A heat dissipation device and a base station

Abstract

The present application provides a heat dissipation device and a base station. The heat dissipation device includes: a first heat conduction substrate, and a second heat conduction substrate spaced apart from the first heat conduction substrate; wherein, a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is respectively in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate; the plurality of first heat dissipation fins divide the gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels; a plurality of second heat dissipation fins are arranged on a surface of the second heat conduction substrate facing away from the first heat conduction substrate. In the above technical solution, by using the first heat conduction substrate, the second heat conduction substrate and the first heat dissipation fins to enclose a ventilation channel, the natural convection heat transfer ability of air in the ventilation channel is increased, and the heat dissipation effect is enhanced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and particularly to a heat dissipation device and a base station. Background Art

[0002] The quality of the thermal design of communication base station products is directly related to the cost, reliability, volume, and weight of the products. If the thermal design is not good, the volume and weight of the equipment will increase to meet the environmental requirements for equipment operation; otherwise, the environmental temperature rise will be too high, and working under high temperature conditions for a long time will reduce the reliability and service life of electronic equipment, and even burn out components in severe cases. How to effectively dissipate heat in a limited space has become a key issue in the design of current communication products. This design is applied to the natural convection heat dissipation module, and its general form is that a certain number of heat dissipation fins are connected to a first heat conducting substrate, and the heat dissipation fins exchange heat with air convection to achieve the overall heat dissipation and temperature reduction of the equipment.

[0003] Figure 1 It is the structural form of the traditional heat dissipation module, where 1 is the substrate and 2 is the heat dissipation fin. The traditional heat dissipation fin structure mainly obtains better heat dissipation effect by changing geometric parameters. However, when parameters such as the height, length, thickness, and fin spacing of the heat dissipation fins reach a certain degree of optimization, due to the marginal effect, the heat dissipation capacity of the heat dissipation fins will not increase significantly anymore. Summary of the Invention

[0004] This application provides a heat dissipation device and a base station to improve the heat dissipation effect.

[0005] In a first aspect, a heat dissipation device is provided. The heat dissipation device includes: a first heat conducting substrate, and a second heat conducting substrate spaced apart from the first heat conducting substrate; wherein, a plurality of first heat dissipation fins are arranged between the first heat conducting substrate and the second heat conducting substrate, and each first heat dissipation fin is thermally connected to the first heat conducting substrate and the second heat conducting substrate respectively; the plurality of first heat dissipation fins divide the gap between the first heat conducting substrate and the second heat conducting substrate into a plurality of ventilation channels;

[0006] On the side of the second heat conducting substrate facing away from the first heat conducting substrate, a plurality of second heat dissipation fins are provided.

[0007] In the above technical solution, by using the first heat conducting substrate, the second heat conducting substrate, and the first heat dissipation fins to enclose a ventilation channel, the natural convection heat exchange ability of air in the ventilation channel is increased, and the heat dissipation effect is enhanced.

[0008] In a specific feasible implementation, the length direction of the first heat dissipation fin forms a set angle with the length direction of the second heat dissipation fin. By setting heat dissipation fins at different angles, the heat dissipation effect is improved.

[0009] In a specific feasible implementation, the length direction of the first heat dissipation fin is the same as the length direction of the first heat conduction substrate;

[0010] The length direction of the second heat dissipation fin is inclined relative to the length direction of the first heat conduction substrate. This improves the heat dissipation effect.

[0011] In a specific feasible implementation, the vertical projection of the second heat conduction substrate on the first heat conduction substrate is located within the first heat conduction substrate.

[0012] In a specific feasible implementation, a plurality of third heat dissipation fins are provided on the portion of the first heat conduction substrate outside the vertical projection of the second heat conduction substrate.

[0013] In a specific feasible implementation, the third heat dissipation fin is parallel to the first heat dissipation fin.

