System and method for automated wafer carrier handling

Abstract

A system and an operation method for automated wafer carrier handling are provided. The system includes: a storage rack including a standby position and a storage position separated from each other, a first moving mechanism and a second moving mechanism, and a controller operably coupled to the first moving mechanism and the second moving mechanism to control the operation of the first moving mechanism and the second moving mechanism. The storage position is used to buffer wafer carriers waiting to be transferred to a loading port. The first moving mechanism is movably coupled to the storage rack and provides at least one degree of freedom of movement to transfer the wafer carrier from the storage position to the standby position. The second moving mechanism is disposed on the storage rack, operably couples the storage rack to the loading port, and provides at least one degree of freedom of movement to transfer the wafer carrier from the standby position to the loading port.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor system and method, and more particularly, to a system and method for automated wafer carrier handling. Background Art

[0002] A typical semiconductor manufacturing facility includes a plurality of processing areas, including semiconductor processing tools and wafer staging equipment. Each processing area may include a stocker that temporarily holds a plurality of wafer carriers or prepares to transport the wafer carriers to a loading port of a semiconductor processing tool. Several semiconductor wafers are usually stored in a wafer carrier (e.g., a wafer pod), which is used to move semiconductor wafers to different semiconductor processing tools throughout the manufacturing facility. Traditionally, wafer carriers are transported to semiconductor processing tools and / or loaded onto loading ports by operators. In modern manufacturing facilities, there is a great emphasis on limiting the presence of operators in the processing area and improving the efficiency of semiconductor manufacturing. Therefore, there is a need for a manufacturing facility that can automatically load and unload wafer pods into and from loading ports to minimize labor requirements and improve manufacturing efficiency. Summary of the invention

[0003] According to some embodiments, a system for automated wafer carrier handling includes a storage rack, a first moving mechanism, a second moving mechanism, and a controller. The storage rack includes a standby position and a storage position separated from the standby position, and the storage position is suitable for buffering wafer carriers waiting to be transferred to a loading port. The first moving mechanism is movably coupled to the storage rack and provides at least one degree of freedom of movement, and the first moving mechanism is suitable for transferring the wafer carrier from the storage position to the standby position. The second moving mechanism is disposed on the storage rack, operably couples the storage rack to the loading port, and provides at least one degree of freedom of movement. The second moving mechanism is suitable for transferring the wafer carrier from the standby position to the loading port. The controller is operably coupled to the first moving mechanism and the second moving mechanism to control the operation of the first moving mechanism and the second moving mechanism.

[0004] According to some embodiments, a system for automated wafer carrier handling includes a storage device, a conveying device, and a controller. The storage device includes a storage rack and a first moving mechanism, the storage rack having a compartment for accommodating a wafer carrier, the first moving mechanism coupled to the storage rack to move the wafer carrier laterally and vertically from the compartment of the storage rack to a standby position of the storage device. The conveying device is disposed above the storage device and includes a second moving mechanism, the second moving mechanism being adapted to transfer the wafer carrier from the standby position of the storage device to a loading port for semiconductor processing. The controller interfaces with the first moving mechanism of the storage device and the second moving mechanism of the conveying device to control the movement of the wafer carrier driven by the first moving mechanism of the storage device and the second moving mechanism of the conveying device.

[0005] According to some embodiments, an operating method for automated wafer carrier handling includes at least the following steps: moving a wafer carrier from a compartment of a storage rack to a standby position of the storage rack by a first moving mechanism, wherein the wafer carrier carries a plurality of semiconductor wafers to be processed therein; carrying and transferring the wafer carrier at the standby position of the storage rack by a second moving mechanism, wherein the second moving mechanism is disposed above the storage rack and operably coupled to the storage rack; and loading the wafer carrier carried by the second moving mechanism onto a load port of a semiconductor processing machine for processing the plurality of semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The various aspects of the embodiments of the present invention will be best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the size of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1A is a schematic perspective view showing an automated wafer carrier handling system according to some embodiments.

[0008] Figure 1B is a schematic front view illustrating an automated wafer carrier handling system according to some embodiments.

[0009] Figure 1C is a schematic right side view illustrating an automated wafer carrier handling system according to some embodiments.

[0010] Figure 1D According to some embodiments Figure 1C Schematic enlargement of the dashed area depicted in .

[0011] FIG. 2A to FIG. 2E is a schematic enlarged view showing various stages of the release process of the quick release mechanism according to some embodiments.

[0012] FIG. 3A to FIG. 3C is a schematic front view showing a storage device at various stages of performing an operating method according to some embodiments.

[0013] Figure 3D is a diagram showing some embodiments of the present invention. Figure 3C Schematic right side view of the operation shown.

[0014] Figure 4A is a schematic perspective view illustrating an automated wafer carrier handling system according to some embodiments.

[0015] Figure 4B is a schematic perspective view showing a moving mechanism according to some embodiments.

[0016] FIG. 5A to FIG. 5C is a schematic front view showing a storage device at various stages of performing an operating method according to some embodiments.

[0017] Figure 5D is a schematic front view showing a wafer carrier being moved from a storage device by a transfer device according to some embodiments.

[0018] Fig. 6A and Figure 6B is a schematic right side view showing a transfer device at various stages of performing an operating method according to some embodiments.

[0019] Fig. 7A is a schematic front view showing the configuration of an automated wafer carrier handling system according to some embodiments.

[0020] Figure 7B is a diagram showing some embodiments of the present invention. Fig. 7A Schematic right side view of the configuration shown.

[0021] Fig. 8A is a schematic perspective view showing the configuration of an automated wafer carrier handling system according to some embodiments.

[0022] Figure 8B is a diagram showing some embodiments of the present invention. Fig. 8A Schematic top view of the configuration shown.

[0023] Fig.9A is a schematic perspective view showing the configuration of an automated wafer carrier handling system according to some embodiments.

[0024] Fig. 9Bis a diagram showing some embodiments of the present invention. Fig.9A Schematic front view of the configuration shown.

[0025] Fig.10 is a schematic perspective view showing the configuration of a load port and a transfer device according to some embodiments.

[0026] Fig.11 is a schematic perspective view showing the configuration of two automated wafer carrier handling systems and load ports according to some embodiments.

[0027] Fig.12 is a schematic perspective view showing a configuration of a load port and an automated wafer carrier handling system including a plurality of storage devices according to some embodiments.

[0028] Fig.13A is a schematic perspective view showing the configuration of a load port and an automated wafer carrier handling system including a plurality of storage devices and a robot arm according to some embodiments.

[0029] Fig. 13B is a diagram showing some embodiments of the present invention. Fig.13A Schematic front view of the configuration shown.

[0030] Fig.14 is a schematic perspective view showing a configuration of a load port and an automated wafer carrier handling system including a plurality of storage devices according to some embodiments.

[0031] Fig.15 is a flow chart illustrating a method of operation of a system for automated wafer carrier handling according to some embodiments. DETAILED DESCRIPTION

[0032] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify embodiments of the present invention. Of course, these are only examples and are not intended to be limiting. For example, the following description in which a first feature is formed on or on a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, embodiments of the present invention may reuse reference numbers and / or letters in various examples. This repetition is for the purpose of brevity and clarity, rather than indicating the relationship between the various embodiments and / or configurations discussed by itself.

[0033] Additionally, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature shown in a figure to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be in other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0034] Semiconductor manufacturing facilities, such as semiconductor fabs (FABs), may typically utilize manual movement of semiconductor wafers in wafer carriers, such as wafer boxes, containers, etc., between different wafer processing or storage areas around the fab. However, typical manual movement may be resource intensive and prone to inefficiencies due to the need for manual movement and control. Various embodiments of systems and operating methods for automated wafer handling are provided herein, including different types of mechanisms that can autonomously coordinate among themselves to move wafer carriers to be transferred to a load port, thereby minimizing labor requirements and improving manufacturing efficiency.

[0035] Figure 1A is a schematic perspective view showing an automated wafer carrier handling system according to some embodiments, Figure 1B is a schematic front view showing an automated wafer carrier handling system according to some embodiments, Figure 1C is a schematic right side view showing an automated wafer carrier handling system according to some embodiments, Figure 1D According to some embodiments Figure 1C Schematic enlargement of the dashed area depicted in .

[0036] Reference Figures 1A to 1D The automated wafer carrier handling system 100 includes a storage device 110 and a conveying device 120. For example, the automated wafer carrier handling system 100 is disposed near a semiconductor processing machine to buffer a load port LP ( Figure 1C1 and 12. The storage device 110 may be configured to receive a plurality of wafer carriers WC (shown in FIG. 1 ). The loading port LP may be fixed to the front end of a semiconductor processing machine or semiconductor manufacturing equipment (not shown). The loading port LP may be configured to receive a wafer carrier WC, and the wafer carrier WC may be loaded on the loading port LP for further processing. The wafer carrier WC may be a box-shaped container that carries one or more semiconductor wafers to be processed. The wafer carrier WC containing semiconductor wafers may be transported between stations in a semiconductor manufacturing facility. In some embodiments, the storage device 110 includes a storage rack 112. For example, the storage rack 112 is a multi-layer structure in which a plurality of compartments 112a are defined. The compartments 112a may be considered as storage locations. Each of the wafer carriers WC may be stored or contained in any one of the compartments 112a. It should be noted that although six compartments 112a are shown, the number and arrangement of the compartments 112a may be adjusted as needed and should not be construed as limiting the embodiments of the present invention.

[0037] The storage rack 112 can be used as a buffer to temporarily store wafer carriers WC waiting to be transferred to the loading port LP. The storage rack 112 may include various guide components, sensors, and tag readers disposed on the compartments 112a to ensure that the wafer carriers WC are stored in the appropriate position. For example, a guide component is installed on each of the compartments 112a to facilitate positioning of the wafer carrier WC when placed. Sensors (such as a present sensor, a tilt sensor, a detecting sensor, etc.) may be installed on each of the compartments 112a to detect whether the wafer carrier WC is in a tilted position. A tag reader may be disposed on each of the compartments 112a and configured to receive wafer data stored on the wafer carrier (such as a radio frequency identification (RFID) tag, etc.).

