Particle radiation device and optical microscope and method for operating the same

Abstract

The present invention relates to a particle radiation device and an optical microscope and a method for operating the same. The method includes changing the first temperature of an object, the object being arranged at an object receiving device, and the object receiving device being movable by at least one motor operated by a power supply current. By changing the first temperature of the object, the second temperature of the object receiving device is changed from a first temperature value to a second temperature value. The method also includes: changing the power supply current of the motor from a first current value to a second current value, the power supply current being designed to fix the object receiving device; and changing the temperature of the object receiving device from the second temperature value to a third temperature value based on the heat generated by the motor, the heat being achieved by the second current value of the power supply current and being delivered to the object receiving device. TOT1‑15°C ≤ TOT3 ≤ TOT1+15°C holds, where TOT1 is the first temperature value of the object receiving device and TOT3 is the third temperature value of the object receiving device.

Description

Technical Field

[0001] The present invention relates to a method for operating a particle irradiation device and / or an optical microscope, a computer program product, and a particle irradiation device and an optical microscope that can be used to implement the method. The particle irradiation device and / or the optical microscope are designed for imaging, analyzing, and / or processing objects. The particle irradiation device is designed, for example, as an electron irradiation device and / or an ion irradiation device. Background Art

[0002] Electron radiation devices, in particular scanning electron microscopes (also referred to below as SEM) and / or transmission electron microscopes (also referred to below as TEM), are used to study objects (samples) in order to gain insights into their properties and behavior under certain conditions.

[0003] In the case of an SEM, an electron beam (hereinafter also referred to as a primary electron beam) is generated by means of a beam generator and is focused onto the object to be studied by a beam guidance system. The primary electron beam is guided in a scanning manner on the surface of the object to be studied by means of a deflection device. The electrons of the primary electron beam interact with the object to be studied. As a result of the interaction, interaction particles and / or interaction radiation are generated. As interaction particles, in particular, electrons are emitted from the object (so-called secondary electrons) and electrons of the primary electron beam are backscattered (so-called backscattered electrons). The secondary electrons and backscattered electrons are detected by a particle detector and used to form an image. An image of the object to be studied is thus obtained. As interaction radiation, in particular, X-ray radiation and / or cathode luminescence are generated. The interaction radiation is detected, for example, by a radiation detector and is used in particular to study and analyze the object.

[0004] In the case of TEM, a primary electron beam is also generated by means of a beam generator and is directed to the object to be studied by means of a beam guidance system. The primary electron beam transmits the object to be studied. When the primary electron beam passes through the object to be studied, the electrons of the primary electron beam interact with the material of the object to be studied. The electrons that penetrate the object to be studied are imaged on a light screen or on a detector (e.g., a camera) by a system consisting of an objective lens and a transmission lens. Imaging can also be performed in the scanning mode of the TEM. This type of TEM is generally referred to as an STEM. It can also be proposed that backscattered electrons and / or secondary electrons emitted by the object to be studied are detected at the object to be studied by means of another detector in order to image the object to be studied.

[0005] Furthermore, it is known from the prior art to use combined devices for studying objects, in which not only electrons but also ions can be directed onto the object to be studied. For example, it is known to additionally equip an SEM with an ion beam generator. An ion beam generator arranged in the ion beam generator generates ions that are used to prepare the object (e.g., to remove material from the object or to apply material to the object) or to image the object. The SEM is particularly useful for observing the preparation process, but is also useful for further studying prepared or unprepared objects.

[0006] It is known that an object to be examined using a particle irradiation device is arranged on an object holder, which in turn is arranged on a stage. The stage is arranged in a sample chamber of the particle irradiation device. The stage is designed to be movable, wherein the movable design of the stage is ensured by a plurality of movement units that constitute the stage. These movement units are capable of moving the stage in at least one specific direction. In particular, stages having multiple translational movement units (e.g., 3 to 4 translational movement units) and multiple rotational movement units (e.g., 2 to 3 rotational movement units) are known. For example, stages are known that are arranged to be movable along a first translational axis (e.g., the x-axis), along a second translational axis (e.g., the y-axis), and along a third translational axis (e.g., the z-axis). The first, second, and third translational axes are oriented perpendicular to each other. In addition, known stages are designed to be rotatable about a first rotational axis and about a second rotational axis oriented perpendicular to the first rotational axis.

[0007] In the prior art, the driving force for movement by means of the mobile unit is provided by a stepper motor. A stepper motor is provided for movement along one of the translation axes or rotation about one of the rotation axes. These stepper motors are arranged either inside the sample chamber of the particle irradiation device or outside the sample chamber. In the latter case, a vacuum channel and a mechanical device are provided to ensure control between the stepper motor and the stage.

[0008] The stepper motors known from the prior art have the following basic structure. The stepper motor is equipped with a rotor, which is rotatably arranged in the stepper motor. The stepper motor also has coils arranged around the rotor. The coils provide a controlled, gradually rotating electromagnetic field, with which the rotor can be rotated through a minimum angle or a multiple of this minimum angle. In this way, a certain number of steps per rotor rotation can be achieved. Stepper motors with a different number of steps per rotor rotation, for example 100 steps per rotation, are known from the prior art. In a stepper motor with 100 steps per rotation, the rotor rotates, for example, by 3.6° per full step.

[0009] In known stepper motors, in addition to the full-step operating mode in which the stepper motor performs a full-step operation, there can also be a so-called micro-step operating mode. In the micro-step operating mode, a step size smaller than a full step is provided. For this purpose, the step angle is reduced. This is provided by manipulating the power supply current for the coils used in the stepper motor. By switching the power supply current to the individual coils of the stepper motor on or off, a step-shaped total control current curve is achieved, which is given by the ratio of the amplitudes of the power supply currents applied to the individual coils. The stepper motor is thus controlled by selectively manipulating the power supply current for the individual coils used in the stepper motor. By selectively manipulating the power supply current for the individual coils of the stepper motor in a phase-shifted manner, a full step or a smaller step size (for example, a half step, an eighth step or a smaller step size) can be achieved.

[0010] It is also known in the prior art to use one or more stepper motors to fix a movable stage at a specific position in a sample chamber in a particle irradiation system. In other words, the stage should not be moved from this specific position. This is particularly desirable for good resolution and / or accurate imaging of objects arranged on the stage. When the stepper motor is stopped, the rotor remains in a predefined position predetermined by one of the microsteps. In this position, the supply current assumes a value that is predetermined by the operating amplitude and operating phase of the supply current required by the stepper motor in this motor position. This operating amplitude is static. This operating amplitude could lead to excessive thermal loading on the stepper motor, which is undesirable. For this purpose, the prior art proposes reducing the amplitude of the supply current to a predefined holding amplitude after shutdown. A supply current with this holding amplitude is also called a holding current. At this holding current, component heating is acceptable.

[0011] It is also known from the prior art to examine frozen objects with electron microscopes. This is advantageous, for example, when examining biological objects. To this end, the frozen object is placed on a coolable object holder. For example, the object holder can be cooled to a temperature of less than or equal to 140°C using liquid nitrogen. The object holder is placed on the stage of the electron microscope. To prevent the stage from cooling, it is known to place the object holder on the stage in a thermally insulated manner.

[0012] However, it has been shown that this does not prevent the stage from also cooling down over time. Since the stage is no longer in thermal equilibrium, this results in thermal expansion of the stage. This leads to drifts when positioning the stage, so that the stage moves away from the position it should actually be in. In other words, this results in drifts of the stage around the desired stage position. The stage then adopts a position that deviates from the desired stage position. This is disadvantageous for good imaging, processing and / or analysis of objects with an electron beam, since the position resolution becomes poorer and the quality of the imaging, processing and / or analysis of the object is thus reduced.

[0013] Measurements have shown that the drift of the stage when the object holder cools to the aforementioned temperature can be 10 to 15 times greater than the drift of the stage before the object holder cools. After the object holder cools to the desired temperature and remains at this desired temperature, the drift of the stage has approximately the same value as the drift of the stage before the object holder cools. However, measurements have also shown that after a certain time after the object holder cools, the drift of the stage increases again and only decreases again continuously over time.

[0014] The aforementioned disadvantages also exist when the cooled object holder is arranged on the movable stage of an optical microscope.

[0015] With regard to the prior art, reference is made by way of example to DE 10 2012 205 317 A1. Summary of the Invention

[0016] The basic object of the invention is to bring the drift of the workpiece stage after the object holder has cooled down and after the object holder has reached the desired temperature as quickly as possible to the value the drift of the workpiece stage had before the object holder cooled down.

[0017] According to the invention, this object is achieved by means of a method having the features of claim 1. Claim 18 provides a computer program product with program code that is loaded or loadable into a processor and, when executed, controls a particle irradiation system and / or an optical microscope, thereby implementing the method according to the invention. The invention relates to a particle irradiation system having the features of claim 19 and an optical microscope having the features of claim 24. Further features of the invention are apparent from the following description, the appended claims, and / or the drawings.

[0018] The method of the present invention is used to operate a particle radiation device and / or an optical microscope for imaging, analyzing, and / or processing an object. For example, a particle beam is generated using at least one particle beam generator of the particle radiation device. The particle beam comprises charged particles. These particles are, for example, electrons or ions. In particular, it is proposed that at least one objective lens be used to guide or focus the particle beam onto the object. Due to the interaction between the particle beam and the object, interaction radiation and / or interaction particles are generated. The interaction radiation is, for example, X-ray radiation and / or cathodoluminescence. The interaction radiation is detected using at least one radiation detector. The interaction particles are, for example, secondary particles emitted by the object, in particular secondary electrons, and / or backscattered particles, in particular backscattered electrons. The interaction particles are detected using at least one particle detector.

[0019] In the method of the present invention, it is proposed to change a first temperature of an object. For example, the object is cooled and / or heated from the first temperature value of the object to the second temperature value of the object. Thus, changing the first temperature of the object, for example, includes cooling and / or heating the object.

[0020] The object is arranged at a movable object receiving device of the particle irradiation device and / or optical microscope. The object is arranged at the object receiving device, for example, directly or by means of an intermediate component arranged between the object and the object receiving device. The object receiving device is, for example, a manipulator, a stage, and / or a fixture for holding and / or gripping the object. At least one motor is provided to move the object receiving device, which is operated by a power supply current. For example, the object receiving device is designed to be movable along a first translation axis (particularly the x-axis), along a second translation axis (particularly the y-axis), and along a third translation axis (particularly the z-axis). The first, second, and third translation axes are, for example, oriented perpendicularly to one another. Furthermore, the object receiving device is designed to be rotatable about a first rotational axis and about a second rotational axis oriented perpendicularly to the first rotational axis. In one embodiment of the method according to the present invention, a motor is provided for each of the aforementioned axes, which enables the object receiving device to move along the corresponding axis.

[0021] Changing the first temperature of the object causes the second temperature of the object receiving device to change from the first temperature value of the object receiving device to the second temperature value of the object receiving device. In other words, changing the first temperature of the object also causes the second temperature of the object receiving device to change.

[0022] The method of the present invention now provides for changing the power supply current of the motor from a first current value to a second current value. The power supply current having the first current value or the second current value is used to secure the object receiving device at a desired position of the object receiving device in the particle irradiation system and / or the optical microscope via the motor. In other words, the power supply current having the first current value or the second current value is a holding current. At both the first and second current values ​​of the power supply current, the object receiving device is held at the desired position of the object receiving device in the particle irradiation system and / or the optical microscope by the motor. When the holding current is supplied to the motor, the motor maintains the object receiving device in the desired position of the object receiving device in the particle irradiation system and / or the optical microscope and thereby positions the object receiving device. For example, the object receiving device is disposed in a sample chamber of the particle irradiation system and / or the optical microscope. Thus, when the holding current is supplied to the motor, the motor maintains the object receiving device in the desired position of the object receiving device in the sample chamber of the particle irradiation system and / or the optical microscope and thereby positions the object receiving device.

[0023] The method of the present invention further provides that, based on heat generated by the motor (the heat is generated by the second current value of the power supply current and is supplied to the object receiving device), the second temperature of the object receiving device is changed from the second temperature value of the object receiving device to a third temperature value of the object receiving device. The third temperature value of the object receiving device is within a temperature range that satisfies the following conditions:

[0024] TOT1-15℃≤TOT3≤TOT1+15℃ [1],

[0025] in

[0026] TOT1 is the first temperature value of the object receiving device, and wherein

[0027] TOT3 is a third temperature value of the object receiving device.

[0028] In other words, the third temperature value of the object receiving device is within a range of ±15° C. around the first temperature value of the stage.

[0029] The method of the present invention is based on the surprising realization that heat generated by a motor configured to move and position an object receiving device is used to counteract changes in a second temperature of the object receiving device. The greater the second current value of the power supply current, the greater the heat generated by the motor. For example, if the second temperature of the object receiving device decreases undesirably, the heat from the motor can be used to increase the second temperature of the object receiving device. Alternatively, if the second temperature of the object receiving device increases undesirably, the heat from the motor can be used to decrease the second temperature of the object receiving device. In the latter case, for example, less heat is generated by the motor and delivered to the object receiving device, causing the second temperature of the object receiving device to decrease.

[0030] The method of the present invention reduces and / or minimizes the effect of changes in the first temperature of an object on the second temperature of an object receiving device. By reducing and / or minimizing this effect, the second temperature of the object receiving device does not change or changes only slightly, thereby reducing thermally induced length changes in the object receiving device and the accompanying drift of the object receiving device compared to the prior art. This allows the drift of the object receiving device, after the object has cooled and after reaching the desired object temperature, to reach the value it had before cooling the object as quickly as possible.

[0031] In one embodiment of the method according to the invention, it is additionally or alternatively proposed that the object is arranged at an object holder. The object holder is arranged at the object receiving device. In this embodiment, the object receiving device is designed as a carrier, for example. Changing the first temperature of the object comprises changing the third temperature of the object holder from the first temperature value of the object holder to the second temperature value of the object holder. For example, the object holder is cooled and / or heated from the first temperature value of the object holder to the second temperature value of the object holder. Thus, changing the third temperature of the object holder comprises, for example, cooling and / or heating the object holder. The object holder is arranged, for example, at a movable carrier of a particle irradiation device and / or an optical microscope. This embodiment also has the advantages already mentioned above.

[0032] In one embodiment of the method according to the invention, it is additionally or alternatively provided that the third temperature of the object holder is changed by cooling or heating the object holder. For this purpose, for example, at least one cooling and / or heating device of the particle irradiation system and / or the optical microscope is used, which acts on the object holder and / or is arranged at the object holder.

