High-reliability LED brackets, manufacturing methods, LEDs and light-emitting devices

Abstract

This invention provides a high-reliability LED bracket, manufacturing method, LED, and light-emitting device. The high-reliability LED bracket includes a substrate and a surrounding wall that encloses the substrate. A first protrusion is provided on the upper surface of the substrate in a region that is in close contact with the surrounding wall. The first protrusion is located on at least two sides of the upper surface of the substrate and extends from one side to at least the other side, thereby improving the bonding force between the substrate and the surrounding wall. A first groove corresponding to the first protrusion and recessed upwards is provided on the lower surface of the substrate in a region that is in close contact with the surrounding wall. A portion of the surrounding wall fills the first groove on the lower surface of the substrate, further strengthening the bonding force between the substrate and the surrounding wall. This improves the reliability and durability of the LED bracket and the LED manufactured using the LED bracket, and also improves the airtightness of the LED to a certain extent, which is more conducive to the widespread use of LEDs.

Description

Technical Field

[0001] This invention relates to the field of LED (Light Emitting Diode), and more particularly to a high-reliability LED bracket, manufacturing method, LED, and light-emitting device. Background Technology

[0002] Because LEDs have advantages such as rich colors, small size, environmental friendliness, energy saving, and long lifespan, they are widely used and promoted in various fields, including but not limited to daily lighting, outdoor lighting, light decoration, advertising signs, automotive lighting or indicators, traffic signs, etc. Since the external environment in which LEDs are used in different fields is different, it puts forward greater requirements for the reliability of LEDs. Among them, the sturdiness of LED brackets is an important indicator of LED reliability.

[0003] See existing LED brackets Figure 1-1 , Figure 1-2 As shown, it includes a plastic enclosure 10 forming a reflective cavity, and a substrate 11 enclosed by the plastic enclosure 10. A portion of the upper surface of the substrate 11 is in direct contact with the plastic enclosure 10, referred to as the contact area; another portion is located at the bottom of the reflective cavity as a functional area. This functional area can be used to support LED chips and other possible electronic devices, as well as for wiring, die bonding, and serving as a light reflection area. However, existing LED brackets are prone to cracking and separation under high-temperature conditions, for example, see [reference needed]. Figure 1-3 As shown, when the LED bracket is in a high-temperature environment, the wall 10 and the substrate 11 crack and separate due to heat. This shows that the reliability of the existing LED bracket is not high. Summary of the Invention

[0004] The high-reliability LED bracket, manufacturing method, LED, and light-emitting device provided by this invention mainly solve the technical problem that the existing LED brackets and the LEDs made using the brackets have poor reliability.

[0005] To solve the above-mentioned technical problems, the present invention provides a high-reliability LED bracket, the high-reliability LED bracket including a substrate and a wall body enclosing the substrate;

[0006] A first protrusion is provided on the upper surface of the substrate in a region that is in close contact with the wall body. The first protrusion is provided on at least two sides of the upper surface of the substrate and extends along one side of the upper surface of the substrate to at least the other side.

[0007] A first groove, corresponding to the first protrusion, is provided on the lower surface of the substrate in a region that is in close contact with the wall body, and is recessed into the upper surface of the substrate.

[0008] In one embodiment of the present invention, the substrate includes a first substrate, a second substrate, and an insulating strip that isolates the first substrate from the second substrate.

[0009] In one embodiment of the present invention, a first protrusion is provided on the upper surface of the first substrate in a region that is in close contact with the wall body, and a first groove corresponding to the first protrusion and recessed into the upper surface of the substrate is provided on the lower surface of the first substrate in a region that is in close contact with the wall body.

[0010] And / or,

[0011] A first protrusion is provided on the upper surface of the second substrate in a region that is in close contact with the wall body, and a first groove corresponding to the first protrusion and recessed into the upper surface of the substrate is provided on the lower surface of the second substrate in a region that is in close contact with the wall body.

[0012] In one embodiment of the present invention, a second groove is provided on the upper surface of the substrate in the area that is in close contact with the wall body.

[0013] In one embodiment of the present invention, the first protrusion and the second groove are disposed adjacent to each other;

[0014] And / or, the first protrusion is disposed separately from the second groove.

[0015] In one embodiment of the present invention, the second groove is disposed on at least two sides of the upper surface of the substrate and extends along one side of the upper surface of the substrate to at least the other side.

[0016] Alternatively, the second groove may be disposed on one side of the upper surface of the substrate.

[0017] In one embodiment of the present invention, the first protrusion is a curved protrusion or a straight protrusion, and the first groove and the second groove are curved grooves or straight grooves.

[0018] In one embodiment of the present invention, part or all of the outer wall of the first protrusion is a roughened layer formed after roughening treatment.

[0019] And / or, part or all of the inner wall of the first groove is a roughened layer formed after roughening treatment;

[0020] And / or, part or all of the inner wall of the second groove is a roughened layer formed after roughening treatment.

[0021] In one embodiment of the present invention, the roughening layer is a curved roughening layer;

[0022] Alternatively, the roughening layer may be a linear roughening layer.

[0023] In one embodiment of the present invention, an absorbent layer is provided in the second groove.

[0024] To address the aforementioned problems, the present invention also provides an LED, comprising a high-reliability LED bracket as described above and at least one LED chip, wherein the LED chip is disposed on the substrate and electrically connected to the substrate.

[0025] To address the aforementioned problems, the present invention also provides a light-emitting device, including the LED as described above, wherein the light-emitting device is an illumination device, a light signal indicator device, a supplementary light device, or a backlight device.

[0026] To address the above problems, the present invention also provides a method for manufacturing a high-reliability LED bracket, the method comprising:

[0027] Step S2: Stamp along the lower surface of the substrate toward the upper surface of the substrate to form a first protrusion on at least two sides of the upper surface of the substrate. The first protrusion extends along one side of the upper surface of the substrate to at least another side. A first groove corresponding to the first protrusion is formed on the lower surface of the substrate and recessed toward the upper surface of the substrate.

[0028] Step S6: Inject or mold plastic material around the substrate to form a wall.

[0029] In one embodiment of the present invention, in step S2, the substrate includes a first substrate and a second substrate;

[0030] The first substrate is stamped to form first protrusions on at least two sides of the upper surface of the first substrate, and to form a first groove corresponding to the first protrusions and recessed into the upper surface of the first substrate on the lower surface of the first substrate.

[0031] And / or,

[0032] The second substrate is stamped to form first protrusions on at least two sides of the upper surface of the second substrate, and to form a first groove corresponding to the first protrusions and recessed into the upper surface of the second substrate on the lower surface of the second substrate.

[0033] In one embodiment of the present invention, after step S2 and before step S4, step S3 is further included:

[0034] The upper surface of the substrate is etched to form a second groove.

[0035] In one embodiment of the present invention, step S3 includes:

[0036] A second groove is formed by etching in the area adjacent to the first protrusion on the upper surface of the substrate;

[0037] Alternatively, a second groove may be formed by etching a non-adjacent area of ​​the first protrusion on the upper surface of the substrate.

[0038] In one embodiment of the present invention, after step S3 and before step S6, step S4 is further included:

[0039] Roughening is applied to part or all of the outer wall of the first protrusion.

[0040] And / or, roughen part or all of the inner wall of the first groove;

[0041] And / or, roughen part or all of the inner wall of the second groove.

[0042] In one embodiment of the present invention, after step S3 and before step S6, step S5 is further included:

[0043] The second groove is filled with absorbent material to form an absorbent layer.

