An optoelectronic device, a circuit module and a lighted switch

Abstract

The present invention discloses an optoelectronic device, a circuit module and a lighted switch, comprising: a base; an optoelectronic chip disposed on the base; and conductive pins. The base is provided with a guiding channel, and the conductive pins are inserted through the guiding channel and connected to the optoelectronic chip. Since the portion of the conductive pins located in the guiding channel is restricted by the guiding channel and can only move along the length direction of the guiding channel, when the conductive pins are bent by an external force, the acting force mainly acts on the wall surface of the base forming the guiding channel, and the optoelectronic chip is hardly affected by the acting force. In this way, when the conductive pins are bent by force, the effect of reducing damage to the optoelectronic chip is achieved, which is beneficial to improving reliability.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic devices, and particularly to an optoelectronic device, a circuit module, and a backlit switch with such a device. Background Art

[0002] With the development of optoelectronic technology, optoelectronic devices such as LED chips and photosensitive chips have been widely used in different fields to meet various usage requirements. Among them, as a new generation of lighting device, the LED chip has the advantages of energy saving, high luminous efficiency, and long service life. In order to adapt to different usage requirements, the sizes, packages, and soldering methods of LEDs are diverse.

[0003] For optoelectronic devices with pins, the optoelectronic chip is easily damaged when the pins are bent. For example, when an LED lamp bead is soldered and installed, the pins of the LED lamp bead generally need to be bent for easy fixing. When applied to devices with a small volume such as a backlit switch, due to the small volume of the LED lamp bead, the force of bending the pins is transmitted to the LED lamp bead, easily causing damage inside the LED lamp bead, resulting in a low yield rate and insufficient reliability. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an optoelectronic device that can reduce the impact on the optoelectronic chip when the conductive pins are bent and reduce the probability of damage to the optoelectronic chip.

[0005] The present invention also provides a circuit module that can reduce the probability of damage to the optoelectronic chip when the conductive pins are bent to connect to the conductive layer on the circuit board.

[0006] The present invention also provides a backlit switch that can reduce the probability of damage to the optoelectronic chip caused by bending of the conductive pins when the base is set on the switch base.

[0007] An optoelectronic device according to an embodiment of the first aspect of the present invention includes: a base; an optoelectronic chip disposed on the base; and conductive pins. The base is provided with a guiding channel, and the conductive pins are inserted through the guiding channel and connected to the optoelectronic chip.

[0008] An optoelectronic device according to an embodiment of the present invention has at least the following beneficial effects: A guiding channel is provided on the base, and the conductive pins pass through the guiding channel and are connected to the optoelectronic chip. Since the part of the conductive pins located in the guiding channel is restricted by the guiding channel and can only move along the length direction of the guiding channel, when the conductive pins are bent by an external force, the acting force mainly acts on the wall surface of the base forming the guiding channel, and the optoelectronic chip is hardly affected by the acting force. In this way, when the conductive pins are bent under force, the effect of reducing damage to the optoelectronic chip is achieved, which is beneficial to improving reliability.

[0009] According to some embodiments of the present invention, the optoelectronic chip is located at one end of the guiding channel, a receiving groove is provided on the base, the receiving groove extends to the other end of the guiding channel, and the bent conductive pins can pass through the receiving groove.

[0010] According to some embodiments of the present invention, a protective convex ring surrounding the optoelectronic chip is provided on the base.

[0011] According to some embodiments of the present invention, the optoelectronic chip is provided with a positive electrode pad and a negative electrode pad. There are two guiding channels. Part or all of the projection of the positive electrode pad is located in one of the guiding channels and part or all of the projection of the negative electrode pad is located in the other guiding channel.

[0012] According to some embodiments of the present invention, a first groove and a second groove are provided on the base. The first groove is located below the positive electrode pad, the second groove is located below the negative electrode pad. The first groove communicates with one of the guiding channels, and the second groove communicates with the other guiding channel.

[0013] According to some embodiments of the present invention, the optoelectronic chip is a flip-chip LED chip.

[0014] According to the circuit module of the second aspect embodiment of the present invention, it includes the above-mentioned optoelectronic device, and further includes a circuit board. Through holes and a conductive layer are provided on the circuit board. The base passes through the through holes, and the conductive pins are connected to the conductive layer.

