Display device and method of manufacturing the same

Abstract

The present invention provides a display device and a method for manufacturing the same. A display device according to some exemplary embodiments includes: a display area; a non-display area surrounding the display area and including a sealing area; a first substrate including a central portion and an outer portion, the central portion being a portion within the display area and the outer portion being a portion within the sealing area; a second substrate including a central portion and an outer portion, the central portion being a portion within the display area and the outer portion being a portion within the sealing area; and a sealing portion between the first substrate and the second substrate and within the sealing area, wherein the thickness of the central portion of the first substrate is different from the thickness of the outer portion of the first substrate, and the thickness of the central portion of the second substrate is different from the thickness of the outer portion of the second substrate.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2019-0101908, filed on August 20, 2019, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of this disclosure relate to display devices and methods of manufacturing the same. Background Technology

[0004] There is a need for display devices with various characteristics, such as thinness, low power consumption, and light weight, and various displays are being developed, such as liquid crystal displays and organic light-emitting device displays.

[0005] The display device is manufactured by: placing switching elements, such as thin-film transistors; wiring for connecting them; electrodes for applying voltage to the display elements; and display elements for configuring red, green, and blue pixels as a thin layer structure on a first substrate, and sealing a second substrate on the thin layer structure.

[0006] A sealing process is performed by inserting a sealing portion made of molten material between a first substrate and a second substrate and allowing the molten material to harden.

[0007] However, if the substrate thickness is greater than or equal to about 0.3t, stress accumulates on the sealing unit where the sealing portion is applied during the process of cutting the display device for each unit (e.g., display unit), and the edges of the substrate may break. To minimize or reduce this, the display device is cut at a position separated from the sealing portion by a set or predetermined distance, which inevitably widens the dead space in the area where no image is displayed (e.g., non-display area). As used herein, the term (t) denotes a distance unit; for example, 1t corresponds to 1 millimeter (1mm = 10^6). - 3 m).

[0008] The information disclosed in this background section is only intended to enhance the understanding of the background art of this disclosure, and therefore may contain information about prior art that is not known to those skilled in the art. Summary of the Invention

[0009] This disclosure provides embodiments of a display device having a reduced dead space in the non-display area and a method for manufacturing the same.

[0010] In embodiments of this disclosure, a display device includes: a display area; a non-display area surrounding the display area and including a sealing area; a first substrate including a central portion and an outer portion, the central portion being a portion within the display area and the outer portion being a portion within the sealing area; a second substrate including a central portion and an outer portion, the central portion being a portion within the display area and the outer portion being a portion within the sealing area; and a sealing portion between the first substrate and the second substrate and within the sealing area, wherein the thickness of the central portion of the first substrate is different from the thickness of the outer portion of the first substrate, and the thickness of the central portion of the second substrate is different from the thickness of the outer portion of the second substrate.

[0011] In some embodiments, the thickness of the central portion of the first substrate may be greater than the thickness of the outer portion of the first substrate.

[0012] In some embodiments, the thickness of the central portion of the first substrate may be from 0.3t (0.3 mm) to 0.4t (0.4 mm), and the thickness of the outer portion of the first substrate may be less than or equal to 0.25t (0.25 mm).

[0013] In some embodiments, the thickness of the central portion of the second substrate may be greater than the thickness of the outer portion of the second substrate.

[0014] In some embodiments, the thickness of the central portion of the second substrate may be from 0.3t (0.3 mm) to 0.4t (0.4 mm), and the thickness of the outer portion of the second substrate may be less than or equal to 0.25t (0.25 mm).

[0015] In some embodiments, the outer portion of the first substrate may include a first outer portion and a second outer portion on two opposite sides in the horizontal direction along the central portion of the first substrate, and the thickness of the first outer portion of the first substrate may be different from the thickness of the second outer portion of the first substrate.

[0016] In some embodiments, the outer portion of the second substrate may include a first outer portion and a second outer portion on two opposite sides in the horizontal direction along the central portion of the second substrate, and the thickness of the first outer portion of the second substrate may be different from the thickness of the second outer portion of the second substrate.

[0017] In some embodiments, the first substrate and the second substrate may include a dicing line at the sealing area.

[0018] In some embodiments, the cutting line may be located at a position 50 μm to 100 μm away from the edge of the outer portion of the first substrate and the edge of the outer portion of the second substrate, towards the center portion of the first substrate and the edge of the outer portion of the second substrate.

[0019] In some embodiments of this disclosure, the display device includes: a display area; a non-display area surrounding the display area and including a sealing area; a first substrate including a central portion and an outer portion, the central portion being a portion within the display area and the outer portion being a portion within the sealing area; a second substrate including a central portion and an outer portion, the central portion being a portion within the display area and the outer portion being a portion within the sealing area surrounding the display area; a sealing portion between the first substrate and the second substrate and within the sealing area; and an optical element on the underside of the first substrate, wherein the central portion of the second substrate includes at least one recessed portion on a side facing the first substrate, and the optical element is located at a portion corresponding to the recessed portion, the thickness of the central portion of the first substrate is different from the thickness of the outer portion of the first substrate, and the thickness of the central portion of the second substrate is different from the thickness of the outer portion of the second substrate.

[0020] In some embodiments, the thickness of the central portion of the first substrate and the thickness of the central portion of the second substrate may each be greater than the thickness of the outer portion of the first substrate and the thickness of the outer portion of the second substrate.

[0021] In some embodiments, the thickness of the central portion of the first substrate and the thickness of the central portion of the second substrate may each be from 0.3t (0.3 mm) to 0.4t (0.4 mm), and the thickness of the outer portion of the first substrate and the thickness of the outer portion of the second substrate may each be less than or equal to 0.25t (0.25 mm).

[0022] In some embodiments, the outer portion of the first substrate may include a first outer portion and a second outer portion on two opposite sides in the horizontal direction along the central portion of the first substrate, and the outer portion of the second substrate may include a first outer portion and a second outer portion on two opposite sides in the horizontal direction along the central portion of the second substrate. The thickness of the first outer portion of the first substrate may be different from the thickness of the second outer portion of the first substrate, and the thickness of the first outer portion of the second substrate may be different from the thickness of the second outer portion of the second substrate.

