Stretchable display device

Abstract

Stretchable display device. According to one aspect of the present disclosure, a stretchable display device includes: a lower substrate; a plurality of first substrates, the plurality of first substrates being disposed on the lower substrate and including a plurality of pixels; a plurality of connecting lines, the plurality of connecting lines electrically connecting the plurality of pixels; a plurality of heat transfer lines, the plurality of heat transfer lines overlapping the plurality of connecting lines; and a heat sink, the heat sink being exposed to the outside and overlapping the plurality of connecting lines and the plurality of heat transfer lines. By doing so, the heat dissipation efficiency of the stretchable display device can be improved.

Description

Technical Field

[0001] The present disclosure relates to a stretchable display device, and more particularly, to a stretchable display device including a heat dissipation structure. Background Art

[0002] As display devices for monitors of computers, televisions, or cellular phones, there are organic light emitting display devices (OLEDs) that are self-light emitting devices and liquid crystal display devices (LCDs) that require a separate light source.

[0003] The applicable range of the display device is expanding to personal digital assistants in addition to monitors of computers and televisions, and display devices having a large display area and reduced volume and weight are being studied.

[0004] In addition, recently, a stretchable display device manufactured by forming a display unit and wiring on a flexible substrate such as plastic as a flexible material so as to be stretchable in a specific direction and changed in various forms is attracting attention as a next-generation display device. Summary of the invention

[0005] One objective to be achieved by the present disclosure is to provide a stretchable display device that improves the heat dissipation efficiency of the stretchable display device.

[0006] Another object to be achieved by the present disclosure is to provide a stretchable display device that can dissipate heat from top and bottom surfaces.

[0007] The objects of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0008] To achieve the above-mentioned purpose, according to one aspect of the present disclosure, a stretchable display device includes: a lower substrate; a plurality of first substrates, the plurality of first substrates are disposed on the lower substrate and include a plurality of pixels; a plurality of connection lines, the plurality of connection lines electrically connecting the plurality of pixels; a plurality of heat transfer lines, the plurality of heat transfer lines overlap the plurality of connection lines; and a heat sink, the heat sink is exposed to the outside and overlaps the plurality of connection lines and the plurality of heat transfer lines. By doing so, the heat dissipation efficiency of the stretchable display device can be improved.

[0009] According to another aspect of the present disclosure, a stretchable display device includes: a first flexible substrate; a plurality of rigid substrates, which are arranged on the first flexible substrate at intervals from each other; a light-emitting element and a transistor, which are arranged on each of the plurality of rigid substrates; a heat transfer layer, which transfers heat generated in the light-emitting element and the transistor; a plurality of connecting wires, which are in contact with the side surface of the heat transfer layer; and a bottom heat sink, which passes through the first flexible substrate and dissipates the heat transferred to the plurality of connecting wires. By doing so, the heat dissipation efficiency of the stretchable display device can be improved.

[0010] Additional details of example embodiments are included in the Detailed Description and the accompanying drawings.

[0011] According to the present disclosure, a heat transfer layer and a heat transfer line are included in a stretchable display device to dissipate heat, so that heat generated in a plurality of pixels can be effectively dissipated.

[0012] According to the present disclosure, a top heat sink and a bottom heat sink of a stretchable display device are included to dissipate heat to an upper portion and a lower portion of the stretchable display device.

[0013] The effects according to the present disclosure are not limited to the contents of the above examples, and more effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0015] Figure 1 is a schematic plan view of a stretchable display device according to an exemplary embodiment of the present disclosure;

[0016] Figure 2A and Figure 2B yes Figure 1 A schematic enlarged plan view of region A in FIG.

[0017] Figure 3 It is along Figure 2A A cross-sectional view taken along line III-III';

[0018] Figure 4A and Figure 4B yes Figure 3 A schematic enlarged plan view of region B in FIG.

[0019] Figure 5A , Figure 5B and Figure 5Cis a diagram illustrating a sub-bottom heat sink and a sub-top heat sink of a stretchable display device according to an exemplary embodiment of the present disclosure;

[0020] Fig. 6A and Figure 6B It is along Figure 2A A cross-sectional view taken along line VI-VI' in FIG.

[0021] Figure 7 is a cross-sectional view of a stretchable display device according to another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] By referring to the following together with the attached Figure 1 With the detailed description of the exemplary embodiments, the advantages and features of the present disclosure and the methods for achieving these advantages and features will be clear. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various ways. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure. Therefore, the present disclosure is limited only by the scope of the appended claims.

[0023] The shapes, sizes, ratios, angles, numbers, etc. shown in the accompanying drawings for describing exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the specification, similar reference numerals generally represent similar elements. In addition, in the following description of the present disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessary confusion of the subject matter of the present disclosure. Terms such as "including", "having" and "consisting of..." used herein are generally intended to allow the addition of other components unless these terms are used together with the term "only". Unless otherwise expressly stated, any reference to the singular may include the plural.

[0024] Components are interpreted as including general margins of error, even if not explicitly stated.

[0025] When terms such as “on,” “above,” “below,” and “next to” are used to describe the positional relationship between two components, one or more components may be disposed between the two components unless these terms are used together with the term “directly” or “just.”

[0026] When an element or layer is referred to as being “on” another element or layer, the other element or layer may be directly disposed on the element or layer, or other elements or layers may be interposed therebetween.

[0027] Although the terms "first", "second", etc. are used to describe various components, these components are not subject to these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of the present disclosure, the first component mentioned below can be the second component.

[0028] Like reference numbers generally refer to like elements throughout the specification.

[0029] For convenience of description, the size and thickness of each component shown in the drawings are illustrated, and the present disclosure is not limited to the illustrated size and thickness of the components.

[0030] The features of the various embodiments of the present disclosure may be combined or coupled with each other in part or in whole, and may be interlocked and operated in various technical ways, and the embodiments may be performed independently of each other or in association with each other.

[0031] Hereinafter, a stretchable display device according to exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0032] <Stretchable Display Device>

[0033] A stretchable display device may be referred to as a display device that can display an image even if the display device is bent or extended. Compared with common display devices of the related art, a stretchable display device may have high flexibility. Therefore, the shape of the stretchable display device may be freely changed according to the manipulation of the user to bend or extend the stretchable display device. For example, when the user holds the end of the stretchable display device to pull the stretchable display device, the stretchable display device may be extended by the force of the user. Alternatively, when the user places the stretchable display device on an uneven wall surface, the stretchable display device may be set to bend according to the surface shape of the wall surface. In addition, when the force applied by the user is removed, the stretchable display device may return to its original shape.

[0034] Figure 1 is a schematic plan view of a stretchable display device according to an exemplary embodiment of the present disclosure. Figure 1 , the stretchable display device 100 includes a lower substrate DS, a plurality of first substrates ST1 , a plurality of second substrates ST2 , a plurality of third substrates ST3 , a plurality of fourth substrates ST4 , a gate driver 150 , a plurality of flexible films 170 , and a printed circuit board 180 .

[0035] The lower substrate DS is a substrate that supports and protects several components of the stretchable display device 100. The lower substrate DS as a flexible substrate may be formed of a bendable or stretchable insulating material. For example, the lower substrate DS may be formed of a silicone rubber such as polydimethylsiloxane (PDMS) or an elastomer such as polyurethane (PU) or polytetrafluoroethylene (PTFE), and thus has a flexible property. However, the material of the lower substrate DS is not limited thereto.

[0036] The lower substrate DS is a soft substrate, so that it can expand and contract reversibly. In addition, the elastic modulus of the lower substrate DS can be several MPa to several hundred MPa, for example, it can be 0.7Mpa to 1MPa. In addition, the ductile breaking rate of the lower substrate DS can be 100% or more. Here, the ductile breaking rate refers to the extension distance when the object to be extended breaks or breaks. That is, the ductile breaking rate is defined as the percentage of the length of the original object to the length of the stretched object when the object has been fully stretched so that the object can be regarded as broken. For example, if the length of the object is 100cm when the object (e.g., the lower substrate DS) is not stretched, then when the object is sufficiently stretched so that the object becomes to break or break at this length, the object reaches a length of 110cm, and this time the object is stretched to 110% of its original length. In this case, the ductile breaking rate of the object is 110%. Since this data is the ratio of the stretched length as the numerator to the unstretched length as the denominator when the fracture occurs, it can be called the ductile breaking rate.

[0037] An object is considered damaged when it is no longer able to function properly in a structure or circuit. For example, a wire, which is a conductor, is considered broken when there is a significant degradation in its ability to carry current so that it cannot operate within the specifications of the circuit. Therefore, in some embodiments, it may not be necessary for the wire to be completely disconnected to be considered broken, and small stresses at the connection ends that cause it to not work within its intended function, small cracks, slight shifts in the position of the wire, or other movements will cause it to be considered a broken wire. If an insulator is stretched sufficiently that it can no longer provide the required amount of insulation for a structure or circuit, the insulator will be considered damaged. In some embodiments, fracture will also include inelastic stretching, where the object has been stretched sufficiently so that the object will not return to its original length and / or shape when it is no longer stretched.

[0038] The thickness of the lower substrate DS may be 10 μm to 1 mm, but is not limited thereto.

[0039] The lower substrate DS may have a display area AA and a non-display area NA surrounding the display area AA.

[0040] The display area AA is a region in the stretchable display device 100 where an image is displayed, and a light emitting element and various driving elements for driving the light emitting element are disposed in the display area AA. Figure 2A and Figure 2B As shown in the figure, the display area AA includes a plurality of pixels PX, and the pixel PX includes a plurality of sub-pixels SPX. The plurality of pixels PX are arranged in the display area AA and include a plurality of light-emitting elements. The plurality of sub-pixels SPX can be connected to various wirings, respectively. For example, the plurality of sub-pixels SPX can be connected to various wirings such as a gate line, a data line, a high potential power line, a low potential power line, and a reference voltage line.

