Electronic modules

Abstract

The present application relates to an electronic module. The electronic module includes an electronic panel, a circuit unit, a supporting film, and a connecting portion. The circuit unit includes a circuit film electrically connected to the electronic panel and a circuit chip mounted on the circuit film. The supporting film is attached to the circuit film. The connecting portion is attached to the supporting film and covers the circuit chip.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0101324, filed on August 19, 2019, which is hereby incorporated by reference herein in its entirety. Technical Field

[0003] Embodiments of the present invention relate to an electronic module having improved reliability and a method of manufacturing the electronic module. Background Art

[0004] The electronic module operates in response to electrical signals applied to it. The electronic module receives these electrical signals to display images or sense touch events. The electronic module includes an electronic panel and a circuit unit that drives the electronic panel. The circuit unit is either separate from the electronic panel and connected to it via a flexible circuit board, or it includes a circuit board that is directly connected to the electronic panel.

[0005] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0006] Embodiments of the present invention provide an electronic module with improved reliability.

[0007] An embodiment of the present invention also provides a method for manufacturing the electronic module.

[0008] Additional features of the present inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present inventive concept.

[0009] Embodiments of the present inventive concept provide an electronic module including an electronic panel, a circuit unit, a supporting film, and a connecting portion. The circuit unit includes a circuit film electrically connected to the electronic panel and a circuit chip mounted on the circuit film. The supporting film is attached to the circuit film. The connecting portion is attached to the supporting film and covers the circuit chip.

[0010] When viewed in plane, the supporting film may not overlap with the circuit chip.

[0011] The circuit film may include a first circuit area connected to the electronic panel and a second circuit area connected to the first circuit area, and the supporting film may include a first supporting area attached to the first circuit area and a second supporting area attached to the second circuit area.

[0012] When viewed in plane, the connection portion may overlap with the first support region, the second support region, and the circuit chip.

[0013] The first circuit region may extend in a first direction, the second circuit region may extend from the first circuit region in a second direction crossing the first direction, the first support region may extend in the first direction, and the second support region may extend from the first support region in the second direction.

[0014] The connecting portion may include a connecting film, a first filling member provided between the first supporting region and the connecting film, and a second filling member provided between the second supporting region and the connecting film.

[0015] The upper surface of the connecting film may be flat.

[0016] The connecting portion may further include a first adhesive layer disposed between the first filling piece and the first supporting area, a second adhesive layer disposed between the first filling piece and the connecting film, a third adhesive layer disposed between the second filling piece and the second supporting area, and a fourth adhesive layer disposed between the second filling piece and the connecting film.

[0017] The electronic module may further include a fifth adhesive layer disposed between the circuit chip and the connection film.

[0018] Each of the first adhesive layer, the second adhesive layer, the third adhesive layer, and the fourth adhesive layer may have an adhesive force greater than that of the fifth adhesive layer.

[0019] Each of the first adhesive layer, the second adhesive layer, the third adhesive layer, and the fourth adhesive layer may have a thickness greater than that of the fifth adhesive layer.

[0020] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the inventive concept.

[0022] Figure 1 is a perspective view showing an electronic device according to an embodiment of the present invention.

[0023] Figure 2 is an exploded perspective view showing an electronic device according to an embodiment of the present invention.

[0024] Figure 3 is a plan view showing a portion of an electronic module according to an embodiment of the present invention.

[0025] Figure 4 According to an embodiment of the present invention, Figure 3 A cross-sectional view taken along line AA'.

[0026] Figure 5 is a transparent plan view showing a portion of an electronic module according to an embodiment of the present invention.

[0027] Figure 6 According to an embodiment of the present invention, Figure 5 A cross-sectional view taken along line BB'.

[0028] Figure 7 is a flowchart illustrating a method of manufacturing an electronic module according to an embodiment of the present invention.

[0029] Figure 8 is a perspective view showing a portion of an electronic module according to an embodiment of the present invention.

[0030] Figure 9 is a plan view showing an electronic module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] In the following description, for the purpose of illustration, many specific details are set forth to provide a thorough understanding of various embodiments of the present invention. As used herein, an "embodiment" is a non-limiting example of a device or method using one or more of the inventive concepts disclosed herein. However, it is apparent that various embodiments can be put into practice without these specific details or with one or more equivalent arrangements. In other examples, well-known structures and devices are shown in block diagram form to avoid unnecessarily blurring the various embodiments. In addition, various embodiments can be different, but not necessarily exclusive. For example, without departing from the present invention, the specific shape, configuration and characteristics of the embodiment can be used or implemented in another embodiment.