[0023] In some embodiments, the thickness of the first outer portion of the first substrate, the thickness of the second outer portion of the first substrate, the thickness of the first outer portion of the second substrate, and the thickness of the second outer portion of the second substrate may each be less than or equal to 0.25 mm.

[0024] In some embodiments, the first substrate and the second substrate may include a dicing line at the sealing area.

[0025] In some embodiments of this disclosure, a method for manufacturing a display device includes: attaching a first acid-resistant film to an upper side of a substrate and attaching a second acid-resistant film to a lower side of the substrate; disposing a first metal pattern portion on a portion of the first acid-resistant film and a second metal pattern portion on a portion of the second acid-resistant film; radiating ultraviolet light on an upper side of a portion of the first acid-resistant film in which the first metal pattern portion is not exposed on the first acid-resistant film, and radiating ultraviolet light on a lower side of the second acid-resistant film in which the second metal pattern portion is not exposed on the second acid-resistant film; removing the exposed portions of the first and second acid-resistant films; and etching the upper side of the substrate in which the first acid-resistant film has been removed and etching the lower side of the substrate in which the second acid-resistant film has been removed, wherein an outer portion of the substrate corresponds to the portion of the substrate in which the first acid-resistant film has been removed, and a recessed portion of the substrate corresponds to the portion of the substrate in which the second acid-resistant film has been removed.

[0026] In some embodiments, the substrate may include a display area for displaying an image and a non-display area surrounding the display area, and the outer portion of the substrate may be in the non-display area.

[0027] In some embodiments, the thickness of the outer portion of the substrate may be less than or equal to 0.25t (0.25 mm).

[0028] In some embodiments, a recessed portion of the substrate may be formed in the display area.

[0029] In some implementations, the substrate may be made of glass.

[0030] According to some exemplary embodiments, the outer portion of the substrate is formed to be thinner than the central portion, and the process for cutting units (e.g., cutting to form display units) can be performed in the sealed area, thereby reducing dead space on the substrate and reducing the cost of processing the outer portion.

[0031] According to some implementations, a setting portion may be included to surround the outer portion of the substrate, thereby achieving a thin and light display device.

[0032] According to some implementations, the outer portion of the substrate can be etched during the process of etching the recessed portion in the light-transmitting region, thereby reducing the number of processing stages and increasing productivity. Attached Figure Description

[0033] The accompanying drawings, together with the specification, illustrate embodiments of the subject matter of this disclosure and, together with the description, serve to explain the principles of embodiments of the subject matter of this disclosure.

[0034] Figure 1 A cross-sectional view of a display device according to an exemplary embodiment is shown.

[0035] Figure 2 The edge portion of a display device according to an exemplary embodiment is shown.

[0036] Figure 3 Showing along according to Figure 2 An image of the edge portion of the display device cut by a cutting line in an exemplary embodiment of the display device.

[0037] Figure 4 A cross-sectional view of a display device according to an exemplary embodiment is shown.

[0038] Figures 5 to 10 A cross-sectional view is shown of a method for manufacturing a display device according to an exemplary embodiment.

[0039] Figure 11 A plan view of a display device according to an exemplary embodiment is shown.

[0040] Figure 12 Showing along Figure 11 A cross-sectional view of the display device taken by line XII-XII'.

[0041] Figures 13 to 18 A cross-sectional view is shown of a method for manufacturing a display device according to an exemplary embodiment.

[0042] Figure 19 A plan view of a display device according to an exemplary embodiment is shown.

[0043] Figure 20 Showing along Figure 19 The cross-sectional view of the display device taken by line XX-XX'. Detailed Implementation

[0044] The subject matter of this disclosure will be described more fully below with reference to the accompanying drawings, in which some exemplary embodiments of this disclosure are illustrated. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit and scope of this disclosure.

[0045] The figures and descriptions are illustrative in nature and not restrictive, and the same reference numerals throughout the specification indicate the same elements.

[0046] For better understanding and ease of description, the dimensions and thicknesses of each configuration shown in the figures (e.g., the relative dimensions and thicknesses of features or elements) may be enlarged, and embodiments of this disclosure are not limited thereto. In the figures, the thicknesses of layers, films, panels, areas, etc., may be enlarged for clarity. The thicknesses of some layers and areas may be enlarged for better understanding and ease of description.

[0047] It will be understood that when an element, such as a layer, film, region, or substrate, is referred to as being "on" or "in contact with" another element, it may be "directly on" or "in contact with" the other element, or there may be intermediate elements present. Conversely, when an element is referred to as being "directly on" or "in contact with" another element, there are no intermediate elements present. Furthermore, in the specification, the phrase "on" may mean a position above or below the target portion, and does not necessarily mean a position on the upper side of the target portion (e.g., the upper side of the target portion based on the direction of gravity).

[0048] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a” and “an” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the terms “comprises,” “comprising,” “includes,” and “including,” when used in this specification, specify the presence of the described features, integers, behaviors, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, behaviors, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerated items.

[0049] The phrase “in a plane” means viewing the target portion from the top, and the phrase “in a cross section” means viewing the cross section of the target portion (e.g., a cross section obtained by vertically cutting the target portion).

[0050] Reference Figure 1 A display device according to an exemplary embodiment is described.

[0051] Figure 1 A cross-sectional view of a display device according to an exemplary embodiment is shown.

[0052] refer to Figure 1 The display device includes a first substrate 100, a second substrate 200, and a sealing portion 30.

[0053] The first substrate 100 is located on the lower side of the display device and may include glass, quartz, and / or ceramic. A display element 110 (which may include an organic light-emitting diode (OLED)) is located on the upper side of the first substrate 100. The display element 110 is equipped with (e.g., the display element 110 includes) pixel circuitry comprising multiple wirings, thin-film transistors, pixel electrodes, and a common electrode, as well as an emitter, and the display element 110 may include multiple pixels for displaying images.

