Integrated circuit modules for circuit breakers, relays and contactors

Abstract

The present invention relates to integrated circuit modules for circuit breakers, relays, and contactors. Embodiments disclose an integrated circuit breaker comprising a solid-state switch module (SSWM) configured to receive and switchably control line power (LP) of a given phase and output a first switching power (SP) to a load. A first sensor (LPS) senses LP current. A second sensor (SPS) senses SP current. A power module controls the operating state of the SSWM based on the LPS and SPS readings. The LPS and / or SPS may also sense temperature. The power module includes a high-voltage domain isolated from a low-voltage domain, the high-voltage domain including a gate driver coupled to the SSWM and a high-voltage controller providing a drive signal to the gate driver. The low-voltage domain includes an LP monitor and an SP monitor, which detect abnormal LP and / or SP conditions and transmit error signals to the high-voltage domain and to a user via an external communication module for reporting, diagnostics, and / or other purposes.

Description

[0001] Cross-references to Related Patent Applications

[0002] This application claims priority to and incorporates by reference in their entirety U.S. Provisional Application Serial No. 62 / 930,101, filed on November 4, 2019, in the name of inventor Pramit Nandy, and entitled “Integrated Circuit Module for Circuit Breakers and Protected Relays,” and U.S. Utility Application Serial No. 17 / 019,799, filed on September 14, 2020, in the name of inventor Pramit Nandy, and entitled “Integrated Circuit Module for Circuit Breakers, Relays and Contactors.” Technical Field

[0003] The technology described herein generally relates to circuit breakers, relays, and contactors. More particularly, the technology described herein relates to integrated circuit modules for use in circuit breakers, relays, and contactors. Background Art

[0004] Circuit breakers, relays, and contactors typically utilize electromechanical components that are configured to detect faults and / or hazardous circuit conditions and, in response thereto, stop the flow of power. However, such electromechanical components often suffer from one or more capability deficiencies, such as having a large footprint, slow response times (e.g., measured on a hundred or more millisecond basis), varying reliability, limited (if any) inrush current detection capabilities, limited current sensing capabilities, limitations on detection of conditions consistent with high temperatures within the components, limited phase imbalance detection capabilities, lack of remote monitoring, control, and warning capabilities, limited ground fault, arc fault, hard short, overcurrent, and other detection capabilities, and other limitations. Furthermore, such components often lack active cooling capabilities and have limited (if any) ability to perform diagnostics in line power fault scenarios, among other limitations. Therefore, there is a need for circuit breakers, relays, and contactors that address these and other issues. Summary of the Invention

[0005] Various embodiments of the present disclosure describe integrated circuit modules for circuit breakers, relays, and other electrical contactors.

[0006] According to at least one embodiment of the present disclosure, an integrated circuit circuit breaker may include a first solid-state switch module (SSWM(1)). The SSWM may be configured to receive a first line power (LP(1)) having a first phase from a power source. The SSWM(1) may be configured to switchably control the LP(1) and output a first switching power (SP(1)) in the first phase to a load via a circuit. The integrated circuit circuit breaker may include a first line power sensor (LPS(1)) configured to sense at least one characteristic of the LP(1). The integrated circuit circuit breaker may include a first switching power sensor (SPS(1)) configured to sense at least one characteristic of the SP(1). The integrated circuit circuit breaker may include: a power module coupled to each of the SSWM(1), the LPS(1), and the SPS(1), and configured to control an operating state of the SSWM(1) based on at least one sensor reading received by the power module from at least one of the LPS(1) and the SPS(1).

[0007] The SSWM (1) may include at least one solid-state switch. The at least one solid-state switch may include at least one of the following: a silicon metal oxide semiconductor field effect transistor ("Si MOSFET") in a cascode configuration with a silicon carbide junction gate field effect transistor ("SiC JFET"); a first silicon carbide metal oxide semiconductor field effect transistor ("SiC MOSFET"); a silicon super junction metal oxide semiconductor field effect transistor ("SJ FET"); and a gallium nitride high electron field effect transistor ("GaN FET").

[0008] The LPS (1) may be configured to sense the LP (1) current, and the SPS (1) may be configured to sense the SP (1) current. At least one of the LPS (1) and the SPS (1) may be configured to sense temperature. The LPS (1) and the SPS (1) may each further include at least one of: an integrated sense field effect transistor ("senseFET"); a sense resistor; a Hall effect current sensor; a current sense transformer; and a tunnel magnetoresistance ("TMR") current sensor.

[0009] The integrated circuit breaker may include a second solid-state switch module (SSWM (2)) configured to receive a second line power (LP (2)) having a second phase from a power source. The SSWM (2) may switchably control the LP (2) and output a second switching power (SP (2)) in the second phase to a load. The integrated circuit breaker may include a second line power sensor (LPS (2)) configured to sense at least one characteristic of the LP (2). The integrated circuit breaker may include a second switching power sensor (SPS (2)) configured to sense at least one characteristic of the SP (2). The power module may also be coupled to each of the SSWM (2), the LPS (2), and the SPS (2). The power module may also be configured to control the operating state of the SSWM (1) and the SSWM (2) based on at least one sensor reading received by the power module from at least one of the LPS (1), the LPS (2), the SPS (1), and the SPS (2).

[0010] The integrated circuit circuit breaker may include a neutral line sensor configured to sense at least one characteristic of a neutral line that provides an electrical return path from the load through the circuit to the power source.

[0011] An integrated circuit breaker may include a power module having a high voltage domain and a low voltage domain. The low voltage domain may include a low voltage controller. The high voltage domain may include a gate driver coupled to an SSWM (1) and a high voltage controller, the high voltage controller coupled to the gate driver and configured to provide a high voltage control signal to the gate driver. The integrated circuit breaker may be configured based on the high voltage control signal so that the gate driver generates a gate drive signal that configures one or more switches provided by the SSWM (1) into an open circuit or closed circuit operating state. For at least one embodiment, the integrated circuit breaker may include a high voltage communication element configured to facilitate communicative coupling of the high voltage controller with the low voltage controller.

[0012] The integrated circuit breaker may include a low voltage domain including a line power monitor coupled to an LPS (1) and a low voltage controller and configured to receive sensor readings from the LPS (1), monitor the received sensor readings, and generate at least one line power flag when an abnormal line power condition occurs. The integrated circuit breaker may include a low voltage domain including a switch power monitor coupled to an SPS (1) and a low voltage controller and configured to receive sensor readings from the SPS (1), monitor the received sensor readings, and generate at least one switch power flag when an abnormal switch power condition is detected. The integrated circuit breaker may include a low voltage domain including a low voltage communication element configured to facilitate communicative coupling of the low voltage controller with a high voltage controller.

[0013] The integrated circuit breaker may include a low voltage domain including a temperature monitor. The temperature module may be configured to monitor the temperature of the SP (1). The integrated circuit breaker may include a low voltage domain including a power controller module, the power controller module coupling the low voltage domain to a backup power source. The integrated circuit breaker may include a low voltage domain including an external communication module, the external communication module communicatively coupling the integrated circuit breaker to an external control device.

[0014] The integrated circuit circuit breaker may include a low voltage controller that may be configured to monitor operating conditions of the integrated circuit circuit breaker, generate diagnostic data representative of the operating conditions, respond to commands received from an external control device, and transmit low voltage control signals to the high voltage controller.

