Substrate processing system and substrate processing method

Abstract

The present invention relates to a substrate processing system and a substrate processing method. Provided is a technology capable of narrowing the pitch of a plurality of substrates processed in batches and capable of suppressing interference between the substrates and a transport robot. The substrate processing system has: a batch processing section that processes a batch containing a plurality of substrates at a first pitch in batches; a single processing section that processes the substrates of the batch one by one; and an interface section that hands over the substrates between the batch processing section and the single processing section, the batch processing section including: a processing tank that stores a block-shaped or mist-shaped processing liquid; a first holding device that holds the substrates at the first pitch; and a second holding device that receives the substrates arranged at a second pitch that is N (N is a natural number of 2 or more) times the first pitch in the processing liquid from the first holding device, the interface section including a transport section that transports the substrates held separately in the first holding device and the second holding device in the processing liquid from the batch processing section to the single processing section.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a substrate processing system and a substrate processing method. BACKGROUND

[0002] The drying device described in Patent Literature 1 is provided with a buffer tank, a transfer section, and a rotary drying section. The buffer tank holds semiconductor wafers subjected to a water washing process in water. The semiconductor wafers are subjected to the water washing process while being placed in a plurality of pieces on one holding table, and are held in the water of the buffer tank while maintaining the state of being placed on the holding table. The transfer section takes out the semiconductor wafers from the buffer tank one by one and transfers them. The rotary drying section supports one semiconductor wafer transferred by the transfer section so that the main surface becomes horizontal, and rotates at high speed, thereby removing water.

[0003] Patent Literature 1: Japanese Patent Application Laid-Open No. 9-162157 SUMMARY

[0004] Problem to be solved by the invention

[0005] A technical solution of the present disclosure provides a technology capable of narrowing the pitch of a plurality of substrates processed in batches and capable of suppressing interference between the substrates and a transport robot.

[0006] Solution for solving the problem

[0007] A substrate processing system of a technical solution of the present disclosure has:

[0008] a batch processing section that processes a batch containing a plurality of substrates in a first pitch;

[0009] a single processing section that processes the substrates of the batch one by one; and

[0010] an interface section that interfaces the substrates between the batch processing section and the single processing section,

[0011] the batch processing section includes a processing tank that stores a processing liquid in a block or mist shape, a first holding tool that holds the substrates in the first pitch, and a second holding tool that receives the substrates arranged in a second pitch that is N (N is a natural number of 2 or more) times the first pitch from the first holding tool in the processing liquid,

[0012] the interface section includes a transport section that transports the substrates held separately in the first holding tool and the second holding tool in the processing liquid from the batch processing section to the single processing section.

[0013] Effects of the invention

[0014] According to a technical solution disclosed herein, the spacing between multiple substrates processed in batches can be narrowed and interference between the substrates and the transport robot can be suppressed. Attached Figure Description

[0015] Figure 1 This is a top view showing a substrate processing system according to one embodiment.

[0016] Figure 2 This is a flowchart illustrating a substrate processing method according to one embodiment.

[0017] Figure 3 It means Figure 1 A top view of an example of a batch forming section.

[0018] Figure 4A It means Figure 3 A side view of an example of the operation of the batch forming section.

[0019] Figure 4B This indicates that the batch formation department continues Figure 4A A side view of an example of the subsequent action.

[0020] Figure 4C This indicates that the batch formation department continues Figure 4B A side view of an example of the subsequent action.

[0021] Figure 5 It means Figure 1 A top view of an example of a batch release section.

[0022] Figure 6A It means Figure 5 A cross-sectional view of an example of the operation of the batch release unit.

[0023] Figure 6B This indicates that the batch release of the department continues Figure 6A A cross-sectional view of an example of the subsequent action.

[0024] Figure 6C This indicates that the batch release of the department continues. Figure 6B A cross-sectional view of an example of the subsequent action.

[0025] Figure 7 It means Figure 1 A side view of an example of the conveyor section of the interface section.

[0026] Figure 8 This is a side view of another example of a conveyor section.

[0027] Figure 9 It means Figure 1 A perspective view of an example of a drying apparatus.

[0028] Figure 10is a plan view showing a substrate processing system of a first modification example.

[0029] Figure 11 is a plan view showing a substrate processing system of a second modification example. DETAILED DESCRIPTION

[0030] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding structures are sometimes denoted by the same reference numerals, and the description will be omitted.

[0031] As shown in Figure 1 , the substrate processing system 1 has an in-out section 2, a single piece processing section 3, an interface section 5, a batch processing section 6, and a control section 9. The in-out section 2 has a placement table 21 on which a cassette C is placed. The cassette C accommodates a plurality of (for example, 25) substrates W and feeds them in and out with respect to the in-out section 2. Inside the cassette C, the substrates W are horizontally held and held at a second interval P2 (P2 = N x PI) that is N times a first interval PI in the vertical direction. N is a natural number of 2 or more, and is 2 in the present embodiment, but can be 3 or more. The single piece processing section 3 processes the substrates W one by one. The interface section 5 hands over the substrates W between the single piece processing section 3 and the batch processing section 6. The batch processing section 6 processes a lot L that contains a plurality of (for example, 50) substrates W at the first interval PI. One lot L includes, for example, the substrates W of N cassettes C.

[0032] The in-out section 2, the single piece processing section 3, the interface section 5, and the batch processing section 6 are arranged in this order from the negative side of the X-axis direction toward the positive side of the X-axis direction. The substrates W are transported from the in-out section 2 in the order of arrows Al, A2, A3, A4, and A5 shown in Figure 1 , and returned to the in-out section 2. The in-out section 2 functions as both an in section and an out section, and thus the substrate processing system 1 can be downsized.

[0033] The in-out section 2 has the placement table 21, and the placement table 21 has a plurality of placement boards 22. A plurality of cassettes C are placed on the plurality of placement boards 22. In addition, the number of placement boards 22 is not particularly limited. Likewise, the number of cassettes C is also not particularly limited.

[0034] The in-out section 2 has a first transport region 23 that is adjacent to the placement table 21 and disposed on the positive side of the X-axis direction of the placement table 21. A first transport device 24 is provided in the first transport region 23. The first transport device 24 has a first transport arm that moves in the horizontal direction (the X-axis direction and the Y-axis direction) and the vertical direction and rotates around a vertical axis. The first transport arm transports the substrates W between the cassettes C and a handover section 25 described later. The number of first transport arms can be one or a plurality, and in the latter case, the first transport device 24 transports a plurality (for example, 5) of substrates W in a batch.

[0035] The in-out section 2 has a handover section 25 adjacent to the first conveying area 23 and disposed on the positive side of the first conveying area 23 in the X-axis direction. The handover section 25 has a first transfer device 26 that temporarily stores the substrate W. The number of the first transfer device 26 can be plural, and the plural first transfer devices 26 can be stacked in the vertical direction. The first transfer device 26 receives the substrate W from the first conveying device 24 and temporarily stores the substrate W until it is handed over to the second conveying device 32 described later. Further, the first transfer device 26 receives the substrate W from the second conveying device 32 and temporarily stores the substrate W until it is handed over to the first conveying device 24.

[0036] The single-piece processing section 3 has a second conveying area 31 adjacent to the handover section 25 and disposed on the positive side of the handover section 25 in the X-axis direction. The second conveying area 31 has a second conveying device 32. The second conveying device 32 has a second conveying arm that moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The second conveying arm conveys the substrates between devices adjacent to the second conveying area 31. The number of the second conveying arm can be one or plural, and in the latter case, the second conveying device 32 conveys plural (for example, 5) substrates W in batches.

