Wafer inspection equipment

Abstract

A wafer inspection apparatus includes a support structure that includes a frame and vacuum chucks mounted on the frame. Each vacuum chuck has a support surface that includes a vacuum suction portion. The support structure is configured to structurally support a wafer on one or more of the vacuum chucks. The frame defines an opening having an area larger than the area of the wafer. The wafer inspection apparatus includes: an electromagnetic wave emitter configured to radiate inspection electromagnetic waves onto the wafer; a sensor configured to receive inspection electromagnetic waves from the wafer based on the inspection electromagnetic waves passing through the wafer; and a driver configured to move at least one of the electromagnetic wave emitter and the frame to change the radiation position of the wafer. Each vacuum chuck is configured to be selectively movable between a first position and a second position with respect to the frame.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of priority to Korean Patent Application No. 10 - 2019 - 0102565, filed on August 21, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to wafer inspection equipment. Background art

[0004] To manage the quality of semiconductor wafers, an inspection process of semiconductor wafers is performed during semiconductor wafer manufacturing.

[0005] Generally, a vacuum chuck is used in wafer inspection equipment to hold a semiconductor wafer during inspection of the wafer. Most vacuum chucks apply a vacuum to the back surface of the wafer to hold the wafer in place. Since a reflection inspection device detects electromagnetic waves reflected from the front surface of the wafer, even when the vacuum chuck is disposed on the back surface of the wafer, it does not interfere with wafer measurement. However, in a transmission inspection device, electromagnetic waves cannot pass through the wafer area in contact with the vacuum chuck, and thus, there are unmeasurable areas. Summary of the invention

[0006] Some example embodiments provide a wafer inspection device configured to increase the inspection area of a wafer.

[0007] According to some example embodiments, a wafer inspection device may include a support frame, an electromagnetic wave emitter, a sensor, and a driver. The support structure may include a frame and a plurality of vacuum chucks, each of the plurality of vacuum chucks being mounted on the frame and each having a support surface including a vacuum suction portion. The support structure may be configured to structurally support a wafer on one or more of the plurality of vacuum chucks, and the frame defines an opening having an area larger than the area of the wafer. The electromagnetic wave emitter may be configured to radiate inspection electromagnetic waves onto the wafer. The sensor may be configured to receive inspection electromagnetic waves from the wafer based on the inspection electromagnetic waves passing through the wafer. The driver may be configured to move at least one of the electromagnetic wave emitter and the frame to change the radiation position of the wafer. Each of the plurality of vacuum chucks may be configured to be selectively movable between a first position and a second position with respect to the frame.

[0008] According to some example embodiments, a wafer inspection device may include a frame defining an opening, the frame being configured to structurally support a wafer in the opening, wherein the area of the opening is larger than the area of the wafer. The wafer inspection device may include a plurality of first vacuum chucks and a plurality of second vacuum chucks. Each of the plurality of first vacuum chucks and the plurality of second vacuum chucks may have a support surface including a vacuum suction portion. The plurality of first vacuum chucks and the plurality of second vacuum chucks may be configured to be movable between a first position and a second position of the frame. When the vacuum chuck is in the first position of the frame, the support surface of each vacuum chuck may be configured to be coplanar with a reference surface for supporting the wafer. The wafer inspection device may include: an electromagnetic wave emitter configured to radiate inspection electromagnetic waves to the back surface of the wafer; a sensor on the wafer, the sensor being configured to receive inspection electromagnetic waves from the wafer based on the inspection electromagnetic waves passing through the wafer; a driver configured to move the electromagnetic wave emitter to change the radiation position on the back surface of the wafer; and a processing circuit configured to control the driver and the movement of the plurality of first vacuum chucks and the plurality of second vacuum chucks. The plurality of first vacuum chucks and the plurality of second vacuum chucks may be configured to move to the second position to deviate from the path of the inspection electromagnetic waves between the wafer and the electromagnetic wave emitter. The plurality of first vacuum chucks may be configured to move to the first position such that the support surfaces of the plurality of first vacuum chucks contact a first contact area of the back surface of the wafer, and the plurality of second vacuum chucks may be configured to move to the first position such that the support surfaces of the plurality of second vacuum chucks contact a second contact area of the back surface of the wafer, the first contact area and the second contact area being different areas of the back surface of the wafer.

[0009] According to some example embodiments, a wafer inspection device may include a support structure having a frame. The support structure may include a plurality of vacuum chucks. Each of the plurality of vacuum chucks may be mounted on the frame, and each vacuum chuck may have a support surface including a vacuum suction portion. The support structure may be configured to structurally support a wafer on one or more of the plurality of vacuum chucks. The frame may define an opening whose area is larger than the area of the wafer. Each vacuum chuck may be configured to be set such that the support surface of the vacuum chuck is coplanar with a reference surface on which the wafer is supported by the support structure. The wafer inspection device may include: an electromagnetic wave emitter configured to radiate inspection electromagnetic waves to the wafer; a sensor configured to receive inspection electromagnetic waves from the wafer based on the inspection electromagnetic waves passing through the wafer; and a driver configured to move at least one of the electromagnetic wave emitter and the frame to change the radiation position of the wafer. Each of the plurality of vacuum chucks may be configured to separate from the reference surface to descend along the frame or flip downward with respect to the frame. Description of the Drawings

[0010] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a schematic view of a transmission wafer inspection system according to some example embodiments;

[0012] Figure 2 is a perspective view of a transmission wafer inspection apparatus according to some example embodiments;

[0013] Figure 3 is Figure 2 a plan view of the transmission wafer inspection apparatus shown in

[0014] Figure 4A and Figure 4B is a perspective view showing the movement of a vacuum chuck that can be employed in the transmission wafer inspection apparatus shown in Figure 2 ;

[0015] Figure 5 is a cross-sectional view showing additional movement of the vacuum chuck shown in Figure 4B ;

[0016] Figure 6 is a flowchart showing a wafer inspection method according to some example embodiments;

[0017] Figure 7A 、 Figure 7B and Figure 7C are plan views showing respective inspection processes of a wafer inspection method according to some example embodiments;

[0018] Figure 8 and Figure 9 are plan views of a transmission wafer inspection apparatus according to various example embodiments;

[0019] Figure 10A 、 Figure 10B and Figure 10C are plan views of a wafer inspection apparatus according to some example embodiments; and

[0020] Figure 11A 、 Figure 11B and Figure 11C are cross-sectional views showing the movement of the vacuum chuck of the wafer inspection apparatus shown in Figure 10A 、 Figure 10B and Figure 10C respectively. DETAILED DESCRIPTION

[0021] Hereinafter, example embodiments will be described with reference to the accompanying drawings.

