Inspection instruction information generating device and method, substrate inspection system and storage medium

Abstract

The present invention relates to an inspection instruction information generating device, an inspection instruction information generating method, a substrate inspection system, and a storage medium. According to conductive structure information (D1) indicating how the planar conductor (IP), conductive part (P), wiring (W), and through hole (V) of the substrate are connected, the substrate includes: a conductor layer (Lc), a substrate surface (F) provided with a plurality of conductive parts (P), a wiring layer (L), and a through hole (V). When there are a plurality of groups of conductive parts (P) that are mutually connected via wiring (W) of the wiring layer (L), the following inspection instruction information generating process is performed: a pair of conductive parts (P) is selected from each of the groups as a first selected conductive part, and information indicating the selected plurality of pairs of first selected conductive parts is generated as inspection instruction information (D2).

Description

[0001] This application is based on Japanese patent application No. 2018-172302 filed on September 14, 2018, the contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to an inspection instruction information generating device and method for generating inspection instruction information for indicating an inspection position when inspecting a substrate, a substrate inspection system for inspecting using the inspection instruction information, an inspection instruction information generating method and a storage medium. Background Art

[0003] Conventionally, there is a known substrate inspection device in which, when a through hole (via) provided in a circuit substrate and penetrating from one surface of the circuit substrate to the other surface is taken as a measurement object, a measurement current is flowed into the measurement object, and the voltage generated in the measurement object is measured, thereby measuring the resistance value of the measurement object based on the current value and the voltage value (for example, refer to patent document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2012-117991 Summary of the invention

[0007] In addition, among substrates including a conductor extending in a planar shape (hereinafter referred to as a planar conductor) therein, there are substrates having a structure in which conductive portions such as pads, bumps, and wiring on the substrate surface are electrically connected to the planar conductor in the thickness direction of the substrate.

[0008] Fig. 22 1 is a conceptual schematic diagram showing a multilayer substrate WB as an example of a substrate including a planar conductor IP as a conductor pattern extending in a planar shape in an inner layer of the substrate. Fig. 22 The multilayer substrate WB shown in FIG. 1 is provided with conductive portions PA and PB such as pads or wiring patterns on its substrate surface BS. The conductive portions PA and PB are electrically connected to the planar conductor IP through the through holes RA and RB. In the example of the multilayer substrate WB, the planar conductor IP is equivalent to the planar conductor.

[0009] In addition, as a method for manufacturing a substrate, there is a method in which a conductive metal plate is used as a base, a printed wiring substrate is formed by laminating on both sides of the metal plate, and the formed substrate is peeled off from the metal plate of the base, thereby forming two printed wiring substrates. In this method for manufacturing a substrate, the substrate in a state before peeling off the substrate from the metal plate of the base (hereinafter referred to as an intermediate substrate) has a form in which the metal plate is sandwiched between two substrates. This intermediate substrate is also called a carrier substrate.

[0010] Fig.23 FIG. 2 is a conceptual schematic diagram showing an example of such an intermediate substrate MB. Fig.23 The intermediate substrate MB shown in the figure has a substrate WB1 on one side of the metal plate MP, and a substrate WB2 on the other side of the metal plate MP. Conductive parts PA1, PB1, ..., and PF1 such as pads or wiring patterns are provided on the substrate surface BS1 of the substrate WB1. Conductive parts PA2, PB2, ..., and PF2 such as pads or wiring patterns are provided on the contact surface BS2 of the substrate WB1 with the metal plate MP. The metal plate MP is, for example, a conductive metal plate with a thickness of about 1 mm to 10 mm.

[0011] The conductive parts PA1 to PF1 are electrically connected to the conductive parts PA2 to PF2 through the through holes RA to RF. The conductive parts PA2 to PF2 are in close contact and conduction with the metal plate MP, so the conductive parts PA1 to PF1 are electrically connected to the metal plate MP through the through holes RA to RF. The conductive part PA1 is paired with the through hole RA, the conductive part PB1 is paired with the through hole RB, and the conductive parts are paired with the through holes. The substrate WB2 is constructed in the same way as the substrate WB1, so its description is omitted. In the example of the intermediate substrate MB, the metal plate MP is equivalent to a planar conductor.

[0012] As an inspection of the multilayer substrate WB, the intermediate substrate MB, and the like, the resistance value Ra and the resistance value Rb of the through-hole RA and the through-hole RB may be measured.

[0013] Fig.24 In the figure, R1 to R4 are used to represent the equivalent resistance of the planar conductor IP. In order to measure the resistance value Ra and the resistance value Rb of the through hole RA and the through hole RB, it is considered that the current I for measurement flows between the conductive part PA1 and the conductive part PB1, and the voltage V generated between the conductive part PA1 and the conductive part PB1 is measured, and the resistance value is calculated as V / I. Thus, through V / I, the total of the resistance value Ra and the resistance value Rb of the through hole RA and the through hole RB at two locations on the current path from the conductive part PA1 to the conductive part PB1 and the resistance value R1 of the planar conductor IP can be obtained.

[0014] Here, in Fig.24 In the figure, the conductive parts PA1 to PE1 are arranged in a straight line due to the paper space. However, in an actual substrate, the conductive parts PA1 to PE1 are two-dimensionally dispersed on the substrate surface. Therefore, if a pair of conductive parts PA1 and PC1 are selected to flow current I1 in order to measure the resistance, and another pair of conductive parts PB1 and PD1 are selected to flow current I2, there is a situation where the current paths of current I1 and current I2 are repeated.

[0015] exist Fig.24 In the example shown in , the current is repeated in the resistor R2. In this case, the voltage V between the conductive part PA1 and the conductive part PC1 is I1(Ra+R1+R2+Rc)+I2R2. If I1=I2, then V / I1=(Ra+R1+R2+Rc)+R2, so the resistance value to be measured (Ra+R1+R2+Rc) plus the resistance value R2 is obtained, and as a result, the resistance measurement accuracy decreases.

[0016] Therefore, in order to avoid duplication of the measuring current, it is necessary to sequentially perform inspections one by one between the pair of conductive parts, which disadvantageously increases the inspection time of the entire substrate.

[0017] The object of the present invention is to provide an inspection instruction information generating device for generating inspection instruction information indicating an inspection location that can easily shorten the inspection time of a substrate, a substrate inspection system including the inspection instruction information generating device, an inspection instruction information generating method and an inspection instruction information generating program.

[0018] An inspection instruction information generating device of one example of the present invention includes: a storage unit storing conductive structure information indicating how the planar conductors, conductive parts, wirings, and through holes of a substrate are connected and conducted, the substrate including: a conductor layer as a layer provided with the planar conductor having conductivity extended into a planar shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through holes connecting the wirings of the wiring layer to the plurality of conductive parts, and through holes connecting the wirings of the wiring layer to the planar conductors of the conductor layer; and an inspection instruction information generating unit which, when there are a plurality of groups of the conductive parts that are mutually conducted via the wirings of the wiring layer, performs the following inspection instruction information generating processing according to the conductive structure information: selects a pair of the conductive parts from each of the groups as first selected conductive parts, and records information indicating the selected plurality of pairs of first selected conductive parts as inspection instruction information.

[0019] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps: (c1) for multiple pairs of first selection conductive parts represented by the inspection instruction information, simultaneously performing a first current supply process for causing current to flow between the paired first selection conductive parts, and detecting the voltage between the paired first selection conductive parts, and based on the current and the voltage, inspecting the through holes and wiring of the current path between the pairs of first selection conductive parts.

[0020] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps: (c1) for multiple pairs of first selected conductive parts represented by the inspection instruction information, simultaneously perform a first current supply process to make current flow between the pairs of first selected conductive parts, and detect the voltage between the pairs of first selected conductive parts, and inspect the through holes and wiring of the current path between the pairs of first selected conductive parts based on the current and the voltage; and (c2) perform a second current supply process to make current flow between the pairs of second selected conductive parts represented by the inspection instruction information at a different time from the first current supply process, and detect the voltage between the pairs of second selected conductive parts, and inspect the through holes and wiring of the current path between the pairs of second selected conductive parts based on the current and the voltage.

[0021] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps for each wiring layer in the order indicated by the inspection instruction information: (c1) for multiple pairs of first selection conductive parts indicated by the inspection instruction information, a first current supply process is simultaneously performed to allow current to flow between the paired first selection conductive parts, and the voltage between the paired first selection conductive parts is detected, and based on the current and the voltage, the through holes and wiring of the current path between the pairs of first selection conductive parts are inspected, and when the inspection result of the (c1) step is poor, the (c1) step is not performed for the wiring layers that are next in the order and thereafter.

[0022] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps: (c1) for multiple pairs of first selection conductive parts represented by the inspection instruction information, simultaneously perform a first current supply process of causing current to flow between the pairs of first selection conductive parts, and detect the voltage between the pairs of first selection conductive parts, and based on the current and the voltage, inspect the through holes and wiring of the current path between the pairs of first selection conductive parts, and in the (c1) process, simultaneously perform the first current supply process for the multiple pairs of first selection conductive parts corresponding to one side of the conductor layer through the inspection instruction information and the first current supply process for the multiple pairs of first selection conductive parts corresponding to the other side of the conductor layer.

[0023] In addition, an inspection instruction information generating method of an example of the present invention includes an inspection instruction information generating process, wherein the inspection instruction information generating process is based on conductive structure information representing how the planar conductor, conductive part, wiring, and through-hole of the substrate are connected and conducted, wherein the substrate includes: a conductor layer as a layer provided with the planar conductor with conductive properties extended into a planar shape, a substrate surface provided with a plurality of the conductive parts, the wiring layer as a layer stacked between the conductor layer and the substrate surface, through-holes connecting the wiring of the wiring layer to the plurality of conductive parts, and through-holes connecting the wiring of the wiring layer to the planar conductor of the conductor layer. When there are a plurality of groups of the conductive parts that are mutually conducted via the wiring of the wiring layer, the following inspection instruction information generating process is performed: a pair of the conductive parts are selected from each of the groups as the first selected conductive parts, and information representing the selected plurality of pairs of the first selected conductive parts is generated as inspection instruction information. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram conceptually showing the structure of a substrate inspection system 1 according to one embodiment of the present invention.

[0025] Figure 2 Yes means Figure 1 A block diagram of an example of the electrical configuration of the measuring unit shown in FIG.

[0026] Figure 3 This is a cross-sectional view showing an example of a substrate to be inspected.

[0027] Figure 4 It is a plan view showing an example of a substrate to be inspected.

[0028] Figure 5 The icon will Figure 3 1 is a diagram showing an example of conductive structure information D1 ′ which is a simplification of the conductive structure information D1 of the substrate B shown in .

[0029] Figure 6 The diagram uses a tree structure to express Figure 5 The conductive structure information D1′ and the conductive structure information D1″ shown in FIG.

[0030] Figure 7 This is a flowchart showing an example of the operation of the inspection instruction information generating method according to one embodiment of the present invention and the inspection instruction information generating device using the inspection instruction information generating method.

[0031] Figure 8 This is a flowchart showing an example of the operation of the inspection instruction information generating method according to one embodiment of the present invention and the inspection instruction information generating device using the inspection instruction information generating method.

[0032] Fig. 9 This is a flowchart showing an example of the operation of the inspection instruction information generating method according to one embodiment of the present invention and the inspection instruction information generating device using the inspection instruction information generating method.

[0033] Fig.10 This is a flowchart showing an example of the operation of a substrate inspection method according to an embodiment of the present invention and a substrate inspection apparatus using the substrate inspection method.

[0034] Fig.11 This is a flowchart showing an example of the first step of the inspection instruction information generating method according to one embodiment of the present invention.

[0035] Fig.12 This is a flowchart showing an example of processing related to a branch connected to a root node (rootnode) in the inspection instruction information generating method according to one embodiment of the present invention.

[0036] Fig.13 This is a flowchart showing an example of processing related to a branch connected to a root node in the inspection instruction information generating method according to one embodiment of the present invention.

[0037] Fig.14 This is a flowchart showing an example of the second step of the inspection instruction information generating method according to one embodiment of the present invention.

[0038] Fig.15 yes Figure 5 A partial enlarged view of .

[0039] Fig.16 Yes means Figure 6 An explanatory diagram of another example of the conductive structure information D1" shown in FIG.

[0040] Fig.17 Yes means Figure 3 An explanatory diagram of another example of the substrate shown in .

[0041] Fig.18 It is an explanatory diagram in a tabular format showing an example of inspection instruction information.

[0042] Fig.19 Yes means Figure 1 A flowchart of an example of the operation of the substrate inspection device shown in .

[0043] Fig. 20 Yes means Figure 1 A flowchart of an example of the operation of the substrate inspection device shown in .

[0044] Fig.21 Yes means Figure 1A flowchart of an example of the operation of the substrate inspection device shown in .

[0045] Fig. 22 This is a conceptual schematic diagram showing an example of a substrate including a planar conductor.

[0046] Fig.23 This is a conceptual schematic diagram showing an example of a substrate including a planar conductor.

[0047] Fig.24 It is used to illustrate the determination Fig. 22 1 is an explanatory diagram of a method for measuring the resistance values ​​of the through-holes and the planar conductors IP of the multilayer substrate WB shown in FIG.