[0037] The single-piece processing section 3 has, for example, a second transfer device 33, a liquid processing device 34, and a drying device 35 beside the second conveying area 31. The second transfer device 33 is adjacent to the second conveying area 31 and disposed on the positive side of the second conveying area 31 in the X-axis direction. The second transfer device 33 receives the substrate W from the second conveying device 32 and temporarily stores the substrate W until it is handed over to the interface section 5. The liquid processing device 34 is single-piece and processes the substrates W one by one with a processing liquid. The processing liquid can also be plural, for example, pure water such as DIW, and a drying liquid that has a lower surface tension than pure water is preferable. The drying liquid is, for example, alcohol such as IPA (isopropyl alcohol) is preferable. The drying device 35 is single-piece and dries the substrates W one by one with a supercritical fluid. In addition, both the liquid processing device 34 and the drying device 35 can not be single-piece, and the liquid processing device 34 can be single-piece and the drying device 35 can be batch-type. The drying device 35 can be a batch-type that dries plural substrates W with a supercritical fluid. The number of substrates W processed in batches by the drying device 35 can be equal to or more than the number of substrates W processed in batches by the batch processing section 6, but can be less than the number.

[0038] In addition, the arrangement and number of the liquid processing device 34 and the drying device 35 are not limited to Figure 1For example, the liquid processing apparatus 34 can also be arranged on both sides of the Y-axis direction of the second conveyance region 31. Further, the liquid processing apparatus 34 can also be stacked in the Z-axis direction. The dry processing apparatus 35 can also be arranged in the same manner as the liquid processing apparatus 34. Further, an apparatus other than the liquid processing apparatus 34 and the dry processing apparatus 35 can also be arranged beside the second conveyance region 31.

[0039] The interface section 5 has, for example, a lot forming section 51 and a conveyance section 52. The lot forming section 51 holds a plurality of substrates W at the first pitch PI to form a lot L. The conveyance section 52 conveys the substrates W from the single piece processing section 3 to the lot forming section 51, and conveys the substrates W from the lot processing section 6 to the single piece processing section 3.

[0040] As shown in FIG. 1, the conveyance section 52 includes a first conveyance robot 53 and a second conveyance robot 54. The first conveyance robot 53 conveys the substrates W from the single piece processing section 3 to the lot forming section 51. The second conveyance robot 54 conveys the substrates W from the lot processing section 6 to the single piece processing section 3. In addition, as shown in FIG. 1, the conveyance section 52 can include one conveyance robot 41 that functions as both the first conveyance robot 53 and the second conveyance robot 54. Figure 7 Figure 8 As shown in FIG. 1, the conveyance section 52 includes a first conveyance robot 53 and a second conveyance robot 54. The first conveyance robot 53 conveys the substrates W from the single piece processing section 3 to the lot forming section 51. The second conveyance robot 54 conveys the substrates W from the lot processing section 6 to the single piece processing section 3. In addition, as shown in FIG. 1, the conveyance section 52 can include one conveyance robot 41 that functions as both the first conveyance robot 53 and the second conveyance robot 54.

[0041] Since the first conveyance robot 53 and the second conveyance robot 54 are independently arranged, the flow Al of the substrates W from the single piece processing section 3 toward the lot processing section 6 and the flow A3 of the substrates W from the lot processing section 6 toward the single piece processing section 3 can be controlled independently. Therefore, the flow of the substrates W can be prevented from stagnating at the interface section 5, and the productivity can be improved.

[0042] The lot processing section 6 has a third conveyance region 61 that is adjacent to the interface section 5 and arranged on the positive side of the X-axis direction of the interface section 5. A third conveyance apparatus 62 is provided in the third conveyance region 61. The third conveyance apparatus 62 has a third conveyance arm that moves in the horizontal direction (the X-axis direction and the Y-axis direction) and the vertical direction, and rotates around a vertical axis. In addition, the third conveyance arm can not rotate around the vertical axis. The third conveyance arm conveys the substrates W between the apparatuses adjacent to the third conveyance region 61. The third conveyance arm conveys the lots L in batches.

[0043] ​The third conveyance region 61 is rectangular in plan view, and the length direction thereof is the X-axis direction. The batch formation section 51 is arranged beside the short side of the third conveyance region 61, and the processing tank (for example, the third rinse liquid tank 68) is arranged beside the long side of the third conveyance region 61. The conveyance section 52 is arranged beside both the batch formation section 51 and the processing tank. The conveyance section 52 is easily accessible to both the batch formation section 51 and the processing tank, and therefore, a conveyance robot with a narrow movable range of the tip of the arm (Japanese: hand) can be used as the first conveyance robot 53 and the second conveyance robot 54.

[0044] However, since the batch formation section 51 is arranged beside the short side of the third conveyance region 61 and the processing tank is arranged beside the long side of the third conveyance region 61, the arrangement direction of the substrate W is different between the batch formation section 51 and the processing tank. Therefore, the third conveyance device 62 is rotated around the vertical axis. By the rotation of the third conveyance device 62, the arrangement direction of the substrate W can be changed between the X-axis direction and the Y-axis direction. In addition, the third conveyance device 62 can not be rotated around the vertical axis in a case where the arrangement direction of the substrate does not need to be changed.

[0045] The batch processing section 6 has, for example, the first chemical solution tank 63, the first rinse liquid tank 64, the second chemical solution tank 65, the second rinse liquid tank 66, the third chemical solution tank 67, and the third rinse liquid tank 68 beside the third conveyance region 61. The processing tanks described above are arranged along the long side of the third conveyance region 61. Specifically, the first chemical solution tank 63, the first rinse liquid tank 64, the second chemical solution tank 65, the second rinse liquid tank 66, the third chemical solution tank 67, and the third rinse liquid tank 68 are arranged in this order from the positive side of the X-axis direction toward the negative side of the X-axis direction.

[0046] In addition, the number of the processing tanks arranged beside the third conveyance region 61 is not limited to Figure 1 the number. For example, the second chemical solution tank 65 and the second rinse liquid tank 66 are one group in Figure 1 , but can be multiple groups.

[0047] The first chemical solution tank 63 stores a first chemical solution for immersion of the batch L. The first chemical solution is not particularly limited, and is, for example, DHF (dilute hydrofluoric acid). The DHF is used for removal of a natural oxide film. Instead of the DHF, a BHF (a mixed solution of hydrofluoric acid and ammonium fluoride) can also be used. The first rinse liquid tank 64 stores a first rinse liquid for immersion of the batch L. The first rinse liquid is pure water for removal of the first chemical solution from the substrate W, and is, for example, DIW (deionized water).

[0048] The batch processing section 6 has a first processing tool 71 that receives and holds the batch L from the third conveyance device 62. The first processing tool 71 holds a plurality of substrates W in the Y-axis direction at a first pitch Pl and holds each of the plurality of substrates W vertically. Further, the batch processing section 6 has a first drive device 72 that moves the first processing tool 71 in the X-axis direction and the Z-axis direction. The first processing tool 71 holds the batch L in the first chemical solution, then holds the batch L in the first rinse liquid, and thereafter, hands over the batch L to the third conveyance device 62.

[0049] Further, the number of units of the first processing tool 71 and the first drive device 72 is one in the present embodiment, but can be plural. In the latter case, one unit dips the batch L in the first chemical solution and another unit dips the batch L in the first rinse liquid. In this case, the first drive device 72 can not move the first processing tool 71 in the X-axis direction as long as it moves the first processing tool 71 in the Z-axis direction.

