BGA chip vertical interconnection test module based on fur button

Abstract

The invention discloses a BGA chip vertical interconnection test module based on a fur button, comprising a base, a PCB circuit board is installed inside the base, an external interface, a first SMA connector and a second SMA connector are embedded on the surface of the PCB circuit board; a fur button module is arranged on the surface of the PCB circuit board, and a radio frequency microwave detection body distributed in a rectangular array is built into the fur button module, the bottom end of the radio frequency microwave detection body is electrically connected to the PCB circuit board, and the radio frequency microwave detection body is a fur button connector; an upper cover plate assembly is movably mounted on the top of the fur button module, and the upper cover plate assembly comprises an outer base body and a floating component; the invention realizes impedance matching and reduces discontinuity through an inner conductor structure, and based on the telescopic characteristics of the fur button, the radio frequency microwave detection body does not need to be welded, but is connected between the radio frequency microwave detection body, the BGA chip to be tested and the PCB board in a crimping manner, so that microwave signals and electrical signals are well matched and transmitted, and signal mismatch phenomenon is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit electronic testing, and in particular relates to a BGA chip vertical interconnection testing module based on wool buttons. Background Art

[0002] With the continuous improvement of manufacturing technology and integrated circuit design capabilities in electronic equipment systems, the enhancement of chip functions and the continuous expansion of integration scale in the microelectronics manufacturing industry, more and more input / output leads are required, which greatly increases the application and popularity of BGA (Ball Grid Array) chip packaging. Therefore, there is an urgent need for efficient detection of BGA chips.

[0003] Traditional chip test modules are considered as concentrated parameter circuits due to their low frequency. They generally only consider the IV performance and logic functions of chips and other devices, while ignoring the impact of the transmission lines connecting these devices on the signal. Its chip test module generally includes a metal guide plate with a probe hole, a fixed seat and a retaining plate, and a spring probe, and the spring probe is directly set in the probe hole. During the test, the spring probe structure has a low test pass frequency and high impedance, which cannot meet high-frequency and high-speed tests. With the increase in the clock frequency of the circuit system and the continuous acceleration of the chip core computing speed, the test circuit characteristics are closer to distributed parameter circuits. The chip test module must fully consider the distributed parameter characteristics of the transmission line and reduce discontinuity to enable it to meet the needs of high-frequency microwave signals and high-speed testing.

[0004] The RF microwave detection body, PCB circuit board and the pins of the BGA chip to be tested in the existing chip test module are connected by welding. This structure is not convenient for replacing the BGA chip to be tested, the operation is not flexible enough, and the welding design damages the pins of the BGA chip to be tested, resulting in inaccurate test data of the chip. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a BGA chip vertical interconnection test module based on a hair button, and the specific technical solution is as follows:

[0006] A BGA chip vertical interconnection test module based on a hair button comprises a base, a PCB circuit board is installed inside the base, and an external interface, a first SMA connector and a second SMA connector are embedded on the surface of the PCB circuit board;

[0007] The first SMA connector includes a first connection terminal and a second connection terminal, the second SMA connector includes a third connection terminal and a fourth connection terminal, and the length of the circuit transmission line from the first connection terminal to the third connection terminal is the same as the length of the circuit transmission line from the second connection terminal to the fourth connection terminal;

[0008] A fur button module is provided on the surface of the PCB circuit board, and a radio frequency microwave detection body distributed in a rectangular array is built into the fur button module. The bottom end of the radio frequency microwave detection body is electrically connected to the PCB circuit board, and the radio frequency microwave detection body is a fur button connector;

[0009] The top of the wool button module is movably card-mounted with an upper cover assembly, and the upper cover assembly includes an outer base body and a floating component. The outer base body is card-mounted on the top of the wool button module, and a floating component is installed inside the outer base body. The floating component is spaced and located directly above the radio frequency microwave detection body. The gap between the floating component and the radio frequency microwave detection body is a BGA chip installation area, and the floating component is used to press down the BGA chip.

[0010] Furthermore, the hair button module includes an outer frame, a positioning plate, and a dielectric base; a groove is opened inside the outer frame, a dielectric base is embedded in the middle of the inner part of the groove, a rectangular array of radio frequency microwave detection bodies is embedded in the middle of the inner part of the dielectric base, a positioning plate is installed inside the groove, a BGA chip mounting hole is opened in the middle of the positioning plate, and the BGA chip mounting hole is relatively located above the radio frequency microwave detection body.