[0048] [Explanation of Symbols]

[0049] 1: Substrate inspection system

[0050] 2: Substrate inspection device

[0051] 3: Check the indication information generating device

[0052] 4U, 4L: Measuring fixture

[0053] 12: Measurement block

[0054] 13: Scanner

[0055] 20: Control Department

[0056] 21: Inspection and Processing Department

[0057] 22: Storage

[0058] 31: Inspection instruction information generating unit

[0059] 32: Storage

[0060] 110: Substrate fixing device

[0061] 112: Frame

[0062] 121, 122: Measurement unit

[0063] 125: Mobile mechanism

[0064] B, B1~B5: substrate

[0065] BS, BS1: substrate surface

[0066] BS2: Contact surface

[0067] CS, CM: Power supply department

[0068] D1, D1', D1": Conductive structure information

[0069] D2: Check the instructions

[0070] F1, F2: substrate surface

[0071] Fip1, Fip2: Flag

[0072] I, I1, I2: current

[0073] IP, IPa, IPd: Planar conductor

[0074] L, L1, L2, L4: wiring layer

[0075] Lc: Conductor layer

[0076] LL1: First selection layer

[0077] LL2: Second selection layer

[0078] LT1, LT2: Inspection layer

[0079] M, M11~M14, M21~M23, M41~M47, Mr1~Mr6: Branch

[0080] MB: Middle Base Plate

[0081] MP: Metal Plate

[0082] N, N11, N12, N21, N41, N42: nodes

[0083] NR: root node

[0084] P, P1~P7, P11~P17: Conductive part

[0085] PA, PB, PA1~PF1, PA2~PF2: Conductive part

[0086] Pr: probe

[0087] RA~RF: Through hole

[0088] T1: One end

[0089] T2: The other end

[0090] V, V11~V17, V21~V27, V31~V36, V41~V45, V51~V57, Vc: through hole

[0091] VM: Voltage detection unit

[0092] W, W11, W12, W21, W22, W41 to W45: Wiring

[0093] WB: Multilayer substrate

[0094] WB1, WB2: substrate DETAILED DESCRIPTION

[0095] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the same reference numerals in the respective drawings represent the same structures, and their description will be omitted. Figure 1 The substrate inspection system 1 shown in FIG. 1 includes an inspection instruction information generating device 3 and a substrate inspection device 2 .

[0096] Figure 1 The inspection instruction information generating device 3 shown in the figure includes an inspection instruction information generating unit 31 and a storage unit 32. The inspection instruction information generating device 3 is constructed using a computer such as a personal computer, and includes: a central processing unit (CPU) that performs a predetermined operation process, a random access memory (RAM) that temporarily stores data, a non-volatile storage device such as a hard disk drive (HDD) and / or a flash memory, a communication circuit, and peripheral circuits thereof.

[0097] The inspection instruction information generating device 3 functions as an inspection instruction information generating unit 31 by executing the inspection instruction information generating program according to an embodiment of the present invention stored in, for example, a nonvolatile storage device. The storage unit 32 is configured using, for example, the nonvolatile storage device.

[0098] The conductive structure information D1 is stored in the storage unit 32. The conductive structure information D1 may be sent to the inspection instruction information generating device 3 from the outside via, for example, a communication circuit (not shown), and the sent conductive structure information D1 may be stored in the storage unit 32. The conductive structure information D1 may be read by the inspection instruction information generating device 3 from a storage medium such as a Universal Serial Bus (USB) memory and stored in the storage unit 32. The conductive structure information D1 may be stored in the storage unit 32 using various methods.

[0099] The conductive structure information D1 is information indicating how the planar conductor IP, the conductive portion P, the wiring W of each wiring layer L, and the through hole V of the substrate B described later are connected. As the conductive structure information D1, for example, so-called gerber data and / or a netlist used in the manufacture of the substrate can be used.

[0100] The inspection instruction information generating unit 31 generates inspection instruction information D2 for the substrate inspection device 2 based on the conductive structure information D1, and the inspection instruction information D2 is used to indicate the pair of conductive parts P to which the current should flow for inspection. The inspection instruction information generating unit 31 may also send the inspection instruction information D2 to the substrate inspection device 2 via, for example, a communication circuit (not shown). Alternatively, the inspection instruction information generating unit 31 may also write the inspection instruction information D2 to a storage medium. Furthermore, the user may also cause the substrate inspection device 2 to read the inspection instruction information D2 from the storage medium. The operation of the inspection instruction information generating unit 31 will be described in detail later.

[0101] Figure 1 The substrate inspection device 2 shown in FIG. 1 is a device for inspecting a substrate B as an inspection target substrate.

[0102] Substrate B is, for example, an intermediate substrate or a multi-layer substrate, and may also be a printed wiring substrate, a film carrier, a flexible substrate, a ceramic multi-layer wiring substrate, a semiconductor substrate such as a semiconductor chip and a semiconductor wafer, a packaging substrate for semiconductor packaging, an electrode plate for a liquid crystal display or a plasma display, and an intermediate substrate in the process of manufacturing these substrates, or a so-called carrier substrate. Fig. 22 The multilayer substrate WB shown in FIG. Fig.23 The intermediate substrate MB shown in FIG. 1 corresponds to an example of the substrate B as the substrate to be inspected.

[0103] Figure 1 The substrate inspection device 2 shown in FIG. 1 includes a housing 112. The internal space of the housing 112 mainly includes a substrate fixing device 110, a measuring unit 121, a measuring unit 122, a moving mechanism 125, and a control unit 20. The substrate fixing device 110 is configured to fix the substrate B at a predetermined position.

[0104] The measuring section 121 is located above the substrate B fixed to the substrate fixing device 110. The measuring section 122 is located below the substrate B fixed to the substrate fixing device 110. The measuring sections 121 and 122 include measuring jigs 4U and 4L for contacting a plurality of conductive portions provided on the substrate B with probes.

[0105] A plurality of probes Pr are mounted on the measuring jig 4U and the measuring jig 4L. The measuring jig 4U and the measuring jig 4L are arranged and hold the plurality of probes Pr in a manner corresponding to the arrangement of the conductive parts of the measuring object provided on the surface of the substrate B. The moving mechanism 125 moves the measuring parts 121 and 122 appropriately within the frame 112 in response to the control signal from the control unit 20, so that the probes Pr of the measuring jig 4U and the measuring jig 4L contact the conductive parts of the substrate B.

[0106] Furthermore, the substrate inspection device 2 may include only one of the measuring unit 121 and the measuring unit 122, and the conductive unit may be provided on only one side of the substrate B. Furthermore, the substrate inspection device 2 may invert the inspected substrate and measure both sides thereof using any one of the measuring units.

[0107] The control unit 20 is composed of, for example, a central processing unit (CPU) that performs a predetermined operation process, a random access memory (RAM) that temporarily stores data, a read only memory (ROM) that stores a predetermined control program, a non-volatile storage unit 22 such as a hard disk drive (HDD), and peripheral circuits thereof, etc. The control unit 20 functions as the inspection processing unit 21 by executing, for example, a control program stored in the storage unit 22.

[0108] Figure 2 The measuring unit 121 shown in FIG. 1 includes a scanner unit 13 , a plurality of measuring blocks 12 , and a plurality of probes Pr. The measuring unit 122 is configured similarly to the measuring unit 121 , and thus description thereof will be omitted.

[0109] The measurement block 12 includes a power supply unit CS, a power supply unit CM, and a voltage detection unit VM. The power supply unit CS and the power supply unit CM are constant current circuits that output a current I corresponding to a control signal from the control unit 20. The power supply unit CS causes the current I to flow in a direction of supply to the scanner unit 13, and the power supply unit CM causes the current I to flow in a direction of introduction from the scanner unit 13. The voltage detection unit VM is a voltage detection circuit that measures a voltage and sends the voltage value to the control unit 20.

[0110] The scanner unit 13 is a switching circuit formed by using a switching element such as a transistor or a relay switch. The scanner unit 13 corresponds to the plurality of measurement blocks 12, and includes a plurality of current terminals +F and current terminals -F for supplying a current I for resistance measurement to the substrate B, and a voltage detection terminal +S and a voltage detection terminal -S for detecting a voltage generated between the conductive parts of the substrate B by the current I. In addition, a plurality of probes Pr are electrically connected to the scanner unit 13. The scanner unit 13 switches the connection relationship between the current terminal +F, the current terminal -F and the voltage detection terminal +S, the voltage detection terminal -S and the plurality of probes Pr in response to a control signal from the control unit 20.

[0111] One end of the output terminal of the power supply unit CS is connected to the circuit ground, and the other end is connected to the current terminal +F. One end of the output terminal of the power supply unit CM is connected to the circuit ground, and the other end is connected to the current terminal -F. One end of the voltage detection unit VM is connected to the voltage detection terminal +S, and the other end is connected to the voltage detection terminal -S.

[0112] Furthermore, the scanner unit 13 can connect the current terminal +F, the current terminal -F and the voltage detection terminal +S, the voltage detection terminal -S to any probe Pr in accordance with the control signal from the control unit 20. Thus, the scanner unit 13 can flow the current I between any conductive parts contacted by the probe Pr in accordance with the control signal from the control unit 20, and measure the voltage V generated between the conductive parts using the voltage detection unit VM.

[0113] Since a plurality of measurement blocks 12 are provided, current supply and voltage measurement can be performed simultaneously between a plurality of conductive portions.

[0114] In addition, the power supply unit CS and the power supply unit CM are not limited to the example in which one end of the power supply unit CS and the power supply unit CM is connected to the circuit ground as long as they can allow the current I to flow into the substrate B via the scanner unit 13. For example, a current loop may be formed by connecting one end of the power supply unit CS to one end of the power supply unit CM.

[0115] Thus, the control unit 20 can output a control signal to the scanner unit 13 to allow the current I to flow between any plurality of pairs of probes Pr using the plurality of power supply units CS and CM, and detect the voltage between any plurality of pairs of probes Pr using the plurality of voltage detection units VM.

[0116] Figure 3 The diagram also serves as an explanation diagram showing the conductive structure information D1 of the substrate B. The conductive structure information D1 is not necessarily data represented by an image, but in the following description, the structure represented by the conductive structure information D1 is shown and explained using the diagram for easy understanding.

[0117] Figure 3 The substrate B shown in the figure is a multilayer substrate formed by stacking five substrates B1 to B5. The surface of one side of the substrate B is set as the substrate surface F1, and the surface of the other side is set as the substrate surface F2. The boundary between the substrates B1 and B2 is set as the wiring layer L1, the boundary between the substrates B2 and B3 is set as the wiring layer L2, the boundary between the substrates B3 and B4 is set as the conductor layer Lc, and the boundary between the substrates B4 and B5 is set as the wiring layer L4.

[0118] Conductive portions P1 to P7 are provided on substrate surface F1, and conductive portions P11 to P17 are provided on substrate surface F2. Conductive portions P1 to P7 and P11 to P17 serve as inspection points where pads, bumps, wirings, electrodes, and the like are contacted by probes Pr.

[0119] The conductor layer Lc is provided with a planar conductor IP as a conductor extended into a planar or mesh shape. The wiring layer L1 is provided with wirings W11 and W12, the wiring layer L2 is provided with wirings W21 and W22, and the wiring layer L4 is provided with wirings W41, W42, W43, W44, and W45. The planar conductor IP may be a conductor extended into a sheet shape, i.e., a planar shape, or may be a conductor having a shape in which conductor patterns such as wirings are combined into a regular or irregular mesh shape (mesh shape), and extended into a planar shape as a whole within the same layer.

[0120] In addition, Figure 3 , an example in which the planar conductor IP extends to substantially the entire area of ​​the substrate B is shown, but the planar conductor IP is not necessarily limited to the example in which it extends to substantially the entire area of ​​the substrate B. The planar conductor IP may be provided only in a part of the area of ​​the substrate B. For example, the wiring W may be provided in an area of ​​the substrate B of the conductor layer Lc where the planar conductor IP is not provided.

[0121] Figure 4 The substrate B shown in FIG. 1 includes a planar conductor IPa and a planar conductor IPd that are electrically separated from each other. The planar conductor IPa can be used as an analog ground, and the planar conductor IPd can be used as a digital ground. Figure 4 As shown, the substrate B may also include a plurality of planar conductors IP that are insulated from each other.

[0122] Wiring W41, wiring W42, and wiring W43 are a wiring formed by connecting wiring W41, wiring W42, and wiring W43 of wiring layer L4, but for the sake of convenience, the parts of a wiring W41, W42, and W43 are referred to as wiring W41, wiring W42, and wiring W43. Similarly, wiring W44 and wiring W45 are a wiring formed by connecting wiring W44 and wiring W45, and wiring W44 and wiring W45 are parts of a wiring W44 and W45, respectively.

[0123] In addition, substrate B is provided with through holes V11 to V17 penetrating substrate B1, through holes V21 to V27 penetrating substrate B2, through holes V31 to V36 penetrating substrate B3, through holes V41 to V45 penetrating substrate B4, and through holes V51 to V57 penetrating substrate B5.

[0124] The conductive structure information stored in the storage unit 22 includes information indicating how the conductive portions P1 to P7, P11 to P17, wiring W11, W12, W21, W22, W41 to W45, through holes V11 to V17, through holes V21 to V27, through holes V31 to V36, through holes V41 to V45, through holes V51 to V57, and the planar conductor IP are conductively connected, for example, indicating Figure 3 Information about the connection relationship shown in the figure.

[0125] Hereinafter, the conductive parts such as the conductive parts P1 to P7, the conductive parts P11 to P17 are collectively referred to as the conductive parts P, the wirings W11, W12, W21, W22, W41 to W45 are collectively referred to as wirings W, the through holes V11 to V17, V21 to V27, V31 to V36, V41 to V45, V51 to V57 are collectively referred to as through holes V, and the wiring layers L1, L2, and L4 are collectively referred to as wiring layers L.