[0050] The second chemical solution tank 65 stores a second chemical solution for dipping the batch L. The second chemical solution is not particularly limited and is, for example, a phosphoric acid aqueous solution. The phosphoric acid aqueous solution selectively etches and removes a silicon nitride film among a silicon oxide film and a silicon nitride film. The second rinse liquid tank 66 stores a second rinse liquid for dipping the batch L. The second rinse liquid is pure water for removing the second chemical solution from the substrate W and is, for example, DIW (deionized water).

[0051] The batch processing section 6 has a second processing tool 73 that receives and holds the batch L from the third conveyance device 62. Like the first processing tool 71, the second processing tool 73 holds a plurality of substrates W in the Y-axis direction at a first pitch Pl and holds each of the plurality of substrates W vertically. Further, the batch processing section 6 has a second drive device 74 that moves the second processing tool 73 in the Z-axis direction. The second processing tool 73 holds the batch L in the second chemical solution and thereafter, hands over the batch L to the third conveyance device 62.

[0052] Likewise, the batch processing section 6 has a third processing tool 75 that receives and holds the batch L from the third conveyance device 62. Like the first processing tool 71, the third processing tool 75 holds a plurality of substrates W in the Y-axis direction at a first pitch Pl and holds each of the plurality of substrates W vertically. Further, the batch processing section 6 has a third drive device 76 that moves the third processing tool 75 in the Z-axis direction. The third processing tool 75 holds the batch L in the second rinse liquid and thereafter, hands over the batch L to the third conveyance device 62.

[0053] The 3rd chemical solution tank 67 stores a 3rd chemical solution used for immersion of the lot L. The 3rd chemical solution is not particularly limited, and is, for example, SC1 (a mixture of ammonia, hydrogen peroxide, and water). The SC1 is used for removal of organic substances and particles. The 3rd rinse solution tank 68 stores a 3rd rinse solution used for immersion of the lot L. The 3rd rinse solution is pure water used for removal of the 3rd chemical solution from the substrate W, and is, for example, DIW (deionized water).

[0054] The batch processing section 6 has a 1st holding tool 811 that receives and holds the lot L from the 3rd conveyance device 62. The 1st holding tool 811 holds a plurality of substrates W at a 1st pitch P1 in the Y-axis direction, and holds each of the plurality of substrates W vertically. Further, the batch processing section 6 has a drive device 818 that moves the 1st holding tool 811 in the X-axis direction and the Z-axis direction. The 1st holding tool 811 holds the lot L in the 3rd chemical solution, and then holds the lot L in the 3rd rinse solution.

[0055] In addition, the number of units of the 1st holding tool 811 and the drive device 818 is one in the present embodiment, but can be plural. In the case of the latter, one unit immerses the lot L in the 3rd chemical solution, and the other unit immerses the lot L in the 3rd rinse solution. In this case, the drive device 818 can not move the 1st holding tool 811 in the X-axis direction as long as the 1st holding tool 811 is moved in the Z-axis direction.

[0056] Further, the batch processing section 6 has a 2nd holding tool 814 that receives the plurality of substrates W arranged at a 2nd pitch P2 (P2 = N x P1) from the 1st holding tool 811 in the 3rd processing solution. The 1st holding tool 811, the 2nd holding tool 814, and the drive device 818 form a lot release section 81.

[0057] In addition, the kind of the chemical solution used in the batch processing section 6 is not limited to dilute hydrofluoric acid, BFH, aqueous phosphoric acid, and SC1, and is, for example, dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), plating solution, and the like. The chemical solution can be for stripping processing or plating processing. Further, the number of the chemical solutions is not particularly limited, and can be one.

[0058] The control unit 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the board processing system 1. The control unit 9 controls the operation of the board processing system 1 by causing the CPU 91 to execute the programs stored in the storage medium 92. Furthermore, the control unit 9 includes an input interface 93 and an output interface 94. The control unit 9 receives signals from the outside via the input interface 93 and sends signals to the outside via the output interface 94.

[0059] The program described above is stored on, for example, a computer-readable storage medium, and installed from that storage medium onto the storage medium 92 of the control unit 9. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards. Alternatively, the program can be downloaded from a server via the Internet and installed onto the storage medium 92 of the control unit 9.

[0060] Next, refer to Figure 2 The operation of the substrate processing system 1 described above, namely the substrate processing method, will be explained. Figure 2 The process shown is implemented under the control of the control unit 9.

[0061] First, the box C, containing multiple substrates W, is fed into the feed / discharge section 2 and placed on the mounting plate 22. Inside the box C, the substrates W are held horizontally and vertically at a second spacing P2 (P2 = N × P1). N is a natural number of 2 or more; in this embodiment, it is 2, but it can also be 3 or more.

[0062] Next, the first conveying device 24 removes the substrate W from box C. Figure 2 The substrate W is then transported from the first conveying device 26 (S101) to the second conveying device 33. Next, the second conveying device 32 receives the substrate W from the first conveying device 26 and transports it to the second conveying device 33. Afterwards, the first conveying robot 53 receives the substrate W from the second conveying device 33 and transports it to the batch forming unit 51.

[0063] Next, the batch forming unit 51 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a batch L. Figure 2 (S102). A batch L, for example, includes N substrates W with boxes C. The spacing between substrates W narrows from the second spacing P2 to the first spacing P1, thereby increasing the number of substrates W that can be processed in batches.

[0064] Next, the 3rd conveyance device 62 receives the lot L from the lot formation section 51 and conveys it to the 1st processing tool 71. En route, the 3rd conveyance device 62 rotates about the vertical axis, changing the arrangement direction of the multiple substrates W from the X-axis direction to the Y-axis direction.

[0065] Next, the 1st processing tool 71 lowers from above the 1st chemical solution tank 63, immerses the lot L in the 1st chemical solution, and performs the 1st chemical solution treatment (S103). After that, the 1st processing tool 71 rises in order to pull up the lot L from the 1st chemical solution, and then moves in the X-axis direction toward above the 1st rinse liquid tank 64. Figure 2

[0066] Next, the 1st processing tool 71 lowers from above the 1st rinse liquid tank 64, immerses the lot L in the 1st rinse liquid, and performs the 1st rinse liquid treatment (S104). After that, the 1st processing tool 71 rises in order to pull up the lot L from the 1st rinse liquid. Next, the 3rd conveyance device 62 receives the lot L from the 1st processing tool 71 and conveys it to the 2nd processing tool 73. Figure 2

[0067] Next, the 2nd processing tool 73 lowers from above the 2nd chemical solution tank 65, immerses the lot L in the 2nd chemical solution, and performs the 2nd chemical solution treatment (S105). After that, the 2nd processing tool 73 rises in order to pull up the lot L from the 2nd chemical solution. Next, the 3rd conveyance device 62 receives the lot L from the 2nd processing tool 73 and conveys it to the 3rd processing tool 75. Figure 2

[0068] Next, the 3rd processing tool 75 lowers from above the 2nd rinse liquid tank 66, immerses the lot L in the 2nd rinse liquid, and performs the 2nd rinse liquid treatment (S106). After that, the 3rd processing tool 75 rises in order to pull up the lot L from the 2nd rinse liquid. Next, the 3rd conveyance device 62 receives the lot L from the 3rd processing tool 75 and conveys it to the 1st holding tool 811. Figure 2

[0069] Next, the 1st holding tool 811 lowers from above the 3rd chemical solution tank 67, immerses the lot L in the 3rd chemical solution, and performs the 3rd chemical solution treatment (S107). After that, the 1st holding tool 811 rises in order to pull up the lot L from the 3rd chemical solution, and then moves in the X-axis direction toward above the 3rd rinse liquid tank 68. Figure 2

[0070] Next, the 1st holding tool 811 lowers from above the 3rd rinse liquid tank 68, immerses the lot L in the 3rd rinse liquid, and performs the 3rd rinse liquid treatment (S108). Figure 2

[0071] ​​​​​​Furthermore, during its descent, the first holding device 811 transfers a portion of the batch L to the second holding device 814, thereby widening the spacing of the substrates W from the first spacing P1 to the second spacing P2. Figure 2 (S109). The second holding device 814 holds multiple substrates W at a second spacing P2, and the first holding device 811 also holds multiple substrates W at a second spacing P2. In addition, the first holding device 811 holds substrates W that are transferred to the second holding device 814 and substrates W that are not transferred to the second holding device 814 and continue to be held in an alternating manner. That is, substrates W that are part of batch L and substrates W that are the remaining part of batch L are arranged alternately to form batch L.

