Metal sheet and film bonding device

By designing a metal sheet and film bonding device, using the combination of the upper mold assembly and the lower mold assembly and the lifting mechanism, the automatic punching and film patching of the same station is realized, and the problem of low production efficiency in the prior art is solved. Improve the accuracy and quality of the workpiece film.

CN112743866BActive Publication Date: 2025-02-21SUZHOU LINGYU ELECTRONICS TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202011556133.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-12-24
Publication Date
2025-02-21
Estimated Expiration
2040-12-24

AI Technical Summary

Technical Problem

In the existing film sticking process, the workpiece needs to be punched and then moved to the next station to apply film, resulting in low production efficiency.

Method used

A metal sheet and film bonding device is designed, adopting a combination of upper mold assembly and lower mold assembly. The lower mold assembly is equipped with a punching template. The upper mold assembly can punch and cut the workpiece when the mold is closed. It is also pasted on the adhesive film, and the adhesive film is raised upward through the lifting mechanism, so that the workpiece falls directly on the adhesive film.

Benefits of technology

Automatic punching and cutting film patching at the same station is realized, which improves production efficiency and quality, avoids workpiece displacement, and enhances the accuracy and quality of film patching.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN112743866B_ABST
    Figure CN112743866B_ABST
Patent Text Reader

Abstract

The present invention discloses a metal sheet and film bonding device, comprising an upper mold assembly and a lower mold assembly. The lower mold assembly is provided with a punching template. When the upper mold assembly moves in a mold-closing manner, it can punch and bond the workpiece to the film, and when the upper mold assembly moves in a mold-closing manner, it can drive a lifting mechanism to lift the film upward, so that the film is pressed against the lower surface of the punching template. The upper mold assembly moves downward in a mold-closing manner to punch and bond the workpiece, and the cut workpiece is pressed against the film, thereby realizing automatic punching and bonding at the same workstation, improving production efficiency and yield, and when the workpiece is punched, the lifting mechanism can simultaneously move upward and lift the film, so that the film is pressed against the lower surface of the punching template, so that the workpiece is directly dropped onto the film after punching, thereby improving the bonding accuracy and quality.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of film laminating equipment, and in particular to a metal sheet and adhesive film laminating device. Background Art

[0002] The existing film laminating process is to punch and shape the workpieces in bulk, and then place the bulk workpieces in a fixture for film laminating. The production efficiency is low and it requires a lot of manpower. Summary of the invention

[0003] The purpose of the present invention is to provide a metal sheet and film bonding device, which can perform punching and film bonding in the same workstation, improve production efficiency and quality, and solve the problem of low production efficiency in the existing workpiece that the punching is completed first and then moved to the next workstation for film bonding.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] The metal sheet and adhesive film bonding device comprises an upper die assembly and a lower die assembly, wherein the lower die assembly is provided with a punching template;

[0006] When the upper mold assembly moves in mold closing mode, the workpiece can be punched and attached to the adhesive film, and when the upper mold assembly moves in mold closing mode, the lifting mechanism can be driven to lift the adhesive film upward, so that the adhesive film is pressed against the lower surface of the punching template.

[0007] Thus, the workpiece and the adhesive film are fed in the device, and after being fed into place, the upper mold assembly moves downward to close the mold, punches the workpiece, and presses the cut workpiece onto the adhesive film, thereby realizing automatic punching and film lamination at the same station, improving production efficiency and yield, and when the workpiece is punched, the lifting mechanism can simultaneously move upward and lift the adhesive film, so that the adhesive film rests against the lower surface of the punching template, so that the workpiece can be directly dropped onto the adhesive film after punching, thereby improving the accuracy and quality of lamination.

[0008] In some embodiments, the lifting mechanism includes a plunger, a slider, and a support block;

[0009] The insert knife is connected to the upper die assembly, and the slide block is horizontally slidably connected to the lower die assembly;

[0010] The inserting knife can move downward and push the slider to move horizontally, and the slider moving horizontally pushes the supporting block to move upward.

[0011] In some embodiments, the bottom of the plunger is provided with an inclined first driving surface;

[0012] One end of the slider is provided with an inclined first driven surface, and the other end of the slider is provided with an inclined second driving surface;

[0013] The bottom of the support block is provided with an inclined second driven surface.

[0014] Thus, the first driving surface cooperates with the first driven surface, and the second driving surface cooperates with the second driven surface, so that the downward motion is converted into the horizontal motion, and then the horizontal motion is converted into the upward motion, and vice versa.

[0015] In some embodiments, the support block is drivingly connected to the slider via a tray and a panel;

[0016] The bottom of the tray is provided with a second driven surface, the tray is provided with a first embedding groove, and the embedding plate is connected to the first embedding groove;

[0017] The inlay plate is provided with a second inlay groove, and the support block is connected to the second inlay groove.

[0018] Therefore, the support block can be provided with a second driven surface directly connected to the slider, or can be connected to the slider through a tray and panel matching structure for replacement, so as to realize the manufacture and replacement of wearing parts.

[0019] In some embodiments, the panel is provided with a second locating pin.