[0126] Each conductive portion P is connected to the planar conductor IP via a through hole V or a wiring W. In this way, the wiring structure in which each conductive portion P is connected to the planar conductor IP is usually used for connection purposes of circuit grounding or power supply pattern. In addition, the substrate B may also include wiring or pads that are not connected to the circuit grounding or power supply pattern.

[0127] When the substrate B is mounted on the substrate fixing device 110, the probes Pr of the measuring unit 121 are brought into contact with the conductive parts P1 to P7, and the probes Pr of the measuring unit 122 are brought into contact with the conductive parts P11 to P17 by the moving mechanism 125. Thus, the measuring units 121 and 122 can flow the current I between any pair of conductive parts P and detect the voltage between the pair of conductive parts P.

[0128] In order to measure the resistance using the so-called four-terminal resistance measurement method, the measuring parts 121 and 122 may also make the probe Pr for current supply and the probe Pr for voltage measurement contact one conductive part P. In order to measure the resistance using the so-called two-terminal resistance measurement method, a probe P that serves both as current supply and voltage measurement may also contact one conductive part P.

[0129] The inspection processing unit 21 controls the measuring units 121 and 122 to supply power from the power supply unit CS (see Figure 2 ) is supplied to one of a pair of conductive portions P selected as described later, and is supplied through the power supply portion CM (refer to Figure 2) and draws current I from the other, thereby supplying current I between the conductive parts P, detecting the voltage between the conductive parts P, and inspecting the substrate B based on the current and the voltage. The inspection processing unit 21 can, for example, measure resistance using a four-terminal resistance measurement method or a two-terminal resistance measurement method based on the current and the voltage, and inspect the substrate B based on the resistance value.

[0130] Hereinafter, the inspection processing unit 21 supplies current and detects voltage by controlling the measuring units 121 and 122. The inspection processing unit 21 supplies current and detects voltage. The operation of the inspection processing unit 21 will be described in detail later.

[0131] Next, the operation of the inspection instruction information generating device 3 is described. Figure 3 The following description will take the inspection instruction information of substrate B shown in FIG. 1 as an example. Figure 5 , Figure 6 is a diagram that generates Figure 3 FIG. 1 is an explanatory diagram of an example of the conductive structure information D1 changed during the execution of the inspection instruction information generation method when the inspection instruction information of the substrate B shown in FIG. Figures 5 to 14 , the operation of the inspection instruction information generating device 3 for executing the inspection instruction information generating method according to the inspection instruction information generating program of one embodiment of the present invention is described.

[0132] In the following flowcharts, the same processing is assigned the same step number and the description thereof is omitted.

[0133] First, the inspection instruction information generating unit 31 performs a process of simplifying the connection structure represented by the conductive structure information D1 as a pre-processing when grouping the conductive parts P of the substrate B. Specifically, when the wirings W of the plurality of wiring layers L are connected in parallel, the inspection instruction information generating unit 31 copies and changes the conductive structure information D1 in such a manner that the wirings W connected in parallel are replaced with the wirings W closest to the substrate surface F1 among the wirings W, thereby generating the conductive structure information D1' (step S1: (d) process).

[0134] Specifically, in Figure 3 In the substrate B shown in FIG. 1 , the wirings W11 and W21 of the wiring layers L1 and L2 are connected in parallel through the through holes V21 and V22. In this case, for the conductive structure information D1, as shown in FIG. Figure 5As shown, the two wirings W11 and W21 are replaced by the wiring W11 closest to the substrate surface F1, and the conductive structure information D1' is generated. At this time, one end of the through hole V22 becomes open, so in terms of data, it can also be treated as if the through hole V22 does not exist. In this way, the wiring structure of the substrate B is simplified, so that the subsequent processing becomes easy.

[0135] Next, when the through hole V or the column of through holes V is connected in parallel through the wiring W and the planar conductor IP, the inspection instruction information generating unit 31 changes the conductive structure information D1' by replacing the through hole V or the column of through holes V connected in parallel with one through hole or one column of through holes (step S2: (e) process).

[0136] Specifically, in Figure 3 In the substrate B shown in FIG, through holes V24 and through holes V33 are connected in series to form a column, and through holes V25 and through holes V34 are connected in series to form a column. Furthermore, through wiring W12 and planar conductor IP, the column of through holes V24 and through holes V33 is connected in parallel with the column of through holes V25 and through holes V34. In addition, through wiring W22 and planar conductor IP, through holes V32 and through holes V33 are connected in parallel.

[0137] In this case, for example Figure 5 As shown, for the conductive structure information D1', the columns of through holes V24 and V33 and the columns of through holes V25 and V34 are replaced with any column, for example, with the columns of through holes V24 and V33, and the through holes V32 and V33 are replaced with one through hole V, for example, with through hole V32.

[0138] Furthermore, the through hole V41 and the through hole V42 are connected in parallel by the series wiring of the wiring W41, the wiring W42, and the wiring W43 and the planar conductor IP. Figure 5 As shown, in the conductive structure information D1, the through hole V41 and the through hole V42 are replaced by one through hole V, for example, replaced by the through hole V41. In addition, the through hole V43, the through hole V44, and the through hole V45 are connected in parallel through the wiring W44, the wiring W45 and the planar conductor IP. In this case, for example, Figure 5 As shown, for the conductive structure information D1', the through hole V43, the through hole V44, and the through hole V45 are replaced by one through hole V, for example, the through hole V43. Thus, the wiring structure of the substrate B is simplified, and the subsequent processing becomes easy.

[0139] In addition, the inspection instruction information generating unit 31 does not necessarily need to execute step S1 and step S2, and can also indicate Figure 3The conductive structure information D1 in the data format of the actual wiring structure of the substrate B shown in FIG. 1 is used as conductive structure information D1 ′, and the subsequent processing is performed.

[0140] Then, the inspection instruction information generating unit 31 converts the data structure of the conductive structure information D1' into a tree structure (step S3: (m) process). The conductive structure information D1' converted into a tree structure is referred to as conductive structure information D1". Figure 6 As shown, in the conductive structure information D1", one wiring W is expressed by one node N, the planar conductor IP is expressed by a root node NR, and the via V is expressed as a branch M connecting the conductive part P to the node or a branch M connecting the nodes to each other.

[0141] In addition, the inspection instruction information generating unit 31 does not necessarily need to execute step S3, and can also perform subsequent processing using the conductive structure information D1 and the conductive structure information D1' in the data format representing the wiring structure of the substrate B. In the following description, the processing for the node N is the same as the processing for the wiring W corresponding to the node N, the processing for the root node NR is the same as the processing for the planar conductor IP, and the processing for the branch M is the same as the processing for the wiring W corresponding to the node N.

[0142] exist Figure 6 In the example of the tree-structured conductive structure information D1" shown in the figure, the node N11 corresponds to the wiring W11 (W21), the node N12 corresponds to the wiring W12, the node N21 corresponds to the wiring W22, the node N41 corresponds to the wiring W41, the wiring W42, and the wiring W43, and the node N42 corresponds to the wiring W44 and the wiring W45. In addition, the branch M11 corresponds to the through hole V11 (V21), the branch M12 corresponds to the through hole V12 (V22), the branch M13 corresponds to the through hole V14, the branch M14 corresponds to the through hole V15, the branch M22 corresponds to the through hole V24 (V25), and the branch M11 corresponds to the through hole V21. , through hole V31, branch Mr2 corresponds to through hole V32 (V33), branch Mr3 corresponds to through hole V16, through hole V26, through hole V35, branch Mr4 corresponds to through hole V17, through hole V27, through hole V36, branch M41 corresponds to through hole V51, branch M42 corresponds to through hole V52, branch M43 corresponds to through hole V53, branch M44 corresponds to through hole V54, branch M45 corresponds to through hole V55, branch M46 corresponds to through hole V56, branch M47 corresponds to through hole V57, branch Mr5 corresponds to through hole V41 (V42), branch Mr6 corresponds to through hole V43 (V44, V45).

[0143] Then, the inspection instruction information generating unit 31 selects the wiring layer L1 closest to the substrate surface F1 as the first selection layer LL1, and selects the wiring layer L4 closest to the substrate surface F2 as the second selection layer LL2 (step S4: (f) process). The processing of steps S4 to S27 and steps S101 to S501 is an example of the inspection instruction information generating processing.

[0144] Then, the inspection instruction information generating unit 31 executes the first step (step S5). Fig.11 The inspection instruction information generating unit 31 groups the conductive portions P on the substrate surface F1 that are mutually conductive via the node N (wiring W) of the first selection layer LL1 according to the conductive structure information D1″ (step S101: (a) step of (f) step).

[0145] Here, the first selection layer LL1 is the wiring layer L1, so Figure 6 In the tree-like conductive structure information D1″ shown in FIG, the conductive portions P1 and P2 connected via the node N11 of the first selection layer LL1 are grouped, and the conductive portions P4 and P5 connected via the node N12 of the first selection layer LL1 are grouped.

[0146] Then, the inspection instruction information generating unit 31 selects two conductive parts from the conductive parts P included in each group grouped in step S101 as a pair of first selected conductive parts, and establishes a correspondence with the first selected layer LL1 and records them in the inspection instruction information D2 (step S102: step (b) of step (f)). The first selected conductive part is information indicating the conductive parts (inspection parts) that can be inspected at the same time.

[0147] exist Figure 6 In the example, the conductive part P1 and the conductive part P2 are selected from the group of the conductive part P1 and the conductive part P2 corresponding to the wiring layer L1 as the first selected conductive part, and the conductive part P4 and the conductive part P5 are selected from the group of the conductive part P4 and the conductive part P5 as the first selected conductive part. Hereinafter, the pair of the conductive part P1 and the conductive part P2 is expressed as the conductive part pair P1 and P2.

[0148] Next, when there is a group including a conductive portion P not selected as the first selected conductive portion among the groups grouped in step S101, the inspection instruction information generating unit 31 selects two conductive portions P including the conductive portion P not selected as the first selected conductive portion as a pair of second selected conductive portions for the group, and establishes a correspondence with the first selected layer LL1 and records them in the inspection instruction information D2 (step S103: (b) step of (f) step). The second selected conductive portion is information indicating a conductive portion (inspection site) that should be inspected at a different time from the first selected conductive portion.

[0149] exist Figure 6 In the example, among the groups of conductive parts P1 and P2, and the groups of conductive parts P4 and P5, there is no group having a conductive part P that has not been selected as the first selected conductive part, so the inspection indication information generating unit 31 transfers the processing to the next step S104.

[0150] Next, the inspection instruction information generating section 31 groups the conductive portions P on the substrate surface F2 that are conductively connected to each other via the node N (wiring W) of the second selection layer LL2 according to the conductive structure information D1″ (step S104: step (a) of step (f)).

[0151] Here, the second selection layer LL2 is the wiring layer L4, so Figure 6 In the tree-like conductive structure information D1" shown in the figure, the conductive parts P11, P12, P13, and P14 which are conducted via the node N41 of the second selection layer LL2 are grouped, and the conductive parts P15, P16, and P17 which are conducted via the node N42 of the second selection layer LL2 are grouped.

[0152] Next, the inspection indication information generating unit 31 selects two conductive parts from the conductive parts P included in each group grouped by step S104 as a pair of first selected conductive parts, establishes a correspondence with the second selection layer LL2 and records them in the inspection indication information D2 (step S105: (b) step of (f) step).

[0153] exist Figure 6 In the example, any conductive part, for example, conductive part P11 or conductive part P12 is selected from the group of conductive parts P11, conductive part P12, conductive part P13, and conductive part P14 as the first selected conductive part, and any conductive part, for example, conductive part P15 or conductive part P16 is selected from the group of conductive parts P15, conductive part P16, and conductive part P17 as the first selected conductive part.

[0154] Next, when there is a group including the conductive portion P that is not selected as the first selected conductive portion in each group grouped by step S104, the inspection instruction information generating unit 31 selects two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion as a pair of second selected conductive portions for the group, and establishes a correspondence with the second selected layer LL2 and records them in the inspection instruction information D2 (step S106: step (b) of step (f)), and then ends the first step and proceeds to step S7 ( Figure 7 ) transfer.

[0155] exist Figure 6In the example of FIG. 1 , the group of conductive portions P11, P12, P13, and P14, and the group of conductive portions P15, P16, and P17 include conductive portions P13, P14, and P17 that are not selected as first selected conductive portions. In this case, the inspection instruction information generating unit 31 selects the conductive portion pair P13, P14, and the conductive portion pair P16, P17 as second selected conductive portions.

[0156] Back to Figure 7 The inspection instruction information generating unit 31 checks the flag Fip1 which is a control flag for controlling the processing (step S7).

[0157] When the flag Fip1 is 1 (YES in step S7), it means that the flag Fip1 has been set to 1 in step S12 described later, and the generation of the inspection instruction information D2 corresponding to the substrate surface F1 side of the conductor layer Lc and each wiring layer L closer to the substrate surface F1 side than the conductor layer Lc has been completed. Therefore, the inspection instruction information generating unit 31 does not execute steps S11 to S16, but proceeds to step S17 ( Fig. 9 ) transfer.

[0158] When the flag Fip1 is not 1 (NO in step S7), the inspection instruction information generating unit 31 proceeds to step S11 ( Figure 8 ) is transferred, and it is checked whether the conductive layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (step S11).

[0159] When the conductor layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (Yes in step S11), the inspection instruction information generating unit 31 sets the flag Fip1 to 1 (step S12), and in order to select the conductive portion P for inspection of the through hole V connected to the substrate surface F1 side of the planar conductor IP, the processing is directed to step S301 ( Fig.12 ) transfer.