[0041] The non-display area NA is an area adjacent to the display area AA. The non-display area NDA is adjacent to the display area AA to surround the display area AA. In the non-display area NA, an image is not displayed and wiring and circuit units may be formed. For example, in the non-display area NA, a plurality of pads may be provided, and the pads may be respectively connected to a plurality of sub-pixels SPX of the display area AA.

[0042] A plurality of first substrates ST1 and a plurality of second substrates ST2 are disposed on the lower substrate DS. The plurality of first substrates ST1 are disposed in the display area AA, and the plurality of second substrates ST2 may be disposed in the non-display area NA.

[0043] The plurality of first substrates ST1 and the plurality of second substrates ST2 are rigid substrates and are spaced apart from each other to be independently disposed on the lower substrate DS. The plurality of first substrates ST1 and the plurality of second substrates ST2 may be more rigid than the lower substrate DS. That is, the lower substrate DS may have more flexible properties than the plurality of first substrates ST1 and the plurality of second substrates ST2, and the plurality of first substrates ST1 and the plurality of second substrates ST2 may have more rigid properties than the lower substrate DS.

[0044] The plurality of first substrates ST1 and the plurality of second substrates ST2 as rigid substrates may be formed of a plastic material having flexibility, and may be formed of polyimide (PI), polyacrylate, or polyacetate, for example, but not limited thereto. In this case, the plurality of first substrates ST1 and the plurality of second substrates ST2 may be formed of the same material, but not limited thereto, and may be formed of different materials.

[0045] The modulus of the plurality of first substrates ST1 and the plurality of second substrates ST2 may be higher than the modulus of the lower substrate DS. The modulus is an elastic modulus indicating a deformation rate caused by stress, and the higher the modulus, the higher the hardness. Therefore, the plurality of first substrates ST1 and the plurality of second substrates ST2 may be a plurality of rigid substrates having greater rigidity than the lower substrate DS. For example, the modulus of the plurality of first substrates ST1 and the plurality of second substrates ST2 may be 1000 times the modulus of the lower substrate DS, but is not limited thereto.

[0046] For example, depending on transparency, the elastic modulus of the plurality of first substrates ST1 and the plurality of second substrates ST2 may be 2 GPa to 9 GPa. More specifically, when the plurality of first substrates ST1 and the plurality of second substrates ST2 are transparent, the elastic modulus is 2 GPa, and when the plurality of first substrates ST1 and the plurality of second substrates ST2 are opaque, the elastic modulus is 9 GPa.

[0047] At the same time, a plurality of first substrates ST1 and a plurality of second substrates ST2 having rigid characteristics are disposed on the lower substrate DS, so that a partial area of ​​the lower substrate DS overlapping with the plurality of first substrates ST1 and the plurality of second substrates ST2 can be defined as an area having rigidity. In addition, in the remaining area of ​​the lower substrate DS that does not overlap with the plurality of first substrates ST1 and the plurality of second substrates ST2, only the lower substrate DS is disposed, so that the remaining area can be defined as an area having flexibility. That is, an area in which the plurality of first substrates ST1 and the plurality of second substrates ST2 are disposed is defined as a plurality of rigid areas, and an area in which the plurality of first substrates ST1 and the plurality of second substrates ST2 are not disposed can be defined as a soft area. In this case, the plurality of first substrates ST1 and the plurality of second substrates ST2 are disposed to be spaced apart from each other, so that the plurality of rigid areas can also be disposed to be spaced apart from each other, and the soft area can be disposed to be surrounded by the plurality of rigid areas.

[0048] A plurality of pixels PX including a plurality of sub-pixels SPX may be disposed on a plurality of first substrates ST1. In each of the plurality of sub-pixels SPX of the plurality of first substrates ST1, a light emitting element and a driving element may be disposed, and various lines such as a gate line, a data line, and a power line may be disposed. Figure 2A and Figure 3 Let's describe the multiple sub-pixels SPX in more detail.

[0049] The gate driver 150 may be mounted on a plurality of second substrates ST2. The gate driver 150 may be disposed in the non-display area NA. When manufacturing various elements on the first substrate ST1, the gate driver 150 may be formed on the second substrate ST2 in a gate-in-panel (GIP) manner. Therefore, various circuit configurations such as various transistors, capacitors, and wirings constituting the gate driver 150 may be disposed on the plurality of second substrates ST2. However, the gate driver 150 may be mounted in a chip-on-film (COF) manner, but is not limited thereto. In addition, even in Figure 1 Although the gate driver 150 is illustrated as being disposed on both sides of the non-display area NA, the gate driver may be disposed only on one side of the non-display area NA.

[0050] Meanwhile, the size of the plurality of second substrates ST2 may be larger than the size of the plurality of first substrates ST1. As described above, on each of the plurality of second substrates ST2, the gate driver 150 is disposed. For example, a first-level STG of the gate driver 150 may be disposed on each of the plurality of second substrates ST2. Therefore, the area occupied by various circuit configurations constituting the first-level STG of the gate driver 150 may be relatively larger than the area on the first substrate ST1 on which the pixels PX are disposed. The size of each of the plurality of second substrates ST2 may be larger than the size of each of the plurality of first substrates ST1.

[0051] The plurality of third substrates ST3 are disposed between the plurality of first substrates ST1 and the plurality of second substrates ST2. The plurality of third substrates ST3 connecting the plurality of first substrates ST1 and the plurality of second substrates ST2 to each other are disposed between the plurality of first substrates ST1, between the plurality of second substrates ST2, and between the plurality of first substrates ST1 and the plurality of second substrates ST2. The plurality of third substrates ST3 are substrates that connect adjacent first substrates ST1, connect adjacent second substrates ST2, and connect mutually adjacent first substrates ST1 and second substrates ST2. The plurality of third substrates ST3 may be integrally formed by simultaneously forming the plurality of first substrates ST1 and the plurality of second substrates ST2 using the same material, but is not limited thereto.

[0052] The plurality of third substrates ST3 may be formed on a flat surface to have a wave shape. For example, the plurality of third substrates ST3 may have a sine wave shape. However, the shape of the plurality of third substrates ST3 is not limited thereto, and the plurality of third substrates ST3 may extend in a zigzag pattern, or may be formed to have various shapes such as a shape extending by connecting a plurality of diamond-shaped substrates at the apex. In addition, the number and shape of the plurality of third substrates ST3 are exemplary, and the number and shape of the plurality of third substrates ST3 may vary according to design.

[0053] The plurality of flexible films 170 are films in which various components are disposed on the base film 171 having flexibility and supply signals to the plurality of sub-pixels SPX of the display area AA. The plurality of flexible films 170 may be bonded to a plurality of pads disposed in the non-display area NA.

[0054] Specifically, the plurality of flexible films 170 are not directly bonded to the lower substrate DS, but may be bonded to the plurality of fourth substrates ST4. The plurality of fourth substrates ST4 are disposed on one side of the non-display area NA so that a plurality of pads bonded to the plurality of flexible films 170 are formed. In addition, in the plurality of fourth substrates ST4 bonded to the plurality of flexible films 170, wiring for transmitting signals from the plurality of flexible films 170 to the sub-pixels of the plurality of first substrates ST1 and the gate driver 150 of the plurality of second substrates ST2 may be disposed. The plurality of fourth substrates ST4 may be integrally formed by simultaneously forming the plurality of first substrates ST1 and the plurality of second substrates ST2 using the same material, but is not limited thereto.

[0055] The plurality of flexible films 170 supply power voltage, data voltage and gate signal to the plurality of sub-pixels SPX of the display area AA through the pads. The plurality of flexible films 170 include a bottom film 171 and a driving IC 172. In addition, various components may be additionally disposed on the flexible film 170. Meanwhile, even in Figure 1 Although four flexible films 170 are illustrated in FIG. 1 , the number of the plurality of flexible films 170 is not limited thereto.

[0056] The base film 171 is a layer supporting the driving IC 172 of the plurality of flexible films 170. The base film 171 may be formed of an insulating material, and, for example, may be formed of an insulating material having flexibility.

[0057] The driver IC 172 is a component that processes data for displaying an image and a driving signal for processing the data. Figure 1 In the embodiment, even though it is illustrated that the driver IC 172 is mounted in a COF manner, the driver IC may be mounted by a technique such as chip on glass (COG) or tape carrier package (TCP), but is not limited thereto.

[0058] A control unit such as an IC chip or a circuit unit may be mounted on the printed circuit board 180. In addition, a memory or a processor may be mounted on the printed circuit board 180. The printed circuit board 180 is a component that transmits a signal for driving the light emitting element to the light emitting element. Figure 1 Although the use of three printed circuit boards 180 is described in the above description, the number of printed circuit boards 180 is not limited thereto.

[0059] In addition, the stretchable display device 100 according to the exemplary embodiment of the present disclosure may further include a heat transfer line HTL disposed between the first substrate ST1 and the heat sink consisting of the top heat sink THU and the bottom heat sink.

[0060] The heat transfer line HTL is a line that transfers heat generated in the plurality of pixels PX to the outside of the pixels PX. The heat transfer line HTL is provided between the first substrates ST1 to transfer heat generated in the pixels PX to the soft area. Figure 1 As illustrated in FIG. 1 , the heat transfer lines HTL may be arranged in a matrix between the first substrates ST1 .

[0061] In addition, the heat sink is a component that dissipates the heat transferred by the heat transfer line HTL to the outside or the external environment through convection, conduction or other similar heat transfer principles. Specifically, the top heat sink THU is in contact with the heat transfer line HTL and is exposed to the outside. Therefore, the top heat sink THU can release the heat transferred from the heat transfer line HTL to the outside. For example, in Figure 1 , it is illustrated that the top heat sink THU is disposed in the intersection region of the plurality of heat transfer lines HTL. However, the present disclosure is not limited thereto, such that the top heat sink THU may be disposed in all regions overlapping the heat transfer lines HTL.