[0022] Figure 1Schematic diagram of a transmission wafer inspection system according to some example embodiments. Figure 2 is Figure 1 Perspective view of a transmission wafer inspection apparatus that can be employed in the system shown in

[0023] Figure 1 The wafer inspection system 300 shown in may include: a chamber 101 provided with a wafer inspection apparatus 200; a control unit 210 configured to control the wafer inspection apparatus 200; and an analysis unit 240 configured to analyze the results measured by the wafer inspection apparatus 200. The wafer inspection system 300 may further include a display unit 250 connected to the analysis unit 240 to display the measurement results and / or analysis results. The display unit 250 may be understood as any display device configured to display images, including but not limited to a light emitting diode (LED) display screen.

[0024] As Figure 1 shown, the control unit 210 and / or the analysis unit 240 may be included in one or more instances of a processing circuit, may include and / or may be implemented as one or more instances of a processing circuit, such as hardware including logic circuits, a hardware / software combination (such as a processor executing software), or a combination thereof. For example, the processing circuit may more specifically include, but is not limited to, a processor that may include a central processing unit (CPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a system on chip (SoC), a programmable logic unit, a microprocessor, an application specific integrated circuit (ASIC), etc. In some example embodiments, the processing circuit of the control unit 210 and / or the analysis unit 240 may include a non-transitory computer-readable storage device (e.g., a memory) storing an instruction program and a processor (e.g., via a bus) coupled to the storage device and configured to execute the instruction program to implement the functions of the control unit 210 and / or the analysis unit 240, and the non-transitory computer-readable storage device is, for example, a solid state drive (SSD). Thus, the control unit 210 and / or the analysis unit 240 as described herein may be interchangeably referred to as a "processing circuit", which may be configured to implement any and all functions of the control unit 210 and / or the analysis unit 240 as described herein.

[0025] The wafer inspection apparatus 200 is a transmission inspection apparatus that analyzes the characteristics of the wafer W by inspecting electromagnetic waves passing through the wafer W. In some exemplary embodiments, the wafer inspection apparatus 200 includes: a support structure 100 that supports the wafer W (e.g., structurally supports the weight or load of the wafer W); a transmitting unit 140 (also interchangeably referred to herein as an electromagnetic wave transmitter) configured to radiate one or more inspection electromagnetic waves L1 onto the wafer W; and a detection unit 160 (also interchangeably referred to herein as a sensor) located on the wafer W (e.g., above the wafer W, isolated from direct contact with the wafer W, or in direct contact with the wafer W) and configured to receive (e.g., detect) one or more inspection electromagnetic waves L2 passing through the wafer W. The one or more inspection electromagnetic waves L2 may include at least a portion of the one or more inspection electromagnetic waves L1 radiated onto the wafer W, such that the detection unit 160 can detect the electromagnetic wave L2 from the wafer W based on the inspection electromagnetic wave L2 as the inspection electromagnetic wave L1 is radiated onto the wafer W and as the inspection electromagnetic wave L2 passes through the wafer W.

[0026] The inspection electromagnetic waves used in the wafer inspection apparatus 200 refer to electromagnetic waves that have an amplitude or the like that varies according to the physical properties of the wafer W being inspected after passing through the wafer W.

[0027] Figure 2 is a perspective view of the wafer inspection apparatus 200 that can be employed in some exemplary embodiments.

[0028] As Figure 2 shown, the support structure 100 employed in the wafer inspection apparatus 200 can structurally support the wafer W (e.g., can support the load of the wafer W). The support structure 100 may include: a frame 110 that defines an opening OP having an area larger than the area of the wafer W; and a plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3, each of which is mounted on the frame 110 to be disposed in the opening OP defined by the frame 110. Each of the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 may have a support surface 155 provided with (e.g., including) a vacuum suction portion VH, and the vacuum suction portion VH may be an opening through which a vacuum can be applied. The support structure 100 can structurally support the wafer W on one or more of the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3. For example, the support structure 100 can structurally support the wafer W on some of the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 rather than all of the vacuum chucks.

[0029] In some exemplary embodiments, the support structure 100 may include a substrate 121 and four support members 125 mounted on the corners of the substrate 121 to support the frame 110. The frame 110 may be fixed to the upper ends of the support members 125 by fastening means 125P (such as screws or nails).

[0030] The frame 110 may include three sides and may have a rectangular structure with an open side, for example, a [ - shaped structure. Again, the frame 110 may include a rectangular frame, a circular frame, or a [ - shaped frame. The wafer W may be loaded and unloaded through the open side of the frame 110 (indicated by "WR"). The shape of the frame 110 is not limited thereto, and the frame 110 may have various shapes such as rectangular and circular (see Figure 8 and Figure 9 ).

[0031] The vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 employed in some exemplary embodiments may be respectively configured to be movable along the frame 110 and may be divided into at least two groups (e.g., multiple groups of vacuum chucks), with each group of vacuum chucks including three chucks. Each group of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 may be mounted on three sides of the frame 110 to support (e.g., structurally support) the wafer W disposed on the opening OP. The opening OP may be defined by the frame 110 and may be configured such that the entire area of the wafer W is exposed for inspection. In some exemplary embodiments, the movement of the vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 may be performed for each group to increase the wafer inspection area, which will be described with reference to FIGS. 4 to 7 later.

[0032] Each of the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 may include a support surface 155, which may contact the back surface of the wafer W. When the vacuum chuck contacts the support surface 155, the inside of the vacuum chuck is brought to a vacuum state or a low - pressure state by the vacuum pumping portion VH, so that a vacuum can be applied to a part of the wafer W via the vacuum pumping portion VH to hold the wafer W at least partially in its original position. Thus, the wafer W can be stably held on the support surface 155 during the wafer inspection process.

[0033] As Figure 3As shown, such a vacuum can extend within the frame 110 and can be executed through a first channel CH1 and a second channel CH2. The first channel CH1 extends into the frame 110 and is in fluid communication with an external vacuum source 900. The second channel CH2 extends into the vacuum chuck and is in fluid communication with the first channel CH1. The vacuum suction portion VH can be connected to the second channel CH2 (e.g., in fluid communication with the second channel CH2) and can be configured to include a concave structure formed on the support surface 155.