[0014] In a specific feasible implementation, the first heat dissipation fin and the second heat dissipation fin are of an integral structure;

[0015] The second heat conduction substrate includes a plurality of connecting plates connecting adjacent first heat dissipation fins.

[0016] In a specific feasible implementation, the first heat conduction substrate and the second heat conduction substrate are of the same size.

[0017] In a specific feasible implementation, the first heat dissipation fin and the second heat dissipation fin are arranged in an alternating manner.

[0018] In a specific feasible implementation, a plurality of hollow structures are provided on the second heat conduction substrate, and each hollow structure communicates with the ventilation channel. This increases the ventilation effect.

[0019] In a second aspect, a base station is provided. The base station includes a device and the heat dissipation device according to any one of the above on the device. In the above technical solution, by using the first heat conduction substrate, the second heat conduction substrate, and the first heat dissipation fin to enclose a ventilation channel, the natural convection heat transfer ability of air in the ventilation channel is increased, and the heat dissipation effect is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural diagram of a heat dissipation device in the prior art;

[0021] Figure 2 It is a schematic structural diagram of the first heat dissipation device provided by an embodiment of the present application;

[0022] Figure 3 It is an end view schematic diagram of the first heat dissipation device provided by an embodiment of the present application;

[0023] Figure 4 The structural schematic diagram of the second heat dissipation device provided by the embodiment of the present application;

[0024] Figure 5 The end face schematic diagram of the second heat dissipation device provided by the embodiment of the present application;

[0025] Figure 6 The structural schematic diagram of the third heat dissipation device provided by the embodiment of the present application;

[0026] Figure 7 The end face schematic diagram of the third heat dissipation device provided by the embodiment of the present application. Detailed implementation manners

[0027] To facilitate the understanding of the heat dissipation device provided by the embodiment of the present application, the application scenario of the heat dissipation device provided by the embodiment of the present application will be described first. The heat dissipation device provided by the embodiment of the present application is applied to a communication base station and is used for dissipating heat from the base station. When in use, the heat dissipation device is fixed on the base station, the heat generated by the base station is transferred to the heat dissipation device, and the heat is dissipated through the heat dissipation device. However, the heat dissipation effect of the heat dissipation device in the prior art is relatively low. Therefore, the embodiment of the present application provides a heat dissipation device. To make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0028] First, refer to Figure 2 and Figure 3 , Figure 2 which shows a specific heat dissipation device, Figure 3 which shows the cross-sectional schematic diagram of the heat dissipation device. The heat dissipation device includes a first heat conduction substrate 10, which is used for fixedly connecting with the base station, and the heat generated by the base station is first transferred to the first heat conduction substrate 10. Continuing to refer to Figure 2 , in Figure 2 , the first heat conduction substrate 10 provided by the embodiment of the present application is a rectangular substrate. However, it should be understood that the first heat conduction substrate 10 provided by the embodiment of the present application is not limited to Figure 2 the rectangular substrate shown in

[0029] It can adopt substrates of other shapes, such as substrates of different shapes like oval, square or rhombus, as long as it can match the area of the base station that needs heat dissipation. For the material of the first heat conduction substrate 10 provided by the embodiment of the present application, common heat conduction metals such as copper and aluminum can be selected, which are not limited herein. Figure 2 , the heat dissipation device provided by the embodiment of the present application further includes a second heat conduction substrate 30. In Figure 2Among them, the second heat-conducting substrate 30 has the same shape and size as the first heat-conducting substrate 10, but the specific shape and size of the second heat-conducting substrate 30 are not limited in the embodiments of the present application. When specifically arranging the second heat-conducting substrate 30, there is a gap with a certain distance between the second heat-conducting substrate 30 and the first heat-conducting substrate 10, and the first heat-conducting substrate 10 and the second heat-conducting substrate 30 are fixedly connected by a plurality of first heat-dissipating fins 20. Among them, one side of each first heat-dissipating fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or connection by threaded connectors (bolts or screws); and when connecting, the first heat-dissipating fin 20 is thermally connected to both the first heat-conducting substrate 10 and the second heat-conducting substrate 30. Continuing to refer to Figure 2 , the plurality of first heat-dissipating fins 20 are arranged at intervals, and the plurality of first heat-dissipating fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. Both ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet. As shown by the arrow in Figure 2 , the arrow shows a specific air flow direction. Cold air enters the ventilation channel from below and then flows out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above and then flow out from the lower air outlet. By using the first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat-dissipating fins 20 to enclose the ventilation channel, for the convenience of description, it is named the first ventilation channel 50. The natural convection heat transfer ability of the cold air in the first ventilation channel 50 increases the heat dissipation effect, and since the first ventilation channel 50 is a cylindrical structure, the cold air will form a high-temperature low-pressure gas after absorbing heat, thereby forming a siphon effect in the first ventilation channel 50, improving the air fluidity, and further improving the heat dissipation effect.