[0015] The circuit module according to the embodiment of the present invention has at least the following beneficial effects: By providing through holes on the circuit board and the base passing through the through holes, the light generated by the optoelectronic chip can be emitted from the other side of the circuit board. In this structure, the conductive pins need to be bent to be connected to the conductive layer. By providing a guiding channel on the base, when the conductive pins are bent, the acting force mainly acts on the wall surface of the guiding channel formed on the base, and the optoelectronic chip is hardly affected by the acting force, reducing the probability of damage to the optoelectronic chip caused by the acting force when the conductive pins are bent, which is beneficial to improving the reliability.

[0016] According to some embodiments of the present invention, a positioning portion is provided on the base, and the positioning portion can abut against the circuit board to limit the base from passing through the through hole.

[0017] According to the lamp switch of the third aspect embodiment of the present invention, it includes the above-mentioned optoelectronic device, and further includes a switch base. The base is provided on the switch base.

[0018] The illuminated switch according to an embodiment of the present invention has at least the following beneficial effects: When the base is arranged on the switch base, the conductive pins need to be bent. By providing a guiding channel on the base, when the conductive pins are bent by an external force, the bending force is mainly borne by the wall surface of the guiding channel, reducing the influence of the bending force on the optoelectronic chip, which is beneficial to reducing the probability of LED damage and improving reliability.

[0019] According to some embodiments of the present invention, the switch base is provided with positioning holes allowing the conductive pins to pass through.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 is a perspective view of one embodiment of the LED lamp bead of the present invention;

[0023] Figure 2 is an exploded cross-sectional view of one embodiment of the LED lamp bead of the present invention;

[0024] Figure 3 is a cross-sectional view of one embodiment of the circuit module of the present invention;

[0025] Figure 4 is a cross-sectional view of one embodiment of the illuminated switch of the present invention;

[0026] Figure 5 is a perspective view of another embodiment of the LED lamp bead of the present invention;

[0027] Figure 6 is an exploded perspective view of another embodiment of the LED lamp bead of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0029] In the description of the present invention, it should be understood that with respect to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0030] In the description of the present invention, if the first and second are described only for the purpose of distinguishing technical features, it should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0032] As Figure 1 、 Figure 2 、 Figure 5 and Figure 6 As shown in

[0033] a photoelectronic device according to an embodiment of the present invention includes: a base 100; a photoelectronic chip 200 disposed on the base 100; and conductive pins 300. The base 100 is provided with a guiding channel 110, and the conductive pins 300 are inserted into the guiding channel 110, and the conductive pins 300 are connected to the photoelectronic chip 200.

[0034] Since the guiding channel 110 is provided on the base 100 and the conductive pins 300 pass through the guiding channel 110 and are connected to the photoelectronic chip 200, the part of the conductive pins 300 located in the guiding channel 110 is restricted by the guiding channel 110 and can only move along the length direction of the guiding channel 110. Therefore, when the conductive pins 300 are bent by an external force, the acting force mainly acts on the wall surface of the guiding channel 110 formed on the base 100, and the photoelectronic chip 200 is hardly affected by the acting force. Thus, when the conductive pins 300 are bent by force, the effect of reducing the damage of the photoelectronic chip 200 is achieved, which is beneficial to improving the reliability.

[0035] The conductive pins 300 can be bent at any angle according to the usage requirements to meet the usage requirements, and the guiding channel 110 can reduce the influence of the bending acting force on the photoelectronic chip 200.

[0036] Referring to Figure 1 、 Figure 2, Figure 5 and Figure 6 As shown in Figure 5 and Figure 6 , in some embodiments of the present invention, the optoelectronic chip 200 is located at one end of the guiding channel 110. A receiving groove 120 is provided on the base 100, and the receiving groove 120 extends to the other end of the guiding channel 110. The bent conductive pins 300 can pass through the receiving groove 120.

[0037] By providing the receiving groove 120 on the base 100, the bent conductive pins 300 can be received in the receiving groove 120, preventing the conductive pins 300 from protruding and causing instability when the base 100 is placed on a plane. This is beneficial for making the placement plane of the base 100 flatter. At the same time, the receiving groove 120 also has a guiding effect, that is, making the bending direction of the conductive pins 300 more stable and preventing deviation during bending.

[0038] Referring to Figure 1 、 Figure 2 、 Figure 5 and Figure 6 As shown in Figure 1 , Figure 2 , Figure 5 and Figure 6 , in some embodiments of the present invention, a protective convex ring 130 surrounding the optoelectronic chip 200 is provided on the base 100.

