A constant temperature destruction electronic tag

Abstract

The present invention provides a constant temperature destruction electronic tag, which relates to the technical field of electronic tags. The constant temperature destruction electronic tag provided by the present invention includes: a substrate, the substrate has a first melting point; a radiator circuit, the radiator circuit is located on the first surface of the substrate; a short-circuit circuit, the short-circuit circuit is located on the second surface of the substrate; an external package, the external package covers the substrate, the radiator circuit and the short-circuit circuit; the short-circuit circuit is used to contact the radiator circuit after the substrate melts, so as to short-circuit the radiator circuit. The technical solution of the present invention can monitor whether the product fails due to over-temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic tags, and in particular to a constant temperature destruction electronic tag. Background Art

[0002] Cold Chain Logistics refers to a systematic project that keeps refrigerated and frozen products in a specified low-temperature environment throughout the production, storage, transportation, sales, and before consumption to ensure product quality and reduce losses. With the development of social needs, cold chain logistics is being used more and more widely.

[0003] The objects of cold chain logistics mainly include medicines, vaccines, and various fresh and quick-frozen foods that need to be stored at low temperatures. These products are highly sensitive to temperature. If the specified temperature is exceeded during the logistics process, they are prone to failure, deterioration, and other problems. At present, domestic cold chain logistics often have over-temperature problems due to technical and management problems. For example, intermittent refrigeration during storage and transportation, or refrigeration equipment failure, the product is still at a low temperature when it reaches the consumer / user, but it has reached above the specified temperature during storage and transportation. Therefore, it is necessary to monitor the temperature of the entire cold chain logistics process. Summary of the invention

[0004] The present invention provides a constant-temperature destruction electronic tag, which can monitor whether a product fails due to over-temperature.

[0005] The present invention provides a constant temperature destruction electronic tag, which adopts the following technical solution:

[0006] The constant temperature destruction electronic tag includes:

[0007] a substrate having a first melting point;

[0008] a radiator circuit, the radiator circuit being located on the first surface of the substrate;

[0009] a short-circuit circuit, the short-circuit circuit being located on the second surface of the substrate;

[0010] An external package, the external package covering the substrate, the radiator circuit and the short-circuit circuit;

[0011] The short-circuit circuit is used to contact the radiator circuit after the substrate is melted, so as to short-circuit the radiator circuit.

[0012] Exemplarily, the short-circuit circuit is a solid metal grid, a solid metal wire or a solid metal sheet.

[0013] Furthermore, the constant temperature destruction electronic tag further includes a first pressure applying component, and the first pressure applying component is used to apply pressure to the short circuit and / or the radiator circuit.

[0014] Furthermore, the outer packaging adopts a vacuum packaging method.

[0015] Furthermore, the outer packaging is a PET film or a nylon film.

[0016] Exemplarily, the short-circuit circuit is a metal planar spring, the short-circuit circuit is compressed and wrapped in a limiting layer, and the limiting layer has the first melting point.

[0017] Furthermore, the planar spring is a spiral planar spring or a wave planar spring.

[0018] Exemplarily, the constant temperature destructive electronic tag includes a covering layer and a second pressure component, the covering layer covers the radiator circuit and has a first melting point, the second pressure component clamps the substrate and the covering layer, the portion of the second pressure component in contact with the substrate serves as the short-circuit circuit, and the covering layer and the second pressure component are both enclosed in the outer package.

[0019] Optionally, the radiator circuit is a liquid metal circuit, and the liquid metal circuit includes liquid metal having a second melting point, and the second melting point is lower than the first melting point.

[0020] Furthermore, the substrate has a property of being repellent to liquid metal.

[0021] Optionally, the substrate is a paraffin sheet.

[0022] Furthermore, the thickness of the substrate is 0.2 mm to 0.5 mm.

[0023] Optionally, the liquid metal circuit includes liquid metal and metal powder mixed with each other.

