Transferring electronic components from a first carrier to a second carrier

By using inspection and conveying devices during the transfer of electronic components, high-precision alignment and positional accuracy are ensured, solving the problem of difficult transfer of opaque materials in the prior art and realizing efficient and low-complexity electronic component assembly.

CN112740388BActive Publication Date: 2026-05-22MUEHLBAUEHR AG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
MUEHLBAUEHR AG
Filing Date
2019-08-23
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Existing technologies for transferring electronic components from a first carrier to a second carrier have problems such as high precision requirements, susceptibility to damage, and difficulty in handling opaque materials, especially in the transfer of monolithic electronic components.

Method used

An apparatus and method are employed in which a first container receives a first carrier, a second container guides a second carrier longitudinally, a separation device transfers components to the second carrier, and an inspection device and a conveying device are combined to ensure high-precision alignment and positional accuracy. This method is suitable for multi-row rolls of foil material as the second carrier.

Benefits of technology

This technology enables high-precision transfer of electronic components on opaque materials, increasing throughput and reducing system complexity. It avoids the dependence on transparency in traditional methods, improving the quality and efficiency of component assembly.

✦ Generated by Eureka AI based on patent content.

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Abstract

In an apparatus for transferring elements from a first carrier to a second carrier, the first carrier carries a plurality of individual elements. The second carrier is quasi-continuous and carries a plurality of subassemblies to which one of the plurality of elements is to be individually transferred from the first carrier. The apparatus has a first receptacle for the first carrier. The first receptacle receives the first carrier such that the elements carried by the first carrier are oriented towards the second receptacle. A separating device separates the elements from the first carrier for transfer to the second carrier. A first conveyor moves the first receptacle transversely to the conveying direction of the second carrier relative to the second receptacle. A second conveyor moves the separating device transversely to the conveying direction of the second carrier relative to the second receptacle. A first checking device detects the position of one of the plurality of elements relative to a storage position on the second receptacle guiding the second carrier. A second checking device is arranged upstream of the storage position and detects the position of one of the plurality of subassemblies on the second carrier relative to the second receptacle and sends the position of the subassembly to a controller. Based on the information sent from the controller, a third conveying device conveys the second carrier to the storage position such that the subassembly on the second carrier reaches the storage position on the second receptacle guiding the second carrier.
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Description

Technical Field

[0001] This document describes an apparatus and method for transferring electronic components from a first carrier to a second carrier, and an apparatus and method for applying an adhesive to the second carrier. Specifically, an apparatus and method are described for separating an electronic component from the first carrier and directly transferring the electronic component to the second carrier after the adhesive has been applied to the second carrier. Background Technology

[0002] When transferring electronic components, especially chips (or "dies"), particularly monolithic electronic components, a common problem is that these components are easily damaged and must be handled with extreme care. Furthermore, the continuous miniaturization of electronic components necessitates ever-increasing precision requirements during their transfer.

[0003] WO2017 / 076989A1 relates to a processing system and method for handling flexible carriers, such as roll foil, using a tensioning device and an indexer. The tensioning device has a vacuum plate movable along the conveying direction of the flexible carrier, and the indexer intermittently moves the flexible carrier for processing. The vacuum plate is configured to move along the conveying direction. The indexer is configured to intermittently move the flexible carrier for processing. A controller is configured to control the tensioning device and the indexer such that the relative speed between the indexer and the vacuum plate of the tensioning device is maintained above a predetermined threshold under all operating conditions, even when the flexible carrier is stopped. The roll foil that can be used in this processing system has multiple electrical structures spaced apart from each other. These electrical structures can be any type of flexible electronics.

[0004] DE102011104225B4 relates to an apparatus for positioning an electronic component to be transferred relative to an ejection device, wherein the ejection device has a slider for at least one electronic component and a housing surrounding the slider, the housing having a first light-transmitting area. A first carrier provides the electronic component to be transferred. The first carrier has a first side facing the ejection device and a second side facing away from the ejection device. A plurality of electronic components are disposed on the second side. An image data acquisition device is designed to acquire image data of an area through the first light-transmitting area of ​​the housing, in which the slider is designed to interact with at least one electronic component. A controller is designed to determine position data of the electronic component to be transferred based on the acquired image data and generate control commands based on the position data. At least one actuator is designed to move the first carrier and the ejection device relative to each other based on the control commands to change the offset between the longitudinal axis of the slider and the central axis of the electronic component to be transferred, wherein the ejection device includes a first mirror disposed inside the housing.

[0005] DE10349847B3 relates to a positioning device and method for transferring electronic components. Here, a semiconductor wafer disposed on a carrier film is positioned above and parallel to a roll-shaped carrier. The wafer can be moved within a wafer plane by means of a wafer container and can also be rotated about a rotation axis perpendicular to the wafer plane. An ejection device includes an ejector pin that acts downwards on the rear side of the chip to be separated and separates the chip from the carrier film. The chip separated from the carrier film is then placed at an adhesive position on the roll-shaped carrier.

[0006] JP2003-109979A relates to an apparatus having at least two sliders for separating elements from a first carrier. Here, these elements are each drawn up by a pipette of a transfer element. In a final step, the transfer element, having the pipette and the element, is positioned above a second carrier, which has been prepared with adhesive, and the element is placed on the second carrier. In this case, the element is not transferred directly from the first carrier to the second carrier, but is received after being separated from the first carrier by means of the transfer element, and is then precisely oriented and attached to the second carrier by the transfer element in a subsequent step.

[0007] Other apparatuses and methods for transferring electronic components that form the technical background of the apparatus and methods described herein are described in the following documents: JP 5267451 A, EP 0 565 781 B1 and DE198 22 512 A1, US 4,667,402 B1, US 2008 / 0086874 A1, EP 2 764 826 A1, US 2002 / 0019074 A1, US 2009 / 242124 A1, EP 0 140 126 A1, US 4,990,051 B1, US 2006 / 237142 A1, US 2007 / 293022 A1, US 6,201,306 B1, JP 2009-238881 A, JP 2010-161155 A,JP 60-097634 A,JP 01-109737 A,JP 55-070041 A,JP 2002-050670 A,JP O9-162204 A,JP 53-100765 A,JP 2008-004936 A,WO 2007 / 137888 A1,WO 2000 / 014789 A1,EP 949 662 A2,US 2006 / 013680 A1,US 2016 / 308269 A1,DE 10 2011 017218 A1,EP 2 491 583 B1. Summary of the Invention

[0008] question

[0009] In this context, there is a need for an apparatus and method that can improve the throughput of transferring components from a first carrier to a second carrier with high accuracy and reproducibility. It should also be possible to use a second carrier ranging from almost opaque to completely transparent without any loss of quality in terms of positional accuracy of component assembly. Finally, these components should be handled with care.