[0054] The first substrate 100 includes a central portion 150 having the same thickness D3 (e.g., having a uniform thickness D3) and a first outer portion 151 and a second outer portion 152 on two sides of the central portion 150 (e.g., on two opposite sides along the horizontal direction of the central portion 150). The first outer portion 151 and the second outer portion 152 may be referred to as outer portions. The first substrate 100 includes areas divided into a display area (DA) and a non-display area (PA), in which a display element 110 is placed to display an image, and the non-display area (PA) surrounds the display area (DA). The non-display area (PA) includes a sealing area (SA) in which a sealing portion 30 is placed.

[0055] The central portion 150 of the first substrate 100 includes part or all of the display area (DA) and a portion of the non-display area (PA), and the outer portions 151 and 152 of the first substrate 100 include portions of the non-display area (PA) containing a sealing area (SA).

[0056] For example, in some embodiments, the display device may include a display area (DA) and a non-display area (PA) surrounding the display area (DA), and the non-display area (PA) may include a sealing area (SA). In some embodiments, the central portion 150 of the first substrate 100 may include a first portion overlapping the display element 110, and the first portion may be within the display area (DA) (e.g., may overlap with the display area (DA)). In some embodiments, the outer portions 151 and 152 of the first substrate 100 may include a second portion overlapping the sealing portion 30, and the second portion may be within the sealing area (SA) (e.g., may overlap with the sealing area (SA)). In some embodiments, a portion of the non-display area (PA) may overlap with a portion of the central portion 150, and another portion of the non-display area (PA) may overlap with portions of the outer portions 151 and 152.

[0057] The central portion 150 of the first substrate 100 has a thickness different from that of the outer portions 151 and 152 of the first substrate 100. In some embodiments, the thickness D3 of the central portion 150 of the first substrate 100 is greater than the respective thicknesses D4 and D6 of the outer portions 151 and 152 of the first substrate 100. In some exemplary embodiments, the thickness D3 of the central portion 150 of the first substrate 100 is 0.3t to 0.4t, and the respective thicknesses D4 and D6 of the outer portions 151 and 152 of the first substrate 100 are less than or equal to 0.25t. In some embodiments, the thickness D4 of the first outer portion 151 may be the same as, substantially the same as, or different from the thickness D6 of the second outer portion 152.

[0058] Each of the outer portions 151 and 152 of the first substrate 100 is formed by etching the edges of the first substrate 100. The stages (e.g., processes) for forming the outer portions will be referred to herein. Figures 5 to 10 To describe in more detail.

[0059] The second substrate 200 is located on top of the display device and faces the first substrate 100. The second substrate 200 may include glass, quartz, and / or ceramic. In some embodiments, the second substrate 200 may seal the display element 110, which may include an organic light-emitting element (OLED). The second substrate 200 may have the same or substantially the same dimensions (e.g., thickness) as the first substrate 100, and the edges of the first substrate 100 and the second substrate 200 may be parallel to each other (e.g., aligned with each other).

[0060] The second substrate 200 includes a central portion 250 having the same thickness (e.g., a uniform thickness). The second substrate 200 includes a first outer portion 251 and a second outer portion 252 on two sides of the central portion 250 (e.g., on two opposite sides along the horizontal direction of the central portion 250). The first outer portion 251 and the second outer portion 252 may be referred to as outer portions. The second substrate 200 includes areas divided into a display area (DA) and a non-display area (PA), in which display elements 110 are arranged to display images, and the non-display area (PA) surrounds the display area (DA). The non-display area (PA) includes a sealing area (SA) in which sealing portions 30 are arranged.

[0061] The central portion 250 of the second substrate 200 includes part or all of the display area (DA) and a portion of the non-display area (PA), and the outer portions 251 and 252 of the second substrate 200 include portions of the non-display area (PA) containing a sealing area (SA).

[0062] For example, in some embodiments, the display device may include a display area (DA) and a non-display area (PA) surrounding the display area (DA), and the non-display area (PA) may include a sealing area (SA). In some embodiments, the central portion 250 of the second substrate 200 may include a first portion overlapping the display element 110, and the first portion may be within the display area (DA) (e.g., may overlap with the display area (DA)). In some embodiments, the outer portions 251 and 252 of the second substrate 200 may include a second portion overlapping the sealing portion 30, and the second portion may be within the sealing area (SA) (e.g., may overlap with the sealing area (SA)). In some embodiments, a portion of the non-display area (PA) may overlap with a portion of the central portion 250, and another portion of the non-display area (PA) may overlap with a portion of each of the outer portions 251 and 252.

[0063] The central portion 250 of the second substrate 200 has a thickness different from that of the outer portions 251 and 252 of the second substrate 200. In some embodiments, the thickness D1 of the central portion 250 of the second substrate 200 is greater than the respective thicknesses D2 and D5 of the outer portions 251 and 252 of the second substrate 200. In some exemplary embodiments, the thickness D1 of the central portion 250 of the second substrate 200 is 0.3t to 0.4t, and the respective thicknesses D2 and D5 of the outer portions 251 and 252 of the second substrate 200 are less than or equal to 0.25t. In some embodiments, the thickness D2 of the first outer portion 251 may be the same as or different from the thickness D5 of the second outer portion 252.

[0064] The central portion 150 of the first substrate 100 and the central portion 250 of the second substrate 200 overlap with the display element 110, and the outer portions 151 and 152 of the first substrate 100 and the outer portions 251 and 252 of the second substrate 200 overlap with the sealing portion 30. The first outer portions 151 and 152 of the first substrate 100 and the first outer portions 251 and 252 of the second substrate 200 may each have the same or different thicknesses, and the thickness of each may be less than or equal to 0.25t.