[0039] By providing the protective convex ring 130, the optoelectronic chip 200 can be protected, reducing the possibility of collision and extrusion with external objects. This is beneficial for preventing the optoelectronic chip 200 from being damaged due to collision and extrusion and improving reliability.

[0040] The protective convex ring 130 can be designed into shapes such as circular, triangular or rectangular according to actual usage requirements.

[0041] Referring to Figure 1 、 Figure 2 、 Figure 5 and Figure 6 As shown in Figure 1 , Figure 2 , Figure 5 and Figure 6 , in some embodiments of the present invention, the optoelectronic chip 200 is provided with a positive electrode pad 210 and a negative electrode pad 220. There are two guiding channels 110. Part or all of the projection of the positive electrode pad 210 is located in one of the guiding channels 110 and part or all of the projection of the negative electrode pad 220 is located in the other guiding channel 110.

[0042] The projections of the positive electrode pad 210 and the negative electrode pad 220 are respectively located in the two guiding channels 110, so that the conductive pins 300 can be welded to the optoelectronic chip 200 after passing through the guiding channels 110, making the assembly and welding operation more convenient.

[0043] Referring to Figure 1 、 Figure 2 、 Figure 5 and Figure 6As shown, in some embodiments of the present invention, a first groove 140 and a second groove 150 are provided on the base 100. The first groove 140 is located below the positive electrode pad 210, and the second groove 150 is located below the negative electrode pad 220. The first groove 140 communicates with one of the guiding channels 110, and the second groove 150 communicates with the other guiding channel 110.

[0044] By respectively providing the first groove 140 and the second groove 150 below the positive electrode pad 210 and the negative electrode pad 220, when the conductive pins 300 are welded to the positive electrode pad 210 and the negative electrode pad 220, the solder can flow into the grooves, increasing the welding area, which is beneficial to making the welding of the conductive pins 300 to the positive electrode pad 210 and the negative electrode pad 220 more stable.

[0045] In some embodiments of the present invention, the optoelectronic chip 200 is a flip-chip LED chip.

[0046] The flip-chip LED chip has the advantages of small size, good heat dissipation performance, and long service life. Moreover, the positive electrode pad 210 and the negative electrode pad 220 of the flip-chip LED chip are on the same side, which is convenient for welding operations.

[0047] Multiple flip-chip LED chips can be provided on the base 100. The number of conductive pins 300, the number of guiding channels 110, and the number of flip-chip LED chips match. The emitting colors between the flip-chip LED chips can be different to achieve multi-color lighting such as two-color and three-color lighting, meeting the requirements of different lighting effects. The flip-chip LED chips can be arranged at positions on the base 100 according to actual usage requirements so as to emit light in different directions.

[0048] The optoelectronic chip 200 can also be an optoelectronic object such as an infrared chip, an ultraviolet chip, a photosensitive chip, etc.

[0049] Refer to Figure 3 , according to the circuit module of the second aspect embodiment of the present invention, it includes the above-mentioned optoelectronic device, and further includes a circuit board 400. Through holes 410 and a conductive layer 420 are provided on the circuit board 400. The base 100 passes through the through holes 410, and the conductive pins 300 are connected to the conductive layer 420.

[0050] Under certain usage requirements, the conductive layer 420 on the circuit board 400 is located on one side of the circuit board 400, while the light emitting direction of the optoelectronic chip 200 needs to be emitted from the other side of the circuit board 400. For this, through holes 410 are provided on the circuit board 400, and the base 100 is inserted through the through holes 410, so that the light generated by the optoelectronic chip 200 can be emitted from the other side of the circuit board 400. This structure requires bending the conductive pins 300 to connect with the conductive layer 420. By providing a guiding channel 110 on the base 100, when the conductive pins 300 are bent, the acting force mainly acts on the wall surface of the guiding channel 110 formed by the base 100, and the optoelectronic chip 200 is hardly affected by the acting force, reducing the probability of damage to the optoelectronic chip 200 caused by the acting force when the conductive pins 300 are bent, which is beneficial to improving the reliability.

[0051] Referring to Figure 1 、 Figure 5 and Figure 6 shown, in some embodiments of the present invention, a positioning portion 160 is provided on the base 100, and the positioning portion 160 can abut against the circuit board 400 to limit the base 100 from passing through the through hole 410.