[0033] In another embodiment of the method of the present invention, additionally or alternatively, it is proposed to change the first temperature of the object by cooling or heating the object. For this purpose, for example, at least one cooling and / or heating device of the particle radiation device and / or the optical microscope is used, and the cooling and / or heating device acts on the object and / or is arranged at the object.

[0034] In another embodiment of the method of the present invention, additionally or alternatively, it is proposed to use a stepper motor as the motor, where the supply current is the holding current of the stepper motor. The stepper motor has, for example, the design explained below. The stepper motor is equipped with a rotor that is rotatably arranged in the stepper motor. The stepper motor additionally has coils arranged around the rotor. The coils provide a controlled, step-by-step rotating electromagnetic field, by means of which the rotor can rotate a minimum angle or a multiple of this minimum angle. In this way, a certain number of steps per rotation of the rotor can be achieved. The stepper motor provides, for example, 100 steps per rotation. In a stepper motor with 100 steps per rotation, the rotor rotates, for example, 3.6° in each full step. With such a stepper motor, in addition to the full-step mode of operation of the stepper motor, there can also be a so-called micro-step mode of operation. Refer to the conclusions drawn above, and these conclusions still apply here.

[0035] In yet another embodiment of the method of the present invention, additionally or alternatively, it is proposed to use a brushless motor as the motor, where the supply current is the holding current of the brushless motor.

[0036] It should be explicitly pointed out that the present invention is not limited to the use of a stepper motor or a brushless motor. Instead, any motor that is current-controlled and outputs heat can be used for the present invention.

[0037] In yet another embodiment of the method of the present invention, additionally or alternatively, it is proposed that when changing the first temperature of the object, the object is cooled and the supply current is changed such that the following holds: TOT1>TOT2 and TOT2<TOT, where TOT2 is the second temperature value of the object receiving device. In other words, when changing the first temperature of the object, the object receiving device is cooled and the supply current is changed so as to satisfy two conditions. On the one hand, the first temperature value of the object receiving device is greater than the second temperature value of the object receiving device. On the other hand, the second temperature value of the object receiving device is less than the third temperature value of the object receiving device.

[0038] In one embodiment of the method according to the invention, additionally or alternatively, it is proposed that when changing the first temperature of the object, the object is cooled with liquid nitrogen and the supply current is changed such that the following holds: TOT1>TOT2 and TOT2<TOT3, where TOT2 is the second temperature value of the object receiving device. In this embodiment, it is also proposed that when changing the first temperature of the object, the object is cooled and the supply current is changed so as to satisfy two conditions. On the one hand, the first temperature value of the object receiving device is greater than the second temperature value of the object receiving device. On the other hand, the second temperature value of the object receiving device is less than the third temperature value of the object receiving device.

[0039] In another embodiment of the method according to the invention, additionally or alternatively, it is proposed that when changing the first temperature of the object, the object is cooled with liquid helium and the supply current is changed such that the following holds: TOT1>TOT2 and TOT2<TOT3, where TOT2 is the second temperature value of the object receiving device. In this embodiment, it is also proposed that when changing the first temperature of the object, the object is cooled and the supply current is changed so as to satisfy two conditions. On the one hand, the first temperature value of the object receiving device is greater than the second temperature value of the object receiving device. On the other hand, the second temperature value of the object receiving device is less than the third temperature value of the object receiving device.

[0040] In yet another embodiment of the method according to the invention, additionally or alternatively, the change of the second temperature of the object receiving device from the second temperature value of the object receiving device to the third temperature value of the object receiving device is carried out such that the third temperature value of the object receiving device corresponds to the first temperature value of the object receiving device. In other words, the change in the second temperature of the object receiving device is offset by the heat generated by the motor such that the second temperature of the object receiving device is again the initial temperature value before the change of the first temperature of the object or is substantially the initial temperature value, where the initial temperature value corresponds to the first temperature value of the object receiving device. In this embodiment of the method according to the invention, the drift of the object receiving device that existed before the change of the first temperature of the object is substantially obtained.

[0041] In yet another embodiment of the method according to the present invention, it is additionally or alternatively provided that the second temperature of the object receiving device is changed from the second temperature value to the third temperature value as follows, such that the following holds: TOT1-15°C ≤ TOT3 ≤ TOT1. In other words, the third temperature value of the object receiving device is within a range defined by a temperature 15°C lower than the first temperature value of the object receiving device and the first temperature value of the object receiving device itself. The range boundary is also included in the range. In yet another embodiment of the method according to the present invention, it is additionally or alternatively provided that the second temperature of the object receiving device is changed from the second temperature value to the third temperature value as follows, such that the following holds: TOT1 ≤ TOT3 ≤ TOT1+15°C. In other words, the third temperature value of the object receiving device is within a range defined by the first temperature value of the object receiving device itself and a temperature 15°C higher than the first temperature value of the object receiving device. The range boundary is also included in the range.

[0042] In one embodiment of the method according to the present invention, additionally or alternatively, the power supply current is changed such that the following holds true: I2 > I1, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, to secure the object receiving device at a certain position in the particle irradiation system and / or optical microscope using the motor, the power supply current of the motor is changed such that the second current value of the power supply current is greater than the first current value of the power supply current. This generates more heat in the motor, which is transferred to the object receiving device.

[0043] In another embodiment of the method according to the present invention, it is additionally or alternatively provided that the power supply current is changed such that the following holds true: I1 > I2, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, in order to secure the object receiving device at a certain position in the particle irradiation system and / or optical microscope using the motor, the power supply current of the motor is changed such that the second current value of the power supply current is less than the first current value of the power supply current. This results in less heat being generated by the motor, which is transferred to the object receiving device.

[0044] In yet another embodiment of the method according to the present invention, it is additionally or alternatively provided that the supply current is changed so that the following holds true: I2>I1, where I1 is the first current value of the supply current and where I2 is the second current value of the supply current. This embodiment of the method according to the present invention is distinguished by the additional feature that the supply current is kept constant at the second current value after reaching the second current value of the supply current. For example, it can additionally be provided that after the change of the first temperature of the object has been completed (in particular after the cooling of the object fixture has been completed), the supply current is changed from the second current value back to the first current value of the supply current. This will be explained further below.

[0045] In one embodiment of the method according to the invention, it is additionally or alternatively provided that the supply current is changed so that the following holds true: I1>I2, where I1 is the first current value of the supply current and I2 is the second current value of the supply current. This embodiment of the method according to the invention is distinguished by the additional feature that the supply current is kept constant at the second current value after reaching the second current value of the supply current. For example, it can additionally be provided that after the change in the first temperature of the object has been completed (in particular after the heating of the object fixture has been completed), the supply current is changed from the second current value back to the first current value of the supply current. This will be explained further below.

[0046] In yet another embodiment of the method according to the present invention, additionally or alternatively, the power supply current is changed when the first temperature of the object reaches or falls below a first predeterminable temperature value during the change. For example, when the object is cooled and the first temperature reaches the first predeterminable temperature value, the power supply current is changed as explained above and further below. Alternatively, in this embodiment of the method according to the present invention, the power supply current is changed when the object is cooled and the first temperature falls below the first predeterminable temperature value. In the above embodiment, the power supply current is changed such that the following holds: I2 > I1, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, in order to secure the object receiving device at a certain position in the particle irradiation system and / or optical microscope using the motor, the power supply current of the motor is changed such that the second current value of the power supply current is greater than the first current value of the power supply current. This generates more heat by the motor, which is transferred to the object receiving device.

[0047] In one embodiment of the method according to the present invention, additionally or alternatively, the power supply current is changed when the first temperature of the object reaches or exceeds a second predeterminable temperature value during the change. For example, when the object is heated and the first temperature reaches the first predeterminable temperature value, the power supply current is changed as explained above or further below. Alternatively, in this embodiment of the method according to the present invention, the power supply current is changed when the object is heated and the first temperature exceeds the first predeterminable temperature value. In the above embodiment, the power supply current is changed such that the following holds: I1 > I2, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, to secure the object receiving device at a certain position in the particle irradiation system and / or optical microscope using the motor, the power supply current of the motor is changed such that the first current value of the power supply current is greater than the second current value of the power supply current. This results in less heat being generated by the motor, which is then transferred to the object receiving device.

[0048] In yet another embodiment of the method according to the present invention, additionally or alternatively, the power supply current is changed when the third temperature of the object holder reaches or falls below a first predeterminable temperature value during the change. For example, when the object holder cools and the third temperature reaches the first predeterminable temperature value, the power supply current is changed as explained above and further below. Alternatively, in this embodiment of the method according to the present invention, the power supply current is changed when the object holder cools and the third temperature falls below the first predeterminable temperature value. In the above embodiment, the power supply current is changed such that the following holds: I2 > I1, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, to secure the object receiving device at a certain position in the particle irradiation system and / or optical microscope using the motor, the power supply current of the motor is changed such that the second current value of the power supply current is greater than the first current value of the power supply current. This generates more heat by the motor, which is transferred to the object receiving device.

[0049] In one embodiment of the method according to the present invention, additionally or alternatively, the power supply current is changed when the third temperature of the object holder reaches or exceeds a second predeterminable temperature value during the change. For example, when the object holder is heated and the first temperature of the object holder reaches the first predeterminable temperature value, the power supply current is changed as explained above or further below. Alternatively, in this embodiment of the method according to the present invention, the power supply current is changed when the object holder is heated and the third temperature of the object holder exceeds the first predeterminable temperature value. In the above embodiment, the power supply current is changed such that the following holds: I1 > I2, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, to secure the object receiving device at a certain position in the particle irradiation system and / or optical microscope using the motor, the power supply current of the motor is changed such that the first current value of the power supply current is greater than the second current value of the power supply current. This results in less heat being generated by the motor, which is transferred to the object receiving device.

[0050] In another embodiment of the method according to the present invention, additionally or alternatively, the supply current of the motor is changed from the second current value to the first current value when the following two conditions are met: (i) the change in the first temperature of the object has concluded, and (ii) the first temperature of the object is a third temperature value within a range between the first and second temperature values ​​of the object. When the change in the first temperature of the object has concluded and the first temperature of the object has returned toward the initial first temperature value, the supply current of the motor is changed back from the second current value to the initial current value, i.e., the first current value. This prevents unnecessary heating of the object receiving device.

[0051] In yet another embodiment of the method of the present invention, additionally or alternatively, the supply current of the motor is changed from the second current value to a third current value when the following three conditions are met: (i) the change in the first temperature of the object has concluded, (ii) the first temperature of the object is a third temperature value within a range between the first temperature value and the second temperature value of the object, and (iii) a predeterminable time period has elapsed after the change in the first temperature of the object has concluded. In other words, after the predeterminable time period has elapsed, when the change in the first temperature of the object has concluded and when the first temperature of the object has again moved toward the initial first temperature value, the supply current of the motor is changed back from the second current value to the initial current value, i.e., the first current value. This also prevents unnecessary heating of the object receiving device.

[0052] In yet another embodiment of the method according to the present invention, it is additionally or alternatively provided that the supply current of the motor is changed from the second current value to the first current value when the following two conditions are met: (i) the change in the first temperature of the object has been completed, and (ii) the first temperature of the object reaches or exceeds a predeterminable first temperature threshold. This embodiment of the method according to the present invention is particularly advantageous when the object is heated again after cooling. The supply current of the motor is then changed back from the second current value to the initial current value, i.e., the first current value. This prevents unnecessary heating of the object receiving device.

[0053] In one embodiment of the method according to the present invention, additionally or alternatively, the supply current of the motor is changed from the second current value to the first current value when the following two conditions are met: (i) the change in the first temperature of the object has been completed, and (ii) the first temperature of the object has reached or fallen below a predeterminable second temperature threshold. This embodiment of the method according to the present invention is particularly advantageous when the object cools down again after being heated. The supply current of the motor is then changed back from the second current value to the initial current value, i.e., the first current value. This prevents unnecessary cooling of the object receiving device.

[0054] In another embodiment of the method of the present invention, additionally or alternatively, the supply current of the motor is changed from the second current value to the first current value when the following two conditions are met: (i) the change in the third temperature of the object holder has been completed, and (ii) the third temperature of the object holder is a third temperature value within a range between the first and second temperature values ​​of the object holder. When the change in the third temperature of the object holder has been completed and the third temperature of the object holder has moved back toward the initial first temperature value, the supply current of the motor is changed back from the second current value to the initial current value, i.e., the first current value. This prevents unnecessary heating of the object receiving device.

[0055] In yet another embodiment of the method of the present invention, additionally or alternatively, the supply current of the motor is changed from the second current value to the third current value when the following three conditions are met: (i) the change in the third temperature of the object holder has been completed, (ii) the third temperature of the object holder is a third temperature value within the range between the first temperature value and the second temperature value of the object holder, and (iii) a predeterminable time period has elapsed after the change in the third temperature of the object holder has been completed. In other words, after the predeterminable time period has elapsed, when the change in the third temperature of the object holder has been completed and when the third temperature of the object holder has again moved toward the initial first temperature value, the supply current of the motor is changed back from the second current value to the initial current value, i.e., the first current value. This also prevents unnecessary heating of the object receiving device.

[0056] In yet another embodiment of the method according to the present invention, it is additionally or alternatively provided that the supply current of the motor is changed from the second current value to the first current value when the following two conditions are met: (i) the change in the third temperature of the object holder has been completed, and (ii) the third temperature of the object holder reaches or exceeds a predeterminable first temperature threshold. This embodiment of the method according to the present invention is particularly advantageous when the object holder heats up again after cooling. The supply current of the motor is then changed back from the second current value to the initial current value, i.e., the first current value. This prevents unnecessary heating of the object receiving device.

[0057] In one embodiment of the method according to the present invention, additionally or alternatively, the supply current of the motor is changed from the second current value to the first current value when the following two conditions are met: (i) the change in the third temperature of the object holder has been completed, and (ii) the third temperature of the object holder has reached or fallen below a predeterminable second temperature threshold. This embodiment of the method according to the present invention is particularly advantageous when the object holder cools down again after being heated. The supply current of the motor is then changed back from the second current value to the initial current value, i.e., the first current value. This prevents unnecessary cooling of the object receiving device.

[0058] In another embodiment of the method according to the present invention, it is additionally or alternatively provided that, before changing the first temperature of the object, the value of the second current value of the supply current is determined so that the second temperature of the object receiving device reaches the third temperature value. This method step of this embodiment of the method according to the present invention does not necessarily have to be performed by the user of the particle irradiation system and / or the optical microscope. Rather, it can also be performed in the factory by the manufacturer of the particle irradiation system and / or the optical microscope. For example, it is provided that the values ​​of the second current value of the supply current are stored in a database depending on the second temperature of the object receiving device and the first temperature of the object. The second current value of the supply current is first loaded from the database into the control unit of the particle irradiation system, depending on the desired value of the third temperature value of the object receiving device and the current second temperature value of the object. The loaded second current value of the supply current is then supplied to the motor, so that the heat subsequently generated by the motor affects the second temperature of the object receiving device, thereby setting the second temperature of the object receiving device to the third temperature value of the object receiving device.