[0065] The sealing portion 30 is located between the first substrate 100 and the second substrate 200, and is situated within a sealing region (SA). The sealing portion 30 is separate from the display element 110, and is situated within the width (W) of the outer portions 151 and 152 of the first substrate 100 and the outer portions 251 and 252 of the second substrate 200. When determined (e.g., defined by) a length measured from the edges of the first substrate 100 and the second substrate 200 toward the center portions 150 and 250, the width (W) of the outer portions 151, 152, 251, and 252 can be greater than or equal to 650 μm. Accordingly, the sealing portion 30 can be situated within a 650 μm region extending toward the center portions 150 and 250 from the edges of the first substrate 100 and the second substrate 200. The sealing portion 30 may include various materials, such as, for example, molten material and / or anisotropic conductive film (ACF), and the sealing portion 30 may have a thickness of 0.005t (SD) to bond the first substrate 100 and the second substrate 200.

[0066] According to some exemplary embodiments, references are now made to Figure 2 and Figure 3The process for cutting a first substrate 100 and a second substrate 200, which are joined by a sealing portion 30, into various units (e.g., display units) in a display device is described.

[0067] Figure 2 The edge portion of a display device according to some exemplary embodiments is shown, and Figure 3 Showing along according to Figure 2 An image of the edge of a display device cut by a cutting line in an exemplary embodiment of a display device.

[0068] refer to Figure 2 The cutting wheel 700 is provided at the cutting line CL in the sealing area (SA). More specifically, the cutting wheel 700 is provided at the cutting line CL on the outer portion 152 of the first substrate 100 and the outer portion 252 of the second substrate 200.

[0069] The cutting line CL of the first substrate 100 and the cutting line CL of the second substrate 200 are dashed lines extending in the vertical direction. For example, the cutting line CL is a dashed line extending in the vertical direction from the upper side of the outer portion 252 of the second substrate 200 to the lower side of the outer portion 152 of the first substrate 100. On the first substrate 100 and the second substrate 200, the cutting line CL may be located at a position (e.g., a location) 50 μm to 100 μm away from the edges of the first substrate 100 and the second substrate 200 toward the center portions 150 and 250. In some embodiments, the cutting line CL may be located at a position (e.g., a location) 60 μm away from the edges of the substrates 100 and 200 toward the center portions 150 and 250. The location of the cutting line CL may be referred to as the cutting edge.

[0070] A cutting wheel 700 provided at the cutting line CL of the first substrate 100 cuts half of the first substrate 100 through the sealing portion 30 from the surface (e.g., the lower side) of the first substrate 100 in the thickness direction. A cutting wheel 700 provided at the cutting line CL of the second substrate 200 cuts half of the second substrate 200 through the sealing portion 30 from the surface (e.g., the upper side) of the second substrate 200 in the thickness direction.

[0071] For example, in some embodiments, the cutting wheel 700 cuts the first substrate 100 along a first cutting path CP1 to provide a curved edge for the display device. In some embodiments, the first cutting path CP1 begins at a cutting line CL on the underside of the first substrate 100, passes through the first outer portion 152 and half of the sealing portion 30 of the first substrate 100 in a vertical direction (e.g., the z-axis direction), and also passes (e.g., simultaneously) a first horizontal distance C1 to the edge of the display device in a horizontal direction (e.g., in a direction opposite to the x-axis direction). In some embodiments, the cutting wheel 700 may cut the second substrate 200 along a second cutting path CP2 to provide a curved edge for the display device. The second cutting path CP2 begins at a cutting line CL on the upper side of the second substrate 200, passes through the second outer portion 252 and half of the sealing portion 30 of the second substrate 200 in a vertical direction (e.g., in a direction opposite to the z-axis direction), and also passes (e.g., simultaneously) a second horizontal distance C2 to the edge of the display device in a horizontal direction (e.g., in a direction opposite to the x-axis direction). The first horizontal distance C1 may be the same as or substantially the same as the second horizontal distance C2, or the first horizontal distance C1 and the second horizontal distance C2 may be different.

[0072] According to some exemplary embodiments, when the thickness of the substrate (e.g., the thickness of each of the outer portions 151, 152, 251, and 252 of the first substrate 100 and the second substrate 200) is less than or equal to 0.25t, the cutting wheel 700 can be applied (e.g., used) more effectively. Therefore, as the outer portions of the substrate are formed (e.g., have been formed) to have a thickness of less than or equal to 0.25t (e.g., after the outer portions of the substrate are formed (e.g., have been formed) to have a thickness of less than or equal to 0.25t), a method of manufacturing a display device according to some exemplary embodiments may include a unit cutting process (e.g., cutting to form display units) via the cutting wheel. In some embodiments, the unit cutting process may be performed in a sealed area (SA), thereby reducing the dead space of the substrate and reducing the cost of processing the outer portions.

[0073] refer to Figure 3 It explains how to achieve this. Figure 2 The image shows a cross-section cut by the cutting wheel 700. In the cross-sectional view, the edges of the first substrate 100 and the second substrate 200 have curved shapes. The first substrate 100 and the second substrate 200 may be integrally (e.g., jointly) referred to as substrates. Figure 3This is an image of the edge of a substrate taken at an angle in the xy direction. The edge of the cut substrate is photographed in white, the left portion is photographed in black as a cross-section of the cut substrate, and the right portion is photographed as a gradually deepening shadow as an extension of the cross-section of the substrate.

[0074] The curved portion on the upper side of the portion photographed in white light represents the central portion 250 of the second substrate 200, and the portion that slopes downwards and connects to the central portion 250 represents the outer portion 252 of the second substrate 200. The curved portion on the lower side of the portion photographed in white light represents the central portion 150 of the first substrate 100, and the portion that slopes upwards and connects to the central portion 150 represents the outer portion 152 of the first substrate 100.

[0075] Reference Figure 4 This describes a display device including a setting section according to some embodiments.

[0076] Figure 4 A cross-sectional view of a display device according to some exemplary embodiments is shown.

[0077] refer to Figure 4 A display device according to some exemplary embodiments includes a first substrate 100, a second substrate 200, a sealing portion 30, a setting portion 300, and a window 400. Figure 4 In some embodiments, the arrangement of the first substrate 100, the sealing portion 30, and the second substrate 200 in the display device corresponds to a reference. Figure 1 The description provided will not be redundant.

