Transfer device, transfer method and display device

Abstract

The embodiments of the present invention disclose a transfer device, a transfer method and a display device. The transfer device includes: a transfer substrate, on which light excitation components arranged in an array are provided, and the side of the light excitation components away from the transfer substrate is used to place the components to be transferred; a light source device, used to generate light to excite the light excitation components; a light source control device, located on the light path of the light generated by the light source device, and the light source control device is used to irradiate the light generated by the light source device onto the corresponding light excitation components, so that at least part of the components to be transferred on the transfer substrate are transferred to the target substrate. Compared with the prior art, the embodiments of the present invention improve the accuracy and yield of mass transfer.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a transfer device, a transfer method and a display apparatus. Background Art

[0002] With the continuous development of display technology, the display device has gradually been replaced by the liquid crystal (LCD) display method instead of the cathode ray tube (CRT) display method. In recent years, the organic light emitting diode (OLED) display method and the micro light emitting diode (MicroLED or MINI LED) display method have been rapidly developed as a new generation of display technology. Among them, Micro LED is called the future display technology due to its advantages such as high response speed, high color gamut, high brightness and long life. LCD can improve the contrast and color gamut with MINI LED backlight technology, quantum dot technology or high color rendering technology. This makes LCD reduce the disadvantages of contrast and color gamut while maintaining the advantages of life and brightness compared to OLED.

[0003] However, Micro LED and MINI LED require mass transfer technology in the production process. Currently, mass transfer technology uses mechanical punching, stamping, electrostatic or fluid assembly, etc. However, the existing transfer technology has problems of low precision and low yield, which makes it difficult to support the mass production and popularization of Micro LED and MINI LED technology. Therefore, transfer technology has become one of the bottlenecks of Micro LED and MINI LED technology. Summary of the invention

[0004] The embodiments of the present invention provide a transfer device, a transfer method and a display apparatus to improve the accuracy and yield of mass transfer.

[0005] In a first aspect, an embodiment of the present invention provides a transfer device, including:

[0006] A transfer substrate, on which light excitation components arranged in an array are disposed, and a side of the light excitation components away from the transfer substrate is used to place components to be transferred;

[0007] A light source device, used to generate light to excite the light excitation component;

[0008] The light source control device is located on the optical path of the light generated by the light source device, and is used to irradiate the light generated by the light source device onto the corresponding light excitation component so that at least part of the components to be transferred on the transfer substrate are transferred to the target substrate.

[0009] Optionally, the light source device includes a backlight panel, and the backlight panel is used to generate a surface light source; the light source control device includes a liquid crystal on silicon panel, and the liquid crystal on silicon panel includes:

[0010] An array circuit layer, comprising switch devices arranged in an array, and drive electrodes connected to the switch devices;

[0011] A liquid crystal layer is disposed on one side of the array circuit layer; the liquid crystal layer includes liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to change their angles so as to control the transmission of light generated by the backlight panel to the corresponding light excitation component;

[0012] Preferably, the array circuit layer further includes:

[0013] A gate gating module connected to the switch device; the gate gating module is used to turn on the switch device row by row, or to turn on the switch devices of at least part of the rows at the same time;

[0014] A source gating module connected to the switch device; the source gating module is used to simultaneously send a driving signal to at least part of the driving electrodes through the switch device to drive the liquid crystal molecules to deflect;

[0015] The rows extend along a first direction, and the columns extend along a second direction; or the rows extend along the second direction, and the columns extend along the first direction; and the first direction and the second direction intersect.

[0016] Optionally, the light source device includes a first light source and a beam expansion module, the first light source emits a light source beam, and the beam expansion module is used to diffuse the light source beam to generate a surface light source; the light source control device includes a digital micromirror, and the digital micromirror includes:

[0017] A drive array, including switch devices arranged in an array;

[0018] Reflectors are arranged in an array, and the reflectors are set corresponding to the switch devices; the reflectors are adjustable in angle under the control of the drive array, and are used to transmit the light generated by the light source device to the corresponding light excitation component.

[0019] Optionally, the light source device includes a second light source, which emits a light source beam; the light source control device includes a deflector, which is used to scan the light source beam to the corresponding light excitation component;

[0020] Preferably, the deflector comprises a lens module, the lens module is located on the optical path of the light emitted by the light source beam, and the lens module is used to adjust the angle of the light.

[0021] Optionally, the transfer device further comprises:

[0022] An optical measuring device, used to measure information contained in the transfer substrate or the target substrate;

[0023] A data processing device connected to the optical measuring device; the data processing device is used to determine the number and position of the components to be transferred on the transfer substrate according to the information;

[0024] The data processing device is also connected to the light source control device to control the light source control device so that the light emitted by the light source device is transmitted to the corresponding light excitation component.

[0025] Optionally, the light source device includes at least one of a laser generator, a visible light generator or a non-visible generator.

[0026] Optionally, at least one of the light-excitation components corresponds to one component to be transferred.

[0027] Optionally, the light excitation component changes from a solid or liquid state to a gaseous state under the action of light;

[0028] The transfer substrate further comprises: at least one via hole, the via hole being located in the middle, the edge, or the area between the middle and the edge of the transfer substrate, the via hole forming a negative pressure gas passage, the negative pressure gas passage being used to discharge the generated gas;

[0029] Alternatively, a neutralizing component is mixed in the light excitation component, and the neutralizing component is used to neutralize harmful substances in the gas, or the neutralizing component generates a neutralizing gas under light excitation to neutralize the harmful substances.

[0030] Optionally, the transfer device further comprises: an execution film, wherein the execution film is arranged on a side of the light excitation component away from the transfer substrate.

[0031] In a second aspect, an embodiment of the present invention further provides a transfer method, which can use the transfer device provided by any embodiment of the present invention, and the transfer method includes:

[0032] providing a target substrate;

[0033] Providing a transfer substrate, and aligning the transfer substrate with the target substrate; the transfer substrate is provided with light excitation components arranged in an array, and a component to be transferred is provided on a side of the light excitation components away from the transfer substrate;

[0034] Providing a light source device and a light source control device, and placing the light source control device on the light path generated by the light source device;

[0035] The light source control device is controlled to irradiate the light generated by the light source device onto the corresponding light excitation component, so that at least part of the components to be transferred on the transfer substrate are transferred to the target substrate; wherein the transferred components meet the transfer accuracy.