[0062] Will refer to Figure 2A and Figure 2B The heat transfer line HTL and the heat sink will be described in more detail.

[0063] In the following, reference will be made to Figure 2A and Figure 3 The plurality of sub-pixels SPX of the stretchable display device 100 according to an embodiment of the present disclosure is described in more detail.

[0064] <Planar and cross-sectional structures of pixels>

[0065] Figure 2A and Figure 2B yes Figure 1 Schematic enlarged plan view of region A in FIG. Figure 3 It is along Figure 2A A cross-sectional view taken along line III-III'.

[0066] Reference Figure 2A and Figure 3 , a plurality of first substrates ST1 are disposed on the lower substrate DS in the display area AA. Figure 1 As illustrated in FIG. 1 , the plurality of first substrates ST1 may be disposed in a matrix on the lower substrate DS, but is not limited thereto.

[0067] The buffer layer 111 is disposed on the plurality of first substrates ST1. The buffer layer 111 is a layer for protecting various components of the stretchable display device 100 from being penetrated by moisture and oxygen from the outside of the lower substrate DS and the plurality of first substrates ST1, and may be formed on the plurality of first substrates ST1. The buffer layer 111 may be composed of an insulating material, and may be composed of, for example, silicon nitride (SiN), silicon oxide (SiO x ) and silicon oxynitride (SiON) are formed into a single layer or a double layer of an inorganic layer. However, depending on the structure or characteristics of the stretchable display device 100, the buffer layer 111 may be omitted.

[0068] In this case, the buffer layer 111 may be formed only in the region overlapping with the plurality of first substrates ST1 and the plurality of second substrates ST2. As described above, the buffer layer 111 may be formed of an inorganic material, so that during the process of pulling the stretchable display device 100, the buffer layer may be easily broken or damaged. In this case, the buffer layer 111 is not formed in the region between the plurality of first substrates ST1 and the plurality of second substrates ST2, but is patterned to have the shape of the plurality of first substrates ST1 and the plurality of second substrates ST2 so as to be disposed only above the plurality of first substrates ST1 and the plurality of second substrates ST2. Therefore, in the stretchable display device 100 according to the exemplary embodiment of the present disclosure, the buffer layer 111 is formed only in the region overlapping with the plurality of first substrates ST1 and the plurality of second substrates ST2 as rigid substrates. Therefore, even if the stretchable display device 100 is bent or extended to be deformed, damage to the buffer layer 111 can be suppressed.

[0069] The transistor TR including an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE is disposed on the buffer layer 111 .

[0070] The active layer ACT is disposed on the buffer layer 111. For example, the active layer ACT may be formed of amorphous silicon (a-Si), polycrystalline silicon (poly-Si), or an organic semiconductor.

[0071] The first heat transfer layer 112 is disposed on the active layer ACT. The first heat transfer layer 112 electrically insulates the gate electrode GE from the active layer ACT and releases heat generated in the gate electrode GE and the active layer ACT. Therefore, the first heat transfer layer 112 may be formed of a material having low electrical conductivity and high thermal conductivity. For example, the first heat transfer layer 112 may be composed of a non-conductive heat exchange polymer, and may be composed of, for example, a polymer material having a chain structure or polyethylene nanofibers. In some exemplary embodiments, the first heat transfer layer 112 may be composed of silicon nitride (SiN x ) or silicon oxide (SiO x)-Silicon carbide (SiC) film or diamond film-Silicon nitride (SiN x ) or silicon oxide (SiO x ) is composed of a three-layer structure, but is not limited to this.

[0072] In addition, in order to release heat to the outside, the end of the first heat transfer layer 112 may be in contact with the connection line 140. Figure 3 , even though it is illustrated that both ends of the first heat transfer layer 112 are in contact with the connection line 140 , the present disclosure is not limited thereto, such that only one end of the first heat transfer layer 112 may be in contact with the connection line 140 .

[0073] The gate electrode GE is disposed on the buffer layer 111. The gate electrode GE is disposed to overlap the active layer ACT. The gate electrode GE may be any one of various metal materials (e.g., any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more thereof, or a multilayer thereof), but is not limited thereto.

[0074] The second heat transfer layer 113 is disposed on the gate electrode GE. The second heat transfer layer 113 insulates the gate electrode GE from the source electrode SE and the drain electrode DE, and releases the heat generated in the gate electrode GE, the source electrode SE, and the drain electrode DE. Therefore, the second heat transfer layer 113 may also be formed of a material having low electrical conductivity and high thermal conductivity. For example, the second heat transfer layer 113 may be composed of a non-conductive heat exchange polymer, and may be composed of, for example, a polymer material having a chain structure or polyethylene nanofibers. In some exemplary embodiments, the second heat transfer layer 113 may be composed of silicon nitride (SiN x ) or silicon oxide (SiO x )-Silicon carbide (SiC) film or diamond film-Silicon nitride (SiN x ) or silicon oxide (SiO x ) is composed of a three-layer structure, but is not limited to this.

[0075] In addition, in order to release heat to the outside, the end of the second heat transfer layer 113 may be in contact with the connection line 140. Figure 3 , even though it is illustrated that both ends of the second heat transfer layer 113 are in contact with the connection line 140 , the present disclosure is not limited thereto, such that only one end of the second heat transfer layer 113 may be in contact with the connection line 140 .

[0076] The source electrode SE and the drain electrode DE in contact with the active layer ACT are disposed on the second heat transfer layer 113. The source electrode SE and the drain electrode DE are disposed on the same layer spaced apart from each other. The source electrode SE and the drain electrode DE may be in contact with the active layer ACT to be electrically connected to the active layer ACT. The source electrode SE and the drain electrode DE may be any one of various metal materials (e.g., any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more thereof, or a multilayer thereof), but are not limited thereto.

[0077] In addition, the first heat transfer layer 112 and the second heat transfer layer 113 are patterned to be formed only in the region overlapping the plurality of first substrates ST1. The first heat transfer layer 112 and the second heat transfer layer 113 may be formed to include an inorganic material, so that during the process of stretching the stretchable display device 100, the first heat transfer layer 112 and the second heat transfer layer 113 may be easily broken and damaged. Therefore, the first heat transfer layer 112 and the second heat transfer layer 113 are not formed in the region between the plurality of first substrates ST1, but are patterned to have the shape of the plurality of first substrates ST1 to be formed only above the plurality of first substrates ST1.

[0078] Even in Figure 3 Only a driving transistor among various transistors TR that may be included in the stretchable display device 100 is exemplified, and a switching transistor or a capacitor may also be included in the stretchable display device 100. In addition, in the specification, even if it is described that the transistor TR has a coplanar structure, various transistors such as a staggered transistor may also be used.

[0079] A plurality of pads PE may be disposed on the second heat transfer layer 113. For example, a gate pad GP among the plurality of pads PE may be disposed on the second heat transfer layer 113. The gate pad GP is a pad that transmits a gate signal to a plurality of sub-pixels SPX. The gate signal may be transmitted from the gate pad GP to the gate electrode GE through a gate line formed on the first substrate ST1. The gate pad GP may be formed of the same material as the source electrode SE and the drain electrode DE, but is not limited thereto.

[0080] For example, a data pad DP among the plurality of pads PE may be disposed on the second heat transfer layer 113. The data pad DP is a pad that transmits a data signal to the plurality of sub-pixels SPX. The data signal may be transmitted from the data pad DP to the source electrode SE or the drain electrode DE through a data line formed on the first substrate ST1. The data pad DP may be formed of the same material as the source electrode SE and the drain electrode DE, but is not limited thereto.

[0081] The planarization layer 114 is formed on the transistor TR and the heat transfer layer 113. The planarization layer 114 planarizes the upper portion of the transistor TR. The planarization layer 114 may be composed of a single layer or multiple layers and may be formed of an organic material. For example, the planarization layer 114 may be formed of an acrylic-based organic material, but is not limited thereto.

[0082] Reference Figure 3 , a planarization layer 114 may be disposed on the plurality of first substrates ST1 to planarize the curved top surface of the second heat transfer layer 113. By doing so, a step of the second heat transfer layer 113 may be compensated. In addition, the planarization layer 114 can enhance the adhesive strength of the connection wire 140 disposed on the side surface of the planarization layer 114.

[0083] In some exemplary embodiments, a passivation layer may be formed between the transistor TR and the planarization layer 114. That is, the passivation layer may be formed to cover the transistor TR to protect the transistor TR from the penetration of moisture and oxygen. The passivation layer may be formed of an inorganic material and consist of a single layer or a multilayer, but is not limited thereto.

[0084] In addition, the third heat transfer layer 115 may be disposed on the planarization layer 114. That is, the third heat transfer layer 115 may be disposed between the LED 120 as a light emitting element and the transistor TR as a driving element. In addition, the third heat transfer layer releases heat generated in the LED 120 as a light emitting element.

[0085] Therefore, the third heat transfer layer 115 may be formed of a material having low electrical conductivity and high thermal conductivity. For example, the third heat transfer layer 115 may be composed of a non-conductive heat exchange polymer, and may be composed of, for example, a polymer material having a chain structure or polyethylene nanofiber. In some exemplary embodiments, the third heat transfer layer 115 may be composed of silicon nitride (SiNx) or silicon oxide (SiO x )-Silicon carbide (SiC) film or diamond film-Silicon nitride (SiNx) or silicon oxide (SiO x ) is composed of a three-layer structure, but is not limited to this.

[0086] In addition, in order to release the heat generated in the LED 120 to the outside, the end and the top surface of the third heat transfer layer 115 may be in contact with the connection wire 140. Figure 3 , even though it is illustrated that both ends of the third heat transfer layer 115 are in contact with the connection line 140 , the present disclosure is not limited thereto, such that only one end of the third heat transfer layer 115 may be in contact with the connection line 140 .