[0078] In the cross-sectional view, the outer portions 151 and 152 of the first substrate 100 include curved shapes formed by a unit cutting process (e.g., cutting to form a display unit). In the cross-sectional view, the outer portions 251 and 252 of the second substrate 200 include curved shapes formed by a unit cutting process.

[0079] The setting portion 300 surrounds (e.g., covers) the outer portions 151 and 152 of the first substrate 100 and the outer portions 251 and 252 of the second substrate 200. The upper side of the setting portion 300 is collinear with the upper side of the center portion 250 of the second substrate 200 (e.g., the upper side of the setting portion 300 is aligned with the upper side of the center portion 250 of the second substrate 200). The setting portion 300 serves as a frame protecting the substrates 100 and 200, and the setting portion 300 may have… Shape or reverse Shape (e.g., C-shape or inverted C-shape). The inner side of the setting portion 300 contacts the outer side of the sealing portion 30 (e.g., the side corresponding to the edge of the display device), and the setting portion 300 can be fixed to the side of the substrate 100 and the side of the substrate 200. The setting portion 300 can be fixed to the sealing portion 30 by an adhesive between the inner side of the setting portion 300 and the outer side of the sealing portion 30.

[0080] Window 400 is located on the upper side of setting portion 300 and second substrate 200. Window 400 protects the various configurations and components below it. Window 400 includes a transparent material to transmit internal light from the inside of the display device to the outside.

[0081] The outer portion of the substrate may be thinner than the central portion. Accordingly, in some exemplary embodiments, the setting portion 300 wraps around (e.g., covers) the outer portion of the substrate, and the upper side of the setting portion 300 is on the same straight line as the upper side of the central portion of the substrate (e.g., the upper side of the setting portion 300 is aligned with the upper side of the central portion of the substrate), thereby achieving a thin and light display device.

[0082] Reference Figures 5 to 10 This describes a process for manufacturing a display device according to some exemplary embodiments.

[0083] Figures 5 to 10 A cross-sectional view is shown of a method for manufacturing a display device according to some exemplary embodiments.

[0084] Figure 5 The stages for preparing substrate 200 are shown.

[0085] refer to Figure 5 A substrate 200 is prepared from any suitable material, such as, for example, glass. The thickness D1 of the substrate 200 can be 0.3t to 0.4t, and the substrate 200 may include a central portion and outer portions on two sides of the central portion (e.g., on two opposite sides along the horizontal direction of the central portion). Figure 5 In the diagram, substrate 200 is shown as a second substrate 200, but... Figures 1 to 4 The first substrate 100 shown in the image can be manufactured according to the same manufacturing method.

[0086] Figure 6 The stage for attaching the acid-resistant membrane 11 is shown.

[0087] refer to Figure 6An acid-resistant film 11 is attached to a substrate 200 (e.g., to the upper side of the substrate 200). The acid-resistant film 11 is a protective film for etching and comprises an acid-resistant material that does not react with strong acids or hydrofluoric acid. The term "strong acid" may have the same meaning as commonly understood by those skilled in the art. For example, the term "strong acid" may refer to hydrochloric acid, nitric acid, sulfuric acid, hydrobromic acid, hydroiodic acid, perchloric acid, and / or chloric acid. The thickness of the acid-resistant film 11 may be formed to be about 0.05t, and the acid-resistant film 11 may be configured (e.g., formed) as a bilayer comprising an adhesive layer and a protective layer. The adhesive layer of the acid-resistant film 11 may be provided between the protective layer and the substrate 200, and the protective layer may be provided on the adhesive layer.

[0088] Figure 7 The stage for irradiating the substrate 200 with ultraviolet (UV) light is shown.

[0089] refer to Figure 7 A metallic pattern portion 13 is provided on the acid-resistant film 11 and is irradiated with ultraviolet (UV) light. The metallic pattern portion 13 is provided at a location overlapping the central portion of the substrate 200. A portion of the acid-resistant film 11 that does not overlap with the metallic pattern portion 13 (e.g., an exposed portion of the acid-resistant film 11) represents a portion that overlaps with the outer portion of the substrate 200. The exposed portion of the acid-resistant film 11 may be exposed to ultraviolet (UV) light (e.g., irradiated with UV light) and may be converted to a state that can be peeled off by a suitable process.

[0090] Figure 8 The stages for removing the acid-resistant film 11 are shown.

[0091] refer to Figure 8 The portion of the acid-resistant film 11 exposed to ultraviolet (UV) light is removed. The remaining portion of the acid-resistant film 11 is located at the center of the substrate 200. The acid-resistant film 11 protects the portion of the substrate 200 on the upper side of the substrate 200 from strong acids or hydrofluoric acid. However, the portion of the substrate 200 where the acid-resistant film 11 is not on the upper side of the substrate 200 (e.g., the exposed portion of the substrate 200) can be etched by an etchant including strong acids or hydrofluoric acid.

[0092] Figure 9 The stage for etching a portion of the substrate 200 is shown.

[0093] refer to Figure 9The outer portions 251 and 252 are formed by etching the exposed portions of the substrate 200. The outer portions 251 and 252 can be formed by a wet etching process. A wet etching process refers to a process that uses an etchant, which may include hydrogen fluoride (HF), to etch the exposed portions of the substrate 200 where the acid-resistant film 11 is not on (e.g., etching where the acid-resistant film 11 is not attached). In some embodiments, the portions of the substrate 200 corresponding to the outer portions 251 and 252 can be etched to a depth greater than or equal to 0.15t. Therefore, the portions of the substrate 200 corresponding to the outer portions 251 and 252 can be formed to have a thickness of about 0.15t to 0.25t. The outer portions 251 and 252 on the two sides of the central portion 250 (e.g., on two opposite sides along the horizontal direction) can be etched to different depths depending on processing errors (e.g., different depths can be etched due to processing errors).

[0094] Figure 10 A second substrate 200 according to some exemplary embodiments is shown.