[0010] Proposed solution

[0011] To achieve this objective, a device for transferring electronic components from a first carrier to a second carrier is proposed, wherein...

[0012] -The first carrier and its separable carrier holding multiple monolithic components, and

[0013] - The second carrier is configured to be nearly infinite and carries a plurality of electronic sub-assemblies in its longitudinal and lateral extensions, one of which is to be transferred from the first carrier to the plurality of sub-assemblies, respectively, and wherein...

[0014] The device includes:

[0015] - A first container, which is designed to receive the first carrier;

[0016] - A second container designed to guide the second carrier along a longitudinal extension of the second carrier in the transport direction of the second carrier;

[0017] in

[0018] - The first container is designed to receive the first carrier such that the plurality of elements supported by the first container are oriented toward the second container;

[0019] - A separation device designed to separate the plurality of elements from the first carrier by contact or non-contact to transfer the plurality of elements to the second carrier;

[0020] - A first conveying device, which is configured and designed to move the first container transversely to the conveying direction of the second carrier relative to the second container;

[0021] - A second conveying device, which is configured and designed to move the separating device transversely to the conveying direction of the second carrier relative to the second container;

[0022] - A first inspection device, configured and designed to detect the position of at least one of the plurality of elements relative to its storage position on the second container that guides the second carrier;

[0023] - A second inspection device is arranged upstream of the storage location and configured to detect the position of at least one of the plurality of electronic sub-components on the second carrier relative to the second container, and to send information indicating the detected position to the controller;

[0024] - A third conveying device, configured and designed to convey the second carrier to its position relative to the storage location in response to information sent by the controller, such that at least one of the plurality of electronic sub-components on the second carrier reaches the storage location on the second container that guides the second carrier.

[0025] Advantages and operating modes

[0026] To date, for the assembly of subassemblies or leadframes via Direct Die Assembly (DDA), a single row of foil material is typically used as a second carrier, on which components from a first carrier are placed. The proposed solution allows for the use of multiple rows of foil material as the second carrier. The reduced complexity and higher throughput of the direct die structure are thus transferred to a system capable of handling multiple rows of foil material. Multiple rows of foil material are typically used to mount components in so-called pick-and-place systems or flip-chip systems. The proposed solution also allows for the replacement of previous inspections of the second carrier at the storage location. Therefore, even second carriers that are nearly opaque to completely opaque can be used without any loss of component assembly quality.

[0027] Traditional systems designed to handle multi-row rolls of foil material typically work in conjunction with an adhesive head that receives an element in a region outside the foil material, positions the element in the X / Y direction to a storage location on the foil material, and then places the element onto the foil material in the Z direction.

[0028] To identify the placement of the foil roll material before die assembly, conventional DDA systems for single-row foil roll material use a camera mounted directly in the assembly area behind / below the foil roll material of the second carrier. Due to this arrangement, conventional DDA systems can only handle fully transparent materials such as PET without limiting assembly accuracy; opaque materials are generally not suitable as a second carrier.

[0029] The proposed solution detects the storage location on the foil material (in both spatial and temporal aspects) before actual component assembly, wherein the second inspection device directly detects the corresponding component storage point on the second carrier itself, thus bypassing the second carrier. Then, the second carrier is conveyed to the storage location under control, such that when the separation device separates the component from the first carrier, the component storage point is aligned as precisely as possible with the position of the component to be stored on the first carrier, and then the component is transferred to the second carrier along the Z-direction.

[0030] Compared to pick-and-place systems or flip-chip systems, the proposed solution achieves significantly higher component throughput due to its lower structural complexity. Here, components can be directly and individually separated from the (sawed) wafer and placed into corresponding sub-assemblies (or lead frames or the like) on a second carrier; intermediate carriers as in conventional pick-and-place machines are no longer required. The transparency of the second carrier material no longer affects positional accuracy during component assembly.

[0031] Configuration of the proposed solution

[0032] In one variation, a first container with a first carrier is positioned directly above the second carrier on the second container. Unlike prior art, the first container and the separation device have a movement space transverse to the transport direction of the second carrier, which at least substantially corresponds to the width of the second carrier. This significantly increases the work / component assembly area across the width of the second carrier. Consequently, multiple adjacent rows of electronic sub-components, such as RFID antennas, on the wide second carrier can be reached by the first carrier and assembled at their storage location by operating the separation device.

[0033] In one variant, the first carrier has a first side facing the separation device and a second side facing away from the separation device and towards the second container, wherein the plurality of elements are detachably mounted on the second side of the first carrier; a first inspection device is designed to capture image data of an area, and the separation device is designed to interact with at least one of the plurality of elements in that area, either with contact or without contact, to separate the at least one element from the first carrier; and a controller is designed to determine position data of the element to be transferred based on the captured image data, and to generate control commands for the separation device and the corresponding transfer device based on the position data.

[0034] In one variant, the second inspection device is arranged upstream of the storage position on the second carrier relative to the transport direction of the second carrier, and is configured and designed to detect the position of one or more of a plurality of electronic sub-components on the second carrier relative to the second container, transverse to the transport direction of the second carrier, and to send information indicating the detected position to the controller.

[0035] In one variant, a first sensor device is associated with a third conveying device, which is configured and designed to send information about the conveying direction and path of the second carrier relative to its storage location to a controller.

[0036] In one variant, the controller is configured and designed to, based on information from the second inspection device regarding the location of the at least one electronic sub-component and information regarding the transport direction and path of the second carrier, and based on information from the first inspection device regarding at least one of the plurality of elements relative to the storage location, control the second transport device to move the separation device to the storage location transverse to the transport direction of the second carrier, and activate the separation device for the purpose of separating the elements from the first carrier.

[0037] In one variant, the apparatus includes a fourth conveying device configured and designed to move the first container relative to the second container along the conveying direction of the second carrier in response to information sent by the controller; and / or a fifth conveying device configured and designed to rotate the first container relative to the second container by an angle (θ) in response to information sent by the controller.

[0038] In another variation, the device includes a sixth conveying device configured and designed to convey a second carrier along a conveying direction (without slippage and therefore without elongation) in response to information sent by a controller, such that at least one of the plurality of electronic sub-components on the second carrier reaches a storage position on the second container that guides the second carrier.

