Electronic devices including optical electronic components and manufacturing processes

Abstract

An electronic device including an optical electronic assembly and a manufacturing process are disclosed. An electronic device includes a first electronic assembly and a second electronic assembly. Each electronic assembly includes: a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between electrical contacts of the electronic chip and the carrier substrate. The overmolded grid encapsulates and holds the first electronic assembly and the second electronic assembly. The grid is configured so that the sides of the first electronic assembly and the second electronic assembly are at least partially exposed.

Description

[0001] Priority declaration

[0002] This application claims the benefit of priority of French Patent Application No. 1909670 filed on September 3, 2019, the entire contents of which are incorporated herein by reference to the maximum extent permitted by law. Technical Field

[0003] The present invention relates to the field of microelectronics, and more particularly to the field of electronic devices comprising electronic chips comprising integrated optical elements for emitting and / or receiving light. Background Art

[0004] A known electronic device comprises: a carrier substrate including an electrical connection network; an electronic chip for emitting light and an electronic chip for receiving light, the chips being mounted at intervals above one side of the carrier substrate; and a packaging cover mounted on the side of the carrier substrate and defining cavities in which the electronic chips are respectively located, the packaging cover containing an aperture of an optical element facing the electronic chip, in which an optical filter is usually arranged.

[0005] Such electronic devices require extensive manufacturing and installation operations. Summary of the invention

[0006] According to one embodiment, an electronic device is proposed, which includes: at least one first electronic component and one second electronic component, each including an opaque carrier substrate having a back side and a front side; an electronic chip, whose back side is mounted on the front side of the carrier substrate and includes an integrated optical element facing the front side of the chip; a secondary molded transparent block encapsulating the chip above the front side of the carrier substrate; and electrical connections between the chip and back electrical contacts on the back side of the carrier substrate; and an opaque secondary molded grid for encapsulating and retaining the electronic components, the encapsulation and retaining grid being configured to expose the back side of the electronic components and to expose at least those areas of the front side of the electronic components that are located in front of the optical elements.

[0007] The electronic device thus forms a self-contained unit, wherein the grid itself holds and encapsulates the electronic component and the mutually remote electrical contacts of the carrier substrate of the electronic component are available for external connections.

[0008] The encapsulation and retention grid may have a back side that lies in the same plane as the back side of the electronic component.

[0009] The encapsulation and retaining grid may have a front side that lies in the same plane as a front side of at least one of the electronic components.

[0010] The encapsulation and retaining grid may have at least one edge over the front side of the at least one electronic component, the edge defining an aperture.

[0011] The encapsulation and retention grid may include peripheral walls and intermediate spacers extending between the electronic components.

[0012] The encapsulation block may be provided with a filter material for filtering light.

[0013] The filter material may comprise a layer above the encapsulation mass.

[0014] The filter material may comprise particles contained within the material of the encapsulation mass.

[0015] The optical component of one electronic component may be a light transmitter, and the optical component of another electronic component may be a light receiver.

[0016] An electronic assembly is also provided, the assembly comprising a receiving substrate and an electronic device mounted above the receiving substrate, the receiving substrate comprising an electrical connection network.

[0017] The electronic device is positioned such that the back side of the electronic component is adjacent to the receiving substrate and such that the back electrical contacts are connected to the electrical contacts of the electrical connection network of the receiving substrate.

[0018] A process for manufacturing an electronic device is also provided, the process comprising the following steps: arranging at least one first electronic component and one second electronic component, each comprising a carrier substrate having a back side and a front side; an electronic chip, the back side of the electronic chip being mounted on the front side of the carrier substrate and comprising an integrated optical element facing the front side; a secondary molded transparent block encapsulating the chip above the front side of the carrier substrate; and an electrical connection between the chip and the back electrical contacts on the back side of the carrier substrate; mounting the electronic components at intervals from each other in a position above one side of a temporary carrier substrate such that the back side or conversely the front side of the electronic components is adjacent to the temporary carrier substrate; placing the electronic components in a position in a cavity of a mold such that the temporary carrier substrate is adjacent to one side of the cavity and the front side of the electronic component is at least partially adjacent to the other side of the cavity, at least in the region of the optical element, or conversely the back side of the electronic component is adjacent to the other side of the cavity; injecting an opaque encapsulation material into the cavity to obtain an encapsulation and retaining grid containing the space where the electronic components are located; and demolding the obtained electronic device.

