Laser light source

By integrating multiple light source structures on the support shaft, the problem of large divergence angle of laser chips is solved, achieving efficient collimation and uniform beam output of the laser source, simplifying the use of optical components and reducing costs.

CN112825407BActive Publication Date: 2025-10-28YLX INC
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Patent Information

Application Number
CN201911149642.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-11-21
Publication Date
2025-10-28
Estimated Expiration
2039-11-21

AI Technical Summary

Technical Problem

Existing laser chips emit light with a large divergence angle, resulting in poor collimation, which limits their use in industrial applications. Furthermore, adding optical components increases costs and material requirements.

Method used

The first light source module is integrated with a support shaft and includes multiple first light source structures. Each structure contains a first heat sink substrate and a first laser chip. Through uniform distribution and integrated design, the collimation and uniform distribution of the beam are achieved, avoiding the use of optical elements for light shaping.

Benefits of technology

This technology enables the emission of laser beams with better light distribution without increasing costs or material requirements, thus enhancing the application potential of lasers.

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Abstract

This invention provides a laser source, including a supporting shaft and a first light source module. The supporting shaft includes an outer peripheral surface; the first light source module includes multiple first light source structures evenly spaced around the axis of the supporting shaft. Each first light source structure includes a first heat sink substrate and a corresponding first laser chip. The first heat sink substrate includes an adjacent fixing surface and a mounting surface. The fixing surface is fixed to the outer peripheral surface along a direction parallel to the axis of the supporting shaft, and the first laser chip is disposed on the mounting surface. The laser source provided by this invention integrates the first heat sink substrate and the first laser chip on the supporting shaft, enabling the emission of a well-distributed beam without the need for optical elements for light shaping.
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Description

Technical Field

[0001] This invention relates to the field of optical technology, and more specifically, to a laser light source. Background Technology

[0002] Semiconductor laser-pumped all-solid-state lasers are a new type of laser that emerged in the late 1980s. Their overall efficiency is at least 10 times higher than lamp-pumped lasers. Due to the reduced heat load per unit output, higher power can be achieved, and the system lifetime and reliability are approximately 100 times that of flash lamp-pumped systems. Therefore, semiconductor laser pumping technology has injected new vitality into solid-state lasers. Currently, semiconductor laser pumping technology has permeated various disciplines, such as laser information storage and processing, laser materials processing, laser medicine and biology, laser communication, and military laser technology, greatly promoting technological progress and unprecedented development in these fields.

[0003] Conventional laser chips suffer from poor collimation due to the large divergence angle of their emitted light, limiting their industrial applications. A common approach is to incorporate optical elements into the emitted light path of the laser chip. These elements further shape the non-uniformly distributed light spot, achieving the desired light distribution. The shaped beam exhibits better pattern distribution and collimation, thus enabling direct application in various fields. However, adding optical elements increases the cost of the laser, and the high energy density distribution of lasers places high demands on the reliability of these optical elements, further increasing material costs. Summary of the Invention

[0004] The purpose of this invention is to provide a laser light source to solve the above-mentioned problems.

[0005] The embodiments of the present invention achieve the above objectives through the following technical solutions.

[0006] This invention provides a laser light source, including a supporting shaft and a first light source module. The supporting shaft includes an outer peripheral surface; the first light source module includes a plurality of first light source structures evenly spaced around the axis of the supporting shaft. Each first light source structure includes a first heat sink substrate and a corresponding first laser chip. The first heat sink substrate includes an adjacent fixing surface and a mounting surface. The fixing surface is fixed to the outer peripheral surface along a direction parallel to the axis of the supporting shaft, and the first laser chip is disposed on the mounting surface.

[0007] In one embodiment, the number of multiple first light source structures is four, and the included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 90°.

[0008] In one embodiment, the number of the plurality of first light source structures is eight, and the included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 45°.

[0009] In one embodiment, the support shaft further includes a parallel first end face and a second end face, with the outer peripheral surface perpendicularly connected between the first end face and the second end face. The distance between the first light source module and the second end face is greater than the distance between the first light source module and the first end face, and the distance between the plurality of first light source structures in the first light source module and the second end face is the same.

