overall production efficiency of the product is improved, and the production cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a detailed schematic diagram of the overall structure of the present invention.

[0025] Figure symbols: main body 1, isolation diaphragm 11, protective ring 112, pressure sensor 12, main circuit board 121, temperature sensor assembly 13, medium temperature sensor 131, cold end temperature sensor 132, temperature measuring circuit board 133, pressure induction chamber 14, pressure induction channel 141, mounting seat 142, groove 143, temperature measuring channel 15, heat sink 16, support ring 17, external hexagonal surface 18, sealing ring 19, thread 20, sealing gasket 21, shell 2, Hirschmann joint 3, lead 4, injection hole 5, plugging piece 51. DETAILED DESCRIPTION

[0026] The following is combined with Figures 1 to 2 And Examples 1 to 4 further illustrate the present invention. Embodiment 1

[0027] See also Figure 1-2The present invention provides an integrated temperature and pressure transmitter, comprising a main body 1 with a process interface, a shell 2 connected to the main body 1 by threads, an isolation diaphragm 11 and a pressure sensor 12 fixed to the main body 1 by welding, the pressure sensor 12 being electrically connected to a main circuit board 121, the main circuit board 121 being mounted with a temperature sensor assembly, a Hirschmann connector 3 being connected to the shell 2 by threads, the Hirschmann connector 3 being electrically connected to the main circuit board 121 with a lead 4; the temperature sensor assembly 13 comprises a medium temperature sensor 131, a cold end temperature sensor 132 and a temperature measuring circuit board 133 on which the medium temperature sensor 131 and the cold end temperature sensor 132 are mounted, and the main body 1 is also provided with a pressure induction cavity 14 whose two ends are sealed by the isolation diaphragm 11 and the pressure sensor 12. The temperature measuring circuit board 133 on which the medium temperature sensor 131 and the cold end temperature sensor 132 are installed is electrically connected to the main circuit board 121, and is suspended and inserted into the temperature measuring channel 15, thereby replacing the armored temperature sensor, and is arranged inside the body 1, which also prevents the problem of corrosion of the temperature sensor component; the temperature measuring circuit board is spaced a certain distance from the inner wall of the temperature measuring channel 15, thereby preventing the temperature sensor component from being damaged by heat due to long-term contact with the temperature of the body 1 due to excessive temperature;

[0028] The medium temperature sensor 131 and the cold end temperature sensor 132 are combined to improve the accuracy of temperature monitoring; the medium temperature sensor 131 measures the process temperature T2; the cold end temperature sensor 132 is set at one end close to the pressure sensor 12 as the cold end reference temperature T 1， It is also used for linear compensation of pressure sensor 12; when the process temperature rises, T2 increases in real time with the process temperature, and the temperature difference TD = T2-T1

[0029] By sealing the pressure inlet cavity 14, the pressure inlet hole is prevented from being blocked when the transmitter is applied to special media such as relatively viscous media or media containing particles, thereby affecting the pressure monitoring accuracy; and the problem of restricted use environment is also solved.

[0030] In this embodiment, the pressure-inducing chamber 14 includes a pressure-inducing channel 141 and a mounting seat 142 for fixing the pressure sensor 12. The mounting seat 142 is provided with a groove 143. The pressure-inducing channel 141 is connected to the groove 143 on the mounting seat 142, and a pressure-inducing medium is injected into the interior. The pressure sensor 12 is fixed with a pressure-inducing medium injection hole 5 connected to the groove 143 on the mounting seat 142, and a plugging member 51 is provided on the medium injection hole 5. The mounting seat 142 is provided so that the pressure sensor 12 is fixedly connected to the mounting seat 142 by resistance welding, thereby improving the sealing effect of the connection. The pressure-inducing channel 141 is connected to the groove 143 on the mounting seat 142, and the pressure-inducing medium is injected into the interior to form a pressure-inducing chamber sealed by the isolation diaphragm assembly and the pressure sensor.

[0031] In this embodiment, the isolation diaphragm 11 is provided with a protective ring 112 outside the isolation diaphragm 11, and the isolation diaphragm 11 is fixedly connected to the protective ring 112, and the isolation diaphragm 11 is also fixedly connected to the main body 1; during assembly, the isolation diaphragm 11 is first welded to the main body, and then the protective ring is put on and welded and fixed to the main body, so that the isolation diaphragm 11 is arranged on the inner side of the protective ring 12, thereby reducing the erosion, friction and wear of the isolation diaphragm 11 by the viscous granular medium, thereby protecting the service life of the diaphragm.

