Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus capable of reducing process time. The substrate processing apparatus of the present invention includes: an indexing chamber provided with a transfer robot for loading and unloading substrates; a process chamber provided with a heating unit for heating the substrate and performing a process on the substrate; a load lock chamber disposed between the indexing chamber and the process chamber; and a transfer chamber formed between the process chamber and the load lock chamber, provided with a transfer robot for transferring the substrate, and a preheating unit for preheating the substrate in a state before the process is performed is provided on the transfer robot.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate, and more particularly, to a substrate processing apparatus capable of reducing the process time. Background Art

[0002] Generally, in a process chamber of a plasma processing apparatus, a DC power supply is supplied to a DC electrode built in an electrostatic chuck (ESC) to electrostatically adsorb a substrate on the electrostatic chuck, and a heater power supply is supplied to a heater built in the electrostatic chuck to heat the substrate to a temperature suitable for the process. Moreover, the process chamber supplies to the electrostatic chuck (ESC) to form plasma in the reaction space of the chamber, whereby a required thin film is formed on the substrate, or the thin film formed on the substrate is removed for patterning.

[0003] In the above process, it takes a long time to heat the substrate to a set temperature using the heater built in the electrostatic chuck. Recently, substrate processing apparatuses for reducing the semiconductor manufacturing process time and increasing the production volume have been improved, and improvements for reducing the process time are required. Summary of the Invention

[0004] In order to solve the above problems, an object of the present invention is to provide a substrate processing apparatus capable of reducing the process time.

[0005] The substrate processing apparatus according to an embodiment of the present invention includes: an indexing chamber provided with a transfer robot for loading and unloading a substrate; a process chamber provided with a heating unit for heating the substrate and performing a process on the substrate; a load lock chamber disposed between the indexing chamber and the process chamber; and a transfer chamber formed between the process chamber and the load lock chamber, provided with a transfer robot for transferring the substrate, and a preheating unit for preheating the substrate in a state before the process is performed is provided on the transfer robot.

[0006] Moreover, in an embodiment, the transfer robot includes: a hand for supporting the substrate and having a heater therein; and a robot body for driving the hand, and the hand preheats the substrate in a state before the process is performed by a contact heating method using the heater.

[0007] Moreover, in an embodiment, when the substrate is placed on the hand, the heater is turned on.

[0008] Moreover, in an embodiment, when the substrate is not placed on the hand, the heater is turned off.

[0009] Also, in the embodiment, the above-mentioned transfer robot includes: a hand for supporting a substrate, provided with a heating lamp component for irradiating light on the substrate; and a robot body for driving the above-mentioned hand, and the above-mentioned hand uses the above-mentioned heating lamp component to pre-heat the substrate in the state before the process treatment by non-contact heating.

[0010] Also, in the embodiment, if the substrate is placed on the above-mentioned hand, the above-mentioned heating lamp component will be turned on.

[0011] Also, in the embodiment, when the substrate is not placed on the above-mentioned hand, the above-mentioned heating lamp component will be turned off.

[0012] Also, in the embodiment, the above-mentioned transfer robot includes: a hand for supporting a substrate, provided with a heater inside and a heating lamp component on the upper part; and a robot body for driving the above-mentioned hand. If the substrate in the state before the process treatment is placed on the above-mentioned hand, after turning on the above-mentioned heating lamp component, turn on the above-mentioned heater to pre-heat the substrate in the state before the process treatment in sequence.

[0013] The substrate processing apparatus according to an embodiment of the present invention includes: an indexing chamber provided with a transfer robot for loading and unloading substrates; a process chamber provided with a heating unit for heating the substrate and performing process treatment on the substrate; a load lock chamber disposed between the above-mentioned indexing chamber and the above-mentioned process chamber; and a transfer chamber formed between the above-mentioned process chamber and the above-mentioned load lock chamber, provided with a transfer robot for transferring the substrate, and a pre-heating unit for pre-heating the substrate in the state before the process treatment is provided in the above-mentioned load lock chamber.

[0014] Also, in the embodiment, the above-mentioned load lock chamber includes: a housing isolated from the outside; and a support unit provided inside the above-mentioned housing for supporting the substrate, and a support unit heater for pre-heating the substrate in the state before the process treatment by contact heating is provided inside the above-mentioned support unit.

