High-density integrated power control assembly with shared cooling system with electric motor

Abstract

A integrated power control assembly mounted on an axial end of a three-phase motor includes a base plate, two input bus bars each having positive and negative polarity alternately spaced on the base plate, a plurality of sets of paired devices, and three output bus bars corresponding to three phases of the motor, wherein a set of paired devices includes a switching semiconductor and a diode. An inner input bus bar has edges adjacent to an opposite polarity inner input bus bar and an opposite polarity outer input bus bar and is configured to have at least twice as many devices as the outer input bus bar. One or more sets of paired devices are disposed axially along the edges on the outer input bus bar and on the inner input bus bar. Separate output bus bars are disposed on and electrically connected to the one or more sets of paired devices disposed on the adjacent input bus bars of opposite polarity.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 911,719, filed October 7, 2019, entitled “High Density Integrated PowerModules With Cooling,” which is incorporated herein by reference in its entirety. Technical Field

[0003] This specification generally relates to power control components for electric motors in vehicles, and more specifically, to high-density integrated power control components for electrified vehicles having a shared cooling system with the electric motor. Background Technology

[0004] Conventional electric motor drive systems in electrified vehicles (e.g., hybrid electric vehicles, plug-in hybrid electric vehicles, fuel cell vehicles, and electric vehicles) consist of three parts—the electric motor, the power control unit (PCU), and high-voltage cables. In this type of system, the electric motor and its corresponding PCU are designed and installed separately. However, the power density is limited due to the presence of cables and separate housings. Interconnecting cables introduce additional power losses, weight, and volume, reducing system efficiency. The cooling system is designed separately for the electric motor and PCU, increasing the complexity of the cooling system.

[0005] Furthermore, because power control components (e.g., inverter circuits) are designed to operate at increased power levels and current densities, they generate high heat flux. This means that the printed circuit boards (PCBs) within the power control components and the active and passive components mounted on them must be able to withstand higher temperatures and thermal stresses. Conventional heat sinks may not remove enough heat to effectively reduce the operating temperature of the power control components to acceptable levels. Additionally, conventional heat sinks and cooling structures may require additional bonding layers and thermal matching materials (e.g., bonding layers, substrates, thermal interface materials). These additional layers and other factors increase the package size and considerable thermal resistance of the power control components, making their thermal management challenging.

[0006] Therefore, it is desirable to have a high-density integrated power control component that is configured to effectively remove high heat flux from it. Summary of the Invention

[0007] This specification relates to a high-density integrated power control assembly in electrified vehicles having a shared cooling system with an electric motor. In one embodiment, an integrated power control assembly is disclosed, configured as an inverter for a three-phase electric motor. The integrated power control assembly is directly mounted on the axial end of the electric motor. The integrated power control assembly includes a substrate, four input buses laterally spaced on the substrate, multiple sets of paired devices, and three output buses corresponding to the three phases of the electric motor, wherein one set of paired devices includes switching semiconductors and diodes. The four input buses include two positive input buses and two negative input buses arranged alternately. Internal input buses of opposite polarity are arranged between external input buses of opposite polarity. The internal input buses have edges adjacent to the internal input buses of opposite polarity and edges adjacent to the external input buses of opposite polarity. The internal input buses are configured to have at least twice as many devices as those arranged on the external input buses. One or more sets of paired devices are axially arranged along the edge adjacent to the outer input bus of opposite polarity and along the edge adjacent to the outer input bus of opposite polarity on a separate outer input bus and a separate inner input bus. A separate output bus is arranged on and electrically coupled to the one or more sets of paired devices, which are arranged on adjacent input buses of opposite polarity.

[0008] In another embodiment, a motor assembly is disclosed, including a three-phase motor, an integrated power control assembly configured as an inverter for the three-phase motor, and a shared cooling system thermally connecting the three-phase motor and the integrated power control assembly. The integrated power control assembly is directly mounted on the axial end of the motor. The integrated power control assembly includes a substrate, four input buses laterally spaced on the substrate, multiple sets of paired devices, and three output buses corresponding to the three phases of the motor, wherein one set of paired devices includes a switching semiconductor and a diode. The four input buses include two positive input buses and two negative input buses arranged alternately. Internal input buses of opposite polarity are arranged between external input buses of opposite polarity. The internal input buses have edges adjacent to the internal input buses of opposite polarity and edges adjacent to the external input buses of opposite polarity. The internal input buses are configured to have at least twice as many devices as those arranged on the external input buses. One or more sets of paired devices are axially arranged along the edge adjacent to the outer input bus of opposite polarity and along the edge adjacent to the outer input bus of opposite polarity on a separate outer input bus and a separate inner input bus. A separate output bus is arranged on and electrically coupled to the one or more sets of paired devices, which are arranged on adjacent input buses of opposite polarity.

[0009] These and additional features provided by the embodiments described herein will be more fully understood in conjunction with the accompanying drawings and the following detailed description. Attached Figure Description

[0010] The embodiments illustrated in the accompanying drawings are illustrative and exemplary in nature and are not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments will be understood when read in conjunction with the accompanying drawings, wherein the same structures are indicated by the same reference numerals, and wherein:

[0011] Figure 1 A perspective top view of an example integrated power control component according to one or more embodiments shown and described herein is shown;

[0012] Figure 2 One or more embodiments according to the examples shown and described herein are illustrated. Figure 1 An example of a perspective bottom view of an integrated power control component;

[0013] Figure 3 One or more embodiments shown and described herein are illustrated. Figure 1 A circuit diagram of the motor assembly of the first embodiment of the example integrated power control component;

[0014] Figure 4 One or more embodiments shown and described herein are illustrated. Figure 1 A circuit diagram of the motor assembly of a second embodiment of the example integrated power control component;

[0015] Figure 5A The illustrations schematically depict one or more embodiments according to those shown and described herein. Figure 1 A top view of the first embodiment of the example integrated power control component without an output connection;

[0016] Figure 5B The illustrations schematically depict one or more embodiments according to those shown and described herein. Figure 1 A top view of a first embodiment of an example integrated power control component having an output connection;

[0017] Figure 6A The illustrations schematically depict one or more embodiments according to those shown and described herein. Figure 1 A top view of a second embodiment of an example integrated power control component without an output connection;

[0018] Figure 6B The illustrations schematically depict one or more embodiments according to those shown and described herein. Figure 1 A top view showing the output connection of a second embodiment of an example integrated power control component;

[0019] Figure 7A The following are illustrated according to one or more embodiments shown and described herein. Figure 5B A side cross-sectional view of the cross-sectional axis AA of the first embodiment of the example integrated power control component;