[0087] Meanwhile, a common line CL is disposed on the first heat transfer layer 112. The common line CL is a wiring that applies a common voltage to a plurality of sub-pixels SPX. The common line CL may be formed of the same material as the gate electrode GE of the transistor TR, but is not limited thereto.

[0088] The plurality of connection lines 140 are provided on the plurality of third substrates ST3. The plurality of connection lines 140 are wirings that electrically connect pads on the plurality of first substrates ST1 and the plurality of second substrates ST2.

[0089] In addition, the plurality of connection lines 140 are in contact with the first heat transfer layer 112 , the second heat transfer layer 113 , and the third heat transfer layer 115 to release heat generated in the pixel PX to the outside.

[0090] The plurality of connection lines 140 include first connection lines 141 and second connection lines 142. The first connection lines 141 and the second connection lines 142 are disposed between the plurality of first substrates ST1. Specifically, the first connection lines 141 refer to wiring extending in the X-axis direction between the plurality of first substrates ST1 and the plurality of second substrates ST2 among the plurality of connection lines 140. The second connection lines 142 refer to wiring extending in the Y-axis direction between the plurality of first substrates ST1 and the plurality of second substrates ST2 among the plurality of connection lines 140.

[0091] At the same time, even in Figure 2A and Figure 2B It is described in the figure that two connection lines 140 are provided between the plurality of first substrates ST1 and the plurality of second substrates ST2, but the number of the connection lines 140 is not limited thereto.

[0092] The plurality of connection lines 140 may be formed of a material having high electrical conductivity and high thermal conductivity.

[0093] For example, the connection line 140 may be formed of a metal material such as copper (Cu), aluminum (Al), titanium (Ti) and molybdenum, or a stacked structure of metal materials such as copper / molybdenum-titanium (Cu / MoTi) or titanium / aluminum / titanium (Ti / Al / Ti), but is not limited thereto.

[0094] The connection line 140 formed of the metal material as described above may have a wavy shape on a flat surface. For example, the plurality of connection lines 140 may have a sine wave shape. However, the shape of the plurality of connection lines 140 is not limited thereto, and the plurality of connection lines 140 may extend in a zigzag pattern, or may be formed with various shapes such as a shape extending by connecting a plurality of rhombus-shaped substrates at the apex. In addition, the number and shape of the plurality of connection lines 140 are illustrative, and the number and shape of the plurality of connection lines 140 may vary according to the design.

[0095] In addition, the connection line 140 may be formed of a laminated structure of a metal material, or may be formed of a base polymer in which conductive particles are dispersed and arranged in a linear shape between the first substrate ST1 and the plurality of second substrates ST2. Similar to the lower substrate DS, the base polymer may be composed of a bendable or stretchable insulating material. For example, the base polymer may include silicone rubber such as polydimethylsiloxane (PDMS), an elastomer such as polyurethane (PU) or styrene butadiene styrene (SBS), but is not limited thereto. Therefore, even if the stretchable display device 100 is bent or stretched, the base polymer will not be damaged.

[0096] The conductive particles may be dispersed in the base polymer. The conductive particles are dispersed in the base polymer to form a conductive path that electrically connects pads disposed in the first substrate ST1 and the second substrate ST2 adjacent to each other. The conductive particles may include at least one of silver (Ag), gold (Au), and carbon, but are not limited thereto.

[0097] Meanwhile, in the case of a common display device, various wirings such as a plurality of gate lines and a plurality of data lines extend between a plurality of sub-pixels in a linear shape, and a plurality of sub-pixels are connected to one signal line. Therefore, in a common display device, various wirings such as a gate line, a data line, a high potential power line, and a reference voltage line extend from one side of the display device to the other side without being disconnected on the substrate.

[0098] In contrast, in the case of the stretchable display device 100 according to the exemplary embodiment of the present disclosure, various wirings formed of a metal material such as a gate line, a data line, a power line, and a common line are disposed only on the plurality of first substrates ST1 and the plurality of second substrates ST2. That is, in the stretchable display device 100 according to the exemplary embodiment of the present disclosure, various wirings formed of a metal material and extending in a linear shape may be disposed only on the plurality of first substrates ST1 and the plurality of second substrates ST2. Therefore, the various wirings are patterned corresponding to the plurality of first substrates ST1 and the plurality of second substrates ST2 to be disposed discontinuously.

[0099] In the stretchable display device 100 according to the exemplary embodiment of the present disclosure, in order to connect discontinuous wirings on the plurality of first substrates ST1 and the plurality of second substrates ST2, a plurality of connection lines 140 are provided between the plurality of adjacent first substrates ST1, between the plurality of adjacent second substrates ST2, and between the plurality of first substrates ST1 and the plurality of second substrates ST2 adjacent to each other. The plurality of connection lines 140 may electrically connect the pads adjacent to each other on the plurality of first substrates ST1 and the plurality of second substrates ST2. For example, the pads on the adjacent first substrates ST1, the adjacent second substrates ST2, or the first substrates ST1 and the second substrates ST2 adjacent to each other may be electrically connected by the plurality of connection lines 140. Therefore, the stretchable display device 100 according to the exemplary embodiment of the present disclosure may include the plurality of connection lines 140 to electrically connect various wirings on the plurality of first substrates ST1 and the plurality of second substrates ST2 spaced apart from each other, between the plurality of first substrates ST1, between the plurality of second substrates ST2, and between the plurality of first substrates ST1 and the plurality of second substrates ST2.

[0100] The first connection line 141 may connect pads on two first substrates ST1 arranged side by side among pads on a plurality of first substrates ST1 arranged adjacent to each other in the X-axis direction. The first connection line 141 may be used as a gate line, a light emitting signal line, a high potential power line, or a low potential power line, but is not limited thereto. For example, the first connection line 141 may be used as a gate line and electrically connect the gate pads GP on two first substrates ST1 arranged side by side in the X-axis direction. Therefore, as described above, the gate pads GP on a plurality of first substrates ST1 arranged in the X-axis direction may be connected by the first connection line 141 used as a gate line, and a gate signal is transmitted.

[0101] Reference Figure 2A and Figure 2B , the second connection line 142 can connect the pads on two first substrates ST1 arranged side by side among the pads on the plurality of first substrates ST1 arranged adjacent to each other in the Y-axis direction. The second connection line 142 can be used as a data line, a high potential power line, a low potential power line or a reference voltage line, but is not limited thereto. For example, the second connection line 142 can be used as a data line and electrically connect the data lines on the two first substrates ST1 arranged side by side in the Y-axis direction. Therefore, as described above, the data pads DP on the plurality of first substrates ST1 arranged in the Y-axis direction can be connected by the plurality of second connection lines 142 used as data lines, and a data signal is transmitted.

[0102] Reference Figure 3, a first connection pad 131 and a second connection pad 132 are disposed on the third heat transfer layer 115. The first connection pad 131 is an electrode that electrically connects the LED 120 and the transistor TR to be described below. For example, the first connection pad 131 may electrically connect the drain electrode DE of the transistor TR and the LED 120 through a contact hole formed in the planarization layer 114 and the third heat transfer layer 115.

[0103] The second connection pad 132 is an electrode that electrically connects the LED 120 and the common line CL. For example, the second connection pad 132 may electrically connect the common electrode and the LED 120 through a contact hole formed in the planarization layer 114.

[0104] The LED 120 as an inorganic light-emitting element is provided as a light-emitting element on the first connection pad 131 and the second connection pad 132. The LED 120 may be transferred onto the first substrate ST1 through a transfer process. The LED 120 includes an n-type layer 121, an active layer 122, a p-type layer 123, an n-electrode 124, and a p-electrode 125. Hereinafter, it is assumed that the LED 120 of the stretchable display device 100 according to the exemplary embodiment of the present disclosure has a flip-chip structure in which the n-electrode 124 and the p-electrode 125 are formed on one surface. However, the LED 120 may be formed to have a vertical structure or a horizontal structure, and is not limited thereto.

[0105] The n-type layer 121 may be formed by implanting n-type impurities into gallium nitride (GaN). The n-type layer 121 may be disposed on a separate base substrate formed of a material capable of emitting light.

[0106] The active layer 122 is disposed on the n-type layer 121. The active layer 122 is a light emitting layer that emits light in the LED 120 and may be formed of a nitride semiconductor such as indium gallium nitride (InGaN). The p-type layer 123 is disposed on the active layer 122. The p-type layer 123 may be formed by injecting p-type impurities into gallium nitride (GaN).

[0107] As described above, the LED 120 according to the exemplary embodiment of the present disclosure may be manufactured by sequentially stacking the n-type layer 121, the active layer 122, and the p-type layer 123, and then etching a predetermined portion to form the n-electrode 124 and the p-electrode 125. In this case, a predetermined portion as a space for separating the n-electrode 124 and the p-electrode 125 from each other may be etched to expose a portion of the n-type layer 121. In other words, the surface of the LED 120 on which the n-electrode 124 and the p-electrode 125 are provided is not a flat surface but has different height levels.

[0108] As described above, in the etched region, in other words, on the n-type layer 121 exposed by the etching process, an n-electrode 124 is provided. The n-electrode 124 may be formed of a conductive material. Meanwhile, in the unetched region, in other words, on the p-type layer 123, a p-electrode 125 is provided. The p-electrode 125 may also be formed of a conductive material, and, for example, may be formed of the same material as the n-electrode 124.

[0109] An adhesive layer AD is provided between the first connection pad 131 and the p-electrode 125 and between the second connection pad 132 and the n-electrode 124 to attach the LED 120 to the first connection pad 131 and the second connection pad 132 .