[0011] Furthermore, the floating component includes a knob and a sleeve, the top of the sleeve is provided with a knob, the bottom of the sleeve spirally penetrates the outer base body, the bottom of the sleeve is provided with a pressure block, and the pressure block is relatively placed directly above the BGA chip mounting hole.

[0012] Furthermore, the outer base body includes a cover plate, a spring and a clamping plate. The center of the cover plate is spirally penetrated by a shaft sleeve. The clamping plates are symmetrically installed on both sides of the cover plate. The middle part of the clamping plate is rotatably connected to the cover plate. The bottom end of the clamping plate is a locking end and the top end is a movable end. The locking end is clamped on the side of the outer frame. The inner wall of the movable end is embedded with a spring, and the other end of the spring facing away from the clamping plate is embedded in the outer frame.

[0013] Furthermore, a concave locking groove is formed on the side wall of the outer frame, and the locking end of the clamping plate is clamped and embedded in the locking groove.

[0014] Furthermore, the interior of the dielectric base is provided with a first inner hole, a second inner hole and a third inner hole in sequence from top to bottom; the inner diameter of the first inner hole is the same as the inner diameter of the third inner hole, the inner diameter of the second inner hole is smaller than the inner diameter of the first inner hole, and the top of the first inner hole is trumpet-shaped; the first inner hole and the second inner hole form a first compensation step, the second inner hole and the third inner hole form a second compensation step, and the top of the radio frequency microwave detection body is assembled with the first compensation step and the second compensation step.

[0015] Furthermore, the radio frequency microwave detection body includes a probe protection cap and an elastic probe, the elastic probe is placed in the third inner hole, the elastic probe is connected to the soldering pad of the PCB circuit board, the top of the elastic probe is provided with a probe protection cap, the elastic probe is a wool button structure, the probe protection cap includes an upper cylinder and a lower cylinder, the upper cylinder passes through the first inner hole and the second inner hole, the outer diameter of the lower cylinder is larger than the outer diameter of the upper cylinder, and the lower cylinder is placed in the third inner hole and conflicts with the second compensation step.

[0016] The beneficial effects of the present invention are:

[0017] 1. Impedance matching is achieved through the inner conductor structure to reduce discontinuity. Based on the expansion and contraction characteristics of the wool button, the RF microwave detection body does not need to be welded, but the connection between the RF microwave detection body, the BGA chip to be tested and the PCB board is achieved by crimping, so that the microwave signal and the electrical signal are well matched and transmitted, reducing the signal mismatch phenomenon.

[0018] 2. The soldering-free method not only improves the reliability of the chip test module, but also greatly improves the chip test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The structural schematic diagram of the BGA chip vertical interconnection test module based on the fur button of the present invention is shown;

[0020] Figure 2 A schematic diagram of the upper cover assembly structure of the present invention is shown;

[0021] Figure 3 The schematic diagram of the structure of the wool button module of the present invention is shown;

[0022] Figure 4 A schematic diagram of the connection structure between the upper cover assembly and the fur button module of the present invention is shown;

[0023] Figure 5 A schematic diagram of the connection structure between the dielectric base and the radio frequency microwave detection body of the present invention is shown;

[0024] As shown in the figure: 1. base; 2. PCB circuit board; 3. upper cover assembly; 31. knob; 32. bushing; 321. pressure block; 33. cover; 34. spring; 35. clamp; 351. movable end; 352. locking end; 4. button module; 41. outer frame; 411. locking groove; 42. positioning plate; 421. BGA chip mounting hole; 43. dielectric base; 431. first inner hole; 432. second inner hole; 433. third inner hole; 44. RF microwave detection body; 441. probe protection cap; 442. elastic probe; 5. external interface; 6. first SMA connector; 61. first connecting terminal; 62. second connecting terminal; 7. second SMA connector, 71. third connecting terminal; 72. fourth connecting terminal. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] A BGA chip vertical interconnection test module based on a hair button comprises a base 1, a PCB circuit board 2 is installed inside the base 1, and an external interface 5, a first SMA connector 6 and a second SMA connector 7 are embedded on the surface of the PCB circuit board 2;