[0015] Also, in the embodiment, if the substrate is placed on the above-mentioned support unit, the above-mentioned support unit heater will be turned on.

[0016] Also, in the embodiment, when the substrate is not placed on the above-mentioned support unit, the above-mentioned support unit heater will be turned off.

[0017] Also, in the embodiment, the above-mentioned load lock chamber includes: a housing isolated from the outside; and a support unit provided inside the above-mentioned housing for supporting the substrate, and an outer housing heater for pre-heating the substrate in the state before the process treatment by non-contact heating is provided in at least one of the inner side wall and the inner upper wall of the above-mentioned housing.

[0018] Moreover, in the embodiment, if the substrate is placed on the above-mentioned support unit, the above-mentioned outer cover heater will be turned on.

[0019] Moreover, in the embodiment, when the substrate is not placed on the above-mentioned support unit, the above-mentioned outer cover heater will be turned off.

[0020] Moreover, in the embodiment, the above-mentioned load lock chamber includes: an outer cover isolated from the outside; and a support unit disposed inside the above-mentioned outer cover to support the substrate. An outer cover heater for preheating the substrate in the state before the process treatment by non-contact heating is provided in at least one of the inner side wall and the inner upper wall of the above-mentioned outer cover. A support unit heater for preheating the substrate in the state before the process treatment by contact heating is provided inside the above-mentioned support unit. If the substrate in the state before the process treatment is placed, after the above-mentioned load lock chamber turns on the above-mentioned outer cover heater, the above-mentioned support unit heater is turned on to preheat the above-mentioned substrate in the state before the process treatment in sequence.

[0021] A substrate processing apparatus according to another embodiment of the present invention includes: an indexing chamber provided with a transfer robot for loading and unloading substrates; a process chamber provided with a heating unit for heating the substrate and performing a process on the substrate; a load lock chamber disposed between the above-mentioned indexing chamber and the above-mentioned process chamber; and a transfer chamber formed between the above-mentioned process chamber and the above-mentioned load lock chamber and provided with a transfer robot for transferring the substrate. A preheating unit for preheating the substrate in the state before the process treatment is provided in the above-mentioned load lock chamber and the above-mentioned transfer robot.

[0022] Moreover, in the embodiment, the above-mentioned load lock chamber includes: an outer cover forming an internal space in a vacuum state; and a support unit disposed inside the above-mentioned outer cover to support the substrate. An outer cover heater for preheating the substrate in the state before the process treatment by non-contact heating is provided in at least one of the inner side wall and the inner upper wall of the above-mentioned outer cover. A support unit heater for preheating the substrate in the state before the process treatment by contact heating is provided inside the above-mentioned support unit.

[0023] Moreover, in the embodiment, the above-mentioned transfer robot includes: a hand including a heater of a contact heating method capable of generating heat and a heating lamp of a non-contact heating method. The heater of the contact heating method capable of generating heat is disposed inside, and the heating lamp of the non-contact heating method is disposed on the upper part. The hand supports the substrate; and a robot body for driving the above-mentioned hand.

[0024] Moreover, in the embodiment, if the substrate is placed on the above-mentioned hand, the above-mentioned heater will be turned on, and when the substrate is not placed on the above-mentioned hand, the above-mentioned heater will be turned off.

[0025] According to the present invention, the present invention has the following effects, that is, the contact heating unit or the non-contact heating unit provided in at least one of the load lock chamber and the transfer robot can pre-heat the substrate in the state before the process treatment, so that the time required for the process chamber to heat the substrate to the target temperature can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a top view of a substrate processing apparatus for explaining an embodiment of the present invention.

[0027] Figures 2a to 2c For explaining the setting in Figure 1 It is a perspective view showing various examples of the pre-heating unit of the transfer robot shown.