[0160] On the other hand, when the conductor layer Lc is not adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (No in step S11), the inspection instruction information generating unit 31 selects the wiring layer L adjacent to the side of the first selection layer LL1 away from the substrate surface F1 as a new first selection layer LL1 (step S13: (g) process). Thus, steps S14 to S16 are executed with the new first selection layer LL1 as the processing object.

[0161] For example, in Figure 6In the example shown in , the first selection layer LL1 is currently the wiring layer L1. The conductor layer Lc is not adjacent to the side of the wiring layer L1 away from the substrate surface F1 (No in step S11), and the wiring layer L2 adjacent to the side of the wiring layer L1 away from the substrate surface F1 becomes the new first selection layer LL1 (step S13).

[0162] Then, the inspection indication information generating unit 31 selects a conductive part P on the substrate surface F1 that is electrically connected to the side of one of the nodes N, i.e., conductive, on the opposite side of the node N, corresponding to each node N of the first selection layer LL1, based on the conductive structure information D1″. The inspection indication information generating unit 31 groups the selected conductive parts P for each corresponding node N (step S14: (g1) process).

[0163] exist Figure 6 In the example shown in , there is a node N21 in the wiring layer L2 as the first selection layer LL1. The branch M21 and the branch M22 are connected to the node N21. As a conductive portion P of the substrate surface F1 directly or indirectly connected to the side of the branch M21 opposite to the node N21, there is a conductive portion P3. Therefore, the conductive portion P3 corresponding to the branch M21 is selected. As a conductive portion P of the substrate surface F1 directly or indirectly connected to the side of the branch M22 opposite to the node N21, there are conductive portions P4 and conductive portions P5. Any one of the conductive portions P4 and P5 is selected, for example, the conductive portion P4 is used as the conductive portion P corresponding to the branch M22. Thus, the conductive portions P3 and P4 are grouped corresponding to the node N21.

[0164] Then, the inspection indication information generating unit 31 selects any two conductive parts from the conductive parts P included in each group grouped by step S14 as a pair of first selected conductive parts, establishes a correspondence with the first selection layer LL1 and records them in the inspection indication information D2 (step S15: (b) step of (g2) step).

[0165] exist Figure 6 In the example shown in , two conductive portions P3 and P4 are selected from the conductive portions P3 and P4 grouped in step S14 as a pair of first selected conductive portions.

[0166] For example, Fig.16Generally, in the tree-like conductive structure information D1 shown in the figure, when the node N11 is not connected to the root node NR but is connected to the node N21 through the branch M23, in step S14, as the conductive part P of the substrate surface F1 directly or indirectly connected to the branch M23 on the opposite side of the node N21, there are conductive parts P1 and P2. Any one of the conductive parts P1 and P2 is selected, for example, the conductive part P1 is used as the conductive part P corresponding to the branch M23. Therefore, the conductive parts P1, P3, and P4 to which the conductive part P1 is added are grouped corresponding to the node N21.

[0167] Furthermore, in step S15 , two conductive portions, for example, the conductive portion P1 and the conductive portion P3 are selected from the conductive portion P1 , the conductive portion P3 , and the conductive portion P4 as a pair of first selected conductive portions.

[0168] Next, when there is a group including the conductive portion P not selected as the first selected conductive portion in the group grouped by step S14, the inspection instruction information generating unit 31 selects two conductive portions P including the conductive portion P not selected as the first selected conductive portion as a pair of second selected conductive portions for the group, and establishes a correspondence with the first selection layer LL1 and records them in the inspection instruction information D2 (step S16: step (b) of step (g2)), and then proceeds to step S17 ( Fig. 9 ) transfer.

[0169] On the other hand, when there is no group including the conductive portion P not selected as the first selected conductive portion among the groups grouped in step S14 , the inspection instruction information generating section 31 directly proceeds to step S17 .

[0170] Next, the inspection instruction information generating unit 31 checks the flag Fip2 which is a control flag for controlling the processing (step S17).

[0171] When the flag Fip2 is 1 (Yes in step S17), it means that the flag Fip2 has been set to 1 in step S19 described later, and the generation of the inspection instruction information D2 for the substrate surface F2 side of the conductor layer Lc and each wiring layer L closer to the substrate surface F2 side than the conductor layer Lc has been completed. Therefore, the inspection instruction information generating unit 31 does not execute steps S18 to S24, but proceeds to step S26 ( Fig.10 ) transfer.

[0172] When the flag Fip2 is not 1 (No in step S17 ), the inspection instruction information generating section 31 moves to step S18 and checks whether the conductive layer Lc is adjacent to the side of the second selection layer LL2 away from the substrate surface F2 (step S18 ).

[0173] When the conductor layer Lc is adjacent to the side of the second selection layer LL2 away from the substrate surface F2 (Yes in step S18), the inspection instruction information generating unit 31 sets the flag Fip2 to 1 (step S19), and in order to select the conductive portion P for inspection of the through hole V connected to the substrate surface F2 side of the planar conductor IP, the processing is directed to step S401 ( Fig.13 ) transfer.

[0174] For example, in Figure 6 In the example shown in , if the second selected layer LL2 is currently the wiring layer L4, the conductor layer Lc is adjacent to the side of the wiring layer L4 away from the substrate surface F2 (yes in step S18), so the flag Fip2 is set to 1 (step S19), and the process proceeds to step S401 ( Fig.13 ) transfer.

[0175] Reference Fig.13 In step S401, the inspection indication information generating unit 31 selects a conductive portion P that is electrically connected, i.e., conductive, on the opposite side of the root node NR for each branch M (through hole V) connected to the substrate surface F2 side of the root node NR (planar conductor IP), thereby grouping the selected conductive portion P as a conductive portion corresponding to the substrate surface F2 side of the root node NR (step S401: (h) process).

[0176] exist Figure 6 In the example shown in , branches Mr5 and Mr6 are connected to the substrate surface F2 side of the root node NR. As the conductive part P that is conductive with the branch Mr5, there are conductive parts P11, P12, P13, and P14. As the conductive part P that is conductive with the branch Mr6, there are conductive parts P15, P16, and P17. Therefore, in step S401, any one of the conductive parts P11, P12, P13, and P14, for example, conductive part P11, is selected, and any one of the conductive parts P15, P16, and P17, for example, conductive part P15 is selected. Thus, the conductive parts P11 and P15 are grouped.

[0177] Next, the inspection instruction information generating unit 31 selects two conductive portions P from the conductive portions P grouped in step S401 as a pair of first selected conductive portions, associates them with the substrate surface F2 side of the root node NR, and records them in the inspection instruction information D2 (step S402: (h) process).

[0178] In step S402, two conductive portions P are selected as a pair of first selected conductive portions from the conductive portions P11 and the conductive portions P15 grouped in step S401. In this case, the conductive portions P grouped in step S401 are only the conductive portions P11 and the conductive portion P15, so the two conductive portions P11 and P15 are selected as a pair of first selected conductive portions.

[0179] Next, when there is a group including a conductive portion P that is not selected as the first selected conductive portion in the group grouped by step S401, the inspection instruction information generating unit 31 selects two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion as a pair of second selected conductive portions for the group, and establishes a correspondence with the substrate surface F2 side of the root node NR and records them in the inspection instruction information D2 (step S403), and then proceeds to step S26 ( Fig.10 ) transfer.

[0180] At present, among the groups grouped by step S401, there is no group having a conductive portion P that is not selected as the first selected conductive portion, so the inspection instruction information generating unit 31 directly proceeds to step S26 ( Fig.10 ) transfer.

[0181] In addition, the inspection indication information generating unit 31 can also select multiple pairs of conductive parts P in a manner that includes all the conductive parts P selected in step S401, and establish a correspondence between multiple pairs of first selected conductive parts and the substrate surface F2 side of the root node NR and record them in the inspection indication information D2, instead of executing steps S402 and S403.

[0182] In this case, in the inspection by the inspection processing unit 21 described later, current is simultaneously supplied to a plurality of pairs of first selected conductive portions corresponding to the substrate surface F2 side of the root node NR, and the inspection is performed. If current is simultaneously supplied to a plurality of pairs of conductive portions P, duplication of current paths occurs. However, the resistance of the root node NR, i.e., the planar conductor IP, is very small compared to the wiring W, so even if duplication of current paths occurs in the planar conductor IP, the influence on the voltage measurement result is small.

[0183] Therefore, multiple pairs of conductive parts P are selected in a manner that includes all the conductive parts P selected in step S401, and are recorded in the inspection instruction information D2 as multiple pairs of first selected conductive parts corresponding to the substrate surface F2 side of the root node NR, instead of executing steps S402 and S403. In the inspection using the inspection processing unit 21 described later, current can be supplied to multiple pairs of first selected conductive parts at the same time, thereby shortening the inspection time.

[0184] On the other hand, when the conductor layer Lc is not adjacent to the side of the second selection layer LL2 away from the substrate surface F2 (No in step S18), the inspection instruction information generating unit 31 selects the wiring layer L adjacent to the side of the second selection layer LL2 away from the substrate surface F2 as a new second selection layer LL2 (step S21: (g) process). Thus, steps S22 to S24 are executed with the new second selection layer LL2 as the processing object.

[0185] Then, the inspection indication information generating unit 31 selects a conductive portion P on the substrate surface F2 that is electrically connected to the side of one of the nodes N, i.e., conductive, on the opposite side of the node N, corresponding to each node N of the second selection layer LL2, based on the conductive structure information D1″. Moreover, the inspection indication information generating unit 31 groups the selected conductive portions P for each corresponding node N (step S22: (g1) process).

[0186] Then, the inspection indication information generating unit 31 selects any two conductive parts from the conductive parts P included in each group grouped by step S22 as a pair of first selected conductive parts, establishes a correspondence with the second selection layer LL2, and records them in the inspection indication information D2 (step S23: (b) step of (g2) step).

[0187] Next, when there is a group including the conductive portion P not selected as the first selected conductive portion in the group grouped by step S22, the inspection instruction information generating unit 31 selects two conductive portions P including the conductive portion P not selected as the first selected conductive portion as a pair of second selected conductive portions for the group, and establishes a correspondence with the second selected layer LL2 and records them in the inspection instruction information D2 (step S24: step (b) of step (g2)), and then proceeds to step S26 ( Fig.10 ) transfer.

[0188] On the other hand, when there is no group having a conductive portion P that is not selected as the first selected conductive portion in the groups grouped by step S22, the inspection instruction information generating unit 31 directly proceeds from step S23 to step S26 ( Fig.10 ) transfer.

[0189] exist Figure 6 In the example shown in , currently, that is, in the processing corresponding to the wiring layer L2 and the substrate surface F2 side of the planar conductor IP, there is no group having the conductive portion P that is not selected as the first selected conductive portion, so the inspection instruction information generating unit 31 does not record the inspection instruction information D2 and advances the processing from step S23 to step S26 ( Fig.10 ) transfer.

[0190] Next, the inspection instruction information generating section 31 checks whether the inspection instruction information D2 corresponding to the substrate surface F1 and the substrate surface F2 sides of all the wiring layers L and the planar conductor IP has been generated (step S26 ).

[0191] When the inspection instruction information D2 corresponding to the substrate surface F1 and the substrate surface F2 of all the wiring layers L and the planar conductor IP has been generated (Yes in step S26), the process is transferred to step S27. On the other hand, when there are still wiring layers L or substrate surfaces F1 and the substrate surface F2 of the planar conductor IP for which the corresponding inspection instruction information D2 has not been generated (No in step S26), the process is transferred to step S11 ( Figure 8 ) transfer.

[0192] In step S11, the inspection instruction information generating unit 31 checks whether the conductive layer Lc is adjacent to the side of the first selection layer LL1 that is away from the substrate surface F1 (step S11). Figure 6 In the example shown in , the first selected layer LL1 is currently the wiring layer L2. The conductor layer Lc is adjacent to the side of the wiring layer L2 away from the substrate surface F1 (Yes in step S11), so the inspection instruction information generating unit 31 sets the flag Fip1 to 1 (step S12) and moves the processing to step S301 ( Fig.12 ) transfer.

[0193] In step S301, the inspection indication information generating unit 31 selects a conductive portion P that is conductive on the opposite side of the root node NR (planar conductor IP) for each branch M (through hole V) connected to the substrate surface F1 side of the root node NR, thereby grouping the selected conductive portion P as a conductive portion corresponding to the substrate surface F1 side of the root node NR (step S301: (h) process).

[0194] exist Figure 6 In the example shown in , branches Mr1, Mr2, Mr3, and Mr4 are connected to the substrate surface F1 side of the root node NR. As the conductive part P that is conductive with the branch Mr1, there are conductive parts P1 and P2. As the conductive part P that is conductive with the branch Mr2, there are conductive parts P3, P4, and P5. As the conductive part P that is conductive with the branch Mr3, there is conductive part P6. As the conductive part P that is conductive with the branch Mr4, there is conductive part P7.

[0195] Therefore, in step S301, any one of the conductive parts P1 and P2 is selected, for example, the conductive part P1, and any one of the conductive parts P3, P4, and P5 is selected, for example, the conductive part P3, and then the conductive parts P6 and P7 are selected. Thus, the conductive parts P1, P3, P6, and P7 are grouped.

[0196] Next, the inspection instruction information generating unit 31 selects any two conductive portions P from the conductive portions P grouped in step S301 as a pair of first selected conductive portions, associates them with the substrate surface F1 side of the root node NR, and records them in the inspection instruction information D2 (step S302: (h) process).