[0036] Optionally, controlling the light source control device to irradiate the light generated by the light source device onto the corresponding light excitation component includes:

[0037] Controlling the light source device to generate a surface light source;

[0038] Driving the light source control device to perform surface scanning on the component to be transferred that meets the transfer accuracy;

[0039] Alternatively, controlling the light source device to generate a light source beam;

[0040] The light source control device is driven to perform single-point scanning on the component to be transferred that meets the transfer accuracy.

[0041] Optionally, controlling the light source control device to irradiate the light generated by the light source device onto the corresponding light excitation component includes:

[0042] Using an optical measuring device to measure the positions of the transfer substrate and the target substrate to obtain transfer information;

[0043] The data processing device processes the transfer information to determine whether the position of the component to be transferred on the transfer substrate meets the transfer accuracy, and obtains quantity information and position information;

[0044] The light source control device adjusts the path of the light generated by the light source device according to the quantity information and the position information;

[0045] Alternatively, controlling the light source control device to irradiate the light generated by the light source device onto the corresponding light excitation component includes:

[0046] Acquire the pre-stored quantity information and location information of the components to be transferred;

[0047] The light source control device adjusts the path of the light generated by the light source device according to the quantity information and the position information.

[0048] Optionally, the transfer information includes at least one of the following:

[0049] The position of the component to be transferred on the transfer substrate, the shape of the component to be transferred on the transfer substrate, the crack of the component to be transferred on the transfer substrate, the direction of the component to be transferred on the transfer substrate, the position of the alignment mark on the transfer substrate, the shape of the alignment mark on the transfer substrate, and the direction of the alignment mark on the transfer substrate; the position of the alignment mark on the target substrate, the shape of the alignment mark on the target substrate, the direction of the alignment mark on the target substrate, the position of the pad on the target substrate, the shape of the pad on the target substrate, and the direction of the pad on the target substrate.

[0050] In a third aspect, an embodiment of the present invention further provides a display device, comprising: a driving backplane and a display component to be transferred disposed on the driving backplane, wherein the display component to be transferred is transferred to the driving backplane using a transfer method as described in any embodiment of the present invention.

[0051] The embodiment of the present invention sets a light excitation component on the transfer substrate, and sets a light source device and a light source control device in the transfer device to excite the corresponding light excitation component to generate thrust, thereby separating the corresponding component to be transferred from the transfer substrate. In this way, during one transfer process, only the components to be transferred that meet the transfer accuracy can be transferred, and other components to be transferred that do not meet the transfer accuracy can be transferred after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the components to be transferred, thereby improving the transfer accuracy and transfer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 A schematic diagram of the structure of a transfer device provided by an embodiment of the present invention;

[0053] Figure 2 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0054] Figure 3 A schematic diagram of the structure of an array circuit layer provided by an embodiment of the present invention;

[0055] Figure 4 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0056] Figure 5 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0057] Figure 6 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention;

[0058] Figure 7A schematic structural diagram of a transfer substrate provided by an embodiment of the present invention;

[0059] Figure 8 For along Figure 7 Schematic diagram of the cross-sectional structure of AA;

[0060] Fig. 9 A schematic structural diagram of another transfer substrate provided by an embodiment of the present invention;

[0061] Fig.10 A schematic diagram of a transfer method provided by an embodiment of the present invention;

[0062] Fig.11 A schematic diagram of each step of a transfer method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0063] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0064] An embodiment of the present invention provides a transfer device. Figure 1 A schematic diagram of the structure of a transfer device provided by an embodiment of the present invention. Figure 1 The transfer device includes: a transfer substrate 100, a light source device 800 and a light source control device 600. The transfer substrate 100 is provided with light excitation components 130 arranged in an array, and the side of the light excitation components 130 away from the transfer substrate 100 is used to place the components to be transferred (for example, the chip 110). The light source device 800 is used to generate light to excite the light excitation components 130. The light source control device 600 is located on the light path of the light generated by the light source device 800, and the light source control device 600 is used to irradiate the light generated by the light source device 800 onto the corresponding light excitation components 130, so that at least part of the components to be transferred on the transfer substrate 100 are transferred to the target substrate 300.

[0065] Among them, the parts to be transferred refer to parts that need to be transferred in large quantities, such as parts with a size in the range of 1um-5mm. Exemplarily, the parts to be transferred include chips, other circuits or semiconductor devices, auxiliary parts for transfer, etc. The following is an example of the part to be transferred being a chip, but it is not intended to limit the present invention. The chip 110 can be, for example, a light-emitting device chip. Specifically, the chip 110 can be a Micro LED chip or a MINI LED chip. A large number of light-emitting device chips 110 are transferred to eventually form a display device. The transfer substrate 100 can also be referred to as a transition carrier plate or a temporary carrier plate, which is used to pre-arrange the chips 110 according to the size of the chips to be transferred. Generally speaking, the position and direction of the chip 110 placed on the transfer substrate 100 may be imprecise or even chaotic. The light-excitation component 130 refers to a component that is excited under the action of specific light and undergoes physical and / or chemical changes. Exemplarily, the light excitation component 130 changes from solid or liquid to gas under the action of light, thereby generating gas expansion, and transferring (punching) the chip 110 from the transfer substrate 100 to the target substrate 300. The main material of the light excitation component 130 may include materials such as ether or an oxidant; the specific light includes at least one of laser, visible light or non-visible light (such as UV light), and correspondingly, the light source device 800 includes at least one of a laser generator, a visible light generator or a non-visible generator. The target substrate 300 can also be called a target carrier board, that is, the transfer target position of the chip 110 is the position on the target carrier board. The transfer device provided by the embodiment of the present invention can make the position accuracy of the chip 110 transferred to the target carrier board higher than the chip position accuracy on the transfer substrate 100. Optionally, both the transfer substrate 100 and the target substrate 300 are provided with high-precision alignment marks (Mark) to achieve accurate alignment, thereby facilitating the improvement of the transfer accuracy of the chip 110. For example, the accuracy range of the alignment mark can be 1μm to 5mm.

[0066] The embodiment of the present invention sets a light excitation component 130 on the transfer substrate 100, and sets a light source device 800 and a light source control device 600 in the transfer device, so as to excite the corresponding light excitation component 130 to generate thrust, thereby separating the corresponding chip 110 from the transfer substrate 100. In this way, in a single transfer process, only the chips 110 that meet the transfer accuracy can be transferred, and other chips 110 that do not meet the transfer accuracy can be transferred after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer accuracy and transfer yield.

