Antenna Packaging Structure and Packaging Method

Abstract

The present invention provides a packaging structure and packaging method for an antenna, the structure comprising a rewiring layer, a metal solder, a metal column, a packaging layer, an antenna metal layer, an antenna circuit chip and a metal bump. The metal column is fixed and electrically connected to the second surface of the rewiring layer by the metal solder, the metal solder completely covers the bottom of the metal column, the metal column is perpendicular to the rewiring layer, and the antenna circuit chip is electrically connected to the antenna metal layer through the rewiring layer and the metal column. The antenna packaging structure of the present invention connects the metal column to the surface of the rewiring layer by metal solder and laser heating process, and a large diameter metal column can be selected to improve the structural strength of the metal column, while reducing the feeder loss and improving the efficiency and performance of the antenna. At the same time, the metal solder can completely cover the bottom of the metal column, realize the vertical setting of the metal column, avoid the deviation of the top center and the end center of the metal column, and reduce the process deviation.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor packaging, and in particular relates to a packaging structure and a packaging method of an antenna. Background Art

[0002] With the advancement of technology, various high-tech electronic products have been developed to facilitate people's lives, including various electronic devices such as notebook computers, mobile phones, tablet computers (PADs), etc.

[0003] With the popularization of these high-tech electronic products and the increase in people's needs, in addition to the significant increase in the functions and applications configured in these high-tech products, in particular, the wireless communication function has been added to meet people's needs for mobility. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. This greatly increases the flexibility and convenience of using these high-tech electronic products. Therefore, people no longer have to be confined to a fixed area, breaking the boundaries of the scope of use, making the application of these electronic products truly convenient for people's lives.

[0004] Generally speaking, existing antenna structures usually include dipole antennas, monopole antennas, flat antennas, inverted F-shaped antennas, zigzag antennas, inverted L-shaped antennas, loop antennas, helical antennas, and spring antennas. A known practice is to directly fabricate the antenna on the surface of a circuit board, which causes the antenna to occupy additional circuit board area and has poor integration. How to reduce the circuit board area occupied by the antenna and improve the integration performance of the antenna packaging structure and the antenna efficiency are the problems that these electronic devices need to overcome. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a packaging structure and a packaging method of an antenna, so as to solve the problem of low efficiency and performance of the antenna in the prior art.

[0006] To achieve the above-mentioned purpose and other related purposes, the present invention provides a packaging structure of an antenna, the packaging structure comprising: a rewiring layer, the rewiring layer comprising a first surface and an opposite second surface; a metal column fixed and electrically connected to the second surface of the rewiring layer by metal solder, the metal solder completely covering the bottom of the metal column, the metal column being perpendicular to the rewiring layer; a packaging layer covering the metal column, and the metal column being exposed on its top surface; an antenna metal layer formed on the packaging layer, the antenna metal layer being connected to the metal column; an antenna circuit chip combined to the first surface of the rewiring layer and electrically connected to the antenna metal layer through the rewiring layer and the metal column; and a metal bump formed on the first surface of the rewiring layer to achieve electrical lead-out of the rewiring layer.

[0007] Optionally, the shape of the metal solder after solidification is a trapezoid, and the angle of the lower base angle of the trapezoid is between 45 degrees and 90 degrees.

[0008] Optionally, the metal solder includes tin or a gold-tin alloy, and the material of the metal column includes one of gold, silver, copper and aluminum.

[0009] Optionally, the radial width of the metal column is between 100 microns and 5000 microns.

[0010] Optionally, the radial width of the metal column is between 1000 microns and 2000 microns.

[0011] Optionally, the material of the encapsulation layer includes one of polyimide, silica gel and epoxy resin.