[0072] Next, the second transport robot 54 transports the substrates W, which are held separately in the first holding device 811 and the second holding device 814 in the third rinsing liquid, to the single-wafer processing unit 3. Because the spacing between the substrates W is wider, interference between the substrates W and the second transport robot 54 can be prevented. Furthermore, the spacing between the substrates W during batch L formation can be narrowed, thereby increasing the number of substrates W processed in batches. The second transport robot 54 transports the substrates W one by one to the liquid treatment apparatus 34 of the single-wafer processing unit 3.

[0073] Next, the liquid processing apparatus 34 processes the substrate W one by one using liquid. Figure 2 (S110). The liquid can be multiple, such as pure water (DIW), or a drying liquid with a lower surface tension than pure water. Alcohol, such as IPA (isopropanol), is preferred as the drying liquid. The liquid treatment apparatus 34 supplies pure water and drying liquid to the upper surface of the substrate W in this order, forming a liquid film of drying liquid.

[0074] Next, the second conveying device 32 receives the substrate W from the liquid treatment device 34 and holds the substrate W horizontally with the liquid film of the drying liquid facing upwards. The second conveying device 32 conveys the substrate W from the liquid treatment device 34 to the drying device 35.

[0075] Next, the drying apparatus 35 uses supercritical fluid to dry the substrates W one by one. Figure 2 (S111). It is possible to replace the drying liquid with supercritical fluid, thereby suppressing the collapse of the uneven pattern of the substrate W caused by the surface tension of the drying liquid. Since supercritical fluid requires a pressure vessel, in order to miniaturize the pressure vessel, it is processed on a single sheet instead of in batch processing.

[0076] like Figure 9As shown, the drying device 35 includes a pressure-resistant container 351, a movable tray 353, and a supply port 356. The pressure-resistant container 351 has a supply / discharge port 352 for supplying and discharging the substrate W. The movable tray 353 has a lid 354 that opens and closes the supply / discharge port 352 and a holding portion 355 that holds the substrate W horizontally. In a state where the lid 354 closes the supply / discharge port 352, the holding portion 355 holds the substrate W horizontally inside the pressure-resistant container 351. A concave-convex pattern is formed on an upper surface of the substrate W in advance, and a liquid film of the drying liquid covers the concave-convex pattern. The supply port 356 supplies a supercritical fluid such as carbon dioxide to the inside of the pressure-resistant container 351. The number and positions of the supply port 356 are not limited to those shown. Figure 9 The single-type drying device 35 dries the substrate W on which the liquid film is formed, one by one, using the supercritical fluid.

[0077] In addition, the drying device 35 is single-type in this embodiment, but as described above, can be batch-type. The batch-type drying device 35 dries a plurality of substrates W on which the liquid film is formed, in batches, using the supercritical fluid. The single-type drying device 35 has one holding portion 355, and in contrast, the batch-type drying device 35 has a plurality of holding portions 355.

[0078] In addition, the drying device 35 of this embodiment dries the substrate W using the supercritical fluid, but the drying method is not particularly limited. The drying method can be, for example, spin drying, scan drying, or hydrophobic drying, as long as it can suppress collapse of the concave-convex pattern of the substrate W. The spin drying rotates the substrate W and uses centrifugal force to fling the liquid film off the substrate W. The scan drying rotates the substrate W while moving the supply position of the drying liquid from the center of the substrate W toward the periphery of the substrate W, and uses centrifugal force to fling the liquid film off the substrate W. The scan drying can also move the supply position of a drying gas such as N2 gas from the center of the substrate W toward the periphery of the substrate W in a manner that follows the supply position of the drying liquid.

[0079] After that, the 2nd conveyance device 32 receives the substrate W from the drying device 35 and conveys it to the 1st transfer device 26.

[0080] Next, the 1st conveyance device 24 receives the substrate W from the 1st transfer device 26 and stores it in the cassette C (S112). The cassette C is discharged from the supply / discharge portion 2 in a state where a plurality of substrates W are stored. Figure 2

[0081] Next, reference will be made to Figure 3 , Figure 4A , Figure 4B and Figure 4C ​The batch forming section 51 will be described. Note that the number of substrates W is illustrated to be smaller than the actual number, in accordance with the occupied space in the drawing. The number of the first holding grooves 513, the number of the second holding grooves 516, and the number of the through grooves 517 are the same.

[0082] The batch forming section 51 has a first holding tool 511, as shown in Figure 4C The first holding tool 511 holds a plurality of (for example, 50) substrates W at a first pitch Pl in the X-axis direction, as shown in Figure 4C for example, 12 of the 50) substrates W at a second pitch P2 in the X-axis direction. As shown in Figure 3 The first holding tool 511 has a plurality of first arms 512. The number of the first arms 512 is not limited to the number shown in the drawing.

[0083] The plurality of first arms 512 each extend in the X-axis direction and have first holding grooves 513 arranged at the first pitch Pl in the X-axis direction. The outer periphery of the substrate W is inserted into the first holding grooves 513, and the first holding grooves 513 hold the outer periphery of the substrate W. The plurality of first arms 512 hold the respective outer peripheries of the plurality of substrates W at intervals along the circumferential direction.

[0084] Further, the batch forming section 51 has a second holding tool 514, as shown in Figure 4B The second holding tool 514 holds a plurality of (for example, 25) substrates W at a second pitch P2 in the X-axis direction. As shown in Figure 4B for example, 6 of the 25) substrates W at a second pitch P2 in the X-axis direction. As shown in Figure 3 The second holding tool 514 has a plurality of second arms 515. The number of the second arms 515 is not limited to the number shown in the drawing.

[0085] The plurality of second arms 515 each extend in the X-axis direction and have second holding grooves 516 arranged at the second pitch P2 in the X-axis direction. The outer periphery of the substrate W is inserted into the second holding grooves 516, and the second holding grooves 516 hold the outer periphery of the substrate W. The plurality of second arms 515 hold the respective outer peripheries of the plurality of substrates W at intervals along the circumferential direction.

[0086] Further, the plurality of second arms 515 also have through grooves 517 arranged at the second pitch P2 in the X-axis direction. The outer periphery of the substrate W is also inserted into the through grooves 517, but the through grooves 517 do not hold the outer periphery of the substrate W and allow the substrate W to pass through. The through grooves 517 and the second holding grooves 516 are alternately arranged in the X-axis direction. The through grooves 517 and the second holding grooves 516 are arranged at the same X-axis direction position as any of the plurality of first holding grooves 513.

[0087] Further, the lot forming section 51 has a driving device 518 that raises and lowers the first holding tool 511 with respect to the second holding tool 514. The first holding tool 511 is raised and lowered between a retreat position (refer to Figure 4B ) that is lower than the second holding tool 514 and a lot forming position (refer to Figure 4C ) that is higher than the second holding tool 514.

[0088] Next, the operation of the lot forming section 51 is described again with reference to Figure 4A , Figure 4B and Figure 4C .