[0034] In addition, the wafer inspection apparatus 200 can include a moving unit 130 (also referred to herein as a driver), which can move the emitting unit 140 to change the radiation position W1 of the wafer W (e.g., the position W1 on the back surface Wb of the wafer W where the electromagnetic wave L1 is radiated). The moving unit 130 can include, for example, a servo brake (including a linear servo brake). In some example embodiments, instead of or in addition to moving the emitting unit 140, the moving unit 130 can move the frame with respect to the wafer W to change the radiation position of the wafer W. Thus, it will be understood that the moving unit 130 can move at least one of the emitting unit 140 and the frame 110 to change the radiation position W1 of the wafer W where the electromagnetic wave L1 for inspection is radiated by the emitting unit 140.

[0035] As Figure 2 shown, the emitting unit 140 can be moved to a desired inspection position in a first direction D1 and a second direction D2 intersecting the first direction D1 (e.g., by the moving unit 130). As Figure 3 shown, by such movement of the emitting unit 140, the entire area (e.g., the entire region) of the wafer W can be scanned using the electromagnetic wave L1 to analyze the transmitted electromagnetic wave (e.g., the wave L2 detected by the detection unit 160) to perform a desired wafer (W) inspection. Figure 3 is Figure 2 a plan view and shows an example of the above-described scanning process using electromagnetic waves.

[0036] Referring to Figure 3 , wafer inspection can be performed by a continuous scan SC from a starting point S to an ending point F (as indicated by the dashed arrow). However, since the electromagnetic wave L1 cannot pass through the regions of the wafer W that are in contact with the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3, it may not be possible to perform the desired analysis due to the vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3.

[0037] As described above, the region NC that cannot be analyzed due to the vacuum chuck may include not only the region in direct contact with the vacuum chuck, but also the adjacent regions where electromagnetic interference may occur.

[0038] To solve such problems, as described above, the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 employed in some example embodiments may be configured to be selectively movable between a first position and a second position in the frame 110 (e.g., for each group). Thus, it will be understood that the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 employed in some example embodiments may be configured to be selectively movable about the frame 110 between a first position and a second position (e.g., for each group).

[0039] As Figure 3 shown, the plurality of vacuum chucks may include a first group of vacuum chucks 150A1, 150A2, 150A3 and a second group of vacuum chucks 150B1, 150B2, 150B3, where each group includes three vacuum chucks, and where the first group of vacuum chucks and the second group of vacuum chucks include three pairs of adjacent vacuum chucks 150A1 and 150B1, 150A2 and 150B2, and 150A3 and 150B3 that are adjacent to each other (e.g., a pair of adjacent vacuum chucks 150A1 and 150B1, a pair of adjacent vacuum chucks 150A2 and 150B2, a pair of adjacent vacuum chucks 150A3 and 150B3).

[0040] Since the support surface 155 of each of the plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 in the first position is disposed on the surface for supporting the wafer W (hereinafter referred to as "reference plane P1") (e.g., coplanar with the reference plane P1), electromagnetic waves propagating to the contact region with the wafer W can be blocked. The "reference plane P1" may be a plane coplanar with the back surface Wb of the wafer W when the wafer W is structurally supported by the frame 110. Thus, when the wafer W is supported by the support structure 100 (e.g., structurally supported by the support structure 100), the wafer W may be described as being disposed and / or supported on the reference plane P1.

[0041] As Figure 3As shown, the first set of vacuum suction cups 150A1, 150A2, and 150A3 are configured to move to a first position such that the support surfaces 155 of the plurality of first vacuum suction cups 150A1, 150A2, and 150A3 contact a first contact region R1 on the back surface Wb of the wafer W, and the plurality of second vacuum suction cups 150B1, 150B2, and 150B3 are configured to move to a first position such that the support surfaces 155 of the plurality of second vacuum suction cups 150B1, 150B2, and 150B3 contact a second contact region R2 on the back surface Wb of the wafer W, where the first contact region R1 and the second contact region R2 are different regions on the back surface Wb of the wafer W. As Figure 3 shown, the first contact region R1 and the second contact region R2 can be adjacent to each other in pairs on the back surface Wb of the wafer W.

[0042] In some example embodiments, as Figure 2 shown, the three points (e.g., the first contact region) on the wafer W that contact the first set of vacuum suction cups 150A1, 150A2, and 150A3 and the three points (e.g., the second contact region) on the wafer W that contact the second set of vacuum suction cups 150B1, 150B2, and 150B3 can be arranged to be rotationally symmetric with respect to the center of the wafer (W). The first set of vacuum suction cups 150A1, 150A2, and 150A3 can be arranged to be adjacent to the second set of vacuum suction cups 150B1, 150B2, and 150B3 on each side. As shown, each vacuum suction cup in the first set of vacuum suction cups 150A1, 150A2, and 150A3 and the second set of vacuum suction cups 150B1, 150B2, and 150B3 is configured to move to a first position, in which the support surface of each vacuum suction cup is disposed on a reference plane P1 (e.g., plane P1) for supporting the wafer W (e.g., coplanar with the reference plane P1), such that when the vacuum suction cup is in the first position, the support surface 155 of each vacuum suction cup is configured to be disposed on the reference plane P1 (e.g., coplanar with the reference plane P1).

[0043] As described above, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 of each group can be arranged in appropriate positions in the frame 110 to support (e.g., structurally support) the wafer W to be inspected in balance at the first position.

[0044] In some example embodiments, the plurality of vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 in the second position may be arranged to deviate from the electromagnetic wave path between the wafer W and the emission unit 140 (e.g., move further away from the electromagnetic wave path), which electromagnetic wave path is also referred to as the path of the inspection electromagnetic wave L1. Each group of vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can be moved from the first position to the second position to reopen (e.g., expose) the wafer area that has contacted the vacuum suction cups, so that the emission unit 140 radiates the inspection electromagnetic wave L1 to the exposed wafer area, thereby enabling inspection of the wafer area. Thus, in some example embodiments, among the plurality of vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3, the first set of vacuum suction cups selectively moved to the first position (e.g., 150A1, 150A2, and 150A3 as shown in Figure 3 may be arranged such that the support surface 155 of the first set of vacuum suction cups is coplanar with the plane (e.g., P1) on which the wafer W is disposed, and among the plurality of vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3, the second set of vacuum suction cups selectively moved to the second position (e.g., 150B1, 150B2, and 150B3 as shown in Figure 3 may be arranged such that the support surface 155 of the second set of vacuum suction cups deviates from the path of the inspection electromagnetic wave L1 between the wafer W and the emission unit 140, e.g., such that when the emission unit 140 is aligned with any part of the wafer W in the vertical direction (e.g., Z direction), the second set of vacuum suction cups does not intersect the path L1-L, and the path L1-L extends in the vertical direction (Z direction) perpendicular to the plane on which the wafer W is disposed. It will be understood that a surface described herein as coplanar with a plane may be substantially coplanar with that plane such that the surface is coplanar with the plane within manufacturing and / or material tolerances.