[0038] In some embodiments, the storage device 110 includes a moving mechanism 114, which is configured to move the wafer carrier WC stored in the compartment 112a to a standby position SP for further transfer to the loading port LP. For example, the moving mechanism 114 is equipped with a carrying member 114a for carrying the wafer carrier WC. The moving mechanism 114 may include a driving unit 114b, which is configured to drive the carrying member 114a and provide at least one degree of freedom of movement. The carrying member 114a may be or may include a stage, a platform, a fork, a clamp, etc. The carrying member 114a may take various forms as long as the wafer carrier WC is stably carried thereon during transfer. In some embodiments, the carrying member 114a includes an engaging component (not shown) disposed on a receiving surface of the carrying member 114a to guide and / or engage the wafer carrier WC in an appropriate position on the carrying member 114a. In some embodiments, each of the compartments 112a is equipped with a slide rail by which the carrying member 114a driven by the driving unit 114b can be moved into and out of the compartment 112a. As another option, the slide rail in the compartment 112a is omitted.

[0039] For example, with the aid of the drive unit 114b, the carrier member 114a carrying the wafer carrier WC performs reciprocating movement. In some embodiments, the drive unit 114b includes a z-axis mover 114bz assembled to the bottom of the storage rack 112. The carrier member 114a can be arranged on the z-axis mover 114bz to be vertically moved by the z-axis mover 114bz. For example, with the aid of the z-axis mover 114bz, the carrier member 114a carrying the wafer carrier WC performs up and down linear movement in the Z-axis direction. In some embodiments, the z-axis mover 114bz includes a scissor lift having a plurality of cross arm pairs pivotally engaged with each other at a cross point. The z-axis mover 114bz can be equipped with any suitable drive assembly (e.g., a hydraulic cylinder, etc.) to drive the scissor lift. The z-axis mover 114bz may include motor gears, shafts, bearings, guide rails and / or any suitable drive components for driving the carrier member 114a. It should be noted that the z-axis mover 114bz may be any type of lifting device (e.g., belt drive, chain drive, screw drive, gear drive, etc.) for lifting and lowering the carrier member 114a.

[0040] In some embodiments, the drive unit 114b includes an x-axis mover 114bx, which is disposed on the carrier member 114a and is capable of driving the carrier member 114a to perform back and forth linear motion in the x-axis direction. For example, the x-axis mover 114bx includes a linear guideway, which includes a slide block operably mounted on the guideway for guiding the carrier member 114a. The x-axis mover 114bx may include other components assembled to the linear guideway, such as a motor gear, a shaft, a bearing and / or any suitable drive component. It should be noted that the x-axis mover 114bx can be used as any suitable mechanism for translating the carrier member 114a. The drive unit 114b may have other configurations as long as the wafer carrier WC at the storage position (i.e., the compartment 112a) can be transferred to the standby position SP. The x-axis translator 114bx and the z-axis translator 114bz assembled to the storage rack 112 may provide two degrees of freedom of movement, such as vertical movement between the top and bottom of the storage rack 112 and horizontal movement to either side of the storage rack 112 .

[0041] In some embodiments, the transfer device 120 includes a moving mechanism for providing at least one degree of freedom of movement above the storage rack 112, the moving mechanism including a track 122 and a robot 124. The track 122 may be an overhead track unit connected to the top of the storage rack 112, and the robot 124 may be movably connected to the track 122. For example, the robot 124 may slide through the track 122 to move between the storage device 110 and the load port LP ( Figure 1C 124 is a robot arm 124 that is configured to transfer wafer carriers WC between the support member 114a at the standby position SP and the receiving surface of the loading port LP. In some embodiments, the robot arm 124 may include a gripper or other suitable means for manipulating the wafer carrier WC between the carrier member 114a at the standby position SP and the receiving surface of the loading port LP. In some embodiments, the robot arm 124 is configured to pick up, move and put down the wafer carrier WC. For example, the robot arm 124 is equipped with a y-axis mover 124a, and the y-axis mover 124a is configured to provide one degree of freedom of movement. The robot arm 124 can be driven by the y-axis mover 124a to move forward and backward in the Y-axis direction along the track 122. The robot arm 124 is optionally equipped with a z-axis mover to move up and down along the Z-axis direction. In other embodiments, the robot arm 124 is equipped with multiple movers (e.g., a y-axis mover, an x-axis mover, a z-axis mover, or a combination thereof), and the multiple movers are configured to provide multi-degree-of-freedom movement.

[0042] In some embodiments, the automated wafer carrier handling system 100 includes a user interface panel 130, which is mounted on the storage rack 112 of the storage device 110 and faces the operator of the automated wafer carrier handling system 100. For example, the user interface panel 130 and the load port LP are arranged at opposite sides of the storage rack 112. In some embodiments, the user interface panel 130 is installed between two vertical rows of compartments 112a. The user interface panel 130 may include any type of interface for input by the operator and / or output to the operator. For example, the user interface panel 130 accommodates various motors and controls for operating the automated wafer carrier handling system 100. For example, the handling and / or transporting operations are performed under automatic control implemented using a controller 132 of the user interface panel 130, and the controller 132 sends control signals for operating the storage device 110 and the conveying device 120 without the intervention of the operator. The controller 132 may include, but is not limited to, a monitor, a computing device, or a mobile device, etc., for controlling the movement of the storage device 110 and the conveying device 120 through program instructions, codes, etc. In some embodiments, the controller 132 interfaces with the mobile mechanisms of the storage device 110 and / or the transport device 120 using hardwire or wireless technology. The controller 132 may also be designed to communicate with controllers coupled to processing stations. In some embodiments, the user interface panel 130 includes hardware and software to allow the automated wafer carrier handling system 100 to communicate with other processing systems over a network. The user interface panel 130 may allow an operator to manually and / or remotely manipulate the automated wafer carrier handling system 100.

[0043] In some embodiments, the automated wafer carrier handling system 100 includes a signal pole 140 mounted on the front top of the storage rack 112. The signal pole 140 can be programmed to send a signal to the operator regarding certain conditions. In some embodiments, the signal pole 140 acts as a barrier above the load port LP. For example, the rear side BS of the storage rack 112 is shielded by the cover plate 112b, while the other sides of the storage rack 112 (such as the front side FS, the right side RS, and the left side LS) may not be covered by any shielding plate (the references to the "front side", "rear side", "right side", and "left side" are from the perspective of the load port LP). Figure 1A 112a). For example, the rear side of each compartment 112a is covered by the cover plate 112b, while the other sides are uncovered. In such embodiments, the storage device 110 may include a light curtain (not shown) or other detection device arranged on at least the front side FS of the storage rack 112 to protect the compartment 112a by detecting whether something accidentally enters the compartment 112a. The details will be described later in conjunction with the various figures.

[0044] Continue to refer to Figure 1C and Figure 1D In some embodiments, the storage device 110 is equipped with a quick positioning mechanism 150 to quickly and easily position the storage rack 112 in place during installation. For example, the quick positioning mechanism 150 of the storage device 110 includes a plurality of support feet disposed on the bottom of the storage rack 112 and a positioning assembly disposed on the support feet. The positioning assembly can be used to quickly position the storage rack 112 during installation, and to reposition the storage rack 112 when the storage rack 112 is displaced or moved and then moved back to its original position. With the help of the quick positioning mechanism 150, the storage rack 112 can be repositioned without the need for a recalibration action of the moving mechanism 114 to achieve rapid installation. In some embodiments, the storage device 110 is equipped with a quick release mechanism 160 to quickly and easily remove the storage rack 112 from the automated wafer carrier handling system 100. For example, the quick release mechanism 160 is disposed on the bottom of the storage device 110 and includes a handle 162, a buckle 164 connected to the handle, and a positioning pin 166 disposed beside the handle 162 and the buckle 164. The operation method of the quick release mechanism 160 will be described below.

[0045] FIG. 2A to FIG. 2E is a schematic enlarged view showing various stages of the release process of the quick release mechanism according to some embodiments. The method of operating the storage device from a predetermined position includes at least the following steps. Figure 2A When the storage device is locked in a predetermined position, the buckle 164 of the quick release mechanism 160 engages with the transverse latch 165 and the positioning pin 166 is inserted into the positioning hole 167.

[0046] Continue to refer to Figure 2A and Figure 2B When the release process is performed on the storage device, the handle 162 of the quick release mechanism 160 is moved along the rotation axis direction, as indicated by arrow D1. For example, the handle 162 is rotated at least 90 degrees in the counterclockwise direction in the side view of the quick release mechanism 160. In some embodiments, the handle 162 is rotated from the right side to the left side (or from the left side to the right side in other embodiments) relative to the handle 162 and the connecting rod 163 of the buckle 164. When the handle 162 is moved, the buckle 164 connected to the handle 162 is released from the transverse latch 165 and also moves along the rotation axis direction, as indicated by arrow D2. For example, the buckle 164 is rotated from the bottom side to the left side relative to the handle 162 and the connecting rod 163 of the buckle 164. As Figure 2B As shown, after the handle 162 and the buckle 164 move, the handle 162 and the buckle 164 are located on the same side (eg, left side) of the connecting rod 163. For example, the handle 162 is located above the buckle 164.

[0047] Continue to refer to Figure 2B , also refer to Figure 2C , the handle 162 and the buckle 164 are moved toward the locking position along the rotation axis direction indicated by the arrow D3. For example, the handle 162 and the buckle 164 are rotated clockwise to the right side of the connecting rod 163 in the side view of the quick release mechanism 160.

[0048] Reference Figure 2D , the lateral protrusion 166a of the positioning pin 166 is moved along the rotation axis direction indicated by the arrow D4. For example, the lateral protrusion 166a of the positioning pin 166 is rotated in a clockwise direction in a top view of the quick release mechanism 160. In some embodiments, when the storage device is locked in a predetermined position, the lateral protrusion 166a of the positioning pin 166 is engaged with the bottom latch 168a. The lateral protrusion 166a of the positioning pin 166 is moved to release the lateral protrusion 166a from the bottom latch 168a.

[0049] Continue to refer to Figure 2D , also refer to Figure 2E , after releasing the lateral protrusion 166a of the positioning pin 166 from the bottom latch 168a, the lateral protrusion 166a of the positioning pin 166 is moved upward, as indicated by arrow D5. For example, when the lateral protrusion 166a is moved upward, the portion of the positioning pin 166 inserted into the positioning hole 167 is also moved out of the positioning hole 167. The lateral protrusion 166a of the positioning pin 166 can be rotated in a counterclockwise direction in a top view so that the lateral protrusion 166a is engaged with the top latch 168b. When the buckle 164 is released from the lateral latch 165 and the positioning pin 166 is moved out of the positioning hole 167, the storage device is ready to be moved away from the predetermined position. The reverse operation sequence can be performed to lock the storage device in a predetermined position by the quick release mechanism 160.