[0020] Figure 7B The following are illustrated according to one or more embodiments shown and described herein. Figure 5B A side cross-sectional view of the cross-sectional axis BB of a first embodiment of an example integrated power control component;

[0021] Figure 8A The following are illustrated according to one or more embodiments shown and described herein. Figure 6B A side cross-sectional view of the cross-sectional axis A'-A' of a second embodiment of an example integrated power control component;

[0022] Figure 8B The following are illustrated according to one or more embodiments shown and described herein. Figure 6B A side cross-sectional view of the cross-sectional axis B'-B' of a second embodiment of an example integrated power control component;

[0023] Figure 9A The diagram schematically illustrates an electric motor assembly having a shared liquid-cooled cooling system according to one or more embodiments shown and described herein, the shared liquid-cooled cooling system being thermally connected. Figure 1 An example of an integrated power control component and the electric motor therein;

[0024] Figure 9B The diagram schematically illustrates an electric motor assembly having a shared air-cooled cooling system according to one or more embodiments shown and described herein, the shared air-cooled cooling system being thermally connected. Figure 1 An example of an integrated power control component and the motor therein; and

[0025] Figure 10 A schematic illustration shows one or more embodiments according to those shown and described herein. Figure 1 An example electric vehicle with an integrated power control component. Detailed Implementation

[0026] The various embodiments described herein pertain to high-density integrated power control components in electrified vehicles that share a cooling system with the electric motor. The integrated power control component is configured as an inverter directly mounted on the axial end of the electric motor and shares the cooling system with it. The integrated power control component includes two input buses, each having alternating positive and negative polarities spaced apart on a substrate, wherein each individual input bus has multiple sets of paired devices disposed thereon. Each set of paired devices includes switching semiconductor devices and diodes. Three output buses corresponding to the three phases of the electric motor are disposed above and electrically coupled to the multiple sets of paired devices. Direct current (DC) signals received through the input buses are converted into alternating current (AC) signals by the multiple sets of paired devices and output through the output buses. The use and configuration of the input and output buses in the integrated power control component results in a compact, leadless bonded package that reduces power losses, voltage spikes, and gate loop inductance, while also helping to dissipate heat generated during device operation. In some embodiments, switching semiconductor devices and diodes on adjacent input buses of opposite polarities are aligned in vertically opposite directions (i.e., physically flipped in orientation), which further increases package density and reduces package size. Finally, the use of a shared cooling system between the integrated power control components and the motor eliminates the need for a separate cooling system for the integrated power control components. Various other aspects of this disclosure and their variations are illustrated or implied by the following description of embodiments.

[0027] Refer to the attached diagram. Figure 1-2 A perspective top view and perspective bottom view of an example integrated power control component 100 configured for use with a three-phase motor 320 are shown. Figure 3-4 The inverter shown in 9A-9B). However, in different embodiments, the example integrated power control component 100 can be configured as an inverter for motors with two or more phases without departing from the principles and scope of this disclosure. Figure 1-2 In the non-limiting example shown, the integrated power control component 100 is configured as a three-phase (U, V, W) inverter that uses pulse width modulation (PWM) for the motor 320 to convert the DC voltage into three equal-amplitude sinusoidal AC waves in three different phases U, V, and W, respectively. In some embodiments, where the motor 320 has more than three phases, the integrated power control component 100 is configured to generate additional or alternative AC output(s) for redundancy.

[0028] The integrated power control assembly 100 includes a cylindrical annular metal housing 110 having a bottom surface 112 and sidewalls 116. A substrate 120 having four laterally spaced input buses 140a, 140b, 140c, and 140d thereon is received within the housing 110 along the sidewalls 116 through arcuate openings 114. The four input buses 140a, 140b, 140c, and 140d are configured to have three capacitors 160a, 160b, and 160c, and multiple devices disposed across them. Although in Figure 1 In a non-limiting embodiment, three capacitors 160a, 160b, and 160c are used, but in other embodiments, one, two, or more capacitors with equivalent capacitance may be present. Three output buses 150a, 150b, and 150c are electrically coupled to four input buses 140a, 140b, 140c, and 140d and devices disposed thereon. The three output buses 150a, 150b, and 150c are received outside the housing 110 through three rectangular openings 115a, 115b, and 115c, respectively. The three rectangular openings 115a, 115b, and 115c are located at opposite ends of the sidewall 116. A printed circuit board (PCB) 170 is bonded (e.g., using solder balls) over and across the three output buses 150a, 150b, and 150c and the three capacitors 160a, 160b, and 160c within the housing 110.

[0029] The substrate 120 includes a thermal interface layer 730, a heat dissipation layer 720 disposed on the thermal interface layer 730, and an electrical isolation layer 710, such as Figures 7A-7B As shown in 8A-8B. The thermal interface layer 730 is formed of a thermal interface material (TIM), such as, but not limited to, silicon for enhanced thermal bonding. The heat dissipation layer 720 is formed of a conductive material, such as, but not limited to, copper, aluminum, nickel, etc. The electrical isolation layer 710 is formed of an electrical isolation material, such as, but not limited to, aluminum nitride.

[0030] The four input buses 140a, 140b, 140c, and 140d, and the three output buses 150a, 150b, and 150c, are formed of a conductive material, such as, but not limited to, copper, aluminum, and nickel. In some embodiments, the PCB 170 may be made of a flame-retardant composite material formed of glass fiber reinforced epoxy resin, such as, but not limited to, FR-4. In other embodiments, the PCB 170 may be made of a ceramic material capable of withstanding temperatures exceeding 250°C, such as, but not limited to, low-temperature co-fired ceramic (LTCC) materials or alumina.

[0031] Figure 3 A circuit diagram of a motor assembly 300 with an example integrated power control component 310 according to a first embodiment is shown, while Figures 5A-5B The corresponding top view is schematically shown, with and without output connections. Therefore, Figure 5A A top view of the integrated power control assembly 310 without the three output buses 150a, 150b, 150c and PCB 170 is shown. Figure 5B An integrated power control assembly 310 is shown with three output buses 150a, 150b, and 150c arranged thereon, but still without a PCB 170. Figures 7A-7B The first embodiment of the example integrated power control component 310 is shown. Figure 5B The side section view of the cross-section axes AA and BB in the figure. Figures 7A-7B Additionally, it is shown how the PCB 170 in the integrated power control assembly 310 is positioned above the three output buses 150a, 150b, and 150c.

