Chip power supply system, chip, PCB and computer equipment

Abstract

The embodiment of the present application is a chip power supply system, a chip, a PCB and a computer device including the power supply system. The chip power supply system includes a first printed circuit board PCB, a chip, a power controller and an inductor module. The first PCB includes N through holes, the first ends of the N through holes are located on the top layer of the PCB, and the second ends of the N through holes are located on the bottom layer of the first PCB; N power supply contacts are arranged on the bottom surface of the chip. The chip is connected to the top layer of the first PCB through the N power supply contacts and the first ends of the N through holes. M power supply contacts are arranged on the bottom surface of the inductor module, and the inductor module is connected to the chip through the M power supply contacts and the second ends of M through holes in the N through holes. The power controller is connected to the inductor module through the first PCB to control the inductor module to supply power to the chip. The embodiment of the present application can shorten the power supply path of the chip and provide a larger current to the chip.

Description

Technical Field

[0001] The present application relates to chip technology, and in particular to a chip power supply system, a chip, a printed circuit board (PCB) and a computer device. Background Art

[0002] The fifth generation of mobile communication technology (5 th The development of 5G (5th generation mobile network) and artificial intelligence (AI) applications requires network chips to provide stronger switching processing capabilities, as well as central processing units (CPUs) and AI chips to provide more powerful computing capabilities, which will inevitably lead to these chips requiring larger currents when working.

[0003] How to provide a larger current for a working chip has become an urgent problem to be solved in this field. Summary of the invention

[0004] The present application provides a chip power supply system, a chip, a PCB and a computer device, which can provide a larger current to the chip, thereby improving the signal processing capability and / or computing capability of the computer device using the chip.

[0005] The first aspect of the present application provides a chip power supply system. The chip power supply system includes a first printed circuit board PCB, a chip, a power controller and an inductor module. The first PCB includes N through holes, the first ends of the N through holes are located on the top layer of the PCB, and the second ends of the N through holes are located on the bottom layer of the first PCB. The bottom surface of the chip is provided with N power supply contacts, and the chip is connected to the top layer of the first PCB through the N power supply contacts and the first ends of the N through holes. The bottom surface of the inductor module is provided with M power supply contacts, and the inductor module is connected to the chip through the M power supply contacts and the second ends of M through holes in the N through holes. The power controller is connected to the inductor module through the first PCB to control the inductor module to supply power to the chip. Wherein, N and M are both natural numbers, and M is less than N.

[0006] The chip power supply system provided by the present application can shorten the power supply path of the chip and greatly reduce the energy consumption on the power supply path. In addition, the chip power supply system of the present application does not require the inductor module to power the chip from the periphery of the chip (referring to the area outside the coverage of the chip) through the PCB, which reduces the number of layers of the PCB and reduces the production cost of the PCB. Furthermore, since the inductor module transmits voltage to the chip through the through-holes of the PCB, the length of each through-hole is the same, so that the impedance reaching each power contact of the chip is basically the same, which solves the problem of excessive current at some power contacts of the chip.

[0007] In one embodiment, the chip power supply system further includes an input capacitor and an output capacitor; the input capacitor is used to filter the input voltage and input the filtered input voltage into the inductor module; the output capacitor is used to filter the output voltage and input the filtered output voltage into the chip. Since the input capacitor can filter the input voltage, the output capacitor can filter the output voltage of the inductor module, and ultimately the current transmitted to the chip is more stable.

[0008] In one embodiment, the inductor module is connected to the bottom surface of the first PCB through the M power supply contacts and the second ends of M through holes among the N through holes, and is connected to the chip through the M through holes. In this embodiment, the inductor module is directly connected to the chip through the M through holes of the PCB, so the chip power supply system can include only one PCB, saving the manufacturing cost of the chip power supply system.

[0009] In one embodiment, the inductor module includes an inductor and two MOS tubes to output a stable voltage and current. Optionally, the inductor module includes a plurality of sub-modules, each of which includes an inductor and two MOS tubes. The inductor module integrated with the plurality of sub-modules can provide a larger current.

[0010] In one embodiment, the chip power supply system includes a plurality of the inductor modules, the output capacitor includes a first capacitor, the first capacitor is coupled to the bottom layer of the first PCB, the first capacitor is connected to the chip through at least two through holes among the N through holes of the first PCB, and the plurality of inductor modules are connected through the power layer and the ground layer in the first PCB. In this embodiment, the plurality of inductor modules can provide a larger current for the chip, and the first capacitor can make the current transmitted from the inductor module to the chip more stable and smooth.

[0011] In one embodiment, the output capacitor further includes a second capacitor, the second capacitor is connected to the plurality of inductor modules through the power layer and the ground layer in the first PCB, the second capacitor is coupled to the first PCB, and is located at the periphery of the chip. In this embodiment, the added second capacitor can make the current transmitted from the inductor module to the chip more stable. In addition, since the second capacitor is arranged at the periphery of the chip, it does not occupy the range where the power supply contacts of the chip are located, and thus does not reduce the current provided to the chip.

[0012] In one embodiment, the output capacitor further includes a second capacitor, which is embedded in the first PCB and connected to the plurality of inductor modules through the power layer and the ground layer in the first PCB. In this embodiment, the added second capacitor can make the current transmitted from the inductor module to the chip more stable. In addition, since the second capacitor is arranged inside the PCB, it does not occupy the range where the power supply contacts of the chip are located, thereby not reducing the current provided to the chip.