[0012] Optionally, the antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

[0013] The present invention also provides a packaging method for an antenna, the packaging method comprising the following steps: 1) providing a supporting substrate, and forming a separation layer on the supporting substrate; 2) forming a rewiring layer on the separation layer, the rewiring layer comprising a first surface connected to the separation layer and a second surface opposite thereto; 3) providing a metal column and a metal solder, melting the metal solder by a laser heating process, implanting the metal column on the second surface of the rewiring layer by the metal solder, and solidifying the metal solder, wherein the metal column is electrically connected to the rewiring layer; 4) packaging the metal column with a packaging layer, and thinning the packaging layer , so that the top surface of the metal column is exposed from the packaging layer; 5) forming an antenna metal layer on the packaging layer, the antenna metal layer is connected to the metal column; 6) peeling off the rewiring layer and the supporting substrate based on the separation layer to expose the first surface of the rewiring layer; 7) providing an antenna circuit chip, bonding the antenna circuit chip to the first surface of the rewiring layer, so that the antenna circuit chip is electrically connected to the antenna metal layer through the rewiring layer and the metal column; and 8) forming a metal bump on the first surface of the rewiring layer to realize the electrical lead-out of the rewiring layer.

[0014] Optionally, the metal solder completely covers the bottom of the metal column, and the metal column is perpendicular to the rewiring layer.

[0015] Optionally, the shape of the metal solder after solidification is a trapezoid, and the angle of the lower base angle of the trapezoid is between 45 degrees and 90 degrees.

[0016] Optionally, the metal solder includes tin or a gold-tin alloy, and the material of the metal column includes one of gold, silver, copper and aluminum.

[0017] Optionally, the supporting substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

[0018] Optionally, the separation layer includes a light-to-heat conversion layer, and in step 6), laser is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the encapsulation layer and the supporting substrate, thereby peeling off the rewiring layer and the supporting substrate.

[0019] Optionally, in step 4), the method of encapsulating the metal column with an encapsulation layer includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the material of the encapsulation layer includes one of polyimide, silicone and epoxy resin.

[0020] Optionally, the antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

[0021] Optionally, the radial width of the metal column is between 100 microns and 5000 microns.

[0022] Optionally, the radial width of the metal column is between 1000 microns and 2000 microns.

[0023] As described above, the packaging structure and packaging method of the antenna of the present invention have the following beneficial effects:

[0024] The antenna packaging structure of the present invention connects the metal column to the surface of the rewiring layer through metal solder and laser heating process. A large diameter metal column can be selected to improve the structural strength of the metal column. At the same time, the feed line loss can be reduced, and the efficiency and performance of the antenna can be improved.

[0025] The present invention prepares the metal column through the above process, so that the metal solder can completely cover the bottom of the metal column, thereby greatly improving the stability of the metal column. At the same time, the vertical setting of the metal column can be achieved, avoiding the deviation of the top center and the end center of the metal column, and reducing process deviation.

[0026] The present invention prepares the metal pillars through the above process, which can avoid the damage to the rewiring layer and the entire packaging structure caused by the traditional high-temperature reflow process, and greatly improve the process yield.

[0027] The present invention adopts a fan-out packaging method to package the antenna structure, which can effectively reduce the packaging volume, so that the antenna packaging structure has a higher integration and better packaging performance, and has broad application prospects in the field of semiconductor packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figures 1 to 13 It is a schematic diagram showing the structure of each step of the antenna packaging method of the present invention, wherein: Fig.13 Shown is a schematic structural diagram of the packaging structure of the antenna of the present invention.

[0029] Component number description

[0030] 101 Support base

[0031] 102 Separation Layer

[0032] 201 First dielectric layer

[0033] 202 First metal wiring layer

[0034] 203 Second dielectric layer

[0035] 204 Second metal wiring layer

[0036] 301 Metal Solder

[0037] 302 Metal Column

[0038] 303 Encapsulation layer

[0039] 304 Antenna metal layer

[0040] 401 Antenna Circuit Chip

[0041] 501 metal bumps DETAILED DESCRIPTION

[0042] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0043] See also Figures 1 to 13 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0044] like Figures 1 to 13 As shown, this embodiment provides a packaging method for an antenna, and the packaging method includes:

[0045] like Figure 1 As shown, step 1) is first performed to provide a supporting substrate 101 and to form a separation layer 102 on the supporting substrate 101 .