[0015] The integrated circuit circuit breaker may include use of a low voltage control signal that causes generation of a gate drive signal that facilitates at least one of the power management operations.

[0016] The integrated circuit circuit breaker can be configured to perform one or more power management operations. Such power management operations may include at least one of waveform shaping, waveform balancing, fail-safe operation, startup operation, minimum power mode, emergency condition power down, and charge pumping.

[0017] The integrated circuit circuit breaker may be configured to electrically isolate the high voltage domain from the low voltage domain.

[0018] The integrated circuit circuit breaker may include a cooling element configured to provide at least one of active cooling and passive cooling to the integrated circuit circuit breaker.

[0019] According to at least one embodiment of the present disclosure, an integrated circuit relay module may include a first solid-state switch module (SSWM(1)) configured to receive a first switching power (SP(1)) having a first phase from a circuit, switchably control SP(1), and output a first relay power (RP(1)) in the first phase to a load. The integrated circuit relay module may include a first relay power sensor (RPS(1))[156(1)], the RPS(1) configured to sense at least one characteristic of RP(1). The integrated circuit relay module may include a power module coupled to each of the SSWM(1) and the RPS(1) and configured to control an operating state of the SSWM(1) based on at least one sensor reading received by the power module from the RPS(1).

[0020] The integrated circuit relay module may include a surge protection module configured to shunt a power surge occurring on the SP (1) to ground.

[0021] The integrated circuit relay module may include a second solid-state switch module (SSWM (2)) configured to receive a second switching power (SP (2)) having a second phase from the circuit, switchably control SP (2), and output a second relay power (RP (2)) at the second phase to the load. The integrated circuit relay module may include a second relay power sensor (RPS (2)) configured to sense at least one characteristic of RP (2). The integrated circuit relay module may include a third solid-state switch module (SSWM (3)) configured to receive a third switching power (SP (3)) having a third phase from the circuit, switchably control SP (3), and output a third relay power (RP (3)) at the third phase to the load. The integrated circuit relay module may include a third relay power sensor (RPS (3)) configured to sense at least one characteristic of RP (3). The power module may be coupled to each of the SWSM (2), the SWSM (3), the RPS (2), and the RPS (3). The power module may be configured to control an operating state of one or more of the SWSM (1), SSWM (2), and SWSM (3) based on at least one sensor reading received from one or more of the RPS (1), RPS (2), and RPS (3).

[0022] The integrated circuit relay module may include a surge protection module configured to shunt to ground one or more power surges occurring on one or more of SP (1), SP (2), and SP (3).

[0023] The integrated circuit relay module may include a power module having a low voltage domain communicatively coupled to and electrically isolated from a high voltage domain. The low voltage domain may include a low voltage controller, a relay power monitor coupled to each of an RPS (1), an RPS (2), and an RPS (3), and the low voltage controller. The relay power module may be configured to receive sensor readings from one or more of the RPS (1), the RPS (2), and the RPS (3), monitor the received sensor readings, and generate at least one relay power flag when an abnormal relay power condition is detected.

[0024] The integrated circuit relay module may include a low voltage communication element configured to facilitate communicative coupling of the low voltage domain with the high voltage domain. The integrated circuit relay module may include a temperature monitor configured to monitor the temperature of one or more of RP (1), RP (2), and RP (3). The integrated circuit relay module may include a power controller module configured to couple at least the low voltage domain with a backup power supply. The integrated circuit relay module may include an external communication module that communicatively couples the integrated circuit circuit breaker with an external control device. The low voltage controller may be configured to monitor an operating condition of the integrated circuit relay module, generate diagnostic data representative of the operating condition, respond to commands received from the external control device, and output a low voltage control signal to the high voltage domain to facilitate control of an operating state of one or more of SSWM (1), SSWM (2), and SSWM (3).

[0025] The integrated circuit relay module may include a high voltage domain that is communicatively coupled to the SSWM (1), SSWM (2), and SSWM (3). The high voltage domain may include a gate driver that is configured to control the operating state of each of the SSWM (1), SSWM (2), and SSWM (3). The high voltage domain may include a high voltage controller that is coupled to the gate driver and is configured to provide a high voltage control signal to the gate driver. For at least one embodiment and based on the high voltage control signal, the gate driver may be configured to generate a gate drive signal that configures one or more switches provided by one or more of the SSWM (1), SSWM (2), and SSWM (3) to an open circuit operating state or a closed circuit operating state. The high voltage domain may include a high voltage communication element that is configured to facilitate communicative coupling of the high voltage controller with the low voltage controller. The low voltage control signal may cause generation of a gate drive signal that facilitates at least one of power management operations including waveform shaping, waveform balancing, fail-safe operation, startup operation, minimum power mode, emergency condition power down, and charge pumping.

[0026] According to at least one embodiment of the present disclosure, a system for controlling the electrical coupling of a load to a power source may include an integrated circuit breaker configured to receive line power from the power source and output switching power. The system may include an electromechanical switch configured to receive switching power from the integrated circuit breaker, provide an air gap between the power source and the circuit, and output switching power. The system may include a circuit electrically coupled to the electromechanical switch and configured to receive switching power and provide switching power to at least one of a first load and a second load. The system may include an integrated circuit relay module electrically coupled to the circuit and configured to output relay power. The system may be configured such that the first load receives relay power from the integrated circuit relay module and the second load receives switching power from the circuit. The system may include the use of an integrated circuit breaker configured to monitor, detect, and respond to at least one characteristic of line power and switching power. The system may include the use of an integrated circuit breaker configured to monitor, detect, and respond to at least one characteristic of relay power. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Features, aspects, advantages, functions, modules, and components of the devices, systems, and methods provided by various embodiments of the present disclosure are further disclosed herein with respect to at least one of the following descriptions and drawings. In the drawings, similar components or elements of the same type may have the same reference numerals and may include additional letter indicators, such as 108a-108n, etc., where the letter indicators indicate that the components with the same reference numerals (e.g., 108) have common properties and / or characteristics. In addition, various views of a component may be distinguished by a first reference numeral followed by a connector and a second reference numeral, where, for the purposes of this description, the second reference numeral is used to designate the view of the component. If only a first reference numeral is used in this specification, the description applies to any similar components and / or views having the same first reference numeral, without regard to any additional letter indicators or second reference numerals (if any).

[0028] Figure 1A is a functional block diagram of a system using at least one integrated circuit circuit breaker and in accordance with at least one embodiment of the present disclosure.

[0029] Figure 1B is a functional block diagram of a system using at least one integrated relay / contactor and in accordance with at least one embodiment of the present disclosure.

[0030] Figure 2A 、 Figure 2B and Figure 2Cis a schematic diagram of an embodiment of a solid-state switch module configured for use with at least one embodiment of an integrated circuit circuit breaker, an integrated relay, and / or an integrated contactor and in accordance with at least one embodiment of the present disclosure.

[0031] Figure 3 is a functional block diagram of a high voltage domain used in an integrated circuit circuit breaker, integrated relay, and / or integrated contactor and in accordance with at least one embodiment of the present disclosure.