[0013] In one embodiment, the chip power supply system further includes a second PCB, the second PCB includes N through holes, the N through holes of the second PCB correspond to the N through holes of the first PCB, and the second PCB is electrically connected to the first PCB through the N through holes of the second PCB. The inductor module is connected to the second ends of the M through holes of the N through holes of the first PCB through the M power supply contacts and the M through holes of the N through holes of the second PCB, and is connected to the chip through the M through holes of the first PCB. In this embodiment, the inductor module is electrically connected to the chip through the second PCB and the first PCB, making the implementation method of the chip power supply system of the present application more flexible.

[0014] In one embodiment, the chip power supply system includes a plurality of the inductor modules, and the output capacitor includes a first capacitor and a second capacitor; the first capacitor is coupled to the bottom layer of the second PCB, the first capacitor is connected to the chip through the second PCB and the through hole corresponding to the first PCB, the second capacitor is buried in the second PCB, and the first capacitor and the second capacitor are connected to the plurality of inductor modules through the power layer and the ground layer in the second PCB. In this embodiment, the capacitor is buried in the second PCB, which provides a filtering effect for the chip power supply system, making the current and voltage transmitted to the chip by the inductor module more stable.

[0015] In one embodiment, the chip power supply system includes a plurality of the inductor modules, the output capacitor is coupled to the bottom layer of the second PCB, and the plurality of inductor modules are connected through the power layer and the ground layer in the second PCB, and the output capacitor is located at the periphery of the chip. In this embodiment, the output capacitor is arranged at the periphery of the chip, does not occupy the range where the power supply contacts of the chip are located, and thus does not reduce the current provided to the chip.

[0016] In one embodiment, the second PCB is electrically connected to the first PCB via a connector; or the second PCB is electrically connected to the first PCB via a contact of the second PCB. It can be seen that the present application provides a variety of connection methods between the second PCB and the first PCB, making the design of the chip power supply system of the present application more flexible.

[0017] The second aspect of the present application provides a chip, which includes: an integrated circuit and a shell for encapsulating the integrated circuit, the shell including a top surface and a bottom surface. A set area of ​​the bottom surface is provided with a plurality of power supply contacts, the plurality of power supply contacts including a plurality of power supply contacts and a plurality of grounding contacts, the plurality of power supply contacts and the plurality of grounding contacts are arranged in partitions so that all power supply contacts in each partition of the set area are power supply contacts of the same type. The power supply contacts and grounding contacts of the chip provided in this embodiment are arranged in partitions, so that the vertical connection between the inductor module and the chip is more convenient.

[0018] In one implementation, the power supply contacts in the set area of ​​the chip are arranged as a power network or a ground network according to the partition. That is, the power network in the integrated circuit in the chip is connected to the power supply contacts of the chip, and the ground network in the integrated circuit is connected to the ground contacts of the chip. This embodiment makes it easy for the chip to receive the current transmitted by the inductor module perpendicular to the bottom of the chip.

[0019] In one implementation, the set area is the central area, corner area or peripheral area of ​​the bottom surface, and the power supply contacts in the set area are arranged in one of the following arrays: rectangular array, square array, diamond array, triangle array, hexagonal array, circular array. It can be seen that the power supply contacts in the specific area of ​​the chip in this embodiment can be flexibly arranged in a variety of forms.

[0020] The third aspect of the present application provides a printed circuit board PCB, which includes a top layer, a bottom layer and N through holes. The first ends of the N through holes are arranged in a first area of ​​the top layer, and the first area is used to connect the power supply contacts of the chip; the N through holes include a plurality of power through holes and a plurality of ground through holes, and the plurality of power through holes and the plurality of ground through holes are arranged in partitions so that all through holes in each partition of the first area are through holes of the same type. The PCB in this embodiment can deploy power through holes and ground through holes in partitions, avoiding interference caused by the interlacing of power through holes and ground through holes.

[0021] In one embodiment, it is characterized in that the second ends of the N through holes are arranged in the second area of ​​the bottom layer of the PCB, the second area corresponds to the first area, and is used to connect the inductor module. The PCB of this embodiment can arrange the inductor module under the chip through the N through holes, so that the path for the inductor module to supply power to the chip is the shortest.

[0022] In one embodiment, the through holes in the first region and the second region are arranged in one of the following arrays: a rectangular array, a square array, a diamond array, a triangle array, a hexagonal array, and a circular array.

[0023] In one embodiment, an output capacitor is embedded in the PCB, one end of the output capacitor is connected to a power through hole among the N through holes, and the other end is connected to a ground through hole among the N through holes. The capacitor is embedded in the PCB in this embodiment, so that the current provided by the inductor module to the chip can be more stable.

[0024] A fourth aspect of the present application provides a computer device, which includes the chip power supply system of the first aspect, or the computer device includes the chip of the second aspect, or the computer device includes the PCB of the third aspect.

