A high power density heat source device and its manufacturing method

Abstract

The present invention discloses a high-power density heat source device and a manufacturing method thereof. The device mainly includes a functional tube core, a frame shell, internal bonding gold wires, and an interconnect input terminal. The functional tube core adopts a serpentine equal column decreasing array structure to achieve uniform heat distribution and improve the power density of the heat source. The frame shell adopts an embedded structure, so that the functional tube core is directly embedded in the bottom of the frame shell and can directly contact the heat sink or radiator, reducing the internal thermal resistance of the high-power density heat source. The internal bonding gold wire realizes circuit input to the functional tube core. The interconnect input terminal adopts a bonding substrate and a vertical plug-in copper tube structure to realize power input to the high-power density heat source device. The above structural design realizes the device's high power density, low device thermal resistance, and convenient application characteristics, effectively meeting the demand for high-power density devices in the field of device thermal management development.

Description

Technical Field

[0001] The present invention belongs to the field of thermal management of microelectronic power devices, in particular to a high power density heat source device and a manufacturing method thereof. Background Art

[0002] As microelectronic devices progress toward miniaturization, multifunctionality, and high power, thermal effects have become a major constraint on their performance and reliability. This is primarily because high-power devices generate significant amounts of heat during operation. Miniaturization leads to significant heat accumulation, causing a sharp increase in device junction temperature, leading to degradation of device electrical performance and a significant decrease in reliability, such as device lifespan. Thermal management has become a hot topic in current research on microelectronic power devices.

[0003] All types of thermal management technology development require testing and verification of heat dissipation capabilities. Currently, conventional microelectronic devices are difficult to meet the heat dissipation verification requirements of various heat pipe development technologies due to complex power-up pathways, difficult integration, and poor economic efficiency. Therefore, exploring convenient, economical, and high-power heat source devices to address the microelectronics field's need for heat dissipation technology verification is of great significance for promoting thermal management technology development and shortening R&D cycles, and has become one of the most important products in the current thermal management field. Summary of the Invention

[0004] The object of the present invention is to provide a high power density heat source device and a manufacturing method thereof.

[0005] The technical solution for achieving the purpose of the present invention is as follows: a high power density heat source device, comprising a functional tube core, a frame shell, internal bonding wires and an interconnection input terminal;

[0006] The frame shell adopts an embedded structure, and the functional tube core is embedded in the bottom of the frame shell, directly contacting the external heat dissipation device for heat transfer; the internal bonding gold wire is used to connect the interconnection input end and the electrode on the functional tube core to realize circuit input to the functional tube core; the interconnection input end adopts a bonding substrate and a vertical plug-in copper tube structure to realize power input to the high power density heat source device.

[0007] Furthermore, the electrodes of the functional tube core adopt a serpentine equal column decreasing array structure.

[0008] Furthermore, the electrode width is between 10um and 200um, and the thickness is between 1um and 8um.

[0009] Furthermore, the functional core material is any one of SiC and diamond material, and the thickness is 80um-500um.

[0010] Furthermore, the frame shell material is made of aluminum nitride ceramic material.

[0011] Furthermore, the frame housing needs to ensure that the electrodes of the functional tube core are in an exposed state.

[0012] Furthermore, the internal bonding gold wires are arranged in an array with equal spacing.

[0013] Furthermore, the interconnect input terminal is made of copper.

[0014] The present invention also provides a method for manufacturing a high-power density heat source device, comprising: integrating the frame shell and the interconnect input end using silver-copper solder; integrating the functional tube core and the frame shell using gold-tin solder; and using a universal bonding machine to realize internal bonding of gold wires to complete the preparation of the high-power density heat source device.

[0015] Furthermore, the functional die is designed with an electrode PAD area and a PAD area integrated with the shell; the frame shell is designed with a PAD area integrated with the functional die and a PAD area integrated with the bonding substrate; the bonding substrate of the interconnect input end is designed with a PAD area, the length of which is the same as the length of the electrode PAD area of ​​the functional die

[0016] Compared with the prior art, the present invention has the following significant advantages: (1) The present invention adopts a serpentine equal column decreasing array structure to realize the preparation of functional tube core electrodes, which has the characteristics of more uniform heat distribution and improves the power density of the heat source; (2) The frame shell adopts an embedded structure, so that the functional tube core is directly embedded in the bottom of the frame shell, reducing the internal thermal resistance of the high power density heat source; (3) The present invention designs the interconnection input end of the plug-in copper tube to realize the convenient application of high power density heat source devices; the above structural design realizes that the device can achieve the characteristics of high power density, low device thermal resistance and convenient application, and effectively meets the demand for high power density devices in the field of device thermal management development. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of a high power density heat source device of the present invention.