[0032] In this embodiment, the body 1 is also provided with a temperature measuring channel 15, a heat sink 16, a support ring 17 and an outer hexagonal surface 18 and is threadedly connected to the medium device; the pressure chamber 14, the temperature measuring channel 15, the heat sink 16, the support ring 17 and the outer hexagonal surface 18 are an integrated structure with the body 1. The heat sink 16 is provided to improve the heat dissipation effect of the transmitter, thereby preventing the temperature in the transmitter from being too high for a long time and shortening the service life of the electronic components; the temperature measuring channel and the body are integrated into a structure, thereby replacing the existing armored temperature sensor, thereby solving the problems of complex structure, low assembly efficiency and high cost of the armored temperature sensor. Through the provision of the support ring and the pressure sensor, the main circuit board is supported and fixed, and the installation of the circuit board does not need to be fixed with screws, thereby simplifying the fixing structure of the main circuit board and reducing the assembly process and thread processing technology.

[0033] The pressure chamber 14, the temperature measuring channel 15, the heat sink 16, the support ring 17 and the outer hexagonal surface 18 are integrated with the main body to improve the protection of the pressure sensor and the temperature sensor assembly; and it has the advantages of a flush membrane and can measure both pressure and temperature parameters at the same time.

[0034] In this embodiment, the main body 1 and the shell 2 are fixed by threaded connection, and a sealing ring 19 is provided between them; thereby improving the efficiency of assembly and the sealing effect between the main body 1 and the shell 2, thereby preventing the humid medium generated by the external environment from entering and reducing the service life of the electronic components.

[0035] In this embodiment, the structure detachably connected to the medium device is a thread 20 and a sealing gasket 21 installed between the thread 20 and the outer hexagonal surface 18. The thread 20 is connected to the medium device to facilitate assembly, and the sealing gasket 21 prevents the medium from leaking out of the device, thereby improving the sealing performance.

[0036] When the transmitter is used, it is connected to the medium device through a thread, and the body of the transmitter is deeply inserted into the medium device; when the pressure in the medium device increases, the isolation diaphragm is deformed in the direction of the pressure chamber, and while the isolation diaphragm is deformed, the pressure medium in the pressure chamber, which is generally oil or other liquid medium, is squeezed in the direction of the pressure sensor, so that the pressure sensor senses the pressure, and the pressure sensor transmits the pressure signal to the MUC chip set on the main circuit board for calculation, thereby transmitting the pressure parameter to the external device through the lead 4 and the Hirschman connector 3; in this process, since the two ends of the pressure chamber are sealed, the pressure chamber will not be blocked by the monitored medium, and because it is sealed, when the isolation diaphragm is deformed and squeezes the medium in the pressure chamber, the pressure medium can only move in the direction of the pressure sensor, thereby making the pressure monitoring more accurate; while monitoring the pressure, the medium temperature sensor 131 and the temperature parameters measured by the cold end temperature sensor 132 are transmitted to the MUC chip on the main circuit board through the temperature measuring circuit board 133 for calculation, thereby transmitting the temperature parameters to the external device through the lead 4 and the Hirschman connector 3. Embodiment 2

[0037] This embodiment discloses a manufacturing process of a temperature and pressure integrated transmitter, and the manufacturing process specifically includes the following steps:

[0038] The first step is to machine the body to form an integral structure in the body, and then connect and fix the isolation diaphragm 11 and the body 1 by welding. The material of the isolation diaphragm 11 is monel alloy;

[0039] The second step is to fix the pressure sensor 12 on the mounting seat 142 by resistance welding so that one end of the pressure sensor 12 is placed in the groove 143 of the mounting seat;

[0040] The third step is to place the main circuit board 121 on the support ring 17 and fix it to the pins on the pressure sensor 12 by welding; the installation and fixation of the main circuit board 121 is completed;

[0041] Step 4: insert one end of the temperature measuring circuit board 133 with the medium temperature sensor 131 installed into the temperature measuring channel 15, and weld the other end with the cold end temperature sensor 132 to the main circuit board 121;

[0042] The fifth step is to evacuate the pressure chamber 14; then inject the pressure medium into the pressure chamber 14 through the medium injection hole 5, and then seal the medium injection hole 5 through the sealing member 51 by welding;

[0043] In the sixth step, the Hirschmann connector 21 is connected to the main circuit board 121 through the lead 3, and then the Hirschmann connector 21 is installed on the housing 2 through a threaded connection, and finally the housing 2 and the main body 1 are fixed together through a threaded connection. Embodiment 3

[0044] The difference between this embodiment and embodiment 2 is that the material of the isolation diaphragm 11 is tantalum alloy. Embodiment 4

[0045] The difference between this embodiment and embodiments 2 and 3 is that the material of the isolation diaphragm can also be 316 stainless steel.