[0025] The various implementations of the first to fourth aspects of the present application can be combined with each other without conflict and achieve effective technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0027] Figure 1A A three-dimensional schematic diagram of a chip;

[0028] Figure 1B and Figure 1C for Figure 1A A possible bottom view of the chip is shown;

[0029] Figure 2 is a cross-sectional schematic diagram of a PCB;

[0030] Figure 3A A schematic diagram of the structure of a chip power supply system provided in an embodiment of the present application;

[0031] Figure 3B for Figure 3A Schematic diagram of the power supply principle of the chip power supply system shown;

[0032] Figure 4A A schematic diagram of the structure of another chip power supply system provided in an embodiment of the present application;

[0033] Figure 4B for Figure 4A Schematic diagram of the power supply principle of the chip power supply system shown;

[0034] Figure 5A-Figure 5B A schematic diagram of the structure of chip contacts provided in an embodiment of the present application;

[0035] Figure 6 A schematic diagram of a first chip power supply system implementation method provided in an embodiment of the present application;

[0036] Figure 7 A schematic diagram of a second chip power supply system implementation method provided in an embodiment of the present application;

[0037] Figure 7A-7C for Figure 7 A schematic diagram of an implementation method of a PCB filter sub-board 404 in the chip power supply system shown;

[0038] Figure 8 A schematic diagram of a third chip power supply system implementation method provided in an embodiment of the present application;

[0039] Fig. 9 A schematic diagram of a fourth chip power supply system implementation method provided in an embodiment of the present application;

[0040] Fig.10 A schematic diagram of a fifth chip power supply system implementation method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] An integrated circuit (IC) is a microstructure with the required circuit functions formed by interconnecting the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit using a certain process and deploying them on one or several semiconductor chips or dielectric substrates. An integrated circuit may include a processor, a microprocessor, a microprocessor in a package, a controller, a controller hub, a field-programmable gate array (FPGA), a programmable logic array (PLA), a microcontroller, an advanced programmable interrupt controller (APIC) or other semiconductor or electronic devices.

[0042] This application refers to the structure formed after the integrated circuit is packaged in a shell as a chip. The bottom surface of the chip is usually provided with a plurality of contacts as input / output terminals. The contact can be any one of a pad, a pin, a protrusion, a ball or a contact member for transmitting a signal or current. Due to the advantages of small size, light weight, few lead wires and welding points, the chip has become a basic device for electronic devices. Chips used in network equipment and computing equipment generally have a larger size and require a larger current because they require higher performance.

[0043] like Figure 1A The figure shows the appearance of a chip. The integrated circuit of the chip is packaged in a shell (package), and the shell includes a surface and a bottom surface. The surface of the shell is usually printed with the brand, name, model and other information of the chip. The chip adopts ball grid array packaging technology, and array solder balls (ball contacts) are deployed at the bottom of the chip as the input / output terminal of the circuit. These ball contacts connect the circuit inside the chip to other devices. For example, Figure 1B and Figure 1C A schematic diagram of the distribution of different spherical contacts on the bottom surface of the chip is shown. Some of these spherical contacts are used to transmit signals, and some are used to transmit current. The function of each spherical contact varies depending on the chip. In this application, the contacts used to transmit signals are referred to as signal contacts, and the contacts used to transmit current are referred to as power contacts. Further, the power supply contacts used to receive the current transmitted by the chip are referred to as ground contacts, and the contacts used to transmit current to the chip are referred to as power contacts. Usually, the chip is connected to other chips or devices through a printed circuit board (PCB) and transmits signals. In addition, the chip also obtains the current required for work through the PCB. PCB is a support for electronic components and a carrier for electrical connections of electronic components. The current mainstream PCB is a multi-layer PCB (the PCB mentioned later in this application is a multi-layer PCB) formed by alternately bonding multiple PCB layers together through a positioning system and insulating materials and interconnecting the conductive patterns according to design requirements. That is, each PCB includes multiple PCB layers, two PCB layers are separated by an insulating layer, contacts for soldering electronic components are arranged on the top PCB layer and / or the bottom PCB layer, and each PCB layer except the insulating layer is deployed with a printed circuit (copper track) for transmitting signals or current. Various guide holes are arranged on the PCB for connecting different PCB layers. Among them, the blind hole is located on the top and bottom surfaces of the printed circuit board, has a certain depth, and is used for connecting the surface layer (top or bottom layer) circuit and the inner layer circuit. The depth of the hole usually does not exceed a certain ratio (aperture). Buried hole refers to a connection hole located in the inner layer of the printed circuit board, which does not extend to the surface of the circuit board.

[0044] like Figure 2 As shown, it is a cross-sectional schematic diagram of a PCB. It can be seen that the PCB includes 6 PCB layers 201-206 (top layer, ground layer, middle layer 1, middle layer 2, power layer and bottom layer). Two PCB layers are attached to a core board, and different core boards are bonded together by resin. Figure 2The through hole 209 in the PCB can connect all 6 PCB layers, the blind hole 210 connects PCB layers 203 and 204, and the buried hole can connect PCB layers 201-204. The order of each PCB layer in the PCB and the content (current or signal) of each transmission can be designed as needed.

[0045] Usually, the PCB supplies power to each electronic component (including chip) connected to the PCB through the power layer so that the system composed of multiple electronic components can work. As shown in Figure 3, it is a structural diagram of the power supply system when the chip is powered by the PCB. The power controller 301 and n power modules 302a to 302n (collectively referred to as power modules 302) are connected (plugged or welded) on the PCB 300. The power controller 301 is used to control the opening or closing of each MOS tube in each power module 302. The output voltage of the power module 302 is determined by adjusting the duty cycle of the opening time of each MOS tube. The voltage output by the multiple power modules 302 is transmitted to the power layer 303 of the PCB 300 (the gray square in the figure) to power the chip 304 connected to the power layer 303. Among them, the chip 304 is connected to the power layer 303 through the power layer 303. Figure 1B The power supply contacts shown in FIG. 1C are connected to the power supply layer 303 , and the power supply controller 301 , n power supply modules 302 a - 302 n and the chip 303 are all connected on the same surface (ie, the top layer) of the PCB 300 .