[0039] In another variation of the device, if the separation device is designed to separate the plurality of elements from the first carrier by contact, the separation device includes a pusher needle designed and sized to pierce the first carrier in response to a message sent by a controller, so as to separate one of the plurality of elements from the first carrier and transfer it to the second carrier in each case; or if the separation device is designed to separate the plurality of elements from the first carrier without contact, the separation device includes a controllable energy source designed and sized to charge the first carrier with energy in response to a message sent by a controller, so as to separate one of the plurality of elements from the first carrier and transfer it to the second carrier respectively.

[0040] In another variation of the device, the second container includes a (circular) cylindrical drum or convex surface through which the second carrier reaches a storage position on the second container. In one variation, the second container has an outlet on its housing / surface that guides the second carrier, the outlet being designed to hold the second carrier on the second container (without slipping or elongating) by means of a vacuum.

[0041] In another variation, the device includes a third inspection device arranged downstream of the storage location relative to the transport direction of the second carrier, and configured and designed to detect the position of at least one of the plurality of electronic sub-components on the second carrier and the elements transferred thereto relative to each other, and to send information indicating the detected position to a controller.

[0042] In another variation, the apparatus includes an eighth conveying device configured to convey a second inspection device relative to the second container and storage location to detect the location of at least one component storage point on the second carrier and / or the location of at least one of the plurality of electronic sub-components on the second carrier, and to send information indicating the detected location to a controller; and / or a ninth conveying device configured to convey a third inspection device relative to the second container and storage location to detect the location of at least one of the plurality of electronic sub-components on the second carrier and the location of the components transferred thereon relative to each other, and to send information indicating the detected location to a controller.

[0043] Alternatively, the second and / or third inspection devices may be pivotally supported on the second container and may be electronically or manually adjustable in orientation of the component storage points or electronic subassemblies on the second carrier, as well as the orientation of the components transferred thereon.

[0044] To achieve this objective, another device is proposed for applying adhesive from a reservoir to a second carrier, wherein the second carrier is configured to be nearly infinite and supports a plurality of electronic sub-assemblies to which adhesive will be applied, in its longitudinal and transverse extensions, for subsequent transfer of an element to one of the plurality of electronic sub-assemblies, and wherein the other device comprises: a third container designed to guide the second carrier along its longitudinal extension in the transport direction of the second carrier; an adhesive dispensing device designed to dispense adhesive in a controlled and metered manner at the adhesive application location toward the third container onto an adhesive point on the second carrier, one of the plurality of electronic sub-assemblies. The component is located at the adhesive application position; an eleventh conveying device is configured to move the adhesive dispensing device transversely to the conveying direction of the second carrier relative to the third container; a fourth inspection device is arranged upstream of the adhesive application position and configured to detect the position of at least one of the plurality of electronic sub-components on the second carrier relative to the third container, and to send information indicating the detected position to the controller; a twelfth conveying device is configured to convey the second carrier to its position relative to the adhesive application position in response to information sent by the controller, such that at least one of the plurality of electronic sub-components having a bonding point on the second carrier reaches the adhesive application position on the third container that guides the second carrier.

[0045] Advantages and operating modes

[0046] The device for applying the adhesive advantageously interacts with and is upstream of the device for transferring electronic components from the first carrier to the second carrier, but will also be used independently of the transfer device.

[0047] The same applies to devices used for applying adhesives, allowing the use of multi-row foil material as a second carrier. This allows for reduced complexity and higher throughput during adhesive application, shifting to areas of the system capable of handling multi-row foil material. The solution for adhesive application presented here also allows for the replacement of previous checks of the second carrier at the adhesive application site. Therefore, even nearly opaque to completely opaque second carriers can be used when applying adhesives prior to component assembly, without any loss of quality.

[0048] To identify the adhesive application location on the foil roll material before adhesive application, conventional DDA systems for single-row foil rolls use a camera mounted directly on the back / underside assembly area of ​​the foil roll material of the second carrier. Due to this arrangement, conventional DDA systems can only process completely transparent materials such as PET without limiting assembly accuracy; opaque materials are generally not feasible as a second carrier.

[0049] The proposed solution detects adhesive points on the foil material (spatially / temporally) prior to actual adhesive application, wherein a fourth inspection device detects corresponding adhesive points directly on the second carrier itself that are associated with the respective electronic components, thus bypassing the second carrier. The second carrier is then conveyed in a controlled manner to the adhesive application location such that when the dispensing device outputs (meters a portion) the adhesive onto the adhesive point, the position of the adhesive point is aligned as precisely as possible with the outlet of the adhesive dispensing device.

[0050] Construction of the proposed solution

[0051] In one variant, the fourth inspection device is configured and designed to detect the position of one or more of a plurality of electronic sub-components on the second carrier relative to the third container, transverse to the transport direction of the second carrier, and to send information indicating the detected position to the controller. The fourth inspection device is arranged upstream of the adhesive application position on the second carrier relative to the transport direction of the second carrier.

[0052] In one variant, a second sensor device is associated with a twelfth conveying device, which is configured and designed to send information about the conveying direction and path of the second carrier relative to the adhesive application location to a controller.

[0053] In one variant, the controller is set and designed to control the eleventh conveying device based on information from the fourth inspection device regarding the position of at least one electronic sub-component and information regarding the conveying direction and path of the second carrier, and based on information from the fourth inspection device regarding the position of at least one element relative to the adhesive application, so as to move the dispensing device to a storage position transverse to the conveying direction of the second carrier, and to activate the dispensing device for the purpose of separating the element from the first carrier.

[0054] In one variant, the device includes a thirteenth conveying device configured and designed to convey a second carrier along the conveying direction via a second container (without slippage and therefore without elongation) in response to information sent by a controller, such that at least one of the plurality of electronic sub-components on the second carrier reaches the adhesive application position on the second container that guides the second carrier.

[0055] In another variation of the device, the third container includes a (circular) cylindrical drum or convex surface through which the second carrier reaches a storage position on the third container. In one variation, the second container has an outlet on its housing / surface that guides the second carrier, the outlet being designed to hold the second carrier on the third container (without slipping or elongating) by means of a vacuum.

[0056] In another variation, the device includes a fifth inspection device arranged downstream of the adhesive application location relative to the transport direction of the second carrier, and configured to detect the position of at least one of a plurality of electronic sub-components on the second carrier and the adhesive applied thereto relative to each other, and to send information indicating the detected position to a controller.

