A microchannel heat exchanger combining embedded fins and elliptical pin fins

Abstract

The present invention relates to the field of radiator technology, and in particular to a microchannel heat exchanger combining embedded ribs and elliptical pin-fins, comprising a microchannel, wherein the microchannel is a rectangular cavity that runs through the heat exchanger, and the microchannel comprises an inlet section flow channel, an outlet section flow channel and a heat exchange section flow channel, wherein the heat exchange section flow channel is provided with embedded ribs and elliptical pin-fins, the lower part of the heat exchange section flow channel is an electronic component bonding surface, the embedded ribs are arranged on the upper part of the electronic component bonding surface, the top end of the elliptical pin-fin is connected to the upper part of the heat exchange section flow channel, and the bottom end of the elliptical pin-fin is connected to the arc surface of the embedded rib. The present invention fully disturbs the fluid through the embedded ribs and elliptical pin-fins, and the array distribution of the elliptical pin-fins enables the fluid to fully flow in the heat exchange section flow channel, destroying the thermal boundary layer of the fluid, enhancing heat exchange, making the surface temperature of the components more uniform, and better controlling the temperature.

Description

Technical Field

[0001] The invention relates to the technical field of radiators, and in particular to a microchannel heat exchanger combining embedded fins and elliptical pin fins. Background Art

[0002] With the development of science and technology, electronic products are becoming more and more highly integrated. In the process of high-density integrated circuits, if the heat generated is not taken away in time, the excessive temperature will affect the normal operation of electronic components and shorten the product's operating life. In order to ensure the normal operation of electronic products, the overall size and weight require the heat exchanger to have the characteristics of small size, light weight, suitable for compact packaging, and good heat exchange performance. Microchannels are used in heat exchangers because of their extremely small size. The thermal resistance between the microchannel heat exchanger and the heat exchange environment is extremely low and has a very high heat exchange efficiency, which can make the temperature distribution of the product uniform. Due to its extremely small size, it can be applied to tiny devices for separate heat exchange and is widely used in the heat dissipation of various products containing electronic components. The current microchannel heat exchanger structure is mainly a parallel arrangement of rectangular, triangular, trapezoidal and other microchannel structures. These traditional forms of parallel microchannels develop flow boundary layers and thermal boundary layers at the same time after the fluid enters the parallel microchannels. When the thermal boundary layer has not yet reached the fully developed area, the heat transfer coefficient is relatively large and the heat transfer performance is relatively good. However, as the flow unfolds, the heat transfer coefficient drops rapidly, resulting in a significant decrease in heat transfer performance and a very limited enhanced heat exchange effect. In addition, when the flow channel of a traditional microchannel heat exchanger is too long, the middle area will boil before the inlet, and the pressure will increase sharply during the expansion of the bubble, blocking the subsequent fluid from entering the heat exchanger, seriously endangering the stable operation of the microchannel heat exchanger. When the flow channel is too long, the flow will tend to be stable, resulting in a relatively low heat exchange effect in the later stage.

[0003] It is for the above reasons that the present invention provides a microchannel heat exchanger combining embedded fins and elliptical pin-fins. The fluid enters the flow channel evenly at the inlet section and is fully developed in the heat exchange section. In addition, fins are embedded in the bottom plate and elliptical pin-fins are placed in the channel, so that the flow disturbance is enhanced, the fluid boundary layer is destroyed, the heat exchange is enhanced, and the heat exchange temperature of the heat exchanger is uniform. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a microchannel heat exchanger combining embedded fins and elliptical pin-fins, so as to improve the shortcomings of the existing heat exchanger and enhance the heat exchange performance.