[0032] like Figure 3 As shown, the integrated power control component 310 is electrically connected between the battery 350 and the motor 320 having a U-phase AC input 322, a V-phase AC input 324, and a W-phase AC input 326. In this first embodiment, the integrated power control component 310 includes multiple sets of paired devices 330a, 330b, ..., 330n—each set having switching semiconductor devices (e.g., Q1, Q2, etc.) electrically connected to diodes (e.g., D1, D2, etc.)—receiving DC input from the battery 350 and providing AC output to the motor 320, wherein the switching semiconductor devices and diodes in the first set of paired devices are laterally adjacent to the diodes and switching semiconductor devices in the second set of paired devices, and the second set of paired devices is laterally adjacent to the first set of paired devices. For example, diode D1 of the first set 330a is laterally adjacent to switching semiconductor device Q2 of the second set 330b, and switching semiconductor device Q1 of the first set 330a is laterally adjacent to diode D2 of the second set 330b, wherein 330a and 330b are laterally adjacent sets of paired devices.

[0033] Furthermore, the DC input current flowing into individual paired device groups 330a, 330b, ..., 330n flows through either of the two positive terminals 340b, 340d electrically connected to the positive terminal 352 of the battery 350, or either of the two negative terminals 340a, 340c electrically connected to the negative terminal 354 of the battery 350. For example, the first group 330a receives DC input current from the battery through the negative terminal 340a, while the second group 330b receives DC input current from the battery through the positive terminal 340b. Finally, the AC output current flowing out from adjacent paired device groups 330a, 330b, ..., 330n is combined to be delivered to the U-phase AC input 322, V-phase AC input 324, or W-phase AC input 326. For example, the AC output current from the first group 330a and the second group 330b is combined to be delivered to the U-phase AC input 322.

[0034] Figure 3 Also shown are capacitors 160a, 160b, 160c electrically coupled between the battery 350 and the DC input current flowing into the individual pairs of devices 330a, 330b, ..., 330n. For example, capacitor 160a is electrically coupled between the battery 350 and the DC input current flowing into the first group 330a and the second group 330b. Capacitors 160a, 160b, 160c are operable to smooth and balance any voltage oscillations from the DC input current from the battery 350, such that the switching semiconductor devices Q1, Q2, etc., in the pairs of devices 330a, 330b, ..., 330n operate optimally to produce an AC output. As described above, in different embodiments, there may be one, two, or more than three capacitors performing the same function as the three capacitors 160a, 160b, 160c.

[0035] like Figures 5A-5B As shown, paired device groups 330a, 330b, ..., 330n are disposed on four input buses 140a, 140b, 140c, and 140d. The four input buses 140a, 140b, 140c, and 140d include two positive input buses 140b and 140d alternately arranged on the substrate 120, and two negative input buses 140a and 140c. The two positive input buses 140b and 140d are supplied to the battery 350 via two positive terminals 340b and 340d. Figures 5A-5B The DC connection (not shown) is provided to the battery 350 via two negative input buses 140a and 140c, while the two negative terminals 340a and 340c supply power to the battery 350. Figures 5A-5B DC connection (not shown). Therefore, the internal input bus 140b with positive terminal 340b and the internal input bus 140c with negative terminal 340c are arranged between the external input bus 140a with negative terminal 340a and the external input bus 140d with positive terminal 340d.

[0036] The positive polarity internal input bus 140b has an edge 342b adjacent to the negative polarity external input bus 140a and an edge 344b adjacent to the negative polarity internal input bus 140c. Similarly, the negative polarity internal input bus 140c has an edge 342c adjacent to the positive polarity internal input bus 140b and an edge 344c adjacent to the positive polarity external input bus 140d. Therefore, the separate positive and negative polarity internal input buses 140b and 140c have edges 344b and 342c adjacent to the negative and positive polarity internal input buses 140c and 140b, respectively. Furthermore, the separate positive and negative polarity internal input buses 140b and 140c have edges 342b and 344c adjacent to the negative and positive polarity external input buses 140a and 140d, respectively.

[0037] exist Figures 5A-5B In the non-limiting example shown, one or more pairs of devices 330a, 330b, ..., 330n are axially arranged on separate external input buses 140a, 140d. One or more pairs of devices 330a, 330b, ..., 330n are axially arranged along edges 344b, 342c adjacent to the negative and positive internal input buses 140c, 140b, respectively, on separate positive and negative internal input buses 140b, 140c. Furthermore, one or more pairs of devices 330a, 330b, ..., 330n are axially arranged along edges 342b, 344c adjacent to the negative and positive external input buses 140a, 140d, respectively, on separate positive and negative internal input buses 140b, 140c. Therefore, the internal input buses 140b and 140c are configured to have at least twice as many devices as those disposed on the external input buses 140a and 140d. Figures 5A-5B As shown in the non-limiting embodiments, six sets of paired devices 330a, 330b, ..., 330n, i.e., twelve devices, are arranged on each internal input bus 140B, 140c, while only three sets of paired devices 330a, 330b, ..., 330n, i.e., six devices, are arranged on each external input bus 140a, 140d. Although in Figures 5A-5B In the illustrated embodiment, thirty-six devices—eighteen switching semiconductor devices and eighteen diodes—are disposed on and across the input buses 140a, 140b, 140c, and 140d, but in different embodiments, more or fewer devices may be disposed.

[0038] In some embodiments, switching semiconductor devices Q1, Q2, etc. on adjacent input buses 140a, 140b / 140b, 140c / 140c, 140d with opposite polarities may be aligned in vertically opposite directions (i.e., physically flipped in orientation, such that the gates G(Q1), G(Q2), etc. of the corresponding switching semiconductor devices Q1, Q2, etc. are located on opposite surfaces of the corresponding switching semiconductor devices Q1, Q2, etc.) to reduce package size and increase package density. In other embodiments, diodes D1, D2, etc. on adjacent input buses 140a, 140b / 140b, 140c / 140c, 140d with opposite polarities may additionally or alternatively be aligned in vertically opposite directions (i.e., physically flipped in orientation) to reduce package size and increase package density.

[0039] like Figure 5B As shown, three output buses 150a, 150b, and 150c are arranged across one or more pairs of devices 330a, 330b, ..., 330n spanning four input buses 140a, 140b, 140c, and 140d. Individual output buses 150a / 150b / 150c are electrically coupled to one or more pairs of devices 330a, 330b, ..., 330n arranged across adjacent input buses 140a, 140b / 140b, 140c / 140c, and 140d of opposite polarity. Individual output buses 150a / 150b / 150c provide an AC output connection corresponding to a single phase of the three-phase U, V, and W of the motor 320. Figures 5A-5B (Not shown in the image). Finally, as... Figures 5A-5B As shown, capacitors 160a, 160b, and 160c are configured to span four input buses 140a, 140b, 140c, and 140d, such that individual capacitors 160a / 160b / 160c are configured to span adjacent input buses 140a, 140b / 140b, 140c / 140c, and 140d of opposite polarities.