[0019] The process may comprise the step of singulating the electronic devices obtained such that the encapsulation and retaining grid has peripheral walls and intermediate walls extending between the electronic components.

[0020] Singulation can be achieved by sawing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The electronic device will now be described by way of non-limiting examples of embodiments, which are illustrated by the accompanying drawings, in which:

[0022] Figure 1 Two discrete electronic components are shown in cross-section;

[0023] Figures 2 to 5 Shows Figure 1 manufacturing steps of electronic components;

[0024] Figure 6 Shown include Figure 1 Cross-section of an electronic device of an electronic assembly;

[0025] Figures 7 to 10 Shows Figure 6 The manufacturing steps of electronic devices;

[0026] Fig.11 Shown include Figure 1 a cross section of another electronic device of an electronic assembly;

[0027] Figures 12 to 15 Shows Fig.11 manufacturing steps of an electronic device; and

[0028] Fig.16 Shown include Figure 6 Cross section of an electronic component of an electronic device. DETAILED DESCRIPTION

[0029] Reference Figures 1 to 4 , individual electronic components 1 and 2 and a batch process for manufacturing these electronic components will first be described.

[0030] like Figure 1 As shown, the individual electronic components 1 and 2 comprise carrier substrates 3 and 4 made of an opaque material, the carrier substrates 3 and 4 having back sides 5 and 6 and front sides 7 and 8, and comprising optical electronic integrated circuit (IC) chips 9 and 10 mounted over the front sides 7 and 8 of the carrier substrates 3 and 4. The carrier substrates are made of a dielectric material.

[0031] To this end, the back sides 11 and 12 of the chips 9 and 10 are fixed over the front sides 7 and 8 of the carrier substrates 3 and 4 by means of adhesive layers 13 and 14. The carrier substrates 3 and 4 are made of an opaque material, for example an opaque resin.

[0032] Chips 9 and 10 comprise integrated optical elements 15 and 16 oriented on one side of their front sides 17 and 18 .

[0033] The optical element 15 of the chip 9 is a light transmitter, and the optical element 16 of the chip 10 is a light receiver.

[0034] The individual electronic components 1 and 2 comprise electrical connections 19 and 20 which connect the chips 9 and 10 to rear electrical contacts 19 a and 20 a of the rear sides 5 and 6 of the carrier substrates 3 and 4 .

[0035] For example, electrical connections 19 and 20 include electrical connection vias that pass through carrier substrates 3 and 4 and connect to back electrical contacts of chips 9 and 10 through conductive adhesive layers 13 and 14 and through wires connected to front bumps of chips 9 and 10 .

[0036] The electronic components 1 and 2 include overmolded packaging blocks 21 and 22, which are made of a transparent material (e.g. epoxy resin) so as to allow light to pass over the front sides 7 and 8 of the carrier substrates 3 and 4, and the chips 9 and 10 and the electrical connections 19 and 20 are embedded in the packaging blocks 21 and 22.

[0037] The packaging blocks 21 and 22 have front faces 23 and 24 parallel to the carrier substrates 3 and 4 and side faces 25 and 26 along the periphery of the carrier substrate 4. Therefore, the shape of the electronic components 1 and 2 is a parallelepiped.

[0038] Optionally, the front faces 23 and 24 of the packaging blocks 21 and 22 are covered by layers 27 and 28 made of a material that filters light (for example infrared rays).

[0039] According to a variant embodiment, the material used to make the encapsulating blocks 21 and 22 may include specific particles that act as filters for light.

[0040] The back sides 5 and 6 of the carrier substrates 3 and 4 form the back sides of the electronic components 1 and 2. The front sides 23 and 24 of the packages 21 and 22, optionally including filter layers 27 and 28, form the front sides of the electronic components 1 and 2.

[0041] The electronic components 1 and 2 can be manufactured as follows.