[0050] FIG. 3A to FIG. 3C is a schematic front view showing various stages of a storage device performing an operation method according to some embodiments, Figure 3D is a diagram showing some embodiments of the present invention. Figure 3C It should be noted that for ease of illustration and better understanding of the movement of the storage device, FIG. 3A to FIG. 3D Some components are omitted (e.g., user interface panel 130 and signal lever 140). The automated wafer carrier handling system can be used to automatically handle and transport wafer carriers between storage racks and load ports without having to wait for an operator to load the wafer carrier on the load port. The method of operating the automated wafer carrier handling system includes at least the following steps. Although the method of operating is shown and described below as a series of actions or events, it should be understood that the order in which such actions or events are shown should not be interpreted as having a limiting meaning.

[0051] Reference Figure 3A and Figure 3B , the wafer carrier WC can be placed into the storage rack 112 manually or by moving a robot arm (not shown). After the wafer carrier WC is placed on the storage rack 112, the driving unit 114b controlled by the controller can drive the bearing member 114a to move toward a predetermined storage position (i.e., any one of the compartments 112a), and transfer the wafer carrier WC from the storage position to the standby position SP. In some embodiments, the storage position is separated from the standby position. For example, the standby position SP is set to be located in the middle and inside of the storage rack 112, such as the middle position between the compartments 112a of two vertical rows of the storage rack 112. In other embodiments, according to design requirements, the standby position SP is set to be located at other sides (e.g., left side, right side, top side, bottom side, etc.) of the storage rack 112. It should be noted that the standby position can be adjusted according to the relative positions of the storage rack 112, the loading port LP, and the conveying device 120.

[0052] Taking the wafer carrier WC at the lower right corner of the storage rack 112 as an example, the carrying member 114a driven by the x-axis mover 114bx of the driving unit 114b can be moved to the compartment 112a at the lower right corner of the storage rack 112 to be positioned at the storage position. The wafer carrier WC in the compartment 112a can be engaged and / or fixed to the carrying member 114a. For example, the carrying member 114a may include a sensor for sensing the position of the wafer carrier WC, a clamp for fixing the wafer carrier WC during transportation, or any suitable component for completing the operation. Next, the wafer carrier WC carried by the carrying member 114a is taken out from the compartment 112a to the middle and bottom of the storage rack 112, as shown in FIG. Figure 3B It should be understood that the moving mechanism 114 may include any suitable components to perform the step of moving the wafer carrier WC out of the compartment 112a, or may be configured in any manner to perform the step of moving the wafer carrier WC out of the compartment 112a.

[0053] Reference Figure 3C and Figure 3D After the wafer carrier WC in the compartment 112a at the lower right corner of the storage rack 112 is moved to the lower middle position of the storage device 110, the carrying member 114a carrying the wafer carrier WC can be driven by the z-axis mover 114bz to move upward, thereby being positioned at the standby position SP, as shown in FIG. Figure 3CAs shown. Next, the robot arm 124 may be driven to move forward and backward, thereby transferring the wafer carrier WC at the standby position SP. For example, the robot arm 124 is driven to move into the storage rack 112 via the rail 122, thereby being positioned at the standby position SP, and then the robot arm 124 is driven to grab the wafer carrier WC from the carrying member 114a. Next, under the drive of the y-axis mover 124a, the robot arm 124 carrying the wafer carrier WC may be moved out of the storage rack 112 to be positioned above the receiving surface LPs of the loading port LP. Subsequently, the robot arm 124 is driven to load the wafer carrier WC onto the receiving surface LPs of the loading port LP, as shown. Figure 3D In some embodiments, the bottom of the standby position SP in the storage device 110 is substantially flush with the receiving surface LPs of the load port LP, so that the robot 124 can be driven to hold the wafer carrier WC and translate the wafer carrier WC between the storage device 110 and the load port LP. In other embodiments where the standby position SP in the storage device 110 is not flush with the receiving surface LPs of the load port LP, the robot 124 can be driven to lift and / or lower in order to grab the wafer carrier WC from the carrier member 114a or load the wafer carrier WC on the load port LP.

[0054] In some embodiments, the reverse order of operations may be performed to return the wafer carrier WC to the compartment 112a. It should be noted that although the foregoing method is based on the wafer carrier WC in the compartment 112a at the lower right corner of the storage rack 112, some of the above actions may occur in a different order and / or simultaneously with other actions or events other than those shown and / or described herein. In addition, not all of the actions shown may be required to implement one or more aspects or embodiments described herein. In addition, one or more of the actions depicted herein may be implemented in one or more separate actions and / or stages.

[0055] For example, in order to transfer the wafer carrier WC in the compartment 112a at the upper right corner of the storage rack 112, the carrying member 114a may first be lifted by the z-axis mover 114bz. Next, the x-axis mover 114bx may drive the carrying member 114a to move forward to be positioned below the wafer carrier WC in the compartment 112a at the upper right corner of the storage rack 112, and then the wafer carrier WC is carried by the carrying member 114a, and the carrying member 114a is driven by the x-axis mover 114bx to take out the wafer carrier WC from the compartment 112a. The carrying member 114a carrying the wafer carrier WC is driven as needed to be positioned at a standby position for the robot arm 124 to transfer. It should be understood that while still remaining within the scope of the embodiments of the present invention, variations of moving the wafer carrier WC at different positions on the storage rack 112 may be implemented by similar concepts as described above.

[0056] Figure 4A is a schematic perspective view showing an automated wafer carrier handling system according to some embodiments, Figure 4B is a schematic perspective view showing a moving mechanism according to some embodiments. Figure 4A and Figure 4B , the automated wafer carrier handling system 200 includes a storage device 210 and a conveying device 220. The storage device 210 may include a storage rack 212, in which a plurality of compartments 212a are defined. Wafer carriers WC may be temporarily stored in the compartments 212a. The storage rack 212 may be similar to the above-mentioned storage rack 112 and include various guide members, sensors, label readers, etc. to ensure that the wafer carriers WC are stored in the appropriate position. It should be noted that although eight compartments 212a are shown, the number and arrangement of the compartments 212a may be adjusted as required and should not be construed as limiting the embodiments of the present invention.

[0057] In some embodiments, the storage device 210 includes a moving mechanism 214, which is configured to move the wafer carrier WC contained in the compartment 212a to the standby position SP for transfer to the loading port LP. The moving mechanism 214 can be installed in the middle of the storage rack 212 to facilitate access to the compartments 212a on the left and right sides of the storage rack 212. It should be noted that according to design requirements, there may be other arrangements for the moving mechanism 214 and the compartment 212a. In some embodiments, the moving mechanism 214 is equipped with a carrying member 214a configured to carry the wafer carrier WC. The moving mechanism 214 may include a drive unit 214b, which provides at least one degree of freedom of movement and is configured to move the carrying member 214a to the desired position. It should be noted that although the carrying member 214a is shown as a fork, the carrying member 214a can take various forms as long as the carrying member 214a can firmly hold the wafer carrier WC when moving. In some embodiments, the carrier member 214a includes a guide / engagement component (not shown) disposed on a receiving surface of the carrier member 214a to guide / engage the wafer carrier WC in a proper position on the carrier member 214a.

[0058] For example, the bearing member 214a is assembled to the driving unit 214b so that the bearing member 214a is driven by the driving unit 214b to perform reciprocating movement. In some embodiments, the driving unit 214b includes a z-axis mover 214bz and the bearing member 214a is installed on the z-axis mover 214bz so that the bearing member 214a driven by the z-axis mover 214bz can reciprocate linearly in the Z-axis direction. In some embodiments, the z-axis mover 214bz includes a linear slide rail, which includes a track RZ and a slider BZ that slides and moves on the track RZ. The bearing member 214a can be fixed to the slider BZ so that the z-axis mover 214bz can drive the bearing member 214a to move linearly along the track RZ. For example, the track RZ is installed on the cover plate 212b at the rear side BS of the storage rack 212 and can extend between the top and the bottom of the storage rack 212. It should be noted that the type of z-axis mover 214bz shown in this article is only exemplary. The z-axis mover 214bz may be any type of lifting device for raising and lowering the carrier member 214a.

[0059] In some embodiments, the drive unit 214b includes an x-axis mover 214bx, which carries the carrier member 214a and is capable of driving the carrier member 214a to perform back and forth linear motion in the x-axis direction. In some embodiments, the x-axis mover 214bx and the z-axis mover 214bz assembled to the storage rack 212 can provide two degrees of freedom of movement, such as vertical movement between the top and bottom of the storage rack 212 and horizontal movement to either side of the storage rack 212. The x-axis mover 214bx can be similar to the z-axis mover 214bz and include a linear slide rail, which includes a slider BX operably mounted on a track RX for slidably guiding the carrier member 214a. For example, the track RX is mounted on the bottom of the storage rack 212 and can extend to the compartment 212a at the lower right / lower left corner of the storage rack 212. The x-axis mover 214bx may include components assembled to the linear slide rail, such as motor gears, shafts, bearings and / or any suitable drive components. It should be noted that the x-axis mover 214bx may be implemented as any suitable mechanism for translating the carrier member 214a. The driving unit 214b may have other configurations as long as the wafer carrier WC stored in the compartment 212a can be transferred to the standby position SP.

[0060] In some embodiments, the conveyor 220 includes a moving mechanism for providing at least one degree of freedom of movement above the storage rack 212, the moving mechanism including a track 222 and a robotic arm 224. The conveyor 220 may include a gantry 226, which is a frame structure on the side supports 226s to span over the storage device 210. For example, the side supports 226s of the gantry 226 are respectively located on the right side RS and the left side LS of the storage rack 212. The bridge member 226b of the gantry 226 may extend between the side supports 226s and span over the storage rack 212. It should be noted that Figure 4A The orientation and structure of the gantry 226 shown are exemplary only, and the gantry may have other orientations and / or structures. In some embodiments, the track 222 is mounted on the bridge member 226b of the gantry 226 and may extend over the storage device 210 and the load port LP.