[0197] exist Figure 6 In the example shown in , any two conductive portions P, for example, conductive portion P1 and conductive portion P3 are selected from the conductive portions P1 , P3 , P6 , and P7 grouped in step S301 as a pair of first selected conductive portions.

[0198] Next, when there is a group including a conductive portion P that is not selected as the first selected conductive portion in the group grouped by step S301, the inspection instruction information generating unit 31 selects two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion as a pair of second selected conductive portions for the group, and establishes a correspondence with the substrate surface F1 side of the root node NR and records them in the inspection instruction information D2 (step S303), and then proceeds to step S17 ( Fig. 9 ) transfer.

[0199] In step S302, among the conductive parts P1, P3, P6, and P7 grouped by step S301, the conductive parts P6 and P7 are not selected as the first selected conductive parts. Therefore, the inspection indication information generating unit 31 selects two conductive parts P including the conductive parts P6 and P7 that are not selected as the first selected conductive parts as a pair of second selected conductive parts for the group of conductive parts P1, P3, P6, and P7 having the conductive parts P that are not selected as the first selected conductive parts. In this case, the conductive parts P6 and P7 are selected as a pair of second selected conductive parts (step S303).

[0200] In step S303, for example, when the conductive parts included in the group are the conductive part P1, the conductive part P3, and the conductive part P6, and the only conductive part not selected as the first selected conductive part is the conductive part P6, the conductive part P6 is selected as a pair of second selected conductive parts with any one of the conductive part P1 and the conductive part P3.

[0201] In addition, similar to the above-mentioned steps S402 and S403, the inspection instruction information generating unit 31 can also select a plurality of pairs of conductive portions P in a manner including all the conductive portions P selected in step S301, and establish a correspondence between the conductive portions P and the substrate surface F1 side of the root node NR as a plurality of pairs of first selected conductive portions and record them in the inspection instruction information D2, instead of performing the steps S302 and S303. For example, the inspection instruction information generating unit 31 can also pair the conductive portions P1 and P3 with the conductive portions P6 and P7, respectively, from the conductive portions P1, P3, P6, and P7 grouped in step S301, and establish a correspondence between the conductive portions P1 and P3 and the conductive portions P6 and P7, as a plurality of pairs of first selected conductive portions and the substrate surface F1 side of the root node NR, and record them in the inspection instruction information D2.

[0202] Then, in step S17 ( Fig. 9 ), the current flag Fip2 is 1, so the inspection instruction information generating unit 31 moves the processing to step S26 ( Fig.10 ) transfer.

[0203] In step S26 , since the processes of steps S5 to S403 have been executed on the substrate surfaces F1 and F2 of all wiring layers L and planar conductors IP (YES in step S26 ), the second step (step S27 ) is further executed to prevent omission of inspection sites.

[0204] Reference Fig.14 The inspection instruction information generating section 31 searches for the wiring W which is not sandwiched by any of the pair of first selected conductive portions and the pair of second selected conductive portions selected in steps S1 to S403 (step S501 : process (j)).

[0205] exist Figure 6 In the example shown in , in steps S1 to S403, conductive portion pair P1, P2, conductive portion pair P1, P3, conductive portion pair P3, P4, conductive portion pair P4, P5, conductive portion pair P11, P12, conductive portion pair P11, P15, conductive portion pair P15, P16 are selected as the first selected conductive portion pair, and conductive portion pair P6, P7, conductive portion pair P13, P14, conductive portion pair P16, P17 are selected as the second selected conductive portion pair.

[0206] Thus, on the substrate surface F1 side, the conductive portions P1 to P7 are continuously selected in a series as the first selected conductive portion and the second selected conductive portion, so there is no wiring W that is not sandwiched by any pair of the first selected conductive portion pair and the second selected conductive portion pair. On the other hand, on the substrate surface F2 side, the conductive portion pair P11, P12 and the conductive portion pair P13, P14 become discontinuous.

[0207] Fig.15 This is an explanatory diagram for explaining the second step. Fig.15 Will Figure 5 The vicinity of the conductive portion P11 to the conductive portion P14 is partially enlarged and shown.

[0208] exist Figure 6 , Fig.15 In the example shown in , in steps S1 to S403 , the conductive portion pair P11 , P12 and the conductive portion pair P13 , P14 are selected as the first selected conductive portion pair and the second selected conductive portion pair, but the conductive portion pair P12 , P13 is not selected. As a result, Fig.15 The wiring W42 shown in FIG. 1 is not sandwiched by any of the pair of first selection conductive portions and the pair of second selection conductive portions.

[0209] Then, the inspection instruction information generating unit 31 checks whether there is a matching wiring W (step S503). If there is a matching wiring W (yes in step S503), the process proceeds to step S504. On the other hand, if there is no matching wiring W (no in step S503), the inspection instruction information generating unit 31 ends the process. Figure 6 In the example shown in , wiring W42 complies.

[0210] In step S504, the inspection indication information generating unit 31 records the conductive portion P that is connected to one end of the corresponding wiring W without passing through the wiring W, and the conductive portion P that is connected to the other end of the wiring W without passing through the wiring W, as a pair of third selected conductive portions that should be inspected differently from the first selected conductive portion in the inspection indication information D2 (step S504: (k) process).

[0211] exist Fig.15 In the example shown in , for example, a conductive portion P12 that is conductively connected to one end T1 of the corresponding wiring W42 without passing through the wiring W42 and a conductive portion P13 that is conductively connected to the other end T2 of the wiring W42 without passing through the wiring W42 are selected as a pair of third selected conductive portions (step S504).

[0212] Next, the inspection instruction information generating unit 31 checks whether the substrate B includes a plurality of conductor layers Lc (step S505), and if there are a plurality of conductor layers Lc (yes in step S505), the process proceeds to step S506. On the other hand, if there are no plurality of conductor layers Lc (no in step S505), the inspection instruction information generating unit 31 ends the process.

[0213] In step S506, the inspection instruction information generating unit 31 checks whether there is a through hole V connecting the planar conductors IP of the plurality of conductor layers Lc to each other (step S506). If the through hole V exists (yes in step S506), the process proceeds to step S507. On the other hand, if the through hole V does not exist (no in step S506), the inspection instruction information generating unit 31 ends the process.

[0214] Fig.17 The substrate B shown in FIG. 1 includes two conductor layers Lc and is provided with through holes Vc connecting planar conductors IP of the two conductor layers Lc. To check the conduction of the through holes Vc, a current must flow between the conductive portion P on the substrate surface F1 and the conductive portion P on the substrate surface F2.

[0215] Therefore, in step S507, the inspection indication information generating unit 31 records one of the conductive parts P on the substrate surface F1 and one of the conductive parts P on the substrate surface F2 as a pair of fourth selected conductive parts that should be inspected differently from the first selected conductive parts in the inspection indication information D2 (step S507: (l) process), and ends the processing.

[0216] As a result of recording the pair of fourth selected conductive portions in the inspection instruction information D2, the substrate inspection device 2 can inspect the through hole Vc by inspection based on the inspection instruction information D2.

[0217] In addition, among the first selected conductive portion, the second selected conductive portion, the third selected conductive portion, and the fourth selected conductive portion selected by steps S1 to S507, only the fourth selected conductive portion for inspecting the through hole Vc selects the conductive portion P on the substrate surface F1 and the conductive portion P on the substrate surface F2 as a pair of conductive portions P to be inspected, and selection of a pair of conductive portions P from both surfaces of the substrate B is set to the necessary minimum.

[0218] When a current is passed between a pair of conductive parts P of the substrate B and the voltage is measured to perform an inspection, an external electromagnetic field overlaps with the detection voltage as noise. The external electromagnetic field is applied in a substantially uniform manner within the surface of one side of the substrate B, so that the noise voltage caused by the external electromagnetic field becomes substantially constant on the surface side of one side of the substrate B. Therefore, when the voltage between a pair of conductive parts P within the surface of one side of the substrate B is measured, the noise overlapped with the measurement voltage becomes a common mode, and as a result, the influence of the noise on the measurement voltage is reduced.

[0219] On the other hand, the electromagnetic field strength applied to the front and back of the substrate B differs between the two surfaces of the substrate B, and the noise voltage caused by the external electromagnetic field differs between the surface on one side and the surface on the other side of the substrate B. Therefore, when the voltage between a pair of conductive parts P is measured across the two surfaces of the substrate B, the noise superimposed on the measured voltage becomes a normal mode, and as a result, the noise voltage directly overlaps with the measured voltage. As a result, compared with the case of measuring the voltage between a pair of conductive parts P within the surface of one side of the substrate B, the influence of noise becomes greater when the voltage between a pair of conductive parts P is measured across the two surfaces of the substrate B.

[0220] According to steps S1 to S507, the conductive portion P spanning the two surfaces of the substrate B is set to the minimum fourth selected conductive portion required to inspect the through hole Vc. In addition, the conductive portion P within the surface of one side of the substrate B is set to a pair of first selected conductive portions, a pair of second selected conductive portions, and a pair of third selected conductive portions, thereby reducing the influence of noise when inspection is performed based on the inspection indication information D2.

[0221] Furthermore, when inspecting a through hole between the two surfaces of the substrate B, the probe Pr of the measuring jig 4U must be brought into contact with the conductive portion P of the substrate surface F1 of the substrate B, and the probe Pr of the measuring jig 4L must be brought into contact with the conductive portion P of the substrate surface F2 of the substrate B. At this time, if a poor contact occurs in either the probe Pr of the measuring jig 4U or the probe Pr of the measuring jig 4L, it is impossible to determine in which probe Pr the poor contact occurs.

[0222] Therefore, the probes Pr of the two measuring jigs are temporarily separated from the substrate B, and then the probes Pr of the two measuring jigs are brought into contact with the substrate B again for re-inspection. This re-inspection must be repeated multiple times until the probes Pr of the two measuring jigs that contact both sides of the substrate B normally contact the conductive portion P. If the separation and contact of the probes Pr with respect to the conductive portion P are repeated in this way, the inspection time is prolonged and the conductive portion P is easily damaged.

[0223] According to steps S1 to S507, the inspection of the conductive part P across the two surfaces of the substrate B is minimized, and most of the inspection becomes the inspection of the conductive parts P arranged on one side of the substrate B, thereby reducing re-inspection caused by poor contact and easily reducing the risk of damage to the conductive part P.

[0224] As described above, the inspection instruction information generating device 3 can generate the inspection instruction information D2 through the processing of steps S1 to S507. In addition, according to steps S1 to S507, for each corresponding substrate surface, the order recorded in the inspection instruction information D2 corresponds to the order of the conductive portion pairs that should be inspected by the substrate inspection device 2. Specifically, starting from the layer corresponding to the substrate surface F1 and the substrate surface F2, they are recorded in the inspection instruction information D2 in sequence.

[0225] By using the processing of steps S15, step S16, step S23, step S24, step S102, step S103, step S105, step S106, step S302, step S303, step S402, step S403, step S504, and step S507 performed by the inspection instruction information generating unit 31, the conductive parts to be inspected are associated with the substrate surface, layer, and the types of the first selected conductive part, the second selected conductive part, the third selected conductive part, and the fourth selected conductive part, thereby generating Fig.18 Here, "layer" means each layer of the wiring layer L and the conductor layer Lc.

[0226] exist Fig.18 In FIG. 1 , the substrate surface F1 is associated with the five conductive portion pairs, and the order of inspection from top to bottom is indicated. Similarly, the substrate surface F2 is associated with the six conductive portion pairs, and the order of inspection from top to bottom is indicated.

[0227] The inspection instruction information D2 obtained in the above manner is sent to the substrate inspection device 2 by, for example, omitting a communication circuit (not shown), or the inspection instruction information D2 is stored in a storage medium such as a USB memory and the substrate inspection device 2 reads the storage medium, thereby storing the inspection instruction information D2 in the storage unit 22.

[0228] Next, the operation of the substrate inspection device 2 will be described. Fig.18 The following description will be made taking the case of the inspection instruction information D2 shown in FIG. 1 as an example.

[0229] Reference Fig.19 The inspection processing unit 21 selects the first layer among the layers on the substrate surface F1 side as the inspection layer LT1 according to the inspection instruction information D2 (step S51). Fig.18 In the example shown in , the first (uppermost) layer in the order of association with the substrate surface F1 is the wiring layer L1 , and therefore the wiring layer L1 is used as the inspection layer LT1 .

[0230] Then, the inspection processing unit 21 selects the first layer among the layers on the substrate surface F2 side as the inspection layer LT2 according to the inspection instruction information D2 (step S52). Fig.18 In the example shown in , the first (uppermost) layer in the order of association with the substrate surface F2 is the wiring layer L4, and therefore the wiring layer L4 is used as the inspection layer LT2.

[0231] Next, the inspection processing unit 21 performs a first current supply process for simultaneously flowing a measurement current between the conductive portions of the first selected conductive portions of the inspection layers LT1 and LT2 (step S53: (c1) process). Fig.18 In the example shown in , the inspection layer LT1 is currently the wiring layer L1, and the inspection layer LT2 is the wiring layer L4. Therefore, the inspection processing unit 21 simultaneously flows the measuring current into the conductive part pair P1, P2, the conductive part pair P4, P5, the conductive part pair P11, P12, and the conductive part pair P15, P16 which are the first selected conductive parts of the wiring layer L1 and the wiring layer L4.

[0232] Next, the inspection processing unit 21 detects the voltage between the conductive portion pairs of the first selected conductive portions of the inspection layer LT1 and the inspection layer LT2, and inspects the through hole V and the wiring W of the current path between the conductive portions based on the voltage and the measuring current (step S54: (c1) process).