[0067] In the above embodiments, the transfer substrate 100 itself is optionally a transparent substrate, so that light can smoothly pass through the transfer substrate 100 and irradiate the light excitation component 130. The transfer substrate 100 itself can also be a colored transparent substrate or a colorless transparent substrate, wherein, if the transfer substrate 100 is a colored transparent substrate, the color of the transfer substrate 100 also needs to match the color of the light emitted by the light source device 800.

[0068] In the embodiment of the present invention, there are many ways to set the light source device 800 and the corresponding light source control device 600, as long as the light excitation component 130 on the transfer substrate 100 can be selectively excited to generate thrust, so that the chip 110 is separated from the transfer substrate 100. The following describes several of them, but they are not intended to limit the present invention.

[0069] Figure 2 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Figure 2 In one embodiment of the present invention, optionally, the light source device 800 includes a backlight panel 810, and the backlight panel 810 is used to generate a surface light source. The light source control device 600 includes a silicon-based liquid crystal panel 610, and the silicon-based liquid crystal panel 610 includes an array circuit layer 611 and a liquid crystal layer 612. The array circuit layer 611 includes switch devices arranged in an array, and drive electrodes connected to the switch devices. The liquid crystal layer 612 is arranged on one side of the array circuit layer 611; the liquid crystal layer 612 includes liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding drive electrodes to change their angles to control the light generated by the backlight panel 810 to be transmitted to the corresponding light excitation component 130.

[0070] Among them, the silicon-based liquid crystal panel 610 includes a plurality of control elements (similar to the pixels in the display panel), and the control element refers to a switching device, a liquid crystal molecule corresponding to the switching device, and a driving electrode connected to the switching device. The switching device includes a semiconductor device such as a triode or a field effect transistor, and optionally, the field effect transistor includes a gate, a source, and a drain. The switching device can be a triode or a field effect transistor that is set separately, or it can be a combination of semiconductor devices, such as a complementary metal oxide semiconductor (CMOS), etc., which can be set as needed in actual needs. The manufacturing form of the switching device can be a thin film transistor (TFT) to reduce the thickness of the array circuit layer 611 and reduce the size of the transfer device. Exemplarily, the thin film transistor or field effect tube array can be directly manufactured on the substrate of the drive array substrate 200 using a semiconductor process.

[0071] Exemplarily, when the switch device is turned on, the corresponding driving electrode is energized, thereby controlling the deflection of the corresponding liquid crystal molecules, and the light is passed or cut off. One control element corresponds to at least one light excitation component 130, or at least one control element corresponds to one light excitation component 130. The backlight panel 810 generates a surface light source to illuminate the entire silicon-based liquid crystal panel 610. Only when the control element is turned on can the light in the corresponding area be controlled to be emitted through the silicon-based liquid crystal panel 610 and illuminate the corresponding light excitation component 130. The backlight panel 810 may, for example, include at least one of an organic light-emitting diode, a micro-light-emitting diode or a diode. Optionally, the backlight panel 810 may also include a film layer such as a light guide layer to make the backlight panel 810 emit light uniformly. In the embodiment of the present invention, the light source device 800 includes a backlight panel 810, and the light source control device 600 includes a silicon-based liquid crystal panel 610, which has a simple structure and is easy to implement.

[0072] In the above embodiment, optionally, the LCOS panel 610 may further include a cover plate 613 , a polarizer and other structures to improve the stability of the LCOS panel 610 and optimize the performance of the LCOS panel 610 .

[0073] Figure 3 A schematic diagram of the structure of an array circuit layer provided by an embodiment of the present invention. Figure 3 In one embodiment of the present invention, the array circuit layer 611 may further include a gate gating module 614 and a source gating module 615. The gate gating module 614 is connected to the switch device; the gate gating module 614 is used to turn on the switch device row by row, or to turn on the switch devices of at least some rows at the same time. The source gating module 615 is connected to the switch device; the source gating module 615 is used to send a driving signal to the driving electrodes of at least some columns through the switch device at the same time to drive the liquid crystal molecules to deflect.

[0074] The driving mode of the gate gate module 614 is to turn on the switch devices row by row or to turn on the switch devices of at least some rows at the same time, which can be selected according to actual needs. The driving mode of the source gate module 615 is to send the driving signal to the driving electrodes of some columns through the switch devices at the same time or to send the driving signal to the driving electrodes of all columns, which can be selected according to actual needs.

[0075] Exemplarily, the drive array substrate 200 can be scanned in a row / column scanning manner. At this time, the gate enable module 614 controls the conduction and disconnection of the switching device row by row. At the same time, under this timing, the drive signal of the corresponding column is output by the source enable module 615, connected to the source of the corresponding switching device for writing, thereby driving the liquid crystal molecules to deflect, exciting the light excitation component 130 to perform the punching action, and causing the corresponding chip 110 to perform the transfer action. For example, the chips 110 located at the first row and first column, the second row and second column, the third row and third column, the fourth row and fourth column, the fifth row and fifth column, and the sixth row and sixth column meet the transfer accuracy. When the gate selection module 614 scans the switching devices in the first row, the source selection module 615 writes a driving signal to the switching devices in the first column; when the gate selection module 614 scans the switching devices in the second row, the source selection module 615 writes a driving signal to the switching devices in the second column; and so on, until the gate selection module 614 scans the switching devices in the sixth row, and the source selection module 615 writes a driving signal to the switching devices in the sixth column.

[0076] Exemplarily, the drive array substrate 200 can also be scanned in a surface scanning manner. At this time, the gate selection module 614 controls the conduction and disconnection of multiple rows of switch devices at the same time. At the same time, under this timing, the driving signal of the corresponding column is output by the source selection module 615, connected to the source of the corresponding switch device for writing, thereby driving the liquid crystal molecules to deflect, stimulating the light technology to perform the punching action, and causing the corresponding chip 110 to perform the transfer action. For example, the chips 110 located in the first three columns of the first row, the first three columns of the second row, the first three columns of the third row, and the first three columns of the fourth row meet the transfer accuracy, the gate selection module 614 scans the switch devices of the first four rows at the same time, and the source selection module 615 writes the driving signal to the switch devices of the first three columns at the same time.