[0040] When the motor 320 is turned on, the switching semiconductor devices Q1, Q2, etc., allow AC current to flow through the output buses 150a, 150b, 150c to the motor 320. The switching semiconductor devices Q1, Q2, etc., can be one or more semiconductor devices, such as, but not limited to, insulated-gate bipolar transistors (IGBTs), reverse-conduction IGBTs (RC-IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), power MOSFETs, diodes, transistors, and / or combinations thereof (e.g., power cards). In some embodiments, the switching semiconductor devices Q1, Q2, etc., may include wide-bandgap semiconductors and may be formed of any suitable material, such as, but not limited to, silicon carbide (SiC), silicon dioxide (SiO2), aluminum nitride (AlN), gallium nitride (GaN), and boron nitride (BN). In some embodiments, the switching semiconductor devices Q1, Q2, etc., operate at high current and high temperature, for example, exceeding 250°C, and generate a large amount of heat, which must be removed for the continued operation of the example integrated power control component 100. When the motor 320 is off, diodes D1, D2, etc. allow DC current to flow back to the battery 350 through the input buses 140a, 140b, 140c, and 140d.

[0041] Figure 7A It shows along Figure 5B The cross-sectional view of the integrated power control component 310 with cross-sectional axis AA is shown. Cross-sectional axis AA passes through the switching semiconductor devices Q4, Q5, Q6, Q7, Q8, Q9, Q10, Q11, Q20, Q12, Q3, Q4, Q5, Q6, Q7, Q8, Q9, Q12, Q13, Q14, Q14, Q14, Q15, Q16, Q14, Q14 10 Q 16 and diodes D3, D9, D 15 The switching semiconductor device Q4 is mounted on the external input bus 140a, and diode D3 and switching semiconductor device Q4 are also mounted on it. 10 Diode D9 and switching semiconductor device Q are located on the internal input bus 140b. 16 It is set on the internal input bus 140c, and diode D. 15 The switching semiconductor device Q4 and diode D3 are installed on the external input bus 140d. They provide output to the output bus 150a, which is also installed on the external input bus 140d. 10 Diode D9 provides output to the output bus 150b mounted on it. Switching semiconductor device Q 16 and diode D 15 Output is provided to the output bus 150c disposed thereon. In some embodiments, a bonding agent such as, but not limited to, copper bonding paste or solder can be used to bond the switching semiconductor devices Q4, Q5, Q6. 10 Q 16These are connected to the corresponding input buses 140a, 140b, 140c, 140d and output buses 150a, 150b, 150c. PCB 170 is disposed above and spans the three output buses 150a, 150b, 150c. PCB 170 has a plurality of gate driver devices 770 disposed thereon for operatively controlling each switching semiconductor device Q1, Q2, etc., on the integrated power control assembly 310. Figure 7A As shown, three gate driver devices 770(Q4), 770(Q) 10 ) and 770(Q 16 These are mounted on PCB170 and are used to operably control the switching semiconductor devices Q4 and Q5 respectively. 10 Q 16 .

[0042] Corresponding to the switching semiconductor device Q disposed on the positive internal input bus 140b. 10 Gate driver device 770(Q 10 Electrically connected to the switching semiconductor device Q via a first conductive via 790a configured to pass through PCB 170. 10 The switching semiconductor device Q between the output bus 150b and the output bus 150b 10 Gate G(Q) 10 ), to drive the gate drive signal. Gate driver device 770(Q 10 The first conductive via 790a is electrically grounded to the output bus 150b via a second conductive via 790b configured to pass through the PCB 170. In some embodiments, the first conductive via 790a may be disposed between the PCB 170 and the switching semiconductor device Q. 10 Gate G(Q) 10 Conductive pillars between ).

[0043] Corresponding to the switching semiconductor devices Q4 and Q4 installed on the negative polarity input buses 140a and 140c 16 Gate driver devices 770(Q4), 770(Q 16 They are electrically connected to the switching semiconductor devices Q4 and Q5 respectively through L-shaped conductive vias 780a. 16 The switching semiconductor devices Q4 and Q5 between the input buses 140a and 140c 16 Gates G(Q4), G(Q) 16 Passing through PCB 170 and openings 760 (Q4) and 760 (Q) respectively. 16 A separate L-shaped conductive via 780a is provided to replace the bonding wire for driving the gate drive signal. Openings 760 (Q4), 760 (Q) 16The via is shaped to accommodate an L-shaped conductive via 780a, and is formed by cutting holes in the negative input buses 140a and 140c respectively, to expose the switching semiconductor devices Q4 and Q5. 16 The gate terminal. In addition, gate driver devices 770(Q4), 770(Q 16 The third conductive via 780b, which is configured to pass through PCB 170, is electrically grounded to the negative polarity input bus 140a, 140c.

[0044] Figure 7B It shows along Figure 5B The cross-sectional view of the integrated power control assembly 310 with cross-sectional axis BB is shown. Cross-sectional axis BB passes through the switching semiconductor devices Q5, Q6, Q7, Q8, Q9, Q10, Q11, Q20, Q12, Q30, Q40, Q50, Q60, Q70, Q80, Q90, Q12, Q130, Q14 ... 11 Q 17 and diodes D6 and D 12 D 18 Diode D6 is mounted on the external input bus 140a, and the switching semiconductor device Q5 and diode D... 12 The switching semiconductor device Q is located on the internal input bus 140b. 11 and diode D 18 It is installed on the internal input bus 140c, and the switching semiconductor device Q. 17 Diode D6 and switching semiconductor device Q5 are installed on the external input bus 140d. They provide output to the output bus 150a, which is connected thereon. 12 and switching semiconductor devices Q 11 It provides output to the output bus 150b located on it. Diode D 18 and switching semiconductor devices Q 17 It provides output to the output bus 150c installed on it. For example... Figure 7B As shown, three gate driver devices 770(Q5), 770(Q6) 11 ) and 770(Q 17 These are mounted on PCB 170 and are used to operably control the switching semiconductor devices Q5 and Q6 respectively. 11 Q 17 .