[0059] In yet another embodiment of the method of the present invention, it is additionally or alternatively proposed that determining the second current value of the power supply current comprises the following steps:

[0060] - setting the first temperature of the object to a plurality of different second temperature values ​​of the object; and

[0061] - determining a second current value of the power supply current for each of the multiple different second temperature values ​​of the object, wherein when the determined second current value is sent to the motor, the second temperature of the object receiving device is changed from the second temperature value of the object receiving device to the third temperature value of the object receiving device.

[0062] In particular, it is proposed that determining the numerical value of the second current value of the supply current includes determining, by extrapolation and / or interpolation, a functional relationship between the different second temperature values ​​of the object and the determined second current values ​​of the supply current and a third temperature value to be achieved of the object receiving device. Any suitable interpolation method can be used for interpolation, such as linear interpolation, nonlinear interpolation, trigonometric interpolation, exponential interpolation, and / or spline interpolation. Any suitable extrapolation method can be used for extrapolation, such as linear interpolation, nonlinear interpolation, trigonometric interpolation, and / or exponential interpolation. Additionally or alternatively, determining the functional relationship can be performed by forming a median from a certain number of first and second values, obtaining a random value, and / or determining a minimum or maximum value.

[0063] In another embodiment of the method according to the present invention, it is additionally or alternatively provided that, before changing the third temperature of the object holder, a determination is made as to what value the second current value of the supply current should have so that the second temperature of the object receiving device reaches the third temperature value. This method step of this embodiment of the method according to the present invention does not necessarily have to be performed by the user of the particle irradiation system and / or the optical microscope. Rather, it can also be performed in the factory by the manufacturer of the particle irradiation system and / or the optical microscope. For example, it is provided that the values ​​of the second current value of the supply current are stored in a database depending on the second temperature of the object receiving device and the third temperature of the object holder. The second current value of the supply current is then first loaded from the database into the control unit of the particle irradiation system, depending on the desired value of the third temperature of the object receiving device and the current second temperature value of the object holder. The loaded second current value of the supply current is then supplied to the motor, so that the heat subsequently generated by the motor affects the second temperature of the object receiving device, thereby setting the second temperature of the object receiving device to the third temperature value of the object receiving device.

[0064] In yet another embodiment of the method of the present invention, it is additionally or alternatively proposed that determining the value of the second current value of the power supply current comprises the following steps:

[0065] - setting the third temperature of the object holder to a plurality of different second temperature values ​​of the object holder; and

[0066] - determining a second current value of the power supply current for each of the multiple different second temperature values ​​of the object fixing part, wherein when the determined second current value is sent to the motor, the second temperature of the object receiving device is changed from the second temperature value of the object receiving device to the third temperature value of the object receiving device.

[0067] In particular, it is proposed that determining the numerical value of the second current value of the supply current includes determining, by extrapolation and / or interpolation, a functional relationship between the different second temperature values ​​of the object holder and the determined second current values ​​of the supply current and a third temperature value to be achieved of the object receiving device. Any suitable interpolation method can be used for interpolation, such as linear interpolation, nonlinear interpolation, trigonometric interpolation, exponential interpolation, and / or spline interpolation. Any suitable extrapolation method can be used for extrapolation, such as linear interpolation, nonlinear interpolation, trigonometric interpolation, and / or exponential interpolation. Additionally or alternatively, determining the functional relationship can be performed by forming a median from a certain number of first and second values, obtaining a random value, and / or determining a minimum or maximum value.

[0068] The present invention further relates to a computer program product with a program code, which can be or is loaded into a processor of a particle radiation device and / or an optical microscope, wherein the program code, when executed in the processor, controls the particle radiation device and / or the optical microscope in such a way that a method having at least one of the above or following features or a combination of at least two of the above or following features is implemented.

[0069] The present invention also relates to a particle irradiation device for imaging, analyzing, and / or processing an object. The particle irradiation device includes at least one beam generator for generating a particle beam comprising charged particles. These charged particles may be, for example, electrons or ions. Furthermore, the particle irradiation device is equipped with at least one objective lens for focusing the particle beam onto the object. Furthermore, the particle irradiation device may include, for example, at least one scanning device for sweeping the particle beam over the object. Furthermore, the particle irradiation device may include at least one object holder for securing the object. The particle irradiation device of the present invention includes at least one temperature device in the form of a cooling and / or heating device for changing the temperature of the object holder and / or the object. The temperature device may be, for example, a cooling or heating device.

[0070] The particle irradiation system of the present invention also includes at least one movable object receiving device. The object receiving device is, for example, a stage, and the object holder is particularly arranged on the stage. Furthermore, the particle irradiation system of the present invention includes at least one motor for moving the object receiving device. Furthermore, the particle irradiation system of the present invention includes at least one power supply unit for supplying power to the motor.

[0071] The object receiving device of the particle irradiation system according to the present invention is, for example, designed to be movable along a first translation axis (particularly the x-axis), along a second translation axis (particularly the y-axis), and along a third translation axis (particularly the z-axis). The first translation axis, the second translation axis, and the third translation axis are, for example, oriented perpendicularly to one another. Furthermore, the object receiving device is, for example, designed to be rotatable about a first rotational axis and about a second rotational axis oriented perpendicularly to the first rotational axis. In one embodiment of the particle irradiation system according to the present invention, a motor is provided for each of the aforementioned axes, which enables movement along the corresponding axis.

[0072] The particle irradiation system of the present invention is also equipped with at least one detector for detecting interaction particles and / or interaction radiation resulting from the interaction of the particle beam with the object. The particle irradiation system of the present invention is also equipped with at least one display device for displaying images of the object and / or analysis results. Furthermore, the particle irradiation system of the present invention has at least one control unit with a processor, into which the aforementioned computer program product is loaded.

[0073] In one embodiment of the particle irradiation device according to the present invention, the motor is additionally or alternatively configured as a stepper motor, wherein the supply current is the holding current of the stepper motor. The stepper motor has, for example, the design described below. The stepper motor is equipped with a rotor rotatably arranged within the stepper motor. The stepper motor also has coils arranged around the rotor. The coils provide a controlled, gradually rotating electromagnetic field, which allows the rotor to rotate through a minimum angle or multiples of this minimum angle. This allows for a certain number of steps per rotor rotation. For example, the stepper motor provides 100 steps per rotation. In a stepper motor with 100 steps per rotation, the rotor rotates, for example, by 3.6° per full step. In addition to full-step operation, such stepper motors can also operate in a so-called microstepping mode. Microstepping provides steps that are smaller than full steps. To achieve this, the step angle is reduced. Please refer to the embodiments discussed above; the conclusions still apply here.

[0074] In another embodiment of the particle radiation device according to the invention, it is additionally or alternatively provided that the motor is designed as a brushless motor, wherein the supply current is a holding current of the brushless motor.

[0075] It should be pointed out explicitly that the present invention is not limited to the use of stepper motors or brushless motors. Rather, any motor that is actuated with current and outputs heat can be used for the present invention.

[0076] In yet another embodiment of the particle irradiation system according to the present invention, it is additionally or alternatively provided that the particle irradiation system includes at least one temperature measuring unit for measuring the temperature of the object holder and / or the object receiving device and / or the object. The temperature measuring unit can be, for example, an infrared measuring device or a semiconductor temperature sensor. However, the present invention is not limited to the use of such temperature measuring units. Rather, any temperature measuring unit suitable for the present invention can be used as the temperature measuring unit.

[0077] In one embodiment of the particle irradiation system according to the present invention, it is additionally or alternatively provided that the beam generator is designed as a first beam generator, wherein the particle beam is formed as a first particle beam comprising first charged particles, and wherein the objective lens is designed as a first objective lens, the first objective lens being used to focus the first particle beam onto the object. Furthermore, the particle irradiation system has at least one second beam generator for generating a second particle beam comprising second charged particles, and a second objective lens for focusing the second particle beam onto the object.

[0078] In another embodiment of the particle irradiation device according to the present invention, it is provided that the particle irradiation device is an electron irradiation device and / or an ion irradiation device.

[0079] The present invention also relates to an optical microscope for imaging, analyzing, and / or processing an object. The optical microscope comprises at least one light source for generating light and at least one optical unit for directing the light onto the object. Furthermore, the optical microscope of the present invention is equipped with at least one object holder for securing the object. The optical microscope of the present invention comprises at least one temperature device in the form of a cooling and / or heating device for changing the temperature of the object holder and / or the object. The temperature device can be configured, for example, as a cooling or heating device.

[0080] The optical microscope of the present invention also includes at least one movable object receiving device. The object receiving device is, for example, formed as a stage, and the object holder is particularly arranged on the stage. Furthermore, the optical microscope of the present invention includes at least one motor for moving the object receiving device. Furthermore, the optical microscope of the present invention includes at least one power supply unit for supplying power to the motor.

[0081] The object receiving device of the optical microscope according to the present invention is, for example, designed to be movable along a first translation axis (particularly the x-axis), along a second translation axis (particularly the y-axis), and along a third translation axis (particularly the z-axis). The first translation axis, the second translation axis, and the third translation axis are, for example, oriented perpendicularly to one another. Furthermore, the object receiving device is, for example, designed to be rotatable about a first rotational axis and about a second rotational axis oriented perpendicularly to the first rotational axis. In one embodiment of the optical microscope according to the present invention, a motor is provided for each of the aforementioned axes, which enables movement along the corresponding axis.

[0082] Furthermore, the optical microscope according to the invention has at least one control unit with a processor, into which the aforementioned computer program product is loaded.

[0083] In one embodiment of the optical microscope of the present invention, it is additionally or alternatively proposed that the motor is formed as a stepper motor, wherein the power supply current is the holding current of the stepper motor. The stepper motor has, for example, a design explained below. The stepper motor is equipped with a rotor that is rotatably arranged in the stepper motor. The stepper motor also has coils arranged around the rotor. The coils provide a controlled, gradually rotating electromagnetic field, using which the rotor can rotate a minimum angle or multiples of this minimum angle. In this way, a certain number of steps can be achieved per rotor rotation. The stepper motor provides, for example, 100 steps per rotation. In a stepper motor that rotates 100 steps per rotation, the rotor rotates, for example, 3.6° in each full step. In addition to the full-step operating mode of the stepper motor, such a stepper motor can also have a so-called micro-step operating mode. In the micro-step operating mode, a step width smaller than a full step is provided. To achieve this, the step angle is reduced. Please refer to the embodiment described above, as these conclusions still apply here.

[0084] In another embodiment of the optical microscope according to the invention, it is additionally or alternatively provided that the motor is designed as a brushless motor, wherein the supply current is a holding current of the brushless motor.

[0085] It should be pointed out explicitly that the present invention is not limited to the use of stepper motors or brushless motors. Rather, any motor that is actuated with current and outputs heat can be used for the present invention.

[0086] In yet another embodiment of the optical microscope according to the present invention, it is additionally or alternatively provided that the optical microscope includes at least one temperature measuring unit for measuring the temperature of the object holder and / or the object receiving device and / or the object. The temperature measuring unit may be, for example, an infrared measuring device or a semiconductor temperature sensor. However, the present invention is not limited to the use of such temperature measuring units. Rather, any temperature measuring unit suitable for the present invention may be used as the temperature measuring unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0087] The present invention will be described in detail below with the aid of embodiments by means of the accompanying drawings. In the accompanying drawings:

[0088] Figure 1 A first embodiment of a particle irradiation device is shown;

[0089] Figure 2 A second embodiment of a particle irradiation device is shown;

[0090] Figure 3 A third embodiment of a particle irradiation device is shown;

[0091] Figure 3A A schematic diagram showing an optical microscope;

[0092] Figure 4 A schematic diagram showing an embodiment of a movably formed object stage for a particle irradiation device and / or an optical microscope;

[0093] Figure 5 Show the basis Figure 4 Another schematic diagram of the stage;

[0094] Figure 6 A schematic diagram showing a flow chart of a first embodiment of the method of the present invention;

[0095] Figure 7 A schematic diagram showing a flow chart of a second embodiment of the method of the present invention;

[0096] Figure 8 A schematic diagram showing a flow chart of a third embodiment of the method of the present invention;

[0097] Figure 9 A schematic diagram showing a flow chart of a fourth embodiment of the method of the present invention;

[0098] Figure 10 A schematic diagram showing a flow chart of a fifth embodiment of the method of the present invention;

[0099] Figure 11 A schematic diagram showing a flow chart of a sixth embodiment of the method of the present invention;

[0100] Figure 12 A schematic diagram showing a flow chart of a seventh embodiment of the method of the present invention;

[0101] Figure 13 A schematic diagram showing a flow chart of an eighth embodiment of the method of the present invention;

[0102] Figure 14 A schematic diagram showing a flow chart of a ninth embodiment of the method of the present invention;

[0103] Figure 15 A schematic diagram showing a flow chart of an embodiment of the method according to the invention for determining a current value;

[0104] Figure 16 a diagram showing that the current value of the power supply current of the motor depends on the temperature of the object fixture; and

[0105] Figure 17 A schematic diagram of a flow chart showing a tenth specific embodiment of the method according to the invention. DETAILED DESCRIPTION

[0106] The invention is now explained in detail with the aid of a particle irradiation device in the form of an SEM and in the form of a combined device with an electron irradiation column and a particle irradiation column. It is explicitly pointed out that the invention can be used in any particle irradiation device, in particular in any electron irradiation device and / or any ion irradiation device.

[0107] Figure 1 A schematic diagram of an SEM 100 is shown. SEM 100 includes a first beam generator in the form of an electron source 101, which serves as a cathode. Furthermore, SEM 100 is provided with an extraction electrode 102 and an anode 103, which is plugged into one end of a beam guide tube 104 of SEM 100. For example, electron source 101 may be a thermal field emitter. However, the present invention is not limited to this type of electron source 101. Rather, any electron source may be used.

[0108] Electrons emitted from electron source 101 form a primary electron beam. Due to the potential difference between electron source 101 and anode 103, the electrons are accelerated to the anode potential. In the embodiment shown here, the anode potential is 100 V to 35 kV, for example, 5 kV to 15 kV, and particularly 8 kV, relative to the ground potential of the housing of sample chamber 120. However, it may alternatively be at ground potential.

