An automatic assembly line for heat dissipation modules with double heat conduction blocks

Abstract

The invention relates to an automatic assembly line for a heat dissipation module with double heat conductive blocks, comprising a CPU heat conductive block loader, a GPU heat conductive block loader, a left translation machine, a left heat dissipation fin loader, a right heat dissipation fin loader, a heat conductive pipe loader, solder paste machines for both end points of the heat conductive pipe, a left end cover loader, a right end cover loader, a cover placing machine, a screw locking machine, a reflow soldering machine, a right translation machine, a cooling machine, a screw loosening machine, a cover taking machine, a finished product unloading machine and a plurality of carriers circulated and transported on the above machines. The invention can fully automatically assemble the heat dissipation module, and only requires several workers to load and unload materials, which not only improves the production efficiency and reduces the labor intensity, but also has high assembly precision and low defective rate, thereby greatly saving the production cost, and the amount of solder paste is easy to control, thereby ensuring the heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation module assembly, in particular to an automatic assembly line for a heat dissipation module with double heat conduction blocks. Background Art

[0002] Cooling modules are widely used in laptops to cool CPU and GPU. Figure 1 A dual-heat-conducting-block heat dissipation module shown comprises a heat pipe 21, a CPU heat-conducting block 22 and a GPU heat-conducting block 23 respectively fixed on the heat pipe 21 by solder paste, heat-dissipating fins 24 respectively fixed to both ends of the heat pipe 21 by solder paste, and end covers 25 respectively fixed to the outermost sides of both ends of the heat pipe 21 by solder paste for connecting to the motherboard; wherein the CPU heat-conducting block 22 and the GPU heat-conducting block 23 both comprise an iron cover 221 for connecting to the motherboard and a heat-dissipating copper sheet 222 fixed in the iron cover by solder paste; however, the heat-dissipating modules are currently assembled manually, and the following problems exist: 1. Since the sizes of the CPU heat-conducting block and the GPU heat-conducting block as well as the heat-dissipating fins and end covers at both ends are different, several or even dozens of workers are required to assemble, which not only has low production efficiency and high labor intensity, but also is difficult to ensure assembly accuracy, resulting in a high defect rate, thereby greatly increasing production costs; 2. The amount of solder paste is difficult to control, and too much or too little will affect the heat dissipation efficiency. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an automatic assembly line for a heat dissipation module with double heat conductive blocks.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an automatic assembly line for a dual-heat-conducting block heat dissipation module, comprising a CPU heat-conducting block loader, a GPU heat-conducting block loader, a left translation machine, a left heat sink fin loader, a right heat sink fin loader, a heat pipe loader, solder paste machines for both ends of the heat pipe, a left end cover loader, a right end cover loader, a cover placing machine, a screw locking machine, a reflow soldering machine, a right translation machine, a cooling machine, a screw loosening machine, a cover removing machine, a finished product unloading machine and a plurality of carriers located on the above-mentioned machines that can be circulated and transported; the carrier comprises a chassis and an upper cover; the chassis is provided with two groups of positioning grooves for correspondingly placing the parts of the heat dissipation module; the upper cover is provided with a plurality of bolts for connecting the chassis.

[0005] Preferably, the CPU thermal block loader and the GPU thermal block loader have the same structure, both comprising a thermal block rack, a turntable mechanism respectively arranged at the upper end of the thermal block rack, a copper sheet feeding mechanism, an iron cover feeding mechanism, a copper sheet picking robot, a solder paste printing mechanism, a solder paste amount detection mechanism, an iron cover picking robot, a thermal block loading robot, and a first section of a conveyor line; the copper sheet picking robot, the solder paste printing mechanism, the solder paste amount detection mechanism, the iron cover picking robot, and the thermal block loading robot are sequentially placed around the turntable mechanism, and a plurality of positioning jigs corresponding to the above mechanisms are arranged on the turntable mechanism; the copper sheet feeding mechanism and the iron cover feeding mechanism are respectively located on both sides of the front of the thermal block rack, corresponding to feeding the copper sheet picking robot and the iron cover picking robot; the first section of the conveyor line is located on the back of the thermal block rack, so as to facilitate loading by the thermal block loading robot.