[0045] There can be various ways to move the vacuum suction cups between the first position and the second position. In some example embodiments, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can each move in a flipping manner to separate from the reference plane P1 and flip downward with respect to the frame 110. In some example embodiments, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can each move in a sliding manner to separate from the reference plane P1 and descend (e.g., slide downward) along the frame 110.

[0046] For example, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 in the first position can be disposed on the inner sidewall of the frame 110 to be parallel to the reference plane P1, and the support surface 155 of the vacuum suction cup can face upward to contact the wafer W. In some exemplary embodiments, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 in the second position can be flipped below the reference plane P1 to be separated from the inner sidewall of the frame 110.

[0047] As Figure 4A and Figure 4B shown in, the plurality of vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can be hingedly connected to the lower end edge of the inner sidewall of the frame 110 and can be configured to be mechanically driven by the control unit 210. Due to the hinged connection, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can move from the first position to the second position and then from the second position to the first position.

[0048] Referring to Figure 4A , the first set of vacuum suction cups 150A1, 150A2 and 150A3 can be disposed in the first position, and the second set of vacuum suction cups 150B1, 150B2 and 150B3 can be flipped to be disposed in the second position.

[0049] As Figure 3 shown in, the first set of vacuum suction cups 150A1, 150A2 and 150A3 can be disposed on the inner sidewall of the frame 110 such that the support surface 155 faces upward and can allow the wafer W to be supported by the support surface 155. The wafer W disposed on the support surface 155 can be adsorbed to the support surface 155 by vacuum suction. In some exemplary embodiments, the second set of vacuum suction cups 150B1, 150B2 and 150B3 can be flipped vertically downward from the reference plane P1 to deviate from the reference plane P1. Again, each of the vacuum suction cups in the second set of vacuum suction cups 150B1, 150B2 and 150B3 can be flipped vertically downward from the first position to selectively move from the first position to the second position, as shown in at least Figure 4A shown in.

[0050] Since the first set (e.g., the first set) of vacuum suction cups 150A1, 150A2, 150A3 can cover a part (or the support area) of the wafer, the first set of vacuum suction cups 150A1, 150A2, 150A3 interferes with the path of the electromagnetic wave. At the same time, the second set of vacuum suction cups 150B1, 150B2 and 150B3 does not interfere with the path of the electromagnetic wave propagating to the wafer W.

[0051] Referring toFigure 4B The second set (e.g., the second group) of vacuum suction cups 150B1, 150B2, and 150B3 can each move from a second position to a first position, and the first set of vacuum suction cups 150A1, 150A2, and 150A3 can each be flipped in the first position to be set in the second position. To reiterate, each vacuum suction cup in the second set of vacuum suction cups 150B1, 150B2, and 150B3 can be flipped vertically upward from the second position to selectively move from the second position to the first position, and each vacuum suction cup in the first set of vacuum suction cups 150A1, 150A2, and 150A3 can be flipped vertically downward from the first position to selectively move from the first position to the second position, as shown in at least Figure 4B as shown. Thus, in view of Figure 4A and Figure 4B , it will be understood that each vacuum suction cup in the first set of vacuum suction cups and the second set of vacuum suction cups can be configured to move to the second position based on being flipped vertically downward from the reference plane P1.

[0052] The second set of vacuum suction cups 150B1, 150B2, and 150B3 can be disposed on the inner sidewall of the frame 110 such that the support surface 155 faces upward, and the wafer W can be allowed to be supported by the support surface 155. The wafer W disposed on the support surface 155 can be adsorbed to the support surface 155 by vacuum suction. In some example embodiments, the first set of vacuum suction cups 150A1, 150A2, and 150A3 can be vertically flipped below the reference plane P1 to deviate from the reference plane P1. In Figure 4A as shown, electromagnetic waves can be radiated to a part of the wafer W covered by the first set of vacuum suction cups 150A1, 150A2, and 150A3.

[0053] In some example embodiments, as shown in Figure 4A and Figure 4B , the inner sidewall of the frame 110 can have placement grooves 110G corresponding to the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3. By assisting them in alignment when the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 move from the second position to the first position, the placement grooves 110G can ensure the stable connection of the first channel and the second channel. Additionally, the vacuum suction cups 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can be more closely attached to the placement grooves 110G of the frame 110 during the vacuum suction process.

[0054] The vacuum suction cup 150A that moves in a flipping manner can also move from the second position to the lower surface of the frame 110 after moving to the second position, as shown in Figure 5As shown. For example, the vacuum chuck 150A can move along a guide rail 110R provided on the lower surface of the frame 110. Due to such movement, electromagnetic wave interference can be more effectively avoided than when it is disposed in an existing second position (indicated by a dashed line).

[0055] As described above, a plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 can be configured to be movable between a first position and a second position in the frame 110 for each group.

[0056] Although some example embodiments have been described as being applied to an example of a transmission wafer inspection apparatus, some example embodiments can be advantageously used in another manner (e.g., a reflection manner) other than the transmission manner even when the measurement is interfered with by the vacuum chuck.

[0057] Hereinafter, an electromagnetic wave scanning process for wafer inspection and the movement of the vacuum chuck for each group will be described.

[0058] Figure 6 is a flowchart showing a wafer inspection method according to some example embodiments, Figure 7A 、 Figure 7B and Figure 7C are plan views showing each inspection process of a wafer inspection method according to some example embodiments.

[0059] Referring to Figure 6 , a wafer inspection method according to some example embodiments may start with: moving a first group of vacuum chucks 150A1, 150A2, and 150A3 to a first position and moving a second group of vacuum chucks 150B1, 150B2, and 150B3 to a second position (S61).