[0109] Two converging lenses, namely a first converging lens 105 and a second converging lens 106, are arranged on the beam guide tube 104. Here, starting from the electron source 101 and viewed in the direction of the first objective lens 107, the first converging lens 105 is arranged first and then the second converging lens 106. It should be explicitly pointed out that other embodiments of the SEM 100 can have only a single converging lens. A first baffle unit 108 is arranged between the anode 103 and the first converging lens 105. The first baffle unit 108, together with the anode 103 and the beam guide tube 104, is at a high voltage potential, i.e., the potential of the anode 103 or ground. The first baffle unit 108 has a plurality of first baffle openings 108A, which are located at the anode 103 and the beam guide tube 104. Figure 1 One of them is shown in FIG. For example, there are two first baffle openings 108A. Each of the multiple first baffle openings 108A has a different opening diameter. With the help of an adjustment mechanism (not shown), the desired first baffle opening 108A can be adjusted to the optical axis OA of the SEM 100. It should be explicitly pointed out that in other embodiments, the first baffle unit 108 can be provided with only a single first baffle opening 108A. In such an embodiment, an adjustment mechanism may not be provided. The first baffle unit 108 is now formed to be fixed in position. A second baffle unit 109 is arranged between the first converging lens 105 and the second converging lens 106. Instead, it is proposed that the second baffle unit 109 is formed to be movably formed.

[0110] The first objective lens 107 has a pole shoe 110 in which a through hole is formed. The beam guide tube 104 is guided through this through hole. A coil 111 is arranged in the pole shoe 110 .

[0111] An electrostatic deceleration device is arranged in the lower region of beam guide tube 104. This deceleration device comprises a single electrode 112 and a tubular electrode 113. Tubular electrode 113 is arranged at the end of beam guide tube 104 facing object 125, which is held on object mount 114. Object mount 114 will be explained further below. Tubular electrode 113 and beam guide tube 104 are at the potential of anode 103, while single electrode 112 and object 125 are at a lower potential relative to anode 103. In this case, this is the ground potential of the housing of sample chamber 120. This allows the electrons of the primary electron beam to be decelerated to the desired energy required for studying object 125.

[0112] The SEM 100 also has a scanning device 115, by which the primary electron beam can be deflected and scanned over an object 125. Electrons of the primary electron beam interact with the object 125. As a result of this interaction, detected interaction particles are generated. These interaction particles include, in particular, electrons emitted from the surface of the object 125—so-called secondary electrons—or electrons of the primary electron beam that are backscattered—so-called backscattered electrons.

[0113] The object 125 and the individual electrodes 112 can also be at different potentials, different from ground. This makes it possible to adjust the deceleration position of the primary electron beam relative to the object 125. If, for example, the deceleration takes place relatively close to the object 125, imaging errors are smaller.

[0114] To detect secondary electrons and / or backscattered electrons, a detector assembly comprising a first detector 116 and a second detector 117 is arranged in the beam guide tube 104. The first detector 116 is arranged on the source side along the optical axis OA, while the second detector 117 is arranged on the object side of the beam guide tube 104 along the optical axis OA. The first detector 116 and the second detector 117 are arranged offset relative to one another in the direction of the optical axis OA of the SEM 100. The first detector 116 and the second detector 117 each have a passage opening through which the primary electron beam can pass. The first detector 116 and the second detector 117 are approximately at the potential of the anode 103 and the beam guide tube 104. The optical axis OA of the SEM 100 extends through the respective passage openings.

[0115] The second detector 117 is primarily used to detect secondary electrons. When leaving the object 125, the secondary electrons initially have relatively low kinetic energy and an arbitrary direction of movement. The strong suction field emitted by the tubular electrode 113 accelerates the secondary electrons in the direction of the first objective lens 107. The secondary electrons enter the first objective lens 107 approximately parallel to each other. The beam diameter of the secondary electron beam is also kept small in the first objective lens 107. The first objective lens 107 now acts strongly on the secondary electrons and produces a relatively short secondary electron focus with a sufficiently steep angle relative to the optical axis OA, so that after focusing, the secondary electrons further disperse from one another and strike the second detector 117 over its effective area. In contrast, only a small portion of the electrons backscattered at the object 125 (i.e., backscattered electrons having a relatively high kinetic energy relative to the secondary electrons when leaving the object 125) are recorded by the second detector 117. The high kinetic energy of the backscattered electrons and the angle relative to the optical axis OA when leaving the object 125 result in the beam waist of the backscattered electrons, i.e. the beam region with the smallest diameter, being located near the second detector 117. A large portion of the backscattered electrons passes through the passage opening of the second detector 117. The first detector 116 is therefore essentially used to record the backscattered electrons.

[0116] In another embodiment of the SEM 100, the first detector 116 can be formed to additionally include a backfield grid 116A. Backfield grid 116A is arranged on the side of the first detector 116 directed toward the object 125. Backfield grid 116A has a negative potential relative to the potential of the beam guide tube 104, so that only backscattered electrons with high energy pass through backfield grid 116A and reach the first detector 116. Additionally or alternatively, the second detector 117 has an additional backfield grid that is similarly formed to the backfield grid 116A of the first detector 116 and has a similar function.

[0117] Furthermore, the SEM 100 has a sample chamber detector 119 in the sample chamber 120 , for example an Everhart-Thornley detector or an ion detector having a light-shielding detection surface coated with metal.

[0118] The detection signals generated by the first detector 116 , the second detector 117 , and the sample chamber detector 119 are used to generate an image of the surface of the object 125 .

[0119] It should be noted that the baffle openings of the first baffle unit 108 and the second baffle unit 109 and the through openings of the first detector 116 and the second detector 117 are shown exaggerated. The through openings of the first detector 116 and the second detector 117 have a size perpendicular to the optical axis OA in the range of 0.5 mm to 5 mm. For example, they are formed into a circular shape and have a diameter perpendicular to the optical axis OA in the range of 1 mm to 3 mm.

[0120] In the embodiment shown, the second baffle unit 109 is configured as an orifice plate and is provided with a second baffle opening 118 for passing the primary electron beam, which has a size in the range of 5 μm to 500 μm, for example 35 μm. Alternatively, in another embodiment, it is proposed that the second baffle unit 109 is provided with a plurality of baffle openings, which can be mechanically deflected toward the primary electron beam or the primary electron beam can reach these baffle openings when using electric and / or magnetic deflection elements. The second baffle unit 109 is formed as a pressure grading plate. The pressure grading plate is to be arranged with the electron source 101 and an ultra-high vacuum prevails (10 -7 hPa to 10 -12 hPa) and the first region with high vacuum (10 -3 hPa to 10 -7 The second region is an intermediate pressure region where the beam guiding tube 104 leads to the sample chamber 120 .

[0121] The sample chamber 120 is under vacuum. In order to generate the vacuum, a pump (not shown) is arranged at the sample chamber 120. Figure 1 In the embodiment shown in FIG, the sample chamber 120 operates within a first pressure range or a second pressure range. The first pressure range only includes less than or equal to 10 -3 hPa, while the second pressure range only includes pressures greater than 10 -3 To ensure these pressure ranges, the sample chamber 120 is vacuum-tight.

[0122] The object holder 114 is arranged at an object receiving device in the form of a stage 122. The stage 122 is formed to be movable in three directions arranged perpendicular to each other, namely in the x-direction (first stage axis), the y-direction (second stage axis), and the z-direction (third stage axis). In addition, the stage 122 can rotate about two rotation axes arranged perpendicular to each other (stage rotation axes). The present invention is not limited to the above-mentioned stage 122. Rather, the stage 122 can have other translation axes and rotation axes, along which or about which the stage 122 can move.

[0123] In another embodiment of the SEM 100, it is provided that the object holder 114 is designed as an object receiving device, for example in the form of a manipulator and / or a gripper for holding the object 125. The object holder 114 is then designed to be movable, for example, as described above and in more detail below with respect to the object stage 122.

[0124] SEM 100 also includes a third detector 121, which is arranged in sample chamber 120. Specifically, third detector 121 is arranged along optical axis OA behind object mount 114, as viewed from electron source 101. Object mount 114 can be rotated so that an object 125 arranged on object mount 114 can be penetrated by the primary electron beam. As the primary electron beam passes through object 125 to be studied, electrons of the primary electron beam interact with the material of object 125 to be studied. Electrons that have passed through object 125 to be studied are detected by third detector 121.

[0125] A radiation detector 500 is arranged in the sample chamber 120 to detect interaction radiation, such as X-ray radiation and / or cathode emission light. The radiation detector 500, the first detector 116, the second detector 117, and the sample chamber detector 119 are connected to a control unit 123, which includes a monitor 124. The third detector 121 is also connected to the control unit 123. For the sake of simplicity, this is not shown in the figure. The control unit 123 processes the detection signals generated by the first detector 116, the second detector 117, the sample chamber detector 119, the third detector 121, and / or the radiation detector 500 and displays them as an image on the monitor 124.

[0126] The control unit 123 has a database 126 in which the control unit 123 can store data and / or from which data can be loaded into a processor of the control unit 123 .

[0127] A cooling and / or heating device 127 is arranged at the object holder 114 , which serves to cool and / or heat the object holder 114 and / or the object 125 . This will be explained in more detail below.

[0128] To determine the first temperature of object 125, the third temperature of object holder 114, and / or the second temperature of stage 122, a temperature measuring unit 128 is disposed in sample chamber 120. Temperature measuring unit 128 may be, for example, an infrared measuring device or a semiconductor temperature sensor. However, the present invention is not limited to the use of such temperature measuring units. Rather, any temperature measuring unit suitable for use in the present invention may be used as the temperature measuring unit.

[0129] The control unit 123 of the SEM 100 has a processor or is formed as a processor. A computer program product is loaded into the processor, which controls the SEM 100 so as to perform the method of the present invention. This will be explained in detail below.

[0130] Figure 2 A particle irradiation device is shown in the form of a combined device 200. The combined device 200 has two particle irradiation columns. On the one hand, the combined device 200 is provided with a SEM 100, as in Figure 1 As shown in FIG, but without the sample chamber 120. Instead, the SEM 100 is arranged at the sample chamber 201. The sample chamber 201 is under vacuum. In order to generate the vacuum, a pump (not shown) is arranged at the sample chamber 201. Figure 2 In the embodiment shown in FIG, the sample chamber 201 operates within a first pressure range or a second pressure range. The first pressure range only includes pressures less than or equal to 10 -3 hPa, while the second pressure range only includes pressures greater than 10 -3 To ensure these pressure ranges, the sample chamber 201 is sealed vacuum-technically.

[0131] A sample chamber detector 119 is arranged in the sample chamber 201. The sample chamber detector 119 is formed as an Everhart-Thornley detector or an ion detector and has a light-shielding detection surface coated with metal. In addition, a third detector 121 is arranged in the sample chamber 201.

[0132] The SEM 100 is used to generate a first particle beam, ie the primary particle beam already described above, and has the optical axis already mentioned above, which is located at Figure 2 The ion beam axis is designated by reference numeral 709 and is also referred to as the first beam axis in the following text. On the other hand, the combined device 200 is provided with an ion irradiation device 300, which is also arranged at the sample chamber 201. The ion irradiation device 300 also has an optical axis, which is located at Figure 2 , is provided with the reference numeral 710 and is also referred to below as the second beam axis.

[0133] The SEM 100 is arranged vertically relative to the sample chamber 201. In contrast, the ion irradiation device 300 is arranged to be tilted at an angle of about 0° to 90° relative to the SEM 100. Figure 2For example, an arrangement of about 50° is shown in FIG. The ion irradiation device 300 has a second beam generator in the form of an ion beam generator 301. Ions are generated by the ion beam generator 301, and these ions constitute a second particle beam in the form of an ion beam. The ions are accelerated by means of an extraction electrode 302 at a preset potential. The second particle beam then passes through the ion optical device of the ion irradiation device 300, wherein the ion optical device has a converging lens 303 and a second objective lens 304. The second objective lens 304 ultimately generates an ion probe, which is focused on the object 125 arranged at the object holder 114. The object holder 114 is arranged at an object receiving device in the form of an object stage 122.

[0134] In another embodiment of the combined device 200, it is provided that the object holder 114 is designed as an object receiving device, for example in the form of a manipulator and / or a gripper for holding the object 125. The object holder 114 is then designed to be movable, for example, as described above and in more detail below with respect to the object stage 122.

[0135] Arranged above the second objective lens 304 (i.e., in the direction of the ion beam generator 301) are an adjustable or selectable baffle 306, a first electrode assembly 307, and a second electrode assembly 308, wherein the first and second electrode assemblies 307 and 308 are configured as scanning electrodes. The second particle beam is scanned across the surface of the object 125 by means of the first and second electrode assemblies 307 and 308, with the first electrode assembly 307 acting in a first direction and the second electrode assembly 308 acting in a second direction opposite to the first. Thus, for example, scanning is performed in the x-direction. By further rotating the electrodes (not shown) at the first and second electrode assemblies 307 and 308 by 90°, scanning is performed in the perpendicular y-direction.

[0136] As described above, the object holder 114 is arranged at the stage 122. Figure 2 In the embodiment shown in , the stage 122 is also movable in three directions perpendicular to each other, namely, the x-direction (first stage axis), the y-direction (second stage axis), and the z-direction (third stage axis). Furthermore, the stage 122 is rotatable about two rotation axes perpendicular to each other (stage rotation axes).

[0137] exist Figure 2 The spacing between the individual units of the combined device 200 shown in FIG. 2 is shown exaggerated in order to better illustrate the individual units of the combined device 200 .

[0138] A radiation detector 500 is arranged at the sample chamber 201, which detects interaction radiation, such as X-ray radiation and / or cathode emission light. The radiation detector 500 is connected to a control unit 123, which has a monitor 124. The control unit 123 processes the detection signals, which are detected by the first detector 116, the second detector 117 (in the Figure 2 ), the sample chamber detector 119, the third detector 121 and / or the radiation detector 500 are generated and displayed on the monitor 124 in the form of an image.

[0139] The control unit 123 has a database 126 in which the control unit 123 can store data and / or from which data can be loaded into a processor of the control unit 123 .

[0140] A cooling and / or heating device 127 is arranged at the object holder 114 , which serves to cool and / or heat the object holder 114 and / or the object 125 . This will be explained in more detail below.

[0141] To determine the first temperature of the object, the third temperature of the object holder 114, and / or the second temperature of the stage 122, a temperature measuring unit 128 is disposed in the sample chamber 201. The temperature measuring unit 128 may be, for example, an infrared measuring device or a semiconductor temperature sensor. However, the present invention is not limited to the use of such temperature measuring units. Rather, any temperature measuring unit suitable for the present invention may be used as the temperature measuring unit.