[0044] The beneficial effects of this invention are:

[0045] The present invention provides a high-reliability LED bracket, a manufacturing method, an LED, and a light-emitting device. The high-reliability LED bracket includes a substrate and a wall enclosing the substrate. A first protrusion is provided on the upper surface of the substrate in a region that is in close contact with the wall. The first protrusion is provided on at least two sides of the upper surface of the substrate and extends from one side to at least the other side. A first groove corresponding to the first protrusion and recessed into the upper surface of the substrate is provided on the lower surface of the substrate in a region that is in close contact with the wall. This invention solves the problem of poor reliability of LED brackets and LEDs made using the bracket in the prior art. In other words, by forming continuous first protrusions on at least two sides of the upper surface of the substrate, the contact area between the substrate and the enclosure is greatly increased. At the same time, a portion of the enclosure fills the first groove on the lower surface of the substrate, making the bonding force between the substrate and the enclosure stronger. This avoids the phenomenon of LED bracket cracking and separation due to heat in high-temperature scenarios, and improves the reliability and durability of the LED bracket and the LED made using the LED bracket. This makes the LED more suitable for various application scenarios, especially high-temperature application scenarios. At the same time, the stronger bonding force between the substrate and the enclosure also improves the airtightness of the LED to a certain extent, which is more conducive to the promotion and use of LED. Attached Figure Description

[0046] Figure 1-1 This is a top view of an LED bracket;

[0047] Figure 1-2 for Figure 1-1 The cross-sectional view of the LED bracket shown;

[0048] Figure 1-3 for Figure 1-2 The diagram shows a cross-sectional view of the LED bracket cracking and separating due to heat in a high-temperature environment.

[0049] Figure 2-1 This is a top view of the LED bracket provided in Embodiment 1 of the present invention;

[0050] Figure 2-2 for Figure 2-1 The cross-sectional view of the LED bracket shown is shown in Figure 1.

[0051] Figure 2-3 for Figure 2-1 The cross-sectional view of the LED bracket shown in Figure 2;

[0052] Figure 2-4 for Figure 2-1 The cross-sectional view of the LED bracket shown in Figure 3 is shown.

[0053] Figure 2-5 for Figure 2-1 The cross-sectional view of the LED bracket shown in Figure 4 is also included.

[0054] Figure 2-6 for Figure 2-1 The cross-sectional view of the LED bracket shown in Figure 5 is as follows;

[0055] Figure 2-7 for Figure 2-1 The cross-sectional view of the LED bracket shown in Figure 6 is also included.

[0056] Figure 2-8 This is a top view of the LED bracket provided in Embodiment 1 of the present invention;

[0057] Figure 2-9 This is a top view of the LED bracket provided in Embodiment 1 of the present invention (3).

[0058] Figure 2-10 This is a top view of the LED bracket provided in Embodiment 1 of the present invention (4).

[0059] Figure 2-11 Fifth top view of the LED bracket provided in Embodiment 1 of the present invention;

[0060] Figure 2-12 A top view of the LED bracket provided in Embodiment 1 of the present invention (see diagram 6).

[0061] Figure 2-13 Top view of the LED bracket provided in Embodiment 1 of the present invention Figure 7 ;

[0062] Figure 3-1 A cross-sectional view of the LED bracket provided in Embodiment 1 of the present invention;

[0063] Figure 3-2 The second cross-sectional view is of the LED bracket provided in Embodiment 1 of the present invention;

[0064] Figure 3-3 The third cross-sectional view is of the LED bracket provided in Embodiment 1 of the present invention;

[0065] Figure 3-4 Cross-sectional view four of the LED bracket provided in Embodiment 1 of the present invention;

[0066] Figure 3-5 Fifth cross-sectional view of the LED bracket provided in Embodiment 1 of the present invention;

[0067] Figure 3-6 Cross-sectional view six of the LED bracket provided in Embodiment 1 of the present invention;

[0068] Figure 3-7 Cross-section of the LED bracket provided in Embodiment 1 of the present invention Figure 7 ;

[0069] Figure 3-8 Eighth cross-sectional view of the LED bracket provided in Embodiment 1 of the present invention;

[0070] Figure 3-9 Cross-sectional view nine of the LED bracket provided in Embodiment 1 of the present invention;

[0071] Figure 3-10 Cross-sectional view 10 of the LED bracket provided in Embodiment 1 of the present invention;

[0072] Figure 3-11 Cross-sectional view eleven of the LED bracket provided in Embodiment 1 of the present invention;

[0073] Figure 3-12 Cross-sectional view 12 of the LED bracket provided in Embodiment 1 of the present invention;

[0074] Figure 4-1 This is a cross-sectional view of the first protrusion of the LED bracket provided in Embodiment 1 of the present invention;

[0075] Figure 4-2 This is a cross-sectional view of the second groove of the LED bracket provided in Embodiment 1 of the present invention;

[0076] Figure 5-1 This is a cross-sectional view of the LED bracket provided in Embodiment 2 of the present invention;

[0077] Figure 5-2 for Figure 5-1 The cross-sectional view of the roughened layer of the first arc-shaped protrusion of the LED bracket is shown in Figure 1.

[0078] Figure 5-3 for Figure 5-1 A top view of the roughened layer of the first arc-shaped protrusion and the second groove of the LED bracket shown in Figure 1;

[0079] Figure 5-4 for Figure 5-1 Figure 2 shows the cross-sectional view of the roughened layer of the first arc-shaped protrusion of the LED bracket;

[0080] Figure 5-5 for Figure 5-1 The second top view shows the roughened layer of the first arc-shaped protrusion and the second groove of the LED bracket.

[0081] Figure 5-6 for Figure 5-1 The cross-sectional view of the roughened layer of the first square protrusion of the LED bracket is shown in Figure 1.

[0082] Figure 5-7 for Figure 5-1 A top view of the roughened layer of the square first protrusion and second groove of the LED bracket shown in Figure 1;

[0083] Figure 5-8 for Figure 5-1 Figure 2 shows a cross-sectional view of the roughened layer of the first square protrusion of the LED bracket.

[0084] Figure 5-9 for Figure 5-1 A top view of the roughened layer of the first protrusion and second groove of the square LED bracket shown in the image;

[0085] Figure 6-1 This is a cross-sectional view of the LED bracket provided in Embodiment 3 of the present invention;

[0086] Figure 6-2 for Figure 6-1 Top view of the LED bracket shown;

[0087] Figure 7 This is a basic flowchart of the LED bracket manufacturing method provided in Embodiment 4 of the present invention;

[0088] in, Figures 1-1 to 1-2 In the attached diagram, 10 represents the enclosure wall and 11 represents the base plate.

[0089] Figures 2-1 to 2-13In the attached figures, reference numeral 20 represents the enclosure wall, 201, 202, 203, and 204 represent the four sides of the upper surface of the substrate, 211 represents the first substrate, 212 represents the second substrate, 213 represents the insulating strip, 214 represents the first protrusion located on the upper surface of the first substrate 211 in close contact with the enclosure wall 20, 215 represents the first groove located on the lower surface of the first substrate 211 in close contact with the enclosure wall 20 corresponding to the first protrusion 214, 216 represents the first protrusion located on the upper surface of the second substrate 212 in close contact with the enclosure wall 20, and 217 represents the first groove located on the lower surface of the second substrate 212 in close contact with the enclosure wall 20 corresponding to the first protrusion 216.

[0090] Figures 3-1 to 3-12 In the diagram, 30 is the enclosure wall, 311 is the first substrate, 312 is the second substrate, 313 is the insulating strip, 314 is the first protrusion located on the upper surface of the first substrate 311 and in close contact with the enclosure wall 30, 318 is the second groove located on the upper surface of the first substrate 311 and in close contact with the enclosure wall 30, 315 is the first groove located on the lower surface of the first substrate 311 and in close contact with the enclosure wall 30, corresponding to the first protrusion 314, 316 is the first protrusion located on the upper surface of the second substrate 312 and in close contact with the enclosure wall 30, 319 is the second groove located on the upper surface of the second substrate 312 and in close contact with the enclosure wall 30, and 317 is the first groove located on the lower surface of the second substrate 312 and in close contact with the enclosure wall 30, corresponding to the first protrusion 316.