[0032] Figure 4A is a functional block diagram of a low voltage domain for use in an integrated circuit circuit breaker and in accordance with at least one embodiment of the present disclosure.

[0033] Figure 4B is a functional block diagram of a low voltage domain for use in an integrated relay and in accordance with at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] Various embodiments described herein relate to integrated circuit modules for circuit breakers, relays, and contactors.

[0035] like Figure 1A As shown and for at least one embodiment of the present disclosure, a system 100 for providing one or more phases for use with an AC power system may include an integrated circuit breaker module "ICB" 102. Figure 1B As shown, and for at least one embodiment of the present disclosure, a system 150 for providing one or more phases for use with an AC power system and / or a DC power system may include an integrated circuit relay / contactor module 152 (“ICR”).

[0036] As used herein, an ICB 102 is typically used to couple a circuit 137 (typically configured as a non-dedicated circuit by wiring that exits a distribution panel and terminates at one or more outlets (not shown)) to a power source 109 (such as provided at a distribution panel in a structure). Power can be provided by any provider, such as by a power company via power lines, through solar panels, or otherwise. Circuit 137 is typically located within a vehicle or structure. For a non-dedicated circuit, circuit 137 includes one or more standard configuration outlets to which corresponding plugs for loads 138 can be physically and electrically connected. Dedicated circuits may also be used. Power is typically provided in one or more phases (n), where n is an integer. One to three phases of power are typically provided. Such power can be provided at various voltages and currents, such as 120 VAC per phase at 50 to 60 Hz and is typically regulated by electrical codes, regulations, and other regulations.

[0037] As further used herein, an ICR 152 is generally used to provide a switchable connection between an electrical circuit 137 (e.g., accessed at one or more outlets) and one or more loads 138. The ICR 152 can be configured for use with or without a transformer (not shown). The use of transformers and their configurations is well known in the art. The ICR 152 differs from the ICB 102 primarily in their intended use, wherein the ICR 152 is configured in a parallel circuit relationship with the load 138 and with respect to the electrical circuit 137 feeding multiple loads 138, while the ICB 102 is generally used in a series circuit relationship between the power source 109 and the electrical circuit 137 powering one or more loads 138. That is, it should be understood that the ICR 152 is configured to monitor and control the power provided to a specific load 138 using an existing electrical circuit 137, while the ICB 102 is concerned with monitoring and controlling the power provided by a given electrical circuit 137, such as a household electrical circuit that provides 120 VAC (US) to any of a variety of household appliances at various times. Furthermore, it should be understood that the ICR 152 and ICB 102 may be configured for use with circuits and loads configured for use with any desired voltage, including but not limited to 230 VAC (as commonly used in the European Union and other countries) and / or any desired number of circuit phases (such as three-phase circuits commonly used in the United States for residential appliance applications and other applications).

[0038] ICB 102 can be configured to provide a switchable coupling to a power source 109, such as a distribution board, circuit, transformer, etc., that provides electrical power at a given phase n (herein, line power "LP"). ICB 102 further provides such a switchable coupling to circuit 137 and ultimately to one or more loads 138. ICB 102 provides output power at a given phase (n) (herein, switching power "SP") to circuit 137.

[0039] Multiple LP feeds providing alternating current in different phases may be received by the ICB 102 from the power source 109. For example, electrical power may be provided in a first phase LP(1), a second phase LP(2), and / or a third phase LP(3). After controlled switching by the ICB 102, such power is provided to the circuit 137 as switching / output power (SP) in one or more of the switched first phase SP(1), the switched second phase SP(2), and / or the switched third phase SP(3). The ICB 102 may include a solid state switch module ("SSWM") 104(n) for each phase of the provided electrical power. In FIG1 , the solid state switch module 104(1) for a single phase is depicted in solid lines. For a multi-phase circuit, such as a three-phase circuit, SSWMs 104(2) and 104(3) may be used and are shown in dashed lines.

[0040] For at least one embodiment of the ICB 102, the SP may be routed through an electromechanical switch ("EMS") 126(n) before being provided to the circuit 137. As desired for a particular embodiment, an EMS 126(n) may be used for each phase (n) provided. The EMS 126(n) is further described below. It should be understood that the EMS 126(n) is not typically used in conjunction with the ICR 152. A surge protection module 154 may be used. Surge protection modules are well known in the art. Figure 1A and Figure 1B In the diagram, the data lines between the power module 105 and the components are shown for the first phase for clarity only, while the data lines of any second and / or third phase components are not shown.

[0041] The neutral "N" connection provides a return circuit path from the circuit 137 (and the load 138) back to the power supply 109, back to a ground node, or other. The neutral N may be coupled to ground potential. A neutral sensor NS 124 may be used to monitor the current transmitted across the neutral connection.

[0042] The power supply module 105 provides monitoring, control, and other features and functions for adaptively controlling the electrical power provided by the power supply 109 to the circuit 137 and the load 138 via a given ICB 102 or ICR 152. By adaptively activating and deactivating one or more switches provided with each SSWM 104(n), the power supply module 105 can adaptively control, monitor, and regulate the electrical power provided to the circuit 137 and / or the load 138. The monitoring of electrical power by the power supply module 105 may include the use of one or more sensors, including but not limited to a "line power" sensor 120(n), a "switch power" sensor 122(n), a "relay power" sensor 156(n), a "neutral" sensor NS 124, and a temperature sensor (not shown). One or more of the line power sensor, the switch power sensor, the relay power sensor, and / or the neutral sensor may be configured to sense current and / or temperature. The temperature sensor may be provided separately from and / or in conjunction with one or more of the line sensor 120(n), the switch sensor 122(n), and / or the relay sensor 156(n). Figure 1BAs depicted by the absence of these sensors in the ICB 102, the line power sensor 120(n) and the switch power sensor 122(n) may not be used in at least one embodiment of the ICR 152, and the relay power sensor 156(n) may not be used in at least one embodiment of the ICB 102. For other embodiments (not shown), one or more of the line power sensor 120(n), the switch power sensor 122(n), and / or the relay power sensor 126(n) may be used interchangeably in the ICB 102 and / or in the ICR 152. Such sensors are described further below.

[0043] The power module 105 may include a high voltage (HV) domain 106 that is electrically separated from a low voltage (LV) domain 112 by an isolation barrier 116. An HV-LV communication link 118 facilitates data communication between the HV domain 106 and the LV domain 112. Such a communication link includes the use of an HV Comm element 117 and an LV Comm element 119. Each of these components will be described in more detail below.

[0044] Other elements of systems 100 and 150 may include, but are not limited to, AC / DC converter 128, cooling element 130, external communication module 132, external control device 136, and backup power module 140. Each of these components will be described in more detail below.

[0045] LPS 120(n) / SPS 122(n) / RPS 156(n) and NS 124

[0046] For at least one embodiment of the ICB 101, the line power sensor ("LPS") 120(n) and the switching power sensor ("SPS") 122(n) may be provided in a common package, module, die, or otherwise for a given phase (n) of line power LP(n). For other embodiments, one or more of the LPS 120(n) and / or SPS 122(n) may be provided in a separate package, module, die, or otherwise from a given phase module 102(n).

