Packaging structure of closed-package rectifier bridge and power module

Abstract

The present invention provides a packaging structure of a closed-package rectifier bridge and a power module, comprising: a plastic package, a plurality of pins at the edge of the plastic package, a rectifier bridge, a power switch tube, a logic circuit, a base island and a high-voltage freewheeling diode in the plastic package; wherein the rectifier bridge comprises four rectifier diodes, and the positive and negative electrodes of each rectifier diode are respectively connected to the corresponding pins through a base island or a lead; the logic circuit is connected to the corresponding pins to generate a logic control signal; the gate of the power switch tube is connected to the logic control signal, and the drain and source are respectively connected to the corresponding pins; the power switch tube and the logic circuit are separately arranged or integrated in a control chip; the negative electrode of the high-voltage freewheeling diode is connected to the high-voltage power supply pin through a base island or a lead, and the positive electrode is connected to the drain pin through a base island or a lead. The present invention encapsulates the rectifier bridge, the power switch tube and the logic circuit in the same plastic package through a lead frame, thereby reducing the packaging cost.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and in particular to a packaging structure of a sealed rectifier bridge and a power supply module. Background Art

[0002] At present, LED-driven lighting is replacing energy-saving lamps on a large scale in the lighting field. Due to the huge amount of usage, the cost requirement is relatively high. With the continuous reduction of system costs, the mainstream topology architecture has basically been finalized, and it is difficult to save a certain component from the periphery. At the same time, the improvement of chip technology has limited cost savings for high-voltage analog circuits, which has basically been compressed to the extreme.

[0003] The current mainstream low-power AC LED driver power supply solution is generally composed of components such as a rectifier bridge, a chip (including a power MOS device), a high-voltage freewheeling diode, an inductor, and input and output capacitors. There are at least three chips with different packages in the system, resulting in a high chip packaging cost, which basically accounts for about half of the chip cost. Therefore, how to save packaging costs has become one of the problems that technicians in this field need to solve urgently. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a packaging structure of a packaged rectifier bridge and a power module to solve the problem of high chip packaging cost in the prior art.

[0005] To achieve the above-mentioned object and other related objects, the present invention provides a packaging structure of a closed-package rectifier bridge, wherein the packaging structure of the closed-package rectifier bridge at least comprises:

[0006] A plastic package, a live pin, a neutral pin, a high-voltage power supply pin, a signal ground pin, a drain pin, and a sampling pin arranged at the edge of the plastic package, and a rectifier bridge, a power switch tube, a logic circuit, and at least two base islands arranged in the plastic package;

[0007] Among them, the first AC input end of the rectifier bridge is connected to the live wire pin through a base island or a lead, the second AC input end is connected to the neutral wire pin through a base island or a lead, the first output end is connected to the high-voltage power supply pin through a base island or a lead, and the second output end is connected to the signal ground pin through a base island or a lead; the control signal output end of the logic circuit outputs a logic control signal, the high-voltage port is connected to the drain of the power switch tube, the sampling port is connected to the sampling pin, and the ground port is connected to the signal ground pin; the gate of the power switch tube is connected to the logic control signal, the drain is connected to the drain pin, and the source is connected to the sampling pin; the power switch tube and the logic circuit are separately arranged or integrated in the control chip.

[0008] Optionally, the spacing between the live pin, the neutral pin, the high-voltage power supply pin and the drain pin and adjacent pins is set to be greater than 2.0 mm.

[0009] Optionally, the at least two base islands include a drain base island and a signal ground base island; when the power switch tube is bonded to the drain base island, the width of the drain pin is set to 0.5mm~1mm; when the power switch tube is set on the signal ground base island, the width of the signal ground pin is set to 0.5mm~1mm.

[0010] Optionally, the at least two base islands include a high-voltage power supply base island and a signal ground base island; the rectifier bridge includes a first rectifier diode, a second rectifier diode, a third rectifier diode and a fourth rectifier diode; the cathodes of the first rectifier diode and the second rectifier diode are bonded to the high-voltage power supply base island, and the anodes are respectively connected to the live wire pin and the neutral wire pin; the anodes of the third rectifier diode and the fourth rectifier diode are bonded to the signal ground base island, and the anodes are respectively connected to the live wire pin and the neutral wire pin.

[0011] Optionally, the at least two base islands include a live base island and a neutral base island; the rectifier bridge includes a fifth rectifier diode, a sixth rectifier diode, a seventh rectifier diode and an eighth rectifier diode; the cathodes of the fifth rectifier diode and the sixth rectifier diode are respectively bonded to the live base island and the neutral base island, and the anodes are connected to the signal ground pin; the anodes of the seventh rectifier diode and the eighth rectifier diode are respectively bonded to the live base island and the neutral base island, and the anodes are connected to the high-voltage power supply pin.