[0030] In the embodiments of the present application, the second heat-conducting substrate 30 can adopt an integral plate-like structure, or a plurality of hollow structures can be provided on the second heat-conducting substrate, and each hollow structure communicates with the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, external cold air can be supplemented into the first ventilation channel through the hollow structures, improving the heat dissipation effect.

[0031] Continuing to refer to Figure 2 and Figure 3 , a plurality of second heat-dissipating fins 40 are provided on the side of the second heat-conducting substrate 30 facing away from the first heat-conducting substrate 10. And the plurality of second heat-dissipating fins 40 are arranged at intervals, and the gaps between the second heat-dissipating fins 40 form another ventilation channel. In Figure 2In it, both the first heat dissipation fin 20 and the second heat dissipation fin 40 adopt flat heat dissipation fins, and the length direction of the second heat dissipation fin 40 is inclined relative to the length direction of the first heat conduction substrate 10, that is, the length direction of the first heat dissipation fin 20 and the length direction of the second heat dissipation fin 40 form a set angle. In Figure 2 In it, the included angle between the length directions of the first heat dissipation fin 20 and the second heat dissipation fin 40 is 45°, so that the flow direction of the air flowing between the first heat dissipation fins 20 is different from the flow direction of the air flowing through the second heat dissipation fin 40. During specific heat dissipation, the air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, the heat transferred from the base station is transferred to the first heat conduction substrate 10, and is transferred to the second heat conduction substrate 30 through the first heat dissipation fin 20, and the second heat conduction substrate 30 then transfers the heat to the second heat dissipation fin 40. When the air circulates, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and contacts the first heat conduction substrate 10, the second heat conduction substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 respectively, thereby increasing the contact area between the air and the heat dissipation device, and further improving the heat dissipation effect. And through the added second heat conduction substrate 30 and the second heat dissipation fin 40, an upper and lower two-layer ventilation effect is formed, strengthening the convective heat transfer ability of the heat dissipation device and improving the heat dissipation efficiency of the heat dissipation device.

[0032] It should be understood that Figure 2 The included angle between the first heat dissipation fin 20 and the second heat dissipation fin 40 shown is only a specific example, and the included angle between the first heat dissipation fin 20 and the second heat dissipation fin 40 provided by the embodiments of the present application is not limited to Figure 2 a specific mode in it, and other included angles can also be adopted, such as the included angle between the first heat dissipation fin 20 and the second heat dissipation fin 40 is 30°, 60° and other different angles. All can achieve improved heat dissipation effect.

[0033] Refer to Figure 4 and Figure 5 together, in which, Figure 4 shows the second heat dissipation device provided by the embodiments of the present application, Figure 5 shows the end view of the second heat dissipation device. In Figure 4 the heat dissipation device shown, the heat dissipation device includes a first heat conduction substrate 10, which is used for fixedly connecting with the base station, and the heat generated by the base station is first transferred to the first heat conduction substrate 10. Continue to refer to Figure 4 In Figure 4 In it, the first heat conduction substrate 10 provided by the embodiments of the present application is a rectangular substrate, but it should be understood that the first heat conduction substrate 10 provided by the embodiments of the present application is not limited to Figure 4The rectangular substrate shown in the figure can use substrates of other shapes, such as substrates of different shapes like oval, square or rhombus, etc., as long as it matches the area of the base station that needs heat dissipation. For the material of the first heat-conducting substrate 10 provided in the embodiment of the present application, common heat-conducting metals such as copper and aluminum can be selected, which is not limited herein.