[0142] The control unit 123 of the combined device 200 has a processor or is formed as a processor. A computer program product is loaded into the processor, and the computer program product controls the combined device 200 so as to perform the method of the present invention. This will be explained in detail below.

[0143] Figure 3 A schematic diagram shows another embodiment of a particle irradiation system according to the present invention. This embodiment of the particle irradiation system is designated by reference numeral 400 and includes a mirror corrector for correcting, for example, color distortion and / or spherical distortion. Particle irradiation system 400 includes a particle irradiation column 401, which is formed as an electron irradiation column and substantially corresponds to the electron irradiation column of a calibrated SEM. Particle irradiation system 400 is not limited to an SEM with a mirror corrector. Rather, the particle irradiation system can include any type of corrector unit.

[0144] The particle radiation column 401 includes a particle beam generator in the form of an electron source 402 (cathode), an extraction electrode 403, and an anode 404. For example, the electron source 402 is formed as a thermal field emitter. Electrons leaving the electron source 402 are accelerated toward the anode 404 due to the potential difference between the electron source 402 and the anode 404. Accordingly, a particle beam in the form of an electron beam is formed along a first optical axis OA1.

[0145] After exiting the electron source 402 , the particle beam is guided along a beam path that corresponds to the first optical axis OA1 . To guide the particle beam, a first electrostatic lens 405 , a second electrostatic lens 406 , and a third electrostatic lens 407 are used.

[0146] Furthermore, the particle beam is steered along the beam path using a beam guide. The beam guide of this embodiment includes a source adjustment unit having two magnetic deflection units 408 arranged along the first optical axis OA1. Furthermore, the particle irradiation device 400 includes an electrostatic beam deflection unit. In another embodiment, a first electrostatic beam deflection unit 409, also in the form of a quadrupole, is arranged between the second electrostatic lens 406 and the third electrostatic lens 407. The first electrostatic beam deflection unit 409 is also arranged after the magnetic deflection unit 408. A first multipole unit 409A, in the form of a first magnetic deflection unit, is arranged on one side of the first electrostatic beam deflection unit 409. Furthermore, a second multipole unit 409B, in the form of a second magnetic deflection unit, is arranged on the other side of the first electrostatic beam deflection unit 409. The first electrostatic beam deflection unit 409, the first multipole unit 409A, and the second multipole unit 409B are adjusted to steer the particle beam relative to the axis of the third electrostatic lens 407 and the entrance window of the beam deflection device 410. The first electrostatic beam deflection unit 409 , the first multipole unit 409A, and the second multipole unit 409B can interact like a Wien filter. A further magnetic deflection element 432 is arranged at the entrance of the beam deflection unit 410 .

[0147] The beam deflection unit 410 serves as a particle beam deflector, deflecting the particle beam in a specific manner. The beam deflection unit 410 includes a plurality of magnetic sectors: a first magnetic sector 411A, a second magnetic sector 411B, a third magnetic sector 411C, a fourth magnetic sector 411D, a fifth magnetic sector 411E, a sixth magnetic sector 411F, and a seventh magnetic sector 411G. A particle beam enters the beam deflection unit 410 along a first optical axis OA1 and is deflected by the beam deflection unit 410 toward a second optical axis OA2. The beam is deflected at an angle of 30° to 120° by the first magnetic sector 411A, the second magnetic sector 411B, and the third magnetic sector 411C. The second optical axis OA2 is oriented at the same angle as the first optical axis OA1. The beam deflection device 410 further deflects the particle beam directed along the second optical axis OA2, specifically in the direction of the third optical axis OA3. The beam deflection is provided by the third magnetic sector 411C, the fourth magnetic sector 411D and the fifth magnetic sector 411E. Figure 3 In the embodiment described herein, the deflection toward the second optical axis OA2 and toward the third optical axis OA3 is achieved by deflecting the particle beam at an angle of 90°. Thus, the third optical axis OA3 extends coaxially with the first optical axis OA1. However, it should be noted that the particle irradiation system 400, in the present invention described herein, is not limited to a deflection angle of 90°. Rather, any suitable deflection angle, such as 70° or 110°, can be selected by the beam deflection device 410, so that the first optical axis OA1 and the third optical axis OA3 do not extend coaxially. For further details of the beam deflection device 410, refer to WO 2002 / 067286 A2.

[0148] After the particle beam has been deflected by the first magnetic sector 411A, the second magnetic sector 411B, and the third magnetic sector 411C, it is directed along the second optical axis OA2. The particle beam is then directed to the electrostatic mirror 414 and, on its way to the electrostatic mirror 414, travels along the fourth electrostatic lens 415, the third multipole unit 416A (in the form of a magnetic deflection unit), the second electrostatic beam deflection unit 416, the third electrostatic beam deflection unit 417, and the fourth multipole unit 416B (in the form of a magnetic deflection unit). The electrostatic mirror 414 includes a first mirror electrode 413A, a second mirror electrode 413B, and a third mirror electrode 413C. Electrons in the particle beam that have been reflected back by the electrostatic mirror 414 travel again along the second optical axis OA2 and reenter the beam deflection device 410. These electrons are then deflected toward the third optical axis OA3 by the third magnetic sector 411C, the fourth magnetic sector 411D, and the fifth magnetic sector 411E.

[0149] Electrons of the particle beam exit the beam deflection device 410 and are directed along the third optical axis OA3 toward the object 425 to be studied and disposed on the object mount 114. On the way to the object 425, the particle beam is directed toward a fifth electrostatic lens 418, a beam guide tube 420, a fifth multipole unit 418A, a sixth multipole unit 418B, and an objective lens 421. The fifth electrostatic lens 418 is an electrostatic immersion lens. The particle beam is braked or accelerated by the fifth electrostatic lens 418 to the potential of the beam guide tube 420.

[0150] The particle beam is focused by objective lens 421 into a focal plane, in which object 425 is arranged. Object holder 114 is arranged at an object receiving device in the form of a movable stage 424. Movable stage 424 is arranged in sample chamber 426 of particle irradiation device 400. Stage 424 is movable in three mutually perpendicular directions: the x-direction (first stage axis), the y-direction (second stage axis), and the z-direction (third stage axis). Furthermore, stage 424 can rotate about two mutually perpendicular rotation axes (stage rotation axes).

[0151] In another embodiment of the particle irradiation system 400, it is provided that the object holder 114 is designed as an object receiving device, for example in the form of a manipulator and / or a gripper for holding the object 425. The object holder 114 is then designed to be movable, for example, as described above and in more detail below with respect to the object stage 424.

[0152] The sample chamber 426 is under vacuum. In order to generate the vacuum, a pump (not shown) is arranged at the sample chamber 426. Figure 3 In the embodiment shown in FIG, the sample chamber 426 operates within a first pressure range or a second pressure range. The first pressure range only includes less than or equal to 10 -3 hPa, while the second pressure range only includes pressures greater than 10 -3 To ensure these pressure ranges, the sample chamber 426 is vacuum-tight.

[0153] Objective lens 421 can be formed as a combination of magnetic lens 422 and sixth electrostatic lens 423. The end of beam guide tube 420 can also be an electrode of the electrostatic lens. Particles from the particle irradiation device—after exiting beam guide tube 420—are braked to the potential of object 425. Objective lens 421 is not limited to a combination of magnetic lens 422 and sixth electrostatic lens 423. Rather, objective lens 421 can take any suitable form. For example, objective lens 421 can also be formed as a purely magnetic lens or a purely electrostatic lens.

[0154] The particle beam focused on object 425 interacts with object 425, generating interacting particles. In particular, secondary electrons are emitted from object 425, or backscattered electrons are backscattered at object 425. The secondary electrons or backscattered electrons are accelerated again and guided along the third optical axis OA3 into beam guide tube 420. The trajectories of the secondary electrons and backscattered electrons, in particular along the beam path of the particle beam, extend in the opposite direction to the particle beam.

[0155] The particle irradiation device 400 includes a first analysis detector 419, which is arranged along the beam path between the beam deflection device 410 and the objective lens 421. Secondary electrons traveling in a direction oriented at a large angle relative to the third optical axis OA3 are detected by the first analysis detector 419. Backscattered electrons and secondary electrons having a small axial spacing relative to the third optical axis OA3 at the position of the first analysis detector 419 (that is, backscattered electrons and secondary electrons having a small spacing from the third optical axis OA3 at the first analysis detector 419) enter the beam deflection device 410 and are deflected by the fifth magnetic sector 411E, the sixth magnetic sector 411F, and the seventh magnetic sector 411G along the detection beam path 427 to the second analysis detector 428. The deflection angle is, for example, 90° or 110°.

[0156] The first analysis detector 419 generates detection signals, which are essentially generated by the emitted secondary electrons. The detection signals generated by the first analysis detector 419 are directed to the control unit 123 and used to obtain information about the characteristics of the interaction range of the focused particle beam with the object 425. In particular, when using a scanning device 429, the focused particle beam is scanned over the object 425. The detection signals generated by the first analysis detector 419 can then be used to generate an image of the scanned area of ​​the object 425 and display it on a display unit. The display unit is, for example, a monitor 124 arranged at the control unit 123.

[0157] The second analysis detector 428 is also connected to the control unit 123. The detection signal of the second analysis detector 428 is guided to the control unit 123 and used to generate an image of the scanned area of ​​the object 425 and display it on a display unit. The display unit is, for example, a monitor 124 arranged at the control unit 123.

[0158] A radiation detector 500 is arranged in the sample chamber 426 to detect interaction radiation, such as X-ray radiation and / or cathode emission light. The radiation detector 500 is connected to the control unit 123, which has a monitor 124. The control unit 123 processes the detection signal of the radiation detector 500 and displays it on the monitor 124 in the form of an image.

[0159] The control unit 123 has a database 126 in which the control unit 123 can store data and / or from which data can be loaded into a processor of the control unit 123 .

[0160] A cooling and / or heating device 127 is arranged at the object holder 114 , which serves to cool and / or heat the object holder 114 and / or the object 425 . This will be explained in more detail below.

[0161] To determine the first temperature of object 425, the third temperature of object holder 114, and / or the second temperature of stage 424, a temperature measuring unit 128 is disposed in sample chamber 426. Temperature measuring unit 128 may be, for example, an infrared measuring device or a semiconductor temperature sensor. However, the present invention is not limited to the use of such temperature measuring units. Rather, any temperature measuring unit suitable for the present invention may be used as the temperature measuring unit.

[0162] The control unit 123 of the particle irradiation device 400 has a processor or is formed as a processor. A computer program product is loaded into the processor, and the computer program product controls the particle irradiation device 400 so as to execute the method of the present invention. This will be explained in detail below.

[0163] Figure 3A A schematic diagram of an optical microscope 800 is shown. The optical microscope 800 includes a light source 801 for generating light and an optical unit 802 for directing the light onto an object 125. Furthermore, the optical microscope 800 is equipped with an object holder 114 for holding the object 125. Furthermore, the optical microscope 800 is formed with a movably formed stage 122, on which the object holder 114 is arranged.

[0164] The stage 122 of the optical microscope 800 is, for example, configured to be movable along a first translation axis (particularly the x-axis), along a second translation axis (particularly the y-axis), and along a third translation axis (particularly the z-axis). The first translation axis, the second translation axis, and the third translation axis are, for example, oriented perpendicularly to one another. Furthermore, the stage 122 is, for example, configured to be rotatable about a first rotation axis and about a second rotation axis oriented perpendicularly to the first rotation axis. In one embodiment of the optical microscope 800, a motor is provided for each of the aforementioned axes, which enables movement along the corresponding axis.

[0165] In another embodiment of the optical microscope 800, it is provided that the object holder 114 is designed as an object receiving device, for example in the form of a manipulator and / or a gripper for holding the object 125. The object holder 114 is then designed to be movable, for example, as described above and further below with respect to the object stage 122.

[0166] The light microscope 800 has a control unit 123 which is equipped with a monitor 124 on which an image of an object 125 captured by the light microscope 800 can be displayed.

[0167] The control unit 123 has a database 126 in which the control unit 123 can store data and / or from which data can be loaded into a processor of the control unit 123 .

[0168] A cooling and / or heating device 127 is arranged at the object holder 114 , which serves to cool and / or heat the object holder 114 and / or the object 125 . This will be explained in more detail below.

[0169] To determine the first temperature of the object, the third temperature of the object holder 114, and / or the second temperature of the stage 122, the optical microscope 800 includes a temperature measuring unit 128. The temperature measuring unit 128 is, for example, an infrared measuring device or a semiconductor temperature sensor. However, the present invention is not limited to the use of such temperature measuring units. Rather, any temperature measuring unit suitable for the present invention may be used as the temperature measuring unit.

[0170] The control unit 123 of the optical microscope 800 has a processor or is formed as a processor. A computer program product is loaded into the processor, which controls the optical microscope 800 so as to perform the method of the present invention. This will be explained in detail below.

[0171] The particle irradiation apparatuses 100, 200, and 400 and the stage 122, 424 of the optical microscope 800 explained above will be described in detail below. The stage 122, 424 is formed as a movable stage. Figure 4 and 5 It is to be noted that the present invention is not limited to the stages 122, 424 described herein. Rather, the present invention may have any movable stage suitable for the present invention.

[0172] The object holder 114 is arranged on the stage 122, 424, in which the object 125, 425 is arranged. The stage 122, 424 has movement elements that ensure the movement of the stage 122, 424 so that a region of interest on the object 125, 425 can be investigated with the aid of the particle beam and / or light beam. Figure 4 and 5 The moving elements are schematically shown in FIG and are described in detail below.

[0173] The sample stage 122, 424 has a first moving element 600, which is arranged, for example, at the housing 601 of the sample chamber 120, 201 or 426 (in which the sample stage 122, 424 is in turn arranged). The first moving element 600 enables the sample stage 122, 424 to be moved along the z-axis (third sample stage axis). In addition, a second moving element 602 is provided. The second moving element 602 enables the sample stage 122, 424 to be rotated about the first sample stage rotation axis 603, which is also called the tilt axis. This second moving element 602 is used to flip the object 125, 425 arranged in the object holder 114 about the first sample stage rotation axis 603.

[0174] Arranged on the second movement element 602 is a third movement element 604, which serves as a guide for a slider and ensures that the sample carrier 122, 424 is movable in the x-direction (first sample carrier axis). The slider is followed by another movement element, namely a fourth movement element 605. The fourth movement element 605 is designed to enable the sample carrier 122, 424 to be movable in the y-direction (second sample carrier axis). To this end, the fourth movement element 605 has a guide in which another slider is guided, and on this slider, the object holder 114 is arranged.