[0010] In one embodiment, a first cavity and a second cavity are connected within the support shaft, the second cavity being exposed at a second end face, and the first cavity surrounding the second cavity.

[0011] In one embodiment, the laser source further includes a cooling fan disposed on the second end face.

[0012] In one embodiment, the laser source further includes a second light source module. The distance between the second light source module and the second end face is smaller than the distance between the second light source module and the first end face. The second light source module includes a plurality of second light source structures that are equally spaced around the axis of the support shaft. The plurality of second light source structures in the second light source module are spaced at the same distance from the second end face.

[0013] In one embodiment, each second light source structure includes a second heat sink substrate and a corresponding second laser chip. The second heat sink substrate of each second light source structure is adjacent to the second laser chip of another second light source structure. On the projection surface perpendicular to the outer peripheral surface, the projection of each second light source structure is located between the projections of the two first light source structures.

[0014] In one embodiment, the first laser chips in a plurality of first light source structures emit different primary color light to mix into white light. The laser light source also includes a driving device, which is mechanically connected to a support shaft and is used to drive the support shaft to rotate around the axis of the support shaft.

[0015] In one embodiment, the first laser chip in a plurality of first light source structures includes at least one red light chip, at least one green light chip, and at least one blue light chip.

[0016] In one embodiment, the first laser chip in a plurality of first light source structures includes at least two red light chips, at least two green light chips, and at least two blue light chips, and the first light source structures emitting the same primary color light are not adjacent.

[0017] Compared with the prior art, the laser light source provided by the present invention integrates the first heat sink substrate and the first laser chip on the support shaft, and can emit an output beam with better light distribution without the need for optical elements to perform optical shaping.

[0018] These or other aspects of the invention will become more apparent from the following description of the embodiments. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the first laser source provided in the embodiment of the present invention.

[0021] Figure 2 This is a three-dimensional structural schematic diagram of the first laser source provided in the embodiments of the present invention.

[0022] Figure 3 This is a longitudinal cross-sectional schematic diagram of a support shaft for a laser light source provided in an embodiment of the present invention.

[0023] Figure 4 This is a cross-sectional schematic diagram of a support shaft for a laser light source provided in an embodiment of the present invention.

[0024] Figure 5 This is a longitudinal cross-sectional schematic diagram of another support shaft for a laser light source provided in an embodiment of the present invention.

[0025] Figure 6 This is a schematic diagram of the structure of the second laser source provided in an embodiment of the present invention.

[0026] Figure 7 This is a three-dimensional structural diagram of the second laser source provided in an embodiment of the present invention.

[0027] Figure 8 This is a three-dimensional structural diagram of the third type of laser source provided in the embodiments of the present invention.

[0028] Figure 9 This is a three-dimensional structural diagram of the fourth type of laser source provided in the embodiments of the present invention.

[0029] Figure 10 This is a three-dimensional structural diagram of the fifth type of laser source provided in the embodiments of the present invention.

[0030] Figure 11 This is a three-dimensional structural diagram of the sixth laser source provided in the embodiments of the present invention.

[0031] Figure 12 This is a three-dimensional structural diagram of the seventh laser source provided in the embodiments of the present invention. Detailed Implementation

[0032] To facilitate understanding of the embodiments of the present invention, a more complete description of the embodiments will be given below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the present invention.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the embodiments of the invention is for the purpose of describing particular implementations only and is not intended to limit the invention.