[0034] Continuing to refer to Figure 4 , the heat dissipation device provided in the embodiment of the present application further includes a second heat-conducting substrate 30. In Figure 4 , the second heat-conducting substrate 30 has the same shape as the first heat-conducting substrate 10, but its size is smaller than that of the first heat-conducting substrate 10. And when setting, one end of the second heat-conducting substrate 30 is flush with the first heat-conducting substrate 10. As Figure 5 shown, the vertical projection of the second heat-conducting substrate 30 on the first heat-conducting substrate 10 is located within the first heat-conducting substrate 10. When specifically setting the second heat-conducting substrate 30, there is a certain distance gap between the second heat-conducting substrate 30 and the first heat-conducting substrate 10, and the first heat-conducting substrate 10 and the second heat-conducting substrate 30 are fixedly connected by a plurality of first heat dissipation fins 20. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or connecting through threaded connectors (bolts or screws); and when connecting, the first heat dissipation fin 20 is thermally connected to both the first heat-conducting substrate 10 and the second heat-conducting substrate 30. Continuing to refer to Figure 4 , the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. Both ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet. As Figure 4 shown by the arrow in the figure, the arrow shows a specific air flow direction. Cold air enters the ventilation channel from below and then flows out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above and then flow out from the lower air outlet. By using the first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 to enclose the ventilation channel, for the convenience of description, it is named the first ventilation channel 50. The natural convection heat transfer ability of cold air in the first ventilation channel 50 increases the heat dissipation effect. And because the first ventilation channel 50 is a cylindrical structure, the cold air will form high-temperature low-pressure gas after absorbing heat, thus forming a siphon effect in the first ventilation channel 50, improving the air fluidity, and further improving the heat dissipation effect.

[0035] In the second heat-conducting substrate 30 provided in the embodiment of the present application, a whole plate-like structure can be adopted, or a plurality of hollow structures can be arranged on the second heat-conducting substrate, and each hollow structure communicates with the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, external cold air can be supplemented into the first ventilation channel through the hollow structures, improving the heat dissipation effect.

[0036] Continue to refer to Figure 4 and Figure 5 , a plurality of second heat dissipation fins 40 are arranged on the side of the second heat-conducting substrate 30 facing away from the first heat-conducting substrate 10. And the plurality of second heat dissipation fins 40 are arranged at intervals, and the intervals between the second heat dissipation fins 40 form another ventilation channel. In Figure 4 , both the first heat dissipation fins 20 and the second heat dissipation fins 40 adopt straight heat dissipation fins, and the length direction of the first heat dissipation fins 20 is the same as the length direction of the first heat-conducting substrate 10. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively. The heat transferred from the base station is transferred to the first heat-conducting substrate 10 and then transferred to the second heat-conducting substrate 30 through the first heat dissipation fins 20. The second heat-conducting substrate 30 then transfers the heat to the second heat dissipation fins 40. When air circulates, air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively and contacts the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat dissipation fins 20 and the second heat dissipation fins 40 respectively, thereby increasing the contact area between the air and the heat dissipation device, and further improving the heat dissipation effect. And through the added second heat-conducting substrate 30 and the second heat dissipation fins 40, an upper and lower two-layer ventilation effect is formed, strengthening the convective heat transfer ability of the heat dissipation device and improving the heat dissipation efficiency of the heat dissipation device.