[0032] Unless otherwise indicated, the embodiments shown should be understood as providing exemplary features of different details of some ways in which the present invention can be implemented in practice. Therefore, unless otherwise indicated, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the present invention.

[0033] The use of cross hatching and / or shading in the drawings is generally to make the boundaries between adjacent elements clear. Therefore, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for specific materials, material properties, dimensions, proportions, commonalities between illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the sizes and relative sizes of the elements may be exaggerated for clarity and / or descriptive purposes. When the embodiments can be implemented differently, the specific processing order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0034] When an element, such as a layer, is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or coupled to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without the presence of intervening elements. In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, the y-axis, and the z-axis), and may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0035] Although the terms "first," "second," etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0036] Spatially relative terms such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein for descriptive purposes, and thereby to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both the above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0037] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "one", "an" and "the" are intended to also include plural forms. In addition, when used in this specification, the terms "comprise", "comprises", "includes" and / or "includes" represent the existence of stated features, integral bodies, steps, operations, elements, parts and / or their sets, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or their sets. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as degree terms, and are therefore used to allow for the inherent deviation in measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0038] Various embodiments are described herein with reference to cross-sectional and / or exploded views that are schematic representations of idealized embodiments and / or intermediate structures. As such, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments disclosed herein should not necessarily be construed as limited to the particular illustrated shapes of regions, but rather include deviations in shapes due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device and, therefore, are not necessarily intended to be limiting.

[0039] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0040] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0041] Figure 1 is a perspective view showing an electronic device EA according to an embodiment of the present invention, and Figure 2 FIG. 1 is an exploded perspective view of the electronic device EA according to the embodiment of the present invention.

[0042] exist Figure 1 and Figure 2 In the embodiment, the electronic device EA can be activated in response to an electrical signal. The electronic device EA can include various embodiments. For example, the electronic device EA can be a tablet computer, a notebook computer, a computer, or a smart TV. In this embodiment, a smart phone will be described as a representative example of the electronic device EA.

[0043] The electronic device EA may display an image IM through the front surface FS. The front surface FS may be substantially parallel to a plane defined by the first direction DR1 and the second direction DR2. The front surface FS may include a transmissive area TA and a bezel area BZA defined adjacent to the transmissive area TA.

[0044] The electronic device EA may display an image IM through the transmissive area TA. The image IM may include at least one of a still image and a moving image. Figure 1 A clock widget and application icons are shown as representative examples of the image IM.

[0045] The transmission area TA may have a square shape having sides substantially parallel to each of the first and second directions DR1 and DR2, however, this is merely exemplary. The transmission area TA according to an embodiment of the present invention may have various shapes and should not be particularly limited thereto.

[0046] The border area BZA may have a predetermined color. The border area BZA may be an area having a relatively lower transmittance than the transmittance of the transmissive area TA. The border area BZA may be adjacent to the transmissive area TA. The border area BZA may surround the transmissive area TA, thereby defining the shape of the transmissive area TA. However, this is merely exemplary. The border area BZA according to an embodiment of the present invention may be provided adjacent to only one side of the transmissive area TA, or may be omitted. The electronic device EA according to an embodiment of the present invention may include various embodiments and should not be particularly limited thereto.

[0047] The normal direction of the front surface FS may correspond to the thickness direction DR3 of the electronic device EA (hereinafter referred to as the "third direction"). In this embodiment, the front surface (or upper surface) and the rear surface (or lower surface) of each member may be defined relative to the direction along which the image IM is displayed. The front surface and the rear surface may be opposite to each other in the third direction DR3.

[0048] The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative to each other, and therefore, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to other directions. In addition, the surface defined by the first direction DR1 and the second direction DR2 is defined as a "plane", and the expression "when viewed in a plan view" may mean a state viewed in the third direction DR3.