[0046] The protection scope of the present invention is not limited to the above embodiments and their variations. Conventional modifications and replacements made by those skilled in the art based on the contents of the above embodiments all fall within the protection scope of the present invention.

Claims

1. A temperature and pressure integrated transmitter, comprising a body (1) having a process interface, a shell (2) detachably connected to the body (1), an isolation diaphragm (11) fixed to the body (1), and a pressure sensor (12), wherein the body (1) is provided with a temperature measurement channel (15), the pressure sensor (12) is connected to a main circuit board (121), a temperature sensor assembly (13) is mounted on the main circuit board (121), a Hirschmann connector (3) is detachably connected to the shell (2), and a lead wire (4) electrically connected is provided between the Hirschmann connector (3) and the main circuit board (121); characterized in that The temperature sensor assembly (13) comprises a medium temperature sensor (131), a cold end temperature sensor (132) and a temperature measuring circuit board (133) on which the medium temperature sensor (131) and the cold end temperature sensor (132) are mounted. The body (1) is also provided with a pressure induction cavity (14) whose two ends are sealed by an isolation diaphragm (11) and a pressure sensor (12). The temperature measuring circuit board (133) on which the medium temperature sensor (131) and the cold end temperature sensor (132) are mounted is electrically connected to the main circuit board (121) and suspended in the air. The temperature measuring channel (15) is inserted into the body (1), and is arranged inside the body (1); the pressure induction chamber (14) comprises a pressure induction channel (141) and a mounting seat (142) for fixing the pressure sensor (12); the mounting seat (142) is provided with a groove (143); the pressure induction channel (141) is connected to the groove (143) on the mounting seat (142), and a pressure induction medium is injected into the interior; the pressure sensor (12) is fixed with a pressure induction medium injection hole (5) connected to the groove (143) on the mounting seat (142).

2. A temperature and pressure integrated transmitter as claimed in claim 1, characterized in that: The isolation diaphragm (11) is provided with a protective ring (112) outside, the isolation diaphragm (11) is fixedly connected to the protective ring (112), and the isolation diaphragm (11) is also fixedly connected to the body (1).

3. A temperature and pressure integrated transmitter as claimed in claim 2, characterized in that: The material of the isolation diaphragm (11) is one of monel alloy, tantalum alloy and stainless steel.

4. The temperature and pressure integrated transmitter according to claim 1, characterized in that: The main body (1) is also provided with a heat sink (16), a support ring (17), an outer hexagonal surface (18), and a structure that can be detachably connected to a medium device; the pressure-inducing chamber (14), the temperature measurement channel (15), the heat sink (16), the support ring (17), and the outer hexagonal surface (18) are an integrated structure with the main body (1).

5. A temperature and pressure integrated transmitter as claimed in claim 4, characterized in that: The main body (1) and the shell (2) are detachably connected and fixed, and a sealing ring (19) is provided between them.

6. A temperature and pressure integrated transmitter as claimed in claim 5, characterized in that: The structure detachably connected to the medium device comprises a thread (20) and a sealing gasket (21) installed between the thread (20) and the outer hexagonal surface (18).

7. The manufacturing process of the temperature and pressure integrated transmitter according to any one of claims 1 to 6, characterized in that: The steps include: The first step is to connect and fix the isolation diaphragm (11) to the body (1); The second step is to fix the pressure sensor (12) on the mounting seat (142) so that one end of the pressure sensor (12) is placed in the groove (143) of the mounting seat; The third step is to place the main circuit board (121) on the support ring (17), pass it through the pins on the pressure sensor (12), and fix it by welding to the pins; Step 4: insert one end of the temperature measuring circuit board (133) on which the medium temperature sensor (131) is installed into the temperature measuring channel (15), and the other end on which the cold end temperature sensor (132) is installed is connected and fixed to the main circuit board (121) by welding; The fifth step is to evacuate the pressure-inducing chamber (14); then inject a pressure-inducing medium into the pressure-inducing chamber (14) through the medium injection hole (5); and then seal the medium injection hole (5); In the sixth step, the Hirschmann connector (3) is connected to the main circuit board (121) via the lead wire (4), the Hirschmann connector (3) is then mounted on the housing (2), and finally the housing (2) and the main body (1) are connected and fixed together.

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