[0020] Therefore, when the slider pushes the supporting block to move upward, the second positioning needle moves upward accordingly and performs positioning correction on the second material strip.

[0021] In some embodiments, the support block is provided with a limiting boss.

[0022] In some embodiments, the upper die assembly is provided with a punch, and the punching template is provided with a punching hole.

[0023] In some embodiments, the lower mold assembly is provided with a first feed channel and a second feed channel, the first feed channel passes over the punching template, and the second feed channel passes under the punching template.

[0024] In some embodiments, the first feed channel and the second feed channel are arranged perpendicular to each other.

[0025] In some embodiments, the workpieces are arranged in half-cut form on the first material strip, and the adhesive film is arranged on the second material strip.

[0026] Thus, the workpiece can be connected to the first material strip without punching, or can be arranged on the first material strip in a half-cut manner. The half-cut manner is beneficial for reducing the punching force and facilitating bonding.

[0027] Beneficial effects of the present invention: the device can perform punching and film lamination in the same station, thereby improving production efficiency and quality;

[0028] In addition, the lifting mechanism is designed to lift the film during film pasting, so that the workpiece can fall directly onto the film to avoid displacement of the workpiece, and the film can be positioned and corrected to further improve the quality of film pasting;

[0029] Furthermore, the workpieces and the film are fed through corresponding material strips, which further improves the degree of automation and production efficiency, and the workpieces are arranged in a half-cut manner on the material strip, which is conducive to improving the punching quality and film lamination quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural diagram of the metal sheet and adhesive film bonding device of the present invention;

[0031] Figure 2 It is an exploded view of the metal sheet and adhesive film bonding device of the present invention;

[0032] Figure 3 It is a structural diagram of the lower mold assembly of the present invention;

[0033] Figure 4 is an exploded view of the lifting mechanism of the present invention;

[0034] Figure 5 A structural diagram of a tray of the lifting mechanism of the present invention;

[0035] Among them: 1-upper die assembly; 11-punch; 2-lower die assembly; 21-first feed channel; 22-second feed channel; 23-punching template; 231-punching hole; 3-lifting mechanism; 31-insertion knife; 311-first driving surface; 32-slider; 321-first driven surface; 322-second driving surface; 33-support block; 331-second driven surface; 332-limiting boss; 330-tray; 330a-first embedding groove; 340-inlay plate; 340a-second embedding groove; 350-second positioning pin; 4-cylinder; 5-first material strip; 6-second material strip. DETAILED DESCRIPTION

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0037] refer to Figures 1 to 5 , a metal sheet and adhesive film bonding device, comprising an upper die assembly 1 and a lower die assembly 2, wherein the lower die assembly 2 is provided with a punching template 23;

[0038] When the upper mold assembly 1 moves in the mold closing motion, the workpiece can be punched and attached to the adhesive film, and when the upper mold assembly 1 moves in the mold closing motion, the lifting mechanism 3 can be driven to lift the adhesive film upward, so that the adhesive film is pressed against the lower surface of the punching template 23 .

[0039] To further illustrate, the lifting mechanism 3 includes an inserting knife 31, a sliding block 32 and a supporting block 33;

[0040] The inserting knife 31 is connected to the upper die assembly 1, and the sliding block 32 is horizontally slidably connected to the lower die assembly 2;

[0041] The inserting knife 31 can move downward and push the slider 32 to move horizontally, and the slider 32 moving horizontally pushes the support block 33 to move upward.

[0042] To further illustrate, the bottom of the inserting blade 31 is provided with an inclined first driving surface 311;

[0043] One end of the slider 32 is provided with an inclined first driven surface 321, and the other end of the slider 32 is provided with an inclined second driving surface 322;

[0044] The bottom of the support block 33 is provided with an inclined second driven surface 331 .

[0045] To further explain, the slider 32 is in a "T" shape.

[0046] Further, the support block 33 is drivingly connected to the slider 32 through the tray 330 and the panel 340;

[0047] The bottom of the tray 330 is provided with a second driven surface 331, the tray 330 is provided with a first embedding groove 330a, and the embedding plate 340 is connected to the first embedding groove 330a;

[0048] The inlay plate 340 defines a second inlay groove 340 a , and the support block 33 is connected to the second inlay groove 340 a .

[0049] To further explain, the panel 340 is provided with a second positioning pin 350 .

[0050] To further explain, the support block 33 is provided with a limiting boss 332 .

[0051] To further explain, the upper die assembly 1 is provided with a punch 11 , and the punching template 23 is provided with a punching hole 231 .

[0052] To further explain, the lower mold assembly 2 is provided with a first feed channel 21 and a second feed channel 22 . The first feed channel 21 passes above the punching template 23 , and the second feed channel 22 passes below the punching template 23 .

[0053] To further explain, the first feed channel 21 and the second feed channel 22 are arranged perpendicular to each other.

[0054] To further illustrate, the workpieces are arranged in a half-cut manner on the first material strip 5 , and the adhesive films are arranged on the second material strip 6 .