[0047] The LPS 120(n), SPS 122(n), and / or relay power sensor ("RPS") 156(n) may be combined with one or more solid-state switches provided by a given SSWM 104(n) in a common package, die, module, or otherwise. For example, and not by way of limitation, a given SSWM 104(n) may include power field effect transistors (FETs) including integrated sense FETs (referred to herein as "senseFETs").

[0048] One or more of the LPS 120(n), SPS 122(n), and / or RPS 156(n) may be provided using one or more senseFETs. The senseFETs may be configured to provide corresponding sensor readings to the HV controller 110. Such sensor readings may include one or more of current, voltage, temperature, or other parameters to the power module 105.

[0049] When isolation is to be provided between the HV domain 106 and the LV domain 112, the senseFETs may be configured to provide readings from the LP 102(n) to the LV controller 110 by using one or more isolated communication links, such as those described herein for the HV-LV communication link 118. In addition, the output senseFETs may be configured to provide readings from the SPS 122(n) and / or from the RPS 156(n) to the LV controller 114, such as directly when isolation is not required, and / or to provide readings from the SPS 122(n) and / or from the RPS 156(n) to the LV controller 114 by using one or more isolated communication link components when isolation is required.

[0050] A neutral sensor NS 124 may be provided. NS 124 may be provided within, with, and / or separately from a given ICB 102. For at least one embodiment of the ICR 152, a neutral sensor is not utilized. NS 124 may be provided in a distribution panel and configured to provide sensor readings for two or more phases within the ICB 102 that use a common neutral node. NS 124 may be configured to provide current, voltage, or other sensor readings.

[0051] Each LPS 120(n) may be configured to perform one or more self-test operations, at power-up or otherwise, including, but not limited to, monitoring at least one characteristic of a given LP(n), such as the current and voltage of a given phase(n) provided by the power source 109 to the ICB 102 before such electrical power flows through or is inhibited by the solid-state switches provided by the SSWM 104(n). Each SPS 122(n) may be configured to monitor at least one characteristic of a given SP(n), such as the current and / or voltage of a given phase(n) after the electrical power passes through the switches utilized in the SSWM 104(n) and, as a result, is output by the ICB 102 to the circuit 137 and for use by the load 138. Each RPS 156(n) may be configured to monitor at least one characteristic of a given RP(n), such as the current and / or voltage of a given phase(n) after the electrical power passes through the switches utilized in the SSWM 104(n) and, as a result, is output by the ICR 152 to the load 138. Each of LPS 120(n), SPS 122(n), RPS 156(n), and NS 124 may utilize any known or later-developed voltage and / or current sensing technology, a combination thereof, or otherwise. LPS 120(n), SPS 122(n), and / or RPS 156(n) may include one or more temperature sensors. As desired for a given implementation of an embodiment of the present disclosure, an amplifier may be used to amplify the signal provided to power module 105 by the one or more sensors.

[0052] One or more (if not each) of LPS 120(n), SPS 122(n), RPS 156(n), and NS 124 may be configured to provide one or more sensor readings on a continuous, periodic, on-demand, scheduled, or other basis. The readings from each such sensor may be transmitted to low voltage controller 112. As desired for any particular implementation of an embodiment of the present disclosure, the sensor readings of one or more of LPS 120(n), SPS 122(n), RPS 156(n), and / or NS 124 may be provided on an isolated or non-isolated basis.

[0053] At least one of LPS 120(n), SPS 122(n), RPS 156(n), and NS 124 may include the use of a sense resistor. It will be appreciated that sense resistors are typically accurate to within three to five percent (±3% to ±5%), but do not provide isolation and have higher insertion loss. For example, and not by way of limitation, sense resistors may be used in high bandwidth applications, such as those switching within the DC to 10 MHz range. As used herein, terms such as low, medium, high, etc., as used to refer to a particular device feature and / or characteristic, may be determined by one of ordinary skill in the art by comparison with known characteristics of alternative sensors, such as, but not limited to, the sensors identified herein.

[0054] At least one of the LPS 120(n), SPS 122(n), RPS 156(n), and NS 124 may include the use of a Hall effect current sensor. The Hall effect current sensor may be a contact sensor or a contactless sensor, with an accuracy within the range of one to five percent (±1% to ±5%) for the former and within the range of five to ten percent (±5% to ±10%) for the latter, respectively. For example and not limitation, a contact Hall effect current sensor may be used to provide medium levels of isolation, medium levels of insertion loss, and for high power requirements. The contact Hall effect current sensor may support switching within the range of DC to 1 MHz. For example and not limitation, a contactless Hall effect current sensor may be used to provide isolation, zero insertion loss, and for high power requirements. The contactless Hall effect current sensor may support switching within the range of DC to 100 kHz.

[0055] At least one of the LPS 120(n), SPS 122(n), RPS 156(n), and NS 124 may include the use of a current sense transformer. For example and not limitation, the current sense transformer may be used to provide accuracy within a range of one to five percent (±1% to ±5%) while providing isolation, zero insertion loss, requiring no power supply, and supporting switching within a range of 50 Hz to 1 MHz.

[0056] For at least one embodiment where current sensing accuracy within one percent (±1%) is desired, at least one of the LPS 120(n), SPS 122(n), RPS 156(n), and NS 124 may include the use of a tunnel magnetoresistive (TMR) current sensor. The TMR current sensor may provide isolation, zero insertion loss, use of a low voltage power supply, and support switching within a DC to 1 MHz range.

[0057] The input / line LP, output / switch SP current, and relay current RP may be continuously monitored by corresponding LPS(n), SPS(n), RPS(n) (one for each phase used in embodiments) to detect whether leakage current or other current anomalies are occurring within a given circuit for one or more phases(n). Monitoring for leakage current and / or other anomalies may be performed, for example, by the LVC 114. When leakage current is detected, the LVC 114 may instruct the HVC 110 to take appropriate action, such as configuring the solid-state switches in the SSWM 104(n) to an open circuit configuration or other configuration for the faulted phase and / or all phases. It should be understood that leakage current and other anomaly detection, such as provided by the ICB 102 and / or ICR 152, may be used in place of and / or in addition to ground fault circuit interrupter receptacles (GFCIs) and / or residual current circuit breakers (RCCBs), which are currently commonly used to protect against leakage current and other fault and / or hazardous electrical power conditions.

[0058] SSWM 104(n)

[0059] The solid-state switch module SSWM 104(n) can be configured to include one or more solid-state switches. Two solid-state switches can be used for each phase(n). For other embodiments, any number of solid-state switches can be used for a given phase(n). Various known and / or later-developed power switching devices and / or combinations thereof can be used in a given SSWM 104(n).

[0060] like Figure 2A As shown and for at least one embodiment of the present disclosure, the SSWM 104(n) may include the use of a first switch 200-1, such as a silicon metal oxide semiconductor field effect transistor (Si MOSFET) in a cascode configuration with a silicon carbide junction gate field effect transistor (SiC JFET), coupled to a similarly configured second switch 202-1. The gates of each of the Si MOSFETs may be controlled individually or jointly by gate control signals provided by the gate driver 108. It should be understood that Figure 2A The first switch 200 and the second switch 202 may have low losses because no body diode is used in SiC JFETs and SiMOSFETs, and there may be low reverse recovery charge (Qrrr). Furthermore, it should be understood that other transistor configurations (such as, but not limited to, Figure 2B The use of a cascode configuration can result in lower input resistance and lower Miller capacitance compared to a common transistor configuration. Si MOSFETs can be rated for low voltage applications, while SiC JFETs can be rated for high voltage applications. Other voltage rating configurations can be used as desired for a given implementation of an embodiment of the present disclosure.