[0005] In order to achieve the purpose of the present invention, the technical solution adopted by the present invention is:

[0006] The present invention discloses a microchannel heat exchanger combining embedded ribs and elliptical pin-fins, comprising a microchannel, wherein the microchannel is a rectangular cavity that runs through the heat exchanger, and the microchannel comprises an inlet section flow channel, an outlet section flow channel and a heat exchange section flow channel, wherein the heat exchange section flow channel is provided with embedded ribs and elliptical pin-fins, the lower part of the heat exchange section flow channel is an electronic component bonding surface, the embedded ribs are arranged on the upper part of the electronic component bonding surface, the top end of the elliptical pin-fin is connected to the upper part of the heat exchange section flow channel, and the bottom end of the elliptical pin-fin is connected to the arc surface of the embedded ribs.

[0007] The flow channel lengths of the inlet section and the outlet section of the microchannel are the same.

[0008] The embedded fins are in a semi-elliptical cylindrical structure with the long axis as the plane, the spacing between adjacent embedded fins is the same, and they are evenly distributed on the entire electronic component bonding surface; the elliptical pin fins are arranged at equal intervals on the embedded fins, and the two ends of the long axis of the elliptical pin fins are respectively facing the inlet and outlet of the heat exchange section flow channel.

[0009] The flow channel width of the microchannel is 5 times the center distance between adjacent elliptical pin fins on the same embedded fin.

[0010] The elliptical pin fins are distributed in an array in the entire heat exchange section flow channel, and the spacing between adjacent elliptical pin fins on the same embedded fin is the same, and the spacing between adjacent elliptical pin fins between adjacent embedded fins is the same.

[0011] The major axis of the embedded fin is 1.5 times the major axis of the elliptical pin fin.

[0012] The beneficial effects of the present invention are:

[0013] The present invention has the characteristics of excellent heat transfer performance, small size, simple structure and easy cleaning. It also has the characteristics of pin-fin array and corrugated channel, can handle higher chip heat flux, and has very good comprehensive heat exchange performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0016] Figure 3 It is a side view of the internal structure of the present invention;

[0017] Figure 4 It is a top view of the internal structure of the present invention.

[0018] In the figure: 1 microchannel, 101 inlet section flow channel, 102 outlet section flow channel, 103 heat exchange section flow channel, 2 embedded fins, 3 elliptical pin fins, 4 electronic component bonding surface. DETAILED DESCRIPTION

[0019] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0020] See also Figure 1-4 .

[0021] The present invention discloses a microchannel heat exchanger combining embedded ribs and elliptical pin-fins, comprising a microchannel 1, characterized in that: the microchannel 1 is a rectangular cavity running through the heat exchanger, the microchannel 1 comprises an inlet section flow channel 101, an outlet section flow channel 102 and a heat exchange section flow channel 103, the heat exchange section flow channel 103 is provided with embedded ribs 2 and elliptical pin-fins 3, the lower part of the heat exchange section flow channel 103 is an electronic component bonding surface 4, the embedded ribs 2 are arranged on the upper part of the electronic component bonding surface 4, the top end of the elliptical pin-fin 3 is connected to the upper part of the heat exchange section flow channel 103, and the bottom end of the elliptical pin-fin 3 is connected to the arc surface of the embedded rib 2; the present invention fully disturbs the fluid through the embedded ribs and elliptical pin-fins, and the array distribution of the elliptical pin-fins enables the fluid to fully flow in the heat exchange section flow channel, destroys the thermal boundary layer of the fluid, enhances heat exchange, and makes the surface temperature of the components more uniform and the temperature control better.

[0022] The inlet section flow channel 101 and the outlet section flow channel 102 of the microchannel 1 have the same flow channel length.

[0023] The embedded fins 2 are in a semi-elliptical cylindrical structure with the long axis as the plane, and the spacing between adjacent embedded fins 2 is the same and evenly distributed on the entire electronic component bonding surface 4; the elliptical pin fins 3 are arranged at equal intervals on the embedded fins 2, and the two ends of the long axis of the elliptical pin fins 3 are respectively directed toward the inlet and outlet of the heat exchange section flow channel 103; the embedded fins 2 are arranged on the electronic component bonding surface 4 so that the bottom of the heat exchange section flow channel 103 is in a convex state, and the bottom protrusion effectively destroys the bottom boundary layer, which greatly enhances heat transfer; the embedded fins 2 cover the bottom of the heat exchange section flow channel 103 to enhance flow disturbance or generate a recirculation area, thereby resulting in better heat transfer performance.