[0006] Preferably, the left and right translation machines have the same structure, both comprising a translation frame, a second section conveyor line respectively arranged at the upper ends of the translation frame, and a feed conveyor line; the second section conveyor line is placed along the length direction of the translation frame; the feed conveyor line is located at the feeding end of the second section conveyor line, and the feed conveyor line is placed perpendicular to the second section conveyor line; a pushing mechanism for pushing the chassis onto the second section conveyor line is provided on the feed conveyor line; and a pushing mechanism for pushing the chassis onto the next machine is provided at the discharging end of the second section conveyor line.

[0007] Preferably, the left heat sink fin loader, the right heat sink fin loader, the left end cover loader and the right end cover loader have the same structure, and all include a loading frame, a tray feeding mechanism respectively arranged at the upper end of the loading frame, a loading robot, and a third section of the conveyor line; the tray feeding mechanism is located in front of the loading frame, and the third section of the conveyor line is located at the back of the loading frame; the loading robot takes the material from the tray feeding mechanism and sends it to the third section of the conveyor line.

[0008] Preferably, the heat pipe loader includes a heat pipe rack, a heat pipe conveying line respectively arranged at the upper end of the heat pipe rack, a solder paste printing mechanism, a solder paste amount detection mechanism, a horizontal flipping mechanism, a heat pipe feeding robot, and a fourth conveying line; the heat pipe conveying line and the fourth conveying line are placed in parallel, and the heat pipe conveying line is located in front of the heat pipe rack, and the fourth conveying line is located at the back of the heat pipe rack; the solder paste printing mechanism, the solder paste amount detection mechanism, and the horizontal flipping mechanism are all located above the heat pipe conveying line, and are placed in sequence along the conveying direction of the heat pipe conveying line; the heat pipe feeding robot takes the material from the horizontal flipping mechanism and sends it to the fourth conveying line.

[0009] Preferably, the solder paste dispensing machines at both ends of the heat pipe include a solder paste dispensing machine rack, two solder paste dispensing mechanisms respectively arranged at the upper ends of the solder paste dispensing machine rack, a solder paste amount detection mechanism, and a fifth section of the conveyor line; the two solder paste dispensing mechanisms and the solder paste amount detection mechanism are both located above the fifth section of the conveyor line, and are placed in sequence along the conveying direction of the fifth section of the conveyor line.

[0010] Preferably, a reflux conveyor line is arranged between the cover placing machine and the cover removing machine; the cover placing machine and the cover removing machine have the same structure, both comprising a conveying frame, a conveying mechanism respectively arranged on the conveying frame, and a sixth section conveyor line; the sixth section conveyor line and the reflux conveyor line are placed in parallel, and the sixth section conveyor line is arranged on the front side of the conveying frame, and the reflux conveyor line is arranged on the back side of the conveying frame; the conveying mechanism is located above the sixth section conveyor line, and is used for conveying the cover back and forth between the sixth section conveyor line and the reflux conveyor line.

[0011] Preferably, the screw locking machine and the screw loosening machine have the same structure, both comprising a screw tightening machine frame, a screw tightening mechanism arranged on the screw tightening machine frame, and a seventh conveyor line; the screw tightening mechanism is located above the seventh conveyor line; the screw locking machine also includes a screw height detection mechanism arranged above the seventh conveyor line and behind the screw tightening mechanism.

[0012] Preferably, the finished product unloading machine includes an unloading frame, a belt conveyor line, and an unloading robot arranged on the unloading frame and capable of respectively delivering the heat dissipation module and the chassis to the belt conveyor line and the first section conveyor line.