[0024] The present invention provides a constant temperature destruction electronic tag. After the constant temperature destruction electronic tag is fixed on a product, when the ambient temperature of the product is lower than a first melting point, the substrate of the constant temperature destruction electronic tag is solid and has a stable structure. The radiator circuit and chip on the constant temperature destruction electronic tag can work normally, that is, the constant temperature destruction electronic tag can be identified. When the ambient temperature of the product is equal to or higher than the first melting point, the substrate will melt into liquid, and then the radiator circuit and the short-circuit circuit will contact each other, causing the radiator circuit to short-circuit, and the constant temperature destruction electronic tag cannot be identified. Even if the ambient temperature drops below the first melting point thereafter, the substrate solidifies again, and the radiator circuit and the short-circuit circuit will not separate again. Therefore, the constant temperature destruction electronic tag can accurately and irreversibly reflect the ambient temperature changes of the product, thereby monitoring whether the product fails due to over-temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 A schematic diagram of the structure of a first constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the structure of the first constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the structure of a second constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0029] Figure 4 A schematic diagram of the structure of the second constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention;

[0030] Figure 5 A schematic diagram of the structure of a third constant temperature destruction electronic tag provided in an embodiment of the present invention;

[0031] Figure 6 A schematic diagram of the structure of the third constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the structure of a fourth constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0033] Figure 8 A schematic diagram of the structure of the fourth constant temperature destruction electronic tag after being destroyed provided by an embodiment of the present invention;

[0034] Fig. 9 A schematic diagram of the structure of a fifth constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0035] Fig.10 A schematic diagram of the structure of the fifth constant temperature destruction electronic tag after being destroyed provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0038] The embodiment of the present invention provides a constant temperature destruction electronic tag, specifically, Figure 1 As shown, Figure 1 The first embodiment of the present invention provides a structural diagram of a fixed temperature destruction electronic tag, the fixed temperature destruction electronic tag comprising:

[0039] A substrate 1, the substrate 1 having a first melting point T1;

[0040] A radiator circuit 2, the radiator circuit 2 is located on the first surface of the substrate 1;

[0041] A short-circuit circuit 3, wherein the short-circuit circuit 3 is located on the second surface of the substrate 1;

[0042] The external package 4 covers the substrate 1 , the radiator circuit 2 and the short-circuit circuit 3 .

[0043] The set destruction temperature range of the above-mentioned fixed temperature destruction electronic tag can be 5°C to 50°C. Those skilled in the art must know that the specific value of the first melting point T1 should be determined according to the temperature corresponding to the high-temperature failure of the product to which the fixed temperature destruction electronic tag is applied. For example, if the high-temperature failure temperature of the product is 30°C, the first melting point T1 should be selected as 30°C. If the high-temperature failure temperature of the product is 5°C, the first melting point T1 should be selected as 5°C, and so on.

[0044] After the constant temperature destruction electronic tag is fixed on the product, Figure 1 As shown, when the ambient temperature of the product is lower than the first melting point T1, the substrate 1 of the constant temperature destruction electronic tag is solid and has a stable structure, and the radiator circuit 2 on the constant temperature destruction electronic tag can work normally, that is, the constant temperature destruction electronic tag can be identified, such as Figure 2 As shown, Figure 2The schematic diagram of the structure of the first constant-temperature destructible electronic tag after destruction provided in an embodiment of the present invention is that when the ambient temperature of the product is equal to or higher than the first melting point T1, the substrate 1 will melt into liquid, and the radiator circuit 2 and the short-circuit circuit 3 will be in contact with each other, thereby causing the radiator circuit 2 to short-circuit, and the constant-temperature destructible electronic tag cannot be identified. Even if the ambient temperature drops below the first melting point thereafter, the substrate 1 solidifies again, and the radiator circuit 2 and the short-circuit circuit 3 will no longer separate. Therefore, the constant-temperature destructible electronic tag can accurately and irreversibly reflect the ambient temperature changes of the product, thereby monitoring whether the product fails due to over-temperature.

[0045] In the embodiment of the present invention, there may be many specific implementations of the short-circuit circuit 3, which are described below by way of example in the embodiment of the present invention.

[0046] In an example, Figure 1 and Figure 2 As shown, the short-circuit circuit 3 is a solid metal grid, a solid metal wire or a solid metal sheet. The above-mentioned "solid state" means that during the entire process of using the constant temperature destruction electronic tag, the state of the short-circuit circuit 3 remains solid.

[0047] In this example, the reliability of the constant temperature destruction electronic tag can be further improved in a variety of ways.