[0061] like Figure 2B As shown and for at least one embodiment of the present disclosure, the SSWM 104(n) may include a first switch 200-2 configured using a silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET). The first switch 200-2 may be coupled to a similarly configured second switch 202-2. The gates of each of the SiC MOSFETs may be controlled individually or jointly by a gate control signal provided by the gate driver 108. It should be understood that Figure 2B The configuration shown is Figure 2A The configuration shown is simpler, while the above Figure 2A Many of the benefits of configuration discussions may not be available Figure 2B Furthermore, it should be understood that other configurations may be used in the SSWM 104(n), including single switch configurations (e.g., Figure 2A and Figure 2B Compared with the dual switch configuration), gallium nitride high electron mobility (GaN HEMT) transistors, such as Figure 2C The use of Si super junction FETs (SJ FETS) and the like is shown.

[0062] Power module 105

[0063] As discussed above, the power module 105 may include a high voltage (HV) domain 106, an isolation barrier 116, a low voltage (LV) domain 112, an HV Comm element 117, and an LV Comm element 119. The HV Comm element 117 and the LV Comm element 119 facilitate the use of an HV-LV communication link 118 between the HV domain 106 and the LV domain 112 while maintaining electrical isolation between the HV domain 106 and the LV domain 112.

[0064] HV domain 106

[0065] like Figure 1A and Figure 1B As shown, Figure 3 As further shown and for at least one embodiment of the present disclosure, the HV domain 106 may include a gate driver 108 that is communicatively coupled to an HV controller “HVC” 110 . The HVC 110 is communicatively coupled to an HV Comm element 117 .

[0066] Gate driver 108

[0067] The gate driver 108 can be configured to control the operating state (open / closed) of the solid-state switches used in the SSWM 104(n). The use of gate drive signals 302 to control the transistors used in the solid-state switches and thereby control the voltage, current, and phase of the electrical power ultimately provided to the load 138 is well known in the art and is not further described herein. Any such known or later-developed switching protocols, methods, components, techniques, etc. may be used with one or more embodiments of the present disclosure. Furthermore, it should be understood that, given the use of solid-state switches in the SSWM 104(n), the voltages and currents provided may be provided at any desired voltage potential, current, etc. Such provided voltages and currents may vary over time or on any other basis, as controlled by the gate drive signals 302 output by the gate driver 108 to the switches provided in the SSWM 104(n).

[0068] The gate driver 108 can be configured to receive a control signal from the HVC 110 and, based thereon, generate a gate drive signal 302 that facilitates one or more power management operations, such as waveform shaping. Such waveform shaping can be provided based on load conditions. The load conditions can be detected by the HVC 110 and / or the LVC 114. The waveform shaping capability can be provided monolithically as an IC with the gate driver, as a multi-die package, as multiple ICs, or otherwise. For at least embodiments, the waveform shaping capability can be provided by, in, or used in conjunction with one or more of the gate driver 108, the HVC 110, and / or the LVC 114.

[0069] The gate driver 108 can be configured to provide adaptive gate drive capabilities. For example, and not by way of limitation, the gate driver 108 can be configured to facilitate startup, protection during operation, and shutdown of a controlled motor and / or other electrical load (referred to herein as "motor operation"). Such motor operation can be based on one or more mathematical models, integrated measurement methods of motor and / or other load electrical parameters, real-world testing, or other methods.

[0070] For at least one embodiment in which two or more phases (n) are to be controlled by the power module 105, the gate driver 108 can be configured to receive control signals from the HVC 110 and, based thereon, generate gate drive signals 302 that facilitate other power management operations, such as phase balancing. Such control signals can be generated using a balance monitor (not shown) provided by one or more of the HVC 110 or the LVC 114. The balance monitor can be configured to perform a difference comparison on the current readings for each phase of a given circuit. Such current readings can be provided by the LPS 120(n) and / or the SPS 122(n) (for the ICB 102) and / or by the RPS 156(n) (for the ICR 152). The results of the difference comparison can be evaluated by balancing logic (not shown) to determine whether one or more of the phases (n) are unbalanced. When an imbalance condition is detected, the controller facilitating balance monitoring (HVC 110 or LVC 114) may be configured to generate one or more imbalance control flag signals that, when communicated to the gate driver 108, cause modification of one or more gate drive signals provided to one or more of the SSWMs 104(n).

[0071] It should be understood that gate drive signals may be provided at any time based on the detection of a fault condition or otherwise to facilitate any given operational consideration. For example, gate drive control signals may enable circuit 137 and / or load 138 to be powered down in a safe and / or controlled manner upon detection of a fault condition (such as a phase imbalance). Similarly, gate drive control signals may be configured to facilitate other power management operations, including but not limited to controlled startup of a load, minimum power mode (such as when the load is not active), controlled non-fault condition power down of a load, emergency condition power down, or other.

[0072] Imbalance flags, other flags, and other fault or monitoring condition signals may be used in diagnostic, reporting, monitoring, and / or other capacities.

[0073] HVC 110

[0074] The HVC 110 can be provided in any desired form or configuration, including, but not limited to, as an application-specific integrated circuit ("ASIC"), a general-purpose processor, a microcontroller, or other. The HVC 110 can be configured to facilitate various HVC control functions, including, but not limited to, current limiting, overvoltage, overtemperature, inrush current control, fault management, and other functions (referred to herein as "HVC functions"). The HVC 110 can facilitate such HVC control functions by providing one or more HVC control signals 304 to the gate driver 108. The HVC control signals 304 can be provided by the HVC 110 to the gate driver 108 and to one or more of the SSWMs 104(n) for providing one or more phases(n) of electrical power, individually, collectively, or otherwise. The HVC control signals 304 can be provided to the gate driver 108 at any given time. The HVC control signals 304 can vary over time, with the phase(n), and otherwise.

[0075] For at least one ICR 152 embodiment, the HVC 110 may also be configured to provide power management functions including, but not limited to, charge pumping, over / under voltage management, bandgap, oscillator, internal voltage regulator, and others.

[0076] like Figure 3 As further shown, the HVC 110 may include one or more program inputs (PROGs) 306. The PROGs 306 may be used to, from time to time or as otherwise determined, modify one or more parameters used by the HVC 110 in determining one or more HVC control signals 304 provided to the gate driver 108. The PROG 306 may be provided for each phase (n) of the SSWM 104(n) controlled by the gate driver 108. For other embodiments, a common PROG 306 may be provided for two or more phases (n) of the SSWM 104(n) controlled by a given gate driver 108.

[0077] A given HVC 110 may be configured to provide control signals to two or more gate drivers 108 ; each such gate driver 108 provides gate drive signals with respect to a different circuit 137 and / or with respect to a different load 138 .