[0028] Figures 3a to 3c For explaining the setting in Figure 1 It is a cross-sectional view showing various examples of the pre-heating unit of the load lock chamber shown. DETAILED DESCRIPTION OF THE INVENTION

[0029] Embodiments of the present invention can be deformed into various forms, and the scope of the present invention is not limited to the embodiments described below. These embodiments are provided to more completely explain the present invention to those of ordinary skill in the technical field to which the present invention belongs. Therefore, the shapes of the structural elements in the drawings are enlarged for more clear explanation.

[0030] In an embodiment of the present invention, a substrate processing apparatus for etching a substrate using plasma is described. However, the present invention is not limited thereto and can be applied to various apparatuses.

[0031] Figure 1 It is a top view of a substrate processing apparatus for explaining an embodiment of the present invention.

[0032] Referring to Figure 1 , the substrate processing apparatus 10 includes an indexing chamber 100, a load lock chamber 200, a transfer chamber 300, and a process chamber 400.

[0033] The indexing chamber 100 includes a loading port 110 and a transfer chamber 120.

[0034] A plurality of loading ports 110 may be formed. A substrate storage container such as a front opening unified pod (FOUP) for accommodating a plurality of substrates is placed in the loading port 110. The substrate storage container is loaded into or unloaded from the loading port 110 by an automated transfer device such as an overhead hoist transfer (OHT) or by a worker.

[0035] The transfer chamber 120 includes a transfer chamber outer cover 121 and a transfer robot 122.

[0036] The transfer chamber outer cover 121 provides an internal space separated from the outside. The transfer robot 122 loads and unloads substrates in the substrate storage container placed at the loading port 110.

[0037] The load lock chamber 200 is disposed between the indexing chamber 100 and the transfer chamber 300. The load lock chamber 200 provides a buffer space for exchanging substrates between the indexing chamber 100 and the transfer chamber 300. Substrates can stay temporarily in the buffer space. Multiple load lock chambers 200 can be formed. The load lock chamber 200 includes a load lock chamber outer cover 210 isolated from the outside and a support unit 220 for supporting substrates.

[0038] The load lock chamber 200 may include a preheating unit for preheating substrates in a state before process treatment. Details of the preheating unit will be described later.

[0039] The transfer chamber 300 transfers substrates between the load lock chamber 200 and the process chamber 400. The transfer chamber 300 can have various shapes. The transfer chamber 300 includes a transfer chamber outer cover 310 isolated from the outside and a transfer robot 320 for transferring substrates.

[0040] The transfer robot 320 transfers substrates between the process chamber 400 and the load lock chamber 200. The transfer robot 320 includes: a hand 321 for supporting substrates; and a robot body 322 for driving the hand 321. The transfer robot 320 may include a preheating unit for preheating substrates in a state before process treatment. Details of the preheating unit will be described later.

[0041] The process chamber 400 is disposed around the transfer chamber 300. When an opening (not shown) is opened, the process chamber 400 receives substrates from the transfer robot 320 in the transfer chamber 300.

[0042] The process chamber 400 includes a heating unit for heating substrates and performs process treatment on the substrates. The treatment process can be an etching process. The process chamber 400 may include a chamber outer cover (not shown), a support member 410, a gas supply member (not shown), and a plasma generation unit (not shown). The support member 410 includes an electrostatic chuck (ESC). The electrostatic chuck (ESC) is a heating unit for heating substrates and includes an electrostatic chuck heater inside. The electrostatic chuck heater heats the substrates to a target temperature suitable for performing the process.

[0043] On the other hand, when heating the substrate, the time required to heat the substrate to the target temperature occupies a relatively large part of the overall working time. In this regard, in the present invention, a preheating unit provided in at least one of the transfer robot 320 and the load lock chamber 200 is used to preheat the substrate in the state before the process treatment. Therefore, in the process chamber, the overall process time can be reduced by reducing the time required to heat the substrate to the target temperature.

[0044] The process can be various substrate processing processes, rather than an etching process. As an example, the process can be a stripping process, an ashing process, a demolding process, or a vapor deposition process. One or more process chambers 400 can be formed.

[0045] When there are multiple process chambers 400, a part or all of the process chambers 400 can perform the same or different processes. The internal pressure of the process chamber 400 is maintained at a preset pressure to provide an environment suitable for performing the process. For example, a pressure lower than atmospheric pressure or a vacuum state can be maintained. After the process is completed, the substrate is carried out of the process chamber 400 by the transfer robot 320.