[0048] Alternatively, if Figure 3-Figure 6 As shown, Figure 3 A schematic diagram of the structure of a second constant temperature destruction electronic tag provided by an embodiment of the present invention, Figure 4 This is a schematic diagram of the structure of the second constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention. Figure 5 A schematic diagram of the structure of a third constant temperature destruction electronic tag provided in an embodiment of the present invention, Figure 6 The third type of constant temperature destruction electronic tag provided in the embodiment of the present invention is a schematic diagram of the structure after being destroyed. The constant temperature destruction electronic tag in the embodiment of the present invention further includes a first pressure component 5, which is used to apply pressure to the short-circuit circuit 3 and / or the radiator circuit 2. When the substrate 1 is not melted, the pressure applied by the first pressure component 5 to the short-circuit circuit 3 and / or the radiator circuit 2 will not cause the two to penetrate the substrate 1. After the substrate 1 is melted, the pressure applied by the first pressure component 5 to the short-circuit circuit 3 and / or the radiator circuit 2 will further promote the two to penetrate the liquid substrate 1, thereby achieving the connection between the short-circuit circuit 3 and the radiator circuit 2, which helps to improve the reliability of the constant temperature destruction electronic tag.

[0049] The first pressure applying component 5 may apply pressure only to the short circuit 3 , or may apply pressure only to the radiator circuit 2 , or may apply pressure to both the short circuit 3 and the radiator circuit 2 at the same time.

[0050] For example, Figure 3 and Figure 4 As shown, the first pressure component 5 includes a compressed plane spring 51 and a coating layer 52 coated on the plane spring 51. The first pressure component 5 is located on the side of the short-circuit circuit 3 away from the substrate 1. At this time, the first pressure component 5 only applies pressure to the short-circuit circuit 3. The above-mentioned plane spring can be a spiral plane spring or a wave plane spring.

[0051] For example, Figure 5 and Figure 6 As shown, the first pressure component 5 is a clip or a torsion compression spring, and the first pressure component 5 is clamped outside the outer package 4. At this time, the first pressure component 5 applies pressure to the short-circuit circuit 3 and the radiator circuit 2 at the same time.

[0052] Optionally, the outer package 4 is vacuum packaged. Such a configuration allows the outer package 4 to provide a certain stress to the radiator circuit 2 and the short-circuit circuit 3 after packaging (the stress is derived from the stress difference that inevitably exists between the upper and lower layers of packaging materials during vacuum packaging). When the substrate 1 is not melted and is in a solid state, the stress will not cause the radiator circuit 2 and the short-circuit circuit 3 to penetrate the substrate 1 and contact each other. When the substrate 1 melts into liquid, the stress will promote the contact between the radiator circuit 2 and the short-circuit circuit 3, thereby improving the reliability of the constant temperature destruction label.

[0053] Furthermore, when vacuum packaging is adopted, the outer packaging 4 can be a PET film or a nylon film.

[0054] In another example, Figure 7 and Figure 8 As shown, Figure 7 A schematic diagram of the structure of a fourth constant temperature destruction electronic tag provided by an embodiment of the present invention, Figure 8 The schematic diagram of the structure of the fourth constant temperature destruction electronic tag after destruction provided by the embodiment of the present invention, the short circuit 3 is a metal plane spring, the short circuit 3 is compressed and wrapped in the limiting layer 6, and the limiting layer 6 has a first melting point T1. Figure 3 As shown, when the ambient temperature of the product is lower than the first melting point T1, the limiting layer 6 is solid and can well limit the short circuit 3. When the ambient temperature of the product is equal to or higher than the first melting point T1, as shown in FIG. Figure 4 As shown, Figure 4 The schematic diagram of the structure of the second type of constant temperature destructible electronic tag after destruction provided in an embodiment of the present invention shows that not only the substrate 1 will melt into liquid, but the limiting layer 6 will also melt into liquid, thereby losing its limiting effect on the short-circuit circuit 3. The short-circuit circuit 3 in the compressed state will stretch toward the radiator circuit 2 under the action of its own elastic force, and then penetrate the liquid substrate 1 and connect with the radiator circuit 2, causing the radiator circuit 2 to short-circuit, thereby destroying the constant temperature destructible electronic tag and making it unrecognizable.

[0055] Optionally, the above-mentioned planar spring is a spiral planar spring or a wave planar spring.