[0061] In some embodiments where the loading port LP is located directly behind the storage rack 212 (e.g., on the rear side BS of the storage rack 212), the track 222 disposed on the gantry 226 is substantially perpendicular to the bridge member 226b to provide a transfer path between the storage rack 212 and the loading port LP. It should be noted that the orientation of the track 222 can be adjusted according to the relative positions of the storage device 210 and the loading port LP. In some embodiments, the robot 224 may include a gripper or other suitable means of manipulating the wafer carrier WC. The robot 224 may be movably connected to the track 222 and may be configured to pick up, move, and load the wafer carrier WC. In some embodiments, the robot 224 is driven by a mover 224a to move forward and backward along the track 222 in the Y-axis direction and move up and down in the Z-axis direction as needed to reach the standby position SP. In other embodiments, the robot 224 is equipped with a plurality of movers (e.g., a y-axis mover, an x-axis mover, a z-axis mover, or a combination thereof) configured to provide multi-degree-of-freedom movement.

[0062] In some embodiments, the automated wafer carrier handling system 200 includes a user interface panel 230 mounted on a storage rack 212 of a storage device 210. For example, the user interface panel 230 is mounted on the front side FS of the storage rack 212 without covering the compartment 212a. The user interface panel 230 includes a controller 232, which may be a computing device that controls the movement of the storage device 210 and the conveying device 220 through program instructions, codes, etc. The user interface panel 230 may be similar to the user interface panel 130 described above, so for the sake of brevity, it will not be described in detail herein. The storage device 210 may be similar to the storage device 110 and include a quick release / positioning mechanism. For the sake of brevity, the quick release / positioning mechanism will not be described in detail.

[0063] In some embodiments, one or more detection devices LC may be arranged on at least the front side FS of the storage rack 212 that is not protected by the cover plate to protect the compartment 212a. For example, the detection device LC includes a light curtain, an optical sensor, a proximity sensor, etc. to detect whether something accidentally enters the compartment 212a. In some embodiments, the detection device LC (such as a light curtain) is automatically enabled and disabled according to the operator's actions. For example, when enabled, the light curtain forms a safety curtain to detect whether something enters the compartment 212a. When the operator loads the wafer carrier WC in the compartment 212a, the light curtain is disabled and the movement of the moving mechanism 214 can be paused.

[0064] FIG. 5A to FIG. 5C is a schematic front view showing various stages of a storage device performing an operation method according to some embodiments, Figure 5D 2 is a schematic front view showing a wafer carrier being moved from a storage device by a transfer device according to some embodiments. It should be noted that in order to better understand the movement performed behind the user interface panel 230, FIG. 5A to FIG. 5C Some components (e.g., user interface panel 230) are omitted. The automated wafer carrier handling system can be used to automatically handle and transport wafer carriers between storage racks and load ports without having to wait for an operator to load the wafer carrier on the load port. The method of operating the automated wafer carrier handling system includes at least the following steps. Although the method of operating is shown and described below as a series of actions or events, it should be understood that the order in which such actions or events are shown should not be construed as limiting.

[0065] Reference Figure 5A and Figure 5B , any one of the wafer carriers WC can be placed into each of the compartments 212a of the storage rack 212 manually or by moving a robot (not shown). The drive unit 214b of the storage device 210 controlled by the controller can drive the carrying member 214a to move toward the predetermined compartment 212a to transfer the wafer carrier WC from the predetermined storage position (i.e., any one of the compartments 212a) to the standby position SP. In some embodiments, the standby position SP is separated from the storage position. The standby position SP can be higher than the storage position (e.g., any one of the compartments 212a at the top of the storage rack 212) relative to the ground GS so that the robot arm can grab it. For example, the standby position SP is set to be located at the upper end of the track RZ between the compartments 112a of two vertical rows. It should be noted that the standby position SP can be adjusted according to the configuration of the storage rack 212, the loading port LP and the conveying device 220.

[0066] Taking the wafer carrier WC at the lower right corner of the storage rack 212 as an example, the carrying member 214a driven by the x-axis mover 214bx of the driving unit 214b can be moved to the compartment 212a at the lower right corner of the storage rack 212 to be positioned at the storage position. Next, the wafer carrier WC in the compartment 212a at the lower right corner of the storage rack 212 is carried by the carrying member 214a and then linearly moved out of the compartment 212a by the x-axis mover 214bx to the middle of the storage rack 212, as shown in FIG. Figure 5B As shown. For example, the carrying member 214a may include a sensor for sensing the position of the wafer carrier WC, a clamp for fixing the wafer carrier WC during movement, or any suitable component for completing the operation. It should be understood that the moving mechanism 214 may include suitable components to perform the step of moving the wafer carrier WC out of the compartment 212a, or may be configured in any manner to perform the step of moving the wafer carrier WC out of the compartment 212a.

[0067] Reference Figure 5C and Figure 5D After the wafer carrier WC is moved out of the compartment 212a at the lower right corner of the storage rack 212, the carrier member 214a carrying the wafer carrier WC may be driven by the z-axis mover 214bz to move upward to the standby position SP along the track RZ. Next, the gripper of the robot 224 may be driven by the mover 224a to descend to grab the wafer carrier WC from the carrier member 214a, and then the gripper holding the wafer carrier WC may move upward and leave the storage device 210, as shown in FIG. Figure 5C Subsequently, the robot arm 224 driven by the mover 224a can be moved along the track 222 to be positioned above the receiving surface of the load port (such as Fig. 6A shown).

[0068] In some embodiments, after the semiconductor wafer undergoes processing in the semiconductor processing machine, the wafer carrier WC containing the processed semiconductor wafer can be returned to the same storage device 210. The reverse operation sequence loads the wafer carrier WC from the receiving surface of the load port to the standby position and stores the wafer carrier WC back in the compartment 212a. In other embodiments, after processing in the semiconductor processing machine, the wafer carrier WC is transported to another storage device or another shelving unit to wait for transfer to the next station.

[0069] Fig. 6A and Figure 6B is a schematic right side view showing various stages of a transmission device performing an operating method according to some embodiments. Although the operating method is shown and described below as a series of actions or events, it should be understood that the order in which such actions or events are shown should not be interpreted as limiting. It should be noted that the same reference numbers are used to identify the same elements.

[0070] Reference Fig. 6A , the automated wafer carrier handling system 300 includes a storage device 210 and a conveying device 320. The conveying device 320 includes a moving mechanism, which includes a track 322 and a robot 224 movably connected to the track 322. The conveying device 320 may further include a gantry 326, which includes a side support 326s and a bridge member 326b. For example, the side support 326s is located behind the rear side BS of the storage rack 212 and the bridge member 326b extends above the standby position SP and the loading port LP. The loading port LP may be located behind the rear side BS of the storage rack 212. In some embodiments, two side supports 326s are arranged at two opposite sides of the loading port LP and one of the side supports 326s is arranged between the loading port LP and the rear side BS of the storage rack 212. In some embodiments, the bridge member 326b is arranged above the storage rack 212 and extends toward the side support 326s away from the storage device 210. For example, the bridge member 326b is provided to extend in the Y-axis direction. The rail 322 may be provided integrally on the bridge member 326b of the door frame 326 so that the rail 322 extends along the bridge member 326b in the direction between the storage device 210 and the load port LP.

[0071] Continue to refer to Fig. 6A And refer to Figure 6B , the wafer carrier WC is transferred to the standby position SP and picked up by the robot arm 224, as in FIG. 5A to FIG. 5D As described in. Next, the robot arm 224 moves along the track 322 away from the storage device 210 to be positioned above the receiving surface LPs of the loading port LP. Subsequently, the gripper of the robot arm 224 driven by the mover 224a can be lowered to load the wafer carrier WC on the receiving surface LPs of the loading port LP. After loading the wafer carrier WC, the gripper of the robot arm 224 can be released and moved upward to grab another wafer carrier WC at the standby position SP. The operation of transferring the wafer carrier from the compartment (i.e., the storage position) to the standby position and the operation of transferring the wafer carrier from the standby position to the loading port can be performed simultaneously to improve manufacturing efficiency, or can be performed sequentially according to demand. After the wafer carrier WC is loaded on the loading port LP, the following steps can be performed, such as unloading the semiconductor wafer, transferring the semiconductor wafer to a semiconductor processing machine, performing a process on the semiconductor wafer, etc.

[0072] In some embodiments, after the semiconductor wafer undergoes processing in the semiconductor processing machine, the wafer carrier WC containing the processed semiconductor wafer is loaded back to the load port LP, and the reverse operation sequence is to remove the wafer carrier WC from the receiving surface LPs of the load port LP and return the wafer carrier WC to the standby position SP. In other embodiments, after processing in the semiconductor processing machine, the wafer carrier WC containing the processed semiconductor wafer is transported to another load port and / or another storage device to wait for transfer to the next station. It should be noted that the aforementioned operation method can be applied to other embodiments described elsewhere in the embodiments of the present invention.

[0073] Fig. 7A is a schematic front view showing a configuration of an automated wafer carrier handling system according to some embodiments, Figure 7B is a diagram showing some embodiments of the present invention. Fig. 7A Schematic right side view of the configuration shown. Fig. 7A and Figure 7B , the automated wafer carrier handling system 400A includes a storage device 210 and a transfer device 420A. The load ports LP1 and LP2 may be arranged side by side, and the storage device 210 may be arranged next to either of the load ports LP1 and LP2. For example, the storage device 210, the load ports LP1 and LP2 are arranged in a row along the X-axis direction. In some embodiments, the load ports LP1 and LP2 arranged on the left side of the storage rack 212 are oriented in the same manner. It should be noted that other configurations / orientations of the load ports and storage devices may exist.

[0074] The conveying device 420A includes a moving mechanism, which includes a track 422 and a robot 424 movably connected to the track 422. The conveying device 420A may further include a gantry 426, which includes a bridge member 426b and a side support 426s. For example, the bridge member 426b is arranged on the side support 426s and extends above the storage rack 212 and the loading ports LP1 and LP2. In some embodiments, the bridge member 426b of the gantry 426 can span over the storage rack 212 and the loading ports LP1 and LP2 in the X-axis direction. In some embodiments, the side support 426s of the gantry 426 is located behind the rear side BS of the storage rack 212. For example, each of the side support 426s includes a vertical portion 426sv extending along the Z-axis direction and a horizontal portion 426sh connected to the vertical portion 426sv and extending forward to the top of the storage rack 212. The bridge member 426b of the gantry 426 may extend between the horizontal portions 426sh of the side supports 426s. The rail 422 may be assembled to the bridge member 426b of the gantry 426 such that the rail 422 extends along the bridge member 426b over the storage device 210 and the load ports LP1 and LP2.