[0233] exist Fig.18 In the example of , the inspection processing unit 21 allows current to flow between each pair of conductive portion pairs P1, P2, conductive portion pairs P4, P5, conductive portion pairs P11, P12, and conductive portion pairs P15, P16, and detects the voltage between each pair. Moreover, the inspection processing unit 21 calculates the resistance value between each pair by dividing the voltage between the pairs by the current flowing between the pairs. The inspection processing unit 21 compares the calculated resistance values ​​with, for example, a reference value stored in advance in the storage unit 22. If each resistance value is below the reference value, the substrate B is determined to be good, and if each resistance value exceeds the reference value, the substrate B is determined to be defective.

[0234] In step S54, the inspection processing unit 21 reports the determination result to the user by displaying it on a reporting unit such as a display device (not shown). In addition, the inspection processing unit 21 does not necessarily need to report the determination result to the user.

[0235] In step S54, the through hole V and the wiring W are checked, the through hole V corresponds to the branches M11, branch M12, branch M13, branch M14, branch M41, branch M42, branch M45, and branch M46 that are the current paths between the conductive part pairs P1, P2, conductive part pairs P4, P5, conductive part pairs P11, P12, and conductive part pairs P15, P16 that have been selected as the first selected conductive parts, and the wiring W corresponds to the nodes N11, node N12, node N41, and node N42.

[0236] In step S53, current can be simultaneously flowed into each pair of conductive parts P1, P2, conductive part pairs P4, P5, conductive part pairs P11, P12, and conductive part pairs P15, P16 that have been selected as the first selected conductive parts, and the voltage between each pair can be measured, thereby easily shortening the inspection time of the substrate.

[0237] In addition, if current is simultaneously flowing between a plurality of pairs of conductive portions P that are connected via the same node N (wiring W), there is a risk that the measurement current will flow repeatedly through the wiring W. In this case, the voltage generated by the repetition of current will become a measurement error, so there is a risk that the inspection accuracy will decrease.

[0238] On the other hand, in the inspection instruction information D2, the conductive portion pairs P of the first selected conductive portion are selected so that current duplication does not occur even if the measuring current flows simultaneously in each layer. Therefore, in steps S51 to S54, the conductive portion pairs P to which the measuring current flows simultaneously are determined based on the inspection instruction information D2, thereby reducing the risk of a decrease in inspection accuracy and shortening the inspection time of the substrate.

[0239] Then, when the substrate B is determined to be defective in step S54 (Yes in step S55), the inspection processing unit 21 does not perform the subsequent processing and ends the processing. On the other hand, when the substrate B is not determined to be defective in step S54 (No in step S55), the inspection processing unit 21 advances the processing to step S61 ( Fig. 20 ) transfer.

[0240] In step S61, the inspection processing unit 21 performs a second current supply process for flowing a measurement current between the paired conductive portions of the second selected conductive portions of the inspection layers LT1 and LT2, independently of the first current supply process (step S61: (c2) process).

[0241] Then, the inspection processing unit 21 detects the voltage between the conductive portion pairs of the second selected conductive portions of the inspection layer LT1 and the inspection layer LT2, and inspects the through hole V and the wiring W of the current path between the paired second selected conductive portions based on the voltage and the measurement current (step S62: (c2) process). The inspection processing unit 21 performs the inspection and reports the determination result in the same manner as in step S54.

[0242] The supply and check of the measuring current in step S61 and step S62 are not performed simultaneously with step S53 , that is, they are performed when the measuring current in step S53 is not flowing.

[0243] In step S61 and step S62, the inspection of the second selected conductive portion is performed at different times from the inspection of the first selected conductive portion, thereby preventing duplication of the measurement current. The processing of step S61 and step S62 for the conductive portion pair of the second selected conductive portion of the inspection layer LT1 and the conductive portion pair of the second selected conductive portion of the inspection layer LT2 may also be performed simultaneously.

[0244] exist Fig.18 In the example, the current inspection layer LT1 is the wiring layer L1, and the inspection layer LT2 is the wiring layer L4. Therefore, there is no conductive portion pair of the second selected conductive portion of the inspection layer LT1 (wiring layer L1), and therefore the second current supply process for the conductive portion pair of the second selected conductive portion of the inspection layer LT1 (wiring layer L1) is not performed. The inspection processing unit 21 performs steps S61 and S62 on the conductive portion pair P13 and P14, and the conductive portion pair P16 and P17, which are the second selected conductive portion of the wiring layer L4, at different times from steps S53 and S54.

[0245] Then, when the substrate B is determined to be defective in the inspection of step S62 (Yes in step S63), the inspection processing unit 21 does not perform the subsequent processing and ends the processing. On the other hand, when the substrate B is not determined to be defective in the inspection of step S62 (No in step S63), the inspection processing unit 21 transfers the processing to step S64.

[0246] In step S64, the inspection processing unit 21 checks whether the inspection layer LT1 and the inspection layer LT2 are both conductor layers Lc, or one is the conductor layer Lc and the other is not (step S64). When the inspection layer LT1 and the inspection layer LT2 are both conductor layers Lc, or one is the conductor layer Lc and the other is not (no in step S64), the inspection processing unit 21 moves to step S65. When the inspection layer LT1 and the inspection layer LT2 are both conductor layers Lc, or one is the conductor layer Lc and the other is not (yes in step S64), the inspection processing unit 21 moves to step S71 ( Fig.21 At present, both the inspection layer LT1 and the inspection layer LT2 are not the conductor layer Lc (No in step S64), so the process proceeds to step S65.

[0247] In step S65, if the inspection layer LT1 is not the conductor layer Lc, the inspection processing unit 21 sets the next sequential layer among the layers on the substrate surface F1 side as the inspection layer LT1 according to the inspection instruction information D2 (step S65). In the case where the current inspection layer LT1 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT1. Then, if the inspection layer LT2 is not the conductor layer Lc, the inspection processing unit 21 sets the next sequential layer among the layers on the substrate surface F2 side as the inspection layer LT2 according to the inspection instruction information D2 (step S66), and proceeds to step S53 ( Fig.19 When the current inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT2.

[0248] At present, the inspection layer LT1 is the wiring layer L1, and the inspection layer LT2 is the wiring layer L4, so the inspection processing unit 21 sets the new inspection layer LT1 as the wiring layer L2, sets the new inspection layer LT2 as the conductor layer Lc, and proceeds to step S53 ( Fig.19 ) transfer.

[0249] In step S53, the inspection processing unit 21 simultaneously flows a measuring current into the conductive portion pair P3 and P4 which are the first selected conductive portion of the wiring layer L2, and the conductive portion pair P11 and P15 which are the first selected conductive portion of the conductor layer Lc of the substrate surface F2, and detects the voltage between the conductive portion pair P3 and P4 and the voltage between the conductive portion pair P11 and P15, and inspects the through hole V and the wiring W of the current path between the conductive portions based on the voltage and the measuring current (step S53, step S54: (c1) process).

[0250] If the answer is NO in step S55, the inspection processing unit 21 proceeds to step S61. Fig.18According to the inspection instruction information D2 shown in FIG, there is no second selected conductive portion corresponding to the wiring layer L2 and the conductor layer Lc of the substrate surface F2, so steps S61 to S63 are not executed and the process proceeds to step S64.

[0251] In step S64, since it does not meet any of the situations that both the inspection layer LT1 and the inspection layer LT2 are the conductor layer Lc, and one is the conductor layer Lc and the other does not have an inspection layer, the process moves to step S65, and the inspection processing unit 21 sets the conductor layer Lc, which is the next layer of the wiring layer L2 on the substrate surface F1 side of the inspection instruction information D2, as the inspection layer LT1 (step S65). In step S66, since the inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT2, and moves to step S53 again.

[0252] In step S53, the inspection processing unit 21 flows a measuring current into the conductive part pair P1, P3 of the first selected conductive part of the conductor layer Lc on the side of the substrate surface F1, and detects the voltage between the conductive part pair P1, P3, and inspects the through hole V and the wiring W of the current path between the conductive parts based on the voltage and the measuring current (step S53, step S54: (c1) process).

[0253] If the answer is NO in step S55, the inspection processing unit 21 proceeds to step S61. Fig.18 According to the inspection instruction information D2 shown in FIG. 1 , the second selected conductive portion of the conductor layer Lc on the substrate surface F1 side is the conductive portion pair P6 and P7. Therefore, the inspection processing unit 21 performs steps S61 and S62 on the conductive portion pair P6 and P7.

[0254] If the result is No in step S63, the inspection processing unit 21 proceeds to step S64. At present, the inspection layer LT1 is set as the conductor layer Lc in step S65, and the inspection layer LT2 is set as None in step S66 (Yes in step S64), so the process proceeds to step S71 ( Fig.21 ) transfer.

[0255] In step S71 , the inspection processing unit 21 performs a third current supply process for flowing a measurement current between the paired conductive portions, independently of the first current supply process and the second current supply process, for the conductive portion pair of the third selected conductive portion (step S71 ).

[0256] Then, the inspection processing unit 21 detects the voltage between the conductive part pairs of the third selected conductive part, and inspects the through hole V and the wiring W of the current path between the conductive parts based on the voltage and the measurement current (step S72). The inspection processing unit 21 performs the inspection and reports the determination result in the same manner as in step S54.

[0257] exist Fig.18 In the example, there is no third selected conductive portion corresponding to the substrate surface F1, and the third selected conductive portion corresponding to the substrate surface F2 is the conductive portion pair P12 and P13. Therefore, the inspection processing unit 21 performs the third current supply process (step S71) to flow the measurement current between the conductive portions of the conductive portion pair P12 and P13 at different times from the first current supply process and the second current supply process, and detects the voltage between the conductive portions of the conductive portion pair P12 and P13, and inspects the through hole V and the wiring W of the current path between the conductive portions based on the voltage and the measurement current (step S72).

[0258] exist Fig.18 In the example, check Fig.15 The wiring W42 of the current path between the conductive portion pair P12 and P13 shown in FIG. Thereby, the risk of missing the inspection of the wiring W can be reduced, and the inspection accuracy of the substrate B can be improved.

[0259] Next, the inspection processing unit 21 performs a fourth current supply process for flowing a measurement current between the paired conductive portions, with respect to the conductive portion pair of the fourth selected conductive portion, independently of the first to third current supply processes (step S73 ).

[0260] Then, the inspection processing unit 21 detects the voltage between the conductive part pair of the fourth selected conductive part, and inspects the through hole V and the wiring W of the current path between the conductive parts based on the voltage and the measurement current (step S74), and then ends the processing. The inspection processing unit 21 performs the inspection and reports the determination result in the same way as in step S54.

[0261] exist Fig.18 In the example of , since the fourth selected conductive portion does not exist, the inspection processing unit 21 does not execute step S73 and step S74 and ends the processing.

[0262] According to step S73 and step S74, for example, it can be checked that Fig.17 The through hole Vc of the substrate B shown in the figure includes two conductor layers Lc and is provided with the through hole Vc connecting the planar conductors IP of the two conductor layers Lc to each other.

[0263] In addition, the inspection instruction information generating device 3 sorts the inspection instruction information D2 for each substrate surface in order from the layer corresponding to the substrate surface F1 and the substrate surface F2. As a result, the substrate inspection device 2 specifies the inspection order through steps S51, S52, S65, and S66, thereby making the wiring layers L the objects of inspection in order from the layer corresponding to the substrate surface F1 and the substrate surface F2.

[0264] Generally, there is a tendency that the closer the substrate B is to the substrate surface F1 and the substrate surface F2, the more wirings W are provided in the wiring layer L. The more wirings W are provided in the wiring layer L, the more the number of conductive portion pairs corresponding to the first selected conductive portion of one layer increases. The more the number of conductive portion pairs of the first selected conductive portion increases, the more the number of conductive portion pairs that can be inspected simultaneously in step S53 increases.

[0265] Therefore, by setting the wiring layer L as the inspection object in sequence from the substrate surface F1 and the substrate surface F2, the number of simultaneous inspections in the early stage of the inspection can be increased. If the number of simultaneous inspections in the early stage of the inspection can be increased, the defect of the substrate B can be detected in the early stage of the inspection. Therefore, in the case where the inspection is terminated when a defect is detected as in step S55 and step S63, by setting the wiring layer L as the inspection object in sequence from the substrate surface F1 and the substrate surface F2, the time before the defect is detected can be shortened, and the possibility of shortening the inspection time can be increased.

[0266] In addition, an example in which the inspection instruction information generating device 3 and the substrate inspection device 2 are configured as separate devices is shown, but the inspection instruction information generating device 3 and the substrate inspection device 2 may also be configured as a single device. For example, the following configuration may be possible: the substrate inspection device 2 includes an inspection instruction information generating unit 31 and a storage unit 32, so that the substrate inspection device 2 also serves as the inspection instruction information generating device. In this case, the substrate inspection system is configured by a substrate inspection device that also serves as the inspection instruction information generating device.

[0267] In addition, the inspection instruction information generating device 3 and the inspection instruction information generating method do not necessarily need to execute Figure 7 to Figure 14 The inspection processing unit 21 does not necessarily need to execute all the processes described in Figure 19 to Figure 21 All the processes documented in .

[0268] The inspection instruction information generating device 3 and the inspection instruction information generating method can generate the following inspection instruction information D2 even when, for example, only steps S101 and S102 are executed: the inspection time of the wiring W of the wiring layer L1 adjacent to the substrate surface F1 and the through hole V connecting the wiring layer L1 adjacent to the substrate surface F1 and the conductive part P can be easily shortened. In this case, the inspection processing unit 21 only needs to execute steps S53 and S54.