[0046] Further, Figure 3B for Figure 3A A schematic diagram of the power supply principle of the power supply system shown in FIG. (Since PCB is the carrier of various devices, its role is equivalent to that of a wire, so Figure 3B PCB 300 is not shown in FIG. Figure 3BIn the embodiment, the power controller 301 is respectively connected to each MOS tube in each power module 302, each power module 302 includes an input power supply Vin, an input capacitor Cin connected to the input power supply Vin, two MOS tubes connected in series (which can be presented as an integrated MOS device to the outside), the drain (D) of the first MOS tube is connected to the input power supply Vin, the source (S) is connected to the drain of the second MOS tube, the source of the second MOS tube is grounded, the gates of the two MOS tubes are respectively connected to the power controller 301, and the connection point between the first MOS tube and the second MOS tube is connected to the inductor L (the inductor L is used for rectification and filtering, and the inductor L is turned on when the first MOS tube is turned on). Energy storage, when the first MOS tube is turned off and the second MOS is turned on, the load is continued to flow, and the inductor L can form a filtering system with the capacitor to output a relatively stable voltage and current), the inductor L is connected to at least one output capacitor Cout (for filtering), the output of each power module 302 is used as a power supply (called a phase) to supply power to the power layer 303, and the outputs of n power modules are connected in parallel to form the output power Vout of the power layer 303. The n power modules can form a multi-phase power supply through parallel output and transmit current to the chip 304 through the power layer 303 (multiple power modules in parallel can achieve a larger current output while reducing the output power switching noise). Multiple power supply contacts for transmitting current are deployed on the chip 304. When the chip 304 is welded to the power layer 303 using these power supply contacts, the chip 304 can obtain current through the power layer 303.

[0047] exist Figure 3A and Figure 3B In the power supply system shown, since the power module 302 and the chip 304 are connected on the same surface of the PCB, the current output by the power module 302 needs to be transmitted for a distance on the power layer 303 before reaching the chip 304. And due to the limitation of the processing technology, the thickness of each layer of the PCB is only 0.5oz-2oz (that is, the thickness of 0.5 to 2 ounces of copper averagely laid flat on an area of ​​1 square foot), which results in a large DC impedance Rdc of the power layer. When the current required by the chip 304 is large, the energy consumption I^2*Rdc on the power supply path on the power layer 303 will exceed the requirements of the heat dissipation and chip power supply specifications. In addition, since the current that each power module 302 can provide is limited, when the chip 304 requires a larger current, multiple power modules 302 are required to supply power to the chip 304 at the same time. The DC impedance Rdc of the power supply contacts from different power modules 302 to the chip 304 is different. Therefore, the current passing through each power supply contact is different. The current passing through the power supply contacts outside the chip 304 is much larger than that passing through the internal power supply contacts. This may cause the current passing through the peripheral power supply contacts to exceed the limit that the power supply contacts can withstand, causing damage to the chip 304.

[0048] Based on the above considerations, the present application provides another chip power supply system to shorten the current transmission path when powering the chip through the PCB, so as to avoid chip damage caused by inconsistent current passing through the various spherical contacts on the chip.

[0049] like Figure 4A As shown, it is a schematic diagram of the structure of another chip power supply system provided by the present application. The chip power supply system includes a PCB 400, a power controller 401, at least one inductor module 402 (402A and 402B are shown in the figure) and a chip 403. PCB 400 includes N through holes (the N through holes are part of all the through holes included in PCB 400, and are used to power the chip 403. Unless otherwise specified in the subsequent parts of this application, the through holes refer to power supply through holes), and the first ends of the N through holes are located on the top layer of PCB 400, and the second ends are located on the bottom layer of PCB 400. The first end and the second end are both made of conductive material. The bottom surface of chip 403 is provided with N power supply contacts ( Figure 4A The solid circles in the figure are power supply contacts, and the hollow circles are contacts with other uses. This application is only for illustration and no further explanation is given). The chip 403 is connected to the top layer of the PCB 400 through the N power supply contacts and the N through holes. Each of the at least one inductor module 402 is vertically disposed below the power supply contacts of the chip 403, and the bottom surface of each inductor module is provided with M power supply contacts ( Figure 4A ), and each inductor module is connected to the bottom layer of PCB 400 through its own M power supply contacts and the second ends of M through holes of N through holes of PCB400. In the present application, M is less than or equal to N. Each inductor module 402 includes a MOS tube and an inductor. The number of MOS tubes and inductors in the inductor module 402 can be changed with the design of the circuit. The power controller 401 is connected to each inductor module 402 through PCB 400. The inductor module 402 is used to supply power to the chip 403 under the control of the power controller 401. The number of inductor modules 402 can be adjusted according to the power specifications of the chip 403. A sufficient number of inductor modules 402 can provide the chip 403 with a large current that meets the requirements of the chip 403 and reduces power supply losses.

[0050] In one possible design, the power controller 401 can be connected to the top layer of the PCB 400. In another possible design, the power controller 401 can be connected to the bottom layer of the PCB 400. Figure 4A The power controller 401 is connected to the top layer of the PCB 400 as an example. The power controller 401 is connected to a PCB layer through the contacts on the top layer of the PCB 400, and is connected to the inductor module 402 through the PCB layer. Optionally, Figure 4AThe chip power supply system shown may further include a plurality of output capacitors, which may be connected to the inductor module 402 in different ways to filter the voltage output by the inductor module 402 .