[0027] The first SMA connector 6 includes a first connection terminal 61 and a second connection terminal 62, the second SMA connector 7 includes a third connection terminal 71 and a fourth connection terminal 72, and the length of the circuit transmission line from the first connection terminal 61 to the third connection terminal 71 is the same as the length of the circuit transmission line from the second connection terminal 62 to the fourth connection terminal 72;

[0028] The length of the SMA connector and its transmission line are equal, and both single-ended insertion loss test calibration and differential pair insertion loss test calibration can be performed. The length of the circuit transmission line from the first connection terminal 61 to the third connection terminal 71 is twice the length of the circuit transmission line of the chip test link. When the insertion loss of the chip link is measured minus half of the insertion loss of the calibration line, the actual insertion loss of the chip is obtained, thereby obtaining more accurate chip test data;

[0029] A fur button module 4 is provided on the surface of the PCB circuit board 2, and a RF microwave detection body 44 distributed in a rectangular array is built into the fur button module 4. The bottom end of the RF microwave detection body 44 is electrically connected to the PCB circuit board 2, and the RF microwave detection body 44 is a fur button connector;

[0030] The PCB circuit board 2 includes a top layer, a radio frequency layer, a power layer, a ground layer, a control layer, a bottom layer, and vias. There are single pads and array pads on the top layer, the SMA connector is crimped on the single pad on the top layer, the button module is placed on the array pad on the top layer, the vias are installed on the top end of the top layer, the external interface is connected to the vias, and the vias are welded to the top end of the circuit board. The radio frequency signal is wired on the radio frequency layer, the power signal is wired on the power layer, and the control signal is wired on the control layer.

[0031] The top of the wool button module 4 is movably card-mounted with an upper cover assembly 3, and the upper cover assembly 3 includes an outer base body and a floating component. The outer base body is card-mounted on the top of the wool button module 4, and a floating component is installed inside the outer base body. The floating component is located just above the radio frequency microwave detection body 44, and the gap between the floating component and the radio frequency microwave detection body 44 is the BGA chip installation area; when the floating component moves downward, it will press down the BGA chip, so that the BGA chip can be fully connected with the radio frequency microwave detection body 44, and there is no need to connect them to each other through welding technology, so that the object to be tested is not damaged, which saves time and effort during the chip testing process and improves the chip testing efficiency; at the same time, the outer base body is card-mounted and connected to the wool button module, which is convenient for disassembly of the upper cover assembly and can flexibly and conveniently replace the object to be tested.

[0032] like Figure 2 As shown, the floating component includes a knob 31 and a sleeve 32. The top of the sleeve 32 is provided with a knob 31, and the bottom of the sleeve 32 is spirally penetrated through the outer base body. The bottom of the sleeve 32 is provided with a pressure block 321, and the pressure block 321 is relatively placed directly above the BGA chip mounting hole 421; the sleeve is threaded through, and when the sleeve is rotated, the pressure block can be driven to move up and down, and the pressure block can move downward to press the BGA chip.

[0033] like Figure 3 As shown, the hair button module 4 includes an outer frame body 41, a positioning plate 42, and a dielectric base 43; a groove is provided inside the outer frame body 41, a dielectric base 43 is embedded in the middle of the groove, a rectangular array of radio frequency microwave detection bodies 44 are embedded in the middle of the dielectric base 43, a positioning plate 42 is installed inside the groove, a BGA chip mounting hole 421 is provided in the middle of the positioning plate 42, and the BGA chip mounting hole 421 is relatively located above the radio frequency microwave detection body 44; the BGA chip mounting hole 421 is used as a mounting area for a BGA chip.

[0034] like Figure 4As shown, the outer base body includes a cover plate 33, a spring 34 and a clamping plate 35. The center of the cover plate 33 spirally penetrates the shaft sleeve 32. The clamping plate 35 is symmetrically installed on both sides of the cover plate 33. The middle part of the clamping plate 35 is rotatably connected to the cover plate 33. The bottom end of the clamping plate 35 is a locking end 352, and the top end is a movable end 351. The locking end is clamped on the side of the outer frame 41. The inner wall of the movable end is embedded with a spring 34, and the other end of the spring 34 away from the clamping plate 35 is embedded in the outer frame 41; under the action of the spring, the clamping plate can be clamped on the outer frame to realize the assembly and fixation of the upper cover plate assembly and the wool button module, and the movable end can be operated to drive the locking end to move outward by utilizing the lever principle, so as to realize the separation of the clamping plate and the wool button module; thereby facilitating the assembly, fixation and separation and disassembly of the upper cover plate assembly.