[0056] In another example, Fig. 9 and Fig.10 As shown, Fig. 9 A schematic diagram of the structure of a fifth constant temperature destruction electronic tag provided in an embodiment of the present invention, Fig.10 The fifth constant temperature destruction electronic tag provided by the embodiment of the present invention is a schematic diagram of a structure after destruction. The constant temperature destruction electronic tag includes a covering layer 7 and a conductive second pressure component 8. The covering layer 7 covers the radiator circuit 2 and has a first melting point T1. The second pressure component 8 clamps the substrate 1 and the covering layer 7. The portion of the second pressure component 8 in contact with the substrate 1 serves as a short-circuit circuit 3. The covering layer 7 and the second pressure component 8 are both enclosed in an outer package 4. The second pressure component 8 can be a metal clip or a metal torsion compression spring.

[0057] like Fig. 9 As shown, when the ambient temperature of the product is lower than the first melting point T1, the substrate 1 and the cover layer 7 are both solid, the clamping force of the metal clip 8 will not damage the substrate 1 and / or the cover layer 7, and the second pressure-applying component 8 will not be connected to the radiator circuit 2. When the ambient temperature of the product is equal to or higher than the first melting point T1, as shown in FIG. Fig.10 As shown, the substrate 1 and the covering layer 7 are melted into liquid, and the clamping force of the second pressure member 8 causes it to penetrate the liquid substrate 1 and the covering layer 7, and then connect with the radiator circuit 2, so that the radiator circuit 2 is short-circuited, and the constant temperature destruction electronic tag is destroyed and cannot be identified. In this example, when the ambient temperature of the product is equal to or higher than the first melting point T1, both ends of the second pressure member 8 will penetrate the substrate 1 and the covering layer 7 and contact the top and bottom of the radiator circuit 2, which helps to further improve the reliability of the constant temperature destruction electronic tag.

[0058] Optionally, the substrate 1 in the embodiment of the present invention may be made of fixed-melting-point materials such as paraffin wax and lipids with a relatively low melting point. The above-mentioned “fixed-melting-point material” refers to a material with a specified melting point and a relatively narrow melting range.

[0059] Optionally, the radiator circuit 2 in the embodiment of the present invention includes a liquid metal circuit, and the liquid metal circuit includes a liquid metal having a second melting point T2, and the second melting point T2 is lower than the first melting point T1. Liquid metal has the advantages of low melting point, good electrical properties and simple manufacturing process, which makes the manufacturing process of the radiator circuit 2 simpler and lower cost.

[0060] The above-mentioned “radiator circuit 2 includes a liquid metal circuit” can be implemented in many ways, such as the entire radiator circuit 2 is a liquid metal circuit, or a part of the radiator circuit 2 is a liquid metal circuit.

[0061] Typically, when an electronic tag includes a chip, the antenna of the electronic tag is composed of an electromagnetic coupling circuit and an electromagnetic reflection circuit. The former determines whether the chip in the electronic tag is working, and the latter determines the distance of signal transmission. Based on this, an embodiment of the present invention selects that when part of the radiator circuit 2 is a liquid metal circuit, the liquid metal circuit is located at the connection between the radiator circuit 2 and the chip, and / or at the position of the electromagnetic coupling circuit. Such a setting can avoid significant changes in the impedance of the radiator circuit 2 caused by the liquid metal circuit being connected to the radiator circuit 2 in other ways, and will not have an adverse effect on the communication distance.

[0062] When the entire radiator circuit 2 is a liquid metal circuit, the radiator circuit 2 can be made on the substrate 1 using liquid metal, or a mixed material of liquid metal and metal powder, by printing (screen printing, steel screen printing, flexographic printing), printing, pad printing, transfer printing, etc.

[0063] Optionally, the liquid metal in the embodiment of the present invention is a metal element with a melting point below 300°C, an alloy with a melting point below 300°C, or a blend with a melting point below 300°C, the blend including at least two of the metal element, the alloy and the functional powder, that is, the blend includes the metal element and the alloy, or the blend includes the alloy and the functional powder, or the blend includes the metal element and the functional powder, or the blend includes the metal element, the alloy and the functional powder.

[0064] Exemplarily, the liquid metal element may be mercury element, gallium element, indium element or tin element.

[0065] Exemplarily, the alloy can be one of a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-tin alloy, a gallium-zinc alloy, a gallium-indium-zinc alloy, a gallium-tin-zinc alloy, a gallium-indium-tin-zinc alloy, a gallium-tin-cadmium alloy, a gallium-zinc-cadmium alloy, a bismuth-indium alloy, a bismuth-tin alloy, a bismuth-indium-tin alloy, a bismuth-indium-zinc alloy, a bismuth-tin-zinc alloy, a bismuth-indium ...lead alloy, a bismuth-tin-cadmium alloy, a bismuth-lead-tin alloy, a bismuth-tin-lead-cadmium alloy, a tin-lead alloy, a tin-copper alloy, a tin-zinc alloy, a tin-zinc-copper alloy, and a tin-silver-copper alloy.