[0060] The first group of vacuum chucks 150A1, 150A2, and 150A3 may be provided on the inner sidewall of the frame 110 such that the support surface 155 faces upward, while the second group of vacuum chucks 150B1, 150B2, and 150B3 may be flipped below a reference surface P1 on which the wafer W is to be provided (see Figure 4A and Figure 7A ).

[0061] In operation S62, the wafer W may be placed on the first group of vacuum chucks 150A1, 150A2, and 150A3, and vacuum adsorption of the wafer W may be performed by the first group of vacuum chucks 150A1, 150A2, and 150A3.

[0062] The support surfaces 155 of the first set of vacuum chucks 150A1, 150A2, and 150A3 can be respectively in contact with regions of the back surface Wb of the wafer W. The wafer W disposed on the support surface 155 can be adsorbed to the support surface 155 by vacuum suction. Electromagnetic waves cannot pass through such contact regions of the wafer W due to the first set of vacuum chucks 150A1, 150A2, and 150A3 (see Figure 7A ).

[0063] In operation S64, a first inspection can be performed by scanning, using electromagnetic waves, a region of the back surface Wb of the wafer W other than the regions in contact with the first set of vacuum chucks 150A1, 150A2, and 150A3.

[0064] As Figure 7A shown, a first scan S1 can be performed on a region other than the regions in contact with the first set of vacuum chucks 150A1, 150A2, and 150A3 (e.g., the first contact region R1). The first unscanned region can include not only the contact regions of the first set of vacuum chucks 150A1, 150A2, and 150A3, but also regions adjacent to the contact regions where accurate measurement cannot be ensured due to interference.

[0065] In operation S66, the second set of vacuum chucks 150B1, 150B2, and 150B3 can be moved to a first position, and vacuum suction of the wafer W can be performed by the second set of vacuum chucks 150B1, 150B2, and 150B3.

[0066] Thus, as Figure 7B shown, the wafer W on which the first inspection has been completed can be supported by the second set of vacuum chucks 150B1, 150B2, and 150B3 together with the first set of vacuum chucks 150A1, 150A2, and 150A3. This process can be introduced as a process for stably replacing the vacuum chucks while significantly reducing the wobbling of the wafer W. For example, the vacuum chucks that stably support the wafer W without wobbling can be replaced by performing adsorption using the second set of vacuum chucks 150B1, 150B2, and 150B3 while being stably supported by the first set of vacuum chucks 150A1, 150A2, and 150A3.

[0067] In operation S68, the first set of vacuum chucks 150A1, 150A2, and 150A3 can be moved to a second position after releasing the vacuum mode of the first set of vacuum chucks 150A1, 150A2, and 150A3.

[0068] As described above, since the wafer W is vacuum adsorbed by the second set of vacuum chucks 150B1, 150B2, and 150B3, the first set of vacuum chucks 150A1, 150A2, and 150A3 can be moved to the second position, asFigure 7C as shown. The first set of vacuum chucks 150A1, 150A2, and 150A3 can be flipped below the reference plane P1 on which the wafer W is to be placed (e.g., Figure 4B ).

[0069] When moving such a vacuum chuck (e.g., when such a vacuum chuck comes into contact with the wafer W (e.g., moves to the first position)), and when it separates from the wafer (e.g., moves to the second position), it can move in a non-parallel direction (specifically, a direction perpendicular to the back surface Wb of the wafer W) from the wafer W to prevent contact with and / or collision with the wafer W during the movement of the vacuum chuck.

[0070] In operation S69, a second inspection is performed by additionally scanning a wafer area that was not scanned in the first scan (e.g., the first contact area R1).

[0071] The area scanned in this scan process can include the area in contact with the vacuum chuck of the first chuck (e.g., the first contact area R1) and the area around this area. This can allow the entire area of the wafer W to be inspected.

[0072] As described above, the scan process can be divided while selectively supporting the wafer using multiple movable vacuum chucks. Therefore, the desired inspection can be performed up to the edge area of the wafer, and the device yield near the wafer edge can be significantly improved.

[0073] The wafer inspection apparatus 200 may perform one or more of operations S61 - S69 based on the control unit 210. For example, the control unit 210 may cause the wafer inspection apparatus 200 to perform a first process (e.g., at least operation S64), in which the emission unit 140 and the moving unit 130 jointly cause the inspection electromagnetic wave L1 to irradiate the back surface Wb of the wafer W except for at least the first contact area R1 when the first set of vacuum suction cups 150A1, 150A2, and 150A3 are in the first position and the second set of vacuum suction cups 150B1, 150B2, and 150B3 are in the second position. Additionally, the control unit 210 may cause the wafer inspection apparatus 200 to perform a second process (e.g., at least operation S69), in which the emission unit 140 and the moving unit 130 jointly cause the inspection electromagnetic wave L1 to irradiate at least the first contact area R1 (e.g., all areas of the wafer W that were not irradiated in the first process when the first set of vacuum suction cups 150A1, 150A2, and 150A3 are in the second position and the second set of vacuum suction cups 150B1, 150B2, and 150B3 are in the first position). Additionally, the control unit 210 may cause the wafer inspection apparatus 200 to further perform a process between the first process and the second process (e.g., operation S66), in which the wafer inspection apparatus 200 structurally supports the wafer W with the plurality of second vacuum suction cups 150B1, 150B2, and 150B3 together with the plurality of first vacuum suction cups 150A1, 150A2, and 150A3 based on stopping the irradiation of the inspection electromagnetic wave L1 and moving the plurality of second vacuum suction cups 150B1, 150B2, and 150B3 to the first position.

[0074] The movement of the vacuum suction cups, the vacuum adsorption process, and the inspection process (e.g., the scanning process) shown in Figure 1 and Figure 6 can be performed by the control unit ( Figures 7A to 7C 210 therein). In some example embodiments, the plurality of vacuum suction cups are described as being divided into two groups and selectively moved, with each group including three vacuum suction cups. However, each group may include a different number of vacuum suction cups (e.g., four vacuum suction cups), or may be randomly selected to be moved individually without being divided into multiple groups.

[0075] Additionally, in some example embodiments, the frame is described as having a three - sided shape structure, but may have various shapes such as square and circular. As described above, the arrangement of the plurality of vacuum suction cups and / or the shape of the frame can be variously changed.

[0076] Figure 8 and Figure 9 are the plan views of the wafer inspection apparatus according to various example embodiments.