[0035] The side wall of the outer frame 41 is provided with an inwardly concave locking groove 411 , and the locking end of the clamping plate 35 is clamped and embedded in the locking groove 411 ; the locking groove and the clamping plate cooperate to facilitate positioning.

[0036] like Figure 5 As shown, the interior of the dielectric base 43 is provided with a first inner hole 431, a second inner hole 432 and a third inner hole 433 in sequence from top to bottom; the inner diameter of the first inner hole 431 is the same as the inner diameter of the third inner hole 433, the inner diameter of the second inner hole 432 is smaller than the inner diameter of the first inner hole 431, and the top of the first inner hole 431 is horn-shaped; the first inner hole 431 and the second inner hole 432 form a first compensation step, the second inner hole 432 and the third inner hole 433 form a second compensation step, and the top of the radio frequency microwave detection body 44 is assembled with the first compensation step and the second compensation step;

[0037] The radio frequency microwave detection body 44 includes a probe protection cap 441 and an elastic probe 442. The elastic probe 442 is placed in the third inner hole 433. The elastic probe 442 is connected to the pad of the PCB circuit board 2. The elastic probe 442 is a wool button structure. The wool button is an elastic body with specific external dimensions formed by a metal wire through a certain process.

[0038] A probe protection cap 441 is provided at the top of the elastic probe 442, and the probe protection cap 441 includes an upper cylinder and a lower cylinder. The upper cylinder passes through the first inner hole 431 and the second inner hole 432, and the outer diameter of the lower cylinder is larger than the outer diameter of the upper cylinder. The lower cylinder is placed in the third inner hole 433 and conflicts with the second compensation step. The entire RF SMA connector is designed based on the characteristic impedance of 50Ω. In order to form compensation, the probe protection cap is made into a stepped structure to form high-resistance compensation. The first compensation step and the second compensation step can be used to adjust the impedance matching at the contact point between the RF microwave detection body and the BGA chip. The elastic probe adopts a wool button structure as the main transmission channel of the RF microwave signal. At the same time, a coaxial structure transmission channel is also constructed at the contact part with the object to be measured. The compensation structure can be set to better achieve the impedance matching effect to reduce the reflection of the RF microwave signal.

[0039] It adopts an integrated design, which can lead out corresponding detection ports for all microwave signals, control signals and power ports of the object under test. It is small in size and can meet the needs of incoming line testing.

[0040] There is a calibration test terminal on the PCB board, which can easily subtract the insertion loss of the test circuit SMA connector and circuit transmission line to obtain more accurate chip test data.

[0041] When the present invention is implemented, the BGA chip to be tested is placed in the BGA chip mounting hole 421, so that the bottom pin of the BGA chip is initially in contact with the probe protection cap 441 of the radio frequency microwave detection body 44;

[0042] The upper cover plate assembly 3 is buckled, and the spring 34 pushes the clamping plate 35 in the opposite direction, so that the locking end 352 of the clamping plate 35 is buckled and embedded in the locking groove 411 of the outer frame 41. At this time, the cover plate 33 is pressed against the outer frame 41, and the pressing block 321 is located directly above the BGA chip;