[0077] The embodiment of the present invention adopts an active drive array, which can realize row / column scanning or surface scanning, so that scanning and printing can be performed quickly, the transfer efficiency and stability are improved, and the operation difficulty is simplified.

[0078] It should be noted that Figure 3 exemplarily shows that the rows extend along the first direction X, the columns extend along the second direction Y, and the first direction X intersects the second direction Y. This is not a limitation of the present invention, and in other embodiments, the directions of the rows and columns may be reversed, for example, the rows extend along the second direction Y, and the columns extend along the first direction X.

[0079] Figure 4 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Figure 4In one embodiment of the present invention, optionally, the light source device 800 includes a first light source 821 and a beam expansion module 822, the first light source 821 emits a light source beam, and the beam expansion module 822 is used to diffuse the light source beam to generate a surface light source; the light source control device 600 includes a digital micromirror (DMD) 620, and the digital micromirror 620 includes a driving array ( Figure 4 The drive array includes switch devices arranged in an array. The reflector 621 is arranged corresponding to the switch device. For example, the reflector 621 is connected to the switch device. The reflector 621 is adjustable in angle under the control of the drive array, and is used to transmit the light generated by the light source device 800 to the corresponding light excitation component 130.

[0080] Among them, the first light source 821 can generate a laser beam, and the laser beam has good stability and is not easily affected by the environment, which is conducive to improving the transfer accuracy of the transfer backplane. Optionally, the light source device 800 includes a collimation module for emitting the surface light source in parallel. The reflectors 621 arranged in an array in the digital micromirror 620 can, for example, use microelectromechanical (MEMS) reflectors or the reflectors 621 are controlled by microelectromechanical systems, so as to achieve adjustable angles. By adjusting the angle of the reflector 621, on the one hand, it can be adjusted whether the light irradiated on the reflector 621 is reflected on the transfer substrate 100; on the other hand, it can be adjusted which light excitation component 130 of the transfer substrate 100 is irradiated on the reflector 621. Therefore, in the embodiment of the present invention, the reflector 621 can be set to correspond to the light excitation component 130 one by one, or at least two reflectors 621 can be set to correspond to one light excitation component 130, or one reflector 621 can be set to correspond to at least two light excitation components 130, which can be set as needed in practical applications.

[0081] Exemplarily, if the reflectors 621 correspond to the light excitation components 130 one by one, the drive array substrate 200 can be scanned in a surface scanning manner. For example, the chips 110 located in the first row and first column, the second row and second column, the third row and third column, the fourth row and fourth column, the fifth row and fifth column, and the sixth row and sixth column meet the transfer accuracy. Accordingly, the angles of the reflectors 621 located in the first row and first column, the second row and second column, the third row and third column, the fourth row and fourth column, the fifth row and fifth column, and the sixth row and sixth column are adjusted so that the light is irradiated onto the corresponding light excitation components 130, and the light excitation components 130 are stimulated to perform the hitting action, so that the corresponding chips 110 perform the transfer action. For the reflectors 621 at other positions, by adjusting their angles, the light cannot be reflected out, or the light is reflected to other areas outside the transfer substrate 100.

[0082] Exemplarily, if one reflector 621 corresponds to at least two light excitation components 130, the drive array substrate 200 can be scanned in a time-sharing scanning manner. For example, the digital micromirror 620 includes only one reflector 621, and the chips 110 located in the first row and first column, the second row and second column, the third row and third column, the fourth row and fourth column, the fifth row and fifth column, and the sixth row and sixth column meet the transfer accuracy. In the first period, the angle of the reflector 621 is adjusted so that the light is irradiated to the light excitation component 130 in the first row and first column; in the second period, the angle of the reflector 621 is adjusted so that the light is irradiated to the light excitation component 130 in the second row and second column; ... and so on, until the sixth row and sixth column are scanned. Among them, the scanning interval periods such as the first period and the second period need to meet the excitation reaction time of the light excitation component 130 to ensure the reliable excitation of the light excitation component 130 and the reliable transfer of the chip 110.

[0083] For example, as the number of reflective mirrors 621 disposed on the digital micromirror 620 increases, multiple reflective mirrors 621 can work simultaneously, thereby reducing the time for scanning and printing.

[0084] In the embodiment of the present invention, the light source device 800 includes a first light source 821 and a beam expansion module 822, and the light source control device 600 includes a digital micromirror (DMD) 620, which is conducive to realizing surface scanning of the light excitation component 130, thereby facilitating improving the transfer efficiency.

[0085] It should be noted that in the above embodiment, the light source device 800 is exemplarily shown to generate a surface light source through the beam expansion module 822, which is not a limitation of the present invention. In other embodiments, a backlight panel can also be provided to generate a surface light source, which can be set as needed in actual applications.

[0086] Figure 5 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Figure 5 In one embodiment of the present invention, optionally, the light source device 800 includes a second light source 830, and the second light source 830 emits a light source beam; the light source control device 600 includes a deflector 630, and the deflector 630 is used to scan the light source beam to the corresponding light excitation component 130. Among them, the second light source 830 can generate a laser beam, and the laser beam has good stability and is not easily affected by the environment, which is beneficial to improve the transfer accuracy of the transfer backplane. Preferably, the deflector 630 includes a lens module 631, and the lens module 631 is located on the optical path of the light emitted by the light source beam, and the lens module 631 is used to adjust the angle of the light. Exemplarily, the deflector 630 includes two lens modules 631, one lens module 631 can be rotated horizontally to adjust the horizontal propagation direction of the light; the other lens module 631 can be rotated vertically to adjust the vertical propagation direction of the light.

[0087] Exemplarily, the drive array substrate 200 may be scanned in a time-sharing scanning manner. For example, the chips 110 located in the first row and first column, the second row and second column, the third row and third column, the fourth row and fourth column, the fifth row and fifth column, and the sixth row and sixth column meet the transfer accuracy. In the first period, the angle of the deflector 630 is adjusted so that the light is irradiated to the light excitation component 130 in the first row and first column; in the second period, the angle of the deflector 630 is adjusted so that the light is irradiated to the light excitation component 130 in the second row and second column; and so on, until the sixth row and sixth column are scanned. Among them, the scanning interval periods such as the first period and the second period need to meet the excitation reaction time of the light excitation component 130 to ensure the reliable excitation of the light excitation component 130 and the reliable transfer of the chip 110.