[0012] More optionally, the packaging structure of the packaged rectifier bridge further includes a power ground pin, and the second output end of the rectifier bridge is connected to the power ground pin via a base island or a lead.

[0013] More optionally, the packaging structure of the sealed rectifier bridge also includes a high-voltage freewheeling diode, the cathode of the high-voltage freewheeling diode is connected to the high-voltage power supply pin through a base island or a lead, and the anode is connected to the drain pin through a base island or a lead; the high-voltage port of the logic circuit is connected to the high-voltage power supply pin.

[0014] More optionally, the packaging structure of the packaged rectifier bridge also includes a transient diode and a high-voltage freewheeling diode; the positive electrode of the transient diode is connected to the high-voltage power supply pin through a base island or a lead, and the negative electrode is connected to the negative electrode of the high-voltage freewheeling diode; the positive electrode of the high-voltage freewheeling diode is connected to the drain pin through a base island or a lead; the high-voltage port of the logic circuit is connected to the high-voltage power supply pin.

[0015] To achieve the above objectives and other related objectives, the present invention further provides a power supply module, the power supply module at least comprising:

[0016] The packaging structure of the above-mentioned packaged rectifier bridge, the first capacitor, the load and the first sampling resistor;

[0017] The live wire pin of the package structure of the closed-package rectifier bridge is connected to the live wire, the neutral wire pin is connected to the neutral wire, and the signal ground pin is grounded;

[0018] One end of the first capacitor is connected to the high-voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is grounded;

[0019] The load is connected between the high voltage power supply pin and the drain pin of the package structure of the packaged rectifier bridge;

[0020] One end of the first sampling resistor is connected to a sampling pin of the packaging structure of the packaged rectifier bridge, and the other end is grounded.

[0021] To achieve the above objectives and other related objectives, the present invention further provides a power supply module, the power supply module at least comprising:

[0022] The packaging structure of the above-mentioned packaged rectifier bridge, the second capacitor, the third capacitor, the first inductor, the load and the second sampling resistor;

[0023] The live wire pin of the package structure of the closed-package rectifier bridge is connected to the live wire, the neutral wire pin is connected to the neutral wire, and the signal ground pin is grounded;

[0024] One end of the second capacitor is connected to the high voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is grounded;

[0025] One end of the third capacitor is connected to the high-voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is connected to the drain pin of the package structure of the packaged rectifier bridge via the first inductor;

[0026] The load is connected to both ends of the third capacitor;

[0027] One end of the second sampling resistor is connected to the sampling pin of the packaging structure of the packaged rectifier bridge, and the other end is grounded.

[0028] To achieve the above objectives and other related objectives, the present invention further provides a power supply module, the power supply module at least comprising:

[0029] The packaging structure of the above-mentioned packaged rectifier bridge, the fourth capacitor, the transformer, the diode, the fifth capacitor, the load and the third sampling resistor;

[0030] The live wire pin of the package structure of the closed-package rectifier bridge is connected to the live wire, the neutral wire pin is connected to the neutral wire, and the signal ground pin is grounded;

[0031] One end of the fourth capacitor is connected to the high-voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is grounded;

[0032] One end of the first coil of the transformer is connected to the high voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is connected to the drain pin of the package structure of the packaged rectifier bridge; one end of the second coil of the transformer is connected to the other end of the second coil via the diode and the fifth capacitor;

[0033] The anode of the diode is connected to the second coil of the transformer, and the cathode of the diode is connected to the fifth capacitor;

[0034] The load is connected to both ends of the fifth capacitor;

[0035] One end of the third sampling resistor is connected to the sampling pin of the packaging structure of the packaged rectifier bridge, and the other end is grounded.

[0036] More optionally, the packaging structure of the sealed rectifier bridge also includes a power ground pin, and the second output end of the rectifier bridge is connected to the power ground pin through a base island or a lead; the power ground pin is connected to the signal ground pin through a second inductor, and the power ground pin is connected to the high-voltage power supply pin through a sixth capacitor.

[0037] As described above, the packaging structure of the packaged rectifier bridge and the power module of the present invention have the following beneficial effects:

[0038] The packaging structure of the packaged rectifier bridge and the power module of the present invention package the rectifier bridge, the power switch tube and the logic circuit in the same plastic package through a lead frame, thereby reducing the packaging cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It shows an implementation of the packaging structure of the packaged rectifier bridge of the present invention.

[0040] Figure 2 It is shown as an implementation of the power module of the present invention.

[0041] Figure 3 Another implementation of the packaging structure of the packaged rectifier bridge of the present invention is shown.

[0042] Figure 4 It is shown as another implementation of the power module of the present invention.

[0043] Figure 5 It is shown as another implementation of the packaging structure of the packaged rectifier bridge of the present invention.