[0078] HV Comm Component 117

[0079] The HV domain 106 may also be configured to include an HV Comm element 117 configured to facilitate communication via an HV-LV communication link 118 (eg, Figure 1A and Figure 1B106 and LV domain 112). The HV Comm element 117 may use any known or later-emerging technology to facilitate such communication. Such communication may be serial, parallel, duplex, bidirectional, unidirectional (between the HV domain 106 and the LV domain 112), or other.

[0080] Such communication is facilitated between the HV domain 106 and the LV domain 112 while maintaining isolation. Such isolation and communication can be facilitated by using an HV transceiver "HV XCVR" 308 coupled to the HV interface 310. Figure 3 As shown, the HV interface 310 can be configured as a first inductive coil 312. It should be understood that other forms of HV interface 310 technology can be used in other embodiments to facilitate isolated communication between the HV domain 106 and the LV domain 112. Non-limiting examples of such interface technologies include capacitive isolation, optical coupling, combinations of any of the foregoing technologies, and others.

[0081] LV domain 112

[0082] like Figure 4A As shown and for at least one embodiment of the ICB 102 of the present disclosure, the LV domain 112 can be configured to include an LP monitor 402, an SP monitor 404, a temperature monitor 406, an LV transceiver ("LV XCVR") 408, an LV controller 114, an LV Comm element 119, an external communication module ("EXT COMM") 132, and an LV power controller module (PWR) 139. Figure 4B As shown, and for at least one embodiment of the ICR 152 of the present disclosure, the LV domain 112 may be configured to include the elements described above, with the LP monitor 402 and the SP monitor 404 replaced with the RP monitor 418 .

[0083] like Figure 4A and Figure 4B As further shown, an LV interface 410 can be used to facilitate isolated communication between the LV domain 112 and the HV domain 106. As shown, the LV interface 410 can include, for example, the use of a second inductive coil 412. It should be understood that other forms of HV interface 310 and LV interface 410 technology can be used in other embodiments to facilitate isolated communication between the HV domain 106 and the LV domain 112. As discussed above, non-limiting examples of such interface technologies include capacitive isolation, optical coupling, combinations of any of the aforementioned technologies, and others.

[0084] LP monitor 402 / SP monitor 404 / RP monitor 418 / temperature monitor 406

[0085] According to at least one embodiment, LP monitor 402, SP monitor 404, RP monitor 418, and / or temperature monitor 406 can be configured to monitor sensor readings provided by one or more of LPS 120(n), SPS 122(n), RPS 156(n), or others, as applicable. Such sensor readings can be monitored for any desired detectable condition. The monitors can set one or more flags when abnormal power conditions are detected.

[0086] LVC 114

[0087] The LVC 114 can be provided in any desired form or configuration, including, but not limited to, as an application-specific integrated circuit ("ASIC"), a general-purpose processor, a microcontroller, or other. The LVC 114 can be configured to facilitate, enhance, and / or support various HVC control functions. The LVC 114 can facilitate such HVC control functions by providing one or more LVC commands 420 to the HVC 110, thereby causing one or more HVC control signals 304 to be provided to the gate driver 108. The LVC commands 420 can be provided by the HVC 110 individually, collectively, or otherwise. The LVC commands 420 can be provided to the HVC 110 at any given time. The LVC commands 420 can vary over time, with phase (n), and other factors.

[0088] EXT COMM 132

[0089] like Figure 4A and Figure 4B As shown, the LV domain 112 may include an external communication module EX COMM 132. The EX COMM 132 may include at least one of a wired interface 133 and a wireless interface 134. Such components will be discussed further below.

[0090] PWR 139

[0091] like Figure 4A and Figure 4BAs shown, the LV domain 112 may include a power controller module (PWR) 139. The PWR may include a VCC power controller 414 and a battery controller 416. The VCC power controller 414 may be configured to provide a consistent input voltage and current to the LVC 114 and, when needed, to the HVC 110. The battery controller 416 may be configured to provide a consistent input voltage and current to the LVC 114 and, when needed, to the HVC 110. The battery controller 416 may be configured to provide a consistent input voltage and current to the LVC 114 and the HVC 110 when power is unavailable from the VCC power controller 414. The battery controller 416 may also be configured to provide electrical power to one or more of the components provided in the HV domain 106 and the LV domain 112, including but not limited to the gate driver 108, the transceiver 308 / 408, the EX COMM 132, and others, when needed. The battery may be used to provide power to the LVC 114 for communication and / or diagnostic purposes, such as fault detection and reporting, when VCC power is unavailable or unreliable, or in other situations.

[0092] LV Comm Element 119

[0093] The LV domain 112 may also be configured to include an LV Comm element 119 configured to facilitate communication via an HV-LV communication link 118 (eg, Figure 1A and Figure 1B 106. The LV Comm element 119 may use any known or later-emerging technology to facilitate such communication. Such communication may be serial, parallel, duplex, bidirectional, unidirectional (between the HV domain 106 and the LV domain 112), or other.

[0094] Such communication is facilitated between the HV domain 106 and the LV domain 112 while maintaining isolation. Such isolation and communication can be facilitated by using an LV transceiver "LV XCVR" 408 coupled to the LV interface 410. Figure 4A and Figure 4B As shown, the LV interface 410 can be configured as a second inductive coil 412. It should be understood that other forms of LV interface 410 technology can be used in other embodiments to facilitate isolated communication between the HV domain 106 and the LV domain 112. Non-limiting examples of such interface technologies include capacitive isolation, optical coupling, combinations of any of the foregoing technologies, and others.

[0095] AC / DC converter 128

[0096] like Figure 1A and Figure 1B As further shown, an AC / DC converter 128 may be used to provide electrical power to the LV domain 112 and / or the HV domain 106. Any known or later-developed technology may be used for the AC / DC converter 128.

[0097] Cooling element 130

[0098] like Figure 1A and Figure 1B As further shown, cooling element 130 can be used to provide adaptive cooling to ICB 102 and / or ICR 152. Cooling element 130 can provide active and / or passive cooling. Any known or later-developed cooling technology can be used. Non-limiting examples of passive cooling technologies include heat sinks, thermal fins, heat plates, and the like. Non-limiting examples of active cooling technologies include fans and heat pipes or carbon nanotubes, thermoelectric cooling, liquid cooling, direct immersion, cryogenics, and the like. Cooling element 130 can be controlled by LVC 114.

[0099] EX COMM 132 and external control device 136

[0100] like Figure 1A 、 Figure 1B 、 Figure 4A and Figure 4B As shown, the ICB 102 and ICR 152 may include an external communication module "COM" 132. COM 132 may be communicatively coupled to one or more external control devices 136. The external control devices may include one or more devices configured for remote monitoring, control, reporting, and the like of one or more ICBs 102 and / or ICRs 152. Non-limiting examples of user control devices include smartphones, laptops, tablet computing devices, desktop computers, remote servers, web interfaces, artificial intelligence systems, and the like. Any known or later-emerging technology suitable for supporting one or more remote control and / or monitoring features and functions of an embodiment of the present disclosure may be used, in whole or in part, to provide the external control devices 136. Furthermore, such external control devices 136 may be co-located with the ICB 102 or ICR 152, such as in a given electrical box, located proximately, such as within a vehicle, building, or other structure in which the ICB 102 or ICR 152 is physically located, or located remotely, such as at a geographic distance greater than the range of a given local network, Wi-Fi, or other limited-range signal. For at least one embodiment, external user device 136 may be communicatively coupled to ICB 102 and / or ICR 152 using the Internet, a local area network (LAN), a wide area network (WAN), a cellular network, or otherwise.