[0037] Continue to refer to Figure 4 and Figure 5 , in the heat dissipation device provided in the embodiment of the present application, a plurality of third heat dissipation fins 70 are arranged on the part of the first heat-conducting substrate 10 outside the vertical projection of the second heat-conducting substrate 30. As Figure 5 shown, the first heat dissipation fins 20 and the third heat dissipation fins 70 are arranged on the first heat-conducting substrate 10, and the first heat dissipation fins 20 and the third heat dissipation fins 70 are arranged in parallel. During specific arrangement, the first heat dissipation fins 20 and the second heat dissipation fins 40 are of an integral structure. At this time, the second heat-conducting substrate 30 can be regarded as a connecting plate connecting adjacent first heat dissipation fins 20. During specific connection, the connecting plate and the heat dissipation fins can be fixedly connected by welding.

[0038] As Figure 6 and Figure 7 shown, Figure 6Shows the third heat dissipation device provided by the embodiments of the present application, Figure 7 Shows a schematic end view of the third heat dissipation device.

[0039] The heat dissipation device includes a first heat-conducting substrate 10, which is used for fixedly connecting with the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10. Continuing to refer to Figure 6 , in Figure 6 , the first heat-conducting substrate 10 provided by the embodiments of the present application is a rectangular substrate, but it should be understood that the first heat-conducting substrate 10 provided by the embodiments of the present application is not limited to Figure 6 the rectangular substrate shown in

[0040] Continuing to refer to Figure 6 , the heat dissipation device provided by the embodiments of the present application further includes a second heat-conducting substrate 30. In Figure 6 , the second heat-conducting substrate 30 has the same shape and size as the first heat-conducting substrate 10, but the specific shape and size of the second heat-conducting substrate 30 are not limited in the embodiments of the present application. When specifically setting the second heat-conducting substrate 30, there is a certain distance gap between the second heat-conducting substrate 30 and the first heat-conducting substrate 10, and the first heat-conducting substrate 10 and the second heat-conducting substrate 30 are fixedly connected by a plurality of first heat dissipation fins 20. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or connection by threaded connectors (bolts or screws); and when connecting, the first heat dissipation fin 20 is thermally connected to both the first heat-conducting substrate 10 and the second heat-conducting substrate 30. Continuing to refer to Figure 6 , the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. Both ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as Figure 6As shown by the arrow in the figure, the arrow indicates a specific air flow direction. Cold air enters the ventilation channel from below and then flows out from the air outlet above. Of course, cold air can also enter the ventilation channel from above and then flow out from the air outlet below. By using the first heat-conducting substrate 10, the second heat-conducting substrate 30, and the first heat-dissipating fins 20 to enclose the ventilation channel, it is named the first ventilation channel 50 for convenience of description. The natural convection heat transfer ability of the cold air in the first ventilation channel 50 increases the heat dissipation effect. And since the first ventilation channel 50 is a cylindrical structure, the cold air will form a high-temperature low-pressure gas after absorbing heat, thus forming a siphon effect in the first ventilation channel 50, improving the air fluidity, and further improving the heat dissipation effect.

[0041] In the second heat-conducting substrate 30 provided in the embodiment of the present application, it can adopt an integral plate-like structure, or a plurality of hollow structures can be provided on the second heat-conducting substrate, and each hollow structure communicates with the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structures, improving the heat dissipation effect.