[0044] Figure 6It is shown as another implementation of the power module of the present invention.

[0045] Figure 7 It is shown as another implementation of the power module of the present invention.

[0046] Component number description

[0047] 1 Package structure of the closed-package rectifier bridge

[0048] 11 Plastic packaging

[0049] 12. Control chip

[0050] 121 Power switch tube

[0051] 122 Logic Circuits

[0052] 13 High voltage power supply island

[0053] 14 Signal base island

[0054] 15 Drain base island

[0055] 16 FireWire Island

[0056] 17 Zero Line Base Island

[0057] 18 Sampling base island DETAILED DESCRIPTION

[0058] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0059] See also Figure 1 to Figure 7 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0060] Embodiment 1

[0061] like Figure 1 As shown, this embodiment provides a packaging structure 1 of a closed-package rectifier bridge, and the packaging structure 1 of the closed-package rectifier bridge includes:

[0062] A plastic package 11 , a plurality of pins arranged at the edge of the plastic package 11 , and a rectifier bridge, a power switch tube, a logic circuit, a high-voltage power supply base island 13 and a signal ground base island 14 arranged in the plastic package 11 .

[0063] like Figure 1 As shown, the plastic package body 11 is rectangular and is used to integrate the lead frame and the device together and protect the internal devices.

[0064] In this embodiment, the plastic package 11 adopts the external dimensions of SOP8, so that it can be shared with existing plastic packages, thereby reducing costs. In actual use, other external dimensions can be adopted as needed, and are not limited to this embodiment.

[0065] like Figure 1 As shown, each pin is arranged at the edge of the plastic package body 11 .

[0066] Specifically, in this embodiment, the package structure 1 of the packaged rectifier bridge includes a live pin L, a neutral pin N, a high-voltage power supply pin HV, a signal ground pin GND, a drain pin Drain and a sampling pin CS.

[0067] As an implementation method of this embodiment, the spacing between the live pin L, the neutral pin N, the high-voltage power supply pin HV and the drain pin Drain and the adjacent pins is generally set to be greater than 2 mm and cannot be less than 1.5 mm, including but not limited to 1.5 mm to 2 mm, 2 mm to 3 mm, thereby meeting the safety spacing requirements for high voltage.

[0068] As an implementation of this embodiment, the width of the signal ground pin GND is greater than 0.3 mm, and is further set to 0.5 mm to 1 mm to enhance heat dissipation and achieve the effect of package thermal resistance.

[0069] In this embodiment, if Figure 1 As shown, the live pin L, the high voltage power supply pin HV and the drain pin Drain are located on one side of the plastic package 11 , and the neutral pin N, the signal ground pin GND and the sampling pin CS are located on the other side of the plastic package 11 .

[0070] It should be noted that the arrangement position and spacing of each pin can be set according to actual needs and are not limited to this embodiment.

[0071] like Figure 1 As shown, the first AC input terminal of the rectifier bridge is connected to the live wire pin through a base island or a lead, the second AC input terminal is connected to the neutral wire pin through a base island or a lead, the first output terminal is connected to the high voltage power supply pin through a base island or a lead, and the second output terminal is connected to the signal ground pin through a base island or a lead.

[0072] Specifically, as an implementation of the present invention, the rectifier bridge includes four rectifier diodes, and the positive and negative electrodes of each rectifier diode are respectively connected to the corresponding pins through the base island or the lead wire. In this embodiment, the rectifier bridge is implemented by two N-type diodes and two P-type diodes, wherein the first rectifier diode Dz1 and the second rectifier diode Dz2 are N-type diodes, the lower layer of the N-type diode is an N-type doping region, the upper layer is a P-type doping region, the bottom surface of the lower layer is silver-plated, and the top surface of the upper layer is aluminum-plated; the third rectifier diode Dz3 and the fourth rectifier diode Dz4 are P-type diodes, the lower layer of the P-type diode is a P-type doping region, the upper layer is an N-type doping region, the bottom surface of the lower layer is silver-plated, and the top surface of the upper layer is aluminum-plated. The negative electrode (metal silver layer) of the first rectifier diode Dz1 is bonded to the high-voltage power supply base island 13 by conductive glue or solder paste, and the positive electrode (metal aluminum layer) is connected to the neutral pin N by a metal lead wire. The cathode (metal silver layer) of the second rectifier diode Dz2 is bonded to the high-voltage power supply base island 13 by conductive glue or solder paste, and the anode (metal aluminum layer) is connected to the live pin L by a metal lead. The anode (metal silver layer) of the third rectifier diode Dz3 is bonded to the signal ground base island 14 by conductive glue or solder paste, and the cathode (metal aluminum layer) is connected to the neutral pin N by a metal lead. The anode (metal silver layer) of the fourth rectifier diode Dz4 is bonded to the signal ground base island 14 by conductive glue or solder paste, and the cathode (metal aluminum layer) is connected to the live pin L by a metal lead.