[0013] Preferably, the suction ends of the copper sheet picking robot, iron cover picking robot, heat conductive block feeding robot, feeding robot, and heat conductive tube feeding robot are all provided with visual sensors for taking pictures and locating the position of parts.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0015] The present invention can fully automatically assemble the heat dissipation module, and only requires a few workers to load and unload materials, which not only improves production efficiency and reduces labor intensity, but also has high assembly accuracy and low defective rate, thereby greatly saving production costs, and the amount of solder paste is easy to control, ensuring heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the present invention is further described below in conjunction with the accompanying drawings:

[0017] Attached Figure 1 This is a structural diagram of a dual-heat-conducting-block heat dissipation module;

[0018] Attached Figure 2 A top view of the automatic assembly line of the dual heat-conducting block heat dissipation module of the present invention;

[0019] Attached Figure 3 It is a structural diagram of the CPU heat conductive block loading machine in the present invention;

[0020] Attached Figure 4 It is a structural diagram of the left translation machine in the present invention;

[0021] Attached Figure 5 It is a structural diagram of the left heat sink fin loading machine in the present invention;

[0022] Attached Figure 6 It is a structural diagram of the heat transfer tube feeding machine in the present invention;

[0023] Attached Figure 7 It is a structural diagram of the solder paste machine at both ends of the heat pipe in the present invention;

[0024] Attached Figure 8 It is a structural diagram of the capping machine in the present invention;

[0025] Attached Fig. 9 It is a structural diagram of the screw locking machine in the present invention;

[0026] Attached Fig.10 It is a top view of the finished product blanking machine in the present invention;

[0027] Attached Fig.11 A top view of the chassis of the present invention;

[0028] Attached Fig.12 It is a structural diagram of the carrier in the present invention. DETAILED DESCRIPTION

[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] Attached Figure 2 The automatic assembly line of the dual heat-conducting block heat dissipation module of the present invention comprises a CPU heat-conducting block loader 1, a GPU heat-conducting block loader 2, a left translation machine 3, a left heat-dissipating fin loader 4, a right heat-dissipating fin loader 5, a heat-conducting pipe loader 6, a solder paste machine for both ends of the heat-conducting pipe 7, a left end cover loader 8, a right end cover loader 9, a cover placing machine 10, a screw locking machine 11, a reflow soldering machine 13, a right translation machine 14, a cooling machine 15, a screw loosening machine 16, a cover taking machine 17, a finished product unloading machine 18 and a plurality of carriers 12 that can be circulated and transported on the above-mentioned machines, which are connected in sequence at the head and the tail; Figure 11-12As shown, the carrier 12 includes a chassis 121 and an upper cover 123; the chassis 121 is provided with two groups of positioning grooves 122 for correspondingly placing various parts of the heat dissipation module; the upper cover 123 is provided with a plurality of bolts 124 for connecting the chassis 121; when working: the chassis 121 is first transported to the CPU heat conduction block loading station through the control of an external controller, and the copper sheet and the iron cover are fixed by solder paste through the CPU heat conduction block loading machine 1 to form a CPU heat conduction block, and then sent to the chassis 121; then the chassis 121 is transported to the GPU heat conduction block loading station , the GPU heat block loader 2 fixes the copper sheet and the iron cover with solder paste to form a GPU heat block, and then sends it to the chassis 121; then the chassis 121 is transported to the left heat sink fin loading station through the left translation machine 3, and the left heat sink fin is sent to the chassis 121 through the left heat sink fin loader 4; then the chassis 121 is transported to the right heat sink fin loading station, and the right heat sink fin is sent to the chassis 121 through the right heat sink fin loader 5; then the chassis 121 is transported to the heat pipe loading station, and the heat pipe loader 6 first brushes solder paste on the heat pipe connection part, and then The chassis 121 is transported to the chassis 121 and bonded to the CPU heat conduction block, GPU heat conduction block, left heat sink fin and right heat sink fin in the chassis 121 respectively; then the chassis 121 is transported to the solder paste point station at both ends of the heat conduction pipe, and solder paste is applied to the two ends of the heat conduction pipe respectively through the solder paste point machine 7 at both ends of the heat conduction pipe; then the chassis 121 is transported to the left end cover loading station, and the left end cover is transported to the chassis 121 by the left end cover loading machine 8, and bonded to the left end of the heat conduction pipe; then the chassis 121 is transported to the right end cover loading station, and the right end cover is transported to the chassis 121 by the right end cover loading machine 9, and bonded to the left end of the heat conduction pipe; The right end of the heat pipe is bonded; then the chassis 121 is transported to the cover placement station, and the upper cover 123 is placed on the chassis 121 by the cover placement machine 10; then the carrier 12 is transported to the screw locking station, and the bolts 124 on the upper cover 123 are locked by the screw locking machine 11 to achieve the connection between the upper cover 123 and the chassis 121; then the carrier 12 enters the reflow soldering machine 13 for reflow soldering and fixation, and is transported to the cooling machine 15 for cooling by the right translation machine 14; then the carrier 12 is transported to the screw loosening station, and the bolts on the upper cover 123 are loosened by the screw loosening machine 16