[0075] In some embodiments, the loading ports LP1 and LP2 are equipped with detection devices LC to protect the receiving surfaces LPs and detect whether something accidentally enters the loading ports LP1 and LP2. In some embodiments, one of the loading ports LP1 and LP2 may be configured to receive a wafer carrier WC containing semiconductor wafers to be processed, and the other of the loading ports LP1 and LP2 may be configured to receive a wafer carrier WC containing processed semiconductor wafers. The wafer carrier WC containing processed semiconductor wafers can be transported to the next processing station manually or by a moving robot (not shown). In other embodiments, both the loading ports LP1 and LP2 are configured to receive a wafer carrier WC containing semiconductor wafers to be processed, and the wafer carrier WC containing processed semiconductor wafers can be loaded onto another (other) loading port disposed on another (other) side of a semiconductor processing machine or semiconductor manufacturing equipment. The robot 424 may be configured to transfer the wafer carrier WC between the loading ports LP1 and LP2 and the storage device 210. It should be noted that more than one robot may be movably mounted on the rail 422 to transfer the wafer carrier WC to the load ports LP1 and LP2 and the storage device 210, respectively.

[0076] Fig. 8A is a schematic perspective view showing the configuration of an automated wafer carrier handling system according to some embodiments, Figure 8B is a diagram showing some embodiments of the present invention. Fig. 8A Schematic top view of the configuration shown. It should be noted that Fig. 8A and Figure 8B The storage device shown in FIG. 1 may be similar to the storage device 210 described above, and thus the details of the storage device are simplified for ease of illustration and better understanding.

[0077] Reference Fig. 8A and Figure 8B , the automated wafer carrier handling system 400B including the storage device 210 and the transfer device 420B can be similar to the automated wafer carrier handling system 400A. In some embodiments, the load ports LP1 and LP2 are arranged on the right side RS of the storage rack 212 and are oriented in the same manner. In other embodiments, the load ports LP1 and LP2 are arranged at the left side LS and the right side RS of the storage rack 212 relative to each other.

[0078] For example, in the top view, the center of the standby position and the center of the receiving surface LPs of the loading ports LP1 and LP2 are substantially aligned with the reference line RL. The reference line RL can be substantially aligned with the center line of the track 422 within the required tolerance, thereby eliminating the occurrence of errors during the steps of picking up and placing the wafer carrier WC by the robot 424. As another option, the center of the standby position is not aligned with the center of the receiving surface LPs of the loading ports LP1 and LP2, and the track 422 can be designed to meet the delivery stroke (delivery stroke) determined according to the configuration of the storage device 210 and the loading ports LP1 and LP2. The track 422 and / or the bridge member 426b may or may not span across the storage device 210. It should be noted that the track 422 can be designed to be linear or non-linear, as long as the track 422 at least spans over the standby position of the storage device 210 and the receiving surface LPs of the loading ports LP1 and LP2. It should be understood that the arrangement described herein is exemplary and its variations can be implemented while still remaining within the scope of the embodiments of the present invention.

[0079] Fig.9A is a schematic perspective view showing the configuration of an automated wafer carrier handling system according to some embodiments, Fig. 9B is a diagram showing some embodiments of the present invention. Fig.9A Schematic front view of the configuration shown. It should be noted that Fig.9A The storage device shown in FIG. 2 may be similar to the storage device 210 described above, and thus the details of the storage device are simplified for ease of illustration and better understanding. Fig. 9B The storage devices 210A and 210B shown represent Fig.9A The same storage device as shown.

[0080] Reference Fig.9A and Fig. 9B , the automated wafer carrier handling system 500 includes a plurality of storage devices (210A, 210B) and a conveying device 520. It should be noted that, Fig.9A and Fig. 9B The two storage devices shown in FIG. 1 are merely exemplary, and the number of storage devices depends on requirements and should not be construed as limiting the embodiments of the present invention.

[0081] For example, the loading ports LP1 and LP2 arranged side by side are located between the storage devices 210A and 210B. In some embodiments, one of the loading ports LP1 and LP2 is configured to receive a wafer carrier WC containing a semiconductor wafer to be processed, and the other of the loading ports LP1 and LP2 may be configured to receive a wafer carrier WC containing a processed semiconductor wafer. The wafer carrier WC containing the processed semiconductor wafer can be transported to the next processing station manually or by a mobile robot (not shown). In other embodiments, both the loading ports LP1 and LP2 are configured to receive a wafer carrier WC containing a semiconductor wafer to be processed. For example, the loading port LP1 is configured to receive a wafer carrier WC transferred from the storage device 210A arranged adjacent to the loading port LP1, and the loading port LP2 is configured to receive a wafer carrier WC transferred from the storage device 210B arranged adjacent to the loading port LP2. The wafer carrier WC containing the processed semiconductor wafer can be loaded onto another (other) loading port arranged on the other (other) side of the semiconductor processing machine or semiconductor manufacturing equipment.

[0082] The conveying device 520 includes a moving mechanism (e.g., a track 522, a robot 524) and a gantry 526. The conveying device 520 may be similar to the conveying device 420A or 420B described above. In some embodiments, the track 522 mounted on the bridge member 526b spans over the two standby positions SP of the storage devices 210A and 210B. With this arrangement, the robot 524 can be driven by a mover to transport the wafer carrier WC between the standby positions SP of the storage devices 210A and 210B and the loading ports LP1 and LP2. In some embodiments, the wafer carrier WC at the standby position SP of the storage devices 210A and 210B is alternately transported to the loading ports (LP1 and / or LP2) along the track 522 by the robot 524. The operation method (e.g., moving the wafer carrier from the compartment of the storage rack to the standby position by the moving mechanism of the storage device, carrying and transferring the wafer carrier at the standby position by the moving mechanism of the transfer device, and loading the wafer carrier on the load port by the moving mechanism of the transfer device, etc.) may be similar to the above-mentioned operation method, so for the sake of brevity, it will not be described in detail. It should be understood that the arrangement described herein is exemplary and its variations may be implemented while still remaining within the scope of the embodiments of the present invention.

[0083] Fig.10 is a schematic perspective view showing the configuration of a load port and a transfer device according to some embodiments. Fig.10, the conveying device 620 may include a moving mechanism (e.g., a track 622 and a robot 624) and a gantry 626. For example, the gantry 626 includes side supports 626s and a bridge member 626b placed between the side supports 626s. The side supports 626s may be spaced apart by a distance determined by the number and size of the loading ports and the storage device. In some embodiments, the side supports 626s are inverted U-shaped frame structures. It should be noted that the side supports 626s may be other types of structures as long as the side supports 626s can be firmly supported on the bridge member 626b. In some embodiments, the track 622 is integrally mounted on the bridge member 626b, and the robot 624 is movably mounted on the track 622. The track 622 and the robot 624 may be similar to the above-mentioned track and robot, so for the sake of brevity, they will not be described again. In some embodiments, the loading ports LP1 and LP2 are arranged side by side with each other and adjacent to one of the side supports 626s. A storage device (not shown) may be installed in the space between the load port LP2 and the other of the side supports 626s. It should be noted that other configurations may exist according to design requirements, such as each load port being separately provided beside the side supports 626s.

[0084] Fig.11 is a schematic perspective view showing the configuration of two automated wafer carrier handling systems and load ports according to some embodiments. Fig.11 , an automated wafer carrier handling system 700A corresponding to the load port LP1 and an automated wafer carrier handling system 700B corresponding to the load port LP2 are provided. The automated wafer carrier handling system 700A may include a storage device 210 and a transfer device 720A, and the automated wafer carrier handling system 700B may include a storage device 210 and a transfer device 720B. It should be noted that the storage device 210 may be similar to the above-mentioned storage device 210, so in order to better understand the orientation of the load ports LP1 and LP2 set behind the storage device, the details of the storage device 210 are simplified and shown in dotted lines.

[0085] In some embodiments, the conveying device 720A includes a moving mechanism, which includes a track 722A and a mechanical arm 724A movably connected to the track 722A. The conveying device 720A may include a gantry 726A, which includes at least two pairs of side supports 726s and a bridge member 726b. For example, the paired side supports 726s are arranged to define the corners of a rectangular area, and the bridge member 726b is placed perpendicular to the paired side supports 726s and spans the distance between the paired side supports 726s. In some embodiments, the storage device 210 is arranged in a rectangular area defined by paired side supports 726s. The gantry 726A may include multiple beams / trusses across each of the side supports 726s and / or the bridge member 726b to strengthen the structure. It should be noted that the illustration of the gantry 726A is only exemplary, and the structure of the gantry can take various forms.

[0086] The arrangement of the track 722A can be adapted according to the relative positions of the standby position SP of the storage device 210 and the receiving surface LPs of the loading port LP1. In some embodiments, the track 722A is placed substantially perpendicular to the bridge member 726b of the gantry 726A, and the robot 724A can be operably connected to the track 722A and configured to move along a linear path defined by the track 722A. As another option, the track 722A is set at an obtuse / acute angle relative to the bridge member 726b of the gantry 726A. It should be noted that Fig.11 The illustration of the conveyor apparatus shown is exemplary only and the conveyor apparatus may be any suitable conveying / pick-up device having any suitable transport path orientation.

[0087] The transfer device 720B includes an arrangement and components similar to the transfer device 720A (e.g., rails 722B, robotic arms 724B, and gantry 726B) to transport wafer carriers WC to and from the loading port LP2. The distance between the transfer devices 720A and 720B can be adjusted according to the layout requirements and should not be interpreted as limiting the embodiments of the present invention. In some embodiments, the loading ports LP1 and LP2 are oriented relative to each other, such as facing each other or facing away from each other. For example, the side where the receiving surface is located is regarded as the front side of the loading port, and the front sides of the loading ports LP1 and LP2 are arranged in opposite axial directions (e.g., the positive X-axis direction and the negative X-axis direction). In some embodiments, the loading ports LP1 and LP2 are respectively configured to load the wafer carrier WC to the semiconductor manufacturing equipment and unload the wafer carrier WC from the semiconductor manufacturing equipment. As another option, the loading ports LP1 and LP2 are both configured to load the wafer carrier WC to the semiconductor manufacturing equipment for further processing.