[0077] Referring to Figure 8 , according to some example embodiments, a wafer inspection apparatus 100A may include a frame 110', which has a rectangle including four sides.

[0078] A plurality of vacuum chucks 150A1, 150A2, 150A3 and 150B1, 150B2, 150B3 may be divided into a first group and a second group, each group having three vacuum chucks. The first group of vacuum chucks 150A1, 150A2 and 150A3 and the second group of vacuum chucks 150B1, 150B2, 150B3 include two pairs of vacuum chucks 150A2, 150A3, 150B2 and 150B3 arranged adjacent to each other (e.g., two pairs of adjacent vacuum chucks 150A2, 150A3, 150B2 and 150B3) and a pair of vacuum chucks 150A1 and 150B1 arranged to face each other (e.g., a pair of opposite vacuum chucks 150A1 and 150B1). As Figure 8 shown, two pairs of vacuum chucks 150A2, 150A3, 150B2 and 150B3 adjacent to each other may be respectively disposed on two opposite sides, and the pair of vacuum chucks 150A1 and 150B1 may be disposed on the other two opposite sides.

[0079] The first group of vacuum chucks 150A1, 150A2 and 150A3 and the second group of vacuum chucks 150B1, 150B2 and 150B3 may be arranged to be rotationally symmetric about the central axis of the wafer W. In some example embodiments, the first group of vacuum chucks 150A1, 150A2 and 150A3 may be arranged such that the contact points (or the first contact region R1) of the wafer W substantially form an equilateral triangle, and the second group of vacuum chucks 150B1, 150B2 and 150B3 may be arranged such that the contact points (or the second contact region R2) of the wafer W substantially form an inverted triangle that is rotationally symmetric 180 degrees with respect to the equilateral triangle configuration of the first group of vacuum chucks 150A1, 150A2 and 150A3. Accordingly, the first contact region R1 and the second contact region R2 may be rotationally symmetric about the central axis W-C of the wafer W.

[0080] Figure 8 The configuration of the vacuum chucks shown in Figure 6 may be implemented with a frame having another shape such as a circle. Additionally, although the vacuum chucks need not form a group, the entire wafer area may be detected in the same manner as the wafer inspection method described with reference to

[0081] Referring to Figure 9, a wafer inspection apparatus 100B according to some example embodiments may include a circular frame 110 ″ and a plurality of vacuum chucks 150A, 150B, 150C, and 150D disposed on the frame 110 ″.

[0082] The plurality of vacuum cups are not substantially divided into two groups, and may be randomly combined instead of selective support by the groups described in some example embodiments.

[0083] For example, the wafer W is supported by the first vacuum chuck 150A, the second vacuum chuck 150B, and the third vacuum chuck 150C (the first combination) disposed in the first position, and a first inspection is performed on a wafer region other than a region in contact with the first vacuum chuck 150A, the second vacuum chuck 150B, and the third vacuum chuck 150C while the wafer is supported by the first combination. Then, the wafer W is supported by the first vacuum chuck 150A, the second vacuum chuck 150B, and the fourth vacuum chuck 150D (the second combination) disposed in the first position, and a second inspection is additionally performed on a region in contact with the vacuum chuck 150C while the wafer W is supported by the second combination.

[0084] In a similar manner, the third inspection and the fourth inspection may be performed on the region contacting the first vacuum chuck 150A and the second vacuum chuck 150B while the wafer W is supported by the other three vacuum chucks. Therefore, the inspection may be performed on the entire region of the wafer W.

[0085] The setting of the first position and the second position and the movement of the first position and the second position can be implemented in various forms. In some example embodiments, the vacuum chuck is shown as moving in a flipping manner. However, the vacuum chuck can be configured to move to the second position (e.g., an area (e.g., a corner area) that is not overlapped with the wafer W (e.g., exposed by the wafer W) along a track formed in the frame).

[0086] Figure 10A , Figure 10B and Figure 10C is a plan view of a wafer inspection apparatus according to some example embodiments, Figure 11A , Figure 11B and Figure 11C They are shown respectively Figure 10A , Figure 10B and Figure 10C A cross-sectional view of the movement of the vacuum chuck of the wafer inspection equipment shown in FIG.

[0087] Reference Figure 10A and Figure 11A, according to some example embodiments, a wafer inspection apparatus includes a frame 110' having a rectangular shape and a plurality of vacuum chucks 150A1, 150A2, 150A3, 150A4, 150B1, 150B2, 150B3, and 150B4 disposed on the frame 110'. As shown, the frame 110' defines an opening OP including a plurality of corner regions CR that are not covered by a wafer W supported by the frame 110' and may be referred to as corner regions of the opening OP that are exposed by the wafer W supported by the frame 110'. Again, when the frame 110' supports the wafer W, the frame 110' and the wafer W may jointly define a corner region CR that is exposed between the frame 110' and the wafer W.

[0088] As Figure 10A shown, the plurality of vacuum chucks 150A1, 150A2, 150A3, 150A4, 150B1, 150B2, 150B3, and 150B4 are divided into four first groups and second groups. The first group of vacuum chucks 150A1, 150A2, 150A3, and 150A4 may be respectively disposed on four sides. The second group of vacuum chucks 150B1, 150B2, 150B3, and 150B4 may also be respectively disposed on four sides. The first group of vacuum chucks 150A1, 150A2, 150A3, 150A4 supports the wafer W at positions (first positions) adjacent to the center of each side, while the second group of vacuum chucks 150B1, 150B2, 150B3, 150B4 may be arranged not to overlap with the wafer W in one or more adjacent corner regions CR (second positions) on each side.

[0089] As Figure 11A shown, some of the vacuum chucks employed in example embodiments may be moved along a track TRb provided in the frame 110'. The second group of vacuum chucks 150B1, 150B2, 150B3, and 150B4 may be moved along the track TRb from a first position to a second position. As Figures 11A to 11CAs shown, each of the plurality of tracks TRa and TRb includes a first portion TR-1 extending downward from a first position and a second portion TR-2 connected to the lower end of the first portion TR-1 and extending horizontally to a second position. The movement of the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 along the track TRb may include a vertical movement L1 and a horizontal movement L2. In the vertical movement L1, the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 are separated from the wafer W in a substantially vertical direction. In the horizontal movement L2, the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 are moved horizontally to the second position. Therefore, it is possible to prevent the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 from contacting and / or colliding with the wafer W during the movement to the second position.