[0066] The inventors have discovered that when the radiator circuit 2 includes a liquid metal circuit, if the substrate 1 has a better effect of adhering to the liquid metal, then during the process of the substrate 1 melting into a liquid state and flowing, there is a possibility that the liquid metal adheres to it and undergoes the same deformation as the substrate 1, which may cause the liquid metal to be unable to contact the short-circuit circuit 3, resulting in unsatisfactory reliability of the constant temperature destruction electronic tag.

[0067] Based on this, in the embodiment of the present invention, it is selected that the substrate 1 has the property of being repellent to liquid metal. At this time, during the process of the substrate 1 melting into liquid and flowing, the liquid metal will not adhere to it and undergo the same deformation as it, which can effectively ensure that the constant temperature destruction electronic tag is prepared to respond to the environmental temperature changes of the product.

[0068] It should be noted that whether liquid metal adheres to substrate 1 can be determined by making liquid metal circuits thereon, or by the following simpler method: substrate 1 is placed on a test bench at an angle of 20°, and liquid metal droplets (volume is 80 μL to 120 μL, taking 80 μL as an example) are dripped onto the surface of substrate 1 from a certain height (2 cm to 5 cm, taking 2 cm as an example). If there is no liquid metal residue on the surface of substrate 1, it means that liquid metal does not adhere to the surface of substrate 1. If there is liquid metal residue on the surface of substrate 1, it means that liquid metal adheres to substrate 1.

[0069] After a lot of experiments and research, it is found that paraffin can better meet the requirements of isolating liquid metal and setting the melting point at the same time. Therefore, the substrate 1 in the embodiment of the present invention is selected as a paraffin sheet. For example, the melting point and melting range of the paraffin sheet can be adjusted by changing the preparation process of paraffin and adjusting the molecular weight and polymer chain length of the synthetic polymer, thereby meeting the requirements of the fixed temperature destruction electronic tag in the embodiment of the present invention for the first melting point T1 of the substrate 1 in different application scenarios.

[0070] Furthermore, if the thickness of the substrate 1 is too large, the melting process will be slower, the melting time will be longer, and the reliability will be poor. If the thickness of the substrate 1 is too small, it will not be able to provide sufficient support when it is in a solid state. After fully considering the above content, the thickness of the substrate 1 selected in the embodiment of the present invention is 0.2mm~0.5mm.

[0071] Optionally, when the substrate 1 is a substrate 1 that is isolated from liquid metal, in order to form a better liquid metal circuit on the substrate 1, the embodiment of the present invention selects a mixed material of liquid metal and metal powder to make the liquid metal circuit. The above material is in a paste form and has higher adhesion on the substrate 1 than the liquid metal, but the adhesion is still low, which can meet the requirement of the liquid metal circuit contacting the short-circuit circuit 3 after the substrate 1 is melted.

[0072] Optionally, the liquid metal in the mixed material is a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-indium-tin-zinc or a gallium-tin alloy, and the metal powder is a silver powder or a silver-coated copper powder. The mass fraction of the metal powder in the mixed material is 8% to 40% to ensure that the mixed material has a suitable viscosity. The particle size of the metal powder ranges from 50nm to 50μm, so that the mixed material is more delicate and less granular, and it is easy to make liquid metal circuits by screen printing and other methods.

[0073] To facilitate understanding and implementation by those skilled in the art, the following embodiments of the present invention provide two specific constant temperature destruction electronic tags, as follows:

[0074] Example 1

[0075] like Figure 1 and Figure 2 As shown, the constant temperature destruction electronic tag provided by the embodiment of the present invention is composed of a substrate 1, a radiator circuit 2, a short-circuit circuit 3 and an external package 4.

[0076] The substrate 1 has a first melting point T1 of 37° C., and is specifically a paraffin sheet with a thickness of 0.4 mm;

[0077] The material of the radiator circuit 2 is silver-coated copper powder with a mixed mass ratio of 8% of gallium-indium alloy and a diameter of 2 μm; the radiator circuit 2 is drawn on the substrate 1 by screen printing.