[0175] The object holder 114 is further formed with a fifth movement element 606 which enables the object holder 114 to be rotated about a second stage rotation axis 607. The second stage rotation axis 607 is oriented perpendicular to the first stage rotation axis 603.

[0176] Due to the above arrangement, the worktable 122, 424 of the embodiment discussed here has the following kinematic chain: first moving element 600 (moving along the z-axis) - second moving element 602 (rotating around the first worktable rotation axis 603) - third moving element 604 (moving along the x-axis) - fourth moving element 605 (moving along the y-axis) - fifth moving element 606 (rotating around the second worktable rotation axis 607).

[0177] In another embodiment (not shown), it is provided that further movement elements are arranged on the object stage 122 , 424 , so that a movement along other translation axes and / or about other rotation axes is possible.

[0178] As from Figure 5 As can be seen in the figure, each of the aforementioned moving elements is connected to a drive unit in the form of a motor M1 to M5. Thus, the first moving element 600 is connected to the first drive unit M1 and is driven by the driving force provided by the first drive unit M1. The second moving element 602 is connected to the second drive unit M2, which drives the second moving element 602. The third moving element 604 is in turn connected to the third drive unit M3. The third drive unit M3 provides the driving force for driving the third moving element 604. The fourth moving element 605 is connected to the fourth drive unit M4, which drives the fourth moving element 605. Furthermore, the fifth moving element 606 is connected to the fifth drive unit M5. The fifth drive unit M5 provides the driving force that drives the fifth moving element 606.

[0179] The drive units M1 to M5 can be formed as stepper motors, for example, and can be controlled by the control unit 608 and supplied with power current by the control unit 608 (see Figure 5 ). It should be explicitly pointed out that the present invention is not limited to movement by means of stepper motors. Rather, any drive unit (e.g., a brushless motor) can be used as a drive unit. By supplying power current to the drive units M1 to M5, the drive units M1 to M5 are controlled in such a way that the stage 122, 424 moves to the desired position in the sample chamber 120, 201, 426. The stage 122, 424 is maintained in this desired position by means of the drive units M1 to M5. In other words, the stage 122, 424 should no longer move from this desired position. This is particularly desirable for good resolution and / or accurate imaging of the objects 125, 425 arranged on the stage 122, 424. When the drive units M1 to M5 are shut down, the amplitude of the power current of each of these drive units M1 to M5 is reduced to a pre-settable holding amplitude. The supply current having this holding amplitude is also referred to as a holding current. When the power supply current of each of the driving units M1 to M5 has a holding current, the stage 122, 424 is held in a desired position.

[0180] The method according to the invention will be explained in detail below by way of example with the aid of an SEM 100. The same applies to the combined device 200, the particle irradiation device 400 and the optical microscope 800.

[0181] Figure 6A schematic diagram of a flow chart illustrating one embodiment of the method of the present invention. In method step S1, a third temperature of an object holder 114 (at which an object 125 is arranged) is changed from a first temperature value of the object holder 114 to a second temperature value of the object holder 114 by means of a cooling and / or heating device 127. For example, the object holder 114 is cooled and / or heated from the first temperature value of the object holder 114 to the second temperature value of the object holder 114. Additionally or alternatively, a first temperature of the object 125 is changed from the first temperature value of the object 125 to the second temperature value of the object 125 by means of the cooling and / or heating device 127. For example, the object 125 is cooled and / or heated from the first temperature value of the object 125 to the second temperature value of the object 125.

[0182] The change in the third temperature of object holder 114 and / or the first temperature of object 125 causes the second temperature of stage 122 to change from the first temperature value of stage 122 to the second temperature value of stage 122. In other words, the change in the third temperature of object holder 114 and / or the first temperature of object 125 also causes the second temperature of stage 122 to change.

[0183] In method step S2, the power supply current of the drive units M1 to M5 is changed from a first current value to a second current value. At both the first and second current values ​​of the power supply current, the stage 122 is secured in a desired position within the sample chamber 120 by the drive units M1 to M5. Therefore, the power supply current is a holding current. In other words, when the power supply current has either the first or second current value, the stage 122 is secured in a desired position within the sample chamber 120 by the drive units M1 to M5.

[0184] Now, in method step S3, the first temperature of stage 122 is changed. More specifically, due to the heat generated by drive units M1 to M5 (this heat is generated by the second current value of the power supply current and is supplied to stage 122), the second temperature of stage 122 is changed from the second temperature value of stage 122 to a third temperature value of stage 122. The third temperature value of stage 122 is within a temperature range that satisfies the following conditions:

[0185] TOT1-15℃≤TOT3≤TOT1+15℃, [1]

[0186] in

[0187] TOT1 is the first temperature value of the stage 122, and

[0188] TOT3 is a third temperature value of the stage 122 .

[0189] In other words, the third temperature value of the stage 122 is within a range of ±15° C. around the first temperature value of the stage 122 .

[0190] In one embodiment of the method according to the invention, method steps S1 to S3 are repeated.

[0191] Figure 7 A schematic diagram of a flow chart showing another specific embodiment of the method according to the invention. Figure 7 The implementation method is based on Figure 6 Therefore, please first refer to the implementation schemes obtained above, and these conclusions still apply here. Figure 7 An embodiment provides for cooling the object holder 114 in method step S1A. Accordingly, in method step S1A, a third temperature of the object holder 114, at which the object 125 is arranged, is reduced by means of a cooling and / or heating device 127 from a first temperature value of the object holder 114 to a second temperature value of the object holder 114. Accordingly, the first temperature value of the object holder 114 is greater than the second temperature value of the object holder 114. For cooling, liquid nitrogen or liquid helium is used, for example. The first temperature value of the object holder 114 is, for example, a room temperature value. The second temperature value of the object holder 114 is, for example, less than or equal to -140° C. Additionally or alternatively, Figure 7 Embodiments provide for cooling object 125 in method step S1A. Accordingly, in method step S1A, the first temperature of object 125 is reduced from a first temperature value of object 125 to a second temperature value of object 125 using cooling and / or heating device 127. Accordingly, the first temperature value of object 125 is greater than the second temperature value of object 125. Liquid nitrogen or liquid helium is used for cooling, for example. The first temperature value of object 125 is, for example, room temperature. The second temperature value of object 125 is, for example, less than or equal to -140°C.

[0192] The change in the first temperature of object 125 and / or the third temperature of object holder 114 causes the second temperature of stage 122 to change from the first temperature value of stage 122 to the second temperature value of stage 122. In other words, the change in the first temperature of object 125 and / or the third temperature of object holder 114 also causes the second temperature of stage 122 to change. In the present case, the first temperature value of stage 122 is greater than the second temperature value of stage 122. For example, the first temperature value of stage 122 is room temperature, and the second temperature value of stage 122 is approximately 5°C to 15°C below room temperature.

[0193] In method step S2A, the power supply current of the drive units M1 to M5 is changed from a first current value to a second current value. Figure 7In the embodiment shown, the supply current of drive units M1 to M5 is changed such that the following holds: I2 > I1, where I1 is a first current value of the supply current and where I2 is a second current value of the supply current. In other words, in order to fix the stage 122 in the sample chamber 120 by drive units M1 to M5, the supply current of drive units M1 to M5 is changed such that the second current value of the supply current is greater than the first current value of the supply current. Thereby, more heat is generated by drive units M1 to M5, and this heat is sent to the stage 122.

[0194] Now, in method step S3A, the first temperature of the stage 122 is changed. More precisely, due to the heat generated in drive units M1 to M5 (which is effected by the second current value of the supply current and sent to the stage 122), the second temperature of the stage 122 changes from the second temperature value of the stage 122 to the third temperature value of the stage 122. The third temperature value of the stage 122 lies within the temperature range already mentioned above.

[0195] In the embodiment shown of the method according to the invention Figure 7 it is particularly proposed that the supply current is changed such that the following holds: TOT1 > TOT2 and TOT2 < TOT3, where TOT2 is the second temperature value of the stage 122. In other words, the supply current is changed such that two conditions are met. On the one hand, the first temperature value of the stage 122 is greater than the second temperature value of the stage 122. On the other hand, the second temperature value of the stage 122 is less than the third temperature value of the stage 122.

[0196] In a still further embodiment of the method according to the invention Figure 7 it is additionally or alternatively proposed that the change of the second temperature of the stage 122 from the second temperature value of the stage 122 to the third temperature value of the stage 122 is effected such that the third temperature value of the stage 122 corresponds to the first temperature value of the stage 122. In other words, the change in the second temperature of the stage 122 is compensated for by the heat generated by drive units M1 to M5 such that the second temperature of the stage 122 is again the initial temperature value before the first temperature change of the object fixing 114 or is substantially the initial temperature value, where the initial temperature value corresponds to the first temperature value of the stage 122. In this embodiment of the method according to the invention, the drift of the stage 122 that existed before the change of the first temperature of the object 125 and / or the third temperature of the object fixing 114 is substantially obtained.

[0197] In a further embodiment of the method according to the invention Figure 7In another embodiment, the second temperature of stage 122 is changed from the second temperature value to the third temperature value as follows, such that the following holds: TOT1 - 15°C ≤ TOT3 ≤ TOT1. In other words, the third temperature value of stage 122 is within a range defined by a temperature 15°C lower than the first temperature value of stage 122 and the first temperature value of stage 122 itself. The boundaries of this range are also included in the range.

[0198] Figure 8 Shown based on Figure 7 Yet another embodiment of the method of the present invention. Therefore, please first refer to the precautions drawn above, which still apply here. Figure 7 The implementation methods are different. Figure 8 An embodiment includes performing method step S4A, for example, between method steps S2A and S3A. The supply current is varied such that the following holds true: I2 > I1, where I1 is a first current value of the supply current and I2 is a second current value of the supply current. After reaching the second current value of the supply current, the supply current is held constant at the second current value.

[0199] Figure 9 Shown based on Figure 7 Yet another embodiment of the method of the present invention. Therefore, please first refer to the precautions drawn above, which still apply here. Figure 7 The implementation methods are different. Figure 9 An embodiment includes performing method step S5A instead of method step S2A. Method step S5A is performed, for example, between method steps S1A and S3A. In method step S5A, when the first temperature of object 125 and / or the third temperature of object holder 114 are changed, the power supply current is changed if the first temperature of object 125 and / or the third temperature of object holder 114 reach or fall below a first predeterminable temperature value (e.g., 0°C). In this embodiment of the method according to the present invention, the power supply current is also changed such that the following holds: I2>I1, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, in order to secure stage 122 at a desired position in sample chamber 120 via drive units M1 to M5, the power supply current of drive units M1 to M5 is changed such that the second current value of the power supply current is greater than the first current value of the power supply current. This generates more heat via drive units M1 to M5, which is transferred to stage 122.

[0200] Figure 10 Shown based on Figure 7Yet another embodiment of the method of the present invention. Therefore, please first refer to the precautions drawn above, which still apply here. Figure 7 The implementation methods are different. Figure 10 An embodiment includes performing method step S6A, which is performed, for example, after method step S3A. After cooling of object holder 114 and / or object 125 is completed, the supply current of drive units M1 to M5 is changed again. For example, the supply current of drive units M1 to M5 is changed from the second current value back to the first current value when the following two conditions are met: (i) cooling of object holder 114 and / or object 125 has been completed, and (ii) the first temperature of object 125 and / or the third temperature of object holder 114 is a third temperature value within a range between the first temperature value and the second temperature value of object holder 114 and / or object 125. When the first temperature of object 125 and / or the third temperature of object holder 114 moves back toward the initial first temperature value of object holder 114 and / or object 125 (i.e., toward room temperature), the supply current of drive units M1 to M5 is changed back from the second current value to the initial current value, i.e., the first current value. This causes the drive units M1 to M5 to generate less heat and thus not unnecessarily heat the stage 122 .

[0201] Alternatively, in one embodiment of the method of the present invention, in method step S6A, the power supply current of the drive units M1 to M5 is changed back from the second current value to the first current value when three conditions are met: (i) cooling of the object holder 114 and / or the object 125 has ended, (ii) the first temperature of the object 125 and / or the third temperature of the object holder 114 is a third temperature value within a range between the first temperature value and the second temperature value of the object holder 114 and / or the object 125, and (iii) a predeterminable time period has elapsed after cooling of the object holder 114 and / or the object 125 has ended. In other words, after the predeterminable time period has elapsed, when cooling of the object holder 114 and / or the object 125 has ended and when the first temperature of the object and / or the third temperature of the object holder 114 has again moved toward the initial first temperature value (i.e., toward room temperature), the power supply current of the drive units M1 to M5 is changed back from the second current value to the initial current value, i.e., the first current value. This also causes the drive units M1 to M5 to generate less heat and thus not unnecessarily heat the stage 122 .

[0202] Alternatively, in one embodiment of the method according to the present invention, in method step S6A, the supply current of drive units M1 to M5 is changed from the second current value to the first current value when two conditions are met: (i) cooling of object holder 114 and / or object 125 has concluded, and (ii) the first temperature of object 125 and / or the third temperature of object holder 114 reaches or exceeds a predeterminable temperature threshold, such as -100°C, -80°C, or -60°C. This embodiment of the method according to the present invention is particularly advantageous when object holder 114 and / or object 125 are reheated after cooling. The supply current of drive units M1 to M5 is then changed back from the second current value to the initial current value, i.e., the first current value. This results in drive units M1 to M5 generating less heat and thus preventing unnecessary heating of stage 122.

[0203] Figure 11 A schematic diagram of a flow chart showing another specific embodiment of the method according to the invention. Figure 11 The implementation method is based on Figure 6 Therefore, please first refer to the implementation schemes obtained above, and these conclusions still apply here. Figure 11 An embodiment provides for heating the object holder 114 and / or the object 125 in method step S1B. Accordingly, in method step S1B, a third temperature of the object holder 114 (at which the object 125 is arranged) is increased from a first temperature value of the object holder 114 to a second temperature value of the object holder 114 by means of a cooling and / or heating device 127. Accordingly, the first temperature value of the object holder 114 is less than the second temperature value of the object holder 114. The first temperature value of the object holder 114 is, for example, room temperature. The second temperature value of the object holder 114 is, for example, less than or equal to 40° C. Additionally or alternatively, in method step S1B, a first temperature of the object 125 is increased from the first temperature value of the object 125 to the second temperature value of the object 125 by means of a cooling and / or heating device 127. Accordingly, the first temperature value of the object 125 is less than the second temperature value of the object 125. The first temperature value of the object 125 is, for example, room temperature. The second temperature value of the object 125 is, for example, less than or equal to 40°C.