[0031] 124, to separate the upper cover 123 from the chassis 121; then the carrier 12 is transported to the upper cover removal station, and the upper cover 123 is removed from the chassis 121 by the upper cover removal machine 17; finally, the chassis 121 is transported to the finished product unloading station, and the heat dissipation module is removed by the finished product unloading machine 18, and at the same time, the chassis 121 is sent to the CPU heat conduction block loading station, and the work is cyclically performed in sequence.

[0032] Further, if Figure 3As shown, the CPU heat conducting block loader 1 and the GPU heat conducting block loader 2 have the same structure, and both include a heat conducting block rack 11, a turntable mechanism 18, a copper sheet feeding mechanism 15, an iron cover feeding mechanism 12, a copper sheet material taking manipulator 16, a solder paste printing mechanism 14, a solder paste amount detection mechanism 13, an iron cover material taking manipulator 19, a heat conducting block material feeding manipulator 17, and a first section of a conveyor line 10, respectively arranged at the upper end of the heat conducting block rack 11; the copper sheet material taking manipulator 16, the solder paste printing mechanism 14, the solder paste amount detection mechanism 13, the iron cover material taking manipulator 19, and the heat conducting block material feeding manipulator 17 are sequentially placed around the turntable mechanism 18, and five positioning fixtures corresponding to the above mechanisms are arranged on the turntable mechanism 18; the copper sheet feeding mechanism 15 and the iron cover feeding mechanism 12 are respectively located on both sides of the front of the heat conducting block rack 11, so as to facilitate loading and unloading by the staff; the first section of the conveyor line 10 is located on the back of the heat conducting block rack 11; the staff During operation, the copper sheet feeding mechanism 15 and the iron cover feeding mechanism 12 respectively feed the copper sheet feeding robot 16 and the iron cover feeding robot 19, and then the copper sheet feeding robot 16 sucks the copper sheet from the copper sheet feeding mechanism 15 and places it on the positioning fixture, and then the turntable mechanism 18 drives the positioning fixture to rotate to the next station, the solder paste printing mechanism 14 prints solder paste on the connecting part of the upper surface of the copper sheet, and then the turntable mechanism 18 drives the positioning fixture to rotate to the next station, the solder paste amount detection mechanism 13 detects whether the amount of solder paste on the copper sheet is qualified, and an alarm is given if it is unqualified, and if it is qualified, the turntable mechanism 18 drives the positioning fixture to rotate to the next station, the iron cover feeding robot 19 sucks the iron cover from the iron cover feeding mechanism 12 and places it on the copper sheet to form a heat conductive block, and then the turntable mechanism 18 drives the positioning fixture to rotate to the next station, and the feeding robot sucks the heat conductive block and places it on the chassis 121 on the first section of the conveyor line 10, and works in sequence.

[0033] Further, if Figure 4 As shown, the left translation machine 3 and the right translation machine 14 have the same structure, both of which include a translation frame 31, a second section conveyor line 34 respectively arranged at the upper end of the translation frame 31, and a feeding conveyor line 32; the second section conveyor line 34 is placed along the length direction of the translation frame 31; the feeding conveyor line 32 is located at the feeding end of the second section conveyor line 34, and the feeding conveyor line 32 is placed vertically with the second section conveyor line 34; a pushing mechanism 33 is arranged on the feeding conveyor line 32, and a pushing mechanism 35 is arranged at the discharging end of the second section conveyor line 34; when working, the pushing mechanism 33 pushes the chassis 121 on the feeding conveyor line 32 onto the second section conveyor line 34, and then the second section conveyor line 34 transports the chassis 121 to the discharging end, and finally the pushing mechanism 35 pushes the chassis 121 to the next machine; wherein, a lifting mechanism for lifting the chassis 121 can be respectively arranged below the discharging end of the feeding conveyor line 32 and the second section conveyor line 34 to facilitate pushing.