[0088] It should be noted that, in the above embodiment, the deflector 630 is set as the lens module 631 for illustration, which is not a limitation of the present invention. In other embodiments, the deflector 630 can also be set as an angle-adjustable mirror (for example, a MEMS mirror), which can be set as needed in actual applications.

[0089] It should also be noted that in the above embodiments, the first light source and / or the second light source 830 may be a monochromatic light generator, or may be composed of a plurality of monochromatic light generators and a light synthesizer, and may be set as required in practical applications.

[0090] Figure 6 A schematic diagram of the structure of another transfer device provided by an embodiment of the present invention. Figure 6 On the basis of the above embodiments, optionally, the transfer device further includes: an optical measuring device 400 and a data processing device 500. The optical measuring device 400 is used to measure the information contained in the transfer substrate 100 or the target substrate 300. The data processing device 500 is connected to the optical measuring device, and is used to determine the number and position of the chips 110 to be transferred on the transfer substrate 100 according to the information measured by the optical measuring device 400; and the data processing device 500 is also connected to the light source control device 600 to control the light source control device 600 so that the light emitted by the light source device 800 is transmitted to the corresponding light excitation component 130.

[0091] The optical measuring device 400 may be, for example, an automatic optical inspection device (AOI) or an X-ray (XRay) measuring device. The information of the transfer substrate 100 measured may be, for example, the position of the chip 110 on the transfer substrate 100, the shape of the chip 110 on the transfer substrate 100, the crack of the chip 110 on the transfer substrate 100, the direction of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, the direction of the alignment mark on the transfer substrate 100, the position of the chip 110 on the transfer substrate 100, the shape of the chip 110 on the transfer substrate 100, the crack of the chip 110 on the transfer substrate 100, or the direction of the chip 110 on the transfer substrate 100. The position information of the target substrate 300 measured may be, for example, the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, or the direction of the pad on the target substrate 300. Therefore, the alignment mark detected by the optical measuring device 400 may be an alignment point or an alignment point array. The information detected by the optical measuring device 400 may be used for alignment, and may also be used to determine whether the chip 110 meets the alignment requirements.

[0092] The data processing device 500 can be, for example, a chip 110 with data processing functions, such as a microprocessor, a single-chip microcomputer or a digital signal processor (DSP). Specifically, the data processing device 500 can process and calculate the position information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100 or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. In addition, the data processing device 500 can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300 or the direction of the pad on the target substrate 300, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device 500 can process and calculate the shape of the chip 110 on the transfer substrate 100 or the cracks of the chip 110 on the transfer substrate 100, so as to obtain the number and position of the defective chip 110. The data processing device 500 combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 meets the transfer accuracy, so as to determine the number and position of the chips 110 to be transferred on the transfer substrate 100, and then control the light source control device 600 so that the light emitted by the light source device 800 is transmitted to the corresponding light excitation component 130.

[0093] The transfer device of the embodiment of the present invention further includes an optical measuring device and a data processing device to measure the transfer substrate 100 and the target substrate 300, thereby further improving the transfer accuracy.

[0094] It should be noted that, in the above-mentioned embodiments, the optical detection device 400 is exemplarily used to detect the position of the target substrate 300 and the transfer substrate 100, which is not a limitation of the present invention. In other embodiments, the optical detection device 400 may not be provided, the number and position of the chips 110 to be transferred may be pre-stored, or the chips 110 on the transfer substrate 100 may be regularly and accurately aligned, and in actual applications, it may be selected whether to provide the optical detection device as needed.

[0095] It should be noted that, in the above-mentioned embodiments, it is exemplarily shown that the arrangement density of the light excitation component 130 is the same as the arrangement density of the chip 110, that is, the light excitation component 130 corresponds to the chip 110 one by one, which is not a limitation of the present invention. In other embodiments, the arrangement density of the light excitation component 130 can also be set to be different from the arrangement density of the chip 110. For example, the arrangement density of the light excitation component 130 is n times the arrangement density of the chip 110, and n is a positive integer such as 2, 3, 4, 5, 10, etc.

[0096] Figure 7 A schematic diagram of the structure of a transfer substrate provided by an embodiment of the present invention, Figure 8 For along Figure 7 Schematic diagram of the cross-sectional structure of AA. Figure 7 and Figure 8 On the basis of the above embodiments, optionally, the light excitation component 130 changes from solid or liquid to gas under the action of light. The transfer substrate 100 further includes: at least one via hole 101, the via hole 101 is located in the middle, edge, or the area between the middle and edge of the transfer substrate 100, and the via hole 101 forms a negative pressure gas passage, which is used to discharge the generated gas to prevent the gas (explosion gas) excited by the light excitation component 130 from causing damage to the chip 110 due to excessive energy.

[0097] In one embodiment of the present invention, optionally, a neutralizing component is mixed in the light excitation component 130, and the neutralizing component is used to neutralize harmful substances in the gas, or the neutralizing component generates a neutralizing gas under light excitation to neutralize harmful substances. Among them, the harmful substances can be, for example, toxic or acidic or alkaline substances. The neutralizing component can be, for example, activated carbon. The neutralizing gas generated by the neutralizing component corresponds to the harmful substance. If the harmful substance is acidic, the corresponding neutralizing gas is alkaline; if the harmful substance is alkaline, the corresponding neutralizing gas is acidic.

[0098] Fig. 9 This is a schematic diagram of the structure of another transfer substrate 100 provided in an embodiment of the present invention. Fig. 9In one embodiment of the present invention, the transfer device further comprises an execution film 140, which is arranged on a side of the light excitation component 130 away from the transfer substrate 100. The material of the execution film 140 may be, for example, a flexible material having a high tensile breaking ratio. In this way, after the light excitation component 130 is excited to generate gas, the deformation of the execution film 140 is greater than the deformation of the transfer substrate 100, thereby separating the chip 110 from the execution film 140. The setting of the execution film 140 can prevent the expansion of the gas generated by the light excitation component 130 when excited from directly acting on the chip 110, but rather acting on the chip to be transferred 110 through the execution film 140, thereby playing a role of buffering and uniform stress, and improving the transfer accuracy. In addition, the setting of the execution film 140 can reduce the contact between the gas generated by the light excitation component 130 and the chip to be transferred 110, thereby avoiding the corrosion and other damages to the chip to be transferred by the gas generated by the excitation part 120 when excited.