[0078] The short-circuit line 3 is a copper wire with a diameter of 0.2 mm.

[0079] The material of the outer package 4 is PET film, and the package is performed in a vacuum packaging manner.

[0080] At present, some biologically active vaccines are mainly used in cold chain logistics below 37°C. The above-mentioned constant temperature destruction electronic tag can be pasted in the vaccine packaging box. When the ambient temperature reaches or exceeds 37°C, the substrate 1 melts, and the short-circuit circuit 3 is under pressure from the external packaging 4 and contacts the radiator circuit 2, causing the radiator circuit 2 to short-circuit and fail, and cannot be identified. When the vaccine ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag whose data cannot be read, it means that the corresponding vaccine has over-temperature failure in the cold chain logistics process.

[0081] Example 2

[0082] like Figure 7 and Figure 8 As shown, the constant temperature destruction electronic tag provided by the embodiment of the present invention is composed of a substrate 1, a radiator circuit 2, a short-circuit circuit 3, a limiting layer 6 and an outer package 4.

[0083] The substrate 1 has a first melting point T1 of 8° C. and is specifically a paraffin sheet with a thickness of 0.2 mm.

[0084] The material of the radiator circuit 2 is a gallium-indium-tin-zinc alloy mixed with silver powder with a mass ratio of 15% and a diameter of 20 μm; the radiator circuit 2 is drawn on the substrate 1 by roller printing.

[0085] The short-circuit circuit 3 is a single-layer wave-shaped plane spring in a compressed state, with a diameter not greater than the size of the radiator circuit 2, a thickness of 0.2 mm, and a spring height of 2 mm.

[0086] The limiting layer 6 also has a first melting point T1, ie, 8° C., and is specifically a paraffin sheet with a thickness of 0.5 mm.

[0087] The limiting layer 6 covers the short-circuit circuit 3 and compresses the short-circuit circuit 3 to a thickness of 0.4 mm, so that the short-circuit circuit 3 remains in a compressed and deformed state.

[0088] The material of the outer package 4 is a nylon film, and the outer package 4 is packaged in a vacuum packaging manner.

[0089] At present, cold chain logistics below 8°C is widely used in the storage and transportation of medicines, vaccines, and fresh foods. The above-mentioned constant temperature destruction electronic tag can be pasted in the product packaging box. When the ambient temperature reaches or exceeds 8°C, the substrate 1 and the limiting layer 6 melt, the short-circuit circuit 3 loses pressure restriction, recovers to a 2mm elastic height, and contacts the radiator circuit 2, causing the radiator circuit 2 to short-circuit and fail, and cannot be identified. When the product ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag whose data cannot be read, it means that the corresponding product has over-temperature failure in the cold chain logistics process.

[0090] Example 3

[0091] like Figure 5 and Figure 6 As shown, the constant temperature destruction electronic tag provided by the embodiment of the present invention is composed of a substrate 1, a radiator circuit 2, a short-circuit circuit 3, an outer package 4 and a first pressure-applying component 5.

[0092] The substrate 1 has a first melting point T1 of 45° C. and is specifically a paraffin sheet with a thickness of 0.5 mm.

[0093] The material of the radiator circuit 2 is silver-coated copper powder with a diameter of 10 μm and a gallium-indium alloy mixed in a mass ratio of 10%. The radiator circuit 2 is drawn on the substrate 1 by roller printing.

[0094] The short-circuit line 3 is a copper wire with a diameter of 0.4 mm.

[0095] The material of the outer package 4 is PET film.

[0096] The first pressure member 5 is a torsion pressure spring with a pressure arm length at least 0.3 times the size of the radiator circuit 2 and a diameter of 1.5 mm. The first pressure member 5 is installed outside the outer package 3 and applies pressure to the outer package 3 and its interior through the pressure arm.

[0097] At present, some biologically active vaccines are widely used in cold chain logistics below 45°C. The above-mentioned constant temperature destruction electronic tag can be pasted in the vaccine packaging box. When the ambient temperature reaches or exceeds 45°C, the substrate 1 melts. Under the pressure of the first pressure component 5, the short-circuit circuit 3 contacts the radiator circuit 2, causing the radiator circuit 2 to short-circuit and fail, and cannot be identified. When the vaccine ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag whose data cannot be read, it means that the corresponding vaccine has over-temperature failure in the cold chain logistics process.