[0091] Figure 4-1 In the attached drawing, reference numerals 41, 42, and 43 represent the three surfaces of the outer wall of the first protrusion;

[0092] Figure 4-2 In the attached drawings, reference numerals 44, 45, and 46 represent three surfaces of the inner wall of the second groove;

[0093] Figure 5-1In this diagram, 50 represents the enclosure wall, 511 represents the first substrate, 512 represents the second substrate, 513 represents the insulating strip, 514 represents the first protrusion located on the upper surface of the first substrate 511 and in close contact with the enclosure wall 50, 518 represents the second groove located on the upper surface of the first substrate 511 and in close contact with the enclosure wall 50, 515 represents the first groove located on the lower surface of the first substrate 511 and in close contact with the enclosure wall 50, corresponding to the first protrusion 514, 516 represents the first protrusion located on the upper surface of the second substrate 512 and in close contact with the enclosure wall 50, 519 represents the second groove located on the upper surface of the second substrate 512 and in close contact with the enclosure wall 50, and 517 represents the first groove located on the lower surface of the second substrate 512 and in close contact with the enclosure wall 50, corresponding to the first protrusion 516.

[0094] Figures 6-1 to 6-2 In the diagram, 60 represents the enclosure wall, 601, 602, 603, and 604 are the four sides of the upper surface of the substrate, 611 is the first substrate, 612 is the second substrate, 613 is the insulating strip, 614 is the first protrusion located on the upper surface of the first substrate 611 in close contact with the enclosure wall 60, 615 is the first groove located on the lower surface of the first substrate 611 in close contact with the enclosure wall 60, corresponding to the first protrusion 614, 616 is the first protrusion located on the upper surface of the second substrate 612 in close contact with the enclosure wall 60, and 617 is the first groove located on the lower surface of the second substrate 612 in close contact with the enclosure wall 60, corresponding to the first protrusion 616. Detailed Implementation

[0095] To make the objectives, technical solutions, and advantages of this invention clearer, the embodiments of this invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0096] Example 1:

[0097] To address the issue of poor reliability in existing LED brackets, this embodiment provides a highly reliable LED bracket, which includes a substrate and a wall enclosing the substrate. A first protrusion is provided on the upper surface of the substrate in a region that is in close contact with the wall. The first protrusion is formed on at least two sides of the upper surface of the substrate, extending from one side to at least the other side. A first groove corresponding to the first protrusion and recessed upwards is provided on the lower surface of the substrate in a region that is in close contact with the wall.

[0098] In this embodiment, the substrate includes a first substrate, a second substrate, an insulating barrier separating the first substrate and the second substrate, and an insulating enclosure that surrounds the first substrate, the second substrate, and the insulating barrier. See, for example... Figure 2-1 As shown, the substrate includes a first substrate 211, a second substrate 212, and an insulating strip 213, wherein the insulating strip 213 is located between the first substrate 211 and the second substrate 212 to insulate and isolate them; the enclosure 20 encloses the first substrate 211, the second substrate 212, and the insulating strip 213 therein, and the upper surfaces of the first substrate 211 and the second substrate 212 have functional areas and contact areas that contact the enclosure 20; in one example, the functional areas on the upper surfaces of the first substrate and the second substrate are located at the bottom of the reflective cavity formed by the enclosure.

[0099] In this embodiment, both the first substrate and the second substrate are conductive substrates. The conductive substrate in this embodiment can be a substrate made of various conductive materials, such as various metal conductive substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, and silver substrates; the conductive substrate can also be a conductive substrate made of a mixed material containing conductive materials, such as conductive rubber.

[0100] Optionally, in this embodiment, a reflective layer may be provided in the functional area of ​​at least one of the first substrate and the second substrate to improve the light emission efficiency of the bracket. The reflective layer may be a light reflective layer that can improve the light emission efficiency, such as including but not limited to a silver plating layer.

[0101] Optionally, in this embodiment, the back side of at least one of the first substrate and the second substrate is exposed at the bottom of the enclosure, serving as an electrode welding area. Of course, in some examples, the back side of at least one of the first substrate and the second substrate may not be used as a welding area, but rather its side surface may be used as a welding area. The specific configuration can be flexibly determined according to the specific application requirements.

[0102] Optionally, in this embodiment, the area of ​​the first substrate is larger than the area of ​​the second substrate. Of course, in some examples, the area of ​​the first substrate may also be smaller than the area of ​​the second substrate; the specific setting can be flexibly set according to specific application requirements.

[0103] Optionally, in this embodiment, the wall can be made of various insulating materials, such as, but not limited to, various plastics and insulating ceramics. For example, in one example, the materials that can be used for the wall include, but are not limited to, poly(1,4-cyclohexylene) dimethylene terephthalate (PCT), epoxy molding compound (EMC), unsaturated polyester (UP) resin, polyester resin (PET), high-temperature resistant nylon (PPA plastic), and polycarbonate (PC).

[0104] Optionally, in this embodiment, the material of the insulating isolation strip can be the same as or different from that of the wall, and it can be formed together with the wall or formed separately.

[0105] In addition, it should be understood that the method of forming the wall in this embodiment can also be flexibly selected, for example, it can be formed by injection molding, but is not limited to injection molding.

[0106] In this embodiment, at least one of the first and second substrates of the LED bracket has a first protrusion on its upper surface in a region tightly fitted with the wall, and a first groove corresponding to the first protrusion on its lower surface in a region tightly fitted with the wall. For example, the first protrusion may be provided only on the upper surface of the first substrate in a region tightly fitted with the wall, and the first groove corresponding to the first protrusion may be provided on the lower surface of the first substrate in a region tightly fitted with the wall; or the first protrusion may be provided only on the upper surface of the second substrate in a region tightly fitted with the wall, and the first groove corresponding to the first protrusion may be provided on the lower surface of the second substrate in a region tightly fitted with the wall; or the first protrusion may be provided on the upper surface of the first substrate in a region tightly fitted with the wall, and the first groove corresponding to the first protrusion may be provided on the lower surface of the first substrate in a region tightly fitted with the wall, while the first protrusion may be provided on the upper surface of the second substrate in a region tightly fitted with the wall, and the first groove corresponding to the first protrusion may be provided on the lower surface of the second substrate in a region tightly fitted with the wall.

[0107] It should be understood that this method of setting a first protrusion on the upper surface of the substrate and a first groove on the lower surface of the substrate greatly increases the bonding area between the enclosure and the substrate, which in turn greatly enhances the bonding force between the enclosure and the substrate. This improves the reliability and durability of the LED bracket and the LED made using the LED bracket, enabling the LED to better meet the requirements of various environments, especially high-temperature applications. Furthermore, due to the stronger bonding force between the substrate and the enclosure, the airtightness of the LED is also improved to a certain extent, which is more conducive to the promotion and use of LEDs.

[0108] It should be clarified that, in this embodiment, the forming process of the first protrusion on the upper surface of the substrate and the first groove on the lower surface of the substrate corresponding to the position of the first protrusion can be a stamping process. This method can improve the strength of the entire LED bracket to a certain extent, and further improve the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0109] In this embodiment, the first protrusion can be a curved protrusion or a straight protrusion. It is understood that, since the first groove and the first protrusion are formed by stamping, the shape and size of the first groove are adapted to the shape and size of the first protrusion.

[0110] In one example, see Figure 2-2 As shown, a curved first protrusion 214 may be provided only on the upper surface of the first substrate 211 in the area that is in close contact with the wall body 20, and a curved first groove 215 corresponding to the curved first protrusion 214 may be provided on the lower surface of the first substrate 211 in the area that is in close contact with the wall body 20.

[0111] In one example, see Figure 2-3 As shown, a curved first protrusion 216 may be provided only on the upper surface of the second substrate 212 in the area that is in close contact with the wall body 20, and a curved first groove 217 corresponding to the curved first protrusion 216 may be provided on the lower surface of the second substrate 212 in the area that is in close contact with the wall body.