[0049] The electronic device EA can sense external input TC applied thereto from the outside. The external input TC may include various forms of external input, such as a part of the user's body, light, heat, or pressure. In addition, the electronic device EA can sense touch input and input applied when approaching or proximately approaching the electronic device EA (e.g., proximity input).

[0050] The electronic device EA may include a window 100, an electronic module 200, a control module 300, and a housing 400. The window 100 and the housing 400 are coupled to each other to form an exterior appearance of the electronic device EA.

[0051] The window 100 may be provided on the electronic module 200 and may cover the front surface IS of the electronic module 200. The window 100 may include an optically transparent insulating material. For example, the window 100 may include a glass substrate, a sapphire substrate, or a plastic film. The window 100 may have a single-layer or multi-layer structure. As an example, the window 100 may have a stacked structure in which multiple plastic films are attached to each other via an adhesive, or a stacked structure in which a glass substrate is attached to plastic films via an adhesive.

[0052] The window 100 may include a front surface FS exposed to the outside. The front surface FS of the electronic device EA may be defined by the front surface FS of the window 100.

[0053] The electronic module 200 may be provided below the window 100. The electronic module 200 may display an image IM and may sense an external input TC. The electronic module 200 may include a front surface IS having a display area AA and a non-display area NAA. The display area AA may be an area activated in response to an electrical signal.

[0054] The display area AA according to an embodiment of the present invention may be an area in which an image IM is displayed and an external input TC is sensed substantially simultaneously. The transmissive area TA may overlap with the display area AA. For example, the transmissive area TA may overlap the entire surface of the display area AA or at least a portion thereof. Thus, a user may view the image IM through the transmissive area TA, or may provide an external input TC through the transmissive area TA. However, this is merely exemplary. The area in which the image IM is displayed and the area in which the external input TC is sensed may be separate from each other within the display area AA and should not be limited thereto.

[0055] The non-display area NAA may be an area covered by the bezel area BZA. The non-display area NAA may be defined to be adjacent to the display area AA. The non-display area NAA may surround the display area AA. A driving circuit or driving line may be arranged in the non-display area NAA to drive the display area AA.

[0056] The electronic module 200 can be assembled in a flat state with the display area AA and the non-display area NAA facing the window 100. However, this arrangement is merely exemplary, and a portion of the non-display area NAA can be curved. In this case, a portion of the non-display area NAA can be curved toward the rear surface of the electronic module 200, and thus, the frame area BZA can be reduced in the front surface FS of the electronic device EA. In another configuration, the electronic module 200 can be assembled in a state in which the display area AA is partially curved. However, this is merely exemplary, and the non-display area NAA can be omitted.

[0057] The electronic module 200 may include an electronic panel 210 and a circuit unit 220. The electronic panel 210 may include a display panel DP and an input sensing panel ISP.

[0058] The display panel DP may have a configuration that basically generates an image IM. The image IM generated by the display panel DP may be displayed on the front surface FS through the transmissive area TA and may be viewed externally by a user. According to an embodiment of the present invention, the display panel DP may be a light-emitting display panel. However, the present invention is not limited thereto. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots or quantum rods.

[0059] The input sensing panel ISP may be disposed on the display panel DP. The input sensing panel ISP may sense an external input TC provided from the outside.

[0060] The circuit unit 220 may be electrically connected to the electronic panel 210. The circuit unit 220 may include a first circuit film CF1, a second circuit film CF2, and a circuit chip IC. The first circuit film CF1 may be electrically connected to the display panel DP. The first circuit film CF1 may connect the display panel DP and the controller 310. In an embodiment of the present invention, the first circuit film CF1 may be a flexible circuit film.

[0061] The first circuit film CF1 may be connected to the display pad PDD of the display panel DP disposed in the non-display area NAA. The first circuit film CF1 may provide an electrical signal to the display panel DP to drive the display panel DP. The electrical signal may be generated by the controller 310.

[0062] The second circuit film CF2 may be electrically connected to the input sensing panel ISP. The second circuit film CF2 may connect the input sensing panel ISP and the controller 310. In an embodiment of the present invention, the second circuit film CF2 may be a flexible circuit film.

[0063] The second circuit film CF2 may be connected to the sensing pad PDS of the input sensing panel ISP disposed in the non-display area NAA. The second circuit film CF2 may provide an electrical signal to the input sensing panel ISP to drive the input sensing panel ISP. The electrical signal may be generated by a circuit chip IC disposed on the second circuit film CF2 or by the controller 310.