[0046] Hereinafter, the preheating unit provided in at least one of the transfer robot 320 and the load lock chamber 200 will be described in detail.

[0047] Figures 2a to 2c For explaining Figure 1 The perspective view of various examples of the preheating unit of the transfer robot shown.

[0048] The transfer robot 320 includes: a hand 321 for supporting the substrate; and a robot body 322 for driving the hand 321 to transfer the substrate. A contact or non-contact preheating unit for preheating the substrate in the state before the process treatment can be provided on the hand 321 of the transfer robot 320.

[0049] Referring to Figure 2a , a heater 323 as a heating unit for preheating the substrate in the state before the process treatment by a contact heating method can be provided inside the hand 321. In this case, in order to increase the contact area with the substrate, the shapes of the hand 321 and the heater 323 can correspond to the shape of the substrate.

[0050] When the substrate in the state before the process treatment is placed on the hand 321, the heater 323 will turn on and generate heat. Through the heater 323 that generates heat, the substrate placed on the hand 321 will be heated.

[0051] On the other hand, when the substrate placed on the hand 321 is a substrate that has completed the process or when no substrate is placed on the hand 321, the heater 323 can be turned off to reduce power consumption. Alternatively, differently, the heater 323 can be kept on all the time.

[0052] As described above, when the heater 323 is provided inside the hand 321, the substrate can be rapidly heated by the contact heating method.

[0053] Refer to Figure 2b , a heating lamp component 324 can be provided above the hand 321. The heating lamp component 324 irradiates light onto the substrate to preheat the substrate by the non-contact heating method.

[0054] If a substrate in the state before the process is placed on the hand 321, the heating lamp component 324 will be turned on. The turned-on heating lamp component 324 irradiates light onto the substrate to heat the substrate.

[0055] Compared with the contact heating method using the heater 323, the non-contact heating method using the heating lamp component 324 has a slow heating speed, but it can prevent the substrate from being damaged.

[0056] On the other hand, when the substrate placed on the hand 321 is a substrate that has completed the process or when the substrate is not supported by the hand 321, the heating lamp component 324 can be turned off to reduce power consumption. Alternatively, differently, during the substrate processing step, the heating lamp component 324 can be kept on.

[0057] Refer to Figure 2c , the heater 323 and Figure 2a the heating lamp component 324 of Figure 2b can be provided in the hand 321 at the same time. In this case, the heating lamp component 324 of the non-contact heating method and the heater 323 of the contact heating method can be turned on simultaneously or sequentially.

[0058] Preferably, when the heating lamp component 324 and the heater 323 are turned on sequentially, the heating lamp component 324 of the non-contact heating method is turned on first, and then the heater 323 of the contact heating method is turned on. That is, if a substrate in the state before the process is placed on the hand 321, the heating lamp component 324 is turned on first, and then the heater 323 is turned on to heat the substrate in the state before the process sequentially. As the heating lamp component 324 is turned on first, the temperature of the substrate rises slowly, and the risk of damage due to the thermal pressure of the substrate will be reduced. Moreover, after a predetermined time has elapsed from the time when the heating lamp component 324 is turned on, the heater 323 will be turned on. The heating speed of the substrate is increased by the turned-on heater 323 and heating lamp component 324.

[0059] According to the present invention, the substrate in the state before the process is pre-heated by a contact type or non-contact type pre-heating unit provided on the hand of the transfer robot, so that the process time in the process chamber is reduced and the production volume is increased.

[0060] Figures 3a to 3c For explaining Figure 1 A cross-sectional view showing various examples of the pre-heating unit provided in the load lock chamber shown.

[0061] The load lock chamber 200 includes a load lock chamber outer cover 210 isolated from the outside and a support unit 220 for supporting the substrate. A contact type or non-contact type pre-heating unit can be provided in the load lock chamber 200.

[0062] Referring to Figure 3a , a support unit heater 221 as a heating unit for pre-heating the substrate in the state before the process by a contact heating method can be provided inside the support unit 220. For example, the support unit 220 can be a heating plate including the support unit heater 221.