[0099] Based on the above embodiments, optionally, the transfer device also includes an auxiliary trigger component, which can be, for example, a magnetic trigger component or the like, which can provide additional force to the chip 110 to be transferred on the transfer substrate 100, so as to assist the transfer of the chip 110.

[0100] In the above embodiments, optionally, the target substrate 300 is another transfer substrate 100, a backlight drive backplane or a display drive backplane. If the target substrate 300 is another transfer substrate 100, the chip transfer action can be repeated multiple times, and each time the transfer is performed, the accuracy of the chip 110 is higher. In this way, each transfer action can have a larger number of chips 110 that meet the transfer accuracy, which is conducive to improving the transfer efficiency. The target substrate 300 can be, for example, a glass substrate or a quartz substrate, which is conducive to improving the dimensional stability, thermal stability and chemical stability of the target substrate 300, thereby improving the transfer accuracy.

[0101] If the target substrate 300 is a backlight driver backplane, at this time, the chip 110 is a backlight chip. After the chip 110 is completely transferred to the backlight driver backplane, it is also necessary to use hot pressing, UV curing and reflow soldering to weld the chip 110 to the pads on the backlight driver backplane to form a backlight source in the display device. If the target substrate 300 is a display driver backplane, at this time, the chip 110 is a display chip. After the chip 110 is completely transferred to the display driver backplane, it is also necessary to use hot pressing, UV curing and reflow soldering to weld the chip 110 to the pads on the display driver backplane to form pixels in the display device. Among them, a drive backplane such as a backlight driver backplane or a display driver backplane is provided with a drive circuit. When the transfer substrate 100 and the drive backplane are transferred in alignment, the transfer substrate 100 and the drive backplane can also play a role in supporting and protecting the chip and protecting the circuit on the drive backplane. The driving backplane can be made of flexible materials such as polyimide (PI), polycarbonate (PC) or polyethylene terephthalate (PET) as a substrate to achieve flexible display. The circuit film layer in the driving backplane can be an organic thin film transistor (OTFT) or an organic field effect transistor (OMOS). The driving backplane can be a glass substrate or a quartz substrate with a driving circuit engraved on it, or a flexible printed circuit board (FPC), a printed circuit board (PCB), etc.

[0102] In one embodiment of the present invention, the transfer device further comprises a motion device, which is used to drive the transfer substrate 100 to move so that the transfer substrate 100 is aligned with the target substrate 300. Exemplarily, the array substrate 200 and the target substrate 300 are driven to remain stationary and accurately aligned, and the position of the transfer substrate 100 only needs to be adjusted by the motion device. In the embodiment of the present invention, only the transfer substrate 100 is arranged to perform displacement alignment, which is conducive to reducing the manufacturing cost of the transfer device.

[0103] In one embodiment of the present invention, the transfer device optionally includes a motion device, which is used to control the displacement of the array substrate 200, the transfer substrate 100 and the target substrate 300. The motion device can be, for example, a device such as a robotic arm that can control the displacement of the substrate. Exemplarily, the motion device can drive the array substrate 200 and the target substrate 300 to remain relatively still, and the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic punching is performed by calculating the motion advance amount, which is conducive to further improving the transfer accuracy.

[0104] In summary, the embodiment of the present invention sets a light excitation component 130 on the transfer substrate 100, and sets a light source device 800 and a light source control device 600 in the transfer device to excite the corresponding light excitation component 130 to generate thrust, so that the corresponding chip 110 is separated from the transfer substrate 100. In this way, in a transfer process, only the chips 110 that meet the transfer accuracy can be transferred, and other chips 110 that do not meet the transfer accuracy can be transferred again after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer accuracy and transfer yield. Further, the light source device 800 can be a backlight panel, and the light source control device 600 can be a silicon-based liquid crystal panel to achieve row / column scanning or surface scanning, thereby improving the efficiency of mass transfer. Further, the light source device 800 can include a first light source and a beam expansion module that generates a light source beam, and the light source control device 600 can be a digital micromirror to achieve row / column scanning or surface scanning, thereby improving the efficiency of mass transfer. Furthermore, the light source device 800 may include a second light source for generating a light source beam, and the light source control device 600 may be a deflector to achieve row / column scanning. Furthermore, by providing the optical measurement device 400, the alignment accuracy may be improved, thereby further improving the transfer accuracy.

[0105] An embodiment of the present invention provides a transfer method, and a transfer device provided by any embodiment of the present invention can be used to transfer chips in batches. Fig.10 A schematic diagram of a transfer method provided by an embodiment of the present invention, Fig.11 A schematic diagram of each step of a transfer method provided by an embodiment of the present invention. Fig.10 and Fig.11 , the transfer method comprises the following steps:

[0106] S110 , providing a target substrate 300 .

[0107] The target substrate 300 may also be referred to as a target carrier plate, that is, the transfer target position of the chip 110 is a position on the target substrate 300 .

[0108] S120, providing a transfer substrate 100, aligning the transfer substrate 100 with the target substrate 300; the transfer substrate 100 is provided with light excitation components 130 arranged in an array, and the chip 110 to be transferred is provided on the side of the light excitation components 130 away from the transfer substrate 100.

[0109] The transfer substrate 100 may also be referred to as a transition carrier or a temporary carrier, and is used to pre-arrange the chips 110 according to the size of the chips to be transferred. Generally speaking, the position and direction of the chips 110 placed on the transfer substrate 100 may be imprecise or even chaotic. In other embodiments, the chips 110 on the transfer substrate 100 are regularly and accurately aligned, and the number and position of the chips 110 to be transferred may be pre-stored.

[0110] The light excitation component 130 refers to a component that is excited by specific light and undergoes physical and / or chemical changes. Exemplarily, the light excitation component 130 changes from a solid or liquid state to a gaseous state under the action of light, thereby generating gas expansion, and transferring (bonding) the chip 110 from the transfer substrate 100 to the target substrate 300. The main material of the light excitation component 130 may include materials such as ether or an oxidant; the specific light includes at least one of laser, visible light or non-visible light (such as UV light), and correspondingly, the light source device 800 includes at least one of a laser generator, a visible light generator or a non-visible generator.

[0111] Optionally, the array substrate 200 and the target substrate 300 are driven to move synchronously and remain relatively still, so that the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic punching is performed by calculating the motion advance amount, which is conducive to further improving the transfer accuracy. Alternatively, the array substrate 200 and the target substrate 300 are driven to be still, and both remain absolutely still.