[0018] Figure 2 Schematic diagram of functional electrode structure design.

[0019] Figure 3 Schematic diagram of the frame shell structure. DETAILED DESCRIPTION

[0020] The specific implementation of the present invention is further described in detail below with reference to the accompanying drawings and examples.

[0021] Combine Figure 1A high-power density heat source device primarily comprises a functional die 1, a frame housing 2, internal bonding wires 3, and an interconnect input terminal 4. The functional die 1 is used to generate high-power heat dissipation, the frame housing 2 provides mechanical structural support, the internal bonding wires 3 connect the device's internal circuits, and the interconnect input terminal 4 enables power input to the high-power density heat source device. The aforementioned structural design enables the device to achieve high power density, low device thermal resistance, and convenient application. This effectively meets the demand for high-power density devices in the field of device thermal management development.

[0022] Combine Figure 2 , the functional tube core can be made of SiC or diamond high thermal conductivity materials. Its thickness is controlled at 80um-500um, which is determined by the matching strength; the electrode A on its tube core adopts a serpentine equal column decreasing array structure, with the central electrode and the electrode width (50um-200um) as the benchmark, and the width decreases by 2-5% on both sides to achieve uniformity of heat distribution. The width of the electrode itself is between 10um-200um, and the thickness is between 1um-8um, which is determined by the heat flux density. At the same time, the electrode PAD area B and the integrated PAD area C with the shell are designed. The width of the electrode PAD area B is more than 150um, which is convenient for gold wire bonding. The integrated PAD area of ​​the shell is located at the edge and has a width of more than 200um to ensure the integration strength with the frame shell. The PAD area described in the present invention is also called the metallization area.

[0023] Combine Figure 3 , the frame shell is made of high thermal conductivity ceramic materials such as aluminum nitride. The structural design is an embedded structure A, so that the functional tube core can be directly embedded in the bottom of the frame shell, directly contacting and transferring heat with the external heat dissipation device, and the frame shell must ensure that the electrodes of the functional tube core are in an exposed state, which is convenient for device temperature distribution testing. The frame shell is designed with a PAD area B integrated with the functional tube core. The two are only interconnected in the PAD area, and other areas are not in contact, to ensure that the heat flux density of the heat source is not transferred to both sides. The frame shell is designed with a PAD area C integrated with the bonding substrate to ensure integration with the interconnection input terminal. The frame shell design contains a mechanical hole D to achieve direct interconnection with an external radiator.

[0024] Combine Figure 1 and 2 The internal bonding wire structure on each side is arranged in an array with equal spacing to ensure the uniformity of the current. The diameter and number of gold wires are determined according to the rated current set by the device. A general bonding machine is used to realize the interconnection between the functional tube core and the bonding substrate to complete the internal circuit connection of the high power density heat source.

[0025] Combine Figure 1 and 3The interconnect input end uses copper-based materials and is designed as a bonding substrate and a vertical plug-in copper tube structure. The bonding substrate contains a PAD area, where the size of the PAD area is consistent with the electrode PAD area of ​​the functional tube core, that is, the length of the gold wire is the same, and the current is evenly distributed; the vertical plug-in copper tube structure is perpendicular to the bonding substrate and can directly connect to the plug-in external lead to realize power input to the high-power density heat source device.

[0026] The method for preparing the high-power density heat source device is as follows: first, the frame shell and the interconnect input end are integrated using high-temperature silver-copper solder, then the functional tube core and the frame shell are integrated using gold-tin solder, and finally a universal bonding machine is used to realize internal bonding of gold wires to complete a high-power density heat source device.

[0027] The present invention is described in detail below with reference to the embodiments.