[0034] Further, if Figure 5As shown, the left heat sink fin loader 4, the right heat sink fin loader 5, the left end cover loader 8, and the right end cover loader 9 have the same structure, and all include a loading frame 41, a tray feeding mechanism 42, a loading robot 43, and a third section conveyor line 44 respectively arranged at the upper end of the loading frame 41; the tray feeding mechanism 42 is located in the front of the loading frame 41 to facilitate loading and unloading by the staff; the third section conveyor line 44 is located at the back of the loading frame 41; when working, the loading robot 43 takes the material from the tray feeding mechanism 42 and sends it to the chassis 121 of the third section conveyor line 44.

[0035] Further, if Figure 6 As shown, the heat-conducting pipe feeding machine 6 comprises a heat-conducting pipe rack 61, a heat-conducting pipe conveying line 62, a solder paste printing mechanism 63, a solder paste amount detection mechanism 65, a horizontal flipping mechanism 67, a heat-conducting pipe feeding robot 66, and a fourth section conveying line 64, respectively arranged at the upper end of the heat-conducting pipe rack 61; the heat-conducting pipe conveying line 62 and the fourth section conveying line 64 are placed in parallel; the heat-conducting pipe conveying line 62 is located in front of the heat-conducting pipe rack 61, which is convenient for the staff to load and unload; the fourth section conveying line 64 is located on the back of the heat-conducting pipe rack 61; the solder paste printing mechanism 63, the solder paste amount detection mechanism 65, and the horizontal flipping mechanism 67 are all located above the heat-conducting pipe conveying line 62, and are placed in sequence along the conveying direction of the heat-conducting pipe conveying line 62; the heat-conducting pipe feeding robot 66 is located at the discharge end of the heat-conducting pipe conveying line 62; when working: manually put a plurality of heat-conducting pipes filled with The material tray of the tube is placed at the feeding end of the heat pipe conveying line 62, and then the heat pipe conveying line 62 conveys the material tray to the bottom of the solder paste printing mechanism 63, and the solder paste is printed on the connection parts of the upper surfaces of multiple heat pipes through the solder paste printing mechanism 63. Then the heat pipe conveying line 62 conveys the material tray to the bottom of the solder paste amount detection mechanism 65, and the solder paste amount detection mechanism 65 detects whether the amount of solder paste on the heat pipe is qualified. If it is unqualified, an alarm is issued. If it is qualified, the heat pipe conveying line 62 conveys the material tray to the bottom of the horizontal flipping mechanism 67, and the horizontal flipping mechanism 67 flips the heat pipe 180 degrees so that its solder paste surface faces down. Finally, the heat pipe loading robot 66 absorbs the heat pipe and sends it to the chassis 121 of the fourth section conveying line 64, so that the solder paste surface is respectively bonded to the CPU heat block, GPU heat block, left heat sink fin, and right heat sink fin in the chassis 121.

[0036] Further, if Figure 7As shown, the solder paste dispenser 7 at both ends of the heat pipe includes a solder paste dispenser rack 71, two solder paste dispensers 73 respectively arranged at the upper ends of the solder paste dispenser rack 71, a solder paste quantity detection mechanism 74, and a fifth conveyor line 72; the two solder paste dispensers 73 and the solder paste quantity detection mechanism 74 are all located above the fifth conveyor line 72, and are placed in sequence along the conveying direction of the fifth conveyor line 72; when working, the fifth conveyor line 72 transports the chassis 121 to the bottom of the two solder paste dispensers 73, and solder paste is dispensed at the outermost connecting parts of the two ends of the heat pipe through the two solder paste dispensers 73, and then the fifth conveyor line 72 transports the chassis 121 to the solder paste quantity detection mechanism 74, and an alarm is given if it is unqualified, and if it is qualified, the fifth conveyor line 72 transports the chassis 121 to the next machine.