[0269] In addition, an example in which the wiring layer L and the conductive portion P are provided on both sides of the conductor layer Lc is shown, but the wiring layer L and the conductive portion P may be provided only on one side of the conductor layer Lc. For example, the substrate B may not include the substrate B4 and the substrate B5. In this case, it is not necessary to perform processing related to the selection layer LL2, for example, it is not necessary to perform steps S18 to S24, steps S104 to S106, steps S401 to S403, step S52, step S66, etc.

[0270] In addition, the inspection processing unit 21 may be configured as follows: even if step S55 and step S63 are not executed and a defect is detected during the inspection, the inspection is continued. In addition, the inspection instruction information generating device 3 and the inspection instruction information generating method are not necessarily limited to the example of recording the conductive portion pairs in the inspection instruction information D2 in order from the layer corresponding to the substrate surface F1 and the substrate surface F2 through step S4, step S13, and step S21. The inspection instruction information generating device 3 and the inspection instruction information generating method may record the conductive portion pairs in the inspection instruction information D2 in any order.

[0271] That is, an inspection instruction information generating device of an example of the present invention includes: a storage unit storing conductive structure information indicating how the planar conductors, conductive parts, wirings, and through holes of a substrate are connected and conducted, wherein the substrate includes: a conductor layer as a layer provided with the planar conductor having conductivity extending into a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through holes connecting the wirings of the wiring layer to the plurality of conductive parts, and through holes connecting the wirings of the wiring layer to the planar conductors of the conductor layer; and an inspection instruction information generating unit which, when there are a plurality of groups of the conductive parts that are mutually conducted via the wirings of the wiring layer, performs the following inspection instruction information generating processing according to the conductive structure information: selects a pair of the conductive parts from each of the groups as the first selected conductive parts, and records information indicating the selected plurality of pairs of the first selected conductive parts as inspection instruction information.

[0272] In addition, an inspection instruction information generating method of an example of the present invention includes an inspection instruction information generating process, wherein the inspection instruction information generating process is based on conductive structure information representing how the planar conductors, conductive parts, wirings, and through holes of a substrate are connected and conducted, wherein the substrate includes: a conductor layer as a layer provided with the planar conductor having conductivity extended into a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through holes connecting the wirings of the wiring layer to the plurality of conductive parts, and through holes connecting the wirings of the wiring layer to the planar conductors of the conductor layer. When there are multiple groups of the conductive parts that are mutually conducted via the wirings of the wiring layer, the following inspection instruction information generating process is performed: a pair of the conductive parts are selected from each of the groups as the first selected conductive parts, and information representing the selected multiple pairs of first selected conductive parts is generated as inspection instruction information.

[0273] In addition, an inspection instruction information generating program of an example of the present invention enables a computer to generate conductive structure information representing how the planar conductors, conductive parts, wirings, and through holes of a substrate are connected and conducted, wherein the substrate includes: a conductor layer as a layer provided with the planar conductor having conductivity extending into a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through holes connecting the wirings of the wiring layer to the plurality of conductive parts, and through holes connecting the wirings of the wiring layer to the planar conductors of the conductor layer. When there are multiple groups of the conductive parts that are mutually conducted via the wirings of the wiring layer, the following inspection instruction information generating process is performed: a pair of the conductive parts are selected from each of the groups as the first selected conductive parts, and information representing the selected multiple pairs of the first selected conductive parts is generated as inspection instruction information.

[0274] When there are multiple groups of conductive parts that are mutually conductive via the wiring of the wiring layer, even if the current flows between the conductive parts of a certain group, the current will not flow into other groups. Therefore, according to the structure, when there are multiple groups of conductive parts that are mutually conductive via the wiring of the wiring layer, through the inspection instruction information generation process, according to the conductive structure information, a pair of conductive parts are selected from each of the groups as the first selected conductive parts, and the information representing the selected multiple pairs of first selected conductive parts is recorded as the inspection instruction information. Thus, a pair of first selected conductive parts are selected from a group, so that the multiple pairs of first selected conductive parts belong to different groups respectively. Therefore, even if the current flows into the multiple pairs of first selected conductive parts represented by the inspection instruction information at the same time, the current will not be repeated. Therefore, the multiple pairs of first selected conductive parts based on the inspection instruction information obtained in the manner are set as the inspection parts, so that the inspection of multiple parts can be carried out at the same time, and as a result, the inspection time of the substrate is easily shortened.

[0275] In addition, it is preferred that the inspection instruction information generation process includes the following steps: (a) grouping the conductive parts that are mutually conductive via the wiring of the wiring layer based on the conductive structure information; and (b) for the grouped multiple groups, selecting two conductive parts from the conductive parts included in each group as the pair of first selected conductive parts, and setting the selected multiple pairs of first selected conductive parts as inspection parts that can be inspected simultaneously and recording them in the inspection instruction information.

[0276] According to the structure, in (a), the conductive parts that are mutually connected via the wiring of the wiring layer are grouped, that is, the conductive parts that are likely to overlap each other's current paths if current flows into a plurality of conductive part pairs are grouped. In addition, in (b), for the grouped plurality of groups, that is, for the plurality of groups in which even if current flows between the conductive part pairs in the group, there will be no overlap of current paths with other groups, two conductive parts are selected from the conductive parts included in the groups as a pair of first selected conductive parts, and the selected plurality of first selected conductive parts are set as inspection parts that can be inspected simultaneously and recorded in the inspection instruction information. Thus, a pair of first selected conductive parts is selected from one group, so that the plurality of first selected conductive parts belong to different groups respectively. Therefore, even if current flows into the plurality of first selected conductive parts represented by the inspection instruction information at the same time, the current will not overlap. Therefore, by setting the plurality of first selected conductive parts based on the inspection instruction information obtained in the above manner as the inspection parts, the inspection of the plurality of parts can be carried out simultaneously, and as a result, the inspection time of the substrate can be easily shortened.

[0277] In addition, it is preferred that in the process (b), when there is a group having a conductive portion that is not selected as the first selected conductive portion, for the group, two conductive portions including the conductive portion that is not selected as the first selected conductive portion are recorded in the inspection indication information as a pair of second selected conductive portions that are to be inspected differently from the multiple pairs of first selected conductive portions.

[0278] According to the above structure, the risk of missing the conductive portion that is not selected as the first selected conductive portion from the inspection site can be reduced.

[0279] In addition, it is preferred that the substrate includes multiple layers of the wiring layers, and further includes multiple through holes connecting the multiple wiring layers, and the inspection indication information generating unit further performs the following process: (d) when the wiring of the multiple wiring layers is connected in parallel, before the (a) process, the conductive structure information is changed in a manner of replacing the multiple wirings connected in parallel with one wiring among the wirings that is closest to the substrate surface, and the inspection indication information generation process is performed based on the conductive structure information changed by the (d) process.

[0280] According to the above configuration, the conductive structure information is simplified, and therefore the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, the inspection instruction information generation process is easily executed.

[0281] In addition, it is preferred that the inspection indication information generating unit further performs the following process: (e) when the through hole or the column of through holes is connected in parallel with the planar conductor through the wiring, before the (a) process, the conductive structure information changed by the process (d) is changed in such a manner that the through hole or the column of through holes connected in parallel is replaced with one through hole or a column of through holes, and the inspection indication information generating process is performed based on the conductive structure information changed by the process (e).

[0282] According to the above configuration, the conductive structure information is simplified, and therefore the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, the inspection instruction information generation process is easily executed.

[0283] In addition, it is preferred that the substrate includes multiple layers of the wiring layers, and further includes multiple through holes connecting the multiple wiring layers. The inspection indication information generating unit (f) performs the (a) step and the (b) step on the wiring layer closest to the substrate surface among the multiple wiring layers as the processing object. (g) For the other wiring layers other than the wiring layer closest to the substrate surface, the other wiring layers are respectively processed as the processing objects. (g1) For each wiring of the wiring layer that becomes the processing object, corresponding to one of the wirings, for a through hole connected to the side of the one wiring away from the conductor layer, a conductive part that is electrically connected to the one through hole on the opposite side of the wiring is selected, thereby grouping the selected conductive parts for the corresponding each wiring. (g2) For the group grouped in the (g1) step, the (b) step is performed, and the (b) step establishes a correspondence between the first selected conductive part of each pair and the wiring layer of the processing object and records them in the inspection indication information.

[0284] According to the above configuration, a pair of conductive portions serving as inspection sites for inspecting a substrate including a plurality of wiring layers and a plurality of through holes connecting the plurality of wiring layers can be recorded in the inspection instruction information.

[0285] In addition, it is preferred that the step (b) starts from selecting the wiring layer close to the substrate surface as the processing object in the steps (f) and (g), and then sequentially sorts the multiple pairs of first selected conductive parts for each wiring layer and records them in the inspection indication information.

[0286] Generally, there is a tendency that the closer a substrate is to the substrate surface, the more wiring is provided in the wiring layer. The more wiring is provided in the wiring layer, the more the number of pairs of first selected conductive portions relative to the wiring layer to be processed, that is, the more pairs of conductive portions into which the measuring current can flow simultaneously during inspection, increase. Therefore, if, starting from selecting the wiring layer close to the substrate surface as the processing object, a plurality of pairs of first selected conductive portions are sequentially sorted for each wiring layer and recorded in the inspection instruction information, then during inspection, the wiring layer to be inspected can be selected in the order sorted by the inspection instruction information, and the measuring current can be made to flow into the first selected conductive portion pairs corresponding to the wiring layer for inspection. If the inspection is performed in this way, the number of simultaneous inspections in the early stage of the inspection can be increased. If the number of simultaneous inspections in the early stage of the inspection can be increased, a defective substrate can be detected in the early stage of the inspection.

[0287] In addition, it is preferred that (h) for each through hole connected to one side of the planar conductor, one of the conductive portions electrically connected to the side opposite to the planar conductor is selected, thereby grouping the selected conductive portions as conductive portions corresponding to one side of the planar conductor, selecting two conductive portions from the grouped conductive portions as a pair of first selected conductive portions, and recording the selected pair of first selected conductive portions in the inspection indication information.

[0288] According to the above structure, the through hole connected to the planar conductor can be inspected.

[0289] In addition, it is preferred that the inspection indication information generation process further includes the following steps: (j) exploring the wiring that is sandwiched by the pair of the first selected conductive parts and not sandwiched by the pair of the second selected conductive parts; and (k) recording in the inspection indication information a conductive part that is conductive to one end of the explored wiring without passing through the wiring, and a conductive part that is conductive to the other end of the wiring without passing through the wiring, as a pair of third selected conductive parts that should be inspected simultaneously with the multiple pairs of first selected conductive parts.

[0290] According to the above configuration, the risk of omission of recording of the inspection target portion of the inspection instruction information can be reduced.

[0291] Furthermore, it is preferable that the substrate surface and the wiring layer are provided on both sides of the conductor layer, respectively, and the inspection instruction information generating section executes the inspection instruction information generating process on both sides of the conductor layer.

[0292] According to the above configuration, it is possible to generate inspection instruction information corresponding to a substrate in which a substrate surface and a wiring layer are provided on both sides of a conductor layer.

[0293] In addition, it is preferred that the substrate includes a plurality of the conductor layers and through holes connecting the planar conductors of the plurality of conductor layers to each other, and the inspection indication information generation process further includes the following steps: (l) recording one of the conductive parts on the substrate surface on one side of the substrate surfaces on both sides and one of the conductive parts on the substrate surface on the other side as a pair of fourth selected conductive parts to be inspected differently from the plurality of pairs of first selected conductive parts in the inspection indication information.

[0294] According to the above configuration, for a substrate including a plurality of conductor layers and through holes connecting planar conductors of the plurality of conductor layers, a pair of fourth selective conductive portions for inspecting the through holes connecting the planar conductors may be recorded in the inspection instruction information.

[0295] In addition, it is preferred that the inspection indication information generating unit further performs the following process: (m) making the through hole correspond to the node, the wiring correspond to the branch, and the planar conductor correspond to the root node, thereby converting the conductive structure information into a tree-structured data structure, and performing the inspection indication information generation processing based on the conductive structure information converted into a tree-structured data structure through the (m) process.

[0296] According to the above configuration, the conductive structure information is simplified, and therefore the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, the inspection instruction information generation process is easily executed.

[0297] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps: (c1) for multiple pairs of first selection conductive parts represented by the inspection instruction information, simultaneously performing a first current supply process for causing current to flow between the paired first selection conductive parts, and detecting the voltage between the paired first selection conductive parts, and based on the current and the voltage, inspecting the through holes and wiring of the current path between the pairs of first selection conductive parts.

[0298] According to the above configuration, the first current supply process is simultaneously performed on a plurality of pairs of first selective conductive portions based on the inspection instruction information, thereby avoiding duplication of current measurement and simultaneously performing inspections of a plurality of locations, resulting in the ease of shortening the inspection time of the substrate.

[0299] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps: (c1) for multiple pairs of first selected conductive parts represented by the inspection instruction information, simultaneously perform a first current supply process to make current flow between the pairs of first selected conductive parts, and detect the voltage between the pairs of first selected conductive parts, and inspect the through holes and wiring of the current path between the pairs of first selected conductive parts based on the current and the voltage; and (c2) perform a second current supply process to make current flow between the pairs of second selected conductive parts represented by the inspection instruction information at a different time from the first current supply process, and detect the voltage between the pairs of second selected conductive parts, and inspect the through holes and wiring of the current path between the pairs of second selected conductive parts based on the current and the voltage.