[0090] As Figure 10B and Figure 11B shown, the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 may be moved along the track TRb provided in the frame 110' to the first position. Similar to Figure 6 the operation S64, this movement may be performed after inspecting the wafer area except for the area in contact with the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4. The second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 may be moved along the track TRb from the second position to the first position. The movement of the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 along the track TRb may include a reverse horizontal movement L2' and a reverse vertical movement L1'. In the reverse horizontal movement L2', the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 are moved horizontally from the second position. In the reverse vertical movement L1', the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 are moved in a substantially vertical direction to the first position. After this movement, similar to Figure 6 the operation S66, the wafer may be vacuum-sucked by the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 to be supported by the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 together with the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4.

[0091] As Figure 10C and Figure 11CAs shown, the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 can be moved along the track TRa provided in the frame 110' to the second position. This movement can be performed by an operation similar to the operation Figure 6 . Specifically, the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 can be moved along the track TRa from the first position to the second position after releasing the vacuum suction. The movement of the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 along the track TRa can include a vertical movement L1 and a horizontal movement L2. In the vertical movement L1, the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 are separated from the wafer W in a substantially vertical direction. In the horizontal movement L2, the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 are moved to the second position in the horizontal direction. Therefore, it is possible to prevent the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 from contacting and / or colliding with the wafer W during the movement to the second position. It will be understood that as Figure 10C and Figure 11C show, the second position of the first set of vacuum suction cups 150A1, 150A2, 150A3, and 150A4 and as Figure 10A and Figure 11A show, the second position of the second set of vacuum suction cups 150B1, 150B2, 150B3, and 150B4 can be located in one or more corner regions CR defined between the wafer W and the frame 110'. As Figures 10A to 11C further shows, the frame 110' can include a plurality of tracks TRa and TRb, which are configured to enable a plurality of vacuum suction cups to move between the first position and the second position.

[0092] As Figures 10A to 11C shows, the plurality of first vacuum suction cups 150A1, 150A2, 150A3, 150A4 and the plurality of second vacuum suction cups 150B1, 150B2, 150B3, 150B4 in the first position are adjacent to each other in pairs. Each pair of the plurality of first vacuum suction cups 150A1, 150A2, 150A3, 150A4 and the plurality of second vacuum suction cups 150B1, 150B2, 150B3, 150B4 in the second position are arranged in a direction away from the first position. The frame 110' can include tracks TRa, TRb, which are configured to enable a plurality of vacuum suction cups to be movable between the first position and the second position. As Figures 10A to 11CAs shown, a plurality of first vacuum suction cups 150A1, 150A2, 150A3, 150A4 and a plurality of second vacuum suction cups 150B1, 150B2, 150B3, 150B4 are located in one or more of the plurality of corner regions CR when moving to the second position.

[0093] In some example embodiments, the movement of the vacuum suction cups using the rails can be similarly applied to frames of different shapes and vacuum suction cups with different configurations. For example, the vacuum suction cups can be moved to the second position (e.g., the corner region CR) in a manner using the rails rather than in a flipping manner without being stacked with the wafer W in the support structure shown. Additionally, in the example embodiments, the movement of the vacuum suction cups can be performed by combining the manner using the rails with the flipping manner. For example, referring to Figure 3 , the vacuum suction cups can each be configured to move at least partially horizontally along the corners of the frame by the provided guide rails or tracks while flipping without moving to the lower surface of the frame. Figure 5

[0094] As described above, according to the example embodiments, the vacuum suction cups can be configured to be movable. Thus, even a part covered by the vacuum suction cups can be measured by an additional inspection process. In particular, the example embodiments can be advantageously used in a transmission wafer inspection device.

[0095] Although some example embodiments have been shown and described above, it will be apparent to those skilled in the art that various modifications and changes can be made without departing from the scope of the inventive concept defined by the appended claims.​

Claims

1. A wafer inspection device, comprising: A support structure, which includes a frame and a plurality of vacuum suction cups. Each of the plurality of vacuum suction cups is mounted on the frame and has a support surface including a vacuum suction portion. The support structure is configured to structurally support a wafer on one or more of the plurality of vacuum suction cups. The frame defines an opening whose area is larger than the area of the wafer; An electromagnetic wave emitter, which is configured to radiate inspection electromagnetic waves to the wafer; A sensor, which is configured to receive the inspection electromagnetic waves from the wafer based on the inspection electromagnetic waves passing through the wafer; And A driver, which is configured to move at least one of the electromagnetic wave emitter and the frame to change the radiation position of the wafer, wherein each of the plurality of vacuum suction cups is configured to be selectively movable between a first position and a second position with respect to the frame, wherein, among the plurality of vacuum suction cups, a first group of vacuum suction cups selectively moved to the first position is arranged such that the support surfaces of the first group of vacuum suction cups are coplanar with the plane on which the wafer is disposed, and among the plurality of vacuum suction cups, a second group of vacuum suction cups selectively moved to the second position is arranged to deviate from the path of the inspection electromagnetic waves between the wafer and the electromagnetic wave emitter, and each of the second group of vacuum suction cups selectively moved to the second position is flipped vertically downward or slides downward along the frame from the first position.

2. The wafer inspection apparatus according to claim 1, wherein, The plurality of vacuum suction cups include multiple groups of vacuum suction cups, and each group of vacuum suction cups includes three or more vacuum suction cups configured to structurally support the wafer.

3. The wafer inspection device according to claim 2, wherein, The plurality of vacuum suction cups include the first group of vacuum suction cups and the second group of vacuum suction cups, and each group of vacuum suction cups includes three vacuum suction cups, and The first group of vacuum suction cups and the second group of vacuum suction cups include three pairs of adjacent vacuum suction cups.

4. The wafer inspection device according to claim 2, wherein, The plurality of vacuum suction cups include the first group of vacuum suction cups and the second group of vacuum suction cups, and each group of vacuum suction cups includes three vacuum suction cups, and The first group of vacuum suction cups and the second group of vacuum suction cups include: Two pairs of adjacent vacuum suction cups, and A pair of opposite vacuum suction cups facing each other.

5. The wafer inspection apparatus according to claim 1, wherein, Each of the second group of vacuum suction cups selectively moved to the second position is configured to be additionally movable from the second position to the lower surface of the frame.

6. The wafer inspection device according to claim 1, wherein, The opening defined by the frame includes a plurality of corner regions exposed by the wafer, and The second group of vacuum suction cups selectively moved to the second position is flipped vertically downward from the first position and moves to one or more of the plurality of corner regions.