[0037] Further, if Figure 8 As shown, a reflux conveyor line 19 is arranged between the cap placing machine 10 and the cap removing machine 17; the cap placing machine 10 and the cap removing machine 17 have the same structure, both of which include a conveying frame 101, a conveying mechanism 103 respectively arranged on the conveying frame 101, and a sixth section conveyor line 102; the sixth section conveyor line 102 and the reflux conveyor line 19 are placed in parallel, and the sixth section conveyor line 102 is arranged on the front of the conveying frame 101, and the reflux conveyor line 19 is arranged on the back of the conveying frame 101; the conveying mechanism 103 is located above the sixth section conveyor line 102; when working, the conveying mechanism 103 of the cap removing machine 17 removes the upper cover from the chassis 121, places it on the reflux conveyor line 19, and conveys the upper cover 123 to the cap placing machine 10 through the reflux conveyor line 19, and then the conveying mechanism 103 of the cap placing machine 10 sucks the upper cover 123 and places it on the chassis 121 to realize the cycle work.

[0038] Further, if Fig. 9 As shown, the screw locking machine 11 and the screw loosening machine 16 have the same structure, both of which include a screw tightening machine frame 111, a screw tightening mechanism 113 arranged on the screw tightening machine frame 111, and a seventh conveyor line 112; the screw tightening mechanism 113 is located above the seventh conveyor line 112; when working, the seventh conveyor line 112 conveys the carrier 12 to the bottom of the screw tightening mechanism 113, and the bolts 124 on the upper cover 123 are loosened or tightened by the screw tightening mechanism 113; the screw locking machine 11 also includes a screw height detection mechanism 114 arranged above the seventh conveyor line 112 and behind the screw tightening mechanism 113, which can be used to detect whether the height of the bolt 124 after tightening is qualified, and if it is unqualified, an alarm is issued, and if it is qualified, the seventh conveyor line 112 conveys the carrier 12 to the next machine.

[0039] Further, if Fig.10As shown, the finished product unloading machine 18 includes an unloading frame 181, a belt conveyor line 183, and an unloading robot 182 arranged on the unloading frame 181; when working: the heat dissipation module and the chassis 121 are respectively sent to the belt conveyor line 183 and the first section conveyor line 10 by the unloading robot 182.

[0040] Furthermore, the suction ends of the copper sheet picking robot 16, iron cover picking robot 13, heat conductive block loading robot 17, loading robot 43, and heat conductive tube loading robot 66 are all provided with visual sensors for taking pictures and locating the position of parts, which can accurately pick up and put down materials and increase assembly accuracy.

[0041] The above are only specific application examples of the present invention and do not constitute any limitation on the protection scope of the present invention. Any technical solution formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the present invention.

Claims

1. An automatic assembly line for a dual heat-conducting block heat dissipation module, characterized in that: It includes a CPU heat conducting block loader, a GPU heat conducting block loader, a left translation machine, a left heat sink fin loader, a right heat sink fin loader, a heat conducting pipe loader, a solder paste machine at both ends of the heat conducting pipe, a left end cover loader, a right end cover loader, a cover placing machine, a screw locking machine, a reflow soldering machine, a right translation machine, a cooling machine, a screw loosening machine, a cover removing machine, a finished product unloading machine, and a plurality of carriers located on the above machines that can be circulated and transported; The carrier includes a chassis and an upper cover; the chassis is provided with two groups of positioning grooves for correspondingly placing various parts of the heat dissipation module; the upper cover is provided with a plurality of bolts for connecting the chassis; The CPU heat conducting block loader and the GPU heat conducting block loader have the same structure, both of which include a heat conducting block rack, a turntable mechanism respectively arranged at the upper end of the heat conducting block rack, a copper sheet feeding mechanism, an iron cover feeding mechanism, a copper sheet material taking manipulator, a solder paste printing mechanism, a solder paste amount detection mechanism, an iron cover material taking manipulator, a heat conducting block feeding manipulator, and a first section of a conveyor line; the copper sheet material taking manipulator, the solder paste printing mechanism, the solder paste amount detection mechanism, the iron cover material taking manipulator, and the heat conducting block feeding manipulator are sequentially placed around the turntable mechanism, and a plurality of positioning jigs corresponding to the above mechanisms are arranged on the turntable mechanism; the copper sheet feeding mechanism and the iron cover feeding mechanism are respectively located on both sides of the front of the heat conducting block rack, corresponding to feeding the copper sheet material taking manipulator and the iron cover material taking manipulator; the first section of the conveyor line is located on the back of the heat conducting block rack, so as to facilitate the feeding of the heat conducting block feeding manipulator; The heat pipe feeding machine includes a heat pipe rack, a heat pipe conveying line respectively arranged at the upper end of the heat pipe rack, a solder paste printing mechanism, a solder paste amount detection mechanism, a horizontal flipping mechanism, a heat pipe feeding robot, and a fourth conveying line; the heat pipe conveying line and the fourth conveying line are placed in parallel, and the heat pipe conveying line is located in front of the heat pipe rack, and the fourth conveying line is located at the back of the heat pipe rack; the solder paste printing mechanism, the solder paste amount detection mechanism, and the horizontal flipping mechanism are all located above the heat pipe conveying line, and are placed in sequence along the conveying direction of the heat pipe conveying line; the heat pipe feeding robot takes the material from the horizontal flipping mechanism and sends it to the fourth conveying line.

2. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: The left and right translation machines have the same structure, and both include a translation frame, a second section conveyor line respectively arranged at the upper end of the translation frame, and a feed conveyor line; the second section conveyor line is placed along the length direction of the translation frame; the feed conveyor line is located at the feeding end of the second section conveyor line, and the feeding conveyor line is placed vertically to the second section conveyor line; a pushing mechanism for pushing the chassis onto the second section conveyor line is arranged on the feeding conveyor line; a pushing mechanism for pushing the chassis onto the next machine is arranged at the discharging end of the second section conveyor line.

3. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: The left heat sink fin loader, the right heat sink fin loader, the left end cover loader and the right end cover loader have the same structure, and all include a loading frame, a tray feeding mechanism respectively arranged at the upper end of the loading frame, a loading robot, and a third section of the conveyor line; the tray feeding mechanism is located in the front of the loading frame, and the third section of the conveyor line is located at the back of the loading frame; the loading robot takes the material from the tray feeding mechanism and sends it to the third section of the conveyor line.

4. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: The solder paste dispensing machine at both ends of the heat conduction tube includes a solder paste dispensing machine rack, two solder paste dispensing mechanisms respectively arranged at the upper ends of the solder paste dispensing machine rack, a solder paste amount detection mechanism, and a fifth section of the conveyor line; the two solder paste dispensing mechanisms and the solder paste amount detection mechanism are both located above the fifth section of the conveyor line, and are placed in sequence along the conveying direction of the fifth section of the conveyor line.

5. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: A reflux conveyor line is arranged between the cap placing machine and the cap removing machine; the cap placing machine and the cap removing machine have the same structure, and both include a conveying frame, a conveying mechanism respectively arranged on the conveying frame, and a sixth section conveyor line; the sixth section conveyor line and the reflux conveyor line are placed in parallel, and the sixth section conveyor line is arranged in front of the conveying frame, and the reflux conveyor line is arranged at the back of the conveying frame; the conveying mechanism is located above the sixth section conveyor line, and is used for conveying the caps back and forth between the sixth section conveyor line and the reflux conveyor line.

6. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: The screw locking machine and the screw loosening machine have the same structure, both including a screw tightening machine frame, a screw tightening mechanism arranged on the screw tightening machine frame, and a seventh conveyor line; the screw tightening mechanism is located above the seventh conveyor line; the screw locking machine also includes a screw height detection mechanism arranged above the seventh conveyor line and behind the screw tightening mechanism.

7. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: The finished product unloading machine comprises an unloading frame, a belt conveyor line, and an unloading robot arranged on the unloading frame and respectively delivering the heat dissipation module and the chassis to the belt conveyor line and the first section conveyor line.

8. The automatic assembly line of the dual heat-conducting block heat dissipation module according to claim 1 is characterized in that: The suction end of the copper sheet picking robot, the iron cover picking robot, the heat conducting block feeding robot or the heat conducting tube feeding robot is provided with a visual sensor for taking pictures and locating the position of the parts.

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