[0034] Please see Figure 1 and Figure 2 The laser light source 1 provided by the present invention includes a support shaft 10 and a first light source module 20. The support shaft 10 includes an outer peripheral surface 14. The first light source module 20 includes a plurality of first light source structures 200 equally spaced around the axis of the support shaft 10. Each first light source structure 200 includes a first heat sink substrate 210 and a corresponding first laser chip 220. The first heat sink substrate 210 includes an adjacent fixing surface 211 and a mounting surface 213. The fixing surface 211 is fixed to the outer peripheral surface 14 along a direction parallel to the axis of the support shaft 10. The first laser chip 220 is disposed on the mounting surface 213. In this embodiment, the mounting surface 213 is a curved surface with the same curvature as the outer peripheral surface 14 of the support shaft 10. The plurality of first light source structures 200 are arranged sequentially along the same axis surrounding the support shaft 10; that is, the plurality of first light source structures 200 are arranged sequentially in a clockwise direction or sequentially in a counterclockwise direction.

[0035] Specifically, in this embodiment, the support shaft 10 is generally cylindrical, and a wire harness can be provided on the surface of the support shaft 10 to supply power to the first laser chip 200. The support shaft 10 can be made of metal, resin, or plastic. The support shaft 10 needs to have sufficient strength to support the first heat sink substrate 210, etc., and should have good heat dissipation performance to quickly dissipate the heat generated by the light-emitting elements such as the first laser chip 220 into the environment, preventing heat accumulation from affecting the lifespan of the light-emitting elements.

[0036] In other embodiments, the support shaft 10 may also be in other shapes such as an elliptical cylinder or a cube, as long as it meets the installation requirements of the first heat sink substrate 210.

[0037] Please continue reading. Figure 2The support shaft 10 includes an outer peripheral surface 14 and a parallel first end surface 11 and a second end surface 13, wherein the outer peripheral surface 14 is perpendicularly connected between the first end surface 11 and the second end surface 13. The outer peripheral surface 14, the first end surface 11, or the second end surface 13 can all be used to fix the support shaft 10, and the outer peripheral surface 14, the first end surface 11, or the second end surface 13 can also be provided with a heat dissipation structure to increase the heat dissipation performance of the support shaft 10. The structure of the support shaft 10 itself can be modified.

[0038] Please see Figure 3 In other embodiments, a first cavity 15 and a second cavity 16 are connected within the support shaft 10, with the first cavity 15 surrounding the second cavity 16. Both the first cavity 15 and the second cavity 16 are exposed on the second end face 13. That is, both the first cavity 15 and the second cavity 16 are recessed from the second end face 13 towards the first end face 11 in a direction parallel to the support axis. The depth of the recess is not limited and can be 5 cm or 10 cm, etc. Alternatively, the first cavity 15 and the second cavity 16 can penetrate through both the second end face 13 and the first end face 11. The first cavity 15 and the second cavity 16 are interconnected, enabling heat exchange between them. The location of the connection is not limited. Heat exchange can be achieved through air convection. For example, ambient airflow enters the support shaft 10 through the second cavity 16 and exits through the first cavity 15, achieving airflow circulation between the first cavity 15 and the second cavity 16. This rapidly dissipates heat from the support shaft 10, improving its heat dissipation capacity. Those skilled in the art will understand that the ambient airflow can also enter the support shaft 10 from the first cavity 15 and flow out of the support shaft 10 through the second cavity 16.

[0039] Please see Figure 4 In other embodiments, a third cavity 17 and a fourth cavity 18 are also formed inside the support shaft 10, and the third cavity 17 surrounds the fourth cavity 18. Both the third cavity 17 and the fourth cavity 18 are exposed on the first end face 11. The heat dissipation performance of the support shaft 10 is further improved by forming the third cavity 17 and the fourth cavity 18.

[0040] Please continue reading. Figure 3 In other embodiments, heat exchange between the first cavity 15 and the second cavity 16 can also be achieved through water cooling. For example, water can be introduced into the first cavity 15 and discharged from the second cavity 16, or heat in the support shaft 10 can be quickly dissipated. Those skilled in the art will understand that ice water can also be used to quickly remove heat and reduce the temperature of the support shaft 10. The specific heat exchange method can be selected according to actual needs.

[0041] Please see Figure 6 and Figure 7In this embodiment, the distance between the first light source module 20 and the second end face 13 is greater than the distance between the first light source module 20 and the first end face 11. In other embodiments, the first light source module 20 may also be located in the middle between the first end face 11 and the second end face 13, or the distance between the first light source module 20 and the second end face 13 may be less than the distance between the first light source module 20 and the first end face 11.