[0057] In another variation, the apparatus includes a fourteenth conveying device configured to convey a fourth inspection device relative to the third container and the adhesive application position, so as to detect at least one bonding point on the second carrier by a fifth inspection device, detect the position of at least one of a plurality of electronic sub-components on the second carrier, and send information indicating the detected position to a controller; and / or a fifteenth conveying device configured to convey the fifth inspection device relative to the third container and the adhesive application position, so as to detect the position of at least one of a plurality of electronic sub-components on the second carrier and the adhesive applied thereto relative to each other, and send information indicating the detected position to a controller.

[0058] Optionally, the fourth and / or fifth inspection devices may be pivotally supported, and their orientation may be adjusted electronically or manually.

[0059] In the aforementioned apparatus for transferring electronic components from a first carrier to a second carrier and / or for applying adhesive from a reservoir to a second carrier, the second to fifth inspection devices may be configured as follows: An illumination device is associated with the image capture device, wherein the illumination device is designed to guide light of different wavelengths onto a second container, the second container being designed to support an object located on the second carrier, the object to be captured by the image capture device; the sixteenth, seventeenth, eighteenth, and / or nineteenth conveying devices are designed to convey the corresponding image capture device and its associated illumination device along the second container; and the eighth, ninth, fourteenth, and / or fifteenth conveying devices are configured and arranged to convey the corresponding second, third, fourth, and / or fifth inspection devices along the conveying direction of the second carrier relative to the corresponding second and / or third containers and the component storage location or adhesive application location.

[0060] In one variation of the inspection device, the illumination device includes a white light source, a (infrared) red light source, and / or a (super) blue light source.

[0061] In one variation of the lighting device, the (infrared) red light source and / or (super) blue light source are configured as a ring light source, which at least partially surrounds the capture area of ​​the image capture device.

[0062] In one variation of the inspection apparatus, a white light source is positioned on the side of a beam deflector that is at least partially transparent, away from the capture area of ​​the image capture device.

[0063] In one variation of the inspection apparatus, the image capturing device includes a focusing optics arranged at a distance from the optically facing side of a beam deflector that is at least partially transparent; this distance can be fixed.

[0064] Even though the operating modes of the reference device describe some of the aspects described above, these aspects can also relate to the structure of the device. In exactly the same way, the aspects described for the reference device above can be applied accordingly to the operating modes. Although the various aspects of the device and the operating modes are described together to explain their interactions, they are also disclosed independently of each other, independent of other devices and other operating modes. Attached Figure Description

[0065] Further objects, features, advantages, and applications will become apparent from the following description of exemplary embodiments, with reference to the accompanying drawings, which should not be construed as limiting. All features described and / or depicted herein, either alone or in any combination, illustrate the subject matter disclosed herein, even independently of their grouping in the claims or their references. In this context, the dimensions and scale of the elements shown in the figures are not necessarily to scale; they may differ from those shown in the embodiments to be implemented herein.

[0066] Figure 1 A schematic side view of an apparatus for transferring electronic components from a first carrier to a second carrier and an apparatus for applying adhesive to the second carrier are shown.

[0067] Figure 2 A schematic plan view of an adjustable worktable in the X- / Y- / θ coordinate system is shown.

[0068] Figure 3 A schematic plan view of the second to fifth inspection devices is shown.

[0069] The method and apparatus variations and their functions and operations described herein are provided only for a better understanding of the structure, operating modes, and characteristics of the invention, and are not intended to limit the scope of the invention to the exemplary embodiments. The accompanying drawings are partial schematic diagrams, in which substantial features and effects are significantly enlarged to illustrate functions, effective principles, technical configurations, and features. The various operating modes, principles, technical configurations, and features disclosed in the foregoing drawings or text can be freely combined in any form with all claims of this application, features in the foregoing and other drawings, and other operating modes, principles, technical configurations, and features contained herein or deduced herein, so that all conceivable combinations are associated with the described apparatus. In this case, combinations between all individual implementations in the text, i.e., combinations between each part of the specification, combinations between different variations in the claims and in the text, and combinations in the claims and in the drawings, are also included and can be the subject of other claims. The claims do not limit the content of this disclosure, and therefore do not limit the possibility of combinations of all features shown with each other. All disclosed features are also explicitly disclosed individually herein, and these disclosed features can be combined with all other features. Detailed Implementation

[0070] In the accompanying drawings, corresponding or functionally similar elements are given corresponding reference numerals. The method and apparatus will now be described based on exemplary embodiments.

[0071] Figure 1 (On the right-hand side) An apparatus 100 for transferring electronic components B from a first carrier W to a second carrier BM is shown. In this variant, the first carrier W is designed as a generally circular semiconductor wafer and supports a plurality of monolithic components B, which can be detached from the first carrier in a manner further described below. The second carrier BM is configured as a nearly infinite roll of foil material and supports a plurality of electronic sub-assemblies ANT in its longitudinal and lateral extensions. In the variant shown here, the sub-assemblies ANT are printed antenna portions of an RFID module. One of the components B from the first carrier W is transferred to each of the plurality of electronic sub-assemblies ANT, respectively. The apparatus has a first container A1 designed to receive the first carrier W. The first container A1 is adapted in its design to the first carrier W.

[0072] In the variant shown, the second container A2 has the form of a cylindrical drum. The second carrier BM is carried along its longitudinal extension in the transport direction FR via an outer wall shaped like a cylindrical jacket. Further details are explained below. The first container A1 receives the first carrier W such that the element B supported by the first carrier W is oriented toward the second container A2. A separation device TE is provided on the side of the first container A1 away from the second container A2. The first carrier W has a first side facing the separation device TE and a second side facing away from it, the second side being opposite the second carrier BM on / at the second container A2. The plurality of elements B are detachably mounted on the second side of the first carrier W. The separation device TE is used to separate the element B from the first carrier W by contact or non-contact, so as to transfer the element B to the second carrier BM at the storage location AP.

[0073] The first container A1 is part of a worktable that is adjustable in the X / Y / θ coordinates, and its respective X / Y axes and rotational position θ are adjusted by a conveying device controlled by an electronic control unit (ECU). Specifically, the first conveying device F1, in the form of a linear servo drive, is configured and designed to move the first container A1 relative to the second container A2 laterally to the conveying direction FR of the second carrier BM. (See also...) Figure 2 The second conveying device F2, in the form of a linear servo drive, is configured and designed to move the separating device TE relative to the second container A2 laterally to the conveying direction FR of the second carrier BM.

[0074] A first inspection device I1 in the form of a camera is associated with a separation device TE and is used to detect the position of at least one of the elements B relative to the storage position AP on the second container A2 that guides the second carrier BM.