[0088] In certain embodiments in which the load ports LP1 and LP2 are respectively configured to load / unload wafer carriers WC, the robot arm 724A of the transfer device 720A is configured to pick up the wafer carrier WC at the standby position SP of the storage device 210 below the track 722A of the transfer device 720A, move to the load port LP1, and place it on the receiving surface LPs of the load port LP1 for further semiconductor processing. The robot arm 724B of the transfer device 720B is configured to pick up the wafer carrier WC loaded on the receiving surface (not shown) of the load port LP2, move to the standby position SP of the storage device 210 below the track 722B of the transfer device 720B, and place it on the carrying member of the moving mechanism positioned at the standby position SP. The wafer carrier WC transferred from the load port LP2 may include processed semiconductor wafers and may be moved to an empty compartment of the storage rack by the moving mechanism. Wafer carrier WC placed on storage device 210 under track 722B of transfer device 720B can be transported to the next processing station manually or by moving a robot (not shown). It should be understood that the arrangement described herein is exemplary and variations thereof can be implemented while still remaining within the scope of embodiments of the present invention.

[0089] Fig.12 is a schematic perspective view showing the configuration of a load port and an automated wafer carrier handling system according to some embodiments, the automated wafer carrier handling system including a plurality of storage devices. Fig.12 , the automated wafer carrier handling system 800A includes a plurality of storage devices (210A, 210B, and 210C) and a conveyor 820A. The plurality of storage devices (210A, 210B, and 210C) may be arranged in a row and spaced apart from each other by gaps. In other embodiments, the storage devices (210A, 210B, and 210C) may be arranged adjacent to each other or integrated into a storage device assembly. In some embodiments, the conveyor 820A includes a track 822 disposed above the storage devices (210A, 210B, and 210C), a robot 824 operably connected to the track 822, and a gantry 826 supporting the track 822 and the robot 824.

[0090] In some embodiments, a plurality of loading ports (LP1, LP2, LP3, and LP4) are respectively arranged at two opposite ends of the semiconductor processing machine PT and located at the front end of the semiconductor processing machine PT. For example, loading ports LP1 and LP2 are arranged on the left side of the front end of the semiconductor processing machine PT to receive a wafer carrier WC containing semiconductor wafers to be processed, and loading ports LP3 and LP4 are arranged on the right side of the front end of the semiconductor processing machine PT to receive a wafer carrier WC containing semiconductor wafers that have been processed. It should be noted that the “front side”, “right side”, and “left side” mentioned are from the perspective of the automated wafer carrier handling system 800A at Fig.12 In other embodiments, one of the groups of load ports (e.g., the groups of LP1 and LP2 or the groups of LP3 and LP4) is configured to receive a wafer carrier WC containing semiconductor wafers to be processed, and another of the groups of load ports is configured to receive a wafer carrier WC containing semiconductor wafers that have been processed. Alternatively, all of the load ports (LP1, LP2, LP3, and LP4) disposed at the front end of the semiconductor processing tool PT are configured to receive wafer carriers WC containing semiconductor wafers to be processed, and some other load ports (not shown) may be disposed at other sides of the semiconductor processing tool to receive wafer carriers WC containing semiconductor wafers that have been processed.

[0091] For example, the row of storage devices 210 is arranged between the loading ports LP and in front of the semiconductor processing machine PT. The semiconductor processing machine PT can be used for chemical vapor deposition (CVD), physical vapor deposition (PVD), rapid thermal processing (RTP), ion implantation, diffusion, oxidation, photolithography, etching, chemical mechanical polishing (CMP), testing, etc. The track 822 of the transfer device 820A can span over the storage devices (210A, 210B and 210C) and the loading ports (LP1, LP2, LP3 and LP4), and the robot 824 is configured to move between the storage devices (210A, 210B and 210C) and the loading ports (LP1, LP2, LP3 and LP4) through the track 822. The gantry 826 including the bridge 826b and the side support 826s can be similar to the Fig. 7A and Figure 7BThe gantry 426 described above may be provided with one or more additional side supports 826s, depending on the length of the track 822. The number of side supports 826s and the length of the track 822 depend on the requirements of the arrangement and should not be construed as limiting the embodiments of the present invention. It should also be noted that Fig.12 The configuration shown is merely exemplary, and the number of storage devices, transfer devices, and load ports should not be construed as limiting the embodiments of the present invention.

[0092] Fig.13A is a schematic perspective view showing the configuration of a load port and an automated wafer carrier handling system according to some embodiments, the automated wafer carrier handling system including a plurality of storage devices and a robot arm, Fig. 13B is a diagram showing some embodiments of the present invention. Fig.13A Schematic front view of the configuration shown. Fig.13A and Fig. 13B , the automated wafer carrier handling system 800B is similar to the Fig.12 , but the automated wafer carrier handling system 800B includes more than one robot 824A and 824B. The robot 824A and 824B can be configured to move along the track 822 without interfering with each other to transport the wafer carrier WC between the load port (e.g., LP1, LP2, LP3, and LP4) and the standby position SP of the storage device (e.g., 210A, 210B, and 210C). In other embodiments, the robot 824A and 824B are configured to travel along different lanes of the track 822 to transport the wafer carrier WC between the storage device (210A, 210B, and 210C) and the load port (LP1, LP2, LP3, and LP4).

[0093] In some embodiments, all storage devices (210A, 210B, and 210C) are configured to temporarily store wafer carriers WC containing semiconductor wafers to be processed. In other embodiments, at least one of the storage devices (210A, 210B, and 210C) is configured to temporarily store wafer carriers WC containing processed semiconductor wafers, and one of the robotic arms 824A and 824B is configured to transport the wafer carriers WC containing processed semiconductor wafers to the one of the storage devices (210A, 210B, and 210C), so that the wafer carriers WC stored in the one of the storage devices (210A, 210B, and 210C) can be transported to the next processing station manually or by moving a robotic arm (not shown). It should be understood that the arrangement described herein is exemplary, and variations thereof can be implemented while still remaining within the scope of the embodiments of the present invention.

[0094] Fig.14is a schematic perspective view showing the configuration of a load port and an automated wafer carrier handling system according to some embodiments, the automated wafer carrier handling system including a plurality of storage devices. Fig.14 , the automated wafer carrier handling system 900 includes at least one set of storage equipment and conveying equipment (e.g., 910A and 920A, 910B and 920B). In some embodiments, the storage equipment 910A includes a storage rack 912A and a moving mechanism 914A. The storage rack 912A is a shelving unit on which a plurality of wafer carriers WC can be temporarily stored. For example, the storage rack 912A provides a large number of storage locations to buffer wafer carriers waiting to be transferred to the loading port. In some embodiments, the carrying member 914c disposed on one side of the storage rack 912A is configured to temporarily carry the wafer carrier WC for the conveying equipment to transport to the loading port. In some embodiments, the conveying equipment 920A includes a track 922A, a robot 924A operably connected to the track 922A, and a gantry 926A supporting the track 922A and the robot 924A.

[0095] In some embodiments, the mobile loading robot 10 is configured to transport wafer carriers WC between storage racks (e.g., 912A and / or 912B) and a carrier member 914c. The mobile loading robot 10 may include a gripper or other means of carrying a wafer carrier from one place to another. For example, the mobile loading robot 10 is driven by a controller to perform operations such as positioning in front of a compartment (i.e., a storage location) of a storage rack 912A storing wafer carriers WC, moving wafer carriers WC out of the compartment of the storage rack 912A, carrying wafer carriers WC to the carrier member 914c, and placing wafer carriers WC on the carrier member 914c.

[0096] In some embodiments, the moving mechanism 914A includes a driving unit 914d. The driving unit 914d may include a z-axis mover 914dz, which is arranged on the carrying member 914c and is configured to drive the carrying member 914c to perform reciprocating movement in the Z-axis direction. For example, after the wafer carrier WC is retrieved from the storage rack 912A by the mobile loading robot 10 and the wafer carrier WC is placed on the carrying member 914c, the carrying member 914c carrying the wafer carrier WC is driven by the z-axis mover 914dz to move upward to the standby position. The driving unit 914d includes an x-axis and / or y-axis mover that can be configured to perform multi-degree-of-freedom movement as needed. In other embodiments, the configuration of the carrying member 914c and the driving unit 914d is similar to the configuration of the above-mentioned carrying member and the driving unit, and the carrying member 914c can be driven by the driving unit 914d to move vertically and / or laterally in the storage rack 912A and transport the wafer carrier WC to the standby position. As another option, the storage device 910A is not equipped with any moving mechanism. In such an embodiment, after the wafer carrier WC is taken out from the storage rack 912A by the mobile loading robot 10 and placed on the carrying member 914c, the robot arm 924A of the transfer device 920A is configured to move to a position above the carrying member 914c and lower to grab the wafer carrier carried by the carrying member 914c.

[0097] In some embodiments, the gantry 926A includes: at least two pairs of side supports 926s and a bridge member 926g, at least two pairs of side supports 926s are arranged to define the corners of a rectangular area, and the bridge member 926g is placed perpendicular to the paired side supports 926s and spans the distance between the paired side supports 926s. The bearing member 914c can be set in the rectangular area defined by the paired side supports 926s. In some embodiments, the bridge member 926g includes an extension structure 926gs, that is, a structure extending beyond the rectangular area defined by the paired side supports 926s. The extension structure 926gs can be located directly above the receiving surface LPs of the loading port LP1. The track 922A can be mounted on the bridge member 926g, so that the robot 924A can be configured to move along the track 922A between the standby position SP and the receiving surface LPs of the loading port LP1. For example, the track 922A includes a first section Tx and a second section Ty connected to the first section Tx, wherein the first section Tx may be disposed on the bridge member 926g along the X-axis direction, and the second section Ty may be disposed on the bridge member 926g along the Y-axis direction. With this configuration, the robot 924A may be configured to move in the X-axis direction and the Y-axis direction via the track 922A.

[0098] In some embodiments, the load ports LP1 and LP2 are equipped with a detection device LC to protect the receiving surface LPs by detecting whether something accidentally enters the load ports LP1 and LP2. The detection device LC used as a safety device can be extended to protect the area defined by the extension structure 926gs of the bridge member 926g. In some embodiments where the detection device LC includes a light curtain, when an object breaks the light beam of the light curtain, the detection device LC can be disabled and a signal can be sent to a controller (not shown) to pause the movement of the robot 924A. The operability can be improved by using the detection device LC.