[0051] like Figure 4B As shown, Figure 4A The power supply principle diagram of the chip power supply system shown in the figure (Since PCB is the carrier of various devices, its function is equivalent to the wire, so Figure 4B PCB 400 is not shown in FIG. Figure 4B In the embodiment, the power controller 401 is connected to each MOS tube in each inductor module 402, and is used to control the opening or closing of each MOS tube in each inductor module 402, and the output voltage of the inductor module 402 is determined by adjusting the duty cycle of the opening time of each MOS tube. Each inductor module 402 includes one or more sub-modules ( Figure 4B In the embodiment, the inductor module 402A includes two sub-modules, and the inductor module 402B includes one sub-module), each sub-module includes at least two MOS tubes connected in series and an inductor L. Different numbers of sub-modules can provide different currents. In each sub-module, the drain (D) of the first MOS tube is connected to the input power supply Vin, the source (S) is connected to the drain of the second MOS tube, the source of the second MOS tube is grounded, the gates of the two MOS tubes are respectively connected to the power controller 401, and the connection point between the first MOS tube and the second MOS tube is connected to the inductor L (the inductor L is used for rectification and filtering, the inductor L stores energy when the first MOS tube is turned on, and provides continuous current to the load when the first MOS tube is turned off and the second MOS is turned on. At the same time, the inductor L and the capacitor form a filtering system to output a relatively stable voltage and current). The current output by each inductor module 402 is directly transmitted to the corresponding power supply contact of the chip 403 through the power supply contact at the bottom of the inductor module 402 (because there are a large number of power supply contacts at the bottom of the inductor module, represented by a thick solid line in the figure). Optionally, Figure 4B The device may also include multiple capacitors, including an input capacitor Cin and an output capacitor Cout. The input capacitor Cin is used to filter the input voltage and input the filtered input voltage to the corresponding inductor module 402. The output capacitor Cout is used to filter the output voltage of the corresponding inductor module and input the filtered output voltage to the chip 403.

[0052] This application Figure 4A and Figure 4BIn the power supply system shown, the inductor module 402 is directly connected to the chip 403 through the N through holes of the PCB 400, and supplies power to the chip 403, shortening the power supply path, reducing the power supply path loss, and improving the power supply efficiency. Furthermore, the present application does not require the power layer of the PCB 400 to supply power to the chip 403, which can reduce the number of layers of the PCB 400 and reduce the complexity and cost of manufacturing the PCB.

[0053] because Figure 4A and Figure 4B The inductor module 402 in the embodiment is connected to the chip 403 through the through hole of the PCB 400. In order to reduce the complexity of implementation, the present application provides a new chip. The chip includes an integrated circuit and a housing, and the housing includes a surface and a bottom surface. Figure 5A and 5B As shown, the bottom surface of the chip provided by the present application is provided with a plurality of contacts, wherein the hollow contacts in the edge area of ​​the bottom surface are signal contacts or other functional contacts other than the power supply contacts, and the center area of ​​the bottom surface ( Figure 5A The area of ​​the small square in Figure 5B The contacts in the diamond area in the chip are power contacts, which are further divided into power contacts (black solid circles) and ground contacts (gray solid circles), wherein the power contacts and ground contacts are arranged in partitions, so that within the set area on the bottom surface, all the power contacts in each partition (for example, each row or column is a partition, or each multiple rows or columns is a partition) are the same type of power contacts. In other words, within the set area on the bottom surface of the chip, the power contacts in a row or column are either all power contacts or all ground contacts. All power contacts can be arranged in the same partition or in different partitions, and all ground contacts can also be arranged in the same partition or in different partitions. Figure 5A and 5B In the , all power supply contacts are divided into 4 partitions, and the power contacts and ground contacts are located in two partitions respectively.

[0054] Figure 5A and Figure 5BIn the embodiment, the power supply contacts are arranged in the central area of ​​the bottom surface of the chip. In a possible implementation, the power supply contacts may also be arranged in other set areas of the bottom surface of the chip, for example, the edge or corner of the bottom surface. The present application does not limit the area where the power supply contacts are located. The power supply contacts in the set area are arranged into a power supply network or a grounding network according to the partitions. That is, the power supply contacts in a partition are interconnected through the circuit in the chip to form a power supply network or a grounding network. Specifically, the contacts in the power contact partition constitute a power supply network, and the contacts in the ground contact partition constitute a grounding network. Accordingly, the power supply network in the integrated circuit in the chip connects the power supply contacts of the chip, and the grounding network in the integrated circuit connects the grounding contacts of the chip. Furthermore, the power supply contacts in the set area can be arranged into one of the following arrays: a rectangular array, a square array, a diamond array, a triangular array, a hexagonal array, and a circular array.

[0055] This application Figure 4A and Figure 4B The chip power supply system shown can be implemented in different ways. Since the input voltage, input capacitor and power controller 401 can be implemented using common technologies in the art, the following Figure 6-10 illustrate Figure 4A and Figure 4B The connection method of the inductor module 402 and the chip 403 in the chip power supply system shown in FIG. Figure 6-10 The capacitors in the figure are all output capacitors.