[0300] According to the above configuration, it is possible to inspect the vias or wirings on the current path connected to the conductive portion that is not selected as the first selected conductive portion.

[0301] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps for each wiring layer in the order indicated by the inspection instruction information: (c1) for multiple pairs of first selection conductive parts indicated by the inspection instruction information, a first current supply process is simultaneously performed to allow current to flow between the paired first selection conductive parts, and the voltage between the paired first selection conductive parts is detected, and based on the current and the voltage, the through holes and wiring of the current path between the pairs of first selection conductive parts are inspected, and when the inspection result of the (c1) step is poor, the (c1) step is not performed for the wiring layers that are next in the order and thereafter.

[0302] According to the structure, the wiring layers are inspected in order from the ones close to the substrate surface, so that the substrate defect can be detected at an early stage of the inspection. In addition, if the inspection result is defective, the inspection of the wiring layers in the next order is not performed. As a result, the defect is detected quickly, and the inspection is completed at the time when the defect is detected, so it is easy to shorten the inspection time.

[0303] In addition, a substrate inspection system of an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate according to the inspection instruction information, and the inspection processing unit performs the following steps: (c1) for multiple pairs of first selection conductive parts represented by the inspection instruction information, simultaneously perform a first current supply process of causing current to flow between the pairs of first selection conductive parts, and detect the voltage between the pairs of first selection conductive parts, and based on the current and the voltage, inspect the through holes and wiring of the current path between the pairs of first selection conductive parts, and in the (c1) process, simultaneously perform the first current supply process for the multiple pairs of first selection conductive parts corresponding to one side of the conductor layer through the inspection instruction information and the first current supply process for the multiple pairs of first selection conductive parts corresponding to the other side of the conductor layer.

[0304] According to the above configuration, when inspecting a substrate having a substrate surface and a wiring layer provided on both sides of a conductor layer, the inspection of one side of the conductor layer and the inspection of the other side can be performed simultaneously, so that the inspection time can be easily shortened.

[0305] That is, the inspection instruction information generating device, inspection instruction information generating method and inspection instruction information generating program of such structure can generate the following inspection instruction information: indicating the inspection position that is easy to shorten the inspection time of the substrate. In addition, the substrate inspection system of such structure is easy to shorten the inspection time of the substrate.

[0306] In addition, the specific implementations or examples presented in the specific implementations always make the technical content of the present invention clear, and the present invention should not be limited to such specific examples and interpreted narrowly.

Claims

1. A device for generating inspection indication information, comprising: A storage unit storing conductive structure information indicating how the planar conductor, conductive parts, wiring, and through-holes of a substrate are connected and conducted, the substrate comprising: a conductor layer as a layer provided with the planar conductor extending in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through-holes connecting the wiring of the wiring layer to the plurality of the conductive parts, and through-holes connecting the wiring of the wiring layer to the planar conductor of the conductor layer; and The inspection instruction information generating unit performs the following inspection instruction information generating process according to the conductive structure information when there are a plurality of groups of the conductive parts that are mutually conductive via the wiring of the wiring layer: selecting a pair of the conductive parts from each of the groups as first selected conductive parts, and recording information indicating the selected plurality of pairs of first selected conductive parts as inspection instruction information, The inspection instruction information generation process includes the following steps: Step a: grouping the conductive parts that are electrically connected to each other via the wiring of the wiring layer according to the conductive structure information; and In step b, for the plurality of groups formed into groups, two conductive portions are selected from the conductive portions included in each of the groups as a pair of first selected conductive portions, and the selected plurality of pairs of first selected conductive portions are set as inspection locations that can be inspected simultaneously and recorded in the inspection instruction information. The inspection instruction information generating unit further performs the following steps: step e: in a case where the through holes or the columns of through holes are connected in parallel via the wiring and the planar conductor, before step a, the conductive structure information is changed in such a manner that the through holes or the columns of through holes connected in parallel are replaced with one through hole or one column of through holes, and The inspection instruction information generation process is performed based on the conductive structure information changed in the e-step.

2. An inspection instruction information generating device according to claim 1, wherein in the process b, when there is a group having a conductive part that is not selected as the first selected conductive part, for the group, two conductive parts including the conductive part that is not selected as the first selected conductive part are recorded in the inspection instruction information as a pair of second selected conductive parts that should be inspected differently from the multiple pairs of first selected conductive parts.

3. The inspection instruction information generating device according to claim 1, wherein the substrate comprises a plurality of wiring layers, and further comprises a plurality of through holes connecting the plurality of wiring layers. The inspection instruction information generating unit further performs the following steps: step d: in a case where the wirings of the plurality of wiring layers are connected in parallel, before step a, the conductive structure information is changed in such a manner that the plurality of wirings connected in parallel are replaced with a wiring closest to the substrate surface among the wirings, and The inspection instruction information generation process is performed based on the conductive structure information changed in the step d.

4. The inspection instruction information generating device according to claim 1, wherein the substrate comprises a plurality of wiring layers, and further comprises a plurality of through holes connecting the plurality of wiring layers. The inspection instruction information generating unit performs the steps a and b in the step f by taking the wiring layer closest to the substrate surface among the plurality of wiring layers as a processing target, g step: for other wiring layers except the wiring layer closest to the substrate surface, the other wiring layers are treated as objects respectively; In step g1, for each wiring of the wiring layer to be processed, for one of the wirings, for one through hole connected to the side of the one wiring away from the conductor layer, the conductive portion electrically connected to the one through hole on the opposite side of the wiring, thereby grouping the selected conductive portions for each corresponding wiring. In step g2, the step b is performed on the groups grouped in step g1, and In the step b, each pair of the first selected conductive portions is associated with the wiring layer to be processed and recorded in the inspection instruction information.

5. An inspection instruction information generating device according to claim 4, wherein the process b starts from selecting the wiring layer close to the substrate surface as the processing object in the process f and the process g, and then sequentially sorts the multiple pairs of first selected conductive parts for each of the wiring layers and records them in the inspection instruction information.

6. The inspection instruction information generating device according to claim 1, wherein in step h, for each through hole connected to one side of the planar conductor, one of the conductive portions electrically connected to the opposite side of the planar conductor is selected, thereby grouping the selected conductive portions as conductive portions corresponding to one side of the planar conductor, selecting two conductive portions from the grouped conductive portions as a pair of first selected conductive portions, and recording the selected pair of first selected conductive portions in the inspection instruction information.

7. The inspection instruction information generating device according to claim 2, wherein the inspection instruction information generating process further comprises the following steps: The j step is to search for the wiring that is not sandwiched by the pair of the first selective conductive portions and is not sandwiched by the pair of the second selective conductive portions; and In step k, a conductive portion that is electrically connected to one end of the explored wiring without passing through the wiring, and a conductive portion that is electrically connected to the other end of the wiring without passing through the wiring, are recorded in the inspection instruction information as a pair of third selected conductive portions that should be inspected differently from the multiple pairs of first selected conductive portions.

8. The inspection instruction information generating device according to claim 1, wherein the substrate surface and the wiring layer are respectively arranged on both sides of the conductor layer, and The inspection instruction information generating section executes the inspection instruction information generating process on both sides of the conductor layer.

9. The inspection instruction information generating device according to claim 8, wherein the substrate comprises a plurality of the conductor layers, and through holes connecting the planar conductors of the plurality of the conductor layers to each other, and The inspection instruction information generation process also includes the following steps: In step 1, one of the conductive portions on one side of the substrate surfaces at both sides and one of the conductive portions on the other side of the substrate surfaces are recorded in the inspection instruction information as a pair of fourth selected conductive portions to be inspected at different times from the plurality of pairs of first selected conductive portions.

10. The inspection instruction information generating device according to claim 1, wherein the inspection instruction information generating unit further performs the following steps: step m: making the through hole correspond to a node, making the wiring correspond to a branch, and making the planar conductor correspond to a root node, thereby converting the conductive structure information into a tree-like data structure, and The inspection instruction information generation process is performed based on the conductive structure information converted into a tree structure through the m step.

11. A substrate inspection system, comprising: The inspection instruction information generating device according to any one of claims 1 to 10; as well as An inspection processing unit inspects the substrate according to the inspection instruction information; and The inspection processing unit performs the following steps: In the c1 process, for a plurality of pairs of first selection conductive parts indicated by the inspection indication information, a first current supply process is simultaneously performed to cause current to flow between the paired first selection conductive parts, and a voltage between the paired first selection conductive parts is detected, and based on the current and the voltage, through holes and wiring of the current paths between each pair of first selection conductive parts are inspected.

12. A substrate inspection system, comprising: The inspection instruction information generating device according to claim 2; as well as An inspection processing unit inspects the substrate according to the inspection instruction information; and The inspection processing unit performs the following steps: Step c1 includes simultaneously performing a first current supply process for causing a current to flow between the paired first selected conductive portions for the plurality of pairs of first selected conductive portions indicated by the inspection instruction information, detecting a voltage between the paired first selected conductive portions, and inspecting through holes and wirings of current paths between the pairs of first selected conductive portions based on the current and the voltage; and Process c2 performs a second current supply process for causing current to flow between the pair of second selected conductive parts represented by the inspection indication information, and detects the voltage between the pair of second selected conductive parts, and inspects the through holes and wiring of the current path between the pair of second selected conductive parts based on the current and the voltage.

13. A substrate inspection system, comprising: The inspection instruction information generating device according to claim 5; as well as An inspection processing unit inspects the substrate according to the inspection instruction information; The inspection processing unit performs the following steps for each of the wiring layers in the order indicated by the inspection instruction information: Step c1 simultaneously performs a first current supply process for a plurality of pairs of first selected conductive portions indicated by the inspection instruction information, causing current to flow between the paired first selected conductive portions, and detecting a voltage between the paired first selected conductive portions, and inspecting through holes and wiring of current paths between the pairs of first selected conductive portions based on the current and the voltage, and If the inspection result of the c1 step is defective, the c1 step is not performed on the wiring layers that are next in the order.

14. A substrate inspection system, comprising: The inspection instruction information generating device according to claim 8; as well as An inspection processing unit inspects the substrate according to the inspection instruction information; The inspection processing unit performs the following steps: step c1 of simultaneously performing a first current supply process for causing a current to flow between the paired first selected conductive portions for the plurality of pairs of first selected conductive portions indicated by the inspection instruction information, and detecting a voltage between the paired first selected conductive portions, and inspecting through holes and wiring of a current path between each pair of first selected conductive portions based on the current and the voltage, and In the c1 step, the first current supply processing for the multiple pairs of first selective conductive portions corresponding to one side of the conductive layer by the inspection instruction information and the first current supply processing for the multiple pairs of first selective conductive portions corresponding to the other side of the conductive layer are simultaneously performed.

15. A method for generating inspection instruction information, comprising a step of generating inspection instruction information, wherein the step of generating inspection instruction information is based on conductive structure information indicating how planar conductors, conductive parts, wirings, and through holes of a substrate are connected and conducted, wherein the substrate comprises: a conductor layer as a layer provided with the conductive planar conductor extending in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through holes connecting the wiring of the wiring layer to the plurality of the conductive parts, and through holes connecting the wiring of the wiring layer to the planar conductor of the conductor layer, When there are a plurality of groups of the conductive portions that are mutually conductive via the wiring of the wiring layer, the following inspection instruction information generation process is performed: a pair of the conductive portions are selected from each of the groups as first selected conductive portions, and information representing the selected plurality of pairs of first selected conductive portions is generated as inspection instruction information, The inspection instruction information generation process includes the following steps: a step of grouping the conductive parts that are electrically connected to each other via the wiring of the wiring layer according to the conductive structure information; Step b: for the plurality of groups formed into groups, selecting two conductive portions from the conductive portions included in each of the groups as a pair of first selected conductive portions, and setting the selected plurality of pairs of first selected conductive portions as inspection locations that can be inspected simultaneously and recording them in the inspection instruction information; as well as In step e, when the through holes or the columns of through holes are connected in parallel through the wiring and the planar conductor, before step a, the conductive structure information is changed by replacing the through holes or the columns of through holes connected in parallel with one through hole or one column of through holes.

16. A computer-readable storage medium, comprising a program for generating inspection instruction information, which enables a computer to generate an inspection instruction information based on the conductive structure information indicating how the planar conductor, the conductive part, the wiring, and the through hole of the substrate are connected and conducted, wherein the substrate comprises: a conductor layer as a layer provided with the conductive planar conductor extending in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer as a layer stacked between the conductor layer and the substrate surface, through holes connecting the wiring of the wiring layer to the plurality of the conductive parts, and through holes connecting the wiring of the wiring layer to the planar conductor of the conductor layer, When there are a plurality of groups of the conductive portions that are mutually conductive via the wiring of the wiring layer, the following inspection instruction information generation process is performed: a pair of the conductive portions are selected from each of the groups as first selected conductive portions, and information representing the selected plurality of pairs of first selected conductive portions is generated as inspection instruction information, The inspection instruction information generation process includes the following steps: a step of grouping the conductive parts that are electrically connected to each other via the wiring of the wiring layer according to the conductive structure information; Step b: for the plurality of groups formed into groups, selecting two conductive portions from the conductive portions included in each of the groups as a pair of first selected conductive portions, and setting the selected plurality of pairs of first selected conductive portions as inspection locations that can be inspected simultaneously and recording them in the inspection instruction information; as well as In step e, when the through holes or the columns of through holes are connected in parallel through the wiring and the planar conductor, before step a, the conductive structure information is changed by replacing the through holes or the columns of through holes connected in parallel with one through hole or one column of through holes.

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