[0063] If the substrate in the state before the process is placed on the support unit 220, the support unit heater 221 will be turned on and generate heat, whereby the substrate placed on the support unit 220 is heated by contact.

[0064] On the other hand, when the substrate placed on the support unit 220 is a substrate that has completed the process or no substrate is placed on the support unit 220, the support unit heater 221 can be turned off to reduce power consumption. Or, differently, the support unit heater 221 can be kept turned on all the time.

[0065] As described above, when the support unit heater 221 is provided inside the support unit 220, the substrate can be rapidly heated by the contact heating method.

[0066] Referring to Figure 3b , an outer cover heater 211 as a heating unit for pre-heating the substrate in the state before the process by a non-contact heating method can be provided in at least one of the inner side wall and the inner upper wall of the load lock chamber outer cover 210.

[0067] If the substrate in the state before the process is placed on the support unit 220, the outer cover heater 211 will be turned on. By the turned-on outer cover heater 211, the inside of the load lock chamber 200 is heated, and the substrate located inside the heated load lock chamber 200 is also heated. Compared with the contact heating method using the support unit heater 221, the heating speed of the non-contact heating method using the outer cover heater 211 is slow, but it can prevent the substrate from being damaged.

[0068] On the other hand, when the substrate placed on the support unit 220 is a substrate that has completed the process treatment or when no substrate is placed on the support unit 220, the outer cover heater 211 can be turned off to reduce power consumption. Or, differently, the outer cover heater 211 can be kept in the on state all the time.

[0069] Referring to Figure 3c , a support unit heater 221 of Figure 3a and an outer cover heater 211 of Figure 3b can be provided inside the load lock chamber 200 at the same time. In this case, the non-contact heating type outer cover heater 211 and the contact heating type support unit heater 221 can be turned on simultaneously or sequentially.

[0070] Preferably, when the outer cover heater 211 and the support unit heater 221 are turned on sequentially, the non-contact heating type outer cover heater 211 is turned on first, and then the contact heating type support unit heater 221 is turned on.

[0071] If a substrate in the state before the process treatment is placed, after the load lock chamber turns on the outer cover heater 211 first, the support unit heater 221 is turned on to preheat the substrate in the state before the process treatment sequentially. Thus, as the outer cover heater 211 is heated first, the substrate rises slowly, thereby reducing the risk of breakage due to the thermal stress of the substrate. Moreover, after a predetermined time has elapsed from the time point when the outer cover heater 211 is turned on, the support unit heater 221 is turned on, thereby increasing the heating speed of the substrate through the support unit heater 221 and the outer cover heater 211.

[0072] According to the present invention, through the contact type or non-contact type preheating unit provided in the load lock chamber, the substrate in the state before the process treatment is preheated, thereby reducing the process time in the process chamber and increasing the production volume.

[0073] As Figures 2a to 3c shown, the preheating unit can be provided only in the load lock chamber 200, or can be provided only in the transfer robot 320. Or, differently, preheating units are provided in both the load lock chamber 200 and the transfer robot 320. In particular, as Figure 2c and Figure 3cAs shown, a preheating unit for preheating a substrate in a state before process treatment can be provided in both the load lock chamber 200 of the present invention and the transfer robot 320 described above. Compared with the case where the preheating unit is provided in only one of the load lock chamber 200 and the transfer robot 320 described above, the degree of preheating of the substrate can be increased when contact-type preheating units and non-contact-type preheating units are provided in both the load lock chamber 200 and the transfer robot 320 described above.

[0074] The foregoing relates to preferred embodiments of the present invention, and other and additional embodiments of the present invention can be created without exceeding the basic scope. The scope of the present invention is determined by the following claims.

Claims

1. A substrate processing apparatus, characterized in that, comprising: an indexing chamber provided with a transfer robot for loading and unloading substrates; a process chamber provided with a heating unit for heating the substrate and performing a process on the substrate; a load lock chamber disposed between the indexing chamber and the process chamber; and a transfer chamber formed between the process chamber and the load lock chamber and provided with a transfer robot for transferring substrates, wherein the transfer robot includes: a hand for supporting the substrate; and a robot body for driving the hand, wherein the hand includes: a heater disposed inside the hand, the heater heating the hand in contact with the substrate and preheating the substrate in a state before the process by contact heating; and a heating lamp component disposed above the hand, the heating lamp component irradiating light on the substrate and preheating the substrate in a state before the process by non-contact heating, if the substrate in a state before the process is placed on the hand, after the heating lamp component is turned on, the heater is turned on to preheat the substrate in a state before the process in sequence.