[0099] The grouped storage device 910B and the transfer device 920B may include arrangements and components similar to the grouped storage device 910A and the transfer device 920A, and may be implemented by concepts similar to the grouped storage device 910A and the transfer device 920A, so for the sake of brevity, they will not be described in detail. In some embodiments, loading ports LP1 and LP2 are configured to receive wafer carriers WC containing semiconductor wafers to be processed. In other embodiments, loading port LP1 is configured to receive wafer carriers WC containing semiconductor wafers to be processed, and loading port LP2 is configured to receive wafer carriers WC containing processed semiconductor wafers. In such embodiments, the storage device 910B disposed next to the loading port LP2 may be configured to temporarily store wafer carriers WC containing processed semiconductor wafers. For example, an additional mobile loading robot may be configured to transport wafer carriers WC between loading port LP2 and the storage device 910B. It should be noted that the number and configuration of mobile loading robots, storage devices, conveying devices, and loading ports can be adjusted as required to achieve improved operability and efficiency of semiconductor manufacturing facilities.

[0100] Fig.15 1 is a flow chart illustrating a method of operation of a system for automated wafer carrier handling according to some embodiments. Although the method of operation 1000 is illustrated and described below as a series of actions or operations, it should be understood that the order in which such actions or operations are illustrated should not be construed as having a limiting meaning.

[0101] At operation 1002, a wafer carrier is moved from a compartment of a storage rack to a standby position of the storage rack by a first moving mechanism, wherein the wafer carrier carries a plurality of semiconductor wafers to be processed therein. FIG. 3A to FIG. 3C shows a front view of system 100 corresponding to operation 1002, FIG. 5A to FIG. 5CA front view of system 200 corresponding to operation 1002 is shown, wherein the standby position of the storage rack is located in the middle of the storage rack, and a first moving mechanism (e.g., moving mechanism 114 / 214) is assembled to the storage rack. The operation of moving the wafer carrier by the first moving mechanism includes reciprocating the first moving mechanism along at least one of a first axis and a second axis (e.g., an x-axis, a z-axis) to move the wafer carrier out of the compartment of the storage rack and position it at the standby position of the storage rack, wherein the first axis is perpendicular to the second axis. In the embodiment of the present invention, the first moving mechanism is a mobile loading robot (e.g., a robot configured to move around the storage rack and the second moving mechanism. Fig.14 In certain embodiments of the mobile loading robot 10 shown, the operation of moving the wafer carrier by the first moving mechanism includes positioning the mobile loading robot in front of a compartment of the storage rack and moving the wafer carrier out of the compartment of the storage rack.

[0102] At operation 1004, the wafer carrier at the standby position of the storage rack is carried and transferred by a second moving mechanism, wherein the second moving mechanism is disposed above the storage rack and operably coupled to the storage rack. Figure 3D showing a side view of system 100 corresponding to operation 1004, Fig. 6A A side view of the system 200 corresponding to operation 1004 is shown, wherein the operation of carrying and transferring the wafer carrier by the second moving mechanism includes reciprocating the second moving mechanism (e.g., the transfer device 120 / 220 / 320) along a third axis (e.g., the y-axis) to move in and out of the storage rack, thereby transporting the wafer carrier at the standby position out of the storage rack, and the third axis is perpendicular to the first axis and the second axis. In certain embodiments where the standby position is set at the top of the storage rack and the load port is set at the back of the storage rack, the operation of carrying and transferring the wafer carrier by the second moving mechanism includes reciprocating the second moving mechanism (e.g., the y-axis) to move in and out of the storage rack, thereby transporting the wafer carrier at the standby position out of the storage rack, and the third axis is perpendicular to the first axis and the second axis. Fig. 6A The transfer device 320 shown in the figure reciprocates back and forth relative to the storage rack between the standby position and the load port of the storage rack to transport the wafer carrier. In certain embodiments in which the standby position is set at the top of the storage rack and the load port is set at the back of the storage rack, the operation of carrying and transferring the wafer carrier by the second moving mechanism includes causing the second moving mechanism (e.g. Fig. 7A The transmission device 420A shown, Fig. 8A The transmission device 420B shown, Fig.9A The transfer apparatus 520 shown, etc.) reciprocates laterally across the storage racks to transport wafer carriers between a standby position and a load port of the storage rack.

[0103] At operation 1006 , the wafer carrier carried by the second moving mechanism is loaded on a load port of a semiconductor processing tool for processing the plurality of semiconductor wafers. Figure 3D or Figure 6BA side view of a system corresponding to operation 1006 is shown. Fig. 8A , Fig.9A and other figures illustrate perspective views of systems corresponding to operation 1006 .

[0104] According to some embodiments, a system for automated wafer carrier handling includes a storage rack, a first moving mechanism, a second moving mechanism, and a controller. The storage rack includes a standby position and a storage position separated from the standby position, and the storage position is suitable for buffering wafer carriers waiting to be transferred to a loading port. The first moving mechanism is movably coupled to the storage rack and provides at least one degree of freedom of movement, and the first moving mechanism is suitable for transferring the wafer carrier from the storage position to the standby position. The second moving mechanism is disposed on the storage rack, operably couples the storage rack to the loading port, and provides at least one degree of freedom of movement. The second moving mechanism is suitable for transferring the wafer carrier from the standby position to the loading port. The controller is operably coupled to the first moving mechanism and the second moving mechanism to control the operation of the first moving mechanism and the second moving mechanism.

[0105] In some embodiments, the standby position is located in the middle of the storage rack. In some embodiments, the standby position is at the top of the storage rack and is higher than the storage position. In some embodiments, the first moving mechanism includes a first mover and a second mover, the first mover being assembled to the storage rack to carry the wafer carrier along a first axis, and the second mover being assembled to the first mover to carry the wafer carrier along a second axis perpendicular to the first axis. In some embodiments, the second moving mechanism includes a third mover, the third mover being disposed above the standby position of the storage rack and extending above the loading port, the third mover being suitable for transporting the wafer carrier along a third axis perpendicular to the first axis and the second axis. In some embodiments, the second moving mechanism includes a third mover, the third mover being disposed above the standby position of the storage rack and extending above the loading port, the third mover being suitable for transporting the wafer carrier along the second axis.

[0106] According to some alternative embodiments, a system for automated wafer carrier handling includes a storage device, a conveyor device, and a controller. The storage device includes a storage rack and a first moving mechanism, the storage rack having a compartment for accommodating a wafer carrier, the first moving mechanism coupled to the storage rack to move the wafer carrier laterally and vertically from the compartment of the storage rack to a standby position of the storage device. The conveyor device is disposed above the storage device and includes a second moving mechanism, the second moving mechanism being adapted to transfer the wafer carrier from the standby position of the storage device to a loading port for semiconductor processing. The controller interfaces with the first moving mechanism of the storage device and the second moving mechanism of the conveyor device to control the movement of the wafer carrier driven by the first moving mechanism of the storage device and the second moving mechanism of the conveyor device.

[0107] In some embodiments, the first moving mechanism of the storage device includes a z-axis mover and an x-axis mover, the z-axis mover is operably coupled to the storage rack for driving the wafer carrier to move along the z-axis direction, and the x-axis mover is operably coupled to the storage rack for driving the wafer carrier to move along the x-axis direction. In some embodiments, the loading port is arranged at the back of the storage device, and the second moving mechanism of the conveying device includes a y-axis mover, which is operably coupled to the storage rack for transporting the wafer carrier at the standby position to the loading port along the y-axis direction. In some embodiments, the standby position of the storage device is located in the middle of the storage rack, and the y-axis mover of the second moving mechanism is suitable for moving into the storage rack to be positioned at the standby position of the storage device. In some embodiments, the standby position of the storage device is located at the top of the storage rack, and the y-axis mover of the second moving mechanism is suitable for moving above the storage rack to be positioned at the standby position of the storage device. In some embodiments, the storage device is disposed next to the loading port, and the second moving mechanism of the transfer device is adapted to carry the wafer carrier from the standby position of the storage device across the storage rack to the loading port along the x-axis direction. In some embodiments, the second moving mechanism of the transfer device is disposed above the standby position of the storage device and extends above the loading port, and the second moving mechanism of the transfer device is adapted to move the wafer carrier laterally and vertically between the standby position and the loading port. In some embodiments, the storage device further comprises a detection device coupled to the storage rack to protect the compartment.

[0108] According to some alternative embodiments, an operating method for automated wafer carrier handling includes at least the following steps: moving a wafer carrier from a compartment of a storage rack to a standby position of the storage rack by a first moving mechanism, wherein the wafer carrier carries a plurality of semiconductor wafers to be processed therein; carrying and transferring the wafer carrier at the standby position of the storage rack by a second moving mechanism, wherein the second moving mechanism is disposed above the storage rack and operably coupled to the storage rack; and loading the wafer carrier carried by the second moving mechanism onto a load port of a semiconductor processing machine for processing the plurality of semiconductor wafers.

[0109] In some embodiments, the standby position of the storage rack is located in the middle of the storage rack, the first moving mechanism is assembled to the storage rack, and moving the wafer carrier by the first moving mechanism includes reciprocating the first moving mechanism along at least one of a first axis and a second axis to move the wafer carrier out of the compartment of the storage rack and position it at the standby position of the storage rack, wherein the first axis is perpendicular to the second axis. In some embodiments, carrying and transporting the wafer carrier by the second moving mechanism includes reciprocating the second moving mechanism along a third axis to move into and out of the storage rack, thereby transporting the wafer carrier at the standby position out of the storage rack, wherein the third axis is perpendicular to the first axis and the second axis. In some embodiments, the standby position is set at the top of the storage rack, the loading port is set at the back of the storage rack, and carrying and transporting the wafer carrier by the second moving mechanism includes reciprocating the second moving mechanism back and forth relative to the storage rack between the standby position and the loading port of the storage rack to transport the wafer carrier. In some embodiments, the standby position is set at the top of the storage rack, the loading port is set beside the storage rack, and carrying and transferring the wafer carrier by the second moving mechanism includes causing the second moving mechanism to reciprocate laterally across the storage rack to transport the wafer carrier between the standby position and the loading port of the storage rack. In some embodiments, the first moving mechanism is a mobile loading robot configured to move around the storage rack and the second moving mechanism, and moving the wafer carrier by the first moving mechanism includes positioning the mobile loading robot in front of the compartment of the storage rack and moving the wafer carrier out of the compartment of the storage rack.