[0073] It should be noted that the rectifier diode may be a diode composed of a single PN structure, or may be a diode structure obtained by other equivalent forms, including but not limited to MOS tubes, which will not be described in detail here.

[0074] It should be noted that the "connected to the pin" mentioned in the present invention includes but is not limited to directly connecting the pin through a metal lead (one end of the metal lead is set on the pin), and also includes connecting a conductive component connected to the pin through a metal lead (one end of the metal lead is set on the conductive component connected to the pin). It is not limited to this embodiment as long as electrical connection can be achieved.

[0075] It should be noted that the rectifier bridge can be implemented by selecting different base islands based on different types of devices. It is not limited to this embodiment. Any setting method that can realize the connection relationship of the rectifier bridge is acceptable and will not be described in detail here.

[0076] like Figure 1 As shown, in this embodiment, the power switch tube and the logic circuit are integrated into the control chip 12.

[0077] Specifically, the drain of the power switch tube serves as the drain port d of the control chip 12, the source is connected to the sampling port of the logic circuit, and the gate is connected to the control signal output end (outputting the logic control signal) of the logic circuit; the sampling port of the logic circuit serves as the sampling port cs of the control chip 12, the high-voltage port is connected to the drain of the power switch tube, and the ground port serves as the ground port gnd of the control chip 12. The ground port gnd of the control chip 12 is connected to the signal ground pin GND, the drain port d is connected to the drain pin Drain, and the sampling port cs is connected to the sampling pin CS. In this embodiment, the bottom surface of the control chip 12 is a substrate, which is bonded to the signal ground island 14 by conductive glue or solder paste. The ground port gnd of the control chip 12 adopts the principle of proximity and is connected to the signal ground island 14 by a metal lead, thereby realizing the connection with the signal ground pin GND; the drain port d is connected to the drain pin Drain by a metal lead; and the sampling port cs is connected to the sampling pin CS by a metal lead. The power switch tube can achieve heat dissipation through the signal ground island 14 and the signal ground pin GND.

[0078] It should be noted that the control chip 12 can be set on different base islands according to design requirements. When set on the signal base island 14, the substrate of the control chip 12 is electrically connected to the signal base island 14, and the heat dissipation effect is good. When set on other base islands, the substrate of the control chip 12 is insulated from the base island, including but not limited to insulating glue to prevent short circuit, and the heat dissipation effect is slightly poor. The specific setting method can be set according to needs, and will not be repeated here.

[0079] The packaging structure of the packaged rectifier bridge of this embodiment adopts a two-base island architecture, integrating the rectifier bridge, power switch tube and logic circuit in a lead frame, wherein a lead frame refers to the pins, base islands, metal leads and other metal connection structures formed in the same plastic package; thus, this embodiment can reduce the packaging cost.

[0080] like Figure 2 As shown, this embodiment further provides a power supply module, the power supply module comprising:

[0081] The package structure 1 of the packaged rectifier bridge, the first capacitor C1, the load and the first sampling resistor Rcs1.

[0082] like Figure 2 As shown, the live wire pin L of the package structure 1 of the packaged rectifier bridge is connected to the live wire, the neutral wire pin N is connected to the neutral wire, and the signal ground pin GND is grounded.

[0083] like Figure 2As shown, one end of the first capacitor C1 is connected to the high voltage power supply pin HV of the package structure 1 of the packaged rectifier bridge, and the other end is grounded.

[0084] like Figure 2 As shown, the load is connected between the high voltage power supply pin HV and the drain pin Drain of the package structure 1 of the packaged rectifier bridge.

[0085] Specifically, in this embodiment, the load is an LED light string, the positive electrode of the LED light string is connected to the high-voltage power supply pin HV, and the negative electrode is connected to the drain pin Drain.

[0086] like Figure 2 As shown, one end of the first sampling resistor Rcs1 is connected to the sampling pin CS of the package structure 1 of the packaged rectifier bridge, and the other end is grounded.

[0087] The power module of this embodiment is a low-power LED driving power supply application in non-isolated occasions, and is suitable for high-voltage linear (3W-12W).

[0088] Embodiment 2

[0089] like Figure 3 As shown, this embodiment provides a packaging structure of a packaged rectifier bridge, which is different from the first embodiment in that the packaging structure of the packaged rectifier bridge also includes a high-voltage freewheeling diode Df, and the power switch tube 121 and the logic circuit 122 are separately arranged.