[0204] As described above, a change in the first temperature of the object 125 and / or the third temperature of the object fixing member 114 causes the second temperature of the stage 122 to change from the first temperature value of the stage 122 to the second temperature value of the stage 122. In other words, a change in the first temperature of the object 125 and / or the third temperature of the object fixing member 114 also causes a change in the second temperature of the stage 122. In the current case, the first temperature value of the stage 122 is less than the second temperature value of the stage 122. For example, the first temperature value of the stage 122 has a room temperature, and the second temperature value of the stage 122 has a value that is about 5°C to 15°C higher than the room temperature.

[0205] In method step S2B, the supply current of the drive units M1 to M5 is changed from a first current value to a second current value. In the embodiment shown in Figure 11 of the method of the present invention, the supply current of the drive units M1 to M5 is changed such that the following holds: I1 > I2, where I1 is the first current value of the supply current and where I2 is the second current value of the supply current. In other words, in order to fix the stage 122 in the sample chamber 120 by means of the drive units M1 to M5, the supply current of the drive units M1 to M5 is changed such that the second current value of the supply current is less than the first current value of the supply current. Thereby, less heat is generated by the drive units M1 to M5, and this heat is sent to the stage 122.

[0206] Now, in method step S3B, the second temperature of the stage 122 is changed. More precisely, due to the heat generated in the drive units M1 to M5 (this heat is achieved by the second current value of the supply current and is sent to the stage 122), the second temperature of the stage 122 changes from the second temperature value of the stage 122 to the third temperature value of the stage 122. The third temperature value of the stage 122 is within the temperature range mentioned above.

[0207] In the embodiment shown in Figure 11 of the method of the present invention, it is particularly provided that the following holds: TOT1 < TOT2 and TOT2 > TOT3, where TOT2 is the second temperature value of the stage 122. In other words, the supply current is changed so as to satisfy two conditions. On the one hand, the first temperature value of the stage 122 is less than the second temperature value of the stage 122. On the other hand, the second temperature value of the stage 122 is greater than the third temperature value of the stage 122.

[0208] In the method of the present invention according to Figure 11In one embodiment, it is additionally or alternatively provided that the second temperature of carrier 122 is changed from the second temperature value of carrier 122 to a third temperature value of carrier 122 in such a way that the third temperature value of carrier 122 corresponds to the first temperature value of carrier 122. In other words, the change in the second temperature of carrier 122 is offset by the heat generated by drive units M1 to M5, so that the second temperature of carrier 122 is again the initial temperature value or essentially the initial temperature value before the first temperature change of object holder 114, wherein the initial temperature value corresponds to the first temperature value of carrier 122. In this embodiment of the method according to the invention, the drift of carrier 122 that existed before the first temperature change of object 125 and / or the third temperature change of object holder 114 is essentially retained.

[0209] According to the method of the present invention Figure 11 In another embodiment, the second temperature of stage 122 is changed from the second temperature value to the third temperature value as follows, such that the following holds: TOT1 ≤ TOT3 ≤ TOT1 + 15°C. In other words, the third temperature value of stage 122 is within a range defined by the first temperature value itself and a temperature 15°C higher than the first temperature value of stage 122. The boundaries of this range are also included in the range.

[0210] Figure 12 Shown based on Figure 11 Yet another embodiment of the method of the present invention. Therefore, please first refer to the precautions drawn above, which still apply here. Figure 11 The implementation methods are different. Figure 12 An embodiment includes performing method step S4B, for example, between method steps S2B and S3B. The supply current is varied such that the following holds true: I1 > I2, where I1 is a first current value of the supply current and I2 is a second current value of the supply current. After reaching the second current value of the supply current, the supply current is held constant at the second current value.

[0211] Figure 13 Shown based on Figure 11 Yet another embodiment of the method of the present invention. Therefore, please first refer to the precautions drawn above, which still apply here. Figure 11 The implementation methods are different. Figure 13An embodiment includes performing method step S5B instead of method step S2B. Method step S5B is performed, for example, between method steps S1B and S3B. In method step S5B, when the first temperature of object 125 and / or the third temperature of object holder 114 are changed, the power supply current is changed if the first temperature of object 125 and / or the third temperature of object holder 114 reach or exceed a first predeterminable temperature value. In this embodiment of the method of the present invention, the power supply current is also changed such that the following holds: I1>I2, where I1 is the first current value of the power supply current and I2 is the second current value of the power supply current. In other words, in order to secure stage 122 at a desired position in sample chamber 120 via drive units M1 to M5, the power supply current of drive units M1 to M5 is changed such that the second current value of the power supply current is less than the first current value of the power supply current. This results in less heat being generated by drive units M1 to M5 and transferred to stage 122.

[0212] Figure 14 Shown based on Figure 11 Yet another embodiment of the method of the present invention. Therefore, please first refer to the precautions drawn above, which still apply here. Figure 11 The implementation methods are different. Figure 14 An embodiment includes performing method step S6B, which is performed, for example, after method step S3B. After heating of object holder 114 and / or object 125 is completed, the power supply current of drive units M1 to M5 is changed again. For example, the power supply current of drive units M1 to M5 is changed from the second current value back to the first current value when the following two conditions are met: (i) heating of object holder 114 and / or object 125 has ended, and (ii) the first temperature of object 125 and / or the third temperature of object holder 114 is a third temperature value within a range between the first temperature value and the second temperature value of object holder 114 and / or object 125. When the first temperature of object 125 and / or the third temperature of object holder 114 moves back toward the initial first temperature value of the object and / or object holder 114 (i.e., toward room temperature), the power supply current of drive units M1 to M5 is changed back from the second current value to the initial current value, i.e., the first current value. This causes drive units M1 to M5 to generate more heat again.

[0213] Alternatively, in one embodiment of the method of the present invention, in method step S6B, the power supply current of the drive units M1 to M5 is changed back from the second current value to the first current value when three conditions are met: (i) heating of the object holder 114 and / or the object has ended, (ii) the first temperature of the object 125 and / or the third temperature of the object holder 114 is a third temperature value within a range between the first temperature value and the second temperature value of the object holder 114 and / or the object 125, and (iii) a predeterminable time period has elapsed after heating of the object holder 114 and / or the object 125 has ended. In other words, after the predeterminable time period has elapsed, when heating of the object holder 114 and / or the object 125 has ended and when the first temperature of the object 125 and / or the third temperature of the object holder 114 has again moved toward the initial first temperature value (i.e., toward room temperature), the power supply current of the drive units M1 to M5 is changed back from the second current value to the initial current value, i.e., the first current value. This also causes the drive units M1 to M5 to generate more heat again.

[0214] Alternatively to the above, in one embodiment of the method of the present invention, in method step S6B, the supply current of drive units M1 to M5 is changed from the second current value to the first current value when two conditions are met: (i) heating of object holder 114 and / or object 125 has concluded, and (ii) the first temperature of object 125 and / or the third temperature of object holder 114 reaches or falls below a predeterminable temperature threshold, such as 35°C, 32°C, or 30°C. The supply current of drive units M1 to M5 is then changed back from the second current value to the initial current value, i.e., the first current value. This causes drive units M1 to M5 to generate more heat again.

[0215] As mentioned above, in another embodiment of the SEM 100, it is provided that the object holder 114 is formed as an object receiving device, for example, in the form of a manipulator and / or gripper for holding the object 125. The object holder 114 is then movable, for example, as described above and below with respect to the stage 122. Embodiments of the method of the present invention will be described below with respect to this alternative embodiment of the SEM 100. First, the first temperature of the object 125 is changed from a first temperature value of the object 125 to a second temperature value of the object 125 by means of the cooling and / or heating device 127. For example, the object 125 is cooled and / or heated from the first temperature value of the object 125 to the second temperature value of the object 125. This change in the first temperature of the object 125 causes the third temperature of the object holder 114 to change from the first temperature value of the object holder 114 to the second temperature value of the object holder 114. In other words, changing the first temperature of the object 125 also causes the third temperature of the object holder 114 to change.

[0216] The power supply current of the drive units M1 to M5 of the object holder 114 is then changed from a first current value to a second current value. At both the first and second current values ​​of the power supply current, the object holder 114 is secured in the desired position in the sample chamber 120 by the drive units M1 to M5. Therefore, the power supply current described above is a holding current. In other words, when the power supply current has either the first or second current value, the object holder 114 is secured in the desired position in the sample chamber 120 by the drive units M1 to M5.

[0217] The third temperature of object holder 114 is now also changed. More specifically, due to the heat generated by drive units M1 to M5 (which is realized by the second current value of the power supply current and is delivered to object holder 114), the second temperature of object holder 114 changes from the second temperature value of object holder 114 to the third temperature value of object holder 114. The third temperature value of object holder 114 is within a temperature range that satisfies the following conditions:

[0218] TOT1-15℃≤TOT3≤TOT1+15℃, [1]

[0219] in

[0220] TOT1 is a first temperature value of the object fixture 114, and wherein

[0221] TOT3 is a third temperature value of the object fixture 114 .

[0222] In other words, the third temperature value of the object holder 114 is within a range of ±15° C. around the first temperature value of the object holder 114. This embodiment of the inventive method may have the variants already explained above with respect to other embodiments of the inventive method.

[0223] In a further embodiment of the method according to the invention, it is proposed that before changing the first temperature of the object 125 and / or the third temperature of the object holder 114, it is determined what value the second current value of the supply current should have so that the second temperature of the object carrier 122 has a third temperature value. This will be explained below with reference to the third temperature of the object holder 114. With regard to the first temperature of the object 125, the corresponding contents apply. This method step of this embodiment of the method according to the invention does not necessarily have to be performed by the user of the SEM 100. Rather, this method step can also be carried out in the factory at the manufacturer of the SEM 100. For example, it is proposed that in the database 126 the numerical value of the second current value of the supply current is stored depending on the second temperature value of the object holder 114 and on the third temperature value to be achieved of the object carrier 122. Then, according to Figure 6After method step S1, in method step S10 (see Figure 17 ), firstly, a second current value of the supply current is loaded from the database 126 into the control unit 123 of the SEM 100 depending on the second temperature value of the object holder 114 and on the desired third temperature value of the stage 122. Figure 6 Then, the second current value of the applied power supply current is sent to the drive units M1 to M5.

[0224] In one embodiment of the method of the present invention, determining the second current value of the power supply current comprises the following steps:

[0225] - setting the third temperature of the object holder 114 to a plurality of different second temperature values ​​of the object holder 114; and

[0226] -Determining a second current value of the power supply current for each of the multiple different second temperature values ​​of the object fixing member 114, wherein when the determined second current value is sent to the driving units M1 to M5, the second temperature of the worktable 122 is changed from the second temperature value of the worktable 122 to the third temperature value of the worktable 122.

[0227] This is achieved through Figure 15 Flowchart 1 shows a method of setting the third temperature of object holder 114 to a second temperature value, for example, value T21, in method step S7. Then, in method step S8, a current value of the power supply current is determined that achieves the predetermined third temperature value of object stage 122. This current value is, for example, second current value I21. Figure 16 A schematic diagram shows a second current value of the supply current for a determined, predetermined third temperature value of the object stage 122 as a function of a second temperature value of the object holder 114 .

[0228] Once the second current value of the supply current has been determined, it is stored in database 126 in method step S9. In method step S10, a check is performed to determine whether a further second current value of the supply current should be determined. If a further second current value of the supply current should be determined, method steps S7 through S9 are repeated. In this manner, further second current values ​​of the supply current are determined depending on the second temperature value of object holder 114. For example, a second current value I22 is determined for second temperature value T22 of object holder 114. Furthermore, a second current value I23 is determined for second temperature value T23 of object holder 114.

[0229] In this embodiment of the method of the present invention, a functional relationship I(T) is obtained between a second current value of the power supply current and a second temperature value of the object holder 114 for a predetermined third temperature value of the object carrier 122. This functional relationship can then be used to determine, for each second temperature value of the object holder 114, the second current value of the power supply current required to bring the second temperature of the object carrier 122 to the third temperature value. The functional relationship can be determined by extrapolation and / or interpolation. Any suitable interpolation method can be used for interpolation, such as linear interpolation, nonlinear interpolation, trigonometric interpolation, exponential interpolation, and / or spline interpolation. Any suitable extrapolation method can be used for extrapolation, such as linear interpolation, nonlinear interpolation, trigonometric interpolation, and / or exponential interpolation. Additionally or alternatively, the functional relationship can be determined by forming a median from a certain number of first and second values, obtaining random values, and / or determining a minimum or maximum value.

[0230] If a measurement of the temperature of the object holder 114 , the object 125 and / or the object stage 122 is necessary, this can be performed by means of the temperature measuring unit 128 .

[0231] All embodiments of the method according to the invention have the advantages already explained above, to which reference is made.

[0232] The features of the invention disclosed in the description, the drawings, and the claims are essential, individually and in any combination, for the realization of the invention in its various embodiments. The invention is not limited to the embodiments described. The invention may vary within the scope of the claims and taking into account the knowledge of a person skilled in the relevant art.