[0042] Continue to refer to Figure 6 and Figure 7 , a plurality of second heat-dissipating fins 40 are provided on the side of the second heat-conducting substrate 30 facing away from the first heat-conducting substrate 10. And the plurality of second heat-dissipating fins 40 are arranged at intervals, and the intervals between the second heat-dissipating fins 40 form another ventilation channel. In Figure 6 , both the first heat-dissipating fins 20 and the second heat-dissipating fins 40 adopt flat heat-dissipating fins, and the length direction of the second heat-dissipating fins 40 is the same as the length direction of the first heat-conducting substrate 10. And when specifically arranging the first heat-dissipating fins 20 and the second heat-dissipating fins 40, such as Figure 7As shown, the first heat dissipation fin 20 and the second heat dissipation fin 40 are arranged in an interleaved manner. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively. The heat transferred from the base station is transferred to the first heat conduction substrate 10 and then transferred to the second heat conduction substrate 30 through the first heat dissipation fin 20. The second heat conduction substrate 30 then transfers the heat to the second heat dissipation fin 40. When air circulates, air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively and contacts the first heat conduction substrate 10, the second heat conduction substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 respectively, thereby increasing the contact area between the air and the heat dissipation device and further improving the heat dissipation effect. Moreover, through the added second heat conduction substrate 30 and the second heat dissipation fin 40, a two-layer ventilation effect is formed, strengthening the convective heat transfer ability of the heat dissipation device and improving the heat dissipation efficiency of the heat dissipation device. In addition, since the first heat dissipation fin 20 and the second heat dissipation fin 40 are arranged in an interleaved manner, the heat transfer effect can be increased.

[0043] An embodiment of the present application further provides a base station, which includes a device and the heat dissipation device according to any one of the above on the device. In the above technical solution, by using the first heat conduction substrate 10, the second heat conduction substrate 30 and the first heat dissipation fin 20 to enclose a ventilation channel, the natural convective heat transfer ability of air in the ventilation channel is increased, and the heat dissipation effect is improved. When specifically arranged, the first heat conduction substrate 10 can be the housing of the device.

[0044] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation device, characterized in that, Comprising: A first heat-conducting substrate, and a second heat-conducting substrate spaced from the first heat-conducting substrate; wherein, a plurality of first heat-dissipating fins are arranged between the first heat-conducting substrate and the second heat-conducting substrate, and each first heat-dissipating fin is respectively in heat-conducting connection with the first heat-conducting substrate and the second heat-conducting substrate; the plurality of first heat-dissipating fins divide the gap between the first heat-conducting substrate and the second heat-conducting substrate into a plurality of ventilation channels; A plurality of second heat-dissipating fins are arranged on a side of the second heat-conducting substrate facing away from the first heat-conducting substrate; A plurality of hollow structures are arranged on the second heat-conducting substrate, and each hollow structure communicates with the ventilation channels; each ventilation channel corresponds to a plurality of the hollow structures, and the plurality of hollow structures are arranged along the length direction of the ventilation channels.

2. The heat dissipation device according to claim 1, characterized in that, The length direction of the first heat-dissipating fin forms a set angle with the length direction of the second heat-dissipating fin.

3. The heat dissipation device according to claim 2, characterized in that, The length direction of the first heat-dissipating fin is the same as the length direction of the first heat-conducting substrate; The length direction of the second heat-dissipating fin is inclined relative to the length direction of the first heat-conducting substrate.

4. The heat dissipation device according to claim 1, characterized in that, The vertical projection of the second heat-conducting substrate on the first heat-conducting substrate is located within the first heat-conducting substrate.

5. The heat dissipation device according to claim 4, characterized in that, A plurality of third heat-dissipating fins are arranged on a part of the first heat-conducting substrate outside the vertical projection of the second heat-conducting substrate.

6. The heat dissipation device according to claim 5, characterized in that, The third heat-dissipating fins are parallel to the first heat-dissipating fins.

7. The heat dissipation device according to claim 4, characterized in that, The first heat-dissipating fin and the second heat-dissipating fin are of an integral structure; The second heat-conducting substrate includes a plurality of connecting plates connecting adjacent first heat-dissipating fins.

8. The heat dissipation device according to claim 1, characterized in that, The first heat-conducting substrate and the second heat-conducting substrate are of the same size.

9. The heat dissipation device according to claim 8, characterized in that, The first heat-dissipating fins and the second heat-dissipating fins are arranged in an alternating manner.

10. A base station, characterized in that, Comprising a device, and a heat dissipation device as described in any one of claims 1 to 9 provided on the device.

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