[0090] like Figure 3 As shown, in this embodiment, the high-voltage freewheeling diode Df adopts an N-type diode, the cathode of the high-voltage freewheeling diode Df is bonded to the high-voltage power supply base island 13 through a conductive glue or solder paste, and the anode is connected to the drain base island 15 through a metal lead, thereby realizing the connection with the drain pin Drain.

[0091] It should be noted that the high-voltage freewheeling diode Df may also be a P-type diode bonded to the drain base island 15, which will not be described in detail here.

[0092] like Figure 3As shown, the drain of the power switch tube 121 is bonded to the drain base island 15 by conductive glue or solder paste, and the source s is connected to the sampling pin CS by a metal lead. The logic circuit 122 is a chip structure, the bottom surface of which is an insulating material, and is arranged on the signal ground base island 14. The control signal output end out is connected to the gate g of the power switch tube 121 by a metal lead, the sampling port cs is connected to the sampling pin CS by a metal lead, the high-voltage port hv is connected to the high-voltage power supply base island 13 by a metal lead, and then connected to the high-voltage power supply pin HV, and the ground port gnd is connected to the signal ground base island 14 by a metal lead, and then connected to the signal ground pin GND.

[0093] It should be noted that the logic circuit 122 can be arranged on different base islands according to design requirements, which is similar to the arrangement of the control chip 12, and will not be described in detail here.

[0094] As an implementation of this embodiment, the width of the drain pin Drain is greater than 0.3 mm, and is further set to 0.5 mm to 1 mm to enhance heat dissipation and achieve the effect of package thermal resistance.

[0095] The packaging structure of the packaged rectifier bridge of this embodiment adopts a three-base island architecture, integrating the rectifier bridge, power switch tube, logic circuit and high-voltage freewheeling diode in one lead frame, thereby reducing the packaging cost.

[0096] like Figure 4 As shown, this embodiment further provides a power supply module, the power supply module comprising:

[0097] The package structure 1 of the packaged rectifier bridge of this embodiment includes a second capacitor C2, a third capacitor C3, a first inductor L1, a load and a second sampling resistor Rcs2.

[0098] like Figure 4 As shown, the live wire pin L of the package structure 1 of the packaged rectifier bridge is connected to the live wire, the neutral wire pin N is connected to the neutral wire, and the signal ground pin GND is grounded.

[0099] like Figure 4 As shown, one end of the second capacitor C2 is connected to the high voltage power supply pin HV of the package structure 1 of the packaged rectifier bridge, and the other end is grounded.

[0100] like Figure 4 As shown, one end of the third capacitor C3 is connected to the high-voltage power supply pin HV, and the other end is connected to the drain pin Drain of the package structure 1 of the packaged rectifier bridge via the first inductor L1.

[0101] like Figure 4 As shown, the load is connected to both ends of the third capacitor C3.

[0102] Specifically, in this embodiment, the load is an LED light string, a positive electrode of the LED light string is connected to the high voltage power supply pin HV, and a negative electrode of the LED light string is connected to a connection node between the third capacitor C3 and the first inductor L1.

[0103] like Figure 4 As shown, one end of the second sampling resistor Rcs2 is connected to the sampling pin CS of the package structure 1 of the packaged rectifier bridge, and the other end is grounded.

[0104] The power module of this embodiment is a low-power LED driving power supply application in a non-isolated environment, and is suitable for high-voltage buck (5W-25W).

[0105] Embodiment 3

[0106] like Figure 5 As shown, this embodiment provides a packaging structure of a sealed rectifier bridge, which is different from the first and second embodiments in that the rectifier bridge is set in a different manner and further includes a transient diode Dtvs.

[0107] like Figure 5 As shown, in this embodiment, the transient diode Dtvs and the high-voltage freewheeling diode Df are stacked on the high-voltage power supply base island 13.

[0108] Specifically, the high-voltage freewheeling diode Df adopts a P-type diode, and the transient diode Dtvs adopts an N-type diode. The positive electrode of the high-voltage freewheeling diode Df is bonded to the drain base island 15 through a conductive glue or solder paste, and the negative electrode faces upward. The negative electrode of the transient diode Dtvs is bonded to the negative electrode of the high-voltage freewheeling diode Df through a conductive glue or solder paste, and the positive electrode (facing upward) is connected to the high-voltage power supply pin HV through a metal lead.

[0109] It should be noted that in actual use, the high-voltage freewheeling diode Df and the transient diode Dtvs can be arranged on the same base island (including but not limited to the high-voltage power supply base island 13 or the drain base island 15) or different base islands (including but not limited to the high-voltage power supply base island 13 and the drain base island 15) as needed using different types of diodes, which will not be elaborated here.

[0110] As an implementation of this embodiment, Figure 5 As shown, the rectifier bridge is arranged on the live wire base island 16 and the neutral wire base island 17 .