[0089] First, as shown in Figure 4A , the first holding tool 511 is stopped at a receiving position that is lower than the second holding tool 514. The receiving position can be set between the retreat position and the lot forming position, or can be set at a position that is higher than the second holding tool 514. The first transport robot 53 inserts the substrates W a plurality of pieces at a time (for example, 5 pieces, only 2 pieces of the 5 pieces are shown in Figure 4A ) into the through slots 517 of the second holding tool 514, and hands over to the first holding tool 511. This operation is repeated a plurality of times, and the first holding tool 511 holds a plurality of pieces (for example, 25 pieces, only 6 pieces of the 25 pieces are shown in Figure 4A ) of the substrates W at the second pitch P2. Alternatively, the first transport robot 53 can insert the substrates W one piece at a time into the through slots 517 of the second holding tool 514, and hand over to the first holding tool 511.

[0090] Next, as shown in Figure 4B , the first holding tool 511 is lowered from the receiving position to the retreat position in order to prevent direct interference between the substrates W and the first transport arm 531 of the first transport robot 53. Then, the first transport robot 53 inserts the substrates W a plurality of pieces at a time (for example, 5 pieces, only 2 pieces of the 5 pieces are shown in Figure 4B ) into the second holding slots 516 of the second holding tool 514, and hands over to the second holding tool 514. This operation is repeated a plurality of times, and the second holding tool 514 holds a plurality of pieces (for example, 25 pieces, only 6 pieces of the 25 pieces are shown in Figure 4A ) of the substrates W at the second pitch P2. Alternatively, the first transport robot 53 can insert the substrates W one piece at a time into the second holding slots 516 of the second holding tool 514, and hand over to the second holding tool 514.

[0091] Next, as shown in Figure 4CAs shown, the first holding device 511 is raised from the retreat position to the lot forming position. On the way, the first holding device 511 receives the substrates W from the second holding device 514 with the empty first holding slots 513, and combines the substrates W held originally, thereby forming the lot L.

[0092] One lot L includes, for example, N pieces of substrates W of one cassette C. One lot L can include one piece of substrates W of one cassette C, or more than three pieces of substrates W of one cassette C. One lot L includes a plurality of pieces of substrates W at the first pitch PI.

[0093] The lot forming section 51 can also have a not-shown third holding device. Like the second holding device 514, the third holding device holds a plurality of pieces of substrates W at the second pitch P2, and hands over the held substrates W to the first holding device 511. The first holding device 511 receives the substrates W not only from the second holding device 514 but also from the third holding device, and therefore, it is possible to increase the ratio N of the first pitch PI to the second pitch P2, and to increase the number of pieces of substrates W handled in lots.

[0094] Next, the lot releasing section 81 will be described with reference to Figure 5 , Figure 6A , Figure 6B and Figure 6C . Note that the number of pieces of substrates W is shown smaller than the actual number of pieces in terms of the occupied space in the drawing. The same applies to the number of first holding slots 813, the number of second holding slots 816, and the number of through slots 817.

[0095] The lot releasing section 81 has a first holding device 811, as shown in Figure 6A . The first holding device 811 holds a plurality of pieces (for example, 50 pieces, of which only 12 pieces are shown in Figure 6A ) of substrates W at the first pitch PI in the Y-axis direction. As shown in Figure 5 , the first holding device 811 has a plurality of first arms 812. The number of first arms 812 is not limited to the number shown in the drawing.

[0096] The plurality of first arms 812 each extend in the Y-axis direction, and have first holding slots 813 arranged at the first pitch PI in the Y-axis direction. The outer periphery of a substrate W is inserted into the first holding slot 813, and the first holding slot 813 holds the outer periphery of the substrate W. The plurality of first arms 812 hold the respective outer peripheries of a plurality of pieces of substrates W at intervals along the circumferential direction.

[0097] Further, the lot releasing section 81 has a second holding device 814, as shown in Figure 6B . The second holding device 814 holds a plurality of pieces (for example, 25 pieces, of which only 12 pieces are shown in Figure 6B(Only 6 out of the 25 substrates shown in the diagram) are held at a second spacing P2 in the Y-axis direction. Figure 5 As shown, the second holding device 814 has multiple second arms 815. The number of second arms 815 is not limited to the number shown in the figure.

[0098] Multiple second arms 815 extend along the Y-axis and have second retaining grooves 816 arranged at a second spacing P2 in the Y-axis direction. The outer periphery of the substrate W is inserted into the second retaining grooves 816, thereby holding the outer periphery of the substrate W in the second retaining grooves 816. The multiple second arms 815 hold the respective outer peripheries of multiple substrates W at circumferential intervals.

[0099] Furthermore, the multiple second arms 815 also have through slots 817 arranged at a second spacing P2 in the Y-axis direction. The outer periphery of the substrate W is also inserted into the through slots 817, but the through slots 817 do not hold the outer periphery of the substrate W, allowing the substrate W to pass through. The through slots 817 and the second holding slots 816 are alternately arranged in the Y-axis direction. The through slots 817 and the second holding slots 816 are arranged at the same Y-axis position as any of the multiple first holding slots 813.

[0100] Furthermore, the batch release unit 81 includes a drive device 818, which raises and lowers the first holding device 811 relative to the second holding device 814. This raises the first holding device 811 to a lowering start position above the second holding device 814 (see reference). Figure 6A ) and the descent end position below the second holding device 814 (refer to Figure 6B It rises and falls between ).

[0101] Next, refer to it again. Figure 6A , Figure 6B and Figure 6C The actions of the batch release unit 81 are explained.

[0102] First, such as Figure 6A As shown, the first holding device 811 holds multiple substrates W in the Y-axis direction at a first spacing P1 at the descent start position. The first holding device 811 holds each of the multiple substrates W vertically. The descent start position is set above the third rinsing liquid tank 68.

[0103] Next, as Figure 6B As shown, the first holding device 811 descends to transfer a portion of batch L to the second holding device 814. The second holding device 814 receives multiple substrates W arranged at a second spacing P2 from the first holding device 811 in a third rinsing solution. At the end of the descent position, the first holding device 811 holds the multiple substrates W that have passed through the through groove 817 of the second holding device 814 at the second spacing P2 through the through groove.

[0104] As a result, the plurality of substrates W are held separately in the 3rd rinse liquid in the 1st holding device 811 and the 2nd holding device 814. The 2nd holding device 814 holds the plurality of substrates W at the 2nd pitch P2 at a position higher than the 1st holding device 811. Likewise, the 1st holding device 811 holds the plurality of substrates W at the 2nd pitch P2. The plurality of substrates W are held vertically respectively.

[0105] Next, as shown in FIG. 6, the 2nd transport robot 54 receives the substrates W from the 2nd holding device 814, takes out the substrates W one by one from the 3rd rinse liquid, and transports them to the single piece processing section 3. Since the substrates W are held at the 2nd pitch P2, interference between the substrates W and the 2nd transport arm 541 of the 2nd transport robot 54 can be prevented. In addition, the 2nd transport robot 54 can take out the substrates W one by one from the 3rd rinse liquid. This taking out is repeated until the substrates W are taken out from the 2nd holding device 814. Figure 6B

[0106] Next, as shown in FIG. 7, the 1st holding device 811 is raised for the purpose of handing over the substrates W to the 2nd transport robot 54. The 1st holding device 811 is stopped at a position slightly lower than the 2nd holding device 814, but can be stopped at a position higher than the 2nd holding device 814. As long as the substrates W continue to be immersed in the 3rd rinse liquid, it is acceptable. Figure 6C

[0107] Next, as shown in FIG. 8, the 2nd transport robot 54 receives the substrates W from the 1st holding device 811, takes out the substrates W one by one from the 3rd rinse liquid, and transports them to the single piece processing section 3. Since the substrates W are held at the 2nd pitch P2, interference between the substrates W and the 2nd transport arm 541 of the 2nd transport robot 54 can be prevented. In addition, the 2nd transport robot 54 can take out the substrates W one by one from the 3rd rinse liquid. This taking out is repeated until the substrates W are taken out from the 1st holding device 811. Figure 6C As described above, the substrates W are held in the 3rd rinse liquid until they are taken out from the 3rd rinse liquid by the 2nd transport robot 54. Since the substrates W exist at a position lower than the liquid surface of the 3rd rinse liquid, the surface tension of the 3rd rinse liquid does not act on the substrates W, and collapse of the concave-convex pattern of the substrates W can be prevented.