[0098] Example 4

[0099] like Fig. 9 and Fig.10 As shown, the constant temperature destruction electronic tag provided by the embodiment of the present invention is composed of a substrate 1, a radiator circuit 2, a covering layer 7, a conductive second pressure-applying component 8, and an outer package 4.

[0100] The substrate 1 has a first melting point T1 of 10° C. and is specifically a paraffin sheet with a thickness of 0.3 mm.

[0101] The material of the radiator circuit 2 is a mixture of gallium-indium-tin alloy with a mass ratio of 8% and silver powder with a diameter of 1 μm; the radiator circuit 2 is drawn on the substrate 1 by screen printing.

[0102] The cover layer 7 also has a first melting point T1, ie, 10° C., and is specifically a 0.3 mm thick paraffin sheet.

[0103] The covering layer 7 is located on the first surface of the substrate 1 and covers the radiator circuit 2 .

[0104] The second pressure member 8 is a torsion pressure spring with a bending pressure arm having a length at least 0.5 times the size of the radiator circuit 2 and a diameter of 1 mm. The portion of the second pressure member 8 in contact with the substrate 1 serves as a short-circuit circuit 3 .

[0105] The second pressure-applying component 8 is installed inside the outer package 4 and applies pressure to the substrate 1 , the radiator circuit 2 and the cover layer 3 through the pressure arm.

[0106] The material of the outer package 4 is PET film.

[0107] At present, the storage and transportation of fresh food mostly use cold chain logistics below 10°C. The above-mentioned constant temperature destruction electronic tag can be pasted in the product packaging box. When the ambient temperature reaches or exceeds 10°C, the substrate 1 and the covering layer 7 melt. Under the pressure of the second pressure component 8, the pressure arm of the second pressure component 8 contacts the radiator circuit 2. The contact part can be used as a short-circuit circuit 3, causing the radiator circuit 2 to short-circuit and fail, and cannot be identified. When the vaccine ends the cold chain logistics, by identifying the constant temperature destruction electronic tag, any constant temperature destruction electronic tag that cannot read data indicates that the corresponding product has over-temperature failure in the cold chain logistics process.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A constant temperature destruction electronic tag, characterized in that: include: a substrate having a first melting point; a radiator circuit, the radiator circuit being located on the first surface of the substrate; a short-circuit circuit, the short-circuit circuit being located on the second surface of the substrate; An external package, the external package covering the substrate, the radiator circuit and the short-circuit circuit; The short-circuit circuit is used to contact the radiator circuit after the substrate is melted, so as to short-circuit the radiator circuit.

2. The constant temperature destruction electronic tag according to claim 1, characterized in that: The short-circuit circuit is a solid metal grid, a solid metal wire or a solid metal sheet.

3. The constant temperature destruction electronic tag according to claim 2, characterized in that: The device further comprises a first pressure applying component, wherein the first pressure applying component is used to apply pressure to the short circuit and / or the radiator circuit.

4. The constant temperature destruction electronic tag according to claim 2, characterized in that: The outer packaging adopts a vacuum packaging method.

5. The constant temperature destruction electronic tag according to claim 4, characterized in that: The outer packaging is a PET film or a nylon film.

6. The constant temperature destruction electronic tag according to claim 1, characterized in that: The short-circuit circuit is a metal planar spring, and the short-circuit circuit is compressed and wrapped in the limiting layer, and the limiting layer has the first melting point.

7. The constant temperature destruction electronic tag according to claim 1, characterized in that: The constant temperature destruction electronic tag includes a covering layer and a conductive second pressure-applying component, wherein the covering layer covers the radiator circuit and has a first melting point, the second pressure-applying component clamps the substrate and the covering layer, and the portion of the second pressure-applying component in contact with the substrate serves as the short-circuit circuit, and the covering layer and the second pressure-applying component are both enclosed in the outer package.

8. The constant temperature destruction electronic tag according to any one of claims 1 to 7, characterized in that: The radiator circuit is a liquid metal circuit, and the liquid metal circuit includes liquid metal with a second melting point, and the second melting point is lower than the first melting point.

9. The constant temperature destruction electronic tag according to claim 8, characterized in that: The substrate has a property of being repellent to the liquid metal.

10. The constant temperature destruction electronic tag according to claim 9, characterized in that: The substrate is a paraffin sheet.

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