[0042] like Figure 2 As shown, a batch carrier substrate 29 is provided, which has a back side 30 and a front side 31 and includes through holes or an electrical connection network at multiple locations for the aforementioned electrical connections 19 and 20. These locations are advantageously adjacent and rectangular or square and arranged in rows and columns.

[0043] At these separate locations and at a certain distance, the chips 9 and 10 are mounted over the front side 31 of the batch carrier substrate 29 by means of the conductive adhesive layers 13 and 14, and the electrical connections 19 and 20 are made as described above.

[0044] Then, if Figure 3As shown, the batch carrier substrate 29 equipped with chips 9 and 10 is placed in a position in the cavity 32 of the mold 33 so that the batch carrier substrate 29 is adjacent to the surface 34 of the cavity 32, and so that the surface 35 opposite and parallel to the surface 34 is located at a certain distance above the chips 9 and 10.

[0045] Then, if Figure 4 As shown, the encapsulation material is injected into the cavity 32 of the mold 33, thereby forming a batch encapsulation block 36 through secondary molding.

[0046] After demoulding, optionally Figure 5 As shown, a batch filter layer 37 , for example in the form of a membrane, is produced on the front side of the batch encapsulation block 36 .

[0047] Then, along the rows and columns, at a distance from the chips 9 and 10, a complete cutting operation 38, for example a sawing operation, is performed by batching the carrier substrate 29 and the packaging blocks 36, so as to obtain single or individual electronic components 1 and 2 as described above.

[0048] According to a variant embodiment, on the one hand, the chip 9 can be individually mounted on a specific batch carrier substrate, and by performing the above operations, a single electronic component 1 is obtained, and on the other hand, the chip 10 can be individually mounted on a specific batch carrier substrate, and by performing the above operations, a single electronic component 2 is obtained.

[0049] like Figure 6 As shown, electronic device 101 includes an overmolded encapsulation and retention grid 102 containing remote spaces 103 and 104 in which electronic components 1 and 2 (as described above) are located such that back sides 5 and 6 of electronic components 1 and 2 are located in the same back plane.

[0050] Since the electronic components 1 and 2 have the same thickness, the front sides 23 and 24 are located in the same front plane.

[0051] The encapsulation and retaining grid 102 is configured such that the back sides 5 and 6 and the front sides 23 and 24 of the electronic components 1 and 2 are exposed.

[0052] The encapsulation and retaining grid 102 has a back side 105 lying in the same plane as the back sides 5 and 6 of the electronic components 1 and 2 , and has a front side 106 lying in the same plane as the front sides 23 and 24 of the electronic components 1 and 2 .

[0053] The encapsulation and retaining grid 102 surrounds the periphery of the electronic components 1 and 2 and therefore has a peripheral wall 107 and an intermediate spacing portion 108 extending between the electronic components 1 and 2 .

[0054] The encapsulation and holding grid 102 is made of an opaque material. Therefore, light cannot pass directly from one of the spaces 103 and 104 to the other. More specifically, light emitted by the transmitting electronic component 1 cannot reach the receiving electronic component 2 directly.

[0055] The electronic device 101 can be manufactured in the following manner.

[0056] like Figure 7 As shown, after a sheet-like or film-like temporary batch carrier 109 is provided, the electronic components 1 and 2 are mounted on one side 110 of the temporary carrier 109 at intervals from each other by placing the front sides 23 and 24 of the electronic components 1 and 2 above the temporary carrier 109 .

[0057] In the manufacturing process of batch manufacturing, the paired electronic components 1 and 2 are respectively mounted on positions of a temporary batch carrier 109 by adhesive holding films. These positions are advantageously adjacent and rectangular or square, and arranged in rows and columns.

[0058] Then, if Figure 8 As shown, the electronic components 1 and 2 mounted on the temporary batch carrier 109 are placed in a position in the cavity 111 of the mold 112 so that the temporary batch carrier 109 abuts against the surface 113 of the cavity 111, and the back sides 5 and 6 of the electronic components 1 and 2 abut against the surface 114 of the cavity 111 opposite to and parallel to the surface 113.