[0111] Specifically, the rectifier bridge is implemented by two N-type diodes and two P-type diodes, wherein the fifth rectifier diode Dz5 and the sixth rectifier diode Dz6 are N-type diodes, and the seventh rectifier diode Dz7 and the eighth rectifier diode Dz8 are P-type diodes. The cathode of the fifth rectifier diode Dz5 is bonded to the live base island 16 by conductive glue or solder paste, and the anode is connected to the signal ground pin GND by a metal lead. The cathode of the sixth rectifier diode Dz6 is bonded to the neutral base island 17 by conductive glue or solder paste, and the anode is connected to the signal ground pin GND by a metal lead. The anode of the seventh rectifier diode Dz7 is bonded to the live base island 16 by conductive glue or solder paste, and the cathode is connected to the high-voltage power supply pin HV by a metal lead. The anode of the eighth rectifier diode Dz8 is bonded to the neutral base island 17 by conductive glue or solder paste, and the cathode is connected to the high-voltage power supply pin HV by a metal lead.

[0112] As an implementation of this embodiment, Figure 5 As shown, the control chip 12 includes a power switch tube and a logic circuit. The drain of the power switch tube serves as the drain port d of the control chip 12, the source is connected to the sampling port of the logic circuit, and the gate is connected to the control signal output end (outputting the logic control signal) of the logic circuit; the sampling port of the logic circuit serves as the sampling port cs of the control chip 12, the high-voltage port serves as the high-voltage port hv of the control chip 12, and the ground port serves as the ground port gnd of the control chip 12. The control chip 12 is arranged on the sampling base island 18, the ground port gnd is connected to the signal ground pin GND, the drain port d is connected to the drain pin Drain via the drain base island 15, the sampling port cs is connected to the sampling pin CS via the sampling base island 18, and the high-voltage port hv is connected to the high-voltage power supply pin HV.

[0113] The packaging structure of the packaged rectifier bridge of this embodiment adopts a four-island architecture, integrating the rectifier bridge, power switch tube, logic circuit, high-voltage freewheeling diode and transient diode in one lead frame, thereby reducing packaging costs.

[0114] like Figure 6 As shown, this embodiment further provides a power supply module, the power supply module comprising:

[0115] The package structure 1 of the packaged rectifier bridge of this embodiment, the fourth capacitor C4, the transformer, the diode D, the fifth capacitor C5, the load and the third sampling resistor Rcs3.

[0116] like Figure 6 As shown, the live wire pin L of the package structure 1 of the packaged rectifier bridge is connected to the live wire, the neutral wire pin N is connected to the neutral wire, and the signal ground pin GND is grounded.

[0117] like Figure 6 As shown, one end of the fourth capacitor C4 is connected to the high-voltage power supply pin HV of the package structure 1 of the packaged rectifier bridge, and the other end is grounded.

[0118] like Figure 6 As shown, one end of the first coil of the transformer is connected to the high-voltage power supply pin HV of the packaging structure 1 of the packaged rectifier bridge, and the other end is connected to the drain pin Drain of the packaging structure 1 of the packaged rectifier bridge; one end of the second coil of the transformer is connected to the other end of the second coil via the diode D and the fifth capacitor C5.

[0119] like Figure 6 As shown, the anode of the diode D is connected to the second coil of the transformer, and the cathode is connected to the fifth capacitor C5.

[0120] like Figure 6 As shown, the load is connected to both ends of the fifth capacitor C5.

[0121] Specifically, in this embodiment, the load is an LED light string, the positive electrode of the LED light string is connected to the negative electrode of the diode D, and the negative electrode is connected to the connection node between the fifth capacitor C5 and the transformer.

[0122] like Figure 6 As shown, one end of the third sampling resistor Rcs3 is connected to the sampling pin CS of the package structure 1 of the packaged rectifier bridge, and the other end is grounded.

[0123] The power module of this embodiment is applied to a low-power LED driving power supply in an isolated environment and is suitable for two-winding flyback (3W-25W).

[0124] Embodiment 4

[0125] The present embodiment provides a packaging structure of a closed-package rectifier bridge, which is different from the first to third embodiments in that the packaging structure 1 of the closed-package rectifier bridge also includes a power ground pin BGND, and the second output end of the rectifier bridge is not connected to the signal ground pin GND, but is connected to the power ground pin BGND. Accordingly, the setting method of the rectifier bridge is also adaptively modified, which will not be described one by one here.

[0126] like Figure 7 As shown, this embodiment also provides a power supply module, which is different from the second embodiment in that the packaging structure 1 of the packaged rectifier bridge in the power supply module adopts the packaging structure 1 of the packaged rectifier bridge of this embodiment, and also includes a sixth capacitor C6 and a second inductor L2.