[0108] The batch release section 81 can also have a 3rd holding device not shown. Like the 2nd holding device 814, the 3rd holding device receives the plurality of substrates W arranged at the 2nd pitch P2 from the 1st holding device 811 in the 3rd rinse liquid. The 1st holding device 811 hands over the substrates W not only to the 2nd holding device 814 but also to the 3rd holding device, and thus the ratio N of the 1st pitch PI to the 2nd pitch P2 can be increased.

[0109] ​​​

[0110] In addition, in order to miniaturize the batch processing section 6, the lot release section 81 is provided to the third rinse liquid tank 68, but can be provided to a dedicated processing tank. As with the third rinse liquid tank 68, this processing tank is preferably used to store pure water. If pure water is used, the aging of the second transport arm 541 of the second transport robot 54 can be suppressed. In addition, the lot release section 81 can be provided to a chemical solution tank as long as the aging of the second transport arm 541 can be suppressed.

[0111] Next, the first transport robot 53 and the second transport robot 54 will be described with reference to Figure 7 , the number of the first transport arms 531 of the first transport robot 53 is illustrated to be less than the actual number according to the occupied space of the drawing.

[0112] The first transport robot 53 transports the substrate W from the single piece processing section 3 to the lot forming section 51 of the interface section 5. After the substrate W is formed into the lot L by the lot forming section 51, it is transported from the lot forming section 51 to the batch processing section 6.

[0113] The first transport robot 53 is, for example, a 6-axis robot having 6 rotary axes Rl, R2, R3, R4, R5, R6. In addition, the first transport robot 53 can be a 7-axis robot. Furthermore, the first transport robot 53 can be a multi-joint robot, an orthogonal robot, or the like. The orthogonal robot can also have a rotary axis.

[0114] The first transport robot 53 has the first transport arm 531 at the tip of its arm. The first transport arm 531 is used to hold the substrate W. The thickness of the first transport arm 531 is set to be able to be inserted between the thicknesses of the substrates W arranged at the second pitch P2 from each other. The first transport arm 531 can also be provided in plural so as to be able to transport a plurality of (for example, 5, in Figure 7 , only 2 of 5 are illustrated) substrates W in a lot.

[0115] The second transport robot 54 transports the substrate W from the batch processing section 6 to the single piece processing section 3. For example, the second transport robot 54 transports the substrate W from the third rinse liquid tank 68 to the liquid processing device 34. For the transport of the substrate W from the third rinse liquid tank 68 to the liquid processing device 34, the second transport robot 54 is used, and the second transport device 32 is not used. Thus, the second transport device 32 can be suppressed from being wetted by the third rinse liquid. In addition, the transport source is appropriately selected according to the structure of the batch processing section 6. Likewise, the transport destination is appropriately selected according to the structure of the single piece processing section 3.

[0116] The second conveyance robot 54 is configured similarly to the first conveyance robot 53, and has a second conveyance arm 541 at the tip of the arm. The second conveyance arm 541 is used to hold the substrate W. The thickness of the second conveyance arm 541 is set to be able to be inserted into the thickness between the substrates W arranged at the second pitch P2. The second conveyance arm 541 is provided only one for the purpose of conveying the substrate W one by one, but can be provided a plurality of second conveyance arms 541 so as to be able to convey a plurality of substrates W in batches.

[0117] Since the second conveyance arm 541 takes out the substrate W from the third rinse liquid, the second conveyance arm 541 is wetted with the third rinse liquid. In order to suppress the third rinse liquid from dripping from the second conveyance arm 541 toward the wrist, the second conveyance robot 54 is suspended from the ceiling 55 of the interface section 5. On the other hand, the first conveyance robot 53 is provided on the floor 56 of the interface section 5.

[0118] In addition, the second conveyance robot 54 and the first conveyance robot 53 can be configured in reverse, and the first conveyance robot 53 can be suspended from the ceiling 55 and the second conveyance robot 54 can be provided on the floor 56. In this case, the third rinse liquid adhering to the second conveyance arm 541 can be suppressed from dripping toward the first conveyance robot 53. The first conveyance robot 53 can always convey the substrate W in a dry state.

[0119] In addition, the first conveyance robot 53 and the second conveyance robot 54 can both be suspended from the ceiling 55, or both can be provided on the floor 56. Furthermore, one or more of the first conveyance robot 53 and the second conveyance robot 54 can be provided on the side wall. The side wall is disposed between the ceiling 55 and the floor 56, and is disposed vertically unlike the ceiling 55 and the floor 56. The ceiling 55 and the floor 56 are disposed horizontally.

[0120] In addition, the second conveyance robot 54 can be provided with a gas nozzle for blowing off liquid droplets adhering to the second conveyance arm 541. Furthermore, the second conveyance robot 54 can be provided with a water pan for recovering liquid droplets dripping from the second conveyance arm 541 toward the wrist. The liquid droplets are liquid droplets condensed from the third rinse liquid or the high-humidity gas.

[0121] Next, the substrate processing system 1 of the first modified example will be described with reference to Figure 10 The substrate processing system 1 of the first modified example will be described. Hereinafter, the differences between the present modified example and the above-described embodiment will be mainly described.

[0122] As described above, the substrate processing system 1 of the first modified example is configured as described above. Figure 10As shown, the substrate processing system 1 of the present modification is provided independently with the in-feed section 2A and the out-feed section 2B. The cassette C is fed to the in-feed section 2A in a state in which a plurality of substrates W are housed at the second pitch P2. Further, the cassette C is fed from the out-feed section 2B in a state in which a plurality of substrates W are housed at the second pitch P2.

[0123] Further, the substrate processing system 1 of the present modification has a second interface section 5A which is different from the interface section 5. The second interface section 5A hands over the substrates W between the in-feed section 2A and the batch processing section 6. The second interface section 5A has the batch forming section 51 and a conveyance robot 57.

[0124] The conveyance robot 57 is configured similarly to the first conveyance robot 53 shown in Fig. 1, for conveying the substrates W from the in-feed section 2A to the batch forming section 51. In addition, the conveyance robot 57 can convey all of the substrates W housed in one cassette C in a batch, for example, can convey 25 substrates W in a batch. Figure 7 The conveyance robot 57 is configured similarly to the first conveyance robot 53 shown in Fig. 1, for conveying the substrates W from the in-feed section 2A to the batch forming section 51. In addition, the conveyance robot 57 can convey all of the substrates W housed in one cassette C in a batch, for example, can convey 25 substrates W in a batch.