[0042] The first light source module 20 includes a plurality of first light source structures 200 evenly spaced around the axis of the support shaft 10. The plurality of first light source structures 200 are distributed circumferentially along an axis perpendicular to the support shaft 10, and the distance between each first light source structure 200 and the second end face 13 is the same. The number of first light source structures 200 can be four, five, six, eight, or more. The distribution of the first light source structures 200 is related to the structure of the support shaft 10. For example, if the support shaft 10 is cylindrical, the included angle between each first light source structure 200 is 360 / n, where n is the number of first light source structures 200. Alternatively, if the support shaft 10 is square, the number of first light source structures 200 can be four, each located on one surface; or the number of first light source structures 200 can be eight, with every two first light source structures 200 located on one surface.

[0043] Each first light source structure 200 includes a first heat sink substrate 210 and a corresponding first laser chip 220. The first heat sink substrate 210 is connected to the outer peripheral surface 14 of the support shaft 10 and can be used to transfer the heat generated by the first laser chip 220 to the support shaft 10. The first laser chip 220 is mounted on the first heat sink substrate 210.

[0044] Specifically, the first heat sink substrate 210 is generally a square plate, and includes an adjacent fixing surface 211 and a mounting surface 213. The mounting surface 213 can be used to mount the first heat sink substrate 210, and the included angle between any two adjacent mounting surfaces 213 is the same, which is related to the number of first light source structures 200. For example, the number of multiple first light source structures 200 is four, such as... Figure 1 As shown, the included angle between the mounting surfaces 213 of the first heat sink substrates 210 of two adjacent first light source structures 200 is 90°. For example, the number of multiple first light source structures 200 is eight, such as... Figure 6As shown, the included angle between the mounting surfaces 213 of the first heat sink substrates 210 of two adjacent first light source structures 200 is 45°. The fixing surface 211 is fixed to the outer peripheral surface 14 along a direction parallel to the axis of the support shaft 10. The fixing method can be welding or bonding, which can be selected according to the materials of the support shaft 10 and the first heat sink substrate 210 or actual needs. In other embodiments, the first heat sink substrate 210 can also be integrally formed with the support shaft 10 to improve the connection strength between the first heat sink substrate 210 and the support shaft 10.

[0045] The intensity distribution of the emitted light from a single first laser chip 220 is a non-uniform distribution including a long axis direction and a short axis direction, and the emitted light has a large divergence angle, resulting in poor collimation of the emitted light.

[0046] In this embodiment, the first laser chip 220 is disposed on the mounting surface 213, and the first laser chip 220 of each first light source structure 200 is adjacent to the first heat sink substrate 210 of another first light source structure 200. The distance between each first laser chip 220 and the support shaft 10 is the same. Since the included angle between any two adjacent mounting surfaces 213 is the same, that is, the first laser chips 220 are uniformly distributed around the axis of the support shaft 10, the long axis direction of the light emitted by each first laser chip 220 is approximately perpendicular to the long axis direction of the light emitted by the adjacent first laser chip 220. This allows the non-uniformly distributed light emitted by each first laser chip 220 to achieve a relatively uniform patterned light spot through superposition. The shape of the light spot is related to the number of first laser chips 220. For example, if there are four first laser chips 220, the final emitted light spot shape is a square light spot; if there are eight first laser chips 220, the final emitted light spot shape is an octagonal light spot; and the more first laser chips 220 there are, the closer the final emitted light spot shape is to a circle.

[0047] In other embodiments, the first heat sink substrate 210 of each first light source structure 200 may also be adjacent to the first heat sink substrate 210 of another first light source structure 200. It is understood that the first laser chip 220 of each first light source structure 200 may also be adjacent to the first laser chip 220 of another first light source structure 200.