[0112] In one example, see Figure 2-4 As shown, a curved first protrusion 214 is provided on the upper surface of the first substrate 211 in the area that is in close contact with the wall body 20, and a curved first groove 215 corresponding to the curved first protrusion 214 is provided on the lower surface of the first substrate 211 in the area that is in close contact with the wall body. At the same time, a curved first protrusion 216 is provided on the upper surface of the second substrate 212 in the area that is in close contact with the wall body 20, and a curved first groove 217 corresponding to the curved first protrusion 216 is provided on the lower surface of the second substrate 212 in the area that is in close contact with the wall body.

[0113] In one example, see Figure 2-5 As shown, a straight first protrusion 214 may be provided only on the upper surface of the first substrate 211 in the area that is in close contact with the wall body 20, and a straight first groove 215 corresponding to the straight first protrusion 214 may be provided on the lower surface of the first substrate 211 in the area that is in close contact with the wall body.

[0114] In one example, see Figure 2-6 As shown, a straight first protrusion 216 may be provided only on the upper surface of the second substrate 212 in the area that is in close contact with the wall body 20, and a straight first groove 217 corresponding to the straight first protrusion 216 may be provided on the lower surface of the second substrate 212 in the area that is in close contact with the wall body.

[0115] In one example, see Figure 2-7 As shown, a straight first protrusion 214 is provided on the upper surface of the first substrate 211 in the area that is in close contact with the wall body 20, and a straight first groove 215 corresponding to the straight first protrusion 214 is provided on the lower surface of the first substrate 211 in the area that is in close contact with the wall body. At the same time, a straight first protrusion 216 is provided on the upper surface of the second substrate 212 in the area that is in close contact with the wall body 20, and a straight first groove 217 corresponding to the straight first protrusion 216 is provided on the lower surface of the second substrate 212 in the area that is in close contact with the wall body.

[0116] It should be noted that, please refer to Figure 2-1 As shown, the upper surface of the substrate has four sides, namely 201, 202, 203, and 204 (due to...). Figure 2-1 (This is a top view, so the four sides 201, 202, 203, and 204 are obscured by the enclosure 20). In this embodiment, the first protrusion is provided on at least two sides of the upper surface of the substrate, extending from one side of the upper surface of the substrate to at least the other side. In this way, at least two continuous first protrusions can be formed on the upper surface of the substrate. Compared with the method of setting the first protrusions on at least two discontinuous sides, the bonding area between the enclosure and the substrate is further increased, that is, the bonding force between the enclosure and the substrate is further enhanced, so that the airtightness and durability of the LED bracket and the LED made using the LED bracket are better.

[0117] In one example, see Figures 2-8 to 2-9 As shown, the first bump is disposed on both sides of the upper surface of the second substrate; wherein, in Figure 2-8 The first protrusion (shown by dashed lines) is disposed on both sides 201, 202 of the upper surface of the second substrate. Figure 2-9 The first protrusion (shown by dashed lines) is disposed on both sides 202 and 203 on the upper surface of the second substrate.

[0118] In one example, see Figure 2-10 As shown, the first bump is disposed on three sides of the upper surface of the second substrate; wherein, in Figure 2-10 The first protrusion (shown by dashed lines) is disposed on three sides 201, 202, and 203 on the upper surface of the substrate.

[0119] In one example, see Figures 2-11 to 2-12 As shown, the first bump is disposed on both sides of the upper surface of the second substrate; wherein, in Figure 2-11 The first protrusion (shown by the dashed line) is disposed on both sides 203 and 204 of the upper surface of the substrate. Figure 2-12 The first protrusion (shown by the dashed line) is disposed on both sides 201 and 204 on the upper surface of the substrate.

[0120] In one example, see Figure 2-13 As shown, the first bump is disposed on three sides of the upper surface of the second substrate; wherein, in Figure 2-13 The first protrusion (shown by dashed lines) is disposed on three sides 201, 203, and 204 on the upper surface of the substrate.

[0121] It should be understood that, Figures 2-8 to 2-10 The diagram shows a first bump disposed on at least two sides of the upper surface of the second substrate. Figures 2-11 to 2-13 The diagram shows a first bump disposed on at least two sides of the upper surface of the first substrate, wherein, Figures 2-8 to 2-10 Can be used with Figures 2-11 to 2-13 In practice, these can be flexibly adjusted according to specific application scenarios.

[0122] To further increase the contact area between the substrate and the wall, and thus strengthen the bonding force between them, a second groove is provided on the upper surface of the substrate in the area that is in close contact with the wall in this embodiment. Specifically, in this embodiment, at least one of the first substrate and the second substrate of the LED bracket has a first protrusion and a second groove on its upper surface in the area that is in close contact with the wall, and a first groove that is in close contact with the wall is provided on its lower surface. For example, a first protrusion and a second groove may be provided only on the upper surface of the first substrate in the area that is in close contact with the wall, and a first groove corresponding to the first protrusion may be provided on the lower surface of the first substrate in the area that is in close contact with the wall; or a first protrusion and a second groove may be provided only on the upper surface of the second substrate in the area that is in close contact with the wall, and a first groove corresponding to the first protrusion may be provided on the lower surface of the second substrate in the area that is in close contact with the wall; or a first protrusion and a second groove may be provided on the upper surface of the first substrate in the area that is in close contact with the wall, and a first groove corresponding to the first protrusion may be provided on the lower surface of the first substrate in the area that is in close contact with the wall, while a first protrusion and a second groove may be provided on the upper surface of the second substrate in the area that is in close contact with the wall, and a first groove corresponding to the first protrusion may be provided on the lower surface of the second substrate in the area that is in close contact with the wall.

[0123] It should be understood that, in addition to providing a first protrusion on the upper surface of the substrate and a first groove on the lower surface of the substrate to increase the bonding area between the wall and the substrate, this embodiment further increases the bonding area between the wall and the substrate by providing a second groove on the upper surface of the substrate. This further enhances the bonding force between the wall and the substrate, thereby improving the reliability and durability of the LED bracket and the LED made using the LED bracket. This allows the LED to better meet the requirements of various environments, especially high-temperature applications. Furthermore, because the bonding force between the substrate and the wall is stronger, the airtightness of the LED is also improved to a certain extent, which is more conducive to the widespread use of LEDs.

[0124] In this embodiment, the first bump on the substrate can be a curved bump or a straight bump, and the first groove and the second groove on the substrate can be curved grooves or straight grooves.

[0125] In one example, see Figure 3-1 As shown, a curved first protrusion 314 and a curved second groove 318 may be provided only on the upper surface of the first substrate 311 in the area that is in close contact with the wall body 30, and a curved first groove 315 corresponding to the curved first protrusion 314 may be provided on the lower surface of the first substrate 311 in the area that is in close contact with the wall body.

[0126] In one example, see Figure 3-2As shown, a curved first protrusion 316 and a curved second groove 319 may be provided only on the upper surface of the second substrate 312 in the area that is in close contact with the wall body 30, and a curved first groove 317 corresponding to the curved first protrusion 316 may be provided on the lower surface of the second substrate 312 in the area that is in close contact with the wall body.

[0127] In one example, see Figure 3-3 As shown, a curved first protrusion 314 and a curved second groove 318 are provided on the upper surface of the first substrate 311 in the area that is in close contact with the wall body 30. A curved first groove 315 corresponding to the curved first protrusion 314 is provided on the lower surface of the first substrate 311 in the area that is in close contact with the wall body. At the same time, a curved first protrusion 316 and a curved second groove 319 are provided on the upper surface of the second substrate 312 in the area that is in close contact with the wall body 30. A curved first groove 317 corresponding to the curved first protrusion 316 is provided on the lower surface of the second substrate 312 in the area that is in close contact with the wall body.

[0128] In one example, see Figure 3-4 As shown, a straight first protrusion 314 and a straight second groove 318 may be provided only on the upper surface of the first substrate 311 in the area that is in close contact with the wall body 30, and a straight first groove 315 corresponding to the straight first protrusion 314 may be provided on the lower surface of the first substrate 311 in the area that is in close contact with the wall body.