[0045] Corresponding to the switching semiconductor devices Q5 and Q6 installed on the positive polarity input buses 140b and 140d. 17 Gate driver devices 770(Q5), 770(Q 17 Electrically connected via a first conductive via 790a passing through PCB 170 to the switching semiconductor devices Q5 and Q6. 17The switching semiconductor devices Q5 and Q2 between the output buses 150b and 150d 17 Gates G(Q5), G(Q 17 ), to drive the gate drive signal. Gate driver devices 770(Q5), 770(Q 17 The second conductive via 790b, configured to pass through PCB 170, is electrically grounded to output buses 150b and 150d. In some embodiments, the first conductive via 790a may be disposed on PCB 170 and the switching semiconductor devices Q5 and Q6. 17 Gates G(Q5), G(Q 17 Conductive pillars between ).

[0046] Corresponding to the switching semiconductor device Q disposed on the negative polarity internal input bus 140c 11 Gate driver device 770(Q 11 ) is electrically connected to the switching semiconductor device Q through the L-shaped conductive via 780a. 11 The switching semiconductor device Q between the internal input bus 140c and the internal input bus 140c 11 Gate G(Q) 11 ). Passing through PCB 170 and opening 760 (Q) respectively. 11 A separate L-shaped conductive via 780a is provided to replace the bonding wire for driving the gate drive signal. Opening 760 (Q) 11 The via is shaped to accommodate an L-shaped conductive via 780a and is formed by cutting a hole in the negative polarity internal input bus 140c to expose the switching semiconductor device Q. 11 The gate terminal. Furthermore, the gate driver device 770(Q 11 The internal input bus 140c is electrically grounded to the negative polarity via a third conductive via 780b that passes through PCB 170.

[0047] exist Figures 7A-7B In a non-limiting example, substrate 120 may be disposed on a cooling device 750 having a plurality of microchannels 755. In different embodiments, substrate 120 may also be thermally connected to a shared liquid-cooled cooling system 950. Figure 9A (as shown) or shared air-cooled cooling system 960 ( Figure 9B (as shown in the image).

[0048] Figure 4 A circuit diagram of a motor assembly 400 with an example integrated power control component 410 according to a second embodiment is shown, while Figures 6A-6B The corresponding top view is schematically shown, with and without output connections. Therefore, Figure 6AA top view of the integrated power control assembly 410 without the three output buses 150a, 150b, 150c and PCB 170 is shown. Figure 6B An integrated power control assembly 410 is shown, which has three output buses 150a, 150b, and 150c, but still no PCB 170. Figures 8A-8B The second embodiment of the example integrated power control component 410 is shown respectively. Figure 6B Side section views of the cross-section axes A'-A' and B'-B' in the diagram. Figures 8A-8B The diagram also shows how PCB 170 is arranged over the three output buses 150a, 150b, and 150c in the integrated power control assembly 410.

[0049] like Figure 4 As shown, the integrated power control component 410 is electrically connected between the battery 350 and the motor 320 having a U-phase AC input 322, a V-phase AC input 324, and a W-phase AC input 326. In this second embodiment, the integrated power control component 410 includes multiple sets of paired devices 430a, 430b, ..., 430n—each set having switching semiconductor devices (e.g., Q1, Q2, etc.) electrically connected to diodes (e.g., D1, D2, etc.)—receiving DC input from the battery 350 and providing AC output to the motor 320, wherein the switching semiconductor devices and diodes in the first set of paired devices are laterally adjacent to the switching semiconductor devices and diodes in the second set of paired devices that are laterally adjacent to the first set of paired devices. For example, diode D1 of the first set 430a is laterally adjacent to diode D2 of the second set 430b, and switching semiconductor device Q1 of the first set 430a is laterally adjacent to switching semiconductor device Q2 of the second set 430b, wherein 430a and 430b are laterally adjacent sets of paired devices.

[0050] Furthermore, the DC input current flowing into individual paired device groups 430a, 430b, ..., 430n flows through either of the two positive terminals 440b, 440d electrically connected to the positive terminal 352 of the battery 350, or either of the two negative terminals 440a, 440c electrically connected to the negative terminal 354 of the battery 350. For example, the first group 430a receives DC input current from the battery 350 through the negative terminal 440a, while the second group 430b receives DC input current from the battery 350 through the positive terminal 440b. Finally, the AC output current flowing out from adjacent paired device groups 430a, 430b, ..., 430n is combined to be delivered to the U-phase AC input 322, V-phase AC input 324, or W-phase AC input 326. For example, the AC output current from the first group 430a and the second group 430b is combined to be delivered to the U-phase AC input 322.

[0051] Figure 4 Also shown are capacitors 160a, 160b, 160c electrically connected between the battery 350 and the DC input current flowing into the individual pairs of devices 430a, 430b, ..., 430n. For example, capacitor 160a is electrically coupled between the battery 350 and the DC input current flowing into the first group 430a and the second group 430b. Capacitors 160a, 160b, 160c are operable to smooth and balance any voltage oscillations from the DC input current from the battery 350, such that the switching semiconductor devices Q1, Q2, etc., in the pairs of devices 430a, 430b, ..., 430n operate optimally to produce an AC output. As described above, in different embodiments, there may be one, two, or more than three capacitors performing the same function as the three capacitors 160a, 160b, 160c.

[0052] like Figures 6A-6B As shown, paired device groups 430a, 430b, ..., 430n are arranged on four input buses: an external input bus 140a with a negative terminal 440a, an internal input bus 140b with a positive terminal 440b, an internal input bus 140c with a negative terminal 440c, and an external input bus 140d with a positive terminal 440d. The four input buses 140a, 140b, 140c, and 140d are connected to... Figures 5A-5B The substrate 120 is arranged in a manner that is basically similar to that described above.

[0053] The positive polarity internal input bus 140b has an edge 442b adjacent to the negative polarity external input bus 140a and an edge 444b adjacent to the negative polarity internal input bus 140c. Similarly, the negative polarity internal input bus 140c has an edge 442c adjacent to the positive polarity internal input bus 140b and an edge 444c adjacent to the positive polarity external input bus 140d. Therefore, the separate positive and negative polarity internal input buses 140b and 140c have edges 444b and 442c adjacent to the negative and positive polarity internal input buses 140c and 140b, respectively. Furthermore, the separate positive and negative polarity internal input buses 140b and 140c have edges 442b and 444c adjacent to the negative and positive polarity external input buses 140a and 140d, respectively.