[0127] Specifically, one end of the sixth capacitor C6 is connected to the high voltage power supply pin HV of the package structure 1 of the packaged rectifier bridge, and the other end is connected to the power ground pin BGND of the package structure 1 of the packaged rectifier bridge.

[0128] Specifically, the second inductor L2 is connected between the power ground pin BGND and the signal ground pin GND of the package structure 1 of the packaged rectifier bridge.

[0129] It should be noted that this embodiment adds the power ground pin BGND to separate the ground end of the rectifier bridge from the ground end of the logic circuit 122, and implements EMI filtering through an external inductor to reduce electromagnetic interference. The same applies to the power modules of Embodiments 1 and 3, but is not limited to this embodiment.

[0130] It should be noted that the configuration of the rectifier bridge, the configuration of the power switch tube and the logic circuit, and the combination of various devices can be configured as needed and are not limited to the several embodiments listed in the present invention.

[0131] In addition, due to the diversity of applications, the present invention mainly provides examples of three topologies using rectifier bridges in the field of LED driving. Similar structures are also applicable to AC-DC power supply fields such as chargers / adapters, etc., especially small and medium power applications with a power of less than 25W. It can be easily extended to other application fields using rectifier bridges by technicians in this field.

[0132] The topology of the present invention covers three applications of LED drive: high voltage linear, high voltage buck, and flyback, and can be extended to the field of AC-DC chargers / adapters; at the same time, it covers two conventional applications: discrete high voltage MOS and controller co-sealed, and high voltage MOS and controller integrated single crystal. The present invention integrates the rectifier bridge and other functional chips of the system into a package, saving the system multi-chip packaging cost and contributing to the miniaturization of the system.

[0133] In summary, the present invention provides a packaging structure of a closed-package rectifier bridge and a power module, comprising: a plastic package, a live pin, a neutral pin, a high-voltage power supply pin, a signal ground pin, a drain pin, and a sampling pin arranged at the edge of the plastic package, and a rectifier bridge, a power switch tube, a logic circuit, and at least two base islands arranged in the plastic package; wherein the rectifier bridge includes four rectifier diodes, and the positive and negative electrodes of each rectifier diode are respectively connected to the corresponding pins through the base island or the lead; the logic circuit is connected to the corresponding pins to generate a logic control signal; the gate of the power switch tube is connected to the logic control signal, and the drain and source are respectively connected to the corresponding pins; the power switch tube and the logic circuit are separately arranged or integrated in the control chip. The packaging structure of the closed-package rectifier bridge and the power module of the present invention encapsulate the rectifier bridge, the power switch tube, and the logic circuit in the same plastic package through a lead frame, thereby reducing the packaging cost. Therefore, the present invention effectively overcomes the various shortcomings in the prior art and has a high industrial utilization value.

[0134] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A packaging structure of a closed-package rectifier bridge, characterized in that: The packaging structure of the sealed rectifier bridge includes: A plastic package, a live pin, a neutral pin, a high-voltage power supply pin, a signal ground pin, a drain pin, and a sampling pin arranged at the edge of the plastic package, and a rectifier bridge, a power switch tube, a logic circuit, and at least two base islands arranged in the plastic package; Among them, the first AC input end of the rectifier bridge is connected to the live wire pin through a base island or a lead, the second AC input end is connected to the neutral wire pin through a base island or a lead, the first output end is connected to the high-voltage power supply pin through a base island or a lead, and the second output end is connected to the signal ground pin through a base island or a lead; the control signal output end of the logic circuit outputs a logic control signal, the high-voltage port is connected to the drain of the power switch tube, the sampling port is connected to the sampling pin, and the ground port is connected to the signal ground pin; the gate of the power switch tube is connected to the logic control signal, the drain is connected to the drain pin, and the source is connected to the sampling pin; the power switch tube and the logic circuit are separately arranged or integrated in the control chip.

2. The packaging structure of the sealed rectifier bridge according to claim 1, characterized in that: The spacing between the live pin, the neutral pin, the high-voltage power supply pin and the drain pin and adjacent pins is set to be greater than 2.0 mm.

3. The packaging structure of the sealed rectifier bridge according to claim 1, characterized in that: The at least two base islands include a drain base island and a signal ground base island; when the power switch tube is bonded to the drain base island, the width of the drain pin is set to 0.5mm~1mm; when the power switch tube is set on the signal ground base island, the width of the signal ground pin is set to 0.5mm~1mm.

4. The packaging structure of the sealed rectifier bridge according to claim 1, characterized in that: The at least two base islands include a high-voltage power supply base island and a signal ground base island; the rectifier bridge includes a first rectifier diode, a second rectifier diode, a third rectifier diode and a fourth rectifier diode; the cathodes of the first rectifier diode and the second rectifier diode are bonded to the high-voltage power supply base island, and the anodes are connected to the live wire pin and the neutral wire pin respectively; the anodes of the third rectifier diode and the fourth rectifier diode are bonded to the signal ground base island, and the anodes are connected to the live wire pin and the neutral wire pin respectively.