[0059] According to a variant embodiment, the temporary batch carrier 109 can also be used through the wall of the cavity of the mold.

[0060] Then, if Fig. 9 As shown, an opaque encapsulating material is injected into the remaining space in the cavity 111 , thereby producing a batch grid 115 for encapsulating and holding the electronic components 1 and 2 through secondary molding.

[0061] In order to prevent mold flash and facilitate demolding, a buffer film may be added to the surface 114 in the cavity 111 .

[0062] After demoulding, Fig.10 As shown, the temporary batch holder 109 is removed and a complete cutting operation 116 (eg by sawing) is performed along the rows and columns separating the aforementioned positions, across the batch grid 115 and separating the remote spaces 103 and 104 in order to obtain one or more individual electronic devices 101 .

[0063] According to a variant embodiment (in Fig.12 ), the electronic components 1 and 2 may be mounted upside down above the batch carrier substrate 109 with the back sides 5 and 6 on the sides of the temporary batch carrier 109.

[0064] In this case, it is the front sides 23 and 24 that bear against the surface of the cavity 111 of the mold 112 .

[0065] Fig.11 An electronic device 201 is shown including a secondary molded package and a retaining grid 202, which defines remote spaces 203 and 204, in which electronic components 1 and electronic components 2 (for example as described above) are located, so that the back sides 5 and 6 of electronic components 1 and 2 are located in the same back plane.

[0066] The encapsulation and retaining grid 202 is configured such that the back sides 5 and 6 of the electronic components 1 and 2 are exposed and such that the front sides 23 and 24 of the electronic components 1 and 2 are partially exposed.

[0067] The encapsulation and retaining grid 202 has a back side 205 which lies in the same plane as the back sides 5 and 6 of the electronic components 1 and 2 .

[0068] The packaging and retaining grid 202 differs from the above-mentioned packaging and retaining grid 102 in that it is thicker than the electronic components 1 and 2, and in that in addition to the peripheral wall 207 and the intermediate spacer 208 between the electronic components 1 and 2, it also includes a front wall 209 extending above the front sides 23 and 24 of the electronic components 1 and 2.

[0069] The front wall 209 comprises apertures 210 and 211 which are located in front of the optical elements 15 and 16 of the chips 9 and 10 in order to let light pass through.

[0070] The encapsulation and retaining grid 202 thus has a front edge around the apertures 210 and 211 which is located above the electronic components 1 and 2 .

[0071] The electronic device 201 can be manufactured in the following manner.

[0072] like Fig.12 As shown, after a temporary batch carrier 109 in sheet or film shape is provided, the electronic components 1 and 2 are mounted on a side surface 215 of the temporary carrier 214 spaced apart from each other by placing the back sides 5 and 6 of the electronic components 1 and 2 on the temporary carrier 109 .

[0073] In a batch manufacturing process, pairs of electronic components 1 and 2 are mounted respectively on positions of a temporary batch carrier 213. These positions are advantageously adjacent and rectangular and are arranged in rows and columns.

[0074] Then, if Fig.13As shown, the electronic components 1 and 2 mounted on the temporary batch carrier 214 are placed in a position in the cavity 216 of the mold 217 so that the temporary batch carrier 214 is adjacent to the surface 218 of the cavity 216, and the front sides 23 and 24 of the electronic components 1 and 2 are at a certain distance from the surface 219 of the cavity 216 which is opposite to and parallel to the surface 218.

[0075] The face 219 is provided with protruding projections 220 and 221 having faces 222 and 223 that abut against the front sides 23 and 24 of the electronic components 1 and 2 .

[0076] Then, if Fig.14 As shown, an opaque encapsulating material is injected into the remaining space in the cavity 216 , thereby producing a batch grid 224 for encapsulating and holding the electronic components 1 and 2 by secondary molding.

[0077] After demoulding, Fig.15 As shown, a complete cutting operation 225 is performed, for example, by sawing through branches of the batch grid 224 at a distance from the remote spaces 203 and 204 where the electronic components 1 and 2 are located, along the rows and columns separating the above-mentioned locations.