[0054] exist Figures 6A-6BIn the non-limiting example shown, one or more pairs of devices 430a, 430b, ..., 430n are axially arranged on separate external input buses 140A, 140d. One or more pairs of devices 430a, 430b, ..., 430n are axially arranged along the edges 444b, 442c of the negative and positive internal input buses 140c, 140b, respectively. Furthermore, one or more pairs of devices 430a, 430b, ..., 430n are axially arranged along the edges 442b, 444c of the negative and positive external input buses 140a, 140d, respectively. Therefore, the internal input buses 140b and 140c are configured to have at least twice as many devices as those on the external input buses 140a and 140d. Figures 6A-6B As shown in the non-limiting embodiment, six sets of paired devices 430a, 430b, ..., 430n, i.e., twelve devices, are arranged on each internal input bus 140b, 140c, while only three sets of paired devices 430a, 430b, ..., 430n, i.e., six devices, are arranged on each external input bus 140a, 140d. Although in Figures 6A-6B In the illustrated embodiment, thirty-six devices—eighteen switching semiconductor devices and eighteen diodes—are disposed on and across the input buses 140a, 140b, 140c, and 140d, but in different embodiments, more or fewer devices may be disposed.

[0055] In some embodiments, switching semiconductor devices Q1, Q2, etc. on adjacent input buses 140a, 140b / 140b, 140c / 140c, 140d with opposite polarities can be aligned in vertically opposite directions (i.e., physically flipped in orientation, such that the gates G(Q1), G(Q2), etc. of the corresponding switching semiconductor devices Q1, Q2, etc. are located on opposite surfaces of the corresponding switching semiconductor devices Q1, Q2, etc.) to reduce package size and increase package density. In other embodiments, diodes D1, D2, etc. on adjacent input buses 140a, 140b / 140b, 140c / 140c, 140d with opposite polarities can additionally or alternatively be aligned in vertically opposite directions (i.e., physically flipped in orientation) to reduce package size and increase package density. Finally, as Figure 6B As shown, the three output buses 150a, 150b, and 150c are connected to... Figures 5A-5B The above-described manner is essentially similar, with four input buses 140a, 140b, 140c, 140d positioned across one or more pairs of devices 430a, 430b, ..., 430n.

[0056] Figure 8A It shows along Figure 6B A cross-sectional view of the integrated power control assembly 410 along the cross-sectional axis A'-A'. The cross-sectional axis A'-A' passes through the switching semiconductor devices Q4, Q3, Q4, Q5, Q6, Q7, Q8, Q9, Q1, Q1, Q2, Q3, Q4, Q5, Q6, Q8, Q9, Q1, Q1, Q1, Q2, Q3, Q4, Q1, Q1, Q2, Q3, Q4, Q5, Q6, Q1, Q1, Q1, Q1, Q2, Q1, Q1, Q3, Q1, Q1, Q1, Q1, Q2 ...2, Q1, Q1, Q1, Q1, Q1, Q1, Q2, Q1, Q1, Q1, Q1, Q1, Q1, Q2, Q1, Q1, Q1, Q1, Q1, Q1 10 Q9, Q 16 and Q 15 Switching semiconductor device Q4 is mounted on the external input bus 140a, and switching semiconductor devices Q3 and Q... 10 Switching semiconductor devices Q9 and Q are located on the internal input bus 140b. 16 It is installed on the internal input bus 140c, and the switching semiconductor device Q. 15 The switching semiconductor devices Q4 and Q3 are installed on the external input bus 140d. They provide output to the output bus 150a, which is also installed on the external input bus. 10 Q9 provides output to the output bus 150b located thereon. Switching semiconductor device Q 16 and Q 15 Output is provided to the output bus 150c disposed thereon. In some embodiments, a bonding agent such as, but not limited to, copper bonding paste or solder can be used to bond the switching semiconductor devices Q4, Q3, Q4, Q5, Q6, Q7, Q8, Q9, Q1, Q2 ... 10 Q9, Q 16 and Q 15 These are connected to the corresponding input buses 140a, 140b, 140c, 140d and output buses 150a, 150b, 150c. A PCB 170 is disposed above and spans the three output buses 150a, 150b, 150c. The PCB 170 has a plurality of gate driver devices 770 disposed thereon for operatively controlling each switching semiconductor device Q1, Q2, etc., on the integrated power control assembly 310. The gate driver devices 770 may include one or more active elements and may be coupled to one or more passive elements, such as, but not limited to, capacitors, resistors, transformers, and inductors disposed on the PCB 170. Figure 8A As shown, gate driver devices 770(Q4), 770(Q3), and 770(Q4) 10 ), 770(Q9), 770(Q 16 ) and 770(Q 15 These are mounted on PCB 170 and are used to operably control the switching semiconductor devices Q4, Q3, and Q4, respectively. 10 Q9, Q 16 and Q 15 .

[0057] Corresponding to the switching semiconductor devices Q3 and Q40b, which are disposed on the positive input buses 140b, 140b, and 140d. 10 and Q 15 Gate driver devices 770(Q3), 770(Q 10 ) and 770(Q 15 They are electrically connected to the switching semiconductor devices Q3 and Q4 respectively through the first conductive via 790a configured to pass through PCB 170. 10 and Q 15 Switching semiconductor devices Q3 and Q4 between output buses 150a, 150b and 150c 10 and Q 15 Gates G(Q3), G(Q) 10 ) and G(Q 15 ), to drive the gate drive signal. Gate driver devices 770(Q3), 770(Q 10 ) and 770(Q 15 The first conductive via 790b, configured to pass through PCB 170, is electrically grounded to output buses 150a, 150b, and 150c. In some embodiments, the first conductive via 790a may be respectively disposed on PCB 170 and the switching semiconductor devices Q3 and Q4. 10 and Q 15 Gates G(Q3), G(Q) 10 ) and G(Q 15 Conductive pillars between ).

[0058] Corresponding to the switching semiconductor devices Q4, Q9 and Q100c disposed on the negative polarity input buses 140a, 140c and 140c. 16 Gate driver devices 770(Q4), 770(Q9) and 770(Q 16 They are electrically connected to the switching semiconductor devices Q4, Q9, and Q3 respectively through L-shaped conductive vias 780a. 16 Switching semiconductor devices Q4, Q9, and Q4 between input buses 140a, 140c, and 140c 16 Gates G(Q4), G(Q9) and G(Q 16 Passing through PCB 170 and openings 760(Q4), 760(Q9) and 760(Q) respectively. 16 A separate L-shaped conductive via 780a is provided to replace the bonding wire for driving the gate drive signal. Openings 760(Q4), 760(Q9), and 760(Q) are also provided. 16 The via is shaped to accommodate an L-shaped conductive via 780a, and is formed by cutting holes in the negative input buses 140a, 140c, and 140c respectively to expose the switching semiconductor devices Q4, Q9, and Q10a. 16The gate terminal. In addition, gate driver devices 770(Q4), 770(Q9), and 770(Q 16 The third conductive via 780b, which is configured to pass through PCB 170, is electrically grounded to the negative polarity input buses 140a, 140c, and 140c.