[0052] Referring to Figure 1 、 Figure 5 and Figure 6 shown, the base 100 includes a square section and a cylindrical section, and a positioning portion 160 is formed at the junction of the square section and the cylindrical section. In addition, the heights of the square section and the cylindrical section can be set according to actual usage requirements to make the height of the conductive pins 300 and the height of the optoelectronic chip 200 appropriate to meet the usage requirements.

[0053] By providing a positioning portion 160 on the base 100, when the positioning portion 160 abuts against the circuit board 400, it can prevent the base 100 from further passing through the through hole 410, achieving a positioning effect, which is beneficial to controlling the height of the base 100 protruding from the other side of the circuit board 400. And under the action of gravity, the base 100 can be stably placed on the circuit board 400, facilitating welding.

[0054] The positioning portion 160 can be an implementation such as a convex block or a stepped block provided on the base 100.

[0055] Refer to Figure 4 , according to the third aspect embodiment of the present invention, a lighted switch includes the above-mentioned optoelectronic device, and further includes a switch base 500, and the base 100 is provided on the switch base 500.

[0056] When the base 100 is disposed on the switch base 500, the conductive pins 300 need to be bent. By providing a guiding channel 110 on the base 100, when the conductive pins 300 are bent by an external force, the bending force is mainly borne by the wall surface of the guiding channel 110, reducing the influence of the bending force on the optoelectronic chip 200, which is beneficial to reducing the probability of LED damage and improving the reliability.

[0057] Referring to Figure 4 , in some embodiments of the present invention, the switch base 500 is provided with positioning holes 510 allowing the conductive pins 300 to pass through.

[0058] When the base 100 is disposed on the switch base 500, the conductive pins 300 are bent so that the conductive pins 300 pass through the positioning holes 510, thereby preventing the base 100 from shifting, achieving a positioning effect, which is beneficial to improving the structural stability.

[0059] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0060] Of course, the present invention is not limited to the above-described embodiments. Those skilled in the art can make equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. An optoelectronic device, characterized in that, Comprising: A base (100); At least one optoelectronic chip (200), disposed on the base (100); A conductive pin (300), the base (100) is provided with a guiding channel (110), the conductive pin (300) is inserted through the guiding channel (110), and the conductive pin (300) is connected to the optoelectronic chip (200); The optoelectronic chip (200) is located at one end of the guiding channel (110), a receiving groove (120) is provided on the base (100), the receiving groove (120) extends to the other end of the guiding channel (110), and the conductive pin (300) can be bent and inserted through the receiving groove (120); The optoelectronic chip (200) is provided with a positive electrode pad (210) and a negative electrode pad (220), there are two guiding channels (110), a projection part or all of the positive electrode pad (210) is located in one of the guiding channels (110) and a projection part or all of the negative electrode pad (220) is located in the other guiding channel (110); The base (100) is provided with a first groove (140) and a second groove (150), the first groove (140) is located below the positive electrode pad (210), the second groove (150) is located below the negative electrode pad (220), the first groove (140) communicates with one of the guiding channels (110), and the second groove (150) communicates with the other guiding channel (110); The end of the conductive pin (300) penetrates into the first groove (140) and the second groove (150), and there is a gap between the conductive pin (300) and the inner walls of the first groove (140) and the second groove (150).

2. The optoelectronic device according to claim 1, wherein: The base (100) is provided with a protective convex ring (130) surrounding the optoelectronic chip (200).

3. The optoelectronic device according to claim 1 or 2, characterized in that: The optoelectronic chip (200) is a flip-chip LED chip.

4. Circuit module, characterized in that: An optoelectronic device comprising the one according to any one of claims 1 to 3, further comprising a circuit board (400), the circuit board (400) is provided with a through hole (410) and a conductive layer (420), the base (100) is inserted through the through hole (410), and the conductive pin (300) is connected to the conductive layer (420).

5. The circuit module according to claim 4, wherein: The base (100) is provided with a positioning portion (160), and the positioning portion (160) can abut against the circuit board (400) to limit the base (100) from passing through the through hole (410).

6. A lamp switch, characterized in that: An optoelectronic device comprising the one according to claim 3, further comprising a switch base (500), and the base (100) is disposed on the switch base (500).

7. The illuminated switch according to claim 6, wherein: The switch base (500) is provided with a positioning hole (510) allowing the conductive pin (300) to pass through.

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