[0075] The second inspection device I2 is arranged upstream of the storage location AP and associated with the second container A2. The second inspection device I2 can be moved in a controlled manner within the longitudinal extension of the drum-shaped second container A2, thereby moving laterally to the conveying direction FR of the second carrier BM, or can be manually or by a motor adjusted by a predetermined angle along the circumference of the shell surface of the drum-shaped second container A2. For example, the inspection device I2 can be connected to the second container A2 via a pivot arm.

[0076] The second inspection device I2 is used to detect the position of at least one of the plurality of electronic sub-components ANT on the second carrier BM relative to the second container A2, and sends information indicating the detected position to the controller ECU. In this configuration, the third conveying device F3 is formed by two controlled conveying rollers arranged upstream and downstream of the drum-shaped second container A2, guiding the second carrier BM around the two conveying rollers. In response to information from the controller ECU, the two controlled conveying rollers convey the second carrier BM to its position relative to the storage position AP, such that at least one of the plurality of electronic sub-components ANT on the second carrier BM reaches the storage position AP on the second container A2 that guided the second carrier BM.

[0077] It can be understood that, based on the sub-component ANT on the second carrier BM that needs to cooperate with element B, the storage position AP changes in both the longitudinal direction and the lateral extension direction of the second carrier BM, while the corresponding area of ​​the second carrier BM is located on the second container A2 and needs to be aligned with the first carrier W. Therefore, the first carrier W will also move in the longitudinal direction and the lateral extension direction of the second carrier BM under the control of the controller ECU.

[0078] Multi-row foil material can obviously be used as a second carrier. This can be understood as foil material supporting several rows of sub-components ANT in its lateral extension. Carrier materials ranging from almost opaque to completely opaque can be used as a second carrier BM without sacrificing any precision during component assembly.

[0079] Before actual component assembly, the storage position AP on the foil material of the second carrier BM is detected in both space and time. In this case, the second inspection device I2 directly detects the corresponding component storage point on the second carrier BM itself, thus bypassing the second carrier. Then, the second carrier BM is conveyed to the storage position AP in a controlled manner, such that when the separation device TE separates the component B from the first carrier W, the component storage point is aligned as precisely as possible with the position of the component to be assembled on the first carrier W, and then the component B is transferred to the second carrier BM along the Z direction.

[0080] A first container A1, having a first carrier W, is directly above a second carrier BM on a second container A2. Here, the first container A1 and the separation device TE have a movement space transverse to the conveying direction FR of the second carrier BM, which at least approximately corresponds to the width of the second carrier BM. (See...) Figure 2The work / component assembly area thus extends substantially across the width of the second carrier BM. In one variation, the movement space of the container A1 and / or the separation device TE transverse to the transport direction FR of the second carrier BM can be greater than the transverse extension of the second carrier BM, thereby allowing the first carrier W to be positioned at least substantially completely, or at least its center / centerline to be positioned beyond the transverse extension of the second carrier BM. Therefore, multiple adjacent rows of electronic sub-components ANT, such as RFID antennas, can reach the wide second carrier BM via the first carrier W and can be assembled at the storage location AP by operating the separation device TE.

[0081] The first inspection device I1 is designed to capture image data of an area in which the separation device TE is designed to separate the element B from the first carrier W by interacting with it, either in contact or without contact.

[0082] The controller ECU is designed to determine the position data of the component B to be transferred based on the captured image data, and generate control commands for the separation device TE and the various transfer devices F1, ... Fn based on the position data.

[0083] The second inspection device I2 is arranged upstream of the storage position AP on the second carrier A2 relative to the conveying direction X of the second carrier BM, and is configured to detect the position of one or more of the multiple electronic sub-components ANT on the second carrier BM relative to the second container, and send information indicating the detected position to the controller ECU.

[0084] Associated with the third transmission device F3 is the first sensor device SE1, which is configured and designed to send information to the controller ECU about the transmission direction and transmission path of the second carrier BM relative to the storage location AP.

[0085] Based on information from the second inspection device I2 regarding the position of at least one electronic sub-component ANT and the transport direction and path of the second carrier BM, and based on information from the first inspection device I1 regarding the position of at least one of the components B relative to the storage location AP, the controller ECU controls the second transport device F2. The controller ECU then moves the separation device TE (along the transport direction) laterally to the storage location AP in the transport direction X of the second carrier BM, and the separation device TE is activated to separate the component B from the first carrier W.

[0086] The fourth conveying device F4 is used to move the first container A1 relative to the second container A2 along the conveying direction FR of the second carrier BM in response to information issued by the controller ECU.

[0087] In summary, each element B of the first carrier W can be positioned within the double-dotted area AF in such a way that the appropriate X- / Y-drives of the transfer devices F1 and F4 are controlled accordingly, so as to transfer element B to the second carrier BM on the second container A2. In a variant, the double-dotted area AF may be larger than the lateral extension of the second carrier BM.

[0088] The fifth conveying device F5 is used to rotate the first container A1 relative to the second container A2 by an angle θ in response to information sent by the controller ECU.

[0089] The sixth conveying device F6 can, in response to information from the controller ECU, cause the second container A2 to rotate in a controlled manner along and against the conveying direction FR. The sixth conveying device F6 is used to convey the second carrier BM through the second container A2 without slippage or elongation along the conveying direction FR, such that at least one of the plurality of electronic sub-components ANT on the second carrier BM reaches the corresponding storage position AP on the second container A2 that guides the second carrier BM.

[0090] In one variant, the separation device TE is designed to separate element B from the first carrier W via contact. For this purpose, the separation device TE has a pusher N, which is designed and sized to respond to information sent by the controller ECU (from...). Figure 1 The upper part of the device pierces the first carrier W to separate one of the elements B from the first carrier W in each case and transfer that element to the second carrier BM. In a second variation, the device is designed to separate the elements B from the first carrier W without contact. For this purpose, the separation device TE has a controllable energy source designed and sized to charge the first carrier W with laser energy, for example, in response to information sent by a controller ECU, so as to separate one of the elements B from the first carrier W in each case and transfer that element to the second carrier BM.

[0091] The second container A2 is a cylindrical drum or a convex surface, through which the second carrier BM can reach the storage position AP on the second container A2. In a variation, the second container A2 has multiple small outlets on its shell / surface that guides the second carrier BM, so as to hold the second carrier BM on the second container A2 by vacuum (Vak) without slipping or elongating.