[0064] The circuit chip IC may be mounted on the second circuit film CF2. For example, the circuit chip IC may be mounted on the second circuit film CF2 using a chip-on-film (COF) method. The circuit chip IC may include a driver chip that transmits electrical signals to the input sensing panel ISP. For example, the circuit chip IC may generate electrical signals required for operating the input sensing panel ISP based on control signals provided by the controller 310.

[0065] The control module 300 may be disposed below the electronic module 200. The control module 300 may include a controller 310 and a power supply unit 320.

[0066] The controller 310 can provide electrical signals to the electronic module 200. The controller 310 may include various functional modules for driving the electronic module 200 and connectors for power supply. The functional modules may include a wireless communication module, an image input module, a sound input module, a memory, an external interface, a light emitting module, a light receiving module, and a camera module. The functional modules may be mounted on a motherboard. The motherboard may include a rigid printed circuit board. Some of the functional modules may be electrically connected to the motherboard via a flexible circuit film rather than being mounted on the motherboard.

[0067] Each of the first circuit film CF1 and the second circuit film CF2 may be connected to the controller 310, however, this is merely exemplary. In the electronic module 200 according to an embodiment of the present invention, the display panel DP and the input sensing panel ISP may be connected to different controllers, and one of the first circuit film CF1 and the second circuit film CF2 may not be connected to the controller 310. However, the present invention should not be limited thereto or thereby.

[0068] The power supply unit 320 may supply power required for the overall operation of the electronic device EA. The power supply unit 320 may include a conventional battery module.

[0069] The housing 400 may be provided below the control module 300. The housing 400 may form an exterior appearance of the electronic device EA together with the window 100. The housing 400 may include a material having greater rigidity than that of the electronic module 200.

[0070] In an embodiment of the present invention, the housing 400 may have a single body. However, the present invention should not be limited to or constrained thereby. For example, the housing 400 according to an embodiment of the present invention may include multiple bodies assembled with each other. Specifically, the housing 400 may include multiple frames and / or multiple plates formed of glass, plastic, or metal materials. The housing 400 may provide a predetermined accommodation space. The electronic module 200 and the control module 300 may be accommodated in the accommodation space and may be protected from external impacts.

[0071] Figure 3 is a plan view showing a portion of an electronic module 200 according to an embodiment of the present invention, and Figure 4 It is along Figure 3 A cross-sectional view taken along line AA'.

[0072] Reference Figure 3 and Figure 4, the second circuit film CF2 may be connected to the sensing pad PDS of the input sensing panel ISP. The second circuit film CF2 may include a first circuit area CA1 and a second circuit area CA2.

[0073] The first circuit area CA1 may be connected to the input sensing panel ISP. The first circuit area CA1 may extend in a first direction DR1.

[0074] The second circuit region CA2 may be connected to the first circuit region CA1. The second circuit region CA2 may extend from one side of the first circuit region CA1 in the second direction DR2.

[0075] The circuit chip IC may be provided on the second circuit film CF2.

[0076] The electronic module 200 may further include a supporting film SF and a connecting portion CP. The supporting film SF may be attached to the second circuit film CF2. The supporting film SF may support the second circuit film CF2 when the second circuit film CF2 is bent. The supporting film SF may include polyethylene terephthalate (PET). However, this is merely exemplary, and the supporting film SF may include various materials. When viewed in a plane, the supporting film SF may not overlap with the circuit chip IC. The supporting film SF may include a first supporting area SA1 and a second supporting area SA2.

[0077] The first support area SA1 may be attached to a portion of the first circuit area CA1 by a pressure-sensitive adhesive.The first support area SA1 may extend in the first direction DR1.

[0078] The second supporting area SA2 may be attached to a portion of the second circuit area CA2 by a pressure-sensitive adhesive.The second supporting area SA2 may extend from one side of the first supporting area SA1 in the second direction DR2.

[0079] The connection portion CP may be provided on the circuit chip IC and may connect the first support area SA1 and the second support area SA2. When viewed in a plane, the connection portion CP may overlap the first support area SA1, the second support area SA2, and the circuit chip IC.