[0110] The above content summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the embodiments of the present invention. Those skilled in the art should understand that they can easily use the embodiments of the present invention as a basis to design or modify other processes and structures to implement the same purpose and / or achieve the same advantages of the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the embodiments of the present invention and that they can make various changes, substitutions and modifications to this article without departing from the spirit and scope of the embodiments of the present invention.

[0111] [Explanation of Symbols]

[0112] 10: Mobile loading robot

[0113] 100, 200: Automated wafer carrier handling system / system

[0114] 110, 210, 210A, 210B, 210C, 910A, 910B: Storage devices

[0115] 112, 212, 912A: Storage rack

[0116] 112a, 212a: Compartment

[0117] 112b, 212b: Cover

[0118] 114, 214, 914A: Mobile mechanism

[0119] 114a, 214a, 914c: load-bearing components

[0120] 114b, 214b, 914d: Drive units

[0121] 114bx, 214bx: x-axis mover

[0122] 114bz, 214bz, 914dz: z-axis mover

[0123] 120, 220, 320, 420A, 420B, 520, 620, 720A, 720B, 820A, 920A, 920B: Transmission equipment

[0124] 122, 222, 322, 422, 522, 622, 722A, 722B, 822, 922A: Track

[0125] 124, 224, 424, 524, 624, 724A, 724B, 824, 824A, 824B, 924A: Robotic arms

[0126] 124a: y-axis mover

[0127] 130, 230: User interface panel

[0128] 132, 232: Controller

[0129] 140: Signal pole

[0130] 150: Rapid positioning mechanism

[0131] 160: Quick release mechanism

[0132] 162: Handle

[0133] 163: Connecting rod

[0134] 164: Buckle

[0135] 165: Lateral latch

[0136] 166: Positioning pin

[0137] 166a: Lateral protrusion

[0138] 167: Positioning hole

[0139] 168a: Bottom latch

[0140] 168b: Top latch

[0141] 224a: Mover

[0142] 226, 326, 426, 526, 626, 726A, 726B, 826, 926A: mast

[0143] 226b, 326b, 426b, 526b, 626b, 726b, 926g: bridge components

[0144] 226s, 326s, 426s, 626s, 726s, 826s, 926s: Side supports

[0145] 300, 400A, 400B, 500, 700A, 700B, 800A, 800B, 900: Automated wafer carrier handling systems

[0146] 426sh: horizontal part

[0147] 426sv: vertical part

[0148] 826b: Bridge

[0149] 926gs: Extended structure

[0150] 1000: How to operate

[0151] 1002, 1004, 1006: Operation

[0152] BS: Back Side

[0153] BX, BZ: Sliders

[0154] D1, D2, D3, D4, D5: Arrow

[0155] FS: Front Side

[0156] GS: Ground

[0157] LC: Detection Device

[0158] LP, LP1, LP2, LP3, LP4: Loading port

[0159] LPs: Receiving Surfaces

[0160] LS: Left side

[0161] PT: Semiconductor processing equipment

[0162] RL: Reference Line

[0163] RS: Right side

[0164] RX, RZ: Track

[0165] SP: Standby position

[0166] Tx: First segment

[0167] Ty: Second Segment

[0168] WC: Wafer Carrier

[0169] X, Y, Z, -X: axis directions.

Claims

1. A system for automated wafer carrier handling, wherein: include: Storage rack, including: a cover plate shielding a rear side of the storage rack and adjacent to a loading port; a panel separating a compartment from the cover plate, shielding a front side of the storage rack opposite to the rear side, and maintaining a distance from the loading port; a standby position, located within the compartment, exposed through the cover and shielded in front view by the panel; and a storage position located in the compartment, separated from the standby position and shielded by the cover plate, the storage position being adapted to buffer wafer carriers waiting to be transferred to the loading port, wherein the loading port is disposed at a front end of a semiconductor processing machine, the semiconductor processing machine and the rear side of the storage rack being located at opposite sides of the loading port; a first movement mechanism movably coupled to the storage rack and providing at least one degree of freedom of movement, the first movement mechanism being adapted to transfer the wafer carrier from the storage position to the standby position; a second movement mechanism disposed above the storage rack, operably coupling the storage rack to the load port and providing at least one degree of freedom of movement, the second movement mechanism passing through the cover plate and into the compartment to be between the cover plate and the panel and inside the storage rack to transfer the wafer carrier between the standby position and the load port; and A controller is operably coupled to the first moving mechanism and the second moving mechanism to control operations of the first moving mechanism and the second moving mechanism.

2. The system for automated wafer carrier handling of claim 1, wherein the standby position is located in the middle of the storage rack.

3. The system for automated wafer carrier handling of claim 1, wherein a user interface is disposed on the panel on the front side of the storage rack.

4. The system for automated wafer carrier handling of claim 1, wherein the first moving mechanism comprises: a first mover assembled to the storage rack to carry the wafer carrier along a first axis; as well as A second mover is assembled to the first mover to carry the wafer carrier along a second axis perpendicular to the first axis.

5. The system for automated wafer carrier handling of claim 4, wherein the second moving mechanism comprises: A third mover is disposed above the standby position of the storage rack and extends above the loading port, and the third mover is suitable for transporting the wafer carrier along a third axis perpendicular to the first axis and the second axis.

6. The system for automated wafer carrier handling according to claim 5, wherein the third mover moves along the third axis to the middle of the storage rack to reach the standby position.

7. A system for automated wafer carrier handling, wherein: include: A storage device, comprising a storage rack having a plurality of compartments for accommodating wafer carriers and a first moving mechanism coupled to the storage rack to move the wafer carrier from one of the compartments of the storage rack to a standby position of the storage device along an x-axis direction and along a z-axis direction; A transfer device, arranged above the storage device and comprising a second moving mechanism, the second moving mechanism being adapted to transfer the wafer carrier from the standby position of the storage device to a loading port for semiconductor processing, wherein the loading port is arranged at the front end of a semiconductor processing machine, the storage rack, the loading port and the semiconductor processing machine are arranged in sequence along the y-axis direction, the second moving mechanism comprising: a y-axis mover operably coupled to the storage rack to move into the storage rack and position in the standby position, wherein the standby position is between the left and right columns of compartments in a front view and between the upper and lower rows of compartments in a side view; as well as A controller interfaces with the first movement mechanism of the storage device and the second movement mechanism of the transfer device to control movement of the wafer carrier driven by the first movement mechanism of the storage device and the second movement mechanism of the transfer device.

8. The system for automated wafer carrier handling of claim 7, wherein the first movement mechanism of the storage device comprises: A z-axis mover operably coupled to the storage rack for driving the wafer carrier to move along the z-axis direction; as well as An x-axis mover is operably coupled to the storage rack and is used to drive the wafer carrier to move along the x-axis direction.

9. The system for automated wafer carrier handling of claim 7, wherein in the front view, when the y-axis translator is positioned in the standby position, the upper row of compartments and one of the left column and one of the right column are located on opposite sides of the y-axis translator.

10. A system for automated wafer carrier handling according to claim 7, wherein the conveying device further comprises a track connected to the top of the storage rack and extending along the y-axis direction to above the loading port, and the y-axis mover is operably coupled to the track and moves along the track.

11. The system for automated wafer carrier handling of claim 7, wherein a user interface panel is disposed on a front side of the storage rack and a rear side of the storage rack faces the load port.

12. The system for automated wafer carrier handling of claim 7, wherein a receiving surface of the load port on which the wafer carrier is placed is flush with the standby position of the storage rack.

13. The system for automated wafer carrier handling of claim 7, wherein the y-axis mover passes through a rear side of the storage rack to the standby position of the storage rack.

14. The system for automated wafer carrier handling of claim 7, wherein the storage device further comprises a detection device coupled to the storage rack to protect the compartment.

15. A method for automated wafer carrier handling, comprising: The wafer carrier is moved from a compartment of a storage rack to a standby position of the storage rack by a first moving mechanism, wherein the wafer carrier carries a plurality of semiconductor wafers to be processed therein, the storage rack comprising: a cover plate shielding the rear side of the storage rack and close to the loading port of the semiconductor processing machine and exposing the standby position; and a panel, separating a compartment from the cover plate, shielding a front side of the storage rack opposite to the rear side and keeping a distance from the loading port, wherein the standby position located inside the compartment is shielded by the panel; moving a second moving mechanism through the cover plate and into the compartment between the cover plate and the panel to be positioned in the standby position of the storage rack; carrying and transferring the wafer carrier at the standby position of the storage rack by the second moving mechanism, wherein the second moving mechanism is disposed above the storage rack and operably coupled to the storage rack; and The chip carrier carried by the second moving mechanism is loaded onto the loading port of the semiconductor processing machine for processing the multiple semiconductor chips, wherein the loading port is arranged at the front end of the semiconductor processing machine, and the semiconductor processing machine and the rear side of the storage rack are respectively located on opposite sides of the loading port.

16. The method for automated wafer carrier handling according to claim 15, wherein the standby position of the storage rack is located in the middle of the storage rack, the first moving mechanism is assembled to the storage rack, and moving the wafer carrier by the first moving mechanism comprises: The first moving mechanism is reciprocated along at least one of a first axis and a second axis to move the wafer carrier out of the compartment of the storage rack and position it at the standby position of the storage rack, wherein the first axis is perpendicular to the second axis.

17. The method for automated wafer carrier handling according to claim 16, wherein carrying and transferring the wafer carrier by the second moving mechanism comprises: The second moving mechanism is reciprocated along a third axis to move into and out of the storage rack, thereby transporting the wafer carrier at the standby position out of the storage rack, wherein the third axis is perpendicular to the first axis and the second axis.

18. The operating method for automated wafer carrier handling according to claim 15, wherein a receiving surface of the load port on which the wafer carrier is placed is flush with the standby position of the storage rack.

19. The method for automated wafer carrier handling according to claim 15, further comprising: Before moving the wafer carrier, locking the storage rack in a predetermined position by a quick release mechanism, wherein the quick release mechanism is disposed at the bottom of the storage rack; and After loading the wafer carrier, the storage rack is released.

20. The method for automated wafer carrier handling according to claim 15, further comprising: The compartments of the storage rack are protected by detection means.

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