[0059] Figure 8B It shows along Figure 6B A cross-sectional view of the integrated power control component 410 with cross-sectional axis B'-B'. Cross-sectional axis B'-B' passes through diodes D6, D5, D6, D7, D8, D9, D10, D11, D21, D12, D14 ... 12 D 11 D 18 and D 17 Diode D6 is located on the external input bus 140a, and diodes D5 and D... 12 Diode D is located on the internal input bus 140b. 11 and D 18 It is set on the internal input bus 140c, and diode D. 17 Diodes D6 and D5 are electrically connected to the output bus 150a, which is located on the external input bus 140D. 12 and D 11 Electrically connected to the output bus 150b mounted thereon. Diode D 18 and D 17 It is electrically connected to the output bus 150c located thereon.

[0060] Figure 9A A motor assembly 900a is schematically depicted in a shared liquid-cooled cooling system 950 having a thermally connected motor 320 and an example integrated power control component 100. The motor 320 includes a rotor 920 and a stator 930 housed within a wall 910 of the motor assembly 900a. The motor assembly 900a has a first axial end 942, a second axial end 944 opposite to the first axial end 942, and a motor shaft 940 between the first axial end 942 and the second axial end 944. The motor shaft 940 has a through-hole 945 toward the second axial end 944. The first axial end 942 is configured to connect to a vehicle 1000 (…). Figure 10 The drive shaft and power transmission gear (not shown) are shown in the diagram. The integrated power control assembly 100 is directly mounted to the second axial end 944 of the motor 320.

[0061] The shared liquid-cooled cooling system 950 includes a fluid passage 955 disposed between a fluid inlet 952 and a fluid outlet 954. The fluid passage 955 is disposed within an aperture 945 surrounding the integrated power control assembly 100 and the motor shaft 940. Cooling fluid flows through the fluid passage 955, guided by a pump (not shown) between the fluid inlet 952 and the fluid outlet 954. The cooling fluid is configured to absorb and transfer heat generated by the operation of the motor 320 and the integrated power control assembly 100. The cooling fluid may be a conductive fluid, such as a mixture of ethylene glycol, water, etc., or a dielectric cooling fluid for single-phase cooling. In some embodiments, the cooling fluid may undergo two-phase cooling by changing from a liquid phase to a gas phase.

[0062] Figure 9B A motor assembly 900b of a shared air-cooled cooling system 960 having a thermally connected motor 320 and an example integrated power control assembly 100 coupled thereto is schematically shown. The motor 320 includes a rotor 920 and a stator 930 housed within a wall 910 of the motor assembly 900b. The motor assembly 900b has a motor shaft 940 disposed between a first axial end 942 and a second axial end 944. The motor shaft 940 has a through-hole 945 toward the second axial end 944. The first axial end 942 is configured to connect to a vehicle 1000 (…). Figure 10 The drive shaft and power transmission gear (not shown) are shown in the diagram. The integrated power control assembly 100 is directly mounted to the second axial end 944 of the motor 320.

[0063] The shared air-cooled cooling system 960 includes a plurality of heat sinks 970 coupled to the integrated power control assembly 100 within a bore 945, an air inlet 982 at a first axial end 942, and an air outlet 984 at a second axial end 944. Cooling air flows into the plurality of heat sinks 970 from the air inlet 982 and flows out from the air outlet 984. The cooling air is configured to absorb and transfer heat generated by the operation of the motor 320 and the integrated power control assembly 100.

[0064] As described above, the integrated power control component 100 described herein can be incorporated into the electric motor components 900a and 900b of the vehicle 1000. The vehicle 1000 can be a hybrid vehicle, a plug-in hybrid vehicle, an electric vehicle, or any vehicle that uses an electric motor. Figure 10A vehicle 1000 is schematically shown having an electric motor 320 electrically coupled to an example integrated power control assembly 100. The vehicle 1000 typically includes a gasoline engine 1070 and the aforementioned electric motor 320, both configured to provide rotational motion to the wheels 1080 of the vehicle 1000 to propel the vehicle 1000 along a road. The example integrated power control assembly 100 is mounted on the axial end of the electric motor 320 and configured as an inverter for the electric motor 320. The example integrated power control assembly 100 is in turn electrically coupled to a battery pack 350 via an electrical connector 1075 as described above.

[0065] The integrated power control assembly 100 described herein can be advantageously configured as an inverter for an electric motor. The use of a bus shortens electrical connections and eliminates interconnecting high-voltage cables, resulting in a compact inverter package. In addition to reducing package size by eliminating lead joints, the leadless package also reduces loop inductance, voltage spikes, and switching power losses. In embodiments where switching semiconductor devices and diodes on adjacent input buses of opposite polarities are aligned in perpendicularly opposite directions (i.e., physically flipped in orientation), package density is further enhanced. Finally, the use of a shared cooling system between the integrated power control assembly and the electric motor eliminates the need for a separate cooling system for the integrated power control assembly. The use of a bus also improves the thermal performance of the integrated power control assembly by increasing thermal protection from the switching semiconductor devices. Overall, the design of the integrated power control assembly is simplified by reducing the weight, volume, and cost of the powertrain used in electrified vehicles.

[0066] Note that the terms “substantially” and “approximately” can be used herein to include an inherent degree of uncertainty that can be attributed to any quantitative comparison, value, measurement, or other representation. These terms are also used herein to indicate the extent to which a quantitative representation may vary from the reference without causing a change in the fundamental function and expected range of the subject matter under discussion.

[0067] Although specific embodiments have been described and illustrated herein, it should be understood that various other changes and modifications may be made without departing from the spirit and scope of the claimed subject matter. Furthermore, while various aspects of the claimed subject matter have been described herein, these aspects need not be used in combination. Therefore, the appended claims are intended to cover all such changes and modifications within the scope of the claimed subject matter.