[0024] The flow channel width of the microchannel 1 is 5 times the center distance between adjacent elliptical pin-fins 3 on the same embedded fin 2 .

[0025] The elliptical pin fins 3 are distributed in an array in the entire heat exchange section flow channel 103, and the spacing between adjacent elliptical pin fins 3 on the same embedded fin 2 is the same, and the spacing between adjacent elliptical pin fins 3 between adjacent embedded fins 2 is the same.

[0026] The major axis of the embedded fin 2 is 1.5 times the major axis of the elliptical pin fin.

[0027] Working principle:

[0028] When the fluid enters the inlet section flow channel 101, it is evenly diverted and enters the heat exchange section flow channel 103 from the inlet section flow channel 101. After entering the heat exchange section flow channel 103, the fluid can flow in two directions, left and right, due to the obstruction of the elliptical pin fins 3. The fluids in different directions will merge with each other after contact, thereby increasing the disturbance. In addition, embedded fins (2) are evenly arranged on the electronic component bonding surface 4 at the bottom of the heat exchange section flow channel 103 to destroy the thermal boundary layer of the bottom fluid, so that the fluid and the bottom plate can fully exchange heat. The fusion and separation of the fluid during the flow can well exchange heat and maintain a good temperature uniformity. Finally, the fluid converges and flows out at the outlet section flow channel 102 to complete the heat exchange.

[0029] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent exchange made using the contents of the specification and drawings of the present invention or any direct or indirect application in related technical fields are also included in the patent protection scope of the present invention.

Claims

1. A microchannel heat exchanger with built-in fins and elliptical pin-fins, comprising a microchannel (1), characterized in that: The microchannel (1) is a rectangular cavity that runs through the heat exchanger. The microchannel (1) comprises an inlet section flow channel (101), an outlet section flow channel (102) and a heat exchange section flow channel (103). The heat exchange section flow channel (103) is provided with embedded fins (2) and elliptical pin fins (3). The lower part of the heat exchange section flow channel (103) is an electronic component bonding surface (4). The embedded fins (2) are arranged on the upper part of the electronic component bonding surface (4). The top end of the elliptical pin fin (3) is connected to the upper part of the heat exchange section flow channel (103), and the bottom end of the elliptical pin fin (3) is connected to the arc surface of the embedded fin (2). The inlet section flow channel (101) and the outlet section flow channel (102) of the microchannel (1) are connected to the arc surface of the embedded fin (2). 102) have the same flow channel length; the embedded fins (2) are in a semi-elliptical column structure with the long axis as the plane, the spacing between adjacent embedded fins (2) is the same, and they are evenly distributed on the entire electronic component bonding surface (4); the elliptical pin fins (3) are arranged at equal intervals on the embedded fins (2), and the long axis ends of the elliptical pin fins (3) are respectively oriented towards the inlet and outlet of the heat exchange section flow channel (103); the elliptical pin fins (3) are distributed in an array in the entire heat exchange section flow channel (103), and the spacing between adjacent elliptical pin fins (3) located on the same embedded fin (2) is the same, and the spacing between adjacent elliptical pin fins (3) located between adjacent embedded fins (2) is the same.

2. A microchannel heat exchanger combining embedded fins and elliptical pin-fins according to claim 1, characterized in that: The flow channel width of the microchannel (1) is 5 times the center distance between adjacent elliptical pin fins (3) on the same embedded fin (2).

3. The microchannel heat exchanger with built-in fins and elliptical pin-fins according to claim 1, characterized in that: The major axis of the embedded fin (2) is 1.5 times the major axis of the elliptical pin fin.

Images