[0046] As an example, the support substrate 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate. In this embodiment, the support substrate 101 is selected as a glass substrate, which has a low cost, is easy to form a separation layer 102 on its surface, and can reduce the difficulty of the subsequent stripping process.

[0047] As an example, the separation layer 102 includes a light-to-heat conversion layer (LTHC), which is formed on the support substrate 101 by a spin coating process and then solidified by a curing process. The light-to-heat conversion layer (LTHC) has stable performance and a smooth surface, which is conducive to the subsequent preparation of the rewiring layer, and in the subsequent stripping process, the stripping difficulty is relatively low.

[0048] like Figure 2 to Figure 5 As shown, step 2) is then performed to form a rewiring layer on the separation layer 102, wherein the rewiring layer includes a first surface connected to the separation layer 102 and an opposite second surface.

[0049] Step 2) making the rewiring layer comprises the steps of:

[0050] like Figure 2 As shown, step 2-1) is performed to form a first dielectric layer 201 on the surface of the separation layer 102 using a chemical vapor deposition process or a physical vapor deposition process. The material of the first dielectric layer 201 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.

[0051] Preferably, the material of the first dielectric layer 201 is PI (polyimide) to further reduce the process difficulty and process cost.

[0052] like Figure 3 As shown, step 2-2) is performed to form a first metal layer on the surface of the first dielectric layer 201 by a sputtering process, and the metal layer is etched to form a patterned first metal wiring layer 202. The material of the first metal wiring layer 202 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.

[0053] like Figure 4 As shown, step 2-3) is performed to form a second dielectric layer 203 on the surface of the patterned first metal wiring layer 202 by chemical vapor deposition or physical vapor deposition, and the second dielectric layer 203 is etched to form a second dielectric layer 203 with patterned through holes. The material of the second dielectric layer 203 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphorus silicon glass, and fluorine-containing glass.

[0054] Preferably, the material of the second dielectric layer 203 is PI (polyimide) to further reduce the process difficulty and process cost.

[0055] like Figure 4As shown, step 2-4) is performed to fill the patterned through hole with a conductive plug, and then a second metal layer is formed on the surface of the second dielectric layer 203 by a sputtering process, and the metal layer is etched to form a patterned second metal wiring layer 204. The material of the second metal wiring layer 204 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.

[0056] Then, if Figure 5 As shown, the above steps 2-3) to 2-4) can be repeated to form a rewiring layer with a multi-layer stacking structure to achieve different wiring functions.

[0057] like Figure 6-7 As shown, step 3) is then performed to provide a metal column 302 and a metal solder 301, and the metal solder 301 is melted by a laser heating process. The metal column 302 is implanted on the second surface of the rewiring layer through the metal solder 301, and the metal solder 301 is solidified, and the metal column 302 is electrically connected to the rewiring layer.

[0058] For example, a metal column 302 with metal solder 301 at the bottom is vertically placed on the surface of the rewiring layer, and then the metal solder 301 is irradiated with laser at room temperature to melt the metal solder, and after it solidifies, the metal column 302 is fixedly connected to the rewiring layer.

[0059] The radial width D of the metal column 302 is between 500 microns and 5000 microns. Preferably, the radial width of the metal column 302 is between 1000 microns and 2000 microns. For example, the radial width of the metal column 302 can be 1100 microns, 1200 microns, 1500 microns, etc. The present invention adopts a laser heating process to melt the metal solder, and implants the metal column on the second surface of the rewiring layer through the metal solder. By selecting metal columns 302 of different diameters, a large diameter metal column 302 can be obtained, thereby improving the structural strength of the metal column 302, and at the same time reducing the feed line loss and improving the efficiency and performance of the antenna.

[0060] The metal solder includes tin or a gold-tin alloy, and the material of the metal column includes one of gold, silver, copper, and aluminum. For example, the metal solder 301 can be solder paste, and the metal column 302 can be a copper column. The metal solder 301 can effectively strengthen the bonding strength between the metal column 302 and the rewiring layer, and reduce the resistance between the metal column 302 and the rewiring layer.