[0056] like Figure 6 As shown, it is a schematic diagram of the first chip power supply system implementation method provided in an embodiment of the present application. Figure 6In the embodiment, two inductor modules 402A and 402B are used to supply power to the chip 403. Each inductor module 402 provides two columns of power contacts and two columns of ground contacts. The power contacts of the inductor module 402 are connected to the power contacts of the chip 403 through the power through holes (gray channels in the figure) on the PCB 400, and the ground contacts of the inductor module 402 are connected to the ground contacts of the chip 403 through the ground through holes (hollow channels in the figure) on the PCB 400. All inductor modules 402 are located vertically below the chip 403 across the PCB 400. All through holes connecting the power contacts are interconnected through the power layer of the PCB 400 (indicated by thick horizontal lines in the figure), and all through holes connecting the ground contacts are interconnected through the ground layer of the PCB 400 (indicated by thin horizontal lines in the figure). The inductor modules 402A and 402B share one (or more) output capacitors (i.e., connected to the one (or more) output capacitors through the lines in the PCB 400). The output capacitors (which may be referred to as first capacitors) are connected to the bottom layer of the PCB 400, and are used to filter the voltage output by the inductor modules 402A and 402B through at least two of the N through holes in the PCB 400, and transmit the filtered voltage to the connection chip 403 through the connected through holes. Optionally, the output capacitor is located below the chip 403, and the PCB 400 may include multiple power layers and ground layers. Figure 6 In the system shown, since multiple inductor modules can share one (or more) output capacitors, the cost of the chip power supply system can be saved.

[0057] like Figure 7 FIG. 1 is a schematic diagram of a second chip power supply system implementation method provided in an embodiment of the present application. Figure 6 Based on the chip power supply system shown, Figure 7 The chip power supply system shown also includes a PCB filter sub-board 404 (in the case of using Figure 7 In the scheme shown, the present application may refer to PCB 400 as the first PCB and the PCB filter sub-board as the second PCB), the PCB filter sub-board 404 includes N through holes, the first end of the N through holes on the top layer of the PCB filter sub-board is connected to the second end of the N through holes of PCB 400, and the second end of the N through holes on the bottom layer of the PCB filter sub-board is connected to the inductor module 402 and the output capacitor. A plurality of output capacitors are embedded in the PCB filter sub-board, one end of each of the plurality of output capacitors is connected to the power through hole (and then connected to the power layer of the PCB filter sub-board 404), and the other end is connected to the ground through hole (and then connected to the ground layer of the PCB filter sub-board 404). It can be seen that in this embodiment, the PCB filter sub-board 404 is used as a transmission medium between the inductor module 402 and the chip 403 to improve the filtering effect, so that the voltage and current output by the inductor module 404 are more stable.

[0058] There are many ways to deploy the output capacitor in the PCB filter daughter board 404. Fig. 7A FIG. 4 is a schematic diagram showing a connection relationship of capacitors in the PCB filter sub-board 404. Fig. 7A In the embodiment, one end of each of the multiple capacitors is connected to the power layer (thick solid line in the figure) in the PCB filter sub-board 404, and the other end is connected to the ground layer (thin solid line in the figure) in the PCB filter sub-board, forming a filter circuit composed of the multiple capacitors in parallel. The filter circuit can reduce the risk of power short circuit caused by capacitor failure.

[0059] like Figure 7B FIG. 4 is another schematic diagram of the connection relationship of capacitors in the PCB filter sub-board 404. Figure 7B In the figure, two capacitors are connected in series through a conductive layer to form a series capacitor, one end of each of the multiple series capacitors is connected to the power layer (thick solid line in the figure) in the PCB filter sub-board 404, and the other end is connected to the ground layer (thin solid line in the figure) in the PCB filter sub-board 404, forming a filter circuit composed of the multiple series capacitors in parallel. The filter circuit can effectively improve the reliability of capacitor applications, especially buried capacitor applications, and reduce the risk of power short circuit due to capacitor failure.

[0060] like Figure 7C FIG. 4 is a schematic diagram showing another connection relationship of capacitors in the PCB filter sub-board 404. Figure 7C In the figure, a plurality of capacitors can be interconnected to form a capacitor matrix, and each capacitor matrix includes at least one series capacitor, which is formed by two capacitors connected in series. One end of the series capacitor in each capacitor matrix is ​​connected to the power layer in the PCB filter sub-board 404 (thick solid line in the figure), and the other end is connected to the ground layer in the PCB filter sub-board 404 (thin solid line in the figure), forming a filter circuit including multiple capacitor matrices (2 capacitor matrices, 4 capacitor matrices and 6 capacitor matrices are shown in the figure). The function of this filter circuit is equivalent to Figure 7B The application of can effectively improve the reliability of capacitor applications, especially embedded capacitor applications. Figure 7B The solution is more flexible to meet engineering design applications.

[0061] The filtering effect can be improved by using the PCB filter sub-board 404, so that the voltage transmitted to the chip 403 is more stable. Optionally, the capacitor in the PCB filter sub-board 404 can also be buried in the PCB 400, so that Figure 7 The illustrated embodiment may also not include the PCB filter daughter board 404 .

[0062] like Figure 8 FIG. 1 is a schematic diagram of a third chip power supply system implementation method provided in an embodiment of the present application. Figure 6 Based on the chip power supply system shown, Figure 8The chip power supply system shown also includes a plurality of remote capacitors (which may be referred to as second capacitors), which are connected to the bottom layer of PCB 400 and connected to inductor modules 402A and 402B through the power layer of PCB 400 to filter the voltage output by inductor modules 402A and 402B. The plurality of remote capacitors are not located below chip 403. By deploying remote capacitors on the bottom layer of PCB 400, the voltage stability output by inductor modules 402A and 402B can be improved.