[0092] In one variation, the shell / surface of the second container may be designed, or the vacuum Vak may be controlled, such that there is no vacuum Vak on the shell / surface below the storage position, but only on the upstream and downstream sides of the storage position AP. The second carrier BM is thus held upstream and downstream of the storage position AP by vacuum; there is no vacuum at the storage position.

[0093] In one variation, the second container A2 can be moved along the Z direction towards and away from the first container A1 by a conveying device to set the distance between the first and second containers.

[0094] In another variation, the second container A2 and / or the third container A3 may have compressed air introduced at least in a portion of the respective area where the second carrier BM is not attached to the respective container A2 or A3, and the compressed air is discharged through an opening to blow out dust that has been drawn into the vacuum vent over time.

[0095] The third inspection device I3 is positioned downstream of the storage position AP at the second container A2, relative to the conveying direction FR of the second carrier BM. It is used to detect the position of at least one of the multiple electronic sub-components ANT on the second carrier BM and the element B transferred thereon relative to each other, and to send information indicating the detected position to the controller ECU.

[0096] The eighth conveying device F8 is used to convey the second inspection device I2 relative to the second container A2 and the storage position AP, so as to detect at least one component storage point on the second carrier BM by means of the second inspection device I2. Therefore, the second inspection device I2 is controlled to move circumferentially by a predetermined angle both in the longitudinal extension of the drum-shaped second container A2, thus transverse to the conveying direction FR of the second carrier BM, and on the shell surface of the drum-shaped second container A2. Alternatively, the angle can be manually set before operation begins.

[0097] The position of at least one of the multiple electronic sub-components ANT on the second carrier BM can also be detected in this way, and information indicating the detected position can be sent to the controller ECU. Furthermore, in this variant, a ninth transfer device F9 is provided to transfer the third inspection device I3 relative to the second container A2 and the storage location AP in a manner similar to that performed on the second inspection device I2 via the eighth transfer device F8. The third inspection device I3 can therefore detect the position of at least one of the multiple electronic sub-components ANT on the second carrier BM and the element B transferred thereto relative to each other, and can send information indicating the detected position to the controller ECU.

[0098] For example Figure 1Another (sub)device shown on the left-hand side is used to apply adhesive K from the reservoir to the second carrier BM. As described above, the second carrier BM is configured to be nearly infinite and supports multiple electronic sub-assemblies ANT to which adhesive K will be applied in its longitudinal and lateral extensions, so that element B can then be transferred to one of the sub-assemblies ANT. The other device includes a third container A3 for guiding the second carrier BM along its longitudinal extension in the transport direction FR of the second carrier BM.

[0099] exist Figure 1 In this process, the adhesive K dispensing device SE is positioned above the third container A3 to dispense the adhesive K onto the adhesive point KS on the second carrier BM in a controlled and metered manner at the adhesive application location KAP toward the third container A3, with one of the multiple electronic sub-components ANT located at the adhesive application location KAP.

[0100] The eleventh conveying device F11 moves the dispensing device SE of adhesive K in a conveying direction FR transverse to the second carrier BM relative to the third container A3. The fourth inspection device I4 is associated with the third container A3 and is arranged upstream of the adhesive application position KAP. The fourth inspection device I4 is used to detect the position of at least one of the plurality of electronic sub-components ANT on the second carrier BM relative to the third container A3, and to send information indicating the detected position to the controller ECU.

[0101] In this configuration, the twelfth conveying device F12 consists of two controlled conveying rollers positioned upstream and downstream of the drum-shaped third container A3, respectively, and guiding the second carrier BM around these rollers. In response to information from the controller ECU, the two controlled conveying rollers convey the second carrier BM to its position relative to the adhesive application position KAP, such that at least one of the plurality of electronic sub-assemblies ANT having the adhesive point KS on the second carrier BM reaches the adhesive application position KAP on the third container A3 that guides the second carrier BM.

[0102] In the configuration shown here, the adhesive application device cooperates with a device for transferring components from a first carrier to a second carrier. For this purpose, the adhesive application device is positioned upstream of the component transfer device.

[0103] The same applies to adhesive application devices, which allow the use of multiple rows of foil material as a second carrier.

[0104] In this apparatus, adhesive points on the foil material are detected spatially and temporally before actual adhesive application. Here, the fourth inspection device I4 directly detects the corresponding adhesive point KS at the corresponding electronic component on the second carrier BM itself, thus bypassing the second carrier BM. The second carrier BM is then conveyed in a controlled manner to the adhesive application position KAP, such that when the dispensing device dispenses a metered portion of adhesive K onto the adhesive point KS, the adhesive point KS is aligned as precisely as possible with the outlet position of the adhesive dispensing device SE.

[0105] The fourth inspection device I4 is positioned upstream of the adhesive application position KAP on the circumference of the drum-shaped third container A3, relative to the conveying direction FR of the second carrier BM. It is used to detect the position of one or more of the multiple electronic sub-components ANT on the second carrier BM relative to the third container A3, transverse to the conveying direction FR of the second carrier BM, and to send information indicating the detected position to the controller ECU.

[0106] Associated with the twelfth conveying device F12 is the second sensor device SE2, which sends information about the conveying direction and conveying path of the second carrier BM relative to the adhesive application position KAP to the controller ECU.

[0107] Based on the information from the fourth inspection device I4 regarding the position of at least one electronic sub-component ANT and the information regarding the conveying direction and path of the second carrier BM, and based on the information from the fourth inspection device I4 regarding the position of at least one element B relative to the adhesive application position KAP, the controller ECU controls the eleventh conveying device F11 to move the dispensing device SE laterally to the conveying direction FR of the second carrier BM.

[0108] In response to a message from the controller ECU, the thirteenth conveying device F13 conveys the second carrier BM along the conveying direction FR via the third container A3. Under the control of the controller ECU, this is carried out without slippage or elongation, such that at least one of the plurality of electronic sub-components ANT on the second carrier BM reaches the adhesive application position KAP on the third container A3 that guides the second carrier BM.

[0109] Similar to the second container A2, the third container A3 is a cylindrical drum or convex surface through which the second carrier BM reaches the adhesive application position KAP on the third container A3. Here, the second container also has an outlet on its housing / surface that guides the second carrier BM, so that the second carrier BM can be held on the third container A3 without slippage or elongation by a vacuum (Vak).

[0110] The fifth inspection device I5 is arranged downstream of the adhesive application position KAP on the circumference of the drum-shaped third container A3 relative to the conveying direction FR of the second carrier BM, and is used to detect the position of at least one of the multiple electronic sub-components ANT on the second carrier BM and the adhesive K applied thereto relative to each other, and sends information indicating the detected position to the controller ECU.