[0101] As further shown, the user device 136 may be communicatively coupled to the ICB 102 and / or ICR 152 using one or more wired links, such as facilitated by the COMM port 133, and / or wireless links, such as facilitated by the transceiver 134. It should be understood that any known or later-emerging communication devices, systems, networks, protocols, technologies, and combinations thereof (individually and collectively referred to herein as "communication technologies") may be used to facilitate communication between the ICB 102 and / or ICR 152 and the external control device 136. Non-limiting examples of such communication technologies may include Ethernet, Wi-Fi, Bluetooth, ZIGBEE, I2C, Wi-Fi, and / or other communication technologies. 2 C, Serial Peripheral Interface (SPI), cellular (such as 3G, 4G, and 5G), and others. COMM 132, port 132, transceiver 134, external control device 136, and communication technology can be configured to support diagnostic reporting, fault reporting, and control of ICB 102 and / or ICR 152 by external control device 136.

[0102] Backup power module 140

[0103] like Figure 1A and Figure 1B As shown, the system 100 may include a backup power module 140 electrically coupled to the LVC 114. For at least one embodiment, the backup power module 140 may include a battery, which may be rechargeable. For at least one embodiment, the backup power module 140 may include the use of solar cells, wind turbines, or other power technologies. For at least one embodiment and during a power failure condition, the backup power module 140 may be configured to provide sufficient electrical power to the LVC 114 to enable the LVC 114 to detect the fault condition, run diagnostic tests, perform one or more fail-safe operations in response thereto, transmit status information to the external control device 136 by providing electrical power to the EX COMM 132 and associated communication components, and other functions.

[0104] ECM 126(n)

[0105] As shown, an electromechanical switch ECM 126(n) may be used to couple the ICB 102 to the load 138. The ECM 126(n) may be used to comply with various government regulations, electrical codes, and the like, such as those requiring an air gap between the distribution board and the load. Examples of such regulations, codes, and the like include, but are not limited to, Underwriters Laboratories standard UL 489, the entire contents of which are incorporated herein by reference, and each embodiment of the present disclosure may be configured to comply with the standard by incorporating known techniques in accordance with the standard. It should be understood that if the requirements of UL 489, etc., are repealed or otherwise modified (including, but not limited to, the removal of the requirement for an air gap), the electromechanical switch 126(n) may be excluded from the embodiments of the present disclosure and the various embodiments of the present disclosure may be modified to comply with such changes.

[0106] Various embodiments of the present disclosure may provide integrated module solutions for circuit breaker and / or relay applications. Embodiments may use the IC within the module package to provide functionality such as, but not limited to, external communications, adjustable and adaptive gate drive, programmable gate drive, system diagnostics, and backup fault reporting for the ICB 102 and / or ICR 152. Some embodiments may include a backup battery to operate in a backup mode in the event of input power removal, thereby enabling diagnostics and "fail-safe" operation. Embodiments may include diagnostics and fault reporting as well as wireless or wired communications to allow external users, programs, or devices to receive and / or respond to the status of the system. Embodiments may allow for a smaller footprint, faster response time, and / or longer life by replacing, reducing, or eliminating required mechanical components.

[0107] Some embodiments of the present disclosure may provide an ICR 152 solution for integrated electronic relays (referred to herein as "IERs") and / or integrated electronic contactors (referred to herein as "IECs") applications. Embodiments of IERs and / or IECs may include features such as, but not limited to, smooth switching, backup fault reporting, wireless diagnostics, and an integrated AC-DC converter. Some embodiments may include a backup battery to operate in a backup mode when input power is removed, thereby enabling diagnostics and "fail-safe" operation. Implementations may include diagnostics and fault reporting as well as wireless or wired communications to allow an external user or program to receive and / or respond to the status of the system. Implementations of IECs may reduce or eliminate arcing caused by the reduction or elimination of mechanical components. Implementations may reduce the need for additional fuses by using overvoltage protection and active clamping shutdown in the HV domain. Implementations may allow for a smaller footprint, fast response time, and / or longer life by replacing, reducing, or eliminating the required mechanical components. Implementations of the present disclosure may be configured for any practical use, including but not limited to use in industrial, residential, commercial, automotive, aerospace, and other switchable controlled current applications.

[0108] The present technology has been described above with reference to several exemplary embodiments. However, changes and modifications may be made to the exemplary embodiments without departing from the scope of the present technology. For example, while the exemplary embodiments may describe multiple IC modules or integrated drivers, those skilled in the art will understand that the system can be implemented using other methods capable of performing similar functions. Furthermore, while exemplary specifications, such as voltage values, may have been described, those skilled in the art will understand that the present technology is not limited to such specifications. These and other changes or modifications are intended to be included within the scope of the present technology.

[0109] Although various embodiments of the claimed invention have been described above with a certain degree of particularity or with reference to one or more individual embodiments, those skilled in the art may make numerous changes to the disclosed embodiments without departing from the spirit or scope of the claimed invention. Although the various figures used herein illustrate various circuit embodiments, it should be understood that other embodiments (not shown) may modify, reconfigure, add and / or remove one or more circuit components, connections, couplings, etc. The use of the terms "approximately" or "substantially" means that the value of an element has a parameter that is expected to be close to the stated value or position. However, as is well known in the art, there may be minor variations that prevent the value from being exactly equal to the stated value. Therefore, expected differences, such as a 10% difference, are reasonable differences that one of ordinary skill in the art would expect and appreciate, and are acceptable relative to the stated or desired goals of one or more embodiments of the present disclosure. It should also be understood that the terms "top" and "bottom," "left" and "right," "up" and "down," "first," "second," "next," "last," "before," "after," and other similar terms are used for descriptive and reference purposes only and are not intended to limit any orientation or configuration of any element of the various embodiments of the present disclosure or any sequence of operation. Furthermore, the terms "coupled," "connected," or otherwise are not intended to limit such interactions and signal communications between two or more devices, systems, components or to otherwise direct interactions; indirect couplings and connections may also occur. Furthermore, the terms "and" and "or" are not intended to be used in a limiting or expansive manner and cover any possible range of combinations of elements and operations of the embodiments of the present disclosure. Other embodiments are therefore contemplated. It is intended that all content contained in the foregoing description and shown in the accompanying drawings be interpreted as merely illustrative of the embodiments and not as limiting. Changes in detail or structure may be made without departing from the basic elements of the invention as defined in the appended claims.

Claims

1. An integrated circuit circuit breaker, comprising: a first solid-state switch module (SSWM(1)) configured to receive a first line power (LP(1)) having a first phase from a power source, switchably control the first line power, and output a first switching power (SP(1)) in the first phase to a load via a circuit; a first line power sensor (LPS(1)) configured to sense at least one characteristic of the first line power; a first switching power sensor (SPS(1)) configured to sense at least one characteristic of the first switching power; and a power module coupled to each of the first solid-state switch module, the first line power sensor, and the first switching power sensor, and configured to control an operating state of the first solid-state switch module based on at least one sensor reading received by the power module from at least one of the first line power sensor and the first switching power sensor, wherein the power module comprises: a high voltage domain, the high voltage domain comprising a high voltage controller coupled to a gate driver of the first solid-state switch module, the high voltage controller configured to provide a high voltage control signal to the gate driver based on a low voltage control signal from a low voltage controller; as well as A low voltage domain is electrically isolated from the high voltage domain, the low voltage domain including a low voltage controller configured to generate a low voltage control signal based on a sensor reading from the first line power sensor or the first switching power sensor.