[0112] S130 , providing a light source device 800 and a light source control device 600 , and placing the light source control device 600 on a light path generated by the light source device 800 .

[0113] Among them, the light source device 800 and the light source control device 600 cooperate to realize the control of the light signal, so as to excite the corresponding light excitation component 130. Optionally, the light source device 800 can be a backlight panel, and the light source control device 600 can be a silicon-based liquid crystal panel to realize row / column scanning or surface scanning, thereby improving the efficiency of large-scale transfer. Optionally, the light source device 800 can include a first light source and a beam expansion module for generating a light source beam, and the light source control device 600 can be a digital micromirror to realize row / column scanning or surface scanning, thereby improving the efficiency of large-scale transfer. Optionally, the light source device 800 can include a second light source for generating a light source beam, and the light source control device 600 can be a deflector to realize row / column scanning.

[0114] S140 , controlling the light source control device 600 to irradiate the light generated by the light source device 800 onto the corresponding light excitation component 130 , so that at least part of the chips 110 on the transfer substrate 100 are transferred to the target substrate 300 .

[0115] There are multiple ways to scan the light generated by the light source device 800 on the light excitation component 130. Optionally, the light source device 800 is controlled to generate a surface light source; the light source control device 600 is driven to perform a surface scan on the chip 110 that meets the transfer accuracy. Alternatively, the light source device 800 is controlled to generate a light source beam; the light source control device 600 is driven to perform a single point scan on the chip 110 that meets the transfer accuracy.

[0116] At least part means part or all. If all the transferred chips 110 meet the transfer accuracy, the number of chips transferred to the target substrate 300 is the total number; if only part of the transferred chips 110 meet the transfer accuracy, the number of chips transferred to the target substrate 300 is the partial number. Optionally, the method for determining whether the chip position on the transfer substrate 100 meets the transfer requirement is: compare the chip position on the transfer substrate 100 with the preset position or the position of the chip solder pin on the target substrate 300 (for example, make a difference), and determine whether the two positions are completely overlapped or partially overlapped. If they are completely overlapped, the transfer requirement is met; if they are partially overlapped, the minimum overlapping area is compared with a set threshold to determine whether the threshold requirement is met.

[0117] Fig.11 exemplarily shows that all chips 110 meet the transfer accuracy, and all chips 110 are transferred to the target substrate 300. In other embodiments, it can also be set that only part of the chips 110 on the transfer substrate 100 meet the transfer accuracy, and these chips 110 that meet the transfer accuracy are transferred through the corresponding light excitation component 130 to complete the first chip-bonding action. Then, the transfer substrate 100 and the target substrate 300 are aligned again so that at least part of the remaining chips 110 can meet the alignment accuracy. And so on, until all the remaining chips 110 are transferred.

[0118] It can be seen from the above steps that the embodiment of the present invention uses the light source device 800 and the light source control device 600 to excite the corresponding light excitation component 130 on the transfer substrate 100 to perform the punching action, so that the corresponding chip 110 is separated from the transfer substrate 100. In this way, in a single transfer process, only the chips 110 that meet the transfer accuracy can be transferred, and other chips 110 that do not meet the transfer accuracy can be transferred again after re-alignment. Compared with the existing mass transfer technology, the embodiment of the present invention realizes accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer accuracy and transfer yield.

[0119] In the above embodiments, optionally, the transfer method further includes the following steps:

[0120] First, an optical measuring device is used to measure the positions of the transfer substrate 100 and the target substrate 300 to obtain transfer information.

[0121] The optical measuring device 400 may be, for example, an automatic optical inspection device (AOI) or an X-ray (XRay) measuring device. The information of the transfer substrate 100 measured may be, for example, the position of the chip 110 on the transfer substrate 100, the shape of the chip 110 on the transfer substrate 100, the crack of the chip 110 on the transfer substrate 100, the direction of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, the direction of the alignment mark on the transfer substrate 100, the position of the chip 110 on the transfer substrate 100, the shape of the chip 110 on the transfer substrate 100, the crack of the chip 110 on the transfer substrate 100, or the direction of the chip 110 on the transfer substrate 100. The position information of the target substrate 300 measured may be, for example, the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, or the direction of the pad on the target substrate 300. Therefore, the alignment mark detected by the optical measuring device 400 may be an alignment point or an alignment point array. The information detected by the optical measuring device 400 may be used for alignment, and may also be used to determine whether the chip 110 meets the alignment requirements.

[0122] Then, the data processing device processes the transfer information to determine whether the position of the chip 110 on the transfer substrate 100 meets the transfer accuracy, and obtains quantity information and position information; the light source control device 600 adjusts the path of the light generated by the light source device 800 according to the quantity information and position information.

[0123] The data processing device 500 may be, for example, a chip 110 having a data processing function, such as a microprocessor, a single-chip microcomputer or a digital signal processor (DSP). Specifically, the data processing device 500 can process and calculate the position information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100 or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. Furthermore, the data processing device 500 can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300 or the direction of the pad on the target substrate 300, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device 500 can process and calculate the shape of the chip 110 on the transfer substrate 100 or the cracks of the chip 110 on the transfer substrate 100, so as to obtain the number and position of the defective chip 110. The data processing device 500 combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 meets the transfer accuracy, so as to determine the number and position of the chips 110 to be transferred on the transfer substrate 100, and then control the light source control device 600 so that the light emitted by the light source device 800 is transmitted to the corresponding light excitation component 130.

[0124] The transfer device of the embodiment of the present invention further includes an optical measuring device and a data processing device to measure the transfer substrate 100 and the target substrate 300, thereby further improving the transfer accuracy.

[0125] An embodiment of the present invention further provides a display device, which may be an LCD display device equipped with a Mini LED backlight source, an LCD display device equipped with a Micro LED backlight source, a Mini LED display device, or a Micro LED display device. The display device includes: a driving backplane and a display chip (e.g., a Mini LED chip or a Micro LED chip) disposed on the driving backplane, wherein the display chip is transferred to the driving backplane using a transfer method provided in any embodiment of the present invention.

[0126] The driving backplane can be made of flexible materials such as polyimide (PI), polycarbonate (PC) or polyethylene terephthalate (PET) as a substrate to achieve flexible display. The circuit film layer in the driving backplane can be made of organic thin film transistors (OTFT) or organic field effect transistors (OMOS). The driving backplane can be a glass substrate or a quartz substrate with a driving circuit engraved on it, or a flexible printed circuit board (FPC), a printed circuit board (PCB), etc.