[0078] The cutting operation may be performed directly on the temporary batch carrier 214 or on another carrier after the temporary batch carrier 214 is removed.

[0079] Then, one or more individual electronic devices 201 are obtained in the above-mentioned positions.

[0080] According to a variant embodiment, as long as one of the electronic components 1 and 2 is thicker than the other, the retaining and encapsulation grid can have a front side lying in the same plane as the front side of the thickest electronic component and therefore have a front wall above the front side of the thinnest electronic component, the front wall comprising an aperture.

[0081] Fig.16 An electronic assembly 301 is shown including a receiving substrate 302 including an electrical connection network 303, such as a printed circuit board or an integrated circuit board, and including the above reference Figure 6 The electronic device 101 is described, and the device is mounted on the receiving substrate 302 .

[0082] The electronic device 101 is positioned so that the back sides 5 and 6 of the electronic components 1 and 2 and the back side 105 of the retaining and encapsulation grid 102 are positioned facing the front side 304 of the receiving substrate 302 and so that the back electrical contacts 19a and 20a of the electronic components 1 and 2 are connected to the front bumps 305 and 306 of the electrical connection network 303.

[0083] Electronic assembly 301 includes electronic components (not shown) capable of exchanging electrical signals with electronic components 1 and 2 via electrical connection network 303 .

[0084] In the electronic assembly 301 , the electronic device 101 may be replaced by the electronic device 201 .

Claims

1. An electronic device comprising: a first electronic assembly comprising: a first opaque carrier substrate having a first back side and a first front side; a first electronic chip having a back side mounted to the first front side of the first opaque carrier substrate, the first electronic chip including a first integrated optical element located on the front side of the first electronic chip; a first overmolded transparent block encapsulating the first electronic chip over the first front side of the first opaque carrier substrate; and a first electrical connection between the first electronic chip and a first back electrical contact located on the first back side of the first opaque carrier substrate; a second electronic assembly comprising: a second opaque carrier substrate having a second back side and a second front side; a second electronic chip having a back side mounted to the second front side of the second opaque carrier substrate, the second electronic chip including a second integrated optical element on the front side of the second electronic chip; a second overmolded transparent block encapsulating the second electronic chip over the second front side of the second opaque carrier substrate; and a second electrical connection between the second electronic chip and a second back electrical contact located at the second back side of the second opaque carrier substrate; and An opaque secondary molded grid for encapsulating and retaining both the first electronic component and the second electronic component, wherein the opaque secondary molded grid is configured such that respective back sides of the first electronic component and the second electronic component are exposed, and such that at least a front area of ​​the first electronic component and the second electronic component located in front of the first integrated optical element and the second integrated optical element is exposed. 2 . The device of claim 1 , wherein the opaque overmold mesh has a backside that lies in the same plane as backsides of the first and second electronic components. 3 . The device of claim 1 , wherein the opaque overmold mesh has a front side that lies in the same plane as a front side of at least one of the first electronic component and the second electronic component.

4. The device of claim 1 , wherein the opaque overmolded grid has at least one edge above a front side of at least one of the first electronic component and the second electronic component, wherein the edge defines an aperture extending through a front wall of the opaque overmolded grid to expose the area.

5. The device of claim 1 , wherein the opaque overmolded mesh comprises: a peripheral wall surrounding the first electronic component and the second electronic component; and an intermediate partition extending between the first electronic component and the second electronic component. 6 . The device of claim 1 , wherein the first overmolded transparent block and the second overmolded transparent block are provided with a filter material that filters light. 7 . The device of claim 6 , wherein the filter material comprises a filter layer extending over each of the first overmolded transparent block and the second overmolded transparent block.

8. The device of claim 6, wherein the filter material comprises particles contained in an encapsulation material forming the first overmolded transparent block and the second overmolded transparent block.

9. The device of claim 1, wherein the first integrated optical component is a light transmitter and the second integrated optical component is a light receiver.