[0048] Please continue reading. Figure 6 In one embodiment, the first laser chip 220 can emit different primary colors of light to mix into white light. The first laser chip 220 in the plurality of first light source structures 200 includes at least one red light chip 223, at least one green light chip 225, and at least one blue light chip 227. The red light chip 223 can be used to emit red laser light, the green light chip 225 can be used to emit green laser light, and the blue light chip 227 can be used to emit blue laser light.

[0049] Please continue reading. Figure 7 The laser source 1 also includes a driving device 30, which is mechanically connected to the support shaft 10 and is used to drive the support shaft 10 to rotate around its axis so as to emit a uniform white circular light spot. Specifically, the driving device 30 can be a motor, and the motor shaft can be directly fixed to the second end face 13 of the support shaft 10 along a direction parallel to the axis of the support shaft 10.

[0050] In other embodiments, the first laser chip 220 in the plurality of first light source structures 200 includes at least two red light chips 223, at least two green light chips 225, and at least two blue light chips 227. At least one green light chip 225 or blue light chip 227 is included between any two red light chips 223, at least one red light chip 223 or blue light chip 227 is included between any two green light chips 225, and at least one red light chip 223 or green light chip 225 is included between any two blue light chips 227. That is, the first light source structures 200 emitting the same primary color light are not adjacent. The number of red light chips 223, green light chips 225, and blue light chips 227 can be the same, for example, one or two each. Different primary color lights can be mixed and emitted as white light by rotating the support shaft 10 around its axis. In other embodiments, the number of red light chip 223, green light chip 225, and blue light chip 227 can be different. For example, if the intensity of the blue laser emitted by the blue light chip 227 is greater than that of the red light chip 223 and the green light chip 225, a smaller number of blue light chips 227 can be selected. As another example, if the cost of the green light chip 225 is the highest compared to the red light chip 223 and the blue light chip 227, a smaller number of green light chips 225 can be selected if the emitted light meets the requirements.

[0051] Please see Figure 8 In other embodiments, the laser source 1 further includes a cooling fan 40, which can be disposed on the second end face 13. The air convection generated by the cooling fan 40 can directly remove the heat from the surface of the first laser chip 220; it can also improve the heat dissipation performance of the support shaft 10 and the first heat sink substrate 210.

[0052] In other embodiments, the cooling fan 40 may also be located on the first end face 11 or the outer peripheral face 14, or at other locations adjacent to the first laser chip 220, as long as it can accelerate the heat dissipation of the first laser chip 220.

[0053] In other embodiments, the laser source 1 may also include a cooling fan 40 while the support shaft 10 has a first cavity 15 and a second cavity 16.

[0054] Please see Figure 9 In other embodiments, the laser light source 1 further includes a second light source module 50, which is located between the first light source module 20 and the second end face 13, and the distance between the second light source module 50 and the second end face 13 is less than the distance between the second light source module 50 and the first end face 11.

[0055] The second light source module 50 includes a plurality of second light source structures 51 equally spaced around the axis of the support shaft 10, and the plurality of second light source structures 51 in the second light source module 50 are spaced at the same distance from the second end face 13. Each second light source structure 51 includes a second heat sink substrate 511 and a corresponding second laser chip 513, and the second heat sink substrate 511 of each second light source structure 51 is adjacent to the second laser chip 513 of another second light source structure 51. The structure and installation method of the second light source structure 51 are the same as those of the first light source structure 200, and will not be described again here.

[0056] On the projection plane perpendicular to the outer peripheral surface 14, the projection of each second light source structure 51 is located between the projections of the two first light source structures 200. That is, in the direction parallel to the axis of the support shaft 10, the second light source structure 51 and the first light source structure 200 are arranged intersectingly to prevent the light emitted by the first light source structure 200 from being blocked by the second light source structure 51, or to prevent the light emitted by the second light source structure 51 from being blocked by the first light source structure 200.

[0057] In other embodiments, when the first laser chip 220 emits laser light towards the first end face 11 and the second laser chip 513 emits laser light towards the second end face 13, the installation position of the second light source structure 51 is not limited. For example, from the first end face 11 to the second end face 13, any second light source structure 51 can coincide with the first light source structure 200.