[0129] In one example, see Figure 3-5 As shown, a straight first protrusion 316 and a straight second groove 319 may be provided only on the upper surface of the second substrate 312 in the area that is in close contact with the wall body 30, and a straight first groove 317 corresponding to the straight first protrusion 316 may be provided on the lower surface of the second substrate 312 in the area that is in close contact with the wall body.

[0130] In one example, see Figure 3-6 As shown, a straight first protrusion 314 and a straight second groove 318 are provided on the upper surface of the first substrate 311 in the area that is in close contact with the wall body 30. A straight first groove 315 corresponding to the straight first protrusion 314 is provided on the lower surface of the first substrate 311 in the area that is in close contact with the wall body. At the same time, a straight first protrusion 316 and a straight second groove 319 are provided on the upper surface of the second substrate 312 in the area that is in close contact with the wall body 30. A straight first groove 317 corresponding to the straight first protrusion 316 is provided on the lower surface of the second substrate 312 in the area that is in close contact with the wall body.

[0131] It should be understood that, Figures 3-1 to 3-6 The diagram shows the first protrusion and the second groove arranged adjacent to each other. In another example of this embodiment, the first protrusion may also be arranged separately from the second groove, for example, see [link to example]. Figure 3-7 to Figure 3-12 As shown, it should be understood that Figures 3-7 to 3-12 This is only to illustrate that the first protrusion and the second recess are separable; for other details, please refer to [link / reference]. Figures 3-1 to 3-6 This will not be elaborated upon here.

[0132] It should be noted that the second groove in this embodiment can be configured on the substrate in the same way as the first protrusion, i.e., it is disposed on at least two sides of the upper surface of the substrate, extending from one side to at least the other side. This forms a continuous second groove on at least two sides of the upper surface of the substrate. Compared to a non-continuous second groove on at least two sides, this further increases the bonding area between the wall and the substrate, thus further enhancing the bonding force between the wall and the substrate. It should be understood that the configuration of the second groove here is similar to that of the first protrusion described above; see [reference needed]. Figures 2-8 to 2-13 As shown ( Figures 2-8 to 2-13 (The first protrusion shown can be replaced with the second groove), which will not be elaborated here.

[0133] Specifically, when the second groove is disposed on both sides of the upper surface of the second substrate, the second groove may optionally be disposed on both sides 201 and 202 of the upper surface of the second substrate, or the second groove may optionally be disposed on both sides 202 and 203 of the upper surface of the second substrate; when the second groove is disposed on three sides of the upper surface of the second substrate, the second groove may optionally be disposed on the three sides 201, 202 and 203 of the upper surface of the second substrate.

[0134] Specifically, when the second groove is disposed on both sides of the upper surface of the first substrate, the second groove may optionally be disposed on both sides 203 and 204 of the upper surface of the first substrate, or the second groove may optionally be disposed on both sides 201 and 204 of the upper surface of the first substrate; when the second groove is disposed on three sides of the upper surface of the first substrate, the second groove may optionally be disposed on the three sides 201, 203 and 204 of the upper surface of the first substrate.

[0135] It should be noted that the way the second groove is set on the substrate in this embodiment may also be different from the way the first protrusion is set on the substrate, that is, it may be set on one side of the upper surface of the substrate.

[0136] Specifically, when the second groove is disposed on one side of the upper surface of the second substrate, the second groove may optionally be disposed on the side 201, 202, or 203 of the upper surface of the second substrate.

[0137] Specifically, when the second groove is disposed on one side of the upper surface of the first substrate, the second groove may optionally be disposed on the side 201, 203, or 204 of the upper surface of the first substrate.

[0138] It should be understood that the second groove located on the side of the upper surface of the second substrate and the second groove located on the side of the upper surface of the first substrate can be arbitrarily combined. In practical applications, they can be flexibly adjusted according to specific application scenarios.

[0139] In one example of this embodiment, at least one of the first and second substrates of the LED bracket has a portion or all of the outer wall of the first bump formed after roughening treatment. For example, the shape of the first bump is as follows: Figure 4-1 The figure shows a straight first protrusion, with regions 41, 42, and 43 on its outer wall. Any one or any combination of regions 41, 42, and 43 on the outer wall is a roughened layer formed after roughening treatment.

[0140] In one example of this embodiment, at least one of the first and second substrates of the LED bracket has a portion or all of the inner wall of the second groove formed after roughening treatment. For example, the shape of the second groove is as follows: Figure 4-2 The second groove is shown as a straight line, with regions 44, 45, and 46 on its inner wall. Any one or any combination of regions 44, 45, and 46 on the inner wall is a roughened layer formed after roughening treatment.

[0141] Optionally, a roughening layer may be formed by roughening only a portion or all of the outer wall of the first protrusion of the first substrate and / or a portion or all of the inner wall of the second groove of the first substrate; or a roughening layer may be formed by roughening only a portion or all of the outer wall of the first protrusion of the second substrate and / or a portion or all of the inner wall of the second groove of the second substrate; or a roughening layer may be formed by roughening a portion or all of the outer wall of the first protrusion of the first substrate and / or a portion or all of the inner wall of the second groove of the first substrate, while simultaneously roughening a portion or all of the outer wall of the first protrusion of the second substrate and / or a portion or all of the inner wall of the second groove of the second substrate.

[0142] Optionally, a roughening layer may be formed by roughening part or all of the inner wall of the first groove.

[0143] Optionally, the coarsening layer in this embodiment is a curved coarsening layer, a straight coarsening layer, or a coarsening layer combining curves and straight lines. In practical applications, it can be flexibly adjusted according to specific application scenarios.

[0144] Optionally, the outer wall of the first bump of the substrate in this embodiment may also be provided with a thermally conductive adhesive layer. Specifically, by coating the outer wall of the first bump with thermally conductive adhesive, the thermal conductivity of the LED bracket can be improved to a certain extent, thereby further improving the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0145] This embodiment provides a first protrusion and / or a second groove on the upper surface of the substrate in a region that is in close contact with the wall. The first protrusion and / or the second groove are located on at least two sides of the upper surface of the substrate, extending from one side to at least the other side. This significantly increases the contact area between the substrate and the wall, resulting in a stronger bond between them. This prevents the LED bracket from cracking and separating due to heat in high-temperature environments, improving the reliability and durability of the LED bracket and the LEDs made from it. This allows the LEDs to be better suited for various application environments, especially high-temperature applications. Furthermore, the stronger bond between the substrate and the wall also improves the airtightness of the LEDs, facilitating their wider adoption.

[0146] Example 2:

[0147] For ease of understanding, this embodiment is illustrated by an example in which a first protrusion and a second groove are provided on the upper surface of the substrate in a region that is in close contact with the wall, and a first groove corresponding to the first protrusion is provided on the lower surface of the substrate in a region that is in close contact with the wall.

[0148] Please see Figure 5-1As shown in the figure, this is a schematic diagram of a substrate having a first protrusion and a second groove on the upper surface of the substrate in a region tightly attached to the wall, and a first groove corresponding to the first protrusion on the lower surface of the substrate in a region tightly attached to the wall. In this diagram, 50 represents the wall, 512 represents the second substrate, 511 represents the first substrate, 513 represents the insulating strip, 514 represents a curved first protrusion on the first substrate 511 in a region tightly attached to the wall 50, 518 represents a curved second groove on the first substrate 511 in a region tightly attached to the wall 50, and 515 represents a curved second groove on the first substrate 511 in a region tightly attached to the wall 50. A curved first groove corresponding to the curved first protrusion 514 is provided on the lower surface of the second substrate 512 in a region tightly attached to the wall body 50. A straight first protrusion 516 is provided on the second substrate 512 in a region tightly attached to the wall body 50. A straight second groove is provided on the second substrate 512 in a region tightly attached to the wall body 50. A straight first groove corresponding to the straight first protrusion 514 is provided on the lower surface of the second substrate 512 in a region tightly attached to the wall body 50. Optionally, the first protrusion and the second groove are arranged adjacent to each other or separately. Optionally, the curved first protrusion is an arc-shaped first protrusion, the curved first groove is an arc-shaped first groove, the curved second groove is an arc-shaped second groove, the straight first protrusion is a square first protrusion, the straight first groove is a square first groove, and the straight second groove is a square second groove.