[0061] The metal solder completely covers the bottom of the metal column, and the metal column is perpendicular to the rewiring layer. The shape of the metal solder after solidification is a trapezoid, and the height of the solder metal can be between 500 microns and 5000 microns. The angle a of the lower bottom angle of the trapezoid is between 45 degrees and 90 degrees. This solder metal angle range can improve the effective support of the metal solder to the side wall of the metal column, ensuring that the metal column can be set vertically and is easy to deviate or crack with the rewiring layer in subsequent processes. For example, when the angle of the lower bottom angle of the trapezoid is 50 degrees to 70 degrees, the above support effect is more significant. The metal column prepared by the above process of the present invention can make the metal solder completely cover the bottom of the metal column, thereby greatly improving the stability of the metal column. At the same time, the vertical setting of the metal column can be realized, avoiding the offset of the top center and the end center of the metal column, and reducing the process deviation. For example, if the metal column has an inclination angle, the top center and the end center are not on the same vertical line, which will make the subsequent processes (such as the production of antenna metal, etc.) difficult to align, resulting in a decrease in the stability of the production process. The present invention can realize the vertical setting of the metal column and can effectively solve the above problems. Furthermore, the metal column prepared by the above process of the present invention can avoid the damage caused by the traditional high-temperature reflow process to the rewiring layer and the entire packaging structure, greatly improving the process yield.

[0062] like Figure 8-Figure 9 As shown, step 4 is then performed to encapsulate the metal pillar 302 with an encapsulation layer 303 , and thin the encapsulation layer 303 so that the top surface of the metal pillar 302 is exposed from the encapsulation layer 303 .

[0063] As an example, a method of encapsulating the antenna structure using the encapsulation layer 303 includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the material of the encapsulation layer 303 includes one of polyimide, silicone and epoxy resin.

[0064] like Fig.10 As shown, step 5 is then performed to form an antenna metal layer 304 on the surface of the dielectric layer, and the antenna metal layer 304 is connected to the metal column 302 .

[0065] Then, the above steps 2) to 5) can be repeated to form a multi-layer stacked antenna structure, for example, the number of repetitions is not less than two times. The above steps can obtain a multi-layer antenna structure layer, and the multi-layer antenna structure will have a certain loss. The present invention uses a metal column 302 with a larger diameter and lower loss, which can greatly reduce the loss of the multi-layer antenna structure.

[0066] like Fig.11As shown, step 6 is then performed to peel off the encapsulation layer 303 and the supporting substrate 101 based on the separation layer 102 to expose the first surface of the rewiring layer.

[0067] Specifically, the separation layer 102 includes a light-to-heat conversion layer, and laser is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the encapsulation layer 303 and the supporting substrate 101 , thereby peeling off the rewiring layer and the supporting substrate 101 .

[0068] like Fig.12 As shown, step 7) is then performed to provide an antenna circuit chip 401, and the antenna circuit chip 401 is bonded to the first surface of the rewiring layer, so that the antenna circuit chip 401 is electrically connected to the antenna metal layer 304 through the rewiring layer and the metal pillar 302. For example, the antenna circuit chip 401 can be bonded to the first surface of the rewiring layer by a welding process or a ball planting process, so that the antenna circuit chip 401 is electrically connected to the rewiring layer.

[0069] For example, the antenna circuit chip 401 includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

[0070] like Fig.13 As shown, step 8) is finally performed to form metal bumps 501 on the first surface of the rewiring layer to achieve electrical extraction of the rewiring layer.