[0110] The adhesive layer AD may be a conductive adhesive layer AD in which conductive balls are dispersed in an insulating base member. When heat or pressure is applied to the adhesive layer AD, the conductive balls are electrically connected in a portion to which heat or pressure is applied to have conductive properties, and the area to which pressure is not applied may have insulating properties. For example, the n-electrode 124 is electrically connected to the second connection line 142 by means of the adhesive layer AD, and the p-electrode 125 may be electrically connected to the first connection line 141 by means of the adhesive layer AD. That is, after the adhesive layer AD is applied to the first connection pad 131 and the second connection pad 132 using an inkjet method, the LED 120 is transferred onto the adhesive layer AD, and the LED 120 is pressurized and heated. By doing so, the first connection pad 131 may be electrically connected to the p-electrode 125, and the second connection pad 132 may be electrically connected to the n-electrode 124. However, the rest of the adhesive layer AD has an insulating property except for a portion of the adhesive layer AD disposed between the n-electrode 124 and the second connection pad 132 and a portion of the adhesive layer AD disposed between the p-electrode 125 and the first connection pad 131. Meanwhile, the adhesive layer AD may be divided into portions disposed on the first connection pad 131 and the second connection pad 132, respectively.

[0111] As described above, the stretchable display device 100 according to the exemplary embodiment of the present disclosure has a structure in which the LED 120 is disposed on the first substrate ST1 on which the transistor TR is disposed. Therefore, when the stretchable display device 100 is turned on, different voltage levels applied to the first connection pad 131 and the second connection pad 132 are transmitted to the n-electrode 124 and the p-electrode 125, so that the LED 120 can emit light.

[0112] At the same time, even if not illustrated in the figure, a bank may also be formed on the planarization layer 114. The bank may be disposed between adjacent sub-pixels SPX to minimize the color mixing phenomenon caused by light emitted from the LED 120 of one sub-pixel SPX and transmitted to the adjacent sub-pixel SPX. For example, the bank is disposed to cover at least a portion of the first connection pad 131 and the second connection pad 132, and may be spaced apart from the LED 120. The bank may be formed of an insulating material such as an acrylic-based resin, a benzocyclobutene (BCB)-based resin, or a polyimide, but is not limited thereto. In addition, the bank may also include a black material, for example, carbon black, but is not limited thereto.

[0113] The upper substrate US is provided to cover the plurality of first substrates ST1 and the third substrate ST3 on the lower substrate DS. The upper substrate US is a substrate that supports various components provided below the upper substrate US. Specifically, the upper substrate US can be formed by coating and curing a material constituting the upper substrate US on the lower substrate DS and the plurality of first substrates ST1.

[0114] The upper substrate US as a flexible substrate may be made of an insulating material that may be bendable or stretchable. The upper substrate US is a flexible substrate, so that it can be expanded and contracted reversibly. In addition, the elastic modulus of the upper substrate US may be several MPa to several hundred MPa, for example, 0.5 MPa to 1 MPa. In addition, the ductile fracture rate of the upper substrate US may be 100% or more. The thickness of the upper substrate US may be 10 μm to 1 mm, but is not limited thereto.

[0115] The upper substrate US may be formed of the same material as the lower substrate DS. The upper substrate US may be formed of a flexible material, for example, silicone rubber such as polydimethylsiloxane (PDMS) or an elastomer such as polyurethane (PU) or polytetrafluoroethylene (PTFE), but is not limited thereto.

[0116] Meanwhile, even if not illustrated in the figure, a polarizing layer may be further provided on the upper substrate US. The polarizing layer may perform the function of polarizing light incident from the outside of the stretchable display device 100 to reduce external light reflection. In addition, an optical film other than the polarizing layer may be provided on the upper substrate US.

[0117] The stretchable display device 100 needs to have a property that can be easily bent and stretched, so that a substrate having a small modulus and thus a flexible property is attempted to be used. However, when a flexible material such as polydimethylsiloxane (PDMS) having a small modulus is used as a lower substrate to be set when manufacturing a light-emitting element, there is a problem in that the substrate is damaged due to a high temperature (e.g., a temperature of 100° C. or higher due to the characteristics of a material having a small modulus that is easily affected by heat) generated during the process of forming the transistor TR and the light-emitting element.

[0118] Therefore, by forming a light-emitting element on a substrate formed of a material that can withstand high temperatures, it is possible to suppress the substrate from being damaged during the formation of the light-emitting element. Therefore, attempts are made to form the substrate using a material that can withstand high temperatures during the manufacturing process, such as polyimide (PI). However, since the modulus of the material that can withstand high temperatures is large, there is a problem in that these materials have no flexible properties, so that the substrate is hardly bent or stretched during the process of pulling the stretchable display device 100.

[0119] Therefore, in the stretchable display device 100 according to the exemplary embodiment of the present disclosure, the plurality of first substrates ST1 and the plurality of second substrates ST2 as rigid substrates are disposed only in the region where the transistor TR is disposed. By doing so, during the manufacturing process of the transistor TR, the plurality of first substrates ST1 and the plurality of second substrates ST2 are not damaged by high temperature.

[0120] In addition, in the stretchable display device 100 according to the exemplary embodiment of the present disclosure, the lower substrate DS and the upper substrate US, which are flexible substrates, may be disposed below and above the plurality of first substrates ST1 and the plurality of second substrates ST2. Therefore, the remaining areas of the lower substrate DS and the upper substrate US, except for the areas overlapping with the plurality of first substrates ST1 and the plurality of second substrates ST2, may be easily extended or bent, so that the stretchable display device 100 can be realized. In addition, the transistor TR, the LED 120, and the gate driver 150 disposed above the plurality of first substrates ST1 and the plurality of second substrates ST2, which are rigid substrates, may be suppressed from being damaged when the stretchable display device 100 is bent or extended.

[0121] Meanwhile, as described above, in the stretchable display device 100 according to the exemplary embodiment of the present disclosure, the first heat transfer layer 112 and the second heat transfer layer 113 may be disposed between the transistor TR. Therefore, the first heat transfer layer 112 and the second heat transfer layer 113 can effectively release the heat generated in the transistor TR to the outside. Specifically, at least one side end portion of each of the first heat transfer layer 112 and the second heat transfer layer 113 is in contact with the connection line 140, so that the first heat transfer layer 112 and the second heat transfer layer 113 can transfer the heat generated in the transistor TR to the connection line 140.

[0122] In addition, in the stretchable display device 100 according to the exemplary embodiment of the present disclosure, the third heat transfer layer 115 may be disposed between the LED 120 as the light emitting element and the transistor TR as the driving element. Therefore, the third heat transfer layer 115 may effectively release the heat generated in the LED 120 as the light emitting element and the transistor TR as the driving element to the outside. Specifically, the third heat transfer layer 115 may be in direct contact with the lower portions of the first connection pad 131 and the second connection pad 132 disposed under the LED 120 as the light emitting element. Therefore, the third heat transfer layer 115 may transfer the heat generated in the LED 120 as the light emitting element to the connection wire 140 through the first connection pad 131 and the second connection pad 132.

[0123] In addition, since the connection line 140 may be formed of a material having high thermal conductivity, heat transferred from the first heat transfer layer 112 , the second heat transfer layer 113 , and the third heat transfer layer 115 is transferred to the bottom heat sink BHU through the connection line 140 .

[0124] In addition, the bottom heat sink BHU may release heat transferred from the connection line 140 to the outside.

[0125] Meanwhile, the plurality of heat transfer lines HTL may be disposed in a matrix form in the soft region between the first substrates ST1 . In addition, the plurality of heat transfer lines HTL may partially overlap the plurality of connection lines 140 .

[0126] The plurality of heat transfer lines HTL include first heat transfer lines HTL1 and second heat transfer lines HTL2. The first heat transfer lines HTL1 and the second heat transfer lines HTL2 are disposed between the plurality of first substrates ST1. Specifically, the first heat transfer lines HTL1 refer to wiring extending in the X-axis direction between the plurality of first substrates ST1 and the plurality of first connection lines 141. The second heat transfer lines HTL2 refer to wiring extending in the Y-axis direction between the plurality of first substrates ST1 and the plurality of second connection lines 142.

[0127] At the same time, even in Figure 2A and Figure 2B 7 and 8 describe that one heat transfer line HTL is disposed between the plurality of first substrates ST1 , but the number of the plurality of heat transfer lines HTL is not limited thereto.

[0128] The plurality of heat transfer lines 140 may also be constructed of a material having high electrical conductivity and high thermal conductivity.

[0129] For example, the heat transfer line HTL may be formed of metal materials such as copper (Cu), aluminum (Al), titanium (Ti), and molybdenum, or a stacked structure of metal materials such as copper / molybdenum-titanium (Cu / Moti) or titanium / aluminum / titanium (Ti / Al / Ti), but is not limited thereto.

[0130] The heat transfer line HTL formed of the metal material as described above may have a wavy shape on a flat surface. For example, the plurality of heat transfer lines HTL may have a sine wave shape. However, the shape of the plurality of heat transfer lines HTL is not limited thereto, and the plurality of heat transfer lines HTL may extend in a zigzag pattern, or may be formed in various shapes such as a shape extending by connecting a plurality of rhombus-shaped substrates at vertices. In addition, the number and shape of the plurality of heat transfer lines HTL are exemplary, and the number and shape of the plurality of heat transfer lines HTL may vary according to the design.

[0131] In addition, the heat transfer line HTL may be formed of a laminated structure of a metal material, or may be formed of a base polymer in which conductive particles are dispersed and arranged between the first substrates ST1 in a linear shape. Similar to the lower substrate DS, the base polymer may be composed of a bendable or stretchable insulating material. For example, the base polymer may include silicone rubber such as polydimethylsiloxane (PDMS), an elastomer such as polyurethane (PU) or styrene butadiene styrene (SBS), but is not limited thereto. Therefore, when the stretchable display device 100 is bent or stretched, the base polymer is not damaged.

[0132] The conductive particles may be dispersed in the base polymer. The conductive particles enable the heat transfer line HTL to transfer heat. The conductive particles may include at least one of silver (Ag), gold (Au), and carbon, but are not limited thereto.