[0058] In other embodiments, when the light spot radius emitted by the second light source module 50 is greater than the light spot radius emitted by the first light source module 20, the installation position of the second light source structure 51 may not be limited.

[0059] Please see Figure 10 In some embodiments, each first light source structure 200 may also include two first laser chips 220, which are respectively disposed on two opposite mounting surfaces 213 of the first heat sink substrate 210. This arrangement can improve the brightness of the emitted beam while ensuring uniform light output.

[0060] Please see Figure 11In other embodiments, each first light source structure 200 may also include a first laser chip 220, and the mounting surface 213 may also have a groove 2132, in which the first laser chip 220 is received and exposed from the mounting surface 213. This arrangement allows for better installation of the first laser chip 220 and also reduces the size of the laser light source 1.

[0061] Please see Figure 12 In some other embodiments, each first light source structure 200 may also include two first laser chips 220. Each of the two opposite mounting surfaces 213 of each first heat sink substrate 210 may have a groove 2132. The two first laser chips 220 are respectively mounted in the two grooves 2132 and exposed from the mounting surfaces 213.

[0062] In summary, the laser light source 1 provided by the present invention integrates the first heat sink substrate 210 and the first laser chip 220 on the support shaft 10, and can emit an output beam with better light distribution without the need for optical elements to perform optical shaping.

[0063] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A laser light source, characterized in that, include: A support shaft includes an outer peripheral surface and a parallel first end surface and a second end surface, wherein the outer peripheral surface is perpendicularly connected between the first end surface and the second end surface; The first light source module includes a plurality of first light source structures equally spaced around the axis of the support shaft. Each first light source structure includes a first heat sink substrate and a corresponding first laser chip. The first heat sink substrate includes an adjacent fixing surface and a mounting surface. The fixing surface is fixed to the outer peripheral surface along a direction parallel to the axis of the support shaft. The first laser chip is disposed on the mounting surface. A second light source module is disposed between the first light source module and the second end face. The distance between the second light source module and the second end face is less than the distance between the second light source module and the first end face. The second light source module includes a plurality of second light source structures equally spaced around the axis of the support shaft. The plurality of second light source structures in the second light source module are spaced at the same distance from the second end face. On a projection plane perpendicular to the outer peripheral surface, the projection of each second light source structure is located between the projections of two first light source structures.

2. The laser source according to claim 1, characterized in that, The number of the plurality of first light source structures is four, and the included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 90°.

3. The laser source according to claim 1, characterized in that, The number of the plurality of first light source structures is eight, and the included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 45°.

4. The laser source according to claim 1, characterized in that, The distance between the first light source module and the second end face is greater than the distance between the first light source module and the first end face, and the distance between the plurality of first light source structures in the first light source module and the second end face is the same.

5. The laser source according to claim 4, characterized in that, The support shaft has a first cavity and a second cavity that are connected to each other. The second cavity is exposed on the second end face, and the first cavity surrounds the second cavity.

6. The laser source according to claim 4, characterized in that, The laser source also includes a cooling fan, which is disposed on the second end face.

7. The laser source according to claim 1, characterized in that, Each of the second light source structures includes a second heat sink substrate and a corresponding second laser chip, and the second heat sink substrate of each of the second light source structures is adjacent to the second laser chip of another second light source structure.

8. The laser source according to claim 1, characterized in that, The first laser chip in the plurality of first light source structures emits different primary color light to mix into white light. The laser light source also includes a drive device mechanically connected to the support shaft, the drive device being used to drive the support shaft to rotate around the axis of the support shaft.

9. The laser source according to claim 8, characterized in that, The first laser chip in the plurality of first light source structures includes at least one red light chip, at least one green light chip, and at least one blue light chip.

10. The laser source according to claim 8, characterized in that, The first laser chip in the plurality of first light source structures includes at least two red light chips, at least two green light chips, and at least two blue light chips, and the first light source structures emitting the same primary color light are not adjacent.

Citation Information

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