[0095] refer to Figure 10 In reference Figure 9 After the etching process described, the acid-resistant film 11 at the central portion 250 is removed. Accordingly, a substrate 200 can be formed, wherein the thickness D1 of the central portion 250 can be 0.3t to 0.4t, and the thicknesses D2 and D5 of the outer portions 251 and 252 can be less than or equal to 0.25t, respectively.

[0096] A display device according to some exemplary embodiments may include a first substrate 100, the first substrate 100 including a central portion 150 and outer portions 151 and 152, and the first substrate 100 and a second substrate 200 may be joined to each other by a sealing portion 30, such as Figure 1 The display is shown in the image. Accordingly, each of the first substrate 100 and the second substrate 200 is respectively formed to have a thickness D4 of the outer portion 151, a thickness D6 of the outer portion 152, a thickness D2 of the outer portion 251, and a thickness D5 of the outer portion 252, respectively, which are less than or equal to 0.25t, so that a unit cutting process (e.g., cutting to form a display unit) can be performed by the cutting wheel 700.

[0097] Reference Figure 11 and Figure 12 This describes a display device according to some exemplary embodiments.

[0098] Figure 11 A plan view of a display device according to some exemplary embodiments is shown, and Figure 12 Showing along Figure 11 A cross-sectional view of the display device taken by line XII-XII'. Regarding... Figure 12 In some exemplary embodiments of the display device, the configurations of the first substrate 100, the sealing portion 30, and the second substrate 200 correspond to reference. Figure 1 This describes some configurations, and will not provide redundant descriptions.

[0099] refer to Figure 11 According to some exemplary embodiments, a display device includes a display area (DA) occupying most of the front side (e.g., the upper side) of the display device, a non-display area (PA) serving as the outer periphery surrounding the display area (DA), and a light-transmitting area (TA) in which light is transmitted through the display area (DA).

[0100] A display device according to some exemplary embodiments may include at least one optical element in the light transmission zone (TA). The optical element may be any suitable optical element, such as, for example, a camera, a flash, or a sensor.

[0101] refer to Figure 12 The display device according to some exemplary embodiments includes a first substrate 100, a second substrate 200 and a sealing portion 30.

[0102] The second substrate 200 may include glass, quartz and / or ceramic, and the second substrate 200 faces the first substrate 100. The central portion 250 of the second substrate 200 includes a recessed portion 201 on one side (e.g., on the underside) facing the first substrate 100.

[0103] The recessed portion 201 represents the corresponding Figure 11 The light transmission area (TA) is a portion of the recessed portion 201. The display element 110 is not located at the portion corresponding to the recessed portion 201, and the optical element (e.g., a camera) is on the underside of the first substrate 100. The optical element (e.g., the camera) can be tightly attached to the underside of the first substrate 100, thereby increasing light transmittance. In some embodiments, because the recessed portion 201 transmits light as is (e.g., without modification), the width of the recessed portion 201 can be determined taking into account the refraction of light based on the size of the optical element (e.g., the camera).

[0104] Because the recessed portion 201 represents an etched portion on the underside of the second substrate 200 facing the first substrate 100, the recessed portion 201 can be formed during the process of etching the outer portions 251 and 252 of the second substrate 200 (e.g., simultaneously), or the recessed portion 201 can be formed during a separate etching process (e.g., after the process for etching the outer portions 251 and 252). The process for etching the outer portions 251 and 252 of the second substrate 200 corresponds to reference [reference missing]. Figures 5 to 10 The manufacturing method is described. The process for etching (e.g., simultaneously etching) the recessed portion and the outer portion will be referred to below. Figures 13 to 18 To describe in more detail.

[0105] The distance (a) between one side (e.g., the upper side) of the recessed portion 201 and one side (e.g., the upper side) of the first substrate 100 facing this side of the recessed portion 201 can be maintained at or greater than about 15 μm. For example, the distance (a) can be greater than or equal to about 15 μm. Accordingly, when an air gap is formed between the recessed portion 201 (e.g., the upper side of the recessed portion 201) and one side (e.g., the upper side) of the first substrate 100 facing the recessed portion 201 (e.g., the upper side of the recessed portion 201), the recessed portion 201 can transmit light input from an optical element (e.g., a camera) without blurring (e.g., the image formed by the transmitted light is not blurred or substantially not blurred).

[0106] In some exemplary embodiments, the display element 110 is not on a side (e.g., the upper side) of the first substrate 100 that overlaps with the recessed portion 201. In some embodiments, a portion of the display element 110 may be on a portion of a side (e.g., the upper side) of the first substrate 100 that overlaps with the recessed portion 201.

[0107] Reference Figures 13 to 18 A method for manufacturing a substrate for a display device according to some exemplary embodiments is described.

[0108] Figures 13 to 18 A cross-sectional view is shown of a method for manufacturing a display device according to some exemplary embodiments.

[0109] Figure 13 The stages for preparing substrate 200 are shown.

[0110] refer to Figure 13A substrate 200 is prepared from any suitable material, such as, for example, glass. The thickness D1 of the substrate 200 may be 0.3t to 0.4t, and the substrate 200 may include a central portion and outer portions on two sides of the central portion (e.g., on two opposite sides along the horizontal direction of the central portion).

[0111] Figure 14 The stages for attaching acid-resistant films 11 and 12 are shown. Acid-resistant films 11 and 12 are protective films for etching, comprising acid-resistant materials that do not react with strong acids or hydrofluoric acid, and comprising a first acid-resistant film 11 and a second acid-resistant film 12.