[0111] The fourteenth conveying device F14 is used to convey the fourth inspection device F4 relative to the third container A3 and the adhesive application position KAP. The fourth inspection device F4 can therefore detect at least one adhesive point KS on the second carrier BM to detect the position of at least one of the plurality of electronic components ANT on the second carrier BM, and send information indicating the detected position to the controller ECU.

[0112] The fifteenth conveying device F15 is used to convey the fifth inspection device I5 along the circumference of the third container A3 relative to the third container A3 and the adhesive application position KAP. The fifth inspection device I5 can therefore detect the position of at least one of the plurality of electronic sub-components ANT on the second carrier BM and the adhesive K applied thereto relative to each other, and can send information indicating the detected position to the controller ECU.

[0113] according to Figure 2 The adjustable worktable in the X- / Y- / θ coordinates is configured in a particularly simple and advantageous manner as follows: the container A1 holding the first carrier W is arranged on the first carrier plate, wherein the fifth conveying device F5 is used to rotate the first container A1 relative to the first carrier plate by an angle θ.

[0114] The first support plate is movably arranged on the second support plate in the lateral extension direction (Y) of the second carrier BM. The first conveying device F1 is configured to move the first support plate (only) laterally to the conveying direction FR of the second carrier BM relative to the second support plate, and thus also move the first container A1.

[0115] The second support plate is movably arranged on the rigid third support plate or support frame in the conveying direction FR of the second carrier BM. The fourth conveying device F4 is configured to move the first container W, the first support plate, and the second support plate relative to the third support plate (only) in the conveying direction FR of the second carrier BM.

[0116] exist Figure 3 In this process, the second to fifth inspection devices I2…I5 are configured for use in the above-described apparatus as described below to transfer electronic component B from the first carrier W to the second carrier BM and to apply adhesive K from the reservoir to the second carrier BM.

[0117] In one configuration, the image capturing device BE (camera) can move along the Y direction at the inspection devices I2…I5. In this variation, the beam deflector can be omitted. Alternatively, the remaining optics, including the focusing optics, beam deflector, and / or illumination, can move along the Y direction, while the camera remains stationary and does not move in the Y direction. In this variation, the camera is set at an angle only by a pivot arm.

[0118] The camera-like image capturing device BE has associated illumination devices WL, RLB, and BLB. The illumination devices WL, RLB, and BLB have a white light source WL, an infrared light source RLR, and a blue light source BLB. The illumination devices WL, RLB, and BLB are used to direct light of different wavelengths onto the second container A2. Therefore, different details of the components / subassemblies and adhesives can be visually captured by the image capturing device BE, which is pointed at the second carrier BM.

[0119] The sixteenth, seventeenth, eighteenth, and / or nineteenth conveyor devices F16…F19 are designed to convey the corresponding image capturing unit BE and its associated lighting devices WL, RLB, and BLB along the second container A2 or the third container A3, i.e., in a conveying direction transverse to the second carrier BM. In other words, the sixteenth, seventeenth, eighteenth, and / or nineteenth conveyor devices F16…F19 are Y-type drives, while the eighth, ninth, fourteenth, and / or fifteenth conveyor devices F8, F9, F14, and F15 are motorized pivot arms, the functions of which can also be implemented manually.

[0120] The eighth, ninth, fourteenth, and / or fifteenth conveying devices F8, F9, F14, and F15 are used to convey the corresponding second, third, fourth, and / or fifth inspection devices I2…I5 along the conveying direction FR of the second carrier BM relative to the corresponding second container A2 and / or third container A3 and the component storage position AP or adhesive application position KAP. The corresponding second, third, fourth, and / or fifth inspection devices I2…I5 can thus be advantageously adapted to different spacings of electronic sub-assemblies on the second carrier.

[0121] In the variations of the illumination devices WL, RLB, and BLB shown, the infrared light RLR and the blue light source RLB are configured as annular light sources surrounding the capture area EB of the image capture device BE. The white light source WL is arranged on one side of a partially transparent beam deflector SU in the form of a 45-degree mirror, which is away from the capture area EB of the image capture device BE. The image capture device BE has a focusing optics FO, which is arranged at a fixed adjustable distance FL from the side of the partially transparent beam deflector SU facing the focusing optics FO.

Claims

1. An apparatus for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM), wherein -The first carrier (W) and its separable carrier that carries multiple monolithic elements, - The second carrier (BM) is configured to be nearly infinite and carries a plurality of electronic sub-assemblies (ANTs) in its longitudinal and lateral extensions, one of which is to be transferred from the first carrier (W) to the plurality of sub-assemblies, respectively, and wherein the device comprises: - A first container (A1) is designed to receive the first carrier (W); - A second container (A2) designed to guide the second carrier (BM) along its longitudinal extension in the transport direction of the second carrier (BM); in - The first container (A1) is designed to receive the first carrier (W) such that the plurality of elements (B) supported by the first container (A1) are oriented toward the second container (A2); - Separation device (TE) designed to separate the plurality of elements (B) from the first carrier (W) by contact or non-contact to transfer the plurality of elements (B) to the second carrier (BM); - A first conveying device (F1) is configured and designed to move the first container (A1) transversely to the conveying direction of the second carrier (BM) relative to the second container (A2); - A second conveying device (F2) is configured and designed to move the separating device (TE) transversely to the conveying direction of the second carrier (BM) relative to the second container (A2); - A first inspection device (I1) is configured and designed to detect the position of at least one of the plurality of elements relative to the storage position (AP) on the second container (A2) that guides the second carrier (BM); - A second inspection device (I2) is arranged upstream of the storage location (AP) and configured to detect the position of at least one of the plurality of electronic sub-components (ANT) on the second carrier (BM) relative to the second container (A2) and send information indicating the detected position to the controller; - A third conveying device (F3) is configured and designed to convey the second carrier (BM) to its position relative to the storage location (AP) in response to information sent by the controller, such that at least one of the plurality of electronic sub-components (ANT) on the second carrier (BM) arrives at the storage location (AP) on the second container (A2) that guides the second carrier (BM).

2. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1, wherein the apparatus (100) detects the storage position (AP) on the second carrier (BM) prior to component assembly, wherein, The second inspection device (I2) directly detects the corresponding component storage point on the second carrier (BM) itself, and then, under control, transports the second carrier (BM) to the storage location (AP) so that the component storage point is aligned with the position of the component (B) to be stored on the first carrier (W). Then, the separation device (TE) separates the component (B) from the first carrier (W) so that the component (B) is transferred to the second carrier (BM).

3. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - The first container (A1) having the first carrier (W) is arranged directly above the second carrier (BM) on the second carrier (BM), and the first container (A1) and the separation device (TE) have a movement space transverse to the conveying direction of the second carrier (BM), the movement space being at least corresponding to the width of the second carrier (BM).

4. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - The first carrier (W) has a first side facing the separation device (TE) and a second side facing the second carrier (BM) on the second container (A2) away from the separation device, wherein the plurality of elements are detachably mounted on the second side of the first carrier (A1); - The first inspection device (I1) is designed to capture image data of a region, and the separation device (TE) is designed to interact with at least one of the plurality of elements in the region, with or without contact, to separate the at least one element from the first carrier (W); The controller is designed to determine the position data of the element to be transferred based on the captured image data, and to generate control commands for the separation device (TE) and the corresponding transfer devices (F1, ..., Fn) based on the position data.

5. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - The second inspection device (I2) is arranged upstream of the storage position (AP) on the second carrier (BM) relative to the transport direction of the second carrier (BM), and is configured to detect the position of one or more of the plurality of electronic sub-components (ANT) on the second carrier (BM) relative to the second container (A2) transverse to the transport direction of the second carrier (BM), and send information indicating the detected position to the controller.

6. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - Associated with the third conveying device (F3) is a first sensor device (SE1), which is configured and designed to send information about the conveying direction and conveying path of the second carrier (BM) relative to the storage location (AP) to the controller.

7. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, The controller is configured and designed to, based on information from the second inspection device (I2) regarding the position of the at least one electronic sub-component (ANT) and information regarding the transport direction and transport path of the second carrier (BM), and based on information from the first inspection device (I1) regarding at least one of the plurality of elements relative to the storage location (AP), control the second transport device (F2) to move the separation device (TE) laterally to the transport direction of the second carrier, and activate the separation device for the purpose of separating the elements from the first carrier (W).

8. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - The fourth conveying device (F4) is configured and designed to move the first container (A1) relative to the second container (A2) along the conveying direction of the second carrier (BM) in response to information sent by the controller; and / or - The fifth conveying device (F5) is configured and designed to rotate the first container (A1) by an angle (θ) relative to the second container (A2) in response to information sent by the controller.

9. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - The sixth conveying device (F6) is configured and designed to convey the second carrier (BM) along the conveying direction via the second container (A2) in response to information sent by the controller, such that at least one of the plurality of electronic sub-components (ANT) on the second carrier reaches the storage position (AP) on the second container (A2) that guides the second carrier (BM).

10. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - If the separation device (TE) is designed to separate the plurality of elements from the first carrier (W) by contact, the separation device includes a pusher (N) designed and sized to pierce the first carrier (W) in response to a message sent by the controller, so as to separate one of the plurality of elements (B) from the first carrier (W) and transfer it to the second carrier (BM) in each case; or if the separation device (TE) is designed to separate the plurality of elements from the first carrier (W) without contact, the separation device (TE) includes a controllable energy source designed and sized to charge the first carrier (W) with energy in response to a message sent by the controller, so as to separate one of the plurality of elements (B) from the first carrier (W) and transfer it to the second carrier (BM), respectively.

11. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - The second container (A2) includes a convex surface through which the second carrier (BM) reaches the storage position (AP) on the second container (A2), wherein the second container (A2) has an outlet on its surface that guides the second carrier (BM), the outlet being designed to hold the second carrier (BM) on the second container (A2) by means of a vacuum.

12. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein, - A third inspection device (I3) is arranged downstream of the storage location (AP) relative to the transport direction of the second carrier (BM), and is configured and designed to detect the position of at least one of the plurality of electronic sub-components (ANT) on the second carrier (BM) and the element transferred thereto relative to each other, and to send information indicating the detected position to the controller.

13. The apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 12, characterized in that, - The eighth conveying device (F8) is configured and designed to convey the second inspection device (I2) relative to the second container (BM) and the storage location (AP) so as to detect, via the second inspection device (I2) at least one component storage point on the second carrier (BM) and / or detect the location of at least one of the plurality of electronic sub-assemblies (ANTs) on the second carrier (BM), and send information indicating the detected location to the controller; and / or - The ninth conveying device (F9) is configured and designed to convey the third inspection device (I3) relative to the second container (BM) and the storage location (AP) in order to detect the position of at least one of the plurality of electronic sub-components (ANT) on the second carrier (BM) and the element transferred thereto relative to each other, and to send information indicating the detected position to the controller.

14. A method for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM), comprising the steps of: - Provides a first carrier (W) that detachably supports a plurality of monolithic elements. - Provide a second carrier (BM), the second carrier (BM) being configured to be nearly infinite and supporting a plurality of electronic sub-assemblies (ANTs) in its longitudinal and lateral extensions, one of the plurality of elements to be transferred from the first carrier (W) to the plurality of sub-assemblies respectively; - Provide a first container (A1) designed to receive the first carrier (W); - Provide a second container (A2) designed for guiding the second carrier (BM) along a longitudinal extension of the second carrier (BM) in the conveying direction of the second carrier (BM); in - The first container (A1) is designed to receive the first carrier (W) such that the plurality of elements (B) supported by the first container (A1) are oriented toward the second container (A2); - Provide a separation device (TE) designed to separate the plurality of elements (B) from the first carrier (W) by contact or non-contact to transfer the plurality of elements (B) to the second carrier (BM); - Provide a first conveying device (F1), the first conveying device (F1) being configured and designed to move the first container (A1) transverse to the conveying direction of the second carrier (BM) relative to the second container (A2); - Provide a second conveying device (F2), which is configured and designed to move the separating device (TE) transversely to the conveying direction of the second carrier (BM) relative to the second container (A2); - Provide a first inspection device (I1) configured and designed to detect the position of at least one of the plurality of elements relative to the storage position (AP) on the second container (A2) that guides the second carrier (BM); - Provide a second inspection device (I2) arranged upstream of the storage location (AP), and configured and designed to detect the position of at least one of the plurality of electronic sub-components (ANT) on the second carrier (BM) relative to the second container (A2), and send information indicating the detected position to the controller; - Provide a third conveying device (F3) configured and designed to convey the second carrier (BM) to its position relative to the storage location (AP) in response to information sent by the controller, such that at least one of the plurality of electronic sub-components (ANT) on the second carrier (BM) arrives at the storage location on the second container (A2) that guides the second carrier (BM).