[0071] like Fig.13 As shown, the present embodiment also provides a packaging structure of an antenna, the packaging structure comprising: a rewiring layer, the rewiring layer comprising a first surface and an opposite second surface; a metal column 302, fixed and electrically connected to the second surface of the rewiring layer by a metal solder 301, the metal solder 301 completely covering the bottom of the metal column, the metal column 302 being perpendicular to the rewiring layer; a packaging layer 303, covering the metal column 302, and the top surface of which exposes the metal column 302; an antenna metal layer 304, formed on the packaging layer 303, the antenna metal layer 304 being connected to the metal column 302; an antenna circuit chip 401, combined with the first surface of the rewiring layer, and electrically connected to the antenna metal layer 304 through the rewiring layer and the metal column 302; and a metal bump 501, formed on the first surface of the rewiring layer to achieve electrical lead-out of the rewiring layer.

[0072] The radial width of the metal column 302 is between 500 microns and 5000 microns. Preferably, the radial width of the metal column 302 is between 1000 microns and 2000 microns. For example, the radial width of the metal column 302 can be 1100 microns, 1200 microns, 1500 microns, etc. The present invention adopts a laser heating process to melt the metal solder, and implants the metal column on the second surface of the rewiring layer through the metal solder. By selecting metal columns 302 of different diameters, a large diameter metal column 302 can be obtained, thereby improving the structural strength of the metal column 302, and at the same time reducing the feed line loss and improving the efficiency and performance of the antenna.

[0073] The metal solder includes tin or a gold-tin alloy, and the material of the metal column includes one of gold, silver, copper, and aluminum. For example, the metal solder 301 can be solder paste, and the metal column 302 can be a copper column. The metal solder 301 can effectively strengthen the bonding strength between the metal column 302 and the rewiring layer, and reduce the resistance between the metal column 302 and the rewiring layer.

[0074] The metal solder completely covers the bottom of the metal column, and the metal column is perpendicular to the rewiring layer. The shape of the metal solder after solidification is a trapezoid, and the height of the solder metal can be between 500 microns and 5000 microns. The angle of the lower bottom angle of the trapezoid is between 45 degrees and 90 degrees. The angle range of the solder metal can improve the effective support of the metal solder on the side wall of the metal column, ensuring that the metal column can be set vertically and easily offset or cracked with the rewiring layer in the subsequent process. For example, when the angle of the lower bottom angle of the trapezoid is 50 degrees to 70 degrees, the above support effect is more significant. The metal column prepared by the above process of the present invention can make the metal solder completely cover the bottom of the metal column, thereby greatly improving the stability of the metal column, and at the same time can realize the vertical setting of the metal column, avoid the offset of the top center and the end center of the metal column, and reduce the process deviation. The metal column prepared by the above process of the present invention can avoid the damage caused by the traditional high-temperature reflow process to the rewiring layer and the entire packaging structure, and greatly improve the process yield.

[0075] The material of the packaging layer 303 includes one of polyimide, silica gel and epoxy resin.

[0076] The antenna circuit chip 401 includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

[0077] The metal bump 501 includes one of tin solder, silver solder and gold-tin alloy solder.

[0078] As described above, the packaging structure and packaging method of the antenna of the present invention have the following beneficial effects:

[0079] The antenna packaging structure of the present invention connects the metal column to the surface of the rewiring layer through metal solder and laser heating process. A large diameter metal column can be selected to improve the structural strength of the metal column. At the same time, the feed line loss can be reduced, and the efficiency and performance of the antenna can be improved.

[0080] The present invention prepares the metal column through the above process, so that the metal solder can completely cover the bottom of the metal column, thereby greatly improving the stability of the metal column. At the same time, the vertical setting of the metal column can be achieved, avoiding the deviation of the top center and the end center of the metal column, and reducing process deviation.

[0081] The present invention prepares the metal pillars through the above process, which can avoid the damage to the rewiring layer and the entire packaging structure caused by the traditional high-temperature reflow process, and greatly improve the process yield.

[0082] The present invention adopts a fan-out packaging method to package the antenna structure, which can effectively reduce the packaging volume, so that the antenna packaging structure has a higher integration and better packaging performance, and has broad application prospects in the field of semiconductor packaging.