2. The integrated circuit circuit breaker according to claim 1, wherein the first line power sensor is configured to sense a first line power current; wherein the first switching power sensor is configured to sense a first switching power current; and wherein at least one of the first line power sensor and the first switching power sensor is configured to sense temperature; The first line power sensor and the first switch power sensor each further include at least one of the following: integrated sense field-effect transistors ("senseFETs"); Sense resistor; Hall effect current sensor; Current sensing transformer; and Tunneling magnetoresistance ("TMR") current sensor.

3. The integrated circuit circuit breaker according to claim 1, The power module includes a high voltage domain, and the high voltage domain includes: the gate driver, the gate driver coupled to the first solid-state switch module; the high voltage controller, the high voltage controller coupled to the gate driver; wherein based on the high voltage control signal, the gate driver generates a gate drive signal, the gate drive signal configuring one or more switches provided by the first solid-state switch module to an open circuit or a closed circuit operating state; and A high voltage communication element is configured to facilitate coupling of the high voltage controller to the low voltage controller.

4. The integrated circuit circuit breaker according to claim 1, The power module includes: A low voltage domain, the low voltage domain comprising: the low voltage controller; a line power monitor coupled to the first line power sensor and the low voltage controller and configured to receive sensor readings from the first line power sensor, monitor the received sensor readings, and generate at least one line power flag when an abnormal line power condition occurs; a switching power monitor coupled to the first switching power sensor and the low voltage controller and configured to receive sensor readings from the first switching power sensor, monitor the received sensor readings, and generate at least one switching power flag when an abnormal switching power condition is detected; and a low voltage communication element configured to facilitate coupling of the low voltage controller to the high voltage controller; wherein the low voltage control signal causes generation of a gate drive signal that facilitates at least one of the power management operations; and The power management operations include at least one of waveform shaping, waveform balancing, fail-safe, startup, minimum power mode, emergency condition power down, and charge pumping.

5. An integrated circuit relay module, comprising: a first solid-state switch module (SSWM(1)) configured to receive a first switching power (SP(1)) having a first phase from a circuit, switchably control the first switching power, and output a first relay power (RP(1)) in the first phase to a load; a first relay power sensor (RPS(1)) configured to sense at least one characteristic of the first relay power; and a power module coupled to each of the first solid-state switch module and the first relay power sensor and configured to control an operating state of the first solid-state switch module based on at least one sensor reading received by the power module from the first relay power sensor, wherein the power module comprises: a high voltage domain, the high voltage domain comprising a high voltage controller coupled to a gate driver of the first solid-state switch module, the high voltage controller configured to provide a high voltage control signal to the gate driver based on a low voltage control signal from a low voltage controller; as well as A low voltage domain is electrically isolated from the high voltage domain, the low voltage domain including a low voltage controller configured to generate a low voltage control signal based on a sensor reading from a first line power sensor or a first switching power sensor.

6. The integrated circuit relay module according to claim 5, further comprising: a second solid-state switch module (SSWM(2)) configured to receive a second switching power (SP(2)) having a second phase from the circuit, switchably control the second switching power, and output a second relay power (RP(2)) in the second phase to the load; and a second relay power sensor (RPS(2)) configured to sense at least one characteristic of the second relay power; a third solid-state switch module (SSWM(3)) configured to receive a third switching power (SP(3)) having a third phase from the circuit, switchably control the third switching power, and output a third relay power (RP(3)) in the third phase to the load; and a third relay power sensor (RPS(3)) configured to sense at least one characteristic of the third relay power; wherein the power module is further coupled to each of the second solid-state switch module, the third solid-state switch module, the second relay power sensor, and the third relay power sensor; and wherein the power supply module is configured to control the operating state of one or more of the first solid-state switch module, the second solid-state switch module, and the third solid-state switch module based on at least one sensor reading received from one or more of the first relay power sensor, the second relay power sensor, and the third relay power sensor.

7. The integrated circuit relay module according to claim 6, further comprising: A surge protection module is configured to shunt to ground one or more power surges occurring on one or more of the first switching power, the second switching power, and the third switching power.

8. The integrated circuit relay module according to claim 5, wherein the power module includes a low voltage domain, the low voltage domain being coupled to a high voltage domain and electrically isolated from the high voltage domain; The low voltage domain further includes: the low voltage controller; a relay power monitor coupled to the first relay power sensor and the low voltage controller and configured to receive sensor readings from the first relay power sensor, monitor the received sensor readings, and generate at least one relay power flag upon detecting an abnormal relay power condition; a low voltage communication element configured to facilitate coupling of the low voltage domain to the high voltage domain; Temperature monitor; wherein the temperature monitor monitors the temperature of one or more of the first relay powers; Power controller module; wherein the power controller module couples at least the low voltage domain to a backup power source; and an external communication module coupling the integrated circuit circuit breaker with an external control device; and wherein the low voltage controller is configured to monitor operating conditions of the integrated circuit relay module, generate diagnostic data representative of the operating conditions, respond to commands received from the external control device, and output low voltage control signals to the high voltage domain to facilitate control of the operating state of the first solid-state switch module.

9. A system for controlling electrical coupling of a load to a power source, the system comprising: an integrated circuit circuit breaker configured to receive line power (LP) from a power source and output switching power (SP); an electromechanical switch configured to receive the switching power from the integrated circuit circuit breaker, provide an air gap between the power source and the circuit, and controllably output the switching power; a circuit electrically coupled to the electromechanical switch and configured to receive the switching power (SP) and provide the switching power to at least one of a first load and a second load; an integrated circuit relay module electrically coupled to the circuit and configured to output relay power (RP); a first solid-state switch module (1SSWM) configured to receive line power, switchably control the line power, and output the switching power to the electromechanical switch; a line power sensor (LPS) configured to sense at least one characteristic of the line power; a switching power sensor (SPS) configured to sense at least one characteristic of the switching power; and a power module configured to control an operating state of the first solid-state switch module based on one or more sensor readings from the line power sensor and the switch power sensor, wherein the power module comprises: a high voltage domain, the high voltage domain comprising a high voltage controller coupled to a gate driver of the first solid-state switch module, the high voltage controller configured to provide a high voltage control signal to the gate driver based on a low voltage control signal from a low voltage controller; as well as A low voltage domain is electrically isolated from the high voltage domain, the low voltage domain including a low voltage controller configured to generate a low voltage control signal based on a sensor reading from the line power sensor or the switch power sensor.

10. The system according to claim 9, wherein the first load receives the relay power from the integrated circuit relay module; wherein the second load receives the switching power from the circuit; wherein the integrated circuit circuit breaker is configured to monitor, detect, and respond to at least one characteristic of the line power and the switch power; and Wherein the integrated circuit relay module is configured to monitor, detect and respond to at least one characteristic of the relay power.

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