[0149] In one example, see Figure 5-2 , 5-3 As shown, the arc-shaped first protrusion is a first protrusion with a curve roughening layer; optionally, part or all of the outer wall of the arc-shaped first protrusion is set as a curve roughening layer, and / or, part or all of the inner wall of the arc-shaped second groove is set as a curve roughening layer.

[0150] In one example, see Figure 5-4 , 5-5 As shown, the arc-shaped first protrusion is a first protrusion with a straight roughening layer; optionally, part or all of the outer wall of the arc-shaped first protrusion is set as a straight roughening layer, and / or, part or all of the inner wall of the arc-shaped second groove is set as a straight roughening layer.

[0151] In one example, see Figure 5-6 , 5-7 As shown, the square first protrusion is a first protrusion with a curve roughening layer. Optionally, part or all of the outer wall of the square first protrusion is set as a curve roughening layer, and / or, part or all of the inner wall of the square second groove is set as a curve roughening layer.

[0152] In one example, see Figure 5-8 ,5-9 As shown, the square first protrusion is a first protrusion with a straight line roughening layer. Optionally, part or all of the outer wall of the square first protrusion is set as a straight line roughening layer, and / or part or all of the inner wall of the square second groove is set as a straight line roughening layer.

[0153] In this embodiment, a first protrusion and a second groove are provided on the upper surfaces of the first and second substrates of the LED bracket in areas that are in close contact with the wall. A first groove corresponding to the first protrusion is provided on the lower surfaces of the first and second substrates in areas that are in close contact with the wall. The first protrusion, the first groove, and the second groove increase the contact area with the wall. At the same time, a portion of the wall fills the first groove on the lower surface of the substrate, making the bonding force between the substrate and the wall stronger. This avoids the phenomenon of the LED bracket cracking and separating due to heat in high-temperature scenarios, improving the reliability and durability of the LED bracket and the LED made using the LED bracket. This makes the LED more suitable for various application scenarios, especially high-temperature application scenarios. At the same time, the stronger bonding force between the substrate and the wall also improves the airtightness of the LED to a certain extent, which is more conducive to the widespread use of LEDs.

[0154] Example 3:

[0155] For ease of understanding, this embodiment will be illustrated by an example in which a first protrusion is provided on the upper surface of the substrate in a region that is in close contact with the wall, and a first groove corresponding to the first protrusion is provided on the lower surface of the substrate in a region that is in close contact with the wall.

[0156] Please see Figure 6-1 As shown in the figure, a first protrusion is provided on the upper surface of the substrate in a region tightly attached to the wall body, and a first groove corresponding to the first protrusion is provided on the lower surface of the substrate in a region tightly attached to the wall body. In this figure, 60 is the wall body, 612 is the second substrate, 611 is the first substrate, 613 is an insulating strip, 614 is a straight first protrusion provided on the first substrate 611 in a region tightly attached to the wall body 60, 615 is a straight first groove corresponding to the straight first protrusion 614 provided on the lower surface of the first substrate 611 in a region tightly attached to the wall body, 616 is a curved first protrusion provided on the second substrate 612 in a region tightly attached to the wall body 60, and 617 is a curved first groove corresponding to the curved first protrusion 616 provided on the lower surface of the second substrate 612 in a region tightly attached to the wall body. Optionally, the curved first protrusion can be an arc-shaped first protrusion, the curved first groove can be an arc-shaped first groove, the straight first protrusion can be a square first protrusion, and the straight first groove can be a square first groove.

[0157] Please also see Figure 6-2 As shown, Figure 6-1 The top view shown shows that the first protrusion (shown by dashed lines) is provided on the four sides 601, 602, 603, and 604 on the upper surface of the substrate.

[0158] It should be noted that the roughening layer provided for the arc-shaped first protrusion, the square first protrusion, the arc-shaped first groove, and the square first groove in this embodiment can be found in the description in Embodiment 2, and will not be repeated here.

[0159] This embodiment provides a first protrusion on the upper surfaces of the first and second substrates of the LED bracket, in areas that are in close contact with the wall. The first protrusion is located on at least two sides of the upper surfaces of the first and second substrates, significantly increasing the contact area with the wall. A first groove corresponding to the first protrusion is provided on the lower surfaces of the first and second substrates, in areas that are in close contact with the wall. A portion of the wall fills the first groove on the lower surface of the substrate, strengthening the bond between the substrate and the wall. This prevents the LED bracket from cracking and separating due to heat in high-temperature environments, improving the reliability and durability of the LED bracket and the LEDs manufactured using it. This allows the LEDs to be better suited for various application environments, especially high-temperature applications. Furthermore, since the first protrusion is continuously provided on the first and second substrates, it also greatly improves the airtightness of the LED, facilitating its widespread use.

[0160] Example 4:

[0161] To address the poor reliability of existing LED brackets, this embodiment provides a method for manufacturing a highly reliable LED bracket according to Embodiments 1 to 3. Please refer to [link / reference]. Figure 7 As shown, the manufacturing method includes:

[0162] Step S701: Stamp along the lower surface of the substrate toward the upper surface of the substrate to form a first protrusion on at least two sides of the upper surface of the substrate. The first protrusion extends along one side of the upper surface of the substrate to at least the other side. A first groove corresponding to the first protrusion is formed on the lower surface of the substrate and recessed toward the upper surface of the substrate.

[0163] Step S702: Inject or mold plastic material around the substrate to form a wall.

[0164] It should be clearly stated that the substrate in this embodiment includes a first substrate and a second substrate. Therefore, in step S701 of this embodiment:

[0165] The first substrate is stamped to form first protrusions on at least two sides of the upper surface of the first substrate, and a first groove corresponding to the first protrusions and recessed into the upper surface of the first substrate is formed on the lower surface of the first substrate.

[0166] And / or,

[0167] The second substrate is stamped to form first protrusions on at least two sides of the upper surface of the second substrate, and to form a first groove corresponding to the first protrusions and recessed into the upper surface of the second substrate on the lower surface of the second substrate.

[0168] It should be clarified that in step S701 of this embodiment, the substrate is stamped to form a first protrusion that can be a curved first protrusion or a straight first protrusion, and correspondingly, the first groove of the substrate can be a curved first groove or a straight first groove.

[0169] In one example, only the first substrate may be stamped to form curved first protrusions on at least two sides of the upper surface of the first substrate, and curved first grooves corresponding to the curved first protrusions may be formed on the lower surface of the first substrate.

[0170] In one example, only the second substrate may be stamped to form curved first protrusions on at least two sides of the upper surface of the second substrate, and curved first grooves corresponding to the curved first protrusions may be formed on the lower surface of the second substrate.

[0171] In one example, a first substrate and a second substrate can be stamped simultaneously, forming curved first protrusions on at least two sides of the upper surface of the first substrate, forming curved first grooves corresponding to the curved first protrusions on the lower surface of the first substrate, forming curved first protrusions on at least two sides of the upper surface of the second substrate, and forming curved first grooves corresponding to the curved first protrusions on the lower surface of the second substrate.

[0172] In one example, only the first substrate may be stamped to form straight first protrusions on at least two sides of the upper surface of the first substrate, and straight first grooves corresponding to the straight first protrusions may be formed on the lower surface of the first substrate.

[0173] In one example, only the second substrate may be stamped to form straight first protrusions on at least two sides of the upper surface of the second substrate, and straight first grooves corresponding to the straight first protrusions may be formed on the lower surface of the second substrate.