[0080] like Figure 4 As shown in FIG, the connection part CP may include a connection film CNF, a first filler FL1, a second filler FL2, a first adhesive layer AD1, a second adhesive layer AD2, a third adhesive layer AD3, a fourth adhesive layer AD4, and a fifth adhesive layer AD5.

[0081] The connecting film CNF may be disposed on the first supporting area SA1, the second supporting area SA2, and the circuit chip IC. The upper surface CNF-U of the connecting film CNF may be flat. The connecting film CNF may include polyethylene terephthalate (PET). However, this is merely exemplary, and the connecting film CNF may include various materials. The connecting film CNF may include the same material as the supporting film SF.

[0082] The first filler FL1 can be arranged between the first supporting area SA1 and the connecting film CNF. The second filler FL2 can be arranged between the second supporting area SA2 and the connecting film CNF. The first filler FL1 and the second filler FL2 can prevent the formation of a step difference on the upper surface CNF-U of the connecting film CNF. The first filler FL1 and the second filler FL2 may include fillers including a foam material. However, this is merely exemplary, and the first filler FL1 and the second filler FL2 may include various other types of fillers. The first filler FL1 may be referred to as a "first compensation layer", and the second filler FL2 may be referred to as a "second compensation layer".

[0083] A first adhesive layer AD1 may be disposed between the first filler FL1 and the first support area SA1. A second adhesive layer AD2 may be disposed between the first filler FL1 and the connection film CNF. A third adhesive layer AD3 may be disposed between the second filler FL2 and the second support area SA2. A fourth adhesive layer AD4 may be disposed between the second filler FL2 and the connection film CNF. Each of the first adhesive layer AD1, the second adhesive layer AD2, the third adhesive layer AD3, and the fourth adhesive layer AD4 may include a pressure-sensitive adhesive.

[0084] In an embodiment of the present invention, the first adhesive layer AD1, the second adhesive layer AD2, the third adhesive layer AD3, and the fourth adhesive layer AD4 may be omitted. In this case, the first filler member FL1 may be directly attached to the first supporting area SA1 and the connection film CNF, and the second filler member FL2 may be directly attached to the second supporting area SA2 and the connection film CNF.

[0085] The fifth adhesive layer AD5 may be provided between the circuit chip IC and the connection film CNF. The fifth adhesive layer AD5 may include a pressure-sensitive adhesive.

[0086] According to an embodiment of the present invention, each of the first thickness TK1 of the first adhesive layer AD1, the second thickness TK2 of the second adhesive layer AD2, the third thickness TK3 of the third adhesive layer AD3, and the fourth thickness TK4 of the fourth adhesive layer AD4 may be greater than the fifth thickness TK5 of the fifth adhesive layer AD5. For example, each of the first thickness TK1, the second thickness TK2, the third thickness TK3, and the fourth thickness TK4 may be at least three times greater than the fifth thickness TK5. Specifically, each of the first thickness TK1, the second thickness TK2, the third thickness TK3, and the fourth thickness TK4 may be approximately 0.1 mm, and the fifth thickness TK5 may be approximately 0.03 mm.

[0087] According to an embodiment of the present invention, the adhesive forces of the first adhesive layer AD1, the second adhesive layer AD2, the third adhesive layer AD3 and the fourth adhesive layer AD4 may be greater than the adhesive force of the fifth adhesive layer AD5, so that the connection film CNF can be easily removed from the circuit chip IC.

[0088] The supporting film SF can be designed so that it does not overlap with the circuit chip IC in the area adjacent to the circuit chip IC when viewed in a planar manner. The area of ​​the supporting film SF adjacent to the circuit chip IC can have a first width TK-CA. The first width TK-CA can be relatively smaller than the second width TK-CA1 of the first supporting area SA1 and the third width TK-CA2 of the second supporting area SA2. For example, the first width TK-CA can be approximately 2.5 mm. The force supporting the second circuit film CF2 in the area with the first width TK-CA can be weaker than the force supporting the second circuit film CF2 in the area with the second width TK-CA1 and the third width TK-CA2. In this case, when the second circuit film CF2 bends, the shape of the supporting film SF in the area with the first width TK-CA may be deformed, and as a result, the second circuit film CF2 may be misaligned. However, according to an embodiment of the present invention, the connecting portion CP can reinforce the area with the first width TK-CA. For example, the connecting portion CP can be attached to the first supporting area SA1, the second supporting area SA2, and the circuit chip IC. According to the present invention, the said area of ​​the supporting film SF can be reinforced by the connecting portion CP. Therefore, when the second circuit film CF2 is bent, the shape of the support film SF can be prevented from being deformed by the connection portion CP. As a result, the bent second circuit film CF2 can be prevented from being displaced. Therefore, the electronic module 200 (refer to FIG. 2 ) can be improved. Figure 2 ) reliability.