[0133] In addition, the top heat sink THU releases the heat transferred from the heat transfer line HTL to the outside.

[0134] Meanwhile, in some exemplary embodiments, Figure 2B As illustrated in FIG. 1 , a fifth substrate ST5 as a rigid substrate may be further disposed in an overlapped region of the plurality of heat transfer lines HTL and the plurality of connection lines 140 .

[0135] Therefore, the plurality of heat transfer lines HTL and the plurality of connection lines 140 disposed on the fifth substrate ST5 as a rigid substrate do not extend in one direction. Therefore, cracks caused in the overlapping regions of the plurality of heat transfer lines HTL and the plurality of connection lines 140 can be suppressed.

[0136] <Bottom Radiator>

[0137] Figure 4A and Figure 4B yes Figure 3 Schematic enlarged plan view of region B in FIG.

[0138] Reference Figure 3 and Figure 4A, the intermediate insulating layer INT1 and the bottom heat sink BHU may be disposed under the connection line 140. Specifically, a heat dissipation hole is formed in the third substrate ST3 and the lower substrate DS disposed under the connection line 140, and the intermediate insulating layer INT1 and the bottom heat sink BHU may be disposed in the heat dissipation hole.

[0139] The bottom radiator BHU can release the heat transferred from the connecting wire 140 to the outside. In order to release the heat to the outside, one surface of the bottom radiator BHU can be exposed to the outside, and the other surface thereof is adjacent to the connecting wire 140 to receive the heat. In addition, in order to release the heat, the bottom radiator BHU can be made of a material with high thermal conductivity. At the same time, the bottom radiator BHU is in contact with the extensible lower substrate DS, so that the bottom radiator can be made of a material with high elongation. That is, the bottom radiator BHU can be made of a material with high thermal conductivity and high elongation. For example, the bottom radiator BHU can be made of cross-linked silver nanowires (Ag-nanowires) or carbon nanotubes. In addition, the bottom radiator BHU is also made of a non-conductive heat exchange polymer, and can be made of a polymer material or polyethylene nanofibers having a chain structure, for example.

[0140] In addition, an intermediate insulating layer INT1 is disposed between the connection line 140 and the bottom heat sink BHU. The intermediate insulating layer INT1 electrically insulates the connection line 140 from the bottom heat sink BHU, and transfers heat of the connection line 140 to the bottom heat sink BHU.

[0141] Therefore, the intermediate insulating layer INT1 may be formed of a material having low electrical conductivity and high thermal conductivity. For example, the intermediate insulating layer INT1 may be formed of a non-conductive heat exchange polymer, and may be formed of a polymer material having a chain structure or polyethylene nanofibers, for example. In some exemplary embodiments, the intermediate insulating layer INT1 may be formed of silicon nitride (SiN x ) or silicon oxide (SiO x )-Silicon carbide (SiC) film or diamond film-Silicon nitride (SiN x ) or silicon oxide (SiO x ) is composed of a three-layer structure, but is not limited to this.

[0142] In addition, even in Figure 4A In the embodiment, only one columnar bottom heat sink BHU is illustrated in the heat dissipation hole. In some exemplary embodiments, Figure 4B As illustrated in FIG. 1 , the bottom heat sink BHU may be divided into a plurality of columnar sub-bottom heat sinks SBHU.

[0143] Specifically, Figure 4B, each of the sub bottom radiators SBHU may be a column extending in a direction perpendicular to a horizontal direction, which is an extending direction of the stretchable display device 100. In addition, the sub bottom radiators SBHU as described above may be disposed in the horizontal direction as an extending direction.

[0144] As described above, since the bottom heat sink BHU is divided into a plurality of sub-bottom heat sinks SBHU, the surface area of ​​the bottom heat sink BHU in contact with the outside can be increased. By doing so, the heat dissipation efficiency of the bottom heat sink BHU can be improved, so that the heat dissipation efficiency of the stretchable display device 100 can also be improved, thereby improving reliability.

[0145] FIG. 5A to FIG. 5C is a diagram illustrating a sub-bottom heat sink and a sub-top heat sink of a stretchable display device according to an exemplary embodiment of the present disclosure.

[0146] like Figure 5A , each of the sub-bottom heat sinks SBHU of the stretchable display device 100 according to an exemplary embodiment of the present disclosure may have a cylindrical shape extending in a direction perpendicular to the extending direction.

[0147] In some exemplary embodiments, in order to increase the surface area of ​​the sub-bottom heat sink SBHU, as Figure 5B By way of example, in the sub-bottom heat sink SBHU, the pins spirally arranged along the outer surface of the cylinder may be further included in the cylinder extending in a direction perpendicular to the extension direction. In other words, the sub-bottom heat sink SBHU may include threads coupled to the outer surface of the sub-bottom heat sink SBHU and extending from the outer surface of the sub-bottom heat sink SBHU in a spiral configuration. The number, size, arrangement and direction of the threads may be selected based on design factors such as, in particular, the amount of heat transfer desired.

[0148] In addition, in order to increase the surface area of ​​the sub-bottom heat sink SBHU, as Figure 5C As illustrated in FIG. 1 , the sub-bottom heat sink SBHU may be deformed such that the outer peripheral surface of a cylinder extending in a direction perpendicular to the extending direction has a predetermined curvature. Figure 5C As shown, the sub-bottom radiator SBHU may have a concave shape close to the center of the sub-bottom radiator SBHU, and its diameter at the top and bottom of the sub-bottom radiator SBHU is larger than the diameter at the center of the sub-bottom radiator SBHU. In some embodiments, the diameter can vary continuously. In one or more embodiments, the sub-bottom radiator SBHU has a convex shape, and its diameter at the center is larger than the diameter of the sub-bottom radiator SBHU at the top and bottom. Other configurations are also possible, such as a continuously tapered sub-bottom radiator SBHU with a top diameter that is larger or smaller than the bottom diameter.

[0149] As described above, in order to increase the surface area of ​​the sub-bottom radiator SBHU, the sub-bottom radiator SBHU can be deformed so that a spiral pin is additionally included on the outer surface or the outer surface has a predetermined curvature. Therefore, the surface area of ​​the bottom radiator BHU of the stretchable display device of the exemplary embodiment of the present disclosure that contacts the outside is increased, so that the heat dissipation efficiency can be increased.

[0150] As described above, heat transferred from the first, second, and third heat transfer layers 112, 113 is transferred to the bottom heat sink BHU through the connection wires 140. The bottom heat sink BHU may discharge heat transferred from the connection wires 140 to the lower portion of the stretchable display device 100.

[0151] <Top Radiator>

[0152] Fig. 6A and Figure 6B It is along Figure 2A A cross-sectional view taken along line VI-VI'.

[0153] like Fig. 6A , the stretchable display device 100 according to the exemplary embodiment of the present disclosure may release heat upward using the heat transfer line HTL, the line insulating layer INT2, and the top heat sink THU.

[0154] The plurality of heat transfer lines HTL are wirings that transfer heat from the plurality of connection lines 140 to the top heat sink THU.

[0155] Therefore, the plurality of heat transfer lines HTL may overlap the plurality of connection lines 140 , and the plurality of heat transfer lines HTL may contact the top heat sink THU.

[0156] As mentioned above Figure 2A Specifically, the plurality of heat transfer lines HTL may be disposed in a matrix form in the soft region between the first substrates ST1 . In addition, partial regions of the plurality of heat transfer lines HTL may overlap with the plurality of connection lines 140 .

[0157] The plurality of heat transfer lines HTL and the plurality of connection lines 140 need to be electrically isolated and need to effectively transfer heat.

[0158] Therefore, the wire insulation layer INT2 disposed between the plurality of heat transfer lines HTL and the plurality of connection lines 140 may be formed of a material having low electrical conductivity and high thermal conductivity. For example, the wire insulation layer INT2 may be composed of a non-conductive heat exchange polymer, and may be composed of, for example, a polymer material having a chain structure or polyethylene nanofibers. In some exemplary embodiments, the wire insulation layer INT2 may be composed of silicon nitride (SiN x ) or silicon oxide (SiOx )-Silicon carbide (SiC) film or diamond film-Silicon nitride (SiN x ) or silicon oxide (SiO x ) is composed of a three-layer structure, but is not limited to this.

[0159] However, even in Fig. 6A , it is illustrated that the wire insulating layer INT2 is disposed below the heat transfer line HTL, but the present disclosure is not limited thereto. Therefore, the bottom heat sink BHU may be disposed in various arrangements that insulate the connection wire 140 and the heat transfer line HTL therebetween.

[0160] The top heat sink THU dissipates the heat transferred from the heat transfer line HTL to the outside. In order to dissipate the heat to the outside, one surface of the top heat sink THU may be exposed to the outside, and the other surface thereof is adjacent to the heat transfer line 140 to receive the heat. In addition, in order to dissipate the heat, the bottom heat sink BHU may be composed of a material having a high thermal conductivity. At the same time, the top heat sink THU is in contact with the extensible upper substrate, so that the top heat sink may be composed of a material having a high elongation. That is, the top heat sink THU may be composed of a material having a high thermal conductivity and a high elongation. For example, the top heat sink THU may be composed of cross-linked Ag-nanowires or carbon nanotubes. In addition, the top heat sink THU may also be composed of a non-conductive heat exchange polymer, and may be composed of, for example, a polymer material having a chain structure or polyethylene nanofibers.

[0161] In addition, even in Fig. 6A In the figure, only one columnar top heat sink THU is illustrated in the heat dissipation hole. In some exemplary embodiments, Figure 6B By way of example, the top heat sink THU may be divided into a plurality of columnar sub-top heat sinks STHU.

[0162] Specifically, Figure 6B , each of the sub-top heat sinks STHU may be a column extending in a direction perpendicular to a horizontal direction, which is an extending direction of the stretchable display device 100. In addition, the sub-top heat sink STHU as described above may be disposed in the horizontal direction as an extending direction.