[0125] The interface section 5 of the present modification has a conveyance robot 58 which corresponds to the second conveyance robot 54 shown in Fig. 1. The conveyance robot 58 conveys the substrates W from the batch processing section 6 to the single processing section 3. The interface section 5 does not have the function of the first conveyance robot 53 shown in Fig. 1. In the interface section 5, the substrates W travel in a one-way traffic manner. Figure 7 The conveyance robot 58 conveys the substrates W from the batch processing section 6 to the single processing section 3. The interface section 5 does not have the function of the first conveyance robot 53 shown in Fig. 1. In the interface section 5, the substrates W travel in a one-way traffic manner. Figure 7

[0126] The second interface section 5A, the batch processing section 6, the interface section 5, and the single processing section 3 are arranged in this order along the conveyance direction of the substrates W between the in-feed section 2A and the out-feed section 2B. The substrates W are conveyed from the in-feed section 2A in the order of the arrows Al, A2, A3, A4 shown in Fig. 1, and are conveyed to the out-feed section 2B. Figure 10 The conveyance robot 58 conveys the substrates W from the batch processing section 6 to the single processing section 3. The interface section 5 does not have the function of the first conveyance robot 53 shown in Fig. 1. In the interface section 5, the substrates W travel in a one-way traffic manner.

[0127] According to the present modification, since the substrates W travel in a one-way traffic manner in the interface section 5 and the second interface section 5A, it is possible to suppress stagnation of the flow of the substrates W, and it is possible to improve the productivity.

[0128] The batch forming section 51 of the present modification is arranged similarly to the processing tanks such as the third rinse liquid tank 68 beside the long side of the third conveyance area 61 of the batch processing section 6. Specifically, the batch forming section 51, the first chemical solution tank 63, the first rinse liquid tank 64, the second chemical solution tank 65, the second rinse liquid tank 66, the third chemical solution tank 67, and the third rinse liquid tank 68 are arranged in a row in this order.

[0129] ​As described above, the batch forming section 51 is arranged along the long side of the third conveying region 61 of the batch processing section 6, like the processing tank such as the third rinse liquid tank 68. Thus, the arrangement direction of the substrates W is common between the batch forming section 51 and the processing tank. Therefore, the third conveying device 62 does not need to rotate around the vertical axis, and since there is no need for a rotation shaft, the configuration of the third conveying device 62 can be simplified.

[0130] Next, the substrate processing system 1 of the second modification example will be described with reference to Figure 11 to the first modification example. In the first modification example described above, the in-feed section 2A, the second interface section 5A, the batch processing section 6, the interface section 5, the single-piece processing section 3, and the out-feed section 2B are arranged in this order in a line.

[0131] In the present modification example, the in-feed section 2A, the second interface section 5A, the batch processing section 6, the interface section 5, the single-piece processing section 3, and the out-feed section 2B are arranged in this order in the shape of a letter U. Specifically, the in-feed section 2A, the second interface section 5A, and the batch processing section 6 are arranged in a line in the X-axis direction, the out-feed section 2B and the single-piece processing section 3 are arranged in a line in the X-axis direction, and the interface section 5 extends in the Y-axis direction from the batch processing section 6 to the single-piece processing section 3.

[0132] The interface section 5 has a conveying robot 58 corresponding to the second conveying robot 54, a transfer device 591, a conveying region 592, and a transfer device 593 as shown in FIG. 6. Figure 7 The conveying robot 58, the transfer device 591, the conveying region 592, and the transfer device 593 are arranged in this order in a line in the Y-axis direction.

[0133] A conveying device 594 is provided in the conveying region 592. The conveying device 594 has a conveying arm that moves in the horizontal direction (the X-axis direction and the Y-axis direction) and the vertical direction and rotates around the vertical axis. The conveying arm conveys the substrate W from the transfer device 591 to the other transfer device 593. The number of the conveying arms can be one or a plurality, and in the latter case, the conveying device 594 conveys a plurality (for example, five) of substrates W in a batch.

[0134] Next, the operation of the interface section 5 of the present modification example will be described. First, the conveying robot 58 takes out the substrate W from the third rinse liquid and conveys it to the transfer device 591. Next, the conveying device 594 conveys it from the transfer device 591 to the other transfer device 593. After that, the second conveying device 32 of the single-piece processing section 3 receives the substrate W from the transfer device 593 and conveys it to the liquid processing device 34.

[0135] The substrate W is conveyed from the in-feed section 2A to the batch processing section 6 in the same manner as in the first modification example described above. Figure 11The arrows A1, A2, A3, A4, A5, and A6 shown are sequentially transported to the delivery unit 2B.

[0136] The above describes embodiments of the substrate processing system and the substrate processing method of the present disclosure, but the present disclosure is not limited to the above-described embodiments and the like. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope of the claims. These are of course within the technical scope of the present disclosure.

[0137] For example, in the above-described embodiments and the above-described modified examples, the cassette C accommodates the substrates W at the second pitch P2 inside thereof, but can accommodate the substrates W at a pitch other than the second pitch P2. The substrates W can be accommodated at a pitch narrower than the second pitch P2 (for example, the first pitch P1), or can be accommodated at a pitch wider than the second pitch P2. If the batch release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2, interference between the substrates W and the transport robots 54 and 58 can be suppressed.

[0138] In the above-described embodiments and the above-described modified examples, the batch forming unit 51 narrows the pitch of the substrates W when forming the batch L, but can not narrow the pitch. For example, in a case where the substrates W of a number smaller than the maximum number of accommodated substrates of the cassette C are accommodated in the cassette C, the batch forming unit 51 can not narrow the pitch of the substrates W. In any case, if the batch release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2, interference between the substrates W and the transport robots 54 and 58 can be suppressed.

[0139] In the above-described embodiments and the above-described modified examples, the batch release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2 in a block-shaped processing liquid larger than the substrates W, but can widen the pitch of the substrates W from the first pitch P1 to the second pitch P2 in a mist-shaped processing liquid. Even if the processing liquid is mist-shaped, since drying of the substrates W can be prevented, collapse of the concave-convex pattern of the substrates W can be suppressed.

[0140] In the above-described embodiments and the above-described modified examples, as shown in Figure 7 The transport unit 52 includes the first transport robot 53 and the second transport robot 54, but can include one transport robot 41 as shown in Figure 8 The transport robot 41 functions as both the first transport robot 53 and the second transport robot 54.

[0141] The transport robot 41 has a first transport arm 531 of a first transport robot 53 and a second transport arm 541 of a second transport robot 54. The first transport arm 531 and the second transport arm 541 are respectively installed at the top end of the arm of the transport robot 41. The transport robot 41 transports the substrate W from the single piece processing section 3 to the batch forming section 51 using the first transport arm 531, and transports the substrate W from the batch processing section 6 to the single piece processing section 3 using the second transport arm 541.

[0142] As shown in FIG. 1, the transport robot 41 has a first transport arm 531 of a first transport robot 53 and a second transport arm 541 of a second transport robot 54. The first transport arm 531 and the second transport arm 541 are respectively installed at the top end of the arm of the transport robot 41. The transport robot 41 transports the substrate W from the single piece processing section 3 to the batch forming section 51 using the first transport arm 531, and transports the substrate W from the batch processing section 6 to the single piece processing section 3 using the second transport arm 541. Figure 8 As shown in FIG. 1, the transport robot 41 has a first transport arm 531 of a first transport robot 53 and a second transport arm 541 of a second transport robot 54. The first transport arm 531 and the second transport arm 541 are respectively installed at the top end of the arm of the transport robot 41. The transport robot 41 transports the substrate W from the single piece processing section 3 to the batch forming section 51 using the first transport arm 531, and transports the substrate W from the batch processing section 6 to the single piece processing section 3 using the second transport arm 541. Figure 8 In this embodiment, the movement mechanism 411 moves the second transport arm 541 relative to the top end of the arm of the transport robot 41, but can also move the first transport arm 531 relative to the top end of the arm of the transport robot 41.