[0233] List of Reference Numerals

[0234] 100 SEM

[0235] 101 Electron Source

[0236] 102 Extraction Electrode

[0237] 103 Anode

[0238] 104 Beam guide tube

[0239] 105 first converging lens

[0240] 106 Second converging lens

[0241] 107 First Objective

[0242] 108 First baffle unit

[0243] 108A First baffle opening

[0244] 109 Second baffle unit

[0245] 110 pole shoes

[0246] 111 Coil

[0247] 112 individual electrodes

[0248] 113 Tubular Electrode

[0249] 114 Object Fixing Parts

[0250] 115 Scanning Device

[0251] 116 First Detector

[0252] 116A Reverse Field Grid

[0253] 117 Second Detector

[0254] 118 Second baffle opening

[0255] 119 Sample Chamber Detector

[0256] 120 Sample Room

[0257] 121 Third Detector

[0258] 122 stage

[0259] 123 Control Unit (Processor)

[0260] 124 Monitor

[0261] 125 objects

[0262] 126 Database

[0263] 127 Cooling and / or heating devices

[0264] 128 Temperature measurement unit

[0265] 200 combination equipment

[0266] 201 Sample Room

[0267] 300 Ionizing Radiation Equipment

[0268] 301 Ion Beam Generator

[0269] 302 Extraction electrodes in ion radiation equipment

[0270] 303 Converging Lens

[0271] 304 Second Objective Lens

[0272] 306 Settable or selectable baffles

[0273] 307 first electrode assembly

[0274] 308 second electrode assembly

[0275] 400 Particle radiation equipment with corrector unit

[0276] 401 Particle Radiation Column

[0277] 402 electron source

[0278] 403 Extraction Electrode

[0279] 404 anode

[0280] 405 First Electrostatic Lens

[0281] 406 Second Electrostatic Lens

[0282] 407 Third Electrostatic Lens

[0283] 408 Magnetic Deflection Unit

[0284] 409 First electrostatic beam deflection unit

[0285] 409A First Multipole Unit

[0286] 409B Second multipole unit

[0287] 410 Beam Deflection Device

[0288] 411A First magnetic sector

[0289] 411B Second magnetic sector

[0290] 411C Third magnetic sector

[0291] 411D Fourth magnetic sector

[0292] 411E Fifth Magnetic Sector

[0293] 411F Sixth magnetic sector

[0294] 411G seventh magnetic sector

[0295] 413A First mirror electrode

[0296] 413B Second mirror electrode

[0297] 413C third mirror electrode

[0298] 414 Electrostatic Mirror

[0299] 415 Fourth Electrostatic Lens

[0300] 416 Second electrostatic beam deflection unit

[0301] 416A third multi-pole unit

[0302] 416B Fourth multipole unit

[0303] 417 Third electrostatic beam deflection unit

[0304] 418 Fifth Electrostatic Lens

[0305] 418A Fifth Multipole Unit

[0306] 418B Sixth multipole unit

[0307] 419 First Analytical Detector

[0308] 420 Beam Guide Tube

[0309] 421 objective lens

[0310] 422 Magnetic Lens

[0311] 423 Sixth Electrostatic Lens

[0312] 424 stage

[0313] 425 objects

[0314] 426 Sample Room

[0315] 427 Detection Beam Path

[0316] 428 Secondary Analytical Detector

[0317] 429 Scanning Device

[0318] 432 Additional magnetic deflection unit

[0319] 500 Radiation Detector

[0320] 600 First moving element

[0321] 601 housing

[0322] 602 Second moving element

[0323] 603 First stage rotation axis

[0324] 604 Third moving element

[0325] 605 Fourth Moving Element

[0326] 606 Fifth Moving Element

[0327] 607 Second stage rotation axis

[0328] 608 Control Unit

[0329] 709 First Beam Axis

[0330] 710 Second beam axis

[0331] 800 optical microscope

[0332] 801 Light Source

[0333] 802 Optical Unit

[0334] M1 first drive unit

[0335] M2 Second drive unit

[0336] M3 third drive unit

[0337] M4 fourth drive unit

[0338] M5 fifth drive unit

[0339] OA optical axis

[0340] OA1 first optical axis

[0341] OA2 Second Optical Axis

[0342] OA3 third optical axis

[0343] S1 to S3 method steps

[0344] S1A to S6A Method Steps

[0345] S1B to S6B method steps

[0346] S7 to S10 method steps

Claims

1. A method for operating a particle radiation device (100, 200, 400) and / or an optical microscope (800) for imaging, analyzing and / or processing an object (125, 425), wherein the method comprises the following steps: - changing a first temperature of the object (125, 425), wherein the object (125, 425) is arranged at an object receiving device (122, 424) which is movable by at least one motor (M1 to M5) operated with a power supply current, wherein changing the first temperature of the object (125, 425) causes a second temperature of the object receiving device (122, 424) to change from a first temperature value of the object receiving device (122, 424) to a second temperature value of the object receiving device (122, 424); - changing the power supply current of the motor (M1 to M5) from a first current value to a second current value, wherein the power supply current at both the first current value and the second current value is used to fix the object receiving device (122, 424) at a certain position in the particle irradiation device (100, 200, 400) and / or the optical microscope (800) via the motor (M1 to M5); and - changing the second temperature of the object receiving device (122, 424) from the second temperature value of the object receiving device (122, 424) to a third temperature value of the object receiving device (122, 424) based on heat generated by the motors (M1 to M5), the heat being realized by the second current value of the power supply current and being supplied to the object receiving device (122, 424), wherein the third temperature value of the object receiving device (122, 424) is within a temperature range that satisfies the following conditions: TOT1-15℃≤TOT3≤TOT1+15℃, in TOT1 is a first temperature value of the object receiving device (122, 424), And among them TOT3 is a third temperature value of the object receiving device (122, 424).

2. The method according to claim 1 , wherein the object ( 125 , 425 ) is arranged on an object holder ( 114 ), wherein the object holder ( 114 ) is arranged on the object receiving device ( 122 , 424 ), wherein the object receiving device ( 122 , 424 ) is formed as a stage, and wherein the method comprises the following steps: - changing the first temperature of the object (125, 425) by changing a third temperature of the object fixture (114) from a first temperature value of the object fixture (114) to a second temperature value of the object fixture (114).

3. The method of claim 2, wherein changing the third temperature of the object holder (114) is performed by cooling or heating the object holder (114).

4. The method according to one of the preceding claims, wherein changing the first temperature of the object (125, 425) is performed by cooling or heating the object (125, 425).

5. The method according to claim 1 , wherein the method has at least one of the following features: (i) using a stepper motor as the motor (M1 to M5), wherein the power supply current is a holding current of the stepper motor; (ii) A brushless motor is used as the motor (M1 to M5), wherein the power supply current is the holding current of the brushless motor.

6. The method according to claim 1 , wherein the method comprises at least one of the following steps: (i) while changing the first temperature of the object (125, 425), cooling the object (125, 425) and changing the power supply current so that the following is true: TOT1>TOT2 and TOT2 <TOT3; (ii) while changing the first temperature of the object (125, 425), cooling the object (125, 425) with liquid nitrogen and changing the power supply current so that the following is true: TOT1>TOT2 and TOT2 <TOT3; (iii) while changing the first temperature of the object (125, 425), cooling the object (125, 425) with liquid helium and changing the power supply current so that the following is true: TOT1>TOT2 and TOT2 <TOT3, TOT2 is a second temperature value of the object receiving device (122, 424).

7. The method according to one of the preceding claims, wherein the second temperature of the object receiving device (122, 424) is changed from the second temperature value of the object receiving device (122, 424) to a third temperature value of the object receiving device (122, 424) so ​​that the third temperature value of the object receiving device (122, 424) corresponds to the first temperature value of the object receiving device (122, 424).

8. The method according to claim 1 , wherein the second temperature of the object receiving device ( 122 , 424 ) is changed from the second temperature value to the third temperature value such that one of the following relationships holds true: (i)TOT1-15℃≤TOT3≤TOT1; (ii)TOT1≤TOT3≤TOT1+15℃.

9. The method according to claim 1 , wherein the method comprises: (i) changing the power supply current so that the following holds true: I2>I1, where I1 is a first current value of the power supply current and where I2 is a second current value of the power supply current; (ii) changing the power supply current so that the following holds true: I1>I2, where I1 is a first current value of the power supply current and where I2 is a second current value of the power supply current; (iii) changing the supply current so that the following holds true: I2>I1, wherein I1 is a first current value of the supply current, wherein I2 is a second current value of the supply current and wherein the supply current is held constant at the second current value after reaching the second current value; (iv) changing the supply current so that the following holds true: I1>I2, wherein I1 is a first current value of the supply current, wherein I2 is a second current value of the supply current and wherein the supply current is held constant at the second current value after reaching the second current value; (v) when the first temperature of the object (125, 425) reaches or falls below a first presettable temperature value while changing the first temperature of the object (125, 425), changing the power supply current so that the following holds true: I2>I1, wherein I1 is a first current value of the power supply current and wherein I2 is a second current value of the power supply current; (vi) when the first temperature of the object (125, 425) reaches or exceeds a second preset temperature value when the first temperature of the object (125, 425) is changed, changing the power supply current so that the following is true: I1>I2, where I1 is a first current value of the power supply current and where I2 is a second current value of the power supply current.

10. The method according to claim 2, wherein the method comprises one of the following steps: (i) when the third temperature of the object fixture (114) reaches or falls below a first presettable temperature value while changing the third temperature of the object fixture (114), changing the power supply current so that the following holds true: I2>I1, where I1 is a first current value of the power supply current and where I2 is a second current value of the power supply current; (ii) when the third temperature of the object fixture (114) reaches or exceeds a second preset temperature value when the third temperature of the object fixture (114) is changed, changing the power supply current so that the following is true: I1>I2, where I1 is a first current value of the power supply current and where I2 is a second current value of the power supply current.

11. The method according to claim 1 , wherein the method comprises: (i) after the change of the first temperature of the object (125, 425) is completed and when the first temperature of the object (125, 425) is a third temperature value between the first temperature value and the second temperature value of the object (125, 425), changing the power supply current of the motor (M1 to M5) from the second current value to the first current value; (ii) after a preset time period after the change of the first temperature of the object (125, 425) is completed and when the first temperature of the object (125, 425) is a third temperature value between the first temperature value and the second temperature value of the object (125, 425), changing the power supply current of the motor (M1 to M5) from the second current value to the first current value; (iii) when the first temperature of the object (125, 425) reaches or exceeds a first presettable temperature threshold after the changing of the first temperature of the object (125, 425) ends, changing the power supply current from the second current value to the first current value; (iv) when the first temperature of the object (125, 425) reaches or falls below a second preset temperature threshold after the change of the first temperature of the object (125, 425) is completed, changing the power supply current from the second current value to the first current value.

12. The method according to claim 2, wherein the method comprises one of the following steps: (i) after the change of the third temperature of the object fixture (114) is completed and when the third temperature of the object fixture (114) is a third temperature value between the first temperature value and the second temperature value of the object fixture (114), changing the power supply current of the motor (M1 to M5) from the second current value to the first current value; (ii) after a preset period of time after the change of the third temperature of the object fixture (114) ends and when the third temperature of the object fixture (114) is a third temperature value between the first temperature value and the second temperature value of the object fixture (114), changing the power supply current of the motor (M1 to M5) from the second current value to the first current value; (iii) when the third temperature of the object fixture (114) reaches or exceeds a first presettable temperature threshold after the changing of the third temperature of the object fixture (114) ends, changing the power supply current from the second current value to the first current value; (iv) when the third temperature of the object fixture (114) reaches or falls below a second preset temperature threshold after the change of the third temperature of the object fixture (114) is completed, changing the power supply current from the second current value to the first current value.

13. The method according to claim 1, wherein before changing the first temperature of the object (125, 425), it is determined what value the second current value of the supply current should have so that the second temperature of the object receiving device (122, 424) has the third temperature value.

14. The method according to claim 13 , wherein determining the second current value of the power supply current comprises: - setting the first temperature of the object (125, 425) to a plurality of different second temperature values; as well as - determining the second current value for each of the plurality of different second temperature values, wherein when the determined second current value is sent to the motor (M1 to M5), the second temperature of the object receiving device (122, 424) is changed from the second temperature value of the object receiving device (122, 424) to the third temperature value of the object receiving device (122, 424).

15. The method according to claim 2, wherein before changing the third temperature of the object holder (114), it is determined what value the second current value of the power supply current should have so that the second temperature of the object receiving device (122, 424) has the third temperature value.

16. The method according to claim 15, wherein determining the second current value of the power supply current comprises: - setting the third temperature of the object fixing member (114) to a plurality of different second temperature values; as well as - determining the second current value for each of the plurality of different second temperature values, wherein when the determined second current value is sent to the motor (M1 to M5), the second temperature of the object receiving device (122, 424) is changed from the second temperature value of the object receiving device (122, 424) to the third temperature value of the object receiving device (122, 424).

17. The method according to claim 14 or 16, wherein determining the second current value comprises extrapolation and / or interpolation.

18. A computer program product with a program code which can be loaded into a processor (123) and which, when executed, controls a particle irradiation device (100, 200, 400) and / or an optical microscope (800) in order to carry out the method according to at least one of the preceding claims.

19. A particle radiation device (100, 200, 400) for imaging, analyzing and / or processing an object (125, 425), the particle radiation device having - at least one beam generator (101, 301, 402) for generating a particle beam comprising charged particles; at least one objective lens (107, 304, 421) for focusing the particle beam onto the object (125, 425); at least one scanning device (115, 429) for scanning the particle beam over the object (125, 425); - at least one object fixing member (114) for fixing the object (125, 425); at least one cooling and / or heating device (127) for changing the temperature of the object holder (114) and / or the object (125, 425); at least one movably formed object receiving device (122, 424), at which the object holder (114) is arranged; - at least one motor (M1 to M5) for moving the object receiving device (122, 424); - at least one power supply unit (608) for supplying power current to the motors (M1 to M5); at least one detector (116, 117, 119, 121, 419, 428, 500) for detecting interaction particles and / or interaction radiation caused by the particle beam and the object (125, 425); - at least one display device (124) for displaying an image of the object (125, 425) and / or an analysis result; and At least one control unit (123) having a processor, in which the computer program product according to claim 18 is loaded.

20. The particle irradiation device (100, 200, 400) according to claim 19, wherein the motor (M1 to M5) for moving the object receiving device (122, 424) is formed as a stepper motor and / or a brushless motor.

21. The particle irradiation system (100, 200, 400) according to claim 19 or 20, wherein the particle irradiation system (100, 200, 400) has at least one temperature measuring unit (128) for measuring the temperature of the object holder (114) and / or the object receiving device (122, 424) and / or the object (125, 425).

22. The particle irradiation device (200) according to claim 19 , wherein the beam generator (101) is formed as a first beam generator (101) and the particle beam is formed as a first particle beam having first charged particles, wherein the objective lens (107) is formed as a first objective lens for focusing the first particle beam onto the object (125), and wherein the particle irradiation device (200) further comprises: - at least one second beam generator (301) for generating a second particle beam having second charged particles; and - at least one second objective (304) for focusing the second particle beam onto the object (125).

23. The particle irradiation device (100, 200, 400) according to any one of claims 19 to 22, wherein the particle irradiation device (100, 200, 400) is an electron irradiation device and / or an ion irradiation device.

24. An optical microscope (800) for imaging, analyzing and / or processing an object, the optical microscope having - at least one light source (801) for generating light; - at least one optical unit (802) for directing the light onto the object (125); - at least one object fixing member (114) for fixing the object (125); at least one cooling and / or heating device (127) for changing the temperature of the object holder (114) and / or the object (125, 425); at least one movably formed object receiving device (122), at which the object holder (114) is arranged; - at least one motor (M1 to M5) for moving the object receiving device (122); - at least one power supply unit (608) for supplying power current to the motors (M1 to M5); as well as A control unit (123) having a processor, in which the computer program product according to claim 18 is loaded.

25. The optical microscope (800) according to claim 24, wherein the motor (M1 to M5) for moving the object receiving device (122) is formed as a stepper motor and / or a brushless motor.

26. An optical microscope (800) according to claim 24 or 25, wherein the optical microscope (800) has at least one temperature measuring unit (128) for measuring the temperature of the object holder (114) and / or the object receiving device (122) and / or the object (125, 425).

Images