[0089] Figure 5 is a transparent plan view showing a portion of the electronic module 200-1 according to an embodiment of the present invention, and Figure 6 According to an embodiment of the present invention, Figure 5A cross-sectional view taken along line BB'.

[0090] Reference Figure 5 and Figure 6 The first circuit film CF1-1 may be connected to the display pad PDD of the display panel DP. The circuit chip IC-1 may be disposed on the first circuit film CF1-1. The circuit chip IC-1 may generate an electrical signal for driving the display panel DP.

[0091] The electronic module 200-1 may further include a supporting film SF-1 and a connecting portion CP-1. The supporting film SF-1 may be attached to the first circuit film CF1-1. The supporting film SF-1 may support the first circuit film CF1-1 when the first circuit film CF1-1 is bent. The supporting film SF-1 may include polyethylene terephthalate (PET). However, this is merely exemplary, and the supporting film SF-1 may include various materials. When viewed in a plane, the supporting film SF-1 may not overlap with the circuit chip IC-1. The supporting film SF-1 may include a first supporting area SA1-1 and a second supporting area SA2-1.

[0092] When viewed in a plane, the first supporting area SA1 - 1 and the second supporting area SA2 - 1 may be spaced apart from each other with the circuit chip IC- 1 interposed therebetween.

[0093] The connection portion CP-1 may be provided on the circuit chip IC-1 and may connect the first support area SA1-1 and the second support area SA2-1. When viewed in a plane, the connection portion CP-1 may overlap the first support area SA1-1, the second support area SA2-1, and the circuit chip IC-1.

[0094] like Figure 6 As shown in the figure, the connection part CP-1 may include a connection film CNF-1, a first filler FL1-1, a second filler FL2-1, a first adhesive layer AD1-1, a second adhesive layer AD2-1, a third adhesive layer AD3-1, a fourth adhesive layer AD4-1 and a fifth adhesive layer AD5-1.

[0095] The connecting film CNF-1 may be disposed on the first supporting area SA1-1, the second supporting area SA2-1, and the circuit chip IC-1. The upper surface CNF-1U of the connecting film CNF-1 may be flat. The connecting film CNF-1 may include polyethylene terephthalate (PET). However, this is merely exemplary, and the connecting film CNF-1 may include various materials. The connecting film CNF-1 may include the same material as the supporting film SF-1.

[0096] The first filler FL1-1 may be disposed between the first support area SA1-1 and the connection film CNF-1. The second filler FL2-1 may be disposed between the second support area SA2-1 and the connection film CNF-1. The first filler FL1-1 and the second filler FL2-1 may prevent a step from being formed on the upper surface CNF-1U of the connection film CNF-1. The first filler FL1-1 and the second filler FL2-1 may include fillers made of a foam material. However, this is merely exemplary, and the first filler FL1-1 and the second filler FL2-1 may include various other types of fillers.

[0097] A first adhesive layer AD1-1 may be disposed between the first filler FL1-1 and the first support area SA1-1. A second adhesive layer AD2-1 may be disposed between the first filler FL1-1 and the connection film CNF-1. A third adhesive layer AD3-1 may be disposed between the second filler FL2-1 and the second support area SA2-1. A fourth adhesive layer AD4-1 may be disposed between the second filler FL2-1 and the connection film CNF-1. Each of the first adhesive layer AD1-1, the second adhesive layer AD2-1, the third adhesive layer AD3-1, and the fourth adhesive layer AD4-1 may include a pressure-sensitive adhesive.

[0098] In an embodiment of the present invention, the first adhesive layer AD1-1, the second adhesive layer AD2-1, the third adhesive layer AD3-1, and the fourth adhesive layer AD4-1 may be omitted. In this case, the first filler member FL1-1 may be directly attached to the first supporting area SA1-1 and the connecting film CNF-1, and the second filler member FL2-1 may be directly attached to the second supporting area SA2-1 and the connecting film CNF-1.