[0127] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A transfer device, characterized in that: include: A transfer substrate, on which light excitation components arranged in an array are disposed, and a side of the light excitation components away from the transfer substrate is used to place components to be transferred; A light source device, used to generate light for exciting the light excitation component; the light source device includes at least one of a laser generator, a visible light generator or a non-visible light generator; the light source device includes a backlight panel, and the backlight panel is used to generate a surface light source; A light source control device is located on the optical path of the light generated by the light source device, and is used to irradiate the light generated by the light source device onto the corresponding light excitation component, so that at least part of the component to be transferred on the transfer substrate is transferred to the target substrate; The light source control device comprises a liquid crystal on silicon panel, and the liquid crystal on silicon panel comprises: An array circuit layer, comprising switch devices arranged in an array, and drive electrodes connected to the switch devices; A liquid crystal layer is arranged on one side of the array circuit layer; the liquid crystal layer includes liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to change their angles so as to control the light generated by the backlight panel to be transmitted to the corresponding light excitation component.

2. The transfer device according to claim 1, characterized in that The array circuit layer also includes: A gate gating module connected to the switch device; the gate gating module is used to turn on the switch device row by row, or to turn on the switch devices of at least part of the rows at the same time; A source gating module connected to the switch device; the source gating module is used to simultaneously send a driving signal to at least part of the driving electrodes through the switch device to drive the liquid crystal molecules to deflect; The rows extend along a first direction, and the columns extend along a second direction; or the rows extend along the second direction, and the columns extend along the first direction; and the first direction and the second direction intersect.

3. The transfer device according to claim 1, characterized in that The light source device comprises a first light source and a beam expansion module, the first light source emits a light source beam, and the beam expansion module is used to diffuse the light source beam to generate a surface light source; The light source control device comprises a digital micromirror, and the digital micromirror comprises: A drive array, including switch devices arranged in an array; Reflectors are arranged in an array, and the reflectors are set corresponding to the switch devices; the reflectors are adjustable in angle under the control of the drive array, and are used to transmit the light generated by the light source device to the corresponding light excitation component.

4. The transfer device according to claim 1, characterized in that The light source device comprises a second light source, and the second light source emits a light source beam; the light source control device comprises a deflector, and the deflector is used to scan the light source beam to the corresponding light excitation component; The deflector includes a lens module, which is located on the optical path of the light emitted by the light source beam, and is used to adjust the angle of the light.

5. The transfer device according to claim 1, characterized in that Also includes: An optical measuring device, used to measure information contained in the transfer substrate or the target substrate; A data processing device connected to the optical measuring device; the data processing device is used to determine the number and position of the components to be transferred on the transfer substrate according to the information; The data processing device is also connected to the light source control device to control the light source control device so that the light emitted by the light source device is transmitted to the corresponding light excitation component.

6. The transfer device according to claim 1, characterized in that At least one of the light-excitation components corresponds to one component to be transferred.

7. The transfer device according to claim 1, characterized in that The light-excitation component changes from a solid or liquid state to a gaseous state under the action of light; The transfer substrate further comprises: at least one via hole, the via hole being located in the middle, the edge, or the area between the middle and the edge of the transfer substrate, the via hole forming a negative pressure gas passage, the negative pressure gas passage being used to discharge the generated gas; Alternatively, a neutralizing component is mixed in the light excitation component, and the neutralizing component is used to neutralize harmful substances in the gas, or the neutralizing component generates a neutralizing gas under light excitation to neutralize the harmful substances.

8. The transfer device according to claim 1, characterized in that Also includes: The execution film is arranged on a side of the light excitation component away from the transfer substrate.

9. A transfer method, characterized in that: The transfer device according to any one of claims 1 to 8 comprises: providing a target substrate; Providing a transfer substrate, and aligning the transfer substrate with the target substrate; the transfer substrate is provided with light excitation components arranged in an array, and a component to be transferred is provided on a side of the light excitation components away from the transfer substrate; Providing a light source device and a light source control device, and placing the light source control device on the light path generated by the light source device; The light source control device is controlled to irradiate the light generated by the light source device onto the corresponding light excitation component, so that at least part of the components to be transferred on the transfer substrate are transferred to the target substrate; wherein the transferred components meet the transfer accuracy.

10. The transfer method according to claim 9, characterized in that: The controlling the light source control device to irradiate the light generated by the light source device onto the corresponding light excitation component includes: Controlling the light source device to generate a surface light source; Driving the light source control device to perform surface scanning on the component to be transferred that meets the transfer accuracy; Alternatively, controlling the light source device to generate a light source beam; The light source control device is driven to perform single-point scanning on the component to be transferred that meets the transfer accuracy.

11. The transfer method according to claim 9, characterized in that: The controlling the light source control device to irradiate the light generated by the light source device onto the corresponding light excitation component includes: Using an optical measuring device to measure the positions of the transfer substrate and the target substrate to obtain transfer information; The data processing device processes the transfer information to determine whether the position of the component to be transferred on the transfer substrate meets the transfer accuracy, and obtains quantity information and position information; The light source control device adjusts the path of the light generated by the light source device according to the quantity information and the position information; Alternatively, controlling the light source control device to irradiate the light generated by the light source device onto the corresponding light excitation component includes: Acquire the pre-stored quantity information and location information of the components to be transferred; The light source control device adjusts the path of the light generated by the light source device according to the quantity information and the position information.

12. The transfer method according to claim 11, characterized in that: The transfer information includes at least one of the following: The position of the component to be transferred on the transfer substrate, the shape of the component to be transferred on the transfer substrate, the crack of the component to be transferred on the transfer substrate, the direction of the component to be transferred on the transfer substrate, the position of the alignment mark on the transfer substrate, the shape of the alignment mark on the transfer substrate, and the direction of the alignment mark on the transfer substrate; The alignment mark position on the target substrate, the alignment mark shape on the target substrate, the alignment mark direction on the target substrate, the pad position on the target substrate, the pad shape on the target substrate and the pad direction on the target substrate.

13. A display device, characterized in that: include: A driving backplane and a display chip arranged on the driving backplane, wherein the display chip is transferred to the driving backplane using the transfer method as described in any one of claims 9 to 12.

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