[0143] As shown in FIG. 1, the transport robot 41 has a first transport arm 531 of a first transport robot 53 and a second transport arm 541 of a second transport robot 54. The first transport arm 531 and the second transport arm 541 are respectively installed at the top end of the arm of the transport robot 41. The transport robot 41 transports the substrate W from the single piece processing section 3 to the batch forming section 51 using the first transport arm 531, and transports the substrate W from the batch processing section 6 to the single piece processing section 3 using the second transport arm 541. Figure 8 As shown in FIG. 1, the transport robot 41 can be suspended from the ceiling 55, can be provided on the floor 56, and can be provided on the side wall.

Claims

1. A substrate processing system, wherein the substrate processing system has: a batch processing section which processes a batch containing a plurality of substrates in a first interval; a single-substrate processing section which processes the substrates of the batch one by one; and an interface section which interfaces the substrates between the batch processing section and the single-substrate processing section, the batch processing section includes: a processing tank which stores a processing liquid in a block or mist form; a first holding device which holds the substrates in the first interval; and a second holding device which receives the substrates arranged in a second interval from the first holding device in the processing liquid, the second interval being N times the first interval, N being a natural number of 2 or more, the interface section includes a conveyance section which conveys the substrates held separately in the first holding device and the second holding device in the processing liquid from the batch processing section to the single-substrate processing section, the substrate processing system further has a loading and unloading section for loading and unloading a cassette which houses a plurality of the substrates in the second interval, the loading and unloading section, the single-substrate processing section, the interface section, and the batch processing section are arranged in the order of the loading and unloading section, the single-substrate processing section, the interface section, and the batch processing section, the interface section includes a batch forming section for forming the batch.

2. The substrate processing system according to claim 1, wherein the batch processing section further includes a conveyance area which is rectangular in plan view, and a conveyance device which moves and rotates one side of the batch while holding the other side of the batch, the batch forming section is arranged beside a short side of the conveyance area, the processing tank is arranged beside a long side of the conveyance area, and the conveyance section is arranged beside both the batch forming section and the processing tank.

3. The substrate processing system according to claim 1 or 2, wherein the processing tank stores pure water for immersion of the batch.

4. The substrate processing system according to claim 1 or 2, wherein the batch processing section includes a chemical solution tank which stores dilute hydrofluoric acid for immersion of the batch.

5. The substrate processing system according to claim 1 or 2, wherein the batch processing section includes a chemical solution tank which stores a phosphoric acid aqueous solution for immersion of the batch.

6. The substrate processing system according to claim 1 or 2, wherein the batch processing section includes a chemical solution tank which stores SC1 for immersion of the batch.

7. The substrate processing system according to claim 1 or 2, wherein the batch processing section includes a chemical solution tank which stores SPM for immersion of the batch.

8. The substrate processing system according to claim 1 or 2, wherein the single-substrate processing section includes a liquid processing device which processes the substrates one by one using a liquid.

9. The substrate processing system according to claim 1 or 2, wherein the single-substrate processing section includes a drying device which dries the substrates one by one using a supercritical fluid.

10. A substrate processing system, wherein the substrate processing system has: a batch processing section which processes a batch containing a plurality of substrates in a first interval; ​ ​ a single piece processing section which processes the substrates of the batch one by one; and an interface section which interfaces the substrates between the batch processing section and the single piece processing section, the batch processing section includes a processing tank which stores a processing liquid in a block or mist form, a first holding device which holds the substrates at the first interval, and a second holding device which receives the substrates arranged at a second interval from the first holding device in the processing liquid, the second interval being N times the first interval, N being a natural number of 2 or more, the interface section includes a conveying section which conveys the substrates held separately in the first holding device and the second holding device in the processing liquid from the batch processing section to the single piece processing section, the substrate processing system further has a feeding-in section which feeds in a cassette which houses a plurality of the substrates at the second interval, a feeding-out section which feeds out a cassette which houses a plurality of the substrates at the second interval, and a second interface section which interfaces the substrates between the feeding-in section and the batch processing section, the second interface section includes a batch forming section which forms the batch, the second interface section, the batch processing section, the interface section, and the single piece processing section are arranged in the order of the second interface section, the batch processing section, the interface section, and the single piece processing section between the feeding-in section and the feeding-out section in the conveying direction of the substrates.

11. A substrate processing method comprising: a substrate processing method of conveying a substrate from a batch processing section which processes a batch containing a plurality of the substrates at a first interval to a single piece processing section which processes the substrates of the batch one by one, wherein the substrate processing method includes: interfacing a part of the batch from a first holding device which holds the substrates at the first interval to a second holding device which holds the substrates at a second interval in a processing liquid in a block or mist form, and then taking out the substrates from the processing liquid, wherein the second interval is N times the first interval, N being a natural number of 2 or more, the substrate processing method further includes: interfacing the substrates between the batch processing section and the single piece processing section by an interface section, and feeding in and out a cassette which houses a plurality of the substrates at the second interval by a feeding-in and feeding-out section, the feeding-in and feeding-out section, the single piece processing section, the interface section, and the batch processing section are arranged in the order of the feeding-in and feeding-out section, the single piece processing section, the interface section, and the batch processing section, the interface section includes a batch forming section which forms the batch.

12. The substrate processing method according to claim 11, wherein the processing liquid is pure water.

13. The substrate processing method according to claim 11 or 12, wherein the substrate processing method includes: immersing the batch in dilute hydrofluoric acid in the batch processing section.

14. The substrate processing method according to claim 11 or 12, wherein the substrate processing method includes: immersing the batch in an aqueous phosphoric acid solution in the batch processing section.

15. The substrate processing method according to claim 11 or 12, wherein The substrate processing method includes immersing the batch in SC1 at the batch processing section.

16. The substrate processing method according to claim 11 or 12, wherein The substrate processing method includes immersing the batch in SPM at the batch processing section.

17. The substrate processing method according to claim 11 or 12, wherein The substrate processing method includes processing the substrates one by one with a liquid at the single-substrate processing section.

18. The substrate processing method according to claim 17, wherein The substrate processing method includes drying the substrates one by one with a supercritical fluid at the single-substrate processing section.

19. The substrate processing method according to claim 11 or 12, wherein The substrate processing method includes: forming a liquid film of a drying liquid on a surface of the substrate on which a concavo-convex pattern is formed at the single-substrate processing section one by one; and drying a plurality of the substrates on which the liquid film is formed with a supercritical fluid in batches.

20. A substrate processing method comprising: The substrate processing method includes transporting a substrate from a batch processing section that processes a batch containing a plurality of the substrates in a first interval to a single-substrate processing section that processes the substrates of the batch one by one, wherein The substrate processing method includes transferring a part of the batch from a first holding tool that holds the substrates in the first interval to a second holding tool that holds the substrates in a second interval in a bulk or mist state of a processing liquid, and then taking out the substrates from the processing liquid, wherein the second interval is N times the first interval, N being a natural number of 2 or more, The substrate processing method further includes transferring the substrates between the batch processing section and the single-substrate processing section with an interface section, feeding in a cassette that accommodates a plurality of the substrates in the second interval with a feeding-in section, feeding out a cassette that accommodates a plurality of the substrates in the second interval with a feeding-out section, and transferring the substrates between the feeding-in section and the batch processing section with a second interface section, The second interface section includes a batch forming section that forms the batch, The second interface section, the batch processing section, the interface section, and the single-substrate processing section are arranged in the order of the second interface section, the batch processing section, the interface section, and the single-substrate processing section between the feeding-in section and the feeding-out section in the direction of transport of the substrates.

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