[0163] As described above, since the top heat sink THU is divided into a plurality of sub-top heat sinks STHU, the surface area of ​​the top heat sink BHU in contact with the outside can be increased. By doing so, the heat dissipation efficiency of the top heat sink THU can be improved, so that the heat dissipation efficiency of the stretchable display device is also improved, thereby improving reliability.

[0164] In addition, if Figure 5A, each of the sub-top heat sinks STHU of the stretchable display device 100 according to the exemplary embodiment of the present disclosure may have a cylindrical shape extending in a direction perpendicular to the extending direction of the stretchable display device.

[0165] In some exemplary embodiments, in order to increase the surface area of ​​the sub-top heat sink SBHU, as Figure 5B By way of example, in the sub-top heat sink SBHU, pins spirally disposed along the outer surface of the cylinder may be further included in the cylinder extending in a direction perpendicular to the extending direction.

[0166] In addition, in order to increase the surface area of ​​the sub-top heat sink STHU, such as Figure 5C By way of example, the sub-top heat sink STHU may be deformed such that an outer circumferential surface of a cylinder extending in a direction perpendicular to the extending direction has a predetermined curvature.

[0167] As described above, in order to increase the surface area of ​​the sub-top heat sink STHU, the sub-top heat sink STHU can be deformed so that a spiral pin is additionally included on the outer surface or the outer surface has a predetermined curvature. Therefore, the surface area of ​​the top heat sink THU of the stretchable display device of the exemplary embodiment of the present disclosure that contacts the outside is increased, so that the heat dissipation efficiency can be increased.

[0168] As described above, the heat transferred from the first heat transfer layer 112, the second heat transfer layer 113, and the third heat transfer layer 113 is transferred to the connection line 140. In addition, the heat transferred to the connection line 140 is transferred to the heat transfer line HTL through the wire insulation layer INT2. In addition, the heat is released to the top heat sink THU through the heat transfer line HTL, so that the upward heat dissipation of the stretchable display device 100 can be performed.

[0169] <Organic Light Emitting Device>

[0170] Figure 7 is a cross-sectional view of a stretchable display device according to another exemplary embodiment of the present disclosure. Figures 1 to 6B Compared with the stretchable display device 100 illustrated in Figure 7 In the stretchable display device 700 in FIG. 7 , the organic light emitting element 720 is different and a bank 715 and a heat dissipation encapsulation layer 716 are further provided. However, other configurations are substantially the same, and thus redundant descriptions will be omitted.

[0171] Reference Figure 7, the organic light emitting element 720 is arranged to correspond to each of the plurality of sub-pixels SPX, and emits light having a specific wavelength band. That is, the organic light emitting element 720 may be a blue organic light emitting element emitting blue light, a red organic light emitting element emitting red light, a green organic light emitting element emitting green light, or a white organic light emitting element emitting white light, but is not limited thereto. When the organic light emitting element 720 is a white organic light emitting element, the stretchable display device 700 may further include a color filter.

[0172] The organic light emitting element 720 includes an anode 721, an organic light emitting layer 722 and a cathode 723. Specifically, the anode 721 is disposed on the third heat transfer layer 115. The anode 721 is an electrode configured to supply holes to the organic light emitting layer 722. The anode 721 may be composed of a transparent conductive material having a high work function. Here, the transparent conductive material may include indium tin oxide (ITO), indium zinc oxide (IZO) or indium tin zinc oxide (ITZO). In addition, when the stretchable display device 700 is implemented as a top emission type, the anode 721 may further include a reflector.

[0173] For each of the sub-pixels SPX, the anodes 721 are disposed to be spaced apart from each other to be electrically connected to the transistor TR through the contact hole of the planarization layer 114. Figure 7 , it is illustrated that the anode 721 is electrically connected to the drain electrode DE of the transistor TR, but the anode 721 may be electrically connected to the source electrode SE.

[0174] The bank 715 is disposed on the anode 721 and the third heat transfer layer 115. The bank 715 is a component that divides adjacent sub-pixels SPX. The bank 715 is disposed to cover at least a portion of both sides of the adjacent anode 721 to expose a portion of the top surface of the anode 721. The bank 715 can suppress the problem that the current is concentrated at the corner of the anode 721 to emit light to the side surface of the anode 721 so that the undesired sub-pixel SPX emits light or the color is mixed. The bank 715 may be formed of an acrylic-based resin, a benzocyclobutene (BCB)-based resin, or a polyimide, but is not limited thereto.

[0175] The organic light emitting layer 722 is disposed on the anode 721. The organic light emitting layer 722 is configured to emit light. The organic light emitting layer 722 may include a light emitting material, and the light emitting material may include a phosphorescent material or a fluorescent material, but is not limited thereto.

[0176] The organic light-emitting layer 722 may be composed of one light-emitting layer. Alternatively, the organic light-emitting layer 722 may have a stacked structure in which a plurality of light-emitting layers are stacked with a charge generating layer stacked therebetween. In addition, the organic light-emitting layer 722 may further include at least one of a hole transport layer, an electron transport layer, a hole blocking layer, an electron blocking layer, a hole injection layer, an electron injection layer, and the like.

[0177] Reference Figure 7 , the cathode 723 is disposed on the organic light emitting layer 722. The cathode 723 supplies electrons to the organic light emitting layer 722. The cathode 723 may be formed of a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO) and tin oxide (TO) or ytterbium (Yb) alloy. Alternatively, the cathode 723 may be formed of a metal material.

[0178] The cathode 723 may be patterned to overlap with the plurality of first substrates ST1. That is, the cathode 723 is formed only in the region overlapping with the plurality of first substrates ST1, and may not be formed in the region between the plurality of first substrates ST1. Since the cathode 723 is formed of a material such as a transparent conductive oxide or a metal material, when the cathode 723 is formed in the region between the plurality of first substrates ST1, the cathode 723 may be damaged during the stretching process of the stretchable display device 700. Therefore, the cathode 723 may be formed to correspond to each of the plurality of first substrates ST1 on the flat surface. Referring to Figure 7 , the cathode 723 may be formed to have a region which does not overlap a region in which the connection line 140 is disposed, in a region overlapping with the plurality of first substrates ST1.

[0179] Unlike a general organic light-emitting display device, in the stretchable display device 700 according to another exemplary embodiment of the present disclosure, the cathode 723 is patterned to correspond to the plurality of first substrates ST1. Therefore, the cathodes 723 disposed on the plurality of first substrates ST1 can be independently supplied with low potential power through the connection line 140.

[0180] Meanwhile, in the present specification, it has been described that the LED 120 or the organic light emitting element 720 is used as the light emitting element, but a quantum dot light emitting diode (QLED) may also be used as the light emitting element, but is not limited thereto.

[0181] The heat dissipation encapsulation layer 716 is disposed on the organic light emitting element 720. The heat dissipation encapsulation layer 716 covers the organic light emitting element 720 and contacts a portion of the top surface of the bank 715 to seal the organic light emitting element 720. Therefore, the heat dissipation encapsulation layer 716 protects the organic light emitting element 720 from moisture, air, or physical impact penetrating from the outside.

[0182] In addition, the heat dissipation encapsulation layer 716 is used to dissipate heat generated in the organic light emitting element 720 upward. Therefore, the upper portion of the heat dissipation encapsulation layer 716 may be exposed to the outside, and the lower portion of the heat dissipation encapsulation layer 716 may be disposed to contact the organic light emitting element 720.

[0183] Specifically, the heat dissipation packaging layer 716 includes a first heat dissipation packaging layer 716 a , a second heat dissipation packaging layer 716 b and a third heat dissipation packaging layer 716 c .

[0184] The first heat dissipation encapsulation layer 716a is in contact with the organic light emitting element 720 and may be made of silicon nitride (SiN x ) or silicon oxide (SiO x )constitute.

[0185] The second heat-dissipating encapsulation layer 716 b is disposed on the first heat-dissipating encapsulation layer 716 a , and may be formed of a polymer including a carbon structure having high thermal conductivity, such as a silicon carbide (SiC) structure or a diamond structure.

[0186] The third heat dissipation encapsulation layer 716c is disposed on the second heat dissipation encapsulation layer 716b and may be made of silicon nitride (SiN x ) or silicon oxide (SiO x )constitute.

[0187] In addition, the top surface, bottom surface and side surface of the second heat dissipation packaging layer 716b are covered by the first heat dissipation packaging layer 716a and the third heat dissipation packaging layer 716c. By doing so, the second heat dissipation packaging layer 716b can be protected from external foreign matter by the first heat dissipation packaging layer 716a and the third heat dissipation packaging layer 716c.

[0188] In addition, since the second heat dissipation encapsulation layer 716b is composed of a polymer including a carbon structure, the heat dissipation encapsulation layer 716 is not broken by external particles. In addition, the interface contact properties with the first heat dissipation encapsulation layer 716a and the third heat dissipation encapsulation layer 716c composed of inorganic materials can be improved.

[0189] As described above, the heat dissipation encapsulation layer 716 includes the second heat dissipation encapsulation layer 716b having high thermal conductivity to discharge upward the heat generated in the organic light emitting element 720. Therefore, the heat dissipation efficiency of the stretchable display device 700 is increased to improve reliability.

[0190] Meanwhile, the heat dissipation encapsulation layer 716 covers the cathode 723, the cathode 723 is patterned to overlap with the plurality of first substrates ST1 and may be formed in each of the plurality of first substrates ST1. That is, the heat dissipation encapsulation layer 716 is disposed to cover one cathode 723 disposed in one first substrate ST1, and the heat dissipation encapsulation layers 716 disposed on each of the plurality of first substrates ST1 may be spaced apart from each other.