10. An electronic assembly comprising: a receiving substrate including an electrical connection network; as well as Electronic devices, including: a first electronic assembly comprising: a first opaque carrier substrate having a first back side and a first front side; a first electronic chip having a back side mounted to the first front side of the first opaque carrier substrate, the first electronic chip including a first integrated optical element located on the front side of the first electronic chip; a first overmolded transparent block encapsulating the first electronic chip over the first front side of the first opaque carrier substrate; and a first electrical connection between the first electronic chip and a first back electrical contact located on the first back side of the first opaque carrier substrate; a second electronic assembly comprising: a second opaque carrier substrate having a second back side and a second front side; a second electronic chip having a back side mounted to the second front side of the second opaque carrier substrate, the second electronic chip including a second integrated optical element on the front side of the second electronic chip; a second overmolded transparent block encapsulating the second electronic chip over the second front side of the second opaque carrier substrate; and a second electrical connection between the second electronic chip and a second back electrical contact located on the second back side of the second opaque carrier substrate; and an opaque overmolded grid for encapsulating and retaining both the first electronic component and the second electronic component, wherein the opaque overmolded grid is configured such that respective back sides of the first electronic component and the second electronic component are exposed and such that at least a region of the front sides of the first electronic component and the second electronic component located in front of the first integrated optical element and the second integrated optical element is exposed; wherein the electronic device is mounted to the receiving substrate at a position such that the back sides of the first electronic component and the second electronic component are adjacent to the receiving substrate; and Wherein the first back electrical contact and the second back electrical contact are connected to electrical contacts of the electrically connected network of the receiving substrate.

11. The assembly of claim 10, wherein the opaque overmold mesh has a back side that lies in the same plane as back sides of the first and second electronic components.

12. The assembly of claim 10, wherein the opaque overmold grid has a front side that lies in the same plane as a front side of at least one of the first electronic component and the second electronic component.

13. The assembly of claim 10, wherein the opaque overmolded grid has at least one edge above a front side of at least one of the first electronic component and the second electronic component, wherein the edge defines an aperture extending through a front wall of the opaque overmolded grid to expose the area.

14. The assembly of claim 10, wherein the opaque overmolded mesh comprises: a peripheral wall surrounding the first electronic component and the second electronic component; and an intermediate partition extending between the first electronic component and the second electronic component.

15. The assembly of claim 10, wherein the first overmolded transparent block and the second overmolded transparent block are provided with a filter material that filters light.

16. The assembly of claim 15, wherein the filter material comprises a filter layer extending over each of the first overmolded transparent block and the second overmolded transparent block.

17. The assembly of claim 15, wherein the filter material comprises particles contained in an encapsulating material forming the first overmolded transparent block and the second overmolded transparent block.

18. The assembly of claim 10, wherein the first integrated optical component is a light transmitter and the second integrated optical component is a light receiver.

19. A method for manufacturing an electronic device, comprising the steps of: A first electronic assembly and a second electronic assembly are provided, wherein each electronic assembly comprises: a carrier substrate having a back side and a front side; an electronic chip having a back side mounted on the front side of the carrier substrate; an integrated optical element at the front side of the electronic chip; an overmolded transparent block encapsulating the electronic chip over the front side of the carrier substrate; and an electrical connection between the electronic chip and a back electrical contact located at the back side of the carrier substrate; Mounting the first electronic component and the second electronic component spaced apart from each other at positions above one side of a temporary carrier substrate such that the back sides, or conversely the front sides, of the first electronic component and the second electronic component are adjacent to the one side of the temporary carrier substrate; placing the temporary carrier substrate with the first and second electronic components in a position in the cavity of the mold such that the temporary carrier substrate is adjacent to one face of the mold and such that the front sides of the electronic components are at least partially adjacent to the other face of the mold, at least in the region of the optical element, or conversely such that the back sides of the electronic components are adjacent to the other face of the mold; injecting an opaque encapsulation material into the cavity to obtain an encapsulation and retention grid containing the space in which the first electronic component and the second electronic component are located; and The electronic device is demolded from the mold.

20. The method according to claim 19, further comprising: The electronic devices are singulated such that the packaging and retaining grid has a peripheral wall surrounding the first electronic component and the second electronic component, and an intermediate wall extending between the first electronic component and the second electronic component. The method of claim 20 , wherein singulating comprises sawing.

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