[0112] refer to Figure 14 A first acid-resistant film 11 is attached to the upper side of the substrate 200, and a second acid-resistant film 12 is attached to the lower side of the substrate 200. The first acid-resistant film 11 and the second acid-resistant film 12 may be attached to the upper and lower sides of the substrate 200 concurrently (e.g., simultaneously) or sequentially. The thickness of the acid-resistant films 11 and 12 may be formed to be about 0.05t, and each acid-resistant film 11 and 12 may be configured as (e.g., each may include) a double layer comprising an adhesive layer and a protective layer. Accordingly, the adhesive layer of the first acid-resistant film 11 may be provided between the upper side of the substrate 200 and the protective layer of the first acid-resistant film 11. The adhesive layer of the second acid-resistant film 12 may be provided between the lower side of the substrate 200 and the protective layer of the second acid-resistant film 12. When a photoresist is used instead of an acid-resistant film, the liquid photoresist may flow down when applied to the upper and lower sides of the substrate 200. Therefore, photoresist made of liquid is not suitable for etching processes on the upper and lower sides of substrate 200. Thus, in some exemplary embodiments, by attaching acid-resistant films 11 and 12 to the upper and lower sides of substrate 200, etching processes can be more easily performed on the upper and lower sides of substrate 200.

[0113] Figure 15 The stage for irradiating the substrate 200 with ultraviolet light is shown.

[0114] refer to Figure 15 A first metallic pattern portion 13 is provided on the first acid-resistant film 11 and radiates ultraviolet (UV) light onto the upper side of the substrate 200 (e.g., radiating onto the upper side of the first metallic pattern portion 13 and onto the exposed upper side of the first acid-resistant film 11). In some embodiments, a second metallic pattern portion 14 is provided on the second acid-resistant film 12 and radiates ultraviolet (UV) light onto the lower side of the substrate 200 (e.g., radiating onto the lower side of the second metallic pattern portion 14 and onto the exposed lower side of the second acid-resistant film 12). In some embodiments, the upper side of the second metallic pattern portion 14 directly contacts a portion of the second acid-resistant film 12.

[0115] The first metal pattern portion 13 is provided at a location overlapping the central portion of the substrate 200. The portion of the first metal pattern portion 13 that does not overlap with the first acid-resistant film 11 represents the portion overlapping with the outer portion of the substrate 200. The second metal pattern portion 14 is provided at a location overlapping the underside of the substrate 200, excluding the recessed portion 201 formed in the substrate 200 (e.g., to be formed in the substrate 200). The portion of the second metal pattern portion 14 that does not overlap with the second acid-resistant film 12 represents the portion where the recessed portion 201 will be formed when the underside of the substrate 200 is etched. Exposed portions of each of the acid-resistant films 11 and 12 may be exposed to ultraviolet (UV) radiation (e.g., may be irradiated by UV radiation) and may be converted to a state that can be peeled off by a suitable process.

[0116] Figure 16 The stages for removing portions of each of the first acid-resistant film 11 and the second acid-resistant film 12 are shown.

[0117] refer to Figure 16 The portion of the first acid-resistant film 11 on the upper side of the substrate 200 exposed to ultraviolet (UV) light is removed. The remaining portion of the first acid-resistant film 11 is located at the central portion of the substrate 200, and the first acid-resistant film 11 protects the central portion from strong acids or hydrofluoric acid.

[0118] The portion of the second acid-resistant film 12 on the underside of the substrate 200 exposed to ultraviolet (UV) light is removed. The remaining portion of the second acid-resistant film 12 overlaps with the underside of the substrate 200 outside of the recessed portion 201 formed in the substrate 200 (e.g., to be formed in the substrate 200), and the portion of the underside of the substrate 200 overlapping with the remaining portion of the second acid-resistant film 12 is protected from strong acids or hydrofluoric acid.

[0119] Figure 17 The stages for etching substrate 200 are shown.

[0120] refer to Figure 17 External portions 251 and 252 are formed by etching the exposed portion of the upper side of the substrate 200 where the first acid-resistant film 11 has been removed. External portions 251 and 252 can be formed by a wet etching process. The wet etching process is a process that uses an etchant, which may include hydrogen fluoride (HF), to etch the exposed portion of the upper side of the substrate 200. In some embodiments, the portions of the substrate 200 corresponding to external portions 251 and 252 can be etched to a depth greater than or equal to 0.15t. In some embodiments, external portions 251 and 252 can be etched to different depths.

[0121] In some embodiments, a recessed portion 201 is formed by etching the exposed portion of the underside of the substrate 200 where the second acid-resistant film 12 has been removed. The recessed portion 201 can be formed by a wet etching process, and the recessed portion 201 can be formed from the underside of the substrate 200 to a depth of about 0.005t.

[0122] Figure 18 A second substrate 200 according to some exemplary embodiments is shown.

[0123] refer to Figure 18 In reference Figure 17 After the described etching process, the first acid-resistant film 11 and the second acid-resistant film 12 are removed. Accordingly, a substrate 200 including a recessed portion 201 can be formed on the lower side of the substrate 200, wherein the thickness D1 of the central portion 250 of the substrate 200 can be 0.3t to 0.4t, and the thicknesses D2 and D5 of the outer portions 251 and 252 can be formed to be less than or equal to 0.25t.

[0124] According to some exemplary embodiments, with respect to a substrate 200 including a recessed portion 201 in a light transmission region (TA), the outer portions 251 and 252 of the substrate 200 can be etched in the process used to etch the recessed portion 201 (e.g., during the same process), thereby reducing the number of processing stages and increasing productivity.

[0125] According to some exemplary embodiments, during the manufacture of the display device, it may be as described in reference Figures 5 to 10 The description describes the manufacture of a first substrate 100 comprising a central portion 150 and outer portions 151 and 152, wherein the first substrate 100 and the second substrate 200 are joined together by a sealing portion 30. Accordingly, the thickness of the outer portions of the first substrate 100 and the second substrate 200 is respectively formed to be less than or equal to 0.25t, thereby allowing for a unit cutting process (e.g., cutting to form a display unit) by a cutting wheel 700.

[0126] Reference Figure 19 and Figure 20 This describes a display device including a recessed portion according to some exemplary embodiments.

[0127] Figure 19 A plan view of a display device according to some exemplary embodiments is shown, and Figure 20 Showing along Figure 19 A cross-sectional view of the display device taken by line XX-XX'. (Reference) Figure 19 and Figure 20 The display device described according to some exemplary embodiments is similar to the reference. Figure 11 and Figure 12The description pertains to a display device based on some exemplary embodiments. Therefore, the focus will be on describing the differences, and redundant descriptions will be avoided.