[0174] In one example, a first substrate and a second substrate can be stamped simultaneously, forming straight first protrusions on at least two sides of the upper surface of the first substrate, forming straight first grooves corresponding to the straight first protrusions on the lower surface of the first substrate, forming straight first protrusions on at least two sides of the upper surface of the second substrate, and forming straight first grooves corresponding to the straight first protrusions on the lower surface of the second substrate.

[0175] In one example, a first substrate and a second substrate can be stamped simultaneously, forming curved first protrusions on at least two sides of the upper surface of the first substrate, forming curved first grooves corresponding to the curved first protrusions on the lower surface of the first substrate, forming straight first protrusions on at least two sides of the upper surface of the second substrate, and forming straight first grooves corresponding to the straight first protrusions on the lower surface of the second substrate.

[0176] In one example, a first substrate and a second substrate can be stamped simultaneously, forming straight first protrusions on at least two sides of the upper surface of the first substrate, forming straight first grooves corresponding to the straight first protrusions on the lower surface of the first substrate, forming curved first protrusions on at least two sides of the upper surface of the second substrate, and forming curved first grooves corresponding to the curved first protrusions on the lower surface of the second substrate.

[0177] It should be understood that this method of stamping the substrate to form continuous first protrusions on at least two sides of the upper surface of the substrate greatly increases the bonding area between the enclosure and the substrate, which in turn greatly enhances the bonding force between the enclosure and the substrate, thereby improving the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0178] In order to further increase the contact area between the substrate and the wall and make the bonding force between the substrate and the wall stronger, this embodiment may include etching on the upper surface of the substrate to form a second groove before step S702.

[0179] Optionally, the second groove can be formed by etching in the adjacent area of ​​the first bump on the upper surface of the substrate, or by etching in the non-adjacent area of ​​the first bump on the upper surface of the substrate.

[0180] Optionally, a second groove is formed by etching on at least one side of the upper surface of the substrate, and when the second groove is formed on at least two sides of the upper surface of the substrate, it extends along one side of the upper surface of the substrate to at least the other side.

[0181] Optionally, the substrate is etched to form a second groove in the substrate, which may be a curved first groove or a straight first groove.

[0182] In one example, etching may be performed only in adjacent or non-adjacent areas of the first bump on the upper surface of the first substrate to form a curved second groove.

[0183] In one example, etching can be performed only in the adjacent or non-adjacent areas of the first bump on the upper surface of the second substrate to form a curved second groove.

[0184] In one example, adjacent or non-adjacent areas of the first protrusion on the upper surface of the first substrate and the second substrate can be etched simultaneously to form a curved second groove.

[0185] In one example, etching may be performed only in the adjacent or non-adjacent areas of the first bump on the upper surface of the first substrate to form a linear second groove.

[0186] In one example, etching can be performed only in adjacent or non-adjacent areas of the first bump on the upper surface of the second substrate to form a straight second groove.

[0187] In one example, adjacent or non-adjacent areas of the first protrusion on the upper surface of both the first substrate and the second substrate can be etched simultaneously to form a linear second groove.

[0188] In one example, the first substrate and the second substrate can be etched simultaneously to form a straight second groove on the upper surface of the first substrate and a curved second groove on the upper surface of the second substrate.

[0189] In one example, the first substrate and the second substrate can be etched simultaneously to form a curved second groove on the upper surface of the first substrate and a straight second groove on the upper surface of the second substrate.

[0190] It should be understood that, in addition to increasing the bonding area between the wall and the substrate by stamping the first protrusion on the upper surface of the substrate, this embodiment also further increases the bonding area between the wall and the substrate by etching the second groove on the upper surface of the substrate, that is, further enhances the bonding force between the wall and the substrate, thereby further improving the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0191] In this embodiment, after etching the upper surface of the substrate to form the second groove, before step S702, the process may further include: roughening part or all of the outer wall of the first protrusion, and / or roughening part or all of the inner wall of the first groove, and / or roughening part or all of the inner wall of the second groove.

[0192] In one example, some or all of the outer wall of the first protrusion can be roughened. For example, if the first protrusion is a straight-line protrusion with three sides on its outer wall, any one or any combination of the three sides of the outer wall can be roughened.

[0193] Optionally, roughening treatment may be performed on only a portion or all of the outer wall of the first bump on the first substrate, or only a portion or all of the outer wall of the first bump on the second substrate, or both the first substrate and the outer wall of the first bump on the second substrate may be roughened simultaneously.

[0194] In one example, some or all of the inner wall of the first groove can be roughened. For example, if the first groove is a straight groove with three inner wall surfaces, any one or any combination of the three inner wall surfaces can be roughened.

[0195] Optionally, roughening treatment may be performed on only part or all of the inner wall of the second groove of the first substrate, or only part or all of the inner wall of the second groove of the second substrate, or roughening treatment may be performed on both part or all of the inner wall of the second groove of the first substrate and the second substrate.

[0196] It should be understood that this roughening treatment of the first bump and / or the first groove and / or the second groove of the substrate can further increase the bonding area between the wall and the substrate, that is, it can further enhance the bonding force between the wall and the substrate, thereby improving the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0197] Optionally, in this embodiment, the first bump of the substrate is roughened to obtain a roughened layer of the first bump of the substrate. The roughened layer can be a curved roughened layer, a straight roughened layer, or a roughened layer combining curves and straight lines. In practical applications, it can be flexibly adjusted according to the specific application scenario.

[0198] In this embodiment, after etching the upper surface of the substrate to form the second groove, before step S702, the method may further include filling the second groove with a water-absorbing material to form a water-absorbing layer. In practical applications, the water-absorbing material used for filling can be flexibly selected according to the specific application scenario.

[0199] It should be understood that this method of filling the second groove with absorbent material to form an absorbent layer can improve the moisture resistance of the LED bracket to a certain extent, and further improve the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0200] In this embodiment, after etching the upper surface of the substrate to form the second groove, before step S702, the method may further include: coating the second groove with thermally conductive adhesive to form a thermally conductive adhesive layer. In practical applications, the application of thermally conductive adhesive can be flexibly selected according to the specific application scenario.

[0201] It should be understood that this method of coating the second groove with thermally conductive adhesive to form a thermally conductive adhesive layer can improve the thermal conductivity of the LED bracket to a certain extent, and further improve the reliability and durability of the LED bracket and the LED made using the LED bracket.

[0202] It should be noted that in this embodiment, the roughening treatment of the first bump and / or the second groove of the substrate, the filling of the second groove with water-absorbing material to form a water-absorbing layer, and the coating of the second groove with thermally conductive adhesive to form a thermally conductive adhesive layer can be performed in any order, and the present invention does not specifically limit this.

[0203] This embodiment uses a stamping process to form a first protrusion on the upper surface of the substrate and a first groove on the lower surface of the substrate, and / or uses an etching process to form a second groove on the upper surface of the substrate. This greatly increases the bonding area between the enclosure and the substrate, thus enhancing the bonding force between the substrate and the enclosure. This improves the reliability and durability of the LED bracket and the LED made using the LED bracket, making the LED more suitable for various application scenarios, especially high-temperature applications. At the same time, the stronger bonding force between the substrate and the enclosure also improves the airtightness of the LED to a certain extent, which is more conducive to the widespread use of LEDs.

[0204] Example 5:

[0205] This embodiment provides an LED, including an LED bracket as shown in Embodiments 1 to 3 above, and at least one LED chip disposed on a substrate, with the pins of the LED chip electrically connected to the substrate. It should be understood that the LED chip in this embodiment can be a flip-chip LED chip or a standard-mount LED chip, and the method of electrically connecting the LED chip to the substrate includes, but is not limited to, using conductive wires, conductive adhesive, or other forms of conductive materials.

[0206] It should be understood that the color of the light emitted by the LED provided in this embodiment and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light emitted by the LED can be flexibly controlled by, but is not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a light-emitting conversion layer, and the type of light-emitting conversion layer when the LED includes a light-emitting conversion layer.