[0099] The fifth adhesive layer AD5-1 may be provided between the circuit chip IC-1 and the connection film CNF-1.The fifth adhesive layer AD5-1 may include a pressure-sensitive adhesive.

[0100] According to an embodiment of the present invention, each of the first thickness TK1-1 of the first adhesive layer AD1-1, the second thickness TK2-1 of the second adhesive layer AD2-1, the third thickness TK3-1 of the third adhesive layer AD3-1, and the fourth thickness TK4-1 of the fourth adhesive layer AD4-1 may be greater than the fifth thickness TK5-1 of the fifth adhesive layer AD5-1. For example, each of the first thickness TK1-1, the second thickness TK2-1, the third thickness TK3-1, and the fourth thickness TK4-1 may be three times greater than the fifth thickness TK5-1 or more. In detail, each of the first thickness TK1-1, the second thickness TK2-1, the third thickness TK3-1, and the fourth thickness TK4-1 may be approximately 0.1 mm, and the fifth thickness TK5-1 may be approximately 0.03 mm.

[0101] According to an embodiment of the present invention, the adhesive force of the first adhesive layer AD1-1, the second adhesive layer AD2-1, the third adhesive layer AD3-1, and the fourth adhesive layer AD4-1 can be greater than the adhesive force of the fifth adhesive layer AD5-1. Therefore, the connection film CNF-1 can be easily removed from the circuit chip IC-1.

[0102] The support film SF-1 can be designed so as not to overlap the circuit chip IC-1 in the area adjacent to the circuit chip IC-1 when viewed in a planar manner. The first support area SA1-1 and the second support area SA2-1 can be spaced apart from each other, with the circuit chip IC-1 interposed between the first support area SA1-1 and the second support area SA2-1. When the first circuit film CF1-1 is bent, the shape of the support film SF-1 may be deformed, and as a result, the first and second support areas SA1-1 and SA2-1 may be displaced. However, according to an embodiment of the present invention, the connection portion CP-1 can be attached to the first support area SA1-1, the second support area SA2-1, and the circuit chip IC-1. According to the present invention, when the first circuit film CF1-1 is bent, the area between the first and second support areas SA1-1 and SA2-1 can be reinforced by the connection portion CP-1. When the first circuit film CF1-1 is bent, the connection portion CP-1 can prevent the shape of the support film SF-1 from being deformed. As a result, the bent first circuit film CF1-1 can be prevented from being displaced. Therefore, the reliability of the electronic module 200 - 1 can be improved.

[0103] Figure 7 FIG. 2 is a diagram showing a method for manufacturing an electronic module 200 (see FIG. Figure 2 ), and Figure 8 is a perspective view showing a portion of an electronic module 200 according to an embodiment of the present invention.

[0104] Reference Figure 7and Figure 8 The electronic module 200 can be set to execute the circuit unit 220 (refer to Figure 2 ) is placed on a bending stage (S10). The support film SF may be attached to the second circuit film CF2 (S20). The connection portion CP may be attached to the support film SF and the circuit chip IC (S30).

[0105] The second circuit film CF2 may be bent after attaching the supporting film SF and the connection portion CP ( S40 ). The bending of the second circuit film CF2 may include adsorbing the supporting film SF and bending the supporting film SF and the second circuit film CF2 .

[0106] The support film SF can be fixed by the suction portion VP. For example, the support film SF can be vacuum-adsorbed by the suction portion VP. Since the width of the second circuit film CF2 is smaller than that of the support film SF, there may not be enough space for the suction portion VP to adsorb the second circuit film CF2. However, according to the present invention, since the width of the support film SF is greater than that of the second circuit film CF2, the suction portion VP can adsorb the support film SF. With the support film SF adsorbed to the suction portion VP, both the support film SF and the second circuit film CF2 can bend. Therefore, a manufacturing method for the electronic module 200 can be provided that improves the assemblability of the electronic module 200.