2. The substrate processing apparatus according to claim 1, characterized in that, if the substrate is placed on the hand, the heater will be turned on.

3. The substrate processing apparatus according to claim 1, characterized in that, when the substrate is not placed on the hand, the heater will be turned off.

4. The substrate processing apparatus according to claim 1, characterized in that, if the substrate is placed on the hand, the heating lamp component will be turned on.

5. The substrate processing apparatus according to claim 1, characterized in that, when the substrate is not placed on the hand, the heating lamp component will be turned off.

6. A substrate processing apparatus, characterized in that, comprising: an indexing chamber provided with a transfer robot for loading and unloading substrates; a process chamber provided with a heating unit for heating the substrate and performing a process on the substrate; a load lock chamber disposed between the indexing chamber and the process chamber; and a transfer chamber formed between the process chamber and the load lock chamber and provided with a transfer robot for transferring substrates, wherein the load lock chamber includes: a housing isolated from the outside; and a support unit disposed inside the housing for supporting the substrate, an outer housing heater for preheating the substrate in a state before the process by non-contact heating is provided in at least one of the inner side wall and the upper wall of the outer housing, a support unit heater for preheating the substrate in a state before the process by contact heating is provided inside the support unit, if the substrate in a state before the process is placed, after the outer housing heater of the load lock chamber is turned on, the support unit heater is turned on to preheat the substrate in a state before the process in sequence.

7. The substrate processing apparatus according to claim 6, characterized in that, if the substrate is placed on the support unit, the support unit heater will be turned on.

8. The substrate processing apparatus according to claim 6, characterized in that, When the substrate is not placed on the above-mentioned support unit, the above-mentioned support unit heater will be turned off.

9. The substrate processing apparatus according to claim 6, wherein, if the substrate is placed on the above-mentioned support unit, the above-mentioned outer cover heater will be turned on.

10. The substrate processing apparatus according to claim 6, wherein, when the substrate is not placed on the above-mentioned support unit, the above-mentioned outer cover heater will be turned off.

11. A substrate processing apparatus, characterized in that, comprising: an indexing chamber provided with a transfer robot for loading and unloading substrates; a process chamber provided with a heating unit for heating the substrate and performing a process on the substrate; a load lock chamber disposed between the above-mentioned indexing chamber and the above-mentioned process chamber; and a transfer chamber formed between the above-mentioned process chamber and the above-mentioned load lock chamber and provided with a transfer robot for transferring the substrate, wherein the above-mentioned load lock chamber includes: an outer cover that forms an internal space in a vacuum state; and a support unit disposed inside the above-mentioned outer cover for supporting the substrate, an outer cover heater for pre-heating the substrate in a state before the process is performed by non-contact heating is provided in at least one of the inner sidewall and the inner upper wall of the above-mentioned outer cover, a support unit heater for pre-heating the substrate in a state before the process is performed by contact heating is provided inside the above-mentioned support unit, if a substrate in a state before the process is placed, after the above-mentioned load lock chamber turns on the above-mentioned outer cover heater, the above-mentioned support unit heater is turned on to sequentially pre-heat the substrate in the state before the process.

12. The substrate processing apparatus according to claim 11, wherein, the above-mentioned transfer robot includes: a hand including a heater of a contact heating method capable of generating heat and a heating lamp of a non-contact heating method, the heater of the contact heating method capable of generating heat is provided inside, the heating lamp of the non-contact heating method is provided on the upper part, and the hand supports the substrate; and a robot body for driving the above-mentioned hand.

13. The substrate processing apparatus according to claim 12, wherein, if the substrate is placed on the above-mentioned hand, the above-mentioned heater will be turned on, and when the substrate is not placed on the above-mentioned hand, the above-mentioned heater will be turned off.

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