[0083] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An antenna packaging structure, characterized in that: The packaging structure comprises: a redistribution layer, the redistribution layer comprising a first side and an opposite second side; A metal column, wherein the metal solder is melted by a laser heating process, and the metal column is implanted on the second surface of the rewiring layer by the metal solder, and the metal solder is solidified, wherein the metal column is fixed and electrically connected to the second surface of the rewiring layer by the metal solder, and the metal solder completely covers the bottom of the metal column, and the shape of the metal solder after solidification is a trapezoid, and the angle of the lower bottom angle of the trapezoid is between 45 degrees and 90 degrees, and the metal column is perpendicular to the rewiring layer; A packaging layer, covering the metal pillar, with the metal pillar exposed on its top surface; An antenna metal layer is formed on the packaging layer, and the antenna metal layer is connected to the metal column; an antenna circuit chip, bonded to the first surface of the rewiring layer and electrically connected to the antenna metal layer through the rewiring layer and the metal pillar; and Metal bumps are formed on the first surface of the rewiring layer to realize electrical extraction of the rewiring layer.

2. The antenna packaging structure according to claim 1, characterized in that: The metal solder includes tin or a gold-tin alloy, and the material of the metal column includes one of gold, silver, copper and aluminum.

3. The antenna packaging structure according to claim 1, characterized in that: The radial width of the metal column is between 100 micrometers and 5000 micrometers.

4. The antenna packaging structure according to claim 3, characterized in that: The radial width of the metal column is between 1000 microns and 2000 microns.

5. The antenna packaging structure according to claim 1, characterized in that: The material of the packaging layer includes one of polyimide, silica gel and epoxy resin.

6. The antenna packaging structure according to claim 1, characterized in that: The antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

7. A packaging method for an antenna, characterized in that: The packaging method comprises the steps of: 1) providing a supporting substrate, and forming a separation layer on the supporting substrate; 2) forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface connected to the separation layer and an opposite second surface; 3) providing a metal column and a metal solder, melting the metal solder by a laser heating process, implanting the metal column on the second surface of the rewiring layer by the metal solder, and solidifying the metal solder, wherein the metal solder has a trapezoidal shape after solidification, the metal solder completely covers the bottom of the metal column, the metal column is perpendicular to the rewiring layer, and the bottom angle of the trapezoid is between 45 degrees and 90 degrees, and the metal column is electrically connected to the rewiring layer; 4) encapsulating the metal pillar with an encapsulation layer, and thinning the encapsulation layer so that the top surface of the metal pillar is exposed from the encapsulation layer; 5) forming an antenna metal layer on the packaging layer, wherein the antenna metal layer is connected to the metal column; 6) peeling off the rewiring layer and the supporting substrate based on the separation layer to expose the first surface of the rewiring layer; 7) providing an antenna circuit chip, and bonding the antenna circuit chip to the first surface of the rewiring layer, so that the antenna circuit chip is electrically connected to the antenna metal layer through the rewiring layer and the metal column; as well as 8) Forming metal bumps on the first surface of the rewiring layer to electrically lead out the rewiring layer.

8. The antenna packaging method according to claim 7, characterized in that: The metal solder includes tin or a gold-tin alloy, and the material of the metal column includes one of gold, silver, copper and aluminum.

9. The antenna packaging method according to claim 7, characterized in that: The supporting substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

10. The antenna packaging method according to claim 7, characterized in that: The separation layer includes a light-to-heat conversion layer. In step 6), laser is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the encapsulation layer and the supporting substrate, thereby peeling off the rewiring layer and the supporting substrate.

11. The antenna packaging method according to claim 7, characterized in that: Step 4) The method of encapsulating the metal column with an encapsulation layer includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the material of the encapsulation layer includes one of polyimide, silicone and epoxy resin.

12. The antenna packaging method according to claim 7, characterized in that: The antenna circuit chip includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.

13. The antenna packaging method according to claim 7, characterized in that: The radial width of the metal column is between 100 micrometers and 5000 micrometers.

14. The antenna packaging method according to claim 13, characterized in that: The radial width of the metal column is between 1000 microns and 2000 microns.

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