[0107] According to the present invention, when the second circuit film CF2 is bent, the area of ​​the supporting film SF adjacent to the circuit chip IC can be reinforced by the connecting portion CP. When the second circuit film CF2 is bent, the connecting portion CP prevents the supporting film SF from deforming. As a result, the bent second circuit film CF2 can be prevented from shifting. Therefore, the reliability of the electronic module 200 manufactured using this manufacturing method can be improved.

[0108] The suction portions VP disposed in the first supporting area SA1 may be arranged to be spaced apart from each other in the first direction DR1 , and the suction portions VP disposed in the second supporting area SA2 may be arranged to be spaced apart from each other in the second direction DR2 .

[0109] Figure 9 is a plan view showing an electronic module 200 according to an embodiment of the present invention.

[0110] Reference Figures 7 to 9 , the first circuit film CF1 and the second circuit film CF2 may be bent and assembled to overlap with the rear surface of the display panel DP ( S40 ).

[0111] After the second circuit film CF2 is bent, the support film SF and the connection portion CP may be removed (S50). A pressure-sensitive adhesive may be provided between the first circuit film CF1 and the support film SF, and between the second circuit film CF2 and the support film SF, to attach the first circuit film CF1 to the support film SF, and to attach the second circuit film CF2 to the support film SF. The pressure-sensitive adhesive may have an adhesive force that allows the support film SF to be easily removed from the first circuit film CF1 and the second circuit film CF2.

[0112] The first circuit film CF1 and the second circuit film CF2 may be disposed at one side of the display panel DP. The first circuit film CF1 and the second circuit film CF2 may be bent and may be electrically connected to the controller 310 (refer to FIG. Figure 2 According to the present invention, the electronic device EA (refer to Figure 2 ) of the circuit unit 220 (refer to Figure 2 ) can be provided at one side of the rear surface of the display panel DP, and thus, a space in which the control module 300 is provided can be ensured. Therefore, a slimmed-down electronic device EA (referring to Figure 2 ).

[0113] As described above, the region of the supporting film supporting the circuit film can be reinforced by the connecting portion. When the circuit film bends, the supporting film and the connecting portion can prevent the circuit film from deflecting. Therefore, a display device with improved reliability and a method for manufacturing the display device can be provided.

[0114] Although specific embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. Electronic module, including: Electronic panels; a circuit unit comprising a circuit film electrically connected to the electronic panel and a circuit chip mounted on the circuit film; a supporting film attached to the circuit film; as well as a connecting portion attached to the supporting film and covering the circuit chip, wherein the connection portion, the circuit film, and the circuit chip overlap with each other when viewed in a plane, and Wherein, after the circuit film and the circuit chip are bent to the rear surface of the electronic panel, the supporting film and the connecting portion can be removed.

2. The electronic module according to claim 1, wherein: When viewed in plane, the supporting film does not overlap with the circuit chip.

3. The electronic module according to claim 1, wherein: The circuit film includes a first circuit area connected to the electronic panel and a second circuit area connected to the first circuit area, and the supporting film includes a first supporting area attached to the first circuit area and a second supporting area attached to the second circuit area.

4. The electronic module according to claim 3, wherein: When viewed in plane, the connection portion overlaps the first support region, the second support region, and the circuit chip.

5. The electronic module according to claim 3, wherein: The first circuit region extends in a first direction, the second circuit region extends from the first circuit region in a second direction intersecting the first direction, the first support region extends in the first direction, and the second support region extends from the first support region in the second direction.

6. The electronic module according to claim 3, wherein: The connecting portion includes a connecting film, a first filling member provided between the first supporting region and the connecting film, and a second filling member provided between the second supporting region and the connecting film.

7. The electronic module according to claim 6, wherein: The upper surface of the connection film is flat.

8. The electronic module according to claim 6, wherein: The connecting portion further includes a first adhesive layer disposed between the first filling piece and the first supporting area, a second adhesive layer disposed between the first filling piece and the connecting film, a third adhesive layer disposed between the second filling piece and the second supporting area, and a fourth adhesive layer disposed between the second filling piece and the connecting film. 9 . The electronic module according to claim 8 , further comprising a fifth adhesive layer provided between the circuit chip and the connection film.

10. The electronic module according to claim 9, wherein: Each of the first adhesive layer, the second adhesive layer, the third adhesive layer, and the fourth adhesive layer has an adhesive force greater than an adhesive force of the fifth adhesive layer.

Images