[0128] refer to Figure 19 A display device according to some exemplary embodiments includes: a display area (DA) occupying most of the front side (e.g., the upper side) of the display device; a non-display area (PA) being the outer periphery surrounding the display area (DA); and a first light-transmitting area (TA1) and a second light-transmitting area (TA2) that transmit light in the display area (DA).

[0129] refer to Figure 20 The central portion 250 of the second substrate 200 includes a first recessed portion 201 and a second recessed portion 202 on one side (e.g., the lower side) facing the first substrate 100.

[0130] The first recessed portion 201 and the second recessed portion 202 respectively correspond to Figure 19 The first light-transmitting region (TA1) and the second light-transmitting region (TA2) are defined. The display element 110 is not located at the portion corresponding to the first recessed portion 201 and the second recessed portion 202, and optical elements, such as, for example, a camera and a sensor, are located on the underside of the first substrate 100. The optical elements (e.g., a camera and a sensor) can be tightly attached to the underside of the first substrate 100 to increase light transmittance.

[0131] The first recessed portion 201 and the second recessed portion 202 are in the display area (DA), so a portion of the display element 110 is in the area between the first recessed portion 201 and the second recessed portion 202.

[0132] With the thickness of the outer portions 151 and 152 of the first substrate 100 and the outer portions 251 and 252 of the second substrate 200 formed (e.g., already formed) less than or equal to 0.25t (e.g., after the thickness of the outer portions 151 and 152 of the first substrate 100 and the outer portions 251 and 252 of the second substrate 200 formed (e.g., already formed) less than or equal to 0.25t), a method of manufacturing a display device according to some exemplary embodiments may include a unit cutting process (e.g., cutting to form display units) by a cutting wheel 700. In some embodiments, the unit cutting process (e.g., cutting to form display units) may be performed in a sealed area (SA), thereby reducing the dead space of the substrate and reducing the cost of processing the outer portions.

[0133] Although some exemplary embodiments have been described in this disclosure, it should be understood that this disclosure is not limited to the disclosed embodiments, but is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A display device, comprising: Display area; A non-display area surrounding the display area and including a sealed area; A first substrate comprising a central portion and an outer portion, the central portion being a portion within the display area, and the outer portion being a portion within the sealing area; A second substrate comprising a central portion and an outer portion, the central portion being a portion within the display area, and the outer portion being a portion within the sealing area; as well as The sealing portion between the first substrate and the second substrate and in the sealing area. The thickness of the central portion of the first substrate is greater than the thickness of the outer portion of the first substrate, and The thickness of the central portion of the second substrate is greater than the thickness of the outer portion of the second substrate.

2. The display device according to claim 1, wherein, The thickness of the central portion of the first substrate and the thickness of the central portion of the second substrate are 0.3 mm to 0.4 mm, and the thickness of the outer portion of the first substrate and the thickness of the outer portion of the second substrate are less than or equal to 0.25 mm.

3. The display device according to claim 2, wherein, The first substrate and the second substrate include a cut line at the sealing area.

4. The display device according to claim 3, wherein, The cutting line is located 50 μm to 100 μm away from the edges of the outer portions of the first substrate and the second substrate in a direction from the edge of the outer portion of the first substrate and the edge of the outer portion of the second substrate to the center portion of the first substrate and the center portion of the second substrate.

5. A display device, comprising: Display area; A non-display area surrounding the display area and including a sealed area; A first substrate comprising a central portion and an outer portion, the central portion being a portion within the display area, and the outer portion being a portion within the sealing area; A second substrate comprising a central portion and an outer portion, the central portion being a portion within the display area, and the outer portion being a portion within the sealing area; A sealing portion between the first substrate and the second substrate and within the sealing area; as well as Optical elements on the lower side of the first substrate, The central portion of the second substrate includes at least one recessed portion on one side facing the first substrate. The optical element is located at the portion corresponding to the recessed portion. The thickness of the central portion of the first substrate and the thickness of the central portion of the second substrate are both greater than the thickness of the outer portion of the first substrate and the thickness of the outer portion of the second substrate.

6. The display device according to claim 5, wherein, The outer portion of the first substrate includes a first outer portion and a second outer portion on two opposite sides in the horizontal direction along the central portion of the first substrate. The outer portion of the second substrate includes a first outer portion and a second outer portion on two opposite sides in the horizontal direction along the central portion of the second substrate. The thickness of the first outer portion of the first substrate is different from the thickness of the second outer portion of the first substrate, and The thickness of the first outer portion of the second substrate is different from the thickness of the second outer portion of the second substrate.

7. The display device according to claim 6, wherein, The thickness of the first outer portion of the first substrate, the thickness of the second outer portion of the first substrate, the thickness of the first outer portion of the second substrate, and the thickness of the second outer portion of the second substrate are all less than or equal to 0.25 mm.

8. A method for manufacturing a display device according to any one of claims 1 to 7, comprising: A first acid-resistant film is attached to the upper side of the substrate, and a second acid-resistant film is attached to the lower side of the substrate; A first metal pattern portion is disposed on a portion of the first acid-resistant film, and a second metal pattern portion is disposed on a portion of the second acid-resistant film; The ultraviolet light is radiated on the upper side of the portion of the first acid-resistant film where the first metal pattern portion is not exposed on the first acid-resistant film, and the ultraviolet light is radiated on the lower side of the portion of the second acid-resistant film where the second metal pattern portion is not exposed on the second acid-resistant film. Remove the exposed portions of the first acid-resistant membrane and the second acid-resistant membrane; as well as The upper side of the substrate is etched to remove the portion of the first acid-resistant film, and the lower side of the substrate is etched to remove the portion of the second acid-resistant film. The outer portion of the substrate corresponds to the portion of the substrate in which the first acid-resistant film has been removed, and The recessed portion of the substrate corresponds to the portion of the substrate in which the second acid-resistant film has been removed.

Images