5. The packaging structure of the sealed rectifier bridge according to claim 1, characterized in that: The at least two base islands include a live base island and a neutral base island; the rectifier bridge includes a fifth rectifier diode, a sixth rectifier diode, a seventh rectifier diode and an eighth rectifier diode; the cathodes of the fifth rectifier diode and the sixth rectifier diode are respectively bonded to the live base island and the neutral base island, and the anodes are connected to the signal ground pin; the anodes of the seventh rectifier diode and the eighth rectifier diode are respectively bonded to the live base island and the neutral base island, and the anodes are connected to the high voltage power supply pin.

6. The packaging structure of the sealed rectifier bridge according to any one of claims 1 to 5, characterized in that: The packaging structure of the packaged rectifier bridge also includes a power ground pin, and the second output end of the rectifier bridge is connected to the power ground pin through a base island or a lead.

7. The packaging structure of the sealed rectifier bridge according to any one of claims 1 to 5, characterized in that: The packaging structure of the sealed rectifier bridge also includes a high-voltage freewheeling diode, the cathode of which is connected to the high-voltage power supply pin via a base island or a lead, and the anode is connected to the drain pin via a base island or a lead; the high-voltage port of the logic circuit is connected to the high-voltage power supply pin.

8. The packaging structure of the sealed rectifier bridge according to any one of claims 1 to 5, characterized in that: The packaging structure of the packaged rectifier bridge also includes a transient diode and a high-voltage freewheeling diode; the positive electrode of the transient diode is connected to the high-voltage power supply pin through a base island or a lead, and the negative electrode is connected to the negative electrode of the high-voltage freewheeling diode; the positive electrode of the high-voltage freewheeling diode is connected to the drain pin through a base island or a lead; the high-voltage port of the logic circuit is connected to the high-voltage power supply pin.

9. A power module, characterized in that: The power module at least includes: The packaging structure of the packaged rectifier bridge according to any one of claims 1 to 5, a first capacitor, a load and a first sampling resistor; The live wire pin of the package structure of the closed-package rectifier bridge is connected to the live wire, the neutral wire pin is connected to the neutral wire, and the signal ground pin is grounded; One end of the first capacitor is connected to the high-voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is grounded; The load is connected between the high voltage power supply pin and the drain pin of the package structure of the packaged rectifier bridge; One end of the first sampling resistor is connected to a sampling pin of the packaging structure of the packaged rectifier bridge, and the other end is grounded.

10. A power module, characterized in that: The power module at least includes: The packaging structure of the packaged rectifier bridge as claimed in claim 7, the second capacitor, the third capacitor, the first inductor, the load and the second sampling resistor; The live wire pin of the package structure of the closed-package rectifier bridge is connected to the live wire, the neutral wire pin is connected to the neutral wire, and the signal ground pin is grounded; One end of the second capacitor is connected to the high voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is grounded; One end of the third capacitor is connected to the high-voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is connected to the drain pin of the package structure of the packaged rectifier bridge via the first inductor; The load is connected to both ends of the third capacitor; One end of the second sampling resistor is connected to the sampling pin of the packaging structure of the packaged rectifier bridge, and the other end is grounded.

11. A power module, characterized in that: The power module at least includes: The packaging structure of the packaged rectifier bridge as claimed in claim 8, a fourth capacitor, a transformer, a diode, a fifth capacitor, a load and a third sampling resistor; The live wire pin of the package structure of the closed-package rectifier bridge is connected to the live wire, the neutral wire pin is connected to the neutral wire, and the signal ground pin is grounded; One end of the fourth capacitor is connected to the high-voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is grounded; One end of the first coil of the transformer is connected to the high voltage power supply pin of the package structure of the packaged rectifier bridge, and the other end is connected to the drain pin of the package structure of the packaged rectifier bridge; one end of the second coil of the transformer is connected to the other end of the second coil via the diode and the fifth capacitor; The anode of the diode is connected to the second coil of the transformer, and the cathode of the diode is connected to the fifth capacitor; The load is connected to both ends of the fifth capacitor; One end of the third sampling resistor is connected to the sampling pin of the packaging structure of the packaged rectifier bridge, and the other end is grounded.

12. The power module according to any one of claims 9 to 11, characterized in that: The packaging structure of the sealed rectifier bridge also includes a power ground pin, and the second output end of the rectifier bridge is connected to the power ground pin through a base island or a lead; the power ground pin is connected to the signal ground pin through a second inductor, and the power ground pin is connected to the high-voltage power supply pin through a sixth capacitor.

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