[0207] In one example of this embodiment, the LED may further include a lens adhesive layer or a diffusion adhesive layer disposed on the LED chip (or on the light-emitting conversion adhesive layer if a light-emitting conversion adhesive layer is disposed on the LED chip).

[0208] It should be understood that, in one example, the light-emitting conversion adhesive layer may be a phosphor adhesive layer containing phosphor, a colloid containing quantum dot photosensitive material, or other light-emitting conversion adhesives or films that can realize light-emitting conversion, and may also include diffusion powder or silicon powder as needed; the methods for forming the light-emitting conversion adhesive layer, lens adhesive layer or diffusion adhesive layer on the LED chip in this embodiment include, but are not limited to, dispensing, molding, spraying, pasting, etc.

[0209] For example, the light-emitting conversion layer may include a phosphor adhesive layer, a fluorescent film, or a quantum dot (QD) film; the phosphor adhesive layer and the fluorescent film may be made of inorganic phosphors, which may be inorganic phosphors doped with rare earth elements, wherein the inorganic phosphors include, but are not limited to, at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors.

[0210] For example, quantum dot QD films can be made using quantum dot phosphors; quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, and CsPbI3.

[0211] In this embodiment, the light emitted by the LED chip itself can be visible light or invisible ultraviolet or infrared light. When the light emitted by the LED chip is invisible ultraviolet or infrared light, a light-emitting conversion layer can be provided on the LED chip to convert the invisible light into visible light, so that the light emitted by the LED is visible to the user. For example, when the light emitted by the LED chip is ultraviolet light, if the LED is to present white light visible to the user, the light-emitting conversion layer can be made by mixing red, green, and blue phosphors.

[0212] This embodiment also provides a light-emitting device, which includes the LED exemplified in the above embodiments. The light-emitting device in this embodiment can be an illumination device, a light signal indicator device, a supplementary light device, or a backlight device, etc. When used as a lighting device, it can specifically refer to lighting devices applied in various fields, such as table lamps, fluorescent lamps, ceiling lights, downlights, streetlights, and spotlights in daily life; high beams, low beams, and ambient lights in automobiles; surgical lights, low electromagnetic lamps, and lighting for various medical instruments in the medical field; and various colored lights, landscape lights, and advertising lights in the decorative lighting field. When used as a light signal indicator device, it can specifically refer to light signal indicator devices applied in various fields, such as traffic signal indicator lights, various signal status indicator lights on communication equipment in the communication field, and various indicator lights on vehicles. When used as a supplementary lighting device, it can refer to supplementary lighting in the photography field, such as flashlights and supplementary lights, or plant supplementary lighting for plants in the agricultural field. When used as a backlight device, it can refer to backlight modules applied in various backlight fields, such as those used in monitors, televisions, mobile terminals such as mobile phones, and advertising machines.

[0213] It should be understood that the above applications are merely a few examples of applications exemplified in this embodiment, and that the applications of LEDs are not limited to the few fields exemplified above.

[0214] The above description, in conjunction with specific implementation methods, provides a further detailed explanation of the embodiments of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A high-reliability LED bracket, characterized in that, The high-reliability LED bracket includes a substrate and a wall that encloses the substrate. A first protrusion is provided on the upper surface of the substrate in a region that is in close contact with the wall body. The first protrusion is provided on at least two sides of the upper surface of the substrate and extends along one side of the upper surface of the substrate to at least the other side. A first groove, corresponding to the first protrusion, is provided on the lower surface of the substrate in a region that is in close contact with the wall body. The first protrusion and the first groove are formed by stamping the substrate, and the shape and size of the first groove are adapted to the shape and size of the first protrusion. A second groove is also provided on the upper surface of the substrate in the area that is in close contact with the wall body. The first protrusion is disposed adjacent to the second groove, or the first protrusion is disposed separately from the second groove. The substrate includes a first substrate, a second substrate, and an insulating strip that isolates the first substrate from the second substrate; The upper surfaces of the first substrate and the second substrate have functional areas, and at least one of the first substrate and the second substrate has a reflective layer disposed in the functional area.

2. The high-reliability LED bracket as described in claim 1, characterized in that, A first protrusion is provided on the upper surface of the first substrate in a region that is in close contact with the wall body, and a first groove corresponding to the first protrusion and recessed into the upper surface of the first substrate is provided on the lower surface of the first substrate in a region that is in close contact with the wall body. And / or, A first protrusion is provided on the upper surface of the second substrate in a region that is in close contact with the wall body, and a first groove corresponding to the first protrusion and recessed into the upper surface of the second substrate is provided on the lower surface of the second substrate in a region that is in close contact with the wall body.

3. The high-reliability LED bracket as described in claim 1 or 2, characterized in that, The second groove is disposed on at least two sides of the upper surface of the substrate and extends along one side of the upper surface of the substrate to at least the other side; Alternatively, the second groove may be disposed on one side of the upper surface of the substrate.

4. The high-reliability LED bracket as described in claim 1 or 2, characterized in that, The first protrusion is a curved protrusion or a straight protrusion, and the first groove and the second groove are curved grooves or straight grooves.

5. The high-reliability LED bracket as described in claim 1 or 2, characterized in that, Part or all of the outer wall of the first protrusion is a roughened layer formed after roughening treatment; And / or, part or all of the inner wall of the first groove is a roughened layer formed after roughening treatment; And / or, part or all of the inner wall of the second groove is a roughened layer formed after roughening treatment.

6. The high-reliability LED bracket as described in claim 5, characterized in that, The roughening layer is a curved roughening layer; Alternatively, a linear coarsening layer.

7. The high-reliability LED bracket as described in claim 1 or 2, characterized in that, The second groove is provided with an absorbent layer.

8. An LED, characterized in that, It includes a high-reliability LED bracket as described in any one of claims 1-7 and at least one LED chip, wherein the LED chip is disposed on the substrate and the LED chip is electrically connected to the substrate.

9. A light-emitting device, characterized in that, Includes the LED as described in claim 8, wherein the light-emitting device is an illumination device, a light signal indicator device, a supplementary light device, or a backlight device.

10. A method for manufacturing a high-reliability LED bracket, characterized in that, The high-reliability LED bracket includes a substrate and a wall that encloses the substrate. The method for manufacturing the high-reliability LED bracket includes: Step S2: A stamping process is performed along the lower surface of the substrate toward the upper surface of the substrate, forming a first protrusion on at least two sides of the area on the upper surface of the substrate that is in close contact with the wall body. The first protrusion extends along one side of the upper surface of the substrate to at least the other side, and a first groove corresponding to the first protrusion is formed on the lower surface of the substrate and recessed toward the upper surface of the substrate. Step S3: Etch the adjacent area of ​​the first protrusion on the upper surface of the substrate to form a second groove, or etch the non-adjacent area of ​​the first protrusion on the upper surface of the substrate to form a second groove; Step S6: Inject or mold plastic material around the substrate to form the enclosure.

11. The method for manufacturing a high-reliability LED bracket as described in claim 10, characterized in that, In step S2, the substrate includes a first substrate and a second substrate; The first substrate is stamped to form first protrusions on at least two sides of the upper surface of the first substrate, and to form a first groove corresponding to the first protrusions and recessed into the upper surface of the first substrate on the lower surface of the first substrate. And / or, The second substrate is stamped to form first protrusions on at least two sides of the upper surface of the second substrate, and to form a first groove corresponding to the first protrusions and recessed into the upper surface of the second substrate on the lower surface of the second substrate.

12. The method for manufacturing a high-reliability LED bracket as described in claim 10 or 11, characterized in that, After step S3 and before step S6, step S4 is also included: Roughening is performed on part or all of the outer wall of the first protrusion; and / or, roughening is performed on part or all of the inner wall of the first groove. And / or, roughen part or all of the inner wall of the second groove.

13. The method for manufacturing a high-reliability LED bracket as described in claim 10 or 11, characterized in that, After step S3 and before step S6, step S5 is also included: The second groove is filled with absorbent material to form an absorbent layer.

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