[0055] Working principle:

[0056] The laminating device comprises an upper die assembly 1 and a lower die assembly 2. The upper die assembly 1 realizes die closing and die opening movements through a cylinder 4. The upper die assembly 1 is provided with a punch 11. The lower die assembly 2 is correspondingly provided with a punching template 23. The punching template 23 is provided with a punching hole 231. The lower die assembly 2 is provided with a first feed channel 21 and a second feed channel 22. The first feed channel 21 passes above the punching template 23, and the second feed channel 22 passes below the punching template 23. The workpiece is fed in the first feed channel 21 through a first material belt 5, and the adhesive film is fed in the second feed channel 22 through a second material belt 6. When the workpiece and the adhesive film are fed into place, the upper die assembly 1 is closed downward. When closing the die, the upper die assembly 1 is provided with corresponding first positioning pins to position the first material belt 5 and the second material belt 6 respectively. Then, the punch 11 punches and separates the workpiece from the first material belt 5, and presses the workpiece onto the adhesive film of the second material belt 6, thereby completing punching and laminating at the same station, thereby improving production efficiency.

[0057] In order to further improve the lamination quality, the lifting mechanism 3 can lift the film upward during lamination, reduce the distance between the film and the workpiece, and make the film abut against the lower surface of the punching template 23. After the workpiece is punched, it can be directly dropped onto the film from the punching hole 231 to avoid the workpiece from falling and shifting. The lifting mechanism 3 includes a plunger 31, a slider 32 and a support block 33. When the plunger 31 moves downward with the upper mold assembly 1, its inclined first driving surface 311 abuts against the first driven surface 321 and pushes the slider 32 to move horizontally. The second driving surface 322 of the slider 32 abuts against the second driven surface 331 at the same time and pushes the support block 33 to move upward.

[0058] The second driven surface 331 can be directly disposed on the support block 33, so that the support block 33 is directly connected to the slider 32 in a driving manner. The second driven surface 331 can also be disposed on the tray 330, and the support block 33 is indirectly driven through the structure of the tray 330 and the panel 340. The panel 340 can be provided with a second positioning pin 350, and when the support block 33 moves upward, the second material strip 6 can be positioned and corrected, thereby further improving the bonding quality.

[0059] After the punching and laminating is completed, the upper mold assembly 1 opens upward and resets, the insert knife 31 withdraws, the slider 32 can be reset under the push of a spring or other structure, the support block 33 falls back, and the corresponding material strip can continue to be fed and the above-mentioned punching and laminating action is repeated.

[0060] The workpieces can be arranged in a half-cut manner on the first material strip 5, which is beneficial to improving the punching quality and can reduce the impact force during film lamination.

[0061] The above disclosure is only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the invention.

Claims

1. A device for laminating a metal sheet and an adhesive film, characterized in that: It comprises an upper die assembly (1) and a lower die assembly (2), wherein the lower die assembly (2) is provided with a punching template (23); When the upper mold assembly (1) moves in a mold-closing manner, the workpiece can be punched and attached to the adhesive film, and when the upper mold assembly (1) moves in a mold-closing manner, the lifting mechanism (3) can be driven to lift the adhesive film upward, so that the adhesive film is pressed against the lower surface of the punching template (23); The lifting mechanism (3) comprises a plunger (31), a slide block (32) and a support block (33); The insert knife (31) is connected to the upper mold assembly (1), and the slider (32) is connected to the lower mold assembly (2) in a horizontally slidable manner; The inserting knife (31) can move downward and push the slider (32) to move horizontally, and the slider (32) moving horizontally pushes the support block (33) to move upward; The bottom of the inserting blade (31) is provided with an inclined first driving surface (311); One end of the slider (32) is provided with an inclined first driven surface (321), and the other end of the slider (32) is provided with an inclined second driving surface (322); The bottom of the support block (33) is provided with an inclined second driven surface (331); The support block (33) is drivingly connected to the slider (32) via a tray (330) and a panel (340); The bottom of the tray (330) is provided with the second driven surface (331), the tray (330) is provided with a first embedding groove (330a), and the embedding plate (340) is connected to the first embedding groove (330a); The panel (340) is provided with a second embedding groove (340a), and the support block (33) is connected to the second embedding groove (340a); The upper die assembly (1) is provided with a punch (11), and the punching template (23) is provided with a punching hole (231); The lower die assembly (2) is provided with a first feed channel (21) and a second feed channel (22), wherein the first feed channel (21) passes above the punching template (23), and the second feed channel (22) passes below the punching template (23); The first feed channel (21) and the second feed channel (22) are arranged perpendicular to each other.

2. The metal sheet and adhesive film bonding device according to claim 1, characterized in that: The panel (340) is provided with a second positioning pin (350).

3. The metal sheet and adhesive film bonding device according to claim 1, characterized in that: The support block (33) is provided with a limiting boss (332).

4. The metal sheet and adhesive film bonding device according to claim 1, characterized in that: The workpieces are arranged in a half-cut manner on a first material strip (5), and the adhesive film is arranged on a second material strip (6).

Citation Information

Patent Citations

  • Metal sheet and adhesive film laminating device

    CN214774122U