[0063] like Fig. 9 As shown, it is a schematic diagram of the implementation method of the third chip power supply system provided in the embodiment of the present application. In addition to the power controller 401, the chip power supply system also includes a PCB 400 (which can be called the first PCB), a PCB 405 (which can be called the third PCB), a plurality of inductor modules 402 (inductor modules 402A, 402B and 402C are shown in the figure) and a chip 403. The description of other embodiments can be referred to for PCB 400. PCB 405 includes N through holes corresponding to PCB 400, and PCB 405 is coupled to PCB 400 through the N through holes to form N through holes across the PCB, some of which are cross-PCB power through holes (gray through holes in the figure), and some are cross-PCB grounding through holes (hollow through holes in the figure). Chip 403 is connected to the top layer of PCB 400. The multi-inductor module 402 is coupled to the bottom surface of PCB 405, connected to chip 403 through the cross-PCB through holes, and supplies power to chip 403. The multiple inductor modules 402 are vertically disposed below the chip 403. The chip power supply system further includes multiple output capacitors, which are coupled to the bottom surface of the PCB 405 and connected to the multiple inductor modules 402 through the power layer and power through-holes in the PCB 405. Fig. 9 The power supply system shown realizes vertical deployment of more inductor modules through the combined design of two PCBs to achieve greater current power supply. At the same time, the filter capacitor can be placed close to the inductor module to achieve a good filtering effect and provide a stable power supply voltage to the chip 403.

[0064] exist Fig. 9 Based on the chip power supply system shown in FIG. 1 , the present application also provides a fifth chip power supply system, such as Fig.10As shown, the chip power supply system also includes a connector for connecting PCB 400 and PCB 405. One end of the connector is provided with N metal springs, and the other end includes N power supply contacts. The N metal springs are connected to the power supply contacts of the N through holes of PCB 400 at the bottom layer, and the N power supply contacts are connected to the power supply contacts of the N through holes of PCB 405 at the top layer. Since PCB 400 and PCB 405 are connected through the connector, in order to stabilize the connection between PCB 400 and PCB 405, other fixing devices ( Fig.10 The studs are shown in the figure to connect PCB 400 and then PCB 405. Through this connector, a flexible connection between PCB 400 and PCB 405 is achieved. Fig. 9 The effect of the power supply system.

[0065] The above embodiments demonstrate the chip power supply system provided by the present application. Although the embodiments are slightly different, they belong to the same inventive concept and can be referenced to each other, that is, for parts not described in detail in one embodiment, reference can be made to the description of other embodiments.

[0066] Furthermore, in order to increase the life of the chip, the chip power supply system provided in each embodiment of the present application may further include a heat sink, which is coupled to the surface of the chip to dissipate heat for the chip.

[0067] In order to achieve the purpose of powering the chip, the present application also provides a PCB, which includes a top layer, a bottom layer and N through holes, the first ends of the N through holes are arranged in the first area of ​​the top layer of the PCB, the first area is used to connect the power supply contacts of the chip, the N through holes include a plurality of power through holes and a plurality of ground through holes, the plurality of power through holes and the plurality of ground through holes are arranged in partitions, so that all through holes in each partition of the first area are through holes of the same type. That is, the through holes in each row or each column of the first area are either all ground through holes or all power through holes. The partitions in the PCB can refer to Figure 5A and Figure 5B Description.

[0068] In one implementation, the second ends of the N through holes are disposed in a second area of ​​the bottom layer of the PCB, the second area corresponding to the first area, and used to connect the inductor module. Specifically, the second area is located below the first area.

[0069] The through holes in the first area and the second area are arranged in one of the following arrays: a rectangular array, a square array, a diamond array, a triangle array, a hexagonal array, and a circular array. The shapes of the first area and the second area are the same as the shape of the area for arranging power supply contacts on the bottom surface of the chip shown in FIG. 5 .

[0070] In another implementation, some of the N through holes are connected to the inductor module, and another part of the through holes are connected to the first type of output capacitor.

[0071] Optionally, an output capacitor is embedded inside the PCB, one end of the output capacitor is connected to one of the N power supply through holes, and the other end of the output capacitor is connected to one of the grounding through holes among the N power supply through holes.

[0072] The chip power supply system provided by the present application can shorten the power supply path of the chip and greatly reduce the energy consumption on the power supply path. In addition, the chip power supply system of the present application does not require the inductor module to power the chip from the periphery of the chip through the PCB, which reduces the number of layers of the PCB and reduces the production cost of the PCB. In addition, since the inductor module transmits voltage to the chip through the through hole, the length of each through hole is the same, so that the impedance reaching each power contact of the chip is basically the same, which solves the problem of excessive current at some power contacts of the chip.

[0073] Furthermore, the present application also provides a computer device, which includes the chip power supply system, chip, or PCB provided in the present application. The computer device can be a terminal, such as a personal computer, a mobile phone, a PDA, a wearable electronic device, a vehicle-mounted device, etc. The computer device can also be a network device, such as a switch, a router, a firewall, a base station, a wireless access point, a wireless controller, etc. The computer device can also be a storage device, such as a storage server, a storage array, etc. The computer device can also be a device that provides high-performance computing. The various embodiments in the present application can be combined with each other without conflict, and the effective technical effect can be achieved.

[0074] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A chip power supply system, characterized in that: It includes a first printed circuit board PCB, a chip, a power controller and an inductor module; The first PCB includes N through holes, wherein first ends of the N through holes are located on a top layer of the PCB, and second ends of the N through holes are located on a bottom layer of the first PCB; The bottom surface of the chip is provided with N power supply contacts; the chip is connected to the top layer of the first PCB through the N power supply contacts and the first ends of the N through holes; The bottom surface of the inductor module is provided with M power supply contacts, and the inductor module is connected to the chip through the M power supply contacts and the second ends of M through holes among the N through holes; The power controller is connected to the inductor module through the first PCB, and controls the inductor module to supply power to the chip.