Claims

1. An integrated power control assembly configured as an inverter to be directly mounted on the axial end of a three-phase motor, the integrated power control assembly comprising: substrate; Four input buses are horizontally spaced apart on the substrate. These four input buses include two positive input buses and two negative input buses arranged alternately, wherein: Internal input buses of opposite polarity are arranged between external input buses of opposite polarity, and the internal input buses have edges adjacent to the internal input buses of opposite polarity and edges adjacent to the external input buses of opposite polarity; and The internal input bus is configured to have at least twice as many devices disposed thereon as the external input bus; A group or more pairs of devices are axially arranged on the external input bus, wherein one pair of devices includes a switching semiconductor device and a diode; One or more pairs of devices are axially arranged on the inner input bus along the edge adjacent to the inner input bus of opposite polarity; One or more pairs of devices axially arranged along the edge adjacent to the external input bus of opposite polarity on the internal input bus; and Corresponding to the three output buses of the three phases of the motor, a separate output bus is disposed on one or more pairs of devices and electrically coupled to the one or more pairs of devices, and the one or more pairs of devices are disposed on adjacent input buses of opposite polarity.

2. The integrated power control component according to claim 1 further includes; A circuit board disposed above and spanning the three output buses, wherein the circuit board further includes a gate driver device disposed on the circuit board for operatively controlling each switching semiconductor device in the integrated power control assembly.

3. The integrated power control component according to claim 1 further includes; One or more capacitors are disposed on and across the four input buses, wherein each individual capacitor is electrically coupled to the battery.

4. The integrated power control component according to claim 1, wherein the first switching semiconductor device and the first diode in the first pair of devices are laterally adjacent to the second diode and the second switching semiconductor device in the second pair of devices, wherein the first pair of devices and the second pair of devices are laterally adjacent pairs of devices.

5. The integrated power control component according to claim 1, wherein the first switching semiconductor device and the first diode in the first set of paired devices are laterally adjacent to the second switching semiconductor device and the second diode in the second set of paired devices, wherein the first set of paired devices and the second set of paired devices are laterally adjacent paired device groups.

6. The integrated power control assembly of claim 1, wherein switching semiconductor devices on adjacent input buses of opposite polarities are aligned in a vertically opposite direction such that the gates of the switching semiconductor devices are located on opposite surfaces of the switching semiconductor devices.

7. The integrated power control assembly of claim 1, wherein diodes on adjacent input buses of opposite polarities are aligned in a vertically opposite direction.

8. The integrated power control assembly according to claim 1, wherein the substrate comprises: Thermal interface layer; A heat dissipation layer disposed above the thermal interface layer, the heat dissipation layer being formed of a conductive material; as well as Electrical isolation layer.

9. The integrated power control component according to claim 1, wherein: The gate driver of the switching semiconductor device corresponding to the one located on the positive input bus is electrically connected to the gate of the switching semiconductor device and grounded to the corresponding output bus, which is electrically coupled to the switching semiconductor device through a conductive via configured to pass through the circuit board.

10. The integrated power control component according to claim 1, wherein: The gate driver of the switching semiconductor device corresponding to the negative input bus is electrically connected to the gate of the switching semiconductor device through an L-shaped conductive via, the L-shaped conductive via being configured as an opening passing through the circuit board and the negative input bus. as well as The gate-driven device is grounded to the negative input bus via a conductive via configured to pass through the circuit board.

11. An electric motor assembly, comprising: Three-phase electric motor; as well as An integrated power control assembly, configured as an inverter and directly mounted on the axial end of the three-phase motor, includes: substrate; Four input buses are horizontally spaced apart on the substrate. These four input buses include two positive input buses and two negative input buses arranged alternately, wherein: Internal input buses of opposite polarity are arranged between external input buses of opposite polarity, and the internal input buses have edges adjacent to the internal input buses of opposite polarity and edges adjacent to the external input buses of opposite polarity; and The internal input bus is configured to have at least twice as many devices disposed thereon as the external input bus; A group or more pairs of devices are axially arranged on the external input bus, wherein one pair of devices includes a switching semiconductor device and a diode; One or more pairs of devices are axially arranged on the inner input bus along the edge adjacent to the inner input bus of opposite polarity; One or more pairs of devices axially arranged along the edge adjacent to the external input bus of opposite polarity on the internal input bus; and Corresponding to the three output buses of the three phases of the three-phase motor, a separate output bus is disposed on one or more sets of paired devices and electrically coupled to the one or more sets of paired devices, the one or more sets of paired devices being disposed on adjacent input buses of opposite polarity; and A shared cooling system is thermally connected to the three-phase motor and the integrated power control assembly.

12. The electric motor assembly of claim 11, wherein the integrated power control assembly further comprises: A circuit board disposed above and spanning the three output buses, wherein the circuit board further includes a gate driver device disposed on the circuit board for operatively controlling each switching semiconductor device in the integrated power control assembly.

13. The electric motor assembly of claim 11, wherein the integrated power control assembly further comprises: One or more capacitors are disposed on and across the four input buses, wherein each individual capacitor is electrically coupled to the battery.

14. The motor assembly of claim 11, wherein the first switching semiconductor device and the first diode in the first pair of devices are laterally adjacent to the second diode and the second switching semiconductor device in the second pair of devices, respectively, wherein the first pair of devices and the second pair of devices are laterally adjacent pairs of devices.

15. The motor assembly of claim 11, wherein the first switching semiconductor device and the first diode in the first pair of devices are laterally adjacent to the second switching semiconductor device and the second diode in the second pair of devices, respectively, wherein the first pair of devices and the second pair of devices are laterally adjacent pairs of devices.

16. The motor assembly of claim 11, wherein switching semiconductor devices on adjacent input buses of opposite polarities are aligned in a vertically opposite direction such that the gate of the switching semiconductor device is located on the opposite surface of the switching semiconductor device.

17. The motor assembly of claim 11, wherein diodes on adjacent input buses of opposite polarities are aligned in a vertically opposite direction.

18. The electric motor assembly of claim 11, wherein the substrate comprises: Thermal interface layer; A heat dissipation layer disposed above the thermal interface layer, the heat dissipation layer being formed of a conductive material; as well as Electrical isolation layer.

19. The electric motor assembly of claim 11, wherein: The gate driver of the switching semiconductor device corresponding to the one located on the positive input bus is electrically connected to the gate of the switching semiconductor device and grounded to the corresponding output bus, which is electrically coupled to the switching semiconductor device through a conductive via configured to pass through the circuit board.

20. The electric motor assembly of claim 11, wherein: The gate driver of the switching semiconductor device corresponding to the negative input bus is electrically connected to the gate of the switching semiconductor device through an L-shaped conductive via, the L-shaped conductive via being configured as an opening passing through the circuit board and the negative input bus. as well as The gate-driven device is grounded to the negative input bus via a conductive via configured to pass through the circuit board.

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