[0191] The heat dissipation encapsulation layer 716 may be formed only in the region overlapping with the plurality of first substrates ST1. As described above, the heat dissipation encapsulation layer 716 may be configured to include an inorganic material, so that during the stretching process of the stretchable display device 700, the heat dissipation encapsulation layer 716 may be easily broken or damaged. Specifically, since the organic light emitting element 720 is susceptible to moisture or oxygen, when the heat dissipation encapsulation layer 716 is damaged, the reliability of the organic light emitting element 720 may be reduced. Therefore, the heat dissipation encapsulation layer 716 may be formed only on the plurality of first substrates ST1 as a rigid substrate.

[0192] Exemplary embodiments of the present disclosure may also be described as follows:

[0193] According to one aspect of the present disclosure, a stretchable display device includes: a lower substrate; a plurality of first substrates, which are arranged on the lower substrate and include a plurality of pixels; a plurality of connecting lines, which electrically connect the plurality of pixels; a plurality of heat transfer lines, which overlap the plurality of connecting lines; and a heat sink, which is exposed to the outside and overlaps the plurality of connecting lines and the plurality of heat transfer lines.

[0194] Each of the plurality of pixels may include: a light emitting element that emits light; and a transistor that drives the light emitting element.

[0195] The stretchable display device may further include a plurality of heat transfer layers contacting the plurality of connection lines.

[0196] The plurality of heat transfer layers may include a first heat transfer layer disposed between an active layer and a gate electrode of the transistor.

[0197] The plurality of heat transfer layers may include a second heat transfer layer disposed between a gate electrode and a source electrode or between the gate electrode and a drain electrode of the transistor.

[0198] The plurality of heat transfer layers may include a third heat transfer layer disposed between the light emitting element and the transistor.

[0199] Each of the plurality of heat transfer layers is comprised of a non-conductive heat exchange polymer.

[0200] The stretchable display device may further include a wire insulating layer disposed between the plurality of connection wires and the plurality of heat transfer wires.

[0201] The plurality of connection lines may include: a plurality of first connection lines extending in a first direction; and a plurality of second connection lines extending in a second direction.

[0202] The plurality of heat transfer lines may include: a first heat transfer line extending in the first direction and disposed between the plurality of first connection lines; and a second heat transfer line extending in the second direction and disposed between the plurality of second connection lines.

[0203] The stretchable display device may further include an intermediate insulating layer disposed between the heat sink and the plurality of connection lines.

[0204] The stretchable display device may further include a rigid substrate overlapping crossing regions of the plurality of connection lines and the plurality of heat transfer lines.

[0205] The heat sink may be formed by cross-linking of silver nanowires (Ag-nanowires) or carbon nanotubes.

[0206] The heat sink may include a plurality of sub-heat sinks extending in a direction perpendicular to an extending direction of the stretchable display.

[0207] Pins spirally disposed along an outer surface of each of the plurality of sub-heat sinks may be disposed on the outer surface.

[0208] An outer surface of each of the plurality of sub-heat sinks may have a predetermined curvature.

[0209] The heat dissipation structure may include: a bottom heat sink disposed in a heat dissipation hole of the lower substrate; and a top heat sink disposed in a heat dissipation hole of an upper substrate opposite to the lower substrate. The light emitting element is an organic light emitting element.

[0210] The stretchable display device may further include a heat dissipation encapsulation layer disposed on the organic light emitting element.

[0211] The heat dissipation packaging layer may include: a first heat dissipation packaging layer, which is composed of an inorganic material and is in contact with the organic light-emitting element; a second heat dissipation packaging layer, which is composed of a polymer including a carbon structure and is in contact with the first heat dissipation packaging layer; and a third heat dissipation packaging layer, which is composed of an inorganic material and is in contact with the second heat dissipation packaging layer.

[0212] According to another aspect of the present disclosure, a stretchable display device includes: a first flexible substrate; a plurality of rigid substrates, which are arranged on the first flexible substrate at intervals from each other; a light-emitting element and a transistor, which are arranged on each of the plurality of rigid substrates; a heat transfer layer, which transfers heat generated in the light-emitting element and the transistor; a plurality of connecting wires, which are in contact with side surfaces of the heat transfer layer; and a bottom heat sink, which passes through the first flexible substrate and dissipates the heat transferred to the plurality of connecting wires.

[0213] The stretchable display device may further include: a second flexible substrate covering the light emitting element; a plurality of heat transfer lines overlapping the plurality of connecting lines to transfer heat of the plurality of connecting lines; and a top heat sink passing through the second flexible substrate and in contact with the plurality of heat transfer lines to dissipate heat transferred to the plurality of heat transfer lines.

[0214] The stretchable display device may further include a heat dissipation encapsulation layer disposed on the light emitting element and including a polymer including a carbon structure to dissipate heat generated in the light emitting element to the outside.

[0215] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the attached claims, and all technical concepts within their equivalent ranges should be understood to fall within the scope of the present disclosure.

[0216] CROSS-REFERENCE TO RELATED APPLICATIONS

[0217] This application claims the priority of Korean Patent Application No. 10-2019-0126231 filed on October 11, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.

Claims

1. A stretchable display device, comprising: lower base plate; a plurality of first substrates disposed on the lower substrate and comprising a plurality of pixels; A plurality of connection lines electrically connecting the plurality of pixels; a plurality of heat transfer lines disposed between the first substrates and overlapping the plurality of connection lines; and A heat sink is exposed to the outside and overlaps the plurality of connection lines and the plurality of heat transfer lines.

2. The stretchable display device according to claim 1, further comprising: a plurality of heat transfer layers in contact with the plurality of connection lines, and wherein each of the plurality of pixels comprises: a light emitting element that emits light; and A transistor drives the light emitting element.

3. The stretchable display device according to claim 2, wherein: The plurality of heat transfer layers includes a first heat transfer layer disposed between an active layer of the transistor and a gate electrode of the transistor.

4. The stretchable display device according to claim 2, wherein: The plurality of heat transfer layers include a second heat transfer layer disposed between a gate electrode of the transistor and a source electrode of the transistor or between the gate electrode and a drain electrode of the transistor.

5. The stretchable display device according to claim 2, wherein: The plurality of heat transfer layers include a third heat transfer layer disposed between the light emitting element and the transistor.

6. The stretchable display device according to claim 2, wherein: Each of the plurality of heat transfer layers is comprised of a non-conductive heat exchange polymer.

7. The stretchable display device according to claim 1, further comprising: A wire insulating layer is provided between the plurality of connection wires and the plurality of heat transfer wires.

8. The stretchable display device according to claim 1, wherein: The plurality of connecting lines include: a plurality of first connection lines extending in a first direction; and A plurality of second connection lines extend in a second direction.

9. The stretchable display device according to claim 8, wherein: The plurality of heat transfer lines include: a first heat transfer line extending in the first direction and disposed between the plurality of first connection lines; and A second heat transfer line extending in the second direction and disposed between the plurality of second connection lines.

10. The stretchable display device according to claim 9, wherein: The heat sink overlaps a region where the first heat transfer line and the second heat transfer line cross.

11. The stretchable display device according to claim 1, further comprising: An intermediate insulating layer is provided between the heat sink and the plurality of connection lines.

12. The stretchable display device according to claim 1, further comprising: A rigid substrate overlaps with intersection regions of the plurality of connection lines and the plurality of heat transfer lines.

13. The stretchable display device according to claim 1, wherein: The heat sink is formed by cross-linking of silver nanowires or carbon nanotubes.

14. The stretchable display device according to claim 1, wherein: The heat sink includes a plurality of sub-heat sinks extending in a direction perpendicular to an extending direction of the stretchable display device.

15. The stretchable display device according to claim 14, wherein: Each of the plurality of sub-heat sinks includes an outer surface on which a plurality of threads are disposed.

16. The stretchable display device according to claim 14, wherein: An outer surface of each of the plurality of sub-heat sinks has a predetermined curvature.

17. The stretchable display device according to claim 1, wherein: The radiator comprises: a bottom heat sink, the bottom heat sink being disposed in the heat dissipation hole of the lower substrate, and A top heat sink is disposed in a heat dissipation hole of an upper substrate opposite to the lower substrate.

18. The stretchable display device according to claim 2, wherein: The plurality of pixels include organic light emitting elements, and Wherein, the stretchable display device further includes a heat dissipation packaging layer arranged on the organic light-emitting element.

19. The stretchable display device according to claim 18, wherein: The heat dissipation packaging layer comprises: a first heat dissipation encapsulation layer, the first heat dissipation encapsulation layer being made of an inorganic material and being in contact with the organic light emitting element; a second heat dissipation encapsulation layer, the second heat dissipation encapsulation layer being composed of a polymer including a carbon structure and contacting the first heat dissipation encapsulation layer; and A third heat dissipation encapsulation layer is formed of an inorganic material and is in contact with the second heat dissipation encapsulation layer.

20. A stretchable display device, comprising: a first flexible substrate; a plurality of rigid substrates, the plurality of rigid substrates being arranged on the first flexible substrate at intervals from each other; a light emitting element and a transistor, the light emitting element and the transistor being disposed on each of the plurality of rigid substrates; a heat transfer layer that transfers heat generated in the light emitting element and the transistor; a plurality of connection lines, the plurality of connection lines being in contact with a side surface of the heat transfer layer; as well as A bottom heat sink passes through the first flexible substrate and dissipates heat transferred from the plurality of connection lines to the bottom heat sink.

21. The stretchable display device according to claim 20, further comprising: a second flexible substrate, wherein the second flexible substrate covers the light emitting element; a plurality of heat transfer lines, the plurality of heat transfer lines overlapping the plurality of connection lines to transfer heat from the plurality of connection lines; as well as A top heat sink passes through the second flexible substrate and contacts the plurality of heat transfer lines to dissipate heat transferred from the plurality of heat transfer lines to the top heat sink.

22. The stretchable display device according to claim 20, further comprising: A heat dissipation encapsulation layer is provided on the light emitting element and includes a polymer including a carbon structure to dissipate heat generated in the light emitting element to the outside.

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