2. The chip power supply system according to claim 1, characterized in that: The chip power supply system also includes an input capacitor and an output capacitor; the input capacitor is used to filter the input voltage and input the filtered input voltage into the inductor module; the output capacitor is used to filter the output voltage and input the filtered output voltage into the chip.

3. The chip power supply system according to claim 2, characterized in that: The inductor module is connected to the chip through the M power supply contacts and the second ends of the M through holes among the N through holes, including: The inductor module is connected to the bottom surface of the first PCB through the M power supply contacts and second ends of M through holes among the N through holes, and is connected to the chip through the M through holes.

4. The chip power supply system according to claim 2 or 3, characterized in that: The chip power supply system includes multiple inductor modules, the output capacitor includes a first capacitor, the first capacitor is coupled to the bottom layer of the first PCB, the first capacitor is connected to the chip through at least two through holes among N through holes of the first PCB, and the multiple inductor modules are connected through the power layer and the ground layer in the first PCB.

5. The chip power supply system according to claim 4, characterized in that: The output capacitor also includes a second capacitor, which is connected to the multiple inductor modules through the power layer and the ground layer in the first PCB. The second capacitor is coupled to the first PCB and is located at the periphery of the chip.

6. The chip power supply system according to claim 4, characterized in that: The output capacitor also includes a second capacitor, which is buried in the first PCB and connected to the multiple inductor modules through a power layer and a ground layer in the first PCB.

7. The chip power supply system according to claim 2, characterized in that: The chip power supply system further includes a second PCB, the second PCB includes N through holes, the N through holes of the second PCB correspond to the N through holes of the first PCB, the second PCB is electrically connected to the first PCB through the N through holes of the second PCB, and the inductor module is connected to the chip through the M power supply contacts and the second ends of M through holes of the N through holes, including: The inductor module is connected to second ends of M through holes among the N through holes of the first PCB through the M power supply contacts and M through holes among the N through holes of the second PCB, and is connected to the chip through the M through holes of the first PCB.

8. The chip power supply system according to claim 7, characterized in that: The chip power supply system includes a plurality of the inductor modules, and the output capacitor includes a first capacitor and a second capacitor; the first capacitor is coupled to the bottom layer of the second PCB, the first capacitor is connected to the chip through the second PCB and the through holes corresponding to the first PCB, the second capacitor is buried in the second PCB, and the first capacitor and the second capacitor are connected to the plurality of inductor modules through the power layer and the ground layer in the second PCB.

9. The chip power supply system according to claim 7, characterized in that: The chip power supply system includes a plurality of the inductor modules, the output capacitor is coupled to the bottom layer of the second PCB, and the plurality of inductor modules are connected through the power layer and the ground layer in the second PCB, and the output capacitor is located at the periphery of the chip.

10. The chip power supply system according to claim 9, characterized in that ； The second PCB is electrically connected to the first PCB via a connector; or The second PCB is electrically connected to the first PCB through contacts of the second PCB.

11. The chip power supply system according to any one of claims 1 to 3 and 7 to 10, characterized in that: The chip comprises: integrated circuit; A housing for packaging the integrated circuit, the housing comprising a top surface and a bottom surface; A plurality of power supply contacts are arranged in a set area of ​​the bottom surface, and the plurality of power supply contacts include a plurality of power contacts and a plurality of ground contacts. The plurality of power contacts and the plurality of ground contacts are arranged in partitions so that all power supply contacts in each partition of the set area are power supply contacts of the same type.

12. The chip power supply system according to claim 11, characterized in that: The power supply contacts in the set area are configured as a power supply network or a grounding network according to the partitions.

13. The chip power supply system according to claim 11, characterized in that: The set area is the central area of ​​the bottom surface, and the power supply contacts in the set area are arranged in one of the following arrays: a rectangular array, a square array, a diamond array, a triangle array, a hexagonal array, and a circular array.

14. The chip power supply system according to claim 12, characterized in that: The set area is the central area of ​​the bottom surface, and the power supply contacts in the set area are arranged in one of the following arrays: a rectangular array, a square array, a diamond array, a triangle array, a hexagonal array, and a circular array.

15. A printed circuit board (PCB), characterized in that: include: Top layer, bottom layer and N through holes; The first ends of the N through holes are arranged in a first area of ​​the top layer, and the first area is used to connect the power supply contacts of the chip; The N through holes include a plurality of power through holes and a plurality of ground through holes, and the plurality of power through holes and the plurality of ground through holes are arranged in partitions so that all through holes in each partition of the first area are through holes of the same type; The second ends of the N through holes are arranged in a second area of ​​the bottom layer of the PCB, and the second area corresponds to the first area. The second ends of M through holes among the N through holes are used to be respectively connected to the power supply contacts of at least one inductor module, thereby connecting the at least one inductor module to the bottom layer of the PCB board, where M is less than or equal to N.

16. The PCB according to claim 15, characterized in that: The N through holes are used to enable the at least one inductor module to provide current to the chip.

17. The PCB according to claim 15, characterized in that: The through holes in the first area and the second area are arranged in one of the following arrays: a rectangular array, a square array, a diamond array, a triangle array, a hexagonal array, and a circular array.

18. The PCB according to any one of claims 14 to 17, characterized in that: An output capacitor is embedded in the PCB, one end of the output capacitor is connected to a power through hole among the N through holes, and the other end of the output capacitor is connected to a ground through hole among the N through holes.

19. A computer device, characterized in that: The computer device comprises the chip described in any one of claims 1-14; or the PCB described in any one of claims 15-18.

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