[0043] By turning the knob 31, the sleeve 32 rotates downward along the screw hole in the cover plate 33, thereby driving the pressure block 321 to move downward. The pressure block 321 presses down the BGA chip, and the lower pin of the BGA chip is in full contact with the probe protection cap 441. The probe protection cap 441 pushes the elastic probe 442 to deform, and the elastic probe 442 with a fur button structure is in full electrical contact with the PCB circuit board 2.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A BGA chip vertical interconnection test module based on fur buttons, characterized by: It comprises a base (1), a PCB circuit board (2) is installed inside the base (1), and an external interface (5), a first SMA connector (6) and a second SMA connector (7) are embedded on the surface of the PCB circuit board (2); The first SMA connector (6) comprises a first connecting terminal (61) and a second connecting terminal (62); the second SMA connector (7) comprises a third connecting terminal (71) and a fourth connecting terminal (72); the length of a circuit transmission line from the first connecting terminal (61) to the third connecting terminal (71) is the same as the length of a circuit transmission line from the second connecting terminal (62) to the fourth connecting terminal (72); A fur button module (4) is provided on the surface of the PCB circuit board (2), the fur button module (4) having built-in radio frequency microwave detection bodies (44) distributed in a rectangular array, the bottom end of the radio frequency microwave detection body (44) being electrically connected to the PCB circuit board (2), the radio frequency microwave detection body (44) being a fur button connector; The top of the fur button module (4) is movably mounted with an upper cover assembly (3), the upper cover assembly (3) comprising an outer base body and a floating component, the outer base body is mounted on the top of the fur button module (4), the inner part of the outer base body is equipped with a floating component, the floating component is spaced and located directly above the radio frequency microwave detection body (44), and the gap between the floating component and the radio frequency microwave detection body (44) is a BGA chip installation area; The hair button module (4) comprises an outer frame (41), a positioning plate (42), and a dielectric base (43); a groove is provided inside the outer frame (41), a dielectric base (43) is embedded in the middle of the groove, a rectangular array of radio frequency microwave detection bodies (44) are embedded in the middle of the dielectric base (43), a positioning plate (42) is installed inside the groove, a BGA chip mounting hole (421) is provided in the middle of the positioning plate (42), and the BGA chip mounting hole (421) is relatively located above the radio frequency microwave detection body (44); The dielectric base (43) is provided with a first inner hole (431), a second inner hole (432) and a third inner hole (433) in sequence from top to bottom; the inner diameter of the first inner hole (431) is the same as the inner diameter of the third inner hole (433), the inner diameter of the second inner hole (432) is smaller than the inner diameter of the first inner hole (431), and the top end of the first inner hole (431) is trumpet-shaped; the first inner hole (431) and the second inner hole (432) form a first compensation step, and the second inner hole (432) and the third inner hole (433) form a second compensation step, and the top end of the radio frequency microwave detection body (44) is assembled with the first compensation step and the second compensation step; The radio frequency microwave detection body (44) comprises a probe protection cap (441) and an elastic probe (442); the elastic probe (442) is placed in the third inner hole (433); the elastic probe (442) is connected to a solder pad of a PCB circuit board (2); the elastic probe (442) is a wool button structure; a probe protection cap (441) is provided at the top of the elastic probe (442); the probe protection cap (441) comprises an upper column and a lower column; the upper column passes through the first inner hole (431) and the second inner hole (432); the outer diameter of the lower column is greater than the outer diameter of the upper column; the lower column is placed in the third inner hole (433) and abuts against the second compensation step.

2. The BGA chip vertical interconnection test module based on fur button according to claim 1, characterized in that: The floating component comprises a knob (31) and a shaft sleeve (32); the top end of the shaft sleeve (32) is provided with a knob (31); the bottom end of the shaft sleeve (32) spirally penetrates the outer seat body; the bottom end of the shaft sleeve (32) is provided with a pressing block (321); the pressing block (321) is relatively located directly above the BGA chip mounting hole (421).

3. The BGA chip vertical interconnection test module based on fur button according to claim 2, characterized in that: The outer base body comprises a cover plate (33), a spring (34) and a clamping plate (35); the center of the cover plate (33) spirally penetrates the shaft sleeve (32); the clamping plates (35) are symmetrically mounted on both sides of the cover plate (33); the middle portion of the clamping plate (35) is rotatably connected to the cover plate (33); the bottom end of the clamping plate (35) is a locking end (352) and the top end is a movable end (351); the locking end (352) is clamped on the side of the outer frame (41); the inner wall of the movable end (351) is embedded with a spring (34); and the other end of the spring (34) facing away from the clamping plate (35) is embedded in the outer frame (41).

4. The BGA chip vertical interconnection test module based on fur button according to claim 3 is characterized in that: The side wall of the outer frame (41) is provided with an inwardly concave locking groove (411), and the locking end of the clamping plate (35) is clamped and embedded in the locking groove (411).

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