7. The wafer inspection apparatus according to claim 6, wherein, The frame includes a plurality of tracks, which are configured to enable the plurality of vacuum suction cups to be movable between the first position and the second position.

8. The wafer inspection apparatus according to claim 7, wherein, Each of the plurality of tracks includes: A first part that extends downward in the vertical direction from the first position, and A second part that is connected to the lower end of the first part and extends horizontally to the second position.

9. The wafer inspection apparatus according to claim 1, wherein, The frame includes a rectangular frame, a circular frame, or a [ - shaped frame.

10. A wafer inspection device, comprising: A frame defining an opening, the frame being configured to structurally support a wafer in the opening, wherein the area of the opening is larger than the area of the wafer; A plurality of first vacuum suction cups and a plurality of second vacuum suction cups, each of the plurality of first vacuum suction cups and the plurality of second vacuum suction cups having a support surface including a vacuum suction portion, the plurality of first vacuum suction cups and the plurality of second vacuum suction cups being configured to be movable between a first position and a second position of the frame, and the support surface of each vacuum suction cup being configured to be coplanar with a reference surface for supporting the wafer when the vacuum suction cup is located at the first position of the frame; An electromagnetic wave emitter configured to radiate inspection electromagnetic waves to the back surface of the wafer; A sensor on the wafer, the sensor being configured to receive the inspection electromagnetic waves from the wafer based on the inspection electromagnetic waves passing through the wafer; A driver configured to move the electromagnetic wave emitter to change the radiation position on the back surface of the wafer; and A processing circuit configured to control the driver and the movement of the plurality of first vacuum suction cups and the plurality of second vacuum suction cups, wherein the plurality of first vacuum suction cups and the plurality of second vacuum suction cups are configured to move to the second position to deviate from the path of the inspection electromagnetic waves between the wafer and the electromagnetic wave emitter, and The plurality of first vacuum suction cups are configured to move to the first position such that the support surfaces of the plurality of first vacuum suction cups contact a first contact area on the back surface of the wafer, and the plurality of second vacuum suction cups are configured to move to the first position such that the support surfaces of the plurality of second vacuum suction cups contact a second contact area on the back surface of the wafer, the first contact area and the second contact area being different areas on the back surface of the wafer, wherein each of the plurality of first vacuum suction cups and the plurality of second vacuum suction cups is configured to be moved to the second position based on flipping vertically downward from the reference surface or sliding downward along the frame.

11. The wafer inspection apparatus according to claim 10, wherein, The processing circuit is configured to cause the wafer inspection device to perform: A first process, in which, when the plurality of first vacuum suction cups are located at the first position and the plurality of second vacuum suction cups are located at the second position, the electromagnetic wave emitter and the driver jointly cause the inspection electromagnetic waves to be radiated to the back surface of the wafer except for the first contact area, and A second process, in which, when the plurality of first vacuum suction cups are located at the second position and the plurality of second vacuum suction cups are located at the first position, the electromagnetic wave emitter and the driver jointly cause the inspection electromagnetic waves to be radiated to the first contact area on the back surface of the wafer.

12. The wafer inspection apparatus according to claim 11, wherein, The processing circuit is configured to further cause the wafer inspection device to perform a process between the first process and the second process, in which, based on stopping the radiation of the inspection electromagnetic wave and moving the plurality of second vacuum suction cups to the first position, the wafer inspection device structurally supports the wafer together with the plurality of first vacuum suction cups and the plurality of second vacuum suction cups.

13. The wafer inspection apparatus according to claim 10, wherein, The first contact area and the second contact area are arranged to be rotationally symmetric about the central axis of the wafer.

14. The wafer inspection apparatus according to claim 10, wherein, The first contact area and the second contact area are adjacent to each other in pairs on the back surface of the wafer.

15. The wafer inspection device according to claim 10, wherein, the plurality of first vacuum suction cups and the plurality of second vacuum suction cups are adjacent to each other in pairs in the first position, and each pair of vacuum suction cups in the second position among the plurality of first vacuum suction cups and the plurality of second vacuum suction cups is arranged in a direction away from the first position, and the frame includes a plurality of tracks configured to enable the plurality of first vacuum suction cups and the plurality of second vacuum suction cups to be movable along the tracks.

16. The wafer inspection device according to claim 15, wherein, the opening defined by the frame includes a plurality of corner areas exposed by the wafer, and the plurality of first vacuum suction cups and the plurality of second vacuum suction cups are flipped vertically downward from the reference plane and move along the tracks into one or more of the plurality of corner areas.

17. The wafer inspection apparatus according to claim 15, wherein, Each of the plurality of tracks includes: a first portion that extends downward in the vertical direction from the first position, and a second portion that is connected to the lower end of the first portion, and the second portion extends in the horizontal direction to the second position.

18. A wafer inspection device, comprising: a support structure including a frame and a plurality of vacuum suction cups, each of the plurality of vacuum suction cups being mounted on the frame and each vacuum suction cup having a support surface including a vacuum suction portion, the support structure being configured to structurally support a wafer on one or more of the plurality of vacuum suction cups, the frame defining an opening having an area larger than the area of the wafer, each vacuum suction cup being configured to be arranged such that the support surface of the vacuum suction cup is coplanar with a reference plane, and the wafer being supported by the support structure on the reference plane; an electromagnetic wave emitter configured to radiate an inspection electromagnetic wave to the wafer; a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer; and a driver configured to move at least one of the electromagnetic wave emitter and the frame to change the radiation position of the wafer, wherein each of the plurality of vacuum suction cups is configured to be separated from the reference plane to descend along the frame or to be flipped downward with respect to the frame.

19. The wafer inspection device according to claim 18, wherein, the opening defined by the frame includes a plurality of corner areas exposed by the wafer, and Each of the plurality of vacuum suction cups is configured to separate from the reference surface based on at least partially moving to the plurality of corner regions in the horizontal direction of the frame.

20. The wafer inspection apparatus according to claim 18, wherein, The vacuum suction portion of each vacuum suction cup has a concave structure on the support surface of the vacuum suction cup.

21. The wafer inspection apparatus according to claim 20, further comprising: a first channel extending into the frame and in fluid communication with a vacuum source, and a second channel extending into the vacuum suction cups of the plurality of vacuum suction cups, the second channel being connected to the vacuum suction portion and in fluid communication with the first channel.

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