[0028] Example

[0029] A structural design and manufacturing method of a high power density heat source device, specifically comprising:

[0030] Functional die structure design: The die is made of SiC material with a thickness of 350μm. The electrode width on the die is designed to be 200μm, with a 200μm spacing between electrodes in the center. The electrode spacing adopts a serpentine array structure with a 2.5% decrease in width toward the sides, totaling 20 rows. The total electrode length is 180mm, and the electrode thickness is between 4μm, ensuring uniform heat distribution. The electrode pad area is 350μm wide and 9mm long to facilitate gold wire bonding. The pad area for integration with the frame is located at the edge, with a width of 300μm and a length of 10mm to ensure integration strength with the frame.

[0031] Frame housing design: The frame housing is made of aluminum nitride with a total thickness of 1.5mm. The embedded structure is designed based on the functional die size, with the embedded area 20µm thicker than the functional die to ensure solder layer thickness. The dimensions of the PAD area integrated with the functional die and the PAD area integrated with the housing on the functional die are consistent. The PAD area integrated with the bonding substrate of the frame housing is consistent with the bonding substrate of the interconnect input terminal to ensure integration with the interconnect input terminal. The frame housing is designed with a mechanical hole with a size of 2mm*6mm to enable direct connection to the external heat sink.

[0032] The internal bonding wire structure is designed to be arranged in an array with equal spacing. Twenty 50µm diameter gold wires are evenly spaced along the length of the electrode PAD area. A universal bonding machine is used to interconnect the functional die and the bonding substrate, completing the internal circuit connection of the high-power density heat source.

[0033] Interconnect input: Made of copper-based material with gold plating throughout. The PAD area on the bonding substrate matches the electrode PAD area on the functional die, ensuring even current distribution. The vertical pluggable copper tube structure, perpendicular to the bonding substrate, has a 1mm diameter and 0.5mm wall thickness, ensuring strength and rated current. It connects directly to pluggable external leads to enable power input to high-power-density heat source devices.

[0034] The above specific implementation methods and examples are specific support for the technical ideas of the structural design and manufacturing method of a high-power density heat source device proposed in the present invention, and cannot be used to limit the scope of protection of the present invention. Any equivalent changes or equivalent modifications made on the basis of this technical solution in accordance with the technical ideas proposed in the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A high power density heat source device, characterized in that it comprises a functional tube core (1), a frame shell (2), an internal bonding wire (3) and an interconnection input terminal (4); The frame shell (2) adopts an embedded structure, and the functional tube core (1) is embedded in the bottom of the frame shell and directly contacts the external heat dissipation device for heat transfer; the internal bonding wire (3) is used to connect the interconnection input end (4) and the electrode on the functional tube core (1) to realize the circuit input of the functional tube core (1); the interconnection input end (4) adopts a bonding substrate and a vertical plug-in copper tube structure to realize the power input of the high power density heat source device; the material of the functional tube core (1) is any one of SiC and diamond materials, and the thickness is 80um-500um; the electrodes of the functional tube core (1) adopt a serpentine equal column decreasing array structure, with the center electrode and the electrode width as the reference, and the width decreases by 2-5% to both sides; the electrode width The width of the functional tube core (1) is between 10um and 200um, and the thickness is between 1um and 8um; the functional tube core (1) is designed with an electrode PAD area and a PAD area integrated with the shell, the width of the electrode PAD area is more than 150um, and the integrated PAD area of ​​the shell is located at the edge and has a width of more than 200um; the frame shell is designed with a PAD area integrated with the functional tube core and a PAD area integrated with the bonding substrate; the bonding substrate of the interconnect input end is designed with a PAD area, the length of which is the same as the length of the electrode PAD area of ​​the functional tube core; the frame shell (2) is made of aluminum nitride ceramic material, and the frame shell (2) needs to ensure that the electrodes of the functional tube core (1) are in a bare state; the internal bonding wires (3) are arranged in an array with equal spacing.

2. The high power density heat source device according to claim 1, characterized in that: The interconnection input end (4) is made of copper.

3. A method for manufacturing a high power density heat source device according to any one of claims 1 to 2, characterized in that: include: The frame shell and the interconnect input end are integrated using silver-copper solder; the functional tube core and the frame shell are integrated using gold-tin solder; a universal bonding machine is used to realize internal bonding of gold wires to complete the preparation of the high-power density heat source device; the functional tube core is designed with an electrode PAD area and a PAD area integrated with the shell; the frame shell is designed with a PAD area integrated with the functional tube core and a PAD area integrated with the bonding substrate; a PAD area is designed on the bonding substrate of the interconnect input end, and its length is the same as the length of the electrode PAD area of ​​the functional tube core.

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